Liquid supply arm and grinding equipment
By introducing a temperature regulation system of condenser tubes and heating wires into the liquid supply arm, the problem of reaction rate and strength control in the chemical mechanical planarization of the liquid supply arm is solved, and the stability and accuracy are improved, and the preheating time is shortened.
Patent Information
- Application Number
- CN202510766181.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2025-07-25
AI Technical Summary
It is difficult for the existing liquid supply arms to effectively control the rate and strength of the grinding reaction during the chemical mechanical planarization process, resulting in out-of-control reaction and prolonged process time.
The temperature regulating member composed of a condenser tube and a heating wire is used to cool down and increase the grinding liquid, and the temperature of the grinding liquid is monitored and controlled through a temperature sensor to ensure that the grinding reaction is carried out within a stable range.
Improves the stability and accuracy of the grinding rate, shortens the preheating time, and avoids out-of-control reactions and prolonged process time.
Smart Images
Figure CN120363100A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor manufacturing, and particularly to a liquid supply arm and a grinding device. Background Art
[0002] Chemical mechanical planarization is a technology that uses chemical corrosion and mechanical force to smooth the silicon wafer or other substrates during the processing, and is one of the most important links in the semiconductor manufacturing process.
[0003] During the chemical mechanical planarization process, the removal of the wafer material is achieved by relying on the relative movement between the polishing pad and the wafer and the chemical erosion of the grinding fluid. The liquid supply arm provides the grinding fluid for chemical mechanical planarization, supplies the grinding fluid to the upper surface of the polishing pad, and can adjust the supply position of the grinding fluid by adjusting its swing angle, so that the grinding fluid can be evenly distributed between the wafer and the polishing pad, thereby realizing chemical mechanical polishing of the wafer and improving the uniformity and accuracy of polishing. The grinding fluid can form a lubricating film between the grinding tool and the material to be ground, reduce the friction between the two, help reduce the grinding force, improve the grinding efficiency, and at the same time reduce the wear of the grinding tool and extend its service life.
[0004] However, there are still many problems with the current liquid supply arm. Summary of the Invention
[0005] The problem solved by the present invention is how to improve the liquid supply arm, so as to control the rate and intensity of the grinding reaction and inhibit the out-of-control of the grinding reaction.
[0006] To solve the above problems, the technical solution of the present invention provides a liquid supply arm, which is adapted to convey a grinding fluid to a grinding pad, and the grinding pad is adapted to grind a wafer. The liquid supply arm includes: a delivery pipe adapted to convey the grinding fluid to the grinding pad; a temperature regulating member including a condensing pipe wound around the delivery pipe, and the condensing pipe is adapted to cool the grinding fluid.
[0007] Optionally, the delivery pipe has a liquid outlet for discharging the grinding fluid; the liquid supply arm further includes: a temperature sensor disposed at the position of the liquid outlet to monitor the temperature of the grinding fluid conveyed to the grinding pad.
[0008] Optionally, the temperature regulating member further includes: a heating wire adapted to heat up the grinding fluid.
[0009] Optionally, the heating wire and the condensing pipe are wound in a double helix.
[0010] Optionally, the heating wire is wound around one end of the delivery pipe, and the condensing pipe is wound around the other end of the delivery pipe.
[0011] Optionally, it further includes an external heating circuit, and the external heating circuit is adapted to be connected to the heating wire.
[0012] Optionally, it further includes an external cooling circulation component, and the external cooling circulation component is adapted to be connected to the condenser tube.
[0013] Optionally, it further includes a switch component, and the switch component is adapted to control the connection and interruption of the temperature regulating component.
[0014] Optionally, the number of the delivery pipes is at least one; and the temperature regulating component corresponds to the delivery pipes one by one.
[0015] Correspondingly, the technical solution of the present invention further provides a grinding device, including a grinding pad adapted to grind a wafer; a liquid supply arm as described in any one of the above, the liquid supply arm being adapted to deliver grinding liquid to the grinding pad; and a control module adapted to control the temperature regulating component to adjust the temperature of the grinding liquid.
[0016] Optionally, the control module is adapted to control the temperature regulating component to adjust the temperature of the grinding liquid according to the duration of the grinding reaction.
[0017] Optionally, it further includes a monitoring module adapted to monitor the temperature of the grinding pad, and the control module is adapted to control the temperature regulating component to adjust the temperature of the grinding liquid according to the temperature of the grinding pad.
