Dual signal output sensor packaging mechanism
By using an electric cylinder to drive the glue application box and a servo motor in conjunction with a shielding plate, uniform glue application and precise encapsulation of MEMS sensors are achieved, solving the problem of uneven glue distribution in traditional acrylic plate encapsulation and improving the reliability and encapsulation robustness of the sensors.
Patent Information
- Application Number
- CN202510521058.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2045-04-24
AI Technical Summary
Traditional acrylic sheet encapsulation processes result in uneven glue distribution, affecting the encapsulation robustness and reliability of sensors, especially MEMS-based semiconductor dual-signal output temperature and humidity sensors.
A dual-signal output sensor packaging mechanism is adopted, which uses an electric cylinder to drive the glue application box and a servo motor in conjunction with a shielding plate to achieve uniform glue application through multiple square glue holes. The guide plate and shielding plate structure ensure the accurate delivery and packaging of the sensor, and the fan accelerates the glue curing.
This improved the efficiency and quality of adhesive application, reduced the probability of adhesive dripping onto sensitive components, enhanced the bonding effect of acrylic sheets, and ensured the reliability of sensor performance and the robustness of the encapsulation.
Smart Images

Figure CN120348905B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of sensor packaging technology, specifically a dual-signal output sensor packaging mechanism. Background Technology
[0002] Sensor packaging is a key process that protects sensitive components such as MEMS, optical chips, and electrodes in a specific housing and ensures their reliable interaction with the environment. The effectiveness of packaging can directly affect the accuracy, reliability, environmental adaptability, and cost of the sensor.
[0003] A MEMS-based semiconductor dual-signal output temperature and humidity sensor is a sensor that can simultaneously support two different output signal types. The sensitive element of a semiconductor dual-signal output temperature and humidity sensor is usually encapsulated and protected with epoxy resin or acrylic sheet.
[0004] Acrylic sheets are widely used due to their excellent optical and mechanical properties, as well as their relatively low cost. When using acrylic sheets to encapsulate the sensitive elements of MEMS-based semiconductor dual-signal output temperature and humidity sensors, traditional encapsulation equipment usually adopts a process of multiple dispensing and bonding with a single glue head. This process often leads to uneven glue distribution, which affects the adhesion of the acrylic sheet and easily causes problems with weak encapsulation, thereby affecting the overall performance and reliability of the sensor.
[0005] Therefore, the present invention provides a dual-signal output sensor packaging mechanism. Summary of the Invention
[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.
[0007] The technical solution adopted by the present invention to solve its technical problem is as follows: The present invention provides a dual-signal output sensor packaging mechanism, including a packaging body; an electric cylinder is fixedly connected to the inner wall of the packaging body; a glue applicator is fixedly connected to the output end of the electric cylinder; a plurality of glue holes are opened at the bottom end of the glue applicator, and the plurality of glue holes are arranged in a square shape; a flow tube is fixedly connected to one side of the glue applicator; a mating component is provided at the bottom end of the glue applicator, the mating component being used to assist the glue applicator in applying glue to and packaging the dual-signal output sensor.
[0008] Preferably, the mating components include a shielding plate, a conveyor, and a servo motor; the shielding plate is fixed to the bottom end of the glue-applying box, and the cross-sectional shape of the shielding plate is square; the conveyor is fixed to the packaging machine body; the servo motor is fixed to the conveyor, and the output end of the servo motor is connected to one shaft of the conveyor.
[0009] Preferably, multiple fixed frames are fixedly connected to both sides of the middle section of the conveyor; a guide plate is fixedly connected to one end of the three fixed frames away from the conveyor, and one end of the guide plate is inclined.
[0010] Preferably, a first baffle is slidably connected between the two opposing fixed frames; a fixed plate is fixedly connected to the top center of the first baffle; a top plate is fixedly connected to the outer wall of the electric cylinder, and a square groove is formed in the center of the top plate.
[0011] Preferably, a fan is fixedly connected to the side of the packaging machine body near the electric cylinder; a square box is fixedly connected to the bottom of the fan; a guide box is fixedly connected to one side of the square box, and the guide box is connected to the square box.
