Chip radiator structure

Abstract

The invention relates to a chip radiator structure which comprises a radiator connector, a radiator cover plate and a radiator cold plate. The radiator cold plate is provided with a cold plate concave cavity, and a microstructure rib column perpendicular to the bottom face is arranged in the cold plate concave cavity so as to enhance heat exchange. The radiator cold plate and the cover plate bottom surface groove of the radiator cover plate form a clearance fit structure through cold plate positioning rib edges arranged around the cold plate concave cavity so as to be quickly positioned and mounted; the radiator cold plate is pressed on the chip; a cover plate body of the radiator cover plate is provided with a cover plate through hole communicated with the radiator joint; the radiator cover plate is hermetically connected with the radiator cold plate and forms a heat exchange cavity with the cold plate concave cavity; and the radiator joints are connected with the radiator cover plate to form a flowing channel through which a cooling working medium flows into the heat exchange cavity from the radiator joint on one side and then is discharged from the radiator joint on the other side. Compared with the prior art, multiple sealing is achieved, and operation is reliable and stable; a fluid channel is optimized, and the heat dissipation efficiency is improved; and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and particularly to a chip radiator structure. Background Art

[0002] In the context of the rapid development of microelectronics technology, while the chip integration degree is continuously improved and the size is getting smaller and smaller, the substantial increase in the core heat generation and the existence of stacked heat accumulation lead to a sharp increase in the heat flux density. The performance of the chip is very sensitive to the working temperature, and the thermal design of the chip has been increasingly emphasized. In order to ensure the stable operation of the chip and extend its service life, the heat dissipation technology plays a crucial role in the development of the chip.

[0003] Common chip radiators can be divided into various types according to the heat dissipation method, such as air cooling, heat pipe radiator, liquid cooling, semiconductor refrigeration, compression refrigeration, etc. Among them, liquid cooling is divided into phase change liquid cooling and non-phase change liquid cooling. Phase change liquid cooling has become the preferred heat dissipation method for high-heat-generation chips due to its compact radiator, good heat dissipation effect, and low noise.

[0004] However, due to the deficiencies in the structural design of general liquid cooling devices, the existing liquid cooling has limited heat dissipation effect and low heat transfer efficiency, and cannot continuously dissipate heat at high power, resulting in the defect that it is difficult to meet the heat dissipation requirements of high heat flux density chips. Patent CN201510338846.0 discloses a chip radiator, including: a heat conducting body, a heat dissipating body, and heat dissipating fins. The heat conducting member includes a first heat conducting member and a second heat conducting member connected to the first heat conducting member. The first heat conducting member is used to contact the chip. The heat dissipating body is provided with a receiving cavity filled with a heat dissipating liquid. The heat conducting body is hermetically connected to the receiving cavity. The second heat conducting member is received in the receiving cavity and at least partially inserted into the heat dissipating liquid. The heat dissipating fins are disposed on the heat dissipating body. For the above chip radiator, a receiving cavity is provided in the heat dissipating body, and the second heat conducting body is at least partially inserted into the heat dissipating liquid. By using the fluidity of the liquid, the heat generated by the electronic components is quickly absorbed by the heat dissipating liquid through the heat conducting body, and is dispersed to the heat dissipating body through the inner wall of the receiving cavity, and then the heat is dissipated into the air through the heat dissipating fins by heat dissipation methods such as convection, radiation, and conduction, which is beneficial to the rapid transmission and dispersion of heat and improves the heat dissipation performance of the chip radiator. However, the performance of the heat dissipating liquid is limited, and in a long-term high-temperature environment, the sealing material may age or deform.

[0005] Therefore, designing a new type of efficient cooling and heat dissipation device is a common concern of those skilled in the art. Summary of the Invention

[0006] The object of the present invention is to provide a chip radiator structure to overcome the defects of low heat exchange efficiency, poor heat dissipation effect, and unstable operation of the existing chip radiator, so as to improve the heat exchange efficiency and heat dissipation effect of the chip radiator and ensure reliable and stable operation.

