Assembly method of camera module, camera module and camera device

Abstract

The invention discloses an assembly method of a camera module, the camera module and a camera device, and the assembly method comprises the steps: fixedly installing a welding part on a lens mount, and installing a corresponding welding through hole in a PCB, thereby enabling the lens mount with an optical lens to be connected with the PCB in an inserted manner, and enabling the welding through hole to be formed in the PCB. A plurality of welding pieces can be simultaneously welded in the welding through holes in which the welding pieces are inserted through a laser welding technology, namely, the lens mount and the PCB are welded and assembled, so that glue assembly is avoided; therefore, the technical problem that the assembly precision of the camera module is adversely affected by factors such as curing shrinkage or thermal expansion and cold contraction when glue is used for assembly is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of camera devices, and particularly to an assembly method for a camera module, a camera module, and a camera device. Background Art

[0002] Camera modules have a wide range of applications. For example, they can be applied to in-vehicle camera devices in the automotive industry, shooting devices in the security industry, and so on.

[0003] A camera module generally includes a PCB circuit board, an image sensor, a lens holder, an optical lens, etc. Among them, the image sensor and the lens holder are both mounted on the PCB circuit board, and the lens holder covers the image sensor, and the optical lens is mounted at the end of the lens holder. Thus, external light can be imaged on the image sensor through the optical lens.

[0004] In related solutions, when assembling the above camera module, usually the lens holder is first assembled with the PCB circuit board, then glue is applied to the end of the lens holder, and then the optical lens is placed on the end face of the lens holder. In this way, after the glue cures, the optical lens can be bonded to the lens holder to complete the assembly of the camera module.

[0005] However, it is found that based on the above assembly process, factors such as the curing shrinkage or thermal expansion and contraction of the glue often have an adverse impact on the assembly accuracy of the camera module and reduce the imaging quality. Summary of the Invention

[0006] In view of at least one of the above technical problems, embodiments of the present application provide an assembly method for a camera module, a camera module, and a camera device. In this assembly method, a welding part is fixedly installed on the lens holder, and a corresponding welding through hole is installed on the PCB circuit board. In this way, between the lens holder with the optical lens and the PCB circuit board, on the basis of insertion, multiple welding parts can be simultaneously welded to the inserted welding through holes by laser welding technology, that is, the lens holder and the PCB circuit board are welded and assembled, avoiding the use of glue for assembly, thereby solving the technical problem that the curing shrinkage or thermal expansion and contraction of the glue has an adverse impact on the assembly accuracy of the camera module during glue assembly.

[0007] Embodiments of the present application provide an assembly method for a camera module, and the assembly method includes: Along a first direction, a plurality of welding parts are fixedly installed at a first end of the lens holder, and an optical lens is fixedly installed at a second end of the lens holder; wherein, the welding parts extend along the first direction, and the optical axis direction of the optical lens is arranged along the first direction; Welding through-holes are respectively arranged at multiple projected positions on the PCB circuit board corresponding to the welding parts, and the multiple welding through-holes circumferentially surround an image sensor on the PCB circuit board; Manipulate a fixture that clamps at least one of the lens holder and the PCB circuit board to dock the lens holder and the PCB circuit board along the first direction, so that the multiple welding parts are respectively inserted into the corresponding welding through-holes; When the imaging of the image sensor reaches the standard by manipulating the fixture, use laser welding technology to simultaneously weld the multiple welding parts to the welding through-holes into which they are inserted, so that the camera module is welded and assembled.

[0008] In one embodiment, preferably, the steps of fixedly installing multiple welding parts at the first end of the lens holder and fixedly installing an optical lens at the second end of the lens holder include: Along the circumferential end face of the first end of the lens holder, use thermal riveting or insert molding to embed the connecting seat of the welding part into the lens holder, and expose the surface of the connecting seat outside the lens holder; wherein, the welding part further includes a welding post extending along the first direction from the connecting seat, and the diameter of the welding post is smaller than the diameter of the connecting seat; Fix the optical lens to the second end of the lens holder by any one of screw installation, plug-in installation, and snap installation.

[0009] In one embodiment, preferably, the steps of respectively arranging welding through-holes at multiple projected positions on the PCB circuit board corresponding to the welding parts include: Open installation through-holes at multiple projected positions on the PCB circuit board corresponding to the welding parts, and the diameter of the installation through-holes is between the diameter of the connecting seat of the welding part and the diameter of the welding post; Use surface treatment technology to form pads on the radially outer side of the installation through-holes, so that the installation through-holes form the weldable welding through-holes; wherein, the pads are at least on the side of the PCB circuit board facing away from the image sensor.

[0010] In one embodiment, preferably, on the side of the PCB circuit board facing away from the image sensor and on the side facing the image sensor, pads are provided on the radially outer side of the installation through-holes, and the pads on both sides are connected by welding side walls located on the circumferential side wall of the installation through-holes.

[0011] In one embodiment, preferably, the steps of manipulating a fixture that clamps at least one of the lens holder and the PCB circuit board to dock the lens holder and the PCB circuit board along the first direction include: Use the first fixture to pick up the PCB circuit board and adjust the first fixture so that the side of the PCB circuit board facing away from the image sensor faces upward; Use the second fixture to pick up the lens mount and adjust the second fixture so that the first end of the lens mount faces upward; Adjust the position of the second fixture in a plane perpendicular to the first direction so that the plurality of welding parts are respectively axially aligned with the corresponding welding through holes; Drive the second fixture to rise along the first direction so that the plurality of welding parts are respectively inserted into the corresponding welding through holes.

