Multilayer electronic component and method of manufacturing the same

Abstract

The present disclosure provides a multilayer electronic component and a method of manufacturing the same. The multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes, and including first and second surfaces opposite to each other in a first direction, third and fourth surfaces opposite to each other in a second direction, and fifth and sixth surfaces opposite to each other in a third direction; and an external electrode including a connection portion disposed on the third surface and / or the fourth surface and a tape portion extending from the connection portion to a portion of the first surface and a portion of the second surface, in which the external electrode includes a sputtering layer, an oxide layer, and a conductive polymer layer, a sputter layer is provided in the connection portion and in contact with the first and / or second internal electrodes and includes Cu, an oxide layer is provided on the sputter layer and includes Cu oxide, and a conductive polymer layer is provided in the tape portion and includes a polymer material.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0009846, filed with the Korean Intellectual Property Office on January 23, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multilayer electronic component and a method of manufacturing the multilayer electronic component. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, may be a chip capacitor that is mounted on a printed circuit board of various types of electronic products (such as image display devices including liquid crystal displays (LCDs), plasma display panels (PDPs), etc., computers, smart phones, mobile phones, etc.) and is used to charge or discharge therefrom. Since the MLCC has the advantages of reduced size, ensuring high capacitance, and easy installation, the MLCC can be used as a component of various electronic devices.

[0004] The external electrodes of the MLCC may generally be formed using a Cu sintered electrode and a plating layer formed on the Cu sintered electrode. In addition, when the MLCC is mounted on a printed circuit board, an impact may be applied to the MLCC, and cracks caused by such an impact may reduce the reliability of the MLCC.

[0005] To solve these problems, in MLCCs for electrical / electronic / industrial use, there may be a case of using an external electrode including a conductive resin layer formed on a Cu sintered electrode and including metal particles and a resin (such as epoxy resin, etc.).

[0006] However, in MLCCs for small IT products, when a conductive resin layer is applied, the thickness of the external electrode may increase, which may reduce the capacitance per unit volume of the MLCC. Therefore, it is necessary to study a structure of an external electrode that suppresses cracks during installation while not reducing the capacitance per unit volume of the MLCC. Summary of the Invention

[0007] One aspect of the present disclosure is to provide a multilayer electronic component having excellent reliability.

[0008] The object of the present disclosure is not limited to the above, and will be more easily understood during the process of explaining the specific embodiments of the present disclosure.

[0009] According to one aspect of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately arranged and the dielectric layer being interposed between the first and second internal electrodes, and the body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and an external electrode including a connection portion and a strip portion, the connection portion being provided on the third surface and / or the fourth surface, the strip portion extending from the connection portion to a part of the first surface and a part of the second surface, wherein the external electrode includes a sputtered layer, an oxide layer, and a conductive polymer layer, the sputtered layer being provided in the connection portion, contacting the first internal electrode and / or the second internal electrode and including Cu, the oxide layer being provided on the sputtered layer and including Cu oxide, and the conductive polymer layer being provided in the strip portion and including a polymer material.

[0010] According to another aspect of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately arranged and the dielectric layer being interposed between the first and second internal electrodes, and the body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and an external electrode including a connection portion and a strip portion, the connection portion being provided on the third surface and / or the fourth surface, the strip portion extending from the connection portion to a part of the first surface and a part of the second surface, wherein the external electrode includes a first layer, an oxide layer, and a conductive polymer layer, the first layer being provided in the connection portion, directly contacting the first internal electrode and / or the second internal electrode and including Cu, wherein, in the total amount (at%) of the elements constituting the first layer, the amount (at%) of Cu is greater than or equal to 99 at%, the oxide layer being provided on the first layer and including Cu oxide, and the conductive polymer layer being provided in the strip portion and including a polymer material.

[0011] According to yet another aspect of the present disclosure, a method of manufacturing a multilayer electronic component includes: preparing a body including a dielectric layer, a first internal electrode, and a second internal electrode, the first internal electrode and the second internal electrode being alternately arranged with the dielectric layer interposed therebetween, and the body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; performing an electrode forming operation including a first operation and a second operation, the first operation including forming a Cu film on the third surface and the fourth surface by sputtering, and the second operation including coating a polymer composition on at least one of the first surface and the second surface, wherein the first operation and the second operation are performed sequentially or in reverse order; and performing a heat treatment operation including heat-treating the body on which the electrode forming operation has been performed to oxidize an outer surface of the Cu film. Description of the Drawings

[0012] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present disclosure.

[0013] Figure 2 is schematically shown along Figure 1 a cross-sectional view taken along line I-I'.

[0014] Figure 3 is schematically shown along Figure 1 a cross-sectional view taken along line II-II'.

[0015] Figure 4 is schematically shown along Figure 1 a cross-sectional view taken along line III-III'.

[0016] Figure 5 is schematically shown along Figure 2 a cross-sectional view taken along line IV-IV'.

[0017] Figure 6 is schematically shown along Figure 2 a cross-sectional view taken along line V-V'.

[0018] Figure 7 is a view corresponding to Figure 3 a multilayer electronic component according to a modified example of the present disclosure.

[0019] Figure 8 is a view corresponding to Figure 5 of a multi-layer electronic component according to a variant example of the present disclosure.

[0020] Figure 9 is a view corresponding to Figure 6 of a multi-layer electronic component according to a variant example of the present disclosure.

[0021] Figures 10 to 13 is a cross-sectional view schematically showing a multi-layer electronic component according to other embodiments of the present disclosure, and is a view corresponding to Figure 2 thereof.

[0022] Figure 14 and Figure 15 are views schematically showing a method for manufacturing a multi-layer electronic component according to an embodiment of the present disclosure. Detailed Description

[0023] Hereinafter, embodiments of the present disclosure will be described with reference to specific examples and drawings. However, the embodiments of the present disclosure can be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure are provided to more completely describe the present disclosure to those of ordinary skill in the art. Therefore, for clarity of description, the shapes, sizes, etc. of the elements in the drawings may be exaggerated, and the elements denoted by the same reference numerals in the drawings may be the same elements.

[0024] In addition, in order to clearly explain the present disclosure in the drawings, parts irrelevant to the description will be omitted, and the thickness may be enlarged to clearly show the layers and regions. The same reference numerals will be used to denote the same components. Further, throughout the specification, unless otherwise specifically stated, when an element is referred to as "comprising" or "including" another element, this means that the element may further include other elements without excluding other elements.

[0025] In the drawings, the first direction may be defined as the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0026] Multi-layer electronic component Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an embodiment of the present disclosure.