[0018] Optionally, it further includes a detection module adapted to detect the amount of the wafer to be ground, and the control module is adapted to control the temperature regulating component to adjust the temperature of the grinding liquid according to the amount to be ground.
[0019] Compared with the prior art, the technical solution of the present invention has the following advantages:
[0020] In the liquid supply arm of the technical solution of the present invention, the condenser tube is wound around the delivery pipe, and the condenser tube is adapted to cool down the grinding liquid. The condenser tube is adapted to cool down the grinding liquid to control the rate of the grinding reaction, avoid the situation that the temperature of the grinding pad is too high due to the increase of the grinding reaction duration, resulting in the out-of-control of the grinding reaction, improve the stability of the grinding rate, and is beneficial to controlling the precision of grinding.
[0021] In the optional solution of the present invention, the temperature regulating component further includes a heating wire, and the heating wire is adapted to heat up the grinding liquid. The grinding reaction requires a certain start-up warm-up time to reach stability. The heating wire heats up the grinding liquid to increase the rate of the grinding reaction, avoid the extension of the process time caused by the way of reaching stability through frictional heating, improve the reaction intensity in the early stage of the grinding reaction, and shorten the preheating duration. Brief Description of the Drawings
[0022] Figure 1 It is a schematic cross-sectional structure diagram of a liquid supply arm;
[0023] Figure 2 It is a schematic cross-sectional structure diagram of the liquid supply arm according to some embodiments of the present invention;
[0024] Figure 3 It is a schematic cross-sectional structure diagram of the liquid supply arm according to other embodiments of the present invention;
[0025] Figure 4 It is a schematic diagram showing the change of the grinding reaction intensity with the grinding reaction duration after the temperature of the grinding liquid is regulated by the liquid supply arm according to the embodiment of the present invention. Detailed Description of the Embodiments
[0026] As can be seen from the background art, there are still problems with the current liquid supply arm. Now analyze the reasons for the problems:
[0027] Please refer to Figure 1 , a liquid supply arm, the liquid supply arm is adapted to deliver a grinding liquid to a polishing pad 100, the polishing pad 100 is adapted to polish a wafer, and the liquid supply arm includes:
[0028] A delivery pipe 101, the delivery pipe 101 is adapted to deliver a grinding liquid to the polishing pad 100.
[0029] Specifically, the grinding liquid is a grinding liquid for chemical mechanical polishing reaction. As the grinding time increases, the chemical reaction becomes stronger and stronger, the temperature of the polishing pad 100 is too high, and the speed of the chemical mechanical polishing reaction is too fast, which is likely to cause the reaction to get out of control.
[0030] Moreover, since the chemical mechanical polishing reaction requires a certain start-up warm-up time to reach stability, about 20% of the time for each wafer polishing process is required for the preparation step, and the mechanical movement is used to increase the temperature so that the grinding chemical reaction reaches stability, which prolongs the process production time.
[0031] To solve the above technical problems, the present invention provides a liquid supply arm, the liquid supply arm is adapted to deliver a grinding liquid to a polishing pad, the polishing pad is adapted to polish a wafer, and is characterized in that the liquid supply arm includes: a delivery pipe, the delivery pipe is adapted to deliver a grinding liquid to the polishing pad; a temperature regulating member, the temperature regulating member includes a condensing pipe, the condensing pipe is wound around the delivery pipe, and the condensing pipe is adapted to cool the grinding liquid.
[0032] In the liquid supply arm of the technical solution of the present invention, the condensation tube is wound around the delivery tube, and the condensation tube is adapted to cool the abrasive slurry. The condensation tube is adapted to cool the abrasive slurry to control the rate of the grinding reaction, avoid the situation that the temperature of the grinding pad is too high due to the increase of the grinding reaction time, resulting in the out-of-control of the grinding reaction, improve the stability of the grinding rate, and is beneficial to controlling the accuracy of grinding.
[0033] To make the above objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be given with reference to the accompanying drawings.
[0034] An embodiment of the present invention provides a liquid supply arm, which is adapted to supply an abrasive slurry to a grinding pad 200, and the grinding pad 200 is adapted to grind a wafer. The function of the liquid supply arm is as follows: the abrasive slurry flows onto the grinding pad 200 through the liquid outlet of the front end of the liquid supply arm; high-pressure ultrapure water is sprayed out through the nozzle of the liquid supply arm to clean the by-products accumulated in the grinding reaction.