[0012] Preferably, two connecting frames are fixedly connected to the first barrier plate; a second barrier plate is fixedly connected to the end of the two connecting frames away from the first barrier plate.
[0013] Preferably, a top frame is fixedly connected to the top of the middle part of the connecting frame; a sealing plate is fixedly connected to the top frame, the sealing plate is slidably connected to the guide box, and two flow grooves are staggered on the sealing plate.
[0014] Preferably, a first short plate is slidably connected to both sides of the square box; a second short plate is slidably connected to both sides of the square box and below the first short plate; two telescopic rods are hinged between the first and second short plates; a connecting rod is fixed to the inner wall of the two telescopic rods; a gear is fixed to the outer wall of the middle part of the connecting rod; a transmission assembly is provided on the connecting rod, which is used to drive the first and second short plates to slide alternately.
[0015] Preferably, the transmission assembly includes a fixed rod, a second gear, and a gear plate; the fixed rod is fixed to the outer wall of the square box, and both ends of the connecting rod are rotatably connected to the fixed rod; the second gear is rotatably connected to the middle of the fixed rod, and the second gear can mesh with the first gear; the gear plate is fixed to the connecting frame, and the gear plate can mesh with the second gear.
[0016] Preferably, a wind trough is provided at one bottom side of the square box; an infrared sensor is fixedly connected to the bottom of the fan and located in the middle of the square box, and the infrared sensor is electrically connected to the fan.
[0017] The beneficial effects of this invention are as follows:
[0018] 1. The dual-signal output sensor packaging mechanism of this invention uses an electric cylinder to drive a glue applicator to extend above the sensor and apply glue evenly to the sensor using multiple square-shaped glue holes. A first baffle and a conveyor precisely intercept and transport the glue during the sensor glue application process, greatly improving the efficiency and quality of glue application. The baffle reduces the occurrence of glue dripping onto the sensitive element. The square-shaped glue application method using multiple glue holes replaces the traditional single-head dispensing method, enabling uniform coating in one go, improving the bonding effect of the sealing layer and the efficiency of dispensing, reducing the probability of acrylic sheet bonding and encapsulation detachment, and thus ensuring the reliable performance of the packaged sensor.
[0019] 2. The dual-signal output sensor packaging mechanism of the present invention uses a conveyor with a guide plate for straightening and conveying. When the sensor is conveyed to the bottom of the glue coating box, the multiple glue holes of the glue coating box are evenly coated with glue and protected by a shielding plate. The first shielding plate intercepts and releases the sensor. Subsequently, the conveyor conveys the glued sensor to the bottom of the square box. The acrylic sheet is temporarily stored by switching between the first short plate and the second short plate and then falls sequentially, pressing on the glued area for packaging. The infrared sensor monitors the product position and controls the fan to work to accelerate the curing of the glue, finally completing the sensor packaging process. Attached Figure Description
[0020] The invention will now be further described with reference to the accompanying drawings.
[0021] Figure 1 This is a perspective view of the present invention;
[0022] Figure 2 This is a schematic diagram of the guide plate structure in this invention;
[0023] Figure 3 This is a schematic diagram of the top plate structure in this invention;
[0024] Figure 4 This is a schematic diagram of the structure of the fixing plate in this invention;
[0025] Figure 5 This is a partial structural cross-sectional view of the square box of the present invention;
[0026] Figure 6 This is a schematic diagram of the sealing plate in this invention;
[0027] Figure 7 This is a schematic diagram of the telescopic rod in this invention.
[0028] In the diagram: 1. Packaging body; 11. Electric cylinder; 12. Glue applicator box; 13. Glue hole; 14. Flow pipe; 2. Baffle plate; 21. Conveyor; 22. Servo motor; 3. Fixing frame; 31. Guide plate; 4. First baffle plate; 41. Fixing plate; 42. Top plate; 5. Fan; 51. Square box; 52. Material guide box; 6. Connecting frame; 61. Second baffle plate; 7. Top frame; 71. Sealing plate; 8. First short plate; 81. Second short plate; 82. Telescopic rod; 83. Connecting rod; 84. First gear; 9. Fixing rod; 91. Second gear; 92. Gear plate; 93. Air duct. Detailed Implementation
[0029] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.
