Cleaning brush cleaning device and chemical mechanical polishing equipment

Abstract

The invention provides a cleaning brush cleaning device and chemical mechanical grinding equipment, the cleaning brush cleaning device comprises an ultrasonic cleaning container, an adjustable clamping mechanism, a driving structure and a scraping and washing assembly, the adjustable clamping mechanism comprises supporting arms symmetrically arranged in the ultrasonic cleaning container, and surface treatment plates are arranged at the tail ends of the supporting arms; the driving structure is used for driving the cleaning brush to rotate, the scraping and washing assembly is arranged at the bottom of the ultrasonic cleaning container and comprises a plurality of comb-shaped sheets arranged in parallel, and the comb-shaped sheets are used for brushing the cleaning brush. When the cleaning brush cleaning device is used for cleaning the cleaning brush, the comb-shaped sheets of the surface treatment plate and the scraping and cleaning assembly can more thoroughly clean away adhered objects and embedded pollutants on the surface of the cleaning brush under the action of ultrasonic waves, and therefore deep cleaning of the cleaning brush is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and more specifically, relates to a cleaning brush cleaning device and a chemical mechanical polishing equipment. Background Art

[0002] The semiconductor industry belongs to a high-precision industry, which puts extremely high requirements on wafer processing equipment. With the development of the semiconductor industry, the feature size of integrated circuits continues to shrink, so the requirements for the planarization quality of the wafer surface are becoming more and more strict, and thus the requirements for the stability of chemical mechanical polishing equipment are also getting higher and higher.

[0003] Chemical-mechanical polishing (CMP) is an important means to achieve the planarization of the wafer surface, which includes a grinding process and a post-cleaning process. In the CMP process, after the wafer is ground in the grinding unit of the machine, it then needs to enter the cleaning unit to complete the steps of cleaning and drying. Among them, the cleaning brush (Brush) plays a very important role in the cleaning unit. The wafer needs to be washed off the particle residues on the front and back surfaces of the wafer through the combined action of the Brush and the chemical cleaning solution.

[0004] However, in the cleaning unit, the abrasive particles and by-products in the grinding fluid are easily dirtied and accumulated in the Brush. Long-term accumulation will lead to a decline in the cleaning ability of the Brush, and even cause secondary pollution to the wafer. Therefore, ensuring the cleanliness of the Brush itself is very important for stabilizing product quality. Currently, the self-cleaning method of the Brush usually achieves the cleaning effect by rotating and rubbing on the quartz plate surface. This method can only clean the surface of the Brush, and it is difficult to clean the embedded pollutants thoroughly. Summary of the Invention

[0005] The purpose of the present invention is to provide a cleaning brush cleaning device and a chemical mechanical polishing equipment, and the cleaning brush cleaning device can achieve deep cleaning of the cleaning brush.

[0006] To achieve the above purpose, the technical solution adopted by the present invention is: In the first aspect of the present invention, a cleaning brush cleaning device is provided, including: An ultrasonic cleaning container; An adjustable clamping mechanism, including support arms symmetrically arranged inside the ultrasonic cleaning container, and a surface treatment plate is arranged at the end of the support arm, and the surface treatment plate is used for frictional contact with the cleaning brush; A driving structure, and the driving structure is used to drive the cleaning brush to rotate; A scraping and washing assembly, which is arranged at the bottom of the ultrasonic cleaning container and includes a plurality of comb-shaped thin sheets arranged in parallel, and the comb-shaped thin sheets are used for brushing the cleaning brush.

[0007] In one embodiment, the adjustable clamping mechanism includes: An angle adjustment mechanism for forming an adjustable inclination angle of 15-30° between the surface treatment plate and the vertical direction.

[0008] In one embodiment, the ultrasonic cleaning container is configured with: A multi-frequency ultrasonic generator with an adjustable operating frequency in the range of 28-120 kHz; A temperature control module for maintaining the temperature of the cleaning liquid in the ultrasonic cleaning container at 30-60°C; A liquid level sensor for real-time monitoring of the liquid level height of the cleaning liquid in the ultrasonic cleaning container.

[0009] In one embodiment, a cleaning liquid circulation system is further included, and the cleaning liquid circulation system is connected to the liquid inlet and outlet of the ultrasonic cleaning container to maintain dynamic update of the cleaning liquid.

[0010] In one embodiment, the cleaning liquid circulation system includes: A filtering structure for filtering particulate residues in the cleaning liquid; A flow control valve for adjusting the flow rate of the cleaning liquid; A waste liquid recovery pipe and a cleaning liquid supply pipe.