[0007] The present invention provides a chip radiator structure, including: a radiator joint, a radiator cover plate, and a radiator cold plate;

[0008] The radiator cold plate is provided with a cold plate cavity, and microstructural rib columns perpendicular to the bottom surface are arranged in the cold plate cavity to enhance heat exchange; the radiator cold plate forms a clearance fit structure with the groove on the bottom surface of the radiator cover plate through the cold plate positioning rib edges arranged around the cold plate cavity for quick positioning and installation; the radiator cold plate is pressed on the chip;

[0009] A cover plate through hole communicating with the radiator joint is arranged on the cover plate body of the radiator cover plate; the radiator cover plate forms a sealed connection with the radiator cold plate by welding or screwing and forms a heat exchange cavity with the cold plate cavity;

[0010] The radiator joint is connected to the radiator cover plate by welding or threaded connection to form a flow channel for the cooling medium to flow into the heat exchange cavity from one side radiator joint and discharge from the other side radiator joint.

[0011] Furthermore,

[0012] When the radiator joint is connected to the radiator cover plate by welding, the radiator joint is a customized joint structure, and the radiator joint includes: an inlet joint, a joint bottom surface, and a joint channel; the inlet joint is used to connect the external pipeline; the joint channel communicates with the cover plate through hole, and the cover plate through hole is a gradually expanding hole structure;

[0013] When the radiator joint is threadedly connected to the radiator cover plate, the cover plate through hole is a threaded hole.

[0014] Furthermore,

[0015] When the radiator cover plate is hermetically connected to the radiator cold plate by welding, a filler metal is filled between the second cover plate fitting surface of the radiator cover plate and the cold plate fitting surface of the radiator cold plate to achieve sealing and connection;

[0016] When the radiator cover plate is hermetically connected to the radiator cold plate by screws, a sealing gasket is arranged between the second cover plate fitting surface of the radiator cover plate and the cold plate fitting surface of the radiator cold plate to achieve sealing, and corresponding and evenly distributed screw holes are arranged on the periphery of the radiator cover plate and the radiator cold plate to achieve connection by screws.

[0017] Furthermore, the peripheral contour dimension of the planar projection of the cold plate positioning rib edge is smaller than the planar projection contour dimension of the groove on the bottom surface of the cover plate; the height dimension of the cold plate positioning rib edge is smaller than the depth dimension of the groove on the bottom surface of the cover plate;

[0018] A cavity transition structure and a cavity bottom surface are provided below the through hole of the cover plate in the cold plate cavity, so that the cooling working medium can flow smoothly and uniformly into the cold plate cavity.

[0019] Furthermore, the micro-structured rib columns are arranged above the cavity bottom surface, and the shapes of the micro-structured rib columns are one or more of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape; the arrangement of the micro-structured rib columns is a straight arrangement or a staggered arrangement. The rib columns in the straight arrangement are arranged parallel to the longitudinal or transverse direction of the radiator, which can effectively provide a large contact area, thereby improving the heat exchange efficiency; the staggered arrangement of the rib columns can improve the disturbance of the fluid and promote the heat exchange between the liquid and the surface of the rib columns, thereby enhancing the heat dissipation performance.

[0020] When the shape feature of the micro-structured rib column is an umbrella shape, the umbrella structure is divided into a head structure and a root structure. The head structure and the root structure can be the same or different, and are each selected from one or more of a rectangular cross-section column, a trapezoidal column, a cone, a frustum, a parallelogram column, a triangular column, a circular column, an elliptical column, and an umbrella shape. The circumscribed centers of the horizontal projection contours of the root and the head of the umbrella structure can be coincident or misaligned according to design requirements; define R1 as the radius of the circumscribed circle of the horizontal projection contour of the root, and R2 as the radius of the circumscribed circle of the horizontal projection contour of the head. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

[0021] When the shape feature of the micro-structured rib column is an umbrella shape, the ratio of the circumscribed circle radius dimension of the root to the circumscribed circle radius dimension of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0022] Furthermore, a bottom surface capillary structure is provided on the cavity bottom surface of the cold plate cavity; when the thickness of the bottom surface capillary structure is 0, the cavity bottom surface is a smooth metal surface.

