Semiconductor chip packaging aid

Abstract

The present specification relates to the technical field of semiconductor manufacturing, and provides an auxiliary device for semiconductor chip packaging, which comprises a conveying mechanism, the conveying mechanism comprising a first conveying plate, a second conveying plate and a power source, the first conveying plate and the second conveying plate being used to convey chips to be packaged to a packaging device in a reciprocating exchange working position mode, and the power source being used to drive the first conveying plate and the second conveying plate, in the reciprocating exchange working position mode, the first conveying plate moving in a transverse reciprocating straight line, and the second conveying plate moving in a transverse reciprocating arc line, so that the first conveying plate and the second conveying plate reciprocate in the exchange working position mode transformed from space tiling to space staggering and then from space staggering to space tiling. The embodiment of the present specification can improve the conveying efficiency of the auxiliary device for semiconductor chip packaging, and further improve the chip packaging efficiency.

Description

TECHNICAL FIELD

[0001] The present specification relates to the technical field of semiconductor manufacturing, and in particular to an auxiliary device for semiconductor chip packaging BACKGROUND

[0002] Chip packaging is a key link in the semiconductor manufacturing process, which not only protects the chip from the external environment, but also realizes the electrical connection between the chip and the external circuit, and ensures the normal operation of the chip. Chip packaging is generally completed by packaging equipment. However, the inventors of the present application have found that in actual production, the packaging equipment usually runs at a high speed, while the conveying efficiency of the auxiliary device providing the packaging equipment with packaged chips is relatively low, which easily causes the packaging equipment to be in a waiting state, thereby affecting the chip packaging efficiency. SUMMARY

[0003] The purpose of the embodiments of the present specification is to provide an auxiliary device for semiconductor chip packaging and a control method thereof, so as to improve the conveying efficiency of the auxiliary device for semiconductor chip packaging and improve the chip packaging efficiency.

[0004] To achieve the above-mentioned purpose, on the one hand, the embodiments of the present specification provide an auxiliary device for semiconductor chip packaging, which comprises a conveying mechanism, the conveying mechanism comprises a first conveying plate, a second conveying plate and a power source, the first conveying plate and the second conveying plate are used to convey the chips to be packaged to the packaging equipment in a reciprocating exchange working position mode, and the power source is used to drive the first conveying plate and the second conveying plate. In the process of reciprocating exchange working position, the first conveying plate moves horizontally and linearly, and the second conveying plate moves horizontally and circularly, so that the first conveying plate and the second conveying plate reciprocate and exchange working positions in the mode of changing from space tiling to space staggering and then from space staggering to space tiling.

[0005] In the auxiliary device for semiconductor chip packaging of the embodiments of the present specification, the conveying mechanism comprises a box body, the box body is internally provided with a first sliding groove and an arc groove, the arc groove is located below the first sliding groove, the two ends of the first conveying plate are installed on the first sliding groove, so that the first conveying plate can slide horizontally and linearly along the first sliding groove, and the second conveying plate is installed on the arc groove through a connecting frame, so that the second conveying plate can move horizontally and circularly along the arc groove.

[0006] In the auxiliary device for semiconductor chip packaging of the embodiments of the present specification, the middle part of the arc groove forms a concave arc groove, the two ends of the arc groove form a linear groove, and the concave arc groove and the linear groove are smoothly connected; when the first conveying plate and the second conveying plate are in a space staggering position, the second conveying plate is located below the first conveying plate.

[0007] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the box is internally provided with a moving plate and a second sliding groove, the second sliding groove is located between the first sliding groove and the arc-shaped groove, the two ends of the moving plate are mounted on the second sliding groove, the moving plate is provided with a central hole and a plurality of edge holes which are uniformly distributed in the circumferential direction, the upper end of the connecting frame is fixed to the middle part of the bottom surface of the second conveying plate, the lower end of the connecting frame extends into the arc-shaped groove through the central hole, a plurality of vertical rods are respectively slidably mounted in the edge holes, the upper end of the vertical rod is fixed to the bottom surface of the second conveying plate, and the lower end of the vertical rod extends downward through the corresponding edge hole; the moving plate can reciprocate linearly along the second sliding groove, and the second conveying plate is driven by the connecting frame and the vertical rod to reciprocate along the arc-shaped groove in an arc-shaped manner; when the lower end of the connecting frame moves along the concave arc-shaped part of the arc-shaped groove, the vertical rod slides vertically relative to the moving plate and synchronously drives the second conveying plate to move vertically.

[0008] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the box is internally provided with a moving plate and a second sliding groove, the second sliding groove is located between the first sliding groove and the arc-shaped groove, the two ends of the moving plate are mounted on the second sliding groove, the moving plate is provided with a central hole and a plurality of edge holes which are uniformly distributed in the circumferential direction, the upper end of the connecting frame is fixed to the middle part of the bottom surface of the second conveying plate, the lower end of the connecting frame extends into the arc-shaped groove through the central hole, a plurality of vertical rods are respectively slidably mounted in the edge holes, the upper end of the vertical rod is fixed to the bottom surface of the second conveying plate, and the lower end of the vertical rod extends downward through the corresponding edge hole; the moving plate can reciprocate linearly along the second sliding groove, and the second conveying plate is driven by the connecting frame and the vertical rod to reciprocate along the arc-shaped groove in an arc-shaped manner; when the lower end of the connecting frame moves along the concave arc-shaped part of the arc-shaped groove, the vertical rod slides vertically relative to the moving plate and synchronously drives the second conveying plate to move vertically.