[0035] Please refer to Figure 2 , the liquid supply arm includes: a delivery tube 201, and the delivery tube 201 is adapted to supply an abrasive slurry to the grinding pad 200.
[0036] Specifically, the delivery tube 201 has a liquid outlet A for discharging the abrasive slurry.
[0037] An abrasive slurry is a liquid used in the grinding process, mainly composed of components such as abrasives, dispersants, surfactants, pH regulators, and corrosion inhibitors. Abrasives are the main components of the abrasive slurry, which are used to cut and grind the surface of the workpiece to remove materials and improve the surface finish. Common abrasives include alumina (Al2O3), silicon carbide (SiC), diamond, cerium oxide (CeO2), and silicon dioxide (SiO2), etc.
[0038] Exemplarily, in some embodiments of the present invention, the abrasive includes silicon dioxide. Silicon dioxide is a common abrasive, and the Mohs hardness of silicon dioxide is usually between 6 and 7, which can effectively grind various materials. By friction and scratching with the surface of the material to be ground, the micro-protrusions on the surface of the workpiece are removed, realizing the flattening and improvement of the surface finish of the workpiece. Silicon dioxide is often used in the chemical mechanical polishing process and can be used for planarizing the surface of the wafer to ensure the high precision and high performance of chip manufacturing.
[0039] During the chemical mechanical polishing process, when silicon dioxide (SiO2) in the silicon dioxide polishing slurry comes into contact with water, a hydration reaction occurs, i.e., SiO2 + H2O → Si(OH)4. This forms active hydroxyl (-OH) groups on the surface of the silicon dioxide. These hydroxyl groups can interact with atoms or groups on the surface of the material to be polished (such as a wafer), promoting chemical reactions during the polishing process and thus improving the polishing efficiency.
[0040] The material of the delivery pipe 201 includes stainless steel, perfluoroethylene copolymer (PFA), and polyvinyl chloride (PVC). Specifically, in some embodiments of the present invention, the delivery pipe 201 is a metal pipe with a corrosion-resistant coating. As a metal pipe with a corrosion-resistant coating, on the one hand, the delivery pipe 201 can transport the polishing slurry with certain corrosiveness, and on the other hand, the delivery pipe 201 has good heat conduction performance.
[0041] The number of the delivery pipes 201 is at least one. Specifically, in some embodiments of the present invention, the number of the delivery pipes 201 is one, which reduces the occupied area of the delivery pipe 201. Moreover, when the number of the delivery pipes 201 is one, the liquid supply of the liquid supply arm is relatively simple, with fewer program setting parameters, and the liquid discharge of the polishing slurry is easier to adjust.
[0042] In other embodiments, the number of the delivery pipes can also be other values. For example, the number of the delivery pipes can be two, three, or four.
[0043] Please continue to refer to Figure 2 , the liquid supply arm further includes: a temperature sensor 202, which is arranged at the position of the liquid outlet A to monitor the temperature of the polishing slurry delivered to the polishing pad 200.
[0044] The temperature sensor 202 is arranged at the position of the liquid outlet A, so that the temperature sensor 202 can accurately measure the temperature of the polishing slurry actually participating in the polishing reaction. The polishing slurry may undergo heat exchange with the external environment during transportation. Measuring the temperature of the polishing slurry at the position of the liquid outlet A can exclude the influence of the temperature change of the polishing slurry during transportation, ensuring that the measured temperature of the polishing slurry is the temperature of the polishing slurry actually contacted by the polishing pad 200, thereby providing a basis for precisely controlling the polishing reaction.
[0045] Specifically, in some embodiments of the present invention, the temperature sensor 202 is arranged at the position of the liquid outlet A, that is, the temperature sensor 202 is arranged within 1 cm around the liquid outlet A.
[0046] The number of the temperature sensors 202 is adapted to the number of the delivery pipes 201. Specifically, in some embodiments of the present invention, the number of the delivery pipes 201 is 1, and correspondingly, the number of the temperature sensors 202 is also 1.
[0047] In other embodiments, the number of the temperature sensors may also be other values. For example, when the number of the delivery pipes is 2, 3, or 4, correspondingly, the number of the temperature sensors is 2, 3, or 4.
