Platform type constant temperature equipment suitable for semiconductor temperature calibration

Abstract

The invention discloses platform type constant temperature equipment suitable for semiconductor temperature calibration, and relates to the field of semiconductors, the platform type constant temperature equipment comprises an equipment main body, a heating control mechanism and a cooling control mechanism, an operation table is arranged above the equipment main body, a constant temperature calibration platform is embedded in the middle surface of the operation table, the heating control mechanism is arranged in the equipment main body, and the cooling control mechanism is arranged in the equipment main body. The heating control mechanism is arranged in the equipment body and used for controlling the constant-temperature calibration platform to heat, the cooling control mechanism is arranged in the equipment body and used for controlling the constant-temperature calibration platform to cool, and the heating control mechanism and the cooling control mechanism are supported and controlled by the supporting control mechanism. According to the invention, the structures for heating and cooling control are mutually independent, that is, the heating control mechanism and the cooling control mechanism independently control the semiconductor to perform heating or cooling, and the heating control mechanism and the cooling control mechanism can quickly respond to the temperature adjustment requirement without mutual influence, so that the efficiency and accuracy of the calibration process are improved, and the quality of the semiconductor product is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and particularly to a platform-type constant temperature device suitable for semiconductor temperature calibration. Background Art

[0002] During the semiconductor manufacturing and testing processes, temperature calibration is a crucial link to ensure product quality and performance. Precise temperature control directly affects the physical and electrical properties of semiconductor materials. Therefore, it is particularly important to use efficient and reliable constant temperature devices for temperature calibration.

[0003] Existing semiconductor temperature calibration devices usually use constant temperature baths or dry furnaces for temperature control calibration, and cannot perform large-scale calibration. Moreover, most of the existing constant temperature baths or dry furnaces integrate the heating control structure and the cooling control structure in the same area. Although this design simplifies the structure and operation of the device to a certain extent, it also brings many technical problems. The most significant problem is the mutual interference between the heating and cooling processes. In actual operation, the heating and cooling processes need to quickly and accurately adjust the temperature to meet the requirements of different semiconductor materials. However, since the heating and cooling control structures are in the same area, heat transfer interference is likely to occur when they work. When the heating device is working, the generated heat may affect the effect of the cooling device, resulting in a decrease in the cooling efficiency; vice versa, which significantly increases the response time of the entire calibration process and affects the accuracy and efficiency of calibration.

[0004] In addition, when the existing device switches the temperature mode (such as switching from the heating mode to the cooling mode), due to the mutual influence of the heating and cooling structures, the device may take a long time to stabilize to the target temperature, and even in some cases, temperature fluctuations occur, further affecting the reliability of calibration. This structural design leads to a reduction in temperature control accuracy, and in severe cases, it may lead to failure to achieve the expected calibration results, thereby affecting the performance of semiconductor products. Summary of the Invention

[0005] (I) Object of the Invention In view of this, the object of the present invention is to provide a platform-type constant temperature device suitable for semiconductor temperature calibration. In this device, the structures for heating and cooling control are independent of each other, that is, the heating control mechanism and the cooling control mechanism independently control the semiconductor to heat up or cool down. The two can quickly respond to the temperature adjustment requirements without affecting each other, thereby improving the efficiency and accuracy of the calibration process and ensuring the quality of semiconductor products.

[0006] (II) Technical Solution To achieve the above technical objectives, the present invention provides a platform-type constant temperature device suitable for semiconductor temperature calibration, which includes a device main body, above which there is an operating table. The upper surface of the operating table is inlaid with a constant temperature calibration platform, and above the operating table there is an adiabatic sealing box, and the adiabatic sealing box covers the constant temperature calibration platform; A heating control mechanism, which is arranged inside the device main body and is used to control the heating of the constant temperature calibration platform; A cooling control mechanism, which is arranged inside the device main body and is used to control the cooling of the constant temperature calibration platform; Among them, both the heating control mechanism and the cooling control mechanism are supported and controlled by a support control mechanism. The heating control mechanism and the cooling control mechanism can move to a first position and a second position under the control of the support control mechanism. The first position is: the heating control mechanism is horizontal, the cooling control mechanism is vertical, the upper part of the heating control mechanism is in contact with the constant temperature calibration platform, and the cooling control mechanism is separated from the constant temperature calibration platform, which is the heating working position. The second position is: the heating control mechanism is vertical, the cooling control mechanism is horizontal, the heating control mechanism is separated from the constant temperature calibration platform, and the upper part of the cooling control mechanism is in contact with the constant temperature calibration platform, which is the cooling working position.