[0009] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the box is internally provided with a moving plate and a second sliding groove, the second sliding groove is located between the first sliding groove and the arc-shaped groove, the two ends of the moving plate are mounted on the second sliding groove, the moving plate is provided with a central hole and a plurality of edge holes which are uniformly distributed in the circumferential direction, the upper end of the connecting frame is fixed to the middle part of the bottom surface of the second conveying plate, the lower end of the connecting frame extends into the arc-shaped groove through the central hole, a plurality of vertical rods are respectively slidably mounted in the edge holes, the upper end of the vertical rod is fixed to the bottom surface of the second conveying plate, and the lower end of the vertical rod extends downward through the corresponding edge hole; the moving plate can reciprocate linearly along the second sliding groove, and the second conveying plate is driven by the connecting frame and the vertical rod to reciprocate along the arc-shaped groove in an arc-shaped manner; when the lower end of the connecting frame moves along the concave arc-shaped part of the arc-shaped groove, the vertical rod slides vertically relative to the moving plate and synchronously drives the second conveying plate to move vertically.

[0010] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the first conveying plate and the second conveying plate are provided with positioning grooves for accommodating the chips to be packaged; the lower end of the positioning groove is provided with a pressure sensor, and the pressure sensor is used to detect whether the chip to be packaged is placed in the positioning groove.

[0011] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the device further comprises an adjusting mechanism arranged at the upper end of the box, the adjusting mechanism is provided with a transfer mechanism, the transfer mechanism is used to transfer the chip to be packaged conveyed by the conveying mechanism to a packaging device, and the adjusting mechanism is used to adjust the relative position of the transfer mechanism and the positioning groove, so as to facilitate picking up the chip to be packaged from the positioning groove.

[0012] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the adjusting mechanism comprises a pair of first linear motors arranged on the upper end of the box body, a support rod is arranged on the moving end of each first linear motor, a second linear motor is fixedly arranged between the support rods, sliding rails are arranged on the upper and lower ends of the second linear motor, a moving seat is slidingly arranged between the sliding rails, the moving end of the second linear motor is connected to the inner side of the moving seat, and the transferring mechanism is arranged on the moving seat.

[0013] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the transferring mechanism comprises an extension frame, one end of the extension frame is connected to one side of the moving seat, a pressing plate is slidingly arranged at the bottom side of the extension frame, a telescopic rod is arranged at one side of the upper end surface of the extension frame, the bottom end of the telescopic rod is connected to the center of the upper end surface of the pressing plate, the bottom end of the pressing plate is provided with a buffering mechanism, and a suction disc for picking up the chip to be packaged is arranged at the bottom end of the buffering mechanism.

[0014] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the buffering mechanism comprises a plurality of limiting rods slidingly arranged at the four corner positions of the pressing plate, a buffer plate is arranged at the bottom end of the limiting rod, a compression spring is sleeved on the limiting rod, and the upper and lower ends of the compression spring are in abutment with the bottom end of the pressing plate and the upper end of the buffer plate.

[0015] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, the buffering mechanism further comprises a damping rod arranged between the pressing plate and the buffer plate, first movable seats are arranged on the two sides of the upper end surface of the buffer plate, second movable seats are arranged on the two sides of the bottom end of the pressing plate, and the upper and lower ends of the damping rod are hingedly connected to the second movable seat and the first movable seat.

[0016] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, one end of the extension frame is fixedly provided with an air pump, a connecting pipe is sleeved on the output end of the air pump, a plurality of telescopic hoses are arranged at the bottom end of the connecting pipe, and the other ends of the telescopic hoses are respectively connected to the input ends of the corresponding suction discs.

[0017] The auxiliary device for semiconductor chip packaging of the embodiment of the present application, a touch panel is arranged on the box body, and the touch panel is in communication connection with the first linear motor, the second linear motor, the servo motor, the telescopic rod, the air pump and the pressure sensor.

[0018] From the technical solutions provided by the above embodiments of the present specification, it can be seen that the reciprocating exchange of working positions of the first conveying plate and the second conveying plate in the embodiments of the present specification can greatly improve the conveying efficiency of the auxiliary device for semiconductor chip packaging in conveying the chips to be packaged to the packaging equipment, thereby facilitating the improvement of the chip packaging efficiency. Moreover, since the first conveying plate moves horizontally and linearly, and the second conveying plate moves horizontally and in an arc, the first conveying plate and the second conveying plate are not exchanged in working positions by horizontal and arc reciprocating movement, thereby avoiding the increase of the volume of the auxiliary device for semiconductor chip packaging. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present specification or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present specification, and other drawings can be obtained by those skilled in the art without creative labor. In the drawings:

[0020] Figure 1 A perspective structural schematic view of the auxiliary device for semiconductor chip packaging of some embodiments of the present specification is shown;

[0021] Figure 2 A perspective structural schematic view of the auxiliary device for semiconductor chip packaging of some embodiments of the present specification is shown; Figure 1 A perspective structural schematic view of another view of the auxiliary device for semiconductor chip packaging shown is shown;

[0022] Figure 3 A perspective structural schematic view of the transfer mechanism of the auxiliary device for semiconductor chip packaging of some embodiments of the present specification is shown;

[0023] Figure 4 A perspective structural schematic view of the inside of the box of the auxiliary device for semiconductor chip packaging of some embodiments of the present specification is shown;

[0024] Figure 5 A perspective structural schematic view of another view of the inside of the box of the auxiliary device for semiconductor chip packaging of some embodiments of the present specification is shown;

