UV curing device and curing process

Abstract

The invention discloses a UV curing device and a curing process, and relates to the technical field of packaging. Comprising a first supporting frame and a second supporting frame, the first supporting frame and the second supporting frame are both in a U shape, the first supporting frame and the second supporting frame are arranged in parallel, a fixing frame is installed on the inner side between the first supporting frame and the second supporting frame through a driving part, and the fixing frame is in a mouth shape. Then the thickness needing to be packaged is output on a control panel, a first electric push rod rapidly drives a scraper and a glue injection pipe to be in place, then a second motor drives an operation panel to move, glue injection is conducted on the semiconductor electronic device, and meanwhile injected glue is flattened; and finally, the gluing box and the semiconductor device coated with the UV glue are moved to the lower end of an ultraviolet lamp through a first motor, a second electric push rod drives a light shield to cover the gluing box, then the ultraviolet lamp is turned on, the UV glue can be cured, and the ultraviolet lamp is prevented from irradiating other areas.

Description

Technical Field

[0001] The present invention relates to the field of encapsulation technology, and particularly to a UV curing device and a curing process. Background Art

[0002] UV glue is widely used in the semiconductor industry. To prevent water and oxygen from penetrating into the organic materials in the product and achieve the effect of long-term preservation, UV glue is used for encapsulation or as a basic support for subsequent encapsulation processes. After applying the UV glue, it is necessary to irradiate it with an ultraviolet lamp.

[0003] During the process of irradiating the laying material with the ultraviolet lamp, the ultraviolet lamp will also irradiate other areas. The consequence of this is that it affects the lifespan of some materials in other areas or poses an impact on the health of workers near the equipment. Summary of the Invention

[0004] The present invention provides a UV curing device and a curing process to solve the problem proposed in the background art that during the process of irradiating the laying material with the ultraviolet lamp, the ultraviolet lamp will also irradiate other areas, and the consequence of this is that it affects the lifespan of some materials in other areas or poses an impact on the health of workers near the equipment.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: a UV curing device includes: a first support frame and a second support frame. Both the first support frame and the second support frame are U-shaped and are arranged in parallel. Inside the first support frame and the second support frame, a fixed frame is installed through a driving component. The fixed frame is in a square shape, and a movable frame is elastically connected to the inner end of the fixed frame. A shaking component is fixedly installed on one end side wall of the first support frame, and the shaking component is located below one end of the movable frame. A glue application box is installed in the movable frame through an installation component. A movable plate is horizontally slidably connected to the inner end of the first support frame. An operating plate is installed at the lower end of the movable plate in a liftable manner. A glue scraping component is arranged at the lower end of the operating plate, and a glue application component is arranged at one end of the operating plate. An ultraviolet lamp is installed at the inner end of the second support frame in a liftable manner, and a light-shielding cover is detachably installed on the outer side of the lower end of the ultraviolet lamp.

[0006] Further, the driving component includes a first mounting plate. The first mounting plate is L-shaped, and there are four first mounting plates, which are respectively fixedly installed on the outer walls of the left and right ends of the first support frame and the second support frame. A first threaded rod is fixedly installed between two of the first mounting plates, and a first guide rod is fixedly installed between the other two first mounting plates. A first motor is fixedly installed on the outer side of one of the first mounting plates, and the output end of the first motor is fixedly connected to one end of the first threaded rod. A first threaded cylinder is threadedly sleeved on the outer wall of the first threaded rod, and a first guide cylinder is slidably sleeved on the outer wall of the first guide rod. The first guide cylinder and the first threaded cylinder are respectively fixedly installed on the outer walls of the left and right ends of the fixed frame.

[0007] Further, on the inner walls at the left and right ends of the fixed frame, a first spring and a damper are fixedly installed, and the other ends of the first spring and the damper are fixedly installed on the outer walls at the left and right ends of the moving frame.

[0008] Further, the shaking member includes a second mounting plate. The second mounting plate is L-shaped. One end of the second mounting plate is fixedly installed on the outer wall of the first support frame. The other end of the second mounting plate is fixedly installed with a third motor. The output end of the third motor is fixedly installed with a rotating shaft through a coupling. A plurality of rotating blades are uniformly fixedly installed on the outer wall of the rotating shaft. A rotating roller is installed at the outer end of the rotating blade, and the rotating roller can contact the outer wall of the moving frame.

