MEMS semiconductor device and packaging method of MEMS semiconductor device
By designing the coupling and the plug-in hole in the MEMS semiconductor device, using preset external force and splitting knife welding technology, the problem of large size of traditional MEMS sensors is solved, achieving a more compact package and higher integration.
Patent Information
- Application Number
- CN202410107265.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-25
- Publication Date
- 2025-07-25
AI Technical Summary
The traditional MEMS sensor is large in size, resulting in a less compact package.
A MEMS semiconductor device is designed, including a substrate, chip, frame and pad. The plug-in is inserted deeper into the plug-in hole under preset external force to realize the electrical connection between the chip and the pad, and the device volume is reduced by using the split knife welding technology.
Effectively reduce the volume of MEMS semiconductor devices, improve their integration, and enhance packaging effect and connection reliability.
Smart Images
Figure CN120364641A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of sensors, and particularly to a MEMS semiconductor device and a packaging method for a MEMS semiconductor device. Background Art
[0002] MEMS sensors are new sensors manufactured using microelectronic and micromachining technologies. However, a certain safety distance needs to be set between the chip and the pads of MEMS sensors during the welding process, resulting in a relatively large volume of traditional MEMS sensors. Summary of the Invention
[0003] Based on this, in view of the problem of the relatively large volume of traditional MEMS sensors, it is necessary to provide a MEMS semiconductor device and a packaging method for a MEMS semiconductor device.
[0004] According to a first aspect of the present application, there is provided a MEMS semiconductor device, including:
[0005] A substrate;
[0006] A chip disposed on the substrate;
[0007] A fence disposed on one side of the substrate where the chip is disposed and surrounding the chip; and
[0008] Pads disposed on the fence;
[0009] Wherein, one of the substrate and the fence is provided with a plug hole, and the other of the substrate and the fence is provided with a plug-in member corresponding to the plug hole;
[0010] The MEMS semiconductor device has a welding state and a packaging state; when the MEMS semiconductor device is in the welding state, the plug-in member is partially inserted into the plug hole, and a preset distance is provided between the pads and the chip in the insertion direction of the plug-in member;
[0011] The plug-in member is configured to be inserted more deeply into the plug hole under a preset external force than in the welding state, so that the MEMS semiconductor device is in the packaging state.
[0012] In one embodiment, the plug hole includes a first hole section and a second hole section that are connected and communicate with each other. Along the direction parallel to the axis of the plug hole, the first hole section is located outside the second hole section;
[0013] When the MEMS semiconductor device is in the welding state, the plug-in member is inserted into the first hole section, and a preset distance is provided between the pads and the chip in the insertion direction of the plug-in member;
[0014] The plug-in part is configured to be able to extend from the first hole section into the second hole section under the preset external force so as to be completely plugged into the plug hole, and make the MEMS semiconductor device in the packaged state.
[0015] In one embodiment, the aperture of the first hole section is larger than that of the second hole section, and in the radial direction of the first hole section, the maximum dimension of the plug-in part is larger than the aperture of the second hole section and less than or equal to the aperture of the first hole section.
[0016] In one embodiment, the plug-in part includes a first cylinder section adapted to the first hole section and a second cylinder section corresponding to the second hole section;
[0017] The second cylinder section is configured to be able to deform under the preset external force and be plugged into the second hole section.
[0018] In one embodiment, at least one diameter-reducing groove is arranged on the second cylinder section in a radially concave manner along the second cylinder section.
[0019] In one embodiment, the at least one diameter-reducing groove includes a first diameter-reducing groove extending along the axial direction of the second cylinder section.
[0020] In one embodiment, the at least one diameter-reducing groove further includes a second diameter-reducing groove extending along the circumferential direction of the second cylinder section.
[0021] In one embodiment, the second diameter-reducing groove has a first groove edge and a second groove edge arranged at intervals along the axial direction of the second cylinder section;
[0022] Along the axial direction of the second cylinder section, one end of the first diameter-reducing groove close to the first cylinder section is located between the first groove edge and the second groove edge.
[0023] In one embodiment, the MEMS semiconductor device further includes a cover body, and the cover body is covered on the side of the fence away from the substrate to enclose a receiving space for receiving the chip and the pad with the fence and the substrate.
[0024] According to the second aspect of the present application, a packaging method for a MEMS semiconductor device is provided. The MEMS semiconductor device described in any of the above embodiments is packaged, and the packaging method includes:
[0025] Partially plug the plug-in part into the plug hole, and there is a preset distance between the pad and the chip in the plugging direction of the plug-in part, and electrically connect the chip and the corresponding pad by welding;
[0026] Apply a preset external force to the plug-in component, so that the plug-in component is inserted into the plug hole deeper than in the welding state.
