Heat dissipation structure and DC-DC converter

Abstract

The invention discloses a heat dissipation structure and a DC-DC converter, the heat dissipation structure is used for heat dissipation of an electrical part, the electrical part is provided with a first heat dissipation surface and a second heat dissipation surface which are deviated from each other, and the heat dissipation structure comprises a first heat dissipation part and a second heat dissipation part; one surface of the first heat dissipation part is attached to the first heat dissipation surface of the electrical part; the second heat dissipation piece exchanges heat with the first heat dissipation piece, and one face of the second heat dissipation piece is attached to the second heat dissipation face of the electrical piece. The DC-DC converter comprises the heat dissipation structure. The device is high in heat dissipation efficiency and low in power consumption.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation, and particularly to a heat dissipation structure and a DC-DC converter. Background Art

[0002] With the rapid development of new energy vehicles and intelligent in-vehicle systems, as a core component of the in-vehicle power supply, the DC-DC converter needs to achieve efficient power conversion under harsh working conditions. However, the in-vehicle environment poses extremely high requirements on the reliability of the DC-DC converter, and its temperature fluctuates violently (-40°C to 125°C). Especially for high-power-consuming components on the circuit board, such as the DC-DC module. In traditional designs, the DC-DC module is mostly welded to the substrate through planar layout, and the heat needs to be transferred to the shell through multiple interfaces, with a long path and a large thermal resistance, and it is easy to form local hot spots under vibration, leading to performance degradation or even burnout of the device. Therefore, how to construct a heat dissipation system with low thermal resistance and efficient temperature uniformity has become a key challenge for improving the reliability of in-vehicle DC-DC converters and is also a technical bottleneck that needs to be broken through in this field. Summary of the Invention

[0003] The object of the present invention is to overcome the above-mentioned defects or problems in the background art and provide a heat dissipation structure and a DC-DC converter with high heat dissipation efficiency and low power consumption.

[0004] To achieve the above object, the present invention and its preferred embodiments adopt the following technical solutions, but the embodiments are not limited to the following solutions:

[0005] Technical solution one and its related embodiments relate to a heat dissipation structure for dissipating heat from an electrical component. The electrical component is provided with a first heat dissipation surface and a second heat dissipation surface facing away from each other. The heat dissipation structure includes a first heat dissipation member, one side of which is attached to the first heat dissipation surface of the electrical component; and a second heat dissipation member that exchanges heat with the first heat dissipation member, and one side of which is attached to the second heat dissipation surface of the electrical component.

[0006] Based on technical solution one, there is also technical solution two. In technical solution two and its related embodiments, the first heat dissipation member has a circulating through-flow channel for liquid or gas.

[0007] Based on technical solution two, there is also technical solution three. In technical solution three and its related embodiments, the first heat dissipation surface and the second heat dissipation surface are arranged along a first direction; the first heat dissipation member is provided with two relatively opposed first heat absorption surfaces spaced apart along the first direction, and the second heat dissipation member is disposed between the two first heat absorption surfaces and is provided with two heat conduction surfaces respectively opposite to the two first heat absorption surfaces; the relatively opposed first heat absorption surface and the heat conduction surface are respectively attached to the first heat dissipation surface and the second heat dissipation surface of the same electrical component facing away from each other.

[0008] Based on Technical Solution Three, there is also provided Technical Solution Four. In Technical Solution Four and its related embodiments, the first heat dissipation member is provided with a heat dissipation cavity. The heat dissipation cavity is provided with two first cavity walls that are parallel and opposite to each other along a first direction and a second cavity wall connecting the two first cavity walls. The second heat dissipation member is disposed in the heat dissipation cavity and supported on the second cavity wall. The circulating through-flow channel includes a first flow channel embedded in the first cavity wall, and the inner surface of the first cavity wall forms a first heat absorption surface. The second heat dissipation member is provided with a liquid / gas flow channel connected in series between the two first flow channels.

[0009] Based on Technical Solution Three, there is also provided Technical Solution Five. In Technical Solution Five and its related embodiments, the first heat dissipation member is provided with a heat dissipation cavity. The heat dissipation cavity is provided with two first cavity walls that are parallel and opposite to each other along a first direction and a second cavity wall connecting the two first cavity walls. The second heat dissipation member is disposed in the heat dissipation cavity and supported on the second cavity wall. The circulating through-flow channel includes a first flow channel embedded in the first cavity wall and a second flow channel embedded in the second cavity wall. The inner surface of the first cavity wall forms a first heat absorption surface, and the inner surface of the second cavity wall forms a second heat absorption surface for heat exchange with the second heat dissipation member.

[0010] Based on Technical Solution Five, there is also provided Technical Solution Six. In Technical Solution Six and its related embodiments, the second heat dissipation member includes at least one heat transfer assembly. Each heat transfer assembly includes two heat transfer members. The heat transfer members are made of a heat-conducting material and form a continuous heat-conducting structure. The continuous heat-conducting structure includes a heat absorption portion and a heat dissipation portion that communicate with each other. The heat absorption portions of the two heat transfer members are arranged parallel to each other along the first direction, and the two surfaces of the two heat absorption portions facing away from each other respectively form the heat-conducting surfaces. The heat dissipation portions of the two heat transfer members are close to each other or communicate with each other along the first direction to concentrate heat exchange with the first heat dissipation member. Among them, the continuous heat-conducting structure is configured to achieve heat transfer from the heat absorption portion to the heat dissipation portion through the heat conduction path of the heat-conducting material and / or the heat transfer path of the medium in the continuous heat-conducting structure. The first heat dissipation member is provided with a second heat absorption surface that fits with the heat dissipation portions of the two heat transfer members.

[0011] Based on Technical Solution Six, there is also provided Technical Solution Seven. In Technical Solution Seven and its related embodiments, the heat transfer member dissipates heat through fluid phase change. The second heat dissipation member includes at least two heat transfer assemblies, and each heat transfer assembly is arranged along a second direction perpendicular to the first direction. The heat-conducting surfaces of the heat absorption portions on the same side are located on the same plane.

[0012] Based on Technical Solution Seven, there is also provided Technical Solution Eight. In Technical Solution Eight and its related embodiments, the heat dissipation portion is arc-shaped, and the heat dissipation portions of the two heat transfer members communicate with each other so that the two heat transfer members of the heat transfer assembly are integrally formed and form a U-shaped opening structure. The second heat absorption surface is convexly provided with a heat transfer block that fits with the heat dissipation portion of the heat transfer assembly.

[0013] Based on Technical Solution VIII, there is also provided Technical Solution IX. In Technical Solution IX and its related embodiments, an inlet / outlet connector for liquid / gas arranged along the first direction and an outlet / inlet connector for liquid / gas are provided on the first side of the first heat dissipation member in the heat dissipation cavity along the second direction, and the inlet / outlet connector for liquid / gas and the outlet / inlet connector for liquid / gas are respectively communicated with two first flow channels; the heat dissipation cavity further has two third cavity walls parallel and opposite to each other along the second direction, and the second cavity wall connects the two third cavity walls; one end of the third cavity wall close to the second cavity wall on the second side of the first heat dissipation member along the second direction is provided with a third flow channel, and the third flow channel is communicated with both of the two first flow channels. The second flow channel is provided with a partition extending along the second direction to divide the second flow channel into second sub-flow channels respectively communicated with the two first flow channels. The heat transfer block and the partition overlap each other in the projection on the plane perpendicular to the third direction, and the third direction is perpendicular to the first direction and the second direction.

[0014] Based on Technical Solution IX, there is also provided Technical Solution X. In Technical Solution X and its related embodiments, guiding grooves respectively adapted to the two ends of the electrical component along the second direction are provided oppositely on the two third cavity walls.

[0015] Based on Technical Solution VIII, there is also provided Technical Solution XI. In Technical Solution XI and its related embodiments, one end of each of the two heat absorption parts of each heat transfer assembly away from the heat dissipation part is respectively provided with a first contraction section and a second contraction section. The length of the first contraction section along the second direction is less than the length of the second contraction section along the second direction, and the first contraction sections and the second contraction sections of each heat transfer assembly are arranged alternately along the second direction.

[0016] Based on any one of Technical Solutions V to XI, there is also provided Technical Solution XII. In Technical Solution XII and its related embodiments, the second heat dissipation member is further provided with a fixing seat made of a metal material, and the fixing seat is used for fixedly connecting with the first heat dissipation member and the electrical component; each part of the heat transfer assembly is attached to the outer wall of the fixing seat, the heat absorption part extends along a third direction perpendicular to the first direction, and at least part of the heat dissipation part of the heat transfer assembly is located on one side of the fixing seat along the third direction perpendicular to the first direction.

[0017] Based on Technical Solution XII, there is also provided Technical Solution XIII. In Technical Solution XIII and its related embodiments, accommodating grooves extending along the third direction are respectively provided on both sides of the fixing seat along the first direction, and the heat absorption parts of each heat transfer assembly are located in the accommodating grooves and attached to the bottom of the accommodating grooves.

[0018] Based on Technical Solution XII, there is also provided Technical Solution XIV. In Technical Solution XIV and its related embodiments, a through channel extending along the second direction perpendicular to the first direction and the third direction and penetrating is provided in the fixing seat; each part of the heat transfer assembly is attached to the outer wall of the through channel.

[0019] Based on Technical Solution Fourteen, there is also provided Technical Solution Fifteen. In Technical Solution Fifteen and its related embodiments, a reinforcing portion protruding from the inner wall of the through-channel is provided in the middle of the fixed seat along the second direction.

[0020] Based on Technical Solution Fifteen, there is also provided Technical Solution Sixteen. In Technical Solution Sixteen and its related embodiments, one end of the through-channel away from the heat dissipation portion is open; the reinforcing portion is provided with two reinforcing ribs respectively protruding from the inner walls on both sides of the through-channel along the first direction. Each reinforcing rib extends along the third direction and is provided with a first connecting portion protruding out of the through-channel. The first connecting portion is integrally connected to the end face of the open end of the through-channel and is used for connecting with an electrical component.

[0021] Based on Technical Solution Sixteen, there is also provided Technical Solution Seventeen. In Technical Solution Seventeen and its related embodiments, a second connecting portion and a third connecting portion are respectively provided on both sides of one end of the fixed seat close to the heat dissipation portion along the first direction. The second connecting portion and the third connecting portion are both used for connecting with an electrical component and have different structures.

[0022] Based on Technical Solution Six, there is also provided Technical Solution Eighteen. In Technical Solution Eighteen and its related embodiments, the heat transfer member dissipates heat through heat conduction, and the heat transfer assembly is integrally formed with the second cavity wall.

[0023] Technical Solution Nineteen and its related embodiments relate to a DC-DC converter, including the heat dissipation structure according to any one of Technical Solutions One to Eighteen and at least one electrical component. The electrical component is provided with a first heat dissipation surface and a second heat dissipation surface facing away from each other.