[0025] Figure 6 A schematic view of the exchange of working positions of the auxiliary device for semiconductor chip packaging of some embodiments of the present specification (the first conveying plate is located at the chip receiving working position and moves linearly to the right, and the second conveying plate is located at the chip supplying working position and moves in an arc to the left and downward) is shown;

[0026] Figure 7This specification shows a schematic diagram of the semiconductor chip packaging auxiliary device changing working positions (the first conveyor plate moves linearly to the right, and the second conveyor plate moves in an arc to the upper left after crossing below the first conveyor plate);

[0027] Figure 8 This specification shows a schematic diagram of the semiconductor chip packaging auxiliary device changing working positions (the first conveyor plate is located in the chip receiving working position and moves linearly to the left, and the second conveyor plate is located in the chip supply working position and moves in an arc to the lower right).

[0028] Figure 9 This specification shows a schematic diagram of the semiconductor chip packaging auxiliary device changing working positions (the first conveyor plate moves linearly to the left, and the second conveyor plate moves in an arc to the upper right after crossing below the first conveyor plate);

[0029] Figure 10 This specification shows a schematic diagram of the semiconductor chip packaging auxiliary device switching working positions (the first conveyor plate is located in the chip receiving working position, and the second conveyor plate is located in the chip supply working position) according to some embodiments of this specification.

[0030] [Explanation of Labels in the Attached Image]

[0031] 1. Conveying mechanism;

[0032] 2. Servo motor;

[0033] 3. Box body;

[0034] 4. Second conveyor plate;

[0035] 5. First conveyor plate;

[0036] 6. Positioning groove;

[0037] 7. Synchronizing pulley;

[0038] 8. Tensioner;

[0039] 9. Synchronous belt;

[0040] 10. Movable board;

[0041] 11. Connecting frame;

[0042] 12. Guide frame;

[0043] 13. Curved groove;

[0044] 14. Rollers;

[0045] 15. Second chute;

[0046] 16. First chute;

[0047] 17. Adjusting mechanism;

[0048] 18. First linear motor;

[0049] 19. Touch panel;

[0050] 20. Support rod;

[0051] 21. Second linear motor;

[0052] 22. Slide rail;

[0053] 23. Moving seat;

[0054] 24. Transfer mechanism;

[0055] 25. Extension frame;

[0056] 26. Air pump;

[0057] 27. Lower pressing plate;

[0058] 28. Limiting rod;

[0059] 29. Second movable seat;

[0060] 30. Buffer plate;

[0061] 31. First movable seat;

[0062] 32. Damping rod;

[0063] 33. Compression spring;

[0064] 34. Telescopic rod;

[0065] 35. Connecting pipe;

[0066] 36. Telescopic hose;

[0067] 37. Sucker;

[0068] 38. Vertical rod. DETAILED DESCRIPTION

[0069] For a better understanding of the technical solutions in the specification, the technical solutions in the specification will be described clearly and completely in the following with reference to the drawings in the embodiments of the specification. Obviously, the described embodiments are only some of the embodiments of the specification, rather than all the embodiments. Based on the embodiments in the specification, all other embodiments obtained by those of ordinary skill in the art without creative labor should belong to the protection scope of the specification. For example, in the following description, forming a second component above a first component can include an embodiment in which the first component and the second component are formed in direct contact, and can also include an embodiment in which the first component and the second component are formed in indirect contact (i.e., additional components can be further included between the first component and the second component), and the like.

[0070] Moreover, for ease of description, some embodiments of the specification can use spatial relative terms such as "above", "below", "top", "bottom", and the like to describe the relationship between one element or component and another (or other) element or component as shown in the drawings of the embodiments. It should be understood that, in addition to the orientation described in the drawings, the spatial relative terms are also intended to include different orientations of the device in use or operation. For example, if the device in the drawings is turned over, the element or component described as "below" or "under" other elements or components will then be positioned "above" or "over" the other elements or components.

[0071] The present specification provides an auxiliary device for semiconductor chip packaging, which comprises a conveying mechanism, an adjusting mechanism and a transferring mechanism; the conveying mechanism is used for conveying chips to be packaged to a packaging device; the transferring mechanism is used for transferring the chips to be packaged conveyed by the conveying mechanism to the packaging device; and the adjusting mechanism is used for adjusting the position of the transferring mechanism relative to the conveying mechanism, so as to facilitate the transferring mechanism to pick up the chips to be packaged from the conveying mechanism and package them. Wherein, the conveying mechanism comprises a first conveying plate, a second conveying plate and a power source; the first conveying plate and the second conveying plate are used for conveying the chips to be packaged to the packaging device in a reciprocating exchange working position mode; and the power source is used for driving the first conveying plate and the second conveying plate. In the process of reciprocating exchange working position, the first conveying plate moves laterally in a reciprocating straight line, and the second conveying plate moves laterally in a reciprocating arc line, so that the first conveying plate and the second conveying plate reciprocate exchange working position in a mode of space tiling transformation to space staggered transformation, and then space staggered transformation to space tiling transformation. In this way, by reciprocating exchange working position of the first conveying plate and the second conveying plate, the conveying efficiency of the auxiliary device for semiconductor chip packaging to the packaging device conveying the chips to be packaged can be greatly improved, thereby facilitating to improve the chip packaging efficiency. Moreover, since the first conveying plate moves laterally in a reciprocating straight line, and the second conveying plate moves laterally in a reciprocating arc line, the volume of the auxiliary device for semiconductor chip packaging is also avoided to increase due to the first conveying plate and the second conveying plate both exchanging working position through lateral reciprocating arc line motion.

