Method for determining optimal heat dissipation position of chip, electronic equipment and storage medium

Abstract

The invention discloses a method for determining the optimal heat dissipation position of a chip, electronic equipment and a storage medium. According to the technical scheme provided by the embodiment of the invention, flow field distribution is analyzed from a three-dimensional angle by means of speed simulation, n sections of circular sections are intercepted, the maximum wind speed absolute value of each circular section and the position of the spatial region where the maximum wind speed absolute value is located are extracted, and on the basis, the average surface speed of the equivalent area, equal to the windward side area of the chip, in each circular section is calculated, so that the average surface speed is calculated. The theoretical optimal heat dissipation position is deduced, so that the optimal solution can be accurately found; in addition, due to the fact that only the flow field is analyzed, accidental errors caused by the fact that a chip solid domain and a heat boundary analysis temperature field are added and iterative calculation errors caused by the fact that an energy equation is started are omitted, and the simulation efficiency is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip thermal simulation and analysis, and particularly to a method for determining the optimal heat dissipation position of a chip, an electronic device, and a storage medium. Background Art

[0002] For the forced air-cooling heat dissipation mode, there is currently no patent for the optimal heat dissipation position of chips. From the perspective of papers, the research directions are all based on the one-dimensional distance along the axis of the axial flow fan, that is, the distance between the air outlet of the fan and the center of the chip. However, since the windward area of the chip is generally much smaller than the cross-sectional area of the air outlet of the fan, and due to the hub and gas rotation effects after the axial flow fan discharges air, the flow field distribution in the cross-section is very uneven. This non-uniformity persists in the axial direction for a distance related to the hub diameter. Also, on the premise of a certain heat transfer area, the heat dissipation effect of the chip directly depends on the heat transfer coefficient. And on the premise of certain material properties and initial working conditions, the heat transfer coefficient ultimately depends on the average velocity of the windward surface of the chip, that is, the greater the average velocity, the greater the heat transfer coefficient, and the better the heat dissipation effect of the chip. Therefore, analyzing the distance-average wind speed correspondence relationship in the one-dimensional direction along the axis of the axial flow fan cannot determine the relative position of the maximum average wind speed, that is, the optimal heat dissipation position of the chip. Therefore, it is very valuable to analyze the distance-windward surface average velocity correspondence relationship between the air outlet of the fan and the center of the chip from a three-dimensional perspective. Summary of the Invention

[0003] The present invention provides a method for determining the optimal heat dissipation position of a chip, an electronic device, and a storage medium to solve the problem that in the prior art, based on the one-dimensional direction along the axis of the axial flow fan, analyzing the distance-average wind speed correspondence relationship cannot determine the optimal heat dissipation position of the chip and the optimal heat dissipation position is inaccurate.

[0004] According to one aspect of the present invention, a method for determining the optimal heat dissipation position of a chip is provided, including:

[0005] S1. In a simulation software, based on a pre-imported fan-chip simulation model, intercept n equal distances along the axis of the fan according to the hub diameter of the fan, and establish a circular cross-section identical to the cross-section of the air outlet of the fan at each distance;

[0006] S2. According to the wind speed distribution cloud map of each circular cross-section, identify the maximum wind speed region in each circular cross-section, and extract the absolute value of the maximum wind speed of the circular cross-section where each maximum wind speed region is located, and the spatial region position where each absolute value of the maximum wind speed is located;

[0007] S3. Starting from the i-th circular cross-section, respectively extract the first absolute value of the wind speed of the (i - 1)-th circular cross-section and the second absolute value of the wind speed of the (i + 1)-th circular cross-section that are in the same spatial region position as the spatial region position where the absolute value of the maximum wind speed of the i-th circular cross-section is located;

[0008] S4. Calculate the wind speed change rate of the \(i\)-th circular cross-section based on the absolute value of the maximum wind speed of the \(i\)-th circular cross-section, the absolute value of the first wind speed of the \((i - 1)\)-th circular cross-section, and the absolute value of the second wind speed of the \((i + 1)\)-th circular cross-section;

[0009] S5. Determine whether the wind speed change rate of the \(i\)-th circular cross-section is less than the preset wind speed change rate threshold. When the wind speed change rate of the \(i\)-th circular cross-section is less than the preset wind speed change rate threshold, let \(i = i + 1\) and execute S3 and its subsequent steps until the wind speed change rates of all \(n\) circular cross-sections are less than the preset wind speed change rate threshold;

[0010] S6. When the wind speed change rates of all \(n\) circular cross-sections are less than the preset wind speed change rate threshold, take an equivalent area equal to the windward area of the chip centered at the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located, and calculate the average surface velocity of each equivalent area;

[0011] S7. Determine the optimal heat dissipation position of the chip according to the average surface velocity; where \(i = n\), and both \(i\) and \(n\) are integers greater than or equal to 1.

