Dual-signal output sensor packaging mechanism

Abstract

The invention belongs to the technical field of sensor packaging, and particularly relates to a dual-signal output sensor packaging mechanism which comprises a packaging machine body. An electric cylinder is fixedly connected to the inner wall of the packaging machine body; the output end of the electric cylinder is fixedly connected with a gluing box; a plurality of glue holes are formed in the bottom end of the gluing box and are square; the gluing box is driven by the electric cylinder to extend downwards to the position above the sensor, the sensor is evenly glued through the multiple glue holes formed in the square shape, the first blocking plate and the conveyor conduct accurate interception and conveying in the gluing process of the sensor, and the gluing efficiency and quality are greatly improved; the situation that glue drips to the sensitive element can be reduced through cooperation with the blocking plate, a traditional single-head dispensing mode is replaced by a square gluing mode of the multiple glue holes, one-time uniform coating can be achieved, the bonding effect of the sealing layer and the dispensing efficiency are improved, the probability that the acrylic plate is bonded, packaged and disengaged is reduced, and the product quality is improved. And thus, the reliable performance of the packaged sensor is ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensor packaging, and specifically relates to a dual-signal output sensor packaging mechanism. Background Art

[0002] Sensor packaging is a key process that protects sensitive components such as MEMS, optical chips, and electrodes in a specific housing and ensures their reliable interaction with the environment. The packaging effect can directly affect the accuracy, reliability, environmental adaptability, and cost of the sensor.

[0003] A semiconductor-based dual-signal output temperature and humidity sensor based on MEMS is a sensor that can support two different output signal types simultaneously. The sensitive components of semiconductor-based dual-signal output temperature and humidity sensors are usually encapsulated and protected using epoxy resin or acrylic plates.

[0004] Due to its excellent optical properties, mechanical properties, and relatively low cost, acrylic plates are widely used. When using acrylic plates to encapsulate the sensitive components of semiconductor-based dual-signal output temperature and humidity sensors based on MEMS, traditional packaging equipment usually adopts a process of multiple glue dispensing and bonding with a single glue head. This process often leads to uneven glue distribution, which in turn affects the adhesion effect of the acrylic plate and easily causes problems with insecure packaging, thus affecting the overall performance and reliability of the sensor.

[0005] Therefore, the present invention provides a dual-signal output sensor packaging mechanism. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art and solve at least one of the technical problems proposed in the background art.

[0007] The technical solution adopted by the present invention to solve its technical problems is as follows: A dual-signal output sensor packaging mechanism of the present invention includes a packaging body; an electric cylinder is fixedly connected to the inner wall of the packaging body; the output end of the electric cylinder is fixedly connected to a glue application box; a plurality of glue holes are opened at the bottom end of the glue application box, and the plurality of glue holes are arranged in a square shape; a circulation pipe is fixedly connected to one side of the glue application box; a matching component is arranged at the bottom end of the glue application box, and the matching component is used to assist the glue application box in applying glue and packaging the dual-signal output sensor.

[0008] Preferably, the matching component includes a shielding plate, a conveyor, and a servo motor; the shielding plate is fixedly connected to the bottom end of the glue application box, and the cross-sectional shape of the shielding plate is square; the conveyor is fixedly connected to the packaging body; the servo motor is fixedly connected to the conveyor, and the output end of the servo motor is connected to a shaft of the conveyor.

[0009] Preferably, a plurality of fixing frames are fixedly connected to both sides of the middle part of the conveyor; one end of the three fixing frames away from the conveyor is fixedly connected with a guide plate, and one end of the guide plate is inclined.

[0010] Preferably, a first baffle is slidably connected between two opposite fixing frames; a fixing plate is fixedly connected to the top end of the middle part of the first baffle; a top plate is fixedly connected to the outer wall of the electric cylinder, and a square groove is formed in the middle of the top plate.

[0011] Preferably, a blower is fixedly connected to one side of the encapsulation body close to the electric cylinder; a square box is fixedly connected to the bottom end of the blower; a material guide box is fixedly connected to one side of the square box, and the material guide box is communicated with the square box.

[0012] Preferably, two connecting frames are fixedly connected to the first baffle; one end of the two connecting frames away from the first baffle is fixedly connected with a second baffle.

