Radiator and electronic equipment

Abstract

The invention discloses a radiator and electronic equipment, the radiator comprises a heat dissipation base part (10) and a first heat pipe (20), the heat dissipation base part (10) is provided with an evaporation cavity (11), the evaporation cavity (11) is internally provided with a first phase change medium, two ends of the first heat pipe (20) are closed ends, a pipe cavity (21) of the first heat pipe (20) is internally provided with a second phase change medium, and the second phase change medium is arranged in the pipe cavity (21) of the first heat pipe (20). An evaporation cavity (11) is formed in the heat dissipation base part (10), an evaporation end (22) of the first heat pipe (20) is connected with a heat dissipation surface (12) of the heat dissipation base part (10), a condensation end (23) of the first heat pipe (20) extends out of the edge of the heat dissipation surface (12) and extends in the direction away from the heat dissipation base part (10), and a pipe cavity (21) of the first heat pipe (20) is isolated from the evaporation cavity (11). According to the scheme, the problem that a radiator in the related technology is poor in radiating effect can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of radiators, and particularly relates to a radiator and an electronic device. Background Art

[0002] Servers are the core electronic devices in the development of big data and communication technologies. With the continuous improvement of the computing power of servers, the power consumption and heat flux density of servers are also increasing year by year. This poses higher requirements for the radiators supporting the servers. However, the radiators in related technologies still have problems with poor heat dissipation. Of course, not limited to servers, other devices that generate high heat during operation also need to be equipped with radiators. Similarly, these radiators also have problems with poor heat dissipation effects. Summary of the Invention

[0003] This application discloses a radiator and an electronic device to solve the problem of poor heat dissipation effect of the radiators in related technologies.

[0004] To solve the above technical problems, this application provides the following technical solutions:

[0005] In a first aspect, an embodiment of this application discloses a radiator. The disclosed radiator includes a heat dissipation base and a first heat pipe. The heat dissipation base is provided with an evaporation chamber, and a first phase change medium is arranged in the evaporation chamber. Both ends of the first heat pipe are closed ends, and a second phase change medium is arranged in the lumen of the first heat pipe. The evaporation end of the first heat pipe is connected to the heat dissipation surface of the heat dissipation base. The condensation end of the first heat pipe extends beyond the edge of the heat dissipation surface and extends in a direction away from the heat dissipation base. The lumen of the first heat pipe is isolated from the evaporation chamber.

[0006] In a second aspect, an embodiment of this application discloses an electronic device. The disclosed electronic device includes the radiator described in the above embodiment.

[0007] The technical solutions adopted by this application can achieve the following technical effects:

[0008] The radiator disclosed in the embodiment of this application, through the design of the structure, enables the heat dissipation base and the first heat pipe to cooperate with each other to dissipate heat. At the same time, the first heat pipe can transfer the heat it obtains from the heat dissipation base to the condensation end of the first heat pipe and dissipate it at a position far from the heat dissipation surface. In this process, the first heat pipe can transfer the heat to a position farther away from the heat dissipation base for dissipation, so as to ensure that in addition to the first heat pipe and the heat dissipation base playing their respective independent heat dissipation functions, the first heat pipe can also avoid having an adverse impact on the heat dissipation of the heat dissipation base, and further enable the heat dissipation performance of the entire radiator to be greatly improved.

[0009] In addition, the lumen of the first heat pipe and the evaporation chamber of the heat dissipation base are isolated from each other, so there is no need for connection, and thus the problem of cumbersome operation caused by the connection between the lumen of the first heat pipe and the evaporation chamber of the heat dissipation base can be avoided. In the specific assembly process, it is only necessary to connect the evaporation end of the first heat pipe to the evaporation surface of the heat dissipation base, without further connection and without considering the sealing problem that may be caused by the connection, which is beneficial to improving the yield rate of the radiator. Description of the Drawings

[0010] Figure 1 is a schematic three-dimensional structure diagram of the radiator disclosed in the embodiment of the present application;

[0011] Figure 2 is a schematic three-dimensional structure diagram of a part of the structure of the radiator disclosed in the embodiment of the present application, Figure 2 in which the housing part 14 and the cover body 15 are in an unassembled state;

[0012] Figure 3 is a cross-sectional view of a part of the structure of the radiator disclosed in the embodiment of the present application, Figure 3 in which the hollow arrow indicates the heat flow direction of the heat generated by the object to be cooled flowing towards the heat dissipation base, Figure 3 in which the solid arrow indicates the liquid flow direction when the corresponding phase change medium is in a liquid state, Figure 3 in which the dashed arrow indicates the vapor flow direction when the corresponding phase change medium is in a gaseous state;

[0013] Figure 4 and Figure 5 are respectively schematic diagrams of a part of the structures of two different radiators.

