Data processing method and system for integrated circuit detection

Abstract

The invention relates to the technical field of chip detection, and discloses a data processing method and system for integrated circuit detection. According to the invention, the geometric stability of chip pin arrangement is ensured through the transverse and longitudinal error control of the pin spacing; secondly, a pin curvature detection and tolerance mechanism is introduced, manufacturing tolerance and actual assembly requirements are considered, and unnecessary scrapping caused by tiny deformation is avoided; combining the size matching of the pin and the hole of the mainboard and the judgment of the contact area, comprehensively evaluating the sufficiency of mechanical and electrical contact, and particularly judging the insertion state through the difference value between the maximum diameter of the pin and the diameter of the hole, so as to ensure the tightness and stability of connection; and finally, aiming at the problem of chip inclination caused by the fact that the maximum diameter of the pin is larger than the diameter of the hole, the good contact condition of the top plane of the chip and the radiator is further guaranteed through inclination angle measurement, and it is ensured that the heat dissipation performance is not affected.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and particularly to a data processing method and system for integrated circuit detection. Background Art

[0002] Integrated circuit detection is used to ensure the performance and reliability of chips. Its detection process mainly includes three stages: wafer-level detection, pre-packaging detection, and post-packaging detection.

[0003] Among them, wafer-level detection is mainly to detect the physical and process defects of the chips, and to judge whether there are defects in the chips from the appearance. Pre-packaging detection is mainly to detect the electrical characteristics of the chips to ensure that the chip performance meets the standards. Post-packaging detection is mainly to detect the performance of the chips in the actual working environment to ensure the durability and stability of the chips.

[0004] Although the chips can be directly detected whether they are normal through performance tests after packaging, the detection of their physical defects should not be ignored after packaging. Because after the chips are packaged, it is equivalent to adding structures to the chips themselves, and these structures are connected to the chips. Therefore, it is also necessary to detect these extra structures and whether the connections between the structures and the chips are normal. Summary of the Invention

[0005] Aiming at the problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a data processing method and system for integrated circuit detection, so as to be able to detect the chips of integrated circuits.

[0006] To achieve the above object, the present invention provides the following technical solution: A data processing method for integrated circuit detection, comprising: Step 1, obtaining the distance between each pin and the pins near it, recording the distance between it and the pins near it longitudinally as the longitudinal pin distance, and the distance between it and the pins near it horizontally as the horizontal pin distance. After adding up all the horizontal pin distances and taking the average value, the average horizontal pin distance is obtained. Similarly, the average longitudinal pin distance is obtained. The horizontal-vertical pin error is obtained by subtracting the average longitudinal pin distance from the average horizontal pin distance; Step 2, setting a horizontal-vertical pin error threshold according to parameter requirements, comparing the horizontal-vertical pin error with the horizontal-vertical pin error threshold. If the horizontal-vertical pin error is less than or equal to the horizontal-vertical pin error threshold, it means that the distances between the pins are consistent horizontally and vertically. In this case, the pin distance detection of the chip is qualified; if the horizontal-vertical pin error is greater than the horizontal-vertical pin error threshold, it means that the distances are inconsistent. In this case, the pin distance detection of the chip is unqualified; Step 3, obtaining the curvature of each pin of the chip and setting a curvature threshold, comparing the curvature of each pin with the curvature threshold respectively. If the curvature of the pin is less than or equal to the curvature threshold, it means that the curvature of this pin is within the standard range. In this case, the curvature detection of this pin is qualified; if the curvature of the pin is greater than the curvature threshold, it means that the curvature of this pin exceeds the standard range. In this case, the curvature detection of this pin is unqualified. Only when the curvature detections of all pins are qualified, the pin curvature detection of the chip is qualified; Step 4, if there are pins with unqualified curvature detections, obtaining the number of pins with unqualified curvature detections, denoted as the curvature-unqualified pins; Step 5, setting a curvature-unqualified pin tolerance threshold, comparing the curvature-unqualified pins with the curvature-unqualified pin tolerance threshold. If the curvature-unqualified pins are less than or equal to the curvature-unqualified pin tolerance threshold, it means that the number of pins with unqualified curvature is within the tolerance limit. In this case, analyze the curvature of the curvature-unqualified pins again to determine whether the pins can be inserted into the holes on the main board; if the curvature-unqualified pins are greater than the curvature-unqualified pin tolerance threshold, it means that the number of pins with unqualified curvature exceeds the tolerance limit. In this case, maintain the unqualified pin curvature detection of the chip.

