Device for adjusting clean gas distribution and thin film deposition equipment thereof

Abstract

The invention discloses a device for adjusting the distribution of clean gas and thin film deposition equipment thereof. The device for adjusting the distribution of the clean gas comprises a gas inlet block and a gas distribution block connected to the gas inlet block, a gas inlet channel for inputting clean gas is arranged in the gas inlet block, a gas distribution channel is arranged in the gas distribution block, and the gas distribution channel is communicated with the gas inlet channel; the gas distribution block is provided with a side gas distribution port and a bottom gas distribution port, and the side gas distribution port and the bottom gas distribution port are both communicated with the gas distribution channel, so that clean gas is distributed and output from the side wall and the bottom of the gas distribution block. According to the device for adjusting the distribution of the clean gas and the thin film deposition equipment thereof, the clean gas is respectively output from the side surface and the bottom surface of the gas distribution block through the gas distribution device, so that the clean gas entering the process chamber is more uniform, the cleaning effect is better, the efficiency is higher, and the quality and the productivity of a thin film deposition process are synchronously improved.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film deposition equipment, and particularly to a device for adjusting the distribution of cleaning gas and a thin film deposition equipment thereof. Background Art

[0002] In semiconductor thin film deposition equipment, the cleaning gas (the cleaning gas for cleaning the process chamber) generally enters the process chamber from above the process chamber, and finally is extracted from the bottom air extraction port after cleaning the chamber. The uniformity of the distribution of the cleaning gas in the process chamber is crucial. The uniformity of the cleaning gas distribution affects the cleaning effect of the process chamber, the cleaning time and frequency, and simultaneously affects the quality and productivity of the thin film deposition process. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and provide a device for adjusting the distribution of cleaning gas and a thin film deposition equipment thereof, so as to solve the technical problem of uneven distribution of the existing cleaning gas in the process chamber.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a device for adjusting the distribution of cleaning gas, which includes: an air inlet block and a gas distribution block connected to the air inlet block;

[0006] An air inlet channel for inputting cleaning gas is provided in the air inlet block, and a gas distribution channel is provided in the gas distribution block, and the gas distribution channel is communicated with the air inlet channel;

[0007] Wherein, a side gas distribution port and a bottom gas distribution port are provided on the gas distribution block, and both the side gas distribution port and the bottom gas distribution port are communicated with the gas distribution channel, so as to distribute and output the cleaning gas from the side wall and the bottom of the gas distribution block.

[0008] Wherein, the flow resistance of the bottom gas distribution port to the cleaning gas is greater than the flow resistance of the side gas distribution port.

[0009] Wherein, the number of the side gas distribution ports is at least two, and at least two side gas distribution ports are evenly distributed around the side wall of the gas distribution block at equal intervals.

[0010] Wherein, the bottom gas distribution port includes: a central gas distribution port and a plurality of peripheral gas distribution ports surrounding the central gas distribution port, and the plurality of peripheral gas distribution ports are arranged at equal intervals.

[0011] Wherein, the air inlet channel and the gas distribution channel are coaxially aligned and communicated.

[0012] Among them, the intake block includes a disc-shaped body, the intake channel is opened at the axial center position of the disc-shaped body, and the intake channel is a cylindrical channel.

[0013] Among them, a plurality of process gas channels are further provided on the disc-shaped body, the process gas channels penetrate from the top surface to the bottom surface of the disc-shaped body, and the plurality of process gas channels are circularly distributed outside the intake channel.

[0014] Among them, the gas distribution block is connected to the bottom surface of the disc-shaped body and protrudes from the intake block.

[0015] Among them, the central gas distribution port is a circular hole, and the peripheral gas distribution port is a waist-shaped hole extending along the edge of the central gas distribution port.

[0016] In a second aspect, an embodiment of the present invention provides a thin film deposition apparatus, and the thin film deposition apparatus includes the device for adjusting the distribution of the cleaning gas as described in any one of the above.

[0017] The device for adjusting the distribution of the cleaning gas and the thin film deposition apparatus thereof according to the present invention output the cleaning gas from the side and the bottom surface of the gas distribution block respectively through a gas distribution device, so that the cleaning gas entering the process chamber is more uniform, the cleaning effect is better and the efficiency is higher, and the quality and productivity of the thin film deposition process are improved synchronously.

[0018] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other objects, features and advantages of the present invention more obvious and understandable, the following preferred embodiments are specifically described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figures 1 to 3 Structural schematic diagrams of different perspectives of the device for adjusting the distribution of the cleaning gas according to an embodiment of the present invention.

[0020] Figure 4 Bottom view of the device for adjusting the distribution of the cleaning gas according to an embodiment of the present invention.