[0012] In one embodiment, preferably, the step of simultaneously welding the plurality of welding parts to the welding through holes into which they are inserted by using a laser welding technique includes: Place a solder ring at each position of the welding through hole on the side of the PCB circuit board facing away from the image sensor; wherein, the solder ring is sleeved on the welding part protruding from the welding through hole; Control the spatial position and three-dimensional rotating shaft of at least one of the first fixture and the second fixture so that the imaging of the image sensor meets the standard; Use a laser to simultaneously irradiate each solder ring through a beam splitting mechanism disposed above the PCB circuit board, so that the plurality of solder rings are simultaneously melted, and the melted solder flows into the annular accommodation space between the welding through hole and the welding part.

[0013] The embodiment of the present application further provides an imaging device, and the imaging device includes a camera module, and the camera module is obtained by using the following assembly method: Along the first direction, fixedly install a plurality of welding parts at the first end of the lens mount, and fixedly install an optical lens at the second end of the lens mount; wherein, the welding parts extend along the first direction, and the optical axis direction of the optical lens is set along the first direction; Set welding through holes at a plurality of projection positions corresponding to the welding parts on the PCB circuit board, and the plurality of welding through holes circumferentially surround the image sensor on the PCB circuit board; Control the fixture that picks up at least one of the lens mount and the PCB circuit board to dock the lens mount and the PCB circuit board along the first direction so that the plurality of welding parts are respectively inserted into the corresponding welding through holes; In the case where the imaging of the image sensor meets the standard by controlling the fixture, use a laser welding technique to simultaneously weld the plurality of welding parts to the welding through holes into which they are inserted, so that the camera module is welded and assembled.

[0014] The embodiment of the present application further provides a camera module, which includes: A PCB circuit board arranged perpendicular to the first direction, the PCB circuit board includes a first surface and a second surface facing away from each other, and an image sensor is mounted on the first surface; A lens holder extending along the first direction, the first end of the lens holder is used for fixed installation on the first surface, so that the lens holder masks the image sensor; and, An optical lens fixedly mounted on the second end of the lens holder; Wherein, a plurality of welding parts are fixedly mounted at the first end of the lens holder, and the welding parts extend along the first direction; The PCB circuit board is respectively provided with welding through holes at a plurality of projection positions corresponding to the welding parts, the welding through holes penetrate through the first surface and the second surface, and the welding through holes are used for the welding parts to be inserted and installed along the first direction; So that when the plurality of welding parts are respectively inserted into the corresponding welding through holes, the welding parts are welded and assembled with the welding through holes.

[0015] In one embodiment, preferably, the welding part includes a connecting seat and a welding column extending along the first direction from the connecting seat; Wherein, the connecting seat is embedded in the end face of the first end of the lens holder and is exposed, and the diameter of the welding column is smaller than the diameter of the connecting seat; And, the diameter of the welding through hole is between the diameter of the welding column and the diameter of the connecting seat, so that the solder for welding assembly is located in the annular accommodation space between the welding through hole and the welding column.

[0016] In one embodiment, preferably, the height of the welding column is greater than the thickness of the PCB circuit board, so that the end of the welding column protrudes relative to the second surface.

[0017] In one embodiment, preferably, the welding part is made of a weldable metal material or alloy material.

[0018] In one embodiment, preferably, the welding through hole includes an installation through hole penetrating through the first surface and the second surface, and an annular solder pad is provided at least on one side of the second surface of the installation through hole, and the solder pad extends radially outward from the end of the installation through hole.

[0019] In one embodiment, preferably, the installation through hole is provided with the solder pad on both the first surface side and the second surface side, and the solder pads on both sides are connected by a welding side wall located on the circumferential side wall of the installation through hole.

[0020] In one embodiment, preferably, the optical lens and the second end of the lens holder are fixedly installed by any one of screw installation, plug-in installation, and snap installation.

[0021] An embodiment of the present application further provides a camera device, the camera device includes a camera module, and the camera module includes: A PCB circuit board perpendicular to the first direction, the PCB circuit board includes a first surface and a second surface opposite to each other, and an image sensor is installed on the first surface; A lens holder extending along the first direction, the first end of the lens holder is used for fixedly installing on the first surface so that the lens holder masks the image sensor; and, An optical lens fixedly installed at the second end of the lens holder; Wherein, a plurality of welding parts are fixedly installed at the first end of the lens holder, and the welding parts extend along the first direction; The PCB circuit board is respectively provided with welding through holes at a plurality of projection positions corresponding to the welding parts, the welding through holes penetrate through the first surface and the second surface, and the welding through holes are used for the welding parts to be plug-in installed along the first direction; So that when the plurality of welding parts are respectively inserted into the corresponding welding through holes, the welding parts and the welding through holes are welded and assembled.

[0022] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: The embodiment of the present application provides an assembly method of a camera module, a camera module, and a camera device. The assembly method first fixedly installs a plurality of welding parts and an optical lens at both ends of the lens holder respectively; then, welding through holes are respectively arranged at a plurality of projection positions of the PCB circuit board corresponding to the welding parts; then, at least one fixture is controlled to dock and install the lens holder and the PCB circuit board, so that a plurality of welding parts can be respectively inserted into the corresponding welding through holes; when the imaging of the image sensor reaches the standard by controlling the at least one fixture, the laser welding technology can be used to weld the plurality of welding parts to the inserted plurality of welding through holes at the same time, so that the camera module can be welded and assembled.