[0072] Please refer to Figure 1 In some embodiments of the present specification, the auxiliary device for semiconductor chip packaging comprises a conveying mechanism 1, an adjusting mechanism 17 and a transferring mechanism 24. The transferring mechanism 24 is used for transferring the chips to be packaged conveyed by the conveying mechanism 1 to a packaging device; and the adjusting mechanism 17 is used for adjusting the relative position of the transferring mechanism 24 and the conveying mechanism 1, so as to facilitate picking up the chips to be packaged from the conveying mechanism 1.

[0073] Please continue to refer to Figure 1 In some embodiments of the present specification, the conveying mechanism 1 comprises a box body 3, a servo motor 2 as a power source is installed on one side of the box body 3, the adjusting mechanism 17 is arranged at the upper end of the box body 3, and the transferring mechanism 24 is arranged on one side of the adjusting mechanism 17. In combination with Figure 2 As shown in the figure, the conveying mechanism further comprises a first conveying plate 5 and a second conveying plate 4; the first conveying plate 5 and the second conveying plate 4 are used for conveying the chips to be packaged to the packaging device in a reciprocating exchange working position mode; and the first conveying plate 5 and the second conveying plate 4 are driven by the power source (see Figure 1The servo motor 2 shown in the middle drives the first conveying plate 5 to move laterally and linearly and the second conveying plate 4 to move laterally and arcuately during the reciprocating exchange of the working positions, so that the first conveying plate 5 and the second conveying plate 4 exchange the working positions in the manner of space tiling to space staggering and then space staggering to space tiling, thereby realizing the continuous supply (conveying) of the packaged chips to the packaging device by the first conveying plate 5 and the second conveying plate 4.

[0074] In some embodiments of the present specification, the working positions include a chip receiving working position and a chip supplying working position; the first conveying plate 5 and the second conveying plate 4 receive the packaged chips at the chip receiving working position, and provide the packaged chips at the chip supplying working position for the transfer mechanism 24 to transfer to the packaging device. Since the first conveying plate 5 moves laterally and linearly and the second conveying plate 4 moves laterally and arcuately, the first conveying plate 5 and the second conveying plate 4 can avoid exchanging the working positions by moving laterally and arcuately, thereby avoiding the increase in the volume of the auxiliary device for packaging semiconductor chips.

[0075] Reference Figure 6 As shown in the middle, when the first conveying plate 5 is at the chip receiving working position and the second conveying plate 4 is at the chip supplying working position, the first conveying plate 5 and the second conveying plate 4 are in a space tiling state, the first conveying plate 5 receives the packaged chips at the chip receiving working position, and the second conveying plate 4 supplies the packaged chips at the chip supplying working position to the packaging device via the transfer mechanism; after the first conveying plate 5 completes the reception of the packaged chips at the chip receiving working position and the second conveying plate 4 completes the supply of the packaged chips at the chip supplying working position, the first conveying plate 5 starts to move linearly to the right, while the second conveying plate 4 starts to move arcuately to the left and downward; when the second conveying plate 4 moves arcuately to the lowest end, the second conveying plate 4 is below the first conveying plate 5, and the first conveying plate 5 and the second conveying plate 4 are in a space staggering state (as shown in the left of the middle). Figure 7 As shown in the middle, when the first conveying plate 5 is at the chip receiving working position and the second conveying plate 4 is at the chip supplying working position, the first conveying plate 5 and the second conveying plate 4 are in a space tiling state, the first conveying plate 5 receives the packaged chips at the chip receiving working position, and the second conveying plate 4 supplies the packaged chips at the chip supplying working position to the packaging device via the transfer mechanism; after the first conveying plate 5 completes the reception of the packaged chips at the chip receiving working position and the second conveying plate 4 completes the supply of the packaged chips at the chip supplying working position, the first conveying plate 5 starts to move linearly to the right, while the second conveying plate 4 starts to move arcuately to the left and downward; when the second conveying plate 4 moves arcuately to the lowest end, the second conveying plate 4 is below the first conveying plate 5, and the first conveying plate 5 and the second conveying plate 4 are in a space staggering state (as shown in the left of the middle). Figure 8 As shown in the middle, when the first conveying plate 5 is at the chip receiving working position and the second conveying plate 4 is at the chip supplying working position, the first conveying plate 5 and the second conveying plate 4 are in a space tiling state, the first conveying plate 5 receives the packaged chips at the chip receiving working position, and the second conveying plate 4 supplies the packaged chips at the chip supplying working position to the packaging device via the transfer mechanism; after the first conveying plate 5 completes the reception of the packaged chips at the chip receiving working position and the second conveying plate 4 completes the supply of the packaged chips at the chip supplying working position, the first conveying plate 5 starts to move linearly to the right, while the second conveying plate 4 starts to move arcuately to the left and downward; when the second conveying plate 4 moves arcuately to the lowest end, the second conveying plate 4 is below the first conveying plate 5, and the first conveying plate 5 and the second conveying plate 4 are in a space staggering state (as shown in the left of the middle).