[0024] Based on Technical Solution Nineteen, there is also provided Technical Solution Twenty. In Technical Solution Twenty and its related embodiments, the electrical component includes a circuit board and a heating element mounted on one side of the circuit board. The circuit board is also provided with an avoidance opening corresponding to the heating element; the front surface of the heating element away from the circuit board forms the first heat dissipation surface, and the back surface of the heating element close to the circuit board forms the second heat dissipation surface; one surface of the second heat dissipation member penetrates through the avoidance opening of the circuit board and is attached to the second heat dissipation surface of the heating element.

[0025] Based on Technical Solution Twenty, there is also provided Technical Solution Twenty-one. In Technical Solution Twenty-one and its related embodiments, the gaps between the electrical component and the first heat dissipation member and the second heat dissipation member are all filled with thermal conductive glue.

[0026] Based on Technical Solution Twenty-one, there is also provided Technical Solution Twenty-two. In Technical Solution Twenty-two and its related embodiments, the gaps between the second heat dissipation member and the first heat dissipation member are all filled with thermal conductive glue.

[0027] From the above description of the present invention and its preferred embodiments, it can be seen that, compared with the prior art, the technical solution of the present invention and its preferred embodiments have the following beneficial effects due to the adoption of the following technical means:

[0028] In the technical solution 1 and its preferred embodiment, one side of the first heat sink is "attached" to the first heat sink surface of the electrical component, and one side of the second heat sink is "attached" to the second heat sink surface of the electrical component. "Attachment" includes both direct attachment and attachment through heat-conducting materials. The "heat exchange" between the second heat sink and the first heat sink includes both solid-state heat exchange formed by direct contact heat conduction (such as metal interface attachment) or indirect heat transfer (such as through an intermediate medium), and also includes heat exchange caused by heat transfer between the first heat sink and the second heat sink through a dynamically circulating fluid working medium.

[0029] In the present technical solution, the pasting design directly contacts the electrical parts, reducing the contact thermal resistance. The heat is conducted from the first heat dissipation surface and the second heat dissipation surface of the electrical parts to the first heat dissipation member and the second heat dissipation member respectively, avoiding the accumulation of thermal resistance in a single heat dissipation path, and achieving higher heat dissipation efficiency. The double-sided heat dissipation reduces the temperature difference between the first heat dissipation surface and the second heat dissipation surface of the electrical parts which are opposite to each other, and prevents thermal stress or performance degradation of the material caused by the temperature gradient. Heat redistribution is achieved between the first heat dissipation member and the second heat dissipation member through heat exchange (such as heat conduction or convection). After the second heat dissipation member absorbs the heat from the second heat dissipation surface, it transfers it to the first heat dissipation member, realizing the secondary transfer of heat. The first heat dissipation member can simultaneously process the direct heat from the first heat dissipation surface and the heat transferred through the second heat dissipation member. Compared with the electrical parts, which require two independent heat dissipation systems to achieve double-sided heat dissipation through design, no additional heat dissipation components are required, and the power consumption of redundant heat dissipation components (such as additional pumps and fans) is reduced. The heat exchange between the first heat dissipation member and the second heat dissipation member can form a closed or semi-closed thermal circulation system, thereby enhancing the dynamic heat dissipation capability of the heat dissipation structure.

[0030] Therefore, this technical solution significantly improves the heat dissipation efficiency of electrical components, reduces the operating temperature of electrical components, and extends the service life of electrical components through the coordination of double-sided contact heat dissipation and heat exchange, and the power consumption of the heat dissipation structure is low.

[0031] In technical solution two and its preferred embodiment, the first heat sink has a circulating through flow channel for liquid or gas. The circulating through flow channel of the first heat sink quickly takes away the heat of the first heat sink surface through active liquid cooling / air cooling. Compared with pure heat conduction or natural convection, the heat dissipation efficiency is high and local high temperature can be effectively reduced. Combined with technical solution one, this technical solution uses a double-sided heat dissipation design of the first heat sink (liquid / gas circulation) and the second heat sink, so that the heat of the first heat sink surface and the second heat sink surface of the electrical component is simultaneously extracted and the contact thermal resistance is small. If the electrical component only relies on the first heat sink for heat dissipation, the temperature difference between the first heat sink surface and the second heat sink surface of the electrical component is large, and a cooling medium with a higher flow rate / flow rate needs to be forced to cool down in the circulating through flow channel. The power consumption of the first heat sink is large. After the second heat sink and the first heat sink cooperate to dissipate heat, the temperature distribution of the first heat sink surface and the second heat sink surface of the electrical component is more uniform, the temperature rise of the cooling medium is reduced, the required flow rate / flow rate is reduced under the same heat dissipation capacity, and the power consumption of the first heat sink is reduced.

[0032] In the technical solution three and its preferred embodiment, the first heat absorbing surface and the heat conducting surface facing each other are respectively attached to the first heat dissipation surface and the second heat dissipation surface of the same electrical component which are away from each other, so that the two electrical components can dissipate heat synchronously on both sides of the heat dissipation structure along the first direction, and each electrical component can export heat through its own first heat absorbing surface and heat conducting surface, without interfering with each other, with high heat dissipation efficiency, and the two electrical components can share the same heat dissipation structure, reducing the volume of the equipment and making the structure compact. This advantage is particularly prominent when the heat dissipation structure is applied to a vehicle environment, because the space of the vehicle power supply is relatively compact, and compared with configuring a heat dissipation structure for each electrical component separately, it is more conducive to saving materials and assembly costs; wherein, the second heat dissipation component transfers the heat on both sides to the first heat dissipation component through the heat conducting surface, thereby improving the utilization rate of the circulating through-flow channel. In addition, the provision of the two first heat absorbing surfaces also makes the heat on both sides of the first heat dissipation component evenly distributed, avoiding stress concentration caused by unilateral heat concentration.

[0033] In Technical Solution 4 and its preferred embodiments, the integrated design of embedding the circulating through-flow channel into the cavity wall of the heat dissipation cavity and the design of connecting the second heat dissipation member in series between the two first flow channels can reduce external pipeline connections, lower the leakage risk, and save more space, making the overall volume of the heat dissipation structure smaller. The inner surface of the first cavity wall forms a first heat absorption surface, enabling the first heat absorption surface to have a high heat absorption efficiency, thereby improving the heat dissipation efficiency of the electrical component. The second heat dissipation member is provided with a liquid / gas flow channel connected in series between the two first flow channels, such that the two first flow channels form a closed circulation loop through the second heat dissipation member. As a series connection node, the second heat dissipation member can well balance the flow distribution of the two first flow channels, ensuring the heat dissipation uniformity of the two first heat dissipation surfaces. The heat absorbed by one of the first flow channels is relayed through the liquid / gas flow channel of the second heat dissipation member to the other first flow channel, forming a continuous heat transfer link and reducing the thermal resistance. In addition, this design enables the heat dissipation structure to dissipate heat for two electrical components, and the two electrical components occupy less space in the first direction, which is beneficial to the miniaturization design of the heat dissipation structure along the first direction when applied to a DC-DC converter.

[0034] In Technical Solution 5 and its preferred embodiments, the integrated design of embedding the circulating through-flow channel into the cavity wall of the heat dissipation cavity can reduce external pipeline connections, lower the leakage risk, and save more space, making the overall volume of the heat dissipation structure smaller. The inner surface of the first cavity wall forms a first heat absorption surface, and the inner surface of the second cavity wall forms a second heat absorption surface, enabling the first heat absorption surface and the second heat absorption surface to have a high heat absorption efficiency, thereby improving the heat dissipation efficiency of the electrical component. Among them, the heat dissipation cavity provides physical support and a heat exchange interface (the second heat absorption surface) for the second heat dissipation member, increasing the contact area between the second heat dissipation member and the first heat dissipation member. In addition, this design enables the heat dissipation structure to dissipate heat for two electrical components, and the two electrical components occupy less space in the first direction, which is beneficial to the miniaturization design of the heat dissipation structure along the first direction when applied to a DC-DC converter.

[0035] In technical solution six and its preferred embodiment, the heat dissipation part is attached to the second heat absorbing surface. "Attachment" includes both direct attachment and attachment through heat conductive materials. "Continuous heat conductive structure" means a physical structure formed by the heat conductive material of the heat transfer element without heat flow interruption between the heat absorbing part and the heat dissipation part, which realizes the directional migration of heat from the heat absorbing part to the heat dissipation part through at least one of the following two heat transfer modes: one is solid-state heat conduction, in which case the heat dissipation part and the second heat absorbing surface exchange heat to achieve heat dissipation; the other is medium heat transfer, which relies on the workpiece encapsulated inside the heat transfer element. The heat transfer element has a closed fluid circulation path in which the fluid flows in the heat transfer element without exchanging the medium with the external environment. The heat absorbing part can absorb external heat through fluid phase change or forced flow, and the heat dissipating part can release heat through the fluid with the help of a radiator or external circulation (such as a liquid cooling pump, fan, heat sink, secondary cooling system, etc.). Therefore, the heat transfer element can realize the heat absorption and heat dissipation functions through fluid phase change (such as heat pipe evaporation / condensation) or through forced flow (such as liquid cooling pump drive).

[0036] The two heat-absorbing parts parallel to each other uniformly absorb the heat of the electrical components, and the heat dissipation parts of the two heat transfer parts are close to each other or connected to each other along the first direction, so that the heat dissipation parts of the heat transfer components are centrally designed, thereby reducing the contact area with the first heat dissipation part. Therefore, the technical solution can use the efficient heat transfer characteristics of the heat transfer part to quickly export the heat of the second heat dissipation surface of the electrical component.

[0037] In technical solution seven and its preferred embodiments, the heat transfer element dissipates heat through fluid phase change, which has high heat dissipation efficiency compared to solid-state heat conduction or convection cycle, and compared to convection cycle, does not require an external pump or mechanical drive and has a simple structure; the second heat dissipation element includes at least two heat transfer components, and each heat transfer component is arranged along a second direction perpendicular to the first direction; the heat conduction surfaces of the heat absorption part on the same side are located on the same plane. On the one hand, the heat conduction area of the second heat dissipation element can be expanded by increasing the number of heat transfer components as needed. On the other hand, since the heat transfer element dissipates heat through fluid phase change, compared with a solution with a heat transfer component with a relatively long length along the second direction, the redundant reliability of the heat transfer component when a failure occurs is improved; in addition, the heat conduction surfaces on the same side are coplanar, which can ensure uniform contact between the heat transfer component and the electrical component and reduce assembly tolerance requirements.

