Display screen cover plate structure and preparation method thereof

Abstract

According to the display screen cover plate structure and the preparation method thereof provided by the invention, the first hardening and buffering integrated layer and the second hardening and buffering integrated layer are formed by adopting an integrated forming process, so that the problem of stress concentration caused by a multi-layer stacked hardening layer and buffering layer structure in the prior art is effectively solved; according to the integrated design, the folding service life is prolonged, the reliability is improved, the production cost is reduced, the process complexity is reduced, in addition, the touch conducting layer is integrated on the UFG base material layer, the integrated design of the touch electrode and the cover plate is achieved, the overall thickness and weight of a display screen product are remarkably reduced, and the production cost is reduced. And the thickness of the UFG substrate layer in the non-folding area is larger than that of the UFG substrate layer in the folding area, so that the structure of the cover plate is further optimized, the overall flexibility of a display screen product is improved, and meanwhile, the folding performance of a double-folding display product is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of display device preparation, and particularly to a display screen cover plate structure and a preparation method thereof. Background Art

[0002] With the rapid development of electronic products (such as foldable mobile phones, tablet computers, etc.), the requirements for display screen cover plates are getting higher and higher. In the traditional display screen cover plate structure, the hardening layer and the buffer layer formed on ultra-thin glass (UTG, Ultra Thin Glass) usually adopt a multi-layer stacking structure. For example, a three-layer stacking process of OCA (optical adhesive) + CPI (polyimide) or TPU (thermoplastic polyurethane) + HC (hardening coating). Although this structure can meet certain requirements, there are many problems in foldable screen products: stress concentration is likely to occur during the folding process, resulting in material damage, affecting the folding life and reliability; the multi-layer stacking process requires multiple coating, curing and bonding steps, increasing the production cost and process complexity; it is difficult to balance the flexibility and wear resistance of traditional materials (such as CPI and TPU), and it is difficult to meet the requirements for high-performance materials in foldable screen products.

[0003] In addition, traditional display screen products generally have an externally mounted touch electrode plate, and the thickness of the traditional display screen cover plate is relatively large (usually not less than 400 microns), and the thickness of the externally mounted touch electrode plate is usually not less than 95 microns. Therefore, the total thickness of the traditional display screen cover plate and the externally mounted touch electrode plate is not less than 495 microns, resulting in a relatively large overall thickness and weight of the product, restricting the thin and light design of the display screen product. Especially in the context of the rapid development of foldable screen products, the limitations of the traditional display screen cover plate structure and preparation method are gradually emerging. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a display screen cover plate structure and a preparation method thereof, which are used to solve the problems of insufficient flexibility and complex process caused by the multi-layer stacked hardening layer and buffer layer structure in the existing display screen cover plate structure, and the problems of large thickness and heavy weight caused by the externally mounted touch electrode plate of the display screen device.

[0005] To achieve the above purpose and other related purposes, the present invention provides a display screen cover plate structure, which sequentially includes from the screen end to the client end: a first hardening and buffering integrated layer, a UFG substrate layer, a second hardening and buffering integrated layer, and an optical function layer; wherein, The UFG substrate layer has a first surface close to the screen end and a second surface close to the client side. The UFG substrate layer includes a folding area and two non-folding areas on two adjacent sides of the folding area. A folding groove is formed on the second surface of the UFG substrate layer in the folding area, so that the thickness of the UFG substrate layer in the non-folding area is greater than the thickness of the UFG substrate layer in the folding area; A touch conductive layer is formed on the first surface of the UFG substrate layer and / or on the second surface of the UFG substrate layer in the non-folding area.

[0006] Optionally, the thickness of the UFG substrate layer in the folding area is 30 µm to 70 µm, and the thickness of the UFG substrate layer in the non-folding area is 70 µm to 230 µm.

[0007] Optionally, the touch conductive layer includes a first touch conductive layer formed on the first surface of the UFG substrate layer and a second touch conductive layer formed on the second surface of the UFG substrate layer in the non-folding area, and a first wiring layer is formed at the outer edge of the surface of the first touch conductive layer close to the screen end, and a second wiring layer is formed at the outer edge of the surface of the second touch conductive layer close to the client side.

