Rigid-flex PCB manufacturing method, rigid-flex PCB and electronic equipment

Abstract

The invention relates to the technical field of rigid-flex PCB manufacturing, in particular to a rigid-flex PCB manufacturing method, a rigid-flex PCB and electronic equipment, and aims to solve the problem that a traditional scheme cannot meet the high-multilayer high-density design requirement of a customer on a rigid-flex product PCB. The method comprises the steps that a first rigid-flex composite core material, a rigid printed circuit board core plate and a second rigid-flex composite core material are laminated to form a daughter board Core, and a rigid printed circuit board base material is located between the first rigid-flex composite core material and the second rigid-flex composite core material; and the manufactured M daughter boards Core are laminated together by using a bonding medium to obtain the high-layer rigid-flex PCB.

Description

Technical Field

[0001] The present application relates to the technical field of rigid-flex PCB manufacturing, and particularly to a method for manufacturing a rigid-flex PCB board, a rigid-flex PCB board, and an electronic device. Background Art

[0002] A rigid-flex PCB (Rigid-Flex PCB) is a circuit board that combines a rigid PCB (Rigid PCB) and a flexible PCB (Flexible PCB). It utilizes the bending characteristics of the flexible circuit board to make the circuit design more compact. A high-layer count rigid-flex PCB (High-Layer Count Rigid-Flex PCB) is a composite circuit board that includes multiple rigid parts and multiple flexible parts, and is more suitable for electronic devices with high density, complex wiring, and the need for dynamic bending.

[0003] With the development of the demand for lightweight electronic products and industrial equipment and high-speed signal output, due to the replacement of existing customer products to meet market demands, the existing processing technology for high-layer count rigid-flex products has limitations. The product has a low layer count and a heavy board quality, and cannot meet the design requirements of high-layer, thin, and reliable products, nor can it meet the customer's requirements for high-layer count and high-density design of rigid-flex PCB products. Summary of the Invention

[0004] Embodiments of the present application provide a method for manufacturing a rigid-flex PCB board, a rigid-flex PCB board, and an electronic device to solve the technical problem that the traditional solution cannot meet the customer's requirements for high-layer count and high-density design of rigid-flex PCB products.

[0005] In a first aspect, a method for manufacturing a rigid-flex PCB board is provided. The method includes: Pressing a first rigid-flex composite core material, a rigid printed circuit board core board, and a second rigid-flex composite core material to form a sub-board Core, where the rigid printed circuit board substrate is located between the first rigid-flex composite core material and the second rigid-flex composite core material; Stacking and pressing M of the produced sub-boards Core together with a bonding medium to obtain a high-layer rigid-flex PCB board.

[0006] Further, the rigid printed circuit board core board includes a glass fiber reinforced epoxy resin core board FR4. The pressing of the first rigid-flex composite core material, the rigid printed circuit board core board, and the second rigid-flex composite core material to form a sub-board Core includes: Pressing the first rigid-flex composite core material, the glass fiber reinforced epoxy resin core board FR4, and the second rigid-flex composite core material to form a sub-board Core.

[0007] Further, the thickness of the sub-board Core is 0.2 mm.

[0008] Further, the bonding medium includes a prepreg PP. Stacking and pressing M obtained sub-boards Core together with the bonding medium to obtain a high-layer rigid-flex PCB board, including: Bonding M obtained sub-boards Core together with the prepreg PP and stacking and pressing them together to obtain a high-layer rigid-flex PCB board. The thickness of the prepreg PP is the lowest thickness that meets the medium thickness requirement.

[0009] Further, the thickness of the high-layer rigid-flex PCB board is within 5 mm, and the number of layers of the high-layer rigid-flex PCB board is 60 - 80 layers.

[0010] Further, the thickness of the rigid printed circuit board core is 2 mil.