[0011] In one embodiment, it further includes: a visual detection module including a CCD camera and an image processing unit for evaluating the cleanliness of the cleaning brush; an automatic control unit for adjusting the operating frequency and cleaning time parameters of the ultrasonic generator according to the cleanliness; and an abnormal alarm device for triggering an alarm when the residual amount of particulate contaminants exceeds a threshold.

[0012] In one embodiment, the following are further provided in the ultrasonic cleaning container: A vortex device for generating a vortex; A bubble generating device for generating bubbles with a particle size <200 nm.

[0013] In one embodiment, the material of the comb-shaped thin sheet is quartz, and the comb-shaped thin sheets are arranged at equal intervals; The surface treatment plate is quartz.

[0014] In one embodiment, the hardness of the contact end of the comb-shaped thin sheet with the cleaning brush is greater than the hardness of the side of the comb-shaped thin sheet close to the bottom of the ultrasonic cleaning container, and the surface of the comb-shaped thin sheet has a hydrophobic layer.

[0015] In a second aspect of the present invention, a chemical mechanical polishing equipment is provided, and the chemical mechanical polishing equipment includes a polishing unit and a cleaning unit, and the cleaning unit includes the cleaning brush cleaning device as described above.

[0016] The cleaning brush cleaning device provided by the present invention includes an ultrasonic cleaning container, an adjustable clamping mechanism, a driving structure, and a scraping assembly. The adjustable clamping mechanism includes support arms symmetrically arranged inside the ultrasonic cleaning container. The ends of the support arms are provided with surface treatment plates for friction contact with the cleaning brush. The driving structure is used to drive the cleaning brush to rotate. The scraping assembly is arranged at the bottom of the ultrasonic cleaning container and includes a plurality of comb-shaped thin sheets arranged in parallel for brushing the cleaning brush. When cleaning the cleaning brush, the cleaning brush is located above the comb-shaped thin sheets of the scraping assembly. The adjustable clamping mechanism is symmetrically arranged, and the cleaning brush is located between two surface treatment plates. The driving structure drives the cleaning brush to rotate. When the cleaning brush rotates, the two surface treatment plates perform friction cleaning on the cleaning brush, and the comb-shaped thin sheets perform scraping on the cleaning brush. The ultrasonic cleaning container generates ultrasonic waves to perform ultrasonic cleaning on the cleaning brush. Under the action of ultrasonic waves, the surface treatment plates and the comb-shaped thin sheets of the scraping assembly can more thoroughly clean the adhesion and embedded pollutants on the surface of the cleaning brush, thereby achieving deep cleaning of the cleaning brush.

[0017] The chemical mechanical polishing equipment provided by the present invention includes the above-mentioned cleaning brush cleaning device. When cleaning the cleaning brush, the cleaning brush is located above the comb-shaped thin sheets of the scraping assembly. The adjustable clamping mechanism is symmetrically arranged, and the cleaning brush is located between two surface treatment plates. The driving structure drives the cleaning brush to rotate. When the cleaning brush rotates, the two surface treatment plates perform friction cleaning on the cleaning brush, and the comb-shaped thin sheets perform scraping on the cleaning brush. The ultrasonic cleaning container generates ultrasonic waves to perform ultrasonic cleaning on the cleaning brush. Under the action of ultrasonic waves, the surface treatment plates and the comb-shaped thin sheets of the scraping assembly can more thoroughly clean the adhesion and embedded pollutants on the surface of the cleaning brush, thereby achieving deep cleaning of the cleaning brush and improving the stability of the polishing process. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram of the cleaning brush cleaning device provided by the embodiment of the present invention; Figure 2 It is a front view of the scraping assembly of the cleaning brush cleaning device provided by the embodiment of the present invention; Figure 3 It is a left view of the scraping assembly of the cleaning brush cleaning device provided by the embodiment of the present invention; Figure 4 It is a top view of the scraping component of the cleaning brush cleaning device provided by the embodiment of the present invention.

[0020] Among them, the reference signs in the figure are as follows: 1 - Ultrasonic cleaning container; 2 - Adjustable clamping mechanism; 3 - Scraping component; 4 - Cleaning brush; 11 - Cleaning liquid container; 12 - Vortex device; 21 - Support arm; 22 - Surface treatment plate; 31 - Comb-shaped thin sheet. Specific embodiments

[0021] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0023] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be construed as a limitation of the present invention.