[0076] As shown in the middle, when the first conveying plate 5 is at the chip receiving working position and the second conveying plate 4 is at the chip supplying working position, the first conveying plate 5 and the second conveying plate 4 are in a space tiling state, the first conveying plate 5 receives the packaged chips at the chip receiving working position, and the second conveying plate 4 supplies the packaged chips at the chip supplying working position to the packaging device via the transfer mechanism; after the first conveying plate 5 completes the reception of the packaged chips at the chip receiving working position and the second conveying plate 4 completes the supply of the packaged chips at the chip supplying working position, the first conveying plate 5 starts to move linearly to the right, while the second conveying plate 4 starts to move arcuately to the left and downward; when the second conveying plate 4 moves arcuately to the lowest end, the second conveying plate 4 is below the first conveying plate 5, and the first conveying plate 5 and the second conveying plate 4 are in a space staggering state (as shown in the left of the middle). Figure 8As shown, the first conveyor plate 5 supplies the chip to be packaged to the packaging equipment via a transfer mechanism at the chip supply working position, and the second conveyor plate 4 receives the chip to be packaged at the chip receiving working position. When the second conveyor plate 4 completes receiving the chip to be packaged at the chip receiving working position, and the first conveyor plate 5 completes supplying the chip to be packaged at the chip supply working position, the first conveyor plate 5 begins to move linearly to the left, while the second conveyor plate 4 begins to move in an arc to the lower right. When the second conveyor plate 4 reaches its lowest point in the arc, it is again positioned below the first conveyor plate 5, and the first and second conveyor plates 5 and 4 are once again in a spatially staggered state (e.g., ...). Figure 9 As the relative motion between the two continues, the first conveyor plate 5 moves linearly to the left to the chip receiving position, and the second conveyor plate 4 moves in an arc to the upper right to the chip supply position (as shown). Figure 10 As shown in the figure, at this time, the first conveyor plate 5 and the second conveyor plate 4 once again exchange working positions, and the first conveyor plate 5 and the second conveyor plate 4 return to a spatially flat state. Thus, the first conveyor plate 5 and the second conveyor plate 4 complete one cycle of exchanging working positions; this process is repeated until the first conveyor plate 5 and the second conveyor plate 4 exchange working positions back and forth.

[0077] Combination Figure 4 and Figure 5 As shown in some embodiments of this specification, the inner sides of the housing 3 are provided with a first sliding groove 16 and an arc groove 13; the arc groove 13 is located below the first sliding groove 16, and the two ends of the first conveying plate 5 are installed on the first sliding groove 16 so that the first conveying plate 5 can slide laterally back and forth in a straight line along the first sliding groove 16. The second conveying plate 4 is installed on the arc groove 13 through a connecting frame 11 so that the second conveying plate 4 can move laterally back and forth in an arc along the arc groove 13.

[0078] refer to Figure 4 As shown, in some embodiments of this specification, the arc groove 13 has a concave arc groove in its middle and straight grooves at both ends, with a smooth connection between the concave arc groove and the straight grooves. The concave arc groove in the middle of the arc groove 13 allows for spatial interleaving between the first conveying plate 5 and the second conveying plate 4, meaning the second conveying plate 4 can smoothly pass under the first conveying plate 5 without contact, thus achieving spatial interleaving. The straight grooves at both ends of the arc groove 13 facilitate the first conveying plate 5 and the second conveying plate 4 receiving or supplying the chip to be packaged at their corresponding working positions. The smooth connection between the concave arc groove and the straight grooves allows the second conveying plate 4 to move smoothly along the trajectory of the arc groove 13; when the first conveying plate 5 and the second conveying plate 4 are in a spatially interleaved position, the second conveying plate 4 is located below the first conveying plate 5.

[0079] CombinationFigure 4 and Figure 5 As shown in some embodiments of this specification, the housing 3 is provided with a movable plate 10 and a second slide groove 15. The second slide groove 15 is located between the first slide groove 16 and the arc groove 13. The two ends of the movable plate 10 are installed on the second slide groove 15. The movable plate 10 has a central hole in its middle and edge holes at its four corners. The upper end of the connecting frame 11 is fixed to the middle of the bottom surface of the second conveying plate 4, and the lower end of the connecting frame 11 extends through the central hole into the arc groove 13, thereby guiding the second conveying plate 4 to move along the trajectory of the arc groove 13. A vertical rod 38 is slidably installed in each edge hole. The upper end of the vertical rod 38 is fixed to the bottom surface of the second conveying plate 4, and the lower end of the vertical rod 38 extends downward through the corresponding edge hole. The movable plate 10 can slide laterally and reciprocally in a straight line along the second slide groove 15, and synchronously drive the second conveying plate 4 to move laterally and reciprocally in an arc along the arc groove 13 through the upright 38 and the connecting frame 11; when the lower end of the connecting frame 11 moves along the concave arc portion of the arc groove 13, the upright 38 slides vertically relative to the movable plate 10 and synchronously drives the second conveying plate 4 to move vertically, that is, the second conveying plate 4 can move downward toward or upward away from the movable plate 10; when the lower end of the connecting frame 11 is located at the end of the arc groove 13 (straight groove), the distance between the second conveying plate 4 and the movable plate 10 is the largest, and when the lower end of the connecting frame 11 is located at the center of the concave arc groove of the arc groove 13, the distance between the second conveying plate 4 and the movable plate 10 is the smallest.

[0080] refer to Figure 4 As shown in some embodiments of this specification, a guide frame 12 is fixedly installed at the bottom of the inner side of the housing 3, and the arc groove 13 is formed on the guide frame 12. A roller 14 is rotatably connected to the lower end of the connecting frame 11, and the roller 14 is in rolling connection with the arc groove 13. This helps to reduce the friction between the lower end of the connecting frame 11 and the arc groove 13, thereby helping to reduce the power consumption of the servo motor.