[0007] As a further description of the above technical solution: the heating control mechanism and the cooling control mechanism are respectively located at symmetric positions on both sides below the constant temperature calibration platform.

[0008] As a further description of the above technical solution: there are two sets of the support control mechanism, and the two sets of the support control mechanism are respectively symmetrically installed inside the device main body. The support control mechanism includes: Two columns, which are vertically arranged; A flipping connecting plate, which is rotatably installed between the two columns; A position-changing control motor, which is installed outside one of the columns, and the output shaft of the position-changing control motor is connected to the rotating shaft of the flipping connecting plate, so that the position-changing control motor can control the rotation of the flipping connecting plate; Among them, the heating control mechanism and the cooling control mechanism are respectively installed on the flipping connecting plates of the two sets of support control mechanisms, so that the heating control mechanism and the cooling control mechanism can change positions following the rotation of the flipping connecting plate.

[0009] As a further description of the above technical solution: a guide groove is vertically formed at the top of the column, a sliding seat is slidably assembled in the guide groove, and both ends of the flipping connection plate are respectively rotatably installed inside the two columns on the inner side of the sliding seat, so that the flipping connection plate can follow the sliding seat and slide vertically within the range of the guide groove. A cylinder for pushing the sliding seat to move up and down is installed below the interior of the column. A docking space is provided below the bottom of the operation table and below the constant temperature calibration platform. The cooling control mechanism and the heating control mechanism can be lifted so that their upper surfaces are docked into the docking space and are attached to the bottom of the constant temperature calibration platform.

[0010] As a further description of the above technical solution: a connection plate is connected to the bottom of the sliding seat through a spring, and the front end of the piston rod of the cylinder is fixedly connected to the connection plate through a bolt.

[0011] As a further description of the above technical solution: fastening components are arranged at both ends of the docking space inside the equipment main body. The fastening components can fasten and fix the cooling control mechanism and the heating control mechanism when they are docked into the docking space. The fastening components include: A U-shaped frame, which is fixedly installed at the bottom of the operation table. A shaft body is rotatably installed inside the U-shaped frame. A fastening control motor is fixedly installed on one side of the U-shaped frame, and the output shaft of the fastening control motor is in transmission connection with the shaft body; A pressing plate, which is fixedly installed on the shaft body through a U-shaped connecting rod, so that the pressing plate can be controlled to rotate through the shaft body; Wherein, a pressure sensor is embedded on the surface of the pressing plate. When the fastening control motor operates, the pressing plate can be driven to rotate through the shaft body and the U-shaped connecting rod so that it reaches the locking position and the unlocking position.

[0012] As a further description of the above technical solution: the cooling control mechanism includes: A refrigerant bearing plate, one side of which is fixed on the flipping connection plate. A refrigerant channel for the circulation of the refrigerant medium is arranged inside the refrigerant bearing plate; A first heat conducting plate, which is embedded above the refrigerant bearing plate and covers the refrigerant channel; Wherein, the refrigerant channel adopts a continuous S-shaped structure.

[0013] As a further description of the above technical solution: the cooling control mechanism further includes a refrigerating machine, which is installed on the operation table. The refrigerating machine is respectively communicated with the refrigerant channel inside the refrigerant bearing plate through a refrigerant conduit and a refrigerant return pipe.

[0014] As a further description of the above technical solution: The temperature rising control mechanism includes a heat source bearing plate, one side of the heat source bearing plate is fixed on the flipping connecting plate, a heating coil is arranged inside the heat source bearing plate, a second heat conducting plate is embedded on the upper surface of the heat source bearing plate, and the second heat conducting plate covers the heating coil.

