Intelligent self-monitoring deep ultraviolet disinfection module system

Abstract

The invention provides an intelligent self-monitoring deep ultraviolet disinfection and killing module system, which comprises a substrate module, a light current acquisition module, a microcontroller, a constant current power supply, an input current acquisition module and an alarm, and is characterized in that the substrate module comprises a deep ultraviolet light-emitting chip and a detection chip, and after the constant current power supply supplies power, the light current acquisition module is connected with the microcontroller; the input current acquisition module sends acquired data to the microcontroller, and the current enters the substrate module through the input current acquisition module to enable the deep ultraviolet light-emitting chip to work normally; the detection chip converts the optical signal into light current, and the light current is collected by the light current collection module and then sent to the microcontroller; and the microcontroller compares the light current acquired by the light current acquisition module with a preset normal current value. The system has the functions of deep ultraviolet sterilization and deep ultraviolet self-monitoring at the same time, the magnitude of input light current is intelligently judged, the deep ultraviolet luminous intensity of the substrate module is regulated and controlled in real time, an alarm is given out in case of abnormal emergency, and intelligent self-regulation and control are achieved.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic devices and intelligent control systems, and in particular to an intelligent self-monitoring deep ultraviolet disinfection module system. Background Art

[0002] Deep ultraviolet light has been widely used in the field of sterilization and disinfection. Deep ultraviolet light-emitting diodes provide a more environmentally friendly and low-cost sterilization and disinfection method. With the outbreak of the new crown epidemic, the importance of responding to sudden public health crises has become increasingly clear. The life of deep ultraviolet light-emitting diodes is affected by temperature, light decay, packaging materials, environmental factors, driving power supply and other factors. It is difficult to accurately and effectively monitor the life of deep ultraviolet light-emitting diodes in large-area deep ultraviolet disinfection systems. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In view of the above shortcomings, the main purpose of the present invention is to provide an intelligent self-monitoring deep ultraviolet disinfection module system, which not only has deep ultraviolet disinfection but also has deep ultraviolet self-monitoring. According to the intelligent judgment of the input photocurrent size, the deep ultraviolet luminescence intensity of the substrate module is adjusted in real time, and an alarm is automatically issued in an emergency condition to achieve accurate monitoring.

[0005] (II) Technical solution

[0006] In order to achieve the above-mentioned purpose, the first aspect of the present invention provides an intelligent self-monitoring deep ultraviolet disinfection module system, including a substrate module module, a photocurrent acquisition module, a microcontroller, a constant current power supply, an input current acquisition module and an alarm, wherein the substrate module module includes a deep ultraviolet light-emitting chip and a detection chip, wherein; after the constant current power supply is supplied, the current sends the collected data to the microcontroller through the input current acquisition module, and the current enters the substrate module through the input current acquisition module to enable the deep ultraviolet light-emitting chip to work normally; the detection chip converts the optical signal into a photocurrent, and the photocurrent is collected by the photocurrent acquisition module and sent to the microcontroller; the microcontroller compares the photocurrent collected by the photocurrent acquisition module with a preset normal current value, and when the photocurrent collected by the photocurrent acquisition module is less than the photocurrent required for normal operation, an instruction to increase the input current is sent to the constant current power supply; the microcontroller also compares the data collected by the input current acquisition module with a preset warning current value, and when the data collected by the input current acquisition module is greater than the preset warning current value, an instruction to stop increasing the input current is sent to the constant current power supply, and an abnormal signal is sent to the alarm.

[0007] In the above solution, the substrate module includes: a deep ultraviolet light-emitting and detecting chip assembly, a packaging substrate, and a module substrate, where the deep ultraviolet light-emitting and detecting chip assembly is fixed on the packaging substrate in a flip-chip manner, and the packaging substrate is welded above the module substrate.

[0008] In the above solution, the deep ultraviolet light-emitting and detecting chip assembly includes a deep ultraviolet light-emitting chip, a passivation protection layer, and a detecting chip, where the detecting chip is located at the center of the deep ultraviolet light-emitting and detecting chip assembly, and the deep ultraviolet light-emitting chip is connected to the detecting chip through the passivation protection layer.