[0008] Further, the first wiring layer includes one of a silver paste layer, a copper layer, a copper alloy layer, and a molybdenum / lithium / molybdenum laminate, and the material of the second wiring layer is a black conductive material.

[0009] Further, the second touch conductive layer further includes a grid-shaped conductive layer formed on the bottom wall and the side wall of the folding groove.

[0010] Optionally, the touch conductive layer is formed on the first surface of the UFG substrate layer, and a third wiring layer is formed at the outer edge of the surface of the touch conductive layer close to the screen end.

[0011] Optionally, the material of the first hardening and buffering integrated layer includes at least one of acrylic acid and polyurethane, and at least one of silicon oxide and aluminum oxide; the material of the second hardening and buffering integrated layer includes at least one of acrylic acid and polyurethane, and at least one of silicon oxide and aluminum oxide.

[0012] Optionally, the folding groove is a trapezoidal groove that is larger at the top and smaller at the bottom in the direction from the screen end to the client side, and the falling angle of the folding groove is arc-shaped.

[0013] The present invention also provides a preparation method for a display screen cover plate structure, and the preparation method includes: S1. Provide a UFG substrate layer, where the UFG substrate layer has a first surface close to the screen end and a second surface close to the client side, and the UFG substrate layer includes a folding area and two non-folding areas on two adjacent sides of the folding area; S2. Form a folding groove on the second surface of the UFG substrate layer in the folding area, so that the thickness of the UFG substrate layer in the non-folding area is greater than the thickness of the UFG substrate layer in the folding area; S3. Form a touch conductive layer on the first surface of the UFG substrate layer and / or on the second surface of the UFG substrate layer in the non-folding area; S4. Use an integrated molding process to form a first hardening and buffering integrated layer on the surface of the obtained structure close to the screen end, and use an integrated molding process to form a second hardening and buffering integrated layer on the surface of the obtained structure close to the client side, which covers the second surface of the UFG substrate layer and fills the folding groove; S5. Form an optical functional layer on the surface of the second hardening and buffering integrated layer close to the client side.

[0014] Optionally, in step S3, a vapor deposition process or a magnetron sputtering process is used, combined with a photolithography and etching process to form the touch conductive layer, and the annealing temperatures of both the vapor deposition process and the magnetron sputtering process are lower than 100 °C.

[0015] Optionally, in step S4, a 3D printing process is used in combination with a curing treatment to form the first hardening and buffering integrated layer and the second hardening and buffering integrated layer.

[0016] Further, the solid content of the material used for the 3D printing process is 100%, and the method of the curing treatment is single UV curing.

[0017] Optionally, in step S3, the method of forming the touch conductive layer includes: S31. Form a first touch conductive layer on the first surface of the UFG substrate layer, and form a second touch conductive layer on the second surface of the UFG substrate layer in the non-folding area; S32. Form a first wiring layer at the outer edge of the surface of the first touch conductive layer close to the screen end, and form a second wiring layer at the outer edge of the surface of the second touch conductive layer close to the client side.

[0018] Further, in step S31, it also includes the step of forming a grid-shaped conductive layer on the bottom wall and side wall of the folding groove, and the grid-shaped conductive layer is in contact connection with the second touch conductive layer on the second surface of the UFG substrate layer in the non-folding area.

[0019] Optionally, in step S3, the method of forming the touch conductive layer includes: Form a third touch conductive layer on the first surface of the UFG substrate layer; Form a third wiring layer at the outer edge of the surface of the third touch conductive layer close to the screen end.

[0020] Optionally, after step S2, it further includes a step of performing laser micro-nano polishing or local etching treatment on the folding groove, so that the folding groove is a trapezoidal groove with a larger upper part and a smaller lower part in the direction from the screen end to the client end, and the falling angle of the folding groove is arc-shaped.