[0015] As a further description of the above technical solution: A first heat insulation partition frame is enclosed around the edge of the first heat conducting plate, a second heat insulation partition frame is enclosed around the edge of the second heat conducting plate, and a third heat insulation partition frame is enclosed around the edge of the constant temperature calibration platform. Among them, the first heat insulation partition frame, the second heat insulation partition frame and the third heat insulation partition frame are made of ceramic fiber.

[0016] In the above technical solution, a platform type constant temperature device suitable for semiconductor temperature calibration provided by the present invention is a platform type calibration, that is, a constant temperature calibration platform is used for semiconductor temperature calibration. Compared with traditional constant temperature baths or dry furnace calibrations, this device can calibrate the temperatures of multiple semiconductors simultaneously, with high calibration efficiency. And in this device, the structures for heating and cooling control are independent of each other, that is, the temperature rising control mechanism and the temperature dropping control mechanism independently control the semiconductor to rise or fall in temperature. The two can quickly respond to temperature adjustment requirements without affecting each other, thereby improving the efficiency and accuracy of the calibration process, ensuring the quality of semiconductor products. And through the structural design of the temperature rising control mechanism, the temperature dropping control mechanism and the support control mechanism, the temperature conduction and exchange efficiency of the temperature rising control mechanism and the temperature dropping control mechanism is high and fast when controlling the constant temperature calibration platform to rise and fall in temperature, further improving the speed and efficiency of semiconductor temperature calibration. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0018] Figure 1 It is a schematic diagram of the overall structure of a platform type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 2 It is a schematic diagram of the structure of another perspective of a platform type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 3 It is a schematic diagram of the installation structure of the constant temperature calibration platform in a platform type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 4Schematic diagram of the internal structure of a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 5 Installation schematic diagram of the cooling control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention Figure 1 ; Figure 6 Installation schematic diagram of the cooling control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention Figure 2 ; Figure 7 Schematic diagram of the cooling control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 8 Schematic diagram of the installation structure of the sliding seat in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 9 Schematic diagram of the connection structure between the sliding seat and the cylinder in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 10 Schematic diagram of the heating control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention; Figure 11 Schematic diagram of the fastening component structure in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention.

[0019] Description of the drawings: 1. Equipment main body; 2. Operating table; 200. Constant temperature calibration platform; 201. Third heat insulation partition frame; 202. Docking space; 3. Refrigerator; 300. Refrigerant conduit; 301. Refrigerant return pipe; 4. Adiabatic sealing box; 5. Heating control mechanism; 500. Heat source bearing plate; 501. Second heat insulation partition frame; 502. Second heat conducting plate; 503. Heating coil; 6. Support control mechanism; 600. Column; 601. Flipping connecting plate; 602. Cylinder; 603. Guide groove; 604. Sliding seat; 605. Displacement control motor; 606. Spring; 607. Connecting plate; 7. Cooling control mechanism; 700. Refrigerant bearing plate; 701. First heat conducting plate; 702. First heat insulation partition frame; 703. Refrigerant channel; 8. Fastening component; 800. U-shaped frame; 801. Fastening control motor; 802. Shaft body; 803. U-shaped connecting rod; 804. Pressure sensor; 805. Pressing plate. Detailed implementation manners

[0020] The following description is merely exemplary in nature and is not intended to limit the present disclosure, its applications, and uses. It should be understood that in all these drawings, the same or similar reference numerals indicate the same or similar parts and features. Each drawing only schematically shows the concept and principle of the embodiments of the present disclosure, and does not necessarily show the specific dimensions and their ratios of the embodiments of the present disclosure. In a specific part of a specific drawing, the relevant details or structures of the embodiments of the present disclosure may be illustrated in an exaggerated manner.