[0009] Further, the mounting member includes a groove, an ear plate and a sliding rod. There are four grooves and ear plates, which are respectively opened on the four sides of the upper end of the moving frame. The four ear plates are respectively fixedly installed on the four sides of the upper end of the glue application box. There are two sliding rods. The sliding rods are U-shaped. The two sliding rods are respectively fixedly installed on the outer walls at the left and right ends of the moving frame. A positioning plate is slidably connected to each sliding rod. The positioning plate is L-shaped. A hand-tightening bolt is threadedly connected to the upper end of the positioning plate, and the lower end of the hand-tightening bolt can contact the upper end of the ear plate.

[0010] Further, a second threaded cylinder and a second guide sleeve are respectively fixedly installed on the upper end of the moving plate. A second threaded rod is threadedly connected to the inner end of the second threaded cylinder. A second guide rod is slidably connected to the inner end of the second guide sleeve. The second guide rod is fixedly installed on the inner walls at the left and right ends of the first support frame. The second threaded rod is rotatably connected to the inner walls at the left and right ends of the first support frame. A second motor is fixedly installed on the outer wall at one end of the first support frame. The output end of the second motor is fixedly connected to one end of the second threaded rod. An electric push rod is fixedly installed at the lower end of the moving plate, and the lower end of the electric push rod is fixedly connected to the upper end of the operation plate.

[0011] Further, the glue scraping member includes a bottom plate and a connecting plate fixedly installed at the lower end of the operation plate. A limiting groove is opened at one end of the bottom plate. The limiting groove is I-shaped. A plurality of second springs are fixedly installed on the inner bottom wall of the limiting groove. A push plate is fixedly installed at the upper end of the second springs. The connecting plate is I-shaped. A first limiting block is fixedly installed on the upper side of one end of the connecting plate. A second limiting block is fixedly installed on the lower side of one end of the connecting plate. A scraping plate is fixedly installed at the lower end of the second limiting block through a bolt.

[0012] Further, the glue application member includes a side plate fixedly installed on the side wall at one end of the operation plate. A plurality of glue injection tubes are uniformly fixedly installed on the side plate. The lower ends of the glue injection tubes are located on one side of the scraping plate and above the lower end of the scraping plate. The upper ends of the plurality of glue injection tubes are fixedly installed with a circular tube, and the upper end of the circular tube is fixedly connected with a connector.

[0013] Furthermore, an electric push rod two is fixedly installed at the upper end of the support frame two. The output end of the electric push rod two passes through the upper side wall of the support frame two and is fixedly connected to the upper end housing of the ultraviolet lamp. A lapping plate is fixedly installed at the outer end of the ultraviolet lamp. A sealing gasket is fixedly installed at the upper end of the lapping plate. A lapping frame is placed at the upper end of the sealing gasket. Connecting frames are fixedly installed on the four sides of the lower end of the lapping frame. The inner ends of the connecting frames are in contact with the outer sides of the four ends of the lapping plate. The light-shielding cover is adhered to the outer walls of the lapping frame and the connecting frames.

[0014] A curing process of a UV curing device specifically includes the following steps: By installing the glue application box at the inner end of the moving frame, placing the semiconductor device to be encapsulated in the glue application box, then connecting the external hose for transporting UV glue to the connector, and starting the electric push rod one to drive the operation plate to bring the glue scraping component and the glue application component into the glue application box. The scraper is located above the semiconductor device and does not contact the upper end of the semiconductor device. Then start the motor two to drive the operation plate to move the glue scraping component and the glue application component, and at the same time, the external hose for transporting UV glue injects glue into the injection tube. The UV glue is injected onto the upper end of the semiconductor device, and at the same time, the scraper levels the UV glue. Next, start the motor three. The motor three drives the rotating shaft to drive the rotating pieces to rotate. Several rotating pieces alternately contact the outer wall of the moving frame through the rotating rollers and push the moving frame to one side. When the rotating piece does not contact the outer wall of the moving frame, it resets under the reaction force of the spring one, causing the moving frame to drive the glue application box to shake reciprocally, leveling the UV glue at the corners of the upper end of the semiconductor device that has not been leveled by the scraper. Start the electric push rod one to reset the scraper and place it above the glue application box. Then start the motor one to drive the fixed frame to move the glue application box under the ultraviolet lamp. Then start the electric push rod two to drive the ultraviolet lamp and the light-shielding cover to move downward. The lower end of the light-shielding cover covers the outer side of the upper end of the fixed frame. Finally, start the ultraviolet lamp to cure the UV glue.