[0014] Description of the Reference Numerals:

[0015] 10 - heat dissipation base, 11 - evaporation chamber, 12 - heat dissipation surface, 13 - third capillary structure, 14 - housing part, 15 - cover body, 20 - first heat pipe, 21 - lumen, 22 - evaporation end, 23 - condensation end, 24 - first capillary structure, 30 - first heat sink, 40 - first shroud, 50 - connection substrate, 60 - second heat pipe, 61 - evaporation end, 62 - lumen, 63 - condensation end, 64 - second capillary structure, 70 - second heat sink, 80 - second shroud, 01 - first heat dissipation structure, 011 - sub - heat dissipation structure, 02 - second heat dissipation structure, 03 - object to be cooled. Detailed Embodiments

[0016] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments of this application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

[0017] The following will, in conjunction with the drawings, elaborate on the technical solutions disclosed in each embodiment of this application.

[0018] Please refer to Figures 1 to 5 , an embodiment of this application discloses a heat sink. The disclosed heat sink is used to dissipate heat from the object to be cooled 03. The object to be cooled 03 can be a server, a chip, etc. The specific type of the object to be cooled 03 is not limited in the embodiments of this application. The disclosed heat sink may include a heat dissipation base 10 and a first heat pipe 20.

[0019] The heat dissipation base 10 is the basic part of the heat sink. The heat dissipation base 10 can be in contact with the object to be cooled 03, so that the heat generated by the object to be cooled 03 (for example, it can be along the Figure 3 direction indicated by the hollow arrow) is transmitted to the heat dissipation base 10, and then transmitted to the heat sink and dissipated. Specifically, the heat dissipation base 10 is provided with an evaporation chamber 11, and a first phase change medium is provided in the evaporation chamber 11. The heat generated by the object to be cooled 03 is transmitted to the evaporation chamber 11, thereby heating the first phase change medium, and then causing the first phase change medium to evaporate into a gas and absorb heat. The gaseous first phase change medium can be cooled in a region away from the object to be cooled and condense to release heat, ultimately realizing heat dissipation. Of course, the first phase change medium condensed into a liquid will flow back and then be heated and evaporated to enter the next heat dissipation cycle. In the embodiments of this application, the heat dissipation base 10 has a heat dissipation surface 12. The heat dissipation surface 12 can be a plane or a non-plane, such as a curved surface. The specific shape of the heat dissipation surface 12 is not limited in the embodiments of this application.

[0020] In the embodiments of this application, the structure of the heat dissipation base 10 can be various. For example, the heat dissipation base 10 can be a plate-like structure or a non-plate-like structure. Optionally, the heat dissipation base 10 can be a vapor chamber. A vapor chamber is a heat dissipation component with good heat dissipation performance, which is beneficial to improving the heat dissipation performance of the entire heat sink. In the embodiments of this application, the heat dissipation base 10 can be a split structure or an integral structure. To facilitate the formation of the evaporation chamber 11, optionally, the heat dissipation base 10 can include a shell part 14 and a cover body 15. The cover body 15 can be detachably fixed at the opening of the shell part 14 and enclose the evaporation chamber 11 with the shell part 14, as Figure 2 shown.

[0021] In a further embodiment, the heat dissipation base 10 can be fixed on the object to be heat dissipated 03, so as to realize the assembly of the radiator and the object to be heat dissipated 03. This solution can ensure a relatively stable heat transfer cooperation between the heat dissipation base 10 and the object to be heat dissipated 03.

[0022] Both ends of the first heat pipe 20 are closed ends. A second phase change medium is provided in the lumen 21 of the first heat pipe 20. Since both ends of the first heat pipe 20 are closed ends, the second phase change medium will be confined in the lumen 21 of the first heat pipe 20. The evaporation end 22 of the first heat pipe 20 is connected to the heat dissipation surface 12 of the heat dissipation base 10. The condensation end 23 of the first heat pipe 20 extends away from the heat dissipation base 10. The lumen 21 of the first heat pipe 20 is isolated from the evaporation chamber 11 of the heat dissipation base 10, so that the first phase change medium and the second phase change medium will not blend. In the embodiment of the present application, the first phase change medium and the second phase change medium each achieve heat dissipation through an evaporation-condensation cycle. When the heat dissipation surface 12 performs the heat dissipation function, it can also transfer heat to the first heat pipe 20 through cooperation with the evaporation end 22 of the first heat pipe 20 and then be dissipated by the first heat pipe 20. Furthermore, it can improve the efficiency of the condensation-liquid return-re-evaporation cycle of the heat dissipation surface 12, which is beneficial to increasing the critical heat flux density of the radiator and strengthening the heat dissipation capacity of the radiator.

[0023] To ensure the structural stability of the radiator, the first heat pipe 20 and the heat dissipation base 10 can be fixedly connected by welding, bonding, connecting with a connecting piece, clamping, etc. This connection method can ensure that the evaporation end 22 of the first heat pipe 20 is in relatively stable contact with the heat dissipation surface 12, which is beneficial to receiving the heat dissipated from the heat dissipation base 10 and then dissipating the heat. The first heat pipe 20 and the heat dissipation base 10 can be connected in a non-detachable manner or in a detachable manner. For the convenience of flexible maintenance and replacement of individual components, a relatively optional solution is that the first heat pipe 20 can be detachably connected to the heat dissipation base 10. For example, the first heat pipe 20 and the heat dissipation base 10 are detachably connected by a connecting piece (such as a threaded connecting piece), clamping, etc. It should be noted that the embodiment of the present application does not limit the specific connection method between the first heat pipe 20 and the heat dissipation base 10.