[0021] Embodiment 1 As Figures 1-7 shown, this embodiment provides a technical solution: a platform-type constant-temperature device applicable to semiconductor temperature calibration, including a device main body 1, a heating control mechanism 5, and a cooling control mechanism 7. Among them, an operating table 2 is provided above the device main body 1. A constant-temperature calibration platform 200 is embedded in the middle surface of the operating table 2. An adiabatic sealing box 4 is arranged above the operating table 2. The adiabatic sealing box 4 covers the constant-temperature calibration platform 200. The heating control mechanism 5 is arranged inside the device main body 1 and is used to control the constant-temperature calibration platform 200 to heat up. The cooling control mechanism 7 is arranged inside the device main body 1 and is used to control the constant-temperature calibration platform 200 to cool down; Both the heating control mechanism 5 and the cooling control mechanism 7 are supported and controlled by a support control mechanism 6. The heating control mechanism 5 and the cooling control mechanism 7 can be moved to a first position and a second position under the control of the support control mechanism 6. The first position is: the heating control mechanism 5 is horizontal, the cooling control mechanism 7 is vertical, the heating control mechanism 5 is in contact with the constant-temperature calibration platform 200 above, and the cooling control mechanism 7 is separated from the constant-temperature calibration platform 200, which is the heating working position. The second position is: the heating control mechanism 5 is vertical, the cooling control mechanism 7 is horizontal, the heating control mechanism 5 is separated from the constant-temperature calibration platform 200, and the cooling control mechanism 7 is in contact with the constant-temperature calibration platform 200 above, which is the cooling working position; Working principle: When the device is in use, first place the semiconductor to be calibrated above the constant-temperature calibration platform 200, then close the adiabatic sealing box 4, and then, according to the need for heating or cooling, control the heating control mechanism 5 and the cooling control mechanism 7 through the support control mechanism 6, so that the heating control mechanism 5 and the cooling control mechanism 7 are moved to the heating working position or the cooling working position, and then the semiconductor temperature calibration operation can be carried out; In summary: This device is a platform-type calibration, that is, the constant-temperature calibration platform 200 is used for semiconductor temperature calibration. Therefore, this device can calibrate the temperatures of multiple semiconductors at the same time, and the structures for heating and cooling control in this device are independent of each other, that is, the heating control mechanism 5 and the cooling control mechanism 7 independently control the semiconductor to heat up or cool down, and the two can quickly respond to the temperature adjustment requirements without affecting each other, thereby improving the efficiency and accuracy of the calibration process and ensuring the quality of semiconductor products.

[0022] Specifically, the heating control mechanism 5 and the cooling control mechanism 7 are respectively located at symmetric positions on both sides below the constant temperature calibration platform 200, so that the heating control mechanism 5 and the cooling control mechanism 7 do not interfere with each other when performing position conversion.

[0023] Specifically, as Figures 4-9 shown, in order to control the heating control mechanism 5 and the cooling control mechanism 7, in this embodiment, two sets of support control mechanisms 6 are provided. The two sets of support control mechanisms 6 are symmetrically installed inside the equipment main body 1. The support control mechanism 6 includes columns 600, a flipping connection plate 601 and a position conversion control motor 605. Among them, there are two columns 600, and the two columns 600 are vertically arranged. The flipping connection plate 601 is rotatably installed between the two columns 600. The position conversion control motor 605 is installed outside one of the columns 600. The output shaft of the position conversion control motor 605 is connected to the rotating shaft of the flipping connection plate 601, so that the position conversion control motor 605 can control the flipping connection plate 601 to rotate; The heating control mechanism 5 and the cooling control mechanism 7 are respectively installed on the flipping connection plates 601 of the two sets of support control mechanisms 6, so that the heating control mechanism 5 and the cooling control mechanism 7 can change their positions following the rotation of the flipping connection plate 601; Based on this, when it is necessary to control heating through the heating control mechanism 5, the cooling control mechanism 7 is in a vertical state and separated from the constant temperature calibration platform 200. The flipping connection plate 601 installed with the heating control mechanism 5 is driven and controlled by the position conversion control motor 605 to rotate to the horizontal position, that is, the position conversion control motor 605 operates, and drives the flipping connection plate 601 installed with the heating control mechanism 5 to rotate 90° through the rotating shaft, so that it rotates from the vertical state to the horizontal state. At this time, the upper part of the heating control mechanism 5 is in contact with the constant temperature calibration platform 200, and the constant temperature calibration platform 200 can be heated through the heating control mechanism 5. On the contrary, when it is necessary to control cooling through the cooling control mechanism 7, the flipping connection plate 601 installed with the heating control mechanism 5 is driven by the position conversion control motor 605 to rotate from the horizontal state to the vertical state and separated from the constant temperature calibration platform 200, while the flipping connection plate 601 installed with the cooling control mechanism 7 is driven and controlled by the position conversion control motor 605 to rotate to the horizontal position. At this time, the upper part of the cooling control mechanism 7 is in contact with the constant temperature calibration platform 200, and the constant temperature calibration platform 200 can be cooled through the cooling control mechanism 7. Therefore, there will be no mutual interference between the heating control mechanism 5 and the cooling control mechanism 7, ensuring the response efficiency of heating and cooling.