[0013] Preferably, a top frame is fixedly connected to the top end of the middle part of the connecting frame; a sealing plate is fixedly connected to the top frame, the sealing plate is slidably connected to the material guide box, and two flow-through grooves are relatively and staggeredly formed in the sealing plate.

[0014] Preferably, a first short plate is slidably connected to both sides of the square box relatively; a second short plate is slidably connected to both sides of the square box and below the first short plate relatively; two telescopic rods are hinged between the first short plate and the second short plate; a connecting rod is fixedly connected to the inner wall of the two telescopic rods; a first gear is fixedly connected to the outer wall of the middle part of the connecting rod; a transmission component is arranged on the connecting rod, and the transmission component is used for driving the first short plate and the second short plate to slide staggeredly.

[0015] Preferably, the transmission component includes a fixed rod, a second gear and a toothed plate; the fixed rod is fixedly connected to the outer wall of the square box, and both ends of the connecting rod are rotatably connected to the fixed rod; the second gear is rotatably connected to the middle of the fixed rod, and the second gear can be meshed with the first gear; the toothed plate is fixedly connected to the connecting frame, and the toothed plate can be meshed with the second gear.

[0016] Preferably, an air groove is formed at the bottom end of one side of the square box; an infrared sensor is fixedly connected to the bottom end of the blower and in the middle of the square box, and the infrared sensor is electrically connected to the blower.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. A double-signal output sensor encapsulation mechanism according to the present invention drives a glue application box to extend downward above the sensor through an electric cylinder, and evenly applies glue to the sensor by relying on a plurality of glue holes arranged in a square shape. The first baffle and the conveyor perform precise interception and conveyance during the glue application process of the sensor, greatly improving the efficiency and quality of glue application. Cooperating with the shielding plate can reduce the occurrence of glue droplets falling onto sensitive components. By applying glue in a square shape through a plurality of glue holes, it replaces the traditional single-head dispensing method, can coat evenly at one time, improve the bonding effect of the sealing layer and the dispensing efficiency, reduce the probability of the bonding and encapsulation of the acrylic plate falling off, and thus ensure the reliable performance of the encapsulated sensor.

[0019] 2. A double-signal output sensor encapsulation mechanism according to the present invention performs straightening conveyance by means of a conveyor carrying a guide plate. When the sensor is conveyed below the glue application box, a plurality of glue holes of the glue application box evenly coat glue and are blocked and protected by the shielding plate. The first baffle realizes the functions of intercepting and releasing the sensor. Subsequently, the conveyor conveys the glue-applied sensor below the square box. The acrylic plate is temporarily stored through the switching between the first short plate and the second short plate and then falls in sequence, pressing and covering the glue-applied part for encapsulation. The infrared sensor monitors the product position and controls the blower to work to accelerate the curing of the glue, and finally completes the encapsulation process of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings.

[0021] Figure 1 is a perspective view of the present invention;

[0022] Figure 2 is a schematic structural view of the guide plate in the present invention;

[0023] Figure 3 is a schematic structural view of the top plate in the present invention;

[0024] Figure 4 is a schematic structural view of the fixing plate in the present invention;

[0025] Figure 5 is a partial structural cross-sectional view of the square box in the present invention;

[0026] Figure 6 is a schematic structural view of the plugging plate in the present invention;

[0027] Figure 7 is a schematic structural view of the telescopic rod in the present invention.

[0028] In the figure: 1. Encapsulation body; 11. Electric cylinder; 12. Glue application box; 13. Glue holes; 14. Flow pipe; 2. Baffle plate; 21. Conveyor; 22. Servo motor; 3. Fixed frame; 31. Guide plate; 4. First baffle; 41. Fixed plate; 42. Top plate; 5. Fan; 51. Square box; 52. Material guiding box; 6. Connecting frame; 61. Second baffle; 7. Top frame; 71. Sealing plate; 8. First short board; 81. Second short board; 82. Telescopic rod; 83. Connecting rod; 84. First gear; 9. Fixed rod; 91. Second gear; 92. Tooth plate; 93. Air duct. Detailed implementation manners

[0029] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with the specific implementation manners.