[0021] Figure 5 Top view of the device for adjusting the distribution of the cleaning gas according to an embodiment of the present invention.

[0022] Figure 6 For Figure 2 Partial enlarged structural schematic diagram of A in

[0023] Figure 7 Side view of the device for adjusting the distribution of the cleaning gas according to an embodiment of the present invention.

[0024] Figure 8 ForFigure 7 The sectional view taken along the A-A direction shown

[0025] Figure 9 The bottom view of the device for adjusting the distribution of cleaning gas according to an embodiment of the present invention

[0026] Figure 10 is Figure 9 The sectional view taken along the B-B direction shown

[0027] Description of reference numerals:

[0028] Intake block 1, gas distribution block 2, disc-shaped body 11, intake passage 12, process gas passage 13, connection hole 14, annular groove 15, gas distribution passage 20, side gas distribution port 21, bottom gas distribution port 22, top surface 111, bottom surface 112, intake port 131, outlet port 132, first side gas distribution port 211, second side gas distribution port 212, third side gas distribution port 213, central gas distribution port 221, peripheral gas distribution port 222, device 100 for adjusting the distribution of cleaning gas Detailed implementation manners

[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless specifically defined otherwise.

[0033] In the present invention, unless otherwise clearly defined and limited, the terms such as "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral molding; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the horizontal height of the first feature is lower than that of the second feature.

[0035] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0036] In a semiconductor thin film deposition apparatus, a cleaning gas (a cleaning gas for cleaning a process chamber) generally enters the process chamber from above the process chamber, and after cleaning the chamber, it is finally exhausted from the bottom exhaust port. Therefore, the uniform distribution of the cleaning gas in the process chamber is crucial. The uniformity of the cleaning gas distribution affects the cleaning effect of the process chamber, the cleaning time and frequency, and simultaneously affects the quality and productivity of the thin film deposition process. To solve the above problems, this embodiment discloses a device 100 for adjusting the distribution of the cleaning gas.

[0037] Please refer to Figures 1 to 10 , this embodiment discloses a device 100 for adjusting the distribution of cleaning gas, which includes: an intake block 1 and a gas distribution block 2 connected to the intake block 1. The intake block 1 is used to communicate with an external cleaning gas source and convey the cleaning gas to the gas distribution block 2. The gas distribution block 2 is used to output the cleaning gas in multiple directions again into the process chamber, where the process chamber herein refers to the thin film deposition process chamber of a thin film deposition device. It can be understood that the intake block 1 and the gas distribution block 2 can be an integrally formed structure or a structure in which two independent structures are fixedly connected in alignment. In this embodiment, the intake block 1 and the gas distribution block 2 are taken as an integrally formed structure for description.

[0038] An intake channel 12 for the input of cleaning gas is provided in the intake block 1, and a gas distribution channel 20 is provided in the gas distribution block 2. The gas distribution channel 20 communicates with the intake channel 12.

[0039] Among them, a side gas distribution port 21 and a bottom gas distribution port 22 are provided on the gas distribution block 2. Both the side gas distribution port 21 and the bottom gas distribution port 22 communicate with the gas distribution channel 20, so as to distribute and output the cleaning gas from the side wall and the bottom of the gas distribution block 2. After the device 100 for adjusting the distribution of cleaning gas is assembled with the process chamber, a part of the gas distribution block 2 extends into the interior of the process chamber. The cavity of the process chamber is generally a cylindrical cavity. The side gas distribution port 21 faces the side wall of the cylindrical cavity, and the bottom gas distribution port 22 faces the bottom wall of the cylindrical cavity. Therefore, the device 100 for adjusting the distribution of cleaning gas outputs the input cleaning gas into the process chamber from two angles, namely the lateral periphery and the lower part, through the side gas distribution port 21 and the bottom gas distribution port 22 on the gas distribution block 2, so that the output cleaning gas is more evenly distributed, the cleaning gas can fully contact all corners of the cavity of the process chamber, improving its cleaning effect. Since the cleaning gas is in full contact inside the cavity, the entire cleaning process takes less time and has higher cleaning efficiency.

