Optical communication assembly, socket and optical communication equipment

Abstract

The invention relates to the technical field of optical communication, and discloses an optical communication assembly which comprises a photoelectric device and a socket. The photoelectric device comprises a printed circuit board, a first end of the printed circuit board is provided with a conductive contact piece assembly, and the conductive contact piece assembly comprises a signal transmitting conductive contact piece and a signal receiving conductive contact piece; the printed circuit board is further provided with a first isolation strip extending in the length direction of the printed circuit board, and the signal sending conductive contact piece and the signal receiving conductive contact piece are located on the two sides of the first isolation strip in the width direction of the printed circuit board. The socket is provided with jacks, and isolation ribs are arranged in the jacks. When the conductive contact piece assembly is inserted into the socket, the isolation rib can be matched with the first isolation strip to form a first isolation part for isolating the signal transmitting conductive contact piece and the signal receiving conductive contact piece. According to the invention, crosstalk between the signal receiving channel and the signal sending channel in the photoelectric device can be reduced, so that the performance of the photoelectric device is improved. The invention also discloses a socket and optical communication equipment.

Description

Technical Field

[0001] This application relates to the field of optical communication technologies, and particularly to an optical communication component, a socket, and an optical communication device. Background Art

[0002] In optical communication, an optoelectronic device (also known as an optical module) is a tool for realizing the mutual conversion between optical and electrical signals and is one of the key components of an optical communication device. The optoelectronic device can be inserted into a socket of a communication device to achieve an electrical connection with the communication device. The optoelectronic device is provided with a signal receiving channel and a signal sending channel. Among them, the signal receiving channel can convert an external optical signal into an electrical signal and input the converted electrical signal into the communication device through the socket; the signal sending channel can convert the electrical signal sent by the socket into an optical signal and output the converted optical signal outward.

[0003] In the prior art, the isolation degree between the signal receiving channel and the signal sending channel is not effectively controlled, which will cause signal crosstalk between the signal receiving channel and the signal sending channel, seriously affecting the overall performance of the optoelectronic device. Summary of the Invention

[0004] This application provides an optical communication component, a socket, and an optical communication device. This application can reduce the crosstalk between the signal receiving channel and the signal sending channel in the optoelectronic device, thereby improving the performance of the optoelectronic device.

[0005] In a first aspect, this application provides an optical communication component, including an optoelectronic device and a socket. One end of the optoelectronic device can input / output an optical signal, and correspondingly, the other end outputs / inputs an electrical signal corresponding to the optical signal.

[0006] The optoelectronic device includes a printed circuit board. The two ends of the printed circuit board along its length direction are respectively a first end and a second end. A conductive contact assembly is provided at the first end of the printed circuit board. The conductive contact assembly is used for electrically connecting with the terminals in the socket that is the insertion destination of the optoelectronic device. The conductive contact assembly includes a signal sending conductive contact and a signal receiving conductive contact. A first isolation strip extending along the length direction of the printed circuit board is also provided on the printed circuit board. The signal sending conductive contact and the signal receiving conductive contact are located on both sides of the first isolation strip along the width direction of the printed circuit board.

[0007] The socket is provided with a socket opening that can allow the conductive contact assembly to be inserted. An isolation rib is provided in the socket opening. When the conductive contact assembly is inserted into the socket opening, the isolation rib can cooperate with the first isolation strip to form a first isolation portion that isolates the signal sending conductive contact and the signal receiving conductive contact.

[0008] In this application, by providing a first isolation strip on the printed circuit board and isolation ribs in the socket, when the conductive contact assembly is inserted into the socket, the first isolation strip and the isolation ribs in the socket overlap to form a first isolation portion. The first isolation portion can separate the signal - transmitting conductive contacts and the signal - receiving conductive contacts in different isolation chambers, thereby achieving physical isolation between the signal - transmitting conductive contacts and the signal - receiving conductive contacts, reducing crosstalk between the transmitted signal and the received signal, and improving the performance of the optoelectronic device.

[0009] This application does not limit the specific structure of the first isolation strip. Any structure that can cooperate with the isolation ribs in the socket to isolate the signal - transmitting conductive contacts and the signal - receiving conductive contacts falls within the protection scope of this application.

[0010] In some implementation manners of this application, the first isolation strip is a split groove, and a first isolation rib is provided in the socket. The width of the split groove matches the first isolation rib. Moreover, when the conductive contact assembly is inserted into the socket, the first isolation rib is inserted into the split groove to form a first isolation portion, so as to separate the signal - transmitting conductive contacts and the signal - receiving conductive contacts in different isolation spaces. A conductive layer connected to the ground is provided on the side wall of the split groove, the first isolation rib is made of a conductive material and is connected to the ground, and when the first isolation rib is inserted into the split groove, the first isolation rib contacts the conductive layer.

[0011] In some implementation manners of this application, the first isolation strip is located on the printed circuit board, made of a conductive material and connected to the ground. Moreover, a pair of second isolation ribs corresponding to the position of the first isolation strip are provided in the socket. The pair of second isolation ribs are made of a conductive material and connected to the ground, and a first opening corresponding to the thickness of the first isolation strip is provided between the pair of second isolation ribs. When the conductive contact assembly is inserted into the socket, the first isolation strip is inserted into the first opening, and the pair of second isolation ribs overlap with the first isolation strip from both sides of the plane where the printed circuit board is located to form a first isolation portion, and the first isolation portion can separate the signal - transmitting conductive contacts and the signal - receiving conductive contacts in different isolation spaces.

[0012] In this application, by grounding both the first isolation strip and the isolation ribs in the socket, the signal isolation effect between the signal - transmitting conductive contacts and the signal - receiving conductive contacts can be enhanced.