[0015] The present invention provides a UV curing device and a curing process. It has the following beneficial effects: By placing the semiconductor electronic device to be encapsulated in the glue application box, then outputting the required encapsulation thickness on the control panel, the electric push rod one quickly drives the scraper and the injection tube into place. Then, the motor two drives the operation plate to move, injecting glue into the semiconductor electronic device while leveling the injected glue. Finally, the motor one moves the glue application box and the semiconductor device coated with UV glue under the ultraviolet lamp. The electric push rod two drives the light-shielding cover to cover the glue application box, and then the ultraviolet lamp is turned on to cure the UV glue, preventing the ultraviolet lamp from irradiating other areas. Description of the Drawings

[0016] Figure 1 It is a front schematic diagram of the overall structure of the present invention; Figure 2 Schematic diagram of the back of the overall structure of the present invention; Figure 3 Left view of the inner end structure of the first support frame of the present invention; Figure 4 Right view of the inner end structure of the first support frame of the present invention; Figure 5 Expansion schematic diagram of the moving frame and the glue application box of the present invention; Figure 6 Schematic diagram of the structure of the shaking component of the present invention; Figure 7 Schematic diagram of the structures of the glue application component and the glue scraping component of the present invention; Figure 8 Side view of the glue application component and the glue scraping component of the present invention; Figure 9 Expansion schematic diagram of the connecting plate and the limiting groove of the present invention; Figure 10 Schematic diagram of the inner end structure of the second support frame of the present invention; Figure 11 Expansion schematic diagram of the light-shielding cover and the connecting frame of the present invention.

[0017] In the figure: 1. The first support frame; 2. The second support frame; 3. The first mounting plate; 4. The second mounting plate; 5. The first threaded rod; 6. The first guide rod; 7. The first motor; 8. The fixed frame; 9. The moving frame; 10. The first spring; 11. The damper; 12. The first threaded cylinder; 13. The first guide cylinder; 14. The groove; 15. The sliding rod; 16. The positioning plate; 17. The hand-tightening bolt; 18. The glue application box; 19. The ear plate; 20. The second motor; 21. The second threaded rod; 22. The second guide rod; 23. The moving plate; 24. The second threaded cylinder; 25. The second guide sleeve; 26. The operation plate; 27. The guide post; 28. The first electric push rod; 29. The controller; 30. The side plate; 31. The glue injection pipe; 32. The round pipe; 33. The connector; 34. The bottom plate; 35. The limiting groove; 36. The connecting plate; 37. The first limiting block; 38. The second limiting block; 39. The scraper; 40. The second spring; 41. The push plate; 42. The slideway; 43. The slider; 44. The ultraviolet lamp; 45. The second electric push rod; 46. The overlapping plate; 47. The gasket; 48. The overlapping frame; 49. The connecting frame; 50. The light-shielding cover; 51. The third motor; 52. The rotating shaft; 53. The rotating piece; 54. The rotating roller; 55. The distance sensor. Detailed implementation manners

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiment 1: Please refer to Figures 1-11 , the present invention provides a technical solution: a UV curing device, including: a support frame 1 and a support frame 2. Both the support frame 1 and the support frame 2 are U-shaped, and the support frame 1 and the support frame 2 are arranged in parallel. The lower ends of the support frame 1 and the support frame 2 are fixed on the platform of the semiconductor packaging equipment by bolts. An inner side between the support frame 1 and the support frame 2 is provided with a fixed frame 8 through a driving component. The driving component includes a mounting plate 3. The mounting plate 3 is L-shaped, and there are four mounting plates 3, which are respectively fixedly installed on the outer walls of the left and right ends of the support frame 1 and the support frame 2. A threaded rod 5 is fixedly installed between two longitudinal mounting plates 3, and a guide rod 6 is fixedly installed between the other two longitudinal mounting plates 3. A motor 7 is fixedly installed on the outer side of one of the mounting plates 3. The output end of the motor 7 is fixedly connected to one end of the threaded rod 5. The motor 7 is a servo motor that can drive the threaded rod 5 to rotate forward and backward. A threaded cylinder 12 is threadedly sleeved on the outer wall of the threaded rod 5, and a guide cylinder 13 is slidably sleeved on the outer wall of the guide rod 6. The guide cylinder 13 and the threaded cylinder 12 are respectively fixedly installed on the outer walls of the left and right ends of the fixed frame 8. When the motor 7 is started, the motor 7 drives the threaded rod 5 to rotate. When the threaded rod 5 rotates, it drives the threaded cylinder 12 to move. The threaded cylinder 12 drives the fixed frame 8 to move. When the fixed frame 8 moves, the guide cylinder 13 slides on the outer wall of the guide rod 6.

