A data processing method and system for integrated circuit detection

Abstract

The present invention relates to the field of chip detection technology and discloses a data processing method and system for integrated circuit detection. The present invention ensures the geometric stability of the chip pin arrangement by controlling the horizontal and vertical errors of the pin spacing; secondly, it introduces a pin curvature detection and tolerance mechanism, taking into account both manufacturing tolerances and actual assembly requirements, and avoiding unnecessary scrapping due to minor deformation; then, combined with the matching of the pin and the motherboard hole size and the determination of the contact area, it comprehensively evaluates the adequacy of mechanical and electrical contact, especially judging the insertion status by the difference between the maximum diameter of the pin and the hole diameter, to ensure the tightness and stability of the connection; finally, in response to the chip tilt problem caused by the maximum diameter of the pin being larger than the hole diameter, the tilt angle measurement is used to further ensure good contact conditions between the top plane of the chip and the heat sink, ensuring that the heat dissipation performance is not affected.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and in particular to a data processing method and system for integrated circuit detection. Background Art

[0002] Integrated circuit testing is used to ensure chip performance and reliability. The testing process mainly includes three stages: wafer-level testing, pre-packaging testing, and post-packaging testing.

[0003] Wafer-level inspection primarily detects physical and process defects in chips, determining whether a chip is defective based on its appearance. Pre-packaging inspection primarily tests the chip's electrical characteristics to ensure that its performance meets standards. Post-packaging inspection primarily examines the chip's performance in actual operating environments to ensure its durability and stability.

[0004] Although the chip can be directly tested for normal operation through performance testing after packaging, the detection of physical defects after packaging should not be ignored. This is because chip packaging is equivalent to adding structures to the chip itself, and these structures are connected to the chip. Therefore, these additional structures and whether the connection between the structure and the chip is normal also need to be tested. Summary of the Invention

[0005] In view of the problems existing in the above-mentioned prior art, the object of the present invention is to provide a data processing method and system for integrated circuit detection, so as to be able to detect the chips of the integrated circuit.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: A data processing method for integrated circuit detection, comprising: step 1, obtaining the distance between each pin and its neighboring pins, recording the distance between the pin and the neighboring pins in the longitudinal direction as the longitudinal pin distance, and recording the distance between the pin and the neighboring pins in the transverse direction as the transverse pin distance, adding up all the transverse pin distances and taking the average value thereof to obtain the average transverse pin distance, similarly obtaining the average longitudinal pin distance, and subtracting the average longitudinal pin distance from the average transverse pin distance to obtain the longitudinal and transverse pin errors; step 2, setting longitudinal and transverse pin error thresholds according to parameter requirements, comparing the longitudinal and transverse pin errors with the longitudinal and transverse pin error thresholds, if the longitudinal and transverse pin errors are less than or equal to the longitudinal and transverse pin error thresholds, it means that the distances between the pins in the transverse and longitudinal directions are consistent, in which case the pin distance detection of the chip passes; if the longitudinal and transverse pin errors are greater than the longitudinal and transverse pin error thresholds, it means that the distances are inconsistent, in which case the pin distance detection of the chip fails; step 3, obtaining the curvature of each pin of the chip, and setting a curvature threshold, comparing the curvature of each pin with the curvature threshold respectively, if the curvature of the pin If the curvature of the pin is less than or equal to the curvature threshold, it means that the curvature of the pin is within the standard range. In this case, the curvature test of the pin is qualified. If the curvature of the pin is greater than the curvature threshold, it means that the curvature of the pin exceeds the standard range. In this case, the curvature test of the pin fails. The curvature test of the chip pins passes only when and only when the curvature test of all pins passes. Step 4: If there are pins that fail the curvature test, the number of pins that fail the curvature test is obtained and recorded as pins with unqualified curvature. Step 5: Set a tolerance threshold for unqualified curvature pins and compare the number of unqualified curvature pins with the tolerance threshold. If the number of unqualified curvature pins is less than or equal to the tolerance threshold, it means that the number of unqualified curvature pins is within the tolerance limit. In this case, the curvature degree of the unqualified curvature pins is analyzed again to determine whether the pins can be plugged into the holes of the motherboard. If the number of unqualified curvature pins is greater than the tolerance threshold, it means that the number of unqualified curvature pins exceeds the tolerance limit. In this case, the chip pin curvature test fails.