[0013] In some implementation manners of this application, the optoelectronic device further includes a structural member and an optical device. Among them, a cavity is provided inside the structural member, the printed circuit board is disposed in the cavity, and the optical device is disposed at the second end of the printed circuit board.

[0014] In some implementations of the present application, a second isolation strip extending along the width direction of the printed circuit board is provided on the printed circuit board. The conductive contact component and the optical device are located on both sides of the second isolation strip along the length direction of the printed circuit board. The second isolation strip is used to cooperate with the isolation ribs in the structural member to form a second isolation portion for isolating the conductive contact component.

[0015] By providing the second isolation strip on the printed circuit board in the present application, the second isolation strip can overlap with the isolation ribs in the structural member to form a second isolation portion. The second isolation portion can isolate the area where the conductive contact component is located from other areas, so that the conductive contact component and other components (such as optical devices) on the printed circuit board are separated in different isolation chambers, thereby realizing physical isolation between the conductive contact component and other components, reducing crosstalk between the conductive contact component and other components, and improving the performance of the optoelectronic device.

[0016] In some implementations of the present application, the second isolation strip is located on the printed circuit board, made of a conductive material and connected to the ground. Moreover, a pair of third isolation ribs corresponding to the position of the second isolation strip are provided in the cavity of the structural member. The pair of third isolation ribs are made of a conductive material and connected to the ground. A second opening corresponding to the thickness of the second isolation strip is provided between the pair of third isolation ribs. The printed circuit board is inserted into the second opening, and the pair of third isolation ribs overlap with the second isolation strip from both sides of the plane where the printed circuit board is located to form a second isolation portion. The second isolation portion can separate the conductive contact component and other components on the printed circuit board in different isolation spaces.

[0017] By grounding both the second isolation strip and the isolation ribs in the structural member in the present application, the signal isolation effect between the conductive contact component and the optical device can be enhanced.

[0018] In some implementations of the present application, conductive adhesives are respectively provided between both sides of the pair of third isolation ribs and the plane where the printed circuit board is located. By providing the conductive adhesives in the present application, the sealing performance can be enhanced, thereby ensuring strict isolation.

[0019] In some implementations of the present application, the optoelectronic device provided by the present application further includes a flexible circuit board, a signal transmission line, and a signal reception line. Among them, the flexible circuit board is disposed between the optical device and the printed circuit board, and the flexible circuit board is used to connect the optical device and the printed circuit board. The signal transmission line extends along the length direction of the printed circuit board. One end of the signal transmission line is electrically connected to the signal transmission conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence. The signal transmission line is used to transmit the signal emitted by the signal transmission conductive contact to the optical device. The signal reception line extends along the length direction of the printed circuit board. One end of the signal reception line is electrically connected to the signal reception conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence. The signal reception line is used to transmit the signal emitted by the optical device to the signal reception conductive contact.

[0020] When the socket sends out a signal, the electrical signal sent out by the socket is transmitted to the optical device through the signal transmission conductive contact and the signal transmission line in sequence. Subsequently, the optical device converts the electrical signal sent out by the socket into an optical signal and transmits the optical signal outward. When an external optical signal comes, the optical device converts the optical signal into an electrical signal, and then the electrical signal is transmitted to the socket through the signal reception line and the signal reception conductive contact in sequence, so that the socket receives the signal.

[0021] In some implementations of the present application, a second conductive region is provided on the flexible circuit board, and the second conductive region is connected to the ground. A first protrusion corresponding to the position of the second conductive region is provided in the cavity of the structural member. The first protrusion is made of a conductive material and is connected to the ground, and the first protrusion is in contact with the second conductive region.

[0022] The inventor has discovered through exploration that the impedance at the connection between the optical device and the flexible circuit board is discontinuous, which is prone to radiating electromagnetic waves. Moreover, due to the limited space inside the optoelectronic device, it is difficult to completely shield the connection between the optical device and the flexible circuit board, resulting in the coupling of radiated signals. In the present application, by providing a second conductive region connected to the ground on the flexible circuit board and overlapping the second conductive region with the grounded first protrusion, the radiation resistance of the optical device and the flexible circuit board can be enhanced, while reducing external radiation and improving the isolation degree.

[0023] In some implementations of the present application, an extension board is provided on the flexible circuit board, and the second conductive region is disposed on the extension board. A second protrusion opposite to the first protrusion is provided in the cavity of the structural member. A third opening is provided between the first protrusion and the second protrusion. The extension board is disposed in the third opening, and the first protrusion and the second protrusion are in contact with the extension board from both sides of the plane where the extension board is located, so as to clamp the extension board in the third opening, thereby enabling the second conductive region to be in close contact with the first protrusion and enhancing the reliability of the device.

[0024] In some implementations of the present application, both the signal transmission line and the signal reception line are routed in the inner layer of the flexible circuit board. This design can enhance the isolation between the signal transmission line and the signal reception line, reduce the interference between the signal transmission line and the signal reception line, and at the same time avoid the signal transmission line and the signal reception line from interfering with other channels or being interfered by other channels.

[0025] In some implementations of the present application, the signal transmission line and the signal reception line are routed on the surface layer of the flexible circuit board, and a ground wire is provided on each of the two sides of the signal transmission line and / or the signal reception line along the width direction of the printed circuit board, and the ground wire extends along the length direction of the printed circuit board. Since the radiation signal generated by the signal transmission line is relatively high compared to the signal reception line, the signal transmission line is likely to interfere with the signal reception line. In the present application, by providing a ground wire on each of the two sides of the signal transmission line, the electromagnetic radiation of the signal transmission line to the signal reception line can be restricted. By providing a ground wire on each of the two sides of the signal reception line, the radiation resistance of the signal reception line can be enhanced.