[0048] Please continue to refer to Figure 2 , the liquid supply arm includes: a temperature adjusting member 203, the temperature adjusting member 203 includes a condensing pipe 204, the condensing pipe 204 is wound around the delivery pipe 201, and the condensing pipe 204 is adapted to cool the abrasive slurry.
[0049] The temperature adjusting member 203 is adapted to adjust the temperature of the abrasive slurry in the delivery pipe 201. Specifically, the condensing pipe 204 is adapted to reduce the temperature of the abrasive slurry in the delivery pipe 201.
[0050] The condensing pipe 204 is wound around the delivery pipe 201, and the condensing pipe 204 is adapted to cool the abrasive slurry to control the rate of the grinding reaction, avoid the situation that the temperature of the grinding pad 200 is too high due to the increase of the grinding reaction time, resulting in the out-of-control of the grinding reaction, improve the stability of the grinding rate, and is beneficial to controlling the accuracy of grinding.
[0051] Please refer to Figure 4 , Figure 4 in which the abscissa is the grinding time, and the unit is second (s); Figure 4 the left ordinate in it is the reaction intensity, and the unit is angstrom per minute (Å / min); Figure 4 the right ordinate in it is the temperature, and the unit is degree Celsius (℃). Figure 4 The red solid line in it represents the relationship between the grinding reaction intensity and the grinding reaction time when the abrasive slurry is not temperature-adjusted; Figure 4 The red dotted line in it represents the relationship between the temperature of the abrasive slurry and the grinding reaction time when the abrasive slurry is not temperature-adjusted; Figure 4 The green solid line in it represents the relationship between the grinding reaction intensity and the grinding reaction time after the abrasive slurry is temperature-adjusted; Figure 4 The green dotted line in it represents the relationship between the temperature of the abrasive slurry and the grinding reaction time after the abrasive slurry is temperature-adjusted.
[0052] Specifically, the temperature of the abrasive slurry is obtained by a grinding pad temperature sensor (not shown) provided on the grinding pad 200.
[0053] For example, please refer to Figure 2 andFigure 4 As can be seen from the red dashed line in the figure, when the condenser tube 204 is not started to cool the abrasive slurry in the delivery tube 201, during the later stage of the grinding reaction from 70 s to 100 s, the temperature of the abrasive slurry on the grinding pad 200 is relatively high, about 65°C to 85°C. At this time, as can be seen from the red solid line in the figure, during the later stage of the grinding reaction from 70 s to 100 s, the reaction intensity of the grinding reaction is correspondingly high, about 7 Å / min to 10 Å / min.
[0054] If the intensity of the grinding reaction is too high, it is easy to cause the grinding reaction to get out of control. If the condenser tube 204 is started to cool the abrasive slurry in the delivery tube 201, when the abrasive slurry in the delivery tube 201 is delivered to the grinding pad 200, the temperature of the abrasive slurry on the grinding pad 200 can be reduced, thereby reducing the intensity of the grinding reaction.
[0055] As can be seen from the green dashed line in the figure, after the condenser tube 204 is started, during the later stage of the grinding reaction from 70 s to 100 s, the temperature of the abrasive slurry on the grinding pad 200 is reduced, approximately reduced to 20°C. At this time, as can be seen from the green solid line in the figure, during the later stage of the grinding reaction from 70 s to 100 s, the reaction intensity of the grinding reaction is correspondingly reduced, about 6 Å / min to 7 Å / min. Starting the condenser tube 204 to cool the abrasive slurry in the delivery tube 201 reduces the rate of the grinding reaction and avoids the grinding reaction getting out of control.
[0056] Please continue to refer to Figure 2 The temperature regulating member 203 further includes: a heating wire 205, and the heating wire 205 is adapted to heat up the abrasive slurry.
[0057] The temperature regulating member 203 is adapted to adjust the temperature of the abrasive slurry in the delivery tube 201. Specifically, the heating wire 205 is adapted to heat up the abrasive slurry in the delivery tube 201.
[0058] The grinding reaction requires a certain start-up warm-up time to reach stability. The heating wire 205 heats up the abrasive slurry to increase the rate of the grinding reaction, avoiding the extension of the process time caused by the way of reaching stability through frictional heating, increasing the grinding reaction intensity, and shortening the preheating duration.