[0007] In some embodiments, during re-analysis, the maximum curvature of the pin that can be inserted into the hole is set based on the parameter information of the hole for installing the chip pin on the motherboard. Under this condition, the curvature of all pins with unqualified curvature is compared with the maximum curvature again, and different responses are obtained based on the comparison results.

[0008] In some embodiments, if the curvature of all pins with unqualified curvature is less than or equal to the maximum curvature, it means that although all pins with unqualified curvature are bent, it does not affect the installation on the motherboard. In this case, the chip pin curvature test is qualified; if the curvature of all pins with unqualified curvature is not less than or equal to the maximum curvature, it means that among all pins with unqualified curvature, there are pins with large curvature and cannot be inserted into the holes at the chip installation location on the motherboard. In this case, the chip pin curvature test is unqualified.

[0009] In some embodiments, when the pin distance and pin curvature tests are both qualified, the hole diameter at the chip installation location on the motherboard is obtained, and at the same time, the diameter of the pin top is obtained and recorded as the maximum pin diameter. The diameter difference is obtained by subtracting the hole diameter from the maximum pin diameter and taking the positive value. At the same time, a diameter difference error is set, and the diameter difference is compared with the diameter difference error, and different responses are obtained based on the comparison results.

[0010] In some embodiments, if the diameter difference between the pin and the hole is less than or equal to the diameter difference error, it means that the maximum diameter of the pin is the same as the hole diameter, and the pin can be perfectly inserted into the hole. In this case, the pin diameter test is qualified; if the diameter difference between the pin and the hole is greater than the diameter difference error, it means that there is a gap between the maximum diameter of the pin and the hole diameter, and the pin cannot be perfectly inserted into the hole. In this case, the pin diameter test is unqualified.

[0011] In some embodiments, when the diameter difference between the pin and the hole is greater than the diameter difference error, regardless of whether the maximum diameter of the pin is smaller than the hole diameter or the maximum diameter of the pin is larger than the hole diameter, the chip is mounted on the motherboard so that the pin is inserted into the hole. In this state, the contact area between the pin and the inner surface of the hole is obtained. At the same time, a contact area threshold is set, and the contact area is compared with the contact area threshold, and different responses are obtained based on the comparison results.

[0012] In some embodiments, if the contact area is greater than or equal to the contact area threshold, it means that the contact area between the pin and the hole is large and there is no physical contact between the two. In this case, the pin diameter test is changed to qualified; if the contact area is less than the contact area threshold, it means that the contact area between the pin and the hole is small and there is insufficient physical contact between the two. In this case, the pin diameter test remains unqualified.

[0013] In some embodiments, when the maximum diameter of the pin is larger than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, so that the pin diameter detection is also qualified, the chip and the motherboard are kept installed, and then the motherboard is placed on the table, so that the motherboard is kept in a horizontal position, and the motherboard is used as the X-axis. The angle between the X-axis and the top plane of the chip is measured by the sensor, which is recorded as the tilt angle. At the same time, a tilt angle threshold is set, and the tilt angle is compared with the tilt angle threshold; if the tilt angle is less than or equal to the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is small. In this case, when the maximum diameter of the pin is larger than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter detection is maintained to be qualified; if the tilt angle is greater than the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is large. In this case, when the maximum diameter of the pin is larger than the hole diameter, even if the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter detection is unqualified.