[0030] like Figures 1 to 3 As shown in the embodiment of the present invention, a dual-signal output sensor packaging mechanism includes a packaging body 1; an electric cylinder 11 is fixedly connected to the inner wall of the packaging body 1; a glue-applying box 12 is fixedly connected to the output end of the electric cylinder 11; a plurality of glue holes 13 are provided at the bottom end of the glue-applying box 12, and the plurality of glue holes 13 are arranged in a square shape; a flow tube 14 is fixedly connected to one side of the glue-applying box 12; a mating component is provided at the bottom end of the glue-applying box 12 to assist the glue-applying box 12 in applying glue to and packaging the dual-signal output sensor; the MEMS-based semiconductor dual-signal output temperature and humidity sensor supports two different output signal types simultaneously, has two detection positions, and can realize the function of simultaneously detecting two sets of data. When using an acrylic plate to package the sensitive element of the semiconductor dual-signal output temperature and humidity sensor, the packaging body 1 is used as the packaging equipment for the semiconductor dual-signal output temperature and humidity sensor. The main structure, in conjunction with the components, sequentially transports multiple semiconductor dual-signal output temperature and humidity sensors to be coated and encapsulated to a position below the electric cylinder 11. When a sensor is transported to the position below the electric cylinder 11, the output end of the electric cylinder 11 drives the glue-applying box 12 to extend downwards, with multiple glue holes 13 approaching the glue application area of the sensor. At this time, the external glue-dispensing device delivers glue into the glue-applying box 12 through the flow pipe 14, and the glue is applied to the sensor's encapsulation housing in a square pattern through the multiple glue holes 13. After the coating is completed, the cooperating components transport the coated sensor to the sealing area, where an acrylic sheet is used as a sealing layer to press and encapsulate the glued area. The square glue application method with multiple glue holes 13 replaces the traditional single-head dispensing method, enabling uniform coating in one go, improving the bonding effect of the sealing layer and the efficiency of dispensing, reducing the probability of the acrylic sheet bonding and encapsulation falling off, thereby ensuring the overall performance and reliability of the sensor.
[0031] The assembly includes a shielding plate 2, a conveyor 21, and a servo motor 22. The shielding plate 2 is fixed to the bottom of the glue-applying box 12, and the cross-sectional shape of the shielding plate 2 is square. The conveyor 21 is fixed to the encapsulation body 1. The servo motor 22 is fixed to the conveyor 21, and the output end of the servo motor 22 is connected to one shaft of the conveyor 21. When conveying multiple semiconductor dual-signal output temperature and humidity sensors to be glued and encapsulated, the multiple sensors are placed on the conveyor 21 in sequence. The output end of the servo motor 22 drives one shaft of the conveyor 21 to rotate, synchronously driving the conveyor 21 to rotate. When multiple sensors are being transported, as one sensor is delivered to the bottom of the electric cylinder 11, the glue application box 12 extends downward along with the output end of the electric cylinder 11. The shielding plate 2 is first inserted into the sensor's encapsulation area and adheres to the inner wall of the sensor's housing, blocking the glue application area. At this time, multiple glue holes 13 begin to apply glue. The shielding plate 2 blocks the sensor's sensitive element until the glue application is complete. The output end of the electric cylinder 11 drives the glue application box 12 and the shielding plate 2 to rise and retract. By using the shielding plate 2 to block the sensor's sensitive element by adhering to the inner wall of the sensor's housing, the occurrence of glue dripping onto the sensitive element during the glue application process can be reduced.
[0032] like Figures 1 to 4 As shown, multiple fixed frames 3 are fixedly connected to both sides of the middle part of the conveyor 21; a guide plate 31 is fixedly connected to one end of the three fixed frames 3 away from the conveyor 21, and one end of the guide plate 31 is inclined; when the conveyor 21 conveys multiple semiconductor dual-signal output temperature and humidity sensors, the multiple fixed frames 3 are fixed to both sides of the conveyor 21 to suspend two guide plates 31. The inclined surfaces at the front ends of the two guide plates 31 guide the multiple sensors being conveyed, so that sensors with angular deviations can be straightened and conveyed, thereby improving the accuracy of the sensor coating and encapsulation.
