Loudspeaker module and earphone

Abstract

The invention provides a loudspeaker module and an earphone. The loudspeaker module comprises a first loudspeaker unit, a support and a second loudspeaker unit. The first loudspeaker unit comprises a basin stand and a wiring terminal, and the wiring terminal is arranged on the basin stand; the bracket comprises a conductive part; the second loudspeaker unit is fixed to the basin stand by means of the support, and an electrode of the second loudspeaker unit is electrically connected with the wiring terminal by means of the conductive part. According to the loudspeaker module provided by the embodiment of the invention, the electrical connection relationship between the first loudspeaker unit and the second loudspeaker unit can be simplified to a certain extent, at least one signal line for electrically connecting the first loudspeaker unit and the second loudspeaker unit can be omitted, the structure of the whole loudspeaker module is simplified, and the reliability of the loudspeaker module is improved. And the loudspeaker module can be electrically connected to the circuit board by means of the wiring terminal.

Description

[0001] This application is a divisional application. The application number of the original application is 202111276330.X, the original application date is October 29, 2021, and the entire content of the original application is incorporated herein by reference. Technical Field

[0002] This application relates to the technical field of electronic products, and particularly to a speaker module and an earphone. Background Art

[0003] During the use of electronic products, in order to enable users to listen to the sound information provided by electronic products without disturbing others, earphones have become essential accessories for electronic products.

[0004] In related technologies, the structural compactness of the speaker module in the earphone is poor, and the assembly efficiency is low. Summary of the Invention

[0005] This application provides a speaker module and an earphone, which have good structural compactness.

[0006] To achieve the above object, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, this application provides a speaker module, including: a first speaker unit, a bracket, and a second speaker unit. The first speaker unit includes a chassis and a terminal, and the terminal is arranged on the chassis; the bracket includes a conductive part; the second speaker unit is fixed to the chassis by means of the bracket, and the electrode of the second speaker unit is electrically connected to the terminal by means of the conductive part.

[0008] For the speaker module according to the embodiment of the first aspect of this application, by providing a bracket and using the bracket to fix the chassis of the first speaker unit and the second speaker unit, the first speaker unit and the second speaker unit are connected as a whole, so as to facilitate modularization of the speaker module. In this way, when the speaker module is installed, the first speaker unit and the second speaker unit can be installed as a whole, so that it is not necessary to separately install the first speaker unit and the second speaker unit into the housing of the earphone, which can simplify the installation of the speaker module and also achieve the structural compactness of the speaker module. In addition, by making the bracket have a conductive part, and the electrode of the second speaker unit is electrically connected to the terminal by means of the conductive part. Thus, the electrical connection relationship between the first speaker unit and the second speaker unit can be simplified to at least a certain extent, at least one signal line for electrically connecting the first speaker unit and the second speaker unit can be omitted, the structure of the entire speaker module can be simplified, and it is also convenient for the speaker module to be electrically connected to the circuit board by means of the terminal.

[0009] In a possible implementation of the first aspect of the present application, the terminal includes a negative terminal, and the negative pole of the second speaker unit is electrically connected to the negative terminal by means of a conductive part, and the conductive part can be electrically connected to the ground point on the circuit board. Such an arrangement can omit the negative signal line connected between the negative terminal and the negative pole of the second speaker unit, simplify the structure of the speaker module, and when the conductive part is grounded, it can also improve the reliability of the bracket use and avoid the short-circuit problem to a certain extent.

[0010] In a possible implementation of the first aspect of the present application, the first speaker unit includes a first diaphragm group, and the first diaphragm group is supported on a chassis; the bracket includes a support plate and a connecting part, the support plate is located on one axial side of the first speaker unit and is opposite to the outer surface of the first diaphragm group, the connecting part is connected between the outer peripheral edge of the support plate and the peripheral wall of the chassis, and the second speaker unit is supported on the side of the support plate away from the first speaker unit. Such an arrangement can facilitate the use of the support plate to support the second speaker unit. In other embodiments, the bracket may not include a support plate.

[0011] In a possible implementation of the first aspect of the present application, the conductive part may be constituted by only a part of the connecting part.

[0012] In a possible implementation of the first aspect of the present application, the conductive part may be constituted by only the connecting part.

[0013] In a possible implementation of the first aspect of the present application, the conductive part may be constituted by a part of the connecting part and a part of the support plate.

[0014] In a possible implementation of the first aspect of the present application, the conductive part may be constituted by a part of the connecting part and the entire support plate.

[0015] In a possible implementation of the first aspect of the present application, the conductive part may be constituted by the bracket. In this way, the structure of the bracket can be simplified, the processing and manufacturing of the bracket can be facilitated, and the processing cost can be reduced.

[0016] In a possible implementation of the first aspect of the present application, a first sound transmission channel is formed on the support plate, and the second speaker unit does not cover the first sound transmission channel. Such an arrangement can avoid the blocking of the sound transmission generated by the vibration of the first diaphragm group by the support plate and the second speaker unit, so as not to affect the sound production effect of the first speaker unit.

[0017] In a possible implementation of the first aspect of the present application, there are a plurality of spaced-apart first sound transmission channels.

[0018] In a possible implementation manner of the first aspect of the present application, the support plate is formed into a ring shape to define a first sound transmission channel, and the second speaker unit is formed into a ring shape extending along the circumference of the support plate to define an avoidance channel, and the avoidance channel communicates with the first sound transmission channel.

[0019] In a possible implementation manner of the first aspect of the present application, the connecting portion includes at least two sub-parts, and the at least two sub-parts are spaced apart in the circumferential direction of the chassis. Each sub-part is connected between the outer peripheral edge of the support plate and the outer peripheral surface of the chassis. A clamping hole is formed on each sub-part, and a clamping rib cooperating with the clamping hole is formed on the outer peripheral surface of the chassis. Thereby, the detachable connection between the bracket and the chassis is realized. In other implementation manners, clamping ribs can also be formed on the sub-parts and clamping holes can be formed on the chassis.

[0020] In a possible implementation manner of the first aspect of the present application, clamping holes are formed on some of the at least two sub-parts.

[0021] In a possible implementation manner of the first aspect of the present application, a sound transmission channel can be formed between two adjacent sub-parts. Thereby, the sound generated by the vibration of the first diaphragm group is transmitted through the sound transmission channel, and the sound production effect of the first speaker unit is improved.

[0022] In a possible implementation manner of the first aspect of the present application, in a plane parallel to the plane of the first diaphragm group, a part of the orthographic projection of the sound transmission channel is located inside the outer contour of the orthographic projection of the first diaphragm group. With such a setting, the transmission effect of the sound transmission channel on the sound emitted by the first speaker unit can be further improved.

[0023] In a possible implementation manner of the first aspect of the present application, a second sound transmission channel is formed on the part of each sub-part located between the first diaphragm group and the support plate. With such a setting, the transmission effect of the sound emitted by the first speaker unit can be further improved.

[0024] In a possible implementation manner of the first aspect of the present application, a second sound transmission channel is formed on the part of some of the at least two sub-parts located between the first diaphragm group and the support plate.

[0025] In a possible implementation manner of the first aspect of the present application, the connecting portion is formed into a closed ring shape extending along the circumference of the chassis, a clamping hole is formed on the connecting portion, and a clamping rib cooperating with the clamping hole is formed on the outer peripheral surface of the chassis. Thereby, the detachable connection between the bracket and the chassis is realized. In other implementation manners, clamping ribs can also be formed on the connecting portion and clamping holes can be formed on the chassis.

[0026] In a possible implementation manner of the first aspect of the present application, a plurality of card holes are formed on the connecting portion, and the plurality of card holes are spaced apart in the circumferential direction of the speaker frame. In this way, it is beneficial to improve the reliability of the cooperation between the connecting portion and the speaker frame.

[0027] In a possible implementation manner of the first aspect of the present application, a second sound transmission channel is formed on the portion of the connecting portion located between the first diaphragm group and the support plate. Such a setting can, to a certain extent, prevent the sub-part from blocking the first speaker unit and affecting the sound transmission of the first speaker unit.

[0028] In a possible implementation manner of the first aspect of the present application, a plurality of second sound transmission channels are formed on the portion of the connecting portion located between the first diaphragm group and the support plate, and the plurality of second sound transmission channels are spaced apart in the circumferential direction of the speaker frame. Such a setting can, to a certain extent, prevent the sub-part from blocking the first speaker unit and affecting the sound transmission of the first speaker unit.

[0029] In a possible implementation manner of the first aspect of the present application, in a plane parallel to the first diaphragm group, the orthographic projection of the second sound transmission channel is located within the outer contour of the orthographic projection of the first diaphragm group. Such a setting can further improve the sound transmission effect of the second sound transmission channel on the first speaker unit.

[0030] In a possible implementation manner of the first aspect of the present application, the first speaker unit includes a first voice coil, the first voice coil is connected to the inner surface of the first diaphragm group, and the negative terminal has a conductive extension portion located within the speaker frame, and the conductive extension portion can be electrically connected to the negative lead of the first voice coil. Since the negative lead of the first voice coil is relatively thin and its structural strength is relatively weak, it is easy to be scratched and damaged. Therefore, by electrically connecting the conductive extension portion to the negative lead of the first voice coil, the length of the negative lead can be shortened, avoiding the problem of scratching and damage of the negative lead with the speaker frame, which is beneficial to improving the reliability of the operation of the first voice coil.

[0031] In a possible implementation manner of the first aspect of the present application, the peripheral wall of the speaker frame has a first opening, the negative terminal has a conductive extension portion located within the speaker frame, the conductive extension portion extends to the first opening, and the portion of the conductive portion facing the first opening is connected to the conductive extension portion. In this way, not only can the second speaker unit be electrically connected to the negative terminal through the bracket, but also compared with the solution of directly connecting the conductive portion to the negative terminal located outside the speaker frame, the negative terminal does not need to extend too long outside the speaker frame, thus avoiding the interference between the negative terminal extending too long outside the speaker frame and the structures within the housing.

[0032] In a possible implementation of the first aspect of the present application, the speaker module includes a conductive member, the wiring terminal includes a positive wiring terminal, and the positive pole of the second speaker unit is electrically connected to the positive wiring terminal by means of the conductive member.

[0033] In a possible implementation of the first aspect of the present application, the conductive member can be an enameled wire. In this way, insulation between the conductive member and the bracket can be achieved.

[0034] In a possible implementation of the first aspect of the present application, the first speaker unit includes a first voice coil, the first voice coil is connected to the inner surface of the first diaphragm group, the positive wiring terminal is provided with a conductive wiring portion located inside the chassis, and the conductive wiring portion can be electrically connected to the positive lead of the first voice coil. Since the positive lead of the first voice coil is relatively thin and its structural strength is relatively weak, it is easily scratched and damaged. Therefore, by setting the conductive wiring portion to be electrically connected to the positive lead of the first voice coil, the length of the positive lead can be shortened, avoiding the problem of scratching and damage of the positive lead with the chassis, which is beneficial to improving the reliability of the operation of the first voice coil.

[0035] In a possible implementation of the first aspect of the present application, the positive wiring terminal is provided with a conductive wiring portion located inside the chassis, the peripheral wall of the chassis has a second opening, and the conductive member extends into the chassis through the second opening and is electrically connected to the conductive wiring portion. In this way, not only can the second speaker unit be electrically connected to the positive wiring terminal through the conductive member, but also compared with the scheme of directly electrically connecting the conductive member to the positive wiring terminal located outside the chassis, the positive wiring terminal does not need to extend too long outside the chassis, thus avoiding interference between the positive wiring terminal extending too long outside the chassis and the structures inside the housing.

[0036] In a possible implementation of the first aspect of the present application, a part of the conductive member is located on the side facing the outer surface of the connecting portion, a wiring groove is formed on the outer surface of the connecting portion, and a part of the conductive member is located in the wiring groove. Such a setting can prevent the conductive member from protruding from the outer surface of the connecting portion and interfering with other structures inside the housing.

