Horizontal pluggable silicon light engine and assembling method thereof
Through the design-level pluggable silicon optical engine, the fiber array is pluggable before reflow soldering, solving the problem of fiber arrays in high-temperature reflow soldering, simplifying the manufacturing process and reducing costs.
Patent Information
- Application Number
- CN202510781779.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-12
- Publication Date
- 2025-07-22
AI Technical Summary
In the prior art, the optical fiber array cannot withstand the reflow soldering temperature of flip chip assembly, resulting in optical coupling that must be performed after the chip bonding operation, and the exposed optical fibers are troubled during welding and installation, making it difficult to achieve pluggable and unpluggable between the silicon optical engine and the optical fiber.
Design a horizontal pluggable silicon optical engine. The optical fiber or fiber array can be separated from the silicon optical engine when used. The pluggable direction is parallel to the bottom surface of the silicon optical engine substrate and the optical chip light exit direction. First unplug the optical fiber or fiber array and plug it back before reflow soldering. The fiber array plug, positioning guide hole, elastic hook and guide support structure are used to achieve stable connection.
The optical interface structure design is simplified, manufacturing difficulty and cost is reduced, the requirements of fiber array reflow soldering at high temperatures are avoided, and structural stability and manufacturability are improved.
Smart Images
Figure CN120352992A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical fields of AI / cloud computing data centers, high-speed optical interconnections, optical fiber communication networks, etc., and specifically provides a horizontally pluggable silicon photonics optical engine and an assembly method thereof. Background Art
[0002] Silicon photonics chips for communication are currently developing towards higher speeds and higher integration levels. With the increase in speed, the single-channel speed has developed from 100G to 200G, and the transmission distance of signals on the circuit board is getting shorter and shorter. To ensure the quality of signal transmission, it is required that the distance between the optical engine and the main chip (such as switch ASIC, xPU, Memory, etc.) is as short as possible, and it is best to be soldered to the same substrate. To meet the requirements of soldering processes such as reflow soldering and operation convenience, how to achieve the pluggability of the silicon photonics optical engine and the optical fiber has become an urgent task.
[0003] Currently, the fiber array FA usually cannot withstand the reflow soldering temperature of flip-chip assembly, resulting in the optical coupling of the fiber array having to be performed after the chip bonding operation, which is often impossible in many application scenarios. Moreover, during soldering installation, the long exposed optical fibers also bring great trouble to the soldering and assembly of the optical engine or optical components. Summary of the Invention
[0004] The technical problem to be solved by the present invention is: how to achieve the pluggability of the silicon photonics optical engine and the optical fiber or fiber array.
[0005] To solve the above technical problem, the first object of the present invention is to propose a horizontally pluggable silicon photonics optical engine, that is, the optical fiber or fiber array of the silicon photonics optical engine can be separated from the silicon photonics optical engine during use to achieve the plugging and unplugging of the optical fiber or fiber array, and its plugging and unplugging direction is parallel to the bottom surface of the silicon photonics optical engine substrate and the light output direction of the silicon photonics optical chip of the silicon photonics optical engine. Before soldering the optical engine to the system substrate, first unplug the optical fiber or fiber array, and then reinsert the optical fiber or fiber array after completing the mounting and reflow soldering fixation of the silicon photonics optical engine.
[0006] The specific technical solutions adopted are as follows: A horizontally pluggable silicon photonics optical engine, the silicon photonics optical engine includes an optoelectronic chip assembly, a silicon photonics optical engine substrate, a fiber array plug, an array of optical fibers, and a coupling lens. The optoelectronic chip assembly is fixed to the bottom surface of the silicon photonics optical engine substrate, and the coupling lens is fixed to the bottom surface of the silicon photonics optical engine substrate or to the end face of the silicon chip coupler of the optoelectronic chip assembly; the fiber array plug is horizontally pluggable and connected to one end of the silicon photonics optical engine substrate, and the array of optical fibers is disposed inside the fiber array plug; a first lens is disposed at the end face of the array of optical fibers inside the fiber array plug to turn the divergent light beam from the array of optical fibers into a collimated light beam or to focus the collimated light beam from the coupling lens onto the array of optical fibers.
