Combined heat dissipation device capable of switching between air cooling and liquid cooling and combined heat dissipation method

Abstract

The present invention proposes a combined heat dissipation device and a combined heat dissipation method for switching between air cooling and liquid cooling, relating to the field of chip heat dissipation technology. The combined heat dissipation device comprises: a cold plate heat exchanger including a cold plate and a coolant pump, the cold plate having a coolant inlet and a coolant outlet, the coolant pump connected to the coolant outlet via a first liquid infusion pipe, the first liquid infusion pipe being provided with an electronic valve; an air-cooled heat exchanger including a fan frame, a fan assembly, and a drive motor, the fan frame being provided on the cold plate, the fan assembly and the drive motor being mounted on the fan frame, and the drive motor driving the fan assembly to rotate; a temperature controller including a controller, an intelligent prediction module, and multiple temperature sensors, the multiple temperature sensors being provided at intervals on the cold plate, the controller being electrically connected to the coolant pump, the electronic valve, the drive motor, and the multiple temperature sensors, respectively. The combined heat dissipation device and the combined heat dissipation method for switching between air cooling and liquid cooling have a larger temperature adjustment range and a wider range of applications.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a combined heat dissipation device and a combined heat dissipation method capable of switching between air cooling and liquid cooling. Background Art

[0002] Chips are core components in electrical, power, control, and feedback systems, playing a vital role in the communications, electrical, energy, and power industries. Thermal failure is a major cause of chip damage, with serious consequences. As chip integration performance increases, chip heat generation also increases. Therefore, chip heat dissipation has become a key focus for improving chip performance.

[0003] In the prior art, heat sinks for chips are divided into liquid-cooled heat sinks and air-cooled heat sinks. Air-cooled heat sinks use the rotation of a fan to remove heat from the air, but have low heat dissipation capacity. Liquid-cooled heat sinks remove heat from the device by continuously circulating a cold source, thereby cooling it. However, the heat dissipation contact area of ​​a liquid-cooled heat sink is limited, and it cannot effectively transfer large amounts of heat, resulting in low heat dissipation efficiency. How to reasonably design a chip heat sink has also become an important part of chip research and development, and some patents have proposed chip heat dissipation structures.

[0004] For example, patent CN118231361A provides a multi-flow-layer chip air-cooled heat sink designed to address the low heat dissipation efficiency of existing fins. The heat sink comprises fins, a base plate, cooling strips, a chip, a chip base, and a heat sink base, arranged in order from top to bottom. Multiple air ducts are formed between the fins, ensuring uniform heat exchange between the fluid and the fins and improving the heat dissipation efficiency of the fins. However, this type of heat sink utilizes the heat dissipation area of ​​the fins themselves and the airflow generated by the fan to remove heat, resulting in low heat dissipation capacity.

[0005] Patent CN118591161A discloses a microchannel liquid-cooled radiator, comprising a fluid inlet, a fluid outlet, and a cold plate body. After passing through a throttling structure, the liquid enters the microchannel region from the center and is then diverted to the periphery into the microchannel sub-zones. The liquid entering the liquid-dividing chamber through the throttling structure impacts the radiator at high speed, forming a jet flow, enhancing heat transfer in the central region. However, this type of microchannel liquid-cooled radiator utilizes liquid circulation to dissipate heat from electronic devices, resulting in a narrow temperature range and difficulty meeting the cooling requirements of servers operating in complex temperature environments.

[0006] Patent CN109192711B provides a combined air-cooled and liquid-cooled thermal superconducting plate radiator, comprising a thermal superconducting plate with interconnected sealed channels formed therein, the sealed channels filled with a heat transfer medium, a liquid inlet and outlet provided on the liquid cooling radiator connected to the liquid channels, cooling fins located on the surface of the thermal superconducting plate, a plurality of parallel heat dissipation channels formed therein, and a fan located at one end of the cooling fins, with the fan's air outlet facing the cooling fins and perpendicular to the extension direction of the heat dissipation channels. This provides a flexible forced heat dissipation method, significantly enhanced heat dissipation capacity, and high reliability. However, this type of radiator is complex in structure and too large in size, making it unsuitable for microchips.