[0024] Specifically, as Figures 4-9As shown in the figure, in order to make the heat transfer faster during the process of the cooling control mechanism 7 and the heating control mechanism 5 controlling the temperature reduction or increase of the constant temperature calibration platform 200, in this embodiment, a guide groove 603 is vertically opened at the top of the column 600. A sliding seat 604 is slidably assembled in the guide groove 603. Both ends of the flipping connecting plate 601 are rotatably installed inside the two columns 600 on the inner side of the sliding seat 604, so that the flipping connecting plate 601 can slide vertically within the range of the guide groove 603 following the sliding seat 604. A cylinder 602 for pushing the sliding seat 604 to move up and down is installed below the interior of the column 600. A docking space 202 is provided at the bottom of the operating table 2 below the constant temperature calibration platform 200. The cooling control mechanism 7 and the heating control mechanism 5 can be lifted so that their upper surfaces are docked into the docking space 202 and are in contact with the bottom of the constant temperature calibration platform 200. Such a structural setting enables the cooling control mechanism 7 and the heating control mechanism 5 to respond faster when controlling the constant temperature calibration platform 200 to cool down or heat up.

[0025] Specifically, as Figures 4-9 shown, in order to further enhance the full contact between the cooling control mechanism 7 and the heating control mechanism 5 and the constant temperature calibration platform 200 when the cooling control mechanism 7 and the heating control mechanism 5 are docked into the docking space 202, in this embodiment, a connecting plate 607 is connected to the bottom of the sliding seat 604 through a spring 606. The front end of the piston rod of the cylinder 602 is fixedly connected to the connecting plate 607 through a bolt. Based on this, when the cylinder 602 pushes the sliding seat 604 to rise and the cooling control mechanism 7 and the heating control mechanism 5 are docked into the docking space 202, under the elastic force of the spring 606, the cooling control mechanism 7 and the heating control mechanism 5 can be in full contact with the constant temperature calibration platform 200, improving the temperature conduction speed and efficiency.