[0007] Further, the optoelectronic chip component is a silicon photonics optoelectronic hybrid packaging component, and one side of the silicon photonics chip of the optoelectronic chip component is attached to the bottom surface of the silicon photonics optical engine substrate.
[0008] Further, at least two positioning guide holes are provided along the horizontal direction of the insertion and extraction of the fiber array plug, and the positioning guide holes are cooperatively connected with the positioning guide posts protruding from the end surface of the silicon photonics optical engine substrate. The positioning guide holes and the positioning guide posts are cooperatively connected to align the array optical fibers in the fiber array plug with the coupling waveguides of the silicon photonics chip of the optoelectronic chip component of the silicon photonics optical engine through the coupling lens system.
[0009] Further, a slot is provided at one end surface of the silicon photonics optical engine substrate.
[0010] Further, elastic hooks are provided on both sides of the fiber array plug along the horizontal direction of the insertion and extraction of the fiber array plug, and clamping grooves for clamping the elastic hooks are recessed on the groove walls on both sides of the slot.
[0011] Further, a guiding and supporting structure is provided between the fiber array plug and the slot of the silicon photonics optical engine substrate.
[0012] Further, the silicon photonics optical engine substrate is made of a metal material, and a heat sink is further provided on the top surface of the silicon photonics optical engine substrate. A dust plug is inserted and removed in the slot. The silicon photonics optical engine substrate is made of a metal material, such as tungsten copper, for fixing the optoelectronic chip component and the fiber array plug, and positioning and dissipating heat of the two relative to the silicon photonics optical engine substrate. A heat sink is further provided on the top surface of the silicon photonics optical engine substrate. On the one hand, the silicon photonics optical engine substrate is made of tungsten copper material, which can effectively conduct the heat of the optoelectronic chip component. Adding a heat sink on the optical engine substrate increases the heat dissipation area, further improves the heat dissipation effect, and reduces the temperature of the optoelectronic chip inside the silicon photonics optical engine. When the fiber array plug in the slot of the silicon photonics optical engine substrate is removed, a dust plug is inserted into the slot of the silicon photonics optical engine substrate.
[0013] Further, the bottom surface of the coupling lens is a fixed surface, serving as the bonding surface with the silicon photonics optical engine substrate; the material of the coupling lens is glass or silicon, and a dust-proof cover plate is installed on the outer periphery of the coupling lens. The dust-proof cover plate is fixed on the silicon photonics optical engine substrate by bolts. A dust plug is provided in the slot at one end of the silicon photonics optical engine substrate, and the dust-proof cover plate covers the periphery of the coupling lens. Covering the periphery of the coupling lens on the bottom surface of the silicon photonics optical engine substrate with a dust-proof cover plate avoids the soiling of the end faces of the coupling lens and the optical chip of the optoelectronic chip component caused by dust entering the coupling optical path during the long-term use of the optical engine, which affects the coupling efficiency of the optical channel and causes a large insertion loss; considering that it is more convenient to remove the fiber array plug component during the transportation, storage and installation of the silicon photonics optical engine, the dust-proof requirement of the optical port of the silicon photonics optical engine needs to be considered when removing the fiber array plug component. Therefore, a dust plug is provided in the slot.
[0014] Further, the optoelectronic chip component is fixed on the bottom surface of the silicon photonic optical engine substrate by bonding or welding; the coupling lens is fixed on the bottom surface of the silicon photonic optical engine substrate by bonding or welding, or is fixed to the end face of the optical chip coupler of the optoelectronic chip component by photolithography.