[0014] The present invention further provides a data processing system for integrated circuit testing, which is used to execute the above-mentioned method, including: a pin distance acquisition module, which is used to obtain the distance between each pin and its neighboring pins, recording the distance between the pin and the neighboring pins in the longitudinal direction as the longitudinal pin distance, and recording the distance between the pin and the neighboring pins in the transverse direction as the transverse pin distance, adding up all the transverse pin distances and taking the average value thereof to obtain the average transverse pin distance, and similarly obtaining the average longitudinal pin distance, and subtracting the average longitudinal pin distance from the average transverse pin distance to obtain the longitudinal and transverse pin errors; a pin distance comparison module, which is used to set longitudinal and transverse pin error thresholds according to parameter requirements, and compare the longitudinal and transverse pin errors with the longitudinal and transverse pin error thresholds. If the longitudinal and transverse pin errors are less than or equal to the longitudinal and transverse pin error thresholds, it means that the distances between the pins in the transverse and longitudinal directions are consistent, in which case the pin distance test of the chip passes; if the longitudinal and transverse pin errors are greater than the longitudinal and transverse pin error thresholds, it means that the distances are inconsistent, in which case the pin distance test of the chip fails; a pin bend comparison module, which is used to obtain the bend of each pin of the chip and set a bend threshold, and compare the bend of each pin with the bend threshold respectively. If the bend of the pin is less than or equal to the longitudinal and transverse pin error thresholds, it means that the distances between the pins in the transverse and longitudinal directions are consistent, in which case the pin distance test of the chip fails. If the curvature of the pin is greater than the curvature threshold, it means that the curvature of the pin is within the standard range. In this case, the curvature test of the pin is qualified; if the curvature of the pin is greater than the curvature threshold, it means that the curvature of the pin exceeds the standard range. In this case, the curvature test of the pin is unqualified. If and only if the curvature test of all pins is qualified, the curvature test of the pins of the chip is qualified; the pin bending unqualified acquisition module is used to obtain the number of pins that fail the curvature test when there are pins that fail the curvature test, and record them as curvature unqualified pins; the pin bending unqualified comparison module is used to compare the number of pins that fail the curvature test according to the parameter information. The tolerance threshold for the unqualified bend pins is set according to the information, and the number of unqualified bend pins is compared with the tolerance threshold. If the number of unqualified bend pins is less than or equal to the tolerance threshold, it means that the number of unqualified bend pins is within the tolerance limit. In this case, the degree of bending of the unqualified bend pins is analyzed again to determine whether the pins can be plugged into the holes of the motherboard; if the number of unqualified bend pins is greater than the tolerance threshold, it means that the number of unqualified bend pins exceeds the tolerance limit. In this case, the pin bending test of the chip is maintained as unqualified.

[0015] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the above-mentioned data processing method for integrated circuit detection.

[0016] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0017] The method provided by the present invention effectively improves the accuracy and reliability of the assembly of integrated circuit chips and motherboards through multi-step, multi-dimensional comprehensive detection. First, the geometric stability of the chip pin arrangement is ensured by controlling the horizontal and vertical errors of the pin spacing; secondly, a detection and tolerance mechanism for the pin curvature is introduced, taking into account both manufacturing tolerances and actual assembly requirements, to avoid unnecessary scrapping due to minor deformations; then, combined with the matching of the pin and the motherboard hole size and the determination of the contact area, the adequacy of the mechanical and electrical contact is comprehensively evaluated, especially the insertion state is judged by the difference between the maximum diameter of the pin and the hole diameter to ensure the tightness and stability of the connection; finally, for the chip tilt problem caused by the maximum diameter of the pin being greater than the hole diameter, the tilt angle measurement is used to further ensure good contact conditions between the top plane of the chip and the heat sink, ensuring that the heat dissipation performance is not affected. The entire method not only strictly controls the size and shape parameters and pays attention to the actual contact situation, but also introduces a flexible tolerance threshold and a multi-parameter linkage judgment strategy, which significantly improves the scientificity and applicability of the detection, effectively prevents electrical failures and poor heat dissipation caused by size errors and deformation, and ensures the stable performance of the chip during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the method steps of the present invention;

[0019] Figure 2 Schematic diagram of the system module of the present invention. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0022] The data processing method for integrated circuit detection provided by the present invention is as follows: Figure 1 and Figure 2 Shown, including:

[0023] The first step involves using sensors to measure the distance between each pin on the bottom of the chip and the adjacent pins. Each pin is located near more than one pin, with at least one pin located laterally and one pin located vertically. The distance between each pin and its adjacent pin is recorded as the lateral pin distance, and the distance between each pin and its adjacent pin is recorded as the vertical pin distance. The average of all lateral pin distances is added together to obtain the average lateral pin distance. The average of all vertical pin distances is added together to obtain the average vertical pin distance. The average vertical pin distance is subtracted from the average lateral pin distance to obtain the horizontal and vertical pin error. Furthermore, a horizontal and vertical pin error threshold is set according to parameter requirements. The horizontal and vertical pin error is compared with the horizontal and vertical pin error threshold, and different responses are determined based on the comparison results. If the horizontal and vertical pin error is less than or equal to the horizontal and vertical pin error threshold, the horizontal and vertical pin distances between the pins on the bottom of the chip remain consistent. In this case, the chip passes the pin distance test. If the horizontal and vertical pin error is greater than the horizontal and vertical pin error threshold, the horizontal and vertical pin distances between the pins on the bottom of the chip do not match. In this case, the chip fails the pin distance test.