[0012] Optionally, after S5. Determine whether the wind speed change rate of the \(i\)-th circular cross-section is less than the preset wind speed change rate threshold, it further includes:

[0013] When the wind speed change rate of the \(i\)-th circular cross-section is greater than or equal to the preset wind speed change rate threshold, then evenly add \(m / 2\) circular cross-sections between the \(i\)-th circular cross-section and the \((i - 1)\)-th circular cross-section, and between the \(i\)-th circular cross-section and the \((i + 1)\)-th circular cross-section, for a total of \(m\) circular cross-sections, and execute S2 and its subsequent steps until the wind speed change rate of the \(i\)-th circular cross-section is less than the preset wind speed change rate threshold; where \(m\) is an integer multiple of 2.

[0014] Optionally, after executing step S4, it further includes:

[0015] Record the duration and / or number of loop calculations, and determine whether the duration and / or the number of times reach the preset calculation duration limit and / or the preset calculation number limit;

[0016] If so, modify the preset wind speed change rate threshold, and execute S2 and its subsequent steps;

[0017] If not, execute S2 and its subsequent steps.

[0018] Optionally, S7. Determine the optimal heat dissipation position of the chip according to the average surface velocity includes:

[0019] Determine the spatial region position where the maximum average surface velocity value among the n + m average surface velocities is located as the optimal heat dissipation position of the chip.

[0020] Optionally, the step S4 of calculating the wind speed change rate of the i-th circular cross-section based on the absolute value of the maximum wind speed of the i-th circular cross-section, the absolute value of the first wind speed of the (i - 1)-th circular cross-section, and the absolute value of the second wind speed of the (i + 1)-th circular cross-section includes:

[0021] Respectively take the maximum value and the minimum value among the absolute value of the maximum wind speed of the i-th circular cross-section, the absolute value of the first wind speed of the (i - 1)-th circular cross-section, and the absolute value of the second wind speed of the (i + 1)-th circular cross-section;

[0022] Divide the difference obtained by subtracting the minimum value from the maximum value by the minimum value to calculate the wind speed change rate of the i-th circular cross-section.

[0023] Optionally, the step S6 of, when the wind speed change rates of the n circular cross-sections are all less than the preset wind speed change rate threshold, taking, with the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located as the center, equivalent areas equal to the windward area of the chip, and calculating the average surface velocity of each equivalent area includes:

[0024] When the wind speed change rates of the n circular cross-sections are all less than the preset wind speed change rate threshold, taking, with the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located as the center, equivalent areas equal to the windward area of the chip, and calculating the volume flow rate of the fluid passing through each equivalent area;

[0025] Divide the volume flow rate of each equivalent area by each equivalent area to calculate the average surface velocity of each equivalent area.

[0026] Optionally, the initial value of the preset wind speed change rate threshold can be preset according to empirical values.

[0027] According to another aspect of the present invention, there is provided an electronic device, the electronic device includes:

[0028] At least one processor; and

[0029] A memory communicatively connected to the at least one processor; wherein,

[0030] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for determining the optimal heat dissipation position of the chip according to any embodiment of the present invention.

[0031] According to another aspect of the present invention, there is provided a computer-readable storage medium storing computer instructions for causing a processor to implement the method for determining the optimal heat dissipation position of a chip according to any embodiment of the present invention when executed.