[0015] The second object of the present invention is to propose an assembly method for a horizontally pluggable silicon photonic optical engine, including the following steps: Step 1: With the bottom surface of the silicon photonic optical engine substrate facing upward, place the optoelectronic chip component on the bottom surface of the silicon photonic optical engine substrate, align the coupler end face of the silicon photonic chip in the optoelectronic chip component with the pre-marked positioning mark line on the bottom surface of the silicon photonic optical engine substrate, and fix it; Step 2: With the top surface of the silicon photonic optical engine substrate facing upward, connect the fiber array plug provided with an array of optical fibers to the positioning guide posts of the silicon photonic optical engine substrate through the positioning guide holes, and fix it through the elastic hooks on both sides of the fiber array plug and the card slots on the two inner side surfaces of the slot of the silicon photonic optical engine substrate; Step 3: With the bottom surface of the silicon photonic optical engine substrate facing upward, place the coupling lens on the bottom surface of the silicon photonic optical engine substrate, adjust the position of the coupling lens on the bottom surface of the silicon photonic optical engine substrate, and perform the coupling of the coupling lens and the optoelectronic chip component and the mounting on the bottom surface of the optical engine substrate; Step 4: Separate the fiber array plug provided with an array of optical fibers from the silicon photonic optical engine substrate, insert the dust plug into the silicon photonic optical engine substrate, and then fix the combination formed by the optoelectronic chip component, the coupling lens and the silicon photonic optical engine substrate on the system substrate or circuit board through reflow soldering; Step 5: Remove the dust plug, reinsert the fiber array plug, insert the positioning guide posts of the silicon photonic optical engine substrate into the positioning guide holes of the fiber array plug and fix it to the silicon photonic optical engine substrate; Step 6: Fix the heat sink to the silicon photonic optical engine substrate, and the assembly is completed.
[0016] The beneficial effects of the present invention compared with the prior art: For the horizontally pluggable silicon photonic optical engine of the present invention, the optical fiber or fiber array can be plugged and unplugged with the silicon photonic optical engine through the fiber array plug. Before the optical engine is soldered to the system substrate or circuit board, first unplug the fiber array plug, then solder the silicon photonic optical engine to the system substrate or circuit board through reflow soldering, and then reinsert the fiber array plug.
[0017] The horizontally pluggable silicon photonic optical engine of the present invention simplifies the design of the pluggable optical interface structure. Compared with the existing disclosed solutions, it has fewer requirements for optical chips, a more stable structure, is easier to manufacture and mass-produce, and has a lower cost.
[0018] The assembling method of the horizontally pluggable silicon photonic optical engine of the present invention simplifies the SMT soldering process compared with non-pluggable optical fiber interfaces and also avoids the requirement for the glue used in the array optical fibers and the optical path of the optical fiber array plug to withstand the high temperature of reflow soldering. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 FIG. 6 is a perspective structural view of the horizontally pluggable silicon photonic optical engine according to Embodiment 1 of the present invention; Figure 2 FIG. 7 is a top view of the horizontally pluggable silicon photonic optical engine according to Embodiment 1 of the present invention; Figure 3 FIG. 8 is a bottom view of the horizontally pluggable silicon photonic optical engine according to Embodiment 1 of the present invention; Figure 4 FIG. 9 is a side view of the horizontally pluggable silicon photonic optical engine according to Embodiment 1 of the present invention; Figure 5 FIG. 10 is a front view of the horizontally pluggable silicon photonic optical engine according to Embodiment 1 of the present invention; Figure 6 FIG. Figure 5 is a sectional view taken along line B-B of Figure 7 FIG. Figure 6 is an enlarged view of part A of Figure 8 FIG. 14 is a perspective view of the optical fiber array plug being pulled out and the dust plug being inserted in Embodiment 1; Figure 9 FIG. Figure 8 is a top view of Wherein, 1 - optoelectronic chip assembly, 2 - silicon photonic optical engine substrate, 21 - pillar, 23 - positioning guide post, 3 - optical fiber array plug, 31 - first lens, 32 - second lens, 34 - positioning guide hole, 35 - elastic catch, 36 - card slot, 37 - chute, 38 - slider, 4 - heat sink, 5 - array optical fiber, 6 - dust-proof cover plate, 8 - coupling lens, 10 - dust plug. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying Figures 1 - 9 drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0021] Embodiment 1
[0022] As shown in Figures 1 - 6As shown in the figure, this embodiment is a horizontally pluggable silicon photonics optical engine, which includes an optoelectronic chip component 1, a silicon photonics optical engine substrate 2, an optical fiber array plug 3, an array of optical fibers 5, and a coupling lens 8.