[0027] In the technical solution of the present application, the MEMS semiconductor device can be first in the welding state. At this time, the plug-in component is partially inserted into the plug hole, and there is a preset distance between the solder pad and the chip in the insertion direction of the plug-in component, which is convenient for using a bonding wire bonder to perform wire bonding to electrically connect the chip to the corresponding solder pad. After completing the welding between the chip and the corresponding solder pad, then the plug-in component is inserted into the plug hole deeper than in the welding state under a preset external force, so that the MEMS semiconductor device is in the packaged state. In this way, by using this MEMS semiconductor device, while the chip can be electrically connected to the corresponding solder pad, the occupied size of the MEMS semiconductor device in the insertion direction of the plug-in component can also be smaller, which is beneficial to reducing the volume of the MEMS semiconductor device and improving the integration degree of the MEMS semiconductor device. Brief Description of the Drawings
[0028] Figure 1 Shows an exploded view of the MEMS semiconductor device in an embodiment of the present application (first perspective).
[0029] Figure 2 Shows a cross-sectional view of the substrate, chip and fence in an embodiment of the present application (when in the welding state).
[0030] Figure 3 Shows Figure 2 An enlarged view of part I in
[0031] Figure 4 Shows a cross-sectional view of the substrate, chip, fence and cover in an embodiment of the present application (when in the packaged state).
[0032] Figure 5 Shows Figure 4 An enlarged view of part II in
[0033] Figure 6 Shows an exploded view of the MEMS semiconductor device in an embodiment of the present application (second perspective).
[0034] Figure 7 Shows a structural view of the substrate, chip and fence in an embodiment of the present application (when in the welding state).
[0035] Figure 8 Shows a top view of the substrate, chip and fence in an embodiment of the present application.
[0036] Figure 9 Shows a flowchart of the packaging method of the MEMS semiconductor device in an embodiment of the present application.
[0037] Reference numerals:
[0038] 10. MEMS semiconductor device
[0039] 100. Substrate; 101. Insertion hole; 1011. First hole section; 1012. Second hole section
[0040] 200. Chip
[0041] 300. Fence; 310. Connector; 3101. First cylinder section; 3102. Second cylinder section; 311. First reduced-diameter groove; 312. Second reduced-diameter groove; 3121. First groove edge; 3122. Second groove edge; 313. Chamfered portion
[0042] 320. Embedding groove; 3201. Embedding sub-groove; 330. Fence portion; 331. Common edge portion
[0043] 400. Pad
[0044] 500. Cover body; 510. Frame body; 511. Embedding portion; 520. Cover plate; 600. Lead
[0045] A. Accommodating space Detailed implementation manners
[0046] In order to make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe in detail the specific implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0047] In the description of the present application, it should be understood that if there appear such terms as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.
[0048] In addition, if the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0049] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0050] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0051] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.
[0052] Based on this, this application designs a MEMS semiconductor device and a packaging method for the MEMS semiconductor device, aiming to solve the problem that the traditional MEMS sensor has a relatively large volume.
[0053] Figure 1 The structural schematic diagram of the MEMS semiconductor device 10 in an embodiment of this application is shown. Figure 2The cross-sectional schematic diagram of the substrate 100, the chip 200, and the fence 300 in an embodiment of the present application is shown. Figure 3 Shows Figure 2 The enlarged schematic diagram at position I of
[0054] Please refer to Figures 1 - 3 , the MEMS semiconductor device 10 provided by an embodiment of the present application includes a substrate 100, a chip 200, a fence 300, and a pad 400.
[0055] The chip 200 is disposed on the substrate 100, the fence 300 is disposed on one side of the substrate 100 where the chip 200 is disposed, and surrounds the chip 200. The pad 400 is disposed on the fence 300. It can be understood that the pad 400 disposed on the fence 300 also surrounds the corresponding chip 200.
[0056] Among them, one of the substrate 100 and the fence 300 is provided with a socket hole 101, and the other of the substrate 100 and the fence 300 is provided with a socket member 310 corresponding to the socket hole 101.
[0057] It can be that the substrate 100 is provided with the socket hole 101, and the fence 300 is provided with the socket member 310 corresponding to the socket hole 101. Of course, it can also be that the fence 300 is provided with a socket hole, and the substrate 100 is provided with a socket member corresponding to the socket hole.
[0058] In this embodiment, the substrate 100 is provided with the socket hole 101, and the fence 300 is provided with the socket member 310 corresponding to the socket hole 101.
