Mini LED encapsulation adhesive film and application

Abstract

The application discloses a MiniLED encapsulating adhesive film and application, and belongs to the technical field of LED encapsulation. The MiniLED encapsulating adhesive film comprises ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, heat-conducting filler, coupling agent, anti-aging agent, cross-linking agent, dopamine-modified graphene and polyphenolic compound, and the mass ratio of the polyphenolic compound to the dopamine-modified graphene is less than or equal to 1:2. In the formula, dopamine-modified graphene and polyphenolic compound are introduced as adjuvants for forming the adhesive film. The adhesion property of polydopamine is enhanced to improve the interface bonding force. SiO2 nanoparticles expand the spacing between graphene layers, reduce the conductivity and improve the thermal diffusion efficiency, thereby indirectly improving the heat resistance. Epigallocatechin gallate inhibits the aggregation of graphene through hydrogen bonding / π-π stacking of phenolic hydroxyl groups and polydopamine, neutralizes the solidification shrinkage stress, reduces the thermal expansion coefficient of the adhesive film, and improves the anti-warping performance of the adhesive film.

Description

Technical Field

[0001] The present invention relates to the field of LED packaging technology, and in particular to a MiniLED packaging film and its application. Background Art

[0002] LED packaging technology involves integrating LED chips into protective housings through precision processes, achieving electrical connections, optical control, and thermal management. Its core goal is to transform fragile semiconductor chips into reliable light sources for industrial applications. The packaging process and the quality of the encapsulant directly impact the LED's brightness, lifespan, light quality, and cost. With the continuous advancement of LED technology, MiniLED encapsulation film is the invisible engine of display technology evolution. Balancing the extreme performance of light, heat, force, and electricity at the micron scale, it directly determines the image quality and lifespan of the terminal.

[0003] In the prior art, MiniLED packaging usually includes materials such as silicone, substrates, and chips, and the thermal expansion coefficients of each component vary significantly. During the curing cooling or operating temperature rise process, the expansion and contraction of different materials are uneven, resulting in tensile or compressive stresses inside the film, causing warping and deformation. At the same time, MiniLEDs generate a lot of heat when powered on, and the properties of the packaging film directly affect their high-temperature resistance and peel strength. Among the existing public patents, CN115632002A discloses a packaging method and display for a low-warpage MiniLED display. It records that by setting specific curing temperature and pressing time and other conditions, and using a specific semi-cured hot-melt epoxy film, the epoxy film is in a surface-dry state when pressed against the substrate, making it easier for the epoxy film to bond to the MiniLED substrate. After the two are pressed together, they are further cured and bonded, and the encapsulated MiniLED display has better stability and reliability. It improves the processing technology and the epoxy film to improve the anti-warping effect. The process conditions of the above patent are relatively high, and its heat resistance needs to be further improved.

[0004] Therefore, how to provide a MiniLED encapsulation film that aims to simultaneously improve the heat resistance, peel strength and anti-warping properties of the encapsulation film. Summary of the Invention

[0005] To this end, the present invention provides a MiniLED encapsulation film and its application to solve the related technical problems existing in the prior art.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] According to a first aspect of the present invention, a MiniLED encapsulation film is provided, comprising the following components in parts by weight:

[0008] 45-60 parts of ethylene-vinyl acetate copolymer

[0009] 10-18 parts of ethylene-acrylic acid copolymer

[0010] 23-35 parts thermal conductive filler

[0011] 0.5-2.5 parts coupling agent

[0012] 0.3-1.2 parts of anti-aging agent

[0013] Cross-linking agent 0.2-0.9 parts

[0014] 0.5-2 parts of dopamine-modified graphene

[0015] 0.4-1.2 parts of polyphenols

[0016] The mass ratio of the polyphenol compound to the dopamine-modified graphene is ≤1:2.

[0017] Furthermore, the polyphenol compound is one or more of catechin, gallic acid, gallol, epigallocatechin, epicatechin gallate, and epigallocatechin gallate.

[0018] Furthermore, the polyphenol compound is epigallocatechin gallate.

[0019] Furthermore, the thermally conductive filler is one or more of zinc oxide, aluminum oxide, magnesium oxide, boron nitride, aluminum nitride, and silicon carbide.