[0007] In some embodiments, during the re-analysis, according to the parameter information of the holes on the main board for installing the chip pins, set the maximum curvature of the pins that can be inserted into the holes. Under this condition, compare the curvatures of all the curvature-unqualified pins with the maximum curvature respectively, and different responses are obtained according to the comparison results.

[0008] In some embodiments, if the bend angles of all pins with unqualified bend angles are less than or equal to the maximum bend angle, it means that although all pins with unqualified bend angles are bent, it does not affect the installation with the main board. In this case, the pin bend angle detection of the chip is qualified; if the bend angles of all pins with unqualified bend angles are not all less than or equal to the maximum bend angle, it means that among all pins with unqualified bend angles, there are pins with large bend angles that cannot be inserted into the holes at the chip installation location on the main board. In this case, the pin bend angle detection of the chip is unqualified.

[0009] In some embodiments, when the detections of both the pin distance and the pin bend angle are qualified, obtain the hole diameter at the chip installation location on the main board. At the same time, obtain the diameter at the top of the pin, denoted as the maximum pin diameter. Subtract the hole diameter from the maximum pin diameter and take the positive value to obtain the diameter difference. At the same time, set the diameter difference error, compare the diameter difference with the diameter difference error, and obtain different responses according to the comparison results.

[0010] In some embodiments, if the diameter difference between the pin and the hole is less than or equal to the diameter difference error, it means that the maximum pin diameter is the same as the hole diameter, and the pin can be perfectly inserted into the hole. In this case, the pin diameter detection is qualified; if the diameter difference between the pin and the hole is greater than the diameter difference error, it means that there is a gap between the maximum pin diameter and the hole diameter, and the pin cannot be perfectly inserted into the hole. In this case, the pin diameter detection is unqualified.

[0011] In some embodiments, when the diameter difference between the pin and the hole is greater than the diameter difference error, whether the maximum pin diameter is less than the hole diameter or the maximum pin diameter is greater than the hole diameter, install the chip on the main board and insert the pin into the hole. In this state, obtain the contact area between the pin and the inner surface of the hole. At the same time, set the contact area threshold, compare the contact area with the contact area threshold, and obtain different responses according to the comparison results.

[0012] In some embodiments, if the contact area is greater than or equal to the contact area threshold, it means that the contact area between the pin and the hole is large, and there is no situation of insufficient physical contact between the two. In this case, the pin diameter detection is changed to qualified; if the contact area is less than the contact area threshold, it means that the contact area between the pin and the hole is small, and there is insufficient physical contact between the two. In this case, the pin diameter detection remains unqualified.

[0013] In some embodiments, when the maximum diameter of the pin is greater than the diameter of the hole, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, and the pin diameter detection is also qualified, the installation of the chip and the motherboard is maintained. Then, the motherboard is placed on the desktop to keep the motherboard in a horizontal position. The motherboard is regarded as the X-axis, and the angle between the X-axis and the top plane of the chip is measured by a sensor and recorded as the tilt angle. At the same time, a tilt angle threshold is set, and the tilt angle is compared with the tilt angle threshold. If the tilt angle is less than or equal to the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is small. In this case, when the maximum diameter of the pin is greater than the diameter of the hole and the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter detection is maintained as qualified. If the tilt angle is greater than the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is large. In this case, when the maximum diameter of the pin is greater than the diameter of the hole, even if the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter detection is unqualified.

[0014] The present invention further provides a data processing system for integrated circuit detection, which is used to execute the above-mentioned method, and includes: a pin distance acquisition module, which is used to acquire the distance between each pin and its nearby pins, record the distance between it and the longitudinally nearby pins as the longitudinal pin distance, and record the distance between it and the laterally nearby pins as the lateral pin distance. After adding up all the lateral pin distances and taking the average value, the average lateral pin distance is obtained. Similarly, the average longitudinal pin distance is obtained. The longitudinal and lateral pin error is obtained by subtracting the average longitudinal pin distance from the average lateral pin distance; a pin distance comparison module, which is used to set the longitudinal and lateral pin error threshold according to the parameter requirements, and compare the longitudinal and lateral pin error with the longitudinal and lateral pin error threshold. If the longitudinal and lateral pin error is less than or equal to the longitudinal and lateral pin error threshold, it means that the distances between the pins in the lateral and longitudinal directions are consistent. In this case, the pin distance detection of the chip is qualified; if the longitudinal and lateral pin error is greater than the longitudinal and lateral pin error threshold, it means that the distances are inconsistent. In this case, the pin distance detection of the chip is unqualified; a pin bending comparison module, which is used to acquire the bending degree of each pin of the chip and set the bending degree threshold, and compare the bending degree of each pin with the bending degree threshold respectively. If the bending degree of the pin is less than or equal to the bending degree threshold, it means that the bending degree of this pin is within the standard range. In this case, the bending degree detection of this pin is qualified; if the bending degree of the pin is greater than the bending degree threshold, it means that the bending degree of this pin exceeds the standard range. In this case, the bending degree detection of this pin is unqualified. Only when the bending degree detections of all pins are qualified, the pin bending degree detection of the chip is qualified; a pin bending unqualified acquisition module, which is used to acquire the number of pins with unqualified bending degree detection when there are pins with unqualified bending degree detection, and record it as the number of pins with unqualified bending degree; a pin bending unqualified comparison module, which is used to set the tolerance threshold for the number of pins with unqualified bending degree according to the parameter information, and compare the number of pins with unqualified bending degree with the tolerance threshold for the number of pins with unqualified bending degree. If the number of pins with unqualified bending degree is less than or equal to the tolerance threshold for the number of pins with unqualified bending degree, it means that the number of pins with unqualified bending degree is within the tolerance limit. In this case, the bending degree of the pins with unqualified bending degree is analyzed again to determine whether the pins can be inserted into the holes of the main board; if the number of pins with unqualified bending degree is greater than the tolerance threshold for the number of pins with unqualified bending degree, it means that the number of pins with unqualified bending degree exceeds the tolerance limit. In this case, the pin bending degree detection of the chip remains unqualified.