[0009] In the above solution, the deep ultraviolet light-emitting chip, the passivation protection layer, and the detecting chip are arranged in the same plane, and both the deep ultraviolet light-emitting chip and the detecting chip are rectangular or circular.

[0010] In the above solution, the packaging substrate has a groove structure, and the inside of the groove structure is coated with a high-reflection deep ultraviolet light coating.

[0011] In the above solution, the packaging substrate includes: metal electrodes, external pins, and an insulating layer, where the metal electrodes include two positive metal electrodes and two negative metal electrodes, and the external pins include two positive pins and two negative pins; the material of the metal electrodes is copper, and the material of the insulating layer is ceramic.

[0012] In the above solution, there are multiple groups of the packaging substrate and the deep ultraviolet light-emitting and detecting chip assembly respectively; each group of the deep ultraviolet light-emitting and detecting chip assemblies is respectively fixed on each group of the packaging substrates; multiple groups of the packaging substrates are welded above the module substrate to form an array of packaging substrates.

[0013] In the above solution, on the module substrate, the deep ultraviolet light-emitting chips in multiple groups of the deep ultraviolet light-emitting and detecting chip assemblies are connected in a combined series-parallel manner.

[0014] In the above solution, on the module substrate, the detecting chips in multiple groups of the deep ultraviolet light-emitting and detecting chip assemblies are connected in parallel.

[0015] In the above solution, the microcontroller adjusts the deep ultraviolet light-emitting intensity of the substrate module in real time by judging the magnitude of the photocurrent collected by the photocurrent acquisition module.

[0016] (III) Beneficial effects

[0017] The technical solution of the embodiment of the present invention has at least the following beneficial effects:

[0018] (1) This system can use only the deep ultraviolet sterilization function or only the deep ultraviolet detection function; it can simultaneously have deep ultraviolet disinfection and self-monitoring of deep ultraviolet.

[0019] (2) Adjust the deep ultraviolet light emission intensity of the substrate module in real time according to the intelligent judgment of the input photocurrent magnitude. If an abnormal emergency occurs, the increase of the system current will be automatically terminated, and an alarm will be issued in real time to achieve intelligent self-regulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematically shows a framework diagram of a deep ultraviolet disinfection module system according to an embodiment of the present invention;

[0021] Figure 2A Shows a front schematic diagram of the composition of a deep ultraviolet light emission-detection chip assembly according to an embodiment of the present invention;

[0022] Figure 2B Shows a back schematic diagram of the composition of a deep ultraviolet light emission-detection chip assembly according to an embodiment of the present invention;

[0023] Figure 3 Shows another front schematic diagram of the composition of a deep ultraviolet light emission-detection chip assembly according to an embodiment of the present invention;

[0024] Figure 4A Shows a front schematic diagram of a packaging substrate according to an embodiment of the present invention;

[0025] Figure 4B Shows a back schematic diagram of a packaging substrate according to an embodiment of the present invention;

[0026] Figure 5 Shows a schematic diagram of a deep ultraviolet light emission-detection chip assembly flip-chip mounted on a packaging substrate according to an embodiment of the present invention;

[0027] Figure 6 Shows a schematic diagram of a module substrate according to an embodiment of the present invention;

[0028] Figure 7 Shows a schematic diagram of a packaging substrate welded to a module substrate according to an embodiment of the present invention;

[0029] Figure 8 Schematically shows an internal wiring diagram of a module substrate according to an embodiment of the present invention.

[0030] [DESCRIPTION OF THE REFERENCE NUMERALS]

[0031] 1 - Substrate module; 2 - Encapsulation substrate; 3 - Module substrate; 4 - Photoelectric current acquisition module; 5 - Microcontroller; 6 - Constant current power supply; 7 - Input current acquisition module; 8 - Alarm; 11 - Deep ultraviolet light-emitting and detecting chip assembly; 12 - Deep ultraviolet light-emitting chip; 13 - Passivation protection layer; 14 - Detecting chip; 121 - n electrode of deep ultraviolet light-emitting chip; 122 - P electrode of deep ultraviolet light-emitting chip; 141 - n electrode of detecting chip; 142 - P electrode of detecting chip; 2-1 Metal electrode; 22 - External pin; 23 - Insulating layer; 31 - Pad. Detailed implementation manners

[0032] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0033] Figure 1 The framework diagram of the deep ultraviolet disinfection module system according to an embodiment of the present invention is schematically shown.