[0023] In the traditional packaging of silicon photonics components, the optical fiber or the array of optical fibers is directly glued and pasted to the end face of the silicon photonics chip coupler. In the technical solution of this application, as Figure 1 shown, the optical chip in the optoelectronic chip component 1 is fixed on the bottom surface of the silicon photonics optical engine substrate 2, and the array of optical fibers 5 arranged in the optical fiber array plug 3 can be horizontally plugged and unplugged with the end face of the silicon photonics optical engine substrate 2.
[0024] As Figure 1 and 7 shown, the optoelectronic chip component 1 is fixed on the bottom surface of the silicon photonics optical engine substrate 2, and the coupling lens 8 is fixed on the bottom surface of the silicon photonics optical engine substrate 2 or on the end face of the optical chip coupler of the optoelectronic chip component 1; the optical fiber array plug 3 is horizontally plugged and unplugged to one end of the silicon photonics optical engine substrate 2, and the array of optical fibers 5 is arranged in the optical fiber array plug 3; a first lens 31 is arranged at the end face of the array of optical fibers inside the optical fiber array plug 3 to turn the divergent light beam from the array of optical fibers 5 into a collimated light beam or to focus the collimated light beam from the coupling lens 8 onto the array of optical fibers 5.
[0025] At the transmitting end of the silicon photonics optical engine, the horizontal light output of the optoelectronic chip component 1 becomes collimated light after passing through the coupling lens 8, and the first lens 31 at the optical fiber array 5 focuses the collimated light received from the coupling lens 8 onto the end face of the optical fiber array 5, and the optical fiber array 5 is connected to the external transmission optical fiber; At the receiving end of the silicon photonics optical engine, the externally input optical signal enters the array of optical fibers 5 arranged in the optical fiber array plug 3, and the first lens 31 at the optical fiber array 5 converts the light from the optical fiber into collimated light, and the coupling lens 8 focuses the collimated light beam from the first lens 31 onto the end face of the optical chip coupler of the optoelectronic chip component 1.
[0026] As Figure 1 shown, in this embodiment, the optoelectronic chip component 1 includes an optical chip, an electrical chip, an electrical connection layer for interconnecting the optical chip and the electrical chip, and bottom solder balls. The optoelectronic chip component 1 is fixed on the silicon photonics optical engine substrate 2 by gluing or soldering, and the bottom surface of the silicon photonics optical engine substrate 2 is attached to one side of the optical chip in the optoelectronic chip component 1; the silicon photonics optical engine substrate 2 also functions to dissipate heat from the optoelectronic chip component 1.
[0027] In this embodiment, the preferred material of the silicon photonics optical engine substrate 2 is tungsten copper, which is used for fixing the optoelectronic chip component 1 and the optical fiber array plug 3, as well as positioning and heat dissipation of the two relative to the silicon photonics optical engine substrate 2.
[0028] As Figure 7As shown, in this embodiment, the coupling lens 8 is fixed on the bottom surface of the silicon photonic light engine substrate 2 or integrated into the end face of the silicon photonic chip coupler of the optoelectronic chip assembly 1 by photolithography. Further, the coupling lens 8 is directly fixed on the silicon photonic light engine substrate 2 by using active coupling alignment and gluing or soldering. By directly integrating the lens into the end face of the coupler through photolithography, complex active coupling of the lens can be omitted.
