Special soldering flux dipping structure and ceramic substrate production device

Abstract

The invention provides a special soldering flux dipping structure and a ceramic substrate production device.The special soldering flux dipping structure comprises a soldering flux bottom plate, a supporting plate is arranged on the soldering flux bottom plate in parallel, a soldering flux container, an air cylinder and a cleaning device are arranged on the supporting plate, soldering flux is placed in the soldering flux container, and the cleaning device is arranged on the air cylinder; the output end of the air cylinder is connected with a scaling powder tray, scaling powder sponge is arranged on the scaling powder tray, and the scaling powder tray is driven by the output end to move up and down in the vertical direction so that the scaling powder sponge can stretch into scaling powder or be separated from the scaling powder. The soldering flux dipping device can be used for dipping the ceramic substrate into the soldering flux, the uniformity of dipping the back face of the ceramic substrate into the soldering flux is ensured, the yield of products is improved, the labor intensity of related operators is reduced, and the productivity of the products is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic packaging, and specifically, to a special flux dipping structure and a ceramic substrate production device. Background Art

[0002] Informatization is the main theme of the economic and social development in the world today. It is not only a trend but also an important force driving economic and social transformation, enhancing productivity, and promoting modernization. The relationship between electronic packaging and informatization is inseparable. Electronic packaging technology is not only a key link to realize the functions of electronic products but also the core driving force for promoting the development of the information society. The field of electronic packaging is in a rapid development stage. Its core lies in realizing the miniaturization, high density, high performance, and multi-functionality of chips through advanced packaging technology, while reducing power consumption and improving product performance. The application scope of electronic packaging is extensive, covering multiple industries and fields, mainly including: high-performance computing, artificial intelligence, communication and consumer electronics, medical and industrial control used in supercomputers and data centers, etc.

[0003] As an advanced packaging material and process, the low-temperature co-firing technology of ceramic substrates has become an important part of the field of electronic packaging. The demand for advanced packaging technology continues to grow, which will drive the semiconductor industry to a higher level. Advanced packaging will play an important role in more fields and become an important force for promoting the development of the electronics industry. The low-temperature co-fired ceramic substrate has the following remarkable characteristics: high-frequency characteristics: due to the use of ceramic materials with low dielectric constants, the low-temperature co-fired ceramic substrate shows excellent performance in high-frequency applications, such as low loss and low signal transmission delay; high thermal conductivity: although the addition of glass powder reduces the thermal conductivity, the heat dissipation performance can be improved by optimizing the design, such as increasing heat conduction holes or conductive holes; high reliability: the low-temperature co-fired ceramic substrate has good mechanical strength and thermal stability and is suitable for high-temperature, high-humidity, and harsh environments; high-density integration: through the multi-layer structure design, the low-temperature co-fired ceramic substrate can integrate more electronic components to achieve miniaturization and light weight.

[0004] However, the existing processes and structures for dipping flux on ceramic substrates have defects, resulting in poor dipping uniformity and easily causing defective products. Summary of the Invention

[0005] The purpose of the embodiments of the present disclosure is to provide a special flux dipping structure and a ceramic substrate production device to solve the problem in the prior art that the uniformity of dipping flux on existing ceramic substrates is poor and easily causes defective products.

[0006] In order to solve the above-mentioned technical problems, an embodiment of the present disclosure provides a special flux dipping structure, including a flux base plate, a support plate is arranged parallel to the flux base plate, a flux container, a cylinder and a cleaning device are arranged on the support plate, flux is placed in the flux container, the output end of the cylinder is connected to the flux tray, a flux sponge is arranged on the flux tray, and the flux tray is driven to move up and down in a vertical direction through the output end so that the flux sponge extends into the flux or detaches from the flux.

[0007] In some embodiments, a first mounting notch is disposed on the support plate, and the flux container is embedded in the first mounting notch.

[0008] In some embodiments, a plurality of fixing seats are arranged on the support plate around the first mounting notch, and the fixing seats are used to fix the flux container.

[0009] In some embodiments, a second mounting notch is provided on the support plate, a connecting plate is provided at the edge of the second mounting notch, the connecting plate extends in a vertical direction, and the side of the cylinder facing the support plate is connected to the connecting plate.