[0034] Please specifically refer to Figure 1 , the deep ultraviolet disinfection module system includes a substrate module 1, a photoelectric current acquisition module 4, a microcontroller 5, a constant current power supply 6, an input current acquisition module 7 and an alarm 8, and the substrate module 1 includes a deep ultraviolet light-emitting chip and a detecting chip.

[0035] Specifically, the substrate module 1 is respectively connected to the photoelectric current acquisition module 2 and the input current acquisition module 5, the photoelectric current acquisition module 2 is connected to the microcontroller 3, and the microcontroller 3 is respectively connected to the constant current power supply module 4, the input current acquisition module 5 and the alarm 6.

[0036] After the constant current power supply 6 supplies power, the current sends the collected data to the microcontroller 5 through the input current acquisition module 7, and, the current enters the substrate module 1 through the input current acquisition module 7 to make the deep ultraviolet light-emitting chip work normally; the detecting chip converts the optical signal into a photoelectric current, and the photoelectric current is sent to the microcontroller 5 after being collected by the photoelectric current acquisition module 4.

[0037] The microcontroller 5 compares the photoelectric current collected by the photoelectric current acquisition module 4 with a preset normal current value. When the photoelectric current collected by the photoelectric current acquisition module 4 is less than the photoelectric current required during normal operation, it sends an instruction to increase the input current to the constant current power supply 6; the microcontroller 5 also compares the data collected by the input current acquisition module 7 with a preset warning current value. When the data collected by the input current acquisition module 7 is greater than the preset warning current value, it sends an instruction to stop increasing the input current to the constant current power supply 6, and sends an abnormal signal to the alarm 8.

[0038] Through the embodiments of the present invention, the deep ultraviolet disinfection module system can accurately monitor deep ultraviolet sterilization and disinfection, and at the same time has the function of real-time regulating the deep ultraviolet emission intensity of the substrate module according to the intelligent judgment of the input photocurrent magnitude. If an abnormal emergency occurs, the increase of the system current will be automatically terminated and an alarm will be issued in real time.

[0039] In an embodiment of the present invention, the substrate module 1 includes: a deep ultraviolet light-emitting and detecting chip assembly 11, a packaging substrate 2 and a module substrate 3. Among them, the deep ultraviolet light-emitting and detecting chip assembly 11 is fixed on the packaging substrate 2 in a flip-chip manner, and the packaging substrate 2 is welded above the module substrate 3.

[0040] Next, with reference to FIGS. 2 to Figure 8 the deep ultraviolet disinfection module system will be further described in detail.

[0041] Figure 2A FIG. shows a front schematic diagram of the composition of the deep ultraviolet light-emitting and detecting chip assembly according to an embodiment of the present invention. Figure 2B FIG. shows a back schematic diagram of the composition of the deep ultraviolet light-emitting and detecting chip assembly according to an embodiment of the present invention. Figure 3 FIG. shows another front schematic diagram of the composition of the deep ultraviolet light-emitting and detecting chip assembly according to an embodiment of the present invention.

[0042] As Figure 2A shown, the deep ultraviolet light-emitting and detecting chip assembly 11 includes a deep ultraviolet light-emitting chip 12, a passivation protection layer 13 and a detecting chip 14. The detecting chip 14 is located at the center of the deep ultraviolet light-emitting and detecting chip assembly 11, and the deep ultraviolet light-emitting chip 12 is connected to the detecting chip 14 through the passivation protection layer 13. As Figure 2A shown, the deep ultraviolet light-emitting chip 12, the passivation protection layer 13 and the detecting chip 14 are arranged in the same plane, and both the deep ultraviolet light-emitting chip 12 and the detecting chip 14 are rectangular. In addition, as Figure 3 shown, both the deep ultraviolet light-emitting chip 12 and the detecting chip 14 can also be circular.

[0043] In an embodiment of the present invention, the deep ultraviolet light-emitting chip 12 and the detecting chip 14 are made of III-V nitride materials. As Figure 2B shown, on the back of the deep ultraviolet light-emitting and detecting chip assembly 11, there are 4 electrodes, namely the n-electrode 121 and the P-electrode 122 of the deep ultraviolet light-emitting chip 12, and the n-electrode 141 and the P-electrode 142 of the detecting chip 14.