[0015] The present invention further provides a computer-readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the above-mentioned data processing method for integrated circuit detection.

[0016] The technical solution provided by the present invention has the following beneficial effects compared with the prior art:

[0017] The method provided by the present invention effectively improves the accuracy and reliability of the assembly of integrated circuit chips and motherboards through multi-step and multi-dimensional comprehensive detection. First, by controlling the horizontal and vertical errors of the pin pitch, the geometric stability of the chip pin arrangement is ensured; secondly, a detection and tolerance mechanism for pin bending is introduced, taking into account manufacturing tolerances and actual assembly requirements to avoid unnecessary scrapping due to minor deformations; then, by combining the matching of the pin and motherboard hole sizes and the determination of the contact area, the sufficiency of mechanical and electrical contacts is comprehensively evaluated. In particular, the insertion state is judged by the difference between the maximum diameter of the pin and the hole diameter to ensure the tightness and stability of the connection; finally, for the chip tilt problem caused when the maximum diameter of the pin is greater than the hole diameter, the tilt angle is measured to further ensure good contact conditions between the top plane of the chip and the radiator, ensuring that the heat dissipation performance is not affected. The entire method not only strictly controls the size and shape parameters, pays attention to the actual contact situation, but also introduces flexible tolerance thresholds and multi-parameter linkage judgment strategies, significantly improving the scientificity and applicability of the detection, effectively preventing electrical failures and poor heat dissipation caused by dimensional errors and deformations, and ensuring the stable performance of the chip during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the method steps of the present invention;

[0019] Figure 2 is a schematic diagram of the system modules of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "a" cannot be understood as a limitation on the number.

[0022] The data processing method for integrated circuit detection provided by the present invention, as Figure 1 and Figure 2 shown, includes:

[0023] First step, for the already encapsulated chip, use a sensor to obtain the distances between each pin at the bottom of the chip and the pins in its vicinity. There is more than one pin in the vicinity of each pin, and there is at least one pin in the horizontal vicinity and one pin in the vertical vicinity for each pin. Denote the distance between each pin and the pin in its horizontal vicinity as the horizontal pin distance, and the distance between each pin and the pin in its vertical vicinity as the vertical pin distance. Add up all the horizontal pin distances and then take the average to obtain the average horizontal pin distance. Add up all the vertical pin distances and then take the average to obtain the average vertical pin distance. Use the average horizontal pin distance minus the average vertical pin distance to get the horizontal-vertical pin error. At the same time, set the horizontal-vertical pin error threshold according to the parameter requirements, compare the horizontal-vertical pin error with the horizontal-vertical pin error threshold, and obtain different responses according to the comparison results. If the horizontal-vertical pin error is less than or equal to the horizontal-vertical pin error threshold, it means that the distances between the pins at the bottom of the chip are consistent horizontally and vertically. In this case, the pin distance detection of the chip is qualified. If the horizontal-vertical pin error is greater than the horizontal-vertical pin error threshold, it means that the distances between the pins at the bottom of the chip are inconsistent horizontally and vertically. In this case, the pin distance detection of the chip is unqualified.