[0027] Figure 2 schematically shows a cross-sectional view taken along line Figure 1 I-I' thereof.

[0028] Figure 3 schematically shows a cross-sectional view taken along line Figure 1The cross-sectional view taken along line II-II'.

[0029] Figure 4 Schematically shows the cross-sectional view taken along Figure 1 the line III-III'.

[0030] Figure 5 Schematically shows the cross-sectional view taken along Figure 2 the line IV-IV'.

[0031] Figure 6 Schematically shows the cross-sectional view taken along Figure 2 the line V-V'.

[0032] Hereinafter, the multilayer electronic component 100 according to an embodiment of the present disclosure will be described in detail with reference to Figures 1 to 6 In addition, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the present disclosure is not limited thereto, and the present disclosure can be applied to various multilayer electronic components such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0033] The size of the multilayer electronic component 100 is not particularly limited. The maximum size of the multilayer electronic component 100 in the second direction can be, for example, 0.2 mm to 5.0 mm, the maximum size of the multilayer electronic component 100 in the third direction can be, for example, 0.2 mm to 5.0 mm, and the maximum size of the multilayer electronic component 100 in the first direction can be, for example, 0.04 mm to 0.3 mm.

[0034] The multilayer electronic component 100 may include a main body 110 and external electrodes 131 and 132. There may be no particular limitation on the specific shape of the main body 110, but as Figure 1 shown, the main body 110 may be formed in a hexahedral shape or a shape similar to a hexahedral shape. The main body 110 may not have a completely regular hexahedral shape, but may generally have a hexahedral shape.

[0035] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in the first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in the third direction.

[0036] The main body 110 may include a first edge EG1 connecting the third surface 3 to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, and a second edge EG2 connecting the fourth surface 4 to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first edge EG1 and the second edge EG2 may have a rounded shape by performing a separate polishing process. The first surface 1, the second surface 2, the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may be substantially flat surfaces, and uneven areas may be regarded as edges.

[0037] The main body 110 may include a dielectric layer 111 and inner electrodes 121 and 122 alternately disposed with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated such that it is difficult to distinguish the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0038] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may be, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5).

[0039] The average thickness of the dielectric layer 111 is not particularly limited. The average thickness of the dielectric layer 111 may be, for example, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0040] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 are alternately arranged, and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122. For example, the first inner electrode 121 and the second inner electrode 122, which are a pair of electrodes with different polarities, may be arranged opposite to each other, and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0041] The first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed from the third surface 3 to be connected to the first external electrode 131. The second inner electrode 122 may be spaced apart from the third surface 3 and exposed from the fourth surface 4 to be connected to the second external electrode 132.

[0042] The conductive metal included in the inner electrodes 121 and 122 may be at least one of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more preferably may include Ni, but the present disclosure is not limited thereto.

[0043] The average thickness of the inner electrodes 121 and 122 may not be particularly limited. The average thickness of the inner electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0044] The average thickness of the dielectric layer 111 and the average thickness of the inner electrodes 121 and 122 respectively represent the average size of the dielectric layer 111 in the first direction and the average size of the inner electrodes 121 and 122 in the first direction. The average thickness of the dielectric layer 111 and the average thickness of the inner electrodes 121 and 122 may be measured by scanning the cross-sections of the main body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average thickness of the dielectric layer 111 may be determined by measuring the thicknesses at a plurality of points of one dielectric layer 111 (for example, at thirty equally spaced points in the second direction) and then taking the average. In addition, the average thickness of the inner electrodes 121 and 122 may be determined by measuring the thicknesses at a plurality of points of one inner electrode 121 or 122 (for example, at thirty equally spaced points in the second direction) and then taking the average. Thirty equally spaced points may be specified in the capacitance forming portion Ac. When the average thickness values are determined by performing measurements on ten dielectric layers 111 and ten inner electrodes 121 and 122 and taking the average, the average thickness of the dielectric layer 111 and the average thickness of the inner electrodes 121 and 122 may be more generalized.

[0045] The main body 110 may include: a capacitance forming portion Ac provided in the main body 110 and including a dielectric layer 111 and first inner electrodes 121 and second inner electrodes 122 alternately provided to form a capacitance; and covering portions 112 and 113 provided on opposite surfaces of the capacitance forming portion Ac in a first direction. Except that the covering portions 112 and 113 do not include inner electrodes, the covering portions 112 and 113 may have the same structure as that of the dielectric layer 111.

[0046] The average thickness of the covering portions 112 and 113 is not particularly limited. The average thickness of the covering portions 112 and 113 may be, for example, less than or equal to 100 μm, less than or equal to 30 μm, or less than or equal to 20 μm. The average thickness of the covering portions 112 and 113 may be, for example, greater than or equal to 5 μm. In this case, the average thickness of the covering portions 112 and 113 refers to the average thickness of each of the first covering portion 112 and the second covering portion 113.

[0047] The average thickness of the covering portions 112 and 113 may refer to the average dimension of the covering portions 112 and 113 in the first direction, and may be the average value of the dimensions in the first direction measured at five equally spaced points in the second direction in a cross-section of the main body 110 cut from the center in the third direction in the first and second directions.

[0048] The main body 110 may include edge portions 114 and 115 respectively provided on two surfaces of the capacitance forming portion Ac in a third direction. For example, the edge portions 114 and 115 may refer to: in a cross-section of the main body 110 cut from the center in the second direction in the first and third directions, the regions between the two ends of the inner electrodes 121 and 122 and the outer surface of the main body 110. Except that the edge portions 114 and 115 do not include the inner electrodes 121 and 122, the edge portions 114 and 115 may have a structure similar to that of the dielectric layer 111.

[0049] The average thickness of the edge portions 114 and 115 is not particularly limited. The average thickness of the edge portions 114 and 115 may be, for example, less than or equal to 100 μm, less than or equal to 20 μm, or less than or equal to 15 μm. The average thickness of the edge portions 114 and 115 may be, for example, greater than or equal to 2 μm. In this case, the average thickness of the edge portions 114 and 115 refers to the average thickness of each of the first edge portion 114 and the second edge portion 115. The average thickness of the edge portions 114 and 115 may refer to the average dimension of the edge portions 114 and 115 in the third direction, and may be the average value of the dimensions in the third direction measured at five equally spaced points in the first direction in a cross-section of the main body 110 cut from the center in the second direction in the first and third directions.