[0026] In some implementations of the present application, the printed circuit board includes multiple inner layers. When the signal transmission line and the signal reception line are routed in the same printed circuit board, the signal transmission line and the signal reception line are respectively routed in different inner layers of the same printed circuit board. When the number of printed circuit boards is two, the signal transmission line and the signal reception line are respectively routed in the inner layers of the two printed circuit boards. The above design can enhance the isolation between the signal transmission line and the signal reception line, thereby reducing the interference between the signal transmission line and the signal reception line.

[0027] In a second aspect, the present application provides a socket, on which there is a socket opening, and an isolation rib is provided inside the socket opening. The socket opening can allow the optoelectronic device in the optical communication component as in the first aspect to be inserted. When the optoelectronic device is inserted into the socket opening, the isolation rib can cooperate with the first isolation band on the optoelectronic device to form a first isolation portion for isolating the signal transmission conductive contact and the signal reception conductive contact.

[0028] In a third aspect, the present application provides an optical communication device, including the optical communication component as in the first aspect. Description of the Drawings

[0029] Figure 1 Shows a schematic structural diagram of a wireless small station system;

[0030] Figure 2 Shows a structural block diagram of a wireless small station system;

[0031] Figure 3 Shows a schematic diagram of an optical communication component in the prior art;

[0032] Figure 4 Shows Figure 3 exploded schematic diagram of

[0033] Figure 5 Shows a structural block diagram of a digital optical module SFP+;

[0034] Figure 6 Shows a structural block diagram of a single-channel optoelectronic device;

[0035] Figure 7 Shows a structural block diagram of a multi-channel optoelectronic device;

[0036] Figure 8 Shows a schematic structural diagram of a single-channel optoelectronic device provided with a partition member;

[0037] Figure 9 Shows a schematic structural diagram of a multi-channel optoelectronic device provided with a partition member;

[0038] Figure 10 Shows a schematic structural diagram of a multi-channel optoelectronic device provided with an absorbing material;

[0039] Figure 11 Shows the explosion of an optical communication component in a separated state in some embodiments of the present application Figure 1 ;

[0040] Figure 12 Shows the explosion of an optical communication component in a plugged state in some embodiments of the present application Figure 1 ;

[0041] Figure 13 Shows the schematic diagram of a printed circuit board in some embodiments of the present application Figure 1 ;

[0042] Figure 14 Shows the explosion of an optical communication component in a separated state in some other embodiments of the present application Figure 2 ;

[0043] Figure 15 Shows the schematic diagram of a socket in some other embodiments of the present application;

[0044] Figure 16 Shows the explosion of an optical communication component in a plugged state in some other embodiments of the present application Figure 2 ;

[0045] Figure 17 Shows the schematic diagram of a printed circuit board in some other embodiments of the present application Figure 2 ;

[0046] Figure 18 Shows Figure 16 The side view of the printed circuit board and the socket in;

[0047] Figure 19 Shows Figure 18Cross-sectional view in the direction of A-A;

[0048] Figure 20 Shows the explosion of the optical communication component in a separated state in some other embodiments of the present application Figure 3 ;

[0049] Figure 21 Shows the schematic diagram of the printed circuit board in some other embodiments of the present application Figure 3 ;

[0050] Figure 22 Shows the schematic cross-sectional view of the optoelectronic device in some other embodiments of the present application Figure 1 ;

[0051] Figure 23 Shows the schematic cross-sectional view of the optoelectronic device in some other embodiments of the present application Figure 2 ;

[0052] Figure 24 Shows Figure 23 The partial enlarged view of part B in

[0053] Figure 25 Shows the partial structural schematic diagram of the optoelectronic device in some other embodiments of the present application;

[0054] Figure 26 Shows the schematic diagram of the printed circuit board in some other embodiments of the present application Figure 4 ;

[0055] Figure 27 Shows the schematic diagram of the flexible circuit board in some embodiments of the present application Figure 1 ;

[0056] Figure 28 Shows the schematic cross-sectional view of the flexible circuit board in some embodiments of the present application;

[0057] Figure 29 Shows the schematic diagram of the flexible circuit board in some other embodiments of the present application Figure 2 ;

[0058] Figure 30 Shows the schematic cross-sectional view of the printed circuit board in some other embodiments of the present application;

[0059] Figure 31 Shows the comparison diagram of the isolation effect between the present application and the prior art.

[0060] Explanation of reference numerals:

[0061] 1 - Structural member; 11 - Cavity; 12 - Third isolation rib; 121 - Third upper isolation rib; 122 - Third lower isolation rib; 13 - Second opening; 14 - Conductive adhesive; 15 - First protrusion; 16 - Second protrusion; 17 - Third opening;

[0062] 2 - Printed circuit board; 21 - First isolation strip; 211 - Partition slot; 22 - Second isolation strip;

[0063] 3 - Conductive contact component; 31 - Signal - sending conductive contact; 32 - Signal - receiving conductive contact;

[0064] 4 - Optical device; 41 - PIN foot;

[0065] 5 - Flexible circuit board; 51 - Second conductive area; 52 - Extension board; 53 - Through - hole;

[0066] 6 - Signal - sending line;

[0067] 7 - Signal - receiving line;

[0068] 8 - Ground wire;

[0069] 9 - Socket; 91 - Socket opening; 92 - First isolation rib; 93 - Second isolation rib; 931 - Second upper isolation rib; 932 - Second lower isolation rib; 94 - First opening;

[0070] 10 - Partition member;

[0071] 20 - Absorbing material;

[0072] 100 - Optoelectronic device;

[0073] 200 - Optical fiber. Detailed implementation manners

[0074] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe the implementation manners of this application in detail with reference to the accompanying drawings.