[0029] As Figure 7 shown, preferably in this embodiment, the coupling lens 8 can be bonded or soldered on the bottom surface of the silicon photonic light engine substrate 2; the bottom surface of the coupling lens 8 is bonded to the bottom surface of the silicon photonic light engine substrate 2. The silicon photonic light engine substrate 2 also functions as a heat sink. After the optoelectronic chip assembly 1 and the coupling lens 8 are fixed on the silicon photonic light engine substrate 2, the outgoing light of the optoelectronic chip assembly 1 becomes collimated light after passing through the coupling lens 8.
[0030] As Figure 7 shown, in the silicon photonic light engine of this embodiment, at the transmitting end of the silicon photonic light engine, the horizontal outgoing light of the optoelectronic chip assembly 1 becomes collimated light after passing through the coupling lens 8. The first lens 31 disposed in the fiber array plug 3 focuses the collimated light from the coupling lens 8 onto the array fiber 5 disposed in the fiber array plug 3, and the array fiber 5 is connected to an external transmission fiber. Further, in this embodiment, the array fiber 5 is connected to the transmission fiber through a fiber interface, such as: MPO / MTP / SN-MT, etc.
[0031] As Figure 7 shown, at the receiving end of the silicon photonic light engine, the externally input optical signal enters the array fiber 5 in the fiber array plug 3, is converted into collimated light by the first lens 31 disposed in the fiber array plug 3, and the collimated light is incident on the coupling lens 8 and then focused into the coupler waveguide of the silicon photonic chip in the optoelectronic chip assembly 1.
[0032] In this embodiment, the fiber array plug 3 is made of an injection molded part of optical resin with optical fibers inserted. There are a plurality of fiber holes in the array fiber injection molded part of the optical array plug that match the array fiber 5. The first lens 31 built into the fiber array plug 3 is disposed at the end face of the fiber array plug 3. The material of the first lens 31 can also be other materials such as glass or silicon.
[0033] In this embodiment, a second lens 32 can be disposed at the end face of the fiber array in the fiber array plug 3. The function of the lens system of the first lens 31 and the second lens 32 is to convert the divergent light from the fiber array 5 into collimated light, or to focus the collimated light from the coupling lens 8 onto the fiber array 5.
[0034] In this embodiment, the manufacturing method of the fiber array plug 3 with the array fiber 5 is known to those skilled in the art, and preferably, it is integrally injection molded with resin.
[0035] As Figure 6 and 7 shown, in this embodiment, the fiber array plug 3 is horizontally inserted into the silicon photonics optical engine substrate 2. The array optical fiber 5 is engaged with the positioning guide post 23 provided on the end face of the silicon photonics optical engine substrate 2 through the positioning guide hole 34 in the fiber array plug 3 to ensure the best coupling alignment between the first lens 31, the second lens 32 or the optical fiber end face and the optical chip.
[0036] The best coupling alignment means that the coupling lens 8 is coupled and mounted with the optoelectronic chip assembly 1, and the position of the coupling lens 8 on the bottom surface of the silicon photonics optical engine substrate 2 is adjusted so that the optical power of the light beam from the fiber array coupled into the optoelectronic chip assembly 1 through the coupling lens 8 is maximized, and the optical power of the light emitted from the optoelectronic chip assembly 1 entering the array optical fiber 5 in the fiber array plug through the coupling lens 8 is maximized.
[0037] As Figure 1 、 2 and 4 shown, in this embodiment, after the fiber array plug 3 is horizontally inserted into the silicon photonics optical engine substrate 2, it is fixed. Specifically: The guide hole of the fiber array plug 3 is aligned with the positioning guide post provided on the end face of the optical engine substrate and horizontally inserted into the slot of the silicon photonics optical engine substrate. At the same time, the elastic hooks 35 provided on both sides of the fiber array plug 3 are squeezed until the elastic hooks 35 completely enter the slots 36 on both sides of the slot provided on the end face of the silicon photonics optical engine substrate 2 and then released. The elastic hooks 35 are reset and snapped into the slots 36 to fix the fiber array plug.