[0023] That is to say, different from the method of assembling the lens holder and the optical lens with glue, in this embodiment, on the basis of the insertion of the welding parts arranged on the lens holder and the welding through holes arranged on the PCB circuit board, the laser welding technology can be used to weld and assemble the plurality of welding parts and the plurality of welding through holes at the same time, that is, to weld and assemble the lens holder and the PCB circuit board; Therefore, it can be understood that, on the one hand, since the coefficient of thermal expansion of the solder is much smaller than that of the glue, when the assembled camera module operates in a high or low temperature cycle, the relative position between the optical lens and the image sensor will not deviate due to the mismatch of thermal expansion performance; on the other hand, the curing shrinkage of the solder has less impact on the positioning accuracy. Moreover, when the lens holder is welded and assembled with the PCB circuit board, it can be understood that the molten solder will flow into the annular space between the welding through-hole and the welding part. That is to say, the molten solder will surround the welding part circumferentially. In this way, although shrinkage stress will be generated when the solder cures, this stress will act on the welding part uniformly in the circumferential direction of the welding part, thus achieving a self-balanced state and having no adverse impact on the docking accuracy. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments of the present invention. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0025] Figure 1 Schematic diagram of the assembly structure of the camera module in the prior art.

[0026] Figure 2 Schematic flow chart of the assembly method of the camera module described in the embodiment of the present application.

[0027] Figure 3 Exploded structure diagram of the assembly process of the camera module described in the embodiment of the present application.

[0028] Figure 4 Schematic structure diagram of the assembly process of the camera module described in the embodiment of the present application.

[0029] Figure 5 A solder ring is respectively placed at the position of each welding through-hole on the side of the PCB circuit board facing away from the image sensor in the embodiment of the present application.

[0030] Figure 6 is Figure 5 partial enlarged view of

[0031] Figure 7 Schematic structure diagram of the PCB circuit board provided with four welding through-holes in the embodiment of the present application.

[0032] Figure 8 Schematic structure diagram of the welding through-hole in the embodiment of the present application.

[0033] Figure 9Schematic structural diagram of the welded part in the embodiments of the present application.

[0034] Among them, reference numerals: 100 - jaw, 200 - UV glue, 10 - lens holder, 11 - welded part, 12 - optical lens, 111 - connecting seat, 112 - welding post, 113 - insertion post, 20 - PCB circuit board, 21 - welding through hole, 22 - image sensor, 23 - first surface, 24 - second surface, 211 - pad, 212 - welding side wall, 30 - first fixture, 40 - second fixture, 50 - solder ring, 60 - beam splitting mechanism, 70 - laser, 80 - annular accommodation space, X - first direction. Detailed implementation manners

[0035] In order to better understand the above technical solutions, exemplary embodiments of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein.

[0036] Figure 1 Schematic assembly structure diagram of the camera module in the prior art. Refer to Figure 1 , it can be seen that the existing assembly process of the camera module is as follows: First, fix the lens holder 10 to the PCB circuit board 20 on which the image sensor has been pasted (i.e., installed); then, evenly apply UV glue 200 to the end of the lens holder 10; then use the jaw 100 to pick up the optical lens 12 and move it to the end position of the lens holder 10, so that the optical lens 12 contacts the UV glue 200; finely adjust the six degrees of freedom of the jaw 100 to make the optical axis of the optical lens 12 correspond to the photosensitive surface of the image sensor 22 on the PCB circuit board 20 until the imaging of the image sensor 22 meets the standard; finally, irradiate the connection between the optical lens 12 and the lens holder 10 with an ultraviolet lamp to cure the UV glue 200, that is, complete the assembly of the camera module.

[0037] It can be seen that due to the use of UV glue, during the curing process of the UV glue irradiated by the ultraviolet lamp, due to the curing shrinkage effect of the glue, it is very likely to have an adverse impact on the alignment accuracy of the fine-tuned optical lens and the image sensor, thus unable to meet the high-quality imaging requirements; in addition, considering that the UV glue has a large coefficient of thermal expansion and does not match the coefficients of thermal expansion of other components such as the optical lens, when the assembled camera module operates in a high-temperature or low-temperature environment, it will cause a deviation in the relative position between the optical axis of the optical lens and the photosensitive surface of the image sensor, affecting the imaging quality and unable to meet the high-quality imaging requirements; furthermore, the bonding surface strength of the UV glue is low and cannot meet the operating conditions of vibration or impact.

[0038] In view of the above situation, an embodiment of the present application provides an assembly method for a camera module to solve the above problems.

[0039] Figure 2 It is a schematic flowchart of the assembly method for the camera module described in the embodiment of the present application. Figure 3 It is an exploded structural schematic diagram of the assembly process of the camera module described in the embodiment of the present application. Please refer to Figure 2 and Figure 3 An assembly method for a camera module includes: S1. Along the first direction X, fixedly install a plurality of welding parts 11 at the first end of the lens holder 10 and fixedly install an optical lens 12 at the second end of the lens holder 10; wherein, the welding parts 11 extend along the first direction X, and the optical axis direction of the optical lens 12 is set along the first direction X. S2. Respectively set welding through-holes 21 at the projection positions of the PCB circuit board 20 corresponding to the plurality of welding parts 11, and the plurality of welding through-holes 21 circumferentially surround the image sensor 22 on the PCB circuit board 20. S3. Manipulate a fixture for clamping at least one of the lens holder 10 and the PCB circuit board 20 to dock the lens holder 10 and the PCB circuit board 20 along the first direction X, so that the plurality of welding parts 11 are respectively inserted into the corresponding welding through-holes 21. S4. When the imaging of the image sensor 2 reaches the standard by manipulating the fixture, use laser welding technology to simultaneously weld the plurality of welding parts 11 to the welding through-holes 21 into which they are inserted, so as to weld and assemble the camera module.