[0033] A first baffle 4 is slidably connected between two opposing fixed frames 3; a fixed plate 41 is fixedly connected to the top center of the first baffle 4; a top plate 42 is fixedly connected to the outer wall of the electric cylinder 11, and a square groove is formed in the center of the top plate 42; when conveying and applying adhesive to a semiconductor dual-signal output temperature and humidity sensor, the first baffle 4 slides between the two fixed frames 3 to intercept the conveyed sensor. When the sensor is intercepted by the first baffle 4, the conveyor 21 stops conveying, and multiple adhesive holes 13 evenly apply adhesive to the intercepted sensor. After the adhesive is applied, the electric cylinder 11... The output end of the electric cylinder 11 retracts, causing the top plate 42 to slide upward. The square groove in the middle of the top plate 42 is used to fit onto the vertical plate of the fixed plate 41 until the top plate 42 slides upward and fits against the bottom surface of the fixed plate 41. The output end of the electric cylinder 11 continues to retract, and the top plate 42 lifts the fixed plate 41. The first baffle 4 is then pulled upward by the fixed plate 41 and slides onto the two fixed frames 3 until the first baffle 4 is higher than the sensor. Then the conveyor 21 continues to transport the sensor to the encapsulation area where it is sealed with an acrylic plate, which serves to limit and intercept the transported sensor and improve the effect of gluing and encapsulation.
[0034] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, a fan 5 is fixedly connected to the side of the packaging machine body 1 near the electric cylinder 11; a square box 51 is fixedly connected to the bottom end of the fan 5; a guide box 52 is fixedly connected to one side of the square box 51, and the guide box 52 is connected to the square box 51; when the sensor is coated with adhesive and an acrylic plate is used as a sealing layer for packaging, the square box 51 is fixed to the inner wall of the packaging machine body 1 by the fan 5. The conveyor 21 first transports the coated sensor to the position below the square box 51, and then the acrylic plate is placed into the inclined guide box 52 for conveying. The acrylic plate slides from the guide box 52 into the square box 51, and then slides down the inner wall of the square box 51 to press against the adhesive coating of the sensor, thereby realizing the function of using an acrylic plate as a sealing layer to encapsulate the sensor. At the same time, the output end of the fan 5 blows air into the interior of the square box 51, which can cool and cure the adhesive at the packaging site, improving the effect of sensor packaging.
[0035] like Figure 1 , Figure 2 and Figure 4As shown, two connecting brackets 6 are fixedly connected to the first barrier plate 4; a second barrier plate 61 is fixedly connected to one end of the two connecting brackets 6 away from the first barrier plate 4; when an acrylic sheet is used as a sealing layer to encapsulate the sensor, the two connecting brackets 6 are fixed on the first barrier plate 4 as connecting parts of the second barrier plate 61. When the first barrier plate 4 intercepts the sensor to be coated with glue, the second barrier plate 61 simultaneously intercepts the sensor after it has been coated with glue. During the process of coating the sensor with glue, the acrylic sheet is simultaneously pressed onto the sensor after it has been coated with glue for encapsulation. After the sensor is coated with glue, the electric cylinder 11 drives the top plate 42 to slide up and lift the fixed plate 41. The first barrier plate 4 and the second barrier plate 61 connected to the connecting brackets 6 slide up and pass over the height of the sensor. The conveyor 21 transports the coated sensor to the encapsulation point and simultaneously transports the encapsulated sensor for unloading, which plays the role of simultaneously controlling and intercepting the sensor at the coating point and the encapsulation point.