[0010] In some embodiments, the output end located at the top of the cylinder is connected to the flux tray through a cylinder connecting plate and an adapter plate, the cylinder connecting plate is horizontally arranged, and the adapter plate is an inverted L-shaped structure, one end of which is connected to the cylinder connecting plate, and the other end of which is connected to the flux tray.

[0011] In some embodiments, the flux base plate and the support plate are connected via a plurality of guide shafts.

[0012] In some embodiments, the cleaning device at least includes a cleaning cloth box, and a hoop is arranged inside the cleaning cloth box, through which the flux cleaning cloth is fixed in the cleaning cloth box.

[0013] In some embodiments, the inner side of the cleaning cloth box is threadedly connected to the outer side of the ferrule.

[0014] An embodiment of the present disclosure further provides a ceramic substrate production device, which includes a gantry and any of the above-mentioned dedicated flux dipping structures.

[0015] In some embodiments, a ZR axis assembly is disposed on the gantry, the ZR axis assembly is movably disposed on the gantry, the ZR axis assembly is rotatably connected to a nozzle assembly, and the nozzle assembly cooperates with the ZR axis assembly to pick up and place the ceramic substrate.

[0016] The present disclosure can be used to dip the ceramic substrate in the soldering flux, ensuring the uniformity of the soldering flux dipped on the back of the ceramic substrate, improving the yield of the product, reducing the labor intensity of relevant operators, and increasing the production capacity of the product. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 The first structural schematic diagram of the dedicated soldering flux dipping structure provided by the embodiment of the present disclosure;

[0019] Figure 2 The second structural schematic diagram of the dedicated soldering flux dipping structure provided by the embodiment of the present disclosure;

[0020] Figure 3 The partial enlarged schematic diagram of the dedicated soldering flux dipping structure provided by the embodiment of the present disclosure;

[0021] Figure 4 The structural schematic diagram of the ceramic substrate production device provided by the embodiment of the present disclosure;

[0022] Figure 5 The structural schematic diagram of the nozzle assembly in the ceramic substrate production device provided by the embodiment of the present disclosure.

[0023] Reference Signs:

[0024] 1 - Support plate; 2 - Cleaning cloth box; 3 - Ferrule; 4 - Soldering flux bottom plate; 5 - Cylinder connecting plate; 6 - Fixed seat; 7 - Cylinder; 9 - Positioning hole; 10 - Guide shaft; 11 - Connecting plate; 12 - Soldering flux tray; 13 - Soldering flux container; 14 - Adapter plate; 15 - Soldering flux sponge; 16 - ZR axis assembly; 17 - Nozzle assembly; 171 - Nozzle body; 172 - Nozzle quick change head; 173 - Nozzle head; 174 - Nozzle intake pipe joint; 100 - Dedicated soldering flux dipping structure; 200 - Fixed platform; 300 - Gantry; 301 - First guide rail; 302 - Second guide rail; 303 - Third guide rail. Detailed Embodiments

[0025] Reference is made herein to the various aspects and features of the present disclosure with reference to the accompanying drawings.

[0026] It should be understood that various modifications can be made to the embodiments applied herein. Therefore, the above description should not be construed as limiting, but merely as exemplifications of the embodiments. Those skilled in the art will envision other modifications within the scope and spirit of the present disclosure.

[0027] The accompanying drawings, which are included in and form a part of this specification, illustrate embodiments of the present disclosure and, together with the general description of the present disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the present disclosure.

[0028] These and other features of the present disclosure will become apparent from the following description of the preferred forms of the embodiments, given by way of non-limiting example with reference to the accompanying drawings.

[0029] It should also be understood that although the present disclosure has been described with reference to some specific examples, those skilled in the art can surely implement many other equivalent forms of the present disclosure, which have the features as described in the claims and thus are all within the protection scope defined hereby.

[0030] When combined with the accompanying drawings, the above and other aspects, features, and advantages of the present disclosure will become more apparent in view of the following detailed description.

[0031] Specific embodiments of the present disclosure are hereinafter described with reference to the accompanying drawings; however, it should be understood that the embodiments applied are merely examples of the present disclosure, which can be implemented in various ways. Well-known and / or repetitive functions and structures are not described in detail to avoid obscuring the present disclosure with unnecessary or redundant details. Therefore, the specific structural and functional details applied herein are not intended to be limiting, but merely serve as a basis for the claims and a representative basis for teaching those skilled in the art to use the present disclosure in substantially any suitable detailed structure in a variety of ways.