[0038] In Technical Solution VIII and its preferred embodiments, the heat dissipation part is arc-shaped, and the heat dissipation parts of the two heat transfer members communicate with each other so that the two heat transfer members of the heat transfer assembly are integrally formed and form a U-shaped opening structure, which has a simpler structure, lower process cost and smaller required space. Under the condition that the length of the second heat dissipation member along the first direction is certain, the length of the heat dissipation part can be extended, and the flow resistance of the fluid in the heat transfer member can be reduced, thereby improving the heat exchange efficiency and the heat dissipation efficiency of the second heat dissipation member. The second heat absorption surface is convexly provided with a heat transfer block that fits the heat dissipation part of the heat transfer assembly, further increasing the heat exchange area between the second heat dissipation member and the first heat dissipation member and improving the heat dissipation efficiency of the second heat dissipation member.

[0039] In Technical Solution IX and its preferred embodiments, the second flow channel is provided with a partition extending along the second direction to divide the second flow channel into second sub-flow channels communicating with the two first flow channels, so that the two first flow channels respectively form an inlet flow channel and an outlet flow channel. The coolant or cold air enters one of the first flow channels and one of the second sub-flow channels from the inlet / outlet joint, then flows into the other first flow channel and the other second sub-flow channel through the third flow channel, and then flows to the outlet / inlet joint, realizing the circulation of the coolant or cold air; the projections of the heat transfer block and the partition on the projection plane perpendicular to the third direction overlap each other. On the one hand, the strength of the heat transfer block is improved, so that the heat transfer block forms a better support for the second heat dissipation member; on the other hand, the heat of the heat dissipation part can be transmitted to the partition through the heat transfer block, and the heat can be evenly distributed along the partition to the two second sub-flow channels to avoid local overheating.

[0040] In Technical Solution X and its preferred embodiments, the setting of the guiding groove realizes the rapid and accurate assembly of the heat dissipation structure and the electrical component, and the guiding groove can also limit the electrical component along the second direction, realizing the stable connection between the electrical component and the heat dissipation structure.

[0041] In Technical Solution XI and its preferred embodiments, since the heat transfer member dissipates heat through fluid phase change and the heat transfer member is in the form of a heat pipe, during the processing of the heat transfer assembly, two shrinkage sections will inevitably be formed at both ends of the heat transfer assembly, and the contribution of these two shrinkage sections to heat dissipation is small. In this technical solution, the length of the first shrinkage section along the second direction is less than the length of the second shrinkage section along the second direction, and the first shrinkage sections and the second shrinkage sections of each heat transfer assembly are alternately arranged along the second direction, which is beneficial to balancing the influence of the first shrinkage sections and the second shrinkage sections on both sides of the second heat dissipation member along the first direction on the heat dissipation efficiency, and is more beneficial to the heat dissipation balance on both sides of the second heat dissipation member.

[0042] In technical solution twelve and its preferred embodiments, the fixing seat is made of metal material, so that the fixing seat is easy to process and cast into a structure that fits the inner wall of the heat transfer component and has high structural strength; all parts of the heat transfer component fit the outer wall of the metal fixing seat, which means that the two heat absorbing parts and the two heat dissipating parts of the heat transfer component fit the outer wall of the fixing seat. This arrangement can improve the structural stability of the heat transfer component and enable the heat of the heat transfer component to be transferred to the fixing seat and dissipated by the fixing seat. Advantageously, the heat of the heat dissipating part can be transferred to the fixing seat, thereby improving the heat dissipation efficiency of the heat dissipating part and further improving the heat dissipation efficiency of the heat transfer component; in addition, this also means that the two heat absorbing parts are respectively fitted to the two surfaces of the fixing seat that are away from each other along the first direction, which can balance the stress distribution on both sides of the heat transfer component and prevent deformation of the heat transfer component. The fixing seat realizes the rigid connection between the first heat sink and the second heat sink, and realizes the rigid connection between the heat dissipation structure and the electrical component, thereby ensuring the stability of the first heat dissipation surface and the second heat dissipation surface of the electrical component under a long-term vibration environment. At the same time, it is also beneficial to make the electrical component and the second heat sink form an integral module and be installed in the heat dissipation cavity of the first heat sink during installation, thereby reducing the difficulty of installation. It should be understood that when the heat transfer component realizes the heat absorption and heat dissipation functions through fluid phase change (such as heat pipe evaporation / condensation), although the fixing seat is made of metal, due to the characteristics of the heat transfer component, the heat transfer component transfers heat through the phase change of the internal working fluid (liquid evaporation-gas flow-condensation reflux), and its equivalent thermal conductivity can reach 10,000-100,000W / (m·K), which is much higher than that of metal material. Therefore, the metal fixing seat has little effect on the temperature difference between the heat dissipation part and the heat absorption part. When the heat transfer component realizes heat absorption and heat dissipation functions through forced drive (such as liquid cooling pump drive) or through solid-state heat conduction, the high thermal conductivity of the metal fixing seat can quickly diffuse the local heat to the entire heat absorption part, avoiding heat accumulation near the contact point of the heat absorption part and reducing the risk of local overheating. The metal fixing seat can serve as a supporting structure for the heat dissipation part (such as a liquid cooling radiator) and assist in transferring heat from the heat dissipation part to the external environment.

[0043] In the technical solution thirteen and its preferred embodiment, the receiving groove extends along the third direction, and the heat absorbing part of each heat transfer component is located in the receiving groove and fits the groove bottom of the receiving groove. The receiving groove can play a certain role in pre-positioning the heat transfer component during the process of the heat transfer component fitting outside the fixing seat. The heat absorbing part fits the groove bottom of the receiving groove, which can further enhance the mechanical stability and avoid deformation of the heat transfer component due to vibration. In addition, the two groove side walls of the metal receiving groove can be used to fit with the back of the heating element, further increasing the heat dissipation efficiency of the electrical component.

[0044] In technical solution fourteen and its preferred embodiment, a through channel extending and penetrating along the second direction is provided in the fixing seat, so that the heat of the heat dissipation part can be transferred to the fixing seat and then dissipated by the through channel in the fixing seat. The heat exchange efficiency of the heat dissipation part is high, which further improves the heat dissipation efficiency of the second heat dissipation element. When the heat dissipation structure is applied to a DC-DC converter, the through channel can be filled with thermal conductive glue to further enhance the heat dissipation efficiency of the through channel. In addition, the provision of the through channel can also reduce production materials, reduce production costs and reduce the weight of the fixing seat.

[0045] In technical solution fifteen and its preferred embodiment, the provision of the reinforcement portion is helpful in compensating for the influence of reduced strength caused by the through-channel structure, and the reinforcement portion is located in the middle of the fixing seat along the second direction, which has a better reinforcement effect on the fixing seat.

[0046] In technical solution sixteen and its preferred embodiments, the first connecting portion is connected as one piece with the end face of the opening end of the through-channel and is used to connect with the electrical component, so that the reinforcement portion can not only strengthen the structural stability of the fixed seat, but also realize the connection with the electrical component. The first connecting portion is connected as one piece with the end face of the opening end of the through-channel, so that the first connecting portion has a longer length along the first direction, and the structural strength of the first connecting portion is large.

[0047] In technical solution seventeen and its preferred embodiment, a second connecting portion and a third connecting portion are respectively provided on both sides along the first direction of one end of the fixing seat close to the heat dissipation portion, and the second connecting portion and the third connecting portion are both used to connect with the electrical components and have different structures, so that the electrical components are connected to both sides of the fixing seat along the third direction, and the structure is more stable. In addition, the structures of the second connecting portion and the third connecting portion are different, so that when the structures of two electrical components are the same during installation, a fool-proof design can be formed to avoid misinstallation.

[0048] In Technical Solution 18 and its preferred embodiments, the heat transfer element dissipates heat through heat conduction, which can avoid the risk of fluid leakage and adapt to high-frequency vibration environments. The heat transfer component and the second cavity wall are integrally formed to reduce interface thermal resistance and improve heat transfer efficiency.

[0049] Technical solution nineteen and its preferred embodiments have the technical advantages of any one of technical solutions one to seventeen.

[0050] In Technical Solution 20 and its preferred embodiments, in the prior art, the heat on the back of the heating element needs to be conducted to the first heat sink through the circuit board, but the circuit board itself has a low thermal conductivity and a large thermal resistance. In this technical solution, the second heat sink penetrates the circuit board to dissipate heat for the second heat dissipation surface of the heating element, eliminating the conduction link of the circuit board, so that the heat of the heating element can be directly extracted, shortening the heat transfer path and reducing the thermal resistance; in addition, the first heat sink is embedded in the circuit board, so that after the heat dissipation structure is combined with the heating element, the length along the first direction is shorter and the space occupied is smaller.

[0051] In Technical Solution Twenty-One and its preferred embodiments, the gaps between the electrical components and the first heat sink and the second heat sink are filled with thermal conductive adhesive. The filling of the thermal conductive adhesive can eliminate the microscopic voids or large gaps on the contact surfaces of the electrical components with the first heat sink and the second heat sink, reducing the interfacial thermal resistance; at the same time, it provides mechanical buffering to prevent stress damage to the circuit board and the second heat sink due to differences in the coefficients of thermal expansion.

[0052] In Technical Solution Twenty-Two and its preferred embodiments, the gaps between the second heat sink and the first heat sink are filled with thermal conductive adhesive. The filling of the thermal conductive adhesive can eliminate the microscopic voids or large gaps on the contact surfaces of the second heat sink and the first heat sink, reducing the interfacial thermal resistance; at the same time, it provides mechanical buffering. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0054] Figure 1 Schematic diagram of the heat dissipation structure of Embodiment 1 of the present application;

[0055] Figure 2 Three-dimensional cross-section of the heat dissipation structure of Embodiment 1 of the present application Figure 1 ;

[0056] Figure 3 Three-dimensional cross-section of the heat dissipation structure of Embodiment 1 of the present application Figure 2 ;

[0057] Figure 4 Schematic diagram of the first heat sink of Embodiment 1 of the present application;

[0058] Figure 5 Three-dimensional exploded view of the second heat sink and two electrical components of Embodiment 1 of the present application;

[0059] Figure 6 Three-dimensional view of the second heat sink and two electrical components of Embodiment 1 of the present application;

[0060] Figure 7 For Figure 6 Top view;

[0061] Figure 8 For Figure 6 Three-dimensional cross-sectional view;

[0062] Figure 9 Schematic diagram of the second heat sink of Embodiment 1 of the present application;

[0063] Figure 10 Schematic diagram of the heat transfer component according to Embodiment 1 of the present application;

[0064] Figure 11 Schematic diagram of the heat dissipation structure according to Embodiment 2 of the present application;

[0065] Figure 12 Schematic diagram of the heat dissipation structure according to Embodiment 3 of the present application;

[0066] Figure 13 Exploded perspective view of the DC-DC converter according to Embodiment 4 of the present application.

