Control method of heat dissipation device and electronic equipment

Abstract

The invention discloses a control method of a heat dissipation device and electronic equipment, and relates to the field of control, the method comprises the steps that a control instruction is received, the control instruction is used for controlling and adjusting operation parameters of the heat dissipation device, and the heat dissipation device is used for dissipating heat of internal components of the electronic equipment; under the condition that a target operation parameter corresponding to the control instruction is matched with a current operation parameter of a heat dissipation device, the heat dissipation device is adjusted according to the target operation parameter; and ignoring the control instruction under the condition that the target operation parameter is not matched with the current operation parameter.

Description

Technical Field

[0001] This application relates to the field of control, and particularly to a control method for a heat dissipation device and an electronic device. Background Art

[0002] Currently, the heat dissipation device (such as a fan) in an electronic device mainly relies on the BMC (Baseboard Management Controller) to control the rotation speed. The BMC determines the operating parameters of the heat dissipation device according to internal set rules.

[0003] The operating system (OS) operates the BMC through an interface to control the fan speed. When the operating system encounters a kernel problem or error, it will increase the operating parameters of the heat dissipation device, which will cause the operating parameters to not match the actual situation of the heat dissipation device, resulting in high system noise and unnecessary power costs. Summary of the Invention

[0004] A first aspect of this application provides a control method for a heat dissipation device, which is applied to an electronic device and includes:

[0005] Receiving a control instruction for controlling and adjusting the operating parameters of the heat dissipation device, where the heat dissipation device is used to dissipate heat from the internal components of the electronic device;

[0006] When the target operating parameters corresponding to the control instruction match the current operating parameters of the heat dissipation device, adjusting the heat dissipation device according to the target operating parameters;

[0007] When the target operating parameters do not match the current operating parameters, ignoring the control instruction.

[0008] In a possible implementation, determining whether the target operating parameters match the current operating parameters includes:

[0009] Obtaining the current operating parameters of the heat dissipation device;

[0010] Determining the change amount between the target operating parameters and the current operating parameters;

[0011] Based on the change amount belonging to a preset change range, determining that the target operating parameters match the current operating parameters, where the preset change range corresponds to the current operating environment of the heat dissipation device.

[0012] In a possible implementation, obtaining the current operating parameters of the heat dissipation device includes:

[0013] Detecting the current temperature value of the heat dissipation device;

[0014] Based on the preset correspondence between the temperature value and the operating parameter, query the current operating parameter corresponding to the current temperature value.

[0015] In a possible implementation, it further includes:

[0016] Based on the matching between the target operating parameter and the current operating parameter, record the relevant information for adjusting the heat dissipation device;

[0017] Based on the non - matching between the target operating parameter and the current operating parameter, record the alarm information, and the alarm information is related to the control instruction.

[0018] In a possible implementation, before receiving the control instruction, it further includes:

[0019] Receive an enabling instruction, where the enabling instruction is generated based on an operation body triggering an enabling button or generated by a preset management software for managing the baseboard management controller.

[0020] In a possible implementation, it further includes:

[0021] Based on not receiving the enabling instruction, receive the control instruction;

[0022] Adjust the heat dissipation device according to the target operating parameter corresponding to the control instruction.

[0023] In a possible implementation, receiving the control instruction includes:

[0024] Based on the communication interface with the operating system, receive the control instruction.

[0025] The second aspect of this application provides an electronic device, including:

[0026] A heat dissipation device for dissipating heat from the internal components of the electronic device;

[0027] A processor for receiving a control instruction, where the control instruction is used to control and adjust the operating parameter of the heat dissipation device; in the case where the target operating parameter corresponding to the control instruction matches the current operating parameter of the heat dissipation device, adjust the heat dissipation device according to the target operating parameter; in the case where the target operating parameter does not match the current operating parameter, ignore the control instruction.

[0028] In a possible implementation, it further includes:

[0029] A temperature sensor for detecting the current temperature value of the heat dissipation device;

[0030] Correspondingly, the processor is used to query the current operating parameter corresponding to the current temperature value based on the preset correspondence between the temperature value and the operating parameter.

[0031] In a possible implementation, it further includes:

[0032] An input device, configured to generate an opening instruction based on a received input operation, where the input operation is used to trigger an opening button;

[0033] Correspondingly, the processor is configured to execute the step of receiving a control instruction based on the received opening instruction.

[0034] A third aspect of the present application provides a computer program product, including computer-readable instructions, which when running on an electronic device, enable the electronic device to implement the control method of the heat dissipation device in the above first aspect or any implementation manner of the first aspect.

[0035] A fourth aspect of the present application provides an electronic device, including at least one processor and a memory connected to the processor, where:

[0036] The memory is used to store a computer program;

[0037] The processor is configured to execute the computer program so that the electronic device can implement the control method of the heat dissipation device in the above first aspect or any implementation manner of the first aspect.

[0038] A fifth aspect of the present application provides a computer storage medium, where the storage medium carries one or more computer programs, and when the one or more computer programs are executed by an electronic device, the electronic device can implement the control method of the heat dissipation device in the above first aspect or any implementation manner of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In combination with the accompanying drawings and with reference to the following specific embodiments, the above and other features, advantages and aspects of the various embodiments of the present disclosure will become more apparent. Throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic, and the original elements and elements are not necessarily drawn to scale.