[0023] Furthermore, a rib column capillary structure is provided on the micro-structured rib column, and the percentage of the thickness of the rib column capillary structure in the total thickness of the micro-structured rib column is 0% to 100%;

[0024] When the thickness ratio of the rib column capillary structure is 0%, the microstructured rib column is a completely solid rib column; when the thickness ratio of the rib column capillary structure is 100%, the microstructured rib column is composed of a completely porous capillary structure.

[0025] Furthermore, when the shape of the microstructured rib column is umbrella-shaped, an interstitial capillary structure is provided around the root of the microstructured rib column.

[0026] The bottom surface capillary structure, the rib column capillary structure, and the interstitial capillary structure are all porous capillary structures; the porous capillary structure is formed by one of metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering, and the thickness in different positions or regions is adjusted differently according to design requirements.

[0027] Furthermore, the heat sink cold plate is provided with cold plate mounting holes and is pressed onto the chip through a connection structure;

[0028] The connection structure includes: a connection screw, a pre-tightening spring, and a connection nut. The pre-tightening spring is sleeved inside the connection screw. The connection screw passes through the cold plate mounting hole and the chip mounting surface, and the connection nut is screwed onto the end of the connection screw to achieve connection and fixation.

[0029] Furthermore, a thermal grease or liquid metal is filled between the contact surface of the heat sink cold plate and the chip. When the heat transfer medium is liquid metal, there is a protective design around the chip to prevent damage to the main board caused by liquid metal leakage.

[0030] Furthermore, the cooling medium is selected from one of deionized water, electronic fluorinated liquid, thermal oil, ammonia, or nanofluid.

[0031] The basic application principle of the present invention is: the low-temperature cooling medium enters the heat sink through the joint hole of a heat sink joint, smoothly flows into the heat exchange cavity provided with microstructured rib columns through the through holes of the cover plate and the concave cavity transition structure for efficient heat exchange, takes away the heat conducted from the chip to the heat sink cold plate, and is then discharged to the external pipeline through the heat sink joint on the other side.

[0032] Compared with the prior art, the present invention has the following advantages:

[0033] (1) Enhanced heat dissipation structure. The expanded part of the umbrella-shaped rib column structure of the present invention helps to enhance the turbulent effect of the fluid and improve the dispersion of bubbles. The rib columns create complex flow paths during the fluid flow process, making it difficult for bubbles to form large aggregates in the fluid, thereby reducing the detachment diameter of bubbles and increasing the detachment speed of bubbles.

[0034] (2) Improve the heat dissipation effect. The bottom surface of the cavity and the gaps between the microstructural rib columns of the present invention can be sintered with copper powder particles to form capillary structures. The capillary structures can significantly increase the internal surface area of the radiator and enhance the supply of liquid through the capillary effect, thereby strengthening the convective heat transfer.

[0035] (3) Optimize the fluid channel to improve the heat dissipation efficiency. The design of the gradually expanding holes in the cover plate and the transition structure of the cavity of the present invention can help the fluid to transition smoothly to a larger channel, thereby reducing the resistance loss caused by the sudden acceleration or deceleration of the fluid; it also helps to reduce the amplitude of the velocity change when the fluid passes through the orifice. The uniform velocity distribution helps to improve the heat dissipation efficiency and enables the fluid to cover the internal surface of the radiator more evenly.

[0036] (4) Multiple seals, reliable and stable operation. When welding and connecting, the present invention realizes the rapid positioning and installation of the joint - cover plate and the cover plate - cold plate respectively through the grooves on the top surface and the bottom surface of the cover plate, providing guidance for the fitting and positioning during welding connection. Welding connection can distribute stress more evenly and at the same time provide good airtightness, which is very important for a heat dissipation system that needs to prevent the leakage of the cooling medium or the entry of air. Description of the Drawings

[0037] Figure 1 Exploded view of the overall structure of the welded radiator;

[0038] Figure 2 Assembly drawing of the overall structure of the welded radiator;

[0039] Figure 3 Cross - sectional view of the overall structure of the welded radiator;

[0040] Figure 4 Schematic diagram of the structure of the radiator joint;