[0032] An embodiment of the present invention provides a method for determining the optimal heat dissipation position of a chip, an electronic device, and a storage medium. The method includes: S1. In a simulation software, based on a pre-imported fan-chip simulation model, intercept n equal distances along the axial direction of the fan according to the fan hub diameter, and establish a circular cross-section identical to the cross-section of the fan air outlet at each distance; S2. According to the wind speed distribution cloud map of each circular cross-section, identify the maximum wind speed region in each circular cross-section, and extract the absolute value of the maximum wind speed of the circular cross-section where each maximum wind speed region is located, and the spatial region position where each absolute value of the maximum wind speed is located; S3. Starting from the i-th circular cross-section, respectively extract the first wind speed absolute value of the (i - 1)-th circular cross-section and the second wind speed absolute value of the (i + 1)-th circular cross-section that are in the same spatial region position as the spatial region position where the absolute value of the maximum wind speed of the i-th circular cross-section is located; S4. Calculate the wind speed change rate of the i-th circular cross-section according to the absolute value of the maximum wind speed of the i-th circular cross-section, the first wind speed absolute value of the (i - 1)-th circular cross-section, and the second wind speed absolute value of the (i + 1)-th circular cross-section; S5. Determine whether the wind speed change rate of the i-th circular cross-section is less than a preset wind speed change rate threshold, and in the case where the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, let i = i + 1 and execute S3 and its subsequent steps until the wind speed change rates of all n circular cross-sections are less than the preset wind speed change rate threshold; S6. In the case where the wind speed change rates of all n circular cross-sections are less than the preset wind speed change rate threshold, take an equivalent area equal to the windward area of the chip centered on the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located, and calculate the average surface velocity of each equivalent area; S7. Determine the optimal heat dissipation position of the chip according to the average surface velocity; where i = n, and both i and n are integers greater than or equal to 1. The technical solution provided by the embodiment of the present invention, with the help of velocity simulation, analyzes the flow field distribution from a three-dimensional perspective. By intercepting n circular cross-sections, extracting the absolute value of the maximum wind speed of each circular cross-section and the spatial region position where it is located, and based on this, calculating the average surface velocity of the equivalent area equal to the windward area of the chip in each circular cross-section, and then deriving the theoretical optimal heat dissipation position, can not only accurately find the optimal solution; but also, due to only analyzing the flow field, eliminate the accidental error caused by adding the chip solid domain and heat boundary to analyze the temperature field and the iterative calculation error caused by enabling the energy equation, effectively improving the simulation efficiency.

[0033] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. Brief Description of the Drawings

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0035] Figure 1 It is a flowchart of a method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention;

[0036] Figure 2 It is a schematic diagram of the spatial structure position of an axial flow fan and a chip provided by an embodiment of the present invention;

[0037] Figure 3 It is a schematic diagram of the maximum wind speed of different circular cross-sections provided by an embodiment of the present invention;

[0038] Figure 4 It is a flowchart of another method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention;

[0039] Figure 5 It is a schematic diagram of a newly added circular cross-section provided by an embodiment of the present invention;

[0040] Figure 6 It is a schematic diagram of the structure of an electronic device for a method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention. Detailed Embodiments

[0041] To enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present invention are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0043] Figure 1 FIG. 4 is a flowchart of a method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention. This embodiment is applicable to determining the optimal heat dissipation position of a chip in a forced air-cooling heat dissipation mode. This method can be executed by a device for determining the optimal heat dissipation position of a chip, and this determining device can be implemented in the form of hardware and / or software, and this determining device can be configured in any electronic device with communication functions. Refer to Figure 1 , the method includes:

[0044] S1. In the simulation software, based on the pre-imported fan-chip simulation model, intercept n equal distances along the axial direction of the fan according to the hub diameter of the fan, and establish a circular cross-section identical to the cross-section of the fan outlet at each distance.

[0045] Among them, first refer to Figure 2 , Figure 2 FIG. 5 is a schematic diagram of the spatial structure positions of an axial fan and a chip provided by an embodiment of the present invention. p, q, and h respectively represent the length, width, and height distances from the center of the chip to the center of the fan outlet; the simulation software can adopt Computational Fluid Dynamics (CFD) software; the axial direction of the fan refers to the extension direction of the fan rotation axis, that is, the main flow direction of the fan air flow; the hub diameter refers to the diameter of the central hub to which the fan blades are connected; n equal distances refer to dividing the axial length of the fan into n segments according to the hub diameter, and the distance of each segment is the same. The larger the value of n, the higher the accuracy of finding the optimal heat dissipation position; and the initial value of each distance can be set according to the hub diameter. Assuming that the hub diameter is d and the distance in the n equal distances is a, d / a is the distance of each segment. When a = 1, that is, within a range of one hub diameter, the non-uniformity of the flow field is very obvious. Therefore, the larger the value of a, the faster the optimal heat dissipation position can be found. Generally, 2-5 can be taken first, and then appropriately increased according to the simulation results. For details, refer to Figure 3 , Figure 3It is a schematic diagram of the maximum wind speed of different circular cross-sections provided by the embodiments of the present invention. In the figure, d / a is each section of distance, and dn / a is the total distance value of n equal sections of distance. The air outlet cross-section refers to the cross-section at the outlet of the fan, usually circular.

[0046] Specifically, import the constructed "fan-chip" simulation model into the simulation software, determine the axial direction of the fan, usually the z-axis or the central axis of the coordinate system of the model, intercept n equal sections of distance along the axial direction of the fan according to the hub diameter of the fan. At the end points of each section of distance, establish a circular cross-section perpendicular to the axial direction of the fan. The diameter and shape of the cross-section are exactly the same as the air outlet cross-section of the fan, with a total of n circular cross-sections.