[0011] Further, after stacking and pressing M obtained sub-boards Core together with the bonding medium to obtain a high-layer rigid-flex PCB board, the method further includes: Processing the hard board and the flexible board parts of the high-layer rigid-flex PCB board respectively; Among them, the hard board part is designed as a rigid part according to customer requirements to meet the requirements of the components on the keys. The flexible board part is subjected to windowing treatment to retain the flexible board layers to be bent, and the outer layer of the flexible board part is subjected to controlled-depth opening of the cover.

[0012] Further, between the first rigid-flex composite core material and the rigid printed circuit board core, and between the rigid printed circuit board core and the second rigid-flex composite core material, epoxy resin, polyurethane, silicone or film lamination materials are used.

[0013] In a second aspect, a rigid-flex PCB board is provided. The rigid-flex PCB board is manufactured based on the manufacturing method of the rigid-flex PCB board described in any one of the foregoing items.

[0014] In a third aspect, an electronic device is provided. The electronic device includes the rigid-flex PCB board as described above.

[0015] It can be seen that a method for manufacturing a rigid-flex PCB board is provided. In this embodiment, a method for manufacturing a rigid-flex PCB board is provided, in which a first rigid-flex composite core material, a rigid printed circuit board core board, and a second rigid-flex composite core material are laminated to synchronously prepare M sub-board Cores of multiple different levels, and the number of sub-board Cores of the levels required by the customer is laminated. Then, the M sub-board Cores obtained are laminated together with a bonding medium to obtain a high-layer rigid-flex PCB board, that is, the rigid-flex PCB process structure of the stepped ultra-high layer is completed by combining and laminating all sub-board Cores. Compared with the traditional solution, since the adhesive layer of the rigid-flex composite core material is thin and resistant to high temperature and high pressure, the thickness after lamination of multiple sub-board Cores prepared based on the rigid-flex composite core material can be effectively compressed, effectively avoiding the influence of the ultra-processing process limit ability on the reliability-related indicators of the rigid-flex PCB board, and solving the existing customer design requirements for products with increasingly high multi-layers, thinness, and high reliability. It can increase the number of layers of the rigid-flex PCB product while simultaneously reducing the weight of the board, having the characteristics of a compact structure, strong signal transmission, ultra-high multi-layers, thinness, and saving thickness space. It is a manufacturing process of a new ultra-high layer rigid-flex PCB structure solution that can be mass-produced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 is a schematic flow chart of a method for manufacturing a rigid-flex PCB board in an embodiment of the present application; Figure 2 is a schematic structural diagram of a rigid-flex composite core material FRCC in a method for manufacturing a rigid-flex PCB board in an embodiment of the present application; Figure 3 is a schematic structural diagram of a sub-board Core in a method for manufacturing a rigid-flex PCB board in an embodiment of the present application; Figure 4 is a schematic lamination structural diagram of multiple layers of sub-board Cores in a method for manufacturing a rigid-flex PCB board in an embodiment of the present application; Figure 5 is another schematic flow chart of a method for manufacturing a rigid-flex PCB board in an embodiment of the present application; Figure 6 is a schematic structural diagram of a high-layer rigid-flex PCB board manufactured by a method for manufacturing a rigid-flex PCB board in an embodiment of the present application; REFERENCE SIGNS: The first rigid-flex composite core materials - 11, 12 - rigid printed circuit board substrates, the second rigid-flex composite core materials - 13, prepregs - 14. Detailed implementation manners

[0018] In order to make the technical problems, technical solutions and beneficial effects solved by the present application clearer and more understandable, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] The existing processing technologies for high multi-layer rigid-flex PCB products have limitations. The product layers are relatively low and the board quality is heavy, resulting in the inability to meet the customer design requirements of increasingly high multi-layer, thin and light, and high reliability of products. The embodiments of the present application provide a new manufacturing solution for rigid-flex PCB boards to solve the above problems, and the following will be described in detail respectively.

[0020] In one embodiment, as Figure 1 shown, a method for manufacturing a rigid-flex PCB board is provided, and the method includes the following steps: S101. Press the first rigid-flex composite core material, the rigid printed circuit board core board, and the second rigid-flex composite core material to form a sub-board Core, wherein the rigid printed circuit board substrate is located between the first rigid-flex composite core material and the second rigid-flex composite core material; S102. Stack and press M of the produced sub-boards Core together with a bonding medium to obtain a high-layer rigid-flex PCB board.

