Packing device and method for packing resin columns in multiple through holes of IC carrier plate

Abstract

The invention discloses a filling device and method for filling resin columns in multiple through holes of an IC carrier plate, and relates to the technical field of filling the resin columns in the multiple through holes of the IC carrier plate, and the filling device comprises a dispersing assembly which is arranged on a workbench and is used for dispersing powder resin, an inner side support and an outer side support are fixedly arranged on the top surface of a shaking plate of the dispersing assembly, a horizontally-arranged enclosure frame is fixedly arranged at the top end of the inner side support, an opening is formed in the top of the enclosure frame, the bottom of the enclosure frame is closed, and a plurality of unthreaded holes corresponding to through holes of the IC carrier plate are formed in the closed end; a piston rod of the pressurizing air cylinder downwards penetrates through the transverse plate, a lifting plate is fixedly arranged at the extending end, and a plurality of pressurizing rods are fixedly arranged on the bottom surface of the lifting plate; the shaking plate is provided with a jacking assembly used for positioning and fixing the IC carrier plate. The resin column filling device has the beneficial effects that the filling quality is high, and the efficiency of filling the resin column into the IC carrier plate is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of filling resin columns in multiple through-holes of an IC carrier board, and particularly to a filling device and method for filling resin columns in multiple through-holes of an IC carrier board. Background Art

[0002] The IC carrier board is a packaging substrate for integrated circuits. It can serve as a bridge connecting the bare chip and the PCB board, and bears multiple functions such as electrical connection, support, and heat dissipation. The structure of the IC carrier board 1 produced by a certain workshop is as Figures 1 - 2 shown. A row of through-holes 2 are formed in the IC carrier board 1, and the diameter of the through-holes 2 is 1 - 2 mm.

[0003] When the workshop delivers a batch of IC carrier boards 1 to the customer, workers will fill a columnar resin column 3 in each through-hole 2 of each IC carrier board 1. The structure of the IC carrier board 1 filled with the resin column 3 is as Figures 3 - 4 shown. The reason for filling the resin column 3 in the IC carrier board 1 is that the resin column 3 plays a role in protecting the inner wall of the through-hole 2. When the customer receives the IC carrier board 1, the customer then removes the resin column 3 in the IC carrier board 1 for further processing of the IC carrier board 1.

[0004] The method for workers in this workshop to fill the resin column 3 in each through-hole 2 of the IC carrier board 1 is as follows: S1. Workers take out a rectangular fixture 4 as Figures 5 - 6 shown, and place the IC carrier board 1 as Figures 1 - 2 shown into the rectangular groove 5 of the rectangular fixture 4, ensuring that the bottom surface of the IC carrier board 1 is in contact with the bottom surface of the rectangular fixture 4, as Figure 7 shown; S2. Workers pile up powder resin on the top surface of the IC carrier board 1, as Figure 8 shown, and then use a scraper to drive the piled-up powder resin so that the piled-up powder resin is dispersed in each through-hole 2 of the IC carrier board 1, as Figure 9 shown; S3. Workers place the rectangular fixture 4 flat on the tabletop of the pressing table 6 of the press, and then adjust the position of the rectangular fixture 4 so that the four outer end faces of the rectangular fixture 4 are respectively flush with the four outer end faces of the pressing table 6, thereby positioning the IC carrier board 1 on the pressing table 6 of the press, as Figure 10 shown. At this time, each through-hole 2 in the IC carrier board 1 is respectively located directly below each pressing rod 7 of the press; S4. The worker controls the piston rod of the pressure cylinder 8 of the press to extend downward. The pressure cylinder 8 drives the lifting plate 9 connected thereto to move downward, and the lifting plate 9 drives the respective pressure rods 7 thereon to move downward. Each of the pressure rods 7 presses the powdered resin in each through hole 2 of the IC carrier 1, so that the powdered resin gradually becomes dense. After the piston rod of the pressure cylinder 8 is fully extended, a resin column 3 can be pressed in each through hole 2 of the IC carrier 1, as Figure 11 shown, realizing the filling of the resin column 3 into the first IC carrier 1; S5. After the filling is completed, the worker controls the piston rod of the pressure cylinder 8 of the press to retract upward. The piston rod drives the lifting plate 9 to move upward, and the lifting plate 9 drives the respective pressure rods 7 to move upward. Then the worker pours out the IC carrier 1 in the rectangular fixture 4 and the powdered resin remaining on its top surface, and the pouring direction is as Figure 12 shown by the arrow in, so as to obtain the first IC carrier 1 filled with the resin column 3 as Figures 3 - 4 shown; S6. The worker repeats the operations in steps S1 - S5 multiple times, and then the resin column 3 can be filled into all the IC carriers 1. Finally, the worker delivers these IC carriers 1 to the customer.