[0040] To further improve the uniformity of the distribution of the cleaning gas, the flow resistance of the bottom gas distribution port 22 to the cleaning gas is greater than that of the side gas distribution port 21. That is, after the cleaning gas input from the gas inlet channel 12 of the inlet block 1 passes through the gas distribution channel 20, the flow resistance of the cleaning gas output from the bottom gas distribution port 22 is greater than that of the side gas distribution port 21. At this time, the gas diverted by the bottom gas distribution port 22 will be less than the gas diverted by the side gas distribution port 21. Combined with the cylindrical cavity structure of the process chamber, more cleaning gas will be diverted from the side gas distribution port 21 to the peripheral space of the process chamber. Since the exhaust port is arranged at the bottom of the process chamber, the cleaning gas diverted to the peripheral space and the bottom space of the process chamber will finally flow downward to the exhaust port and be exhausted. According to the flow direction and distribution mode of the cleaning gas, it can be seen that the gas distribution block 2 can improve the uniformity of the distribution of the cleaning gas in the process chamber and can maintain a relatively balanced state even under the flowing state of the cleaning gas, so that the cleaning effect and efficiency are significantly improved.

[0041] As Figure 6 shown, the number of the side gas distribution ports 21 is at least two, and at least two of the side gas distribution ports 21 are evenly distributed around the side wall of the gas distribution block 2 at equal intervals. Specifically, the side gas distribution port 21 includes a first side gas distribution port 211, a second side gas distribution port 212, and a third side gas distribution port 213. In other embodiments, the number of the side gas distribution ports 21 can be increased or decreased according to the size of the gas distribution block 2 and the application scenario, and is not limited to three in this embodiment.

[0042] Among them, the bottom gas distribution port 22 includes: a central gas distribution port 221 and a plurality of peripheral gas distribution ports 222 surrounding the central gas distribution port 221, and the plurality of peripheral gas distribution ports 222 are arranged at equal intervals.

[0043] Whether it is the side gas distribution port 21 or the bottom gas distribution port 22, their core function is to evenly output the cleaning gas into the process chamber. Therefore, the specific distribution modes of the side gas distribution port 21 and the bottom gas distribution port 22 should also be kept as uniform as possible. The side gas distribution port 21 and the bottom gas distribution port 22 divert the cleaning gas from two major directions to make the output uniform, and the specific outlet distribution and shape of the side gas distribution port 21 and the bottom gas distribution port 22 further make the output of the cleaning gas in a single direction also maintain a balanced state, which can further improve the uniformity of the cleaning gas output to the process chamber and further improve the cleaning effect and quality.

[0044] Please refer to Figure 8 again, the gas inlet channel 12 and the gas distribution channel 20 are coaxially aligned and connected. That is, the gas inlet channel 12 and the gas distribution channel 20 are in a direct-through state in the vertical direction. The direct-through design can reduce the resistance effect on the cleaning gas during the transportation process and improve the transportation efficiency of the cleaning gas.

[0045] Please refer to again Figures 2 to 4 The intake block 1 includes a disc-shaped body 11. The intake channel 12 is opened at the axial center position of the disc-shaped body 11. The intake channel 12 is a columnar channel, such as a cylindrical channel or a straight prism-shaped channel, etc. In this embodiment, the ventilation channel 12 is a cylindrical channel.

[0046] Wherein, a plurality of process gas channels 13 are further provided on the disc-shaped body 11. The process gas channels 13 penetrate from the top surface 111 to the bottom surface 112 of the disc-shaped body 11, and the plurality of process gas channels 13 are circularly distributed outside the intake channel 12. The circle where the plurality of process gas channels 13 are located is coaxially arranged with the ventilation channel 12, and the two form an inner and outer concentric ring structure. The intake port 131 of the process gas channel 13 is located on the top surface 111 of the disc-shaped body 11, and the outlet port 132 is located on the bottom surface 112 of the disc-shaped body 11, which is used to evenly transport the process gas into the process chamber.

[0047] An annular groove 15 is further recessed on the top surface 111 of the disc-shaped body 11. The intake port 131 of the process gas channel 13 extends to the bottom of the annular groove 15. The annular groove 15 is used to collect and divide the process gas, and it has the function of evenly outputting the process gas.

[0048] A connection hole 14 is further provided on the top surface 111 of the disc-shaped body 11. The connection hole 14 surrounds the outside of the intake channel 12. The connection hole 14 can be externally connected to a connecting piece to fixedly connect the intake block 1 to the gas source output end of the cleaning gas.

[0049] Such as Figure 1 shown, the gas distribution block 2 is connected to the bottom surface 112 of the disc-shaped body 11 and protrudes from the intake block 1.

[0050] Such as Figure 4 shown, the central gas distribution port 221 is a circular hole, and the peripheral gas distribution port 222 is a waist-shaped hole extending along the edge of the central gas distribution port 221. In other embodiments, the shapes of the central gas distribution port 221 and the peripheral gas distribution port 222 can also be other shapes, and their distribution methods can also be other uniformly symmetric distribution methods.