[0037] In a possible implementation of the first aspect of the present application, the second speaker unit is a piezoelectric ceramic speaker unit, and the piezoelectric ceramic speaker unit and the support plate are stacked. Such a setting makes the structure more compact.

[0038] In a possible implementation of the first aspect of the present application, the negative pole of the second speaker unit is located at one end of the second speaker unit adjacent to the support plate, and the negative pole of the second speaker unit is connected to the support plate through conductive adhesive. Such a setting can facilitate the electrical connection between the negative pole of the second speaker unit and the support plate, and there is no need to additionally provide structures such as signal lines for electrical connection between the two, which can simplify the structure of the speaker module, reduce the cost of the speaker module, and at the same time facilitate assembly.

[0039] In a possible implementation of the first aspect of the present application, the positive electrode of the second speaker unit is located at one end of the second speaker unit facing away from the support plate, and the positive electrode of the second speaker unit is connected to the conductive member by conductive adhesive or welding. This arrangement can facilitate the separation of the positive and negative electrodes of the second speaker unit, and can at least to some extent avoid the problem of short circuit.

[0040] In a possible implementation of the first aspect of the present application, the piezoelectric ceramic speaker unit includes a piezoelectric ceramic sheet. The piezoelectric ceramic sheet includes a piezoelectric body, a first electrode layer, and a second electrode layer. The first electrode layer is disposed on one surface of the piezoelectric body facing the support plate to form the negative electrode of the piezoelectric ceramic speaker unit, and the first electrode layer can be electrically connected to the support plate by conductive adhesive. The second electrode layer is disposed on the surface of the piezoelectric body facing away from the support plate to form the positive electrode of the piezoelectric ceramic speaker unit, and the second electrode layer can be electrically connected to the conductive member.

[0041] In a possible implementation of the first aspect of the present application, the second speaker unit is a moving iron speaker unit, and the moving iron speaker unit is vertically supported on the support plate. This arrangement makes the structure more compact.

[0042] In a possible implementation of the first aspect of the present application, the moving iron speaker unit includes a second diaphragm group, and the second diaphragm group is arranged perpendicular to the first diaphragm group. Thus, it can at least to some extent avoid the interference of the sound output of the first speaker unit on the vibration of the second diaphragm group.

[0043] In a possible implementation of the first aspect of the present application, the second speaker unit further includes: a protective shell, a reed, a transmission rod, a second magnetic circuit system, and a second voice coil. The second diaphragm group is disposed in the protective shell to divide the space in the protective shell into a front cavity and a rear cavity, and the reed, the transmission rod, the second magnetic circuit system, and the second voice coil are all located in the rear cavity, and the reed, the transmission rod, the second magnetic circuit system, and the second voice coil cooperate to drive the second diaphragm group to vibrate.

[0044] In a possible implementation of the first aspect of the present application, the second diaphragm group is parallel to the axis of the first speaker unit to divide the space in the protective shell into a front cavity and a rear cavity. The second magnetic circuit system and the second voice coil are coaxially arranged. Thus, the structure is simple and the volume is small.

[0045] In a possible implementation of the first aspect of the present application, the reed includes a first sheet body, a second sheet body, and a connecting sheet body. The first sheet body and the second sheet body are both arranged parallel to the second diaphragm group. The second sheet body is located on the side of the first sheet body away from the second diaphragm group. A support body extending beyond the edge of the first sheet body is provided at one end of the second sheet body. The connecting sheet body is connected between the end of the second sheet body away from the support body and the end of the first sheet body away from the support body. The support body is connected to one end of the transmission rod, and the other end of the transmission rod is connected to the second diaphragm group.

[0046] In a possible implementation of the first aspect of the present application, the second magnetic circuit system includes a magnetic conduction part and two magnet parts. The magnetic conduction part is annular, and the axis of the magnetic conduction part is the same as the axis of the first speaker unit. The first sheet body is supported on the surface of the magnetic conduction part adjacent to the second diaphragm group. The two magnet parts are arranged inside the magnetic conduction part and are oppositely arranged in the radial direction of the magnetic conduction part. The second sheet body penetrates from one axial end of the magnetic conduction part to the other axial end of the magnetic conduction part so that the support body is located outside the magnetic conduction part, and the second sheet body is located between the two magnet parts.

[0047] In a possible implementation of the first aspect of the present application, the side wall of the protective shell adjacent to the support plate can be configured as a conductive structure, and the conductive structure can form the negative electrode of the second speaker unit. The conductive structure is electrically connected to the support plate through conductive glue, and the negative lead of the second voice coil is welded to the conductive structure. With such a setting, it is possible to electrically connect the negative electrode of the second speaker unit to the negative terminal through the bracket.

[0048] In a possible implementation of the first aspect of the present application, through holes are provided on the peripheral wall of the protective shell, and the negative lead of the second voice coil can pass through the through holes to be electrically connected to the bracket.

[0049] In a possible implementation of the first aspect of the present application, a wire passing hole is formed on the peripheral wall of the protective shell, and the conductive part can pass through the wire passing hole to be electrically connected to the positive lead of the second voice coil, or the positive lead of the second voice coil passes through the wire passing hole to be electrically connected to the conductive part.

[0050] In a possible implementation of the first aspect of the present application, the sounding frequency of the second speaker unit is greater than that of the first speaker unit. Thus, by making the earphone include the first speaker unit and the second speaker unit with different sounding frequencies, it is beneficial to utilize the difference in the sounding frequencies of the first speaker unit and the second speaker unit, so that the earphone has good sound expressiveness in different frequency ranges, and the sound output effect of the speaker module is improved.

[0051] Second aspect, the present application provides a pair of headphones, including: a housing, a circuit board, and the speaker module in any of the above technical solutions. An sound outlet hole is formed on the housing; the circuit board is arranged inside the housing; the speaker module is arranged inside the housing, and both the first speaker unit and the second speaker unit emit sound towards the sound outlet hole, and the speaker module is electrically connected to the circuit board through a wiring terminal.

[0052] For the headphones according to the embodiment of the second aspect of the present application, by providing a speaker module including a bracket, and using the bracket to fix the chassis of the first speaker unit and the second speaker unit, the first speaker unit and the second speaker unit are connected as a whole, so as to facilitate modularization of the speaker module. In this way, when the speaker module is installed, the first speaker unit and the second speaker unit can be installed as a whole, so that it is not necessary to install the first speaker unit and the second speaker unit into the housing of the headphones separately, which can simplify the installation of the speaker module, and can also achieve the structural compactness of the speaker module. In addition, by making the bracket have a conductive part, and the electrode of the second speaker unit is electrically connected to the wiring terminal by means of the conductive part. Thus, the electrical connection relationship between the first speaker unit and the second speaker unit can be simplified to at least a certain extent, at least one signal line for electrically connecting the first speaker unit and the second speaker unit can be omitted, the structure of the entire speaker module can be simplified, and it is also convenient for the speaker module to be electrically connected to the circuit board through the wiring terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 is a schematic structural diagram of the headphones provided by some embodiments of the present application;

[0054] Figure 2 is Figure 1 the exploded structural diagram of the headphones shown in ;

[0055] Figure 3 is Figures 1-2 the charging connection diagram between the headphones shown in and a wireless charging base;

[0056] Figure 4 is a cross-sectional view of the headphones provided by some other embodiments of the present application;

[0057] Figure 5 is Figure 4 the structural diagram of the first speaker unit of the headphones shown in ;

[0058] Figure 6 is Figure 5 the cross-sectional structural diagram of the first speaker unit shown in ;

[0059] Figure 7 is a partial structural diagram of the headphones provided by some other embodiments of the present application;

[0060] Figure 8 is Figure 7 a schematic structural diagram of the speaker module of the earphone shown in

[0061] Figure 9 is Figure 8 a schematic structural diagram of the bracket in the speaker module shown in

[0062] Figure 10 is Figure 8 a schematic diagram of another angle of the speaker module shown in

[0063] Figure 11 a schematic structural diagram of the bracket in some other embodiments of the present application;

[0064] Figure 12a a schematic structural diagram of the bracket in still some other embodiments of the present application;

[0065] Figure 12b a schematic structural diagram of the bracket in yet some other embodiments of the present application;

[0066] Figure 13 is Figure 8 a schematic diagram of yet another angle of the speaker module shown in

[0067] Figure 14a is Figure 13 an enlarged view of the circled part at A of the speaker module shown in

[0068] Figure 14b is Figure 13 a sectional view of the speaker module shown in taken along line B-B;

[0069] Figure 15 is Figure 8 a schematic connection diagram of the bracket, the second speaker unit, the terminal and the conductive member of the speaker module shown in

[0070] Figure 16 a schematic structural diagram of the speaker module in some other embodiments of the present application;

[0071] Figure 17 is Figure 8 a sectional schematic diagram of the speaker module shown in

[0072] Figure 18 a schematic structural diagram of the speaker module in still some other embodiments of the present application;

[0073] Figure 19 is Figure 18 a schematic cross-sectional structure diagram of the second speaker unit shown in

[0074] Figure 20 is Figure 19Schematic diagram of the structure of the second diaphragm group of the second speaker unit shown in

[0075] Figure 21 is Figure 19 Schematic diagram of the structure of the reed of the second speaker unit shown in

[0076] Figure 22 is Figure 19 Schematic diagram of the structure of the second magnetic circuit system of the second speaker unit shown in

[0077] Figure 23 Schematic diagram of the speaker module according to some other embodiments of the present application.

[0078] Reference numerals

[0079] 100, earphone;

[0080] 1, housing; 10, accommodation space; 101, first accommodation cavity; 11, front shell; 110, sound outlet hole; 111, main body part; 112, extension part; 1121, limiting rib; 12, rear shell; 102, second accommodation cavity; 121, cover body; 122, rod body; 13, contact sleeve;

[0081] 2, main board;

[0082] 3, battery;

[0083] 4, speaker module;

[0084] 4a, first speaker unit; 4a21, first diaphragm group; 4a211, first connecting part; 4a212, first surround; 4a213, first dome; 4a22, first voice coil; 4a23, first magnetic circuit system; 4a23a, magnetic gap; 4a231, side magnetic part; 4a232, first central magnetic part; 4a233, second central magnetic part; 4a234, magnetic yoke; 4a24, chassis; 4a241, first opening; 4a242, second opening; 4a2413, annular groove; 4a25, terminal; 4a251, negative terminal; 4a2511, conductive extension; 4a252, positive terminal; 4a2521, conductive connection part;

[0085] 4b. Second speaker unit; 4b1. Protective housing; 4b1a. First housing part; 4b1b. Second housing part; 4b11. Sound outlet channel; 4b21. Second diaphragm group; 4b21a. Second connecting part; 4b21b. Second surround; 4b21c. Second dome; 4b22. Reed; 4b221. First sheet body; 4b222. Second sheet body; 4b223. Connecting sheet body; 4b224. Support body; 4b23. Drive rod; 4b24. Second magnetic circuit system; 4b241. Magnetic conduction part; 4b242. Magnet part; 4b25. Second voice coil; 4b3. Avoidance channel; 4b41. First electrode layer; 4b42. Second electrode layer; 4b43. Piezoelectric body;

[0086] 4c. Bracket; 4c1. Support plate; 4c11. First sound transmission channel; 4c2. Connecting part; 4c21. Sub - part; 4c211. Card hole; 4c22. Wiring groove; 4c23. Sound transmission channel; 4c24. Second sound transmission channel;

[0087] 4d. Conductive part;

[0088] 4e. Conductive adhesive;

[0089] 5. Wireless charging module; 51. Power receiving coil; 52. AC - DC conversion component; 53. Charging control component; 6. Wireless communication module;

[0090] 200. Wireless charging base; 201. Charging coil; 202. AC - DC conversion component; 203. Power interface. Detailed implementation manners

[0091] In the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0092] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, "connected" can be a detachable connection or a non - detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The orientation terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only with reference to the direction of the drawings. Therefore, the orientation terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the embodiments of the present application. "Plural" means more than two.

[0093] In the embodiments of the present application, the term "comprise", "include" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element.