[0024] In the second step, once the chip's pins have passed preliminary testing, the curvature of each pin is measured. A curvature threshold is set based on the parameter requirements. The curvature of each pin is then compared to the threshold, and different responses are determined based on the comparison results. If the pin's curvature is less than or equal to the threshold, it means the pin's curvature is within the standard range, and the test passes. If the pin's curvature is greater than the threshold, it means the pin's curvature exceeds the standard range, and the test fails. The chip's pin curvature test passes only if all pins pass the curvature test.

[0025] In the third step, if not all pins pass the curvature test, the number of pins that fail the curvature test is determined and recorded as "curvature-unqualified pins." A tolerance threshold for curvature-unqualified pins is set, and the number of curvature-unqualified pins is compared with the tolerance threshold. Different responses are determined based on the comparison results. If the number of curvature-unqualified pins is less than or equal to the tolerance threshold, the number of curvature-unqualified pins is within the tolerance limit. In this case, the degree of curvature of the curvature-unqualified pins is re-analyzed. If the number of curvature-unqualified pins is greater than the tolerance threshold, the number of curvature-unqualified pins exceeds the tolerance limit. In this case, the chip pin curvature test remains unqualified. During the re-analysis, the maximum curvature that can be accepted by the pins is set based on the parameters of the holes on the motherboard used to mount the chip pins. Under this condition, the curvature of all curvature-unqualified pins is compared with the maximum curvature, and different responses are determined based on the comparison results. If the curvature of all unqualified pins is less than or equal to the maximum curvature, this means that although all the unqualified pins are bent, they do not affect motherboard mounting. In this case, the chip passes the pin curvature test. If the curvature of all unqualified pins is not less than or equal to the maximum curvature, this means that some of the unqualified pins are too bent to fit into the chip mounting holes on the motherboard. In this case, the chip fails the pin curvature test. For example, a packaged chip has 100 pins on its bottom. The sensor measures the total horizontal pin distance as 950 mm and the total vertical pin distance as 1000 mm. Therefore, the average horizontal pin distance is 950 ÷ 100 = 9.5 mm, and the average vertical pin distance is 1000 ÷ 100 = 10 mm. The calculated horizontal and vertical pin error is 9.5 mm - 10 mm = -0.5 mm. Assuming the horizontal and vertical pin error threshold is set to 1 mm, since the error of 0.5 mm ≤ 1 mm, the chip passes the pin distance test. Then the curvature of each pin was tested, and it was found that the curvatures of 3 pins were 0.08 mm, 0.09 mm and 0.1 mm respectively, and the curvatures of the other 97 pins were less than or equal to 0.05 mm. The curvature threshold was set to 0.05 mm, and the curvature test of the 3 pins with curvature exceeding the standard failed. The number of pins with unqualified curvature is 3. If the tolerance threshold of the pins with unqualified curvature is 5, 3≤5, the maximum allowable curvature of these 3 pins is further tested. Assuming that the maximum allowable curvature of the motherboard hole is 0.1 mm, the 3 unqualified pins are 0.08 mm, 0.09 mm and 0.1 mm respectively, all ≤0.1 mm. Therefore, although some pins are bent beyond the standard, it does not affect the installation, and the chip pin curvature test is finally qualified.

[0026] The fourth step is to obtain the hole diameter of the chip installation on the motherboard when both the pin distance and pin curvature tests are qualified. At the same time, since the pin shape is usually a cone that becomes increasingly pointed from top to bottom, the diameter of the top of the pin, that is, the maximum diameter of the pin, is obtained. The diameter difference is obtained by subtracting the hole diameter from the maximum diameter of the pin and taking its positive value. At the same time, the diameter difference error is set according to the parameter requirements, and the diameter difference is compared with the diameter difference error. Different responses are obtained based on the comparison results. If the diameter difference between the pin and the hole is less than or equal to the diameter difference error, it means that the maximum diameter of the pin is basically the same as the hole diameter, and the pin can be perfectly inserted into the hole. In this case, the pin diameter test is qualified. If the diameter difference between the pin and the hole is greater than the diameter difference error, it means that there is a gap between the maximum diameter of the pin and the hole diameter, and the pin cannot be perfectly inserted into the hole. In this case, the pin diameter test fails. When the diameter difference between the pin and the hole is greater than the diameter difference error, there are two situations in which the pin cannot be perfectly inserted into the hole. One is that the maximum diameter of the pin is larger than the hole diameter, resulting in the pin being able to be partially inserted in the longitudinal direction but not fully inserted. The other is that the maximum diameter of the pin is smaller than the hole diameter, resulting in the pin being relatively thin. Even if inserted into the hole, it cannot form good electrical contact with the inner surface of the hole. That is, when the pin is inserted into the hole, the pin will be relatively loose, resulting in poor contact.