[0024] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. It should be understood that the term "and / or" used herein is only a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0025] In the cleaning unit of the CMP process, the wafer needs to be scrubbed by the combined action of a cleaning brush and a chemical cleaning solution to remove particulate residues on the front and back surfaces of the wafer. Abrasive particles and by-products in the polishing slurry are likely to embed in the cleaning brush, and long-term accumulation will lead to a decline in the cleaning ability of the cleaning brush and even cause secondary contamination to the wafer. Currently, the cleaning method of the cleaning brush is usually to rotate and rub on the surface of the quartz plate for cleaning. This method can only clean the surface of the cleaning brush, and it is difficult to thoroughly clean the embedded contaminants. Based on the above problems, this application provides a cleaning brush cleaning device and a chemical mechanical polishing equipment.

[0026] The cleaning brush cleaning device and the chemical mechanical polishing equipment provided by the present invention will be described in detail below with reference to specific embodiments.

[0027] Figure 1 It is a schematic structural diagram of the cleaning brush cleaning device provided by an embodiment of the present invention. Figure 2 It is a front view of the scraping component of the cleaning brush cleaning device provided by an embodiment of the present invention. Figure 3 It is a left view of the scraping component of the cleaning brush cleaning device provided by an embodiment of the present invention. Figure 4 It is a top view of the scraping component of the cleaning brush cleaning device provided by an embodiment of the present invention. Please refer to Figures 1-4 In the first aspect of this embodiment, a cleaning brush cleaning device is provided, including an ultrasonic cleaning container 1, an adjustable clamping mechanism 2, a driving structure, and a scraping component 3. The ultrasonic cleaning container 1 provides ultrasonic waves during the cleaning process of the cleaning brush. The adjustable clamping mechanism 2 includes support arms 21 symmetrically arranged inside the ultrasonic cleaning container. The end of the support arm 21 is provided with a surface treatment plate 22, and the surface treatment plate 22 is used for frictional contact with the cleaning brush 4. The driving structure is used to drive the cleaning brush 4 to rotate. The scraping component 3 is arranged at the bottom of the ultrasonic cleaning container and includes a plurality of comb-shaped thin sheets 31 arranged in parallel, and the comb-shaped thin sheets 31 are used for brushing the cleaning brush 4.

[0028] The ultrasonic cleaning container 1 of this embodiment includes an ultrasonic generator and a cleaning liquid container 11. The ultrasonic generator is used to generate ultrasonic waves in the cleaning liquid in the accommodating cavity of the cleaning liquid container 11. The specific structure of the ultrasonic generator in this embodiment is not particularly limited, and the ultrasonic generator is an ultrasonic generator applied in the prior art.

[0029] The adjustable clamping mechanism 2 of this embodiment includes support arms 21 symmetrically arranged inside the cleaning liquid container 11. A surface treatment plate 22 is provided at the end of the support arm 21. The surface treatment plate 22 of this embodiment is used to friction-clean the cleaning brush 4 during the ultrasonic cleaning process of the cleaning brush 4. Exemplarily, the support arm of this embodiment is installed on a rotatable driving device. When the rotatable driving device drives the support arm 21 to rotate to a certain angle, the surface treatment plate 22 contacts the cleaning brush 4. After the cleaning is completed, the rotatable driving device drives the support arm 21 to return to its original position. The contact angle and pressure between the surface treatment plate 22 and the cleaning brush 4 are adjustable. By changing the contact angle and force between the surface treatment plate 22 and the cleaning brush 4, the contact area between the surface treatment plate 22 and the cleaning brush 4 can be adjusted, improving the cleaning efficiency of the cleaning brush 4. The surface treatment plate 22 of this embodiment is generally a quartz plate. The quartz plate has extremely high hardness, can resist wear and scratches, ensure that the cleaning brush 4 is not damaged during use, and extend its service life. Quartz has extremely high chemical inertness and can withstand chemical reagents such as strong acids (such as hydrofluoric acid), strong bases (such as ammonia water), or oxidants (such as hydrogen peroxide) used in CMP cleaning, avoiding corrosion or contamination of the quartz plate by the cleaning solution during the cleaning process and the roller brush.

[0030] The driving structure of this embodiment is used to drive the cleaning brush 4 to rotate. Exemplarily, the cleaning brush 4 is supported by a support shaft during the cleaning process, and the driving structure drives the support shaft to rotate, thereby causing the cleaning brush 4 to rotate. The driving structure of this embodiment is located inside the cleaning liquid container 11 of the ultrasonic cleaning container, and the driving structure is a waterproof driving structure.