[0067] Description of main reference numerals:

[0068] First heat dissipation member 10; heat dissipation cavity 01; first cavity wall 11; first heat absorption surface 111; second cavity wall 12; second heat absorption surface 121; heat transfer block 122; connection seat 123; third cavity wall 13; guide groove 131; liquid / gas inlet joint 14; liquid / gas outlet joint 15; circulating through-flow channel 02; first flow channel 021; second flow channel 022; second sub-flow channel 0221; partition 0222; second heat dissipation member 20; heat transfer assembly 21; heat transfer member 211; heat absorption portion 212; heat conduction surface 2121; heat dissipation portion 213; first contraction section 214; second contraction section 215; fixing seat 22; accommodation groove 221; groove side wall 2211; through channel 222; strengthening portion 223; strengthening rib 224; first connection portion 2241; first threaded hole 2242; second connection portion 225; third connection portion 226; second threaded hole 227; guide post 228; connection hole 229; electrical component 30; circuit board 31; avoidance opening 311; through hole 312; heating element 32; first heat dissipation surface 321; second heat dissipation surface 322; mounting seat 40; first area 41; second area 42; third area 43; fourth area 44; cover plate 50; connector 60; filtering module 70; control module 80. Detailed implementation manners

[0069] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are the preferred embodiments of the present invention and should not be regarded as excluding other embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

[0070] In the claims, description and the above-mentioned accompanying drawings of the present invention, unless otherwise clearly defined, when using terms such as "first", "second" or "third", etc., they are all used to distinguish different objects and not for describing a specific order.

[0071] In the claims, the description and the above-mentioned drawings of the present invention, unless otherwise clearly defined, for orientation terms, such as the use of terms "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise", etc. to indicate the orientation or position relationship are based on the orientation and position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, so it should not be construed as limiting the specific protection scope of the present invention.

[0072] In the claims, the description and the above-mentioned drawings of the present invention, unless otherwise clearly defined, if the terms "fixed connection" or "fixedly connected" are used, they should be understood in a broad sense, that is, any connection method without displacement relationship and relative rotation relationship between the two, that is, including non-detachable fixed connection, detachable fixed connection, being integrally connected, and being fixed by other devices or elements.

[0073] In the claims, the description and the above-mentioned drawings of the present invention, if the terms "comprise", "have" and their variants are used, are intended to mean "including but not limited to".

[0074] In the claims and the description except for the embodiments, the terms "first direction", "second direction" and "third direction" only mean that the feature having one of the above directions is perpendicular to the feature having another direction, and it is not required that they must be implemented in the "first direction", "second direction" and "third direction" introduced in the embodiments. In the embodiments, the first direction is perpendicular to the second direction and also perpendicular to the third direction. Exemplarily, the first direction can be divided into left and right, the second direction can be divided into front and rear, and the third direction can be divided into up and down.

[0075] In the claims, the description and the above-mentioned drawings of the present invention, one side of the first heat dissipation member 10 is "attached" to the first heat dissipation surface 321 of the electrical component, and one side of the second heat dissipation member 20 is "attached" to the second heat dissipation surface of the electrical component 30. "Attached" includes both direct attachment and attachment through a heat-conducting material. The "heat exchange" between the second heat dissipation member 20 and the first heat dissipation member 10 includes both solid-state heat exchange formed by direct contact heat conduction (such as metal interface fitting) or indirect heat transfer (such as through an intermediate medium), and heat exchange caused by heat transfer between the first heat dissipation member 10 and the second heat dissipation member 20 through a dynamically circulating fluid working medium.

[0076] Embodiment 1

[0077] See Figures 1-3 , Figure 1 shows a schematic diagram of the heat dissipation structure dissipating heat for two electrical components 30.Figures 2-3 shows a Figure 1 cross-sectional view of two different angles. The heat dissipation structure is used to dissipate heat from the electrical component 30. The electrical component 30 is provided with a first heat dissipation surface 321 and a second heat dissipation surface 322 that face away from each other. The first heat dissipation surface 321 and the second heat dissipation surface 322 are arranged along a first direction. The heat dissipation structure includes a first heat dissipation member 10 and a second heat dissipation member 20.

[0078] One side of the first heat dissipation member 10 is attached to the first heat dissipation surface 321 of the electrical component 30. Refer to Figure 4 , Figure 4 which shows a schematic diagram of the first heat dissipation member 10. The first heat dissipation member 10 is provided with two relatively opposed first heat absorption surfaces 111 at intervals along the first direction. Refer to Figure 2 , and the two first heat absorption surfaces 111 are respectively attached to the first heat dissipation surfaces 321 of the two electrical components 30. In this embodiment, the first heat dissipation member 10 has a circulating through-flow channel 02 for liquid or gas. Specifically, refer to Figure 4 , the first heat dissipation member 10 is provided with a heat dissipation cavity 01. The heat dissipation cavity 01 is provided with two first cavity walls 11 that are parallel and opposed to each other along the first direction and a second cavity wall 12 that connects the two first cavity walls 11. The heat dissipation cavity 01 is further provided with two third cavity walls 13 that are parallel and opposed to each other along a second direction. The second cavity wall 12 connects the two third cavity walls 13. Exemplarily, one end of the heat dissipation cavity 01 is open along a third direction, and the second cavity wall 12 forms the bottom wall of the heat dissipation cavity 01. The first heat dissipation member 10 is provided with a liquid / gas inlet joint 14 and a liquid / gas outlet joint 15 arranged along the first direction on the first side of the heat dissipation cavity 01 along the second direction ( Figure 4 the front side in Figures 2-3 ); refer to Figure 3 , the circulating through-flow channel 02 includes a first flow channel 021 embedded in the first cavity wall 11 and a second flow channel 022 embedded in the second cavity wall 12. The liquid / gas inlet joint 14 and the liquid / gas outlet joint 15 are respectively communicated with the two first flow channels 021; one end of the third cavity wall 13 close to the second cavity wall 12 on the second side of the first heat dissipation member 10 along the second direction ( Figure 3 the rear side in Figure 2 ) is provided with a third flow channel (not shown in the figure) that is communicated with both first flow channels 021. Refer to , the second flow channel 022 is provided with a partition 0222 extending along the second direction to divide the second flow channel 022 into second sub-flow channels 0221 that are communicated with the two first flow channels 021. The second sub-flow channels 0221 are communicated with the third flow channel, so that the two first flow channels 021 respectively form an inlet / outlet liquid / gas flow channel. The coolant or cold air enters one of the first flow channels 021 and one of the second sub-flow channels 0221 from the liquid / gas inlet joint 14, then flows through the third flow channel into the other first flow channel 021 and the other second sub-flow channel 0221, and then flows to the liquid / gas outlet joint 15, realizing the circulation of the coolant or cold air.

[0079] In this embodiment, referring to Figure 4 , on the inner surface of the first cavity wall 11, a first heat absorption surface 111 is formed, and on the inner surface of the second cavity wall 12, a second heat absorption surface 121 for heat exchange with the second heat dissipation member 20 is formed. In this embodiment, the second heat absorption surface 121 is protrudingly provided with a heat transfer block 122 that fits with the heat dissipation portion 213 of the heat transfer component 21 described below. Referring to Figure 2 , the projections of the heat transfer block 122 and the partition 0222 on the projection plane perpendicular to the third direction overlap each other. In this embodiment, referring to Figure 4 , the heat transfer block 122 is located in the middle of the second cavity wall 12 along the second direction, and two connecting seats 123 are respectively provided at both ends of the heat transfer block 122 along the second direction. The two connecting seats 123 can be respectively used to connect with the connecting holes 229 of the fixing seats 22 of the second heat dissipation member 20 described below. Referring to Figure 3 , the two third cavity walls 13 are oppositely provided with guiding grooves 131 adapted to both ends of the electrical component 30. In this embodiment, the guiding grooves 131 are mainly adapted to the circuit board 31 described below. It should be understood that in the embodiments of the present invention, the specific structure of the first heat dissipation member 10 can be flexibly designed according to actual needs. For example, the first heat dissipation member 10 is in the form of a heat dissipation substrate and heat dissipation fins made of a high thermal conductivity material, and its first heat absorption surface 111 and second heat absorption surface 121 are both formed on the heat dissipation substrate. Or the first heat dissipation member 10 can also adopt a combined structure of a heat pipe and heat dissipation fins, and the first heat absorption surface 111 and second heat absorption surface 121 are both formed on the evaporation section of the heat pipe. Those skilled in the art can adaptively adjust the structure of the first heat dissipation member 10 according to the heat dissipation power, space layout, and cost requirements, and are not limited to the heat dissipation methods described in the above embodiments.

[0080] Referring to Figure 2 , the second heat dissipation member 20 exchanges heat with the first heat dissipation member 10, and one side of the second heat dissipation member 20 is attached to the second heat dissipation surface 322 of the electrical component 30. The second heat dissipation member 20 is placed between the two first heat absorption surfaces 111 and is provided with two heat conduction surfaces 2121 respectively opposite to the two first heat absorption surfaces 111; the opposite first heat absorption surface 111 and heat conduction surface 2121 are respectively attached to the first heat dissipation surface 321 and the second heat dissipation surface 322 of the same electrical component 30 that face away from each other.

[0081] Specifically, referring to Figures 5-10 , Figure 5 shows an exploded view of the second heat dissipation member 20 and the two electrical components 30, Figures 6-8 respectively shows the three-dimensional view, top view, and cross-sectional view of the second heat dissipation member 20 and the two electrical components 30, Figure 9 shows the three-dimensional view of the second heat dissipation member 20, Figure 10A schematic diagram of the heat transfer component 21 is shown. The second heat sink 20 includes at least one heat transfer component 21 and a fixing base 22. The heat transfer component 21 is fixedly connected outside the fixing base 22. In this embodiment, the second heat sink 20 includes at least two heat transfer components 21, and each heat transfer component 21 is arranged in a second direction perpendicular to the first direction; Figure 9 In [the example], the second heat sink 20 includes 3 heat transfer components 21. Refer to Figure 10 , each heat transfer component 21 includes two heat transfer elements 211. The heat transfer elements 211 are made of a heat-conducting material and form a continuous heat-conducting structure. The continuous heat-conducting structure includes a heat-absorbing portion 212 and a heat-radiating portion 213 that communicate with each other; the heat-absorbing portions 212 of the two heat transfer elements 211 are arranged parallel to each other in the first direction, and the two surfaces of the two heat-absorbing portions 212 facing away from each other respectively form heat-conducting surfaces 2121. The heat-radiating portions 213 of the two heat transfer elements 211 are close to each other or communicate with each other in the first direction to concentrate heat exchange with the first heat sink 10; wherein, the continuous heat-conducting structure is configured to realize heat transfer from the heat-absorbing portion 212 to the heat-radiating portion 213 through the heat conduction path of the heat-conducting material and / or the medium heat transfer path in the continuous heat-conducting structure; In this embodiment, the "continuous heat-conducting structure" means a physical structure formed by the heat-conducting material of the heat transfer element 211, without heat flow interruption between the heat-absorbing portion 212 and the heat-radiating portion 213, and it realizes the directional migration of heat from the heat-absorbing portion 212 to the heat-radiating portion 213 through at least one of the following two heat transfer modes: one is solid-state heat conduction, in this case, the heat-radiating portion 213 exchanges heat with the second heat-absorbing surface 121 to dissipate heat; the other is medium heat transfer, relying on the gas-liquid phase change or convection cycle of the working medium encapsulated inside the heat transfer element 211. In this case, the heat transfer element 211 has a closed fluid circulation path, and the fluid flows inside the heat transfer element 211 without exchanging medium with the external environment; the heat-absorbing portion 212 can absorb external heat through fluid phase change or forced flow, and the heat-radiating portion 213 can release heat through the fluid with the help of a radiator or an external cycle (such as a liquid cooling pump, a fan, a heat sink, a secondary cooling system, etc.). Therefore, the heat transfer element 211 can realize the heat absorption and dissipation functions either through fluid phase change (such as heat pipe evaporation / condensation) or through forced flow (such as driven by a liquid cooling pump). The following mainly describes the heat transfer element 211 taking fluid phase change heat dissipation as an example.