[0040] Generally speaking, the assembly method of this embodiment is to weld and assemble the lens holder installed by plugging and the PCB circuit board through laser welding technology. It can be understood that the laser welding technology can use a beam splitting mechanism to simultaneously weld multiple welded parts (fixed to the lens holder) to the welding through holes (fixed to the PCB circuit board) where they are plugged. That is, when the optical axis of the optical lens is aligned with the photosensitive surface of the image sensor, multiple welding points of the lens holder and the PCB circuit board are welded simultaneously, greatly improving the assembly accuracy.

[0041] Specifically, in step S1, the lens holder extends along the first direction. At both ends of the lens holder along the first direction, multiple welded parts and the optical lens are fixedly installed respectively. That is, multiple welded parts are arranged at one end for connection with the PCB circuit board, and the optical lens is arranged at the other end for light to enter. It can be understood that the welded parts should extend along the first direction, and the optical axis direction of the optical lens is the above-mentioned first direction.

[0042] Implementably, for example, the first end of the lens holder is circumferentially arranged in a square shape relative to the first direction. Then, multiple welded parts can be fixed on the end face of the first end of the lens holder. For example, four welded parts can be specifically arranged, and each welded part is located at one vertex of the square. Of course, three welded parts can also be arranged, and this embodiment does not limit this.

[0043] In step S2, the PCB circuit board is arranged perpendicular to the first direction. The PCB circuit board includes a first surface and a second surface opposite to each other. The image sensor is installed on the first surface. Then, the PCB circuit board is provided with multiple welding through holes that penetrate the first surface and the second surface. The multiple welding through holes circumferentially surround the image sensor. And when the lens holder and the PCB circuit board are butt-jointed and installed, the multiple welding through holes correspond to the multiple welded parts one by one. Or rather, welding through holes are respectively provided at multiple projection positions on the PCB circuit board corresponding to the welded parts. It can be understood that in this way, when the lens holder and the PCB circuit board are butt-jointed and installed, the multiple welding through holes and the multiple welded parts can achieve one-to-one corresponding simultaneous plugging installation.

[0044] In step S3, the PCB circuit board can be fixed first, and then a fixture is used to clamp the lens holder. In this way, by controlling the fixture, the lens holder and the PCB circuit board can be butt-jointed and installed along the first direction, that is, the above-mentioned multiple welded parts and the multiple welding through holes are plugged and installed correspondingly.

[0045] Or, it can be understood that the lens holder can also be fixed and a fixture is used to clamp the PCB circuit board to achieve the plugging installation of the two. Of course, in other embodiments, two fixtures can also be used to clamp the PCB circuit board and the lens holder respectively. In this way, by simultaneously controlling the two fixtures, the butt-jointed installation of the lens holder and the PCB circuit board along the first direction can also be achieved.

[0046] In step S4, first, it can be understood that by finely adjusting one or two of the above fixtures, the imaging of the image sensor on the PCB can meet the standard. When the imaging meets the standard, the above-mentioned multiple weldments can be simultaneously welded to the welding through-holes into which they are inserted by using laser welding technology in combination with a beam splitting mechanism, thereby completing the welding and assembly of the imaging device.

[0047] It can be seen that, first, the assembly method of this embodiment uses laser welding technology. Since the heat-affected zone of the laser heat source is small, this can effectively reduce the influence of the welding heat on the area around the welding through-holes on the PCB and other components, greatly improving the assembly accuracy and meeting the requirements of high-quality cameras; second, the assembly method of this embodiment utilizes the characteristics of the solder with a small coefficient of thermal expansion and strong environmental adaptability to solve the problem of poor imaging quality of the camera module in high-temperature and low-temperature environments; third, the assembly method of this embodiment utilizes the high-strength characteristics of the solder joints to solve the problem that the existing assembly methods cannot meet the working conditions of vibration or impact.

[0048] The embodiment of the present application provides an assembly method of a camera module, a camera module, and an imaging device. The assembly method first fixedly installs a plurality of weldments and an optical lens at both ends of a lens holder respectively; then, welding through-holes are respectively arranged at a plurality of projection positions corresponding to the weldments on the PCB; then, at least one fixture is controlled to dock and install the lens holder and the PCB, so that the plurality of weldments can be respectively inserted into the corresponding welding through-holes; when the imaging of the image sensor meets the standard by controlling the at least one fixture, the laser welding technology can be used to simultaneously weld the plurality of weldments to the inserted plurality of welding through-holes, so that the camera module can be welded and assembled.

