A transfer dispensing detection device and a transfer dispensing detection method of a die bonder

Abstract

The application relates to a transmission point glue detection device and a transmission point glue detection method of a die bonder, which comprise a workbench, a transmission mechanism, a point glue height detection mechanism and an AOI detection mechanism. The left and right sides of a first stand are respectively provided with a first displacement mechanism and a second displacement mechanism. The output end of the first displacement mechanism is provided with a first connecting plate. The point glue height detection mechanism comprises a point glue function head and a height detection function head. The point glue function head and the height detection function head are arranged on the first connecting plate. The output end of the second displacement mechanism is provided with a second connecting plate. The AOI detection mechanism is arranged on the second connecting plate. The first connecting plate and the second connecting plate are respectively arranged at the head end and the tail end of the transmission mechanism. The application integrates the transmission, point glue, height detection and AOI detection functions, greatly improves the overall operation efficiency of the production line, guarantees the accuracy of appearance detection, and effectively reduces the space occupied by the equipment through compact design.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonder, in particular to a transmission dispensing detection device and a transmission dispensing detection method of die bonder. BACKGROUND

[0002] With the rapid development of the semiconductor industry, die bonder as one of the key equipment plays an important role in the chip manufacturing process. The traditional die bonder in the execution of transmission, dispensing and detection operations, due to the particularity of the industry, the precision requirement is high, so the transmission, dispensing, detection, feeding and discharging device and other functional components occupy a large volume, often need to separate multiple independent modules or equipment to complete the corresponding task, which not only increases the overall complexity of the equipment, but also due to the lack of coordination between different modules, may lead to low production efficiency, low dispensing precision and unstable product quality and other problems. SUMMARY

[0003] The present application aims to at least solve the technical problems existing in the prior art. To this end, the present application provides a transmission dispensing detection device and a transmission dispensing detection method of die bonder, which integrates transmission, dispensing, height measurement and AOI detection functions, can accurately position, simplify the equipment structure, and also can improve the die bonding process precision and efficiency, so as to improve the overall production quality and work efficiency.

[0004] According to some embodiments of the first aspect of the present application, a transmission dispensing detection device of die bonder, comprising a workbench, a transmission mechanism, a dispensing and height measurement mechanism and an AOI detection mechanism, the workbench is provided with a first stand and a second stand, the left and right sides of the first stand are respectively provided with a first displacement mechanism and a second displacement mechanism, the transmission mechanism is arranged on the second stand, the output end of the first displacement mechanism is provided with a first connecting plate, the dispensing and height measurement mechanism comprises a dispensing function head and a height measurement function head, the dispensing function head and the height measurement function head are arranged on the first connecting plate, the output end of the second displacement mechanism is provided with a second connecting plate, the AOI detection mechanism is arranged on the second connecting plate, and the first connecting plate and the second connecting plate are respectively located at the head and tail ends of the transmission mechanism.

[0005] According to some embodiments of the first aspect of the present application, a transmission dispensing detection device of die bonder, at least has the following beneficial effects:

[0006] The present application integrates the functions of transmission, dispensing, height measurement and AOI detection, reduces the conversion and coordination time between different functional modules, greatly improves the overall operation efficiency of the production line, accurately controls the position of the dispensing function head and the AOI detection mechanism by using the first displacement mechanism and the second displacement mechanism, ensures that each chip can obtain consistent and accurate dispensing amount and position, and ensures the accuracy of appearance detection. Compared with the traditional multi-module or equipment combination mode, the present application effectively reduces the space occupied by the equipment through compact design, simplifies the overall structure, makes maintenance more convenient, reduces the operation complexity, the device can flexibly adjust the working parameters of each functional component according to different production process requirements, has strong adaptability and expansibility, and is suitable for chip production requirements of various specifications.

[0007] According to the transmission, dispensing and detection device of the die bonder of some embodiments of the first aspect of the present application, the bottom of the first stand extends to the front end to form an assembly platform, the height of the second stand is less than the height of the first stand, and the transmission mechanism is located at the bottom of the assembly platform.

