Displacement table for wafer detection

Abstract

The invention relates to the field of semiconductor equipment, and provides a displacement table for wafer detection, which comprises a base, a first movement assembly and a first driving assembly, the first driving assembly comprises a first driving wheel, a first traction rope and a first knob; when the first knob is rotated, the first traction rope drives the first movement assembly to move back and forth in the X-axis direction of the base under the action of the first driving wheel. By adopting the technical scheme, manual adjustment of the displacement table in the X-axis direction in the wafer detection process can be realized. Specifically, the first driving wheel is driven to rotate by manually rotating the first knob, and then the first movement assembly stably moves back and forth in the X-axis direction of the base through the transmission effect of the first traction rope. According to the design, operation is easy and convenient, an additional power source is not needed, the complexity and cost of equipment are effectively reduced, and meanwhile the reliability and stability of the system are improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor equipment, and particularly to a displacement stage for wafer detection. Background Art

[0002] As a key component in precision detection equipment, displacement stages are widely used in fields such as semiconductor manufacturing and optical detection. In these fields, displacement stages are mainly used to achieve precise movement and positioning of workpieces or samples in space, thereby ensuring the accuracy and reliability of the detection process. With the rapid development of semiconductor technology, the accuracy requirements for wafer detection are getting higher and higher, and the design and performance optimization of displacement stages have become particularly important, which directly affects the detection efficiency and product quality.

[0003] Currently, to achieve precise displacement in wafer detection, common solutions include using mechanical structures such as lead screw drives, ball guides, and air-bearing platforms. The lead screw drive rotates the lead screw to drive the slider to move linearly, which can provide high positioning accuracy; the ball guide uses rolling friction instead of sliding friction, significantly reducing the running resistance and improving the movement smoothness; the air-bearing platform achieves contactless movement through gas support, further reducing friction and vibration.

[0004] However, the existing displacement stages still have problems with inconvenient operation in practical applications. Especially when manual position adjustment is required, there is a lack of a simple and reliable driving method. This problem may lead to a decrease in positioning accuracy and affect the accuracy of the detection results. Therefore, an improved displacement stage design is urgently needed to solve this defect. Summary of the Invention

[0005] To solve the above technical problems, this application provides a displacement stage for wafer detection.

[0006] A displacement stage for wafer detection provided by this application adopts the following technical solutions: A displacement stage for wafer detection includes: A base, a first motion component slidably engaged with the base, and a first driving component for driving the first motion component to move; the first driving component includes a first driving wheel pivotally connected to the base, a first traction rope wound around the first driving wheel, and a first knob coaxially fastened to the first driving wheel; When the first knob is rotated, the first traction rope is acted upon by the first driving wheel, driving the first motion component to move back and forth along the X-axis direction of the base.

[0007] By adopting the above technical solution, it is possible to achieve manual adjustment of the displacement stage in the X-axis direction during the wafer detection process. Specifically, by manually rotating the first knob, the first driving wheel is driven to rotate, and then through the transmission of the first traction rope, the first moving component moves smoothly back and forth along the X-axis direction of the base. This design not only has simple operation, but also does not require an additional power source, effectively reducing the complexity and cost of the equipment, while improving the reliability and stability of the system.

[0008] Preferably, it further includes a second moving component slidably engaged with the first moving component, and a second driving component for driving the second moving component to move; the second driving component includes a second driving wheel and a second knob pivotally connected to the first moving component, a second traction rope wound around the second driving wheel, and a transmission belt disposed between the second driving wheel and the second knob; When the second knob is rotated, the second traction rope is acted on by the second driving wheel, driving the second moving component to move back and forth along the Y-axis direction of the base.

[0009] By adopting the above technical solution, the displacement stage can achieve precise adjustment with multiple degrees of freedom during the wafer detection process. Specifically, by adding a second moving component and its driving component to the first moving component, the displacement stage can not only move along the X-axis direction, but also achieve stable reciprocating motion along the Y-axis direction. This design significantly improves the spatial positioning ability of the displacement stage, providing a more flexible and precise motion control method for wafer detection. At the same time, the introduction of the transmission belt effectively reduces the transmission error between the second knob and the second driving wheel, further improving the smoothness and accuracy of the motion.

[0010] Preferably, it further includes a third moving component slidably engaged with the second moving component, and a third traction rope wound around the second driving wheel; When the second driving wheel rotates, both the third moving component and the second moving component move synchronously along the Y-axis direction of the base.