[0081] refer to Figure 4As shown in some embodiments of the present application, a belt drive mechanism is arranged in the box 3, and the servo motor drives the first conveying plate 5 and the moving plate 10 through the belt drive mechanism. The belt drive mechanism includes a pair of synchronous wheels 7, a pair of tensioning wheels 8 and a synchronous belt 9. The pair of synchronous wheels 7 and the pair of tensioning wheels 8 are rotatably connected to the two ends of the inner side of the box 3. The synchronous belt 9 is wound around the synchronous wheels 7 and the tensioning wheels 8 and is tensioned by the tensioning wheels 8. The upper part of the synchronous belt 9 is fixedly connected to the first conveying plate 5, and the lower part of the synchronous belt 9 is fixedly connected to the moving plate 10. The output end of the servo motor is drivingly connected to one of the synchronous wheels 7 (not shown in the figure). In this way, the first conveying plate 5 and the moving plate 10 can be synchronously driven by one servo motor, and the second conveying plate 4 can be synchronously driven by the moving plate 10. The size and structure of the device are further simplified.

[0082] Referring to Figure 2 As shown in some embodiments of the present application, a positioning groove 6 for accommodating the chip to be packaged is arranged on each of the first conveying plate 5 and the second conveying plate 4. A pressure sensor (not shown in the figure) is arranged at the lower end of the positioning groove 6. The pressure sensor is used to detect whether the chip to be packaged is placed in the positioning groove 6, so as to facilitate the conveying mechanism to perceive and perform conveying. When the chip to be packaged is not placed in the positioning groove 6, the output value of the pressure sensor is zero. When the chip to be packaged is placed in the positioning groove 6, the output value of the pressure sensor increases to a certain specific value (for example, the pressure generated by a single chip to be packaged). When the chip to be packaged placed in the positioning groove 6 is taken out by the transfer mechanism, the output value of the pressure sensor decreases to zero.

[0083] Referring to Figure 2 As shown in some embodiments of the present application, the adjusting mechanism includes a pair of first linear motors 18 arranged on the front and rear sides of the upper end of the box 3. The moving end of each first linear motor 18 is provided with a support rod 20. A second linear motor 21 is fixedly arranged between the support rods 20. The upper and lower ends of the second linear motor 21 are provided with slide rails 22. A moving seat 23 is slidingly arranged between the slide rails 22. The moving end of the second linear motor 21 is connected to the inner side of the moving seat 23. The transfer mechanism is arranged on the moving seat 23. The relative position between the transfer mechanism and the positioning groove 6 can be adjusted horizontally by controlling the first linear motor 18, and the relative position between the transfer mechanism and the positioning groove 6 can be adjusted vertically by controlling the second linear motor 21.

[0084] Referring to Figure 3As shown in some embodiments of the present application, the transfer mechanism comprises an extension frame 25, one end of which is connected to one side of the moving base, the bottom side of the extension frame 25 is slidingly inserted with a pressing plate 27, and the upper end face of the extension frame 25 is inserted with a telescopic rod 34 on one side, the bottom end of the telescopic rod 34 is connected to the center of the upper end face of the pressing plate 27, the bottom end of the pressing plate 27 is provided with a buffering mechanism, and the bottom end of the buffering mechanism is provided with a suction disc 37 for picking up the chip to be packaged. The telescopic rod 34 can control the lifting of the pressing plate 27, so that the suction disc 37 can be controlled to approach or move away from the first conveying plate 5 or the second conveying plate 4 by the vertical extension of the telescopic rod 34.

[0085] Reference Figure 3 As shown in some embodiments of the present application, the buffering mechanism comprises a plurality of limiting rods 28 slidingly inserted at the four corner positions of the pressing plate 27, the bottom end of the limiting rod 28 is mounted with a buffer plate 30, and the limiting rod 28 is sleeved with a compression spring 33, and the upper and lower ends of the compression spring 33 are in contact with the bottom end of the pressing plate 27 and the upper end of the buffer plate 30, respectively. In this way, the buffering of the compression spring 33 and the limiting rod 28 can avoid damaging the chip during picking up, that is, when the pressing plate 27 is pressed down, the buffer plate 30 can buffer the pressing force under the action of the limiting rod 28 and the compression spring 33, so as to avoid damaging the chip, and at the same time ensure the stability of the pressing operation.

[0086] Reference Figure 3 As shown in some embodiments of the present application, the buffering mechanism further comprises a damping rod 32 arranged between the pressing plate 27 and the buffer plate 30, the upper end face of the buffer plate 30 is mounted with a first movable seat 31 on both sides, the bottom end of the pressing plate 27 is mounted with a second movable seat 29 on both sides, and the upper and lower ends of the damping rod 32 are hinged to the second movable seat 29 and the first movable seat 31, respectively. In this way, the structure composed of the first movable seat 31, the second movable seat 29 and the damping rod 32 can further enhance the buffering effect and avoid the reciprocating bounce of the compression spring 33 driving the buffer plate 30 to move reciprocally.

[0087] Reference Figure 3As shown in some embodiments of the present application, one end of the extension frame 25 is fixedly provided with an air pump 26, the output end of the air pump 26 is provided with a connecting pipe 35, the bottom end of the connecting pipe 35 is provided with a plurality of flexible hoses 36, and the other end of the flexible hoses 36 is respectively connected with the input end of a corresponding suction cup 37. The suction cup 37 is used for adsorbing the chip to be packaged, facilitating the transfer operation of the chip to be packaged. The air pump 26 provides adsorption force for the suction cup 37 through the connecting pipe 35 and the flexible hose 36, so that the chip to be packaged can be adsorbed. The flexible hose 36 can be stretched and contracted with the movement of the lower pressing plate 27 and the buffer plate 30, so as to ensure the stability of the air connection.