[0094] The present application provides a headset 100, which can be used in cooperation with electronic products such as mobile phones, tablet computers, laptop computers, etc., to receive the sound information provided by the electronic products and output it to the user. By using the headset 100 in cooperation with the electronic products, the external sound of the electronic products can be avoided from disturbing others. The headset 100 can be a wireless headset or a wired headset.

[0095] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic structural diagram of the headset 100 provided by some embodiments of the present application; Figure 2 is Figure 1 the exploded structural diagram of the headset 100 shown in Figure 1 and Figure 2 The headset 100 shown in

[0096] It can be understood that Figure 1 , Figure 2 and the related drawings below only schematically show some components included in the headset 100, and the actual shape, actual size, actual position and actual structure of these components are not limited by Figure 1 , Figure 2 and the drawings below. In addition, when the headset 100 is a wired headset, the wired headset may not include the battery 3, the wireless communication module 6 and the wireless charging module 5.

[0097] The housing 1 can be used as a carrier for the functional devices in the headset 100 to protect the functional devices located in the accommodation space 10 of the housing 1. And when the user wears the headset 100, the headset 100 contacts the user's ear through the housing 1. Therefore, in order to improve the comfort of the user wearing the headset 100, the housing 1 can be adapted to the shape of the human ear in terms of its external shape.

[0098] Since the housing 1 is directly exposed to the external environment and contacts the human ear. Or the earphone 100 contacts other external structures through the housing 1. This inevitably leads to problems such as scratches and corrosion on the outer surface of the housing 1. To avoid this technical problem, the housing 1 can have certain wear-resistant, corrosion-resistant, scratch-resistant properties, or a functional material for wear-resistant, corrosion-resistant, and scratch-resistant can be coated on the outer surface of the housing 1.

[0099] In some embodiments, the housing 1 can be a structural whole, that is to say, the housing 1 can be an integrally formed part, and the integrally formed housing 1 has higher structural strength. In other embodiments, the housing 1 can also be formed by assembling multiple parts. Please continue to refer to Figure 1 and Figure 2 , in this embodiment, the housing 1 can include a front shell 11 and a rear shell 12. Among them, the front shell 11 faces the human ear when the earphone 100 is in use, and the rear shell 12 faces away from the human ear when the earphone 100 is in use. The housing 1 is formed by assembling the front shell 11 and the rear shell 12, which can facilitate the separate processing of the front shell 11 and the rear shell 12, is beneficial to simplifying the mold structures of the front shell 11 and the rear shell 12, thereby reducing the forming difficulty of the front shell 11 and the rear shell 12, and further reducing the processing and manufacturing difficulty of the housing 1. Specifically, the front shell 11 can be fixedly connected to the rear shell 12 by a snap-fit method. The front shell 11 can also be connected to the rear shell 12 by screws. Or, in other embodiments, the front shell 11 can also be fixedly connected to the rear shell 12 by glue or tape.

[0100] The material of the front shell 11 includes but is not limited to hard plastic, metal, and the combination of plastic and metal. To achieve the lightweight of the earphone 100, the material of the front shell 11 can be selected as hard plastic.

[0101] Please refer to Figure 2 , a first accommodation cavity 101 is formed in the front shell 11, and one side of the first accommodation cavity 101 adjacent to the rear shell 12 is open. An sound outlet hole 110 communicating with the first accommodation cavity 101 is formed on the front shell 11, and the sound of the earphone 100 can be conducted to the outside of the earphone 100 through the sound outlet hole 110.

[0102] Specifically, the front shell 11 can include a main body part 111 and an extension part 112. The extension part 112 can be located on one side of the main body part 111 and extend in a direction away from the main body part 111. Please refer to Figure 2 , the above-mentioned first accommodation cavity 101 can be formed in the main body part 111, and the above-mentioned sound outlet hole 110 can be formed in the extension part 112. It can be understood that, in other embodiments, the front shell 11 may not include the extension part 112, but directly form the sound outlet hole 110 on the wall surface of the main body part 111.

[0103] To improve the comfort of the user wearing the earphone 100, the earphone 100 may further be provided with a contact sleeve 13, which can be used to contact the user's ear. For example, the contact sleeve 13 can be disposed around the outer peripheral surface of the extension portion 112, and the contact sleeve 13 can be similar in shape to the shape of the human ear canal in appearance to improve the adaptability of wearing the earphone 100. At the same time, the contact sleeve 13 can be made of flexible materials such as silica gel and rubber to improve the comfort of the user wearing the earphone 100.

[0104] Please refer to Figure 2 , a limiting rib 1121 can be formed on the outer peripheral surface of the extension portion 112, so that when the contact sleeve 13 is disposed around the outer peripheral surface of the extension portion 112, the limiting rib 1121 can abut against the contact sleeve 13, thereby playing a role in limiting the contact sleeve 13 and reducing the probability of the contact sleeve 13 falling off the extension portion 112 naturally. Of course, in order to reduce costs, the earphone 100 may not include the contact sleeve 13.

[0105] The material of the rear shell 12 can be the same as the material of the above-mentioned front shell 11. Of course, the material of the rear shell 12 can also be different from the material of the above-mentioned front shell 11. In order to achieve the light weight of the earphone 100, the material of the rear shell 12 can be selected as a hard plastic.

[0106] Please continue to refer to Figure 2 , the rear shell 12 can include a cover body 121 and a rod body 122. The cover body 121 can be connected to the front shell 11, and the rod body 122 can be disposed on a side of the cover body 121 away from the front shell 11. A second receiving cavity 102 can be formed in the cover body 121, and a side of the second receiving cavity 102 adjacent to the front shell 11 is open, so that the second receiving cavity 102 can communicate with the first receiving cavity 101, and the second receiving cavity 102 and the first receiving cavity 101 can jointly form the accommodation space 10 of the housing 1.

[0107] The cover body 121 and the rod body 122 can be an integral structure, that is to say, the cover body 121 and the rod body 122 are a whole structure. This can simplify the processing and manufacturing process of the rear shell 12 and improve the connection strength between the cover body 121 and the rod body 122. Of course, this application is not limited thereto, and the cover body 121 and the rod body 122 can also be assembled, and the cover body 121 and the rod body 122 are connected by means such as gluing, snap connection, screw connection or welding.

[0108] The circuit board 2 can be accommodated in the accommodation space 10. Specifically, the circuit board 2 can be installed in the second receiving cavity 102. The installation method of the circuit board 2 in the housing 1 includes but is not limited to snap connection, screw connection or gluing.

[0109] The circuit board 2 is used to integrate control chips, etc. The control chips may be, for example, an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), and a universal storage (UFS). The circuit board 2 is electrically connected to functional devices such as a wireless communication module 6, a wireless charging module 5, a battery 3, and a speaker module 4 to achieve operations such as signal control and data signal processing between different functional devices.

[0110] The circuit board 2 can be a hard circuit board, a flexible circuit board, or a hard-soft circuit board. The circuit board 22 can be a FR-medium board, a Rogers dielectric board, or a mixed dielectric board of FR- and Rogers, etc. Here, FR- is a code for a flame retardant material grade, and the Rogers dielectric board is a high-frequency board.

[0111] The wireless communication module 6 can be integrated on the circuit board 2. Exemplarily, the wireless communication module 6 can be welded and fixed on the circuit board 2. Optionally, the wireless communication module 6 can be a Bluetooth, infrared or wifi module. The headset 100 can perform wireless signal interaction with the electronic product through the wireless communication module 6 to receive the sound information of the electronic product.

[0112] The battery 3 is used to provide power to functional components in the headset 100, such as the circuit board 2, the wireless communication module 6, the speaker module 4, etc. The battery 3 may include, but is not limited to, a nickel-cadmium battery, a nickel-metal hydride battery, a lithium battery, or other types of batteries. In addition, the number of batteries 3 in the embodiment of the present application may be multiple or one. The shape of the battery 3 includes, but is not limited to, a rectangular parallelepiped, a cylinder, or a truncated cone. In some examples, the battery 3 may be located in the second accommodating cavity 102, and the battery 3 is located on the side of the circuit board 2 close to the first accommodating cavity 101. In other examples, the battery 3 may also be located on the side of the circuit board 2 that is away from the first accommodating cavity 101. The installation method of the battery 3 in the housing 1 includes, but is not limited to, snap-on, screw connection, or gluing.

[0113] The wireless charging module 5 can be integrated on the circuit board 2 and wirelessly charge the battery 3 in the headset 100. For details, please refer to Figure 3 , Figure 3 for Figures 1-2 Schematic diagram of charging connection between the headset 100 and the wireless charging base 200 shown in FIG. In this embodiment, the wireless charging module 5 includes: a power receiving coil 51, an AC / DC conversion component 52, and a charging control component 53. The power receiving coil 51, the AC / DC conversion component 52, and the charging control component 53 are all electrically connected to the circuit board 2.

[0114] The power receiving coil 51 can receive the wireless charging input of the wireless charging base 200 of the earphone 100. Of course, this application is not limited thereto, and the power receiving coil 51 can also receive the wireless charging input of other terminals supporting wireless charging. The power receiving coil 51 is a receiving (Rx) coil. The AC / DC conversion component 52 can be an Rx chip.

[0115] The wireless charging base 200 includes a power interface 203, a charging coil 201, and an AC / DC conversion component 202. The charging coil 201 can be a transmitting (Tx) coil. The AC / DC conversion component 202 can be a Tx chip.

[0116] In the embodiment of this application, the wireless charging base 200 serves as the transmitting end of the wireless charging signal, and the earphone 100 serves as the receiving end of the wireless charging signal. The wireless charging base 200 wirelessly charges the earphone 100. Specifically, the AC / DC conversion component 202 of the wireless charging base 200 can receive the DC signal input from the power interface 203. The AC / DC conversion component 202 can convert the DC signal into an AC signal and then input the AC signal to the charging coil 201. In response to the AC signal, the charging coil 201 can generate an alternating electromagnetic field.

[0117] The power receiving coil 51 of the earphone 100 is coupled with the charging coil 201. The power receiving coil 51 (i.e., the Rx coil) can induce the alternating electromagnetic field emitted by the charging coil 201 (i.e., the Tx coil), generate an AC signal, and input the AC signal to the AC / DC conversion component 52. The AC / DC conversion component 52 can rectify the AC signal into a DC signal and input the DC signal to the charging control component 53. The charging control component 53 can charge the battery 3 according to the DC signal.

[0118] Of course, this application is not limited thereto. In some other examples, the earphone 100 can also support wired charging. Specifically, a charging interface is provided on the housing 1. The charging interface is electrically connected to the circuit board 2. The charging interface can be connected to a wired charger (also called a power adapter) to receive the charging input of the wired charger for the battery 3. For example, the above-mentioned charging interface can be a universal serial bus (USB) interface.

[0119] Please refer back to Figure 2, the speaker module 4 can be installed in the accommodation space 10, and the speaker module 4 is located on the side of the battery 3 close to the sound outlet hole 110. Specifically, the speaker module 4 can be installed in the first accommodation cavity 101. The assembly method between the speaker module 4 and the housing 1 includes but is not limited to snap connection, threaded connection or gluing, etc. The speaker module 4 is electrically connected to the circuit board 2 to obtain audio electrical signals such as music and voice, and the speaker module 4 can convert the audio electrical signals into sound signals to support audio external playback.

[0120] In the earphone 100 of the above embodiment, the speaker module 4 adopted is a moving coil type bass speaker. Although this can enable the earphone 100 to have a low-frequency sound field performance and make the cost of the earphone 100 cheap. However, the moving coil type bass speaker has a large vibration mass and poor transient characteristics, and the asymmetric distribution of the mass distribution, the compliance of the diaphragm and the BL electromagnetic driving force will generate different degrees of rocking vibration and splitting vibration of different frequencies, resulting in serious peaks and valleys in the high-frequency response, unable to achieve high-frequency sound field performance, resulting in poor audio external playback performance and poor sound effect of the earphone 100.