[0011] By adopting the above technical solution, the third moving component and the second moving component cooperate with each other, and can achieve synchronous displacement of two moving components along the same axis under the drive of a single driving wheel. This design not only simplifies the driving structure, reduces the number of components, but also improves the stability and motion accuracy of the system, effectively avoiding the position deviation problem caused by the non-synchronization of multiple driving sources. At the same time, using the same driving wheel to drive two moving components simultaneously significantly reduces the energy consumption and improves the efficiency of the overall device.

[0012] Preferably, the second driving wheel is provided with a first wheel groove and a second wheel groove. The second traction rope is wound in the first wheel groove, and the third traction rope is wound in the second wheel groove. The inner diameters of the bottoms of the first wheel groove and the second wheel groove are different.

[0013] By adopting the above technical solution, the second driving wheel winds the second traction rope and the third traction rope respectively through two wheel grooves with different inner diameters. When the second driving wheel rotates, the second moving component and the third moving component can be synchronously driven to move along the Y-axis direction with different transmission ratios. This design not only simplifies the driving structure, but also improves the coordination and stability of the displacement stage during multi-degree-of-freedom movement, and at the same time reduces the positioning deviation caused by transmission errors, thereby improving the accuracy and efficiency of wafer detection.

[0014] Preferably, the first moving component includes a first sliding seat and a first slide rail disposed between the first sliding seat and the base; a first groove for avoiding the first driving wheel is provided on the lower bottom surface of the first sliding seat along the movement direction, and both ends of the first traction rope wound around the first driving wheel are tightened and respectively fastened to both ends of the first groove.

[0015] By adopting the above technical solution, the first slide rail between the first sliding seat and the base can ensure the smooth sliding of the first moving component in the X-axis direction. At the same time, the first groove provided on the lower bottom surface of the first sliding seat effectively avoids the first driving wheel and avoids the problem of structural interference. In addition, both ends of the first traction rope are fastened to both ends of the first groove, making the force on the traction rope more uniform, thereby improving the stability and reliability of the displacement stage during movement in the X-axis direction and reducing the jitter and offset phenomena during the movement process.

[0016] Preferably, the second driving wheel is disposed in the middle of the first sliding seat, and a second knob is pivotally connected to one end of the first sliding seat. The second knob is matched with a first long groove opened on the base.

[0017] By adopting the above technical solution, the second driving wheel is disposed in the middle of the first sliding seat, so that the second driving wheel can be stably installed on the first sliding seat, thereby providing stable support for the driving of the second moving component. A second knob is pivotally connected to one end of the first sliding seat, which is convenient for the operator to control the rotation of the second driving wheel by rotating the second knob, and then realize the precise movement of the second moving component along the Y-axis direction. The first long groove is opened on the base, so that the second knob can slide along the first long groove, avoiding the interference between structures, and improving the overall reliability and operation convenience of the displacement stage.

[0018] Preferably, the second moving component includes a second sliding seat and a second slide rail disposed between the second sliding seat and the first sliding seat; a second long groove for avoiding the second driving wheel is provided on the second sliding seat along the movement direction.

[0019] By adopting the above technical solution, the cooperation between the second slide and the first slide is closer and more stable, effectively reducing the shaking and offset during the movement. At the same time, the design of the second long groove not only provides a necessary avoidance space for the second driving wheel, but also ensures the smoothness and accuracy of the second slide moving in the Y-axis direction, further improving the positioning accuracy and reliability of the wafer detection.

[0020] Preferably, the third moving component includes a third slide slidably engaged with the second slide, a third slide rail disposed between the third slide and the second slide, and a wafer positioning table disposed at one end of the third slide; a second groove for avoiding the second driving wheel is provided on the lower bottom surface of the third slide; a positioning notch is provided at one end of the third slide close to the wafer positioning table.

[0021] By adopting the above technical solution, the cooperation between the third slide and the second slide and the setting of the third slide rail can achieve the precise displacement of the wafer positioning table in the Y-axis direction. At the same time, the design of the second groove effectively avoids the interference between the third slide and the second driving wheel during the movement, thereby improving the overall stability and reliability of the displacement table.

[0022] Preferably, both ends of the second traction rope wound around the second driving wheel are tightened and respectively fastened to both ends of the second long groove; both ends of the third traction rope wound around the second driving wheel are tightened and respectively fastened to both ends of the second groove.