[0007] In view of this, the inventor, based on many years of production design experience in this field and related fields, has designed a combined heat dissipation device and a combined heat dissipation method that can switch between air cooling and liquid cooling after repeated experiments, in order to solve the problems existing in the prior art. Summary of the Invention

[0008] The object of the present invention is to provide a combined heat dissipation device and a combined heat dissipation method capable of switching between air cooling and liquid cooling, which have a larger temperature adjustment range and a wider range of application.

[0009] To achieve the above-mentioned object, the present invention proposes a combined heat dissipation device capable of switching between air cooling and liquid cooling, wherein the combined heat dissipation device comprises:

[0010] A cold plate heat exchanger comprising a cold plate and a coolant pump, wherein the cold plate is provided with a coolant inlet and a coolant outlet, the coolant pump being connected to the coolant outlet via a first liquid infusion pipe, and the first liquid infusion pipe being provided with an electronic valve;

[0011] An air-cooled heat exchanger comprises a fan blade frame, a fan blade group and a drive motor, wherein the fan blade frame is arranged on the cold plate, the fan blade group and the drive motor are mounted on the fan blade frame, and the drive motor drives the fan blade group to rotate;

[0012] The temperature controller includes a control element, an intelligent prediction module and multiple temperature sensors. The multiple temperature sensors are arranged at intervals on the cold plate. The control element is electrically connected to the coolant pump, the electronic valve, the drive motor and the multiple temperature sensors respectively; the intelligent prediction module is electrically connected to the control element. The intelligent prediction module predicts the future temperature rise trend of the cold plate based on historical temperature data collected by the multiple temperature sensors, and adjusts the operating status of the coolant pump, the electronic valve and the drive motor in advance to improve the temperature control response speed and reduce system energy consumption.

[0013] The present invention proposes a combined heat dissipation method that switches between air cooling and liquid cooling, using the combined heat dissipation device described above to dissipate heat from a chip, wherein the combined heat dissipation method includes:

[0014] A cold plate is stacked on one side of the chip, and the temperature of the chip is measured in real time by each temperature sensor to obtain temperature data;

[0015] The intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the multiple temperature sensors, and adjusts the operating status of the coolant pump, electronic valve and drive motor in advance;

[0016] assigning a first weight value to the temperature data acquired by each temperature sensor based on a position of each temperature sensor;

[0017] The control element calculates the weighted average temperature of the chip according to the temperature data and the first weight value corresponding thereto;

[0018] The control element adjusts operating parameters of the drive motor, the electronic valve, and the coolant pump according to the weighted average temperature.

[0019] Compared with the prior art, the present invention has the following characteristics and advantages:

[0020] The combined heat dissipation device and heat dissipation method proposed in the present invention transmit temperature data to the control element and the intelligent prediction module in real time through multiple temperature sensors. The intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the multiple temperature sensors, and adjusts the operating status of the coolant pump, electronic valve and drive motor in advance; at the same time, the control element adjusts the weight according to the actual position of the temperature sensor and the environmental conditions in which they are located, and then starts the air-cooled heat exchanger or the cold plate heat exchanger according to the heat generation and heat dissipation requirements of the chip and server during operation. When the chip heat dissipation is low, only the air-cooled heat exchanger is turned on and the coolant pump is turned off at the same time. When the chip heat dissipation is high, the cold plate heat exchanger is turned on. It has the characteristics of large temperature adjustment range, wide application range, energy saving and high efficiency, and can meet the heat dissipation requirements of variable power electronic devices.

[0021] The combined heat dissipation device and method proposed in this invention combine liquid cooling and air cooling, leveraging the complementary nature of the two cooling technologies to improve cooling efficiency. Furthermore, the combination of liquid and air cooling can be flexibly adjusted based on the actual heat dissipation conditions of the chip, allowing for adjustment and optimization in different application scenarios to achieve more efficient thermal management. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present invention in any way. In addition, the shapes and proportional dimensions of the various components in the drawings are merely illustrative and are used to help understand the present invention, and are not intended to specifically limit the shapes and proportional dimensions of the various components of the present invention. Those skilled in the art can select various possible shapes and proportional dimensions to implement the present invention according to specific circumstances under the guidance of the present invention.

[0023] Figure 1 This is a schematic structural diagram of the combined heat dissipation device proposed in the present invention;

[0024] Figure 2 Schematic diagram of the structure of the cold plate in the present invention.