[0121] Please refer to Figure 4 , Figure 4 is a cross-sectional view of the earphone 100 provided by some other embodiments of the present application. In this embodiment, the speaker module 4 includes a first speaker unit 4a and a second speaker unit 4b.

[0122] The first speaker unit 4a and the second speaker unit 4b are spaced apart and arranged in the housing 1. Both the first speaker unit 4a and the second speaker unit 4b emit sound towards the sound outlet hole 110. The sound emission frequency of the second speaker unit 4b is greater than that of the first speaker unit 4a. Thus, by making the earphone 100 include the first speaker unit 4a and the second speaker unit 4b with different sound emission frequencies, it is beneficial to utilize the sound emission frequency difference between the first speaker unit 4a and the second speaker unit 4b, so that the earphone 100 has good sound expressiveness in sound fields of different frequencies and improves the sound output effect of the speaker module 4.

[0123] Specifically, in this embodiment, the first speaker unit 4a can be used as a bass speaker. Exemplarily, the first speaker unit 4a can be a moving coil type bass speaker. The second speaker unit 4b can be a treble speaker. Exemplarily, the second speaker unit 4b can be a moving iron speaker unit, a planar voice coil speaker unit or a piezoelectric ceramic speaker unit.

[0124] In the embodiment of the present application, the first speaker unit 4a is used as a bass speaker and the second speaker unit 4b is used as a treble speaker, so that the earphone 100 can take into account the expressiveness in the low-frequency sound field and the high-frequency sound field and improve the sound output effect of the speaker module 4.

[0125] Please refer to Figure 5 and Figure 6 , Figure 5 which is Figure 4 a schematic structural diagram of the first speaker unit 4a of the earphone shown in Figure 6 and Figure 5 is a schematic cross-sectional structural diagram of the first speaker unit 4a shown in. In this embodiment, the first speaker unit 4a includes a first diaphragm group 4a21, a first voice coil 4a22, a first magnetic circuit system 4a23, a chassis 4a24, and a terminal 4a25.

[0126] It can be understood that Figure 5 and Figure 6 and the related drawings below only schematically show some components included in the first speaker unit 4a, and the actual sizes, actual positions, and actual structures of these components are not limited by Figure 5 and Figure 6 and the respective drawings below.

[0127] Specifically, the first speaker unit 4a is fixed in the housing 1 by means of the chassis 4a24. The assembly method between the chassis 4a24 and the housing 1 includes but is not limited to snap connection, threaded connection, or gluing, etc. The chassis 4a24 serves as the "supporting framework" of the first speaker unit 4a and is used to support the first diaphragm group 4a21, the first voice coil 4a22, and the first magnetic circuit system 4a23. The material of the chassis 4a24 includes but is not limited to metal, plastic, and the combination of metal and plastic. The chassis 4a24 can be an integrally formed part, that is to say, the chassis 4a24 is a monolithic structure. In this way, it is beneficial to improve the connection strength of the chassis 4a24. Of course, the present application is not limited to this, and the chassis 4a24 can also be formed by assembling different components, and different components can be connected by means of snap connection, threaded connection, gluing, or welding, etc.

[0128] Please continue to refer to Figure 6, an annular groove 4a2413 is provided on the inner peripheral surface of the basin frame 4a24, which is recessed in a direction away from the central axis of the basin frame 4a24. The annular groove 4a2413 extends circumferentially along the basin frame 4a24 to form an annulus, and the annular groove 4a2413 penetrates through to the end face of the open end of the basin frame 4a24, that is, the end face facing the sound outlet hole 110. The outer edge of the first diaphragm group 4a21 is received in the annular groove 4a2413 and fixed to the wall surface of the annular groove 4a2413 facing the sound outlet hole 110. By receiving the outer edge of the first diaphragm group 4a21 in the annular groove 4a2413 and fixing it to the wall surface of the annular groove 4a2413 facing the sound outlet hole 110, it is beneficial to effectively support the first diaphragm group 4a21 by using the annular groove 4a2413. At the same time, the setting of the annular groove 4a2413 can increase the volume of the space inside the basin frame 4a24, which is beneficial to setting the size of the first diaphragm group 4a21 larger, and further beneficial to increasing the effective vibration area of the first diaphragm group 4a21 and improving the sound output effect of the first speaker unit 4a. It can be understood that the annular groove 4a2413 may not be provided on the basin frame 4a24, and the outer edge of the first diaphragm group 4a21 may be connected to the end face of the open end of the basin frame 4a24.

[0129] It should be noted that the effective vibration area of the diaphragm group involved in this article refers to the area of the part of the diaphragm group that can drive air movement.

[0130] The outer surface of the first diaphragm group 4a21 faces the sound outlet hole 110, so that the first speaker unit 4a can emit sound toward the sound outlet hole 110. The first speaker unit 4a can divide the housing 1 into a front cavity C1 and a rear cavity C2 with the help of the first diaphragm group 4a21 (in combination Figure 4 ). The first voice coil 4a22, the first magnetic circuit system 4a23 and the basin frame 4a24 are located in the rear cavity C2. The sound outlet hole 110 is communicated with the front cavity C1. Of course, this application is not limited to this. In some other examples, the first speaker unit 4a may further include a housing. The first speaker unit 4a is fixed in the housing 1 by means of the housing. The basin frame 4a24 is fixed to the inner wall of the housing. The first diaphragm group 4a21 divides the housing into a front cavity and a rear cavity, and the front cavity of the housing is communicated with the sound outlet hole 110.

[0131] Among them, it should be explained that the "outer surface" of the first diaphragm group 4a21 refers to the side surface of the first diaphragm group 4a21 that faces away from the inside of the basin frame 4a24, and the inner surface of the first diaphragm group 4a21 faces the opposite side of the outer surface of the first diaphragm group 4a21.

[0132] Please continue to refer to Figure 6 , the first diaphragm group 4a21 includes: a first connecting portion 4a211, a first surround 4a212, and a first dome 4a213 surrounded by the first surround 4a212.

[0133] The first connecting portion 4a211 is in the shape of an annular sheet. For example, the first connecting portion 4a211 is in the shape of a circular ring or a rectangular ring. The first connecting portion 4a211 is laminated on the wall surface of the annular groove 4a2413 facing the sound outlet hole 110, so that the first diaphragm group 4a21 is connected to the speaker frame 4a24 by means of the first connecting portion 4a211. The connection manner between the first connecting portion 4a211 and the annular groove 4a2413 includes but is not limited to gluing, snap connection, welding or screw connection.

[0134] The outer peripheral edge of the first surround 4a212 is connected to the inner peripheral edge of the first connecting portion 4a211. The cross-sectional shape of the first surround 4a212 is arc-shaped or approximately arc-shaped. The extending locus of the first surround 4a212 along the circumferential direction of the speaker frame 4a24 is circular or rectangular. The first surround 4a212 protrudes towards the sound outlet hole 110. In this way, the first surround 4a212 can be deformed when subjected to an external force, so that the first dome 4a213 can vibrate axially relative to the first connecting portion 4a211 along the first diaphragm group 4a21. Of course, it can be understood that the first surround 4a212 can also protrude towards the direction away from the sound outlet hole 110.

[0135] In some examples, the first diaphragm group 4a21 is an integrally formed part. That is to say, the first connecting portion 4a211, the first surround 4a212 and the first dome 4a213 are an integral structure. Such a setting is beneficial to improving the structural strength of the first diaphragm group 4a21 and facilitating the processing and manufacturing of the first diaphragm group 4a21. Of course, the present application is not limited thereto. The first connecting portion 4a211, the first surround 4a212 and the first dome 4a213 can also be independently formed parts. The first connecting portion 4a211 and the first surround 4a212 can be connected by gluing, and the first surround 4a212 and the first dome 4a213 can be connected by gluing. The material of the first diaphragm group 4a21 includes but is not limited to metal, plastic, plant fiber and animal fiber.

[0136] The first voice coil 4a22 is connected to the inner surface of the first dome 4a213 (i.e., the surface on the side away from the sound outlet hole 110). The connection manner between the first voice coil 4a22 and the first dome 4a213 includes but is not limited to gluing.

[0137] The first magnetic circuit system 4a23 is fixed within the chassis 4a24. The first magnetic circuit system 4a23 has an annular magnetic gap 4a23a. One end of the first voice coil 4a22, which is away from the first diaphragm assembly 4a21, can extend into the magnetic gap 4a23a. In this way, the first magnetic circuit system 4a23 can cooperate with the first voice coil 4a22 to drive the first diaphragm assembly 4a21 to vibrate synchronously. Specifically, after the first voice coil 4a22 is energized, an induced magnetic field can be generated. The first magnetic circuit system 4a23 can respond to this induced magnetic field, so that the first voice coil 4a22 is displaced under the magnetic force of the first magnetic circuit system 4a23 to drive the first diaphragm assembly 4a21 to vibrate, pushing the air in the front cavity C1 to vibrate to form sound, and this sound is output from the sound outlet hole 110.

[0138] Please continue to refer to Figure 6 , the first magnetic circuit system 4a23 includes: a side magnetic part 4a231, a first central magnetic part 4a232, and a second central magnetic part 4a233. The side magnetic part 4a231 is located on the outer periphery of the first central magnetic part 4a232 to define the magnetic gap 4a23a with the first central magnetic part 4a232. The magnetization directions of the side magnetic part 4a231 and the first central magnetic part 4a232 are opposite, so that the side magnetic part 4a231 and the first central magnetic part 4a232 can form a magnetic circuit for driving the first voice coil 4a22 to move. Exemplarily, along the axial direction of the chassis 4a24 and towards the direction away from the first diaphragm assembly 4a21, the magnetization direction of the side magnetic part 4a231 is from the north pole (N) to the south pole (S), and the magnetization direction of the first central magnetic part 4a232 is from the south pole (S) to the north pole (N).

[0139] Please continue to refer to Figure 6 , the side magnetic part 4a231 can be formed into an annular shape. For example, the side magnetic part 4a231 is formed into a circular ring or a rectangular ring. Of course, it can be understood that the side magnetic part 4a231 can also be non-annular, and there are multiple side magnetic parts 4a231, and the multiple side magnetic parts 4a231 are spaced apart and distributed in the circumferential direction of the first central magnetic part 4a232.

[0140] The second central magnetic part 4a233 plugs one end of the side magnetic part 4a231 that is away from the first diaphragm assembly 4a21, and the first central magnetic part 4a232 and the second central magnetic part 4a233 are stacked. The second central magnetic part 4a233 and the side magnetic part 4a231 can be an integrally formed part. That is to say, the second central magnetic part 4a233 and the side magnetic part 4a231 can be a structural whole. Of course, the present application is not limited to this, and the second central magnetic part 4a233 and the side magnetic part 4a231 can also be connected by means such as gluing, snap connection, and screw connection.

[0141] Specifically, the second central magnetic part 4a233 can be a magnetic conductive material piece. In this way, the leakage of magnetic force lines can be restricted by the second central magnetic part 4a233, and the magnetic induction intensity of the first magnetic circuit system 4a23 can be increased. Of course, the present application is not limited thereto. In some other examples, the second central magnetic part 4a233 can be a magnet. Specifically, the magnet is a permanent magnet or a magnetic steel.

[0142] In some examples, both the side magnetic part 4a231 and the first central magnetic part 4a232 can be magnets. Exemplarily, both the side magnetic part 4a231 and the first central magnetic part 4a232 are permanent magnets or magnetic steels. Of course, the present application is not limited thereto. In other embodiments, one of the side magnetic part 4a231 and the first central magnetic part 4a232 is a magnet, and the other is a magnetic conductive material piece.

[0143] To increase the magnetic induction intensity of the first magnetic circuit system 4a23, the first magnetic circuit system 4a23 further includes a magnetic conductive yoke 4a234. The magnetic conductive yoke 4a234 is provided on the side of the first central magnetic part 4a232 facing the first diaphragm group 4a21, and is used to restrict the leakage of magnetic force lines, thereby improving the driving force on the first diaphragm group 4a21.