[0021] As described above, the display screen cover plate structure and its manufacturing method of the present invention have the following beneficial effects: By adopting an integrated molding process to form the first hardening and buffering integrated layer and the second hardening and buffering integrated layer, it effectively solves the problem of stress concentration caused by the structure of the hardening layer and the buffering layer stacked in multiple layers in the prior art. This integrated design not only improves the folding life and reliability, but also reduces the production cost and process complexity. In addition, by integrating the touch conductive layer on the UFG substrate layer, an integrated design of the touch electrode and the cover plate is realized, significantly reducing the overall thickness and weight of the display screen product, and further optimizing the structure of the cover plate by making the thickness of the UFG substrate layer in the non-folding area greater than that in the folding area, improving the overall flexibility of the display screen product, and at the same time improving the folding performance of the double-fold display product. Description of the Drawings

[0022] Figure 1 It shows a cross-sectional structure schematic diagram of the display screen cover plate structure of an example of the present invention.

[0023] Figure 2 It shows a cross-sectional structure schematic diagram of the display screen cover plate structure of another example of the present invention.

[0024] Figure 3 It shows a cross-sectional structure schematic diagram of the folding groove in the display screen cover plate structure of the present invention.

[0025] Figure 4 It shows a flow schematic diagram of the manufacturing method of the display screen cover plate structure of the present invention.

[0026] Description of Component Labels: 10 First hardening and buffering integrated layer, 11 UFG substrate layer, 12 Second hardening and buffering integrated layer, 13 Optical functional layer, 14 First touch conductive layer, 15 Second touch conductive layer, 16 First wiring layer, 17 Second wiring layer, 18 Third touch conductive layer, 19 Third wiring layer, 20 Folding groove, 30 Mesh-shaped conductive layer, 40 Falling angle, Steps S1 to S5. Detailed Embodiments

[0027] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0028] Please refer to Figures 1 to 4 . It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and proportion of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0029] This embodiment provides a display screen cover plate structure, as Figure 1 and Figure 2 shown. The cover plate structure successively includes from the screen end to the client end: a first hardening and buffering integrated layer 10, a UFG (Ultra Thin Flexible Glass) substrate layer 11, a second hardening and buffering integrated layer 12, and an optical function layer 13; wherein, The UFG substrate layer 11 has a first surface close to the screen end and a second surface close to the client end. The UFG substrate layer 11 includes a folding area and two non-folding areas located on two adjacent sides of the folding area. A folding groove 20 is formed on the second surface of the UFG substrate layer 11 in the folding area, so that the thickness of the UFG substrate layer 11 in the non-folding area is greater than the thickness of the UFG substrate layer 11 in the folding area; A touch conductive layer is formed on the first surface of the UFG substrate layer 11 and / or on the second surface of the UFG substrate layer 11 in the non-folding area.

[0030] The display screen cover plate structure of this embodiment effectively solves the problem of stress concentration caused by the multi-layer stacked hardening layer and buffering layer structure in the prior art by adopting the first hardening and buffering integrated layer and the second hardening and buffering integrated layer. This integrated design not only improves the folding life and reliability, but also reduces the production cost and process complexity. In addition, by integrating the touch conductive layer on the UFG substrate layer, the integrated design of the touch electrode and the cover plate is realized, significantly reducing the overall thickness and weight of the display screen product. And by making the thickness of the UFG substrate layer in the non-folding area greater than the thickness of the UFG substrate layer in the folding area, the structure of the cover plate is further optimized, improving the overall flexibility of the display screen product and at the same time enhancing the folding performance of the double-fold display product.