[0047] S2. According to the wind speed distribution cloud map of each circular cross-section, identify the maximum wind speed area in each circular cross-section, and extract the absolute value of the maximum wind speed of the circular cross-section where each maximum wind speed area is located, as well as the spatial area position where each absolute value of the maximum wind speed is located.

[0048] Specifically, the wind speed distribution cloud map of each circular cross-section will be automatically generated in the simulation software, visually displaying the wind speed of each point in each circular cross-section with a color gradient. The local area with the highest wind speed value in the circular cross-section usually corresponds to the area with the darkest color in the cloud map. Based on this, the maximum wind speed area in each circular cross-section can be identified, and the probe tool can be used to read the absolute values of the maximum wind speeds V1max, V2max, V3max........Vnmax of the circular cross-sections where each maximum wind speed area is located, and record the spatial area position corresponding to each absolute value of the maximum wind speed. Continue to refer to Figure 3 , Figure 3 The red vertical lines in

[0049] S3. Starting from the i-th circular cross-section, respectively extract the first wind speed absolute value of the (i - 1)-th circular cross-section and the second wind speed absolute value of the (i + 1)-th circular cross-section that are in the same spatial area position as the absolute value of the maximum wind speed of the i-th circular cross-section.

[0050] Exemplarily, continue to refer to Figure 3 , taking the 2nd circular cross-section as an example. As can be seen from the figure, the absolute value of the maximum wind speed of the 2nd circular cross-section is V2max. Based on the position where V2max is located, read the first wind speed absolute value of the 1st circular cross-section and the second wind speed absolute value of the 3rd circular cross-section that are in the same spatial area position as the absolute value of the maximum wind speed V2max of the 2nd circular cross-section, that is, V2.1 and V2.2 in the figure.

[0051] S4. Calculate the wind speed change rate of the $i$-th circular cross-section based on the absolute value of the maximum wind speed of the $i$-th circular cross-section, the absolute value of the first wind speed of the $(i - 1)$-th circular cross-section, and the absolute value of the second wind speed of the $(i + 1)$-th circular cross-section.

[0052] Specifically, compare the absolute value of the maximum wind speed of the $i$-th circular cross-section, the absolute value of the first wind speed of the $(i - 1)$-th circular cross-section, and the absolute value of the second wind speed of the $(i + 1)$-th circular cross-section, find the maximum and minimum values among the three, and calculate the wind speed change rate of the $i$-th circular cross-section based on the maximum and minimum values.

[0053] Exemplarily, taking the 2nd circular cross-section as an example, compare $V_{2max}$, $V_{2.1}$, and $V_{2.2}$, find the maximum and minimum values among $V_{2max}$, $V_{2.1}$, and $V_{2.2}$, divide the difference obtained by subtracting the minimum value from the maximum value by the minimum value to obtain the wind speed change rate of the 2nd circular cross-section.

[0054] S5. Determine whether the wind speed change rate of the $i$-th circular cross-section is less than the preset wind speed change rate threshold; if so, execute S6.

[0055] S6. Let $i = i + 1$.

[0056] Among them, the initial value of the preset wind speed change rate threshold can be preset according to empirical values. The preset wind speed change rate threshold is related to the windward area of the chip. The smaller the windward area, the larger the preset wind speed change rate threshold, and generally, it can be taken as $\leq 5\%$.

[0057] Specifically, determine whether the wind speed change rate of the $i$-th circular cross-section is less than the preset wind speed change rate threshold. If the wind speed change rate of the $i$-th circular cross-section is less than the preset wind speed change rate threshold, then let $i = i + 1$ and execute S3 and its subsequent steps, and so on until the wind speed change rates of all $n$ circular cross-sections are less than the preset wind speed change rate threshold.

[0058] Exemplarily, determine whether the wind speed change rate of the 1st circular cross-section is less than the preset wind speed change rate threshold. If the wind speed change rate of the 1st circular cross-section is less than the preset wind speed change rate threshold, then let $i = 2$ and execute S3 and its subsequent steps, and then determine whether the wind speed change rate of the 2nd circular cross-section is less than the preset wind speed change rate threshold, and so on until the wind speed change rates of all $n$ circular cross-sections are less than the preset wind speed change rate threshold.

[0059] S7. In the case where the wind speed change rates of all $n$ circular cross-sections are less than the preset wind speed change rate threshold, with the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located as the center, take equivalent areas equal to the windward area of the chip respectively, and calculate the average surface velocity of each equivalent area.