[0031] The scraping and washing assembly 3 of this embodiment is arranged at the bottom of the cleaning liquid container 11 of the ultrasonic cleaning container and includes a plurality of comb-shaped thin plates 31 arranged in parallel. The comb-shaped thin plates 31 are used to support and brush the cleaning brush 4. The scraping and washing assembly 3 of this embodiment is fixed to the cleaning liquid container 11. The comb-shaped thin plates 31 contact and scrape the cleaning brush 4 during the rotation of the cleaning brush 4 to remove contaminants on the cleaning brush 4. Exemplarily, the material of the comb-shaped thin plates 31 of this embodiment is quartz, and the Mohs hardness of quartz is 7, which is much higher than the common materials of the cleaning brush 4 (such as polyurethane or nylon). This high hardness enables it to effectively scrape off abrasive particles (such as silicon dioxide, cerium oxide) or polishing residues attached to the surface of the cleaning brush 4, and it is not easily worn by itself. After long-term use, the comb-shaped thin plates 31 made of quartz can still maintain a flat surface, avoiding a decrease in cleaning efficiency due to wear.

[0032] In the chemical mechanical polishing cleaning unit, abrasive particles and by-products in the polishing liquid are likely to accumulate dirt in the cleaning brush 4. Long-term accumulation will cause the cleaning ability of the cleaning brush 4 to decline and even cause secondary contamination to the wafer. At present, the self-cleaning method of the cleaning brush 4 usually achieves the cleaning effect by rotating and rubbing on the surface of the quartz plate. This method can only clean the surface of the cleaning brush 4, and it is difficult to thoroughly clean the embedded pollutants. When the brush cleaning device of the chemical mechanical polishing equipment in this embodiment cleans the cleaning brush, the driving structure drives the cleaning brush to rotate, and the ultrasonic cleaning container causes the cleaning liquid to generate ultrasonic waves. The cleaning brush 4 is located between two surface treatment plates 22 of the adjustable clamping mechanism. When the driving structure drives the cleaning brush 4 to rotate, the comb-shaped thin plate 31 scrapes the surface of the cleaning brush 4, and the two surface treatment plates 22 clean the cleaning brush 4 by friction. Under the action of ultrasonic waves, the surface treatment plate 22 and the comb-shaped thin plate 31 of the scraping component 3 can more thoroughly clean the adhesion and embedded pollutants on the surface of the cleaning brush 4, so as to achieve deep cleaning of the cleaning brush 4, reducing or avoiding secondary contamination of the wafer by the cleaning brush 4 in the cleaning unit.

[0033] The brush cleaning device provided in this embodiment includes an ultrasonic cleaning container, an adjustable clamping mechanism, a driving structure and a scraping component. The adjustable clamping mechanism includes support arms symmetrically arranged inside the ultrasonic cleaning container. The ends of the support arms are provided with surface treatment plates for friction contact with the cleaning brush. The driving structure is used to drive the cleaning brush to rotate. The scraping component is arranged at the bottom of the ultrasonic cleaning container and includes a plurality of parallel arranged comb-shaped thin plates for brushing the cleaning brush. When cleaning the cleaning brush, the cleaning brush is located above the comb-shaped thin plates of the scraping component. The adjustable clamping mechanism is symmetrically arranged, and the cleaning brush is located between two surface treatment plates. The driving structure drives the cleaning brush to rotate. When the cleaning brush rotates, the two surface treatment plates perform friction cleaning on the cleaning brush, and the comb-shaped thin plates perform scraping on the cleaning brush. The ultrasonic cleaning container generates ultrasonic waves to perform ultrasonic cleaning on the cleaning brush. Under the action of ultrasonic waves, the surface treatment plates and the comb-shaped thin plates of the scraping component can more thoroughly clean the adhesion and embedded pollutants on the surface of the cleaning brush, so as to achieve deep cleaning of the cleaning brush.