[0030] As Figures 1 to 3 shown, a double-signal output sensor encapsulation mechanism according to an embodiment of the present invention includes an encapsulation body 1; an electric cylinder 11 is fixedly connected to the inner wall of the encapsulation body 1; a glue application box 12 is fixedly connected to the output end of the electric cylinder 11; a plurality of glue holes 13 are opened at the bottom end of the glue application box 12, and the plurality of glue holes 13 are square; a flow pipe 14 is fixedly connected to one side of the glue application box 12; a matching component is arranged at the bottom end of the glue application box 12, and the matching component is used to assist the glue application box 12 to apply glue and encapsulate the double-signal output sensor; the semiconductor type double-signal output temperature and humidity sensor based on MEMS supports two different output signal types at the same time, has two detection positions, and can realize the function of detecting two groups of data at the same time. When using an acrylic plate to encapsulate the sensitive element of the semiconductor type double-signal output temperature and humidity sensor, taking the encapsulation body 1 as the main framework of the semiconductor type double-signal output temperature and humidity sensor encapsulation device, the matching component sequentially conveys a plurality of semiconductor type double-signal output temperature and humidity sensors to be glued and encapsulated to the position below the electric cylinder 11. When a sensor is conveyed to the position below the electric cylinder 11, the output end of the electric cylinder 11 drives the glue application box 12 to extend downward, and the plurality of glue holes 13 approach the glue application position of the sensor. At this time, an external glue feeding device sends glue into the glue application box 12 through the flow pipe 14, and the glue is coated on the shell at the encapsulation position of the sensor in a square shape by the plurality of glue holes 13. After the coating is completed, the coated sensor is conveyed to the sealing position by the matching component, and an acrylic plate is used as a sealing layer to be laminated on the glue application position for encapsulation. By coating the glue in a square shape by the plurality of glue holes 13, the traditional single-head dispensing method is replaced, and the coating can be made uniform at one time, improving the bonding effect of the sealing layer and the dispensing efficiency, reducing the probability of the acrylic plate bonding and encapsulation falling off, and thus ensuring the overall performance and reliability of the sensor.

[0031] The matching component includes a shielding plate 2, a conveyor 21, and a servo motor 22; the shielding plate 2 is fixedly connected to the bottom end of the glue application box 12, and the cross-sectional shape of the shielding plate 2 is square; the conveyor 21 is fixedly connected to the encapsulation body 1; the servo motor 22 is fixedly connected to the conveyor 21, and the output end of the servo motor 22 is connected to a shaft of the conveyor 21; when transporting multiple semiconductor type dual-signal output temperature and humidity sensors to be encapsulated with glue, place the multiple sensors on the conveyor 21 in sequence. The output end of the servo motor 22 drives a shaft of the conveyor 21 to rotate, synchronously driving the conveyor 21 to work and transport the multiple sensors. When a sensor reaches the bottom end of the electric cylinder 11, the glue application box 12 extends downward along with the output end of the electric cylinder 11. The shielding plate 2 first inserts into the encapsulation location of the sensor, and the shielding plate 2 fits against the inner wall of the sensor housing, blocking the area where glue is applied. At this time, multiple glue holes 13 start to apply glue, and the shielding plate 2 blocks the sensitive element area of the sensor until the glue application is completed. The output end of the electric cylinder 11 drives the glue application box 12 and the shielding plate 2 to rise and retract. By the shielding plate 2 fitting against the inner wall of the sensor housing to block the sensitive element area of the sensor, it is possible to reduce the occurrence of glue droplets falling onto the sensitive element during the glue application process.

[0032] As Figures 1 to 4 shown, multiple fixing frames 3 are respectively fixedly connected to both sides of the middle part of the conveyor 21; one end of the three fixing frames 3 away from the conveyor 21 is fixedly connected with a guiding plate 31, and one end of the guiding plate 31 is inclined; when the conveyor 21 transports multiple semiconductor type dual-signal output temperature and humidity sensors, the multiple fixing frames 3 are respectively fixed on both sides of the conveyor 21 to suspend the two guiding plates 31. Relying on the inclined surfaces at the front ends of the two guiding plates 31, the multiple sensors being transported are guided, enabling the sensors with angular offsets to be straightened during transportation, thereby improving the accuracy of glue application and encapsulation for the sensors.