[0024] In an optional solution, the condensation end 23 of the first heat pipe 20 can extend beyond the edge of the heat dissipation surface 12, that is to say, the condensation end 23 of the first heat pipe 20 is not within the space facing the heat dissipation surface 12. This structure can prevent the condensation end 23 of the first heat pipe 20 from condensing and dissipating heat within the space facing the heat dissipation surface 12 of the heat dissipation base 10, so that the heat to be dissipated can be better transported to a farther position, achieving a better heat dissipation effect and better avoiding having an adverse impact on the heat dissipation of the heat dissipation base 10 by being close to the heat dissipation base 10.

[0025] In the radiator disclosed in the embodiment of the present application, through the design of the structure, while the heat dissipation base 10 and the first heat pipe 20 cooperate with each other to dissipate heat, the first heat pipe 20 can also transfer the heat obtained from the heat dissipation base 10 to the condensation end 23 of the first heat pipe 20 and dissipate it at a position far from the heat dissipation surface 12. During this process, the first heat pipe 20 can transfer the heat to a position farther away from the heat dissipation base 10 for dissipation, so as to ensure that in addition to the first heat pipe 20 playing its independent heat dissipation function, it can also avoid the adverse effect of the first heat pipe 20 on the heat dissipation of the heat dissipation base 10, and thus the heat dissipation performance of the entire radiator can be greatly improved.

[0026] In addition, the lumen 21 of the first heat pipe 20 and the evaporation chamber 11 of the heat dissipation base 10 are isolated from each other, so there is no need for connection, and thus the problem of cumbersome operation caused by the connection between the lumen 21 of the first heat pipe 20 and the evaporation chamber 11 of the heat dissipation base 10 can be avoided. Since the evaporation chamber 11 and the lumen 21 of the first heat pipe 20 are isolated from each other, the heat dissipation base 10 and the first heat pipe 20 can be independently processed and manufactured and then connected. Product manufacturers are more likely to use relatively simple or existing production lines for production, with a higher process maturity and a higher yield rate, which is also beneficial to controlling the manufacturing cost. In the specific assembly process, only the evaporation end 22 of the first heat pipe 20 needs to be connected to the heat dissipation surface 12 of the heat dissipation base 10, without further connection and without considering the sealing problem that may be caused by the connection, which is also beneficial to improving the yield rate of the radiator.

[0027] Of course, in the case where the first capillary structure 24 is provided in the lumen 21 of the first heat pipe 20 and the third capillary structure 13 is provided in the evaporation chamber 11 of the heat dissipation base 10, if the lumen 21 of the first heat pipe 20 is connected to the evaporation chamber 11 of the heat dissipation base 10, an effective lap between the first capillary structure 24 and the third capillary structure 13 is also required. The lap between the first capillary structure 24 and the third capillary structure 13 is a relatively delicate operation and is not easy to succeed, which is likely to result in a lower yield rate of the radiator. In the embodiment of the present application, since the evaporation chamber 11 of the heat dissipation base 10 and the lumen 21 of the first heat pipe 20 are isolated from each other and do not need to be connected, there is no need to lap the first capillary structure 24 in the first heat pipe 20 and the third capillary structure 13 in the heat dissipation base 10, so as to save the relatively cumbersome and unsuccessful assembly operation between the first heat pipe 20 and the heat dissipation base 10, which is beneficial to the manufacture of the radiator and can also ensure the yield rate of the radiator.

[0028] In order to increase the thermal contact area, in a more preferable solution, the evaporation end 22 of the first heat pipe 20 may be a flat structure end. The flat structure end and the heat dissipation surface 12 may be connected by surface-to-surface contact. This structure enables the first heat pipe 20 to contact the heat dissipation surface 12 with a larger area, which is conducive to better receiving the heat dissipated from the heat dissipation surface 12, and further conducive to transferring this part of the heat to the farther condensation end 23 for dissipation.

[0029] The flat structure end and the heat dissipation surface 12 may be connected by surface-to-surface contact formed by non-planar and non-planar surfaces, or may be connected by surface-to-surface contact between planar surfaces. The embodiments of the present application do not make any restrictions. Considering that a more regular surface is conducive to assembly and also conducive to improving the appearance of the product, in a further preferable solution, the heat dissipation base 10 may be a heat sink, the heat dissipation surface 12 may be a planar surface, and correspondingly, the evaporation end 22 of the first heat pipe 20 may be a flat structure end. The flat structure end and the heat dissipation surface 12 may be connected by a surface-to-surface contact structure formed by planar surfaces.