[0020] The fixed frame 8 is in a square shape, and the inner end of the fixed frame 8 is elastically connected to a moving frame 9. Springs 10 and dampers 11 are fixedly installed on the inner walls of the left and right ends of the fixed frame 8. The other ends of the springs 10 and the dampers 11 are fixedly installed on the outer walls of the left and right ends of the moving frame 9. The moving frame 9 can move in the fixed frame 8 by squeezing or stretching the spring 10. At the same time, the damper 11 quickly stops shaking when the moving frame 9 is not under force. A glue application box 18 is installed in the moving frame 9 through a mounting component. When the fixed frame 8 moves, it can drive the moving frame 9 and the glue application box 18 to move synchronously.

[0021] The installation components include a groove 14, an ear plate 19, and a slide bar 15. There are four grooves 14 and four ear plates 19, which are respectively arranged on the four sides of the upper end of the moving frame 9. The four ear plates 19 are respectively fixedly installed on the four sides of the upper end of the glue application box 18. There are two slide bars 15, and the slide bars 15 are U-shaped. The two slide bars 15 are respectively fixedly installed on the outer walls of the left and right ends of the moving frame 9. A positioning plate 16 is slidably connected to each slide bar 15. The positioning plate 16 is L-shaped, and the upper end of the positioning plate 16 is located above the upper port of the moving frame 9. A hand-tightening bolt 17 is threadedly connected to the upper end of the positioning plate 16, and the lower end of the hand-tightening bolt 17 can contact the upper end of the ear plate 19. By placing the reinforcement glue application box 18 inside the moving frame 9, and at the same time, the four ear plates 19 are located in the four grooves 14, then move the positioning plate 16 to make its upper end located above the ear plate 19, and then rotate the hand-tightening bolt 17 to make its lower end abut against the upper end of the ear plate 19, so as to fix the glue application box 18 inside the moving frame 9, which plays a role in facilitating the quick disassembly and assembly of the glue application box 18.

[0022] A shaking component is fixedly installed on the side wall of one end of the support frame one 1. The shaking component is located under one end of the moving frame 9. The shaking component includes a mounting plate two 4. The mounting plate two 4 is L-shaped. One end of the mounting plate two 4 is fixedly installed on the outer wall of the support frame one 1, and the other end of the mounting plate two 4 is fixedly installed with a motor three 51. The output end of the motor three 51 is fixedly installed with a rotating shaft 52 through a coupling. A plurality of rotating pieces 53 are evenly fixedly installed on the outer wall of the rotating shaft 52. A rotating roller 54 is installed at the outer end of the rotating piece 53. The rotating roller 54 can contact the outer wall of the moving frame 9. Start the motor three 51, and the motor three 51 drives the rotating shaft 52 to drive the rotating pieces 53 to rotate. The plurality of rotating pieces 53 alternately contact the outer wall of the moving frame 9 through the rotating roller 54 and push the moving frame 9 to one side. When the rotating piece 53 does not contact the outer wall of the moving frame 9, it resets under the reaction force of the spring one 10, so that the moving frame 9 drives the glue application box 18 to shake reciprocally, and shakes flat the UV glue at the upper corner of the semiconductor device that has not been leveled by the squeegee 39.

[0023] The inner end of the first support frame 1 is horizontally slidably connected with a moving plate 23. The lower end of the moving plate 23 is installed with an operating plate 26 in a liftable manner. The upper end of the moving plate 23 is fixedly installed with a second threaded cylinder 24 and a second guide sleeve 25 respectively. The inner end of the second threaded cylinder 24 is threadedly connected with a second threaded rod 21. The inner end of the second guide sleeve 25 is slidably connected with a second guide rod 22. The second guide rod 22 is fixedly installed on the inner walls of the left and right ends of the first support frame 1. The second threaded rod 21 is rotatably connected to the inner walls of the left and right ends of the first support frame 1. A second motor 20 is fixedly installed on the outer wall of one end of the first support frame 1. The output end of the second motor 20 is fixedly connected with one end of the second threaded rod 21. The second motor 20 is a servo motor that can drive the second threaded rod 21 to rotate forward and backward. When the second motor 20 is started, it can drive the second threaded rod 21 to rotate. The second threaded cylinder 24 at the outer end of the second threaded rod 21 drives the moving plate 23 to move synchronously with the operating plate 26. A first electric push rod 28 is fixedly installed at the lower end of the moving plate 23. The lower end of the first electric push rod 28 is fixedly connected with the upper end of the operating plate 26. A guide post 27 is fixedly installed on one side of the upper end of the operating plate 26. The upper end of the guide post 27 slidably passes through the side wall of one end of the moving plate 23. When the first electric push rod 28 drives the operating plate 26 to move up and down, the guide post 27 slides on the side wall of the moving plate 23.