[0050] The outer electrodes 131 and 132 may include: connection portions A1 and A2 provided on the third surface 3 and / or the fourth surface 4; and belt portions B1 and B2 extending from the connection portions A1 and A2 to a part of the first surface 1 and a part of the second surface 2. In addition, the outer electrodes 131 and 132 may include corner portions C1 and C2 provided between the connection portions A1 and A2 and the belt portions B1 and B2. The outer electrodes 131 and 132 may include a first outer electrode 131 connected to the first inner electrode 121 and a second outer electrode 132 connected to the second inner electrode 122.

[0051] The first outer electrode 131 may include: a first connection portion A1 provided on the third surface 3; a first belt portion B1 extending from the first connection portion A1 to a part of the first surface 1 and a part of the second surface 2; and a first corner portion C1 provided between the first connection portion A1 and the first belt portion B1. The second outer electrode 132 may include: a second connection portion A2 provided on the fourth surface 4; a second belt portion B2 extending from the second connection portion A2 to a part of the first surface 1 and a part of the second surface 2; and a second corner portion C2 provided between the second connection portion A2 and the second belt portion B2.

[0052] The boundary between the first connection portion A1 and the first corner portion C1 may correspond to the region where the third surface 3 intersects the first edge EG1, and the boundary between the second connection portion A2 and the second corner portion C2 may correspond to the region where the fourth surface 4 intersects the second edge EG2. The boundary between the first belt portion B1 and the first corner portion C1 may correspond to the region where the first surface 1 and the second surface 2 intersect the first edge EG1, and the boundary between the second belt portion B2 and the second corner portion C2 may correspond to the region where the first surface 1 and the second surface 2 intersect the second edge EG2.

[0053] The outer electrodes 131 and 132 may include sputtering layers 131a and 132a provided in the connection portions A1 and A2 and in contact with the inner electrodes 121 and 122. For example, the first outer electrode 131 may include a first sputtering layer 131a provided in the first connection portion A1 and in contact with the first inner electrode 121, and the second outer electrode 132 may include a second sputtering layer 132a provided in the second connection portion A2 and in contact with the second inner electrode 122.

[0054] The sputtering layers 131a and 132a can be used for electrically connecting the inner electrodes 121 and 122 to the outer electrodes 131 and 132. Since the sputtering layers 131a and 132a are mainly formed by a sputtering method, they can be thin and have a uniform thickness. Thus, by thinning the outer electrodes 131 and 132, the capacitance per unit volume of the multilayer electronic component 100 can be improved. In addition, since the outer electrodes 131 and 132 can ensure a thickness of a certain level or greater even in the corner portions C1 and C2 due to the sputtering layers 131a and 132a, the penetration of external moisture, plating solution, etc. can be effectively blocked. The thickness of the sputtering layers 131a and 132a is not particularly limited and can be from several tens of nm to several tens of μm.

[0055] Since the sputtering layers 131a and 132a can be formed by a sputtering method, they can be directly formed on the outer surface of the main body 110 without performing a separate additional process on the main body 110. For example, when a plating layer is directly formed on the main body 110 by an electrolytic plating method, there may be a problem that the plating layer is not formed on the side surface of the covering portion mainly formed of a ceramic component. In the sputtering method, different from the electrolytic plating method, since no separate metal seed is required, the sputtering layers 131a and 132a can be uniformly formed on the side surfaces of the covering portions 112 and 113 and on the edges EG1 and EG2 of the main body 110. As a result, one end of the sputtering layers 131a and 132a can be disposed in the corner portions C1 and C2. In addition, the sputtering layers 131a and 132a can be in contact with at least a part of the edges EG1 and EG2 of the main body 110.

[0056] In addition, when a plating layer is directly formed on the main body 110 by an electrolytic plating method, a process of immersing the main body 110 in an acidic solution may be required, and there may be a concern that the insulation resistance of the dielectric layer 111 may deteriorate due to the penetration of the acidic solution or the generation of hydrogen gas during this process. In the multilayer electronic component 100 according to an embodiment of the present disclosure, since the sputtering layers 131a and 132a can be formed by a sputtering method, the penetration of the acidic solution or the generation of hydrogen gas can be prevented.

[0057] The sputtering layers 131a and 132a may include Cu. Since the sputtering layers 131a and 132a include Cu, oxide layers 131b and 132b including Cu oxide may be formed by the heat treatment process described below. Since the sputtering layers 131a and 132a are formed by sputtering, the amount (at%) of Cu may be greater than or equal to 99 at% in the total amount (at%) of the elements constituting the sputtering layers 131a and 132a. The sputtering layers 131a and 132a may further include Ni, but the present disclosure is not limited thereto. The amount of Cu may be calculated from an image scanned using SEM-EDS (scanning electron microscope - energy dispersive spectrometer). Specifically, after polishing the multilayer electronic component 100 to the position of the central portion in the third direction to expose the cross sections in the first and second directions, the amount (at%) of Cu in the total amount (at%) of the elements constituting the sputtering layers 131a and 132a may be measured using SEM-EDS. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used to measure the amount (at%) of Cu in the total amount (at%) of the elements constituting the sputtering layers 131a and 132a.

[0058] Different from the sintered electrodes used in the prior art, since the sputtering layers 131a and 132a are formed by sputtering, they may not contain a glass component. This enables improvement of the ESR characteristics of the multilayer electronic component 100 compared with the prior art.

[0059] The outer electrodes 131 and 132 may include the oxide layers 131b and 132b provided on the sputtering layers 131a and 132a. For example, the first outer electrode 131 may include the first oxide layer 131b provided on the first sputtering layer 131a, and the second outer electrode 132 may include the second oxide layer 132b provided on the second sputtering layer 132a.

[0060] The oxide layers 131b and 132b may include Cu oxide. The type of Cu oxide included in the oxide layers 131b and 132b is not particularly limited, but may include at least one of, for example, Cu2O and CuO. Since Cu oxide has a low moisture permeability and hydrogen diffusion coefficient, the oxide layers 131b and 132b may function to prevent external moisture or hydrogen from penetrating into the main body 110.

[0061] The drawings show that the oxide layers 131b and 132b are formed continuously between the sputtering layers 131a and 132a and the plating layers 131d and 132d, but the present disclosure is not limited thereto, and the oxide layers 131b and 132b may be formed discontinuously according to the conditions of the heat treatment operation described later. The oxide layers 131b and 132b may be provided at the interfaces between the sputtering layers 131a and 132a and the plating layers 131d and 132d, but may not be provided at the interfaces between the sputtering layers 131a and 132a and the conductive polymer layers 131c and 132c. Optionally, the proportion of the total length of the regions where the oxide layers are formed in the entire length of the interfaces between the sputtering layers 131a and 132a and the plating layers 131d and 132d may be higher than the proportion of the total length of the regions where the oxide layers are formed in the entire length of the interfaces between the sputtering layers 131a and 132a and the conductive polymer layers 131c and 132c.