[0020] Furthermore, the coupling agent is one or more of vinyltriethoxysilane, vinyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-methacryloxypropyltrimethoxysilane.

[0021] Furthermore, the anti-aging agent is a benzotriazole UV absorber and a hindered amine light stabilizer prepared in a mass ratio of 1:1.

[0022] Furthermore, the cross-linking agent is at least one of dicumyl peroxide and benzoyl peroxide.

[0023] According to a second aspect of the present invention, a method for preparing a MiniLED encapsulation film is provided, comprising the following steps:

[0024] Ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer are mixed in proportion to form a resin system, and thermal conductive filler, coupling agent, anti-aging agent, cross-linking agent and dopamine-modified graphene are mixed in proportion to form an auxiliary agent system;

[0025] The resin system and the auxiliary agent system are stirred and mixed according to a proportion, and the polyphenol compound is added three times according to a proportion, and the reaction temperature is controlled at 55-60° C. to obtain an encapsulating film system;

[0026] The encapsulation film system is subjected to cast extrusion to obtain the MiniLED encapsulation film.

[0027] Furthermore, the preparation method of dopamine-modified graphene is:

[0028] Graphene oxide and dopamine were ultrasonically dispersed in a 20% ethanol aqueous solution at a weight ratio of 1:1, with a controlled power of 180 W and a time of 1.5 h until uniformly mixed;

[0029] Add 1.5 wt% of hydrophobic SiO2 nanoparticles to the graphene oxide and dopamine mixture, stir evenly, and react at 35-40°C for 12 hours;

[0030] After the reaction is completed, the dopamine-modified graphene is washed by centrifugation until neutral and freeze-dried.

[0031] According to a third aspect of the present invention, there is provided an application of the MiniLED encapsulation film as described above in MiniLED packaging.

[0032] The present invention has the following advantages:

[0033] In the present application, a composite system of ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer forms a flexible-rigid interpenetrating network through gradient crosslinking of carboxyl groups and epoxy groups. The polar segments of the ethylene-acrylic acid copolymer enhance the adhesion between the film and the substrate and improve the peel strength, while the elastic buffer layer of the ethylene-vinyl acetate copolymer reduces the accumulation of thermal stress and reduces the incidence of warping after cooling and solidification. At the same time, the present application creatively introduces dopamine-modified graphene and polyphenol compounds as auxiliary agents. The dopamine-modified graphene forms an insulating-thermal conductive dual-function network through the synergistic effect of the polydopamine coating layer and hydrophobic SiO2 nanoparticles. The adhesion properties of polydopamine enhance the interfacial bonding force, while the SiO2 nanoparticles expand the spacing between the graphene sheets, reduce the conductivity and improve the thermal diffusion efficiency, thereby indirectly improving the heat resistance. Epigallocatechin gallate further inhibits graphene agglomeration through the hydrogen bonding / π-π stacking effect between phenolic hydroxyl groups and polydopamine, neutralizes the curing shrinkage stress, reduces the thermal expansion coefficient of the film, and thus improves the anti-warping performance of the film. DETAILED DESCRIPTION

[0034] The following describes the implementation of the present invention using specific embodiments. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. Obviously, the embodiments described are only a portion of the present invention, not all of it. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are intended to fall within the scope of protection of the present invention.

[0035] According to a first aspect of the present invention, a MiniLED encapsulation film is provided, comprising the following components in parts by weight:

[0036] 45-60 parts of ethylene-vinyl acetate copolymer

[0037] 10-18 parts of ethylene-acrylic acid copolymer

[0038] 23-35 parts thermal conductive filler

[0039] 0.5-2.5 parts coupling agent

[0040] 0.3-1.2 parts of anti-aging agent

[0041] Cross-linking agent 0.2-0.9 parts

[0042] 0.5-2 parts of dopamine-modified graphene

[0043] 0.4-1.2 parts of polyphenols

[0044] The mass ratio of polyphenol compounds to dopamine-modified graphene is ≤1:2.

[0045] The composite system of ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer forms a flexible-rigid interpenetrating network through gradient crosslinking of carboxyl and epoxy groups. The polar segments of the ethylene-acrylic acid copolymer enhance adhesion between the film and the substrate, improving peel strength. The elastic buffer layer of the ethylene-vinyl acetate copolymer reduces thermal stress accumulation and lowers the incidence of warping after cooling and curing.