[0025] Description of Reference Numerals

[0026] 100. Combined heat dissipation device; 10. Cold plate heat exchanger;

[0027] 11. Cold plate; 111. Coolant inlet;

[0028] 112. Coolant outlet; 113. Cold plate frame;

[0029] 114. Fins; 12. Coolant pump;

[0030] 13. Electronic valve; 14. Cooler;

[0031] 20. Air-cooled heat exchanger; 21. Fan blade frame;

[0032] 22. Fan blade assembly; 23. Drive motor;

[0033] 30. Temperature controller; 31. Control element;

[0034] 311. Temperature sensor input interface; 312. Power input interface;

[0035] 313. Coolant pump control interface; 314. Drive motor control interface;

[0036] 32. Temperature sensor; 33. Intelligent prediction module. DETAILED DESCRIPTION

[0037] The details of the present invention can be more clearly understood by referring to the accompanying drawings and the description of the specific embodiments of the present invention. However, the specific embodiments of the present invention described herein are only for the purpose of explaining the present invention and are not to be construed as limiting the present invention in any way. Based on the teachings of the present invention, a skilled person can conceive of any possible variations based on the present invention, and such variations should be considered to fall within the scope of the present invention.

[0038] Unless otherwise specified, the directions of up, down, left, and right mentioned in this document are based on the Figure 1 The up, down, left and right directions in the figure shall prevail and are explained here.

[0039] like Figure 1 、 Figure 2 As shown, the present invention proposes a combined heat dissipation device 100, which includes a cold plate heat exchanger 10, an air-cooled heat exchanger 20 and a temperature controller 30. The cold plate heat exchanger 10 includes a cold plate 11 and a coolant pump 12. The cold plate 11 is provided with a coolant inlet 111 and a coolant outlet 112. The coolant pump 12 is connected to the coolant outlet 111 through a first liquid infusion pipe. An electronic valve 13 is provided on the first liquid cooling pipe. The air-cooled heat exchanger 20 includes a fan blade frame 21, a fan blade assembly 22, and a fan blade assembly 23. and a drive motor 23, the fan blade frame 21 is arranged on the cold plate 11, the fan blade group 22 and the drive motor 23 are installed on the fan blade frame 21, and the drive motor 23 drives the fan blade group 22 to rotate; the temperature controller 30 includes a control element 31, multiple temperature sensors 32 and an intelligent prediction module 33, and the multiple temperature sensors 32 are arranged at intervals on the cold plate 11. The control element 31 is electrically connected to the intelligent prediction module 33, the coolant pump 12, the electronic valve 13, the drive motor 23 and the multiple temperature sensors 32 respectively.

[0040] In the combined heat sink 100 proposed by the present invention, multiple temperature sensors 32 disposed on the cold plate 11 transmit temperature data in real time to a control element 31 and an intelligent prediction module 33. The control element 31 controls the coolant pump 12, the electronic valve 13, and the drive motor 23 based on the real-time temperature data, enabling the combined heat sink 100 to switch between liquid cooling and air cooling according to the actual environment, thereby extending the temperature adjustment range of the combined heat sink 100.

[0041] At the same time, the intelligent prediction module 33 predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by multiple temperature sensors 32, and adjusts the operating status of the coolant pump 12, the electronic valve 13 and the drive motor 23 in advance to meet the heat dissipation requirements of chips and servers working in complex temperature environments, ensuring that the combined heat dissipation device 100 operates efficiently, stably and safely and extends its service life.

[0042] The present invention also proposes a combined heat dissipation method, which uses the combined heat dissipation device 100 described above to dissipate heat from a chip (not shown in the figure). The combined heat dissipation method includes:

[0043] The cold plate 11 is stacked on one side of the chip, and the temperature of the chip is measured in real time through each temperature sensor 32 and the corresponding temperature data is obtained;

[0044] The intelligent prediction module 33 predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the multiple temperature sensors 32, and adjusts the operating status of the coolant pump 12, the electronic valve 13 and the drive motor 23 in advance; and assigns a first weight value to the temperature data obtained by each temperature sensor 32 based on the position of each temperature sensor 32;

[0045] The control element 31 calculates the weighted average temperature T of the chip in real time based on each temperature data and its corresponding first weight value;

[0046] The control element 31 adjusts the operating parameters of the drive motor 23 , the electronic valve 13 and the coolant pump 12 according to the weighted average temperature T.