[0033] A No. 1 baffle plate 4 is slidably connected between the two opposite fixing frames 3; a fixing plate 41 is fixedly connected to the top of the middle part of the No. 1 baffle plate 4; a top plate 42 is fixedly connected to the outer wall of the electric cylinder 11, and a square groove is opened in the middle of the top plate 42; when the semiconductor type dual signal output temperature and humidity sensor is conveyed and coated with glue, the No. 1 baffle plate 4 is used to slide between the two fixing frames 3 to intercept the conveyed sensor, and when the sensor is adhered to the No. 1 baffle plate 4 and is intercepted, the conveying of the conveyor 21 is suspended, and the multiple glue holes 13 are evenly coated with glue on the intercepted sensor. After the coating is completed, the electric cylinder 1 The output end of 1 retracts and drives the top plate 42 to slide up. The square groove in the middle of the top plate 42 is used to be sleeved on the vertical plate of the fixed plate 41 until the top plate 42 slides up and fits the bottom surface of the fixed plate 41. The output end of the electric cylinder 11 continues to retract, and the top plate 42 lifts the fixed plate 41. The No. 1 baffle plate 4 is then pulled up by the fixed plate 41 to slide on the two fixed frames 3 until the No. 1 baffle plate 4 is higher than the sensor. The conveyor 21 continues to transport the sensor to the packaging place and uses an acrylic plate to seal it, which plays a role in limiting the conveyed sensor and improving the effect of gluing and packaging.

[0034] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, a fan 5 is fixedly connected to one side of the packaging body 1 close to the electric cylinder 11; a square box 51 is fixedly connected to the bottom end of the fan 5; a material guide box 52 is fixedly connected to one side of the square box 51, and the material guide box 52 is communicated with the square box 51; when the sensor is glued and an acrylic plate is used as a sealing layer for packaging, the square box 51 is fixed to the inner wall of the packaging body 1 by the fan 5, and the conveyor 21 first conveys the glued sensor to the lower position of the square box 51, and then puts the acrylic plates into the inclined material guide box 52 for transportation, and the acrylic plates slide from the inside of the material guide box 52 into the square box 51, and then the acrylic plates are attached to the inner wall of the square box 51 and slide down to the glue coating of the sensor for pressure, thereby realizing the effect of using the acrylic plate as the sealing layer to package the sensor, and at the same time, the output end of the fan 5 works to blow air into the inside of the square box 51, which can blow air to the packaging to cool and solidify the glue, thereby improving the effect of sensor packaging.

[0035] like Figure 1 , Figure 2 and Figure 4As shown, two connecting brackets 6 are fixedly connected to the first baffle 4; at the ends of the two connecting brackets 6 away from the first baffle 4, a second baffle 61 is fixedly connected; when using an acrylic board as the sealing layer to encapsulate the sensor, the two connecting brackets 6 are fixed on the first baffle 4 as the connecting members of the second baffle 61. When the first baffle 4 intercepts the sensor to be coated with glue, the second baffle 61 synchronously intercepts the sensor after being coated with glue. During the process of coating the sensor with glue, the acrylic board is synchronously pressed on the sensor that has been coated with glue for encapsulation. Until the sensor is completely coated with glue, the electric cylinder 11 drives the top plate 42 to slide upward to lift the fixing plate 41, and the first baffle 4 and the second baffle 61 connected by the connecting brackets 6 slide upward synchronously beyond the height of the sensor. The conveyor 21 conveys the sensor after being coated with glue to the encapsulation position, and synchronously conveys the encapsulated sensor for discharging, playing a role in synchronously controlling and intercepting the sensor at the glue coating position and the encapsulation position.

[0036] As Figure 1 , Figure 2 and Figures 4 to 6 shown, a top bracket 7 is fixedly connected to the middle top end of the connecting bracket 6; a blocking plate 71 is fixedly connected to the top bracket 7, and the blocking plate 71 is slidably connected to the material guiding box 52, and two flow-through slots are relatively staggered on the blocking plate 71; when successively loading multiple acrylic boards, first place an acrylic board into the material guiding box 52. At this time, the acrylic board is intercepted by the blocking plate 71 that blocks the channel of the material guiding box 52. As the connecting bracket 6 slides upward along with the first baffle 4, the top bracket 7 synchronously lifts the blocking plate 71 upward, so that one flow-through slot that originally misaligned and blocked the front end of the channel of the material guiding box 52 is communicated with it, and the other flow-through slot misaligns and blocks the tail end of the channel of the material guiding box 52. The acrylic board slides down to the tail end of the channel of the material guiding box 52 and is intercepted. As the output end of the electric cylinder 11 extends downward, another acrylic board is placed into the material guiding box 52. At this time, the two flow-through slots slide down along with the top bracket 7, the front end of the channel of the material guiding box 52 is blocked and the rear end is communicated. The acrylic board originally intercepted at the rear end of the channel of the material guiding box 52 slides down to the inner wall of the square box 51 until it is pressed on the sensor coated with glue for encapsulation, playing a role in controlling the blocking and intermittent feeding of the acrylic board in the channel of the material guiding box 52.