[0075] The embodiment of this application provides an optical communication component, including an optoelectronic device and a socket. In the field of optical communication, an optoelectronic device (also known as an optical module) is a tool for realizing the mutual conversion of optical and electrical signals and is one of the key devices of optical communication equipment. The optoelectronic device can be inserted into the socket of the communication equipment and electrically connected to the communication equipment to realize the signal sending and receiving of the communication equipment.

[0076] In this application, the optical communication component can be applied to wireless transmission scenarios, such as routers, switches, and wireless base stations, etc. This application does not make any limitations in this regard. The following will introduce an example of applying the optical communication component to a wireless small station system.

[0077] Figure 1 Shows the structural schematic diagram of the wireless small station system, refer to Figure 1, The wireless small station system includes a pRRU (Pico Remote Radio Unit), an RHUB (Radio HUB), and a BBU (baseband unit). Among them, the pRRU is used to implement radio frequency signal processing. The pRRU can modulate the baseband signal to the transmitting frequency band, and after filtering and amplification, transmit it through the antenna. The pRRU can also receive radio frequency signals from the antenna, and after filtering and amplification, down-convert the radio frequency signals and send them to the RHUB for processing. The RHUB is used in cooperation with the pRRU and the BBU to support in-building coverage, receive downlink data sent by the BBU and forward it to each pRRU, and forward the uplink data of multiple pRRUs to the BBU. The BBU is used to provide external interfaces connected to transmission equipment, radio frequency modules, USB a devices, external clock sources, LMT or MAE, to implement functions such as signal transmission, automatic software upgrade of the base station, receiving clock, and maintenance of the BBU on the LMT or MAE. It can also centrally manage the entire base station system and complete functions such as uplink and downlink data processing, signaling processing, resource management, and operation and maintenance.

[0078] Figure 2 shows the structural block diagram of the wireless small station system. Refer to Figure 2 , sockets are provided on both the pRRU and the RHUB, and the optoelectronic device 100 (as Figure 3 shown) can be inserted into the socket to electrically connect the optoelectronic device 100 to the pRRU or the RHUB. The optoelectronic device 100 inserted into the pRRU socket and the optoelectronic device 100 inserted into the RHUB socket can transmit signals through optical fibers.

[0079] Furthermore, refer to Figure 4 , the optoelectronic device 100 includes a structural member 1 and a printed circuit board 2 (PCB board) provided inside the structural member. A conductive contact component 3, an optical device 4, and a functional circuit (not labeled) are provided on the printed circuit board 2, and the conductive contact component 3 and the optical device 4 are electrically connected through the functional circuit. Exemplarily, the conductive contact component 3 can be a gold finger component. During the use of the optoelectronic device 100, the optical fiber 200 is inserted into the optical device 4, and the conductive contact component 3 is inserted into the socket 9 of the pRRU or the RHUB, and the conductive contact component 3 can contact the terminals inside the socket 9 to achieve electrical connection. Specifically, the conductive contact component 3 includes a signal transmission conductive contact 31 and a signal reception conductive contact 32. Among them, the signal transmission conductive contact 31 can be a signal transmission gold finger, and the signal reception conductive contact 32 can be a signal reception gold finger. The signal transmission conductive contact 31 and the signal reception conductive contact 32 are respectively electrically connected to the optical device 4 through the functional circuit.

[0080] Refer to Figure 2 andFigure 4 When the optical communication device (pRRU or RHUB) into which the optoelectronic device 100 is inserted sends out signals, the electrical signals sent out by the optical communication device sequentially pass through the socket 9, the signal transmitting conductive contact 31, and the functional circuit and are transmitted to the optical device 4. Subsequently, the optical device 4 converts the electrical signals sent out by the optical communication device into optical signals and transmits the converted optical signals outwards through the optical fiber 200. When the optical communication device into which the optoelectronic device 100 is inserted receives signals, the optical signals are transmitted to the optical device 4 through the optical fiber 200. The optical device 4 converts the optical signals into electrical signals, and then the electrical signals sequentially pass through the functional circuit, the signal receiving conductive contact 32, and the socket 9 and are transmitted to the optical communication device.

[0081] In practical applications, whether it is a traditional optoelectronic device, such as a digital optical module SFP+ (as Figure 5 shown), QSFP, etc., or an analog optoelectronic device, such as a ROF optical module, etc., if there is no effective isolation between the signal transmitting conductive contact 31 and the signal receiving conductive contact 32, signal crosstalk will occur between the signal transmitting conductive contact 31 and the signal receiving conductive contact 32, affecting the overall performance of the optoelectronic device. Moreover, as the transmitted data continues to grow, optoelectronic devices have evolved from single-channel in the early stage (as Figure 6 shown) to multi-channel (as Figure 7 shown), and crosstalk between different channels will have a greater impact on optoelectronic devices.

[0082] To solve the above technical problems, in some embodiments, referring to Figure 8 and Figure 9 , a partition member 10 is provided on the printed circuit board. The partition member 10 extends along the extension direction of the signal channel, and each signal channel is separated by the partition member 10 in different regions. This technical solution can reduce the crosstalk between each signal channel to a certain extent. However, due to structural limitations, only partial area isolation can be achieved, and it is impossible to isolate the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 inserted into the socket 9 in Figure 4 either. Therefore, the isolation degree is low, and the performance of the optoelectronic device will still be affected. In other embodiments, referring to Figure 10 , the signal radiation can also be reduced and the crosstalk can be reduced by covering the absorbing material 20 on part of the circuit. However, the absorbing material 20 will affect the transmission performance of the signal and bring certain negative impacts.

[0083] Referring to Figure 11 and Figure 14 , the present application provides an optical communication component, which includes an optoelectronic device 100 and a socket 9. One end of the optoelectronic device 100 can input / output optical signals, and correspondingly, the other end outputs / inputs electrical signals corresponding to the optical signals.