[0005] However, although the method used in the workshop can fill the resin column 3 into each through hole 2 of the IC carrier 1, in actual operation, the following technical defects are still reflected: I. In step S2, when the worker uses the scraper to drive the powdered resin piled on the top surface of the IC carrier 1, the moving powdered resin will undoubtedly rub against the top surface of the IC carrier 1, and thus scratches will be generated on the top surface of the IC carrier 1. However, the customer requires that the top surface of the IC carrier 1 filled with the resin column 3 has no scratches. Therefore, the filling method used in the workshop has the technical defect of poor filling quality.

[0006] II. In step S2, that is, before filling the resin column 3, the powdered resin needs to be piled on the top surface of the IC carrier 1; in step S5, that is, after filling the resin column 3, the powdered resin remaining on the top surface of the IC carrier 1 also needs to be poured out so as to continue filling the resin column 3 into the second IC carrier 1. That is to say, in the process of filling each IC carrier 1, the worker needs to perform these two processes, resulting in a long time consumption for filling the resin column 3 into one IC carrier 1, and further a long time consumption for filling the resin column 3 into all the IC carriers 1. There is the technical defect of low efficiency in filling the resin column 3 into the IC carrier 1.

[0007] Therefore, there is an urgent need for a filling device and method with high filling quality and greatly improved efficiency in filling the resin column into the IC carrier. Summary of the Invention

[0008] The object of the present invention is to overcome the shortcomings of the prior art and provide a filling device and method for filling resin columns in multiple through-holes of an IC carrier board.

[0009] The object of the present invention is achieved by the following technical solutions: A filling device for filling resin columns in multiple through-holes of an IC carrier board, which includes a dispersion component disposed on a workbench for dispersing powder resin. An inner support and an outer support are fixedly provided on the top surface of the shaking plate of the dispersion component. A horizontally arranged surrounding frame is fixedly provided at the top end of the inner support. An opening is provided at the top of the surrounding frame, and the bottom of the surrounding frame is closed. A plurality of light holes corresponding to the respective through-holes of the IC carrier board are provided on the closed end, and the diameter of the light holes is equal to the diameter of the through-holes of the IC carrier board. A horizontal plate extending directly above the surrounding frame is fixedly provided at the top of the outer support. A pressing cylinder is fixedly provided on the top surface of the horizontal plate. The piston rod of the pressing cylinder penetrates downward through the horizontal plate, and a lifting plate is fixedly provided at the extending end. A plurality of pressing rods are fixedly provided on the bottom surface of the lifting plate. The plurality of pressing rods are respectively located directly above the respective light holes, and the diameter of the pressing rods is equal to the diameter of the through-holes. A jacking component for positioning and fixing the IC carrier board is provided on the shaking plate. The jacking component includes a vertically arranged jacking cylinder fixedly provided inside the shaking plate. A positioning table located directly below the surrounding frame is fixedly provided at the acting end of the piston rod of the jacking cylinder. A positioning notch penetrating through its right end face is provided on the top surface of the positioning table. The positioning notch is matched with the outer contour of the IC carrier board, and the depth of the positioning notch is less than the thickness of the IC carrier board.

[0010] Support legs supporting the ground are fixedly provided on the bottom surface of the workbench at its four corners.

[0011] The dispersion component includes a fixed column and a shaking cylinder respectively fixedly provided on the top and bottom surfaces of the workbench. A horizontally arranged shaking plate is provided between the shaking cylinder and the fixed column. First hinge seats are fixedly provided on the bottom surface of the shaking plate at its left and right ends respectively. The first hinge seat is hinged to the top end of the fixed column. A connecting rod is hinged to the second hinge seat, and the other end of the connecting rod is hinged to the piston rod of the shaking cylinder.

[0012] The cylinder body of the shaking cylinder is fixedly provided on the bottom surface of the workbench, and its piston rod penetrates upward through the workbench.