[0021] Among them, the first rigid-flex composite core material 11 and the second rigid-flex composite core material 13 respectively refer to the upper and lower layers of rigid-flex composite core materials (Flexible-Rigid Copper Clad, FRCC) that sandwich the rigid printed circuit board core board 12. For the convenience of distinction and description, in the embodiments of the present application, they are respectively denoted as the first rigid-flex composite core material 11 and the second rigid-flex composite core material 13. It should be understood that, as Figure 2As shown, the rigid-flex composite core material is a substrate specifically used for rigid-flex printed circuit boards (Rigid-Flex PCBs). By integrating rigid and flexible materials on the same copper-clad laminate, the material structure of the rigid-flex composite core material FRCC generally includes a rigid section, a flexible section, a copper layer, a dielectric layer, and a transition zone: The rigid section is used to provide mechanical support and welding areas, and is suitable for installing high-power components, connectors, and heat sinks, etc. The flexible section can use flexible materials such as polyimide (PI) and LCP (liquid crystal polymer), and is used for dynamic connection, folding areas, and high-density signal transmission. The copper layer can use electrolytic copper (ED copper) or rolled copper (RA copper), which is used to enhance the anti-bending ability and is suitable for high-speed signal transmission and power circuit applications. The dielectric layer generally consists of insulating materials such as epoxy resin and is used to determine signal loss and heat resistance. The transition zone is the area connecting the rigid section and the flexible section, and special treatment is used to prevent fracture. Compared with traditional rigid-flex printed circuit boards, the use of the rigid-flex composite core material FRCC in the embodiments of the present application can eliminate multiple lamination and drilling processes, reduce costs, and also reduce stress concentration at the rigid-flex connection, improving anti-bending and fatigue resistance, thereby simplifying the manufacturing process, improving reliability, and reducing production costs; the specific structure of the rigid-flex composite core material FRCC is not specifically described in the embodiments of the application.

[0022] Among them, as Figure 3 shown, the rigid printed circuit board substrate 12 is located between the first rigid-flex composite core material 11 and the second rigid-flex composite core material 13. In the embodiments of the present application, a lamination process will be used to laminate the first rigid-flex composite core material 11, the rigid printed circuit board core board 12, and the second rigid-flex composite core material 13 to form a sub-board Core. The formed sub-board Core includes at least 3 layers or 4 layers, etc. For example, the bonding medium can also be laminated together, and the bonding medium is located below the lower rigid-flex composite core material; after laminating the first rigid-flex composite core material 11, the rigid printed circuit board core board 12, and the second rigid-flex composite core material 13, the pattern required by the customer is made, that is, the copper layer is patterned to obtain the required pattern. It should be noted that the rigid printed circuit board substrate 12 can adopt various substrate types, which are not specifically limited. Exemplarily, the rigid printed circuit board substrate can include a glass fiber-reinforced epoxy resin core board (Flame Retardant 4, FR4) or other types of rigid printed circuit board substrates. For the convenience of description, the embodiments of the present application will all take the rigid printed circuit board substrate FR4 as an example for description, which is not specifically limited.

[0023] In this embodiment, as Figure 4As shown, other layers of the sub-board Core will be manufactured synchronously. The sub-board Cores are bonded with a bonding medium, and the M manufactured sub-board Cores are stacked and pressed together with a bonding medium to obtain a high-layer rigid-flex PCB board. That is to say, the lamination process will be used to stack and press M sub-board Cores of different layers with the sub-board Core as a unit to obtain a multi-layer high-layer rigid-flex PCB board. It should be noted that the specific number of sub-board Cores used can be determined according to the design requirements of the high-layer rigid-flex PCB board, and the specific embodiments of this application are not limited.