[0084] Further, the optoelectronic device 100 includes a printed circuit board 2. The two ends of the printed circuit board 2 along its length direction (such as the X direction shown in Figure 11 and Figure 14 ) are respectively the first end and the second end. A conductive contact assembly 3 is provided at the first end of the printed circuit board 2. The conductive contact assembly 3 is used for electrically connecting with the terminals in the socket 9 which is the insertion destination of the optoelectronic device 100. The conductive contact assembly 3 includes a signal transmitting conductive contact 31 and a signal receiving conductive contact 32. A first isolation strip 21 extending along the length direction of the printed circuit board 2 is further provided on the printed circuit board 2. The signal transmitting conductive contact 31 and the signal receiving conductive contact 32 are located on both sides of the first isolation strip 21 along the width direction of the printed circuit board 2 (such as the Y direction shown in Figure 11 and Figure 14 ).

[0085] The socket 9 is provided with a socket 91 which can allow the conductive contact assembly 3 to be inserted. An isolation rib is provided in the socket 91. The isolation rib can be the first isolation rib 92 shown in Figure 11 or a pair of second isolation ribs 93 shown in Figure 14 . When the conductive contact assembly 3 is inserted into the socket 91 (as shown in Figure 12 and Figure 16 ), the isolation rib can cooperate with the first isolation strip 21 to form a first isolation portion for isolating the signal transmitting conductive contact 31 and the signal receiving conductive contact 32.

[0086] In this application, by providing the first isolation strip 21 on the printed circuit board 2 and the isolation rib in the socket 9, after the conductive contact assembly 3 is inserted into the socket 9, the first isolation strip 21 on the printed circuit board 2 can overlap with the isolation rib in the socket 9 to form a first isolation portion. The first isolation portion can separate the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 in different isolation chambers, thereby realizing the physical isolation of the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 and reducing the crosstalk between the transmitted signal and the received signal.

[0087] In addition, in this application, by overlapping the first isolation strip 21 on the printed circuit board 2 with the isolation rib in the socket 9 to form a first isolation portion, the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 inserted into the socket 9 can be isolated, thereby enhancing the isolation degree and avoiding the problem of low isolation degree in the technical solutions shown in Figure 8 and Figure 9 , as well as the problem of affecting the signal transmission performance in the technical solution shown in Figure 10 .

[0088] This application does not limit the specific structure of the first isolation strip 21. Any structure that can cooperate with the isolation ribs in the socket 9 to isolate the signal - transmitting conductive contact 31 and the signal - receiving conductive contact 32 falls within the protection scope of this application.

[0089] In some implementation manners of this application with reference to Figures 11 to 13 , as shown in Figure 11 and Figure 13 , the first isolation strip 21 is a split groove 211. A first isolation rib 92 extending along the thickness direction of the socket 9's socket opening 91 (such as the Z - direction shown in Figure 11 ) is provided in the socket opening 91 of the socket 9. Both ends of the first isolation rib 92 along the Z - direction are connected to the top surface and the bottom surface of the socket opening 91 respectively, and the width of the split groove 211 matches that of the first isolation rib 92.

[0090] When the conductive contact assembly 3 is inserted into the socket 9, as shown in Figure 12 , the first isolation rib 92 is inserted into the split groove 211 to form a first isolation portion, so as to separate the signal - transmitting conductive contact 31 and the signal - receiving conductive contact 32 in different isolation spaces.

[0091] In some implementation manners of this application, a conductive layer connected to the ground is provided on the side wall of the split groove 211. The first isolation rib 92 is made of a conductive material and is connected to the ground. When the first isolation rib 92 is inserted into the split groove 211, the first isolation rib 92 contacts the conductive layer. Exemplarily, both the first isolation rib 92 and the conductive layer are made of a metal material, and the conductive layer covers the entire side wall of the split groove 211.

[0092] In some other implementation manners of this application with reference to Figures 14 to 19 , as shown in Figure 14 and Figure 17 , the first isolation strip 21 is located on the printed circuit board 2, made of a conductive material and connected to the ground. And, a pair of second isolation ribs 93 corresponding to the position of the first isolation strip 21 are provided in the socket opening 91 of the socket 9.

[0093] Specifically, as shown in the schematic detailed view of the socket in Figure 15 , a pair of second isolation ribs 93 includes a second upper isolation rib 931 and a second lower isolation rib 932. Both the second upper isolation rib 931 and the second lower isolation rib 932 are made of a conductive material and are connected to the ground. The second upper isolation rib 931 is connected to the top surface of the socket opening 91, the second lower isolation rib 932 is connected to the bottom surface of the socket opening 91, and a first opening 94 corresponding to the thickness of the first isolation strip 21 is provided between the second upper isolation rib 931 and the second lower isolation rib 932.

[0094] When the conductive contact assembly 3 is inserted into the socket 9, as shown in Figure 16 , Figure 18 and Figure 19As shown, the first isolation strip 21 is inserted into the first opening 94, and a pair of second isolation ribs 93 are respectively lapped with the first isolation strip 21 from the upper and lower sides of the plane where the printed circuit board 2 is located. That is, as Figure 19 shown, the second upper isolation rib 931 contacts the upper surface of the first isolation strip 21, and the second lower isolation rib 932 contacts the lower surface of the first isolation strip 21 to form a first isolation portion. The first isolation portion can separate the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 in different isolation spaces.

[0095] In this application, by grounding both the first isolation strip 21 and the isolation ribs in the socket 9, the signal isolation effect between the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 can be enhanced.

[0096] Refer to Figure 11 and Figure 14 , in some implementation manners of this application, the optoelectronic device 100 further includes a structural member 1 and an optical device 4. Among them, a cavity 11 is provided inside the structural member 1, the printed circuit board 2 is disposed in the cavity 11, and the optical device 4 is disposed at the second end of the printed circuit board 2.