[0046] At the same time, this application creatively introduces dopamine-modified graphene and polyphenol compounds as auxiliary agents. The dopamine-modified graphene forms an insulating and thermally conductive dual-functional network through the synergistic effect of the polydopamine coating and hydrophobic SiO2 nanoparticles. The adhesive properties of polydopamine enhance interfacial bonding, while the SiO2 nanoparticles expand the spacing between graphene sheets, reducing conductivity while increasing thermal diffusion efficiency, thereby indirectly improving heat resistance. Epigallocatechin gallate further inhibits graphene aggregation through hydrogen bonding / π-π stacking between phenolic hydroxyl groups and polydopamine, neutralizes curing shrinkage stress, reduces the thermal expansion coefficient of the film, and thus improves the film's anti-warping performance.

[0047] Furthermore, the polyphenol compound is one or more of catechin, gallic acid, gallol, epigallocatechin, epicatechin gallate, and epigallocatechin gallate. In the present application, preferably, the polyphenol compound is epigallocatechin gallate, and in actual use, the mass ratio of epigallocatechin gallate to modified graphene is ≤1:2. When epigallocatechin gallate is added to the film system, it is also used to reduce dopamine-modified graphene. The epigallocatechin gallate component can react with the carbonyl group of dopamine-modified graphene oxide to generate a phenolic hydroxyl structure. The two can form a network structure by chemical bonding and cross-linking through redox reaction, thereby alleviating warpage from three aspects: reducing the thermal expansion coefficient, enhancing mechanical strength, and improving interface bonding. However, the ratio must be controlled and the dispersion process must be optimized to reduce the possibility of graphene agglomeration.

[0048] Furthermore, the thermally conductive filler is one or more of zinc oxide, aluminum oxide, magnesium oxide, boron nitride, aluminum nitride, and silicon carbide.

[0049] Furthermore, the coupling agent is one or more of vinyltriethoxysilane, vinyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-methacryloxypropyltrimethoxysilane.

[0050] Furthermore, the anti-aging agent is a benzotriazole UV absorber and a hindered amine light stabilizer prepared in a mass ratio of 1:1. In the present invention, the benzotriazole UV absorber is UV-P, and the hindered amine light stabilizer is HALS292.

[0051] Furthermore, the cross-linking agent is at least one of dicumyl peroxide and benzoyl peroxide.

[0052] According to a second aspect of the present invention, a method for preparing a MiniLED encapsulation film is provided, comprising the following steps:

[0053] Ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer are mixed in proportion to form a resin system, and thermal conductive filler, coupling agent, anti-aging agent, cross-linking agent and dopamine-modified graphene are mixed in proportion to form an auxiliary agent system;

[0054] The resin system and the auxiliary agent system are stirred and mixed according to a proportion, and the polyphenol compound is added three times according to a proportion, and the reaction temperature is controlled at 55-60° C. to obtain an encapsulating film system;

[0055] The encapsulation film system is subjected to cast extrusion to obtain the MiniLED encapsulation film.

[0056] Furthermore, the preparation method of dopamine-modified graphene is:

[0057] Graphene oxide and dopamine were ultrasonically dispersed in a 20% ethanol aqueous solution at a weight ratio of 1:1, with a controlled power of 180 W and a time of 1.5 h until uniformly mixed;

[0058] Add 1.5 wt% of hydrophobic SiO2 nanoparticles to the graphene oxide and dopamine mixture, stir evenly, and react at 35-40°C for 12 hours;

[0059] After the reaction is completed, the dopamine-modified graphene is washed by centrifugation until neutral and freeze-dried.

[0060] Among them, hydrophobic SiO2 nanoparticles are added in the above-mentioned dopamine-modified graphene process. SiO2 is embedded between the graphene sheets to form a physical barrier, blocking the electron migration path, thereby increasing the volume resistivity, thereby reducing the conductivity in the graphene film, and reducing the conductivity while increasing the thermal diffusion efficiency, thereby indirectly improving the heat resistance.

[0061] According to a third aspect of the present invention, there is provided an application of the above MiniLED encapsulation film in MiniLED packaging.