[0082] When the heat transfer member 211 dissipates heat through the phase change of the fluid, the tube body of the heat absorption part 212 is usually made of a high thermal conductivity metal material, such as copper (high thermal conductivity, corrosion-resistant) or aluminum (lightweight, low cost). The tube body material of the heat dissipation part 213 is the same as that of the tube body of the heat absorption part 212 (copper / aluminum) to ensure rapid heat dissipation. The heat absorption part 212 absorbs external heat, causing the working liquid to evaporate into vapor. The heat dissipation part 213 releases heat, causing the vapor to condense into liquid. A liquid absorption core with a capillary structure is also provided inside the heat transfer member 211. Through capillary action, the condensed liquid is "pumped back" from the heat dissipation part 213 to the heat absorption part 212 to complete the cycle. The working fluid inside the heat transfer member 211 transfers heat through liquid-vapor phase change (absorbing heat and vaporizing in the evaporation section, releasing heat and liquefying in the condensation section), and the efficiency is hundreds of times that of pure heat conduction. In this embodiment, the working fluid is ethylene glycol.

[0083] See Figures 9-10 , the heat absorption parts 212 of the two heat transfer members 211 are arranged parallel to each other along the first direction, and the two surfaces of the two heat absorption parts 212 facing away from each other respectively form heat conduction surfaces 2121. The heat conduction surfaces 2121 of the heat absorption parts 212 on the same side are located on the same plane, and the heat absorption part 212 extends along the third direction; the heat dissipation parts 213 of the two heat transfer members 211 are close to each other or communicate with each other along the first direction to concentrate heat exchange with the first heat dissipation member 10; wherein, the heat dissipation parts 213 of the two heat transfer members 211 are both attached to the heat transfer block 122 of the second heat absorption surface 121, that is, the heat dissipation part 213 is attached to the second heat absorption surface 121. In this embodiment, the heat dissipation part 213 is arc-shaped, and the heat dissipation parts 213 of the two heat transfer members 211 communicate with each other so that the two heat transfer members 211 of the heat transfer assembly 21 are integrally formed and form a U-shaped opening structure; See Figure 2 , the U-shaped opening is in the same direction as the opening direction of the heat dissipation cavity 01.

[0084] Still see Figure 10 , one end of each of the two heat absorption parts 212 of each heat transfer assembly 21 away from the heat dissipation part 213 is respectively provided with a first contraction section 214 and a second contraction section 215. The length of the first contraction section 214 along the second direction is less than the length of the second contraction section 215 along the second direction. See Figure 9 , the first contraction sections 214 and the second contraction sections 215 of each heat transfer assembly 21 are arranged alternately along the second direction.

[0085] The fixing seat 22 is made of a metal material and is used to fixedly connect with the first heat dissipation member 10 and the electrical component 30; each part of the heat transfer assembly 21 is attached to the outer wall of the fixing seat 22, that is, the shape of the outer wall of the fixing seat 22 is the same as the shape of the heat transfer assembly 21. The two heat absorption parts 212 and the two heat dissipation parts 213 of the heat transfer assembly 21 are both attached to the outer wall of the fixing seat 22, and at least part of the heat dissipation part 213 of the heat transfer assembly 21 is located on one side of the fixing seat 22 along the third direction. In this embodiment, the heat transfer assembly 21 is welded to the outer wall of the fixing seat 22.

[0086] See Figure 9 Figure 9 , on both sides of the fixing base 22 along the first direction, accommodating grooves 221 extending along the third direction are respectively provided. The heat absorption parts 212 of each heat transfer component 21 are located in the accommodating grooves 221 and are attached to the groove bottoms of the accommodating grooves 221. Therefore, the two heat absorption parts 212 of the heat transfer component 21 are respectively attached to the two surfaces of the fixing base 22 that are opposite to each other along the first direction. Exemplarily, the heat conducting surface 2121 of the heat transfer component 21 and the notch of the accommodating groove 221 are in the same plane, so that the second heat dissipation surface 322 of the electrical component 30 is evenly contacted. A through channel 222 extending along the second direction and penetrating through is provided in the fixing base 22, and one end of the through channel 222 away from the heat dissipation part 213 is open. A reinforcing part 223 protruding from the inner wall of the through channel 222 is provided in the middle of the fixing base 22 along the second direction. The reinforcing part 223 is provided with two reinforcing ribs 224 respectively protruding from the inner walls on both sides of the through channel 222 along the first direction. Each reinforcing rib 224 extends along the third direction and is provided with a first connecting part 2241 protruding out of the through channel 222. The first connecting part 2241 is integrally connected with the end surface of the open end of the through channel 222 and is used for connecting with the electrical component 30. On both sides of one end of the fixing base 22 close to the heat dissipation part 213 along the first direction, a second connecting part 225 and a third connecting part 226 are respectively provided. Both the second connecting part 225 and the third connecting part 226 are used for connecting with the electrical component 30 and have different structures. In this embodiment, the first connecting part 2241 is a first threaded hole 2242 extending along the first direction. Both the second connecting part 225 and the third connecting part 226 include two second threaded holes 227 arranged along the second direction and two guide posts 228 arranged along the second direction. The axis of the second threaded hole 227 extends along the first direction, and the guide posts 228 extend along the first direction. The difference is that the distance between the guide posts 228 of the second connecting part 225 and the third connecting part 226 is inconsistent. See Figure 7 Figure 7 , on both sides of the fixing base 22 on both sides of each heat transfer component 21 in the second direction, two connecting holes 229 are respectively provided, and the two connecting holes 229 are respectively used for screwing with the two connecting seats 123 of the heat transfer block 122.

[0087] See Figure 5 Figure 5 , the electrical component 30 includes a circuit board 31 and a heating element 32 mounted on one side surface of the circuit board 31. The circuit board 31 is also provided with an avoidance opening 311 corresponding to the heating element 32. The front surface of the heating element 32 away from the circuit board 31 forms a first heat dissipation surface 321, and the back surface of the heating element 32 close to the circuit board 31 forms a second heat dissipation surface 322.

[0088] When the heat dissipation structure is used to dissipate heat for two electrical components 30, the circuit board 31 is respectively provided with through holes 312 corresponding to the first threaded hole 2242, the second threaded hole 227, and the guide post 228.

[0089] During installation, first fixedly connect the two circuit boards 31 to the fixed seat 22 respectively, that is, align the through holes 312 of the circuit board 31 with the first threaded holes 2242, the second threaded holes 227 and the guide posts 228 respectively, and realize the screw connection between the circuit board 31 and the fixed seat 22 through screws. Among them, the distances between the guide posts 228 on both sides of the fixed seat 22 are inconsistent, that is, the structures of the second connecting portion 225 and the third connecting portion 226 are inconsistent, which can prevent the two circuit boards 31 from being installed wrongly. After the fixed connection is completed, the heat-conducting surface 2121 is in contact with the second heat-dissipating surface 322 of the heating element 32;

[0090] Subsequently, insert the above-mentioned installed module into the heat dissipation cavity 01 from the opening of the heat dissipation cavity 01. The oppositely arranged guide grooves 131 can pre-position the circuit board 31. After the circuit board 31 is inserted into the guide grooves 131, the heat-dissipating parts 213 of the heat-transfer components 21 of the second heat-dissipating member 20 are also in contact with the heat-transfer block 122. Subsequently, lock the second heat-dissipating member 20 to the first heat-dissipating member 10 by passing screws through the connection holes 229 and the connection seat 123, and the installation is completed. Refer to Figure 3 and Figure 8 , in practical applications, the pin voltage of the heating element 32 plugged into the circuit board 31 is relatively high. In order to meet the safety regulations requirements, the back of the heating element 32 near the position with a relatively high pin voltage is not in contact with the heat-conducting surface 2121 of the second heat-dissipating member 20, and a gap is formed between the second heat-dissipating member 20 and the high-voltage pins along the second direction. However, it should be understood that when the pin voltage of the heating element 32 is relatively low, it can be designed such that the heat-conducting surface 2121 of the second heat-dissipating member 20 is in complete contact with the surface of the heating element 32.

[0091] In this embodiment, the mounting design directly contacts the electrical component 30, reducing the contact thermal resistance. Heat is transferred from the first heat dissipation surface 321 and the second heat dissipation surface 322 of the electrical component 30 to the first heat dissipation component 10 and the second heat dissipation component 20 respectively, avoiding the accumulation of thermal resistance in a single heat dissipation path, and achieving higher heat dissipation efficiency. In addition, double-sided heat dissipation reduces the temperature difference between the first heat dissipation surface 321 and the second heat dissipation surface 322 of the electrical component 30 which are away from each other, thereby preventing thermal stress or performance degradation of the material caused by temperature gradient. Heat redistribution is achieved between the first heat dissipation component 10 and the second heat dissipation component 20 through heat exchange (such as heat conduction or convection). After the heat sink 20 absorbs the heat from the second heat sink surface 322, it transfers it to the first heat sink 10, realizing the secondary transfer of heat. The first heat sink 10 can simultaneously process the direct heat from the first heat sink surface 321 and the heat transferred through the second heat sink 20. Compared with the electrical component 30, which requires two independent heat dissipation systems to achieve double-sided heat dissipation through design, no additional heat dissipation components are required, and the power consumption of the redundant heat dissipation parts 213 (such as additional pumps and fans) is reduced. The heat exchange between the first heat sink 10 and the second heat sink 20 can form a closed or semi-closed heat cycle system, enhancing the dynamic heat dissipation capacity of the heat dissipation structure. Therefore, in this embodiment, the heat dissipation efficiency of the electrical component 30 is significantly improved, the operating temperature of the electrical component 30 is reduced, the service life of the electrical component 30 is extended, and the power consumption of the heat dissipation structure is low through the coordination of double-sided contact heat dissipation and heat exchange.