[0051] In this embodiment, when the intake passage 12 is a cylindrical passage, its diameter is 44 mm. The diameter of the gas distribution passage 20 on the corresponding gas distribution block 2 is 48 mm, and the height by which the gas distribution passage 48 protrudes from the bottom surface 112 of the intake block 1 is 38 mm. It can be understood that in other embodiments, the diameters of the intake passage 12 and the gas distribution passage 20 are not limited to the values in this embodiment, and their sizes can be adjusted according to the application scenario. When the device 100 for adjusting the distribution of the cleaning gas is assembled in the process chamber, the length of the gas distribution block 2 extending into the cavity of the process chamber is 6 mm.

[0052] In this embodiment, the side gas distribution port 21 is a longitudinally extending rectangular hole, and this rectangular hole should be designed as large as possible according to the size of the gas distribution block 2.

[0053] In a second aspect, an embodiment of the present invention provides a thin film deposition device, and the thin film deposition device includes the device 100 for adjusting the distribution of the cleaning gas as described in any one of the above. Other structures of this thin film deposition device all adopt the existing publicly disclosed technical solutions, which will not be elaborated here.

[0054] In the existing intake structure, it is common that the cleaning gas flows in from the middle of the intake block. The cleaning gas will continue to flow downward towards the inside of the process chamber after colliding with the baffle. Since the distance between the intake block and the baffle is small, this space is not sufficient to achieve the rapid diffusion of the cleaning gas on the baffle. Eventually, the cleaning gas is more concentrated in the central area of the process chamber compared to the edge area. If the edge area is to meet the qualified cleaning standard, only a longer cleaning time can be maintained, thus prolonging the cleaning cycle and affecting the efficiency and the production capacity of the equipment.

[0055] The device for adjusting the distribution of the cleaning gas in this embodiment and its thin film deposition device output the cleaning gas from the side and the bottom surface of the gas distribution block through a gas distribution device, so that the cleaning gas entering the process chamber is more uniform, the cleaning effect is better and the efficiency is higher, and at the same time, the quality and the production capacity of the thin film deposition process are improved.

[0056] The above only further illustrates the technical content of the present invention with embodiments to make it easier for readers to understand, but it does not mean that the implementation manners of the present invention are limited to this. Any technical extension or re - creation made according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A device for regulating the distribution of cleaning gas, characterized in that, Comprising: An intake block and a gas distribution block connected to the intake block; An intake passage for cleaning gas input is provided in the intake block, and a gas distribution passage is provided in the gas distribution block, and the gas distribution passage communicates with the intake passage; Wherein, a side gas distribution port and a bottom gas distribution port are provided on the gas distribution block, and both the side gas distribution port and the bottom gas distribution port communicate with the gas distribution passage, so as to distribute and output the cleaning gas from the side wall and the bottom of the gas distribution block.

2. The device for adjusting the distribution of the cleaning gas according to claim 1, characterized in that, The flow resistance of the bottom gas distribution port to the cleaning gas is greater than that of the side gas distribution port.

3. The device for adjusting the distribution of the cleaning gas according to claim 2, characterized in that, The number of the side gas distribution ports is at least two, and at least two of the side gas distribution ports are circumferentially distributed at equal intervals on the side wall of the gas distribution block.

4. The device for adjusting the distribution of the cleaning gas according to claim 2, characterized in that, The bottom gas distribution port includes: a central gas distribution port and a plurality of peripheral gas distribution ports surrounding the central gas distribution port, and the plurality of peripheral gas distribution ports are arranged at equal intervals.

5. The device for adjusting the distribution of cleaning gas according to any one of claims 2 to 4, characterized in that, The intake passage and the gas distribution passage are coaxially and oppositely communicated.

6. The device for regulating the distribution of the cleaning gas according to claim 2, characterized in that, The intake block includes a disc-shaped body, the intake passage is opened at the axial center position of the disc-shaped body, and the intake passage is a cylindrical passage.

7. The device for adjusting the distribution of the cleaning gas according to claim 6, characterized in that, A plurality of process gas passages are further provided on the disc-shaped body, the process gas passages penetrate from the top surface to the bottom surface of the disc-shaped body, and the plurality of process gas passages are circularly distributed outside the intake passage.

8. The device for adjusting the distribution of the cleaning gas according to claim 6, characterized in that, The gas distribution block is connected to the bottom surface of the disc-shaped body and protrudes from the intake block.

9. The device for adjusting the distribution of the cleaning gas according to claim 4, wherein The central gas distribution port is a circular hole, and the peripheral gas distribution port is a waist-shaped hole extending along the edge of the central gas distribution port.

10. A thin film deposition device, characterized in that, The thin film deposition device includes the device for adjusting the distribution of the cleaning gas according to any one of claims 1 to 9.

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