[0047] In the combined heat dissipation method proposed in the present invention, the control element 31 adjusts the weight according to the actual position of each temperature sensor 32, and performs weighted averaging processing on the temperature data to obtain the weighted average temperature T. The operating parameters of the drive motor 23, the electronic valve 13 and the coolant pump 12 are then adjusted according to the weighted average temperature T to achieve real-time and rapid switching between liquid cooling and air cooling, so as to better cope with factors such as the complexity of the chip operating environment and changes in equipment load, avoid errors caused by simple arithmetic averaging, and help the cooling system to be adjusted and optimized more accurately.

[0048] In the combined heat dissipation method proposed in the present invention, the control element 31 adjusts the weight according to the actual position of each temperature sensor 32, and dynamically adjusts the weight of each temperature sensor 32 through the weighted average method, thereby improving the accuracy of the temperature data, and then adjusts the operating parameters of the drive motor 23, the electronic valve 13 and the coolant pump 12 based on the weighted average temperature, so that the combined heat dissipation device 100 can better cope with factors such as environmental complexity and equipment load changes, avoid errors caused by the different positions of the temperature sensors 32, and help the combined heat dissipation device 100 to be adjusted and optimized more accurately.

[0049] In an optional example of the present invention, the intelligent prediction module 33 predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by multiple temperature sensors 32, including: the intelligent prediction module 33 caches the temperature data of a recent period of time, calculates the temperature change ∆T during the period ∆t (i.e., the temperature change time), calculates the temperature change rate from the temperature change ∆T and the temperature change time ∆t, and determines whether there is a continuous temperature rise trend based on the temperature change rate. If the temperature change rate increases for multiple consecutive times, it is determined that the temperature rise trend is established.

[0050] Furthermore, when the intelligent prediction module 33 determines that the temperature rise trend is established, the operating states of the coolant pump 12, the electronic valve 13 and the drive motor 23 are adjusted in advance.

[0051] In an optional embodiment of the present invention, the cold plate 11 includes a cold plate frame 113 and a plurality of fins 114. The cold plate frame 113 includes two horizontal beams and two longitudinal beams. The two horizontal beams are arranged in parallel and spaced apart. The two longitudinal beams are respectively arranged at the ends of the horizontal beams, and the ends of each longitudinal beam are fixedly connected to the two horizontal beams. The two horizontal beams and the two longitudinal beams enclose a hollow section. The plurality of fins 114 are arranged in the hollow section, and the ends of each fin 114 are respectively fixedly connected to the two horizontal beams. With this structure, the cold plate frame 113 serves to connect the chips and support the fins 114, so that the fins 114 can be stably mounted on the chips to better cool the chips.

[0052] In an optional embodiment of this embodiment, the fan frame 21 is fixedly connected to the cold plate frame 113, and the fan assembly 22 is aligned with the hollowed-out area. With this structure, when the fan assembly 22 is activated, it can cool the chip through the hollowed-out area and simultaneously quickly cool each fin 114, thereby improving the cooling effect on the chip.

[0053] In an optional example, a first cooling channel is defined within the cold plate frame 113, with a coolant inlet 111 and a coolant outlet 112 at either end of the first cooling channel. A second cooling channel is defined within each fin 114, with both ends of each second cooling channel connected to the first cooling channel. In the above structure, liquid channels are defined within each crossbeam and longitudinal beam, and the liquid channels are connected end to end to form the first cooling channel. The ends of the fin 114 are fixedly connected to the two crossbeams, and the ends of the second cooling channels within the fin 114 are connected to the liquid channels within the crossbeams. After the coolant enters the first cooling channel through the coolant inlet 111, it is diverted to multiple second cooling channels and finally flows out through the coolant outlet 112.

[0054] In an optional example, the fins 114 are in the shape of long strips, and the fins 114 are arranged in parallel and at intervals.

[0055] In an optional embodiment of this embodiment, the cold plate frame 113 and the fins 114 are respectively made of thermally conductive materials.

[0056] In an optional example of this embodiment, the cold plate frame 113 is made of phase change material or liquid-cooled metal material, which can further optimize the cooling performance and improve the heat exchange efficiency.

[0057] Preferred phase-change materials include paraffin waxes (such as n-dodecane and n-hexadecane), metal salts (such as hydrated salts), or composite phase-change materials. These materials absorb and release large amounts of heat during phase change, thereby balancing temperature fluctuations and improving thermal management efficiency. Liquid-cooled metal materials can include highly thermally conductive aluminum alloys (such as 6061 aluminum alloy), copper alloys (such as C1100 pure copper), or liquid metals (such as gallium-based alloys). These materials utilize their excellent thermal conductivity, enhancing cooling capacity and reducing thermal resistance.