[0034] In a specific embodiment, the adjustable clamping mechanism 2 includes an angle adjustment mechanism for forming an adjustable inclination angle of 15-30° between the surface treatment plate 22 and the vertical direction. Since the cleaning brush 4 is generally made of a soft, porous and elastic material, the pressure of the surface treatment plate 22 on the cleaning brush 4 and the contact area between the surface treatment plate 22 and the cleaning brush 4 can be adjusted by adjusting the angle of the surface treatment plate 22. When the pressure and the contact area between the surface treatment plate 22 and the cleaning brush 4 are large, the cleaning efficiency of the cleaning brush 4 can be improved. For example, when the surface treatment plate 22 forms an angle of 15° with the vertical direction, the pressure and the contact area between the surface treatment plate 22 and the cleaning brush 4 are small. When the surface treatment plate 22 forms an angle of 30° with the vertical direction, the pressure and the contact area between the surface treatment plate 22 and the cleaning brush 4 are large. Exemplarily, one end of the support arm of the adjustable clamping mechanism of this embodiment is provided with a first driving motor. The angle adjustment mechanism of this embodiment is arranged at the other end of the support arm. The first driving motor of this embodiment is used to drive the surface treatment plate 22 to be in frictional contact with the cleaning brush 4 when the cleaning brush 4 is placed into the ultrasonic cleaning container. The angle adjustment mechanism of this embodiment includes a second driving motor, and the output end of the second driving motor is connected to the surface treatment plate 22. The second driving motor of this embodiment is a stepping motor, and the rotation angle of the surface treatment plate 22 can be controlled by controlling the rotation angle of the stepping motor.

[0035] Exemplarily, the ultrasonic cleaning container is configured with a multi-frequency ultrasonic generator, a temperature control module and a liquid level sensor. The working frequency of the multi-frequency ultrasonic generator of this embodiment is adjustable within the range of 28-120 kHz. The multi-frequency ultrasonic generator can perform customized cleaning on the pollution degree of the cleaning brush 4 through a combination of ultrasonic waves with different frequencies. This multi-frequency design can more effectively remove the pollutants on the cleaning brush 4 and improve the cleaning efficiency and quality. The temperature control module of this embodiment maintains the temperature of the cleaning liquid between 30-60°C. Exemplarily, the cleaning speed can be increased by raising the temperature, and the adverse effects caused by too high or too low temperature can be avoided by controlling the cleaning liquid temperature within a certain range. The liquid level sensor of this embodiment monitors the liquid level height in real time and can remind the technician to replenish the cleaning liquid when the cleaning liquid volume in the ultrasonic cleaning container is insufficient.

[0036] Furthermore, the cleaning brush cleaning device further includes a cleaning liquid circulation system, which is connected to the liquid inlet and outlet of the ultrasonic cleaning container to maintain the dynamic update of the cleaning liquid. The liquid circulation system of this embodiment enables the cleaning liquid to be circulated and discharged or replaced regularly.

[0037] Preferably, the cleaning liquid circulation system includes a filter structure and a flow control valve. The filter structure is used to filter particulate residues in the cleaning liquid, and the flow control valve is used to adjust the flow rate of the cleaning liquid. Exemplarily, the filter structure is configured with a filter having an accuracy of 5 - 20 μm. By setting the filter structure in the liquid circulation system of this embodiment, during the circulation of the cleaning liquid, the filter structure can filter particulate residues in the cleaning liquid and keep the cleaning liquid clean. The filtration accuracy of the filter is 5 - 20 μm, which can ensure the filtration effect. Exemplarily, the flow control valve of this embodiment can adjust the flow rate of the cleaning liquid to be 0.5 - 5 L / min. During the cleaning process, maintaining the temperature and flow rate of the cleaning liquid constant can ensure the consistency of the cleaning effect and avoid affecting the cleaning quality due to changes in temperature and flow rate. Moreover, an appropriate flow rate can enhance the mechanical scouring effect of the cleaning liquid, thereby more effectively removing contaminants on the cleaning brush 4. The liquid circulation system of this embodiment includes a waste liquid recovery pipeline and a cleaning liquid supply pipeline. By setting the waste liquid recovery pipeline, it is possible to quickly replace the cleaning liquid in the cleaning liquid container 11 of the ultrasonic cleaning container 1, and at the same time avoid polluting the environment with the cleaning liquid inside the ultrasonic cleaning container 1. By setting the cleaning liquid supply pipeline, it is convenient to supply the cleaning liquid into the ultrasonic cleaning container 1.

[0038] In a specific embodiment, the cleaning brush cleaning device further includes a visual detection module, an automatic control unit, and an abnormal alarm device. The visual detection module includes a CCD camera and an image processing unit, and is used to evaluate the cleanliness of the cleaning brush; the automatic control unit is used to adjust the working frequency and cleaning time parameters of the ultrasonic generator according to the cleanliness; the abnormal alarm device is used to trigger an alarm when the residual amount of particulate pollutants exceeds a threshold.