[0024] It can be seen that in this embodiment, a method for manufacturing a rigid-flex PCB board is provided. The first rigid-flex composite core material 11, the rigid printed circuit board core board 12, and the second rigid-flex composite core material 13 are pressed together to synchronously prepare M sub-board Cores of multiple different layers, and the number of sub-board Cores of the required layers for the customer is pressed out. Then, the M manufactured sub-board Cores are stacked and pressed together with a bonding medium to obtain a high-layer rigid-flex PCB board, that is, all the sub-board Cores are combined and pressed to complete the rigid-flex PCB process structure of the stepped ultra-high layer. Compared with the traditional solution, since the adhesive layer of the rigid-flex composite core material is thin and resistant to high temperature and high pressure, the thickness after pressing of multiple sub-board Cores prepared based on the rigid-flex composite core material can be effectively compressed and controlled, effectively avoiding the influence of the ultra-processing technology limit ability on the reliability-related indicators of the rigid-flex PCB board. It can solve the existing customers' design requirements for high multi-layer, thin, light, and high-reliability products, can improve the layer of the rigid-flex PCB product while synchronously reducing the weight of the board, and has the characteristics of compact structure, strong signal transmission, ultra-high multi-layer, thin, light, and saving thickness space. It is a manufacturing process of a new ultra-high layer rigid-flex PCB structure solution that can be mass-produced. It should be understood that in the manufacturing of printed circuit boards, the ultra-processing technology refers to the manufacturing process of high-precision, high-density, multi-layer, or special material PCBs.

[0025] In one embodiment, after step S102, that is, after the M manufactured sub-board Cores are stacked and pressed together with a bonding medium to obtain a high-layer rigid-flex PCB board, the method further includes the following steps: 103. Process the hard board and the flexible board parts of the high-layer rigid-flex PCB board respectively; among them, the hard board part is designed into a rigid part according to the customer's requirements to meet the requirements of the components on the key, the flexible board part is subjected to windowing treatment to retain the flexible board layers that need to be bent, and the outer layer of the flexible board part is subjected to controlled-depth opening of the cover.

[0026] Such as Figure 6As shown, in this embodiment, after stacking and laminating the M sub-boards Core obtained by manufacturing with a bonding medium to obtain a high-layer rigid-flex PCB board, the rigid board and the flexible board parts can also be processed separately: the rigid board is designed according to customer requirements to meet the requirements of the component keying on the components; it should be noted that in PCB design and manufacturing, component keying refers to the requirements for the placement, direction, polarity, package size, etc. of components to ensure correct electrical connection and assembly reliability. The flexible board part is subjected to windowing treatment to retain the flexible board layers to be bent, and the outer layer of the flexible board part is subjected to controlled depth milling / routing.

[0027] It should be noted that as Figure 6 shown, controlled depth milling / routing is a special processing method in PCB processing technology, mainly used for locally removing the cover layer (such as the protective film, solder mask or metal layer) for welding, connection or other special functional requirements. This process requires precise control of the processing depth to ensure that only the specified layer is removed without damaging the underlying circuit or substrate. In this embodiment, after the above-mentioned rigid board and flexible board processing, both the bending space and the lightweight high-layer structure are satisfied. The finally formed high-layer rigid-flex PCB has the characteristics of a compact structure, small occupied space and a bending function, and can be widely used in the application scenarios of rigid-flex PCB products.

[0028] It should be noted that the rigid printed circuit board core board 12 includes a glass fiber reinforced epoxy resin core board FR4 or other types of rigid printed circuit board core boards, and no specific limitation is made. The FR4 core board is a relatively common substrate for rigid printed circuit boards (Rigid PCB), mainly including glass fiber reinforced epoxy resin and a copper clad layer, and has the characteristics of high strength, good heat resistance and excellent electrical performance. As an exemplary illustration, in the embodiments of the present application, according to the application products of the final rigid-flex PCB board, it may include but is not limited to a standard FR4 core board, a mid-Tg FR-4 core board, a high-Tg FR-4 core board or a halogen-free FR-4 core board, and no specific limitation is made.