[0058] In an optional example, the cold plate frame 113 does not need to be entirely made of phase change material or liquid cooling material. The phase change material or liquid cooling material is only applied to the cooling liquid flow channel or the heat conduction area.

[0059] In an optional embodiment of the present invention, the cold plate heat exchanger 10 further includes a cooler 14 and a liquid storage tank (not shown). The outlet of the liquid storage tank is connected to the coolant inlet 111 via a second liquid infusion pipeline. The cooler 14 is connected in series to the second liquid infusion pipeline, and the inlet of the liquid storage tank is connected to the coolant pump 12 via a third liquid infusion pipeline. With this structure, the liquid storage tank is used to store coolant, which enters the cooler 14 from the outlet of the liquid storage tank for cooling. The cooled coolant then enters the cold plate 11 and exchanges heat with the chips within the cold plate 11.

[0060] In the present invention, the first weight value corresponding to the temperature data measured by each temperature sensor 32 is dynamically set as the position of the temperature sensor 32 changes, so as to improve the accuracy of the temperature data.

[0061] In an optional embodiment of the present invention, the chip has a high-function consumption area and a low-function consumption area, and the first weight value corresponding to the temperature sensor 32 measuring the high-function consumption area is 0.3 to 0.5, and the first weight value corresponding to the temperature sensor 32 monitoring the low-function consumption area is 0.1 to 0.3.

[0062] The high-performance consumption area of ​​a chip generally refers to the portion responsible for core computing tasks, while the low-performance consumption area generally refers to the portion responsible for basic functions. Chip heat dissipation is typically uneven, with high-performance consumption areas typically experiencing higher temperatures. Therefore, the temperature data from these high-performance consumption areas should be given a higher weight. Temperature sensors 32 in low-performance consumption areas may measure lower temperatures, so these data are generally given a lower weight.

[0063] In an optional example of the present invention, four temperature sensors 32 are provided on the cold plate frame 113. The four temperature sensors 32 are respectively provided at the four corners of the cold plate frame 113. The temperature data measured by the four temperature sensors 32 are T1, T2, T3 and T4 respectively. The first weight values ​​of the corresponding four temperature sensors 32 are W1, W2, W3 and W4 respectively. The calculation formula of the weighted average temperature T of the chip is:

[0064] ;

[0065] Therefore, the weighted average temperature T is calculated by the temperature data after weighting by the first weight value, and can more accurately represent the overall environment or chip temperature value.

[0066] In this embodiment, four temperature sensors 32 are positioned at the four corners of the cold plate frame 113, effectively reflecting the temperature distribution and heat dissipation efficiency of the entire cold plate 11. Furthermore, since the four corners are located at relatively peripheral locations, inaccurate temperature data collection when the surface temperature of the cold plate 11 is unevenly distributed can be avoided, thereby preventing the control element 31 from issuing erroneous instructions. Placing the four temperature sensors 32 at the four corners of the cold plate frame 113 also balances temperature monitoring across the entire cold plate area and avoids excessive concentration and repeated measurements of the temperature sensors 32, thereby ensuring the heat dissipation efficiency of the cold plate 11. Furthermore, placing the temperature sensors 32 at the four corners of the cold plate frame 113 facilitates installation and subsequent maintenance of the temperature sensors 32.

[0067] It should be noted that there are no specific requirements for the placement of temperature sensors 32, as long as they are not affected by the uneven temperature distribution of the cold plate 11. The placement of temperature sensors 32 can be adjusted based on the specific chip conditions. The location of the temperature sensors can be determined based on several factors: the location of the heat source (the high-performance area of ​​the chip), the cooling design (the specific location of the first and second cooling channels within the cold plate 11), and balanced distribution (ensuring that the four temperature sensors 32 cover the entire cold plate 11 as evenly as possible to avoid overlooking any localized overheating areas).

[0068] In the present invention, by setting up multiple temperature sensors 32, it can be ensured that even if one or more temperature sensors 32 fail, the other temperature sensors 32 can still provide valid temperature data, avoiding failure of the entire system due to failure of a single temperature sensor 32, and enhancing the fault tolerance and safety of the system.