[0024] Second step, when the initial pin detection of the chip is qualified, obtain the curvature of each pin of the chip. At the same time, set the curvature threshold according to the parameter requirements, compare the curvature of each pin with the curvature threshold respectively, and obtain different responses according to the comparison results. If the curvature of the pin is less than or equal to the curvature threshold, it means that the curvature of this pin is within the standard range. In this case, the curvature detection of this pin is qualified. If the curvature of the pin is greater than the curvature threshold, it means that the curvature of this pin exceeds the standard range. In this case, the curvature detection of this pin is unqualified. Only when the curvature detections of all pins are qualified, the pin curvature detection of the chip is qualified.

[0025] Step 3: When the bend detection of not all pins is qualified, obtain the number of pins with unqualified bend detection, denoted as the pins with unqualified bend. Meanwhile, set the tolerance threshold for the pins with unqualified bend, compare the pins with unqualified bend with the tolerance threshold for the pins with unqualified bend, and obtain different responses according to the comparison results. If the number of pins with unqualified bend is less than or equal to the tolerance threshold for the pins with unqualified bend, it means that the number of pins with unqualified bend is within the tolerance limit. In this case, analyze the degree of excessive bend of the pins with unqualified bend again. If the number of pins with unqualified bend is greater than the tolerance threshold for the pins with unqualified bend, it means that the number of pins with unqualified bend exceeds the tolerance limit. In this case, maintain the unqualified bend detection of the pins of the chip. When analyzing again, set the maximum allowable bend of the pins that can be inserted into the holes according to the parameter information of the holes on the main board for installing the pins of the chip. Under this condition, compare the bends of all the pins with unqualified bend with the maximum bend again, and obtain different responses according to the comparison results. If the bends of all the pins with unqualified bend are less than or equal to the maximum bend, it means that although all the pins with unqualified bend have bends, it does not affect the installation with the main board. In this case, the bend detection of the pins of the chip is qualified. If the bends of all the pins with unqualified bend are not all less than or equal to the maximum bend, it means that among all the pins with unqualified bend, there are pins with excessive bend and cannot be inserted into the holes at the chip installation position on the main board. In this case, the bend detection of the pins of the chip is unqualified. For example, there are 100 pins at the bottom of the packaged chip. The sensor measures that the total distance of all horizontal pins is 950 mm, and the total distance of vertical pins is 1000 mm. Therefore, the average horizontal pin distance is 950÷100 = 9.5 mm, and the average vertical pin distance is 1000÷100 = 10 mm. Calculate the horizontal and vertical pin error as 9.5 mm - 10 mm = -0.5 mm. Assume that the horizontal and vertical pin error threshold is set to 1 mm. Since the error 0.5 mm ≤ 1 mm, the pin distance detection of the chip is qualified. Subsequently, detect the bend of each pin and find that the bends of 3 pins are 0.08 mm, 0.09 mm, and 0.1 mm respectively, and the bends of the other 97 pins are less than or equal to 0.05 mm. Set the bend threshold to 0.05 mm, and the bend detection of the 3 pins with excessive bend is unqualified. The number of pins with unqualified bend is 3. If the tolerance threshold for the pins with unqualified bend is 5 and 3 ≤ 5, further detect the maximum allowable bend of these 3 pins. Assume that the maximum allowable bend of the main board hole is 0.1 mm. The 3 unqualified pins are 0.08 mm, 0.09 mm, and 0.1 mm respectively, all ≤ 0.1 mm. Therefore, although some pins have bends exceeding the standard, it does not affect the installation, and the bend detection of the chip pins is finally qualified.

[0026] Step 4: When both the pin distance and the pin bend detection are qualified, obtain the hole diameter at the chip installation location on the main board. At the same time, since the pin shape is usually a cone that gets sharper from top to bottom, obtain the diameter at the top of the pin, that is, the maximum pin diameter. Subtract the hole diameter from the maximum pin diameter and take the positive value to get the diameter difference. Meanwhile, set the diameter difference error according to the parameter requirements, compare the diameter difference with the diameter difference error, and obtain different responses based on the comparison result. If the diameter difference between the pin and the hole is less than or equal to the diameter difference error, it means that the maximum pin diameter is basically the same as the hole diameter, and the pin can be perfectly inserted into the hole. In this case, the pin diameter detection is qualified. If the diameter difference between the pin and the hole is greater than the diameter difference error, it means that there is a gap between the maximum pin diameter and the hole diameter, and the pin cannot be perfectly inserted into the hole. In this case, the pin diameter detection is unqualified. When the diameter difference between the pin and the hole is greater than the diameter difference error, there are two cases where the pin cannot be perfectly inserted into the hole. One is that the maximum pin diameter is greater than the hole diameter, resulting in the pin being able to insert only partially in the longitudinal direction and not fully. The other is that the maximum pin diameter is less than the hole diameter, resulting in the pin being relatively thin, and even if inserted into the hole, it cannot form good electrical contact with the inner surface of the hole, that is, when the pin is inserted into the hole, the pin will be relatively loose, resulting in poor contact.