[0013] Two guiding seats are fixedly provided on the top surface of the horizontal plate respectively on the left and right sides of the pressing cylinder. Two rods are fixedly provided on the top surface of the lifting plate. The two rods respectively slide upward through the two guiding seats.

[0014] The filling device further includes a controller, and the controller is electrically connected to the shaking cylinder, the jacking cylinder, and the pressing cylinder via signal lines.

[0015] A method for filling resin columns in multiple through-holes of an IC carrier board, which comprises the following steps: S1. Positioning of the IC carrier board: A worker takes out an IC carrier board and inserts the IC carrier board into the positioning stop of the positioning table of the lifting assembly from top to bottom. Since the positioning stop matches the outer contour of the IC carrier board, the positioning of the IC carrier board is achieved. At this time, each through-hole in the IC carrier board is respectively directly below each light hole of the surrounding frame; S2. Fixing of the IC carrier board: Control the piston rod of the lifting cylinder of the lifting assembly to extend upward. The piston rod drives the positioning table to move upward, and the positioning table drives the IC carrier board therein to move towards the surrounding frame. When the piston rod of the lifting cylinder is fully extended, the IC carrier board is just fixed between the surrounding frame and the positioning table, thus achieving the fixing of the IC carrier board; S3. The worker stacks powdered resin from the opening of the surrounding frame. At this time, the stacked powdered resin is supported on the surface of the inner bottom wall of the surrounding frame and is restricted within the surrounding frame; S4. Disperse the stacked powdered resin into each through-hole of the IC carrier board. The specific operation steps are as follows: S41. The worker controls the piston rod of the shaking cylinder of the dispersion assembly to perform reciprocating telescopic motion. When the piston rod of the shaking cylinder extends upward, the piston rod drives the connecting rod to move upward, and the connecting rod drives the shaking plate to rotate counterclockwise around the first hinge seat. The shaking plate drives the inner support bracket, outer support bracket, lifting cylinder, surrounding frame and IC carrier board thereon to rotate synchronously; When the piston rod of the shaking cylinder retracts downward, the piston rod drives the connecting rod to move downward, and the connecting rod drives the shaking plate to rotate clockwise around the first hinge seat. The shaking plate drives the inner support bracket, outer support bracket, lifting cylinder, surrounding frame and IC carrier board thereon to rotate synchronously; S42. As the piston rod of the shaking cylinder performs reciprocating telescopic motion, the powdered resin accumulated in the surrounding frame is gradually dispersed. The powdered resin enters the through-holes of the IC carrier board through the light holes of the surrounding frame; After the shaking cylinder works for a period of time, the controller controls the shaking cylinder to close, thus finally achieving the dispersion of the stacked powdered resin into each through-hole of the IC carrier board; S5. Control the piston rod of the pressurizing cylinder to extend downward. The piston rod drives the lifting plate to move downward, and the lifting plate drives each pressurizing rod to move downward. Each pressurizing rod respectively faces each light hole of the surrounding frame, and the pressurizing rod pressurizes the powdered resin in the light hole and the through-hole to make the powdered resin gradually become dense; When the piston rod of the pressurizing cylinder is fully extended, a resin column can be pressed in each through-hole of the IC carrier board, and the top and bottom surfaces of the pressed resin column are respectively flush with the top and bottom surfaces of the IC carrier board, thus achieving the filling of resin columns into the first IC carrier board; S6. Removal of the IC carrier filled with resin columns: The worker controls the piston rod of the lifting cylinder to retract downward. The piston rod drives the positioning table to move downward, and the positioning table drives the IC carrier to move downward. After the piston rod of the lifting cylinder is fully retracted, the worker removes the IC carrier from the positioning table, thereby obtaining the first IC carrier filled with resin columns. S7. Filling resin columns into the second IC carrier: The worker first repeats the operations of steps S1 - S2 once to fix the second IC carrier between the surrounding frame and the positioning table. Then, the worker controls the piston rod of the pressure - adding cylinder to retract upward. The piston rod drives the lifting plate to move upward, and the lifting plate drives each pressure - adding rod to move upward to reset the pressure - adding rods. Then, the worker repeats the operation of step S4 once to disperse the powdered resin in the surrounding frame into each through - hole of the second IC carrier. Then, the worker repeats the operation of step S5 once, and thus the resin columns can be filled into the second IC carrier. Finally, the worker repeats the operation of step S6 once, and the second IC carrier filled with resin columns can be obtained. S8. The worker repeats the operation of step S7 multiple times to complete the filling of resin columns into all IC carriers.