[0029] In the embodiments of the present application, taking the rigid printed circuit board core board as the FR4 core board as an example, the embodiments of the present application are described in detail.

[0030] In one embodiment, as Figure 5 shown, an embodiment of the present application provides a method for manufacturing a rigid-flex PCB board, and the method includes the following steps: S201. Press-fit the first flexible-rigid composite core material, the fiberglass-reinforced epoxy resin core board FR4, and the second flexible-rigid composite core material to form a sub-board Core, where the fiberglass-reinforced epoxy resin core board FR4 is located between the first flexible-rigid composite core material and the second flexible-rigid composite core material; Among them, the first flexible-rigid composite core material 11 and the second flexible-rigid composite core material 13 respectively refer to the flexible-rigid composite core materials (Flexible-Rigid Copper Clad, FRCC) sandwiching the upper and lower layers of the rigid printed circuit board core board 12. For the convenience of distinction and description, in the embodiments of the present application, they are respectively denoted as the first flexible-rigid composite core material 11 and the second flexible-rigid composite core material 13. It should be understood that, as Figure 2 shown, the flexible-rigid composite core material is a substrate specifically used for rigid-flex printed circuit boards (Rigid-Flex PCB), which integrates rigid and flexible materials on the same copper-clad laminate.

[0031] Among them, as Figure 3 shown, the rigid printed circuit board substrate 12 is located between the first flexible-rigid composite core material 11 and the second flexible-rigid composite core material 13. In the embodiments of the present application, a lamination process will be used to press-fit the first flexible-rigid composite core material 11, the fiberglass-reinforced epoxy resin core board FR4, and the second flexible-rigid composite core material to form a sub-board Core. The formed sub-board Core includes at least 3 layers or 4 layers, etc., and the patterns required by the customer are made, that is, the copper layer is patterned to obtain the required patterns.

[0032] In one embodiment, the thickness of the rigid printed circuit board core board is 2 mil or other thicknesses.

[0033] In one embodiment, the total thickness of the sub-board Core is 0.2 mm. In this embodiment, since the adhesive layer of the flexible-rigid composite core material is thin, and the thickness of the rigid printed circuit board core board 12 (such as the FR4 core board) is controlled to be 2 mil, the thickness after pressing multiple sub-boards Core prepared based on the flexible-rigid composite core material can be effectively controlled to keep it at or about 0.2 mm, so as to control the thickness of the subsequent entire rigid-flex PCB board and ensure the realization of the solution to obtain the ultra-high-layer rigid-flex PCB board required by the design.

[0034] In one embodiment, between the first rigid-flex composite core material 11 and the rigid printed circuit board core board 12, and between the rigid printed circuit board core board 12 and the second rigid-flex composite core material 13, epoxy resin, polyurethane, silica gel or film lamination materials are used. In combination with this embodiment, between the first rigid-flex composite core material and the glass fiber reinforced epoxy resin core board FR4, and between the glass fiber reinforced epoxy resin core board FR4 and the second rigid-flex composite core material 13, epoxy resin, polyurethane, silica gel or film lamination materials can be used for lamination. Each lamination material has its own characteristics and can be selected according to the characteristics of the applied product or the process cost, and no specific limitation is made.

[0035] S202. Stack and press M of the manufactured sub-boards Core together with prepregs to obtain a high-layer rigid-flex PCB board.

[0036] In one embodiment, the bonding medium includes prepregs or other types of bonding media. Stacking and pressing M of the manufactured sub-boards Core together with the bonding medium to obtain a high-layer rigid-flex PCB board includes: bonding M of the manufactured sub-boards Core together with prepregs 14 to stack and press them together to obtain a high-layer rigid-flex PCB board. It should be noted that the specific number of layers of sub-boards Core can be determined according to requirements, and no specific limitation is made in the embodiments of the present application.

[0037] In an actual application scenario, the thickness of the prepreg 14 is the lowest thickness that meets the dielectric thickness requirement. In this embodiment, the thickness of the prepreg 14 can be compressed as much as possible to ensure the number of layers of the high-layer rigid-flex PCB board, so as to obtain a higher-layer high-layer rigid-flex PCB board.