[0069] In an optional embodiment of the present invention, the control element 31 includes a temperature sensor input interface 311 , a power input interface 312 , a coolant pump control interface 313 , an electronic valve control interface and a drive motor control interface 314 .

[0070] In an optional embodiment of the present invention, the control element 31 adjusts the operating parameters of the drive motor 23, the electronic valve 13 and the coolant pump 12 according to the weighted average temperature, including:

[0071] Set the upper limit temperature for air cooling and liquid cooling, and make the upper limit temperature for liquid cooling higher than that for air cooling;

[0072] When the weighted average temperature T is lower than the upper limit temperature of the air-cooling operation, the control element 31 controls the electronic valve 13 and the coolant pump 12 to close and the drive motor 23 to start;

[0073] When the weighted average temperature T is higher than the upper limit temperature of air cooling and lower than the upper limit temperature of liquid cooling, the control element 31 controls the electronic valve 13 and the coolant pump 12 to open and the drive motor 23 to close;

[0074] When the weighted average temperature is higher than the upper limit temperature of the liquid cooling operation, the control element 31 controls the electronic valve 13, the coolant pump 12 and the drive motor 23 to start.

[0075] Specifically, when the weighted average temperature T is lower than the upper limit temperature for air cooling, or when the load is light, the control element 31 controls the electronic valve 13 to close and simultaneously activates the drive motor 23 through the fan control interface. The drive motor 23 drives the fan blade assembly 22 to rotate, accelerating the heat dissipation transferred to the fins 114, thereby achieving air cooling and heat dissipation. When the weighted average temperature T is higher than the upper limit temperature for air cooling and lower than the upper limit temperature for liquid cooling, or when the load is high, the control element 31 activates the coolant pump 12 through the coolant pump control interface and simultaneously opens the electronic valve 13, allowing the coolant in the cooler 14 to flow within the cold plate 11, dissipating the heat transferred to the fins 114, thereby achieving liquid cooling and heat dissipation. When the weighted average temperature T is higher than the upper limit temperature for air cooling and the upper limit temperature for liquid cooling, or when the load is too high, operating the air cooling heat exchanger 20 or the cold plate heat exchanger 10 alone cannot meet the heat dissipation requirements. The control element 31 controls the electronic valve 13 to open and activates the air cooling heat exchanger 20 through the drive motor 23 control interface, thereby achieving combined air cooling and liquid cooling.

[0076] In an optional embodiment of the present invention, fluctuations of each temperature data are monitored and second weight values ​​are assigned to each temperature data based on the fluctuations; the control element 31 corrects the weighted average temperature T based on each second weight value.

[0077] Specifically, the degree of fluctuation of the temperature data measured by each temperature sensor 32 can be reflected by measuring the temperature difference at the latest several time points:

[0078] ;

[0079] The calculation formula for the second weight value is:

[0080] ;

[0081] Among them, k is the adjustment coefficient, which is 0.1; w adj,i is the second weight value; w i is the first weight value.

[0082] Based on the calculated second weight value w adj,i , re-correct the weighted average temperature:

[0083] ;

[0084] Where, T avg is the weighted average temperature after correction; T1, T2, T3 and T4 are the temperature data measured by four temperature sensors respectively; w adj,1 、w adj,2 、w adj,3 , and w adj,4 , are the second weight values ​​corresponding to the four temperature sensors respectively.

[0085] By introducing a second weight value based on temperature fluctuations, the influence of each sensor in the weighted average temperature calculation can be dynamically adjusted, improving the accuracy of temperature calculation and ensuring that the system can better cope with data environments with greater volatility.

[0086] In an optional embodiment of the present invention, the control element 31 adjusts the operating parameters of the drive motor 23, the electronic valve 13 and the coolant pump 12 according to the corrected weighted average temperature, including:

[0087] Set the upper limit temperature for air cooling and liquid cooling, and make the upper limit temperature for liquid cooling higher than that for air cooling;

[0088] When the corrected weighted average temperature T avg When the temperature is lower than the upper limit of air-cooling operation, the control element 31 controls the electronic valve 13 and the coolant pump 12 to close and the drive motor 23 to start;

[0089] When the corrected weighted average temperature T avg When the temperature is higher than the upper limit of air cooling and lower than the upper limit of liquid cooling, the control element 31 controls the electronic valve 13 and the coolant pump 12 to open and the drive motor 23 to close;

[0090] When the corrected weighted average temperature T avg When the temperature is higher than the upper limit of the liquid cooling operation temperature, the control element 31 controls the electronic valve 13, the coolant pump 12 and the drive motor 23 to start.