[0027] Step 5. When the diameter difference between the pin and the hole is greater than the diameter difference error, whether the maximum diameter of the pin is smaller than the hole diameter or the maximum diameter of the pin is larger than the hole diameter, the chip and the motherboard are installed so that the pin is inserted into the hole. In this state, the contact area between the pin and the inner surface of the hole is obtained. At the same time, the contact area threshold is set, and the contact area is compared with the contact area threshold. Different responses are obtained based on the comparison results. If the contact area is greater than or equal to the contact area threshold, it means that the contact area between the pin and the hole is large, and there is no physical contact between the two, thereby ensuring good electrical contact. In this case, the pin diameter detection is changed to qualified. If the contact area is less than the contact area threshold, it means that the contact area between the pin and the hole is small, and the physical contact between the two is insufficient, and good electrical contact cannot be guaranteed. In this case, the pin diameter detection remains unqualified. This is because when the diameter difference between the pin and the hole is greater than the set diameter difference error, although the pin size appears to be too small or too large, there is a certain amount of loose space or it cannot be fully inserted, which may theoretically lead to insufficient physical contact between the pin and the inner surface of the hole, thereby affecting the stability and reliability of the electrical connection, but in actual applications, the contact area between the pin and the hole often determines the quality of the electrical contact. If the contact area is measured to be larger after the chip and motherboard are assembled and installed, it means that although the pin diameter is smaller or larger, the pin and the inner wall of the hole can still form a sufficient contact interface through mechanical deformation, elastic contact or other structural characteristics, ensuring the reliability of electrical conduction and the stability of mechanical fixation. At this time, although the diameter of such pins does not strictly match the hole size, it can still meet the functional requirements in actual use. Therefore, it is judged that the pin diameter test is qualified, which reflects the flexible adaptability and tolerance of the test standard to actual performance. For example, assuming that the diameter of the motherboard chip installation hole is 0.50mm, the diameter difference error is set to 0.05mm. If the maximum diameter of the pin is detected to be 0.44mm, the diameter difference is 0.44mm minus 0.50mm, and the absolute value is 0.06mm, which is greater than the diameter difference error of 0.05mm. At this time, the pin is thin and there is a risk of loosening. By measuring the contact area between the pin and the inner surface of the hole after actual assembly, if the contact area is, for example, 3.0 square millimeters (the threshold is set to 2.5 square millimeters), it means that although the size difference is significant, the pin surface has sufficient contact with the hole wall, and a stable connection is maintained through mechanical stress distribution or elastic deformation, ensuring good electrical contact. At this time, the pin diameter test is judged to be qualified; on the contrary, if the contact area is, for example, 1.5 square millimeters, which is far below the threshold of 2.5 square millimeters, then the contact is insufficient and the test is maintained unqualified.