[0040] Figure 1 is a flowchart showing a control method of a heat dissipation device provided by an embodiment of the present application;

[0041] Figure 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0042] Figure 3 is a flowchart showing a process of determining whether the target operating parameter matches the current operating parameter provided by an embodiment of the present application;

[0043] Figure 4 is another flowchart showing a control method of a heat dissipation device provided by an embodiment of the present application;

[0044] Figure 5 It is another schematic flowchart of a control method for a heat dissipation device provided by an embodiment of the present application;

[0045] Figure 6 It is a schematic structural diagram of an electronic device applying a control method for a heat dissipation device provided by an embodiment of the present application;

[0046] Figure 7 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Specific embodiments

[0047] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0048] The embodiments of the present application will be described below with reference to the accompanying drawings. Those of ordinary skill in the art will know that with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0049] The terms "first", "second", etc. in the specification, claims and above-mentioned drawings of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances, which is only a way of distinguishing when describing objects with the same attributes in the embodiments of the present application. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion, so that a process, method, system, product or device comprising a series of units does not have to be limited to those units, but may include other units not clearly listed or inherent to these process, method, product or device.

[0050] Figure 1 It is a schematic flowchart of a control method for a heat dissipation device provided by an embodiment of the present application. As Figure 1 shown, a control method for a heat dissipation device provided by an embodiment of the present application may include steps 101 to 103, and these steps will be described in detail below.

[0051] 101. Receive a control instruction for controlling and adjusting the operating parameters of a heat dissipation device for dissipating heat from internal components of an electronic device;

[0052] Among them, the control method of the heat dissipation device is applied to the BMC of the electronic device. The BMC receives the control instruction sent by the operating system and responds to the control instruction to control the operation of the heat dissipation device.

[0053] Among them, the heat dissipation device in the electronic device may include one or more. The heat dissipation device may be a fan, or a thermoelectric cooler, etc. The specific form of the heat dissipation device is not limited in this application.

[0054] Among them, heat is generated during the operation of the internal components of the electronic device. In order to ensure the normal operation of the internal components, it is necessary to dissipate heat from the internal components.

[0055] In a possible implementation, the installation position of the heat dissipation device is close to the internal component to achieve timely heat dissipation of the internal component.

[0056] In a possible implementation, when the heat dissipation device uses a fan, the heat dissipation device is respectively arranged at positions close to the air outlet and air inlet of the electronic device, etc., so as to form a flowing wind inside the electronic device. The wind flows through the internal components, takes away the heat of the internal components, and realizes the heat dissipation of the internal components.

[0057] Among them, the control instruction may be a control instruction sent by the OS to the BMC, and the control instruction is used to adjust the operating parameters of the heat dissipation device in the electronic device.

[0058] In a possible implementation, the control instruction may be an IPMI (Intelligent Platform Management Interface, a standard interface for managing and monitoring computer system hardware) instruction, or a command under the OS (such as pwmconfig / fancontrol).

[0059] As an example, when the heat dissipation device is an electric fan, the control instruction may be an instruction for adjusting the rotation speed of the electric fan.

[0060] Among them, the control instruction corresponds to the target operating parameter. It may be that the target operating parameter is carried in the control instruction, or it may be the target operating parameter determined by the BMC according to the control instruction.

[0061] In a possible implementation, the target operating parameter may be carried in the control instruction. Correspondingly, after receiving the control instruction, the BMC parses the control instruction and can obtain the target operating parameter carried therein.

[0062] In a possible implementation, the control instruction may be an instruction indicating a change in the operating parameter gear of the heat dissipation device. Correspondingly, the operating parameters corresponding to each gear are preset in the BMC, and the BMC can use the control instruction to determine the target operating parameter corresponding to the corresponding gear.

[0063] In a possible implementation, receiving the control instruction includes: receiving the control instruction based on the communication interface with the operating system.

[0064] Among them, a communication bus is set between the operating system and the BMC, and a corresponding communication interface is set in the BMC. The BMC receives, through this communication, control instructions sent by the operating system.

[0065] Among them, this communication interface can adopt KCS (Keyboard Controller Style, a standard system interface), and under the OS, IPMI instructions can be sent to the BMC through this KCS interface.

[0066] As an example, this control instruction instructs the heat dissipation device to increase an operating gear. Currently, the gear of the heat dissipation device is gear 2. Correspondingly, after receiving this control instruction, the BMC parses this control instruction, determines that it is to increase an operating gear, determines that the corresponding gear is gear 3, and further determines that the operating parameters corresponding to gear 3 are the target operating parameters.

[0067] In a possible implementation, the control instruction can be an instruction indicating the operating parameter gear of the heat dissipation device. Correspondingly, the operating parameters corresponding to each gear are preset in the BMC, and the BMC can use this control instruction to determine the target operating parameters corresponding to this operating parameter gear.

[0068] As an example, this control instruction instructs the heat dissipation device to switch to gear 2 of the operating gear. Correspondingly, after receiving this control instruction, the BMC parses this control instruction, determines that it is to switch to gear 2, and further determines that the operating parameters corresponding to gear 2 are the target operating parameters.