[0060] Among them, the definition of the average surface velocity is: in the wind field of an axial flow fan, the average surface velocity at a certain position refers to the average distance that the air flows through per unit time on a unit area perpendicular to the air flow direction at this position. For example, if 0.5 m 3 of gas passes through a plane with an area of 0.25 m 2 in 10.5 seconds, then the average surface velocity v- = 2 m / s. On the windward surface of the chip, the wind speed distribution is uneven. Only at the point of Vnmax, that is, Figure 3 the wind speed value at the red short line in is the largest, and the wind speed decreases towards both ends. The overall wind speed on the windward surface of the chip shows a trend of being large in the middle and small at both ends. During the calculation process of the simulation software, the average surface velocity can be obtained by integrating the linear velocity of an infinitesimal area and then performing a surface average. It can be understood that the area is evenly divided into an infinite number of infinitesimal areas, and the surface velocity of the infinitesimal area can be approximately replaced by the linear velocity. Then, the average of these infinite linear velocities can be calculated, which is the surface average velocity.

[0061] Specifically, continue to refer to Figure 3 , Figure 3 The red short vertical line in is the projection of the windward surface of the chip. The windward surface area of the chip is perpendicular to the wind speed, and the areas taken at each position are the same as the windward surface area of the chip. At each position of the maximum absolute wind speed Vnmax, that is, at the red short vertical line, an equivalent area equal to the windward surface area of the chip is taken, and the average surface velocity at this position is calculated in the simulation software. Each equivalent area equal to the windward surface area of the chip is centered on the spatial region position where the maximum absolute wind speed of each circular cross-section is located.

[0062] S8. Determine the optimal heat dissipation position of the chip according to the average surface velocity; where i = n, and both i and n are integers greater than or equal to 1.

[0063] Specifically, compare the average surface velocities of each equivalent area equal to the windward surface area of the chip, find the maximum average surface velocity among them, and determine the position where the maximum average surface velocity is located as the optimal heat dissipation position of the chip.

[0064] An embodiment of the present invention provides a method for determining the optimal heat dissipation position of a chip, an electronic device, and a storage medium. The method includes: S1. In a simulation software, based on a pre-imported fan-chip simulation model, intercept n equal-distance segments along the axial direction of the fan according to the fan hub diameter, and establish a circular cross-section identical to the fan outlet cross-section at each segment distance; S2. According to the wind speed distribution cloud map of each circular cross-section, identify the maximum wind speed region within each circular cross-section, and extract the absolute value of the maximum wind speed of the circular cross-section where each maximum wind speed region is located, and the spatial region position where each absolute value of the maximum wind speed is located; S3. Starting from the i-th circular cross-section, respectively extract the first wind speed absolute value of the (i - 1)-th circular cross-section and the second wind speed absolute value of the (i + 1)-th circular cross-section that are in the same spatial region position as the spatial region position where the absolute value of the maximum wind speed of the i-th circular cross-section is located; S4. According to the absolute value of the maximum wind speed of the i-th circular cross-section, the first wind speed absolute value of the (i - 1)-th circular cross-section, and the second wind speed absolute value of the (i + 1)-th circular cross-section, calculate the wind speed change rate of the i-th circular cross-section; S5. Determine whether the wind speed change rate of the i-th circular cross-section is less than a preset wind speed change rate threshold, and in the case where the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, let i = i + 1 and execute S3 and its subsequent steps until the wind speed change rates of all n circular cross-sections are less than the preset wind speed change rate threshold; S6. In the case where the wind speed change rates of all n circular cross-sections are less than the preset wind speed change rate threshold, with the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located as the center, respectively take an equivalent area equal to the windward area of the chip, and calculate the average surface velocity of each equivalent area; S7. Determine the optimal heat dissipation position of the chip according to the average surface velocity; where i = n, and both i and n are integers greater than or equal to 1. The technical solution provided by the embodiment of the present invention, with the help of velocity simulation, analyzes the flow field distribution from a three-dimensional perspective. By intercepting n circular cross-sections, extracts the absolute value of the maximum wind speed of each circular cross-section and the spatial region position where it is located, and based on this, calculates the average surface velocity of the equivalent area equal to the windward surface area of the chip within each circular cross-section, and then deduces the theoretical optimal heat dissipation position, which can not only accurately find the optimal solution, but also, in view of only analyzing the flow field, eliminates the accidental error caused by adding the chip solid domain and heat boundary to analyze the temperature field and the iterative calculation error caused by enabling the energy equation, effectively improving the simulation efficiency.