[0092] In this embodiment, the first heat sink 10 has a circulation through-flow channel 02 for liquid or gas. The circulation through-flow channel 02 of the first heat sink 10 quickly takes away the heat of the first heat sink surface 321 through active liquid cooling / air cooling. Compared with pure heat conduction or natural convection, the heat dissipation efficiency is high and the local high temperature can be effectively reduced. In this embodiment, the double-sided heat dissipation design of the first heat sink 10 (liquid / gas circulation) and the second heat sink 20 is adopted, so that the heat of the first heat sink surface 321 and the second heat sink surface 322 of the electrical component 30 can be simultaneously discharged and the contact thermal resistance is small. If the electrical component 30 The pneumatic component 30 only relies on the first heat sink 10 for heat dissipation, so the temperature difference between the first heat dissipation surface 321 and the second heat dissipation surface 322 of the electrical component 30 is large, and a cooling medium with a higher flow rate / flow rate is required to circulate through the flow channel 02 for forced cooling. The power consumption of the first heat sink 10 is large. After the second heat sink 20 and the first heat sink 10 cooperate to dissipate heat, the temperature distribution of the first heat dissipation surface 321 and the second heat dissipation surface 322 of the electrical component 30 is more uniform, the temperature rise of the cooling medium is reduced, the required flow rate / flow rate is reduced under the same heat dissipation capacity, and the power consumption of the first heat sink 10 is reduced.

[0093] In this embodiment, the mutually opposite first heat absorption surface 111 and the heat conduction surface 2121 are respectively attached to the first heat dissipation surface 321 and the second heat dissipation surface 322 of the same electrical component 30 that face away from each other, so that both sides of the heat dissipation structure in the first direction can dissipate heat for two electrical components 30 synchronously. Each electrical component 30 dissipates heat through the dedicated first heat absorption surface 111 and the heat conduction surface 2121 without interference, with high heat dissipation efficiency, and enables the two electrical components 30 to share the same heat dissipation structure, reducing the volume of the device and making the structure compact. This advantage is particularly prominent when the heat dissipation structure is applied to the vehicle-mounted environment because the space of the vehicle-mounted power supply is relatively compact, and compared with each electrical component 30 being equipped with a separate heat dissipation structure, it is more conducive to saving materials and assembly costs; among them, the second heat dissipation member 20 transfers the heat on both sides to the first heat dissipation member 10 through the heat conduction surface 2121, improving the utilization rate of the circulating through-flow channel 02. In addition, the arrangement of the two first heat absorption surfaces 111 also enables the heat on both sides of the first heat dissipation member 10 to be evenly distributed, avoiding stress concentration caused by heat concentration on one side.

[0094] In this embodiment, the integrated design of embedding the circulating through-flow channel 02 into the cavity wall of the heat dissipation cavity 01 can reduce external pipeline connections, reduce the risk of leakage, and save more space, making the overall volume of the heat dissipation structure smaller; the inner surface of the first cavity wall 11 forms the first heat absorption surface 111, and the inner surface of the second cavity wall 12 forms the second heat absorption surface 121, so that the first heat absorption surface 111 and the second heat absorption surface 121 have high heat absorption efficiency, thereby improving the heat dissipation efficiency of the electrical component 30. Among them, the heat dissipation cavity 01 provides physical support and a heat exchange interface (the second heat absorption surface 121) for the second heat dissipation member 20, increasing the contact area between the second heat dissipation member 20 and the first heat dissipation member 10. In addition, this design enables the heat dissipation structure to dissipate heat for two electrical components 30, and the two electrical components 30 occupy less space in the first direction, which is conducive to the miniaturization design of the heat dissipation structure along the first direction when applied to a DC-DC converter.

[0095] In this embodiment, the two heat absorption parts 212 that are parallel to each other evenly absorb the heat of the electrical component 30, and the heat dissipation parts 213 of the two heat transfer parts 211 are close to each other or communicate with each other in the first direction, so that the heat dissipation parts 213 of the heat transfer assembly 21 are centrally designed, thereby reducing the contact area with the first heat dissipation member 10. Therefore, this embodiment can utilize the high heat transfer characteristics of the heat transfer part 211 to quickly dissipate the heat of the second heat dissipation surface 322 of the electrical component 30.

[0096] In this embodiment, the heat transfer member 211 dissipates heat through fluid phase change. Compared with solid heat conduction or convection circulation, the heat dissipation efficiency is high. And compared with convection circulation, no external pump or mechanical drive is required, and the structure is simple. The second heat dissipation member 20 includes at least two heat transfer components 21, and the heat transfer components 21 are arranged along a second direction perpendicular to the first direction. The heat conduction surfaces 2121 of the heat absorption portions 212 on the same side are located on the same plane. On the one hand, the heat conduction surface area of the second heat dissipation member 20 can be enlarged by increasing the number of heat transfer components 21 as needed. On the other hand, since the heat transfer member 211 dissipates heat through fluid phase change, compared with a solution with a heat transfer component 21 having a relatively long length along the second direction, the redundancy reliability when the heat transfer component 21 fails is improved. In addition, the coplanarity of the heat conduction surfaces 2121 on the same side can ensure uniform contact between the heat transfer component 21 and the electrical component 30, reducing the requirement for assembly tolerance.

[0097] In this embodiment, the heat dissipation portion 213 is arc-shaped, and the heat dissipation portions 213 of the two heat transfer members 211 communicate with each other so that the two heat transfer members 211 of the heat transfer component 21 are integrally formed and form a U-shaped opening structure, which has a simpler structure, lower process cost and smaller required space. Under the condition that the length of the second heat dissipation member 20 along the first direction is certain, the length of the heat dissipation portion 213 can be extended, and the flow resistance of the fluid in the heat transfer member 211 can be reduced, thereby improving the heat exchange efficiency and the heat dissipation efficiency of the second heat dissipation member 20. The second heat absorption surface 121 is convexly provided with a heat transfer block 122 that fits the heat dissipation portion 213 of the heat transfer component 21, further increasing the heat exchange area between the second heat dissipation member 20 and the first heat dissipation member 10, and improving the heat dissipation efficiency of the second heat dissipation member 20.

[0098] In this embodiment, the second flow channel 022 is provided with a partition 0222 extending along the second direction to divide the second flow channel 022 into second sub-flow channels 0221 communicating with the two first flow channels 021, so that the two first flow channels 021 respectively form an inlet flow channel and an outlet flow channel. The coolant or cold air enters one of the first flow channels 021 and one of the second sub-flow channels 0221 from the inlet / air joint 14, and then flows into the other first flow channel 021 and the other second sub-flow channel 0221 through the third flow channel, and then flows to the outlet / air joint 15, realizing the circulation of the coolant or cold air. The projection of the heat transfer block 122 and the partition 0222 on the projection plane perpendicular to the third direction overlap each other. On the one hand, the strength of the heat transfer block 122 is improved, so that the heat transfer block 122 forms better support for the second heat dissipation member 20. On the other hand, the heat of the heat dissipation portion 213 can be transmitted to the partition 0222 through the heat transfer block 122, and the heat can be evenly distributed to the two second sub-flow channels 0221 along the partition 0222, avoiding local overheating.

[0099] In this embodiment, the provision of the guiding groove 131 enables the rapid and precise assembly of the heat dissipation structure and the electrical component 30. Moreover, the guiding groove 131 can also limit the electrical component 30 in the second direction, achieving a stable connection between the electrical component 30 and the heat dissipation structure.

[0100] In this embodiment, since the heat transfer member 211 dissipates heat through the phase change of the fluid and the heat transfer member 211 is in the form of a heat pipe, during the processing of the heat transfer assembly 21, two shrinkage sections will inevitably be formed at both ends of the heat transfer assembly 21. These two shrinkage sections contribute less to heat dissipation. In this embodiment, the length of the first shrinkage section 214 in the second direction is less than the length of the second shrinkage section 215 in the second direction. The first shrinkage sections 214 and the second shrinkage sections 215 of each heat transfer assembly 21 are alternately arranged in the second direction, which is conducive to balancing the influence of the first shrinkage section 214 and the second shrinkage section 215 on both sides of the second heat dissipation member 20 in the first direction on the heat dissipation efficiency, and is more conducive to the heat dissipation balance on both sides of the second heat dissipation member 20.

[0101] In this embodiment, the fixing base 22 is made of a metal material, which facilitates the machining and casting of the fixing base 22 into a structure that fits the inner wall of the heat transfer component 21 and has high structural strength. Each part of the heat transfer component 21 is in contact with the outer wall of the fixing base 22 made of a metal material, which means that the two heat absorption parts 212 and the two heat dissipation parts 213 of the heat transfer component 21 are in contact with the outer wall of the fixing base 22. This arrangement can improve the structural stability of the heat transfer member 211 and enable the heat of the heat transfer component 21 to be transferred to the fixing base 22 and dissipated by the fixing base 22. Advantageously, the heat of the heat dissipation part 213 can be transferred to the fixing base 22, thereby improving the heat dissipation efficiency of the heat dissipation part 213 and further improving the heat dissipation efficiency of the heat transfer component 21. In addition, this also means that the two heat absorption parts 212 are respectively in contact with the two surfaces of the fixing base 22 that are opposite to each other in the first direction, which can balance the stress distribution on both sides of the heat transfer component 21 and prevent the heat transfer component 21 from deforming. The fixing base 22 realizes the rigid connection between the first heat dissipation member 10 and the second heat dissipation member 20, and at the same time realizes the rigid connection between the heat dissipation structure and the electrical component 30, ensuring the stability of the first heat dissipation surface 321 and the second heat dissipation surface 322 of the electrical component 30 in a long-term vibration environment. At the same time, it is also beneficial to form an integral module of the electrical component 30 and the second heat dissipation member 20 during installation and install it in the heat dissipation cavity 01 of the first heat dissipation member 10, reducing the installation difficulty. It should be understood that when the heat transfer member 211 realizes the heat absorption and heat dissipation functions through fluid phase change (such as heat pipe evaporation / condensation), although the fixing base 22 is made of a metal material, due to the characteristics of the heat transfer member 211, the heat transfer member 211 transfers heat through the phase change of the internal working fluid (liquid evaporation - gas flow - condensation reflux), and its equivalent thermal conductivity can reach 10,000 - 100,000 W / (m·K), which is much higher than that of the metal material. Therefore, the metal material fixing base 22 has little influence on the temperature difference between the heat dissipation part 213 and the heat absorption part 212. When the heat transfer member 211 realizes the heat absorption and heat dissipation functions through forced driving (such as liquid cooling pump driving) or through solid-state heat conduction, the high thermal conductivity of the metal material fixing base 22 can quickly diffuse the local heat to the entire heat absorption part 212, avoiding the accumulation of heat near the contact point of the heat absorption part 212 and reducing the risk of local overheating. The metal material fixing base 22 can be used as a support structure for the heat dissipation part 213 (such as a liquid cooling radiator) and at the same time assist in transferring heat from the heat dissipation part 213 to the external environment.