[0039] The visual detection module of this embodiment is used to evaluate the cleanliness of the cleaning brush 4. The visual detection module of this embodiment includes a CCD camera and an image processing unit. Exemplarily, the CCD camera is used to take pictures during the cleaning process of the cleaning brush 4, and the image processing unit compares the taken pictures with the pictures of the preset clean cleaning brush 4 to evaluate the cleanliness of the bristles of the cleaning brush 4. The automatic control unit of this embodiment is electrically connected to the visual detection module and is used to adjust the working frequency and cleaning time parameters of the ultrasonic generator according to the detection results of the image processing unit. For example, when the cleanliness of the bristles does not meet the preset requirements within the preset cleaning time, the ultrasonic power of the ultrasonic generator of the ultrasonic cleaning container 1 is increased and the cleaning time is extended. The abnormal alarm device of this embodiment is used to trigger an alarm when the residual amount of pollutants exceeds a threshold. Specifically, a particle counting sensor is arranged inside the cleaning liquid container 11 of the ultrasonic cleaning container 1 of this embodiment to detect the particulate matter in the cleaning liquid, and an alarm is triggered when the content of particulate pollutants exceeds the threshold.

[0040] Further, a vortex device 12 and a bubble generating device are also provided in the ultrasonic cleaning container 1. The vortex device 12 is used to generate a vortex, and the bubble generating device is used to generate bubbles with a particle size < 200 nm. In this embodiment, the vortex device 12 is provided to generate a vortex, and the eddy current will drive the dirt on the surface of the object to be cleaned away. For example, at the center of the eddy current, the pressure is relatively low, and the surrounding liquid rushes towards the surface of the cleaning brush 4 with greater energy. This impact force impacts the residues on the surface of the cleaning brush 4 and can better pull the residues away from the surface of the cleaning brush 4. The bubble generating device in this embodiment is used to generate bubbles with a particle size < 200 nm. When the bubbles are formed in the liquid, a tiny blasting effect will occur on the surface, enabling the cleaning liquid to better contact the surface of the cleaning brush 4, increasing the cleaning surface area, and improving the cleaning efficiency. Further, when the bubbles are formed and burst in the liquid, an impact force will be generated. This mechanical impact can help clean the residues and improve the cleaning efficiency. When the bubbles move in the liquid, they will carry away gases and fill the voids, making it easier for the cleaning liquid to penetrate the surface and fine gaps of the object to be cleaned, thereby cleaning the cleaning brush 4 more thoroughly.

[0041] In a specific embodiment, the hardness of the contact end of the comb-shaped thin sheet 31 with the cleaning brush 4 is greater than the hardness of the side of the comb-shaped thin sheet 31 close to the bottom of the ultrasonic cleaning container, and the surface of the comb-shaped thin sheet 31 has a hydrophobic layer. The comb-shaped thin sheet 31 is in direct contact with the cleaning brush 4 during the cleaning process of the cleaning brush 4. In this embodiment, the hardness of the contact end of the comb-shaped thin sheet 31 with the cleaning brush 4 is greater than the hardness of the side of the comb-shaped thin sheet 31 close to the bottom of the ultrasonic cleaning container 1, which can reduce the probability of damage to the end of the comb-shaped thin sheet 31 in contact with the cleaning brush 4 during the cleaning process of the cleaning brush 4. By providing a hydrophobic layer on the surface of the comb-shaped thin sheet 31, the moisture in the cleaning liquid is prevented from penetrating into the substrate of the comb-shaped thin sheet 31, which plays a protective role for the comb-shaped thin sheet 31. The water droplets on the surface of the hydrophobic layer are not easy to form water stains and are easy to roll off, thereby taking away the dirt and dust on the surface, and having a certain self-cleaning function. The hydrophobic layer can protect the substrate from external factors such as moisture, corrosion, and pollution, thereby prolonging the service life of the substrate, and has a significant effect on improving the overall durability of the comb-shaped thin sheet 31.

[0042] Specifically, the material of the comb-shaped thin sheet 31 in this embodiment is quartz, the comb-shaped thin sheets 31 are arranged at equal intervals, and the surface treatment plate 22 is quartz. The material of the comb-shaped thin sheet 31 and the material of the surface treatment plate 22 in this embodiment are both quartz. Quartz has characteristics such as high hardness, wear resistance, scratch resistance, corrosion resistance, and easy cleaning, can withstand a large amount of friction and wear, and is not easy to produce scratches or wear marks, thereby being able to prolong the service life of the cleaning brush cleaning device.