[0028] Step 6. When the maximum diameter of the pin is greater than the diameter of the hole, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, and the pin diameter detection is also qualified, maintain the installation of the chip and the motherboard. Then, place the motherboard on the desktop to keep the motherboard in a horizontal position. Take the motherboard as the X-axis, and measure the angle between the X-axis and the top plane of the chip through a sensor, which is recorded as the tilt angle. At the same time, set the tilt angle threshold, compare the tilt angle with the tilt angle threshold, and obtain different responses according to the comparison result. If the tilt angle is less than or equal to the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is small. When installing a radiator to dissipate heat from the chip, the heat conduction fin at the bottom of the radiator can have good contact with the top plane of the chip. In this case, when the maximum diameter of the pin is greater than the diameter of the hole, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, maintain the qualified detection of the pin diameter. If the tilt angle is greater than the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is large. When installing a radiator to dissipate heat from the chip, the heat conduction fin at the bottom of the radiator cannot have good contact with the top plane of the chip. In this case, when the maximum diameter of the pin is greater than the diameter of the hole, even if the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter detection is unqualified. This is because the chip itself needs a radiator to dissipate heat, and the top plane of the chip needs to be flat to form good contact with the heat conduction fin at the bottom of the radiator after applying thermal grease, so as to be effectively cooled. If the top plane of the chip is uneven or tilted, it cannot make good contact with the heat conduction fin at the bottom of the radiator. In this application, when the maximum diameter of the pin is greater than the diameter of the hole, it will itself cause the problem that the pin cannot be fully inserted into the hole, making the installation of the chip and the motherboard not a perfect horizontal installation. Therefore, after the contact area detection, it is necessary to detect whether the tilt of the top plane of the chip will affect the installation of the radiator according to the relative installation position of the chip and the motherboard in this case. Therefore, the tilt angle of the top plane of the chip pointed out here is not the flatness of the top of the chip itself, but the tilt angle of the chip relative to the motherboard regarded as the X-axis after the chip and the motherboard are installed when the maximum diameter of the pin is greater than the diameter of the hole. And in the case where the maximum diameter of the pin is less than the diameter of the hole, since the chip can be perfectly installed with the motherboard, there is no need to perform subsequent tilt angle detection. For example, assume that the diameter of the chip installation hole is 0.50 mm, the diameter difference error is set to 0.02 mm, the contact area threshold is 2.5 square millimeters, and the tilt angle threshold is 1.5 degrees. If the maximum diameter of the pin is detected to be 0.53 mm, then the diameter difference is 0.03 mm. The diameter difference of 0.03 mm is greater than the diameter difference error of 0.02 mm, but the actually measured contact area is 3.0 square millimeters, which is greater than the contact area threshold of 2.5 square millimeters. It is preliminarily determined that the pin diameter detection is qualified.Subsequently, keep the chip installed on the motherboard, place the motherboard on a horizontal tabletop, measure the angle between the top plane of the chip and the motherboard with a sensor, and obtain an inclination angle of 1.2 degrees, which is less than the inclination angle threshold of 1.5 degrees. This indicates that the chip is tilted relatively little with respect to the motherboard, and the heat sink can make good contact with the top plane of the chip, ensuring effective heat dissipation and ultimately maintaining the qualified pin diameter detection. However, if the inclination angle is 2.0 degrees, exceeding the inclination angle threshold, it means that the chip is significantly tilted during installation, and the heat sink cannot achieve sufficient contact, affecting the heat dissipation effect. Even though the contact area is qualified, the pin diameter detection is still judged as unqualified. In contrast, if the maximum diameter of the pin is smaller than the hole diameter (e.g., 0.46 mm), the chip can be installed normally horizontally without the need for inclination angle detection, simplifying the process.

[0029] It should be noted that the thresholds used in the above steps need to be scientifically determined according to the design requirements of the device, manufacturing processes, product reliability requirements, and actual test data. The specific parameter thresholds such as the vertical and horizontal pin error threshold set to 1 mm, the curvature threshold to 0.05 mm, and the inclination angle threshold of 1.5 degrees listed in the above embodiments should also be adjusted according to the actual design specifications and process drawings used. For example, the designed dimensions of the chip pins and the allowable process tolerances are usually clearly specified in the design stage. The design specifications will give the standard pitch, dimensions, and curvature requirements of the pins, which provide a basis for initially setting the "vertical and horizontal pin error threshold", "curvature threshold", "diameter difference error", etc. Also, the hole dimensions, tolerance ranges, and material properties on the motherboard need to be referred to. By statistically detecting a large number of samples, the size distribution and error range in actual production can be determined. For example, the distribution of the actual pitch of the horizontal and vertical pins measured in mass production can be used to set the tolerance range of the vertical and horizontal errors, aiming to distinguish the situations that deviate abnormally from the normal process fluctuations. At the same time, international and industry standards and empirical data can also be referred to. There are already mature industry standards in many semiconductor packaging and PCB manufacturing fields, such as JEDEC standards or IPC standards, etc., which stipulate the dimensions, pitch, curvature, and installation accuracy, and can be used as important references for determining the thresholds, and the historical data and reliability reports of the same type of products can be referred to optimize these parameters.

[0030] In the embodiments disclosed by the present invention, the processes described above with reference to the flowcharts can be implemented as computer software programs. The embodiments disclosed by the present invention include a computer program product, which includes a computer program carried on a computer-readable medium. The computer program contains program codes for executing the methods shown in the flowcharts. In such an embodiment, the computer program can be downloaded and installed from a network through a communication part, and / or installed from a removable medium. When the computer program is executed by a central processing unit, the above-mentioned functions defined in the methods of the present application are executed. It should be noted that the above-mentioned computer-readable medium in the present application can be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of a computer-readable storage medium can include, but are not limited to: an electrical connection with one or more wire segments, a portable computer disk, a hard disk, a random access memory, a read-only memory, an erasable programmable read-only memory, an optical fiber, a portable compact disk read-only memory, an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or combined with an instruction execution system, apparatus, or device. In the present application, a computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries computer-readable program codes. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, and this computer-readable medium can send, propagate, or transmit a program for use by or combined with an instruction execution system, apparatus, or device. The program codes contained on a computer-readable medium can be transmitted by any suitable medium, including but not limited to: wireless segments, wire segments, optical cables, RF, etc., or any suitable combination of the above.