[0031] As an example, as Figure 1 andFigure 2 As shown, the thickness of the UFG substrate layer 11 in the folding area is 30 µm to 70 µm, and the thickness of the UFG substrate layer 11 in the non-folding area is 70 µm to 230 µm. Among them, the thinner folding area has higher flexibility and can achieve a smaller folding radius (folding R angle), thereby improving the folding performance of the folding screen product. The thicker non-folding area can provide sufficient structural strength and wear resistance to protect the folding screen product from external damage. The thickness of the UFG substrate layer 11 in the folding area can be selected according to the size of the folding R angle of the actual product. Specifically, when the folding R angle is small (for example, 1.0 mm), the thickness of the UFG substrate layer 11 in the folding area is, for example, 30 µm to achieve higher flexibility; when the folding R angle is large (for example, 4.5 mm), the selectable thickness is, for example, 70 µm to ensure sufficient structural strength, so that the display cover plate can maintain good performance at different folding R angles, effectively reducing stress concentration during the folding process and improving the folding life and reliability.

[0032] As an example, as Figure 1 and Figure 2 shown, the thickness of the first hardening buffer layer 10 is 4 µm to 10 µm, and the thickness of the second hardening buffer layer 12 is 15 µm to 25 µm. Among them, the thinner first hardening buffer integrated layer 10 helps to improve the overall flexibility of the display cover plate, enabling it to better adapt to the folding action. The thicker second hardening buffer integrated layer 12 helps to improve scratch and wear resistance from the client side and extends the service life of the product. The specific thicknesses of the first hardening buffer integrated layer 10 and the second hardening buffer integrated layer 12 can be adjusted according to the design requirements of the actual folding R angle, and no excessive restrictions are imposed here.

[0033] The formation position of the touch conductive layer on the UTG substrate layer 11 can be adjusted according to the actual touch mode requirements. As an example, to achieve the mutual capacitance touch mode requirements, as Figure 1 shown, the touch conductive layer includes a first touch conductive layer 14 formed on the first surface of the UFG substrate layer 11 and a second touch conductive layer 15 formed on the second surface of the UFG substrate layer 11 in the non-folding area. And a first wiring layer 16 is formed at the outer edge of the surface of the first touch conductive layer 14 close to the screen end, and a second wiring layer 17 is formed at the outer edge of the surface of the second touch conductive layer 15 close to the client side. It should be noted here that the outer edge refers to the edge corresponding to the outer periphery of the UFG substrate layer 11.

[0034] ​Among them, the second touch conductive layer 15 is formed on the second surface of the UFG substrate layer 11 in the non-folding area. In addition, the second touch conductive layer 15 may or may not be formed on the second surface of the UFG substrate layer 11 in the folding area. Preferably, in this embodiment, the second touch conductive layer 15 is further provided with a grid-shaped conductive layer 30 formed on the bottom wall and side walls of the folding groove 20. While ensuring the signal transmission performance, the grid-shaped conductive layer 30 increases the flexibility of the second touch conductive layer 15, enabling it to better adapt to the folding action. It should be noted here that the width and spacing of the grid-shaped conductive layer 30 can be adjusted according to process conditions and folding requirements, which are not specifically shown here and are not overly limited.

[0035] The first wiring layer 16 is used to realize the control and feedback of the integrated circuit to the first touch conductive layer 14. As a further example, the first wiring layer 16 includes one of a silver paste layer, a copper layer, a copper alloy layer, and a molybdenum / lithium / molybdenum laminate. Using its relatively small resistivity, a relatively small circuit load can be achieved, reducing signal delay and loss. The material of the second wiring layer 17 is preferably a black conductive material, which can not only be used to realize the control and feedback of the integrated circuit to the second touch conductive layer 15, but also reduce the light leakage around the display screen product, especially on both sides of the display screen, improving the optical performance of the display screen product.

[0036] As a further example, the thickness of the first wiring layer 16 is less than 5 µm, the thickness of the second wiring layer 17 is less than 5 µm, the thickness of the first touch conductive layer 14 is less than 100 nm, and the thickness of the second touch conductive layer 14 is less than 100 nm, enabling it to ensure its normal electrical functions while achieving a relatively small integrated thickness and better flexibility.