[0036] like Figure 1 , Figure 2 and Figures 4 to 6 As shown, a top frame 7 is fixedly connected to the top of the middle part of the connecting frame 6; a sealing plate 71 is fixedly connected to the top frame 7, and the sealing plate 71 is slidably connected to the guide box 52, and two flow grooves are staggered on the sealing plate 71; when multiple acrylic sheets are fed sequentially, an acrylic sheet is first placed into the guide box 52, at which time the acrylic sheet is intercepted by the sealing plate 71 blocking the channel of the guide box 52. As the connecting frame 6 slides up with the first baffle plate 4, the top frame 7 simultaneously lifts the sealing plate 71 and slides it up, so that the flow groove at the front end of the channel of the guide box 52, which was originally staggered, is now open. The channel is connected to the guide box 52, while another flow channel is offset and blocked at the end of the guide box 52 channel. The acrylic plate slides down to the end of the guide box 52 channel and is intercepted. As the output end of the electric cylinder 11 extends downward, another acrylic plate is lowered into the guide box 52. At this time, the two flow channels slide down with the top frame 7. The front end of the guide box 52 channel is blocked and the rear end is connected. The acrylic plate that was originally blocked at the rear end of the guide box 52 channel slides down to the inner wall of the square box 51 until it is pressed onto the glued sensor for sealing. This plays the role of controlling the intermittent feeding of acrylic plates by blocking the guide box 52 channel.
[0037] like Figure 1 , Figure 2 and Figures 4 to 7As shown, a first short plate 8 is slidably connected to both sides of the square box 51; a second short plate 81 is slidably connected to both sides of the square box 51 and below the first short plate 8; two telescopic rods 82 are hinged between the first short plate 8 and the second short plate 81; a connecting rod 83 is fixedly connected to the inner wall of the two telescopic rods 82; a gear 84 is fixedly connected to the outer wall of the middle part of the connecting rod 83; a transmission component is provided on the connecting rod 83, which is used to drive the first short plate 8 and the second short plate 81 to slide alternately; when the acrylic plate slides into the square box 51 from the guide box 52 channel, one end of the acrylic plate may tilt and fall first, thus affecting the sensor encapsulation. By using the two sets of opposing first short plates 8 and second short plates 81 sliding on the inner wall of the square box 51, the guide box 52... The acrylic sheet falling in the channel first lands on the two short plates 8. As the connecting frame 6 slides up, it drives the transmission component to move. The transmission component drives the first gear 84 to rotate. The first gear 84 simultaneously drives the two telescopic rods 82 on the connecting rod 83 to rotate, so that the first short plate 8 and the second short plate 81 slide alternately. The two first short plates 8 retract into the inner wall of the square box 51, while the two second short plates 81 slide out of the inner wall of the square box 51. The acrylic sheet originally placed on the two first short plates 8 falls onto the two second short plates 81 for temporary storage. As the connecting frame 6 slides down, it drives the transmission component to move, simultaneously causing the second short plate 81 to slide alternately with the first short plate 8 again. At this time, the acrylic sheet placed on the second short plate 81 falls and presses onto the position where the sensor is coated with adhesive for sealing, which plays a role in guiding the intermittent feeding of the acrylic sheet.
[0038] The transmission assembly includes a fixed rod 9, a second gear 91, and a gear plate 92. The fixed rod 9 is fixed to the outer wall of the square box 51, and both ends of the connecting rod 83 are rotatably connected to the fixed rod 9. The second gear 91 is rotatably connected to the middle of the fixed rod 9, and the second gear 91 can mesh with the first gear 84. The gear plate 92 is fixed to the connecting frame 6, and the gear plate 92 can mesh with the second gear 91. When the connecting frame 6 slides upward, the connecting frame 6 drives the gear plate 92 synchronously. As the plate slides upward, the toothed plate 92 drives the meshing second gear 91 to rotate on the fixed rod 9. The second gear 91 synchronously drives the meshing first gear 84 to rotate. The connecting rod 83 then drives the two telescopic rods 82 to rotate, causing the first short plate 8 and the second short plate 81 to slide alternately. When the connecting frame 6 slides downward, it also drives the first short plate 8 and the second short plate 81 to slide alternately, thereby realizing the function of driving the first short plate 8 and the second short plate 81 to alternately receive the acrylic sheet and deliver it to the pressing and sealing.
[0039] like Figure 1 , Figure 2 , Figure 4 and Figure 5As shown, a wind trough 93 is provided at the bottom of one side of the square box 51; an infrared sensor is fixedly connected to the bottom of the fan 5 and located in the middle of the square box 51, and the infrared sensor is electrically connected to the fan 5; when the sensor after applying glue is transported to the bottom of the square box 51, the infrared sensor detects that the product has reached the packaging position and sends a signal to the main controller. The main controller controls the fan 5 to work and blow air. The air blows to the glued area of the acrylic sheet to cool and solidify. Some air is blown out from the wind trough 93 to reduce the heat residue in the square box 51. If the infrared sensor detects that the product has not reached the bottom of the square box 51 within a set time, it sends a signal to stop the fan 5, which plays the role of controlling the start and stop of the fan 5 and accelerating the cooling and solidification of the glue at the packaging area.