[0144] Specifically, the outer peripheral surface of the magnetic conductive yoke 4a234 is flush with the outer peripheral surface of the first central magnetic part 4a232 in the axial direction of the first magnetic circuit system 4a23. In this way, it is beneficial to further improve the effect of the magnetic conductive yoke 4a234 on restricting magnetic force lines, increase the magnetic induction intensity of the first magnetic circuit system 4a23, and the magnetic conductive yoke 4a234 does not affect the magnetic gap 4a23a, which is beneficial to improving the adaptability between the first magnetic circuit system 4a23 and the first voice coil 4a22.

[0145] Please refer to Figure 5 , the wiring terminal 4a25 is provided on the chassis 4a24. Specifically, the wiring terminal 4a25 is located outside the chassis 4a24. Exemplarily, the wiring terminal 4a25 can protrude from the outer peripheral surface of the chassis 4a24. Another example is that a groove can be formed on the outer peripheral surface of the chassis 4a24, and the wiring terminal 4a25 can be located in the groove. Regarding the setting method of the wiring terminal 4a25, those skilled in the art can design it according to actual needs, as long as it is ensured that the wiring terminal 4a25 is located outside the chassis 4a24.

[0146] The wiring terminal 4a25 includes a positive wiring terminal 4a252 and a negative wiring terminal 4a251.

[0147] The positive wiring terminal 4a252 is provided with a conductive wiring part located inside the chassis 4a24. The conductive wiring part can be electrically connected to the positive lead of the first voice coil 4a22. In some examples, the positive lead of the first voice coil 4a22 and the conductive wiring part can be connected by welding.

[0148] The negative terminal 4a251 is provided with a conductive extension portion located within the chassis 4a24. The conductive extension portion can be electrically connected to the negative lead of the first voice coil 4a22. In some examples, the negative lead of the first voice coil 4a22 and the conductive extension portion can be connected by soldering.

[0149] In the embodiments of the present application, since both the positive lead and the negative lead of the first voice coil 4a22 are relatively thin, their structural strength is relatively weak and they are easily scratched and damaged. Therefore, by electrically connecting the conductive wiring portion located within the chassis 4a24 to the positive lead of the first voice coil 4a22, the length of the positive lead can be shortened, avoiding the problem of scratching and damage between the positive lead and the chassis 4a24; by electrically connecting the conductive extension portion located within the chassis 4a24 to the negative lead of the first voice coil 4a22, the length of the negative lead can be shortened, avoiding the problem of scratching and damage between the negative lead and the chassis 4a24, which is beneficial to improving the reliability of the operation of the first voice coil 4a22.

[0150] The first speaker unit 4a is electrically connected to the circuit board 2 through the positive terminal 4a252 and the negative terminal 4a251, so as to obtain audio electrical signals such as music and voice.

[0151] As described above, the first speaker unit 4a and the second speaker unit 4b are spaced apart within the housing 1. In this way, the first speaker unit 4a and the second speaker unit 4b need to be respectively installed with the housing 1, resulting in a relatively complex assembly process, low assembly efficiency, and the spaced-apart arrangement of the first speaker unit 4a and the second speaker unit 4b within the housing 1 is also not conducive to the structural compactness of the speaker module 4. To solve this technical problem, in the embodiments of the present application, please refer to Figure 7 and Figure 8 , Figure 7 which is a partial structural schematic diagram of the earphone 100 provided in some other embodiments of the present application; Figure 8 is Figure 7 a structural schematic diagram of the speaker module 4 of the earphone 100 shown in. In this embodiment, the speaker module 4 further includes a bracket 4c. The second speaker unit 4b can be connected to the chassis 4a24 of the first speaker unit 4a by means of the bracket 4c, so as to realize the fixed connection between the first speaker unit 4a and the second speaker unit 4b. When installing the speaker module 4, it is beneficial to install the speaker module 4 as a whole into the housing 1, so that it is not necessary to separately install the first speaker unit 4a and the second speaker unit 4b into the housing 1, which can simplify the installation of the speaker module 4 and also achieve the structural compactness of the speaker module 4.

[0152] Specifically, please refer to Figure 9 , Figure 9 is Figure 8The structural diagram of the bracket 4c in the speaker module 4 is shown. In this embodiment, the bracket 4c includes a support plate 4c1 and a connecting portion 4c2.

[0153] The support plate 4c1 is located on one side of the axial direction of the first speaker unit 4a, and the support plate 4c1 is opposite to the outer surface of the first diaphragm group 4a21 of the first speaker unit 4a, and the second speaker unit 4b is supported on the side of the support plate 4c1 away from the first speaker unit 4a, that is, the second speaker unit 4b is supported on the side of the support plate 4c1 facing the sound outlet 110. Therefore, the second speaker unit 4b can be supported by the support plate 4c1 to facilitate the installation of the second speaker unit 4b. The connection method between the second speaker unit 4b and the support plate 4c1 includes but is not limited to gluing, clamping, welding or screw connection.

[0154] In order to prevent the support plate 4c1 and the second speaker unit 4b from blocking the transmission of the sound generated by the vibration of the first diaphragm group 4a21, thereby affecting the sound effect of the first speaker unit 4a, please continue to refer to Figure 9 , and combined with Figure 8 , a first sound transmission channel 4c11 is formed on the support plate 4c1, and the second speaker unit 4b does not cover the first sound transmission channel 4c11, so that the sound emitted by the first diaphragm group 4a21 vibrating and pushing the air to vibrate can be transmitted toward the sound outlet 110 through the first sound transmission channel 4c11. The number of the first sound transmission channels 4c11 can be multiple or one. Exemplarily, the support plate 4c1 is formed in a ring shape to define the first sound transmission channel 4c11, and the second speaker unit 4b is formed in a ring shape extending along the circumference of the support plate 4c1 to define the avoidance channel 4b3, and the avoidance channel 4b3 is connected to the first sound transmission channel 4c11. Of course, the present application is not limited to this. In other examples, the second speaker unit 4b may not be ring-shaped, and the second speaker unit 4b may cover a portion of the support plate 4c1. Exemplarily, the second speaker unit 4b may be arranged away from the center of the support plate 4c1.

[0155] The outer contour of the support plate 4c1 is circular, rectangular, triangular, trapezoidal or irregular. The material of the support plate 4c1 includes but is not limited to metal, plastic and a combination of metal and plastic.

[0156] The connecting portion 4c2 is connected between the outer peripheral edge of the support plate 4c1 and the peripheral wall of the chassis 4a24, so that the second speaker unit 4b can be fixed to the chassis 4a24 by means of the connecting portion 4c2. In some examples, the connecting portion 4c2 and the support plate 4c1 can be integrally formed, that is to say, the connecting portion 4c2 and the support plate 4c1 can be a whole structure, in this way, it is beneficial to improve the connection strength between the connecting portion 4c2 and the support plate 4c1. In other examples, the connecting portion 4c2 can also be connected to the support plate 4c1 by means of gluing, snap connection, welding or screw connection. The connection methods between the connecting portion 4c2 and the chassis 4a24 include but are not limited to snap connection, gluing, welding and screw connection. The materials of the connecting portion 4c2 include but are not limited to metals, plastics and combinations of metals and plastics.

[0157] Specifically, please continue to refer to Figure 9 , the connecting portion 4c2 includes at least two sub-parts 4c21, and the at least two sub-parts 4c21 are spaced apart in the circumferential direction of the support plate 4c1, and each sub-part is connected between the outer peripheral edge of the support plate 4c1 and the peripheral wall of the chassis 4a24.

[0158] Please continue to refer to Figure 9 , each sub-part 4c21 extends into a plate shape in the circumferential direction of the support plate 4c1. With such a setting, while reducing the volume and weight of the bracket 4c, it is also helpful to improve the structural strength of the sub-part 4c21, thereby improving the connection reliability between the bracket 4c and the chassis 4a24, and further improving the fixing reliability of the bracket 4c to the first speaker unit 4a and the second speaker unit 4b.

[0159] Specifically, please continue to refer to Figure 9 , a snap hole 4c211 is formed on each sub-part 4c21, and a snap rib (not shown in the figure) is formed on the outer peripheral surface of the chassis 4a24, and the snap rib is snapped into the snap hole 4c211, so as to realize the detachable connection between the bracket 4c and the chassis 4a24. Of course, the present application is not limited to this. In other embodiments, a snap rib can also be formed on each sub-part 4c21, and a snap hole can be formed on the outer peripheral surface of the chassis 4a24, and the snap rib is snapped into the snap hole, and the detachable connection between the bracket 4c and the chassis 4a24 can also be realized.

[0160] Since the support plate 4c1 is spaced apart from the first speaker unit 4a, by connecting the sub-part 4c21 between the outer peripheral edge of the support plate 4c1 and the peripheral wall of the chassis 4a24. In this way, a sound transmission channel 4c23 can be formed between two adjacent sub-parts 4c21, so as to transmit the sound generated by the vibration of the first diaphragm group 4a21 by using the sound transmission channel 4c23, and improve the sound emission effect of the first speaker unit 4a.

[0161] To prevent the sub - part 4c21 from blocking the first speaker unit 4a and affecting the sound transmission of the first speaker unit 4a, and to improve the sound output effect of the first speaker unit 4a, please continue to refer to Figure 9 , a second sound transmission channel 4c24 is formed on the part of each sub - part 4c21 located between the first diaphragm group 4a21 and the support plate 4c1. Of course, this application is not limited to this, and the second sound transmission channel 4c24 may not be provided on the sub - part 4c21.

[0162] To further improve the sound transmission effect of the sound transmission channel 4c23 on the sound emitted by the first speaker unit 4a, please refer to Figure 10 , Figure 10 For Figure 8 Another perspective schematic diagram of the speaker module 4 shown. In the plane parallel to the first diaphragm group 4a21, a part of the orthographic projection of the sound transmission channel 4c23 is located within the outer contour of the orthographic projection of the first diaphragm group 4a21.

[0163] To further improve the sound transmission effect of the second sound transmission channel 4c24 on the sound of the first speaker unit 4a, please continue to refer to Figure 10 , in the plane parallel to the first diaphragm group 4a21, the orthographic projection of the second sound transmission channel 4c24 is located within the outer contour of the orthographic projection of the first diaphragm group 4a21. In this way, the second sound transmission channel 4c24 can be opposite to the first diaphragm group 4a21 in the axial direction of the first speaker unit 4a, which is more conducive to the sound output of the first speaker unit 4a and ensures the sound output effect of the first speaker unit 4a.

[0164] Please refer to Figure 11 , Figure 11 This is a schematic structural diagram of the bracket 4c in some other embodiments of the present application. Figure 11 The structure of the bracket 4c shown is different from the structure of the bracket 4c shown in Figure 9 in that the second sound transmission channel 4c24 is no longer provided on each sub - part 4c21, and each sub - part 4c21 is rod - shaped. In this way, the volume and weight of the sub - part 4c21 can be reduced, thereby reducing the weight and volume of the speaker module 4. At the same time, it also helps to increase the area of the sound transmission channel 4c23 and improve the sound output effect of the first speaker unit 4a.

[0165] Please refer to Figure 12a , Figure 12aSchematic structural diagram of the bracket 4c in some further embodiments of the present application. The connecting portion 4c2 may also not include a plurality of spaced sub-portions, and the connecting portion 4c2 is a closed annular shape extending in the entire circumferential direction of the chassis 4a24. Such an arrangement helps to improve the structural strength of the connecting portion 4c2, thereby improving the connection reliability between the bracket 4c and the chassis 4a24, and further improving the fixing reliability of the bracket 4c to the first speaker unit 4a and the second speaker unit 4b.

[0166] Specifically, please continue to refer to Figure 12a , a clamping hole 4c211 is formed on the connecting portion 4c2. A clamping rib (not shown in the figure) is formed on the outer peripheral surface of the chassis 4a24, and the clamping rib is clamped into the clamping hole 4c211, thereby realizing the detachable connection between the bracket 4c and the chassis 4a24. Of course, the present application is not limited thereto. In other embodiments, a clamping rib may also be formed on the connecting portion 4c2, and a clamping hole is formed on the outer peripheral surface of the chassis 4a24, and the clamping rib is clamped into the clamping hole, and the detachable connection between the bracket 4c and the chassis 4a24 can also be realized.