[0062] In order to better illustrate the technical effects of the present application, the present invention is described below with reference to specific embodiments.

[0063] Example 1

[0064] This embodiment provides a MiniLED encapsulation film, specifically as follows:

[0065] Among them, the preparation method of dopamine-modified graphene is as follows: graphene oxide and dopamine are ultrasonically dispersed in a 20% ethanol aqueous solution in a weight ratio of 1:1, the power is controlled at 180W, and the time is 1.5 hours, until the mixture is uniform; hydrophobic SiO2 nanoparticles are added to the above mixed system at 1.5wt%, stirred evenly, and reacted at 35-40°C for 12 hours; after the reaction is completed, centrifugation and washing are performed until neutral, and the dopamine-modified graphene is freeze-dried.

[0066] Among them, the preparation method of MiniLED encapsulation film is:

[0067] Weigh the following components according to the proportion:

[0068] EVA UL00328 (Mitsui Chemicals) 55 copies

[0069] EAA Primacor 5980I (Dow) 12 parts

[0070] 30 parts of silicon nitride

[0071] KH-560 1.8 parts

[0072] 0.8 parts of anti-aging agent

[0073] 0.6 parts DCP crosslinking agent

[0074] 1.2 parts of dopamine-modified graphene

[0075] 0.4 parts of epigallocatechin gallate

[0076] Ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer are mixed in proportion to form a resin system, and thermal conductive filler, coupling agent, anti-aging agent, cross-linking agent and dopamine-modified graphene are mixed in proportion to form an auxiliary agent system; the resin system and the auxiliary agent system are stirred and mixed in proportion, and epigallocatechin gallate is added three times in proportion (the three addition ratios are 40%, 30% and 30%), and the reaction temperature is controlled at 55-60°C to obtain an encapsulation film system; the encapsulation film system is subjected to cast extrusion to obtain a MiniLED encapsulation film.

[0077] Example 2

[0078] This embodiment provides a MiniLED encapsulation film, specifically as follows:

[0079] Among them, the preparation method of dopamine-modified graphene is as follows: graphene oxide and dopamine are ultrasonically dispersed in a 20% ethanol aqueous solution in a weight ratio of 1:1, the power is controlled at 180W, and the time is 1.5 hours, until the mixture is uniform; hydrophobic SiO2 nanoparticles are added to the above mixed system at 1.5wt%, stirred evenly, and reacted at 35-40°C for 12 hours; after the reaction is completed, centrifugation and washing are performed until neutral, and the dopamine-modified graphene is freeze-dried.

[0080] Among them, the preparation method of MiniLED encapsulation film is:

[0081] Weigh the following components according to the proportion:

[0082] EVA UL00328 (Mitsui Chemicals) 48 copies

[0083] EAA Primacor 5980I (Dow) 16 parts

[0084] 25 parts of silicon nitride

[0085] KH-560 2.2 parts

[0086] 1.0 part of anti-aging agent

[0087] DCP crosslinking agent 0.7 parts

[0088] 1.1 parts of dopamine-modified graphene

[0089] 0.5 parts of epigallocatechin gallate

[0090] Ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer are mixed in proportion to form a resin system, and thermal conductive filler, coupling agent, anti-aging agent, cross-linking agent and dopamine-modified graphene are mixed in proportion to form an auxiliary agent system; the resin system and the auxiliary agent system are stirred and mixed in proportion, and epigallocatechin gallate is added three times in proportion (the three addition ratios are 40%, 30% and 30%), and the reaction temperature is controlled at 55-60°C to obtain an encapsulation film system; the encapsulation film system is subjected to cast extrusion to obtain a MiniLED encapsulation film.

[0091] Example 3

[0092] This embodiment provides a MiniLED encapsulation film, specifically as follows:

[0093] Among them, the preparation method of dopamine-modified graphene is as follows: graphene oxide and dopamine are ultrasonically dispersed in a 20% ethanol aqueous solution in a weight ratio of 1:1, the power is controlled at 180W, and the time is 1.5 hours, until the mixture is uniform; hydrophobic SiO2 nanoparticles are added to the above mixed system at 1.5wt%, stirred evenly, and reacted at 35-40°C for 12 hours; after the reaction is completed, centrifugation and washing are performed until neutral, and the dopamine-modified graphene is freeze-dried.