[0023] By adopting the above technical solution, both ends of the second traction rope and the third traction rope are respectively fastened to the corresponding long groove and groove, so that the ropes can maintain a stable tension during the driving process, effectively avoiding the phenomenon of rope loosening or slipping. At the same time, this fixing method simplifies the structural design, reduces the use of additional fixing parts, thereby reducing the manufacturing cost and improving the assembly efficiency. In addition, the tightened ropes can provide more precise position control in the movement transmission, improving the positioning accuracy of the displacement table during the wafer detection process.

[0024] Preferably, a first positioning groove for accommodating the first slide rail is provided between the base and the first slide; a second positioning groove for accommodating the second slide rail is provided between the first slide and the second slide; a third positioning groove for accommodating the third slide rail is provided between the second slide and the third slide.

[0025] By adopting the above technical solution, the slide rails between the base and the first sliding seat, between the first sliding seat and the second sliding seat, and between the second sliding seat and the third sliding seat are respectively arranged in the corresponding positioning grooves, effectively reducing the overall height of the displacement stage and making the structure more compact. At the same time, the positioning groove design can protect the slide rails and prevent external impurities from entering the slide rails, thereby improving the operation stability and service life of the displacement stage.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. By rotating the first knob to drive the first moving component to move back and forth in the X-axis direction of the base, a simple and reliable operation for manually adjusting the position is achieved, effectively improving the positioning accuracy of the displacement stage; 2. The combined use of the first driving wheel and the first traction rope not only simplifies the transmission structure, but also effectively reduces friction and vibration during operation, ensuring smooth and reliable movement; 3. It solves the problem of inconvenient operation of the existing displacement stage during manual adjustment, and improves the use efficiency and reliability of the displacement stage during the wafer detection process. Description of the Drawings

[0027] Figure 1 is an axonometric view of the first moving component and the base after cooperation in the embodiment of the present application; Figure 2 is Figure 1 exploded view of; Figure 3 is Figure 2 axonometric view of the lower bottom surface of the first sliding seat in; Figure 4 is at Figure 1 axonometric view after superimposing the second moving component on the basis of.

[0028] Figure 5 is Figure 4 exploded view of.

[0029] Figure 6 is at Figure 4 axonometric view after superimposing the third moving component on the basis of.

[0030] Figure 7 is Figure 6 exploded view of.

[0031] Figure 8 is a schematic diagram of the winding modes of the first traction rope, the second traction rope and the third traction rope.

[0032] Figure 9 is Figure 5 local enlarged view of part A in.

[0033] Description of the Reference Numerals: 1. Base; 11. First long groove; 2. First moving component; 21. First sliding seat; 211. First groove; 22. First slide rail; 3. First driving component; 31. First driving wheel; 33. First knob; 4. Second moving component; 41. Second sliding seat; 411. Second long groove; 42. Second slide rail; 5. Second driving component; 51. Second driving wheel; 511. First wheel groove; 512. Second wheel groove; 52. Second knob; 54. Transmission belt; 6. Third moving component; 61. Third sliding seat; 62. Third slide rail; 63. Wafer positioning table; 64. Positioning notch; 7. Third towing rope; 81. First positioning groove; 82. Second positioning groove; 83. Third positioning groove. Detailed implementation mode

[0034] The following further describes the present application in detail with reference to the accompanying drawings.

[0035] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Multiple" means at least two.

[0036] In the embodiments of the present application, the orientation terms mentioned, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", etc., are only with reference to the direction of the accompanying drawings. Therefore, the orientation terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation on the embodiments of the present application.

[0037] In the embodiments of the present application, the limitations on the relative position relationship mentioned, such as parallel, perpendicular, alignment, etc. These limitations are all for the current technological level and are not absolute strict limitations. A small deviation is allowed, and approximate parallel, approximate perpendicular, approximate alignment, etc. are all acceptable. For example, A is parallel to B means that A and B are parallel or approximately parallel, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, A is perpendicular to B means that A and B are perpendicular or approximately perpendicular, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0038] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of such features.

[0039] An embodiment of the present application discloses a displacement stage for wafer detection. The displacement stage can conveniently and flexibly adjust the position of the moving platform manually, which is not only easy to operate but also low in cost, and is convenient and practical.