[0167] In order to prevent the connecting portion 4c2 from blocking the first speaker unit 4a and affecting the sound transmission of the first speaker unit 4a and improving the sound output effect of the first speaker unit 4a, please continue to refer to Figure 12a , a second sound transmission channel 4c24 is formed on the portion of the connecting portion 4c2 located between the first diaphragm group 4a21 and the support plate 4c1. Of course, the present application is not limited thereto, and the second sound transmission channel 4c24 may not be provided on the connecting portion 4c2.

[0168] In order to further improve the sound transmission effect of the second sound transmission channel 4c24 on the sound of the first speaker unit 4a, in the plane parallel to the plane of the first diaphragm group 4a21, the orthographic projection of the second sound transmission channel 4c24 is located within the outer contour of the orthographic projection of the first diaphragm group 4a21. In this way, the second sound transmission channel 4c24 can be axially opposite to the first diaphragm group 4a21 in the first speaker unit 4a, which is more conducive to the sound output of the first speaker unit 4a and ensures the sound output effect of the first speaker unit 4a.

[0169] Please refer to Figure 12b , Figure 12b Schematic structural diagram of the bracket 4c in some other further embodiments of the present application. The difference between this embodiment and the above embodiment is that the bracket 4c may not include the support plate 4c1, but includes the connecting portion 4c2, and the second speaker unit 4b may be supported at one end of the connecting portion 4c2 away from the first speaker unit 4a.

[0170] Based on the above embodiments, in some embodiments of the present application, the bracket 4c has a conductive part, and the electrode of the second speaker unit 4b is electrically connected to the terminal 4a25 through the conductive part. In this way, the speaker module 4 can be electrically connected to the circuit board 2 through the terminal 4a25. That is to say, the negative electrode of the second speaker unit 4b can be electrically connected to the negative terminal 4a251 through the conductive part; or, the positive electrode of the second speaker unit 4b can be electrically connected to the positive terminal 4a252 through the conductive part; or, the conductive part is two insulated and separated parts, the negative electrode of the second speaker unit 4b is electrically connected to the negative terminal 4a251 through one of the conductive parts, and the positive electrode of the second speaker unit 4b is electrically connected to the positive terminal 4a252 through the other conductive part.

[0171] Optionally, when the positive electrode of the second speaker unit 4b is electrically connected to the positive terminal 4a252 through the conductive part, in order to improve the reliability of the bracket 4c and avoid short-circuit problems caused by contact between the bracket 4c and other structures in the housing 1 of the earphone 100, an insulating protective layer can be provided on the surface of the conductive part.

[0172] When the negative electrode of the second speaker unit 4b is electrically connected to the negative terminal 4a251 through the conductive part, in order to improve the reliability of the bracket 4c and avoid short-circuit problems caused by contact between the bracket 4c and other structures in the housing 1 of the earphone 100, the conductive part can be electrically connected to the ground point on the circuit board 2 to achieve grounding.

[0173] Specifically, the conductive part is at least composed of at least part of the connecting part 4c2. Specifically, the conductive part can be only composed of a part of the connecting part 4c2, the conductive part can be only composed of the connecting part 4c2, the conductive part can also be composed of a part of the connecting part 4c2 and a part of the support plate 4c2, the conductive part can also be composed of a part of the connecting part 4c2 and the entire support plate 4c2, and the conductive part can also be composed of the bracket 4c.

[0174] According to the loudspeaker module 4 of the embodiment of the present application, by making the earphone 100 include a first loudspeaker unit 4a and a second loudspeaker unit 4b with different sounding frequencies, it is beneficial to utilize the difference in the sounding frequencies of the first loudspeaker unit 4a and the second loudspeaker unit 4b, so that the earphone 100 has good sound expressiveness in sound ranges of different frequencies, and the sound output effect of the loudspeaker module is improved. Moreover, by providing a bracket 4c and fixing the chassis 4a24 of the first loudspeaker unit 4a and the second loudspeaker unit 4b by means of the bracket 4c, the first loudspeaker unit 4a and the second loudspeaker unit 4b are connected into one body, so as to facilitate modularizing the loudspeaker module 4. In this way, when the loudspeaker module 4 is installed, the first loudspeaker unit 4a and the second loudspeaker unit 4b can be installed as a whole, thus eliminating the need to separately install the first loudspeaker unit 4a and the second loudspeaker unit 4b into the housing 1 of the earphone 100, which can simplify the installation of the loudspeaker module 4 and also achieve the structural compactness of the loudspeaker module 4. In addition, by making the bracket 4c have a conductive part, and the electrode of the second loudspeaker unit 4b is electrically connected to the terminal 4a25 through the conductive part. Thus, the electrical connection relationship between the first loudspeaker unit 4a and the second loudspeaker unit 4b can be simplified to at least a certain extent, at least one signal line for electrically connecting the first loudspeaker unit 4a and the second loudspeaker unit 4b can be omitted, the structure of the entire loudspeaker module 4 is simplified, and it is also convenient for the loudspeaker module 4 to be electrically connected to the circuit board 2 through the terminal 4a25.

[0175] In some embodiments of the present application, the conductive part is a part of the bracket 4c, the conductive part can be a metal insert, and the remaining part of the bracket 4c can be a plastic part. Exemplarily, the bracket 4c is processed by an in-mold injection process. With such a setting, the processing technology is simple, and the structural strength of the bracket 4c is relatively high.

[0176] In other embodiments of the present application, the bracket 4c defines a conductive part, that is to say, the entire bracket 4c can conduct electricity. The negative electrode of the second loudspeaker unit 4b is electrically connected to the negative terminal 4a251 through the bracket 4c, and the bracket 4c is grounded. With such a setting, the structure of the bracket 4c can be simplified.

[0177] Further, please refer to Figure 13 、 Figure 14a 、 Figure 14b and Figure 15 , Figure 13 is Figure 8 a schematic diagram of another angle of the loudspeaker module 4 shown in Figure 14a is Figure 13 an enlarged view of the circled part at A of the loudspeaker module 4 shown in Figure 14b is Figure 13 a sectional view of the loudspeaker module 4 taken along the line B-B shown inFigure 15 For Figure 8 The connection schematic diagram of the bracket 4c, the second speaker unit 4b, the terminal 4a25, and the conductive member 4d of the speaker module 4 shown in the figure. The peripheral wall of the speaker frame 4a24 has a first opening 4a241. The negative terminal 4a251 is provided with a conductive extension 4a2511 located inside the speaker frame 4a24. The conductive extension 4a2511 extends to the first opening 4a241. The part of the connecting portion 4c2 facing the first opening 4a241 is connected to the conductive extension 4a2511. Exemplarily, the part of the connecting portion 4c2 facing the first opening 4a241 is connected to the conductive extension 4a2511 by welding.

[0178] In this way, not only can the electrical connection between the second speaker unit 4b and the negative terminal 4a251 be achieved through the bracket 4c, but also compared with the solution of directly electrically connecting the connecting portion 4c2 to the negative terminal 4a251, the negative terminal 4a251 does not need to extend too long outside the speaker frame 4a24, thus avoiding interference between the negative terminal 4a251 extending too long outside the speaker frame 4a24 and the structure inside the housing 1. In other examples, the first opening 4a241 may not be provided on the peripheral wall of the speaker frame 4a24, but the connecting portion 4c2 may be directly electrically connected to the negative terminal 4a251.

[0179] Please continue to refer to Figure 13 and Figure 15 , the speaker module 4 further includes a conductive member 4d. The positive electrode of the second speaker unit 4b is electrically connected to the positive terminal 4a252 through the conductive member 4d.

[0180] Optionally, in order to insulate the conductive member 4d from the bracket 4c, the conductive member 4d can be an enameled wire. Of course, the present application is not limited to this. The conductive member 4d can also be a flexible printed circuit (FPC) or a wire, as long as the insulating interval between the bracket 4c and the conductive member 4d is ensured.

[0181] Furthermore, please refer to Figure 13, the circumferential wall of the frame 4a24 has a second opening 4a242, the positive terminal 4a252 has a conductive connection portion 4a2521 located in the frame 4a24, and the conductive member 4d extends into the frame 4a24 through the second opening 4a242 and is electrically connected to the conductive connection portion 4a2521. In this way, not only can the second speaker unit 4b be electrically connected to the positive terminal 4a252 through the conductive member 4d, but also, compared with the solution of directly electrically connecting the conductive member 4d to the positive terminal 4a252, the positive terminal 4a252 does not need to extend too long outside the frame 4a24, thereby avoiding the positive terminal 4a252 extending too long from the frame 4a24 and interfering with the structure in the housing 1. In other examples, the circumferential wall of the frame 4a24 may not be provided with the second opening 4a242, but the conductive member 4d is directly electrically connected to the positive terminal 4a252.

[0182] See also Figure 16 , Figure 16 Schematic diagram of the structure of the speaker module 4 of some other embodiments of the present application. A portion of the conductive member 4d is located on the side to which the outer surface of the connecting portion 4c2 faces. In order to prevent the conductive member 4d from protruding from the outer surface of the connecting portion 4c2 as a whole and interfering with other structures in the housing 1, a wiring groove 4c22 may be formed on the outer surface of the connecting portion 4c2, and a portion of the conductive member 4d is located in the wiring groove 4c22. Of course, it is understandable that the wiring groove 4c22 may not be provided on the outer surface of the connecting portion 4c2.

[0183] Here, the outer surface of the connection portion 4c2 refers to a surface of the connection portion 4c2 on one side facing away from the central axis of the first speaker unit 4a.

[0184] Optionally, part of the conductive member 4d is located on the side toward which the outer circumference of the basin frame 4a24 faces, and in order to prevent the conductive member 4d from protruding as a whole from the outer circumference of the basin frame 4a24 and interfering with other structures in the housing 1, an avoidance groove may be formed on the outer circumference of the basin frame 4a24, and part of the conductive member 4d is located in the avoidance groove. Of course, it is understandable that the avoidance groove may not be provided on the outer circumference of the basin frame 4a24.

[0185] In some embodiments of this application, please refer to Figure 17 , Figure 17 for Figure 8A cross-sectional schematic view of the shown speaker module 4. The negative pole of the second speaker unit 4b is located at one end of the second speaker unit 4b adjacent to the support plate 4c1, and the negative pole of the second speaker unit 4b is connected to the support plate 4c1 through a conductive adhesive 4e. Such an arrangement facilitates the electrical connection between the negative pole of the second speaker unit 4b and the support plate 4c1, and there is no need to additionally provide structures such as signal lines for electrical connection between the two. The positive pole of the second speaker unit 4b is located at one end of the second speaker unit 4b away from the support plate 4c1, and the positive pole of the second speaker unit 4b is connected to the conductive member 4d through a conductive adhesive or by welding. Such an arrangement facilitates the separation of the positive pole and the negative pole of the second speaker unit 4b, and can at least to a certain extent avoid the problem of short circuit.

[0186] In some embodiments of the present application, please continue to refer to Figure 17 , the second speaker unit 4b is a piezoelectric ceramic speaker unit, and the piezoelectric ceramic speaker unit and the support plate 4c1 are stacked. The connection manner between the piezoelectric ceramic speaker unit and the support plate 4c1 includes but is not limited to gluing or welding. In the embodiments of the present application, the piezoelectric ceramic speaker unit has a thin thickness, a small volume, and good high-frequency sound effects.

[0187] Specifically, the piezoelectric ceramic speaker unit includes a piezoelectric ceramic sheet 4bb. The piezoelectric ceramic sheet 4bb includes a piezoelectric body 4b43, a first electrode layer 4b41, and a second electrode layer 4b42.

[0188] It can be understood that Figure 17 and the following related drawings only schematically show some components included in the second speaker unit 4b, and the actual shapes, actual sizes, actual positions, and actual structures of these components are not limited by Figure 17 and the following respective drawings.