[0049] That is to say, different from the method of assembling the lens holder and the optical lens with glue, in this embodiment, on the basis of inserting the weldments provided on the lens holder into the welding through-holes provided on the PCB, the laser welding technology can be used to simultaneously weld and assemble the plurality of weldments and the plurality of welding through-holes, that is, to weld and assemble the lens holder and the PCB; Therefore, it can be understood that, on the one hand, since the coefficient of thermal expansion of the solder is much smaller than that of the glue, when the assembled camera module runs in a high or low temperature cycle, the relative position between the optical lens and the image sensor will not deviate due to the mismatch of thermal expansion performance; on the other hand, the curing shrinkage of the solder has less influence on the positioning accuracy. Moreover, when the lens holder is welded and assembled with the PCB circuit board, it can be understood that the molten solder will flow into the annular space between the welding through hole and the welding part, that is to say, the molten solder will surround the welding part circumferentially. In this way, although shrinkage stress will be generated when the solder solidifies, this stress will act on the welding part uniformly in the circumferential direction of the welding part, thus reaching a self-balanced state and having no adverse effect on the docking accuracy.

[0050] In a possible implementation manner, step S1 includes: S101. Along the circumferential end face of the first end of the lens holder 10, embed the connection seat 111 of the welding part 11 into the lens holder 10 by means of hot riveting or insert molding, and expose the surface of the connection seat 111 outside the lens holder 10; wherein, the welding part 11 further includes a welding post 112 extending along the first direction X from the connection seat 111, and the diameter of the welding post 112 is smaller than the diameter of the connection seat 111. S102. Fix and install the optical lens 12 at the second end of the lens holder 10 by any one of the installation methods such as screw installation, plug-in installation, and snap installation.

[0051] Specifically, in combination with Figure 6 、 Figure 9 , in step S101, first, the welding part 11 includes, for example, a connection seat 111 in the shape of a round cake. One end of the connection seat 111 is provided with a welding post 112 for plugging into the above-mentioned welding through hole 21, and the other end of the connection seat 111 is provided with a plug-in post 113 for plugging into the lens holder 10; wherein, for easy understanding, the diameter of the welding post is usually smaller than the diameter of the connection seat.

[0052] The connection seat can be specifically embedded in the end face of the first end of the lens holder by means of hot riveting or insert molding. Among them, it can be understood that for the convenience of welding, the surface of the connection seat should be exposed outside the lens holder.

[0053] Specifically, in step S102, the optical lens can be fixed to the second end of the lens holder in a variety of ways, such as screw installation, plug-in installation, or snap installation, etc. This embodiment does not limit this.

[0054] In a possible implementation manner, step S2 includes: S201. At multiple projection positions on the PCB circuit board 20 corresponding to the welding parts 11, installation through-holes are respectively opened, and the diameter of the installation through-hole is between the diameter of the connection seat 111 of the welding part 11 and the diameter of the welding post 112; S202. Use surface treatment technology to form solder pads 211 on the radial outer side of the installation through-holes, so that the installation through-holes form weldable welding through-holes 21; wherein, the solder pads 211 are at least located on the side of the PCB circuit board 20 facing away from the image sensor 22.

[0055] That is, this embodiment gives an implementation step of the above-mentioned welding through-hole.

[0056] First, multiple installation through-holes can be opened on the PCB circuit board; wherein, the diameter of the installation through-hole should be between the diameter of the above-mentioned connection seat and the diameter of the welding post.

[0057] Then, surface treatment technologies such as immersion gold, OSP (Organic Solderability Preservatives), etc. can be used to set solder pads on the radial outer side of the installation through-holes; at this time, it can be understood that the solder pads should be at least located on the side of the PCB circuit board facing away from the image sensor, so that the installation through-holes after surface treatment can form weldable welding through-holes.

[0058] Specifically, reference can be made to Figure 8 , on the side of the PCB circuit board 20 facing away from the image sensor 22 and on the side facing the image sensor 22, solder pads 211 can be provided on the radial outer side of the installation through-holes, and the solder pads 211 on both sides are connected by welding side walls 212 located on the circumferential side wall of the installation through-hole.

[0059] In a possible implementation manner, step S3 includes: S301. Use the first fixture 30 to clamp the PCB circuit board 20 and adjust the first fixture 30 so that the side of the PCB circuit board 20 facing away from the image sensor 22 faces upward; S302. Use the second fixture 40 to clamp the lens holder 10 and adjust the second fixture 40 so that the first end of the lens holder 10 faces upward; S303. Adjust the position of the second fixture 40 in the plane perpendicular to the first direction X so that the multiple welding parts 11 are respectively axially aligned with the corresponding welding through-holes 21; S304. Drive the second fixture 40 to rise along the first direction X so that the multiple welding parts 11 are respectively inserted into the corresponding welding through-holes 21.

[0060] That is, this embodiment gives the implementation steps of docking and installing the lens holder and the PCB circuit board along the first direction using two fixtures.

[0061] First, considering that solder needs to be placed later, after the first fixture clamps the PCB circuit board, the first fixture can be adjusted so that the side of the PCB circuit board facing away from the image sensor faces upward, that is, the PCB circuit board is placed with the image sensor facing downward; Then, with the image sensor facing downward, after the second fixture clamps the lens holder, the second fixture can be adjusted so that the end of the lens holder with the welding parts faces upward; Next, the second fixture can be adjusted so that the multiple welding parts are axially aligned with the corresponding welding through holes respectively; finally, by driving the second fixture to rise along the first direction (at this time, the first direction is the vertical direction), the multiple welding parts can be inserted into the corresponding welding through holes respectively.