[0097] In some implementation manners of this application, refer to Figures 20 to 22 , a second isolation strip 22 extending along the width direction of the printed circuit board 2 is further provided on the printed circuit board 2. The conductive contact assembly 3 and the optical device 4 are located on both sides of the second isolation strip 22 along the length direction of the printed circuit board 2. Isolation ribs are provided inside the structural member 1, and the second isolation strip 22 is used to cooperate with the isolation ribs inside the structural member 1 to form a second isolation portion for isolating the conductive contact assembly 3.

[0098] In this application, by providing the second isolation strip 22 on the printed circuit board 2, the second isolation strip 22 can be lapped with the isolation ribs inside the structural member 1 to form a second isolation portion. The second isolation portion can separate the conductive contact assembly 3 and other components (such as the optical device 4) on the printed circuit board 2 in different isolation chambers, thereby realizing physical isolation between the conductive contact assembly 3 and other components, reducing crosstalk between the conductive contact assembly 3 and other components, and improving the performance of the optoelectronic device.

[0099] In some implementation manners of this application, refer to Figure 21 , the second isolation strip 22 is located on the printed circuit board 2, made of a conductive material and connected to the ground. Refer to Figure 20 , a pair of third isolation ribs 12 corresponding to the position of the second isolation strip 22 are provided in the cavity 11 of the structural member 1. Specifically, as Figure 22As shown, a pair of third isolation ribs 12 includes a third upper isolation rib 121 and a third lower isolation rib 122. Both the third upper isolation rib 121 and the third lower isolation rib 122 are made of a conductive material and are connected to the ground. The third upper isolation rib 121 is connected to the top surface of the cavity 11, and the third lower isolation rib 122 is connected to the bottom surface of the cavity 11. A second opening 13 corresponding to the thickness of the second isolation band 22 is provided between the third upper isolation rib 121 and the third lower isolation rib 122. The printed circuit board 2 is inserted into the second opening 13, and a pair of third isolation ribs 12 respectively overlap with the second isolation band 22 from both sides of the plane where the printed circuit board 2 is located. That is, the third upper isolation rib 121 contacts the upper surface of the second isolation band 22, and the third lower isolation rib 122 contacts the lower surface of the second isolation band 22 to form a second isolation portion. The second isolation portion can separate the conductive contact component 3 and other components on the printed circuit board 2 into different isolation spaces.

[0100] In this application, by grounding both the second isolation band 22 and the isolation ribs in the structural member 1, the signal isolation effect between the conductive contact component 3 and the optical device 4 can be enhanced.

[0101] In some implementation manners of this application, referring to Figure 23 and Figure 24 , conductive adhesives 14 are provided between the third upper isolation rib 121 and the printed circuit board 2, and between the third lower isolation rib 122 and the printed circuit board 2. By providing the conductive adhesives 14 in this application, the sealing performance of the isolation chamber can be enhanced, thereby ensuring tight isolation.

[0102] In some implementation manners of this application, referring to Figure 25 and Figure 26 , the optoelectronic device provided in this application further includes a flexible circuit board 5 (FPC board), a signal transmission line 6, and a signal reception line 7. Among them, the flexible circuit board 5 is disposed between the optical device 4 and the printed circuit board 2, and the flexible circuit board 5 is used to connect the optical device 4 and the printed circuit board 2. The signal transmission line 6 extends along the length direction of the printed circuit board 2. One end of the signal transmission line 6 is electrically connected to the signal transmission conductive contact 31, and the other end is electrically connected to the optical device 4 after passing through the printed circuit board 2 and the flexible circuit board 5 in sequence. The signal transmission line 6 is used to transmit the signal emitted by the signal transmission conductive contact 31 to the optical device 4. The signal reception line 7 extends along the length direction of the printed circuit board 2. One end of the signal reception line 7 is electrically connected to the signal reception conductive contact 32, and the other end is electrically connected to the optical device 4 after passing through the printed circuit board 2 and the flexible circuit board 5 in sequence. The signal reception line 7 is used to transmit the signal emitted by the optical device 4 to the signal reception conductive contact 32.

[0103] When the socket 9 sends out a signal, the electrical signal sent out by the socket 9 sequentially passes through the signal - sending conductive contact 31 and the signal - sending line 6 and is transmitted to the optical device 4. Subsequently, the optical device 4 converts the electrical signal sent out by the socket 9 into an optical signal and transmits the optical signal outward. When an external optical signal comes, the optical device 4 converts the optical signal into an electrical signal. Subsequently, the electrical signal sequentially passes through the signal - receiving line 7 and the signal - receiving conductive contact 32 and is transmitted to the socket 9 so that the socket 9 can receive the signal.

[0104] Exemplarily, referring to Figure 27 , the flexible circuit board 5 is provided with a through - hole 53, and the optical device 4 is provided with a PIN - foot 41. The PIN - foot 41 is inserted into the through - hole 53 to realize the connection between the optical device 4 and the flexible circuit board 5.

[0105] In some implementation manners of the present application, referring to Figure 27 , the flexible circuit board 5 is provided with a second conductive region 51, and the second conductive region 51 is connected to the ground. Referring to Figure 28 , a first protrusion 15 corresponding to the position of the second conductive region 51 is provided in the cavity 11 of the structural member 1. The first protrusion 15 is made of a conductive material and is connected to the ground, and the first protrusion 15 is in contact with the second conductive region 51.

[0106] The inventor has explored and found that the impedance at the connection between the optical device 4 and the flexible circuit board 5 is discontinuous, which is prone to radiate electromagnetic waves outward. And due to the limited space inside the optoelectronic device, it is very difficult to completely shield the connection between the optical device 4 and the flexible circuit board 5, resulting in the coupling of radiated signals. In the present application, by providing the second conductive region 51 connected to the ground on the flexible circuit board 5 and making the second conductive region 51 overlap with the grounded first protrusion 15, the radiation resistance of the optical device 4 and the flexible circuit board 5 can be enhanced, while reducing the outward radiation and improving the isolation degree.