[0189] The first electrode layer 4b41 forms the negative electrode of the piezoelectric ceramic speaker unit, and the second electrode layer 4b42 forms the positive electrode of the piezoelectric ceramic speaker unit. The first electrode layer 4b41 and the second electrode layer 4b42 sandwich the piezoelectric body 4b43. The piezoelectric body 4b43 can be made of ceramic material. For example, the material of the piezoelectric body 4b43 includes but is not limited to lead zirconate, lead zirconate titanate, lanthanum lead zirconate titanate, barium titanate, tungsten bronze structure compounds, solid solutions of barium titanate and bismuth ferrite, etc. The first electrode layer 4b41 and the second electrode layer 4b42 can be formed on the piezoelectric body 4b43 by evaporation plating, electroplating, sputtering, etc. The materials of the first electrode layer 4b41 and the second electrode layer 4b42 can be metals. Specifically, for example, the material of the first electrode layer 4b41 includes but is not limited to gold, platinum, silver, copper, palladium, chromium, molybdenum, iron, tin, aluminum, and nickel, etc. The material of the second electrode layer 4b42 includes but is not limited to gold, platinum, silver, copper, palladium, chromium, molybdenum, iron, tin, aluminum, and nickel, etc. The materials of the first electrode layer 4b41 and the second electrode layer 4b42 can be the same or different. When an alternating current is applied to the piezoelectric ceramic speaker unit, the piezoelectric body 4b43 will generate expansion and contraction deformation, thereby driving the air to vibrate and produce sound. In this embodiment, the first electrode layer 4b41 of the piezoelectric ceramic speaker unit is provided on one surface of the piezoelectric body 4b43 facing the support plate 4c1, and the first electrode layer 4b41 and the support plate 4c1 can be electrically connected through the conductive adhesive 4e. The second electrode layer 4b42 is provided on the surface of the piezoelectric body 4b43 facing away from the support plate 4c1, and the second electrode layer 4b42 can be welded to the conductive member 4d.

[0190] In some other embodiments of the present application, please refer to Figure 18 , Figure 18 which is a schematic structural diagram of the speaker module 4 in some other embodiments of the present application. The second speaker unit 4b is a moving iron speaker unit. The second speaker unit 4b is vertically supported on one surface of the support plate 4c1 facing the sound outlet hole 110, and the second speaker unit 4b is located between the inner peripheral surface of the first sound transmission channel 4c11 and the outer peripheral surface of the support plate 4c1.

[0191] Please refer to Figure 19 , Figure 19 which is Figure 18 a schematic cross-sectional structure diagram of the second speaker unit 4b shown in

[0192] It can be understood that Figure 19 and the related drawings below only schematically show some components included in the second speaker unit 4b, and the actual shapes, actual sizes, actual positions, and actual structures of these components are not affected byFigure 19 and are defined by the following drawings and the following text.

[0193] The protective housing 4b1 serves as a carrier for the various components within the second speaker unit 4b, and is used to protect the second diaphragm group 4b21, the reed 4b22, the transmission rod 4b23, the second magnetic circuit system 4b24, the second voice coil 4b25, etc. The connection relationship between the protective housing 4b1 and the support plate 4c1 includes but is not limited to snap connection, gluing, welding, or screw connection.

[0194] On one side of the protective housing 4b1 adjacent to the sound outlet hole 110, a sound outlet channel 4b11 is formed. The sound of the second speaker unit 4b can be emitted through this sound outlet channel 4b11, so that both the second speaker unit 4b and the first speaker unit 4a can emit sound towards the sound outlet hole 110.

[0195] The material of the protective housing 4b1 includes but is not limited to metal, plastic, and the combination of metal and plastic. In some embodiments, the material of the protective housing 4b1 is plastic. Plastic has a low cost and is easy to mold, which is beneficial to reducing the processing cost of the second speaker unit 4b. In some other examples, in order to improve the structural strength of the protective housing 4b1, the material of the protective housing 4b1 can be metal.

[0196] The protective housing 4b1 extends along the sound outlet direction of the sound outlet hole 110. That is to say, the length direction of the protective housing 4b1 is the same as the sound outlet direction of the sound outlet hole 110. Specifically, please refer to Figure 19 , the shape of the protective housing 4b1 can be rectangular parallelepiped.

[0197] The protective housing 4b1 can be a single structural entity, or can be formed by assembling multiple parts. In some embodiments, please continue to refer to Figure 19 . The protective housing 4b1 includes a first housing part 4b1a and a second housing part 4b1b. The first housing part 4b1a and the second housing part 4b1b are arranged in the radial direction of the first speaker unit 4a and are spliced and connected. This can facilitate the separate processing of the first housing part 4b1a and the second housing part 4b1b, which is beneficial to simplifying the mold structure of the first housing part 4b1a and the second housing part 4b1b, thereby reducing the forming difficulty of the first housing part 4b1a and the second housing part 4b1b, and further reducing the processing and manufacturing difficulty of the protective housing 4b1.

[0198] Please continue to refer to Figure 19 . The second diaphragm group 4b21 is arranged inside the protective housing 4b1. The second diaphragm group 4b21 is parallel to the axis of the first speaker unit 4a. In this way, the second diaphragm group 4b21 can be perpendicularly arranged to the first diaphragm group 4a21. Thus, it can at least to a certain extent avoid the interference of the sound emitted by the first speaker unit 4a on the vibration of the second diaphragm group 4b21.

[0199] The second speaker unit 4b divides the space inside the protective housing 4b1 into a front cavity k1 and a rear cavity k2 by means of the second diaphragm assembly 4b21. In this way, the front cavity k1 and the rear cavity k2 are arranged radially with respect to the first speaker unit 4a.

[0200] Please refer to Figure 20 , Figure 20 as Figure 19 a schematic structural view of the second diaphragm assembly 4b21 of the second speaker unit 4b shown in. The second diaphragm assembly 4b21 includes a second connecting portion 4b21a, a second surround 4b21b, and a second dome 4b21c.

[0201] The second connecting portion 4b21a is in the shape of an annular sheet, and the second connecting portion 4b21a is a rounded rectangular ring.

[0202] Please refer to Figure 20 , and in combination with Figure 19 , a stepped portion 4b12 is provided on the inner peripheral surface of the protective housing 4b1, and the second connecting portion 4b21a is stacked on the stepped portion 4b12. The connection relationship between the second connecting portion 4b21a and the stepped portion 4b12 includes but is not limited to gluing. Of course, in some other examples, the protective housing 4b1 may not be provided with the stepped portion 4b12, but the second connecting portion 4b21a may be provided as an annular cylinder, and the second connecting portion 4b21a may be connected to the inner peripheral surface of the protective housing 4b1.

[0203] The second surround 4b21b is provided on the outer periphery of the second dome 4b21c and is surrounded by the second connecting portion 4b21a. The second surround 4b21b is in the shape of a rounded rectangular ring. The second surround 4b21b is recessed toward the side close to the rear cavity K2 to form an arc-shaped or approximately arc-shaped cross-section. Such a setting can save the space of the front cavity K1. Of course, the present application is not limited thereto. In other embodiments, the second surround 4b21b is recessed toward the side close to the front cavity K1 to form an arc-shaped or approximately arc-shaped cross-section.

[0204] In some examples, the second diaphragm assembly 4b21 may be an integrally formed part. That is to say, the second connecting portion 4b21a, the second surround 4b21b, and the second dome 4b21c are integrally formed and connected as a whole. Such a setting not only facilitates the simplification of the processing technology and reduces the production cost, but also can improve the connection strength between the second connecting portion 4b21a and the second surround 4b21b, and between the second surround 4b21b and the second dome 4b21c. Of course, the present application is not limited thereto. In other embodiments, the second connecting portion 4b21a, the second surround 4b21b, and the second dome 4b21c may also be separately processed and manufactured, and then connected by means of gluing or the like.

[0205] Please continue to refer to Figure 19, the reed 4b22 is disposed in the rear cavity K2 of the second speaker unit 4b, and is used to provide a driving force for the vibration of the second diaphragm group 4b21. The material of the reed 4b22 includes, but is not limited to, metal.

[0206] Please refer to Figure 21 , Figure 21 is Figure 19 a schematic structural view of the reed 4b22 of the second speaker unit 4b shown in. The reed 4b22 includes a first sheet body 4b221, a second sheet body 4b222 and a connecting sheet body 4b223.

[0207] The first sheet body 4b221 is in the shape of a rectangular sheet. The first sheet body 4b221 is arranged parallel to the second diaphragm group 4b21. The second sheet body 4b222 is in the shape of a rectangular sheet. The second sheet body 4b222 is arranged parallel to the second diaphragm group 4b21, and the second sheet body 4b222 is located on the side of the first sheet body 4b221 away from the second diaphragm group 4b21. The second sheet body 4b222 may have the same size as the first sheet body 4b221.

[0208] One end of the second sheet body 4b222 is provided with a support body 4b224 that extends beyond the edge of the first sheet body 4b221, and the support body 4b224 is in the shape of a triangle. In some examples, the support body 4b224 and the second sheet body 4b222 may be an integrally formed part, that is, the support body 4b224 and the second sheet body 4b222 are connected into a structural whole. In other examples, the support body 4b224 and the second sheet body 4b222 may be connected by means such as gluing, clamping, welding or screwing.

[0209] The shape of the connecting sheet body 4b223 includes, but is not limited to, "C" shape and "V" shape. The connecting sheet body 4b223 is connected between one end of the second sheet body 4b222 away from the support body 4b224 and one end of the first sheet body 4b221 away from the support body 4b224.

[0210] The reed 4b22 may be an integrally formed part. That is to say, the first sheet body 4b221, the second sheet body 4b222 and the connecting sheet body 4b223 are connected into a whole. Such a setting not only facilitates the simplification of the processing technology and reduces the production cost, but also can improve the connection strength between the first sheet body 4b221 and the connecting sheet body 4b223 and between the second sheet body 4b222 and the connecting sheet body 4b223. Of course, the present application is not limited to this. In other embodiments, the first sheet body 4b221, the second sheet body 4b222 and the connecting sheet body 4b223 may also be independently processed and manufactured, and then connected by means such as gluing or welding.

[0211] Please continue to refer to Figure 19, the transmission rod 4b23 is rod-shaped and is connected between the support 4b224 and the second dome 4b21c. The transmission rod 4b23 is perpendicularly arranged to the second sheet 4b222. Through the connection of the transmission rod 4b23, the vibration of the reed 4b22 can be transmitted to the second diaphragm group 4b21, thereby causing the second speaker unit 4b to emit sound.

[0212] The material of the transmission rod 4b23 includes but is not limited to metal or hard plastic. The connection methods between the transmission rod 4b23 and the second sheet 4b222 include but are not limited to gluing, welding, snap connection or threaded connection. The connection methods between the transmission rod 4b23 and the second diaphragm group 4b21 include but are not limited to gluing, welding, snap connection or threaded connection.

[0213] Please refer to Figure 22 , and in combination with Figure 19 , where Figure 22 is Figure 19 a schematic structural diagram of the second magnetic circuit system 4b24 of the second speaker unit 4b shown in

[0214] The magnetic conduction part 4b241 is in a rectangular ring shape. The axial direction of the magnetic conduction part 4b241 is the same as the axial direction of the speaker frame 4a24. The first sheet 4b221 is supported on one side surface of the magnetic conduction part 4b241 adjacent to the second diaphragm group 4b21. The connection methods between the first sheet 4b221 and the magnetic conduction part 4b241 include but are not limited to gluing or snap connection.

[0215] The two magnet parts 4b242 are arranged in the magnetic conduction part 4b241 and are oppositely arranged in the radial direction of the magnetic conduction part 4b241.