[0040] Specifically, as shown in Figures 1 to 3 , the displacement stage includes a base 1, a first motion component 2 and a first drive component 3. The first motion component 2 includes a first slide 21 and a first slide rail 22 disposed between the base 1 and the first slide 21. Among them, the two first slide rails 22 are respectively installed at both ends of the first slide 21 and are respectively received in the first positioning grooves 81 formed on the opposite side surfaces of the first slide 21 and the base 1, thereby effectively reducing the overall height of the displacement stage, making the structure more compact, and at the same time being able to provide better protection for the first slide rail 22.

[0041] In addition, the above-mentioned first drive component 3 includes a first drive wheel 31 pivotally connected to the base 1, a first knob 33 exposed below the base 1 for driving the first drive wheel 31 to rotate, and a first traction rope wound around the first drive wheel 31 in the manner shown in Figure 8 . A first groove 211 is formed on the lower bottom surface of the first slide 21 along the moving direction, so that both ends of the first traction rope are tightened and fastened to both ends of the first groove 211. The first groove 211 effectively avoids the first drive wheel 31 and avoids structural interference problems. In addition, both ends of the first traction rope are fastened to both ends of the first groove 211, making the force on the traction rope more uniform, thereby improving the stability and reliability of the displacement stage when moving in the X-axis direction, and reducing the jitter and offset phenomena during the movement process.

[0042] For the displacement stage arranged in this way, when used for wafer detection, the wafer positioning stage 63 can be installed on the first slide 21, and the first drive wheel 31 is driven to rotate by manually rotating the first knob 33. Then, through the transmission of the first traction rope, the wafer positioning stage 63 installed on the first slide 21 moves smoothly back and forth along the X-axis direction of the base 1. This design is not only easy to operate, but also does not require an additional power source, effectively reducing the complexity and cost of the equipment, and at the same time improving the reliability and stability of the system.

[0043] In order to enable the displacement stage to be applicable to the movement in both the X-axis and Y-axis directions at the same time, on the basis of the above solution, a second motion component 4 and a second drive component 5 are added, and the second drive component 5 is used to drive the second motion component 4 to slide along the Y-axis direction of the base 1.

[0044] Specifically, as shown in Figure 4 and Figure 5As shown in the figure, the second moving component 4 includes a second sliding seat 41 and a second slide rail 42 disposed between the first sliding seat 21 and the second sliding seat 41. Preferably, two second slide rails 42 are provided, and the two second slide rails 42 are respectively installed in second positioning grooves 82 formed on opposite side surfaces of the first sliding seat 21 and the second sliding seat 41. The second positioning groove 82 has the same function as the above-mentioned first positioning groove 81, and will not be specifically described here.

[0045] Further, the second driving component 5 includes a second driving wheel 51 pivotally connected to the middle of the first sliding seat 21, a second traction rope wound around the second driving wheel 51 in a Figure 8 way, a second knob 52 pivotally connected to one end of the first sliding seat 21, and a transmission belt 54 for driving the second driving wheel 51 to rotate when the second knob 52 is manually rotated; in order to facilitate the second driving component 5 to drive the second sliding seat 41 to move along the Y-axis direction of the base 1 without interference with the base 1, a first long groove 11 for avoiding the second knob 52 is provided at one end of the base 1; in addition, a second long groove 411 for avoiding the second driving wheel 51 is further provided between the two second slide rails 42, so as to drive the second driving wheel 51 to rotate by manually rotating the second knob 52, and then drive the second sliding seat 41 to move back and forth along the Y-axis direction of the base 1 through the second traction rope; preferably, in this state, the wafer positioning table 63 can be installed on the second sliding seat 41, so as to realize the positioning of the wafer by adjusting the positions of the first sliding seat 21 and the second sliding seat 41.

[0046] Furthermore, while satisfying the position adjustment of the displacement table in the X-axis and Y-axis directions, a third moving component 6 can be further installed above the second moving component 4 in a similar manner. The third moving component 6 can realize the expansion of the third moving component 6 in the moving direction of the second moving component 4, that is, the expansion along the Y-axis direction of the base 1, by means of a third traction rope 7 wound around the second driving wheel 51 in a Figure 8 way. In this application scenario, the above-mentioned wafer positioning table 63 can be installed at one end of the third moving component 6, so that the wafer positioning table 63 can be expanded in a farther direction along the Y-axis, and then it is convenient to cooperate with external devices.