[0008] According to the transmission, dispensing and detection device of the die bonder of some embodiments of the first aspect of the present application, the transmission mechanism comprises a rack, a linear drive mechanism, a lifting mechanism and a lifting platform, the front end of the rack is provided with a first connecting frame, the front end of the first connecting frame is provided with a second connecting frame, a first avoidance space is arranged between the rack and the first connecting frame, a second avoidance space is arranged between the first connecting frame and the second connecting frame, the linear drive mechanism is arranged at the top of the rack, the output end of the linear drive mechanism is connected with the lifting mechanism, the lifting mechanism is located in the first avoidance space, the output end of the lifting mechanism is connected with the lifting platform, the rear end of the lifting platform is provided with a connecting part, the top of the connecting part is provided with a first avoidance groove, the first connecting frame is located in the first avoidance groove, and the front end of the lifting platform extends into the second avoidance space.

[0009] According to the transmission, dispensing and detection device of the die bonder of some embodiments of the first aspect of the present application, the output end of the lifting mechanism is provided with a third connecting plate, the bottom of the third connecting plate is provided with a fourth connecting plate, the rear end of the lifting platform is provided with a positioning block on both sides, a positioning groove is arranged between the two positioning blocks, and the bottom of the fourth connecting plate is connected with the bottom of the positioning groove.

[0010] According to some embodiments of the first aspect of the present application, a transmission point detection device of a die bonder is provided, wherein the positioning block is provided with a gas connection port, the left and right ends of the connecting part are provided with a first gas flow channel, the rear end of the lifting platform is provided with a second gas flow channel, the middle part of the lifting platform is provided with a receiving space, and the top of the lifting platform is provided with a plurality of receiving grooves, and the gas connection port, the first gas flow channel, the second gas flow channel, the receiving space and the receiving grooves are sequentially communicated, and the receiving grooves are arranged in an array.

[0011] According to some embodiments of the first aspect of the present application, a transmission point detection device of a die bonder is provided, wherein the second gas flow channel is transversely arranged, two first gas flow channels are respectively communicated with the two ends of the second gas flow channel, the top of the first gas flow channel is provided with a long strip-shaped notch, and the receiving space is communicated with the second gas flow channel through the notch.

[0012] According to some embodiments of the first aspect of the present application, a transmission point detection device of a die bonder is provided, wherein the first displacement mechanism comprises an X-axis displacement mechanism, the output end of the X-axis displacement mechanism is provided with a first Y-axis displacement mechanism, the output end of the first Y-axis displacement mechanism is provided with a Z-axis displacement mechanism, and the first connecting plate is arranged at the output end of the Z-axis displacement mechanism.

[0013] According to some embodiments of the first aspect of the present application, a transmission point detection device of a die bonder is provided, wherein the height measuring function head comprises a 2D camera, a height measuring sensor, a light splitting piece and a first light source, the upper end of the first connecting plate is provided with a first connecting block, the 2D camera is arranged on the first connecting block, the lower end of the first connecting plate is provided with a second connecting block, the light splitting piece is arranged on the second connecting block, the first light source is arranged at the bottom of the second connecting block, the height measuring sensor is arranged on the outer side of the second connecting block, and the 2D camera and the height measuring sensor are respectively arranged at the top and the front end of the light splitting piece.

[0014] According to some embodiments of the first aspect of the present application, a transmission point detection device of a die bonder is provided, wherein the second displacement mechanism comprises a second Y-axis displacement mechanism, the second connecting plate is arranged at the output end of the second Y-axis displacement mechanism, the AOI detection assembly comprises a camera, a lens group, a second light source and a ring light source, the first, second, third and fourth fixed plates are sequentially arranged on the second connecting plate from top to bottom, the camera is connected with the first fixed plate, the lens group is connected with the second fixed plate, the second light source is connected with the third fixed plate, and the ring light source is connected with the fourth fixed plate.

[0015] The transmission dispensing detection method of the die bonder according to some embodiments of the second aspect of the present application is applied to the transmission dispensing detection mechanism of the die bonder according to the first aspect of the present application, and comprises the following steps:

[0016] S100, the transmission mechanism drives the plurality of chips to the bottom of the first connecting plate;

[0017] S200, the first displacement mechanism drives the dispensing head on the first connecting plate to move to the top of the chip for dispensing;

[0018] S300, after the dispensing is completed, the height measuring head measures the thickness of the glue of the last dispensing, and adjusts the glue amount of the next dispensing according to the preset glue thickness of the system;

[0019] S400, repeat S200-S300 until all the chips are dispensed;

[0020] S500, the AOI detection mechanism detects the appearance of the chip.