[0027] Step 5: When the diameter difference between the pin and the hole is greater than the diameter difference error, regardless of whether the pin's maximum diameter is smaller than the hole's diameter or larger than the hole's diameter, the chip is mounted on the motherboard, with the pin inserted into the hole. In this state, the contact area between the pin and the inner surface of the hole is obtained. A contact area threshold is set, and the contact area is compared with the contact area threshold. Different responses are taken based on the comparison result. If the contact area is greater than or equal to the contact area threshold, it indicates that the contact area between the pin and the hole is large, and physical contact is not insufficient between the two, thus ensuring good electrical contact. In this case, the pin diameter test is changed to qualified. If the contact area is less than the contact area threshold, it indicates that the contact area between the pin and the hole is small, and physical contact is insufficient between the two, which cannot ensure good electrical contact. In this case, the pin diameter test remains unqualified. This is because when the diameter difference between the pin and the hole is greater than the set diameter difference error, while the pin may appear to be undersized or oversized, with some loose space or inability to fully insert, theoretically resulting in insufficient physical contact between the pin and the inner surface of the hole, thus affecting the stability and reliability of the electrical connection, in practice, the contact area between the pin and the hole often determines the quality of the electrical contact. If the contact area is larger after the chip and motherboard are assembled, it means that despite the smaller or larger pin diameter, the pin and the inner wall of the hole can still form a sufficient contact interface through mechanical deformation, elastic contact, or other structural characteristics, ensuring reliable electrical conduction and stable mechanical fixation. In this case, although the diameter of such a pin does not strictly match the hole size, it still meets the functional requirements in actual use. Therefore, the pin diameter test is determined to pass, reflecting the test standard's flexible adaptability and tolerance to actual performance. For example, suppose the diameter of the motherboard chip mounting hole is 0.50mm, and the diameter difference error is set to 0.05mm. If the maximum pin diameter detected is 0.44mm, and the diameter difference is 0.44mm minus 0.50mm, the absolute value is 0.06mm, which is greater than the diameter difference error of 0.05mm. In this case, the pin is thin and there is a risk of loosening. After actual assembly, the contact area between the pin and the inner surface of the hole is measured. If the contact area is, for example, 3.0 square millimeters (with a threshold of 2.5 square millimeters), it means that despite the significant size difference, the pin surface has sufficient contact with the hole wall. Mechanical stress distribution or elastic deformation maintains a stable connection, ensuring good electrical contact. In this case, the pin diameter test is considered to have passed. Conversely, if the contact area is, for example, 1.5 square millimeters, far below the threshold of 2.5 square millimeters, it indicates insufficient contact and the test remains unqualified.