[0047] Specifically, as shown in combination with Figures 6 to 9 the figure, the third moving component 6 includes a third sliding seat 61 slidably engaged with the second sliding seat 41, a third slide rail 62 disposed between the third sliding seat 61 and the second sliding seat 41, and a wafer positioning table 63 disposed at one end of the third sliding seat 61; a second groove for avoiding the second driving wheel 51 is provided on the lower bottom surface of the third sliding seat 61; a positioning notch 64 is provided at one end of the third sliding seat 61 close to the wafer positioning table 63. In order to avoid rigid collision when the positioning notch 64 is docked with external equipment, a buffer is further provided in the positioning notch 64 to avoid damage to the displacement table.

[0048] Similar to the installation method of the second slide rail 42 in the above-mentioned second moving component 4, the above-mentioned third slide rail 62 is also installed in the third positioning groove 83 between the third slide seat 61 and the second slide seat 41, so as to achieve the same effect as the first positioning groove 81 and the second positioning groove 82. The above-mentioned first positioning groove 81, second positioning groove 82 and third positioning groove 83 effectively reduce the overall height of the displacement stage, making the structure more compact. At the same time, it can also play a good protective role for the first slide rail 22, second slide rail 42 and third slide rail 62, preventing external impurities from entering the slide rail, thereby improving the running stability and service life of the displacement stage.

[0049] In order to better achieve the synchronous movement between the third slide seat 61 and the second slide seat 41, preferably, the second driving wheel 51 is provided with a first wheel groove 511 and a second wheel groove 512. A second traction rope is wound in the first wheel groove 511, and a third traction rope 7 is wound in the second wheel groove 512. The inner diameters of the bottoms of the first wheel groove 511 and the second wheel groove 512 are different; and the two ends of the second traction rope wound around the second driving wheel 51 are tightened and respectively fastened to the two ends of the second long groove 411; the two ends of the third traction rope 7 wound around the second driving wheel 51 are tightened and respectively fastened to the two ends of the second groove.

[0050] The two ends of the second traction rope and the third traction rope 7 arranged in the above manner are respectively fastened to the corresponding second long groove 411 and the second groove, so that the ropes can maintain a stable tension during the driving process, effectively avoiding the phenomenon of rope loosening or slipping. At the same time, this fixing method simplifies the structural design, reduces the use of additional fixing parts, thereby reducing the manufacturing cost and improving the assembly efficiency. The tightened ropes can provide more precise position control in motion transmission, improving the positioning accuracy of the displacement stage during the wafer detection process.

[0051] In addition, by setting the first wheel groove 511 and the second wheel groove 512 with different inner diameters on the above-mentioned second driving wheel 51 and winding the second traction rope and the third traction rope 7 respectively, when the second driving wheel 51 rotates, the second moving component 4 and the third moving component 6 can be synchronously driven to move along the Y-axis direction with different transmission ratios. This design not only simplifies the driving structure, but also improves the coordination and stability of the displacement stage during multi-degree-of-freedom movement. At the same time, it reduces the positioning deviation caused by transmission errors, and can also make the wafer positioning stage 63 installed on the third moving component 6 extend a relatively long distance outward along the Y-axis direction, then facilitating the cooperation with external detection devices. Moreover, when the second moving component 4 and the third moving component 6 are reset, it can effectively reduce the space occupied by the displacement stage.

[0052] In addition, the third motion component 6 and the second motion component 4 cooperate with each other, and can achieve synchronous displacement of the two motion components along the same axis under the drive of a single second driving wheel 51. This design not only reduces the number of components, but also effectively avoids the position deviation problem caused by the asynchronization of multiple drive sources. At the same time, using the same second driving wheel 51 to drive the two motion components simultaneously significantly reduces the energy consumption and improves the efficiency of the overall device.

[0053] The implementation principle of this application is as follows: when the first knob 33 is manually rotated, the first driving wheel 31 can drive the first traction rope to traction the first sliding seat 21 to move along the X axis; similarly, when the second knob 52 is manually rotated, the second driving wheel 51 can drive the second traction rope to traction the second sliding seat 41 to move along the Y axis; when the third traction rope 7 is wound around the second driving wheel 51 at the same time, the third sliding seat 61 slidably engaged with the second sliding seat 41 can be synchronously driven to expand outward along the Y axis, and then the wafer positioning table 63 mounted on the third sliding seat 61 can expand outward by a relatively long distance, which is convenient for cooperation with an external detection device.