[0016] The present invention has the following advantages: high filling quality and greatly improved efficiency of filling resin columns into IC carriers. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of an IC carrier produced by a certain workshop; Figure 2 It is Figure 1 the top view of Figure 3 It is a schematic structural diagram of an IC carrier filled with resin columns; Figure 4 It is Figure 3 the top view of Figure 5 It is a schematic structural diagram of a rectangular fixture; Figure 6 It is Figure 5 the main sectional view of Figure 7 It is a schematic diagram of placing an IC carrier into the rectangular groove of a rectangular fixture; Figure 8 It is a schematic diagram of piling powdered resin onto the top surface of an IC carrier; Figure 9 It is a schematic diagram of dispersing the piled powdered resin into each through - hole of the IC carrier; Figure 10 It is a schematic diagram of positioning an IC carrier on the pressing table of a press; Figure 11Schematic diagram of pressing a resin column in each through hole of an IC carrier board; Figure 12 Schematic diagram of pouring out the IC carrier board in the rectangular fixture and the powder resin remaining on its top surface; Figure 13 Schematic structural diagram of the present invention; Figure 14 For Figure 13 M-direction schematic diagram of; Figure 15 For Figure 13 Front view of; Figure 16 For Figure 15 Main sectional schematic diagram of Figure 17 Schematic diagram of the connection between the inner bracket and the surrounding frame; Figure 18 Schematic diagram of the connection between the outer bracket, the pressing cylinder and the pressing rod; Figure 19 Schematic diagram of realizing the positioning of the IC carrier board; Figure 20 Schematic diagram of realizing the fixation of the IC carrier board; Figure 21 Schematic diagram of the stacked powder resin supported on the surface of the inner bottom wall of the surrounding frame; Figure 22 Schematic diagram of the movement of the shaking plate; Figure 23 Schematic diagram of realizing the dispersion of the stacked powder resin in each through hole of the IC carrier board; Figure 24 Schematic diagram of pressing a resin column in each through hole of an IC carrier board; Figure 25 For Figure 24 Partial enlarged view of part N of; Figure 26 Schematic diagram of the positioning table driving the IC carrier board to move downward; Figure 27 Schematic diagram of taking away the IC carrier board from the positioning table; In the figure: 1 - IC carrier board, 2 - through hole, 3 - resin column, 4 - rectangular fixture, 5 - rectangular groove, 6 - pressing table, 7 - pressing rod, 8 - pressing cylinder, 9 - lifting plate; 10 - workbench, 11 - inner bracket, 12 - outer bracket, 13 - surrounding frame, 14 - light hole, 15 - cross plate, 16 - lifting assembly, 17 - lifting cylinder, 18 - positioning table, 19 - positioning stop; 20 - Fixed column, 21 - Shaking cylinder, 22 - Shaking plate, 23 - First hinge seat, 24 - Second hinge seat, 25 - Connecting rod, 26 - Guide seat, 27 - Rod member. Detailed implementation manner

[0018] The present invention will be further described below in conjunction with the accompanying drawings. The protection scope of the present invention is not limited to the following: As Figures 13 - 18 shown, a filling device for filling resin columns in multiple through - holes of an IC carrier includes a dispersion component arranged on a workbench 10 for dispersing powder resin. Support legs supported on the ground are fixedly provided on the bottom surface of the workbench 10 at its four corners. An inner support bracket 11 and an outer support bracket 12 are fixedly provided on the top surface of the shaking plate 22 of the dispersion component. A horizontally arranged surrounding frame 13 is fixedly provided at the top end of the inner support bracket 11. An opening is provided at the top of the surrounding frame 13, and the bottom of the surrounding frame 13 is closed. A plurality of light holes 14 corresponding to the respective through - holes 2 of the IC carrier 1 are provided on the closed end. The diameter of the light hole 14 is equal to the diameter of the through - hole 2 of the IC carrier 1. A cross - plate 15 extending directly above the surrounding frame 13 is fixedly provided at the top of the outer support bracket 12. A pressurizing cylinder 8 is fixedly provided on the top surface of the cross - plate 15. The piston rod of the pressurizing cylinder 8 penetrates the cross - plate 15 downward, and a lifting plate 9 is fixedly provided at the extending end. A plurality of pressurizing rods 7 are fixedly provided on the bottom surface of the lifting plate 9. The plurality of pressurizing rods 7 are respectively located directly above the respective light holes 14, and the diameter of the pressurizing rod 7 is equal to the diameter of the through - hole 2. Two guide seats 26 are fixedly provided on the top surface of the cross - plate 15, respectively located on the left and right sides of the pressurizing cylinder 8. Two rod members 27 are fixedly provided on the top surface of the lifting plate 9, and the two rod members 27 respectively slide upward through the two guide seats 26.