[0037] As Figure 1 , Figure 2 and Figures 4 to 7As shown, on both sides of the square box 51, there are first short plates 8 connected by relative sliding; on both sides of the square box 51 and below the first short plates 8, there are second short plates 81 connected by relative sliding; between the first short plates 8 and the second short plates 81, there are two telescopic rods 82 hinged; on the inner walls of the two telescopic rods 82, there is a connecting rod 83 fixedly connected; on the outer wall of the middle part of the connecting rod 83, there is a first gear 84 fixedly connected; on the connecting rod 83, there is a transmission component for driving the first short plates 8 and the second short plates 81 to slide alternately. When the acrylic plate slides into the interior of the square box 51 from the channel of the material guiding box 52, it is easy for one end of the acrylic plate to tilt and fall first, thus affecting the encapsulation of the sensor. By using two groups of opposite first short plates 8 and the second short plates 81 sliding on the inner wall of the square box 51, the acrylic plate falling in the channel of the material guiding box 52 first lands on the two first short plates 8. As the connecting frame 6 slides upward to drive the transmission component to move, the transmission component drives the first gear 84 to rotate. The first gear 84 synchronously drives the two telescopic rods 82 on the connecting rod 83 to rotate an angle, causing the first short plates 8 and the second short plates 81 to slide alternately. The two first short plates 8 retract into the inner wall of the square box 51, and the two second short plates 81 slide out of the inner wall of the square box 51 and extend. The acrylic plate originally placed on the two first short plates 8 lands on the two second short plates 81 for temporary storage. As the connecting frame 6 slides downward to drive the transmission component to move, it synchronously drives the second short plates 81 and the first short plates 8 to slide alternately again. At this time, the acrylic plate placed on the second short plates 81 falls and presses on the position where the sensor is coated for encapsulation, playing a role in guiding the acrylic plate for intermittent feeding.

[0038] The transmission component includes a fixed rod 9, a second gear 91, and a toothed plate 92. The fixed rod 9 is fixedly connected to the outer wall of the square box 51, and both ends of the connecting rod 83 are rotatably connected to the fixed rod 9. The second gear 91 is rotatably connected to the middle of the fixed rod 9, and the second gear 91 can be meshed with the first gear 84. The toothed plate 92 is fixedly connected to the connecting frame 6, and the toothed plate 92 can be meshed with the second gear 91. When the connecting frame 6 slides upward, the connecting frame 6 drives the toothed plate 92 to slide upward synchronously. The toothed plate 92 drives the mutually meshed second gear 91 to rotate on the fixed rod 9. The second gear 91 synchronously drives the mutually meshed first gear 84 to rotate. The connecting rod 83 then drives the two telescopic rods 82 to rotate an angle, causing the first short plates 8 and the second short plates 81 to slide alternately. When the connecting frame 6 slides downward, it also drives the first short plates 8 and the second short plates 81 to slide alternately, thus realizing the function of driving the first short plates 8 and the second short plates 81 to alternately receive the acrylic plate and send it to the position of pressing and encapsulation.

[0039] As Figure 1 、 Figure 2 、 Figure 4 and Figure 5As shown, an air groove 93 is provided at the bottom end of one side of the square box 51; at the bottom end of the blower 5 and located in the middle of the square box 51, an infrared sensor is fixedly connected, and the infrared sensor is electrically connected to the blower 5; when the sensor after gluing is conveyed below the square box 51, the infrared sensor monitors that the product reaches the encapsulation position and sends a signal to the main controller, and the main controller controls the blower 5 to work and blow air. The air blows to the gluing place covered and encapsulated by the acrylic plate to cool and solidify, and part of the air blows out from the air groove 93 to reduce the heat residue in the square box 51. If the infrared sensor monitors that the product does not reach below the square box 51 for more than the set time, a signal is sent to stop the blower 5 from working, which plays a role in controlling the opening and closing of the blower 5 and accelerating the cooling and solidification of the glue at the encapsulation place.