[0065] Figure 4 The flowchart of another method for determining the optimal heat dissipation position of a chip provided by the embodiment of the present invention further limits the foregoing embodiment on the basis of the above embodiment. Refer to Figure 4 , the method includes:

[0066] S10. In the simulation software, based on the pre-imported fan-chip simulation model, intercept n equal distances along the axial direction of the fan according to the fan hub diameter, and establish a circular cross-section identical to the cross-section of the fan air outlet at each distance.

[0067] S20. According to the wind speed distribution cloud map of each circular cross-section, identify the area with the maximum wind speed within each circular cross-section, and extract the absolute value of the maximum wind speed of the circular cross-section where each maximum wind speed area is located, as well as the spatial area position where each absolute value of the maximum wind speed is located.

[0068] S30. Starting from the i-th circular cross-section, respectively extract the first wind speed absolute value of the (i - 1)-th circular cross-section and the second wind speed absolute value of the (i + 1)-th circular cross-section that are in the same spatial area position as the spatial area position where the absolute value of the maximum wind speed of the i-th circular cross-section is located.

[0069] S40. Calculate the wind speed change rate of the i-th circular cross-section according to the absolute value of the maximum wind speed of the i-th circular cross-section, the first wind speed absolute value of the (i - 1)-th circular cross-section, and the second wind speed absolute value of the (i + 1)-th circular cross-section.

[0070] Optionally, step S40. Calculating the wind speed change rate of the i-th circular cross-section according to the absolute value of the maximum wind speed of the i-th circular cross-section, the first wind speed absolute value of the (i - 1)-th circular cross-section, and the second wind speed absolute value of the (i + 1)-th circular cross-section includes:

[0071] Take the maximum value and the minimum value respectively among the absolute value of the maximum wind speed of the i-th circular cross-section, the first wind speed absolute value of the (i - 1)-th circular cross-section, and the second wind speed absolute value of the (i + 1)-th circular cross-section; divide the difference obtained by subtracting the minimum value from the maximum value by the minimum value to calculate the wind speed change rate of the i-th circular cross-section.

[0072] S50. Determine whether the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold;

[0073] If so, execute S60; if not, execute S70.

[0074] S60. Let i = i + 1

[0075] S70. Uniformly add m / 2 circular cross-sections between the i-th circular cross-section and the (i - 1)-th circular cross-section, and between the i-th circular cross-section and the (i + 1)-th circular cross-section, for a total of m circular cross-sections, where m is an integer multiple of 2.

[0076] Specifically, when the wind speed change rate of the i-th circular cross-section is greater than or equal to the preset wind speed change rate threshold, add m / 2 circular cross-sections respectively between the two adjacent circular cross-sections before and after it, for a total of m circular cross-sections, that is, further subdivide each of the n equal distances intercepted initially.

[0077] Exemplarily, refer to Figure 5 , Figure 5 which is a schematic diagram of the newly added circular cross-section provided by the embodiment of the present invention. Still taking the circular cross-section where the absolute value of the maximum wind speed V2max is located as an example, when the wind speed change rate calculated based on V2max, V2.1, and V2.2 is greater than or equal to the preset wind speed change rate threshold, between the circular cross-section where the absolute value of the maximum wind speed V2max is located and the circular cross-section where the absolute value of the maximum wind speed V1max is located, and between the circular cross-section where the absolute value of the maximum wind speed V2max is located and the circular cross-section where the absolute value of the maximum wind speed V3max is located, 2 circular cross-sections are respectively and evenly added, as shown by the yellow line, and a total of 4 circular cross-sections are newly added. After adding the circular cross-sections, return to execute S20 and its subsequent steps until the wind speed change rate of the circular cross-section where the absolute value of the maximum wind speed V2max is located is less than the preset wind speed change rate threshold.

[0078] S80. When the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold, taking the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located as the center, respectively taking an equivalent area equal to the windward area of the chip, and calculating the average surface velocity of each equivalent area.

[0079] Optionally, step S80. When the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold, taking the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located as the center, respectively taking an equivalent area equal to the windward area of the chip, and calculating the average surface velocity of each equivalent area includes:

[0080] When the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold, taking the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located as the center, respectively taking an equivalent area equal to the windward area of the chip, and calculating the volume flow rate of the fluid passing through each equivalent area.

[0081] Specifically, in a wind field or a fluid field, calculating the average surface velocity through a specified surface S usually refers to calculating the average normal velocity component of the fluid passing through this surface. Its core idea is to average the component of the velocity vector in the normal direction of the surface over the entire surface.

[0082] Using the following formula to calculate the volume flow rate Q (unit: m³ / s) through the surface S:

[0083] ; where v represents the velocity vector (m / s) at a certain point in the flow field; dA represents the differential area vector on the surface S, and the direction is the normal direction of the surface; represents the product of the component of the velocity in the normal direction and the area.