[0044] It should be noted that the wavelength of the deep ultraviolet light emitted by the deep ultraviolet light-emitting and detecting chip assembly 11 is less than 280 nm.

[0045] Figure 4A FIG. shows a front schematic diagram of the packaging substrate according to an embodiment of the present invention.Figure 4B The reverse side schematic diagram of the packaging substrate according to an embodiment of the present invention is shown.

[0046] As Figure 4A and Figure 4B shown, the packaging substrate 2 includes: metal electrodes 21, external pins 22 and an insulating layer 23, wherein; the metal electrodes 21 include two positive metal electrodes and two negative metal electrodes, and the external pins 22 include two positive pins and two negative pins; the material of the metal electrodes 21 is copper, and the material of the insulating layer 23 is ceramic.

[0047] It should be noted that the packaging substrate 2 is of a groove structure, and the inside of the groove structure is coated with a high-reflection deep ultraviolet light coating.

[0048] The deep ultraviolet light-emitting and detecting chip assembly (11) is fixed on the packaging substrate 2 in a flip-chip manner, as Figure 5 shown, Figure 5 The schematic diagram of the deep ultraviolet light-emitting and detecting chip assembly flip-chip on the packaging substrate according to an embodiment of the present invention is shown.

[0049] Figure 6 The schematic diagram of the module substrate according to an embodiment of the present invention is shown.

[0050] As Figure 6 shown, the module substrate 3 includes 4 pads 31, and the pads 31 are used to weld the packaging substrate 2, wherein two pads 31 are in a group corresponding to the deep ultraviolet light-emitting chip 12, and the other pads 31 correspond to the detecting chip 14. The internal wiring material of the module substrate 3 is copper, and the substrate main body material is copper, and the insulating part is made of glass fiber reinforced plastic.

[0051] Figure 7 The schematic diagram of the packaging substrate welded on the module substrate according to an embodiment of the present invention is shown;

[0052] As Figure 7 shown, in the embodiment of the present invention, the packaging substrate 2 and the deep ultraviolet light-emitting and detecting chip assembly 11 respectively have multiple groups; each group of deep ultraviolet light-emitting and detecting chip assemblies 11 are respectively fixed on each group of packaging substrates 2; multiple groups of packaging substrates 2 are welded above the module substrate 3 to form a packaging substrate array.

[0053] In the embodiment of the present invention, on the module substrate 3, the deep ultraviolet light-emitting chips 12 in multiple groups of deep ultraviolet light-emitting and detecting chip assemblies 11 are connected in a combination of series and parallel, and the detecting chips 14 in multiple groups of deep ultraviolet light-emitting and detecting chip assemblies 11 are connected in parallel.

[0054] For example, as Figure 8 shown, Figure 8Schematically shown is the internal wiring diagram of the module substrate according to an embodiment of the present invention. On the module substrate 3, the deep ultraviolet light-emitting chips LED are connected in series first and then in parallel, and the detection chips PD are all connected in parallel.

[0055] In summary, the present invention provides an intelligent self-monitoring deep ultraviolet disinfection module system, which can use only the deep ultraviolet sterilization function or only the deep ultraviolet detection function; it can simultaneously have deep ultraviolet disinfection and deep ultraviolet self-monitoring. According to the intelligent judgment of the input photocurrent magnitude, the deep ultraviolet light-emitting intensity of the substrate module is adjusted in real time. If an abnormal emergency occurs, the increase of the system current will be automatically terminated, and an alarm will be issued in real time, so as to realize intelligent self-monitoring.

[0056] Those skilled in the art can understand that although the present invention has been shown and described with reference to specific exemplary embodiments of the present invention, those skilled in the art should understand that various changes in form and details can be made to the present invention without departing from the spirit and scope of the present invention defined by the appended claims and their equivalents. Therefore, the scope of the present invention should not be limited to the above embodiments, but should be determined not only by the appended claims, but also by the equivalents of the appended claims.

[0057] Similarly, it should be understood that, in order to streamline the present invention and help understand one or more of the various disclosed aspects, in the above description of the exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, the disclosed method should not be construed as reflecting the intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the previous claims, the disclosed aspects lie in less than all the features of the previous disclosed single embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into the detailed description, where each claim stands on its own as a separate embodiment of the present invention.