[0069] 102. When the target operating parameters corresponding to this control instruction match the current operating parameters of the heat dissipation device, adjust the heat dissipation device according to this target operating parameter;

[0070] Among them, when the operating system encounters a kernel problem or error, for example, an ACPI (Advanced Configuration and Power Interface) driver configuration error under the OS Kernel causes the BMC to be unable to read the ambient temperature or the temperature of other sensors through the OS, thereby triggering an increase in the heat dissipation device parameters; for example, system software / malware under the OS adjusts or excessively adjusts the fan speed through the interface.

[0071] In an implementation scenario, since the BMC only determines the fan speed according to the fan table value, when the OS sends an instruction to increase the fan speed, the BMC increases the operating parameters of the heat dissipation device, which will cause the operating parameters to not match the actual situation of the heat dissipation device.

[0072] Therefore, after determining the target operating parameters corresponding to the control instruction, compare the target operating parameters with the current operating parameters adopted by the heat dissipation device to determine whether they match.

[0073] Among them, whether the target operating parameters match the current operating parameters can indicate whether the adjustment of the operating parameters of the heat dissipation device by the control instruction matches the actual situation of the heat dissipation device. If the target operating parameters match the current operating parameters, when adjusting the heat dissipation device using the target operating parameters, there will be no situation where the adjusted operating parameters of the heat dissipation device do not match the actual situation of the heat dissipation device, nor will there be problems such as a sudden increase in the system noise of the electronic device or an increase in the power cost of the electronic device.

[0074] Among them, if the target operating parameters match the current operating parameters, it can be determined that the adjustment of the operating parameters of the heat dissipation device this time matches the actual situation of the heat dissipation device, and the adjustment can be carried out.

[0075] Correspondingly, according to the target operating parameters, adjust the operating parameters of the heat dissipation device. The BMC adjusts the operating parameters of the heat dissipation device to the target operating parameters. Subsequently, the MBC controls the operation of the heat dissipation device with the target operating parameters.

[0076] 103. In the case where the target operating parameters do not match the current operating parameters, ignore the control instruction.

[0077] Among them, if the target operating parameters do not match the current operating parameters, it can be determined that the adjustment of the operating parameters of the heat dissipation device this time does not match the actual situation of the heat dissipation device. If the target operating parameters are used to adjust the operating parameters of the heat dissipation device, problems such as high system noise and increased power cost may occur.

[0078] Correspondingly, the control instruction can be ignored, and the operating parameters of the heat dissipation device are not adjusted. The heat dissipation device continues to operate with the current operating parameters.

[0079] Figure 2 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application, including: CPU201, BMC202, heat dissipation device203, and internal components204.

[0080] Among them, the CPU201 carries the operating system of the electronic device. The BMC202 receives the control instruction of the operating system and controls the operation of the heat dissipation device203 according to the control instruction. The heat dissipation device203 is used to dissipate heat from the internal components204.

[0081] Among them, heat is generated during the operation of the internal component 204, and the operating system carried by the CPU 201 can control the operation of the heat dissipation device through the BMC 202. After receiving the control instruction from the operating system, the BMC 202 first verifies the control instruction to determine whether the target operating parameter corresponding to the control instruction matches the current operating parameter of the heat dissipation device 203. If they match, the BMC 202 responds to the control instruction and subsequently controls the operation of the heat dissipation device 203 using the target operating parameter corresponding to the control instruction. Otherwise, the BMC 202 does not respond to the control instruction, which may mean ignoring the target operating parameter, and subsequently controls the operation of the heat dissipation device 203 based on the current operating parameter.

[0082] Among them, the Figure 2 separately represents the CPU and the internal component. In the hardware structure of the electronic device, the CPU may belong to the internal component.

[0083] In this embodiment, a control instruction is received, and the control instruction is used to control and adjust the operating parameter of the heat dissipation device, and the heat dissipation device is used to dissipate heat from the internal components of the electronic device; when the target operating parameter corresponding to the control instruction matches the current operating parameter of the heat dissipation device, the heat dissipation device is adjusted according to the target operating parameter; when the target operating parameter does not match the current operating parameter, the control instruction is ignored. After receiving the control instruction, it is verified to prevent the problem that the operating parameter of the heat dissipation device is suddenly adjusted to not match the actual situation of the heat dissipation device, so that the system of the electronic device will not suddenly produce a large noise, and the power cost of the electronic device can be reduced.

[0084] Figure 3 It is a schematic flowchart of the process for determining whether the target operating parameter matches the current operating parameter provided by the embodiment of the present application, which may include steps 301 to 303, and these steps will be described in detail below.

[0085] 301. Obtain the current operating parameter of the heat dissipation device;

[0086] Among them, in order to determine whether the target operating parameter and the current operating parameter of the heat dissipation device match, the current operating parameter of the heat dissipation device needs to be obtained.

[0087] In a possible implementation, the current operating parameter of the heat dissipation device can be determined through the relevant information of historical adjustment, and the current operating parameter can be obtained.