[0084] Divide the volume flow rate of each equivalent area by each equivalent area to calculate the average surface velocity of each equivalent area.

[0085] Specifically, the average surface velocity is calculated using the following formula:

[0086] ; is the total area of the curved surface S, is the average normal velocity.

[0087] S90. Determine the optimal heat dissipation position of the chip based on the average surface velocity.

[0088] Optionally, step S90. Determine the optimal heat dissipation position of the chip based on the average surface velocity includes:

[0089] Determine the spatial region position where the maximum average surface velocity value among the n + m average surface velocities is located as the optimal heat dissipation position of the chip.

[0090] Specifically, among all the circular cross-sections, which include the initially intercepted n circular cross-sections and the subsequently added m circular cross-sections, that is, n + m circular cross-sections, compare the average surface velocities of the equivalent areas with equal windward surface areas of the chip in each circular cross-section, find the maximum value among them, and the spatial region position where this maximum average surface velocity value is located is the optimal heat dissipation position of the chip. Among them, the windward surface area refers to the area of a surface of an object perpendicular to the flow velocity in a flow field and in contact with the fluid first, which is called the windward surface area.

[0091] After step S40, it further includes:

[0092] S100. Record the duration and / or number of times of the iterative calculation.

[0093] Wherein, the iterative calculation here refers to the total duration and / or number of times of the iterative calculation when the wind speed change rate in the i-th circular cross-section is greater than the preset wind speed change rate threshold, and after subdividing each of the initially intercepted n equal distances, re-execute S20 to S40 to continue calculating the wind speed change rate of the i-th circular cross-section.

[0094] S110. Determine whether the duration and / or number of times reach the preset calculation duration limit and / or preset calculation number limit.

[0095] If so, execute S120, if not, execute S20.

[0096] S120. Modify the preset wind speed change rate threshold.

[0097] Specifically, in the process of judging whether the wind speed change rate of a circular cross-section is less than the preset wind speed change rate threshold, if the wind speed change rate of the circular cross-section is always greater than or equal to the preset wind speed change rate threshold, it is not always executed to add a new circular cross-section and repeatedly calculate its wind speed change rate. In order to avoid an infinite loop, the duration and / or number of loop calculations will be recorded during the calculation process. When the calculation duration reaches the preset calculation duration limit, and / or when the number of calculations reaches the preset calculation number limit, the simulation software will modify and adjust the preset wind speed change rate threshold.

[0098] The technical solution provided by the embodiment of the present invention can not only accurately find the optimal solution, but also eliminate the accidental errors caused by adding the chip solid domain and the thermal boundary analysis temperature field and the iterative calculation errors caused by enabling the energy equation, by a series of steps including intercepting n circular sections, identifying the maximum wind speed value and its spatial region position, refining the segmentation accuracy, and calculating the average surface velocity of the windward surface, thereby deriving the theoretical optimal heat dissipation position.

[0099] Figure 6 A schematic diagram of the structure of an electronic device for determining a method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0100] like Figure 6 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. The input / output (I / O) interface 15 is also connected to the bus 14.

[0101] Multiple components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disc, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0102] The processor 11 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a method for determining the optimal heat dissipation position of a chip.

[0103] In some embodiments, the method for determining the optimal heat dissipation position of a chip can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the method for determining the optimal heat dissipation position of a chip described above can be executed. Alternatively, in other embodiments, the processor 11 can be configured to execute the method for determining the optimal heat dissipation position of a chip in any other suitable way (e.g., by means of firmware).

[0104] The various embodiments of the systems and technologies described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs, which can be executed and / or interpreted on a programmable system including at least one programmable processor, the programmable processor can be a special or general programmable processor, can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0105] A computer program for implementing the method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general purpose computer, a special purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowchart and / or block diagram to be implemented. The computer programs can be executed entirely on the machine, partially on the machine, as a stand-alone software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0106] In the context of the present invention, a computer-readable storage medium can be a tangible medium that can contain or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer-readable storage medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, the computer-readable storage medium can be a machine-readable signal medium. More specific examples of the machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0107] In order to provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the electronic device. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, speech input, or tactile input).

[0108] The systems and techniques described herein can be implemented in a computing system including backend components (e.g., as a data server), or a computing system including middleware components (e.g., an application server), or a computing system including frontend components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described herein), or a computing system including any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected with each other by digital data communication in any form or medium (e.g., a communication network). Examples of communication networks include: local area network (LAN), wide area network (WAN), blockchain network, and the Internet.