[0094] Among them, the preparation method of MiniLED encapsulation film is:

[0095] Weigh the following components according to the proportion:

[0096] EVA UL00328 (Mitsui Chemicals) 60 copies

[0097] EAA Primacor 5980I (Dow) 10 parts

[0098] 23 parts of silicon nitride

[0099] KH-560 0.5 parts

[0100] 0.5 parts of anti-aging agent

[0101] 0.2 parts DCP crosslinking agent

[0102] 2 parts dopamine-modified graphene

[0103] 0.8 parts of epigallocatechin gallate

[0104] Ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer are mixed in proportion to form a resin system, and thermal conductive filler, coupling agent, anti-aging agent, cross-linking agent and dopamine-modified graphene are mixed in proportion to form an auxiliary agent system; the resin system and the auxiliary agent system are stirred and mixed in proportion, and epigallocatechin gallate is added three times in proportion (the three addition ratios are 40%, 30% and 30%), and the reaction temperature is controlled at 55-60°C to obtain an encapsulation film system; the encapsulation film system is subjected to cast extrusion to obtain a MiniLED encapsulation film.

[0105] Comparative Example 1

[0106] The components and processing steps of the film system in this comparative example are the same as those in Example 1, except that epigallocatechin gallate is not added.

[0107] Comparative Example 2

[0108] The components and processing steps of the film system in this comparative example are the same as those in Example 1, except that dopamine-modified graphene is not added.

[0109] Comparative Example 3

[0110] The components and processing steps of the film system in this comparative example are the same as those in Example 1, except that epigallocatechin gallate and dopamine-modified graphene are not added.

[0111] Comparative Example 4

[0112] The components and processing steps of the film system in this comparative example are the same as those in Example 1, except that the dopamine-modified graphene is replaced by graphene oxide.

[0113] Test Example 1

[0114] This application uses the test method disclosed in CN119307225A to test high temperature resistance and warpage, and also tests peel strength and thermal conductivity, as follows:

[0115] High temperature resistance: According to GB / T1036-2008, the thermal expansion coefficient of each group of test samples was tested using a dynamic mechanical tester at a test temperature of -40-150°C.

[0116] Warpage: Perform a warpage test in accordance with IPC-TM-6502.4.22.4. Take 5 test samples from each group and cut them into squares with a side length of 7.07 cm and a diagonal length of 10 cm. Reflow the cut test samples onto the circuit board at 270°C and test the circuit board's curvature. Warpage = warpage height / diagonal length x 100%. Take the average test result of each group of test samples.

[0117] Adhesion performance: Peel strength test was carried out in accordance with GB / T29848-2018 standard.

[0118] Thermal conductivity: thermal conductivity test is carried out according to ASTM D5470 standard.

[0119] In Examples 1-3 of the present application, epigallocatechin gallate forms a hydrogen bond / π-π stacking network with dopamine-modified graphene, which effectively inhibits the thermal motion of the molecular chain and controls the thermal expansion coefficient to be between 37-46 (10 -6 / K), with a warpage rate of <1.2%. Example 1 achieved the best technical results, with a thermal conductivity that was over 85% higher than that of Comparative Example 2, demonstrating that the modified graphene formed a continuous thermally conductive network, enhancing the thermal conductivity of the film system. In Example 2, due to its high EAA content, it achieved optimal peel strength.

[0120] Among them, in Comparative Example 1, due to the lack of epigallocatechin gallate, graphene agglomerates, which may lead to an increase in stress concentration points, thereby causing the thermal expansion coefficient to soar and the warpage rate to increase to 2.54%, which in turn proves the dispersing and stress neutralization effects of epigallocatechin gallate.

[0121] In Comparative Example 2, the absence of dopamine-modified graphene resulted in the thermally conductive filler relying solely on physical accumulation, failing to form a continuous heat conduction path. Thermal conductivity plummeted, and increased heat accumulation led to an increase in the thermal expansion coefficient. Furthermore, the dopamine polydopamine coating, which originally enhanced the resin-filler interface through adhesion, decreased its peel strength, potentially leading to delamination risk. This suggests that the graphene sheets, which originally absorb thermal stress, are directly affected by curing shrinkage stress on the substrate, causing a surge in warpage.