[0028] Step 6: When the maximum pin diameter is larger than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, so that the pin diameter test is also qualified, keep the chip and motherboard installed, then place the motherboard on the table, keep it in a horizontal position, use the motherboard as the X-axis, and use the sensor to measure the angle between the X-axis and the top plane of the chip, which is recorded as the tilt angle. At the same time, set the tilt angle threshold, compare the tilt angle with the tilt angle threshold, and make different responses based on the comparison results. If the tilt angle is less than or equal to the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is small. When the heat sink is installed to dissipate heat from the chip, the thermal pad at the bottom of the heat sink can have good contact with the top plane of the chip. In this case, when the maximum pin diameter is larger than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter test is maintained. If the tilt angle is greater than the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is large. When a heat sink is installed to dissipate heat for the chip, the thermal pad at the bottom of the heat sink cannot make good contact with the top plane of the chip. In this case, when the maximum diameter of the pin is greater than the hole diameter, even if the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter test will fail. This is because the chip itself requires a heat sink for heat dissipation, and the top plane of the chip needs to be flat in order to form good contact with the thermal pad at the bottom of the heat sink after applying thermal grease, so that the heat can be effectively dissipated. If the top plane of the chip is uneven, or tilted, it cannot make good contact with the thermal pad at the bottom of the heat sink. In the present application, when the maximum diameter of the pin is larger than the hole diameter, it will cause the problem that the pin cannot be fully inserted into the hole, so that the installation of the chip and the motherboard is not perfectly horizontal. Therefore, after the contact area detection, it is necessary to detect whether the inclination of the top plane of the chip will affect the installation of the heat sink based on the relative installation position of the chip and the motherboard in this case. Therefore, the inclination angle of the top plane of the chip mentioned here is not the flatness of the top of the chip itself, but the inclination angle of the chip relative to the motherboard as the X-axis after the chip and the motherboard are installed when the maximum diameter of the pin is larger than the hole diameter. In the case where the maximum diameter of the pin is smaller than the hole diameter, since the chip itself can be perfectly installed with the motherboard, there is no need for subsequent inclination angle detection. For example, assuming that the diameter of the chip installation hole is 0.50mm, the diameter difference error is set to 0.02mm, the contact area threshold is 2.5 square millimeters, and the inclination angle threshold is 1.5 degrees. If the maximum pin diameter detected is 0.53mm, the diameter difference is 0.03mm. The diameter difference of 0.03mm is larger than the diameter difference error of 0.02mm, but the actual measured contact area is 3.0 square millimeters, which is larger than the contact area threshold of 2.5 square millimeters. It is preliminarily determined that the pin diameter test is qualified.Then, keep the chip and the motherboard installed, place the motherboard on a horizontal table, and use a sensor to measure the angle between the top plane of the chip and the motherboard. The tilt angle is 1.2 degrees, which is less than the tilt angle threshold of 1.5 degrees. This means that the chip is tilted less relative to the motherboard, and the heat sink can make good contact with the top plane of the chip to ensure effective heat dissipation, and ultimately maintain the pin diameter test qualified. However, if the tilt angle is 2.0 degrees, which exceeds the tilt angle threshold, it means that the chip is installed at a significant tilt, and the heat sink cannot achieve sufficient contact, affecting the heat dissipation effect. Although the contact area is qualified, the pin diameter test is still judged to be unqualified. In contrast, if the maximum diameter of the pin is smaller than the hole diameter (for example, 0.46mm), the chip can be installed horizontally normally without the need for tilt angle detection, simplifying the process.

[0029] It should be noted that the thresholds used in the above steps need to be scientifically determined based on the device's design requirements, manufacturing process, product reliability requirements, and actual test data. Specific parameter thresholds listed in the above embodiments, such as the 1 mm vertical and horizontal pin error threshold, 0.05 mm curvature threshold, and 1.5-degree tilt angle threshold, should also be adjusted based on the actual design specifications and process drawings. For example, the design dimensions of chip pins and the allowable process tolerances are typically clearly defined during the design phase. Design specifications provide standard pin spacing, dimensions, and curvature requirements, providing a basis for initially setting "vertical and horizontal pin error thresholds," "curvature thresholds," and "diameter difference errors." The motherboard's hole dimensions, tolerance ranges, and material properties also require reference. Statistical testing of a large number of samples can determine the dimensional distribution and error range in actual production. For example, the distribution of actual horizontal and vertical pin spacing measured in mass production can be used to set the tolerance range for vertical and horizontal errors, aiming to identify abnormal deviations from normal process fluctuations. At the same time, you can also refer to international and industry standards and empirical data. Many semiconductor packaging and PCB manufacturing fields already have mature industry standards, such as JEDEC standards or IPC standards, which have regulations on size, spacing, curvature, and installation accuracy. These can serve as an important reference for determining thresholds, and you can refer to historical data and reliability reports of similar products to optimize these parameters.

[0030] In the embodiments disclosed herein, the processes described above with reference to the flowcharts can be implemented as computer software programs. The embodiments disclosed herein include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for executing the method illustrated in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication component and / or installed from removable media. When the computer program is executed by a central processing unit, the functions defined in the methods of this application are performed. It should be noted that the computer-readable medium referred to herein can be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. Computer-readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or components, or any combination thereof. More specific examples of computer-readable storage media can include, but are not limited to, an electrical connection having one or more wire segments, a portable computer disk, a hard disk, random access memory, read-only memory, erasable programmable read-only memory, optical fiber, a portable compact disk read-only memory, an optical storage device, a magnetic storage device, or any suitable combination thereof. In this application, a computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. Furthermore, in this application, a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transfer a program for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, electrical, optical, RF, or any suitable combination thereof.

[0031] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of the systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, program segment, or portion of code that contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the boxes can also occur in an order different from that marked in the accompanying drawings. For example, two boxes shown in succession can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, as well as combinations of boxes in the block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified functions or operations, or can be implemented using a combination of dedicated hardware and computer instructions.