[0024] A glue scraping component is arranged at the lower end of the operating plate 26. The glue scraping component includes a bottom plate 34 and a connecting plate 36 fixedly installed at the lower end of the operating plate 26. A limiting groove 35 is formed at one end of the bottom plate 34. The limiting groove 35 is in an I shape. The height of the opening of the limiting groove 35 is greater than the height of the connecting plate 36. A plurality of second springs 40 are fixedly installed on the inner wall of the bottom end of the limiting groove 35. The upper end of the second spring 40 is fixedly installed with a pushing plate 41. The pushing plate 41 can slide in the limiting groove 35 by squeezing the second spring 40. The connecting plate 36 is in an I shape. A first limiting block 37 is fixedly installed on the upper side of one end of the connecting plate 36. A second limiting block 38 is fixedly installed on the lower side of one end of the connecting plate 36. The lower end of the second limiting block 38 is fixedly installed with a scraping plate 39 through a bolt. Guide slopes are formed at the outer ports of the upper and lower ends of the limiting groove 35. The connecting plate 36 is inserted into the limiting groove 35 from the opening of the limiting groove 35. At the same time, the lower end of the connecting plate 36 abuts against the upper end of the pushing plate 41. The upper end of the connecting plate 36 is located inside the upper end of the limiting groove 35. At this time, the second spring 40 is in a compressed state, so as to fix the connecting plate 36. At the same time, the first limiting block 37 contacts the inner wall of the upper end of the limiting groove 35, and the second limiting block 38 contacts the side wall of the outer end lower side of the bottom plate 34, so as to fix the scraping plate 39. When the scraping plate 39 needs to be replaced, the connecting plate 36 is pressed down. The upper end of the connecting plate 36 is separated from the inner wall of the upper end of the limiting groove 35 until the connecting plate 36 is located on one side of the opening of the limiting groove 35. The connecting plate 36 is moved outward, and the connecting plate 36 and the scraping plate 39 can be removed, which plays a role in facilitating the disassembly and assembly of the scraping plate 39.

[0025] One end of the operation panel 26 is provided with a glue application component. The glue application component includes a side plate 30 which is fixedly installed on the side wall of one end of the operation panel 26. A number of glue injection tubes 31 are evenly and fixedly installed on the side plate 30. The lower end of the glue injection tube 31 is located on one side of the scraping plate 39 and above the lower end of the scraping plate 39. The upper ends of a number of glue injection tubes 31 are fixedly installed with a circular tube 32 and are communicated with the inner end of the circular tube 32. The upper end of the circular tube 32 is fixedly connected with a connector 33. The connector 33 is communicated with the inside of the circular tube 32. By connecting the external hose for transporting UV glue with the connector 33, glue can be injected into the glue injection tube 31 through the external hose, and the glue injection tube 31 injects UV glue onto the upper end of the electronic device of the semiconductor.

[0026] An ultraviolet lamp 44 is installed in the inner end of the support frame two 2 in a liftable manner. A light-shielding cover 50 is detachably installed on the outer side of the lower end of the ultraviolet lamp 44. The light-shielding cover 50 can block ultraviolet light. An electric push rod two 45 is fixedly installed on the upper end of the support frame two 2. The output end of the electric push rod two 45 passes through the upper side wall of the support frame two 2 and is fixedly connected with the upper end housing of the ultraviolet lamp 44. When the electric push rod two 45 is started, it can drive the ultraviolet lamp 44 to move up and down. A lapping plate 46 is fixedly installed on the outer end of the ultraviolet lamp 44. A sealing gasket 47 is fixedly installed on the upper end of the lapping plate 46. The lapping frame 48 is in a mouth shape. Connecting frames 49 are fixedly installed on the four sides of the lower end of the lapping frame 48. When the lapping frame 48 is placed on the upper end of the sealing gasket 47, the inner end of the connecting frame 49 contacts the outer sides of the four ends of the lapping plate 46. The light-shielding cover 50 is adhered to the outer walls of the lapping frame 48 and the connecting frames 49 to support and fix the light-shielding cover 50. Start the motor one 7 to drive the fixing frame 8 with the glue application box 18 to move below the ultraviolet lamp 44, then start the electric push rod two 45 to drive the ultraviolet lamp 44 and the light-shielding cover 50 to move down. The lower end of the light-shielding cover 50 covers the outer side of the upper end of the fixing frame 8, and finally start the ultraviolet lamp 44 to cure the UV glue.