[0102] In this embodiment, the accommodation groove 221 extends along the third direction. The heat absorption part 212 of each heat transfer component 21 is located in the accommodation groove 221, and the heat conduction surface 2121 is attached to the bottom of the accommodation groove 221. The accommodation groove 221 can play a certain role in pre-positioning the heat transfer component 21 during the process of the heat transfer component 21 being attached to the outside of the fixed seat 22. The heat absorption part 212 is attached to the bottom of the accommodation groove 221, which can further enhance the mechanical stability and prevent the heat transfer component 21 from deforming due to vibration. In addition, the two groove side walls 2211 of the accommodation groove 221 made of metal material can be used to attach to the back surface of the heating element 32, further increasing the heat dissipation efficiency of the electrical component 30.

[0103] In this embodiment, a through channel 222 extending along the second direction and penetrating is provided in the fixed seat 22, which can enable the heat of the heat dissipation part 213 to be transferred to the fixed seat 22 and then dissipated by the through channel 222 in the fixed seat 22. The heat exchange efficiency of the heat dissipation part 213 is high, further improving the heat dissipation efficiency of the second heat dissipation member 20. When the heat dissipation structure is applied to a DC-DC converter, a heat conduction adhesive can be filled in the through channel 222 to further enhance the heat dissipation efficiency of the through channel 222; in addition, the setting of the through channel 222 can also reduce the production materials, lower the production cost and reduce the weight of the fixed seat 22.

[0104] In this embodiment, the setting of the strengthening part 223 is beneficial to make up for the influence of the reduced strength caused by the structure of the through channel 222. The strengthening part 223 is located in the middle of the fixed seat 22 along the second direction, and the strengthening effect on the fixed seat 22 is better.

[0105] In this embodiment, the first connecting part 2241 is integrally connected with the end surface of the opening end of the through channel 222 and is used for connecting with the electrical component 30, so that the strengthening part 223 can not only strengthen the structural stability of the fixed seat 22, but also realize the connection with the electrical component 30. The first connecting part 2241 is integrally connected with the end surface of the opening end of the through channel 222, so that the first connecting part 2241 has a longer length along the first direction, and the structural strength of the first connecting part 2241 is large.

[0106] In this embodiment, the second connecting part 225 and the third connecting part 226 are respectively provided on both sides of one end of the fixed seat 22 close to the heat dissipation part 213 along the first direction. Both the second connecting part 225 and the third connecting part 226 are used for connecting with the electrical component 30 and have different structures, so that the electrical component 30 is connected to both sides of the fixed seat 22 along the third direction, and the structure is more stable. Moreover, the different structures of the second connecting part 225 and the third connecting part 226 enable an anti-misassembly design to be formed when two electrical components 30 have the same structure during installation, avoiding misinstallation.

[0107] Embodiment 2

[0108] The heat dissipation structure of Example 2 is basically the same as that of Example 1. The difference is that, referring to Figure 11 , heat transfer and thus heat exchange are achieved between the second heat dissipation member 20 and the first heat dissipation member 10 through a dynamically circulating fluid working medium. In this embodiment, the structure of the second heat dissipation member 20 is different from that of Example 1. Figure 11 In , the circulating through-flow channel 02 of the first heat dissipation member 10 only includes a first flow channel 021 respectively embedded in two first cavity walls 11 and a third flow channel embedded in one end of the third cavity wall 13 close to the second cavity wall 12. No flow channel is provided in the second cavity wall 12. The second heat dissipation member 20 is provided with a liquid / gas flow channel (not shown in the figure) connected in series between the two first flow channels 021. In specific implementation, the liquid / gas flow channel is connected in series on the third flow channel of the third cavity wall 13. The coolant / gas flows from the liquid / gas inlet joint 14 through one of the first flow channels 021 and then into the third flow channel. Subsequently, it circulates in the second heat dissipation member 20 for one circle and re-enters the third flow channel, and then flows out of the liquid / gas outlet joint 15 through the other first flow channel 021, realizing the circulation of the coolant / gas. In practical applications, the second heat dissipation member 20 and the first heat dissipation member 10 are integrally formed. In this embodiment, when the electrical component 30 is installed, the bottom end of the avoidance opening 311 of the circuit board 31 can also avoid the second heat dissipation member 20, or the width of the second heat dissipation member 20 in the first direction is the distance between the two first cavity walls 11. The gap between the heat conduction surface 2121 of the second heat dissipation member 20 and the second heat dissipation surface 322 of the heating element 32 is completely filled with heat-conducting glue. The electrical component 30 is initially positioned through cooperation with the guiding groove 131.

[0109] In this embodiment, the integrated design of embedding the circulating through-flow channel into the cavity wall of the heat dissipation cavity 01 and the design of connecting the second heat dissipation member 20 in series between the two first flow channels 021 can reduce external pipeline connections, reduce the risk of leakage, and save more space, making the overall volume of the heat dissipation structure smaller; the inner surface of the first cavity wall 11 forms a first heat absorption surface 111, so that the heat absorption efficiency of the first heat absorption surface 111 is high, thereby improving the heat dissipation efficiency of the electrical component 30. The second heat dissipation member 20 is provided with a liquid / gas flow channel connected in series between the two first flow channels 021, so that the two first flow channels 021 form a closed circulation loop through the second heat dissipation member 20. The second heat dissipation member 20, as a series connection node, can well balance the flow distribution of the two first flow channels 021, ensuring the heat dissipation uniformity of the two first heat dissipation surfaces 321. The heat absorbed by one of the first flow channels 021 is relayed to the other first flow channel 021 through the liquid / gas flow channel of the second heat dissipation member 20, forming a continuous heat transfer link and reducing the thermal resistance. In addition, this design enables the heat dissipation structure to dissipate heat for two electrical components 30, and the space occupied by the two electrical components 30 in the first direction is small, which is beneficial to the miniaturization design of the heat dissipation structure in the first direction when applied to a DC-DC converter.

[0110] Example 3

[0111] Embodiment 3 has basically the same structure as Embodiment 1. The difference is that, referring to Figure 12 , the second heat dissipation member 20 of Embodiment 3 dissipates heat through heat conduction. Therefore, the heat transfer member 211 dissipates heat through heat conduction, and the heat transfer assembly 21 is integrally formed with the second cavity wall 12. When the electrical component 30 is installed, it can be arranged such that the bottom end of the avoidance opening 311 of the circuit board 31 also avoids the second heat dissipation member 20, or the width of the second heat dissipation member 20 in the first direction is the distance between the two first cavity walls 11. The gap between the heat conduction surface 2121 of the second heat dissipation member 20 and the second heat dissipation surface 322 of the heating element 32 is completely filled with heat-conducting glue, and the electrical component 30 is initially positioned by cooperating with the guiding groove 131

[0112] In this embodiment, the heat transfer member 211 dissipates heat through heat conduction, which can avoid the risk of fluid leakage and is suitable for high-frequency vibration environments. The heat transfer assembly 21 is integrally formed with the second cavity wall 12, which can reduce the interfacial thermal resistance and improve the heat transfer efficiency.

[0113] Embodiment 4

[0114] Referring to Figure 13 , Figure 13 shows a DC-DC converter, including a mounting base 40, a cover plate 50, two electrical components 30, two connectors 60, a filtering module 70, a control module 80, and a second heat dissipation member 20.

[0115] The mounting base 40 is a box-like structure with an open side. Exemplarily, the height direction of the mounting base 40 is the third direction. Three mutually independent first regions 41, second regions 42, and third regions 43 are provided in the mounting base 40 along the first direction. The mounting base 40 also has a fourth region 44 on one side of the first region 41 along the second direction ( Figure 13 the front side in

[0116] The components of the DC-DC converter that generate relatively large amounts of heat are two electrical components 30. Specifically, the electrical component 30 includes a circuit board 31 and a heating element 32 mounted on one side of the circuit board 31. The circuit board 31 is also provided with an avoidance opening 311 corresponding to the heating element 32. The two circuit boards 31 are arranged in the second region 42 along the first direction. The heating element 32 is a DC-DC module in this embodiment. The circuit board 31 is placed perpendicular to the control module 80. The circuit board 31 is provided with terminals for electrically connecting to the control module 80. In addition to the DC-DC module on the circuit board 31, there are also other electronic components that generate relatively large amounts of heat, such as high-voltage electronic fuses and low-voltage electronic fuses.

[0117] In order to achieve efficient heat dissipation of the heating element 32 in this embodiment, the structure of the mounting seat 40 is improved. Specifically, the second region 42 and the fourth region 44 form the first heat dissipation member 10 in any one of the above embodiments 1-3. The first heat dissipation member 10 and the second heat dissipation member 20 form the heat dissipation structure in any one of the above embodiments 1-3. That is, the DC-DC converter includes the heat dissipation structure in any one of the above embodiments 1-3 and the electrical component 30. The gaps between the electrical component 30 and the first heat dissipation member 10 and the second heat dissipation member 20 are all filled with thermal conductive glue. The gaps between the second heat dissipation member 20 and the first heat dissipation member 10 are all filled with thermal conductive glue.

[0118] In practical applications, when the heat dissipation structure in Embodiment 1 is adopted, the thermal conductive glue is located in the gaps between the circuit board 31 and the first heat absorption surface 111, and between the circuit board 31 and the second heat absorption surface 121. The thermal conductive glue is also located in the gaps between the heating element 32 and the heat conduction surface 2121 and the side wall 2211 of the accommodating groove 221, between the heating element 32 and the first heat absorption surface 111, and between the heating element 32 and the second heat absorption surface 121. In this embodiment, the thermal conductive glue is also filled in the gap between the second heat dissipation member 20 and the heat dissipation cavity 01. The thermal conductive glue is located in the gaps between the heat dissipation parts 213 of the respective heat transfer components 21 and the heat transfer block 122, between the two sides of the second heat dissipation member 20 along the second direction and the two third cavity walls 13, and between the through-channel 222 of the second heat dissipation member 20 and the opening of the heat dissipation cavity 01.

[0119] During installation, after the heat dissipation structure is fixedly connected to the circuit board 31, the gaps between the electrical component 30 and the first heat dissipation member 10 and the second heat dissipation member 20 are all filled with thermal conductive glue, and the gaps between the second heat dissipation member 20 and the first heat dissipation member 10 are all filled with thermal conductive glue.

[0120] This embodiment inherits the technical advantages of any one of Embodiments 1-3. In the prior art, the heat on the back of the heating element 32 needs to be conducted to the first heat sink 10 through the circuit board 31, and the circuit board 31 itself has a low thermal conductivity and a large thermal resistance. In this embodiment, the second heat sink 20 penetrates the circuit board 31 to dissipate heat for the second heat dissipation surface 322 of the heating element 32, eliminating the conduction link of the circuit board 31, so that the heat of the heating element 32 can be directly conducted out, shortening the heat transfer path and reducing the thermal resistance. In addition, the first heat sink 10 is embedded in the circuit board 31, so that after the heat dissipation structure is combined with the heating element 32, the length along the first direction is shorter and the space occupied is smaller.