[0038] In one embodiment, the thickness of the high-layer rigid-flex PCB board is within 5 mm, and the number of layers of the high-layer rigid-flex PCB board is between 60 and 80. Based on the manufacturing process of the embodiments of the present application, a super-high-layer rigid-flex PCB board with 60 to 80 layers can be completed, meeting the customer's demand for ultra-high multi-layer high density of rigid-flex product PCBs; compared with the traditional 20-layer or 40-layer solutions, the embodiments of the present application can greatly increase the number of layers.

[0039] As Figure 4 shown, other layers of the sub-boards Core will be manufactured synchronously. The sub-boards Core are bonded with prepregs 14, and M of the manufactured sub-boards Core are stacked and pressed together with the bonding medium to obtain a high-layer rigid-flex PCB board. That is to say, the lamination process will be used to stack and press M sub-boards Core of different layers together with the sub-boards Core as a unit to obtain a multi-layer high-layer rigid-flex PCB board.

[0040] It can be seen that in this embodiment, a method for manufacturing a rigid-flex PCB board is provided. The first rigid-flex composite core material 11, the glass fiber-reinforced epoxy resin core board FR4 (i.e., 12 in the figure), and the second rigid-flex composite core material 13 are laminated to simultaneously prepare M sub-boards Core of multiple different layers, and the number of sub-boards Core of the required layers by the customer is laminated. Then, the M obtained sub-boards Core are laminated together with prepregs 14 to obtain a high-layer rigid-flex PCB board, that is, the rigid-flex PCB process structure of the stepped ultra-high layer is completed by combining and laminating all the sub-boards Core. Compared with the traditional solution, since the adhesive layer of the rigid-flex composite core material is thin and resistant to high temperature and high pressure, the thickness after lamination of multiple sub-boards Core prepared based on the rigid-flex composite core material can be effectively compressed, effectively avoiding the influence of the ultra-processing process limit ability on the reliability-related indicators of the rigid-flex PCB board. It can solve the existing customer design requirements for products with increasingly high multi-layers, thinness, and high reliability. It can increase the number of layers of the rigid-flex PCB product while simultaneously reducing the weight of the board. It has the characteristics of a compact structure, strong signal transmission, ultra-high multi-layers, thinness, and saving thickness space. It is a manufacturing process of a new type of ultra-high layer rigid-flex PCB structure solution that can be mass-produced.

[0041] In one embodiment, after step S202, that is, after laminating the M obtained sub-boards Core together with prepregs PP to obtain a high-layer rigid-flex PCB board, the method further includes the following steps: S203. Process the high-layer rigid-flex PCB board into a rigid board part and a flexible board part respectively; wherein, the rigid board part is designed as a rigid part according to customer requirements to meet the requirements of component mounting, and the flexible board part is subjected to windowing treatment to retain the flexible board layers to be bent, and the outer layer of the flexible board part is subjected to controlled-depth opening.

[0042] The above step S203 can refer to the relevant description of step S103 in the foregoing embodiment for details. To avoid redundancy, it will not be repeated here.

[0043] In one embodiment, a rigid-flex PCB board is also provided, and the rigid-flex PCB board is manufactured by the method for manufacturing a rigid-flex PCB board according to any one of the foregoing method embodiments.

[0044] It can be seen that in this embodiment, a rigid-flex PCB board is provided. Compared with the traditional solution, in the rigid-flex PCB board of the embodiment of the present application, due to the thin adhesive layer and high temperature and high pressure resistance of the rigid-flex composite core material, the thickness of multiple sub-boards Core obtained based on the rigid-flex composite core material can be effectively compressed after lamination, effectively avoiding the influence of the ultra-processing process limit ability on the reliability-related indicators, and can solve the existing customers' design requirements for products with increasingly high multi-layers, thinness, and high reliability. It can improve the level of the rigid-flex PCB product while simultaneously reducing the weight of the board. It can meet the requirements of reducing the relatively high thickness / product design on the basis of the original conventional design board thickness. It has the characteristics of compact structure, strong signal transmission, ultra-high multi-layers, thinness, saving thickness space, and high reliability.