[0041] Figure 5 Schematic diagram of the structure of the radiator cover plate Figure 1 ;

[0042] Figure 6 Schematic diagram of the structure of the radiator cover plate Figure 2 ;

[0043] Figure 7 Schematic diagram of the structure of the radiator cold plate (the shape of the microstructural rib column is a rectangular cross - section column);

[0044] Figure 8 Schematic diagram of the structural features of the shape of the microstructural rib column;

[0045] Figure 9 Schematic diagram of the structure of the radiator cold plate with staggered triangular rib columns;

[0046] Figure 10 Schematic structural diagram of the radiator cold plate with a vertical T-shaped rib column;

[0047] Figure 11 Schematic structural diagram of the umbrella-shaped microstructural rib column;

[0048] Figure 12 Schematic structural diagram of the capillary structure in the cold plate cavity Figure 1 ;

[0049] Figure 13 Schematic structural diagram of the capillary structure in the cold plate cavity Figure 2 ;

[0050] Figure 14 Schematic structural diagram of the connection structure;

[0051] Figure 15 Schematic overall structure diagram of the welded connection radiator in Embodiment 3.

[0052] Reference numerals: 1 - radiator joint; 11 - inlet joint; 12 - joint bottom surface; 13 - joint channel;

[0053] 2 - radiator cover; 21 - cover body; 22 - cover through hole; 23 - cover top surface groove; 24 - first cover fitting surface; 25 - cover bottom surface groove; 26 - second cover fitting surface;

[0054] 3 - radiator cold plate; 31 - cold plate fitting surface; 32 - cold plate positioning rib edge; 33 - cold plate cavity, 331 - cavity transition structure; 332 - cavity bottom surface; 34 - microstructural rib column; 341 - bottom capillary structure; 342 - rib column capillary structure; 343 - gap capillary structure; 35 - cold plate mounting hole;

[0055] 4 - connection structure; 41 - connection screw; 42 - pre-tightening spring; 43 - connection nut. Detailed implementation manners

[0056] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Features such as component models, material names, connection structures, control methods, algorithms, etc. that are not clearly described in this technical solution are regarded as common technical features disclosed in the prior art.

[0057] Embodiment 1

[0058] This embodiment provides a chip radiator structure, as Figures 1-7 shown, including: a radiator joint 1, a radiator cover 2, and a radiator cold plate 3;

[0059] The radiator cold plate 3 is provided with a cold plate cavity 33, and microstructural rib columns 34 perpendicular to the bottom surface are arranged in the cold plate cavity 33 to enhance heat transfer; the radiator cold plate 3 forms a clearance fit structure with the cover bottom groove 25 of the radiator cover 2 through a cold plate positioning rib edge 32 arranged around the cold plate cavity 33 for quick positioning and installation; the radiator cold plate 3 is pressed on the chip;

[0060] The cover plate body 21 of the radiator cover 2 is provided with a cover plate through hole 22 communicated with the radiator joint 1; the radiator cover 2 forms a sealed connection with the radiator cold plate 3 by welding or screwing and forms a heat exchange cavity with the cold plate cavity 33;

[0061] The radiator joint 1 is connected to the radiator cover 2 by welding or threaded connection, forming a flow channel for the cooling working medium to flow into the heat exchange cavity from one side radiator joint 1 and discharge from the other side radiator joint 1.

[0062] In a specific embodiment,

[0063] When the radiator joint 1 is connected to the radiator cover 2 by welding, the radiator joint 1 is a customized joint structure, and the radiator joint 1 includes: an inlet joint 11, a joint bottom surface 12, and a joint channel 13; the inlet joint 11 is used to connect an external pipeline; the radiator cover 2 is provided with a cover top groove 23 and a first cover fitting surface 24, the radiator joint 1 is placed in the cover top groove 23, and a filler metal is filled between the joint bottom surface 12 and the first cover fitting surface 24 to achieve welded connection; the joint channel 13 is communicated with the cover plate through hole 22, and the cover plate through hole 22 is a gradually expanding hole structure;

[0064] When the radiator joint 1 is threadedly connected to the radiator cover 2, the radiator joint 1 is one of a quick water stop joint, a pagoda joint, a ferrule joint, and a quick screw joint with a standard thread, and the cover plate through hole 22 is a threaded hole.