[0062] The outer electrodes 131 and 132 may include the conductive polymer layers 131c and 132c provided in the belt portions B1 and B2. For example, the first outer electrode 131 may include a first conductive polymer layer 131c provided in the first belt portion B1, and the second outer electrode 132 may include a second conductive polymer layer 132c provided in the second belt portion B2.

[0063] The conductive polymer layers 131c and 132c mainly include polymer materials, and thus can play a role in preventing cracks from occurring in the multilayer electronic component 100 due to the impact generated when the multilayer electronic component 100 is mounted on a printed circuit board. For example, the conductive polymer layers 131c and 132c can reduce the stress applied to the multilayer electronic component 100 to improve the impact resistance of the multilayer electronic component 100.

[0064] The type of the polymer material is not particularly limited. The polymer material may be an insulating material. For example, the polymer material may include an insulating resin. The insulating resin may be, for example, one or more of an epoxy resin, an acrylic resin, and ethyl cellulose. In this case, the conductive polymer layers 131c and 132c may also include metal particles.

[0065] The metal particles may include at least one of spherical particles and flake-shaped particles. In this case, the spherical particles may also include shapes other than perfect spheres, for example, a shape with a ratio of the length of the major axis to the length of the minor axis (major axis length / minor axis length) less than or equal to 1.45. The flake-shaped particles refer to particles having a flat and elongated shape, and are not particularly limited, for example, may have a ratio of the length of the major axis to the length of the minor axis (major axis length / minor axis length) greater than or equal to 1.95. The metal particles may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or their alloys.

[0066] Additionally, the polymer material can be a conductive material. For example, the polymer material may include one or more of polypyrrole, polyaniline, polythiophene, and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS). In this case, the conductive polymer layers 131c and 132c can be formed of one or more conductive polymers such as polypyrrole, polyaniline, polythiophene, and PEDOT:PSS, and may not include metal particles.

[0067] The shapes of the conductive polymer layers 131c and 132c are not particularly limited. In an embodiment, the conductive polymer layers 131c and 132c may include a first layer 131c1 and 132c1 disposed on the first surface 1 and a second layer 131c2 and 132c2 spaced apart from the first layer 131c1 and 132c1 and disposed on the second surface 2. For example, the conductive polymer layers 131c and 132c may be disposed on the first surface 1 and the second surface 2, but not on the fifth surface 5 and the sixth surface 6. However, the present disclosure is not limited thereto, and the conductive polymer layers 131c and 132c may be disposed on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6. In this case, the conductive polymer layers 131c and 132c disposed on a part of the fifth surface 5 and a part of the sixth surface 6 and / or the first edge EG1 and the second edge EG2 may have a structure similar to the structure of the conductive polymer layers 131c and 132c disposed on a part of the first surface 1 and a part of the second surface 2 and / or the first edge EG1 and the second edge EG2. That is, the outer electrodes 131 and 132 disposed on a part of the fifth surface 5 and a part of the sixth surface 6 and / or the first edge EG1 and the second edge EG2 may have a structure similar to the structure of the outer electrodes 131 and 132 disposed on a part of the first surface 1 and a part of the second surface 2 and / or the first edge EG1 and the second edge EG2.

[0068] Since the conductive polymer layers 131c and 132c have a higher resistance than the resistance of the sputtered layers 131a and 132a, the ESR characteristics of the multilayer electronic component 100 may deteriorate when the conductive polymer layers 131c and 132c are in direct contact with the inner electrodes 121 and 122. In an embodiment, the conductive polymer layers 131c and 132c may not be disposed in the connection portions A1 and A2. For example, the first conductive polymer layer 131c may not be disposed in the first connection portion A1, and the second conductive polymer layer 132c may not be disposed in the second connection portion A2.

[0069] In addition, according to the order of the first process and the second process to be described below, the structures of the sputtering layers 131a and 132a and the structures of the conductive polymer layers 131c and 132c in the corner portions C1 and C2 can be changed. For example, as Figure 2 shown, the conductive polymer layers 131c and 132c in the corner portions C1 and C2 can cover one end of the sputtering layers 131a and 132a. For example, the first conductive polymer layer 131c in the first corner portion C1 can cover one end of the first sputtering layer 131a, and the second conductive polymer layer 132c in the second corner portion C2 can cover one end of the second sputtering layer 132a.

[0070] The thicknesses of the conductive polymer layers 131c and 132c are not particularly limited, but can be greater than or equal to 0.5 μm and less than or equal to 3.0 μm. When the thicknesses of the conductive polymer layers 131c and 132c are less than 0.5 μm, the effect of improving the impact resistance of the present disclosure may be insufficient. In addition, when the thicknesses of the conductive polymer layers 131c and 132c exceed 3.0 μm, the capacitance per unit volume of the multilayer electronic component may decrease. In this case, the thicknesses of the conductive polymer layers 131c and 132c can refer to: in the cross-section in the first direction and the second direction of the main body 110 cut from the center in the third direction, the dimension in the first direction measured from the central portion in the second direction of the conductive polymer layers 131c and 132c.

[0071] The outer electrodes 131 and 132 can include plating layers 131d and 132d provided on the oxide layers 131b and 132b and the conductive polymer layers 131c and 132c. The plating layers 131d and 132d can improve the mounting characteristics.

[0072] The plating layers 131d and 132d can include, for example, Ni, Sn, Pd, and / or their alloys, and can be formed into multiple layers. For example, the plating layers 131d and 132d can be Ni plating layers or Sn plating layers, or can be formed in a form in which a Ni plating layer and a Sn plating layer are sequentially formed. In addition, the plating layers 131d and 132d can include multiple Ni plating layers and / or multiple Sn plating layers.

[0073] In an embodiment, the outer electrodes 131 and 132 can include: Ni plating layers 131d1 and 132d1 provided on the oxide layers 131b and 132b in the connection portions A1 and A2; and Sn plating layers 131d2 and 132d2 provided on the conductive polymer layers 131c and 132c in the belt portions B1 and B2. However, the present disclosure is not limited thereto. For example, as Figure 2As shown in the figure, the outer electrodes 131 and 132 may include: Ni plating layers 131d1 and 132d1, which are provided on the oxide layers 131b and 132b in the connection portions A1 and A2 and on the conductive polymer layers 131c and 132c in the belt portions B1 and B2; and Sn plating layers 131d2 and 132d2, which are provided on the Ni plating layers 131d1 and 132d1.