[0062] In a possible implementation manner, step S4 includes: S401. Place a solder ring 50 at the position of each welding through hole 21 on the side of the PCB circuit board 20 facing away from the image sensor 22; wherein, the solder ring 50 is sleeved outside the welding part 11 protruding from the welding through hole 21; S402. Control the spatial position and three-dimensional rotating shaft of at least one of the first fixture 30 and the second fixture 40 to make the imaging of the image sensor 22 meet the standard; S403. Use a laser to irradiate each solder ring 50 simultaneously through the light splitting mechanism 60 arranged above the PCB circuit board 20, so that the multiple solder rings 50 are melted simultaneously, and the melted solder flows into the annular accommodation space 80 between the welding through hole 21 and the welding part 11.

[0063] It should be noted that placing the solder can be prior to adjusting the imaging to meet the standard. In this way, the already adjusted alignment position will not be affected by placing the solder.

[0064] Among them, a solder ring should be placed at each welding through hole on the second surface of the PCB circuit board; specifically, the height of the welding column can protrude relative to the second surface of the PCB circuit board, and then, the solder ring can be sleeved outside the protruding end of the welding column.

[0065] After placing the solder ring, the first fixture and the second fixture can be finely adjusted simultaneously to make the imaging of the image sensor meet the standard; here, it can be understood that the determination of whether the imaging meets the standard can be determined manually, or can also be determined by using, such as, a determination software, etc.

[0066] After the first fixture and the second fixture are finely adjusted, the laser can irradiate each solder ring simultaneously through the beam splitting mechanism disposed above the PCB circuit board. It can be understood that in this way, multiple solder rings can be melted synchronously. It should also be understood that in combination with the fact that the diameter of the welding through hole mentioned above is between the diameter of the connection base and the diameter of the welding post (the thickness of the welding side wall can be ignored), at this time, the melted solder will flow into the annular accommodation space between the welding through hole and the welded part. Then, in combination with the welding stress acting on the circumference of the welded part when the solder solidifies, at this time, it can be understood that the welding stress circumferentially surrounding the welded part will reach a self-balanced state, that is, it will not have an adverse impact on the alignment accuracy.

[0067] Based on the above assembly method, an embodiment of the present application also discloses an imaging device, which includes a camera module. The camera module is obtained by the following assembly method: Along the first direction, a plurality of welded parts are fixedly installed at the first end of the lens holder, and an optical lens is fixedly installed at the second end of the lens holder; wherein, the welded parts extend along the first direction, and the optical axis direction of the optical lens is arranged along the first direction; Welding through holes are respectively arranged at a plurality of projection positions corresponding to the welded parts on the PCB circuit board, and the plurality of welding through holes circumferentially surround the image sensor on the PCB circuit board; Manipulate the fixture that clamps at least one of the lens holder and the PCB circuit board to dock the lens holder and the PCB circuit board along the first direction, so that the plurality of welded parts are respectively inserted into the corresponding welding through holes; When the imaging of the image sensor reaches the standard by manipulating the fixture, the laser welding technology is used to weld the plurality of welded parts to the welding through holes into which they are inserted simultaneously, so as to weld and assemble the camera module.

[0068] An embodiment of the present application also discloses a camera module, which includes a PCB circuit board 20, a lens holder 10 and an optical lens 12; wherein, the PCB circuit board 20 is arranged perpendicular to the first direction X, the PCB circuit board 20 includes a first surface 23 and a second surface 24 facing away from each other, and an image sensor 22 is installed on the first surface 23; the lens holder 10 extends along the first direction X, and the first end of the lens holder 10 is used for fixedly installing on the first surface 23 so that the lens holder 10 covers the image sensor 22; the optical lens 12 is fixedly installed at the second end of the lens holder 10; wherein, a plurality of welded parts 11 are fixedly installed at the first end of the lens holder 10, and the welded parts 11 extend along the first direction X; the PCB circuit board 20 is respectively provided with welding through holes 21 at a plurality of projection positions corresponding to the welded parts 11, the welding through holes 21 penetrate through the first surface 23 and the second surface 24, and the welding through holes 21 are used for the welded parts 11 to be inserted and installed along the first direction X; so that when the plurality of welded parts 11 are respectively inserted into the corresponding welding through holes 21, the welded parts 11 and the welding through holes 21 are welded and assembled.

[0069] It can be understood that the camera module provided in this embodiment is the camera module assembled by using the assembly method disclosed in the above embodiment.

[0070] That is, the first end of the lens holder in the first direction is welded to the PCB circuit board, and the second end is fixedly installed with an optical lens; specifically, regarding the welded joint, a welding part is fixed at the end of the lens holder, and the PCB circuit board is provided with a welding through hole for the welding part to be inserted; it can be understood that for the convenience of welding, the welding part and the welding through hole are usually made of metal or alloy materials, and it is advisable to be able to realize laser welding. For example, the welding part is made of copper material.

[0071] Among them, the optical lens 12 and the second end of the lens holder 10 can be fixedly installed by any one of the installation methods of screw installation, plug-in installation, and snap installation.

[0072] Specifically, the welding part 11 includes a connection seat 111 and a welding post 112 extending along the first direction X from the connection seat 111; among them, the connection seat 111 is embedded in the end face of the first end of the lens holder 10 and is exposed, and a plug-in post 113 for inserting into the lens holder 10 can also be provided at one end of the connection seat 111 facing away from the welding post 112, and the diameter of the welding post 112 is smaller than the diameter of the connection seat 111; and, the diameter of the welding through hole 21 is between the diameter of the welding post 112 and the diameter of the connection seat 111, so that the solder for welding assembly is located in the annular accommodation space 80 between the welding through hole 21 and the welding post 112.