[0043] The cleaning brush cleaning device provided by the embodiment of the present invention includes an ultrasonic cleaning container, an adjustable clamping mechanism, a driving structure, and a scraping component. The adjustable clamping mechanism includes support arms symmetrically arranged inside the ultrasonic cleaning container. A surface treatment plate is provided at the end of the support arm. The driving structure is used to drive the cleaning brush to rotate. The scraping component is arranged at the bottom of the ultrasonic cleaning container and includes a plurality of comb-shaped thin sheets arranged in parallel. The comb-shaped thin sheets are used to brush the cleaning brush. When cleaning the cleaning brush, the cleaning brush is located above the comb-shaped thin sheets of the scraping component. The adjustable clamping mechanism is symmetrically arranged. The cleaning brush is located between two surface treatment plates. The driving structure drives the cleaning brush to rotate. When the cleaning brush rotates, the two surface treatment plates perform friction cleaning on the cleaning brush, and the comb-shaped thin sheets perform scraping cleaning on the cleaning brush. The ultrasonic cleaning container generates ultrasonic waves to perform ultrasonic cleaning on the cleaning brush. Under the action of ultrasonic waves, the surface treatment plates and the comb-shaped thin sheets of the scraping component of this cleaning brush cleaning device can more thoroughly clean the adhesives and embedded pollutants on the surface of the cleaning brush, thereby realizing deep cleaning of the cleaning brush and improving the stability of the grinding process.

[0044] Please refer to Figures 3-4 , the second aspect of this embodiment provides a chemical mechanical polishing equipment, which includes a polishing unit and a cleaning unit. The cleaning unit includes the cleaning brush cleaning device as described in the above embodiment.

[0045] For example, the cleaning brush cleaning device includes: An ultrasonic cleaning container; An adjustable clamping mechanism, including support arms symmetrically arranged inside the ultrasonic cleaning container. A surface treatment plate is provided at the end of the support arm. The surface treatment plate is used for frictional contact with the cleaning brush; A driving structure, which is used to drive the cleaning brush to rotate; A scraping component, arranged at the bottom of the ultrasonic cleaning container, includes a plurality of comb-shaped thin sheets arranged in parallel. The comb-shaped thin sheets are used to brush the cleaning brush.

[0046] The chemical mechanical polishing equipment of this embodiment includes a polishing unit and a cleaning unit. The polishing unit removes surface materials through the synergistic action of chemical corrosion and mechanical polishing to achieve nanoscale planarization. After the wafer is polished in the polishing unit of the chemical mechanical polishing equipment, it then needs to enter the cleaning unit to complete the steps of cleaning and drying. The cleaning unit of this embodiment includes a cleaning brush and a cleaning brush cleaning device. In the cleaning unit, the wafer needs to be washed by the combined action of the cleaning brush and the chemical cleaning solution to remove the particle residues on the front and back surfaces of the wafer. The cleaning brush cleaning device is used to clean the cleaning brush to avoid contaminating the wafer during the process of washing the wafer.

[0047] The cleaning brush of the cleaning unit has the characteristics of being soft, porous, elastic, having nozzles, and hydrophilicity, and has great advantages in cleaning the particle residues on the surface of the wafer edge. During the process of cleaning the wafer with the cleaning brush, the cleaning brush squeezes the wafer. The porous characteristics of the cleaning brush make its water retention and water holding properties better, and it can store the cleaning liquid, and then squeeze the cleaning liquid out onto the wafer surface during the squeezing process of cleaning the wafer. At the same time, due to the existence of the nozzles, there will be areas with different heights, and a channel will be left for the cleaning liquid in the low areas, thereby improving the cleaning ability and effect. Since the abrasive particles and by-products in the wafer grinding liquid are easy to hide dirt in the cleaning brush, long-term accumulation will cause the cleaning ability of the cleaning brush to decline, and even cause secondary pollution to the wafer. At present, the self-cleaning method of the cleaning brush usually achieves the cleaning effect by rotating and rubbing on the surface of the quartz plate. This method can only clean the surface of the cleaning brush, and it is difficult to clean the embedded pollutants thoroughly.

[0048] The cleaning brush cleaning device of this embodiment includes an ultrasonic cleaning container, an adjustable clamping mechanism, a driving structure, and a scraping component. The adjustable clamping mechanism includes support arms symmetrically arranged inside the ultrasonic cleaning container. The end of the support arm is provided with a surface treatment plate, which is used for frictional contact with the cleaning brush. The driving structure is used to drive the cleaning brush to rotate. The scraping component is arranged at the bottom of the ultrasonic cleaning container and includes a plurality of comb-shaped thin plates arranged in parallel, and the comb-shaped thin plates are used for brushing the cleaning brush. When cleaning the cleaning brush with this cleaning brush cleaning device, the ultrasonic cleaning container generates ultrasonic waves to perform ultrasonic cleaning on the cleaning brush. The driving structure drives the cleaning brush to rotate. The two surface treatment plates perform frictional cleaning on the cleaning brush, and the comb-shaped thin plates perform scraping on the cleaning brush, which can clean off the adhesives and embedded pollutants on the surface of the cleaning brush, so as to achieve thorough cleaning of the cleaning brush.