[0074] The thickness of the plating layers 131d and 132d is not particularly limited. For example, the thickness of the Ni plating layers 131d1 and 132d1 may be greater than or equal to 2 μm and less than or equal to 4 μm, and the thickness of the Sn plating layers 131d2 and 132d2 may be greater than or equal to 2 μm and less than or equal to 4 μm. In the embodiment, the thickness of the conductive polymer layers 131c and 132c measured in the belt portions B1 and B2 may be less than the thickness of the Ni plating layers 131d1 and 132d1 measured in the belt portions B1 and B2.

[0075] The drawings show a structure in which the multilayer electronic component 100 has two outer electrodes 131 and 132, but it is not limited thereto, and the number, shape, etc. of the outer electrodes 131 and 132 may be changed according to the shape of the inner electrodes 121 and 122 or other purposes.

[0076] The inner electrodes 121 and 122 may include main portions 121a and 122a and lead portions 121b and 122b that extend from the main portions 121a and 122a to the third surface 3 and / or the fourth surface 4 and are in contact with the outer electrodes 131 and 132. For example, the first inner electrode 121 may include a first main portion 121a and a first lead portion 121b that extends from the first main portion 121a to the third surface 3 and is in contact with the first outer electrode 131, and the second inner electrode 122 may include a second main portion 122a and a second lead portion 122b that extends from the second main portion 122a to the fourth surface 4 and is in contact with the second outer electrode 132.

[0077] In the embodiment, the dimension of the lead portions 121b and 122b in the third direction may be greater than the dimension of the main portions 121a and 122a in the third direction. More specifically, the lead portions 121b and 122b may be exposed on the fifth surface 5 and the sixth surface 6 of the main body 110. For example, the first lead portion 121b may be in contact with the first outer electrode 131 on the third surface 3, the fifth surface 5, and the sixth surface 6, and the second lead portion 122b may be in contact with the second outer electrode 132 on the fourth surface 4, the fifth surface 5, and the sixth surface 6. The lead portions 121b and 122b exposed on the fifth surface 5 and the sixth surface 6 can be used as metal seeds for forming the plating layers 131d and 132d on the fifth surface 5 and the sixth surface 6.

[0078] However, the present disclosure is not limited thereto, and the inner electrodes 121 and 122 may be disposed to be spaced apart from the fifth surface 5 and the sixth surface 6 of the main body 110. Figure 7 is a view corresponding to a Figure 3 multilayer electronic component according to a modified example of the present disclosure. Figure 8 is a view corresponding to a Figure 5 multilayer electronic component according to a modified example of the present disclosure. Figure 9 is a view corresponding to a Figure 6 multilayer electronic component according to a modified example of the present disclosure. Referring to Figures 7 to 9 , the first inner electrode 121 may be disposed to contact the first outer electrode 131 on the third surface 3 but be spaced apart from the fifth surface 5 and the sixth surface 6, and the second inner electrode 122 may be disposed to contact the second outer electrode 132 on the fourth surface 4 but be spaced apart from the fifth surface 5 and the sixth surface 6. In this case, unevenness may be formed on some or all of the fifth surface 5 and the sixth surface 6, but it is not limited thereto.

[0079] Figures 10 to 13 is a cross-sectional view schematically showing a multilayer electronic component according to another embodiment of the present disclosure, and is a view corresponding to Figure 2 . Hereinafter, a multilayer electronic component according to another embodiment of the present disclosure will be described with reference to Figures 10 to 13 . The same / similar reference numerals may be used for the same / similar configurations as those of the multilayer electronic component 100 described in Figures 1 to 6 , and repeated descriptions may be omitted.

[0080] Referring to Figure 10 , a multilayer electronic component 200 according to an embodiment of the present disclosure may include a main body 110 and outer electrodes 231 and 232.

[0081] The outer electrodes 231 and 232 may include: sputtering layers 231a and 232a, disposed in the connection portions A1 and A2, contacting the inner electrodes 121 and 122 and including Cu; oxide layers 231b and 232b, disposed on the sputtering layers 231a and 232a and including Cu oxide; conductive polymer layers 231c and 232c, disposed in the belt portions B1 and B2 and including a polymer material; and plating layers 231d and 232d, disposed on the oxide layers 231b and 232b and the conductive polymer layers 231c and 232c.

[0082] The conductive polymer layers 231c and 232c may include, for example, a first layer 231c1 and 232c1 disposed on the first surface and a second layer 231c2 and 232c2 disposed on the second surface and spaced apart from the first layer 231c1 and 232c1.

[0083] The plating layers 231d and 232d may include: Ni plating layers 231d1 and 232d1, which are disposed on the oxide layers 231b and 232b in the connection portions A1 and A2 and on the conductive polymer layers 231c and 232c in the belt portions B1 and B2; and Sn plating layers 231d2 and 232d2, which are disposed on the Ni plating layers 231d1 and 232d1.

[0084] In the multi-layer electronic component 200 according to an embodiment of the present disclosure, one end of the conductive polymer layers 231c and 232c may be disposed in the connection portions A1 and A2. For example, one end of the first conductive polymer layer 231c (e.g., one end of the first layer 231c1 of the first conductive polymer layer 231c and / or one end of the second layer 231c2 of the first conductive polymer layer 231c) may be disposed in the first connection portion A1, and one end of the second conductive polymer layer 232c (e.g., one end of the first layer 232c1 of the second conductive polymer layer 232c and / or one end of the second layer 232c2 of the second conductive polymer layer 232c) may be disposed in the second connection portion A2. In this case, cracks generated in the multi-layer electronic component 200 due to the impact generated when the multi-layer electronic component 200 is mounted on the printed circuit board can be more effectively prevented.

[0085] In order to prevent side effects that deteriorate other electrical characteristics of the multi-layer electronic component 200, the conductive polymer layers 231c and 232c may be disposed so as not to overlap the inner electrodes 121 and 122 in the second direction. The oxide layers 231b and 232b may be disposed in the connection portions A1 and A2, but may not be disposed in the belt portions B1 and B2 and the corner portions C1 and C2, but the present disclosure is not limited thereto.

[0086] Referring to Figure 11 , the multi-layer electronic component 300 according to an embodiment of the present disclosure may include a main body 110 and external electrodes 331 and 332.