[0065] In a specific embodiment,

[0066] When the radiator cover 2 is hermetically connected to the radiator cold plate 3 by welding, a filler metal is filled between the second cover fitting surface 26 of the radiator cover 2 and the cold plate fitting surface 31 of the radiator cold plate 3 to achieve sealing and connection;

[0067] When the radiator cover 2 is hermetically connected to the radiator cold plate 3 by screws, a sealing gasket is provided between the second cover fitting surface 26 of the radiator cover 2 and the cold plate fitting surface 31 of the radiator cold plate 3 to achieve sealing, and corresponding and uniformly distributed screw holes are provided at the peripheries of the radiator cover 2 and the radiator cold plate 3 for connection by screws.

[0068] In a specific embodiment, the peripheral contour dimension of the planar projection of the cold plate positioning rib edge 32 is smaller than the planar projection contour dimension of the groove 25 on the bottom surface of the cover plate; the height dimension of the cold plate positioning rib edge 32 is smaller than the depth dimension of the groove 25 on the bottom surface of the cover plate.

[0069] A cavity transition structure 331 and a cavity bottom surface 332 are provided below the cover plate through hole 22 in the cold plate cavity 33, so that the cooling working medium can flow smoothly and uniformly into the cold plate cavity 33.

[0070] As Figure 8 shown, in a specific embodiment, the microstructural rib column 34 is disposed above the cavity bottom surface 332, and the shape of the microstructural rib column 34 is one or more of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape; the arrangement of the microstructural rib columns 34 is a straight arrangement or a staggered arrangement. The straight-arranged rib columns are arranged parallel to the longitudinal or transverse direction of the radiator, which can effectively provide a large contact area, thereby improving the heat exchange efficiency; the staggered arrangement of the rib columns can improve the disturbance of the fluid and promote the heat exchange between the liquid and the surface of the rib columns, thereby enhancing the heat dissipation performance. As Figure 9 is a schematic structural diagram of a radiator cold plate with staggered triangular rib columns; as Figure 10 is a schematic structural diagram of a radiator cold plate with straight-arranged T-shaped rib columns.

[0071] As Figure 12 , 13 shown, in a specific embodiment, a bottom surface capillary structure 341 is provided on the cavity bottom surface 332 of the cold plate cavity 33; when the thickness of the bottom surface capillary structure 341 is 0, the cavity bottom surface 332 is a smooth metal surface.

[0072] In a specific embodiment, a rib column capillary structure 342 is provided on the microstructural rib column 34, and the percentage of the thickness of the rib column capillary structure 342 in the total thickness of the microstructural rib column 34 is 0% to 100%; preferably, the percentage of the thickness of the rib column capillary structure 342 in the total thickness of the microstructural rib column 34 is 5% - 25%.

[0073] When the thickness ratio of the rib column capillary structure 342 is 0%, the microstructural rib column 34 is a completely solid rib column; when the thickness ratio of the rib column capillary structure 342 is 100%, the microstructural rib column 34 is composed of a completely porous capillary structure.

[0074] The bottom capillary structure 341, the rib column capillary structure 342, and the gap capillary structure 343 are all porous capillary structures; the porous capillary structure is formed by one of metal powder sintering, metal wire sintering, or mixed sintering of metal powder and metal wire, and the thickness in different positions or regions is adjusted differently according to design requirements.

[0075] In a specific embodiment, the radiator cold plate 3 is provided with cold plate mounting holes 35 and is pressed onto the chip through a connection structure 4;

[0076] As Figure 14 shown, the connection structure 4 includes: a connection screw 41, a pre-tightening spring 42, and a connection nut 43. The pre-tightening spring 42 is sleeved inside the connection screw 41. The connection screw 41 passes through the cold plate mounting hole 35 and the chip mounting surface, and the connection nut 43 is screwed with the end of the connection screw 41 to achieve connection and fixation.