[0040] Working process: When encapsulating the sensitive element of a semiconductor dual-signal output temperature and humidity sensor using an acrylic sheet, the encapsulation body 1 serves as the main structure of the semiconductor dual-signal output temperature and humidity sensor encapsulation equipment. Multiple semiconductor dual-signal output temperature and humidity sensors to be encapsulated are sequentially transported to the position below the electric cylinder 11 using the accompanying components. When a sensor is transported to the position below the electric cylinder 11, the output end of the electric cylinder 11 drives the glue applicator 12 to extend downwards, and multiple glue holes 13 approach the glue application area of the sensor. At this time, the external glue delivery device delivers glue through the flow pipe 14 to the sensor. Inside the adhesive coating box 12, multiple adhesive holes 13 are arranged in a square pattern to coat the sensor housing. After coating, the coated sensor is delivered to the sealing area by a mating assembly. An acrylic sheet is used as a sealing layer and pressed onto the coated area for encapsulation. The square adhesive coating method using multiple adhesive holes 13 replaces the traditional single-head dispensing method, enabling uniform coating in one go, improving the bonding effect of the sealing layer and the dispensing efficiency, reducing the probability of acrylic sheet bonding and encapsulation detachment, and thus ensuring the overall performance and reliability of the sensor. When multiple semiconductor dual-signal input sensors to be coated and encapsulated are applied... When conveying temperature and humidity sensors, multiple sensors are placed sequentially on conveyor 21. The output of servo motor 22 drives one shaft of conveyor 21 to rotate, synchronously driving conveyor 21 to transport multiple sensors. When a sensor is delivered to the bottom of electric cylinder 11, the glue application box 12 extends downward with the output of electric cylinder 11. The shielding plate 2 is first inserted into the sensor's encapsulation, and the shielding plate 2 adheres to the inner wall of the sensor housing, blocking the glue application area. At this time, multiple glue holes 13 begin to apply glue. The shielding plate 2 blocks the sensor's sensitive element until the glue application is completed. The electric cylinder 11 then resumes its operation. The output end drives the glue coating box 12 and the shielding plate 2 to rise and retract. The shielding plate 2 is attached to the inner wall of the sensor housing to block the sensor sensitive element, which can reduce the occurrence of glue dripping onto the sensitive element during the glue coating process. When the conveyor 21 conveys multiple semiconductor dual-signal output temperature and humidity sensors, multiple fixing frames 3 are fixed on both sides of the conveyor 21 to suspend two guide plates 31. The inclined surfaces at the front ends of the two guide plates 31 guide the multiple sensors being conveyed, so that sensors with angular deviations can be straightened and conveyed, improving the accuracy of glue coating and encapsulation of the sensors.When applying adhesive to a semiconductor dual-signal output temperature and humidity sensor, a first baffle plate 4 slides between two fixed frames 3 to intercept the sensor being transported. When the sensor is intercepted by the first baffle plate 4, the conveyor 21 stops transporting. Multiple adhesive holes 13 apply adhesive evenly to the intercepted sensor. After the adhesive is applied, the output end of the electric cylinder 11 retracts, causing the top plate 42 to slide upward. The square groove in the middle of the top plate 42 is used to fit onto the vertical plate of the fixed plate 41 until the top plate 42 slides upward and adheres to the bottom surface of the fixed plate 41. The output end of the electric cylinder 11 continues to retract, and the top plate 42 lifts the fixed plate 41. The first baffle plate 4 is then pulled upward by the fixed plate 41 and slides onto the two fixed frames 3 until the first baffle plate 4 is higher than the sensor. Then, the conveyor 21 continues to transport the sensor to the encapsulation area where it is sealed with an acrylic plate, which serves to limit and intercept the transported sensor, thereby improving the effect of adhesive application and encapsulation.