[0059] The MEMS semiconductor device 10 has a welding state and a packaging state. When the MEMS semiconductor device 10 is in the welding state, the socket member 310 is partially inserted into the socket hole 101, and there is a preset distance between the pad 400 and the chip 200 in the insertion direction of the socket member 310. The socket member 310 is configured to be inserted more deeply into the socket hole 101 under a preset external force than in the welding state, so that the MEMS semiconductor device 10 is in the packaging state.
[0060] The preset distance means that there is a distance that can safely perform wedge bonding between the pad 400 and the chip 200 in the insertion direction of the socket member 310.
[0061] When the MEMS semiconductor device 10 is in a packaged state, the connector 310 is inserted into the insertion hole 101 deeper than in the soldered state. It can be that the connector 310 is completely inserted into the insertion hole 101, or it can be that most of the connector 310 is inserted into the insertion hole 101 (for example, 99% of the connector 310 is inserted into the insertion hole 101), as long as the insertion depth of the connector 310 at this time is deeper than the insertion depth of the connector 310 when the MEMS semiconductor device 10 is in the soldered state.
[0062] In this way, when the MEMS semiconductor device 10 is in use, the MEMS semiconductor device 10 can be in a soldered state. At this time, the connector 310 is partially inserted into the insertion hole 101, and there is a preset distance between the pad 400 and the chip 200 in the insertion direction of the connector 310, which is convenient for using a bonding wire bonder to perform wire bonding. After the chip 200 is electrically connected to the corresponding pad 400 through the corresponding lead 600 by the method of soldering with the bonding wire bonder, then the connector 310 is inserted into the insertion hole 101 deeper than in the soldered state under a preset external force, and the MEMS semiconductor device 10 can be in a packaged state. In this way, by using this MEMS semiconductor device 10, while the chip 200 is electrically connected to the corresponding pad 400, the occupied dimension of the MEMS semiconductor device 10 in the insertion direction of the connector 310 can also be made smaller, which is beneficial to reducing the volume of the MEMS semiconductor device 10 and improving the integration degree of the MEMS semiconductor device 10.
[0063] Optionally, when the MEMS semiconductor device 10 is in a packaged state, the bottom surface of the fence 300 is hermetically connected to the top surface of the substrate 100. Specifically, when the MEMS semiconductor device 10 is in a packaged state, the bottom surface of the fence 300 is adhesively connected to the top surface of the substrate 100 through an insulating adhesive.
[0064] Since the bottom surface of the fence 300 is hermetically connected to the top surface of the substrate 100, the packaging effect of the MEMS semiconductor device 10 can be improved.
[0065] In some embodiments, both the insertion hole 101 and the connector 310 extend along a direction perpendicular to the substrate 100.
[0066] The convenient plug-in member 310 is at least partially inserted into the corresponding plug-in hole 101, and it is also convenient to apply a corresponding external force to the enclosure 300 in a direction perpendicular to the substrate 100. After welding between the chip 200 and the corresponding pad 400, the plug-in member 310 is completely inserted into the plug-in hole 101 under a preset external force, so that the MEMS semiconductor device 10 is in a packaged state. It can also reduce the occupied size of the MEMS semiconductor device 10 in the direction perpendicular to the substrate 100, which is beneficial to reducing the volume of the MEMS semiconductor device 10 and improving the integration degree of the MEMS semiconductor device 10.
[0067] Optionally, one of the substrate 100 and the enclosure 300 is provided with a plurality of plug-in holes 101, and the other of the substrate 100 and the enclosure 300 is provided with a plurality of plug-in members 310 corresponding to the plug-in holes 101 one by one.
[0068] In this way, the connection reliability between the substrate 100 and the enclosure 300 can be improved by using the plurality of plug-in holes 101 and the plurality of plug-in members 310, so that the MEMS semiconductor device 10 is more stably in a welded state or a packaged state, and it is also convenient for the wire bonding operation.
[0069] In some embodiments, the plug-in hole 101 includes a first hole section 1011 and a second hole section 1012 that are connected and communicate with each other. Along the direction parallel to the axis of the plug-in hole 101, the first hole section 1011 is located outside the second hole section 1012. As Figure 2 and Figure 3 shown, when the MEMS semiconductor device 10 is in a welded state, the plug-in member 310 is inserted into the first hole section 1011, and there is a preset distance between the pad 400 and the chip 200 in the insertion direction of the plug-in member 310. At this time, the plug-in member 310 is partially inserted into the corresponding plug-in hole 101, which is convenient for the wire bonding operation to electrically connect the chip 200 and the corresponding pad 400.
[0070] It may be that the first hole section 1011 and the second hole section 1012 are connected to form a stepped hole, or it may be that a gradually transitional hole section is formed between the first hole section 1011 and the second hole section 1012, and no specific limitation is made here.