[0122] In Comparative Example 3, the absence of epigallocatechin gallate and graphene resulted in the loss of the dual effects of hydrogen bonding / π-π stacking and redox crosslinking. This resulted in the resin system losing its three-dimensional network support, causing a surge in thermal expansion coefficient and deteriorating warpage. Furthermore, the lack of epigallocatechin gallate's dispersing effect led to localized aggregation of the silicon nitride filler, resulting in concentrated stress points and a significant decrease in thermal conductivity.

[0123] Among them, in Comparative Example 4, the oxygen-containing groups of the unmodified graphene oxide destroyed the cross-linked network, resulting in an increase in the thermal expansion coefficient and a warpage rate of 1.73%. Since the graphene oxide has not been modified with dopamine and SiO2, the graphene oxide is still conductive and cannot be directly used for LED packaging.

[0124] Although the present invention has been described in detail above using general descriptions and specific embodiments, it will be apparent to those skilled in the art that modifications and improvements may be made thereto. Therefore, such modifications and improvements, without departing from the spirit of the present invention, are intended to be within the scope of protection claimed herein.

Claims

1. A MiniLED encapsulation film, characterized in that: The composition comprises the following components in parts by weight: 45-60 parts of ethylene-vinyl acetate copolymer 10-18 parts of ethylene-acrylic acid copolymer 23-35 parts thermal conductive filler 0.5-2.5 parts coupling agent 0.3-1.2 parts of anti-aging agent Cross-linking agent 0.2-0.9 parts 0.5-2 parts of dopamine-modified graphene 0.4-1.2 parts of polyphenols The mass ratio of the polyphenol compound to the dopamine-modified graphene is ≤1:2, and the polyphenol compound is epigallocatechin gallate; The preparation method of dopamine-modified graphene is: Graphene oxide and dopamine were ultrasonically dispersed in a 20% ethanol aqueous solution at a weight ratio of 1:1, with a controlled power of 180 W and a time of 1.5 h until uniformly mixed; Add 1.5 wt% of hydrophobic SiO2 nanoparticles to the graphene oxide and dopamine mixture, stir evenly, and react at 35-40°C for 12 hours; After the reaction is completed, the dopamine-modified graphene is washed by centrifugation until neutral and freeze-dried; The epigallocatechin gallate is used for inhibiting the agglomeration of dopamine-modified graphene and neutralizing the curing shrinkage stress through the hydrogen bond and / or π-π stacking effect between the phenolic hydroxyl group and polydopamine.

2. The MiniLED encapsulation film according to claim 1, wherein: The thermal conductive filler is one or more of zinc oxide, aluminum oxide, magnesium oxide, boron nitride, aluminum nitride, and silicon carbide.

3. The MiniLED encapsulation film according to claim 1, wherein: The coupling agent is one or more of vinyl triethoxysilane, vinyl trimethoxysilane, γ-aminopropyl triethoxysilane, γ-glycidyloxypropyl trimethoxysilane, and γ-methacryloxypropyl trimethoxysilane.

4. The MiniLED encapsulation film according to claim 1, wherein: The anti-aging agent is a benzotriazole UV absorber and a hindered amine light stabilizer prepared in a mass ratio of 1:

1.

5. The MiniLED encapsulation film according to claim 1, wherein: The cross-linking agent is at least one of dicumyl peroxide and benzoyl peroxide.

6. A method for preparing a MiniLED encapsulation film, for preparing the MiniLED encapsulation film according to any one of claims 1 to 5, characterized in that: The steps include: Ethylene-vinyl acetate copolymer and ethylene-acrylic acid copolymer are mixed in proportion to form a resin system, and thermal conductive filler, coupling agent, anti-aging agent, cross-linking agent and dopamine-modified graphene are mixed in proportion to form an auxiliary agent system; The resin system and the auxiliary agent system are stirred and mixed according to a proportion, and epigallocatechin gallate is added three times according to a proportion, and the reaction temperature is controlled at 55-60° C. to obtain an encapsulating film system; The encapsulation film system is subjected to cast extrusion to obtain the MiniLED encapsulation film.

7. Use of the MiniLED encapsulation film according to any one of claims 1 to 5 in MiniLED encapsulation.