[0059] Specifically, in some embodiments of the present invention, as Figure 2 shown, the heating wire 205 and the condenser tube 204 are wound in a double helix.
[0060] An insulating medium (not shown) is provided between the heating wire 205 and the condenser tube 204 to avoid the influence of the heating wire 205 and the condenser tube 204 on each other's temperature regulating effects.
[0061] The heating wire 205 and the condensing pipe 204 are wound in a double helix, which can form a more uniform temperature field around the conveying pipe 201 for the heating wire 205 or the condensing pipe 204, so that the grinding liquid can be uniformly heated or cooled in the conveying pipe 201; moreover, the double helix winding method can more accurately control the temperature of the grinding liquid. Whether it is the heating or cooling process, the grinding liquid can be stably maintained within the set temperature range, reducing temperature fluctuations.
[0062] For example, please refer to Figure 2 and Figure 4 , as can be seen from the red dashed line in the figure, when the heating wire 205 is not activated to heat the grinding liquid in the conveying pipe 201, in the early stage of the grinding reaction from 0s to 10s, the temperature of the grinding liquid on the grinding pad 200 is relatively low, about 20°C to 25°C. At this time, as can be seen from the red solid line in the figure, in the early stage of the grinding reaction from 0s to 10s, the reaction intensity of the grinding reaction is correspondingly low, about 2 Å / min to 3 Å / min.
[0063] Too low reaction intensity of the grinding reaction is likely to cause too low reaction efficiency. If the heating wire 205 is activated to heat the grinding liquid in the conveying pipe 201, when the grinding liquid in the conveying pipe 201 is transported to the grinding pad 200, the temperature of the grinding liquid on the grinding pad 200 can be increased, thereby increasing the reaction intensity of the grinding reaction.
[0064] As can be seen from the green dashed line in the figure, after the heating wire 205 is activated, in the early stage of the grinding reaction from 0s to 10s, the temperature of the grinding liquid on the grinding pad 200 is increased, about to 30°C to 50°C. At this time, as can be seen from the green solid line in the figure, in the early stage of the grinding reaction from 0s to 10s, the reaction intensity of the grinding reaction is correspondingly increased, about 2 Å / min to 6 Å / min. Turning on the heating wire 205 to heat the grinding liquid in the conveying pipe 201 increases the rate of the grinding reaction, enhances the early reaction efficiency, and improves the overall production speed.
[0065] Specifically, please continue to refer to Figure 2 , in some embodiments of the present invention, the distance d between the side of the temperature adjusting member 203 close to the temperature sensor 202 and the temperature sensor 202 is in the range of 5 cm to 10 cm.
[0066] The temperature regulating member 203 is at an appropriate distance from the temperature sensor 202, avoiding the situation that the distance between the temperature regulating member 203 and the temperature sensor 202 is too close, which may cause the temperature monitored by the temperature sensor 202 to be inaccurate due to the influence of the temperature regulating member 203, and also avoiding the situation that the distance between the temperature regulating member 203 and the temperature sensor 202 is too far, which may cause a large difference between the temperature of the grinding fluid after being temperature-regulated by the temperature regulating member 203 and the temperature of the grinding fluid discharged from the liquid outlet A. This enables the temperature sensor 202 to accurately monitor the temperature of the grinding fluid after being temperature-regulated by the temperature regulating member 203, and also enables the difference between the temperature of the grinding fluid after being temperature-regulated by the temperature regulating member 203 and the temperature of the grinding fluid delivered to the grinding pad 200 to be as small as possible.
[0067] Specifically, in some embodiments of the present invention, the temperature regulating member 203 corresponds one-to-one with the delivery pipe 201. For example, as Figure 2 shown, one delivery pipe 201 corresponds to one set of temperature regulating members 203, and the temperature regulating member 203 includes a heating wire 205 and a condensing pipe 204.
[0068] Please continue to refer to Figure 2 , the liquid supply arm further includes: an external cooling circulation member 206, and the external cooling circulation member 206 is adapted to be connected to the condensing pipe 204.
[0069] The external cooling circulation member 206 is adapted to provide a low-temperature cooling medium for the condensing pipe 204. These cooling media circulate in the condensing pipe 204 and can absorb the heat transferred from the grinding fluid to the condensing pipe 204, thereby cooling the grinding fluid, so as to ensure that the temperature of the grinding fluid is within a suitable range and prevent the grinding effect and product quality from being affected due to the too high temperature of the grinding fluid during the grinding reaction.