[0037] As another example, to meet the requirements of a self-capacitive touch mode, the touch conductive layer can be formed on the first surface of the UFG substrate layer 11 or the second surface of the UFG substrate layer 11 in the non-folding area. Preferably, as Figure 2 shown, the touch conductive layer is formed on the first surface of the UFG substrate layer 11. Specifically, the formed touch conductive layer is a third touch conductive layer 18 to improve touch sensitivity and response speed, and a third wiring layer 19 is formed at the outer edge of the surface of the touch conductive layer close to the screen end.

[0038] The third wiring layer 19 is preferably made of a black conductive material, which can not only be used to realize the control and feedback of the integrated circuit to the third touch conductive layer 18, but also reduce the light leakage around the display screen, especially on both sides of the display screen, improving the optical performance of the display screen product.

[0039] As a further example, the thickness of the third wiring layer 19 is less than 5 µm, and the thickness of the touch conductive layer 18 is less than 100 nm, enabling it to ensure its normal electrical function while achieving a smaller integrated thickness and better flexibility.

[0040] As an example, the material of the first hardening buffer integrated layer 10 includes at least one of acrylic acid and polyurethane, and at least one of silicon oxide and aluminum oxide. The material of the second hardening buffer integrated layer 12 includes at least one of acrylic acid and polyurethane, and at least one of silicon oxide and aluminum oxide. By combining organic materials (acrylic acid and polyurethane) with inorganic materials (silicon oxide and aluminum oxide), it achieves a balance between hardness and flexibility, thereby improving the folding life and reliability. In addition, the materials of the first hardening buffer integrated layer 10 and the second hardening buffer integrated layer 12 can also be other organic materials and inorganic materials, which can be specifically selected according to actual needs and are not overly restricted here.

[0041] As an example, the display screen cover structure further includes a flexible printed circuit board (FPC, Flexible Printed Circuit), and the FPC is electrically connected to the touch conductive layer to achieve touch feedback for the display screen product.

[0042] As an example, as Figure 3 shown, the folding groove 20 is a trapezoidal groove that is larger at the screen end and smaller at the client end, and the falling angle 40 of the folding groove 20 is arc-shaped to reduce stress concentration caused by acute angle lines, improve the folding performance, and at the same time avoid optical interference, enhance visual consistency, and optimize light propagation caused thereby, thereby enhancing the overall optical performance.

[0043] This embodiment also provides a preparation method for the display screen cover structure for preparing the above-mentioned display screen cover structure, but it is not limited thereto, and other suitable preparation methods are also available. The foregoing content can be fully cited here, and for the sake of brevity, it will not be repeated hereinafter. As Figure 4 shown, the preparation method includes: S1, providing a UFG substrate layer, the UFG substrate layer having a first surface close to the screen end and a second surface close to the client end, and the UFG substrate layer including a folding area and two non-folding areas on both sides adjacent to the folding area; S2, forming a folding groove on the second surface of the UFG substrate layer in the folding area so that the thickness of the UFG substrate layer in the non-folding area is greater than the thickness of the UFG substrate layer in the folding area; S3, forming a touch conductive layer on the first surface of the UFG substrate layer and / or the second surface of the UFG substrate layer in the non-folding area; S4. A first integrated hardening and buffering layer is formed on the surface of the obtained structure near the screen end by using an integrated molding process, and a second integrated hardening and buffering layer that covers the second surface of the UFG substrate layer and fills the folding groove is formed on the surface of the obtained structure near the client side by using an integrated molding process; S5. An optical functional layer is formed on the surface of the second integrated hardening and buffering layer near the client side.

[0044] In the preparation method of the display screen cover plate structure of this embodiment, by using an integrated molding process to form the first integrated hardening and buffering layer and the second integrated hardening and buffering layer, the problem of stress concentration caused by the multi-layer stacked hardening layer and buffering layer structure in the prior art is effectively solved. This integrated design not only improves the folding life and reliability, but also reduces the production cost and process complexity. In addition, by integrating the touch conductive layer on the UFG substrate layer, the integrated design of the touch electrode and the cover plate is realized, significantly reducing the overall thickness and weight of the display screen product. And by making the thickness of the UFG substrate layer in the non-folding area greater than that in the folding area, the structure of the cover plate is further optimized, improving the overall flexibility of the display screen product and at the same time enhancing the folding performance of the double-fold display product.