[0040] Working process: When using an acrylic plate to encapsulate the sensitive element of a semiconductor dual-signal output temperature and humidity sensor, the encapsulation body 1 is used as the main framework of the semiconductor dual-signal output temperature and humidity sensor encapsulation device. The cooperating components sequentially transport multiple semiconductor dual-signal output temperature and humidity sensors to be coated and encapsulated to the position below the electric cylinder 11. When a sensor is transported to the position below the electric cylinder 11, the output end of the electric cylinder 11 drives the glue application box 12 to extend downward, and multiple glue holes 13 approach the glue application position of the sensor. At this time, an external glue feeding device sends glue to the inside of the glue application box 12 through the circulation pipe 14, and the glue is coated on the shell of the sensor encapsulation position in a square shape by the multiple glue holes 13. After the coating is completed, the cooperating components send the coated sensor to the sealing position, and an acrylic plate is used as the sealing layer to be laminated on the glue application position for encapsulation. By coating the glue in a square shape through the multiple glue holes 13, it replaces the traditional single-head dispensing method, can coat evenly at one time, improves the bonding effect of the sealing layer and the dispensing efficiency, reduces the probability of the acrylic plate bonding and encapsulation falling off, and thus ensures the overall performance and reliability of the sensor; when transporting multiple semiconductor dual-signal output temperature and humidity sensors to be coated and encapsulated, the multiple sensors are sequentially placed on the conveyor 21. The output end of the servo motor 22 drives a shaft of the conveyor 21 to rotate, synchronously driving the conveyor 21 to work and transport multiple sensors. When a sensor is transported to the bottom end of the electric cylinder 11, the glue application box 12 extends downward with the output end of the electric cylinder 11, and the baffle 2 first inserts into the encapsulation position of the sensor, and the baffle 2 fits the inner wall of the sensor housing, blocking the glue application area. At this time, the multiple glue holes 13 start to apply glue, and the baffle 2 blocks the sensitive element position of the sensor until the glue application is completed. The output end of the electric cylinder 11 drives the glue application box 12 and the baffle 2 to rise and retract. By the baffle 2 fitting the inner wall of the sensor housing to block the sensitive element position of the sensor, it can reduce the occurrence of glue droplets falling onto the sensitive element during the glue application process; when the conveyor 21 transports multiple semiconductor dual-signal output temperature and humidity sensors, multiple fixing frames 3 are respectively fixed on both sides of the conveyor 21 to suspend two guide plates 31. Relying on the inclined surfaces at the front ends of the two guide plates 31, the multiple sensors being transported are guided, so that the sensors with angular offsets can be straightened and transported, improving the accuracy of glue application and encapsulation of the sensors.When the semiconductor dual-signal output temperature and humidity sensor is conveyed and coated with glue, the No. 1 baffle plate 4 is used to slide between the two fixing frames 3 to intercept the conveyed sensor. When the sensor is attached to the No. 1 baffle plate 4 and is intercepted, the conveying of the conveyor 21 is suspended, and the multiple glue holes 13 evenly coat the intercepted sensor with glue. After the gluing is completed, the output end of the electric cylinder 11 retracts to drive the top plate 42 to slide up. The square groove in the middle of the top plate 42 is used to be sleeved on the vertical plate of the fixing plate 41 until the top plate 42 slides up and fits the bottom surface of the fixing plate 41. The output end of the electric cylinder 11 continues to retract, and the top plate 42 lifts the fixing plate 41. The No. 1 baffle plate 4 is then pulled up by the fixing plate 41 to slide on the two fixing frames 3 until the No. 1 baffle plate 4 is higher than the sensor. The conveyor 21 continues to convey the sensor to the packaging location and is sealed with an acrylic plate, which plays a role in limiting and intercepting the conveyed sensor, thereby improving the effect of gluing and packaging.