[0088] As an example, the record of the last adjustment of the operating parameter of the heat dissipation device by the BMC is recorded in the log, and the current operating parameter of the heat dissipation device can be determined by querying the log.

[0089] In a possible implementation, a fan table is set in the BMC, and the current operating parameters of the heat dissipation device can be queried through this fan table.

[0090] Among them, obtaining the current operating parameters of the heat dissipation device may include the following steps:

[0091] 3011. Detect the current temperature value of the heat dissipation device;

[0092] Among them, the operating parameters of the heat dissipation device may correspond to the ambient temperature where it is located. Correspondingly, by detecting the current temperature value of the heat dissipation device, the current operating parameters of the heat dissipation device are determined.

[0093] Among them, the current temperature value of the heat dissipation device may be the temperature in the environment where the heat dissipation device is located, or the temperature of the internal components corresponding to the heat dissipation device.

[0094] In a possible implementation, a temperature sensor is internally set in the electronic device, and the temperature of the internal components is detected by using this temperature sensor. The heat dissipation device is close to the internal components, and the temperature detected by the temperature sensor can be used as the temperature of the heat dissipation device.

[0095] In a possible implementation, during the operation of each electronic component in the environment where the heat dissipation device is located, the operating parameters of the electronic component may include its component temperature. By reading the operating parameters of the component, the temperature of the environment where the heat dissipation device is located can be determined, and the temperature of this environment is used as the current temperature value of the heat dissipation device.

[0096] Among them, if there are multiple fans in the heat dissipation device of the electronic device, individual control can be performed for each fan, and different preset corresponding relationships are set for each fan respectively.

[0097] 3012. Based on the preset corresponding relationship between the temperature value and the operating parameters, query the current operating parameters corresponding to the current temperature value.

[0098] Among them, the preset corresponding relationship between the temperature value and the operating parameters is recorded in the BMC, and the operating parameters of the heat dissipation device correspond to its temperature.

[0099] Correspondingly, after determining the current temperature value of the heat dissipation device, the current operating parameters can be queried according to this preset corresponding relationship.

[0100] In a possible implementation, this preset corresponding relationship can adopt a fan table.

[0101] Among them, the current operating parameters corresponding to the current temperature value are queried in the fan table. Correspondingly, the BMC reads the fan table to obtain the current operating parameters corresponding to the current temperature value of the heat dissipation device.

[0102] As shown in Table 1 below, there is a schematic diagram of a fan table.

[0103] Table 1

[0104]

[0105] In the above Table 1, the heat dissipation device uses a fan to dissipate heat from internal components such as (CPU, Central Processing Unit, central processing unit), and the heat dissipation device can be set near the internal components.

[0106] Among them, when the current temperature of the heat dissipation device is within 50°C, the fan speed adopts a relatively low value, and as the temperature increases, the fan speed also increases accordingly.

[0107] Among them, in Table 1, the operating parameters used by the BMC to control the operation of the heat dissipation device can adopt PWM (Pulse-Width Modulation, pulse width modulation). The value of the fan speed is the ratio of the high level in the pulse of PWM in the entire control cycle, and the high level drives the fan to rotate. According to Table 1 above, the higher the ambient temperature, the larger the PWM value, the longer the driving time of the fan to rotate, and correspondingly, the higher the fan speed.

[0108] Among them, due to the different installation positions of the fans, different operating parameters can be set.

[0109] In a possible implementation, the corresponding relationship between temperature and speed (revolutions per second) can also be set. Through this corresponding relationship, the fan speed corresponding to the current temperature value can be queried.

[0110] 302. Determine the change amount between the target operating parameter and the current operating parameter;

[0111] Among them, after obtaining the current operating parameters of the heat dissipation device, the target operating parameter can be compared with the current operating parameter to determine the change amount between the two.

[0112] Among them, in order to prevent the operating parameters of the heat dissipation device from suddenly changing drastically, resulting in a situation where they do not match the operating environment of the heat dissipation device, the operating parameters of the heat dissipation device can be controlled to change slightly.

[0113] Among them, based on the change amount between the target operating parameter and the current operating parameter, it can be determined whether the operating parameters of the heat dissipation device have suddenly changed drastically.

[0114] In a possible implementation, the change amount is equal to the difference between the target operating parameter and the current operating parameter.

[0115] As an example, the heat dissipation device is a fan, the target operating parameter corresponds to the rotational speed A, the current operating parameter corresponds to the rotational speed B, and the change amount C = A - B.

[0116] In a possible implementation, the operating parameter of the fan is implemented by using PWM pulses. Correspondingly, the change amount between the target operating parameter and the current operating parameter can be the variable of the high-level ratio in the PWM pulses.

[0117] As an example, the heat dissipation device is a fan, the target operating parameter corresponding to the PWM value is 30%, the current operating parameter corresponding to the PWM value is 20%, and the change amount is 10%.

[0118] 303. Based on that the change amount belongs to a preset change range, determine that the target operating parameter matches the current operating parameter, and the preset change range corresponds to the current operating environment of the heat dissipation device.

[0119] Among them, if the change amount of the operating parameter of the heat dissipation device is within the preset change range, the target operating parameter and the current operating parameter match, and there will be no problem of large noise caused by sudden drastic changes in the operating parameter.