[0032] This specification may use the phrases "in one embodiment", "in another embodiment", "in yet another embodiment", or "in other embodiments", which may each refer to one or more of the same or different embodiments according to the present disclosure.

[0033] An embodiment of the present disclosure provides a dedicated flux dipping structure 100, which is used in a ceramic substrate production device and is applicable to the flux dipping process applied in the production process of ceramic substrates. Specifically, as Figures 1 - 5 shown, the dedicated flux dipping structure 100 involved in this embodiment includes a flux bottom plate 4, and a support plate 1 is arranged on the flux bottom plate 4. Here, the flux bottom plate 4 is, for example, rectangular in shape. Among them, the flux bottom plate 4 can be fixed on the plane of a fixed platform 200 such as marble, and the support plate 1 is arranged above the flux bottom plate 4 and is arranged parallel to the flux bottom plate 4.

[0034] Further, the soldering flux base plate 4 and the support plate 1 are connected by a plurality of guide shafts 10. Through the guide shafts 10, the soldering flux base plate 4 and the support plate 1 can be connected to form an integral body. Among them, the plurality of guide shafts 10 can be correspondingly arranged at the corners of the support plate 1 to facilitate the stable setting of the support plate 1 on the soldering flux base plate 4.

[0035] Further, a cleaning cloth box 2 is arranged on the support plate 1. Here, the cleaning cloth box 2 is, for example, arranged on the first side of the support plate 1 and has a cylindrical structure; among them, an assembly hole is arranged on the support plate 1, and the cleaning cloth box 2 is connected to the support plate 1 through the assembly hole.

[0036] Further, a ferrule 3 is arranged in the cleaning cloth box 2, and the soldering flux cleaning cloth is fixedly arranged in the cleaning cloth box 2 through the ferrule 3; among them, the inner side of the cleaning cloth box 2 is threadedly connected to the outer side of the ferrule 3, and the soldering flux cleaning cloth is fixed through the ferrule 3. Here, the excess soldering flux on the back of the ceramic substrate is cleaned by the soldering flux cleaning cloth, thereby effectively improving the quality of the final product.

[0037] Further, a soldering flux container 13 is arranged on the support plate 1, and soldering flux is placed in the soldering flux container 13. Here, the soldering flux container has a certain depth. Specifically, the soldering flux container 13 can be arranged on the support plate 1 in a hanging manner. Among them, a first installation notch is arranged on the support plate 1, and the soldering flux container 13 is embedded in the first installation notch. Here, the soldering flux container 13 and the first installation notch are of matching dimensions, so that it can be arranged in the installation notch in a hanging manner.

[0038] Specifically, in order to arrange the soldering flux container 13 in the first installation notch, a plurality of fixing seats 6 are arranged on the support plate 1. Here, the fixing seats 6 are especially arranged around the first installation notch. For example, the fixing seats 6 can be respectively arranged on two opposite sides of the first installation notch. A positioning hole 9 is arranged on the fixing seat 6, and the positioning hole 9 of the fixing seat 6 is arranged opposite to the fixing hole on the side of the soldering flux container 13. Here, a positioning pin passes through the positioning hole 9 and extends into the fixing hole, so as to lock and fix the soldering flux container 13 in the first installation notch of the support plate 1, thereby realizing the fixed installation of the soldering flux container 13 at a predetermined position.

[0039] Further, the support plate 1 is connected to the cylinder 7 through the connecting plate 14. Here, the cylinder 7 is arranged on the support plate 1 through the connecting plate 14. Among them, the cylinder 7 here can be arranged on the second side of the support plate 1 opposite to the first side. Among them, the output end of the cylinder 7 is arranged at the top, and it can move up and down along the Z-axis direction (that is, the vertical direction). Here, the cylinder 7 can be a three-axis cylinder, so that the output end can move along three axes. Preferably, the connecting plate 14 is particularly connected to the side surface of the cylinder 7, especially to the side surface of the cylinder 7 facing the support plate 1.