[0031] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that, in some alternative implementations, the functions denoted in the blocks may occur in a different order than that denoted in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and combinations of blocks in the block diagram and / or flowchart, may be implemented by a dedicated hardware-based system that performs the specified functions or operations, or may be implemented by a combination of dedicated hardware and computer instructions.

[0032] Those skilled in the art should understand that the above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present application should be covered by the protection scope of the present application.

Claims

1. A data processing method for integrated circuit detection, characterized in that, Including: Step 1: Obtain the distances between each pin and its nearby pins. Denote the distance between a pin and its longitudinally nearby pins as the longitudinal pin distance, and the distance between it and its transversely nearby pins as the transverse pin distance. After adding up all the transverse pin distances and taking the average, the average transverse pin distance is obtained. Similarly, the average longitudinal pin distance is obtained. Subtract the average longitudinal pin distance from the average transverse pin distance to get the longitudinal and transverse pin error; Step 2: Set the longitudinal and transverse pin error threshold according to the parameter requirements. Compare the longitudinal and transverse pin error with the longitudinal and transverse pin error threshold. If the longitudinal and transverse pin error is less than or equal to the longitudinal and transverse pin error threshold, it means that the distances between the pins in the transverse and longitudinal directions are consistent. In this case, the pin distance detection of the chip is qualified; if the longitudinal and transverse pin error is greater than the longitudinal and transverse pin error threshold, it means that the distances are inconsistent. In this case, the pin distance detection of the chip is unqualified; Step 3: Obtain the curvature of each pin of the chip and set the curvature threshold. Compare the curvature of each pin with the curvature threshold respectively. If the curvature of a pin is less than or equal to the curvature threshold, it means that the curvature of this pin is within the standard range. In this case, the curvature detection of this pin is qualified; if the curvature of a pin is greater than the curvature threshold, it means that the curvature of this pin exceeds the standard range. In this case, the curvature detection of this pin is unqualified. Only when the curvature detections of all pins are qualified, the curvature detection of the chip's pins is qualified; Step 4: If there are pins with unqualified curvature detections, obtain the number of pins with unqualified curvature detections, denoted as the number of pins with unqualified curvature; Step 5: Set the tolerance threshold for the number of pins with unqualified curvature. Compare the number of pins with unqualified curvature with the tolerance threshold for the number of pins with unqualified curvature. If the number of pins with unqualified curvature is less than or equal to the tolerance threshold for the number of pins with unqualified curvature, it means that the number of pins with unqualified curvature is within the tolerance limit. In this case, analyze the curvature degree of the pins with unqualified curvature again to determine whether the pins can be inserted into the holes on the main board; if the number of pins with unqualified curvature is greater than the tolerance threshold for the number of pins with unqualified curvature, it means that the number of pins with unqualified curvature exceeds the tolerance limit. In this case, maintain the unqualified curvature detection of the chip's pins.

2. The data processing method for integrated circuit detection according to claim 1, characterized in that, When analyzing again, set the maximum curvature of the pins that can be accepted for insertion into the holes according to the parameter information of the holes on the main board for installing the chip's pins. Under this condition, compare the curvatures of all pins with unqualified curvature with the maximum curvature respectively, and obtain different responses according to the comparison results.

3. The data processing method for integrated circuit detection according to claim 2, characterized in that If the curvatures of all pins with unqualified curvature are less than or equal to the maximum curvature, it means that although all pins with unqualified curvature have curvature, it does not affect the installation on the main board. In this case, the curvature detection of the chip's pins is qualified; if the curvatures of all pins with unqualified curvature are not all less than or equal to the maximum curvature, it means that among all pins with unqualified curvature, there are pins with large curvature that cannot be inserted into the holes at the chip installation location on the main board. In this case, the curvature detection of the chip's pins is unqualified.

4. The data processing method for integrated circuit detection according to claim 3, wherein When the detection of the pin distance and the pin bend are both qualified, obtain the hole diameter at the chip mounting location on the main board. At the same time, obtain the diameter of the top of the pin, denoted as the maximum pin diameter. Subtract the hole diameter from the maximum pin diameter and take the positive value to get the diameter difference. At the same time, set the diameter difference error, compare the diameter difference with the diameter difference error, and obtain different responses according to the comparison result.