[0120] Among them, the operating environment of the heat dissipation device is the temperature in the operating environment. Correspondingly, the preset change range corresponds to the temperature in the current environment where the heat dissipation device is located.

[0121] Correspondingly, after determining the change amount of the operating parameter of the heat dissipation device, determine whether the change amount belongs to the preset change range. If the change amount belongs to the preset change range, determine that the target operating parameter can match the current operating environment of the heat dissipation device.

[0122] If the change amount does not belong to the preset change range, the control instruction may be an incorrect instruction due to a kernel problem or an error. If the operating parameter of the heat dissipation device is adjusted according to the target operating parameter of the control instruction, the target operating parameter does not match the current operating environment of the heat dissipation device, and there will be a problem of large noise caused by sudden drastic changes in the operating parameter.

[0123] Among them, different heat dissipation devices dissipate heat for different internal components in the electronic device. Due to the different importance levels and heat dissipation requirements of each internal component, the values of the preset change ranges of different heat dissipation devices can be different.

[0124] As shown in Table 2 below is a schematic of a fan table.

[0125] Table 2

[0126]

[0127] Among them, the operating parameters adopted by the BMC to control the operation of the heat dissipation device can use PWM.

[0128] The internal components corresponding to the front fan have greater heat dissipation requirements. Correspondingly, for the same ambient temperature, the operating parameters of the front fan are greater than those of the rear fan, so that the front fan can rotate at a higher speed and dissipate heat from the corresponding internal components more quickly.

[0129] Among them, the preset change range can be the adjustment of the duty ratio of PWM.

[0130] As an example, the preset change range can be ±15%, ±20%, ±10%, etc. The value of the preset change range can be set according to the actual situation and is not limited in this application.

[0131] As an example, the preset change range of Fan 1 is ±15%. If the current operating parameter (represented by PWM) of Fan 1 is 20% and the target operating parameter is 30%, the change amount between the two is 10%. Within this preset change range, it is determined that the two match, and then the heat dissipation device is controlled to operate with 30% subsequently. If the current operating parameter of Fan 1 is 20% and the target operating parameter is 50%, the change amount between the two is 30%. Since it exceeds this preset change range, it is determined that the two do not match, and then the heat dissipation device continues to be controlled to operate with 20% subsequently.

[0132] Among them, the change values in two adjacent temperature regions in the fan table are relatively small. Correspondingly, the preset change range is set to a relatively small value.

[0133] Among them, because the value of the preset change range is relatively small, when the gap between the target operating parameter and the current operating parameter is small, the control instruction can be responded to, and the situation where the operating parameter of the heat dissipation device does not match its operating environment will not occur.

[0134] In this embodiment, the current operating parameter of the heat dissipation device is obtained; the change amount between the target operating parameter and the current operating parameter is determined; based on the change amount belonging to the preset change range, it is determined that the target operating parameter and the current operating parameter match. The preset change range corresponds to the current operating environment of the heat dissipation device. By the change amount between the current operating parameter and the target operating parameter of the heat dissipation device, it can be determined whether the change amount belongs to the preset change range, and thus it can be determined whether the target operating parameter and the current operating parameter match. Whether the target operating parameter and the current operating parameter match can be determined through simple calculation. This verification process will not cause a sharp increase in the processing burden of the electronic device and can maintain the normal processing of the electronic device.

[0135] Figure 4It is another process schematic diagram of a control method for a heat dissipation device provided by an embodiment of the present application. In addition to the steps in Figure 1 , the control method for the heat dissipation device further includes steps 401 to 402, and these steps will be described in detail below.

[0136] 401. Based on the matching of the target operating parameter and the current operating parameter, record the relevant information for adjusting the heat dissipation device;

[0137] Among them, when the target operating parameter matches the current operating parameter, it can be determined that adjusting the operating parameter of the heat dissipation device using the target operating parameter can adjust the heat dissipation capacity of the heat dissipation device and will not introduce the problem of mismatch between the operating parameter and the actual situation of the heat dissipation device.

[0138] Then, when it is determined that the target operating parameter matches the current operating parameter, adjust the heat dissipation device according to the target operating parameter. Correspondingly, the relevant information of the heat dissipation device is also recorded.

[0139] Among them, the relevant information may include adjusting the operating parameter of the heat dissipation device to the target operating parameter, the current temperature value of the heat dissipation device, the current operating parameter, etc. The specific content included in the relevant information is not limited in the present application.

[0140] 402. Based on the non - matching of the target operating parameter and the current operating parameter, record the alarm information, and the alarm information is related to the control instruction.

[0141] Among them, when it is determined that the target operating parameter does not match the current operating parameter, it is necessary to alarm the control instruction received this time, so as to analyze and process the situation where the operating system generates the control instruction subsequently.

[0142] Among them, the alarm information is also recorded for viewing the alarm this time subsequently.

[0143] Among them, the alarm information may include the alarm time, the corresponding target operating parameter, the current temperature value of the heat dissipation device, the current operating parameter, etc. The specific content included in the alarm information is not limited in the present application.