[0121] In this embodiment, the gaps between the electrical component 30 and the first heat sink 10 and the second heat sink 20 are filled with thermally conductive adhesive, which can eliminate microscopic gaps or large gaps on the contact surfaces between the electrical component 30 and the first heat sink 10 and the second heat sink 20, reduce the interface thermal resistance, and provide mechanical buffering to prevent stress damage to the circuit board 31 and the second heat sink 20 due to differences in thermal expansion coefficients. The gaps between the second heat sink 20 and the first heat sink 10 are filled with thermally conductive adhesive, which can eliminate microscopic gaps or large gaps on the contact surfaces between the second heat sink 20 and the first heat sink 10, reduce the interface thermal resistance, and provide mechanical buffering.

[0122] The description of the above specification and embodiments is used to explain the protection scope of the present invention, but does not constitute a limitation on the protection scope of the present invention. Through the enlightenment of the present invention or the above embodiments, ordinary technicians in this field can obtain modifications, equivalent substitutions or other improvements to the embodiments of the present invention or part of the technical features thereof through logical analysis, reasoning or limited experiments, which should be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure for dissipating heat from an electrical component (30), the electrical component (30) having a first heat dissipation surface (321) and a second heat dissipation surface (322) facing away from each other, characterized in that, The heat dissipation structure includes a first heat dissipation member (10), one side of which is attached to the first heat dissipation surface (321) of the electrical component (30); a second heat dissipation member (20), which exchanges heat with the first heat dissipation member (10), and one side of which is attached to the second heat dissipation surface (322) of the electrical component (30).

2. The heat dissipation structure according to claim 1, characterized in that The first heat dissipation member (10) has a circulating through-flow channel (02) for liquid or gas.

3. A heat dissipation structure according to claim 2, characterized in that, The first heat dissipation surface (321) and the second heat dissipation surface (322) are arranged along a first direction; the first heat dissipation member (10) is provided with two mutually opposite first heat absorption surfaces (111) spaced along the first direction, and the second heat dissipation member (20) is placed between the two first heat absorption surfaces (111) and is provided with two heat conduction surfaces (2121) respectively opposite to the two first heat absorption surfaces (111); the mutually opposite first heat absorption surface (111) and the heat conduction surface (2121) are respectively attached to the first heat dissipation surface (321) and the second heat dissipation surface (322) of the same electrical component (30) facing away from each other.

4. The heat dissipation structure according to claim 3, characterized in that, The first heat dissipation member (10) is provided with a heat dissipation cavity (01), the heat dissipation cavity (01) is provided with two first cavity walls (11) parallel and opposite to each other along the first direction and a second cavity wall (12) connecting the two first cavity walls (11), and the second heat dissipation member (20) is placed in the heat dissipation cavity (01) and supported on the second cavity wall (12); the circulating through-flow channel (02) includes a first flow channel (021) embedded in the first cavity wall (11), and the inner surface of the first cavity wall (11) forms the first heat absorption surface (111); the second heat dissipation member (20) is provided with a liquid / gas flow channel connected in series between the two first flow channels (021).

5. The heat dissipation structure according to claim 3, characterized in that, The first heat dissipation member (10) is provided with a heat dissipation cavity (01), the heat dissipation cavity (01) is provided with two first cavity walls (11) parallel and opposite to each other along the first direction and a second cavity wall (12) connecting the two first cavity walls (11), and the second heat dissipation member (20) is placed in the heat dissipation cavity (01) and supported on the second cavity wall (12); the circulating through-flow channel (02) includes a first flow channel (021) embedded in the first cavity wall (11) and a second flow channel (022) embedded in the second cavity wall (12), the inner surface of the first cavity wall (11) forms the first heat absorption surface (111), and the inner surface of the second cavity wall (12) forms a second heat absorption surface (121) for heat exchange with the second heat dissipation member (20).

6. The heat dissipation structure according to claim 5, characterized in that, The second heat sink (20) includes at least one heat transfer component (21), each heat transfer component (21) includes two heat transfer members (211), the heat transfer members (211) are made of a heat conductive material and form a continuous heat conduction structure, the continuous heat conduction structure includes a heat absorption portion (212) and a heat dissipation portion (213) that communicate with each other; the heat absorption portions (212) of the two heat transfer members (211) are arranged parallel to each other in a first direction, and the two surfaces of the two heat absorption portions (212) facing away from each other respectively form the heat conductive surfaces (2121), the heat dissipation portions (213) of the two heat transfer members (211) are close to each other or communicate with each other in the first direction to concentrate heat exchange with the first heat sink (10); wherein, the continuous heat conduction structure is configured to achieve heat transfer from the heat absorption portion (212) to the heat dissipation portion (213) through the heat conduction path of the heat conductive material and / or the heat transfer path of the medium within the continuous heat conduction structure; the heat dissipation portion (213) is attached to the second heat absorption surface (121).

7. The heat dissipation structure according to claim 6, characterized in that; The heat transfer member (211) dissipates heat through fluid phase change; the second heat sink (20) includes at least two heat transfer components (21), and each heat transfer component (21) is arranged in a second direction perpendicular to the first direction; the heat conductive surfaces (2121) of the heat absorption portions (212) on the same side are located on the same plane.

8. The heat dissipation structure according to claim 7, characterized in that, The heat dissipation portion (213) is arc-shaped, and the heat dissipation portions (213) of the two heat transfer members (211) communicate with each other so that the two heat transfer members (211) of the heat transfer component (21) are integrally formed and form a U-shaped opening structure; The second heat absorption surface (121) is convexly provided with a heat transfer block (122) that fits the heat dissipation portion (213) of the heat transfer component (21).

9. A heat dissipation structure according to claim 8, characterized in that, The first heat sink (10) is provided with an inlet / outlet liquid / gas joint (14) and an outlet / inlet liquid / gas joint (15) arranged in the first direction on the first side of the heat dissipation cavity (01) in the second direction, and the inlet / outlet liquid / gas joint (14) and the outlet / inlet liquid / gas joint (15) are respectively communicated with two first flow channels (021); The heat dissipation cavity (01) is further provided with two third cavity walls (13) that are parallel and opposite to each other in the second direction, and the second cavity wall (12) connects the two third cavity walls (13); one end of the third cavity wall (13) close to the second side of the first heat sink (10) in the second direction and close to the second cavity wall (12) is provided with a third flow channel, the third flow channel is communicated with both of the two first flow channels (021), the second flow channel (022) is provided with a partition (0222) extending in the second direction to divide the second flow channel (022) into second sub-flow channels (0221) respectively communicated with the two first flow channels (021), and the projection of the heat transfer block (122) and the partition (0222) on the projection plane perpendicular to the third direction overlaps each other, and the third direction is perpendicular to the first direction and the second direction.

10. A heat dissipation structure according to claim 9, characterized in that, The two third cavity walls (13) are provided with guiding grooves (131) that are respectively adapted to the two ends of the electrical component (30) in the second direction.

11. A heat dissipation structure according to claim 8, characterized in that, One end of each of the two heat absorption portions (212) of each heat transfer component (21) away from the heat dissipation portion (213) is respectively provided with a first contraction section (214) and a second contraction section (215). The length of the first contraction section (214) in the second direction is less than the length of the second contraction section (215) in the second direction. The first contraction sections (214) and the second contraction sections (215) of each heat transfer component (21) are alternately arranged in the second direction.

12. A heat dissipation structure according to any one of claims 5-11, characterized in that, The second heat dissipation member (20) is further provided with a fixing seat (22) made of a metal material. The fixing seat (22) is used for fixedly connecting with the first heat dissipation member (10) and the electrical component (30). Each part of the heat transfer component (21) is attached to the outer wall of the fixing seat (22). The heat absorption portion (212) extends in a third direction perpendicular to the first direction. At least a part of the heat dissipation portion (213) of the heat transfer component (21) is located on one side of the fixing seat (22) in the third direction.

13. A heat dissipation structure according to claim 12, characterized in that, On both sides of the fixing seat (22) in the first direction, there are respectively provided accommodation grooves (221) extending in the third direction. The heat absorption portions (212) of each heat transfer component (21) are located in the accommodation grooves (221) and are attached to the bottom of the accommodation grooves (221).

14. A heat dissipation structure according to claim 12, characterized in that, A through channel (222) extending in a second direction perpendicular to the first direction and the third direction and penetrating is provided in the fixing seat (22). Each part of the heat transfer component (21) is attached to the outer wall of the through channel (222).

15. A heat dissipation structure according to claim 14, characterized in that, In the middle of the fixing seat (22) in the second direction, there is a reinforcing portion (223) protruding from the inner wall of the through channel (222).

16. A heat dissipation structure according to claim 15, characterized in that, One end of the through channel (222) away from the heat dissipation portion (213) is open. The reinforcing portion (223) is provided with two reinforcing ribs (224) respectively protruding from the inner walls on both sides of the through channel (222) in the first direction. Each reinforcing rib (224) extends in the third direction and is provided with a first connecting portion (2241) protruding out of the through channel (222). The first connecting portion (2241) is integrally connected with the end face of the open end of the through channel (222) and is used for connecting with the electrical component (30).

17. A heat dissipation structure according to claim 16, characterized in that, On both sides of one end of the fixing seat (22) close to the heat dissipation portion (213) in the first direction, there are respectively provided a second connecting portion (225) and a third connecting portion (226). The second connecting portion (225) and the third connecting portion (226) are both used for connecting with the electrical component (30) and have different structures.

18. A heat dissipation structure according to claim 6, characterized in that, The heat transfer member (211) dissipates heat through heat conduction. The heat transfer component (21) is integrally formed with the second cavity wall (12).

19. A DC-DC converter, characterized in that, It includes the heat dissipation structure according to any one of claims 1-18 and at least one electrical component (30). The electrical component (30) is provided with a first heat dissipation surface (321) and a second heat dissipation surface (322) facing away from each other.

20. A DC-DC converter according to claim 19, characterized in that, The electrical component (30) includes a circuit board (31) and a heating element (32) mounted on one side of the circuit board (31). The circuit board (31) is further provided with an avoidance opening (311) corresponding to the heating element (32); a front surface of the heating element (32) away from the circuit board (31) forms the first heat dissipation surface (321), and a back surface of the heating element (32) close to the circuit board (31) forms the second heat dissipation surface (322); one surface of the second heat dissipation member (20) penetrates through the avoidance opening (311) of the circuit board (31) and is attached to the second heat dissipation surface (322) of the heating element (32).

21. A DC-DC converter according to claim 20, characterized in that, The gaps between the electrical component (30) and the first heat dissipation member (10) and the second heat dissipation member (20) are all filled with thermal conductive glue.

22. A DC-DC converter according to claim 21, characterized in that, The gaps between the second heat dissipation member (20) and the first heat dissipation member (10) are all filled with thermal conductive glue.

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