[0070] Specifically, the external cooling circulation member 206 is also connected to the temperature sensor 202. The external cooling circulation member 206 is adapted to obtain the temperature of the grinding fluid delivered to the grinding pad 200 according to the temperature sensor 202.
[0071] The liquid supply arm further includes: an external heating circuit 207, and the external heating circuit 207 is adapted to be connected to the heating wire 205.
[0072] The external heating circuit 207 is connected to a power source and can transmit the electrical energy of the power source to the heating wire 205. After obtaining electrical energy, the heating wire 205 will generate heat, and then heat the grinding fluid in the delivery pipe 201 to make it reach a suitable temperature to meet the requirements of the grinding process.
[0073] Specifically, the external heating circuit 207 is also connected to the temperature sensor 202. The external heating circuit 207 is adapted to obtain the temperature of the polishing liquid delivered to the polishing pad 200 according to the temperature sensor 202.
[0074] The liquid supply arm further includes: a switch assembly (not shown), and the switch assembly is adapted to control the connection and interruption of the temperature regulating member 203.
[0075] Specifically, the switch assembly includes a first switch and a second switch. Among them, the first switch is adapted to control the connection and interruption of the condenser tube 204 and the external cooling circulation member 206; the second switch is adapted to control the connection and interruption of the heating wire 205 and the external heating circuit 207.
[0076] The first switch and the second switch respectively control the on-off of the condenser tube 204 and the heating wire 205, which is convenient for cooling or heating the polishing liquid.
[0077] Please refer to Figure 3 , Figure 3 for the liquid supply arm of some other embodiments of the present invention. The same parts as the foregoing embodiments will not be described herein again. The difference from the foregoing embodiments is that the heating wire 305 is wound around one end of the delivery pipe 201, and the condenser tube 304 is wound around the other end of the delivery pipe 201.
[0078] Installing the heating wire 305 and the condenser tube 304 at opposite ends of the delivery pipe 201 respectively makes the installation process relatively simple and does not require complex spiral winding operations. During equipment maintenance, since the heating wire 305 and the condenser tube 304 are separated from each other, maintenance personnel can more easily access and operate, and conduct separate inspections, repairs or replacements on the heating wire 305 or the condenser tube 304, reducing the maintenance difficulty and cost.
[0079] Specifically, as Figure 3 shown, the heating wire 305 is wound around one end of the delivery pipe 201 close to the temperature sensor 302, and the condenser tube 304 is wound around the other end of the delivery pipe 201 away from the temperature sensor 302.
[0080] During the process of the polishing liquid being delivered through the relatively long delivery pipe 201, some heat will be dissipated. Setting the heating wire 305 near the liquid outlet A of the delivery pipe 201 can precisely heat the polishing liquid before it reaches the polishing pad 200, so that the polishing liquid just reaches the required temperature when it reaches the liquid outlet A. In this way, the heating power can be quickly adjusted according to actual needs, making a timely response to temperature changes, and avoiding heat loss and temperature fluctuations caused by premature heating.
[0081] Correspondingly, the present invention further provides a grinding device. Please continue to refer to Figure 2 , including: a grinding pad 200 adapted to grind a wafer; a liquid supply arm as described in any one of the above, the liquid supply arm being adapted to supply a grinding liquid to the grinding pad 200; a control module adapted to control the temperature adjusting member 203 to adjust the temperature of the grinding liquid.
[0082] Please refer to Figure 2 , the grinding device includes: a grinding pad 200 adapted to grind a wafer.
[0083] In a chemical mechanical polishing reaction, the grinding pad 200 is fixed on a grinding machine table and rotates relative to a workpiece such as a wafer under a certain pressure under the action of a grinding liquid. The abrasive on the grinding pad 200 contacts the surface of the workpiece, and through mechanical friction and the chemical action of the grinding liquid, the surface of the workpiece is flattened.
[0084] Please continue to refer to Figure 2 , the grinding device includes: a liquid supply arm as described in any one of the above, the liquid supply arm being adapted to supply a grinding liquid to the grinding pad 200.
