Preparation method of glass core structure capable of being wired

Abstract

The invention discloses a preparation method of a glass core structure capable of wiring, and relates to the field of chips, and the preparation method comprises the following steps: S1, manufacturing through glass through holes in two glass cores, and slotting one of the glass cores; s2, plating a seed layer on the glass through hole; s3, manufacturing a corresponding circuit pattern; s4, manufacturing an electroplating circuit in the glass through hole; s5, bonding the first end of the glass core on a piece of carrier glass by using a bonding process; s6, preparing a multi-layer rewiring layer at the second end of the glass core; s7, stripping the carrier glass, and performing chemical mechanical grinding on the first end of the stripped substrate; s8, connecting the first ends of the two glass cores together; after the glass cores are used for preparing the single-face multi-layer rewiring layer, the two glass cores are bonded in a mixed mode, wiring can be conducted between the core layers, double rewiring layer number superposition is obtained, the difficulty is reduced by half compared with direct building of the multi-layer rewiring layer, and the method is suitable for a high-layer-number rewiring layer packaging technology; and the second end of the glass core is not limited to a redistribution layer and can also be an ABF adding layer.

Description

Technical Field

[0001] The present invention relates to the field of chips, and particularly to a preparation method of a glass core structure with wire routing ability. Background Art

[0002] In recent years, printed circuit boards have developed into micro-substrates with high density and high performance to serve as chip carriers for semiconductor packaging. In the field of semiconductor device packaging technology, glass core boards are favored due to their excellent thermal stability, low coefficient of thermal expansion, outstanding insulation, and high strength. The use of glass core boards significantly improves the performance and reliability of electronic devices. However, in the prior art, when using glass core boards, multi-layer redistribution layers are directly built, and this method has a high processing difficulty. Summary of the Invention

[0003] The purpose of the present invention is to design a preparation method of a glass core structure with wire routing ability to solve the above problems.

[0004] The present invention achieves the above purpose through the following technical solutions: A preparation method of a glass core structure with wire routing ability, comprising: S1. Use the TGV glass via process to manufacture through glass vias on two glass cores, and use the TGV glass via process to slot at the first end of one of the glass cores; S2. Deposit a seed layer on the glass vias; S3. Perform film pasting, exposure, and development steps in sequence to produce corresponding circuit patterns; S4. Use the principle of electrolytic cell to manufacture copper circuits, and electroplated circuits will be manufactured in the glass vias; S5. Bond the first end of the glass core to a carrier glass using a bonding process; S6. Prepare multi-layer redistribution layers at the second end of the glass core; S7. Peel off the carrier glass, and perform chemical mechanical polishing on the first end of the peeled substrate; S8. Connect the first ends of the two glass cores together.

[0005] The beneficial effects of the present invention are as follows: After manufacturing single-sided multi-layer redistribution layers using glass cores and then hybrid bonding the two glass cores, since one of the glass cores is slotted, wires can be routed between the core layers of the two glass cores, resulting in double the number of stacked redistribution layers. Compared with directly building multi-layer redistribution layers, the difficulty is reduced by half, which is suitable for high-layer redistribution layer packaging processes; and the second end of the glass core is not limited to the redistribution layer and can also be an ABF build-up layer. Brief Description of the Drawings

[0006] Figure 1 It is a schematic diagram of the preparation process of the first glass core in the preparation method of a glass core structure with wire routing ability of the present invention; Figure 2 It is a schematic diagram of the preparation process of the second glass core in the preparation method of a wire-walking glass core structure of the present invention; Figure 3 It is a schematic diagram of bonding two glass cores. Specific Embodiments

[0007] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0008] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0009] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0010] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, or the orientation or positional relationships in which the inventive product is habitually placed during use, or the orientation or positional relationships commonly understood by those skilled in the art. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0011] In addition, the terms "first", "second", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0012] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, terms such as "set", "connected" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0013] The following will combine with the attached drawings to elaborate in detail on the specific implementation manners of the present invention.

[0014] As Figure 1 、 Figure 2 shown, a preparation method of a glass core structure with wire routing includes: S1. Use the TGV glass vias process to fabricate penetrating glass vias on two glass cores. After opening the holes, use the TGV glass vias process to slot at the first end of one of the glass cores; S2. Deposit a seed layer on the glass vias by chemical plating or physical vapor deposition (PVD); S3. Successively perform the steps of laminating, exposure, and development to fabricate corresponding circuit patterns; S4. Fabricate copper circuits using the principle of electrolytic cells, and electroplated circuits will be fabricated inside the glass vias; S5. Bond the first end of the glass core to a carrier glass by a bonding process; S6. Prepare multi-layer redistribution layers at the second end of the glass core by coating polyimide (PI), PVD, coating photoresist (PR), exposure, development, electroplating, stripping, and etching. The number of layers of the redistribution layers is 3 - 6 layers; S7. Peel off the carrier glass and perform chemical mechanical polishing on the first end of the peeled substrate; S8. Connect the first ends of the two glass substrates together by a laser bonding or hybrid bonding process.

[0015] After preparing single-sided multi-layer redistribution layers using glass cores and then hybrid bonding the two glass cores, since one of the glass cores is slotted, wires can be routed between the core layers of the two glass cores, obtaining a double stacking of the number of redistribution layers. Compared with directly building multi-layer redistribution layers, the difficulty is halved, which is suitable for high-layer redistribution layer packaging processes; and the second end of the glass core is not limited to redistribution layers and can also be an ABF build-up layer.

[0016] The technical solution of the present invention is not limited to the limitations of the above specific embodiments. Any technical deformation made according to the technical solution of the present invention falls within the protection scope of the present invention.

Claims

1. A preparation method of a glass core structure with wire routing, characterized in that, Including: S1. Fabricate penetrating glass vias on two glass cores using the TGV glass via process, and perform grooving at the first end of one of the glass cores using the TGV glass via process; S2. Deposit a seed layer on the glass vias; S3. Perform the steps of laminating, exposure, and development in sequence to fabricate corresponding circuit patterns; S4. Fabricate copper circuits using the electrolytic cell principle, and electroplated circuits will be fabricated inside the glass vias; S5. Bond the first end of the glass core to a carrier glass using a bonding process; S6. Prepare multiple redistribution layers at the second end of the glass core; S7. Peel off the carrier glass, and perform chemical mechanical polishing on the first end of the peeled substrate; S8. Connect the first ends of the two glass cores together.

2. The preparation method of a wire-walking glass core structure according to claim 1, characterized in that, In S2, deposit a seed layer on the glass vias using electroless plating or physical vapor deposition (PVD).

3. The preparation method of a glass core structure with wire routing according to claim 1, characterized in that, In S6, prepare multiple redistribution layers at the second end of the glass core by coating polyimide (PI), PVD, coating photoresist (PR), exposure, development, electroplating, stripping, and etching.

4. The preparation method of a glass core structure with wire routing according to claim 3, characterized in that, The number of redistribution layers is 3 - 6 layers.

5. The preparation method of a glass core structure with wire routing according to claim 1, characterized in that, In S8, connect the first ends of the two glass cores together using a laser bonding or hybrid bonding process.

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