[0030] In order to further improve the heat dissipation capacity, in an optional solution, the radiator disclosed in the embodiments of the present application may further include a first heat dissipation structure 01. The condensation end 23 of the first heat pipe 20 may be connected to the first heat dissipation structure 01, and the first heat dissipation structure 01 may be provided with a first air passage penetrating along a first preset direction. In this case, the heat dissipated from the condensation end 23 of the first heat pipe 20 can be better dissipated by the first heat dissipation structure 01. The addition of the first heat dissipation structure 01 can increase the heat dissipation area at the condensation end 23 of the first heat pipe 20, thereby reducing the thermal resistance of the entire radiator, enabling the condensation end 23 of the first heat pipe 20 connected thereto to dissipate heat more efficiently, and further facilitating the improvement of the heat dissipation efficiency. At the same time, the first air passage can guide the cold air to flow along the first preset direction, thereby preventing the cold air from spreading, and further prolonging the contact time between the cold air and the first heat dissipation structure 01, and ultimately being more conducive to improving the heat dissipation effect.

[0031] In the embodiments of the present application, the structure of the first heat dissipation structure 01 may be various. For example, the first heat dissipation structure 01 may be a first air guide heat dissipation pipe, and the condensation end 23 of the first heat pipe 20 may extend into the first air guide heat dissipation pipe. In this case, the lumen of the first heat conduction heat dissipation pipe may be regarded as the first air passage.

[0032] Of course, the first heat dissipation structure 01 can also be other structures. In an alternative solution, the first heat dissipation structure 01 can include a first heat sink 30 and a first enclosure 40. The first enclosure 40 is arranged around the first heat sink 30, so as to form a first air passage between the first heat sink 30. Specifically, the first heat sink 30 can be one or multiple, and the specific number of the first heat sinks 30 is not limited in the embodiments of the present application. When the first heat sink 30 is one, the first enclosure 40 surrounds the first heat sink 30, so as to form a first air passage with the first heat sink 30. When the first heat sink 30 is multiple, the multiple first heat sinks 30 are stacked and distributed, and two adjacent first heat sinks 30 are spaced apart, so as to form a first heat dissipation gap. The first enclosure 40 surrounds the periphery of the whole formed by stacking the multiple first heat sinks 30, so as to enclose the first heat dissipation gap between two adjacent first heat sinks 30 into a first air passage.

[0033] The first heat dissipation structure 01 can at least include a first heat sink 30. In order to further increase the heat dissipation area, the first heat dissipation structure 01 can also include heat dissipation protrusions arranged on the surface of the first heat sink 30. The heat dissipation protrusions can be strip-shaped protrusions or needle-shaped protrusions, which are not limited in the embodiments of the present application.

[0034] In the embodiments of the present application, the first heat pipe 20 can be one or multiple. In a more optional solution, in order to improve the heat dissipation capacity, the first heat pipe 20 can be multiple. Further, the evaporation ends 22 of the multiple first heat pipes 20 are connected to the heat dissipation surface 12 at intervals, so as to reduce the mutual heat dissipation influence. Specifically, any two first heat pipes 20 are spaced apart.

[0035] When the first heat pipe 20 is multiple, the first heat pipes 20 can be ungrouped, and correspondingly, the first heat dissipation structure 01 can also be ungrouped. In other embodiments, the first heat pipes 20 can be grouped, and correspondingly, the first heat dissipation structure 01 can also be grouped.

[0036] In an alternative solution, when the radiator includes the first heat dissipation structure 01 and the first heat pipe 20 is multiple, any two first heat pipes 20 are spaced apart, and the multiple first heat pipes 20 can be distributed in at least two groups, and each group includes at least one first heat pipe 20. The first heat dissipation structure 01 can include multiple sub-heat dissipation structures 011. The condensation ends 23 of each group of first heat pipes 20 can be connected in the corresponding sub-heat dissipation structure 011, and each sub-heat dissipation structure 011 can be provided with a first air passage penetrating along a first preset direction.

[0037] In a further technical solution, each sub-heat dissipation structure 011 may include a plurality of first heat dissipation fins 30 and a first enclosure 40. In each sub-heat dissipation structure 011, a plurality of first heat dissipation fins 30 are stacked and distributed, and the first enclosure 40 may surround the circumference of the whole formed by the stacking of a plurality of first heat dissipation fins 30, so as to enclose the first heat dissipation gap between two adjacent first heat dissipation fins 30 into a first air passage. In this case, a plurality of first heat pipes 20 are distributed in groups, and the first heat dissipation structure 01 can configure a corresponding sub-heat dissipation structure 011 for each group of first heat pipes 20, so as to avoid all the first heat pipes 20 being gathered in one place, so that each group of first heat pipes 20 can improve the heat dissipation effect through the corresponding sub-heat dissipation structure 011, which can undoubtedly further improve the heat dissipation capacity of the entire radiator.

[0038] The first air passage allows air to flow from one end of the first air passage to the other end, so that it can continue to exchange heat with the first heat sink 30. In essence, in this structure, the first enclosure 40 can block part of the edge of the first air gap, thereby avoiding the problem of insufficient heat exchange caused by air flowing in all directions, and thus improving the heat dissipation capacity of the radiator in disguise. In addition, the first enclosure 40 can also make the first heat dissipation structure 01 stronger, so as to achieve the effect of one thing serving two purposes.