[0087] The external electrodes 331 and 332 may include: sputtering layers 331a and 332a, which are disposed in the connection portions A1 and A2, are in contact with the inner electrodes 121 and 122 and include Cu; oxide layers 331b and 332b, which are disposed on the sputtering layers 331a and 332a and include Cu oxide; conductive polymer layers 331c and 332c, which are disposed in the belt portions B1 and B2 and include polymer materials; and plating layers 331d and 332d, which are disposed on the oxide layers 331b and 332b and the conductive polymer layers 331c and 332c.

[0088] The conductive polymer layers 331c and 332c may include, for example, a first layer 331c1 and 332c1 provided on the first surface and a second layer 331c2 and 332c2 provided on the second surface and spaced apart from the first layers 331c1 and 332c1.

[0089] The plating layers 331d and 332d may include: Ni plating layers 331d1 and 332d1 provided on the oxide layers 331b and 332b in the connection portions A1 and A2 and provided on the conductive polymer layers 331c and 332c in the belt portions B1 and B2; and Sn plating layers 331d2 and 332d2 provided on the Ni plating layers 331d1 and 332d1.

[0090] In the multi-layer electronic component 300 according to an embodiment of the present disclosure, at least one end of the sputtering layers 331a and 332a may be provided in the belt portions B1 and B2. For example, at least one end of the first sputtering layer 331a may be provided in the first belt portion B1, and at least one end of the second sputtering layer 332a may be provided in the second belt portion B2. For example, the first sputtering layer 331a may be provided on the third surface and may extend above a part of the first surface and / or a part of the second surface, and the second sputtering layer 332a may be provided on the fourth surface and may extend above a part of the first surface and / or a part of the second surface.

[0091] In the belt portions B1 and B2, the sputtering layers 331a and 332a may be provided between the main body 110 and the conductive polymer layers 331c and 332c. For example, in the first belt portion B1, the first sputtering layer 331a may be provided between the main body 110 and the first conductive polymer layer 331c, and in the second belt portion B2, the second sputtering layer 332a may be provided between the main body 110 and the second conductive polymer layer 332c. The conductive polymer layers 331c and 332c may cover the ends of the sputtering layers 331a and 332a in the belt portions B1 and B2.

[0092] The oxide layers 331b and 332b may be provided in the connection portions A1 and A2 and the corner portions C1 and C2. The oxide layers 331b and 332b may not be provided in the belt portions B1 and B2, and thus the ends of the oxide layers 331b and 332b may be provided in the corner portions C1 and C2, but the present disclosure is not limited thereto.

[0093] Refer to Figure 12 According to an embodiment of the present disclosure, the multi-layer electronic component 400 may include a main body 110 and external electrodes 431 and 432.

[0094] The outer electrodes 431 and 432 may include: sputtering layers 431a and 432a, disposed in the connection portions A1 and A2, in contact with the inner electrodes 121 and 122 and including Cu; oxide layers 431b and 432b, disposed on the sputtering layers 431a and 432a and including Cu oxide; conductive polymer layers 431c and 432c, disposed in the belt portions B1 and B2 and including a polymer material; and plating layers 431d and 432d, disposed on the oxide layers 431b and 432b and the conductive polymer layers 431c and 432c.

[0095] The conductive polymer layers 431c and 432c may include, for example, a first layer 431c1 and 432c1 disposed on a first surface and a second layer 431c2 and 432c2 disposed on a second surface and spaced apart from the first layers 431c1 and 432c1.

[0096] The plating layers 431d and 432d may include: Ni plating layers 431d1 and 432d1, disposed on the oxide layers 431b and 432b in the connection portions A1 and A2 and on the conductive polymer layers 431c and 432c in the belt portions B1 and B2; and Sn plating layers 431d2 and 432d2, disposed on the Ni plating layers 431d1 and 432d1.

[0097] In the multi-layer electronic component 400 according to an embodiment of the present disclosure, at least one end of the sputtering layers 431a and 432a and one end of the conductive polymer layers 431c and 432c may be disposed in the corner portions C1 and C2. For example, one end of the first sputtering layer 431a and one end of the first conductive polymer layer 431c may be disposed in the first corner portion C1, and one end of the second sputtering layer 432a and one end of the second conductive polymer layer 432c may be disposed in the second corner portion C2. More specifically, one end of the first sputtering layer 431a and one end of the first layer 431c1 of the first conductive polymer layer 431c may be disposed in one first corner portion C1, and the other end of the first sputtering layer 431a and one end of the second layer 431c2 of the first conductive polymer layer 431c may be disposed in another first corner portion C1. The second sputtering layer 432a and the second conductive polymer layer 432c may also have a similar structure. In this case, the sputtering layers 431a and 432a may cover one end of the conductive polymer layers 431c and 432c in the corner portions C1 and C2. The conductive polymer layers 431c and 432c may be in contact with at least a part of the edges EG1 and EG2 of the main body 110.

[0098] Oxide layers 431b and 432b may be provided in connection portions A1 and A2 and corner portions C1 and C2. Oxide layers 431b and 432b may not be provided in strip portions B1 and B2. Thus, ends of oxide layers 431b and 432b may be provided in corner portions C1 and C2, but the present disclosure is not limited thereto.

[0099] Referring Figure 13 , a multilayer electronic component 500 according to an embodiment of the present disclosure may include a main body 110 and external electrodes 531 and 532.

[0100] External electrodes 531 and 532 may include: sputtering layers 531a and 532a, provided in connection portions A1 and A2, in contact with internal electrodes 121 and 122 and including Cu; oxide layers 531b and 532b, provided on sputtering layers 531a and 532a and including Cu oxide; conductive polymer layers 531c and 532c, provided in strip portions B1 and B2 and including a polymer material; and plating layers 531d and 532d, provided on oxide layers 531b and 532b and conductive polymer layers 531c and 532c.

[0101] Conductive polymer layers 531c and 532c may include, for example, a first layer 531c1 and 532c1 provided on a first surface and a second layer 531c2 and 532c2 provided on a second surface and spaced apart from the first layer 531c1 and 532c1.

[0102] Plating layers 531d and 532d may include: Ni plating layers 531d1 and 532d1, provided on oxide layers 531b and 532b in connection portions A1 and A2 and provided on conductive polymer layers 531c and 532c in strip portions B1 and B2; and Sn plating layers 531d2 and 532d2, provided on Ni plating layers 531d1 and 532d1.