[0045] The following Figures 1 to 3 will be a detailed description of the preparation method of the display screen cover plate structure of this embodiment.

[0046] As an example, in step S1, the formation method of the UFG substrate layer 11 generally includes steps of thinning, edge grinding and strengthening treatment of the UFG raw material; among them, the thickness of the UFG raw material is generally relatively large, for example, greater than 230 µm.

[0047] As an example, in step S2, the folding groove 20 can be formed by using a photolithography etching process. Preferably, as Figure 3 shown, in this embodiment, after step S2, it further includes a step of laser micro-nano polishing or local etching treatment of the folding groove 20, so that the folding groove 20 is a trapezoidal groove with a larger upper part and a smaller lower part in the direction from the screen end to the client side, and the falling angle 40 of the folding groove 20 is arc-shaped, so as to reduce the stress concentration caused by acute angle lines, improve the folding performance, and at the same time avoid the resulting optical interference, enhance the visual consistency, optimize the light propagation, thereby improving the overall optical performance.

[0048] As an example, in step S3, an evaporation coating process or a magnetron sputtering process can be adopted, and combined with a photolithography etching process to form the touch conductive layer. In this embodiment, the evaporation coating process and the magnetron sputtering process preferably adopt a low-temperature film-forming process, and the annealing temperatures of the evaporation coating process and the magnetron sputtering process are both lower than 100°C. The evaporation coating process at a lower temperature can significantly reduce the yellowing of the touch conductive layer material, maintain the high transparency and color accuracy of the display product, and at the same time reduce the stress concentration of the UTG substrate layer, thereby reducing the risk of its cracking. For example, in other embodiments, when high-temperature annealing (280°C) is adopted, the cracking rate of the UTG substrate layer increases by at least 40% compared with the lower annealing temperature in this embodiment.

[0049] As an example, in step S4, a 3D printing process is combined with a curing treatment to form the first hardening buffer integrated layer 10 and the second hardening buffer integrated layer 12. Among them, the method of the curing treatment includes one of single UV curing, single thermal curing, and dual curing of UV curing and thermal curing, so that the first hardening buffer integrated layer 10 and the second hardening buffer integrated layer 12 take into account high hardness and high flexibility. The specific curing method can be selected according to specific materials and scenario requirements, and no excessive restrictions are made here.

[0050] As a further example, the solid content of the material used for the 3D printing process is preferably 100%, and the method of the curing treatment is preferably single UV curing, so that the material can be quickly cross-linked and cured without additional heat sources, reducing or even avoiding safety accidents caused by solvent volatilization.

[0051] Generally speaking, the optical functional layer 13 specifically includes an anti-glare (Anti-Glare), anti-reflection (Anti-Reflection), and anti-fingerprint (Anti-Fingerprint) layer. As an example, in step S5, a 3D printing process can be adopted to form the optical functional layer. The overall thickness of the formed optical functional layer is generally less than 5 µm, for example, about 1 µm, so that it has better flexibility, increases the design space of the folding R angle, and improves the production efficiency at the same time.

[0052] The formation position of the touch conductive layer on the UTG substrate layer 11 can be adjusted according to actual touch mode requirements. As an example, as Figure 1 shown, in order to meet the mutual capacitance touch mode requirements, in step S3, the method of forming the touch conductive layer includes: S31. On the first surface of the UFG substrate layer 11, a first touch conductive layer 14 is formed. On the second surface of the UFG substrate layer 11 in the non-folding area, a second touch conductive layer 15 is formed. In addition, on the second surface of the UFG substrate layer 11 in the folding area, the second touch conductive layer 15 may or may not be formed. Preferably, this step further includes the step of forming a grid-shaped conductive layer 30 on the bottom wall and side walls of the folding groove 20. The grid-shaped conductive layer 30 is in contact connection with the second touch conductive layer 15 on the second surface of the UFG substrate layer 11 in the non-folding area. While ensuring the signal transmission performance, the grid-shaped conductive layer 30 can increase the flexibility of the second touch conductive layer 15, enabling it to better adapt to the folding action.