[0019] A jacking component 16 for positioning and fixing the IC carrier 1 is provided on the shaking plate 22. The jacking component 16 includes a vertically arranged jacking cylinder 17 fixedly provided inside the shaking plate 22. A positioning table 18 located directly below the surrounding frame 13 is fixedly provided at the acting end of the piston rod of the jacking cylinder 17. A positioning stop opening 19 penetrating its right end face is provided on the top surface of the positioning table 18. The positioning stop opening 19 is matched with the outer contour of the IC carrier 1, and the depth of the positioning stop opening 19 is less than the thickness of the IC carrier 1.

[0020] The dispersion component includes a fixed column 20 and a shaking cylinder 21 respectively fixed on the top and bottom surfaces of the workbench 10. A horizontally arranged shaking plate 22 is provided between the shaking cylinder 21 and the fixed column 20. On the bottom surface of the shaking plate 22 and at its left and right ends, a first hinge seat 23 and a second hinge seat 24 are respectively fixed. The first hinge seat 23 is hinged to the top end of the fixed column 20, and a connecting rod 25 is hinged to the second hinge seat 24. The other end of the connecting rod 25 is hinged to the piston rod of the shaking cylinder 21. The cylinder block of the shaking cylinder 21 is fixed on the bottom surface of the workbench 10, and its piston rod penetrates upward through the workbench 10.

[0021] The stuffing device further includes a controller, and the controller is electrically connected to the shaking cylinder 21, the lifting cylinder 17 and the pressurizing cylinder 8 through signal lines.

[0022] A method for stuffing resin columns into multiple through-holes of an IC carrier includes the following steps: S1. Positioning of the IC carrier 1: The worker takes out an IC carrier 1 as shown in Figures 1 - 2 and inserts the IC carrier 1 into the positioning stop 19 of the positioning table 18 of the lifting assembly 16 from top to bottom. Since the positioning stop 19 matches the outer contour of the IC carrier 1, the positioning of the IC carrier 1 is achieved. As shown in Figure 19 , at this time, each through-hole 2 in the IC carrier 1 is respectively located directly below each optical hole 14 of the enclosure 13; S2. Fixing of the IC carrier 1: Control the piston rod of the lifting cylinder 17 of the lifting assembly 16 to extend upward. The piston rod drives the positioning table 18 to move upward, and the positioning table 18 drives the IC carrier 1 therein to move towards the enclosure 13. When the piston rod of the lifting cylinder 17 is fully extended, the IC carrier 1 is just fixed between the enclosure 13 and the positioning table 18, thus achieving the fixing of the IC carrier 1. As shown in Figure 20 ; S3. The worker stacks powder resin from the opening of the enclosure 13. At this time, the stacked powder resin is supported on the surface of the inner bottom wall of the enclosure 13 and is restricted within the enclosure 13. As shown in Figure 21 ; S4. Disperse the stacked powder resin into each through-hole 2 of the IC carrier 1. The specific operation steps are as follows: S41. The worker controls the piston rod of the shaking cylinder 21 of the dispersion component to perform reciprocating telescopic motion. When the piston rod of the shaking cylinder 21 extends upward, the piston rod drives the connecting rod 25 to move upward, and the connecting rod 25 drives the shaking plate 22 to rotate counterclockwise around the first hinge seat 23. The shaking plate 22 drives the inner support bracket 11, the outer support bracket 12, the lifting cylinder 17, the enclosure 13 and the IC carrier 1 thereon to rotate synchronously; When the piston rod of the shaking cylinder 21 retracts downward, the piston rod drives the connecting rod 25 to move downward, and the connecting rod 25 drives the shaking plate 22 to rotate clockwise around the first hinge seat 23. The shaking direction of the shaking plate 22 is as shown by the arrow in Figure 22 , and the shaking plate 22 drives the inner support 11, outer support 12, lifting cylinder 17, enclosure 13 and IC carrier 1 thereon to rotate synchronously; S42. As the piston rod of the shaking cylinder 21 makes reciprocating telescopic movements, the powder resin accumulated in the enclosure 13 is gradually dispersed. The powder resin enters the through holes 2 of the IC carrier 1 through the light holes 14 of the enclosure 13. After the shaking cylinder 21 works for a period of time, the controller controls the shaking cylinder 21 to close, thus finally realizing the dispersion of the stacked powder resin in each through hole 2 of the IC carrier 1, as shown in Figure 23 ; Among them, it can be seen from steps S2 to S4 that only by first controlling the piston rod of the lifting cylinder 17 to extend upward to fix the IC carrier 1 between the positioning table 18 and the enclosure 13, and then controlling the piston rod of the shaking cylinder 21 of the dispersion assembly to make reciprocating telescopic movements, the powder resin can be dispersed in each through hole 2 of the IC carrier 1. Among them, during the dispersion process of the powder resin, the powder resin only moves on the surface of the inner bottom wall of the enclosure 13 and does not rub against the top surface of the IC carrier 1, so that no scratches will be generated on the top surface of the IC carrier 1, achieving the purpose of protecting the top surface of the IC carrier 1. It can be seen from this that compared with using a scraping blade to disperse the powder resin in the workshop, this stuffing device greatly improves the stuffing quality and meets the requirements of customers for the surface quality of the IC carrier.