[0077] In a specific embodiment, a heat-conducting silicone grease or liquid metal is filled between the contact surface of the radiator cold plate 3 and the chip. When the heat-conducting medium is liquid metal, there is a protective design around the chip to prevent damage to the main board caused by leakage of the liquid metal.

[0078] In a specific embodiment, the cooling medium is selected from one of deionized water, electronic fluorinated liquid, heat-conducting oil, ammonia, or nanofluid.

[0079] The basic application principle of the present invention is: the low-temperature cooling medium enters the radiator through the joint hole 13 of a radiator joint 1, smoothly flows into the heat exchange cavity provided with micro-structured ribs 34 through the cover plate through-hole 22 and the cavity transition structure 331 for efficient heat exchange, takes away the heat conducted from the chip to the radiator cold plate 3, and is then discharged to the external pipeline through the radiator joint 1 on the other side.

[0080] Embodiment 2

[0081] This embodiment provides a chip radiator structure, which is characterized by including: a radiator joint 1, a radiator cover plate 2, and a radiator cold plate 3;

[0082] The radiator cold plate 3 is provided with a cold plate cavity 33, and micro-structured ribs 34 perpendicular to the bottom surface are provided in the cold plate cavity 33 to enhance heat exchange; the radiator cold plate 3 forms a clearance fit structure with the cover plate bottom groove 25 of the radiator cover plate 2 through a cold plate positioning rib edge 32 provided around the cold plate cavity 33 for quick positioning and installation; the radiator cold plate 3 is pressed onto the chip;

[0083] The cover plate body 21 of the radiator cover plate 2 is provided with a cover plate through-hole 22 communicating with the radiator joint 1; the radiator cover plate 2 forms a sealed connection with the radiator cold plate 3 by welding or screwing and forms a heat exchange cavity with the cold plate cavity 33;

[0084] The radiator joint 1 is connected to the radiator cover plate 2 by welding or threaded connection, forming a flow channel through which the cooling working medium flows into the heat exchange cavity from one side radiator joint 1 and discharges from the other side radiator joint 1.

[0085] In a specific embodiment,

[0086] When the radiator joint 1 is connected to the radiator cover plate 2 by welding, the radiator joint 1 includes: an inlet joint 11, a joint bottom surface 12, and a joint passage 13; the inlet joint 11 is used to connect an external pipeline; the radiator cover plate 2 is provided with a cover top surface groove 23 and a first cover fitting surface 24, the radiator joint 1 is placed in the cover top surface groove 23, and a filler metal is filled between the joint bottom surface 12 and the first cover fitting surface 24 to achieve welded connection; the joint passage 13 is communicated with the cover through hole 22, and the cover through hole 22 is of a gradually expanding hole structure.

[0087] In a specific embodiment,

[0088] When the radiator cover plate 2 is hermetically connected to the radiator cold plate 3 by welding, a filler metal is filled between the second cover fitting surface 26 of the radiator cover plate 2 and the cold plate fitting surface 31 of the radiator cold plate 3 to achieve sealing and connection;

[0089] When the radiator cover plate 2 is hermetically connected to the radiator cold plate 3 by screws, a sealing gasket is provided between the second cover fitting surface 26 of the radiator cover plate 2 and the cold plate fitting surface 31 of the radiator cold plate 3 to achieve sealing, and corresponding and uniformly distributed screw holes are provided at the peripheries of the radiator cover plate 2 and the radiator cold plate 3 to achieve connection by screws.

[0090] In a specific embodiment, the peripheral contour dimension of the planar projection of the cold plate positioning rib 32 is smaller than the planar projection contour dimension of the cover bottom surface groove 25; the height dimension of the cold plate positioning rib 32 is smaller than the depth dimension of the cover bottom surface groove 25;

[0091] The cold plate cavity 33 is provided with a cavity transition structure 331 and a cavity bottom surface 332 below the cover through hole 22, so that the cooling working medium can flow smoothly and uniformly into the cold plate cavity 33.