[0054] The above are all the preferred embodiments of this application. The protection scope of this application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A displacement stage for wafer inspection, characterized in that, Including: A base (1), a first moving component (2) slidably engaged with the base (1), and a first driving component (3) for driving the first moving component (2) to move; the first driving component (3) includes a first driving wheel (31) pivotally connected to the base (1), a first towing rope wound around the first driving wheel (31), and a first knob (33) coaxially fastened to the first driving wheel (31); When the first knob (33) is rotated, the first towing rope is acted on by the first driving wheel (31) to drive the first moving component (2) to reciprocate in the X-axis direction of the base (1).

2. The displacement stage for wafer inspection according to claim 1, wherein, It further includes a second moving component (4) slidably engaged with the first moving component (2), and a second driving component (5) for driving the second moving component (4) to move; the second driving component (5) includes a second driving wheel (51) and a second knob (52) pivotally connected to the first moving component (2), a second towing rope wound around the second driving wheel (51), and a transmission belt (54) disposed between the second driving wheel (51) and the second knob (52); When the second knob (52) is rotated, the second towing rope is acted on by the second driving wheel (51) to drive the second moving component (4) to reciprocate in the Y-axis direction of the base (1).

3. The displacement stage for wafer inspection according to claim 2, characterized in that It further includes a third moving component (6) slidably engaged with the second moving component (4), and a third towing rope (7) wound around the second driving wheel (51); When the second driving wheel (51) rotates, the third moving component (6) and the second moving component (4) both move synchronously in the Y-axis direction of the base (1).

4. The displacement stage for wafer detection according to claim 3, characterized in that, The second driving wheel (51) is provided with a first groove (511) and a second groove (512), the second towing rope is wound in the first groove (511), the third towing rope (7) is wound in the second groove (512), and the inner diameters of the bottoms of the first groove (511) and the second groove (512) are different.

5. The displacement stage for wafer detection according to claim 3, characterized in that, The first moving component (2) includes a first sliding seat (21), and a first sliding rail (22) disposed between the first sliding seat (21) and the base (1); a first groove (211) for avoiding the first driving wheel (31) is provided on the lower bottom surface of the first sliding seat (21) along the moving direction, and both ends of the first towing rope wound around the first driving wheel (31) are tightened and respectively fastened to both ends of the first groove (211).

6. The displacement stage for wafer inspection according to claim 5, wherein The second driving wheel (51) is disposed in the middle of the first sliding seat (21), the second knob (52) is pivotally connected to one end of the first sliding seat (21), and the second knob (52) is engaged with a first long groove (11) provided on the base (1).

7. A displacement stage for wafer inspection according to claim 5, characterized in that, The second moving component (4) includes a second sliding seat (41) and a second slide rail (42) disposed between the second sliding seat (41) and the first sliding seat (21); a second long groove (411) for avoiding the second driving wheel (51) is provided on the second sliding seat (41) along the moving direction.

8. A displacement stage for wafer inspection according to claim 7, characterized in that, The third moving component (6) includes a third sliding seat (61) slidably engaged with the second sliding seat (41), a third slide rail (62) disposed between the third sliding seat (61) and the second sliding seat (41), and a wafer positioning table (63) disposed at one end of the third sliding seat (61); a second groove for avoiding the second driving wheel (51) is provided on the lower bottom surface of the third sliding seat (61); a positioning notch (64) is provided at one end of the third sliding seat (61) close to the wafer positioning table (63).

9. A displacement stage for wafer inspection according to claim 7, characterized in that, Both ends of the second traction rope wound around the second driving wheel (51) are tightened and respectively fastened to both ends of the second long groove (411); both ends of the third traction rope (7) wound around the second driving wheel (51) are tightened and respectively fastened to both ends of the second groove.

10. A displacement stage for wafer inspection according to claim 8, characterized in that, A first positioning groove (81) for accommodating the first slide rail (22) is provided between the base (1) and the first sliding seat (21); a second positioning groove (82) for accommodating the second slide rail (42) is provided between the first sliding seat (21) and the second sliding seat (41); a third positioning groove (83) for accommodating the third slide rail (62) is provided between the second sliding seat (41) and the third sliding seat (61).

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