[0107] In some implementation manners of the present application, referring to Figure 27 and Figure 28 , the flexible circuit board 5 is provided with an extension plate 52, the second conductive region 51 is arranged on the extension plate 52, a second protrusion 16 opposite to the first protrusion 15 is provided in the cavity 11 of the structural member 1, a third opening 17 is provided between the first protrusion 15 and the second protrusion 16, the extension plate 52 is arranged in the third opening 17, and the first protrusion 15 and the second protrusion 16 are in contact with the extension plate 52 from both sides of the plane where the extension plate 52 is located to clamp the extension plate 52 in the third opening 17, so as to enable the second conductive region 51 to be in close contact with the first protrusion 15 and enhance the reliability of the device.

[0108] In some implementations of the present application, the flexible circuit board 5 has an upper surface layer, a lower surface layer, and an inner layer. The inner layer is disposed between the upper surface layer and the lower surface layer. The signal transmission line 6 and the signal reception line 7 both run in the inner layer of the flexible circuit board 5. This design can enhance the isolation between the signal transmission line 6 and the signal reception line 7, reduce the interference between the signal transmission line 6 and the signal reception line 7, and at the same time avoid the signal transmission line 6 and the signal reception line 7 from interfering with other channels or being interfered by other channels.

[0109] In some implementations of the present application, referring to Figure 29 , the signal transmission line 6 and the signal reception line 7 run on the surface layer of the flexible circuit board 5. On both sides of the signal transmission line 6 and / or the signal reception line 7 along the width direction of the printed circuit board 2 (as shown by the Y direction in Figure 29 ), a ground wire 8 is provided on each side. The ground wire 8 extends along the extension direction of the signal transmission line 6 and the signal reception line 7 (i.e., as shown by the X direction in Figure 29 ). Since the radiation signal generated by the signal transmission line 6 is relatively high compared to the signal reception line 7, the signal transmission line 6 is prone to interfering with the signal reception line 7. In the present application, by providing a ground wire 8 on each side of the signal transmission line 6, the electromagnetic radiation of the signal transmission line 6 to the signal reception line 7 can be restricted. By providing a ground wire 8 on each side of the signal reception line 7, the radiation resistance of the signal reception line 7 can be enhanced.

[0110] In some implementations of the present application, referring to Figure 30 , the printed circuit board 2 has an upper surface layer, a lower surface layer, and a plurality of inner layers. When the signal transmission line 6 and the signal reception line 7 run in the same printed circuit board 2, the signal transmission line 6 and the signal reception line 7 run in different inner layers of the same printed circuit board 2 respectively. When the number of printed circuit boards 2 is two, the signal transmission line 6 and the signal reception line 7 run in the inner layers of the two printed circuit boards 2 respectively. The above design can enhance the isolation between the signal transmission line 6 and the signal reception line 7, thereby reducing the interference between the signal transmission line 6 and the signal reception line 7.

[0111] Figure 31 This is a comparison diagram of the isolation effect experiment between the present application and the prior art. Figure 31 In, the line L1 represents the isolation between the signal reception channel and the signal transmission channel in the prior art, and the line L2 represents the isolation between the signal reception channel and the signal transmission channel after implementing the present application. It has been experimentally proven that without implementing the present application, the isolation between the signal reception channel and the signal transmission channel is poor, only about -40 dB can be achieved. After implementing the present application, the isolation between the signal reception channel and the signal transmission channel has been significantly improved, and can reach above -55 dB.

[0112] The present application also provides a socket, referring toFigure 11 and Figure 14 On the socket 9, there is a socket opening 91 which can allow any one of the optoelectronic devices described in combination with the foregoing embodiments Figures 11 - 30 to be inserted. Inside the socket opening 91, there is a partition rib, which can be Figure 11 the first partition rib 92 shown in Figure 14 or a pair of second partition ribs 93 shown in

[0113] When the optoelectronic device 100 is inserted into the socket opening 91, the partition rib inside the socket opening 91 can cooperate with the first isolation band 21 on the optoelectronic device 100 to form a first isolation part that isolates the signal transmitting conductive contact 31 and the signal receiving conductive contact 32 Figures 11 to 30 This application also provides an optical communication device, including any one of the optical communication components described in combination with the foregoing embodiments

[0114] The above uses specific specific embodiments to illustrate the implementation manners of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be introduced in combination with some embodiments, this does not mean that the features of this application are limited to this implementation manner. On the contrary, the purpose of introducing the application in combination with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of this application. This application can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of this application, some specific details are omitted in the description. It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other

[0115] In the embodiments of this application, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include one or more of such features

[0116] In the embodiments of this application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after

[0117] In the description of the embodiments of this application, it should be noted that unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium

[0118] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0119] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "arranged", "installed", "connected", "fitted" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0120] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

1. An optical communication component, comprising an optoelectronic device and a socket, characterized in that, the optoelectronic device includes a printed circuit board, two ends of the printed circuit board along its length direction are respectively a first end and a second end, a conductive contact assembly is provided at the first end of the printed circuit board, and the conductive contact assembly includes a signal transmission conductive contact and a signal reception conductive contact; a first isolation strip extending along the length direction of the printed circuit board is further provided on the printed circuit board, and the signal transmission conductive contact and the signal reception conductive contact are located on both sides of the first isolation strip along the width direction of the printed circuit board; the socket is provided with a socket opening, the socket opening can allow the insertion of the conductive contact assembly, and an isolation rib is provided in the socket opening; when the conductive contact assembly is inserted into the socket opening, the isolation rib can cooperate with the first isolation strip to form the first isolation part for isolating the signal transmission conductive contact and the signal reception conductive contact.