[0026] Specifically, as Figure 6 and Figure 11As shown in the figure, in order to ensure the stability of the cooling control mechanism 7 and the heating control mechanism 5 when they are docked to the docking space 202 and avoid component damage caused by excessive extrusion of the cooling control mechanism 7 and the heating control mechanism 5, in this embodiment, buckling components 8 are arranged at both ends of the docking space 202 inside the equipment main body 1. The buckling components 8 can buckle and fix the cooling control mechanism 7 and the heating control mechanism 5 when they are docked into the docking space 202. The buckling components 8 include a U-shaped frame 800 and a pressure plate 805. Among them, the U-shaped frame 800 is fixedly installed at the bottom of the operating table 2. A shaft body 802 is rotatably installed inside the U-shaped frame 800. A buckling control motor 801 is fixedly installed on one side of the U-shaped frame 800. The output shaft of the buckling control motor 801 is in transmission connection with the shaft body 802. The pressure plate 805 is fixedly installed on the shaft body 802 through a U-shaped connecting rod 803, so that the pressure plate 805 can be controlled to rotate through the shaft body 802. Specifically, in order to improve the buckling stability of the buckling component 8, multiple U-shaped frames 800 are provided in the buckling component 8. The multiple U-shaped frames 800 are arranged at equal intervals in the horizontal direction, and the shaft bodies 802 on the multiple U-shaped frames 800 are connected. The buckling control motor 801 is installed on the outermost U-shaped frame 800. When the cooling control mechanism 7 or the heating control mechanism 5 is docked to the docking space 202, the multiple U-shaped frames 800 in the buckling component 8 can simultaneously lock the edges of the cooling control mechanism 7 and the heating control mechanism 5, improving the stability of the cooling control mechanism 7 and the heating control mechanism 5, thereby improving the temperature conduction effect; A pressure sensor 804 is embedded on the surface of the pressure plate 805. When the fastening control motor 801 operates, the pressure plate 805 can be driven to rotate through the shaft body 802 and the U-shaped connecting rod 803, so that it reaches the locking position and the unlocking position. The locking position is that the pressure plate 805 fits against the bottom of the cooling control mechanism 7 or the heating control mechanism 5, and tightly fixes both ends of the cooling control mechanism 7 or the heating control mechanism 5. The unlocking position is that the pressure plate 805 is away from the cooling control mechanism 7 or the heating control mechanism 5, so that the cooling control mechanism 7 or the heating control mechanism 5 is unlocked. In this way, when the cooling control mechanism 7 and the heating control mechanism 5 are docked to the docking space 202, the stability of the cooling control mechanism 7 and the heating control mechanism 5 can be ensured. The pressure sensor 804 can sense the pressing force value of the pressure plate 805 on the cooling control mechanism 7 and the heating control mechanism 5, avoiding the situation that the components are damaged due to excessive extrusion of the cooling control mechanism 7 and the heating control mechanism 5, and then forming an "element independent protection mechanism", improving the service life of the equipment. Specifically, the pressure sensor 804 is connected to an external host device. The monitoring pressure threshold of the pressure sensor 804 is set through the host. The pressure sensor 804 transmits the pressure value to the host in real time. When the pressure value of the pressure sensor 804 reaches the threshold, the host controls the fastening control motor 801 to stop rotating. At the same time, when the cooling control mechanism 7 and the heating control mechanism 5 are docked to the docking space 202, the cooling control mechanism 7 and the heating control mechanism 5 can fully contact the constant temperature calibration platform 200, so as to improve the temperature conduction effect. In addition, it should be noted that: since the fastening assembly 8 can fasten and fix the cooling control mechanism 7 or the heating control mechanism 5 when it is docked to the docking space 202, the displacement control motor 605 used to control the rotation of the cooling control mechanism 7 or the heating control mechanism 5 can stop running, avoiding overheating damage caused by its long-term overpressure state, and thus ensuring its service life.

[0027] Embodiment 2 As Figures 1-7 shown, this embodiment provides a technical solution: on the basis of Embodiment 1, in order to achieve cooling control, the cooling control mechanism 7 includes a refrigerant bearing plate 700 and a first heat conducting plate 701. Among them, one side of the refrigerant bearing plate 700 is fixed on the flipping connecting plate 601. A refrigerant channel 703 for the circulation of the refrigerant medium is arranged inside the refrigerant bearing plate 700. The first heat conducting plate 701 is embedded above the refrigerant bearing plate 700 and covers the refrigerant channel 703; The refrigerant channel 703 adopts a continuous S-shaped structure. Based on this, when the refrigerant medium flows through the refrigerant channel 703, since the first heat conducting plate 701 is in direct contact with the constant temperature calibration platform 200, the refrigerant can exchange heat with the constant temperature calibration platform 200 to achieve the cooling control of the constant temperature calibration platform 200.

[0028] Specifically, the temperature reduction control mechanism 7 further includes a refrigerator 3, which is installed on the operating table 2. The refrigerator 3 is respectively connected to the refrigerant channel 703 inside the refrigerant carrier plate 700 through a refrigerant conduit 300 and a refrigerant return pipe 301 to form a circulation loop. That is, the refrigerator 3 introduces the refrigerant into the refrigerant channel 703 through the refrigerant conduit 300, and then returns to the refrigerator 3 through the refrigerant return pipe 301 to complete refrigeration. It should be noted that: the refrigerator 3 uses a Stirling refrigerator.