[0040] Further, a second installation notch is provided on the support plate 1. The connecting plate 14 extends along the Z-axis direction and is fixed at the edge of the second installation notch. The side surface of the cylinder 7 facing the support plate 1 is connected to the connecting plate 14, so that the cylinder 7 can be located in the second installation notch and fixed on the support plate 1.

[0041] Further, the output end of the cylinder 7 is connected to the flux tray 12. Through the output end, the flux tray 12 can be driven to move in multiple directions, especially it can move up and down along the Z-axis direction (that is, the vertical direction), so that it can extend into the flux container 13. Here, the cylinder 7 can drive the flux tray 12 to lift by a predetermined stroke in the Z-axis direction. Here, the predetermined stroke is determined based on the cylinder 7.

[0042] Further, a flux sponge 15 is provided on the flux tray 12. The flux sponge 15 can be arranged on the flux tray 12 in a flat-laying manner, for example. During normal production, the flux tray 12 drives the flux sponge 15 to move downward along the Z-axis direction and extend into the flux placed in the flux container 13. The flux in the flux container 13 will immerse the flux sponge 15, so that the flux sponge 15 is evenly stained with the flux to achieve the dipping operation. Then, by moving the flux tray 12 upward along the Z-axis direction, the flux sponge 15 can be separated from the flux.

[0043] Specifically, the output end located at the top of the cylinder 7 is sequentially connected to the flux tray 12 through, for example, a cylinder connecting plate 5 and an adapter plate 11. When the output end of the cylinder 7 moves to the maximum stroke in the Z-axis direction, the flux sponge 15 placed inside the flux tray 12 will be completely separated from the flux, thus separating the flux sponge 15 from the flux. Here, the cylinder connecting plate 5 is horizontally arranged, and the adapter plate 11 is in an inverted L-shaped structure. One end of it is connected to the cylinder connecting plate 5, and the other end is connected to the flux tray 12, which facilitates the flux sponge 15 to move downward from the vertical direction to invade the flux and move upward to separate from the flux.

[0044] When installing the special flux dipping structure 100 of the embodiment of the present disclosure, first, connect the guide shaft 10, the flux bottom plate 4, and the support plate 1 into a whole through hexagon socket head cap screws; then connect the cleaning cloth box 2 to the support plate 1 through the assembly holes, and then connect the ferrule 3 to the cleaning cloth box 2 by means of threaded connection to fix the flux cleaning cloth.

[0045] Then, after connecting and fixing the side of the cylinder 7 to the connecting plate 14 on the support plate 1 through fasteners such as bolts, connect the output end at the top of the cylinder 7 to the flux tray 12 through the cylinder connecting plate 5 and the adapter plate 11 in sequence. Among them, adjacent two components can be connected orderly by, for example, hexagon socket head cap screws.

[0046] Then, install the flux container 13 at the corresponding position on the support plate 1, and set it at the position of the second installation notch through 2 fixing seats 6 and lock it.

[0047] Finally, install the assembled special flux dipping structure 100 on, for example, a marble platform for horizontal calibration and fixation.

[0048] The present disclosure can be used to dip the ceramic substrate with flux, ensure the uniformity of the flux dipped on the back of the ceramic substrate, improve the yield of the product, reduce the labor intensity of relevant operators at the same time, and improve the production capacity of the product.

[0049] The second embodiment of the present disclosure provides a ceramic substrate production device, which includes a gantry 300 and the special flux dipping structure 100 in any one of the above embodiments. The gantry 300 can be set on, for example, a fixed platform 200 made of marble. The special flux dipping structure 100 is set on the fixed platform 200, especially under the gantry 300, so as to facilitate the operation through the gantry 300.

[0050] Further, a ZR axis assembly 16 is provided on the gantry 300, and a nozzle assembly 17 is rotatably connected to the ZR axis assembly 16. The ZR axis assembly 16 is arranged relative to the dedicated flux dipping structure 100. The gantry 300 can drive the ZR axis assembly 16 to move along the X-axis, Y-axis, and Z-axis, so as to cooperate with the dedicated flux dipping structure 100 for operation.