[0073] Among them, the height of the welding post 112 should be greater than the thickness of the PCB circuit board 20, so that the end of the welding post 112 protrudes relative to the second surface 24.

[0074] Among them, the welding through hole 21 includes an installation through hole penetrating the first surface 23 and the second surface 24, and at least one annular solder pad 211 is provided on one side of the second surface 24, and the solder pad 211 extends radially outward from the end of the installation through hole.

[0075] More specifically, solder pads 211 are provided on one side of the first surface 23 and on one side of the second surface 24 of the installation through hole, and the solder pads 211 on both sides are connected by a welding side wall 212 located on the circumferential side wall of the installation through hole.

[0076] Based on the above camera module, an embodiment of the present application also discloses a camera device, which includes a camera module, and the camera module includes: A PCB circuit board perpendicular to the first direction, the PCB circuit board includes a first surface and a second surface facing away from each other, and an image sensor is installed on the first surface; A lens holder extending in a first direction, with the first end of the lens holder for fixedly mounting on a first surface so that the lens holder masks an image sensor; and, An optical lens fixedly mounted on the second end of the lens holder; Wherein, a plurality of welding parts are fixedly mounted at the first end of the lens holder, and the welding parts extend in the first direction; A PCB circuit board is respectively provided with welding through holes at a plurality of projection positions corresponding to the welding parts. The welding through holes penetrate through the first surface and the second surface, and the welding through holes are used for the welding parts to be inserted and mounted along the first direction; So that when the plurality of welding parts are respectively inserted into the corresponding welding through holes, the welding parts and the welding through holes are welded and assembled.

[0077] The basic principles of the present application have been described above in combination with specific embodiments. However, it should be noted that the advantages, advantages, effects, etc. mentioned in the present application are only examples and not limitations. It cannot be considered that these advantages, advantages, effects, etc. are essential for each embodiment of the present application. In addition, the above-disclosed specific details are only for the purposes of illustration and facilitating understanding, rather than limitations. The above details do not limit the present application to necessarily adopt the above specific details to implement.

[0078] The block diagrams of the devices, apparatuses, equipment, and systems involved in the present application are only illustrative examples and do not intend to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open-ended words, meaning "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used herein refer to the word "and / or", and can be used interchangeably with it, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to", and can be used interchangeably with it.

[0079] It should also be noted that in the devices, equipment, and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present application.

[0080] The above description of the disclosed aspects enables any person skilled in the art to make or use the present application. Various modifications to these aspects are very obvious to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but to the broadest scope consistent with the principles and novel features disclosed herein.

[0081] The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit embodiments of the present application to the form disclosed herein. Although several example aspects and embodiments have been discussed above, those skilled in the art will recognize that certain variations, modifications, alterations, additions, and sub-combinations thereof are within the scope of the present invention.

Claims

1. An assembly method for a camera module, characterized in that, The assembly method includes: Fixing and installing a plurality of welding parts at the first end of the lens holder and fixing and installing an optical lens at the second end of the lens holder along a first direction; wherein, the welding parts extend along the first direction, and the optical axis direction of the optical lens is arranged along the first direction; Providing welding through holes at a plurality of projection positions corresponding to the welding parts on the PCB circuit board, and the plurality of welding through holes circumferentially surround an image sensor on the PCB circuit board; Controlling a fixture for clamping at least one of the lens holder and the PCB circuit board to dock the lens holder and the PCB circuit board along the first direction, so that the plurality of welding parts are respectively inserted into the corresponding welding through holes; When the imaging of the image sensor reaches the standard by controlling the fixture, simultaneously welding the plurality of welding parts to the welding through holes into which they are inserted by using laser welding technology, so as to weld and assemble the camera module.

2. The assembly method according to claim 1, wherein The step of fixing and installing a plurality of welding parts at the first end of the lens holder and fixing and installing an optical lens at the second end of the lens holder includes: Along the circumferential end face of the first end of the lens holder, embedding a connecting seat of the welding part into the lens holder by using a hot riveting or insert molding method, and exposing the surface of the connecting seat outside the lens holder; wherein, the welding part further includes a welding post extending along the first direction from the connecting seat, and the diameter of the welding post is smaller than the diameter of the connecting seat; Fixing and installing the optical lens at the second end of the lens holder by any one of a screw installation, a plug-in installation and a snap installation.

3. The assembly method according to claim 1, characterized in that, The step of providing welding through holes at a plurality of projection positions corresponding to the welding parts on the PCB circuit board includes: Respectively opening installation through holes at a plurality of projection positions corresponding to the welding parts on the PCB circuit board, and the diameter of the installation through hole is between the diameter of the connecting seat of the welding part and the diameter of the welding post; Using a surface treatment technology to form a solder pad on the radially outer side of the installation through hole, so that the installation through hole forms the weldable welding through hole; wherein, the solder pad is at least located on the side of the PCB circuit board facing away from the image sensor.

4. The assembly method according to claim 3, characterized in that, On the side of the PCB circuit board facing away from the image sensor and on the side facing the image sensor, the radially outer sides of the installation through holes are both provided with the solder pads, and the solder pads on both sides are connected by a welding side wall located on the circumferential side wall of the installation through hole.