[0039] The heat sink disclosed in the embodiment of the present application may further include a connecting substrate 50, which is fixedly connected to the heat dissipation base 10, and the first heat dissipation structure 01 is supported on the connecting substrate 50. In this structure, the connecting substrate 50 is similar to a base connected to the heat dissipation base 10, thereby forming an integral base body with the heat dissipation base 10, thereby providing support for the first heat dissipation structure 01, which is beneficial to improving the overall structural stability of the heat sink. At the same time, the connecting substrate 50 also has a reinforcing function, which is beneficial to improving the overall strength of the heat sink.

[0040] In particular, when the first heat dissipation structure 01 includes a plurality of sub-heat dissipation structures 011, the plurality of sub-heat dissipation structures 011 are all supported on the connection substrate 50, which is conducive to improving the structural stability of the plurality of sub-heat dissipation structures 011. Specifically, the first heat dissipation structure 01 can be fixed on the connection substrate 50. For example, the first heat sink 30 can be fixedly connected to the connection substrate 50 by welding, bonding, connection with a connector, etc., so as to achieve a fixed connection between the first heat dissipation structure 01 and the connection substrate 50, which can further improve the overall strength of the radiator.

[0041] Optionally, the first end of the connecting substrate 50 can be fixed on the heat dissipation surface 12, and the second end of the connecting substrate 50 can be fixed on the first heat dissipation structure 01 and support the first heat dissipation structure 01. This structure is also beneficial to ensure the local strength of the radiator such as the condensation end 23 of the first heat pipe 20 and the first heat dissipation structure 01.

[0042] During the specific heat dissipation process, the second phase change medium in the first heat pipe 20 evaporates into a gaseous state at the evaporation end 22, and then moves to the condensation end 23 of the first heat pipe 20 to achieve condensation. The second phase change medium that becomes liquid after condensation will flow back to the evaporation end 22 of the first heat pipe 20. For the convenience of the backflow of the liquid second phase change medium, in an alternative solution, the condensation end 23 of the first heat pipe 20 can be higher than the evaporation end 22 of the first heat pipe 20.

[0043] Considering that the condensation end 23 of the first heat pipe 20 will extend to a relatively far position, in the embodiment of the present application, a first capillary structure 24 can be provided in the first heat pipe 20, and the first capillary structure 24 is beneficial to the rapid backflow of the liquid second phase change medium. The second phase change medium can be water or other solutions, such as refrigerants. The embodiment of the present application does not limit the specific type of the second phase change medium. When the second phase change medium is water, setting the first capillary structure 24 in the first heat pipe 20 can prevent the water from solidifying, and thus can avoid the damage to the first heat pipe 20 caused by ice bulging due to local water solidification. Of course, when the second phase change medium is water, a third capillary structure 13 can be provided in the evaporation cavity 11 of the heat dissipation base 10, so as to avoid the damage to the heat dissipation base 10 caused by ice bulging due to local water solidification. Of course, the second phase change medium can be a phase change medium with a freezing point lower than the freezing point, such as a refrigerant. In this case, the second phase change medium is not easily solidified, and the first capillary structure 24 may not be provided in the first heat pipe 20. Similarly, the third capillary structure 13 may not be provided in the heat dissipation base 10.

[0044] To improve the heat dissipation performance of the radiator, the radiator disclosed in the embodiment of the present application may further include a second heat pipe 60. The evaporation end 61 of the second heat pipe 60 is an open end and communicates with the lumen 62 of the second heat pipe 60 and the evaporation cavity 11. The condensation end 63 of the second heat pipe 60 extends in a direction away from the heat dissipation surface 12. The second heat pipe 60 can be located in the space enclosed by the edges of the heat dissipation surface 12. In this case, the second heat pipe 60 also plays a heat dissipation function and can dissipate heat in the space enclosed by the edges of the heat dissipation surface 12. At the same time, the first heat pipe 20 and the second heat pipe 60 can make full use of the heat dissipation surface 12 to be connected to the heat dissipation base 10, which is beneficial to improving the heat dissipation efficiency.

[0045] In the heat sink disclosed in the embodiments of the present application, the heat dissipation base 10 may have an independent evaporation chamber 11 and a condensation chamber, so that the heat dissipation function can be independently realized through the first phase change medium. In an embodiment where the heat sink includes a second heat pipe 60 and the lumen 62 of the second heat pipe 60 communicates with the evaporation chamber 11 of the heat dissipation base 10, the evaporation chamber 11 of the heat dissipation base 10 serves as the evaporation region of a 3DVC heat sink formed by the heat dissipation base 10 and the second heat pipe 60, and the condensation end 63 of the second heat pipe 60 serves as the condensation region of a 3DVC heat sink formed by the heat dissipation base 10 and the second heat pipe 60, so that a more three-dimensional heat dissipation structure can be formed, thereby improving the heat dissipation capacity of the heat sink.