[0027] As Figure 7 and Figure 8 As shown, in some embodiments, a controller 29 is fixedly installed on the upper end of the operation panel 26, and a distance sensor 55 is fixedly installed on the lower end of the bottom plate 34. More specifically, the controller 29 is built-in with an intelligent chip and a wireless connector (Bluetooth or Wi-Fi). The controller 29 is wirelessly connected to the distance sensor 55, the electric push rod one 28, and the operation panel of the semiconductor packaging device through the wireless connector. The height and installation position of the scraping plate 39 are inconvenient. The distance between the lower end of the scraping plate 39 and the upper end of the semiconductor electronic device to be packaged can be measured by the distance sensor 55 and the distance is transmitted to the controller 29. By setting the thickness of the packaged UV glue on the operation panel, the electric push rod one 28 can be controlled to automatically drive the scraping plate 39 to quickly move into place.

[0028] As Figure 9As shown, in some embodiments, a slideway 42 is provided at the upper end of the bottom plate 34, and a slider 43 is fixedly installed at the upper end of the connecting plate 36. More specifically, when the connecting plate 36 is installed in the limiting groove 35, the slider 43 slides into the slideway 42 to position the connecting plate 36 and the scraping plate 39, so that the scraping plate 39 is accurately installed at the lower end of the operation plate 26.

[0029] Embodiment 2: The present invention provides a curing process for a UV curing device, which specifically includes the following steps: Install the glue application box 18 at the inner end of the moving frame 9 through the installation components, place the semiconductor device to be encapsulated in the glue application box 18, drive the operation plate 26 with the glue scraping component and the glue application component into the glue application box 18 by starting the electric push rod 1, the scraping plate 39 is located above the semiconductor device, move the scraping plate 39 into place without contacting the upper end of the semiconductor device, and then connect the external hose for transporting UV glue to the connector 33 to connect with the external glue supply device; then start the motor 2 to drive the operation plate 26 with the glue scraping component and the glue application component to move, and at the same time the external glue supply device injects glue into the injection pipe 31 through the hose for transporting UV glue, the UV glue is injected onto the upper end of the semiconductor device, and at the same time the scraping plate 39 levels the UV glue; Then the motor 3 drives the rotating shaft 52 to drive the rotating piece 53 to rotate. When the rotating piece 53 rotates, it will drive the rotating roller 54 to rotate synchronously. When the rotating roller 54 rotates, it contacts the outer wall of the moving frame 9 and pushes the moving frame 9 to one side. The moving frame 9 moves in the fixed frame 8 by squeezing or stretching the spring 1. When the rotating piece 53 does not contact the outer wall of the moving frame 9, it resets under the reaction force of the spring 1, so that the moving frame 9 drives the glue application box 18 to shake reciprocally to level the UV glue at the corners of the upper end of the semiconductor device that has not been leveled by the scraping plate 39; start the electric push rod 1 to reset the scraping plate 39 and locate it above the glue application box 18, then start the motor 1 to drive the fixed frame 8 with the glue application box 18 to move under the ultraviolet lamp 44, and then start the electric push rod 2 to drive the ultraviolet lamp 44 and the light shielding cover 50 to move down. The lower end of the light shielding cover 50 covers the outer side of the upper end of the fixed frame 8, and finally start the ultraviolet lamp 44 to cure the UV glue.

[0030] During use: Place the semiconductor electronic device to be encapsulated in the glue application box 18, then output the required encapsulation thickness on the control panel. The electric push rod 1 quickly drives the scraping plate 39 and the injection pipe 31 into place, and then drive the operation plate 26 to move by the motor 2, inject glue into the semiconductor electronic device while leveling the injected glue. Finally, move the glue application box 18 and the semiconductor device coated with UV glue to the lower end of the ultraviolet lamp 44 by the motor 1. The electric push rod 2 drives the light shielding cover 50 to cover the glue application box 18, and then turn on the ultraviolet lamp 44 to cure the UV glue.