[0038] When pulling out the fiber array plug 3, the elastic hooks 35 provided on both sides of the fiber array plug 3 are squeezed to disengage them from the slots 36 on both side walls of the slot of the optical engine substrate, and then the fiber array plug 3 is pulled out.
[0039] As Figure 5 shown, in this embodiment, a guiding and supporting structure is provided between the fiber array plug 3 and the slot of the silicon photonics optical engine substrate 2. Specifically, the guiding and supporting structure is a slider and chute structure. A chute 37 with a rectangular cross-section is provided on the side surface of the fiber array plug 3, and a slider 38 with a rectangular cross-section is protruded on the slot wall of the slot of the silicon photonics optical engine substrate 2.
[0040] This guiding and supporting structure plays a guiding role in the process of inserting the fiber array plug 3, and plays a supporting role for the fiber array plug 3 after the fiber array plug 3 is inserted in place.
[0041] As Figures 1 - 5As shown in the figure, in this embodiment, the silicon photonics optical engine substrate 2 is made of tungsten copper, and is used for fixing the optoelectronic chip assembly 1 and the fiber optic array plug 3, as well as positioning and heat dissipation of their positions relative to the silicon photonics optical engine substrate. A heat sink or a liquid cooling plate can be installed on the silicon photonics optical engine substrate 2 to further enhance the heat dissipation effect. In this embodiment, the optical engine is equipped with a heat sink 4, which is suitable for the scenario of single silicon photonics optical engine assembly. The heat sink can be configured together with the silicon photonics optical engine; when multiple silicon photonics optical engines need to be placed side by side or co-packaged with ASIC chips (such as switch chips, xPU chips, Memory), the silicon photonics optical engines do not need to be separately configured with heat sinks, and the equipment manufacturer will conduct unified overall design and installation of the heat sinks or liquid cooling plates for multiple optical engines according to the system structure requirements.
[0042] As Figure 7 shown in the figure, in this embodiment, the bottom surface of the coupling lens 8 is the fixed surface, which fits with the bottom surface of the silicon photonics optical engine substrate 2. The material of the coupling lens 8 is glass or silicon. A dust-proof cover plate 6 is installed on the outer periphery of the coupling lens 8, and the dust-proof cover plate 6 is fixed on the silicon photonics optical engine substrate 2 by screws.
[0043] In this embodiment, the dust-proof cover plate 6 covers the periphery of the coupling lens 8 on the bottom surface of the silicon photonics optical engine substrate 2, preventing dust from entering and covering the lens and the optical chip end face of the optoelectronic chip assembly 1 during long-term use, which affects the optical channel coupling efficiency and causes large insertion loss; considering that it is more convenient to remove the fiber optic array plug during the transportation, storage and installation of the optical engine, the dust-proof requirements of the optical port of the optical engine need to be considered when removing the fiber optic array plug. As Figure 8 shown in the figure. After removing the fiber optic array plug 3 from the optical engine, insert the dust-proof plug 10 into the slot of the optical engine substrate to play a dust-proof role. After the optical engine completes reflow soldering, remove the dust-proof plug and then reinsert the fiber optic array plug. The fiber optic array plug can use ordinary UV glue and optical resin and does not need to withstand high-temperature reflow soldering.