[0021] The beneficial effects of the transmission dispensing detection method of the die bonder according to some embodiments of the second aspect of the present application have been described in the transmission dispensing detection method of the die bonder according to some embodiments of the first aspect of the present application, and will not be repeated here.

[0022] Additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0023] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description, taken in conjunction with the following drawings, in which:

[0024] Figure 1 It is a structural schematic diagram of the embodiment of the present application.

[0025] Figure 2 It is a side view of the embodiment of the present application.

[0026] Figure 3 It is a structural schematic diagram of the transmission mechanism of the embodiment of the present application.

[0027] Figure 4 It is a side view of the transmission mechanism of the embodiment of the present application.

[0028] Figure 5 It is a structural schematic diagram of the lifting mechanism of the embodiment of the present application.

[0029] Figure 6 It is a sectional view of the lifting mechanism of the embodiment of the present application.

[0030] Figure 7 Figure 7 is a schematic diagram of a dispensing height measurement mechanism according to an embodiment of the present application. Figure 6 Figure 8 is a close-up view of section A of Figure 7.

[0031] Figure 8 Figure 9 is a schematic diagram of a dispensing height measurement mechanism according to an embodiment of the present application.

[0032] Figure 9 Figure 10 is a schematic diagram of a dispensing height measurement mechanism according to an embodiment of the present application, with a fixed frame removed.

[0033] Figure 10 Figure 11 is a schematic diagram of an AOI detection mechanism according to an embodiment of the present application. Figure 1

[0034] Figure 11 Figure 12 is a schematic diagram of an AOI detection mechanism according to an embodiment of the present application. Figure 2

[0035] ​​Label: 1, workbench, 2, transmission mechanism, 3, glue dispensing height measuring mechanism, 4, AOI detection mechanism, 5, first stand, 6, second stand, 7, first displacement mechanism, 8, second displacement mechanism, 9, first connecting plate, 10, glue dispensing function head, 11, height measuring function head, 12, second connecting plate, 13, assembly platform, 14, rack, 15, linear drive mechanism, 16, lifting mechanism, 17, lifting platform, 18, first connecting frame, 19, second connecting frame, 20, first avoidance space, 21, second avoidance space, 22, connecting part, 23, first avoidance groove, 24, third connecting plate, 25, fourth connecting plate, 26, positioning block, 27, positioning groove, 28, gas connection port, 29, first gas flow channel, 30, second gas flow channel, 31, long strip-shaped notch, 32, accommodating space, 33, containing groove, 35, support column, 36, first positioning plate, 37, second positioning plate, 38, assembly plate, 39, first step part, 40, second step part, 42, third connecting plate, 43, second avoidance groove, 44, first boss, 45, second boss, 46, third connecting frame, 47, third avoidance groove, 48, X-axis displacement mechanism, 49, first Y-axis displacement mechanism, 50, Z-axis displacement mechanism, 51, 2D camera, 52, height measuring sensor, 53, light splitting sheet, 54, first light source, 55, first connecting block, 56, second connecting block, 57, fifth connecting plate, 58, sixth connecting plate, 59, fixing frame, 60, first drive motor, 61, right-angle commutator, 62, rotating shaft, 64, first lead screw, 65, first lead screw nut, 66, second Y-axis displacement mechanism, 67, camera, 68, lens group, 69, second light source, 70, ring-shaped light source, 71, first fixing plate, 72, second fixing plate, 73, third fixing plate, 74, fourth fixing plate, 75, second drive motor, 76, second lead screw, 77, second lead screw nut, 78, seventh connecting plate, 79, fifth fixing plate, 80, air jet pipe, 81, hose, 82, side plate, 83, slide rail, 85, code reader, 86, coded ruler, 87, photoelectric switch, 88, mounting groove. DETAILED DESCRIPTION

[0036] Embodiments of the present application are described in detail below with reference to examples illustrated in the accompanying drawings, in which the same or similar components or components having the same or similar functions are denoted by the same or similar reference numerals throughout. The embodiments described below by reference to the accompanying drawings are exemplary and are intended only to explain the present application, and cannot be understood as limiting the present application.