[0091] Specifically, when the corrected weighted average temperature T avg When the temperature is lower than the upper limit of air cooling operation or the load is light, the control element 31 controls the electronic valve 13 to close and starts the drive motor 23 through the fan control interface. The drive motor 23 drives the fan blade group 22 to rotate, accelerating the heat transfer to the fins 114 to achieve air cooling. When the corrected weighted average temperature T avg When the temperature is higher than the upper limit of air cooling and lower than the upper limit of liquid cooling, or the load is high, the control element 31 starts the coolant pump 12 through the coolant pump control interface and opens the electronic valve 13 at the same time, so that the coolant in the cooler 14 flows in the cold plate 11, dissipating the heat transferred to the fins 114 and achieving liquid cooling. avg When the temperature is higher than the upper limit of air cooling and liquid cooling, or the load is too high, operating the air-cooled heat exchanger 20 or the cold plate heat exchanger 10 alone cannot meet the heat dissipation requirements. The control element 31 controls the electronic valve 13 to open, and starts the air-cooled heat exchanger 20 through the drive motor 23 control interface to achieve combined operation of air cooling and liquid cooling.

[0092] The combined heat dissipation device 100 and heat dissipation method proposed by the present invention utilizes multiple temperature sensors 32 to transmit real-time temperature data to a control element 31 and an intelligent prediction module 33. Based on historical temperature data collected by the multiple temperature sensors 32, the intelligent prediction module 33 caches recent temperature data and calculates the temperature change rate from the temperature change ∆T and the temperature change time ∆t to determine whether a continuous temperature increase trend exists. If the temperature change rate increases multiple times in a row, a temperature increase trend is determined. This pre-adjusts the operating status of the coolant pump 12, electronic valve 13, and drive motor 23. The control element 31 also adjusts the weights based on the actual location of the temperature sensors 32 and their environmental conditions. Based on the heat generation and heat dissipation requirements of the chip and server during operation, either the air-cooled heat exchanger 20 or the cold plate heat exchanger 10 is activated. When chip heat dissipation is low, only the air-cooled heat exchanger 20 is activated, while the coolant pump 12 is disabled. When chip heat dissipation is high, the cold plate heat exchanger 10 is activated. This device offers a wide temperature adjustment range, a wide range of applicability, and is energy-efficient and highly efficient, meeting the heat dissipation requirements of variable power electronic devices.

[0093] The combined heat sink 100 and heat dissipation method proposed in this invention combine liquid cooling and air cooling, leveraging the complementary nature of the two cooling technologies to improve cooling efficiency. Furthermore, the combined heat sink 100 and heat dissipation method can be flexibly adjusted based on the actual heat dissipation conditions of the chip. The combination of liquid cooling and air cooling can be adjusted and optimized in different application scenarios to achieve more efficient thermal management.

[0094] The detailed explanations of the above-mentioned embodiments are intended only to explain the present invention so as to facilitate a better understanding of the present invention. However, these descriptions cannot be interpreted as limiting the present invention for any reason. In particular, the various features described in different embodiments may also be arbitrarily combined with each other to form other embodiments. Unless otherwise clearly described, these features should be understood to be applicable to any embodiment and are not limited to the described embodiments.

Claims

1. A combined heat dissipation device capable of switching between air cooling and liquid cooling, characterized in that: The combined heat dissipation device comprises: A cold plate heat exchanger comprising a cold plate and a coolant pump, wherein the cold plate is provided with a coolant inlet and a coolant outlet, the coolant pump being connected to the coolant outlet via a first liquid infusion pipe, and the first liquid infusion pipe being provided with an electronic valve; An air-cooled heat exchanger comprises a fan blade frame, a fan blade group and a drive motor, wherein the fan blade frame is arranged on the cold plate, the fan blade group and the drive motor are mounted on the fan blade frame, and the drive motor drives the fan blade group to rotate; The temperature controller includes a control element, an intelligent prediction module and multiple temperature sensors, wherein the multiple temperature sensors are arranged at intervals on the cold plate, and the control element is electrically connected to the coolant pump, the electronic valve, the drive motor and the multiple temperature sensors respectively; the intelligent prediction module is electrically connected to the control element, and the intelligent prediction module caches the temperature data of a recent period based on the historical temperature data collected by the multiple temperature sensors, calculates the temperature change rate from the temperature change ∆T and the temperature change time ∆t, and determines whether there is a continuous temperature rise trend. If the temperature change rate increases for multiple consecutive times, it is determined that the temperature rise trend is established. At this time, the operating status of the coolant pump, the electronic valve and the drive motor is adjusted in advance to improve the temperature control response speed and reduce system energy consumption.