[0144] In a possible implementation, the recorded alarm information and the relevant information for adjusting the heat dissipation device are recorded in the BMC log LOG for technicians or administrators to view and detect whether there is any abnormality in the operation of the BMC.

[0145] As an example, the operation of normally processing the adjustment of the operating parameter is recorded as Info LOG, and the operation of ignoring the adjustment of the operating parameter is recorded as Warning LOG.

[0146] In this embodiment, based on the matching between the target operating parameters and the current operating parameters, relevant information for adjusting the heat dissipation device is recorded; based on the non - matching between the target operating parameters and the current operating parameters, alarm information is recorded, and this alarm information is related to the control instruction. Two corresponding response methods for the matching and non - matching between the target operating parameters and the current operating parameters are recorded, providing a basis for subsequent viewing and detection.

[0147] In a possible implementation, before receiving the control instruction, it further includes:

[0148] Receiving an enable instruction, which is generated based on an operator triggering an enable button or generated by a preset management software for managing the Baseboard Management Controller (BMC).

[0149] Among them, in the BMC, for the process of verifying the received control instruction, a verification mode is set. If the verification mode of the BMC is enabled, the process of verifying whether the target operating parameters in the control instruction match the current operating parameters of the heat dissipation device in the foregoing embodiment is executed. If they match, the heat dissipation device is adjusted according to the target operating parameters; if they do not match, the control instruction is ignored.

[0150] In a possible implementation, a control interface is set, and an enable button for the verification mode is set in this control interface. The operator can trigger this enable button, and based on the triggering of the enable button, an enable instruction is generated.

[0151] Among them, this control interface can be a dedicated interface for configuring or controlling the BMC, or an interface combined with other functions. An enable button for the verification mode is set in this interface, and the form of this interface is not limited in this application.

[0152] Among them, a preset management software can be set in this electronic device, and this preset management software can be used to manage the BMC to realize the opening and closing of the verification mode in the BMC.

[0153] Among them, this management software can generate an enable instruction. After the BMC receives the enable instruction, it executes the control method of the heat dissipation device in the foregoing embodiment.

[0154] In this embodiment, an enable instruction is received. The enable instruction is generated based on an operation body triggering an enable button or generated by a preset management software for managing a baseboard management controller. When the enable instruction is received, after receiving a control instruction, it is determined whether the target operating parameter corresponding to the control instruction matches the current operating parameter of the heat dissipation device, and different responses are made for different matching situations. Since the enable instruction can be generated by an operation body triggering an enable button or generated by the preset management software for managing the baseboard management controller, it is possible to make settings according to the requirements of the electronic device.

[0155] Figure 5 FIG. 4 is another flowchart of a control method for a heat dissipation device provided by an embodiment of the present application. In addition to the steps in the foregoing figures, the control method for the heat dissipation device includes steps 501 to 502, and these steps are described in detail below.

[0156] 501. Receive a control instruction based on not receiving an enable instruction;

[0157] Among them, if the enable instruction is not received, indicating that the verification mode of the BMC is not enabled, then a response method different from the enabled verification mode is adopted.

[0158] Among them, in the case where the verification mode is not enabled, the receiving method of the control instruction is the same as the receiving method of the BMC after the verification mode is enabled, and this is not elaborated in this embodiment.

[0159] 502. Adjust the heat dissipation device according to the target operating parameter corresponding to the control instruction.

[0160] Among them, the control instruction is parsed to determine the target operating parameter corresponding to the control instruction.

[0161] Among them, for the process of parsing the control instruction to obtain the target operating parameter corresponding to the instruction, please refer to the explanation in step 101 of the foregoing embodiment, and this is not elaborated here.

[0162] Among them, after determining the target operating parameter corresponding to the control instruction, the heat dissipation device is adjusted according to the target operating parameter, and the operating parameter of the heat dissipation device is controlled to be the target operating parameter.

[0163] In this embodiment, a control instruction is received based on not receiving an enable instruction; the heat dissipation device is adjusted according to the target operating parameter corresponding to the control instruction. If the enable instruction is not received, it can be determined that the verification mode of the BMC is not enabled, and the received control instruction can be directly responded to without verifying the target operating parameter corresponding to the control instruction. Whether to verify the control instruction can be set by whether the verification mode is enabled.

[0164] The above has introduced a control method for a heat dissipation device provided by an embodiment of the present application. Next, an electronic device for executing the above control method of the heat dissipation device will be introduced.

[0165] Please refer to Figure 6 , Figure 6 which is a schematic structural diagram of an electronic device applying a control method for a heat dissipation device provided by an embodiment of the present application. As Figure 6 shown, the electronic device 600 includes:

[0166] A heat dissipation device 601 for dissipating heat from the internal components of the electronic device;

[0167] Among them, during the operation of the internal components of the electronic device, heat is dissipated, and the heat dissipation device is used to dissipate heat from the internal components.

[0168] In a possible implementation, the heat dissipation device can be one or more electric fans. In the electronic device, the heat dissipation device can be arranged near the internal components to dissipate the heat generated by the internal components in a timely manner.

[0169] In a possible implementation, the heat dissipation device can be a thermoelectric cooler, and the thermoelectric cooler is arranged near the internal components to dissipate heat and cool down the internal components.