[0037] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, left, right, front, back and the like, is based on the orientation or position relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the modules or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0038] In the description of the present application, if the first, second, etc. are described, they are only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.

[0039] In the description of the present application, unless otherwise explicitly limited, the words such as arrangement, installation, connection and the like should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical scheme.

[0040] As shown in Figures 1-11 The first aspect of the present application provides a transmission point detection device of a die bonder.

[0041] A transmission point detection device of a die bonder, comprising a workbench 1, a transmission mechanism 2, a point detection mechanism 3 and an AOI detection mechanism 4, the workbench 1 is provided with a first stand 5 and a second stand 6, the left and right sides of the first stand 5 are respectively provided with a first displacement mechanism 7 and a second displacement mechanism 8, the transmission mechanism 2 is arranged on the second stand 6, the output end of the first displacement mechanism 7 is provided with a first connecting plate 9, the point detection mechanism 3 comprises a point detection head 10 and a height detection head 11, the point detection head 10 and the height detection head 11 are arranged on the first connecting plate 9, the output end of the second displacement mechanism 8 is provided with a second connecting plate 12, the AOI detection mechanism 4 is arranged on the second connecting plate 12, and the first connecting plate 9 and the second connecting plate 12 are respectively located at the head and tail ends of the transmission mechanism 2.

[0042] The application integrates the transmission, dispensing, height measurement and AOI detection functions, reduces the conversion and coordination time between different functional modules, greatly improves the overall operation efficiency of the production line, accurately controls the positions of the dispensing function head 10 and the AOI detection mechanism 4 by using the first displacement mechanism 7 and the second displacement mechanism 8, ensures that each chip can obtain consistent and accurate dispensing amount and position, and ensures the accuracy of appearance detection. Compared with the traditional multi-module or equipment combination mode, the application effectively reduces the space occupied by the equipment through the compact design, simplifies the overall structure, makes the maintenance more convenient, reduces the operation complexity, the device can flexibly adjust the working parameters of each functional component according to different production process requirements, has strong adaptability and expansibility, and is suitable for chip production requirements of various specifications.

[0043] The transmission, dispensing and detection device of the die bonder of the embodiment, the bottom of the first stand 5 extends to the front end to form an assembly platform 13, the height of the second stand 6 is less than the height of the first stand 5, and the transmission mechanism 2 is located at the bottom of the assembly platform 13. Specifically, the assembly platform 13 formed by the bottom of the first stand 5 extending to the front end provides a stable foundation for other components, and the low height design of the second stand 6 optimizes the overall structural layout. The assembly platform can avoid the transmission mechanism 2, and the first stand 5 and the second stand 6 lift the overall structure, which is convenient for the layout of each device and circuit.

[0044] The transmission point detection device of the die bonder comprises a rack 14, a linear drive mechanism 15, a lifting mechanism 16 and a lifting platform 17, the front end of the rack 14 is provided with a first connecting frame 18, the front end of the first connecting frame 18 is provided with a second connecting frame 19, a first space 20 is arranged between the rack 14 and the first connecting frame 18, a second space 21 is arranged between the first connecting frame 18 and the second connecting frame 19, the linear drive mechanism 15 is arranged at the top of the rack 14, the output end of the linear drive mechanism 15 is connected with the lifting mechanism 16, the lifting mechanism 16 is located in the first space 20, the output end of the lifting mechanism 16 is connected with the lifting platform 17, the rear end of the lifting platform 17 is provided with a connecting part 22, the top of the connecting part 22 is provided with a first space recess 23, the first connecting frame 18 is located in the first space recess 23, and the front end of the lifting platform 17 extends into the second space 21. Specifically, by designing the first space 20 and the second space 21, the linear drive mechanism 15 and the lifting mechanism 16 avoid direct contact with the track or other fixed parts during operation, thereby greatly reducing the possibility of metal dust and mechanical vibration caused by friction, helping to prevent the semiconductor product from being contaminated, ensuring that the electrical performance is not affected, protecting the chip from the risk of scattering due to vibration, thereby improving the quality of the final product, reducing the maintenance cost, and at the same time, the first space recess 23 is arranged on the connecting part at the rear end of the lifting platform 17, and the first connecting frame 18 is located in the first space recess 23, so that the overall structure does not occupy the space at the bottom of the rack, and the space is avoided ingeniously, which is beneficial to the arrangement of various components at the bottom of the rack.