[0032] Those skilled in the art should understand that the above is only a specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered by the scope of protection of the present application.

Claims

1. A data processing method for integrated circuit detection, characterized in that: include: Step 1: Obtain the distance between each pin and its neighboring pins. The distance between each pin and its neighboring pins in the longitudinal direction is recorded as the longitudinal pin distance, and the distance between each pin and its neighboring pins in the transverse direction is recorded as the transverse pin distance. All transverse pin distances are added together and averaged to obtain the average transverse pin distance. Similarly, the average longitudinal pin distance is obtained. The longitudinal and transverse pin errors are obtained by subtracting the average longitudinal pin distance from the average transverse pin distance. Step 2: Set the vertical and horizontal pin error thresholds according to the parameter requirements, and compare the vertical and horizontal pin errors with the vertical and horizontal pin error thresholds. If the vertical and horizontal pin errors are less than or equal to the vertical and horizontal pin error thresholds, it means that the distances between the pins in the horizontal and vertical directions are consistent. In this case, the chip pin distance test passes. If the vertical and horizontal pin errors are greater than the vertical and horizontal pin error thresholds, it means that the distances are inconsistent. In this case, the chip pin distance test fails. Step 3: Obtain the curvature of each pin of the chip and set a curvature threshold. Compare the curvature of each pin with the curvature threshold. If the curvature of the pin is less than or equal to the curvature threshold, it means that the curvature of the pin is within the standard range. In this case, the curvature test of the pin passes. If the curvature of the pin is greater than the curvature threshold, it means that the curvature of the pin exceeds the standard range. In this case, the curvature test of the pin fails. The pin curvature test of the chip passes only when the curvature test of all pins passes. Step 4: If there are pins that fail the curvature test, the number of pins that fail the curvature test is obtained and recorded as pins with unqualified curvature; Step five, set the tolerance threshold for pins with unqualified curvature, and compare the number of pins with unqualified curvature with the tolerance threshold for pins with unqualified curvature. If the number of pins with unqualified curvature is less than or equal to the tolerance threshold for pins with unqualified curvature, it means that the number of pins with unqualified curvature is within the tolerance limit. In this case, analyze the degree of curvature of the pins with unqualified curvature again to determine whether the pins can be plugged into the holes of the motherboard; if the number of pins with unqualified curvature is greater than the tolerance threshold for pins with unqualified curvature, it means that the number of pins with unqualified curvature exceeds the tolerance limit. In this case, the pin curvature test of the chip is maintained as unqualified.

2. The data processing method for integrated circuit detection according to claim 1, characterized in that: During the re-analysis, the maximum curvature of the pin that can be inserted into the hole is set according to the parameter information of the hole for installing the chip pin on the motherboard. Under this condition, the curvature of all pins with unqualified curvature is compared with the maximum curvature again, and different responses are obtained based on the comparison results.

3. The data processing method for integrated circuit testing according to claim 2, wherein: If the curvature of all pins with unqualified curvature is less than or equal to the maximum curvature, it means that although all pins with unqualified curvature are bent, it does not affect the installation on the motherboard. In this case, the chip pin curvature test is qualified; if the curvature of all pins with unqualified curvature is not less than or equal to the maximum curvature, it means that among all pins with unqualified curvature, there are pins with large curvature and cannot be inserted into the holes at the chip installation location on the motherboard. In this case, the chip pin curvature test is unqualified.

4. The data processing method for integrated circuit testing according to claim 3, wherein: When the pin distance and pin curvature tests are both qualified, obtain the hole diameter of the chip installation location on the motherboard. At the same time, obtain the diameter of the pin top and record it as the maximum pin diameter. Subtract the hole diameter from the maximum pin diameter and take the positive value to obtain the diameter difference. At the same time, set the diameter difference error and compare the diameter difference with the diameter difference error. Different responses are obtained based on the comparison results.

5. The data processing method for integrated circuit testing according to claim 4, wherein: If the diameter difference between the pin and the hole is less than or equal to the diameter difference error, it means that the maximum diameter of the pin is the same as the hole diameter, and the pin can be perfectly inserted into the hole. In this case, the pin diameter test is qualified; if the diameter difference between the pin and the hole is greater than the diameter difference error, it means that there is a gap between the maximum diameter of the pin and the hole diameter, and the pin cannot be perfectly inserted into the hole. In this case, the pin diameter test fails.