[0103] In a multilayer electronic component 500 according to an embodiment of the present disclosure, at least one end of sputtering layers 531a and 532a may be provided in strip portions B1 and B2. For example, at least one end of a first sputtering layer 531a may be provided in a first strip portion B1, and at least one end of a second sputtering layer 532a may be provided in a second strip portion B2. For example, a first sputtering layer 531a may be provided on a third surface and may extend above a part of the first surface and / or a part of the second surface, and a second sputtering layer 532a may be provided on a fourth surface and may extend above a part of the first surface and / or a part of the second surface.

[0104] In the belt portions B1 and B2, the conductive polymer layers 531c and 532c may be disposed between the main body 110 and the sputtering layers 531a and 532a. For example, in the first belt portion B1, the first conductive polymer layer 531c may be disposed between the main body 110 and the first sputtering layer 531a, and in the second belt portion B2, the second conductive polymer layer 532c may be disposed between the main body 110 and the second sputtering layer 532a. The sputtering layers 531a and 532a may be disposed to cover the conductive polymer layers 531c and 532c disposed in the belt portions B1 and B2 and the corner portions C1 and C2.

[0105] The oxide layers 531b and 532b may be disposed in the connection portions A1 and A2, the belt portions B1 and B2, and the corner portions C1 and C2. The oxide layers 531b and 532b may be disposed to cover the sputtering layers 531a and 532a in the connection portions A1 and A2, the belt portions B1 and B2, and the corner portions C1 and C2, but the present disclosure is not limited thereto.

[0106] Figure 14 and Figure 15 are diagrams schematically showing a method for manufacturing a multilayer electronic component according to an embodiment of the present disclosure. Hereinafter, reference will be made to Figures 1 to 6 and Figure 14 and Figure 15 to describe the method for manufacturing the above-mentioned multilayer electronic component. The following description may be based on the method for manufacturing the multilayer electronic component 100 shown in Figures 1 to 6 , but the following description may equally apply to the methods for manufacturing the multilayer electronic components 200, 300, 400, and 500 shown in Figures 10 to 13 . Therefore, in the following description, the methods for manufacturing the multilayer electronic components 200, 300, 400, and 500 shown in Figures 10 to 13 will be separately mentioned only when necessary.

[0107] First, ceramic powder may be prepared. The ceramic powder may be, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y)O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). BaTiO3 can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. The method for synthesizing ceramic powder can include, for example, a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present disclosure is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, a ceramic slurry can be prepared by mixing an organic solvent such as ethanol and a binder such as polyvinyl butyral, and the ceramic slurry can be coated on a carrier film and dried to prepare a green ceramic sheet.

[0108] Next, a conductive paste for an internal electrode containing a metal powder, a binder, an organic solvent, etc. can be printed on the green ceramic sheet with a predetermined thickness using a screen printing method, a gravure printing method, etc. to form an internal electrode pattern.

[0109] Thereafter, the green ceramic sheet on which the internal electrode pattern is printed can be peeled off from the carrier film, and a predetermined number of layers of the green ceramic sheet on which the internal electrode pattern is printed can be stacked and compacted to form a ceramic stack. Thereafter, the ceramic stack can be cut into pieces with a predetermined size, and the cut pieces can be sintered at a temperature of greater than or equal to 1000 °C and less than or equal to 1400 °C. As a result, a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 and including a first surface 1, a second surface 2, a third surface 3, a fourth surface 4, a fifth surface 5, and a sixth surface 6 can be formed. Thereafter, a barrel polishing process can be additionally performed to form the edges EG1 and EG2 of the main body 110 into a rounded shape.

[0110] Next, an electrode forming operation for forming external electrodes 131 and 132 on the main body 110 can be performed. Referring to Figure 14 and Figure 15 , the electrode forming operation can include a first process and a second process. The first process is for forming Cu films 31a and 32a on the third surface 3 and the fourth surface 4 by a sputtering method, and the second process is for coating polymer compositions 31b and 32b on at least one of the first surface 1 and the second surface 2.

[0111] Specifically, referring to Figure 14 , in the first process, a plurality of main bodies 110 can be aligned on a substrate 10, and then Cu particles 30 can be discharged from a target 20 in an atomic state or an ionic state to be deposited on the third surface 3 of the main body 110, thereby forming a Cu film 31a. Although not shown, the main body 110 can be flipped, and the Cu particles 30 can be deposited on the fourth surface 4 in the same manner to form Figure 15 the Cu film 32a.

[0112] Next, referring to Figure 15, in the second process, the main body 110 on which the Cu films 31a and 32a are formed can be aligned on a substrate (not shown), and then the polymer compositions 31b and 32b can be coated and dried on at least one of the first surface 1 and the second surface 2. More preferably, as Figure 15 shown, after coating the polymer compositions 31b and 32b on a part of the first surface 1, the main body 110 can be flipped, and the polymer compositions 31b and 32b can be coated and dried on the second surface 2 in the same manner. The coating of the polymer compositions 31b and 32b can be performed, for example, by an inkjet method or the like, but the present disclosure is not limited thereto.

[0113] The polymer compositions 31b and 32b can include a polymer material. The polymer material can be, for example, an insulating material. The polymer material can be one or more of an epoxy resin, an acrylic resin, and ethyl cellulose. In this case, the polymer compositions 31b and 32b can also include metal particles. Optionally, the polymer material can be a conductive material including one or more of polypyrrole, polyaniline, polythiophene, and PEDOT:PSS.

[0114] In Figure 14 and Figure 15 shown in the electrode formation operation, the first process and the second process can be sequentially performed, but the present disclosure is not limited thereto, and the first process and the second process can be performed in the reverse order. For example, in the electrode formation operation, the first process and the second process can be sequentially performed (i.e., the first process is performed first and then the second process) or the first process and the second process can be performed in the reverse order (i.e., the second process is performed first and then the first process). When the first process and the second process are sequentially performed, the outer electrodes 131 and 132 of the multilayer electronic component 100 shown in Figure 2 can be formed, and when the first process and the second process are performed in the reverse order, the outer electrodes 431 and 432 of the multilayer electronic component 400 shown in Figure 12 can be formed.

[0115] In addition, by controlling the amount of the polymer compositions 31b and 32b coated in the second process such that the polymer compositions 31b and 32b flow downward or upward onto the Cu films 31a and 32a, the outer electrodes 231 and 232 of the multilayer electronic component 200 shown in Figure 10 can be formed.