[0041] After the sensor is coated with adhesive, an acrylic sheet is used as a sealing layer for encapsulation. The square box 51 is fixed to the inner wall of the encapsulation machine 1 by the fan 5. The conveyor 21 first transports the coated sensor to the lower position of the square box 51, then sequentially places acrylic sheets into the inclined guide box 52 for conveying. The acrylic sheets slide from the guide box 52 into the square box 51, and then slide down against the inner wall of the square box 51 to press against the adhesive coating of the sensor. This achieves the function of using the acrylic sheet as a sealing layer to encapsulate the sensor. Simultaneously, the output of the fan 5 blows air into the square box 51. Internally, the system can blow air to cool and cure the adhesive at the encapsulation point, improving the encapsulation effect of the sensor. When using an acrylic sheet as the sealing layer to encapsulate the sensor, two connecting brackets 6 are fixed on the first barrier plate 4 as connectors to the second barrier plate 61. When the first barrier plate 4 intercepts the sensor to be coated with adhesive, the second barrier plate 61 simultaneously intercepts the sensor after adhesive coating. During the sensor adhesive coating process, the acrylic sheet is simultaneously pressed onto the already coated sensor for encapsulation. After the sensor adhesive coating is completed, the electric cylinder 11 drives the top plate 42 to slide up and lift the fixing plate 41, connecting the first barrier plate 4 and the connecting brackets 6. The second baffle 61 slides upward synchronously past the height of the sensor, and the conveyor 21 transports the glued sensor to the encapsulation area, simultaneously unloading the encapsulated sensor, thus simultaneously controlling and intercepting the sensor at the glue application and encapsulation areas. When multiple acrylic sheets are fed sequentially, one acrylic sheet is first placed into the guide box 52. At this time, the acrylic sheet is intercepted by the blocking plate 71 that blocks the channel of the guide box 52. As the connecting frame 6 slides upward with the first baffle 4, the top frame 7 simultaneously lifts the blocking plate 71 and slides upward, causing the originally misaligned blocking plate 71 at the front end of the guide box 52 channel to slide upward. The flow channel is connected to it, and the other flow channel is offset and blocked at the end of the guide box 52 channel. The acrylic plate slides down to the end of the guide box 52 channel and is intercepted. As the output end of the electric cylinder 11 extends downward, another acrylic plate is lowered into the guide box 52. At this time, the two flow channels slide down with the top frame 7. The front end of the guide box 52 channel is blocked and the rear end is connected. The acrylic plate that was originally blocked at the rear end of the guide box 52 channel slides down to the inner wall of the square box 51 until it is pressed onto the glued sensor for sealing. This plays the role of controlling the intermittent feeding of acrylic plates by blocking the guide box 52 channel.
[0042] When the acrylic sheet slides from the guide box 52 channel into the square box 51, one end of the acrylic sheet may tilt and fall first, affecting the sensor encapsulation. Two sets of opposing first short plates 8 and second short plates 81 slide on the inner wall of the square box 51. The acrylic sheet falling from the guide box 52 channel first lands on the two first short plates 8. As the connecting frame 6 slides upward, it drives the transmission component to move. The transmission component drives the first gear 84 to rotate, and the first gear 84 simultaneously drives the two telescopic rods 82 on the connecting rod 83 to rotate, causing the first short plates 8 and second short plates 81 to slide alternately. The two first short plates 8 retract into the inner wall of the square box 51, while the two second short plates 81 slide out of the inner wall of the square box 51. The acrylic sheet originally placed on the two first short plates 8 falls onto the two second short plates 81 for temporary storage. When the connecting frame 6 slides down, it drives the transmission component to move, which in turn drives the second short plate 81 and the first short plate 8 to slide alternately again. At this time, the acrylic plate placed on the second short plate 81 falls and presses against the position where the sensor is coated with adhesive for sealing, which plays a role in guiding the acrylic plate for intermittent feeding. When the connecting frame 6 slides up, the connecting frame 6 drives the toothed plate 92 to slide up synchronously. The toothed plate 92 drives the meshing second gear 91 to rotate on the fixed rod 9. The second gear 91 drives the meshing first gear 84 to rotate synchronously. The connecting rod 83 then drives the two telescopic rods 82 to rotate, so that the first short plate 8 and the second short plate 81 slide alternately. When the connecting frame 6 slides down, it also drives the first short plate 8 and the second short plate 81 to slide alternately, thereby realizing the function of driving the first short plate 8 and the second short plate 81 to alternately receive the acrylic plate and send it to the pressing and sealing.