[0045] The transmission point detection device of the die bonder comprises a rack 14, a linear drive mechanism 15, a lifting mechanism 16 and a lifting platform 17, the front end of the rack 14 is provided with a first connecting frame 18, the front end of the first connecting frame 18 is provided with a second connecting frame 19, a first space 20 is arranged between the rack 14 and the first connecting frame 18, a second space 21 is arranged between the first connecting frame 18 and the second connecting frame 19, the linear drive mechanism 15 is arranged at the top of the rack 14, the output end of the linear drive mechanism 15 is connected with the lifting mechanism 16, the lifting mechanism 16 is located in the first space 20, the output end of the lifting mechanism 16 is connected with the lifting platform 17, the rear end of the lifting platform 17 is provided with a connecting part 22, the top of the connecting part 22 is provided with a first space recess 23, the first connecting frame 18 is located in the first space recess 23, and the front end of the lifting platform 17 extends into the second space 21. Specifically, by designing the first space 20 and the second space 21, the linear drive mechanism 15 and the lifting mechanism 16 avoid direct contact with the track or other fixed parts during operation, thereby greatly reducing the possibility of metal dust and mechanical vibration caused by friction, helping to prevent the semiconductor product from being contaminated, ensuring that the electrical performance is not affected, protecting the chip from the risk of scattering due to vibration, thereby improving the quality of the final product, reducing the maintenance cost, and at the same time, the first space recess 23 is arranged on the connecting part at the rear end of the lifting platform 17, and the first connecting frame 18 is located in the first space recess 23, so that the overall structure does not occupy the space at the bottom of the rack, and the space is avoided ingeniously, which is beneficial to the arrangement of various components at the bottom of the rack.

[0046] The transmission point detection device of the die bonder of the embodiment is characterized in that the positioning blocks 26 are provided with gas connection ports 28, the left and right ends of the connecting part 22 are provided with first gas flow channels 29, the rear end of the lifting platform 17 is provided with a second gas flow channel 30, the second gas flow channel 30 is transversely arranged, the two first gas flow channels 29 are respectively communicated with the two ends of the second gas flow channel 30, the top of the first gas flow channel 29 is provided with a long strip-shaped notch 31, and the accommodating space 32 is communicated with the second gas flow channel 30 through the notch 31. The middle part of the lifting platform 17 is provided with an accommodating space 32, the top of the lifting platform 17 is provided with a plurality of accommodating grooves 33, the gas connection port 28, the first gas flow channel 29, the second gas flow channel 30, the accommodating space 32 and the accommodating groove 33 are sequentially communicated, and the accommodating grooves 33 are arranged in an array. Specifically, the chip can be adsorbed in the accommodating groove 33 by arranging the gas connection port 28 on the positioning block 26 and arranging the first and second gas flow channels 29, the second gas flow channel 30, the accommodating space 32 and the accommodating groove 33 on the lifting platform 17, so that a complete gas flow path is formed, and the stability of chip transmission is greatly improved.

[0047] The transmission point detection device of the die bonder of the embodiment is characterized in that the positioning blocks 26 are provided with gas connection ports 28, the left and right ends of the connecting part 22 are provided with first gas flow channels 29, the rear end of the lifting platform 17 is provided with a second gas flow channel 30, the second gas flow channel 30 is transversely arranged, the two first gas flow channels 29 are respectively communicated with the two ends of the second gas flow channel 30, the top of the first gas flow channel 29 is provided with a long strip-shaped notch 31, and the accommodating space 32 is communicated with the second gas flow channel 30 through the notch 31. The middle part of the lifting platform 17 is provided with an accommodating space 32, the top of the lifting platform 17 is provided with a plurality of accommodating grooves 33, the gas connection port 28, the first gas flow channel 29, the second gas flow channel 30, the accommodating space 32 and the accommodating groove 33 are sequentially communicated, and the accommodating grooves 33 are arranged in an array. Specifically, the chip can be adsorbed in the accommodating groove 33 by arranging the gas connection port 28 on the positioning block 26 and arranging the first and second gas flow channels 29, the second gas flow channel 30, the accommodating space 32 and the accommodating groove 33 on the lifting platform 17, so that a complete gas flow path is formed, and the stability of chip transmission is greatly improved.