[0071] The plug-in member 310 is configured to be able to extend from the first hole section 1011 into the second hole section 1012 under a preset external force to be completely inserted into the plug-in hole 101, so that the MEMS semiconductor device 10 is in a packaged state (which can be understood in combination with Figure 4 and Figure 5 )
[0072] After completing the welding between the chip 200 and the corresponding pad 400, the connector 310 can be inserted from the first hole section 1011 into the second hole section 1012, so that the connector 310 is completely inserted into the insertion hole 101, and the MEMS semiconductor device 10 is in a packaged state. At this time, the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310 is small, which is beneficial to reducing the volume of the MEMS semiconductor device 10 and improving the integration degree of the MEMS semiconductor device 10.
[0073] In some embodiments, the aperture of the first hole section 1011 is larger than that of the second hole section 1012, and in the radial direction of the first hole section 1011, the maximum size of the connector 310 is larger than the aperture of the second hole section 1012 and less than or equal to the aperture of the first hole section 1011.
[0074] In this way, the connector 310 can be well limited and fixed in the first hole section 1011, which is convenient for the MEMS semiconductor device 10 to be stably in a welded state, so as to perform a wire bonding operation on the chip 200 and the corresponding pad 400. In addition, the connector 310 needs to be inserted from the first hole section 1011 into the second hole section 1012 under a preset external force to be completely inserted into the insertion hole 101. In this way, after completing the welding between the chip 200 and the corresponding pad 400, the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310 can be reduced, and further the volume of the MEMS semiconductor device 10 can be reduced.
[0075] In some embodiments, the connector 310 includes a first cylinder section 3101 adapted to the first hole section 1011 and a second cylinder section 3102 corresponding to the second hole section 1012. The second cylinder section 3102 is configured to be deformed under a preset external force and inserted into the second hole section 1012.
[0076] Before the preset external force is applied, the second cylinder section 3102 is not deformed and can limit its insertion into the second hole section 1012, so that the connector 310 can be well limited and fixed in the first hole section 1011, which is beneficial to performing a wire bonding operation on the chip 200 and the corresponding pad 400. After completing the welding between the chip 200 and the corresponding pad 400, the second cylinder section 3102 can be deformed under a preset external force and inserted into the second hole section 1012, so that the connector 310 is completely inserted into the insertion hole 101, and further the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310 can be reduced, and the volume of the MEMS semiconductor device 10 can also be well reduced.
[0077] In some embodiments, the second cylinder section 3102 is configured as a hollow structure.
[0078] Since the second cylinder section 3102 is configured as a hollow structure, after the welding between the chip 200 and the corresponding pad 400 is completed, the second cylinder section 3102 can be deformed well under a preset external force and inserted into the second hole section 1012, thereby facilitating the reduction of the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310.
[0079] In some embodiments, at least one diameter-reducing groove is provided on the second cylinder section 3102 and is recessed along the radial direction of the second cylinder section 3102.
[0080] By using the diameter-reducing groove, after the welding between the chip 200 and the corresponding pad 400 is completed, the second cylinder section 3102 can be deformed well under a preset external force and inserted into the second hole section 1012, thereby facilitating the reduction of the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310.
[0081] In some embodiments, at least one diameter-reducing groove may include a first diameter-reducing groove 311 extending along the axial direction of the second cylinder section 3102.
[0082] In this way, after the welding between the chip 200 and the corresponding pad 400 is completed, the second cylinder section 3102 can be deformed relatively easily under a preset external force and inserted into the second hole section 1012, thereby facilitating the reduction of the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310.
[0083] Optionally, at least one diameter-reducing groove may include a plurality of first diameter-reducing grooves 311 arranged at intervals along the circumferential direction of the second cylinder section 3102.
[0084] During the process of inserting the second cylinder section 3102 into the second hole section 1012 by applying a certain external force after the welding between the chip 200 and the corresponding pad 400, the portion of the second cylinder section 3102 provided with the first diameter-reducing groove 311 can contract inward well. Since the plurality of first diameter-reducing grooves 311 are arranged at intervals along the circumferential direction of the second cylinder section 3102, the outer wall of the second cylinder section 3102 provided with the plurality of first diameter-reducing grooves 311 can be reduced in diameter more uniformly, so that the second cylinder section 3102 can be deformed more smoothly under a preset external force and inserted into the second hole section 1012, thereby facilitating the reduction of the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310.
[0085] Of course, the present application is not limited thereto. In some other embodiments, at least one diameter-reducing groove may include a second diameter-reducing groove 312 extending along the circumferential direction of the second cylinder section 3102.