[0109] A computing system can include a client and a server. The client and the server are generally remote from each other and typically interact through a communication network. The client-server relationship is created by computer programs running on respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system, solving the defects of difficult management and weak business scalability existing in traditional physical hosts and VPS services.

[0110] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitation is imposed herein.

[0111] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for determining the optimal heat dissipation position of a chip, characterized in that, Including: S1. In the simulation software, based on the pre-imported fan-chip simulation model, intercept n equal distances along the axial direction of the fan according to the fan hub diameter, and establish a circular cross-section identical to the fan outlet cross-section at each distance; S2. According to the wind speed distribution cloud map of each circular cross-section, identify the maximum wind speed area within each circular cross-section, and extract the absolute value of the maximum wind speed of the circular cross-section where each maximum wind speed area is located, as well as the spatial area position where each absolute value of the maximum wind speed is located; S3. Starting from the i-th circular cross-section, respectively extract the absolute value of the first wind speed of the (i - 1)-th circular cross-section and the absolute value of the second wind speed of the (i + 1)-th circular cross-section that are in the same spatial area position as the spatial area position where the absolute value of the maximum wind speed of the i-th circular cross-section is located; S4. Calculate the wind speed change rate of the i-th circular cross-section according to the absolute value of the maximum wind speed of the i-th circular cross-section, the absolute value of the first wind speed of the (i - 1)-th circular cross-section, and the absolute value of the second wind speed of the (i + 1)-th circular cross-section; S5. Determine whether the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold. If the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, let i = i + 1 and execute S3 and its subsequent steps until the wind speed change rates of all n circular cross-sections are less than the preset wind speed change rate threshold; S6. When the wind speed change rates of all n circular cross-sections are less than the preset wind speed change rate threshold, take an equivalent area equal to the windward area of the chip centered on the spatial area position where the absolute value of the maximum wind speed of each circular cross-section is located, and calculate the average surface velocity of each equivalent area; S7. Determine the optimal heat dissipation position of the chip according to the average surface velocity; where i = n, and both i and n are integers greater than or equal to 1.

2. The determination method according to claim 1, wherein After S5, that is, after determining whether the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, it further includes: If the wind speed change rate of the i-th circular cross-section is greater than or equal to the preset wind speed change rate threshold, then evenly add m / 2 circular cross-sections between the i-th circular cross-section and the (i - 1)-th circular cross-section, and between the i-th circular cross-section and the (i + 1)-th circular cross-section, for a total of m circular cross-sections, and execute S2 and its subsequent steps until the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold; where m is an even multiple value of 2.

3. The determination method according to claim 2, characterized in that, After executing S4, it further includes: Record the duration and / or number of loop calculations, and determine whether the duration and / or the number of times reach the preset calculation duration limit and / or the preset calculation number limit; If so, modify the preset wind speed change rate threshold, and execute S2 and its subsequent steps; If not, execute S2 and its subsequent steps.

4. The determination method according to claim 2, wherein S7. Determining the optimal heat dissipation position of the chip according to the average surface velocity includes: Determine the spatial area position where the maximum average surface velocity value among the n + m average surface velocities is located as the optimal heat dissipation position of the chip.

5. The determination method according to claim 1, wherein S4. Calculating the wind speed change rate of the i-th circular cross-section based on the absolute value of the maximum wind speed of the i-th circular cross-section, the absolute value of the first wind speed of the (i - 1)-th circular cross-section, and the absolute value of the second wind speed of the (i + 1)-th circular cross-section includes: Taking the maximum value and the minimum value respectively from the absolute value of the maximum wind speed of the i-th circular cross-section, the absolute value of the first wind speed of the (i - 1)-th circular cross-section, and the absolute value of the second wind speed of the (i + 1)-th circular cross-section; Dividing the difference obtained by subtracting the minimum value from the maximum value by the minimum value to calculate the wind speed change rate of the i-th circular cross-section.

6. The determination method according to claim 1, wherein S6. In the case where the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold, taking an equivalent area equal to the windward area of the chip centered on the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located, and calculating the average surface velocity of each equivalent area includes: In the case where the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold, taking an equivalent area equal to the windward area of the chip centered on the spatial region position where the absolute value of the maximum wind speed of each circular cross-section is located, and calculating the volume flow rate of the fluid passing through each equivalent area; Dividing the volume flow rate of each equivalent area by each equivalent area to calculate the average surface velocity of each equivalent area.

7. The determination method according to claim 2, wherein The initial value of the preset wind speed change rate threshold can be preset according to empirical values.

8. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for determining the optimal heat dissipation position of the chip according to any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing a processor to execute the method for determining the optimal heat dissipation position of the chip according to any one of claims 1-6 when executed.

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