[0092] Such as Figure 11As shown, when the shape feature of the micro-structured rib column 34 is an umbrella shape, the umbrella structure is divided into two parts: a head structure and a root structure. The head structure and the root structure can be the same or different, and are each selected from one or more of a rectangular cross-section column, a trapezoidal column, a cone, a frustum, a parallelogram column, a triangular column, a circular column, an elliptical column, and an umbrella shape. The circumscribed centers of the horizontal projection profiles of the root and the head of the umbrella structure can coincide or be misaligned according to design requirements; define R1 as the radius of the circumscribed circle of the horizontal projection profile of the root, and R2 as the radius of the circumscribed circle of the horizontal projection profile of the head. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

[0093] The ratio of the size of the circumscribed circle radius of its root to the size of the circumscribed circle radius of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0094] As Figure 12 、 13 shown, in a specific embodiment, a bottom capillary structure 341 is provided on the concave bottom surface 332 of the cold plate cavity 33; when the thickness of the bottom capillary structure 341 is 0, the concave bottom surface 332 is a smooth metal surface.

[0095] In a specific embodiment, a rib column capillary structure 342 is provided on the micro-structured rib column 34, and the percentage of the thickness of the rib column capillary structure 342 in the total thickness of the micro-structured rib column 34 is 0% to 100%; preferably, the percentage of the thickness of the rib column capillary structure 342 in the total thickness of the micro-structured rib column 34 is 5% - 25%.

[0096] When the thickness ratio of the rib column capillary structure 342 is 0%, the micro-structured rib column 34 is a completely solid rib column; when the thickness ratio of the rib column capillary structure 342 is 100%, the micro-structured rib column 34 is composed of a completely porous capillary structure.

[0097] In a specific embodiment, when the shape of the micro-structured rib column 34 is an umbrella shape, a gap capillary structure 343 is provided around the root of the micro-structured rib column 34.

[0098] The bottom capillary structure 341, the rib column capillary structure 342, and the gap capillary structure 343 are all porous capillary structures; the composition method of the porous capillary structure is one of metal powder sintering, metal wire sintering, or mixed sintering of metal powder and metal wire, and the thickness in different positions or regions is differentially adjusted according to design requirements.

[0099] In a specific embodiment, the radiator cold plate 3 is provided with cold plate mounting holes 35 and is pressed onto the chip through a connection structure 4;

[0100] As Figure 14As shown, the connection structure 4 includes: a connection screw 41, a pre-tightening spring 42, and a connection nut 43. The pre-tightening spring 42 is sleeved inside the connection screw 41. The connection screw 41 passes through the cold plate mounting hole 35 and the chip mounting surface, and the connection nut 43 is screwed with the end of the connection screw 41 to achieve connection and fixation.

[0101] In the specific implementation, a heat-conducting silicone grease or liquid metal is filled between the contact surface of the radiator cold plate 3 and the chip. When the heat-conducting medium is liquid metal, there is a protection design around the chip to prevent the motherboard from being damaged due to liquid metal leakage.

[0102] In the specific implementation, the cooling medium is selected from one of deionized water, electronic fluorinated liquid, heat-conducting oil, ammonia, or nanofluid.

[0103] The basic application principle of the present invention is as follows: The low-temperature cooling medium enters the radiator through the joint hole 13 of a radiator joint 1, smoothly flows into the heat exchange cavity provided with micro-structured rib columns 34 through the cover plate through-hole 22 and the concave cavity transition structure 331 for efficient heat exchange, takes away the heat conducted from the chip to the radiator cold plate 3, and is then discharged to the external pipeline by the radiator joint 1 on the other side.

[0104] Embodiment 3

[0105] As Figure 15 shown, the installation method of the radiator joint 1 in this embodiment is an opposite-side installation method facing left and right. The opposite-side installation method can adapt to different server chassis layouts so that the cold head structure has good compatibility. Other technical features are the same as those in Embodiment 2.

[0106] The components not elaborated in detail in this embodiment are all existing components that can be purchased through public channels.

[0107] The above description of the embodiments is for the convenience of those of ordinary skill in the art to understand and use the invention. Those skilled in the art can obviously make various modifications to these embodiments easily and apply the general principles described herein to other embodiments without creative labor. Therefore, the present invention is not limited to the above embodiments, and the improvements and modifications made by those skilled in the art without departing from the scope of the present invention should be within the protection scope of the present invention.