[0085] By adjusting the temperature of the grinding liquid supplied by the liquid supply arm, the temperature of the grinding liquid on the grinding pad 200 is adjusted, thereby adjusting the intensity and rate of the grinding reaction, and avoiding out-of-control grinding reaction or too low grinding reaction efficiency.
[0086] The grinding device includes: a control module adapted to control the temperature adjusting member 203 to adjust the temperature of the grinding liquid.
[0087] Specifically, in some embodiments of the present invention, the control module is adapted to control the temperature adjusting member 203 to adjust the temperature of the grinding liquid according to the duration of the grinding reaction.
[0088] Adjusting the temperature of the grinding liquid according to the duration of the grinding reaction does not require complex monitoring equipment and algorithms to judge the grinding state. The operator only needs to operate according to the preset time nodes, reducing the operation difficulty; and, under the same grinding process and conditions, setting the temperature reduction according to a fixed grinding duration can ensure that the temperature reduction operation in each grinding reaction has high consistency, which helps to improve the quality stability and repeatability of the grinding product, enabling products of different batches to be ground under relatively similar temperature conditions, and reducing the product quality differences caused by inconsistent temperature control; in addition, there is no need to additionally install complex grinding end point monitoring equipment, reducing the equipment cost and maintenance cost.
[0089] Exemplarily, in some embodiments of the present invention, after the grinding reaction proceeds for 60 s, the temperature of the grinding liquid is lowered by 5 °C, and after the grinding reaction proceeds for 80 s, the temperature of the grinding liquid is lowered by 10 °C, so as to reduce the temperature of the grinding liquid on the grinding pad 200, thereby reducing the intensity of the grinding reaction, reducing the rate of the grinding reaction, and avoiding the out-of-control of the grinding reaction.
[0090] Specifically, in some embodiments of the present invention, the grinding device further includes: a monitoring module, the monitoring module is adapted to monitor the temperature of the grinding pad 200, and the control module is adapted to control the temperature adjusting member 203 to adjust the temperature of the grinding liquid according to the temperature of the grinding pad 200.
[0091] Adjusting the temperature of the grinding liquid according to the temperature of the grinding pad 200 can be adjusted in real time and accurately according to the actual requirements of the grinding reaction. When the temperature of the grinding pad 200 rises, it indicates that the grinding reaction rate is too fast and too much heat is generated on the surface of the grinding pad 200. At this time, lowering the temperature of the grinding liquid can effectively control the grinding reaction rate and reaction intensity, and prevent the situation of over-grinding caused by too high temperature; on the contrary, when the temperature of the grinding pad 200 is relatively low, appropriately raising the temperature of the grinding liquid can increase the grinding reaction rate and reaction intensity, and ensure the grinding efficiency; moreover, this control method helps to maintain the grinding reaction in a relatively stable temperature environment, making the grinding reaction more uniform, reducing the surface quality difference of the workpiece caused by the temperature fluctuation of the grinding pad 200, thereby improving the surface flatness and smoothness of the ground wafer, reducing the occurrence probability of surface defects, and improving the yield of the product; in addition, different grinding processes and grinding materials have different sensitivities to temperature. The temperature control method based on the temperature of the grinding pad 200 can flexibly adjust the temperature of the grinding liquid according to specific process requirements and material characteristics to adapt to various different grinding scenarios.
[0092] Exemplarily, in some embodiments of the present invention, when the monitoring module monitors that the temperature of the grinding pad 200 is 30 °C, the control module raises the temperature of the grinding liquid to increase the rate of the grinding reaction and saves the preheating time; when the monitoring module monitors that the temperature of the grinding pad 200 is 60 °C, the control module lowers the temperature of the grinding liquid to reduce the rate of the grinding reaction and suppress the out-of-control of the grinding reaction.
[0093] Specifically, in some embodiments of the present invention, the grinding device further includes: a detection module, the detection module is adapted to detect the amount of the wafer to be ground, and the control module is adapted to control the temperature adjusting member 203 to adjust the temperature of the grinding liquid according to the amount of the wafer to be ground.