[0041] When using an acrylic board as a sealing layer for encapsulation after the sensor is coated with glue, the square box 51 is fixed to the inner wall of the encapsulation body 1 by the blower 5. The conveyor 21 first conveys the sensor after being coated with glue to the position below the square box 51, and then an acrylic board is sequentially placed into the inclined feeding box 52 for internal conveyance. The acrylic board slides into the square box 51 from the inside of the feeding box 52, and then the acrylic board slides along the inner wall of the square box 51 to the glue-coated part of the sensor and presses it, so as to realize the function of using the acrylic board as a sealing layer to encapsulate the sensor. At the same time, the output end of the blower 5 works to blow air into the inside of the square box 51, which can blow and cool the glue at the encapsulation part to solidify the glue and improve the encapsulation effect of the sensor; when using the acrylic board as a sealing layer to encapsulate the sensor, two connecting frames 6 are fixed to the first baffle 4 as the connecting parts of the second baffle 61. When the first baffle 4 intercepts the sensor to be coated with glue, the second baffle 61 synchronously intercepts the sensor after being coated with glue. During the process of the sensor being coated with glue, the acrylic board is synchronously pressed on the sensor that has been coated with glue for encapsulation. Until the sensor is completely coated with glue, the electric cylinder 11 drives the top plate 42 to slide up and jack up the fixed plate 41, and the first baffle 4 and the second baffle 61 connected by the connecting frame 6 slide up synchronously beyond the height of the sensor. The conveyor 21 conveys the sensor after being coated with glue to the encapsulation position and synchronously conveys the encapsulated sensor for blanking, which plays a role in synchronously controlling and intercepting the sensor at the glue-coated part and the encapsulation part; when feeding multiple acrylic boards sequentially, first place an acrylic board into the feeding box 52. At this time, the acrylic board is intercepted by the blocking plate 71 that blocks the channel of the feeding box 52. As the connecting frame 6 slides up with the first baffle 4, the top frame 7 synchronously jacks up the blocking plate 71 to slide up, so that a flow-through slot that originally misaligned and blocked the front end of the channel of the feeding box 52 is connected to it, and the other flow-through slot misaligns and blocks the tail end of the channel of the feeding box 52. The acrylic board slides to the tail end of the channel of the feeding box 52 and is intercepted. As the output end of the electric cylinder 11 extends downward, another acrylic board is placed into the feeding box 52. At this time, the two flow-through slots slide down with the top frame 7, the front end of the channel of the feeding box 52 is blocked and the rear end is connected. The acrylic board originally intercepted at the rear end of the channel of the feeding box 52 slides to the inner wall of the square box 51 until it presses on the glue-coated sensor for encapsulation, which plays a role in controlling the blocking and intermittent blanking of the acrylic board in the channel of the feeding box 52;

[0042] When the acrylic board slides into the interior of the square box 51 from the channel of the material guiding box 52, it is easy for one end of the acrylic board to tilt and fall first, thus affecting the encapsulation of the sensor. By using two sets of opposite first short plates 8 and second short plates 81 to slide on the inner wall of the square box 51, the acrylic board falling in the channel of the material guiding box 52 first lands on the two first short plates 8. As the connecting frame 6 slides upward to drive the transmission component to move, the transmission component drives the first gear 84 to rotate. The first gear 84 synchronously drives the two telescopic rods 82 on the connecting rod 83 to rotate, causing the first short plates 8 and the second short plates 81 to slide alternately. The two first short plates 8 retract into the inner wall of the square box 51, and the two second short plates 81 slide out of the inner wall of the square box 51 and extend. The acrylic board originally placed on the two first short plates 8 lands on the two second short plates 81 for temporary storage. As the connecting frame 6 slides downward to drive the transmission component to move, it synchronously drives the second short plates 81 and the first short plates 8 to slide alternately again. At this time, the acrylic board placed on the second short plates 81 falls and presses on the position where the sensor is coated with glue for encapsulation, playing a role in guiding and intermittently feeding the acrylic board; When the connecting frame 6 slides upward, the connecting frame 6 drives the tooth plate 92 to slide upward synchronously. The tooth plate 92 drives the meshing second gear 91 to rotate on the fixed rod 9. The second gear 91 synchronously drives the meshing first gear 84 to rotate. The connecting rod 83 then drives the two telescopic rods 82 to rotate, causing the first short plates 8 and the second short plates 81 to slide alternately. When the connecting frame 6 slides downward, it also drives the first short plates 8 and the second short plates 81 to slide alternately, thus realizing the function of driving the first short plates 8 and the second short plates 81 to alternately receive the acrylic board and send it to the pressing and encapsulation position;

[0043] When the sensor after being coated with glue is conveyed below the square box 51, the infrared sensor monitors that the product reaches the encapsulation position and sends a signal to the main controller. The main controller controls the blower 5 to work and blow air. The air blows to the glue-coated place where the acrylic board is pressed for cooling and curing. Part of the air blows out from the air slot 93 to reduce the heat residue in the square box 51. If the infrared sensor monitors that the product has not reached below the square box 51 for more than the set time, it sends a signal to stop the blower 5 from working, playing a role in controlling the opening and closing of the blower 5 and accelerating the cooling and curing of the glue at the encapsulation place.