[0058] The above specific embodiments have further detailed the purpose, technical solution and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An intelligent self - monitoring deep - ultraviolet disinfection module system, characterized in that, It includes a substrate module (1), a photocurrent acquisition module (4), a microcontroller (5), a constant current power supply (6), an input current acquisition module (7) and an alarm (8). The substrate module (1) includes a deep ultraviolet light-emitting chip and a detection chip, where; After the constant current power supply (6) supplies power, the current passes through the input current acquisition module (7) to send the acquired data to the microcontroller (5), and, the current enters the substrate module (1) through the input current acquisition module (7) to make the deep ultraviolet light-emitting chip work normally; The detection chip converts the optical signal into a photocurrent, and the photocurrent is sent to the microcontroller (5) after being acquired by the photocurrent acquisition module (4); The microcontroller (5) compares the photocurrent acquired by the photocurrent acquisition module (4) with a preset normal current value. When the photocurrent acquired by the photocurrent acquisition module (4) is less than the photocurrent required during normal operation, it sends an instruction to increase the input current to the constant current power supply (6); The microcontroller (5) also compares the data acquired by the input current acquisition module (7) with a preset warning current value. When the data acquired by the input current acquisition module (7) is greater than the preset warning current value, it sends an instruction to stop increasing the input current to the constant current power supply (6), and sends an abnormal signal to the alarm (8).

2. The deep ultraviolet disinfection module system according to claim 1, characterized in that The substrate module (1) includes: a deep ultraviolet light-emitting and detecting chip assembly (11), a packaging substrate (2) and a module substrate (3), where; The deep ultraviolet light-emitting and detecting chip assembly (11) is fixed on the packaging substrate (2) in a flip-chip manner, and the packaging substrate (2) is welded above the module substrate (3).

3. The deep ultraviolet disinfection module system according to claim 2, wherein The deep ultraviolet light-emitting and detecting chip assembly (11) includes a deep ultraviolet light-emitting chip, a passivation protection layer and a detection chip, where; The detection chip is located at the center of the deep ultraviolet light-emitting and detecting chip assembly (11), and the deep ultraviolet light-emitting chip is connected to the detection chip through the passivation protection layer.

4. The deep ultraviolet disinfection module system according to claim 3, wherein The deep ultraviolet light-emitting chip, the passivation protection layer and the detection chip are arranged in the same plane, and both the deep ultraviolet light-emitting chip and the detection chip are rectangular or circular.

5. The deep ultraviolet disinfection module system according to claim 2, wherein, The packaging substrate (2) is a groove structure, and the inside of the groove structure is coated with a high-reflection deep ultraviolet light coating.

6. The deep ultraviolet disinfection module system according to claim 2 or 5, characterized in that, The packaging substrate (2) includes: metal electrodes, external pins and an insulating layer, where; The metal electrodes include two positive metal electrodes and two negative metal electrodes, and the external pins include two positive pins and two negative pins; The material of the metal electrodes is copper, and the material of the insulating layer is ceramic.

7. The deep ultraviolet disinfection module system according to claim 2, wherein The packaging substrate (2) and the deep ultraviolet light-emitting and detecting chip assembly (11) each have multiple groups; Each group of the deep ultraviolet light-emitting and detecting chip assemblies (11) is respectively fixed on each group of the packaging substrates (2); Multiple groups of the packaging substrates (2) are welded above the module substrate (3) to form a packaging substrate array.

8. The deep ultraviolet disinfection module system according to claim 2 or 7, characterized in that, On the module substrate (3), multiple deep ultraviolet light-emitting chips in multiple groups of the deep ultraviolet light-emitting and detecting chip assemblies (11) are connected in a combined series-parallel manner.

9. The deep ultraviolet disinfection module system according to claim 2 or 7, characterized in that, On the module substrate (3), multiple detecting chips in multiple groups of the deep ultraviolet light-emitting and detecting chip assemblies (11) are connected in parallel.

10. The deep ultraviolet disinfection module system according to claim 1, wherein, The microcontroller (5) adjusts the deep ultraviolet light-emitting intensity of the substrate module (1) in real time by judging the magnitude of the photocurrent collected by the photocurrent acquisition module (4).

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