[0086] Among them, the circumferential direction of the second cylinder section 3102 is the direction around the axis of the second cylinder section 3102, that is, the circumferential direction of the second cylinder section 3102.
[0087] In this way, after the welding between the chip 200 and the corresponding pad 400 is completed, during the process of inserting the second cylinder section 3102 into the second hole section 1012 by a certain external force, since the second reduced-diameter groove 312 extends along the circumferential direction of the second cylinder section 3102, there is a part with a smaller radial dimension on the outer wall of the second cylinder section 3102 where multiple first reduced-diameter grooves 311 are provided. As a result, the second cylinder section 3102 can more easily be squeezed into the second hole section 1012 from the first hole end 1011, and the second cylinder section 3102 can more easily deform under the preset external force and be inserted into the second hole section 1012, thereby facilitating the reduction of the occupied dimension of the MEMS semiconductor device 10 in the insertion direction of the connector 310.
[0088] In still some embodiments, at least one reduced-diameter groove may include the above-mentioned first reduced-diameter groove 311 and second reduced-diameter groove 312.
[0089] In this way, after the welding between the chip 200 and the corresponding pad 400 is completed, the second cylinder section 3102 can more easily deform under the preset external force and be inserted into the second hole section 1012, thereby facilitating the reduction of the occupied dimension of the MEMS semiconductor device 10 in the insertion direction of the connector 310.
[0090] Optionally, one end of the first reduced-diameter groove 311 along the axis direction of the second cylinder section 3102 close to the first cylinder section 3101 is communicated with the second reduced-diameter groove 312.
[0091] Regarding that "one end of the first reduced-diameter groove 311 along the axis direction of the second cylinder section 3102 close to the first cylinder section 3101 is communicated with the second reduced-diameter groove 312", it may be that the communication position between the first reduced-diameter groove 311 and the second reduced-diameter groove 312 is at the following second groove edge 3122, or it may be that one end of the first reduced-diameter groove 311 along the axis direction of the second cylinder section 3102 close to the first cylinder section 3101 penetrates at least part of the groove wall of the second reduced-diameter groove 312 along the axis direction of the second cylinder section 3102 to be communicated with the second reduced-diameter groove 312.
[0092] In this way, after the welding between the chip 200 and the corresponding pad 400 is completed, the reduced-diameter effect at the communication position between the first reduced-diameter groove 311 and the second reduced-diameter groove 312 on the second cylinder section 3102 is better, so that the second cylinder section 3102 can more easily deform under the preset external force and be inserted into the second hole section 1012, thereby facilitating the reduction of the occupied dimension of the MEMS semiconductor device 10 in the insertion direction of the connector 310.
[0093] Further, the second diameter-reducing groove 312 has a first groove edge 3121 and a second groove edge 3122 that are spaced apart along the axis of the second cylindrical section 3102. Along the axis of the second cylindrical section 3102, one end of the first diameter-reducing groove 311 close to the first cylindrical section 3101 is located between the first groove edge 3121 and the second groove edge 3122.
[0094] Specifically, the top end of the first diameter-reducing groove 311 is located between the first groove edge 3121 and the second groove edge 3122.
[0095] With such a setting, the second cylindrical section 3102 can be deformed more easily under a preset external force and extend from the first hole section 1011 into the second hole section 1012 to be completely inserted into the insertion hole 101, improving the convenience of switching the MEMS semiconductor device 10 from the welding state to the packaging state.
[0096] In some embodiments, please refer to Figures 3 - 5 , a chamfered portion 313 is provided at one end of the second cylindrical section 3102 away from the first cylindrical section 3101. Along the radial direction of the second cylindrical section 3102, the size of the chamfered portion 313 is less than or equal to the aperture of the second hole section 1012.
[0097] It can be understood that, compared with other parts of the second cylindrical section 3102, the chamfered portion 313 provided at one end of the second cylindrical section 3102 away from the first cylindrical section 3101 preferentially extends into the second hole section 1012, enabling the second cylindrical section 3102 provided with the chamfered portion 313 to be more easily inserted into the second hole section 1012, and further improving the convenience of switching the MEMS semiconductor device 10 from the welding state to the packaging state.
[0098] In some embodiments, please refer to Figure 5 , a rounded corner is provided on the chamfered portion 313.
[0099] In this way, the chamfered portion 313 can be inserted into the second hole section 1012 more smoothly, and further improve the convenience of switching the MEMS semiconductor device 10 from the welding state to the packaging state.
[0100] In other embodiments, please refer to Figure 3 , along the direction from the first cylindrical section 3101 to the second cylindrical section 3102, the size of the chamfered portion 313 along the radial direction of the second cylindrical section 3102 gradually decreases.