[0045] In one embodiment, an electronic device is provided, and the electronic device includes the rigid-flex PCB board as described in the foregoing embodiment. Among them, for the manufacturing method of the rigid-flex PCB board, reference can be made in detail to the foregoing embodiment, and details will not be repeated here.

[0046] In this embodiment, an electronic device is provided, which includes a rigid-flex PCB board prepared by using the manufacturing method of the rigid-flex PCB board provided in the embodiment of the present application. Since the rigid-flex PCB board has the characteristics of compact structure, strong signal transmission, ultra-high multi-layers, thinness, and saving thickness space, the reliability of the electronic device applying the rigid-flex PCB board is stronger.

[0047] The foregoing embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A manufacturing method of a rigid-flex PCB board, characterized in that, The method includes: Pressing a first rigid-flex composite core, a rigid printed circuit board core board, and a second rigid-flex composite core to form a sub-board Core, wherein the rigid printed circuit board substrate is located between the first rigid-flex composite core and the second rigid-flex composite core; Stacking and pressing M of the produced sub-boards Core together with a bonding medium to obtain a high-layer rigid-flex PCB board.

2. The method for manufacturing a rigid-flex PCB board according to claim 1, wherein, The rigid printed circuit board core board includes a glass fiber-reinforced epoxy resin core board FR4. The pressing of the first rigid-flex composite core, the rigid printed circuit board core board, and the second rigid-flex composite core to form a sub-board Core includes: Pressing the first rigid-flex composite core, the glass fiber-reinforced epoxy resin core board FR4, and the second rigid-flex composite core to form a sub-board Core.

3. The method for manufacturing a rigid-flex PCB board according to claim 2, wherein The thickness of the sub-board Core is 0.2 mm.

4. The method for manufacturing a rigid-flex PCB board according to claim 1, wherein The bonding medium includes a prepreg PP. The stacking and pressing M of the produced sub-boards Core together with a bonding medium to obtain a high-layer rigid-flex PCB board includes: Bonding M of the produced sub-boards Core together with prepreg PP and stacking and pressing them to obtain a high-layer rigid-flex PCB board. The thickness of the prepreg PP is the lowest thickness that meets the medium thickness requirement.

5. The manufacturing method of the rigid-flex PCB board according to claim 1, characterized in that, The thickness of the high-layer rigid-flex PCB board is within 5 mm, and the number of layers of the high-layer rigid-flex PCB board is 60 - 80 layers.

6. The manufacturing method of the rigid-flex PCB board according to claim 1, wherein The thickness of the rigid printed circuit board core board is 2 mil.

7. The manufacturing method of the rigid-flex PCB board according to any one of claims 1-6, characterized in that, After stacking and pressing M of the produced sub-boards Core together with a bonding medium to obtain a high-layer rigid-flex PCB board, the method further includes: Processing the high-layer rigid-flex PCB board to form hard board and flexible board parts respectively; Among them, the hard board part is designed as a rigid part according to customer requirements to meet the requirements for keying on components. The flexible board part is subjected to windowing treatment to retain the flexible board layers that need to be bent, and the outer layer of the flexible board part is subjected to controlled-depth opening of the cover.

8. The manufacturing method of the rigid-flex PCB board according to any one of claims 1-6, characterized in that, Epoxy resin, polyurethane, silicone, or film lamination material is used between the first rigid-flex composite core and the rigid printed circuit board core board, and between the rigid printed circuit board core board and the second rigid-flex composite core.

9. A rigid-flex PCB board, characterized in that, The rigid-flex PCB board is manufactured by the rigid-flex PCB board manufacturing method according to any one of claims 1 - 8.

10. An electronic device, characterized in that, The electronic device includes the rigid-flex PCB board according to claim 9.

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