[0088] Reference Figure 2 As shown in some embodiments of the present application, the box 3 is provided with a touch panel 19, which facilitates the input of instructions by the operator. The touch panel 19 is in communication connection with the first linear motor 18, the second linear motor 21, the servo motor, the telescopic rod, the air pump and the pressure sensor. The touch panel 19 can receive the data of the pressure sensor, control the servo motor to adjust the conveying speed, control the first linear motor 18 and the second linear motor 21 to adjust the position of the transfer mechanism, control the telescopic rod and the air pump to transfer and press the chip to be packaged, and control the pressing force of the telescopic rod.

[0089] In combination Figures 1 to 5 As shown in some embodiments of the present application, the working principle of the auxiliary device for semiconductor chip packaging is as follows:

[0090] In use, the servo motor 2 output end drives the synchronous wheel 7 to rotate, the synchronous belt 9 connects the two pairs of synchronous wheels 7 and a pair of tensioning wheels 8, the tensioning wheels 8 play a role of tensioning the synchronous belt 9 to avoid the synchronous belt 9 slipping, the upper end of the synchronous belt 9 is connected with the bottom side of the first conveying plate 5, and the bottom end is connected with one side of the upper end face of the moving plate 10, so that the first conveying plate 5 and the moving plate 10 move reversely and slide along the first sliding groove 16 and the second sliding groove 15 in the box body 3 respectively, the bottom end of the second conveying plate 4 is connected with the roller 14 on the frame 11 and the arc groove 13 of the guide frame 12, the moving plate 10 drives the second conveying plate 4 to move along the arc track, when the roller 14 reaches the low-lying place of the arc groove 13, the second conveying plate 4 moves to the bottom end of the first conveying plate 5, the positions of the two are staggered, which facilitates the alternate conveying of the chips (i.e. the chips to be packaged), the positioning groove 6 on the upper end face of the first conveying plate 5 and the second conveying plate 4 positions the chip placing disc, the pressure sensor at the bottom of the groove monitors the chip placing condition in real time and transmits the data to the touch panel 19, the first linear motor 18 on the upper end of the two sides of the box body 3 is provided with a support rod 20 at the moving end, the first linear motor 18 is controlled through the touch panel 19, the support rod 20 drives the second linear motor 21 to move forward and backward, the slide rail 22 between the upper end and the lower end of the second linear motor 21, the moving seat 23 slides, the second linear motor 21 moving end is controlled to stretch and retract through the touch panel 19, which drives the moving seat 23 to slide left and right to adjust the position of the transfer mechanism 24, so as to facilitate the adsorption of the chips on the first conveying plate 5 and the second conveying plate 4, the extension frame 25 of the transfer mechanism 24 is connected with the moving seat 23, which can reach the specified position under the action of the adjusting mechanism 17, the air pump 26 at one end of the extension frame 25 provides the suction force for the suction disc 37 at the bottom end of the buffer plate 30 through the connecting pipe 35 and the flexible hose 36, so as to adsorb the chip, the touch panel 19 controls the telescopic rod 34 to stretch, which drives the lower pressing plate 27 to descend to make the suction disc adsorb the chip, when the lower pressing plate 27 descends, the buffer plate 30 buffers the pressure by the limiting rod 28 and the compression spring 33, further, the buffer plate 30 and the lower pressing plate 27 further enhance the buffering effect through the first movable seat 31 and the second movable seat 29 and the damping rod 32, then under the action of the adjusting mechanism 17, the transfer mechanism 24 adsorbing the chip is moved to the packaging equipment, and the telescopic rod 34 is retracted to place the chip.

[0091] For the convenience of description, the above device is described as various units in function. Of course, the functions of the units can be realized in the same or multiple hardware structures when implementing the present specification.

[0092] It should also be understood that, in the embodiments of the present specification, the term "and / or" only describes the association relationship of the associated objects, which means that there can be three relationships. For example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally means that the front and rear associated objects are in an "or" relationship.

[0093] It should also be noted that the terms "comprising", "comprises", "including", "includes" or any other variation thereof are intended to cover a non-exclusive inclusion, such that a device or an apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or even other elements that are inherent to such device or apparatus. An element proceeded by "comprises a... " does not, without further restriction, exclude the presence of additional identical elements in the device or apparatus that includes the element.

[0094] The embodiments of the present application only illustrate the technical solutions of the present application and are not used to limit the present application. Any modifications, equivalent replacements, improvements and the like made on the basis of the technical spirits and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An auxiliary device for semiconductor chip packaging, characterized in that, The device comprises a conveying mechanism, which comprises a first conveying plate, a second conveying plate and a power source, the first and second conveying plates are used to convey the chips to be packaged to a packaging device in a reciprocating exchange working position, and the power source is used to drive the first and second conveying plates, during the reciprocating exchange working position, the first conveying plate moves in a transverse reciprocating straight line, and the second conveying plate moves in a transverse reciprocating arc line, so that the first and second conveying plates reciprocate in the exchange working position in a manner of space tiling transformation to space staggered transformation, and then space staggered transformation to space tiling transformation. The conveying mechanism comprises a box, the inside of the box is provided with a first sliding groove and an arc groove, the arc groove is located below the first sliding groove, the two ends of the first conveying plate are installed on the first sliding groove, so that the first conveying plate can slide in a transverse reciprocating straight line along the first sliding groove, and the second conveying plate is installed on the arc groove through a connecting frame, so that the second conveying plate can move in a transverse reciprocating arc line along the arc groove; the box is provided with a belt transmission mechanism, the power source comprises a servo motor installed on the box, the servo motor drives the first and second conveying plates through the belt transmission mechanism, the belt transmission mechanism comprises a synchronous wheel and a tension wheel arranged in the box, a synchronous belt is wound on the synchronous wheel and the tension wheel, the upper part of the synchronous belt is fixedly connected with the first conveying plate, and the lower part of the synchronous belt is fixedly connected with the moving plate, and the output end of the servo motor is in transmission connection with the synchronous wheel.