[0023] S5. Control the piston rod of the pressing cylinder 8 to extend downward. The piston rod drives the lifting plate 9 to move downward, and the lifting plate 9 drives each pressing rod 7 to move downward. Each pressing rod 7 respectively faces each light hole 14 of the enclosure 13, and the pressing rod 7 presses the powder resin in the light hole 14 and the through hole 2 to make the powder resin gradually become dense. When the piston rod of the pressing cylinder 8 is fully extended, a resin column 3 can be pressed in each through hole 2 of the IC carrier 1, as shown in Figures 24 - 25 . The top and bottom surfaces of the pressed resin column 3 are flush with the top and bottom surfaces of the IC carrier 1 respectively, thus realizing the stuffing of the resin column 3 into the first IC carrier 1; S6. Taking away the IC carrier 1 stuffed with the resin column 3: The worker controls the piston rod of the lifting cylinder 17 to retract downward. The piston rod drives the positioning table 18 to move downward, and the positioning table 18 drives the IC carrier 1 to move downward, as shown in Figure 26 . When the piston rod of the lifting cylinder 17 is fully retracted, the worker takes away the IC carrier 1 from the positioning table 18. The taking-away direction is as shown by the arrow in Figure 27 , thus obtaining the first one as shown in Figures 3 - 4The IC carrier 1 filled with the resin column 3 as shown; S7. Filling the resin column 3 into the second IC carrier 1: The worker first repeats the operations of steps S1 - S2 once to fix the second IC carrier 1 between the surrounding frame 13 and the positioning table 18. Then, control the piston rod of the pressurizing cylinder 8 to retract upward. The piston rod drives the lifting plate 9 to move upward, and the lifting plate 9 drives each pressurizing rod 7 to move upward to reset the pressurizing rod 7. Then the worker repeats the operation of step S4 once to disperse the powdered resin in the surrounding frame 13 into each through - hole 2 of the second IC carrier 1. Then the worker repeats the operation of step S5 once, and thus the resin column 3 can be filled into the second IC carrier 1. Finally, repeat the operation of step S6 once, and the second Figures 3 - 4 IC carrier 1 filled with the resin column 3 as shown can be obtained; S8. The worker repeats the operation of step S7 many times in this way to complete filling the resin column 3 into all the IC carriers 1.

[0024] In step S3, after stacking the powdered resin into the surrounding frame 13 once, the worker only needs to continuously repeat the operations of S5 - S8 to continuously fill the resin column 3 into each IC carrier 1. Compared with the filling method as shown Figures 5 - 12 in the workshop, it is not necessary to stack the powdered resin on the top surface of the IC carrier 1 before filling the resin column 3, nor to pour off the powdered resin remaining on the top surface of the IC carrier 1 after filling the resin column 3, saving two processes, achieving filling the resin column 3 into one IC carrier 1 in a short time, and then achieving filling the resin column 3 into all the IC carriers 1 in a short time, thus greatly improving the efficiency of filling the resin column 3 into the IC carrier 1.