[0053] S32. At the outer edge of the surface of the first touch conductive layer 14 close to the screen end, a first wiring layer 16 is formed. At the outer edge of the surface of the second touch conductive layer 15 close to the client end, a second wiring layer 17 is formed. Among them, the first wiring layer 16 can be formed by a screen printing process or a magnetron sputtering process combined with a photolithography etching process. Preferably, in this embodiment, the first wiring layer 16 is formed by a magnetron sputtering process combined with a photolithography etching process. The material of the first wiring layer 16 is copper, and the thickness of the formed first wiring layer is less than 1000 angstroms, so that the UFG substrate layer 11 has better flexibility and reduces the risk of its rupture.

[0054] As another example, to meet the self-capacitive touch mode requirement, the touch conductive layer can be formed on the first surface of the UFG substrate layer 11 or on the second surface of the UFG substrate layer 11 in the non-folding area. Preferably, as Figure 2 shown, in step S3, the method of forming the touch conductive layer includes: S31. On the first surface of the UFG substrate layer 11, a third touch conductive layer 18 is formed to improve touch sensitivity and response speed.

[0055] S32. At the outer edge of the surface of the third touch conductive layer 18 close to the screen end, a third wiring layer 19 is formed.

[0056] In summary, for the display cover plate structure and its preparation method of the present invention, by adopting an integrated molding process to form the first hardening and buffering integrated layer and the second hardening and buffering integrated layer, the problem of stress concentration caused by the structure of the hardening layer and the buffering layer stacked in multiple layers in the prior art is effectively solved. This integrated design not only improves the folding life and reliability, but also reduces the production cost and process complexity. In addition, by integrating the touch conductive layer on the UFG substrate layer, the integrated design of the touch electrode and the cover plate is realized, significantly reducing the overall thickness and weight of the display product. By making the thickness of the UFG substrate layer in the non-folding area greater than that in the folding area, the structure of the cover plate is further optimized, improving the overall flexibility of the display product and at the same time enhancing the folding performance of the double-fold display product. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0057] The above embodiments are only illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A display screen cover plate structure, characterized in that, The cover plate structure successively includes, from the screen end to the client end: a first hardened buffer integrated layer, a UFG substrate layer, a second hardened buffer integrated layer, and an optical functional layer; wherein, The UFG substrate layer has a first surface close to the screen end and a second surface close to the client end. The UFG substrate layer includes a folding area and two non-folding areas on two sides adjacent to the folding area. A folding groove is formed on the second surface of the UFG substrate layer in the folding area, so that the thickness of the UFG substrate layer in the non-folding area is greater than that of the UFG substrate layer in the folding area; A touch conductive layer is formed on the first surface of the UFG substrate layer and / or on the second surface of the UFG substrate layer in the non-folding area.

2. The display screen cover plate structure according to claim 1, wherein: The thickness of the UFG substrate layer in the folding area is 30 µm to 70 µm, and the thickness of the UFG substrate layer in the non-folding area is 70 µm to 230 µm.

3. The display screen cover plate structure according to claim 1, wherein: The touch conductive layer includes a first touch conductive layer formed on the first surface of the UFG substrate layer and a second touch conductive layer formed on the second surface of the UFG substrate layer in the non-folding area. And a first wiring layer is formed at the outer edge of the surface of the first touch conductive layer close to the screen end, and a second wiring layer is formed at the outer edge of the surface of the second touch conductive layer close to the client end.

4. The display screen cover plate structure according to claim 3, characterized in that: The first wiring layer includes one of a silver paste layer, a copper layer, a copper alloy layer, and a molybdenum / lithium / molybdenum laminate, and the material of the second wiring layer is a black conductive material.

5. The display screen cover plate structure according to claim 3, characterized in that: The second touch conductive layer further includes a grid-shaped conductive layer formed on the bottom wall and side walls of the folding groove.