[0044] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A dual-signal output sensor packaging mechanism, characterized in that: It includes an encapsulation body; an electric cylinder is fixedly connected to the inner wall of the encapsulation body; the output end of the electric cylinder is fixedly connected to a glue application box; a plurality of glue holes are opened at the bottom end of the glue application box, and the plurality of glue holes are arranged in a square shape; a circulation pipe is fixedly connected to one side of the glue application box; a matching component is arranged at the bottom end of the glue application box, and the matching component is used to assist the glue application box to apply glue and encapsulate the dual-signal output sensor.

2. A dual-signal output sensor packaging mechanism according to claim 1, characterized in that: The matching component includes a shielding plate, a conveyor and a servo motor; the shielding plate is fixedly connected to the bottom end of the glue application box, and the cross-sectional shape of the shielding plate is square; the conveyor is fixedly connected to the encapsulation body; the servo motor is fixedly connected to the conveyor, and the output end of the servo motor is connected to a shaft of the conveyor.

3. The dual-signal output sensor packaging mechanism according to claim 2, characterized in that: A plurality of fixing frames are respectively fixedly connected to both sides of the middle part of the conveyor; one end of the three fixing frames away from the conveyor is fixedly connected to a guiding plate, and one end of the guiding plate is inclined.

4. A dual-signal output sensor packaging mechanism according to claim 3, characterized in that: A first baffle is slidably connected between two opposite fixing frames; a fixing plate is fixedly connected to the top end of the middle part of the first baffle; a top plate is fixedly connected to the outer wall of the electric cylinder, and a square groove is opened in the middle of the top plate.

5. A dual-signal output sensor packaging mechanism according to claim 4, characterized in that: A blower is fixedly connected to one side of the encapsulation body close to the electric cylinder; a square box is fixedly connected to the bottom end of the blower; a material guiding box is fixedly connected to one side of the square box, and the material guiding box is communicated with the square box.

6. A dual-signal output sensor packaging mechanism according to claim 5, characterized in that: Two connecting frames are fixedly connected to the first baffle; one end of the two connecting frames away from the first baffle is fixedly connected to a second baffle.

7. A dual-signal output sensor packaging mechanism according to claim 6, characterized in that: A top frame is fixedly connected to the top end of the middle part of the connecting frame; a blocking plate is fixedly connected to the top frame, the blocking plate is slidably connected to the material guiding box, and two circulation grooves are relatively and staggeredly opened on the blocking plate.

8. A dual-signal output sensor packaging mechanism according to claim 6, characterized in that: A first short plate is slidably connected to both sides of the square box relatively; a second short plate is slidably connected to both sides of the square box and below the first short plate relatively; two telescopic rods are hinged between the first short plate and the second short plate; a connecting rod is fixedly connected to the inner wall of the two telescopic rods; a first gear is fixedly connected to the outer wall of the middle part of the connecting rod; a transmission component is arranged on the connecting rod, and the transmission component is used to drive the first short plate and the second short plate to slide staggeredly.

9. A dual-signal output sensor packaging mechanism according to claim 8, characterized in that: The transmission component includes a fixed rod, a second gear and a toothed plate; the fixed rod is fixedly connected to the outer wall of the square box, and both ends of the connecting rod are rotatably connected to the fixed rod; the second gear is rotatably connected to the middle part of the fixed rod, and the second gear can be meshed with the first gear; the toothed plate is fixedly connected to the connecting frame, and the toothed plate can be meshed with the second gear.

10. A dual-signal output sensor packaging mechanism according to claim 5, characterized in that: An air groove is opened at the bottom end of one side of the square box; an infrared sensor is fixedly connected to the bottom end of the blower and in the middle of the square box, and the infrared sensor is electrically connected to the blower.

Images