5. The data processing method for integrated circuit detection according to claim 4, characterized in that If the diameter difference between the pin and the hole is less than or equal to the diameter difference error, it means that the maximum pin diameter is the same as the hole diameter, and the pin can be perfectly inserted into the hole. In this case, the pin diameter detection is qualified. If the diameter difference between the pin and the hole is greater than the diameter difference error, it means that there is a gap between the maximum pin diameter and the hole diameter, and the pin cannot be perfectly inserted into the hole. In this case, the pin diameter detection is unqualified.

6. The data processing method for integrated circuit detection according to claim 5, wherein, When the diameter difference between the pin and the hole is greater than the diameter difference error, whether the maximum pin diameter is less than the hole diameter or the maximum pin diameter is greater than the hole diameter, install the chip on the main board so that the pin is inserted into the hole. In this state, obtain the contact area between the pin and the inner surface of the hole. At the same time, set the contact area threshold, compare the contact area with the contact area threshold, and obtain different responses according to the comparison result.

7. The data processing method for integrated circuit detection according to claim 6, wherein If the contact area is greater than or equal to the contact area threshold, it means that the contact area between the pin and the hole is large, and there is no insufficient physical contact between them. In this case, the pin diameter detection is changed to qualified. If the contact area is less than the contact area threshold, it means that the contact area between the pin and the hole is small, and there is insufficient physical contact between them. In this case, the pin diameter detection remains unqualified.

8. The data processing method for integrated circuit detection according to claim 7, wherein When the maximum pin diameter is greater than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold and the pin diameter detection is also qualified, keep the chip installed on the main board, then place the main board on the table so that the main board is in a horizontal position. Take the main board as the X-axis, and measure the angle between the X-axis and the top plane of the chip through a sensor, denoted as the tilt angle. At the same time, set the tilt angle threshold, compare the tilt angle with the tilt angle threshold. If the tilt angle is less than or equal to the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the main board is small. In this case, when the maximum pin diameter is greater than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, maintain the qualified pin diameter detection. If the tilt angle is greater than the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the main board is large. In this case, when the maximum pin diameter is greater than the hole diameter, even if the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter detection is unqualified.

9. A data processing system for integrated circuit detection, which is used to execute the method described in any one of claims 1-8, characterized in that, Including: A pin distance acquisition module, which is used to acquire the distance between each pin and its nearby pins, record the distance between it and the longitudinally nearby pins as the longitudinal pin distance, and the distance between it and the laterally nearby pins as the lateral pin distance. After adding all the lateral pin distances and taking the average value, the average lateral pin distance is obtained. Similarly, the average longitudinal pin distance is obtained. The vertical and horizontal pin error is obtained by subtracting the average longitudinal pin distance from the average lateral pin distance; A pin distance comparison module, which is used to set the vertical and horizontal pin error threshold according to the parameter requirements, compare the vertical and horizontal pin error with the vertical and horizontal pin error threshold. If the vertical and horizontal pin error is less than or equal to the vertical and horizontal pin error threshold, it means that the distances between the pins in the horizontal and vertical directions are consistent. In this case, the pin distance detection of the chip is qualified; if the vertical and horizontal pin error is greater than the vertical and horizontal pin error threshold, it means that the distances are inconsistent. In this case, the pin distance detection of the chip is unqualified; A pin bending comparison module, which is used to acquire the bending degree of each pin of the chip and set the bending degree threshold, and compare the bending degree of each pin with the bending degree threshold respectively. If the bending degree of the pin is less than or equal to the bending degree threshold, it means that the bending degree of this pin is within the standard range. In this case, the bending degree detection of this pin is qualified; if the bending degree of the pin is greater than the bending degree threshold, it means that the bending degree of this pin exceeds the standard range. In this case, the bending degree detection of this pin is unqualified. Only when the bending degree detections of all pins are qualified, the pin bending degree detection of the chip is qualified; A pin bending unqualified acquisition module, which is used to acquire the number of pins with unqualified bending degree detection when there are pins with unqualified bending degree detection, and record it as the pins with unqualified bending degree; A pin bending unqualified comparison module, which is used to set the tolerance threshold for pins with unqualified bending degree according to the parameter information, and compare the pins with unqualified bending degree with the tolerance threshold for pins with unqualified bending degree. If the pins with unqualified bending degree are less than or equal to the tolerance threshold for pins with unqualified bending degree, it means that the number of pins with unqualified bending degree is within the tolerance limit. In this case, analyze the bending degree of the pins with unqualified bending degree again to judge whether the pins can be inserted into the holes of the main board; if the pins with unqualified bending degree are greater than the tolerance threshold for pins with unqualified bending degree, it means that the number of pins with unqualified bending degree exceeds the tolerance limit. In this case, maintain the unqualified pin bending degree detection of the chip.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the data processing method for integrated circuit detection described in any one of claims 1-8 above.

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