[0044] Embodiment 2
[0045] An assembly method for a horizontally pluggable silicon photonics optical engine includes the following steps: Step 1: Place the silicon photonics optical engine substrate 2 with the bottom surface facing up, and place the optoelectronic chip assembly 1 on the bottom surface of the silicon photonics optical engine substrate 2, aligning the coupler end face of the silicon photonics chip in the optoelectronic chip assembly 1 with the pre-marked positioning mark line on the bottom surface of the silicon photonics optical engine substrate 2, and fixing it; Step 2: Place the silicon photonics optical engine substrate 2 with the top surface facing up, connect the fiber optic array plug 3 provided with the array optical fiber 5 to the positioning guide posts 23 of the silicon photonics optical engine substrate 2 through the positioning guide holes 34, and fix it through the elastic hooks on both sides of the fiber optic array plug and the card slots 36 on the two inner side surfaces of the slot of the silicon photonics optical engine substrate 2; Step 3: With the bottom surface of the optical engine substrate facing upward, adjust the position of the coupling lens 8 on the bottom surface of the silicon photonics optical engine substrate 2, and perform the coupling alignment of the coupling lens 8 with the optoelectronic chip assembly 1 and the mounting on the bottom surface of the optical engine substrate. The steps are as follows: S31: Insert the array optical fiber 5 into the fiber array plug 3, connect the array optical fiber 5 in the fiber array plug 3 to an external light source and optical power meter; connect the optical engine test fixture to the bottom solder balls or bumps of the optoelectronic chip assembly 1, and then power on the optoelectronic chip assembly 1, the light source, and the optical power meter respectively. S32: Perform the coupling and mounting of the coupling lens 8 with the optoelectronic chip assembly 1, and adjust the position of the coupling lens 8 on the bottom surface of the silicon photonics optical engine substrate 2 to maximize the optical power of the light beam from the fiber array coupled into the optoelectronic chip assembly through the coupling lens system (coupling lens 8, first lens 31), and maximize the optical power of the light beam emitted from the optoelectronic chip assembly 1 entering the array optical fiber 5 in the fiber array plug through the lens system composed of the coupling lens 8 and the first lens 31, and fix the coupling lens 8 to the bottom surface of the silicon photonics optical engine substrate 2. Step 4: Separate the fiber array plug 3 provided with the array optical fiber from the silicon photonics optical engine substrate 2, insert the dust plug 10 into the silicon photonics optical engine substrate 2, and then place the combination of the optoelectronic chip assembly 1, the coupling lens 8, and the silicon photonics optical engine substrate 2 on the system substrate or circuit board and fix it by reflow soldering. Step 5: Remove the dust plug 10, re-insert the fiber array plug 3, insert the positioning guide post 23 of the silicon photonics optical engine substrate into the positioning guide hole 34 of the fiber array plug 3, and fix it to the silicon photonics optical engine substrate 2. Step 6: Fix the heat sink 4 to the silicon photonics optical engine substrate 2, and the assembly is completed.
[0046] Those skilled in the art can easily understand that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A horizontally pluggable silicon photonics optical engine, characterized in that The silicon photonics optical engine includes a photoelectric chip assembly (1), a silicon photonics optical engine substrate (2), an optical fiber array plug (3), an array optical fiber (5), and a coupling lens (8). The photoelectric chip assembly (1) is fixed to the bottom surface of the silicon photonics optical engine substrate (2). The coupling lens (8) is fixed to the bottom surface of the silicon photonics optical engine substrate (2) or to the end face of the silicon photonics chip coupler of the photoelectric chip assembly (1). The optical fiber array plug (3) is horizontally pluggable and connected to one end of the silicon photonics optical engine substrate (2). The array optical fiber (5) is arranged inside the optical fiber array plug (3). A first lens (31) is arranged at the end face of the array optical fiber inside the optical fiber array plug (3) to convert the divergent light beam from the array optical fiber (5) into a collimated light beam or to focus the collimated light beam from the coupling lens (8) onto the array optical fiber.
2. The horizontally pluggable silicon photonics optical engine according to claim 1, wherein The photoelectric chip assembly (1) is a silicon photonics optoelectronic hybrid packaging assembly. The silicon photonics chip side of the photoelectric chip assembly (1) is attached to the bottom surface of the silicon photonics optical engine substrate (2).
3. The horizontally pluggable silicon optical engine according to claim 1, characterized in that, At least two positioning guide holes (34) are arranged along the horizontal direction of the plugging and unplugging of the optical fiber array plug (3). The positioning guide holes (34) are cooperatively connected with the positioning guide posts (23) protruding from the end face of the silicon photonics optical engine substrate (2).