[0101] In this way, the chamfered portion 313 can be inserted into the second hole section 1012 more smoothly, and further improve the convenience of switching the MEMS semiconductor device 10 from the welding state to the packaging state.
[0102] In some embodiments, please refer to Figure 5, along the direction from the first cylindrical section 3101 to the second cylindrical section 3102, the radial dimension of the second cylindrical section 3102 gradually decreases.
[0103] Optionally, the second hole section 1012 is adapted to the second cylindrical section 3102. Along the direction from the first hole section 1011 to the second hole section 1012, the radial dimension of the second hole section 1012 gradually decreases.
[0104] This can make the second cylindrical section 3102 better adapted to the second hole section 1012, thereby improving the connection strength between the second cylindrical section 3102 and the second hole section 1012, and also improving the stability of the MEMS semiconductor device 10 in the packaged state.
[0105] In some embodiments, the connection between the first hole section 1011 and the second hole section 1012 is in an arc transition connection.
[0106] This can make the second cylindrical section 3102 more smoothly extend from the first hole section 1011 into the second hole section 1012, thereby improving the convenience of the MEMS semiconductor device 10 switching from the welding state to the packaged state.
[0107] In some embodiments, the depth of the first hole section 1011 is L, the thickness of the chip 200 is N, the thickness of the fence 300 is D, and along the insertion direction of the plug-in part 310, the dimension of the plug-in part 310 is H, where (H + D) ≥ (N + L); the solder pad 400 is provided on the top of the fence 300.
[0108] Thus, when the MEMS semiconductor device 10 is in the welding state, the plug-in part 310 is inserted into the first hole section 1011. At this time, along the insertion direction of the plug-in part 310, the distance between the top of the chip 200 and the top of the fence 300 is greater than or equal to L, so that there can be a preset distance between the solder pad 400 provided on the top of the fence 300 and the chip 200 in the insertion direction of the plug-in part 310, which is convenient for performing the wedge bonding operation between the solder pad 400 and the chip 200.
[0109] Optionally, the thickness of the fence 300 is less than the thickness of the chip 200. When the MEMS semiconductor device 10 is in the packaged state, along the insertion direction of the plug-in part 310, the top of the chip 200 is higher than the top of the fence 300.
[0110] Thus, it is beneficial to further reduce the occupied dimension of the MEMS semiconductor device 10 in the insertion direction of the plug-in part 310, and further reduce the volume of the MEMS semiconductor device 10.
[0111] In some embodiments, please refer to Figure 1 and Figure 4, the MEMS semiconductor device 10 further includes a cover body 500, and the cover body 500 is disposed on the side of the fence 300 away from the substrate 100, so as to enclose a receiving space A for receiving the chip 200 and the pad 400 together with the fence 300 and the substrate 100.
[0112] Components such as the chip 200 and the pad 400 can be encapsulated by using the cover body 500, improving the safety and reliability of the MEMS semiconductor device 10.
[0113] In some embodiments, one of the cover body 500 and the fence 300 is provided with an embedding groove 320, and the other of the cover body 500 and the fence 300 is provided with an engaging portion 511 adapted to the embedding groove 320. The engaging portion 511 is fittingly embedded in the embedding groove 320, so that the cover body 500 is disposed on the side of the fence 300 away from the substrate 100.
[0114] It can be that the fence 300 is provided with an embedding groove 320, and the cover body 500 is provided with an engaging portion 511 adapted to the embedding groove 320; or it can be that the cover body 500 is provided with an embedding groove, and the fence 300 is provided with an engaging portion (not shown in the figure) adapted to the embedding groove 320.
[0115] Optionally, the fence 300 and the cover body 500 are hermetically connected. Specifically, the fence 300 and the cover body 500 are adhesively connected by an insulating adhesive to achieve hermetic connection between the fence 300 and the cover body 500. In this embodiment, the embedding groove 320 is filled with an insulating adhesive, and then the engaging portion 511 of the cover body 500 is fittingly embedded in the embedding groove 320, so that the cover body 500 is disposed on the side of the fence 300 away from the substrate 100.
[0116] The use of the embedding groove 320 and the engaging portion 511 adapted to the embedding groove 320 can improve the connection reliability between the fence 300 and the cover body 500, and can also facilitate alignment and encapsulation.
[0117] Optionally, please refer to Figure 1 , and in combination with referring to Figure 6 , the cover body 500 includes a frame body 510 and a cover plate 520. Along the insertion direction of the plug-in member 310, the cover plate 520 is disposed opposite to the fence 300, the frame body 510 is disposed on the side of the cover plate 520 facing the fence 300, and the engaging portion 511 described above is disposed on the side of the frame body 510 facing the fence 300.