[0031] As described above, it is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, shall be covered by the protection scope of the present invention.

Claims

1. A UV curing device, comprising: Support frame one (1) and support frame two (2), both support frame one (1) and support frame two (2) are U-shaped, support frame one (1) and support frame two (2) are arranged in parallel, and a fixed frame (8) is installed inside between support frame one (1) and support frame two (2) through a driving component. It is characterized in that: the fixed frame (8) is mouth-shaped, and a moving frame (9) is elastically connected to the inner end of the fixed frame (8). A shaking component is fixedly installed on the side wall of one end of support frame one (1), the shaking component is located below one end of the moving frame (9), and a glue application box (18) is installed inside the moving frame (9) through an installation component; A moving plate (23) is horizontally slidably connected to the inner end of support frame one (1), an operating plate (26) is installed at the lower end of the moving plate (23) in a liftable manner, a glue scraping component is arranged at the lower end of the operating plate (26), and a glue application component is arranged at one end of the operating plate (26); An ultraviolet lamp (44) is installed at the inner end of support frame two (2) in a liftable manner, and a light-shielding cover (50) is detachably installed on the outer side of the lower end of the ultraviolet lamp (44).

2. The UV curing device according to claim 1, characterized in that: The driving component includes a first mounting plate (3), the first mounting plate (3) is L-shaped, there are four first mounting plates (3), which are respectively fixedly installed on the outer walls of the left and right ends of support frame one (1) and support frame two (2). A first threaded rod (5) is fixedly installed between two of the first mounting plates (3), a first guide rod (6) is fixedly installed between the other two first mounting plates (3), a first motor (7) is fixedly installed on the outer side of one of the first mounting plates (3), the output end of the first motor (7) is fixedly connected to one end of the first threaded rod (5), a first threaded cylinder (12) is threadedly sleeved on the outer wall of the first threaded rod (5), and a first guide cylinder (13) is slidably sleeved on the outer wall of the first guide rod (6). The first guide cylinder (13) and the first threaded cylinder (12) are respectively fixedly installed on the outer walls of the left and right ends of the fixed frame (8).

3. The UV curing device according to claim 1, wherein: A first spring (10) and a damper (11) are fixedly installed on the inner walls of the left and right ends of the fixed frame (8), and the other ends of the first spring (10) and the damper (11) are fixedly installed on the outer walls of the left and right ends of the moving frame (9).

4. A UV curing device according to claim 1, characterized in that: The shaking component includes a second mounting plate (4), the second mounting plate (4) is L-shaped, one end of the second mounting plate (4) is fixedly installed on the outer wall of support frame one (1), a third motor (51) is fixedly installed at the other end of the second mounting plate (4), the output end of the third motor (51) is fixedly installed with a rotating shaft (52) through a coupling, a number of rotating pieces (53) are evenly fixedly installed on the outer wall of the rotating shaft (52), a rotating roller (54) is installed at the outer end of the rotating piece (53), and the rotating roller (54) can contact the outer wall of the moving frame (9).

5. The UV curing device according to claim 1, wherein: The installation components include grooves (14), ear plates (19) and sliding rods (15). There are four grooves (14) and four ear plates (19), which are respectively arranged on the four sides of the upper end of the moving frame (9). The four ear plates (19) are respectively fixedly installed on the four sides of the upper end of the glue application box (18). There are two sliding rods (15), and the sliding rods (15) are U-shaped. The two sliding rods (15) are respectively fixedly installed on the outer walls of the left and right ends of the moving frame (9). A positioning plate (16) is slidably connected to each sliding rod (15). The positioning plate (16) is L-shaped. A hand-tightening bolt (17) is threadedly connected to the upper end of the positioning plate (16). The lower end of the hand-tightening bolt (17) can contact the upper end of the ear plate (19).