[0046] Specifically, the second heat pipe 60 may be perpendicular to the heat dissipation surface 12. Of course, the second heat pipe 60 may also form an acute angle with the heat dissipation surface 12. The embodiments of the present application do not limit the specific angle between the second heat pipe 60 and the heat dissipation surface 12.

[0047] The second heat pipe 60 may be one or multiple. To further improve the heat dissipation capacity of the heat sink, in a more preferable solution, the second heat pipe 60 may be multiple, and the multiple second heat pipes 60 may be distributed on the heat dissipation surface 12 in a preset manner. Specifically, the multiple second heat pipes 60 may be distributed in rows and columns on the heat dissipation surface 12, or alternatively, the multiple second heat pipes 60 may be evenly distributed within a circular area. Of course, the embodiments of the present application do not limit the distribution manner of the multiple second heat pipes 60 on the heat dissipation surface 12.

[0048] To make the reflux of the first phase change medium easier, a second capillary structure 64 may be provided in the second heat pipe 60, and a third capillary structure 13 may be provided in the evaporation chamber 11. The second capillary structure 64 and the third capillary structure 13 are connected to form a liquid guiding structure. As described above, a 3DVC heat sink is formed by the second heat pipe 60 and the heat dissipation base 10. The condensation end 63 of the second heat pipe 60 serves as the condensation region of the 3DVC heat sink, and the evaporation chamber 11 of the heat dissipation base 10 serves as the evaporation region of the 3DVC heat sink. In the specific heat dissipation process, the first phase change medium evaporates into a gas state in the evaporation chamber 11, and the gaseous first phase change medium will enter the condensation region ( Figure 3 shown in the figure to exchange heat with the cold source air), and condenses and releases heat in the condensation region. The first phase change medium that becomes liquid after condensing in the condensation region will quickly return to the evaporation chamber 11 under the guidance of the liquid guiding structure, thereby preparing for the evaporation in the next cycle. The liquid guiding structure formed by the second capillary structure 64 and the third capillary structure 13 can improve the reflux speed of the liquid first phase change medium, thereby improving the heat dissipation cycle efficiency and achieving the purpose of enhancing the heat dissipation capacity of the heat sink.

[0049] To further improve the heat dissipation capacity of the radiator, the radiator disclosed in the embodiments of the present application may further include a second heat dissipation structure 02, and the condensation end 63 of the second heat pipe 60 may be connected to the second heat dissipation structure 02. The second heat dissipation structure 02 is provided with a second air passage penetrating along a second preset direction. In this case, the heat dissipated from the condensation end 63 of the second heat pipe 60 can be better dissipated by the second heat dissipation structure 02. The addition of the second heat dissipation structure 02 can increase the heat dissipation area at the condensation end 63 of the second heat pipe 60, thereby reducing the thermal resistance of the entire radiator, enabling the condensation end 63 of the second heat pipe 60 connected thereto to dissipate heat more efficiently, and further facilitating the improvement of the heat dissipation efficiency. At the same time, the second air passage can guide the cold air to flow along the second preset direction, thereby preventing the cold air from spreading, and then being able to extend the contact time between the cold air and the second heat dissipation structure 02, and ultimately being more conducive to improving the heat dissipation effect.

[0050] In the embodiments of the present application, the structure of the second heat dissipation structure 02 can be various. For example, the second heat dissipation structure 02 can be a second air guide heat pipe, and the condensation end 63 of the second heat pipe 60 can extend into the second air guide heat pipe. In this case, the lumen of the second air guide heat pipe can be regarded as the second air passage.

[0051] Of course, the second heat dissipation structure 02 can also be other structures. In an alternative solution, the second heat dissipation structure 02 can include a second heat sink 70 and a second enclosure 80. The second enclosure 80 is arranged around the second heat sink 70 to form a second air passage with the second heat sink 70. Specifically, the second heat sink 70 can be one or multiple, and the embodiments of the present application do not limit the specific number of the second heat sinks 70. When the second heat sink 70 is one, the second enclosure 80 surrounds the second heat sink 70 to form a second air passage with the second heat sink 70. When the second heat sink 70 is multiple, the multiple second heat sinks 70 are stacked and distributed, and adjacent two second heat sinks 70 are spaced apart to form a second heat dissipation gap. The second enclosure 80 surrounds the periphery of the whole formed by the stacking of the multiple second heat sinks 70 to enclose the second heat dissipation gap between adjacent two second heat sinks 70 into a second air passage.

[0052] In the embodiments of the present application, the second heat dissipation structure 02 is at least formed by the second heat sink 70. The second heat dissipation structure 02 can further include heat dissipation protrusions provided on the surface of the second heat sink 70 while including the second heat sink 70. The heat dissipation protrusions can be strip-shaped protrusions or needle-shaped protrusions, and the embodiments of the present application do not make limitations. Of course, considering that when the second heat sink 70 is multiple, the second heat sinks 70 can be stacked. In this case, the second heat dissipation structure 02 can further include a connecting member (such as a threaded connecting member) connecting the multiple second heat sinks 70.