[0094] Adjusting the temperature of the abrasive liquid according to the amount of material to be ground can accurately control the grinding efficiency. For a large amount of material to be ground, appropriately increasing the temperature of the abrasive liquid can accelerate the grinding reaction, improve the grinding efficiency, and remove more material in a shorter time. For a small amount of material to be ground, reducing the temperature of the abrasive liquid can slow down the grinding reaction, avoid over-grinding, and ensure the grinding accuracy. Moreover, this adjustment method can make the grinding process more match the actual grinding requirements of the wafer. When the grinding amount is large, increasing the temperature can accelerate the grinding while ensuring the grinding uniformity and avoiding surface quality problems caused by long-term low-speed grinding. When the grinding amount is small, low-temperature grinding can reduce the damage to the wafer surface, improve the surface flatness and smoothness, and help improve the overall quality of the wafer. In addition, adjusting the temperature of the abrasive liquid according to the amount of material to be ground enhances the process adaptability, enabling the grinding equipment to better adapt to the grinding requirements of various wafers, with stronger process flexibility and adaptability.
[0095] In summary, in the liquid supply arm of the technical solution of the present invention, the condenser tube 204 is wound around the delivery tube 201, and the condenser tube 204 is adapted to cool the abrasive liquid. The condenser tube 204 is adapted to cool the abrasive liquid to control the rate of the grinding reaction, avoid the situation that the temperature of the grinding pad 200 becomes too high with the increase of the grinding reaction time, resulting in the out-of-control of the grinding reaction, improve the stability of the grinding rate, and is beneficial to controlling the grinding accuracy. Moreover, the temperature adjusting member 203 further includes: a heating wire 205, and the heating wire 205 is adapted to heat up the abrasive liquid. The grinding reaction requires a certain start-up warm-up time to reach stability. The heating wire 205 heats up the abrasive liquid to increase the rate of the grinding reaction, avoid the extension of the process time caused by the way of reaching stability through frictional heating, increase the intensity of the grinding reaction, and shorten the preheating time.
[0096] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.
Claims
1. A liquid supply arm, the liquid supply arm being adapted to supply a polishing liquid to a polishing pad, the polishing pad being adapted to polish a wafer, characterized in that, The liquid supply arm includes: A delivery pipe, which is adapted to deliver abrasive liquid to the polishing pad; A temperature regulating member, which includes a condensing pipe wound around the delivery pipe and adapted to cool the abrasive liquid.
2. The liquid supply arm according to claim 1, characterized in that, The delivery pipe has a liquid outlet for discharging the abrasive liquid; The liquid supply arm further includes: a temperature sensor disposed at the position of the liquid outlet to monitor the temperature of the abrasive liquid delivered to the polishing pad.
3. The liquid supply arm according to claim 1, characterized in that, The temperature regulating member further includes: a heating wire adapted to heat up the abrasive liquid.
4. The liquid supply arm according to claim 3, characterized in that, The heating wire and the condensing pipe are wound in a double helix.
5. The liquid supply arm according to claim 3, characterized in that, The heating wire is wound around one end of the delivery pipe, and the condensing pipe is wound around the other end of the delivery pipe.
6. The liquid supply arm according to claim 1, characterized in that, It further includes: An external cooling circulation member adapted to be connected to the condensing pipe.
7. The liquid supply arm according to claim 3, wherein It further includes: An external heating circuit adapted to be connected to the heating wire.
8. The liquid supply arm according to claim 1, characterized in that It further includes: A switch assembly adapted to control the connection and interruption of the temperature regulating member.
9. The liquid supply arm according to claim 1, wherein, The number of the delivery pipes is at least one; the temperature regulating members correspond to the delivery pipes one by one.
10. A grinding device, characterized in that, It includes: A polishing pad adapted to polish the wafer; The liquid supply arm according to any one of claims 1 to 9, which is adapted to deliver abrasive liquid to the polishing pad; A control module adapted to control the temperature regulating member to adjust the temperature of the abrasive liquid.
11. The grinding device according to claim 10, characterized in that, The control module is adapted to control the temperature regulating member to adjust the temperature of the abrasive liquid according to the duration of the grinding reaction.
12. The grinding device according to claim 10, wherein It further includes: A monitoring module adapted to monitor the temperature of the polishing pad, and the control module is adapted to control the temperature regulating member to adjust the temperature of the abrasive liquid according to the temperature of the polishing pad.
13. The grinding device according to claim 10, characterized in that, It further includes: A detection module adapted to detect the amount of the wafer to be ground, and the control module is adapted to control the temperature regulating member to adjust the temperature of the abrasive liquid according to the amount to be ground.