[0118] Optionally, the frame body 510 and the cover plate 520 are integrally formed. In this way, the overall structural strength and manufacturing convenience of the cover body 500 can be improved.
[0119] In some embodiments, such as Figure 1 , Figure 7 and Figure 8As shown, the MEMS semiconductor device 10 includes a plurality of chips 200 disposed on a substrate 100. The enclosure 300 includes a plurality of fence portions 330 that respectively surround the chips 200. Two adjacent fence portions 330 are overlapped at their adjacent positions. The embedding grooves 320 include a plurality of embedding sub-grooves 3201 that are respectively recessed in the fence portions 330. Two adjacent embedding sub-grooves 3201 communicate with each other and are overlapped at their adjacent positions.
[0120] In this way, two adjacent fence portions 330 can share a common side, and two adjacent embedding sub-grooves 3201 can share a common groove side, which is beneficial to reducing the occupied size of the enclosure 300 in the direction parallel to the substrate 100, and further beneficial to reducing the size of the MEMS semiconductor device 10 in the direction parallel to the substrate 100, and can also further reduce the volume of the MEMS semiconductor device 10, which is beneficial to improving the integration degree of the MEMS semiconductor device 10.
[0121] In some embodiments, the overlapping portion of two adjacent fence portions 330 is defined as a common side portion 331. The MEMS semiconductor device 10 includes a plurality of sets of pad groups respectively disposed on the fence portions 330. Each pad group includes a plurality of pads 400 that surround the corresponding chip 200. Two adjacent sets of pad groups are symmetrically distributed with the portion of the corresponding embedding sub-groove 3201 located on the corresponding common side portion 331 as the object.
[0122] Optionally, the embedding sub-groove 3201 surrounds the corresponding pad group. In this way, it is equivalent to dividing the above-mentioned accommodation space A into a plurality of sub-accommodation spaces, and each sub-accommodation space is used to accommodate the corresponding pad group and the corresponding chip 200, which is beneficial to better separating two adjacent pad groups and reducing the interference between two adjacent pad groups.
[0123] When the MEMS semiconductor device 10 is in a welding state, the pads 400 of each pad group and the corresponding chip 200 can both have a preset distance in the insertion direction of the connector 310, which is convenient for performing wire bonding operations between the pads 400 of each pad group and the corresponding chip 200. At the same time, it is also beneficial to reducing the occupied size of all the pads 400 in the direction parallel to the substrate 100, and further beneficial to reducing the volume of the MEMS semiconductor device 10, and can also improve the integration degree of the MEMS semiconductor device 10.
[0124] Please refer to Figure 9 , an embodiment of the present application provides a packaging method for a MEMS semiconductor device 10, which packages the MEMS semiconductor device 10 in any of the above embodiments. The packaging method of the MEMS semiconductor device 10 includes:
[0125] S20. Partially insert the connector 310 into the insertion hole 101, and there is a preset distance between the pad 400 and the chip 200 in the insertion direction of the connector 310, and electrically connect the chip 200 and the corresponding pad 400 by welding.
[0126] At this time, the MEMS semiconductor device 10 is in a welded state, and there is a preset distance between the pad 400 and the chip 200 in the insertion direction of the connector 310, so that there is a certain safety distance between the pad 400 and the chip 200 in the insertion direction of the connector 310, which is convenient for electrically connecting the chip 200 and the corresponding pad 400 by welding. Specifically, the chip 200 and the corresponding pad 400 can be electrically connected through the corresponding lead 600 by using the wedge bonding method.
[0127] S40. Apply a preset external force to the connector 310 to make the connector 310 insert deeper into the insertion hole 101 than in the welded state, so that the MEMS semiconductor device 10 can be in a packaged state.
[0128] In this way, by using the packaging method of the MEMS semiconductor device 10, while the chip 200 can be electrically connected to the corresponding pad 400, the occupied size of the MEMS semiconductor device 10 in the insertion direction of the connector 310 can also be smaller, which is beneficial to reducing the volume of the MEMS semiconductor device 10 and improving the integration degree of the MEMS semiconductor device 10.