Claims

1. A chip radiator structure, characterized in that, Comprising: A radiator joint (1), a radiator cover plate (2) and a radiator cold plate (3); The radiator cold plate (3) is provided with a cold plate cavity (33), and microstructural rib columns (34) perpendicular to the bottom surface are arranged in the cold plate cavity (33); the radiator cold plate (3) forms a clearance fit structure with the cover plate bottom groove (25) of the radiator cover plate (2) through a cold plate positioning rib edge (32) arranged around the cold plate cavity (33); the radiator cold plate (3) is pressed on the chip; A cover plate through hole (22) communicated with the radiator joint (1) is arranged on the cover plate body (21) of the radiator cover plate (2); the radiator cover plate (2) is hermetically connected with the radiator cold plate (3) and forms a heat exchange cavity with the cold plate cavity (33); The radiator joint (1) is connected with the radiator cover plate (2) to form a flow channel for the cooling working medium to flow into the heat exchange cavity from one side radiator joint (1) and then discharge from the other side radiator joint (1).

2. A chip radiator structure according to claim 1, wherein When the radiator joint (1) is connected with the radiator cover plate (2) by welding, it includes: an inlet joint (11), a joint bottom surface (12) and a joint channel (13); the inlet joint (11) is used for connecting an external pipeline; the joint channel (13) is communicated with the cover plate through hole (22), and the cover plate through hole (22) is a gradually expanding hole structure; When the radiator joint (1) is threadedly connected with the radiator cover plate (2), the cover plate through hole (22) is a threaded hole.

3. The structure of a chip radiator according to claim 1, characterized in that, The cold plate positioning rib edge (32) is fitted with the cover plate bottom groove (25); the height dimension of the cold plate positioning rib edge (32) is smaller than the depth dimension of the cover plate bottom groove (25).

4. A chip heat sink structure according to claim 1, characterized in that, The cold plate cavity (33) is provided with a cavity transition structure (331) and a cavity bottom surface (332) below the cover plate through hole (22) to enable the cooling working medium to smoothly and uniformly flow into the cold plate cavity (33).

5. A chip heat sink structure according to claim 1, characterized in that, The shape of the microstructural rib column (34) is one or more of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape; the arrangement mode of the microstructural rib columns (34) is a straight row arrangement or a staggered arrangement.

6. The structure of a chip radiator according to claim 5, characterized in that, When the shape of the microstructural rib column (34) is an umbrella shape, it includes a root part and a head part arranged on the cavity bottom surface (332) from inside to outside; Wherein, the root part and the head part have the same or different structures, and are each selected from one or more of the shapes of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape, etc.

7. A chip radiator structure according to claim 6, characterized in that, The circumcenter of the horizontal projection profiles of the root and the head coincides or is misaligned. Denote the radius of the circumcircle of the horizontal projection profile of the root as R1, and the radius of the circumcircle of the horizontal projection profile of the head as R2. The ratio of R1 to R2 is 0.1 to 10. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

8. A chip heat sink structure according to claim 6, characterized in that, When the shape of the microstructural rib column (34) is umbrella-shaped, a gap capillary structure (343) is provided around the root of the microstructural rib column (34).

9. A chip heat sink structure according to claim 1, characterized in that, The microstructural rib column (34) is a solid rib column covered with a rib column capillary structure (342). The percentage of the thickness of the rib column capillary structure (342) in the total thickness of the microstructural rib column (34) is 0% to 100%. The bottom surface (332) of the cavity is covered with a bottom surface capillary structure (341).

10. A chip heat sink structure according to claim 1, characterized in that, The radiator cold plate (3) is provided with cold plate mounting holes (35) and is pressed onto the chip through a connection structure (4). The connection structure (4) includes: a connection screw (41), a pre-tightening spring (42), and a connection nut (43). The pre-tightening spring (42) is sleeved inside the connection screw (41). The connection screw (41) passes through the cold plate mounting hole (35) and the chip mounting surface. The connection nut (43) is screwed with the end of the connection screw (41) to achieve connection and fixation.

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