[0053] Further optionally, in the case where there are multiple second heat sinks 70, in order to improve the convective heat dissipation effect, in an optional scheme, the multiple second heat sinks 70 are distributed at intervals, and a second wind gap can be formed between two adjacent second heat sinks 70. Air can pass through the second wind gap by convection, thereby improving the heat dissipation effect.

[0054] Please refer again Figure 1 The radiator disclosed in the embodiment of the present application may also include a second enclosure 80, which surrounds the circumference of the second heat dissipation structure 02, so that a second air passage that passes through along a second preset direction is formed between two adjacent second heat dissipation fins 70 in the second heat dissipation structure 02. As described above, a second air gap is formed between two adjacent second heat dissipation fins 70, and the provision of the second enclosure 80 enables the second air gap to form a second air passage. The second air passage is a structure with two ends open formed by the second heat dissipation fins 70 and the second enclosure 80, which enables air to flow from one end of the second air passage to the other end, thereby enabling better continuous heat exchange with the second heat dissipation fins 70. In essence, in this structure, the second enclosure 80 can block part of the edge of the second air gap, thereby avoiding the problem of insufficient heat exchange caused by air flowing in all directions, thereby improving the heat dissipation capacity of the radiator in disguised form.

[0055] Similarly, the second enclosure 80 is connected to the second heat dissipation structure 02, so as to further strengthen the strength of the second heat dissipation structure 02, thereby facilitating the improvement of the local strength of the radiator. It can be seen that the second enclosure 80 can play a dual role.

[0056] In the embodiment of the present application, the second preset direction and the first preset direction may be the same or different. The second preset direction and the first preset direction may be parallel to the heat dissipation surface 12 or may not be parallel to the heat dissipation surface 12, which is not limited in the embodiment of the present application. Figure 1 As shown, in a specific embodiment, the second preset direction may be consistent with the first preset direction, and both are parallel to the heat dissipation surface 12 .

[0057] In order to improve the heat dissipation effect of the condensation end 23 of the first heat pipe 20, the inlet or outlet of the second air passage can be toward the condensation end 23 of the first heat pipe 20 or toward other parts of the first heat pipe 20 except its evaporation end 22. In this case, the air guided by the second air passage will blow directly toward or flow through the condensation end 23 of the first heat pipe 20 or other parts except the evaporation end 22, thereby accelerating the convective heat dissipation of these parts. This can further enhance the heat dissipation capacity of the radiator. Of course, the through direction of the first air passage and the second air passage can also be other directions, and the embodiment of the present application does not limit the specific through direction of the first air passage and the second air passage.

[0058] In the embodiments of the present application, the types of the first phase change medium and the second phase change medium may be the same or different. Optionally, the first phase change medium and the second phase change medium may be water or a refrigerant. The embodiments of the present application do not limit the types of the first phase change medium and the second phase change medium.

[0059] In the embodiments of the present application, the structure of the heat dissipation base 10 may be various. For example, the heat dissipation base 10 may be a heat pipe vapor chamber. Of course, it may also be other plate-like structures. Both opposite plate surfaces of the heat dissipation base 10 may be heat dissipation surfaces 12, and each heat dissipation surface 12 may be connected to a first heat pipe 20. In this case, the heat absorbed by the heat dissipation base 10 from the object to be cooled will be transmitted to a distance through the two opposite heat dissipation surfaces 12 through the respective connected first heat pipes 20. This can undoubtedly better share the heat flux density, and thus improve the heat dissipation capacity of the radiator.

[0060] The first heat pipe 20 and the second heat pipe 60 may be metal pipes with good heat dissipation performance, such as copper pipes, aluminum pipes, etc. The heat dissipation base 10 may be a cavity structure formed by a metal member, and the material of the heat dissipation base 10 may be copper, aluminum, iron, etc. The embodiments of the present application do not limit the specific materials of the first heat pipe 20, the second heat pipe 60, and the heat dissipation base 10.

[0061] The radiator disclosed in the embodiments of the present application can be applied to the heat dissipation scenarios of high-power and high-heat flux density chips, and can also be applied to the heat dissipation scenarios of large servers, and is not limited to scenarios such as the heat dissipation of communication products, automobiles, and consumer electronic products.

[0062] Based on the radiator disclosed in the embodiments of the present application, the embodiments of the present application further disclose an electronic device. The disclosed electronic device includes the radiator described in the above embodiments. The electronic device disclosed in the embodiments of the present application may be a heat-generating device such as a large server or a distribution box. The embodiments of the present application do not limit the specific types of the electronic device.

[0063] In the above embodiments of the present application, the differences between the various embodiments are mainly described. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity of the description, they will not be elaborated here.

[0064] The embodiments of the present application have been described above with reference to the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the spirit and scope protected by the claims of the present application, and all of them fall within the protection scope of the present application.