[0029] Specifically, as Figure 10 shown, in order to achieve temperature increase control, in this embodiment, the temperature increase control mechanism 5 includes a heat source carrier plate 500. One side of the heat source carrier plate 500 is fixed on the flipping connection plate 601. The heat source carrier plate 500 is internally provided with a heating coil 503. The upper surface of the heat source carrier plate 500 is embedded with a second heat conducting plate 502, and the second heat conducting plate 502 covers the heating coil 503. Therefore, when the heating coil 503 is heated, since the second heat conducting plate 502 is in direct contact with the constant temperature calibration platform 200, the heat can be directly conducted to the constant temperature calibration platform 200 to achieve temperature increase control of the constant temperature calibration platform 200.

[0030] Specifically, as Figure 3 、 Figure 4 、 Figure 6 、 Figure 10 shown, in order to reduce energy dissipation and affect the calibration effect of the equipment, in this embodiment, a first heat insulation partition frame 702 is enclosed around the edge of the first heat conducting plate 701, a second heat insulation partition frame 501 is enclosed around the edge of the second heat conducting plate 502, and a third heat insulation partition frame 201 is enclosed around the edge of the constant temperature calibration platform 200. Among them, the first heat insulation partition frame 702, the second heat insulation partition frame 501, and the third heat insulation partition frame 201 are made of ceramic fiber, so as to achieve the effect of preventing heat dissipation.

[0031] In the above text, the exemplary implementation modes of the solutions proposed in the present disclosure are described in detail with reference to the preferred embodiments. However, those skilled in the art can understand that, without departing from the concept of the present disclosure, various modifications and changes can be made to the above specific embodiments, and various combinations can be made to the various technical features and structures proposed in the present disclosure, without exceeding the protection scope of the present disclosure. The protection scope of the present disclosure is determined by the appended claims.

Claims

1. A platform type constant temperature device applicable to semiconductor temperature calibration, characterized in that, It includes a device main body (1), a heating control mechanism (5) and a cooling control mechanism (7). Above the device main body (1), there is an operation table (2), and a constant temperature calibration platform (200) is embedded in the middle surface of the operation table (2); the heating control mechanism (5) and the cooling control mechanism (7) are both supported and installed inside the device main body (1) through a support control mechanism (6) for alternately controlling the heating and cooling of the constant temperature calibration platform (200). The heating control mechanism (5) and the cooling control mechanism (7) can move to a first position and a second position under the control of the support control mechanism (6). The first position is: the heating control mechanism (5) is horizontal, the cooling control mechanism (7) is vertical, the upper part of the heating control mechanism (5) is in contact with the constant temperature calibration platform (200), and the cooling control mechanism (7) is separated from the constant temperature calibration platform (200) for the heating working position; the second position is: the heating control mechanism (5) is vertical, the cooling control mechanism (7) is horizontal, the heating control mechanism (5) is separated from the constant temperature calibration platform (200), and the upper part of the cooling control mechanism (7) is in contact with the constant temperature calibration platform (200) for the cooling working position.

2. The platform-type constant temperature device applicable to semiconductor temperature calibration according to claim 1, wherein Above the operation table (2), there is an adiabatic seal box (4). The adiabatic seal box (4) covers the constant temperature calibration platform (200), and the heating control mechanism (5) and the cooling control mechanism (7) are respectively located at symmetric positions on both sides below the constant temperature calibration platform (200).

3. A platform-type constant temperature device applicable to semiconductor temperature calibration according to claim 1, characterized in that, There are two sets of the support control mechanism (6). The two sets of the support control mechanism (6) are respectively symmetrically installed inside the device main body (1). The support control mechanism (6) includes: Columns (600), two of which are provided and are vertically arranged; A flipping connecting plate (601) which is rotatably installed between the two columns (600); A position-changing control motor (605) which is installed outside one of the columns (600). The output shaft of the position-changing control motor (605) is connected to the rotating shaft of the flipping connecting plate (601) so that the position-changing control motor (605) can control the flipping connecting plate (601) to rotate; Among them, the heating control mechanism (5) and the cooling control mechanism (7) are respectively installed on the flipping connecting plates (601) of the two sets of support control mechanisms (6) so that the heating control mechanism (5) and the cooling control mechanism (7) can change positions following the rotation of the flipping connecting plate (601).