[0025] Finally, it should be noted that the above - mentioned are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A filling device for filling resin columns in multiple through-holes of an IC carrier board, characterized in that: It includes a dispersion component disposed on the workbench (10) for dispersing powder resin. An inner bracket (11) and an outer bracket (12) are fixedly provided on the top surface of the shaking plate (22) of the dispersion component. A horizontally arranged surrounding frame (13) is fixedly provided at the top end of the inner bracket (11). An opening is provided at the top of the surrounding frame (13), and the bottom of the surrounding frame (13) is closed. A plurality of light holes (14) corresponding to the respective through holes (2) of the IC carrier (1) are provided in the closed end. The diameter of the light hole (14) is equal to the diameter of the through hole (2) of the IC carrier (1). A cross plate (15) extending directly above the surrounding frame (13) is fixedly provided at the top of the outer bracket (12). A pressing cylinder (8) is fixedly provided on the top surface of the cross plate (15). The piston rod of the pressing cylinder (8) penetrates downward through the cross plate (15), and a lifting plate (9) is fixedly provided at the extending end. A plurality of pressing rods (7) are fixedly provided on the bottom surface of the lifting plate (9). The plurality of pressing rods (7) are respectively located directly above the respective light holes (14), and the diameter of the pressing rod (7) is equal to the diameter of the through hole (2). A jacking component (16) for positioning and fixing the IC carrier (1) is provided on the shaking plate (22). The jacking component (16) includes a vertically arranged jacking cylinder (17) fixedly provided inside the shaking plate (22). A positioning table (18) located directly below the surrounding frame (13) is fixedly provided at the acting end of the piston rod of the jacking cylinder (17). A positioning stop (19) penetrating through its right end face is provided on the top surface of the positioning table (18). The positioning stop (19) is matched with the outer contour of the IC carrier (1), and the depth of the positioning stop (19) is less than the thickness of the IC carrier (1).

2. The resin column stuffing device for stuffing resin columns into multiple through holes of an IC substrate according to claim 1, characterized in that: Support legs supporting the ground are fixedly provided on the bottom surface of the workbench (10) at its four corners.

3. A filling device for filling resin columns in multiple through-holes of an IC carrier board according to claim 2, characterized in that: The dispersion component includes a fixed column (20) and a shaking cylinder (21) fixedly provided on the top and bottom surfaces of the workbench (10) respectively. A horizontally arranged shaking plate (22) is provided between the shaking cylinder (21) and the fixed column (20). First hinge seats (23) and second hinge seats (24) are fixedly provided on the bottom surface of the shaking plate (22) at its left and right ends respectively. The first hinge seat (23) is hinged to the top end of the fixed column (20), and a connecting rod (25) is hinged to the second hinge seat (24). The other end of the connecting rod (25) is hinged to the piston rod of the shaking cylinder (21).

4. A filling device for filling resin columns in multiple through-holes of an IC substrate according to claim 3, characterized in that: The cylinder body of the shaking cylinder (21) is fixedly provided on the bottom surface of the workbench (10), and its piston rod penetrates upward through the workbench (10).

5. The resin column stuffing device for stuffing resin columns into multiple through holes of an IC carrier board according to claim 4, wherein: Two guide seats (26) are fixedly provided on the top surface of the cross plate (15) respectively on the left and right sides of the pressing cylinder (8). Two rods (27) are fixedly provided on the top surface of the lifting plate (9). The two rods (27) respectively slide upward through the two guide seats (26).

6. The resin column filling device for filling resin columns in multiple through holes of an IC substrate according to claim 5, characterized in that: The stuffing device further includes a controller, and the controller is electrically connected to the shaking cylinder (21), the jacking cylinder (17), and the pressing cylinder (8) via signal lines.