Claims

1. A radiator, characterized in that, It includes a heat dissipation base (10) and a first heat pipe (20). The heat dissipation base (10) is provided with an evaporation chamber (11) which is provided with a first phase change medium. Both ends of the first heat pipe (20) are closed ends. A second phase change medium is provided in the lumen (21) of the first heat pipe (20). The evaporation end (22) of the first heat pipe (20) is connected to the heat dissipation surface (12) of the heat dissipation base (10) and extends away from the heat dissipation base (10). The lumen (21) of the first heat pipe (20) is isolated from the evaporation chamber (11).

2. The radiator according to claim 1, wherein, The evaporation end (22) of the first heat pipe (20) is a flat structure end, and the flat structure end is connected to the heat dissipation surface (12) by surface-to-surface fitting.

3. The radiator according to claim 2, characterized in that, The heat dissipation base (10) is a heat spreader, the heat dissipation surface (12) is a plane, and the evaporation end (22) of the first heat pipe (20) is a flat structure end.

4. The radiator according to claim 1, wherein The radiator further includes a first heat dissipation structure (01). The condensation end (23) of the first heat pipe (20) is connected in the first heat dissipation structure (01), and the first heat dissipation structure (01) is provided with a first air passage penetrating along a first preset direction.

5. The radiator according to claim 4, wherein There are multiple first heat pipes (20). The evaporation ends (22) of the multiple first heat pipes (20) are connected to the heat dissipation surface (12) at intervals. Any two of the first heat pipes (20) are spaced apart. The multiple first heat pipes (20) are distributed in at least two groups. The first heat dissipation structure (01) includes multiple sub-heat dissipation structures (011). The condensation ends (23) of each group of the first heat pipes (20) are connected in the corresponding sub-heat dissipation structure (011), and each sub-heat dissipation structure (011) is provided with the first air passage penetrating along the first preset direction.

6. The radiator according to claim 5, characterized in that Each sub-heat dissipation structure (011) includes multiple first heat dissipation fins (30) and a first surrounding plate (40). The multiple first heat dissipation fins (30) are stacked and distributed. The first surrounding plate (40) surrounds the periphery of the whole formed by the stacked multiple first heat dissipation fins (30) to enclose the first heat dissipation gap between two adjacent first heat dissipation fins (30) into the first air passage.

7. The radiator according to claim 4, wherein The radiator further includes a connection substrate (50). The connection substrate (50) is fixedly connected to the heat dissipation base (10), and the first heat dissipation structure (01) is supported on the connection substrate (50).

8. The radiator according to claim 1, wherein The condensation end (23) of the first heat pipe (20) is higher than the evaporation end (22) of the first heat pipe (20).

9. The radiator according to claim 1, wherein The second phase change medium is water, and a first capillary structure (24) is provided in the first heat pipe (20); or the freezing point of the second phase change medium is lower than the freezing point.

10. The radiator according to claim 1, wherein The radiator further includes a second heat pipe (60). The evaporation end (61) of the second heat pipe (60) is an open end and communicates with the lumen (62) of the second heat pipe (60) and the evaporation chamber (11). The condensation end (63) of the second heat pipe (60) extends in a direction away from the heat dissipation surface (12). The second heat pipe (60) is located in the space surrounded by the edge of the heat dissipation surface (12).

11. The radiator according to claim 10, characterized in that, The second heat pipe (60) is perpendicular to the heat dissipation surface (12).

12. The radiator according to claim 10, wherein, There are multiple second heat pipes (60), which are distributed on the heat dissipation surface (12) in a preset manner.

13. The radiator according to claim 10, characterized in that, A second capillary structure (64) is provided in the second heat pipe (60), and a third capillary structure (13) is provided in the evaporation chamber (11). The second capillary structure (64) is connected to the third capillary structure (13) to form a liquid guiding structure.

14. The radiator according to claim 10, characterized in that, The radiator further includes a second heat dissipation structure (02). The condensation end (63) of the second heat pipe (60) is connected to the second heat dissipation structure (02). The second heat dissipation structure (02) is provided with a second air passage penetrating along a second preset direction.

15. The radiator according to claim 14, characterized in that, The second heat dissipation structure (02) includes a plurality of second heat dissipation fins (70) and a second enclosing plate (80). The plurality of second heat dissipation fins (70) are stacked and distributed. The second enclosing plate (80) surrounds the periphery of the whole formed by the stacking of the plurality of second heat dissipation fins (70) to enclose the second heat dissipation gap between two adjacent second heat dissipation fins (70) into the second air passage.

16. The radiator according to claim 14, characterized in that, The inlet or outlet of the second air passage faces the condensation end (23) of the first heat pipe (20) or other parts of the first heat pipe (20) except its evaporation end (22).

17. The radiator according to claim 1, wherein The heat dissipation base (10) is a heat pipe, and both opposite plate surfaces of the heat pipe are the heat dissipation surfaces (12). Each heat dissipation surface (12) is connected with a first heat pipe (20).

18. The radiator according to any one of claims 1 to 17, characterized in that, The condensation end (23) of the first heat pipe (20) extends beyond the edge of the heat dissipation surface (12).

19. An electronic device, characterized in that, A radiator according to any one of claims 1 to 18 is included.

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