6. The display screen cover plate structure according to claim 1, characterized in that: The touch conductive layer is formed on the first surface of the UFG substrate layer, and a third wiring layer is formed at the outer edge of the surface of the touch conductive layer close to the screen end.

7. The display screen cover plate structure according to claim 1, wherein: The material of the first hardened buffer integrated layer includes at least one of acrylic and polyurethane, and at least one of silicon oxide and aluminum oxide; the material of the second hardened buffer integrated layer includes at least one of acrylic and polyurethane, and at least one of silicon oxide and aluminum oxide.

8. The display screen cover plate structure according to claim 1, characterized in that: The folding groove is a trapezoidal groove that is larger at the top and smaller at the bottom in the direction from the screen end to the client end, and the falling angle of the folding groove is arc-shaped.

9. A preparation method of a display screen cover plate structure, characterized in that, The preparation method includes: S1, providing a UFG substrate layer, the UFG substrate layer has a first surface close to the screen end and a second surface close to the client end, and the UFG substrate layer includes a folding area and two non-folding areas on two sides adjacent to the folding area; S2, forming a folding groove on the second surface of the UFG substrate layer in the folding area, so that the thickness of the UFG substrate layer in the non-folding area is greater than that of the UFG substrate layer in the folding area; S3, forming a touch conductive layer on the first surface of the UFG substrate layer and / or on the second surface of the UFG substrate layer in the non-folding area; S4. A first hardening and buffering integrated layer is formed on the surface of the obtained structure near the screen end by an integrated molding process, and a second hardening and buffering integrated layer that covers the second surface of the UFG substrate layer and fills the folding groove is formed on the surface of the obtained structure near the client side by an integrated molding process; S5. An optical functional layer is formed on the surface of the second hardening and buffering integrated layer near the client side.

10. The preparation method of the display screen cover plate structure according to claim 9, characterized in that: In step S3, the touch conductive layer is formed by a vapor deposition process or a magnetron sputtering process in combination with a photolithography and etching process, and the annealing temperatures of both the vapor deposition process and the magnetron sputtering process are lower than 100 °C.

11. The preparation method of the display screen cover plate structure according to claim 9, characterized in that: In step S4, the first hardening and buffering integrated layer and the second hardening and buffering integrated layer are formed by a 3D printing process in combination with a curing treatment.

12. The preparation method of the display screen cover plate structure according to claim 11, characterized in that: The solid content of the material used for the 3D printing process is 100%, and the method of the curing treatment is single UV curing.

13. The manufacturing method of the display screen cover plate structure according to claim 9, characterized in that, In step S3, the method for forming the touch conductive layer includes: S31. A first touch conductive layer is formed on the first surface of the UFG substrate layer, and a second touch conductive layer is formed on the second surface of the UFG substrate layer in the non-folding area; S32. A first wiring layer is formed at the outer edge of the surface of the first touch conductive layer near the screen end, and a second wiring layer is formed at the outer edge of the surface of the second touch conductive layer near the client side.

14. The preparation method of the display screen cover plate structure according to claim 13, characterized in that: In step S31, the step of forming a grid-shaped conductive layer on the bottom wall and side wall of the folding groove is further included, and the grid-shaped conductive layer is in contact connection with the second touch conductive layer on the second surface of the UFG substrate layer in the non-folding area.

15. The preparation method of the display screen cover plate structure according to claim 9, characterized in that, In step S3, the method for forming the touch conductive layer includes: A third touch conductive layer is formed on the first surface of the UFG substrate layer; A third wiring layer is formed at the outer edge of the surface of the third touch conductive layer near the screen end.

16. The preparation method of the display screen cover plate structure according to claim 9, characterized in that: After step S2, the step of performing laser micro-nano polishing or local etching treatment on the folding groove is further included, so that the folding groove is a trapezoidal groove with a larger upper part and a smaller lower part in the direction from the screen end to the client side, and the falling angle of the folding groove is arc-shaped.

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