2. The combined heat dissipation device capable of switching between air cooling and liquid cooling as claimed in claim 1, wherein: The cold plate includes a cold plate frame and a plurality of fins. The cold plate frame includes two cross beams and two longitudinal beams. The two cross beams are arranged in parallel and spaced apart. The two ends of each longitudinal beam are fixedly connected to the two cross beams respectively. The two cross beams and the two longitudinal beams enclose a hollow section. The plurality of fins are arranged in the hollow section. The two ends of each fin are fixedly connected to the two cross beams respectively.

3. The combined heat dissipation device capable of switching between air cooling and liquid cooling as claimed in claim 2, wherein: The fan blade frame is fixedly connected to the cold plate frame, and the fan blade group is aligned with the hollow area.

4. The combined heat dissipation device capable of switching between air cooling and liquid cooling as claimed in claim 2, wherein: A first cooling channel is provided in the cold plate frame, a second cooling channel is provided in each of the fins, and each of the second cooling channels is connected to the first cooling channel.

5. The combined heat dissipation device capable of switching between air cooling and liquid cooling as claimed in claim 2, wherein: The cold plate frame and the fins are respectively made of heat conductive materials.

6. The combined heat dissipation device capable of switching between air cooling and liquid cooling as claimed in claim 1, wherein: The cold plate heat exchanger also includes a heat exchanger and a liquid storage tank. The outlet of the liquid storage tank is connected to the coolant inlet through a second liquid infusion pipeline. The heat exchanger is connected in series to the second liquid infusion pipeline. The inlet of the liquid storage tank is connected to the coolant pump through a third liquid infusion pipeline.

7. A combined heat dissipation method for switching between air cooling and liquid cooling, using the combined heat dissipation device according to any one of claims 1 to 6 to dissipate heat from a chip, characterized in that: The combined heat dissipation method comprises: A cold plate is stacked on one side of the chip, and the temperature of the chip is measured in real time by each temperature sensor to obtain temperature data; The intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the multiple temperature sensors, and adjusts the operating status of the coolant pump, electronic valve and drive motor in advance; assigning a first weight value to the temperature data acquired by each temperature sensor based on a position of each temperature sensor; The control element calculates the weighted average temperature of the chip according to the temperature data and the first weight value corresponding thereto; The control element adjusts operating parameters of the drive motor, the electronic valve, and the coolant pump according to the weighted average temperature.

8. The combined heat dissipation method for switching between air cooling and liquid cooling as claimed in claim 7, characterized in that: The chip has a high-function consumption area and a low-function consumption area. The first weight value of the temperature sensor monitoring the high-function consumption area is 0.3-0.5, and the first weight value of the temperature sensor monitoring the low-function consumption area is 0.1-0.

3.

9. The combined heat dissipation method of switching between air cooling and liquid cooling as claimed in claim 7, characterized in that: The control element adjusts the operating parameters of the drive motor, the electronic valve, and the coolant pump according to the weighted average temperature, including: Set the upper limit temperature of air cooling and liquid cooling. When the weighted average temperature is lower than the air-cooling operating upper limit temperature, the control element controls the electronic valve and the coolant pump to close, and controls the drive motor to start; When the weighted average temperature is higher than the upper limit temperature of air cooling and lower than the upper limit temperature of liquid cooling, the control element controls the electronic valve and the coolant pump to open, and controls the drive motor to close; When the weighted average temperature is higher than the liquid cooling operation upper limit temperature, the control element controls the electronic valve, the coolant pump, and the drive motor to turn on.

10. The combined heat dissipation method of switching between air cooling and liquid cooling according to claim 7, characterized in that: The fluctuation of each temperature data is monitored and a second weight value is assigned to each temperature data based on the fluctuation; and the control element corrects the weighted average temperature based on each second weight.

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