5. The assembly method according to claim 1, characterized in that, The step of controlling a fixture for clamping at least one of the lens holder and the PCB circuit board to dock the lens holder and the PCB circuit board along the first direction includes: Using a first fixture to clamp the PCB circuit board and adjusting the first fixture to make the side of the PCB circuit board facing away from the image sensor face upward; Using a second fixture to clamp the lens holder and adjusting the second fixture to make the first end of the lens holder face upward; Adjusting the position of the second fixture in a plane perpendicular to the first direction so that the plurality of welding parts are respectively axially aligned with the corresponding welding through holes; Drive the second fixture to rise along the first direction so that the plurality of welding parts are respectively inserted into the corresponding welding through holes.

6. The assembly method according to claim 5, characterized in that, The step of simultaneously welding the plurality of welding parts to the welding through holes into which they are inserted by using laser welding technology includes: Place a solder ring at each position of the welding through holes on the side of the PCB board facing away from the image sensor; wherein, the solder ring is sleeved outside the welding part protruding from the welding through hole. Control the spatial position and the three-dimensional rotating shaft of at least one of the first fixture and the second fixture to make the imaging of the image sensor meet the standard. Use a laser to simultaneously irradiate each solder ring through a beam splitting mechanism arranged above the PCB board, so that the plurality of solder rings are melted simultaneously, and the melted solder flows into the annular accommodation space between the welding through hole and the welding part.

7. An imaging device, characterized in that, The imaging device includes a camera module, and the camera module is obtained by the following assembly method: Along the first direction, fixedly install a plurality of welding parts at the first end of the lens holder and fixedly install an optical lens at the second end of the lens holder; wherein, the welding parts extend along the first direction, and the optical axis direction of the optical lens is arranged along the first direction. Welding through holes are respectively arranged at a plurality of projection positions of the PCB board corresponding to the welding parts, and the plurality of welding through holes circumferentially surround the image sensor on the PCB board. Control the fixture that clamps at least one of the lens holder and the PCB board to dock the lens holder and the PCB board along the first direction so that the plurality of welding parts are respectively inserted into the corresponding welding through holes. In the case where the imaging of the image sensor meets the standard by controlling the fixture, use laser welding technology to simultaneously weld the plurality of welding parts to the welding through holes into which they are inserted, so that the camera module is welded and assembled.

8. A camera module, characterized in that, The camera module includes: A PCB board arranged perpendicular to the first direction, the PCB board includes a first surface and a second surface facing away from each other, and an image sensor is installed on the first surface. A lens holder extending along the first direction, the first end of the lens holder is used for being fixedly installed on the first surface so that the lens holder shields the image sensor; and An optical lens fixedly installed at the second end of the lens holder. Wherein, a plurality of welding parts are fixedly installed at the first end of the lens holder, and the welding parts extend along the first direction. The PCB board is respectively provided with welding through holes at a plurality of projection positions corresponding to the welding parts, the welding through holes penetrate through the first surface and the second surface, and the welding through holes are used for the welding parts to be inserted and installed along the first direction. So that when the plurality of welding parts are respectively inserted into the corresponding welding through holes, the welding parts and the welding through holes are welded and assembled.

9. The camera module according to claim 8, wherein The welding part includes a connecting seat and a welding post extending along the first direction from the connecting seat. Wherein, the connecting seat is embedded in the end face of the first end of the lens holder and is exposed, and the diameter of the welding post is smaller than the diameter of the connecting seat. Moreover, the diameter of the soldering through-hole is between the diameter of the soldering post and the diameter of the connection base, so that the solder for soldering assembly is located in the annular accommodation space between the soldering through-hole and the soldering post.

10. The camera module according to claim 9, characterized in that, The height of the soldering post is greater than the thickness of the PCB circuit board, so that the end of the soldering post protrudes relative to the second surface.

11. The camera module according to claim 9, wherein, The soldering member is made of a weldable metal material or alloy material.

12. The camera module according to claim 8, wherein The soldering through-hole includes a mounting through-hole penetrating the first surface and the second surface. The mounting through-hole is provided with an annular pad at least on one side of the second surface, and the pad extends radially outward from the end of the mounting through-hole.

13. The camera module according to claim 12, wherein, The mounting through-hole is provided with pads on both the first surface side and the second surface side, and the pads on both sides are connected by a soldering side wall located on the circumferential side wall of the mounting through-hole.

14. The camera module according to claim 8, wherein The optical lens and the second end of the lens holder are fixedly installed by any one of screw installation, plug-in installation, and snap installation.

15. An imaging device, characterized in that, The imaging device includes a camera module, and the camera module includes: A PCB circuit board perpendicular to the first direction, the PCB circuit board includes a first surface and a second surface facing away from each other, and an image sensor is installed on the first surface; A lens holder extending along the first direction, the first end of the lens holder is used for fixedly installing on the first surface so that the lens holder masks the image sensor; and An optical lens fixedly installed at the second end of the lens holder; Wherein, a plurality of soldering members are fixedly installed at the first end of the lens holder, and the soldering members extend along the first direction; The PCB circuit board is respectively provided with soldering through-holes at a plurality of projection positions corresponding to the soldering members, the soldering through-holes penetrate the first surface and the second surface, and the soldering through-holes are used for the soldering members to be inserted and installed along the first direction; So that when the plurality of soldering members are respectively inserted into the corresponding soldering through-holes, the soldering members are soldered and assembled with the soldering through-holes.

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