[0129] In some embodiments, the packaging method of the MEMS semiconductor device 10 of the present application specifically includes:
[0130] First, the chip 200 is mounted on the top surface of the substrate 100; then, the connector 310 on the frame 300 is partially plugged into the corresponding plug hole 101, specifically, the second column section 3102 of the connector 310 is plugged into the first hole section 1011 of the corresponding plug hole 101, at this time, the second column section 3102 of the connector 310 is not deformed, and there is a preset distance between the pad 400 on the frame 300 and the chip 200 in the plugging direction of the connector 310, and the pad 400 can be connected to the corresponding chip 200 through the corresponding lead 600 by chopping welding; the pad 400 and the corresponding chip 200 are completed. After welding, the pad 400 and the corresponding chip 200 no longer need a safety distance L, and the frame 300 can be pressed down along the thickness direction of the substrate 100. At this time, the second column segment 3102 of the connector 310 is deformed and plugged into the second hole segment 1012 of the plug hole 101, until the bottom surface of the frame 300 fits with the top surface of the substrate 100. The frame 300 can be set on the side of the substrate 100 where the chip 200 is set, and set around the chip 200; finally, the cover body 500 is covered on the side of the frame 300 away from the substrate 100 to form the above-mentioned accommodating space A, which can package all chips 200 and all pads 400.
[0131] In this way, by utilizing the packaging method of the MEMS semiconductor device 10, the chip 200 can be electrically connected to the corresponding pad 400, while the MEMS semiconductor device 10 can occupy a smaller size in the thickness direction of the substrate 100, which is beneficial to reducing the volume of the MEMS semiconductor device 10 and improving the integration of the MEMS semiconductor device 10.
[0132] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0133] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A MEMS semiconductor device, characterized in that, include: substrate; A chip, disposed on the substrate; A frame, arranged on a side of the substrate where the chip is arranged, and arranged around the chip; as well as A welding pad, arranged on the enclosure; Wherein, one of the base plate and the surrounding frame is provided with a plug-in hole, and the other of the base plate and the surrounding frame is provided with a plug-in piece corresponding to the plug-in hole; The MEMS semiconductor device has a welding state and a packaging state; when the MEMS semiconductor device is in the welding state, the plug-in component is partially plugged into the plug-in hole, and there is a preset distance between the pad and the chip in the plug-in direction of the plug-in component; The plug-in component is constructed to be able to be inserted into the plug-in hole more deeply than in the welding state under a preset external force, so that the MEMS semiconductor device is in the packaging state.
2. The MEMS semiconductor device according to claim 1, wherein The plug hole comprises a first hole segment and a second hole segment which are connected to each other, and the first hole segment is located outside the second hole segment along an axis direction parallel to the plug hole; When the MEMS semiconductor device is in the welding state, the connector is plugged into the first hole section, and a preset distance exists between the pad and the chip in the plugging direction of the connector; The plug-in component is configured to extend from the first hole segment into the second hole segment under the preset external force so as to be fully plugged into the plug-in hole, thereby placing the MEMS semiconductor device in the packaging state.
3. The MEMS semiconductor device according to claim 2, wherein The aperture of the first hole segment is larger than that of the second hole segment, and along the radial direction of the first hole segment, the maximum size of the connector is larger than the aperture of the second hole segment and smaller than or equal to the aperture of the first hole segment.
4. The MEMS semiconductor device according to claim 2, characterized in that, The plug-in connector includes a first column segment adapted to the first hole segment, and a second column segment corresponding to the second hole segment; The second column segment is configured to be deformable under the preset external force and inserted into the second hole segment.
5. The MEMS semiconductor device according to claim 4, characterized in that, The second column segment is provided with at least one diameter-reducing groove which is recessed along the radial direction of the second column segment.
6. The MEMS semiconductor device according to claim 5, wherein The at least one reduced diameter groove comprises a first reduced diameter groove extending along the axial direction of the second column segment.
7. The MEMS semiconductor device according to claim 6, wherein The at least one reduced diameter groove further includes a second reduced diameter groove extending along the circumferential direction of the second column segment.
8. The MEMS semiconductor device according to claim 7, wherein The second reduced diameter groove has a first groove edge and a second groove edge which are arranged at intervals along the axial direction of the second column segment; Along the axial direction of the second column segment, one end of the first reduced diameter groove close to the first column segment is located between the first groove edge and the second groove edge.
9. The MEMS semiconductor device according to any one of claims 1-8, characterized in that, The MEMS semiconductor device further comprises a cover body, which is arranged on a side of the enclosure away from the substrate, so as to define, together with the enclosure frame and the substrate, an accommodation space for accommodating the chip and the pad.
10. A packaging method for a MEMS semiconductor device, characterized in that, The MEMS semiconductor device according to any one of claims 1 to 9 is packaged, the packaging method comprising: The plug connector is partially plugged into the plug hole, and a preset distance is provided between the pad and the chip in the plugging direction of the plug connector, and the chip is electrically connected to the corresponding pad by welding; Apply a preset external force to the plug-in part, so that the plug-in part is inserted into the plug hole deeper than in the welded state.