4. The horizontal pluggable silicon photonics optical engine according to claim 1, wherein A slot is arranged at one end face of the silicon photonics optical engine substrate (2).
5. The horizontally pluggable silicon photonic optical engine according to claim 4, wherein, Elastic hooks (35) are arranged on both sides of the optical fiber array plug (3) along the horizontal direction of the plugging and unplugging of the optical fiber array plug (3). Card slots (36) for engaging the elastic hooks (35) are concavely arranged on the two side walls of the slot on both sides of the slot.
6. The horizontal pluggable silicon optical engine according to claim 4, characterized in that, A guiding and supporting structure is also arranged between the optical fiber array plug (3) and the slot of the silicon photonics optical engine substrate (2).
7. The horizontally pluggable silicon photonics optical engine according to claim 4, characterized in that, The silicon photonics optical engine substrate is made of metal. A heat sink is also arranged on the top surface of the silicon photonics optical engine substrate. A dust plug (10) is pluggably arranged in the slot.
8. The horizontally pluggable silicon optical engine according to claim 1, characterized in that, The bottom surface of the coupling lens (8) is a fixed surface and serves as the surface for fitting with the optical engine substrate. The material of the coupling lens (8) is glass or silicon. A dust-proof cover plate (6) is installed on the outer periphery of the coupling lens (8).
9. The horizontal pluggable silicon photonic optical engine according to claim 1, characterized in that The photoelectric chip assembly (1) is fixed to the bottom surface of the silicon photonics optical engine substrate (2) by bonding or welding. The coupling lens (8) is fixed to the bottom surface of the silicon photonics optical engine substrate (2) by bonding or welding, or is fixed to the end face of the silicon photonics chip coupler of the photoelectric chip assembly by photolithography.
10. The assembling method of the horizontally pluggable silicon optical engine according to any one of claims 1-9, characterized in that It includes the following steps: Step 1: With the bottom surface of the silicon photonics optical engine substrate (2) facing upwards, place the photoelectric chip assembly (1) on the bottom surface of the silicon photonics optical engine substrate (2) so that the coupler end face of the silicon photonics chip in the photoelectric chip assembly (1) is aligned with the pre-marked positioning mark line on the bottom surface of the silicon photonics optical engine substrate (2), and fix it. Step 2: With the top surface of the silicon photonics optical engine substrate (2) facing upwards, connect the optical fiber array plug (3) provided with the array optical fiber (5) to the positioning guide posts (23) of the silicon photonics optical engine substrate (2) through the positioning guide holes (34), and fix it through the elastic hooks (35) on both sides of the optical fiber array plug (3) and the card slots (36) on the two inner side surfaces of the slot of the silicon photonics optical engine substrate (2). Step 3: With the bottom surface of the silicon photonics optical engine substrate (2) facing upward, place the coupling lens (8) on the bottom surface of the silicon photonics optical engine substrate, adjust the position of the coupling lens (8) on the bottom surface of the silicon photonics optical engine substrate (2), and perform the coupling of the coupling lens (8) with the optoelectronic chip assembly (1) and the mounting on the bottom surface of the optical engine substrate; Step 4: Separate the fiber array plug (3) provided with the array optical fiber (5) from the silicon photonics optical engine substrate (2), insert the dust plug (10) into the silicon photonics optical engine substrate (2), and then fix the combination formed by the optoelectronic chip assembly (1), the coupling lens (8), and the silicon photonics optical engine substrate (2) on the system substrate or circuit board through reflow soldering; Step 5: Remove the dust plug (10), re-insert the fiber array plug (3), and insert the positioning guide post (23) of the silicon photonics optical engine substrate (2) into the positioning guide hole (34) of the fiber array plug (3) and fix it to the silicon photonics optical engine substrate (2); Step 6: Fix the heat sink (4) to the silicon photonics optical engine substrate (2), and the assembly is completed.