[0051] Specifically, the gantry 300 includes a first guide rail 301 and a second guide rail 302 arranged oppositely. The first guide rail 301 and the second guide rail 302 extend along the Y-axis direction, for example. The first guide rail 301 and the second guide rail 302 are supported by a support structure to have a certain height. A third guide rail 303 is arranged between the first guide rail 301 and the second guide rail 302. The third guide rail 303 extends along the X-axis direction and can move along the Y-axis direction. A first motor 3011 is arranged on the first guide rail 301, and a second motor 3021 is arranged on the second guide rail 302. The first motor 3011 and the second motor 3021 are respectively connected to both ends of the third guide rail 303, so as to drive the third guide rail 303 to move in the reverse direction along the Y-axis. The first motor 3011 and the second motor 3021 can be linear motors. The dedicated flux dipping structure 100 of this embodiment is arranged between the first guide rail 301 and the second guide rail 302.

[0052] Further, the ZR axis assembly 16 is movably arranged on the third guide rail 303 to be able to move along the X-axis direction. In addition, the ZR axis assembly 16 can also move relative to the third guide rail 303 along the Z-axis direction. For example, the ZR axis assembly 16 is connected to the third guide rail 303 through a transmission device such as a lead screw, so as to be able to move relative to the third guide rail 303 along the Z-axis direction.

[0053] In this embodiment, the structure of double drive by two motors and cooperation with three guide rails enables the gantry 300 to have high precision and stability, effectively suppressing vibration and deformation during high-speed movement. In addition, by configuring two motors, power drive can be provided for the guide rail arranged along the X-axis direction. The method of symmetrically arranging motors on both sides can eliminate the yaw error caused by single-side drive, stably provide an acceleration of 5-8g, enable the repeat positioning accuracy to reach ±0.5μm, and the absolute positioning accuracy is better than 0.1μm. It is more conducive to the smooth achievement of the parameter indicators of high-precision assembled products.

[0054] In this embodiment, the ZR-axis assembly 16 is movably arranged on the third guide rail 303 of the gantry 300. The nozzle assembly 17 can rotate relative to the ZR-axis assembly 16 along the R-axis. The nozzle assembly 17 here is used for picking and placing ceramic substrates. Among them, the ZR-axis assembly 16, the nozzle assembly 17, and the special solder paste dipping structure 100 can all be controlled through the host operation console.

[0055] The nozzle assembly 17 includes a nozzle body 171. The two ends of the nozzle body 171 are respectively connected to a nozzle quick-change head 172 and a nozzle head 173. The side of the nozzle body 171 is connected to a nozzle air inlet joint 174. The nozzle assembly 17 is connected to the ZR-axis assembly 16 through the nozzle quick-connector 172. The nozzle quick-connector 172 enables the nozzle assembly 17 to have a quick-change structure, which is convenient for flexible replacement, improves the compatibility of the nozzle assembly with products, and thus enables the equipment to produce more products of different specifications.

[0056] The ZR-axis assembly 16 here cooperates with the nozzle assembly 17 to pick and place ceramic substrates at the ceramic substrate picking position for the process of dipping solder paste. Among them, in particular, the posture of the ceramic substrate can be adjusted by the movement of the ZR-axis assembly 16 to facilitate the adjustment of the dipping angle of the solder paste.

[0057] Specifically, first, adjust the position of the ZR-axis assembly 16 on the gantry 300. After separating the solder paste sponge 15 from the solder paste in the solder paste container 13 by moving the solder paste tray 12, control the ZR-axis assembly 16 and the nozzle assembly 17 to suck the ceramic substrate and move the ceramic substrate downward along the Z-axis direction to facilitate contact with the solder paste sponge. The ceramic substrate here can achieve two-stage staged descent, and the descent distance and speed of each stage can be set. For example, the travel of the first stage is a rapid descent of 3 mm, and the travel of the second stage is a slow descent of 2 mm. This can make the solder paste sponge 15 dipped with solder paste make full and uniform contact with the bottom of the ceramic substrate. In addition, after dipping the solder paste on the ceramic substrate, suck and horizontally move the ceramic substrate to the position of the cleaning cloth box 2 through the ZR-axis assembly 16 and the nozzle assembly 17, clean the excess solder paste on the back of the ceramic substrate with the solder paste cleaning cloth, and then perform the operation of inserting the ceramic substrate into the shell, which will effectively improve the production quality of the final product.