[0043] When the sensor after applying the adhesive is delivered to the bottom of the box 51, the infrared sensor detects that the product has reached the packaging position and sends a signal to the main controller. The main controller controls the fan 5 to work and blow air. The air blows to the adhesive area of the acrylic sheet being pressed and packaged to cool and solidify. Some air is blown out from the air duct 93 to reduce the heat residue inside the box 51. If the infrared sensor detects that the product has not reached the bottom of the box 51 within the set time, it sends a signal to stop the fan 5. This serves to control the start and stop of the fan 5 and accelerate the cooling and solidification of the adhesive at the packaging area.
[0044] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A dual-signal output sensor packaging mechanism, characterized in that: The device includes a packaging body; an electric cylinder is fixedly connected to the inner wall of the packaging body; a glue applicator is fixedly connected to the output end of the electric cylinder; the bottom end of the glue applicator has multiple glue holes, which are arranged in a square shape; a flow tube is fixedly connected to one side of the glue applicator; and a mating component is provided at the bottom end of the glue applicator to assist the glue applicator in applying glue to and packaging a dual-signal output sensor. A first baffle is slidably connected between two opposing fixed frames; a fixed plate is fixedly connected to the top of the middle part of the first baffle; a top plate is fixedly connected to the outer wall of the electric cylinder, and a square groove is opened in the middle of the top plate. A fan is fixedly connected to the side of the packaging machine body near the electric cylinder; a square box is fixedly connected to the bottom of the fan; a guide box is fixedly connected to one side of the square box, and the guide box is connected to the square box. Two connecting frames are fixedly connected to the first barrier plate; the second barrier plate is fixedly connected to the end of the two connecting frames away from the first barrier plate. A top frame is fixedly connected to the top of the middle part of the connecting frame; a sealing plate is fixedly connected to the top frame, the sealing plate is slidably connected to the guide box, and two flow grooves are staggered on the sealing plate.
2. The dual-signal output sensor packaging mechanism according to claim 1, characterized in that: The assembly includes a shielding plate, a conveyor, and a servo motor; the shielding plate is fixed to the bottom of the glue-applying box, and the cross-sectional shape of the shielding plate is square; the conveyor is fixed to the packaging machine body; the servo motor is fixed to the conveyor, and the output end of the servo motor is connected to one shaft of the conveyor.
3. The dual-signal output sensor packaging mechanism according to claim 2, characterized in that: Multiple fixed frames are fixedly connected to both sides of the middle section of the conveyor; a guide plate is fixedly connected to one end of the three fixed frames away from the conveyor, and one end of the guide plate is inclined.
4. The dual-signal output sensor packaging mechanism according to claim 1, characterized in that: The square box has a first short plate slidably connected to both sides of it; a second short plate is slidably connected to both sides of the square box and below the first short plate; two telescopic rods are hinged between the first and second short plates; a connecting rod is fixed to the inner wall of the two telescopic rods; a gear is fixed to the outer wall of the middle part of the connecting rod; a transmission assembly is provided on the connecting rod, which is used to drive the first and second short plates to slide alternately.
5. The dual-signal output sensor packaging mechanism according to claim 4, characterized in that: The transmission assembly includes a fixed rod, a second gear, and a gear plate; the fixed rod is fixed to the outer wall of the box, and the two ends of the connecting rod are rotatably connected to the fixed rod; the second gear is rotatably connected to the middle of the fixed rod, and the second gear can mesh with the first gear; the gear plate is fixed to the connecting frame, and the gear plate can mesh with the second gear.
6. The dual-signal output sensor packaging mechanism according to claim 1, characterized in that: A vent is provided at the bottom of one side of the box; an infrared sensor is fixedly connected to the bottom of the fan and in the middle of the box, and the infrared sensor is electrically connected to the fan.
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