7. A method for filling resin columns in multiple vias of an IC substrate, using the filling device for filling resin columns in multiple vias of an IC substrate as described in claim 6, characterized in that: It includes the following steps: S1. Positioning of the IC substrate (1): The worker takes out an IC substrate (1) and inserts the IC substrate (1) vertically downward into the positioning stop (19) of the positioning table (18) of the lifting assembly (16). Since the positioning stop (19) matches the outer contour of the IC substrate (1), the positioning of the IC substrate (1) is achieved. At this time, each through hole (2) in the IC substrate (1) is respectively located directly below each optical hole (14) of the enclosure (13). S2. Fixing of the IC substrate (1): Control the piston rod of the lifting cylinder (17) of the lifting assembly (16) to extend upward. The piston rod drives the positioning table (18) to move upward, and the positioning table (18) drives the IC substrate (1) therein to move towards the enclosure (13). When the piston rod of the lifting cylinder (17) is fully extended, the IC substrate (1) is just fixed between the enclosure (13) and the positioning table (18), thus achieving the fixing of the IC substrate (1). S3. The worker stacks powder resin from the opening of the enclosure (13). At this time, the stacked powder resin supports on the surface of the inner bottom wall of the enclosure (13) and is restricted within the enclosure (13). S4. Disperse the stacked powder resin into each through hole (2) of the IC substrate (1). The specific operation steps are as follows: S41. The worker controls the piston rod of the shaking cylinder (21) of the dispersion assembly to perform reciprocating telescopic motion. When the piston rod of the shaking cylinder (21) extends upward, the piston rod drives the connecting rod (25) to move upward, and the connecting rod (25) drives the shaking plate (22) to rotate counterclockwise around the first hinge seat (23). The shaking plate (22) drives the inner support (11), outer support (12), lifting cylinder (17), enclosure (13) and IC substrate (1) thereon to rotate synchronously. When the piston rod of the shaking cylinder (21) retracts downward, the piston rod drives the connecting rod (25) to move downward, and the connecting rod (25) drives the shaking plate (22) to rotate clockwise around the first hinge seat (23). The shaking plate (22) drives the inner support (11), outer support (12), lifting cylinder (17), enclosure (13) and IC substrate (1) thereon to rotate synchronously. S42. As the piston rod of the shaking cylinder (21) performs reciprocating telescopic motion, the powder resin accumulated in the enclosure (13) is gradually dispersed. The powder resin enters the through hole (2) of the IC substrate (1) through the optical hole (14) of the enclosure (13). After the shaking cylinder (21) works for a period of time, the controller controls the shaking cylinder (21) to close, thus finally achieving the dispersion of the stacked powder resin into each through hole (2) of the IC substrate (1). S5. Control the piston rod of the pressure cylinder (8) to extend downward. The piston rod drives the lifting plate (9) to move downward, and the lifting plate (9) drives each pressure rod (7) to move downward. Each pressure rod (7) respectively faces each light hole (14) of the surrounding frame (13). The pressure rod (7) presses the powder resin in the light hole (14) and the through hole (2) so that the powder resin gradually becomes dense. After the piston rod of the pressure cylinder (8) fully extends, a resin column (3) can be pressed in each through hole (2) of the IC carrier (1). The top and bottom surfaces of the pressed resin column (3) are flush with the top and bottom surfaces of the IC carrier (1), thus realizing the filling of the resin column (3) into the first IC carrier (1). S6. Removal of the IC carrier (1) filled with the resin column (3): The worker controls the piston rod of the lifting cylinder (17) to retract downward. The piston rod drives the positioning table (18) to move downward, and the positioning table (18) drives the IC carrier (1) to move downward. After the piston rod of the lifting cylinder (17) fully retracts, the worker takes the IC carrier (1) out of the positioning table (18), thus obtaining the first IC carrier (1) filled with the resin column (3). S7. Filling the resin column (3) into the second IC carrier (1): The worker first repeats the operations of steps S1 - S2 once to fix the second IC carrier (1) between the surrounding frame (13) and the positioning table (18). Then, control the piston rod of the pressure cylinder (8) to retract upward. The piston rod drives the lifting plate (9) to move upward, and the lifting plate (9) drives each pressure rod (7) to move upward to reset the pressure rod (7). Then the worker repeats the operation of step S4 once to disperse the powder resin in the surrounding frame (13) into each through hole (2) of the second IC carrier (1). Then the worker repeats the operation of step S5 once, and thus realizes the filling of the resin column (3) into the second IC carrier (1). Finally, repeat the operation of step S6 once, and the second IC carrier (1) filled with the resin column (3) can be obtained. S8. The worker repeats the operation of step S7 many times in this way to complete the filling of the resin column (3) into all IC carriers (1).

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