[0058] Specifically, when using the ceramic substrate production device of this embodiment, in the initial state, it is necessary to zero and correct the origin of the ZR-axis assembly 16. After correcting the origin, first place the clean solder paste sponge 15 at the exact center of the solder paste tray 12, and then pour approximately 200 mL of solder paste into the interior of the solder paste container 13 to ensure that the solder paste sponge 15 is completely immersed.

[0059] Retrieve the software operation control program for the corresponding product on the main console and start production. First, the ZR-axis assembly 16 drives the nozzle assembly 17 to suck the ceramic substrate at the pick-up position according to a predetermined program; control the cylinder 7 to lift, so that the solder paste tray 12 will lift the solder paste sponge 15 immersed in the solder paste above the liquid level of the solder paste; control the ZR-axis assembly 16 to perform a coating operation based on two different speeds through a predetermined program, so that the ceramic substrate is coated with the solder paste on the solder paste sponge 15, and the ceramic substrate is evenly contacted with the solder paste sponge 15 dipped with the solder paste.

[0060] After the operation of dipping the solder paste on the ceramic substrate is completed, control the ZR-axis assembly 16 to carry the ceramic substrate to the solder paste cleaning position based on the gantry 300, and clean the excess solder paste on the back of the ceramic substrate through the solder paste cleaning cloth, ensuring the uniformity of the solder paste coating and effectively improving the reliability of the product quality. After cleaning, control the ZR-axis assembly 16 to place the ceramic substrate into the product housing to complete the whole process of product production.

[0061] This disclosure can be used to dip the ceramic substrate with solder paste, ensure the uniformity of the solder paste dipped on the back of the ceramic substrate, improve the yield of the product, reduce the labor intensity of relevant operators, and increase the production capacity of the product.

[0062] In addition, the features of the embodiments shown in the drawings of this application or various embodiments mentioned in this specification do not have to be understood as independent embodiments from each other. Instead, each feature described in one example of an embodiment can be combined with one or more other desired features from other embodiments to generate other embodiments not described in words or with reference to the drawings.

[0063] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each embodiment of this application, and should all be included within the protection scope of this application.

Claims

1. A special flux dipping structure, characterized in that, It includes a flux base plate, on which support plates are arranged in parallel. A flux container, a cylinder and a cleaning device are arranged on the support plates. Flux is placed in the flux container. The output end of the cylinder is connected to a flux tray, and a flux sponge is arranged on the flux tray. The output end drives the flux tray to move up and down in the vertical direction so that the flux sponge extends into the flux or disengages from the flux.

2. The special flux dipping structure according to claim 1, wherein, A first installation notch is arranged on the support plate, and the flux container is embedded in the first installation notch.

3. The dedicated flux dipping structure according to claim 2, characterized in that, A plurality of fixing seats are arranged on the support plate around the first installation notch, and the fixing seats are used to fix the flux container.

4. The special soldering flux dipping structure according to claim 1, characterized in that, A second installation notch is arranged on the support plate, and a connecting plate is arranged at the edge of the second installation notch. The connecting plate extends in the vertical direction, and the side surface of the cylinder facing the support plate is connected to the connecting plate.

5. The special flux dipping structure according to claim 1, characterized in that, The output end located at the top of the cylinder is connected to the flux tray through a cylinder connecting plate and an adapter plate. The cylinder connecting plate is arranged horizontally, and the adapter plate is of an inverted L-shaped structure. One end of it is connected to the cylinder connecting plate, and the other end is connected to the flux tray.

6. The special flux dipping structure according to claim 1, characterized in that The flux base plate and the support plate are connected through a plurality of guide shafts.

7. The dedicated flux dipping structure according to claim 1, characterized in that, The cleaning device at least includes a cleaning cloth box, and a hoop is arranged in the cleaning cloth box. The flux cleaning cloth is fixedly arranged in the cleaning cloth box through the hoop.

8. The special flux dipping structure according to claim 7, wherein, There is a threaded connection between the inner side of the cleaning cloth box and the outer side of the hoop.

9. A ceramic substrate production device, which includes a gantry and the special flux dipping structure according to any one of claims 1-8.

10. The ceramic substrate production device according to claim 9, characterized in that, A ZR axis assembly is arranged on the gantry. The ZR axis assembly is movably arranged on the gantry and is rotatably connected to a suction nozzle assembly. The suction nozzle assembly cooperates with the ZR axis assembly to pick and place ceramic substrates.

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