[0049] The chemical mechanical polishing equipment provided by the embodiment of the present invention includes the cleaning brush cleaning device as described above. When cleaning the cleaning brush, the cleaning brush is located above the comb-shaped thin plates of the scraping component, the adjustable clamping mechanism is symmetrically arranged, the cleaning brush is located between the two surface treatment plates, the driving structure drives the cleaning brush to rotate. When the cleaning brush rotates, the two surface treatment plates perform frictional cleaning on the cleaning brush, the comb-shaped thin plates perform scraping on the cleaning brush, and the ultrasonic cleaning container generates ultrasonic waves to perform ultrasonic cleaning on the cleaning brush. Under the action of ultrasonic waves, the surface treatment plates and the comb-shaped thin plates of the scraping component of this cleaning brush cleaning device can more thoroughly clean off the adhesives and embedded pollutants on the surface of the cleaning brush, so as to achieve deep cleaning of the cleaning brush and improve the stability of the polishing process.

[0050] In the above description, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0051] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A cleaning brush cleaning device, characterized in that, Comprising: An ultrasonic cleaning container; An adjustable clamping mechanism, including support arms symmetrically arranged inside the ultrasonic cleaning container, with a surface treatment plate provided at the end of the support arms, and the surface treatment plate is used for frictional contact with the cleaning brush; A driving structure, which is used to drive the cleaning brush to rotate; A scraping and washing assembly, arranged at the bottom of the ultrasonic cleaning container, including a plurality of comb-shaped thin sheets arranged in parallel, and the comb-shaped thin sheets are used for brushing the cleaning brush.

2. The cleaning brush cleaning device according to claim 1, characterized in that, The adjustable clamping mechanism includes: An angle adjustment mechanism for forming an adjustable inclination angle of 15 - 30° between the surface treatment plate and the vertical direction.

3. The cleaning brush cleaning device according to claim 1, characterized in that, The ultrasonic cleaning container is configured with: A multi-frequency ultrasonic generator, with a working frequency adjustable within the range of 28 - 120 kHz; A temperature control module for maintaining the temperature of the cleaning liquid in the ultrasonic cleaning container at 30 - 60°C; A liquid level sensor for real-time monitoring of the liquid level height of the cleaning liquid in the ultrasonic cleaning container.

4. The cleaning brush cleaning device according to claim 3, wherein: It further includes a cleaning liquid circulation system, and the cleaning liquid circulation system is connected to the inlet and outlet of the ultrasonic cleaning container to maintain dynamic update of the cleaning liquid.

5. The cleaning brush cleaning device according to claim 4, characterized in that, The cleaning liquid circulation system includes: A filtering structure for filtering particulate residues in the cleaning liquid; A flow control valve for adjusting the flow rate of the cleaning liquid; A waste liquid recovery pipe and a cleaning liquid supply pipe.

6. The cleaning brush cleaning device according to claim 5, characterized in that, It further includes: A visual detection module, including a CCD camera and an image processing unit, for evaluating the cleanliness of the cleaning brush; an automatic control unit for adjusting the working frequency and cleaning time parameters of the ultrasonic generator according to the cleanliness; an abnormal alarm device for triggering an alarm when the residual amount of particulate pollutants exceeds the threshold.

7. The cleaning brush cleaning device according to any one of claims 1-6, characterized in that, Inside the ultrasonic cleaning container, there is also provided: A vortex device for generating vortices; A bubble generating device for generating bubbles with a particle size < 200 nm.

8. The cleaning brush cleaning device according to claim 7, wherein: The comb-shaped thin sheets are made of quartz and are arranged at equal intervals; The surface treatment plate is made of quartz.

9. The cleaning brush cleaning device according to claim 8, characterized in that: The hardness of the contact end of the comb-shaped thin sheet with the cleaning brush is greater than the hardness of the side of the comb-shaped thin sheet close to the bottom of the ultrasonic cleaning container, and the surface of the comb-shaped thin sheet has a hydrophobic layer.

10. A chemical mechanical polishing apparatus, characterized in that: The chemical mechanical polishing equipment includes a polishing unit and a cleaning unit, and the cleaning unit includes the cleaning brush cleaning device according to any one of claims 1 - 9.

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