6. The UV curing device according to claim 1, characterized in that: On the upper end of the moving plate (23), a second threaded cylinder (24) and a second guide sleeve (25) are respectively fixedly installed. A second threaded rod (21) is threadedly connected to the inner end of the second threaded cylinder (24). A second guide rod (22) is slidably connected to the inner end of the second guide sleeve (25). The second guide rod (22) is fixedly installed on the inner walls of the left and right ends of the first support frame (1). The second threaded rod (21) is rotatably connected to the inner walls of the left and right ends of the first support frame (1). A second motor (20) is fixedly installed on the outer wall of one end of the first support frame (1). The output end of the second motor (20) is fixedly connected to one end of the second threaded rod (21). An electric push rod one (28) is fixedly installed on the lower end of the moving plate (23). The lower end of the electric push rod one (28) is fixedly connected to the upper end of the operation plate (26).

7. A UV curing device according to claim 1, characterized in that: The glue scraping component includes a bottom plate (34) and a connecting plate (36) fixedly installed on the lower end of the operation plate (26). A limiting groove (35) is opened at one end of the bottom plate (34). The limiting groove (35) is in the shape of a workbench. A plurality of second springs (40) are fixedly installed on the inner wall of the bottom end of the limiting groove (35). A push plate (41) is fixedly installed at the upper end of the second springs (40). The connecting plate (36) is in the shape of a workbench. A first limiting block (37) is fixedly installed on the upper side of one end of the connecting plate (36). A second limiting block (38) is fixedly installed on the lower side of one end of the connecting plate (36). A scraper (39) is fixedly installed at the lower end of the second limiting block (38) through a bolt.

8. A UV curing device according to claim 1, characterized in that: The glue application component includes a side plate (30). The side plate (30) is fixedly installed on the side wall of one end of the operation plate (26). A plurality of glue injection pipes (31) are evenly fixedly installed on the side plate (30). The lower end of the glue injection pipe (31) is located on one side of the scraper (39). The lower end of the glue injection pipe (31) is located above the lower end of the scraper (39). A circular pipe (32) is fixedly installed at the upper ends of the plurality of glue injection pipes (31). A connector (33) is fixedly connected to the upper end of the circular pipe (32).

9. The UV curing device according to claim 1, wherein: An electric push rod two (45) is fixedly installed at the upper end of the support frame two (2). The output end of the electric push rod two (45) passes through the upper side wall of the support frame two (2) and is fixedly connected to the upper end housing of the ultraviolet lamp (44). A lapping plate (46) is fixedly installed at the outer end of the ultraviolet lamp (44). A sealing gasket (47) is fixedly installed at the upper end of the lapping plate (46). A lapping frame (48) is placed at the upper end of the sealing gasket (47). Connecting frames (49) are fixedly installed at the four sides of the lower end of the lapping frame (48). The inner ends of the connecting frames (49) are in contact with the outer sides of the four ends of the lapping plate (46). The light-shielding cover (50) is adhered to the outer walls of the lapping frame (48) and the connecting frames (49).

10. A curing process for a UV curing device according to any one of claims 1-9, characterized in that: Specifically, it includes the following steps: By installing the glue application box (18) at the inner end of the moving frame (9), placing the semiconductor device to be encapsulated in the glue application box (18), then connecting the external hose for transporting UV glue to the connector (33), and starting the electric push rod one (28) to drive the operation plate (26) to bring the glue scraping component and the glue application component into the glue application box (18). The scraper (39) is located above the semiconductor device and does not contact the upper end of the semiconductor device; Then start the motor two (20) to drive the operation plate (26) to bring the glue scraping component and the glue application component to move. At the same time, the external hose for transporting UV glue injects glue into the glue injection tube (31). The UV glue is injected onto the upper end of the semiconductor device. At the same time, the scraper (39) levels the UV glue; Next, start the motor three (51). The motor three (51) drives the rotating shaft (52) to drive the rotating pieces (53) to rotate. Several rotating pieces (53) take turns to contact the outer wall of the moving frame (9) through the rotating rollers (54) and push the moving frame (9) to one side. When the rotating piece (53) does not contact the outer wall of the moving frame (9), it resets under the reaction force of the spring one (10), causing the moving frame (9) to drive the glue application box (18) to shake reciprocally, leveling the UV glue at the upper end corners of the semiconductor device that has not been leveled by the scraper (39); Start the electric push rod one (28) to reset the scraper (39) and locate it above the glue application box (18). Then start the motor one (7) to drive the fixed frame (8) to move the glue application box (18) below the ultraviolet lamp (44). Then start the electric push rod two (45) to drive the ultraviolet lamp (44) and the light-shielding cover (50) to move downward. The lower end of the light-shielding cover (50) covers the outer side of the upper end of the fixed frame (8). Finally, start the ultraviolet lamp (44) to cure the UV glue.

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