2. The semiconductor chip packaging aid of claim 1, wherein The middle part of the arc groove forms a concave arc groove, the two ends of the arc groove form straight grooves, and the concave arc groove and the straight grooves are smoothly connected; when the first and second conveying plates are in a space staggered position, the second conveying plate is located below the first conveying plate.

3. The semiconductor chip packaging aid of claim 1, wherein The box is provided with a moving plate and a second sliding groove, the second sliding groove is located between the first sliding groove and the arc groove, the two ends of the moving plate are installed on the second sliding groove, the moving plate is provided with a center hole and a plurality of edge holes which are uniformly distributed in a circumferential direction, the upper end of the connecting frame is fixed to the middle part of the bottom surface of the second conveying plate, the lower end of the connecting frame extends into the arc groove through the center hole, a plurality of stand rods are respectively and slidably installed in the edge holes, the upper end of each stand rod is fixed to the bottom surface of the second conveying plate, and the lower end of each stand rod extends downward through the corresponding edge hole, the moving plate can slide in a transverse reciprocating straight line along the second sliding groove, and the second conveying plate can be driven by the stand rods and the connecting frame to move in a transverse reciprocating arc line along the arc groove; when the lower end of the connecting frame moves along the concave arc part of the arc groove, the stand rods slide vertically relative to the moving plate and drive the second conveying plate to move vertically.

4. The semiconductor chip packaging aid of claim 3, wherein The inside bottom end of the box is fixedly installed with a guide frame, the arc groove is arranged on the guide frame, and the lower end of the connecting frame is rotatably connected with a roller which is in rolling connection with the arc groove.

5. The semiconductor chip packaging aid of claim 1, wherein The first conveying plate and the second conveying plate are provided with positioning grooves for accommodating the chips to be packaged; the lower end of the positioning groove is provided with a pressure sensor for detecting whether the chip to be packaged is placed in the positioning groove.

6. The semiconductor chip packaging aid of claim 5, wherein The device further comprises an adjusting mechanism arranged at the upper end of the box, and a transfer mechanism is arranged on the adjusting mechanism, the transfer mechanism is used for transferring the chip to be packaged conveyed by the conveying mechanism to a packaging equipment, and the adjusting mechanism is used for adjusting the relative position of the transfer mechanism and the positioning groove, so as to pick up the chip to be packaged from the positioning groove.

7. The semiconductor chip packaging aid of claim 6, wherein The adjusting mechanism comprises a pair of first linear motors arranged on the front and back sides of the upper end of the box, a support rod is arranged on the moving end of each first linear motor, a second linear motor is fixedly arranged between the support rods, sliding rails are arranged on the upper and lower ends of the second linear motor, a moving seat is slidingly arranged between the sliding rails, the moving end of the second linear motor is connected to the inner side of the moving seat, and the transfer mechanism is arranged on the moving seat.

8. The semiconductor chip packaging aid of claim 7, wherein The transfer mechanism comprises an extension frame, one end of the extension frame is connected to one side of the moving seat, a lower pressing plate is slidingly arranged at the bottom side of the extension frame, a telescopic rod is arranged at one side of the upper end surface of the extension frame, the bottom end of the telescopic rod is connected to the center of the upper end surface of the lower pressing plate, a buffer mechanism is arranged at the bottom end of the lower pressing plate, and a suction disc for picking up the chip to be packaged is arranged at the bottom end of the buffer mechanism.

9. The semiconductor chip packaging aid of claim 8, wherein The buffer mechanism comprises a plurality of limiting rods slidingly arranged at the four corner positions of the lower pressing plate, a buffer plate is arranged at the bottom end of the limiting rod, a compression spring is sleeved on the limiting rod, and the upper and lower ends of the compression spring are in contact with the bottom end of the lower pressing plate and the upper end of the buffer plate.

10. The semiconductor chip packaging aid of claim 9, wherein The buffer mechanism further comprises a damping rod arranged between the lower pressing plate and the buffer plate, first movable seats are arranged on both sides of the upper end surface of the buffer plate, second movable seats are arranged on both sides of the bottom end of the lower pressing plate, and the upper and lower ends of the damping rod are hingedly connected to the second movable seats and the first movable seats.

11. The semiconductor chip packaging aid of claim 8, wherein One end of the extension frame is fixedly provided with an air pump, a connecting pipe is sleeved on the output end of the air pump, a plurality of telescopic hoses are arranged at the bottom end of the connecting pipe, and the other ends of the telescopic hoses are respectively connected to the input ends of the corresponding suction discs.

12. The semiconductor chip packaging aid of claim 11, wherein A touch panel is arranged on the box, and the touch panel is in communication connection with the first linear motor, the second linear motor, the servo motor, the telescopic rod, the air pump and the pressure sensor.

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