[0216] The shape of the magnet part 4b242 includes but is not limited to a cuboid shape, a cylinder shape or an irregular shape. The magnetization directions of the two magnet parts 4b242 are opposite. For example, one end of one magnet part 4b242 close to the central axis of the magnetic conduction part 4b241 is an N pole, and the end far from the central axis of the magnetic conduction part 4b241 is an S pole. One end of the other magnet part 4b242 close to the central axis of the magnetic conduction part 4b241 is an S pole, and the end far from the central axis of the magnetic conduction part 4b241 is an N pole.

[0217] Please continue to refer to Figure 19 , the second sheet 4b222 penetrates from one axial end of the magnetic conduction part 4b241 to the other axial end of the magnetic conduction part 4b241 so that the support 4b224 is located outside the magnetic conduction part 4b241, and the second sheet 4b222 is located between the two magnet parts 4b242.

[0218] The second voice coil 4b25 is located on the axial side of the magnetic conduction part 4b241 adjacent to the connecting piece body 4b223, and the second voice coil 4b25 surrounds the outer periphery of the second sheet body 4b222.

[0219] In some examples, the side wall of the protective case 4b1 adjacent to the support plate 4c1 can be configured as a conductive structure. The negative lead of the second voice coil 4b25 is electrically connected to the conductive structure, for example, by welding. The conductive structure can form the negative pole of the second speaker unit 4b, and the conductive structure can be welded to the support plate 4c1 or connected by conductive glue. Such an arrangement can achieve the electrical connection between the negative pole of the second speaker unit 4b and the negative terminal 4a251. Of course, the present application is not limited thereto. In some other examples, through holes can also be provided on the peripheral wall of the protective case 4b1, and the negative lead of the second voice coil 4b25 can pass through the through holes and be electrically connected to the bracket 4c.

[0220] In some examples, through holes for wire passing can be formed on the peripheral wall of the protective case 4b1 or on the side wall of the protective case 4b1 away from the support plate 4c1. The conductive member 4d can pass through the through holes and be electrically connected to the positive lead of the second voice coil 4b25, or the positive lead of the second voice coil 4b25 can pass through the through holes and be electrically connected to the conductive member 4d.

[0221] When the second voice coil 4b25 is energized, the second voice coil 4b25 can generate a magnetic field, causing the second sheet body 4b222 located in the second voice coil 4b25 to be magnetized and generate magnetic poles. In this way, a driving force for driving the second sheet body 4b222 to vibrate along the interval direction between the two magnet parts 4b242 can be formed between the second voice coil 4b25 and the magnet part 4b242. The vibration of the second sheet body 4b222 can drive the vibration of the transmission rod 4b23, and the vibration of the transmission rod 4b23 can further drive the vibration of the second diaphragm group 4b21. The vibration of the second diaphragm group 4b21 can push the air in the front cavity K1 to vibrate and generate sound, and the sound is emitted through the sound outlet channel 4b11.

[0222] Please refer to Figure 23 , Figure 23 which is a schematic structural diagram of the speaker module 4 according to some other embodiments of the present application. In this embodiment, the second speaker unit 4b can also be horizontally supported on the surface of the support plate 4c1 facing the sound outlet hole 110, that is to say, the length direction of the second speaker unit 4b is parallel to the support plate 4c1.

[0223] In the description of this specification, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0224] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. A headset (100), characterized in that, The earphone includes a housing (1) and a speaker module (4); The housing (1), a part of the housing (1) is adapted to be inside the user's ear, the housing (1) has a sound outlet hole (110), the speaker module (4) is disposed inside the housing (1), and the speaker module (4) includes: a first speaker unit (4a), a second speaker unit (4b), a bracket (4c), a conductive member (4d), a terminal (4a25), and a chassis (4a24); wherein, A groove is provided on the inner peripheral surface of the chassis (4a24), at least a part of the first speaker unit (4a) is disposed in the groove, the bracket (4c) is connected to the chassis (4a24), the first speaker unit (4a), the bracket (4c), and the second speaker unit (4b) are stacked, the first speaker unit (4a) is located on a side of the bracket (4c) away from the sound outlet hole (110), and the second speaker unit (4b) is located on a side of the bracket (4c) facing the sound outlet hole (110); The terminal (4a25) includes a first terminal, a second terminal, a conductive connection portion (4a2521), and a conductive extension portion (4a2511), the first speaker unit (4a) is electrically connected to the first terminal, the first speaker unit (4a) is electrically connected to the second terminal, the second speaker unit (4b) is electrically connected to the bracket (4c), the chassis (4a24) has a second opening (4a242), the conductive connection portion (4a2521) is blocked by the outer surface of the chassis (4a24), the second speaker unit (4b) is connected to the conductive member (4d), the conductive member (4d) extends into the chassis (4a24) through the second opening (4a242) to connect the conductive connection portion (4a2521), the conductive connection portion (4a2521) is connected to the first terminal, the bracket (4c) is connected to the conductive extension portion (4a2511), and the conductive extension portion (4a2511) is connected to the second terminal.

2. The earphone (100) according to claim 1, characterized in that, The earphone (100) further includes a circuit board (2) and a battery (3), the circuit board (2) includes a wireless communication module (6), the battery (3) is located between the circuit board (2) and the speaker module (4), the circuit board (2) is electrically connected to the battery (3), the circuit board (2) is electrically connected to the speaker module (4), at least a part of the terminal (4a25) protrudes from the chassis (4a24), and the speaker module (4) is connected to the circuit board (2) through the terminal (4a25).

3. The earphone (100) according to claim 1 or 2, characterized in that, The first speaker unit (4a) includes a first diaphragm group (4a21), and the orthographic projection of the second speaker unit (4b) on a first plane is located within the outer contour of the orthographic projection of the first diaphragm group (4a21) on the first plane, and the first plane is parallel to the plane where the first diaphragm group (4a21) is located.

4. The earphone (100) according to claim 1 or 2, characterized in that, The first speaker unit (4a) is a moving coil speaker unit, and the second speaker unit (4b) is a piezoelectric ceramic speaker unit.

5. The earphone (100) according to claim 1 or 2, characterized in that, The housing (1) includes a front shell (11) and a rear shell (12). The sound outlet hole (110) is located on the front shell (11). The rear shell (12) includes a cover body (121) and a rod body (122). The cover body (121) is connected to the front shell (11), and the rod body (122) is located on the side of the cover body (121) away from the front shell (11).

6. The earphone (100) according to claim 1 or 2, characterized in that, Both the first speaker unit (4a) and the second speaker unit (4b) emit sound towards the sound outlet hole (110).

7. The earphone (100) according to claim 1 or 2, characterized in that, The first terminal (4a252) is a positive terminal (4a252), and the second terminal is a negative terminal (4a251). The second speaker unit (4b) is connected to the conductive member (4d), including: The positive electrode of the second speaker unit (4b) is electrically connected to the conductive member (4d); The second speaker unit (4b) is electrically connected to the bracket (4c), including: The negative electrode of the second speaker unit (4b) is electrically connected to the bracket (4c); The conductive wiring portion (4a2521) is connected to the first terminal, including: The conductive wiring portion (4a2521) is electrically connected to the positive terminal (4a252); The conductive extension portion (4a2511) is connected to the second terminal, including: The conductive extension portion (4a2511) is electrically connected to the negative terminal (4a251).

8. The earphone (100) according to claim 1 or 2, characterized in that, The bracket (4c) is connected to the conductive extension portion (4a2511), including: The bracket (4c) is detachably connected to the conductive extension portion (4a2511); or, the bracket (4c) is non - detachably connected to the conductive extension portion (4a2511); or, the bracket (4c) is directly connected to the conductive extension portion (4a2511); or, the bracket (4c) is indirectly connected to the conductive extension portion (4a2511) through an intermediate medium; or, the bracket (4c) is electrically connected to the conductive extension portion (4a2511); or, the bracket (4c) is connected to the conductive extension portion (4a2511) through a conductive part.

9. The earphone (100) according to claim 8, wherein, An insulating protective layer is provided on the outer surface of the conductive part.

10. The earphone (100) according to claim 8, characterized in that, The conductive part is a metal insert.

11. The earphone (100) according to claim 8, characterized in that, The bracket (4c) includes a connecting portion (4c2) and a support plate (4c1). The first diaphragm group (4a21) is located on the chassis (4a24); The support plate (4c1) is located on one axial side of the first speaker unit (4a) and is opposite to the outer surface of the first diaphragm group (4a21); the connecting portion (4c2) is connected between the outer peripheral edge of the support plate (4c1) and the peripheral wall of the basin frame (4a24); the second speaker unit (4b) is located on the side of the support plate (4c1) away from the first speaker unit (4a); and the connection method of the connecting portion (4c2) and the basin frame (4a24) includes any one or more of the following methods: snap-on, gluing, welding and screw connection.

12. The earphone (100) according to claim 11, characterized in that, The conductive part is a part of the bracket (4c); or, the conductive part is only composed of a part of the connecting part (4c2); or, the conductive part is only composed of the entire connecting part (4c2); or, the conductive part is composed of a part of the connecting part (4c2) and a part of the supporting plate (4c1); or, the conductive part is composed of a part of the connecting part (4c2) and the entire supporting plate (4c1); or, the conductive part is composed of the bracket (4c).

13. The earphone (100) according to claim 11, characterized in that, The negative electrode of the second speaker unit (4b) is located at one end of the second speaker unit (4b) adjacent to the support plate (4c1), and the negative electrode of the second speaker unit (4b) is electrically connected to the support plate (4c1).

14. The earphone (100) according to claim 11, characterized in that, The support plate (4c1) has a third opening, and the second speaker unit (4b) does not cover the third opening; the sound emitted by the vibration of the first speaker unit (4a) is transmitted toward the sound outlet (110) through the third opening.

15. The earphone (100) according to claim 14, characterized in that, The third opening is circular and the second speaker unit (4b) is annular.

16. The earphone (100) according to claim 3, characterized in that, The bracket (4c) also has a fourth opening, and the sound emitted by the vibration of the first speaker unit (4a) is transmitted toward the sound outlet (110) through the fourth opening. In the first plane, a part of the orthographic projection of the fourth opening is located within the outer contour of the orthographic projection of the first diaphragm group (4a21).

17. The earphone (100) according to claim 1 or 2, characterized in that, A wiring groove (4c22) is provided on the outer surface of the loudspeaker module (4), and a portion of the conductive member (4d) is located in the wiring groove (4c22).

18. The earphone (100) according to claim 2, characterized in that, The circuit board (2) is one of a hard circuit board, a flexible circuit board or a hard-soft combined circuit board.

19. The earphone (100) according to claim 2, characterized in that, The circuit board (2) is one of a FR-medium board, a Rogers-medium board or a mixed-medium board of FR- and Rogers.

20. The earphone (100) according to claim 1 or 2, characterized in that, The conductive member (4d) is one of an enameled wire, a flexible circuit board or a conductive wire.

21. The earphone (100) according to claim 1 or 2, characterized in that, The sound frequency of the second speaker unit (4b) is greater than the sound frequency of the first speaker unit (4a).

22. The earphone (100) according to claim 1 or 2, characterized in that, The second speaker unit (4b) is a moving iron speaker unit, and the moving iron speaker unit is vertically supported on the bracket (4c).

23. The earphone (100) according to claim 22, characterized in that, The moving iron speaker unit comprises a second diaphragm group (4b21), and the second diaphragm group (4b21) is arranged vertically to the first diaphragm group (4a21).

24. The earphone (100) according to claim 22, characterized in that, The moving iron type loudspeaker unit includes a protective shell (4b1), a reed (4b22), a transmission rod (4b23), a second magnetic circuit system (4b24) and a second voice coil (4b25); The second diaphragm group (4b21) is arranged in the protective shell (4b1) to divide the space in the protective shell (4b1) into a front cavity (K1) and a rear cavity (K2). The reed (4b22), the transmission rod (4b23), the second magnetic circuit system (4b24) and the second voice coil (4b25) are all located in the rear cavity (K2), and the reed (4b22), the transmission rod (4b23), the second magnetic circuit system (4b24) and the second voice coil (4b25) cooperate to drive the second diaphragm group (4b21) to vibrate.

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