[0116] In addition, by flipping the main body 110 aligned on the substrate in the first process and depositing Cu particles on the first surface 1 and the second surface 2, the outer electrodes 331 and 332 of the multilayer electronic component 300 shown in Figure 11 or the outer electrodes 531 and 532 of the multilayer electronic component 500 shown in Figure 13 can be formed.

[0117] Next, a heat treatment operation of performing heat treatment on the main body 110 on which the electrode formation operation has been performed can be executed to oxidize the outer surfaces of the Cu films 31a and 32a. By the heat treatment, the outer surfaces of the Cu films 31a and 32a can be oxidized to form sputtering layers 131a and 132a and oxide layers 131b and 132b. At the same time, the polymer compositions 31b and 32b can be cured to form conductive polymer layers 131c and 132c.

[0118] The heat treatment can be executed at a temperature of, for example, 160°C to 200°C. When the above heat treatment temperature is less than 160°C, there may be a concern that the oxide layers 131b and 132b cannot be sufficiently formed, and when the above heat treatment temperature is greater than 200°C, the polymer compositions 31b and 32b may burn due to exceeding the curing temperature.

[0119] The above heat treatment can be executed in an atmosphere having an oxygen concentration of greater than or equal to 30 ppm and less than or equal to 50 ppm to appropriately form the oxide layers 131b and 132b, but the present disclosure is not limited thereto.

[0120] Next, the multilayer electronic component 100 can be manufactured by forming Ni plating layers 131d1 and 132d1 and Sn plating layers 131d2 and 132d2 by a plating method. The plating method can use an electrolytic plating method and / or an electroless plating method. However, the above manufacturing method is exemplary, and the manufacturing method of the multilayer electronic component is not limited to the above manufacturing method.

[0121] The present disclosure is not limited by the above embodiments and the drawings, but is intended to be limited by the appended claims. Therefore, within the scope of the technical spirit of the present disclosure described in the claims, those skilled in the art will be able to make various forms of substitutions, modifications, and changes, and this will also be considered to fall within the scope of the present disclosure.

[0122] In addition, the expression "embodiment" does not mean the same embodiment and is provided to emphasize and describe different unique features. However, the combination of the features of the above-presented embodiment with those of another embodiment is not excluded. For example, unless there is a description contrary to or conflicting with the matters in another embodiment, even if the matters described in one specific embodiment are not described in another embodiment, they can also be understood as descriptions related to another embodiment.

[0123] In the present disclosure, the meaning of "connection" includes not only the meaning of direct connection but also the meaning of indirect connection through an adhesive layer or the like. Additionally, the meaning of "electrical connection" includes both cases of physical connection and cases of non-physical connection. Furthermore, expressions such as "first" and "second" are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the claims, the first element may be named the second element, and similarly, the second element may be named the first element.

[0124] As one of the various effects of the present disclosure, a multilayer electronic component having excellent reliability can be provided.

[0125] Although example embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: a main body including a dielectric layer, a first internal electrode, and a second internal electrode, the first internal electrode and the second internal electrode being alternately arranged and the dielectric layer being interposed between the first internal electrode and the second internal electrode, and the main body including a first surface and a second surface that are opposite to each other in a first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and are opposite to each other in a second direction, and a fifth surface and a sixth surface that are connected to the first surface to the fourth surface and are opposite to each other in a third direction; and an external electrode including: a connection portion provided on the third surface and / or the fourth surface; and a belt portion extending from the connection portion to a part of the first surface and a part of the second surface, wherein the external electrode includes: a sputtering layer provided in the connection portion, contacting the first internal electrode and / or the second internal electrode and including Cu; an oxide layer provided on the sputtering layer and including Cu oxide; and a conductive polymer layer provided in the belt portion and including a polymer material.

2. The multilayer electronic component according to claim 1, wherein, The conductive polymer layer includes a first layer provided on the first surface and a second layer spaced apart from the first layer and provided on the second surface.

3. The multilayer electronic component according to claim 1, wherein, The conductive polymer layer is not provided in the connection portion.

4. The multilayer electronic component according to claim 1, wherein, The external electrode includes a corner portion provided between the connection portion and the belt portion, at least one end of the sputtering layer is provided in the corner portion.

5. The multilayer electronic component according to claim 4, wherein, In the corner portion, the conductive polymer layer covers at least one end of the sputtering layer.

6. The multilayer electronic component according to claim 4, wherein, In the corner portion, the sputtering layer covers one end of the conductive polymer layer.

7. The multi-layer electronic component according to claim 1, wherein, One end of the conductive polymer layer is provided in the connection portion.

8. The multilayer electronic component according to claim 1, wherein, At least one end of the sputtering layer is provided in the belt portion, and in the belt portion, the sputtering layer is provided between the main body and the conductive polymer layer.

9. The multi-layer electronic component according to claim 1, wherein, At least one end of the sputtering layer is provided in the belt portion, and in the belt portion, the conductive polymer layer is provided between the main body and the sputtering layer.

10. The multilayer electronic component according to claim 1, wherein, In the total amount of elements constituting the sputtering layer, the amount of Cu is greater than or equal to 99 at%.

11. The multilayer electronic component according to claim 1, wherein, The external electrode further includes: a Ni plating layer provided on the oxide layer in the connection portion and provided on the conductive polymer layer in the belt portion; and a Sn plating layer provided on the Ni plating layer.

12. The multilayer electronic component according to claim 1, wherein, The polymer material includes an insulating resin, and the conductive polymer layer further includes metal particles.

13. The multi-layer electronic component according to claim 1, wherein, The polymer material includes at least one of polypyrrole, polyaniline, polythiophene, and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate).

14. A method for manufacturing a multilayer electronic component, comprising: Prepare a body, the body including a dielectric layer, a first internal electrode, and a second internal electrode, the first internal electrode and the second internal electrode being alternately arranged and the dielectric layer being interposed between the first internal electrode and the second internal electrode, and the body including a first surface and a second surface that face each other in a first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and face each other in a second direction, and a fifth surface and a sixth surface that are connected to the first surface to the fourth surface and face each other in a third direction; Perform an electrode forming operation, the electrode forming operation including a first operation and a second operation, the first operation including forming a Cu film on the third surface and the fourth surface by sputtering, the second operation including coating a polymer composition onto at least one of the first surface and the second surface, wherein the first operation and the second operation are performed sequentially or in the reverse order; And Perform a heat treatment operation, the heat treatment operation including performing heat treatment on the body on which the electrode forming operation has been performed to oxidize the outer surface of the Cu film.

15. The method according to claim 14, wherein Perform the heat treatment operation at a temperature of 160°C to 200°C.

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