6. The data processing method for integrated circuit testing according to claim 5, characterized in that: When the diameter difference between the pin and the hole is greater than the diameter difference error, regardless of whether the pin's maximum diameter is smaller than the hole diameter or larger than the hole diameter, the chip and the motherboard are mounted so that the pin is inserted into the hole. In this state, the contact area between the pin and the inner surface of the hole is obtained. At the same time, a contact area threshold is set, and the contact area is compared with the contact area threshold. Different responses are obtained based on the comparison results.

7. The data processing method for integrated circuit testing according to claim 6, wherein: If the contact area is greater than or equal to the contact area threshold, it means that the contact area between the pin and the hole is large and there is no physical contact between the two. In this case, the pin diameter test is changed to qualified. If the contact area is less than the contact area threshold, it means that the contact area between the pin and the hole is small and there is insufficient physical contact between the two. In this case, the pin diameter test remains unqualified.

8. The data processing method for integrated circuit testing according to claim 7, wherein: When the maximum diameter of the pin is larger than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, so that the pin diameter test is also qualified, keep the chip and the motherboard installed, then place the motherboard on the table, keep the motherboard in a horizontal position, use the motherboard as the X-axis, and use the sensor to measure the angle between the X-axis and the top plane of the chip, which is recorded as the tilt angle. At the same time, set the tilt angle threshold, and compare the tilt angle with the tilt angle threshold; if the tilt angle is less than or equal to the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is small. In this case, when the maximum diameter of the pin is larger than the hole diameter, but the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter test is still qualified; if the tilt angle is greater than the tilt angle threshold, it means that the tilt angle between the top plane of the chip and the motherboard is large. In this case, when the maximum diameter of the pin is larger than the hole diameter, even if the contact area between the pin and the hole is greater than or equal to the contact area threshold, the pin diameter test is unqualified.

9. A data processing system for integrated circuit testing, configured to execute the method according to any one of claims 1 to 8, characterized in that: include: A pin distance acquisition module is used to obtain the distance between each pin and its neighboring pins. The distance between each pin and its neighboring pins in the longitudinal direction is recorded as the longitudinal pin distance, and the distance between each pin and its neighboring pins in the transverse direction is recorded as the transverse pin distance. All transverse pin distances are summed up and averaged to obtain the average transverse pin distance. Similarly, the average longitudinal pin distance is obtained. The longitudinal and transverse pin errors are obtained by subtracting the average longitudinal pin distance from the average transverse pin distance. The pin distance comparison module is used to set the vertical and horizontal pin error thresholds according to parameter requirements and compare the vertical and horizontal pin errors with the vertical and horizontal pin error thresholds. If the vertical and horizontal pin errors are less than or equal to the vertical and horizontal pin error thresholds, it means that the distances between the pins in the horizontal and vertical directions are consistent. In this case, the chip pin distance test passes. If the vertical and horizontal pin errors are greater than the vertical and horizontal pin error thresholds, it means that the distances are inconsistent. In this case, the chip pin distance test fails. The pin bending comparison module is used to obtain the curvature of each pin of the chip and set a curvature threshold. The curvature of each pin is compared with the curvature threshold. If the curvature of the pin is less than or equal to the curvature threshold, it means that the curvature of the pin is within the standard range. In this case, the curvature test of the pin passes. If the curvature of the pin is greater than the curvature threshold, it means that the curvature of the pin exceeds the standard range. In this case, the curvature test of the pin fails. The pin curvature test of the chip passes only when the curvature test of all pins passes. A pin bending failure acquisition module is used to acquire the number of pins that fail the bending test when there are pins that fail the bending test, and record them as pins that fail the bending test; The pin bending failure comparison module is used to set the tolerance threshold of the pins with failed bending according to the parameter information, and compare the number of pins with failed bending with the tolerance threshold of the pins with failed bending. If the number of pins with failed bending is less than or equal to the tolerance threshold of the pins with failed bending, it means that the number of pins with failed bending is within the tolerance limit. In this case, the bending degree of the pins with failed bending is analyzed again to determine whether the pins can be plugged into the holes of the motherboard; if the number of pins with failed bending is greater than the tolerance threshold of the pins with failed bending, it means that the number of pins with failed bending exceeds the tolerance limit. In this case, the pin bending test of the chip is maintained as unqualified.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the data processing method for integrated circuit detection according to any one of claims 1 to 8.

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