[0170] A processor 602 for receiving a control instruction, where the control instruction is used to control and adjust the operating parameters of the heat dissipation device; when the target operating parameters corresponding to the control instruction match the current operating parameters of the heat dissipation device, adjust the heat dissipation device according to the target operating parameters; when the target operating parameters do not match the current operating parameters, ignore the control instruction.

[0171] Among them, the processor can be the BMC in the electronic device, and the BMC can receive the control instruction sent by the operating system and control the operating parameters of the heat dissipation device.

[0172] In a possible implementation, the processor receiving the control instruction includes:

[0173] Receiving the control instruction based on the communication interface with the operating system.

[0174] In a possible implementation, the processor determines whether the target operating parameters match the current operating parameters, including:

[0175] Obtaining the current operating parameters of the heat dissipation device;

[0176] Determining the change amount between the target operating parameters and the current operating parameters;

[0177] Based on that the change amount belongs to a preset change range, it is determined that the target operating parameter matches the current operating parameter, and the preset change range corresponds to the current operating environment of the heat dissipation device.

[0178] In a possible implementation, the electronic device further includes a temperature sensor.

[0179] Wherein, the temperature sensor 703 is used to detect the current temperature value of the heat dissipation device;

[0180] Correspondingly, the processor is used to query the current operating parameter corresponding to the current temperature value based on the preset corresponding relationship between the temperature value and the operating parameter.

[0181] Wherein, the temperature sensor can be arranged near the heat dissipation device to detect the temperature of the environment where the heat dissipation device is located, and obtain the current temperature value of the heat dissipation device.

[0182] In a possible implementation, the temperature value detected by the temperature sensor can be directly used as the current temperature of the heat dissipation device, or the conversion relationship between the ambient temperature and the temperature of the heat dissipation device can be set, and then the current temperature value of the heat dissipation device is converted according to the detected temperature value. In this application, the conversion relationship between the temperature detected by the heat dissipation device and the current temperature of the heat dissipation device is not limited.

[0183] Wherein, after detecting the current temperature value of the heat dissipation device, the processor can also determine the current operating parameter corresponding to the current temperature value based on the preset corresponding relationship between the temperature value and the operating parameter.

[0184] Wherein, the preset corresponding relationship can be a fan table. By querying the current temperature value, the corresponding operating parameter can be obtained, and the obtained operating parameter is used as the current operating parameter of the heat dissipation device.

[0185] In a possible implementation, the processor is further used for:

[0186] Based on that the target operating parameter matches the current operating parameter, record the relevant information for adjusting the heat dissipation device;

[0187] Based on that the target operating parameter does not match the current operating parameter, record the alarm information, and the alarm information is related to the control instruction.

[0188] In a possible implementation, the electronic device further includes: an input device.

[0189] Wherein, the input device is used to generate an enabling instruction based on the received input operation, and the input operation is used to trigger the enabling button;

[0190] Correspondingly, the processor is used to execute the step of receiving the control instruction based on the received enabling instruction.

[0191] Among them, the input device can be structures such as a touch screen, a keyboard and mouse, etc. In this application, the specific structure of the input device is not limited.

[0192] In a possible implementation, the processor is further configured to:

[0193] Based on not receiving an enabling instruction, receive a control instruction;

[0194] Adjust the heat dissipation device according to the target operating parameters corresponding to the control instruction.

[0195] For the functional explanation of the processor, please refer to the explanation in the foregoing method embodiment, and details are not described herein again.

[0196] In this embodiment, the heat dissipation device is used to dissipate heat from the internal components of the electronic device; the processor is used to receive a control instruction, and the control instruction is used to control and adjust the operating parameters of the heat dissipation device; when the target operating parameters corresponding to the control instruction match the current operating parameters of the heat dissipation device, adjust the heat dissipation device according to the target operating parameters; when the target operating parameters do not match the current operating parameters, ignore the control instruction. After receiving the control instruction, verification of the control instruction is realized to prevent the problem that the operating parameters of the heat dissipation device are suddenly adjusted to not match the actual situation of the heat dissipation device, so that the system of the electronic device will not suddenly produce a large noise, and the power cost of the electronic device can be reduced.

[0197] In the embodiments of the present application, an electronic device is further provided. Refer to Figure 7 As shown, it shows a schematic structural diagram of an electronic device suitable for implementing the control method of the heat dissipation device in the embodiments of the present application. The electronic device in the embodiments of the present application may include, but is not limited to, fixed terminals such as mobile phones, laptop computers, PDAs (Personal Digital Assistants), PADs (Tablet Computers), desktop computers, and the like. Figure 7 The electronic device shown is only an example and should not bring any limitation to the functions and usage scope of the embodiments of the present application.