2. The optical communication component according to claim 1, wherein, The first isolation strip is a dividing groove, a first isolation rib is provided in the socket, the width of the dividing groove matches that of the first isolation rib, and, when the conductive contact assembly is inserted into the socket, the first isolation rib is inserted into the dividing groove to form the first isolation part, so as to separate the signal transmission conductive contact and the signal reception conductive contact in different isolation spaces.

3. The optical communication component according to claim 2, characterized in that, A conductive layer connected to the ground is provided on the side wall of the dividing groove, the first isolation rib is made of a conductive material and connected to the ground, and when the first isolation rib is inserted into the dividing groove, the first isolation rib contacts the conductive layer.

4. The optical communication component according to claim 1, characterized in that, the first isolation strip is located on the printed circuit board, made of a conductive material and connected to the ground, and, a pair of second isolation ribs corresponding to the position of the first isolation strip are provided in the socket, the pair of second isolation ribs are made of a conductive material and connected to the ground, and a first opening corresponding to the thickness of the first isolation strip is provided between the pair of second isolation ribs; when the conductive contact assembly is inserted into the socket, the first isolation strip is inserted into the first opening, and the pair of second isolation ribs respectively overlap with the first isolation strip from both sides of the plane where the printed circuit board is located to form the first isolation part, and the first isolation part can separate the signal transmission conductive contact and the signal reception conductive contact in different isolation spaces.

5. The optical communication component according to claim 1, characterized in that, The optoelectronic device further includes: a structural member, a cavity is provided inside the structural member, and the printed circuit board is arranged in the cavity; an optical device, arranged at the second end of the printed circuit board.

6. The optical communication component according to claim 5, wherein A second isolation strip extending along the width direction of the printed circuit board is provided on the printed circuit board, the conductive contact assembly and the optical device are located on both sides of the second isolation strip along the length direction of the printed circuit board, an isolation rib is provided in the structural member, and the second isolation strip is used to cooperate with the isolation rib in the structural member to form a second isolation part for isolating the conductive contact assembly and the optical device.

7. The optical communication component according to claim 6, characterized in that, The second isolation strip is located on the printed circuit board, made of a conductive material and connected to the ground, and, A pair of third isolation ribs corresponding to the position of the second isolation strip are provided in the cavity of the structural member. The pair of third isolation ribs are made of a conductive material and connected to the ground. A second opening corresponding to the thickness of the second isolation strip is provided between the pair of third isolation ribs; The printed circuit board is inserted into the second opening, and the pair of third isolation ribs are respectively lapped with the second isolation strip from both sides of the plane where the printed circuit board is located, so as to form the second isolation part for isolating the conductive contact component.

8. The optical communication component according to claim 7, wherein Conductive adhesives are respectively provided between the pair of third isolation ribs and both sides of the plane where the printed circuit board is located.

9. The optical communication component according to claim 5, wherein It further includes: A flexible circuit board is provided between the optical device and the printed circuit board, and the flexible circuit board is used to connect the optical device and the printed circuit board; A signal transmission line extends along the length direction of the printed circuit board. One end of the signal transmission line is electrically connected to the signal transmission conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence. The signal transmission line is used to transmit the signal sent by the signal transmission conductive contact to the optical device; A signal receiving line extends along the length direction of the printed circuit board. One end of the signal receiving line is electrically connected to the signal receiving conductive contact, and the other end is electrically connected to the optical device after passing through the printed circuit board and the flexible circuit board in sequence. The signal receiving line is used to transmit the signal sent by the optical device to the signal receiving conductive contact.

10. The optical communication component according to claim 9, characterized in that, A second conductive area is provided on the flexible circuit board, and the second conductive area is connected to the ground. A first protrusion corresponding to the position of the second conductive area is provided in the cavity of the structural member. The first protrusion is made of a conductive material and connected to the ground, and the first protrusion is in contact with the second conductive area.

11. The optical communication component according to claim 10, wherein An extension board is provided on the flexible circuit board, and the second conductive area is provided on the extension board. A second protrusion opposite to the first protrusion is provided in the cavity of the structural member. A third opening is provided between the first protrusion and the second protrusion. The extension board is provided in the third opening, and the first protrusion and the second protrusion are in contact with the extension board from both sides of the plane where the extension board is located.

12. The optical communication component according to claim 9, wherein, Both the signal transmission line and the signal receiving line are routed in the inner layer of the flexible circuit board.

13. The optical communication component according to claim 9, wherein The signal transmission line and the signal receiving line are routed on the surface layer of the flexible circuit board. One ground wire is provided on each of the two sides of the signal transmission line and / or the signal receiving line along the width direction of the printed circuit board, and the ground wire extends along the length direction of the printed circuit board.

14. The optical communication component according to claim 9, wherein, The printed circuit board includes a plurality of inner layers, and the signal transmission line and the signal receiving line are respectively routed in different inner layers of the same printed circuit board.

15. The optical communication component according to claim 9, characterized in that, The number of the printed circuit boards is two, and the signal transmission line and the signal receiving line are respectively routed in the inner layers of the two printed circuit boards.

16. A socket, characterized in that, It is provided with a socket, and isolation ribs are arranged inside the socket. The socket can allow the optoelectronic device in the optical communication component according to any one of claims 1 to 15 to be inserted. When the optoelectronic device is inserted into the socket, the isolation ribs can cooperate with the first isolation band on the optoelectronic device to form the first isolation portion that isolates the signal transmission conductive contact and the signal reception conductive contact.

17. An optical communication device, characterized in that, It includes the optical communication component according to any one of claims 1 to 15.

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