4. A platform type constant temperature device applicable to semiconductor temperature calibration according to claim 3, characterized in that, A guide groove (603) is vertically formed at the top of the column (600). A sliding seat (604) is slidably assembled in the guide groove (603). Two ends of the flipping connection plate (601) are respectively rotatably installed on the inner sides of the sliding seats (604) in the two columns (600), so that the flipping connection plate (601) can slide vertically within the range of the guide groove (603) following the sliding seats (604). A cylinder (602) for pushing the sliding seat (604) to move up and down is installed below the interior of the column (600). A docking space (202) is provided below the bottom of the operation table (2) and below the constant temperature calibration platform (200). The cooling control mechanism (7) and the heating control mechanism (5) can be lifted so that their upper surfaces are docked into the docking space (202) and are in contact with the bottom of the constant temperature calibration platform (200).

5. A platform-type constant temperature device applicable to semiconductor temperature calibration according to claim 4, characterized in that, A connecting plate (607) is connected to the bottom of the sliding seat (604) through a spring (606). The front end of the piston rod of the cylinder (602) is fixedly connected to the connecting plate (607) through a bolt.

6. A platform-type constant temperature device applicable to semiconductor temperature calibration according to claim 5, characterized in that, Clamping assemblies (8) are arranged at both ends of the docking space (202) inside the equipment main body (1). When the cooling control mechanism (7) and the heating control mechanism (5) are docked into the docking space (202), the clamping assemblies (8) can clamp and fix them. The clamping assemblies (8) include: A U-shaped frame (800) which is fixedly installed at the bottom of the operation table (2). A shaft body (802) is rotatably installed inside the U-shaped frame (800). A clamping control motor (801) is fixedly installed on one side of the U-shaped frame (800). The output shaft of the clamping control motor (801) is in transmission connection with the shaft body (802). A pressure plate (805) which is fixedly installed on the shaft body (802) through a U-shaped connecting rod (803), so that the pressure plate (805) can be controlled to rotate through the shaft body (802). Among them, a pressure sensor (804) is embedded on the surface of the pressure plate (805). When the clamping control motor (801) operates, the pressure plate (805) can be driven to rotate through the shaft body (802) and the U-shaped connecting rod (803) so that it reaches the locking position and the unlocking position.

7. A platform type constant temperature device applicable to semiconductor temperature calibration according to any one of claims 3-6, characterized in that, The cooling control mechanism (7) includes: A refrigerant bearing plate (700) with one side fixed on the flipping connection plate (601). A refrigerant channel (703) for the circulation of the refrigerant medium is arranged inside the refrigerant bearing plate (700). A first heat conducting plate (701) which is embedded above the refrigerant bearing plate (700) and covers the refrigerant channel (703). Among them, the refrigerant channel (703) adopts a continuous S-shaped structure.

8. A platform-type constant temperature device applicable to semiconductor temperature calibration according to claim 7, characterized in that, The cooling control mechanism (7) further includes a refrigerator (3) installed on the operation table (2). The refrigerator (3) is respectively communicated with the refrigerant channel (703) inside the refrigerant bearing plate (700) through a refrigerant conduit (300) and a refrigerant return pipe (301).

9. A platform-type constant temperature device applicable to semiconductor temperature calibration according to claim 7, characterized in that, The temperature-raising control mechanism (5) includes a heat source bearing plate (500). One side of the heat source bearing plate (500) is fixed on the flipping connection plate (601). A heating coil (503) is provided inside the heat source bearing plate (500). A second heat conducting plate (502) is embedded in the upper surface of the heat source bearing plate (500), and the second heat conducting plate (502) covers the heating coil (503).

10. A platform-type constant temperature device applicable to semiconductor temperature calibration according to claim 9, characterized in that, A first heat insulation partition frame (702) is enclosed around the edge of the first heat conducting plate (701). A second heat insulation partition frame (501) is enclosed around the edge of the second heat conducting plate (502). A third heat insulation partition frame (201) is enclosed around the edge of the constant temperature calibration platform (200). Among them, the first heat insulation partition frame (702), the second heat insulation partition frame (501), and the third heat insulation partition frame (201) are made of ceramic fiber.

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