[0198] As Figure 7 shown, the electronic device may include a processing device (such as a central processing unit, a graphics processing unit, etc.) 701, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 702 or a program loaded from a storage device 708 into a random access memory (RAM) 703. When the electronic device is powered on, various programs and data required for the operation of the electronic device are also stored in the RAM 703. The processing device 701, the ROM 702, and the RAM 703 are connected to each other through a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0199] Typically, the following devices can be connected to the I / O interface 705: an input device 706 including, for example, a touch screen, a touch pad, a keyboard, a mouse, a camera, a microphone, an accelerometer, a gyroscope, etc.; an output device 707 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 708 including, for example, a memory card, a hard disk, etc.; and a communication device 709. The communication device 709 can allow the electronic device to communicate with other devices wirelessly or wiredly to exchange data. Although Figure 7 an electronic device with various devices is shown, it should be understood that it is not required to implement or have all the shown devices. Instead, more or fewer devices can be implemented or had.

[0200] An embodiment of the present application also provides a computer program product including computer-readable instructions. When the computer-readable instructions run on an electronic device, the electronic device implements any one of the control methods of the heat dissipation device provided by the embodiment of the present application.

[0201] An embodiment of the present application also provides a computer-readable storage medium. The storage medium carries one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can implement any one of the control methods of the heat dissipation device provided by the embodiment of the present application.

[0202] In addition, it should be noted that the device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. In addition, in the drawings of the device embodiments provided by the present application, the connection relationships between the modules indicate that they have communication connections, which can be specifically implemented as one or more communication buses or signal lines.

[0203] Through the description of the above embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general hardware. Of course, it can also be implemented by dedicated hardware including application-specific integrated circuits, dedicated CPUs, dedicated memories, dedicated components, etc. Generally, functions completed by computer programs can be easily implemented by corresponding hardware, and the specific hardware structures for implementing the same function can also be diverse, such as analog circuits, digital circuits, or dedicated circuits. However, for this application, in more cases, software program implementation is a better implementation method. Based on such an understanding, the technical solution of this application, in essence, or the part that makes a contribution to the prior art, can be embodied in the form of a software product. This computer software product is stored in a readable storage medium, such as a computer floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk, or optical disc, etc., and includes several instructions to enable a computer device (which can be a personal computer, training device, or network device, etc.) to execute the methods of various embodiments of this application.

[0204] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product.

[0205] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of this application are generated in whole or in part. The computer can be a general computer, a dedicated computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website, computer, training device, or data center to another website, computer, training device, or data center in a wired (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.) manner. The computer-readable storage medium can be any available medium that a computer can store, or a data storage device such as a training device or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid state disk (SSD)).

Claims

1. A control method for a heat dissipation device, applied to an electronic device, comprising: Receiving a control instruction for controlling and adjusting an operating parameter of the heat dissipation device, where the heat dissipation device is used for dissipating heat from internal components of the electronic device; When the target operating parameter corresponding to the control instruction matches the current operating parameter of the heat dissipation device, adjusting the heat dissipation device according to the target operating parameter; When the target operating parameter does not match the current operating parameter, ignoring the control instruction.

2. According to the control method for the heat dissipation device in claim 1, determining whether the target operating parameter matches the current operating parameter comprises: Obtaining the current operating parameter of the heat dissipation device; Determining the change amount between the target operating parameter and the current operating parameter; Based on the change amount belonging to a preset change range, determining that the target operating parameter matches the current operating parameter, where the preset change range corresponds to the current operating environment of the heat dissipation device.

3. According to the control method for the heat dissipation device in claim 2, the obtaining the current operating parameter of the heat dissipation device comprises: Detecting the current temperature value of the heat dissipation device; Based on a preset corresponding relationship between the temperature value and the operating parameter, querying the current operating parameter corresponding to the current temperature value.

4. According to the control method for the heat dissipation device in claim 1, further comprising: Based on the target operating parameter matching the current operating parameter, recording relevant information on adjusting the heat dissipation device; Based on the target operating parameter not matching the current operating parameter, recording alarm information, where the alarm information is related to the control instruction.

5. According to the control method for the heat dissipation device in claim 1, before receiving the control instruction, further comprising: Receiving an enabling instruction, where the enabling instruction is generated based on an operator triggering an enabling key or is generated by a preset management software for managing a baseboard management controller.

6. According to the control method for the heat dissipation device in claim 5, further comprising: Based on not receiving the enabling instruction, receiving the control instruction; Adjusting the heat dissipation device according to the target operating parameter corresponding to the control instruction.

7. According to the control method for the heat dissipation device in claim 1, receiving the control instruction comprises: Based on a communication interface with an operating system, receiving the control instruction.

8. An electronic device, comprising: A heat dissipation device for dissipating heat from internal components of the electronic device; A processor for receiving a control instruction for controlling and adjusting an operating parameter of the heat dissipation device; When the target operating parameter corresponding to the control instruction matches the current operating parameter of the heat dissipation device, adjusting the heat dissipation device according to the target operating parameter; when the target operating parameter does not match the current operating parameter, ignoring the control instruction.

9. According to the electronic device in claim 8, further comprising: A temperature sensor for detecting the current temperature value of the heat dissipation device; Correspondingly, the processor is used for querying the current operating parameter corresponding to the current temperature value based on a preset corresponding relationship between the temperature value and the operating parameter.

10. The electronic device according to claim 8 further comprises: an input device configured to generate an activation instruction based on a received input operation for triggering an activation button; correspondingly, the processor is configured to execute the step of receiving a control instruction based on the received activation instruction.

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