[0048] The transmission point detection device of the die bonder of the embodiment is characterized in that the positioning blocks 26 are provided with gas connection ports 28, the left and right ends of the connecting part 22 are provided with first gas flow channels 29, the rear end of the lifting platform 17 is provided with a second gas flow channel 30, the second gas flow channel 30 is transversely arranged, the two first gas flow channels 29 are respectively communicated with the two ends of the second gas flow channel 30, the top of the first gas flow channel 29 is provided with a long strip-shaped notch 31, and the accommodating space 32 is communicated with the second gas flow channel 30 through the notch 31. The middle part of the lifting platform 17 is provided with an accommodating space 32, the top of the lifting platform 17 is provided with a plurality of accommodating grooves 33, the gas connection port 28, the first gas flow channel 29, the second gas flow channel 30, the accommodating space 32 and the accommodating groove 33 are sequentially communicated, and the accommodating grooves 33 are arranged in an array. Specifically, the chip can be adsorbed in the accommodating groove 33 by arranging the gas connection port 28 on the positioning block 26 and arranging the first and second gas flow channels 29, the second gas flow channel 30, the accommodating space 32 and the accommodating groove 33 on the lifting platform 17, so that a complete gas flow path is formed, and the stability of chip transmission is greatly improved.

[0049] The output end of the linear drive mechanism 15 is provided with a first positioning plate 36, the front end of the first positioning plate 36 is provided with a second positioning plate 37, the second positioning plate 37 extends into the first avoiding space 20, and the bottom of the second positioning plate 37 is provided with an assembly plate 38, and the lifting mechanism 16 is arranged on the assembly plate 38. Specifically, the output end of the linear drive mechanism 15 is provided with the first positioning plate 36 and the second positioning plate 37, so that the lifting mechanism 16 is more stable, and the second positioning plate 37 can extend into the first avoiding space 20, so that the accuracy control during operation is ensured, and the reliability of the whole transmission mechanism is improved.

[0050] The first connecting frame 18 is provided with a first step portion 39 on one side of the top thereof close to the second connecting frame 19, the second connecting frame 19 is provided with a second step portion 40 on one side of the top thereof close to the first connecting frame 18, and the first step portion 39 and the second step portion 40 are correspondingly arranged. Specifically, the first connecting frame 18 is provided with the step portions corresponding to each other between the first connecting frame 18 and the second connecting frame 19, so that the lifting platform 17 can be lifted between the two step portions, and the range of forward and backward movement of the lifting platform 17 is limited.

[0051] The distance between the top of the first avoiding groove 23 and the bottom of the first connecting frame 18 is L1, the height of the first step portion 39 and the height of the second step portion 40 are L2, and L1 is less than L2. Specifically, L1 refers to the distance between the top of the first avoiding groove 23 and the bottom of the first connecting frame 18 when the lifting platform 17 is located at the bottom, that is, the maximum height to which the lifting platform 17 can be lifted is less than the height of the first step portion 39 and the second step portion 40, so that the lifting platform 17 is always located between the first step portion 39 and the second step portion 40.

[0052] The first connecting frame 18 and the second connecting frame 19 are provided with a plurality of third connecting plates 42, the bottom of each third connecting plate 42 is recessed upward to form a second avoiding groove 43, and the second avoiding groove 43 is located at the top of the second avoiding space 21. Specifically, the first connecting frame 18 and the second connecting frame 19 are provided with a plurality of third connecting plates 42, and the bottom is recessed upward to form a second avoiding groove 43, which not only ensures the stability of the connection, but also provides an avoiding space, so that the chip is not in contact with the chip on the lifting platform 17 during transmission.

[0053] The second stand 6 is provided with two second bosses 44 and 45, the front end of the second connecting frame 19 is provided with a third connecting frame 46, the third connecting frame 46 is connected with the top of the first boss 44, the two ends of the rack 14 are connected with the two second bosses 45 respectively, the third avoiding groove 47 is arranged between the first boss 44 and the second boss 45, and the first avoiding space 20 and the second avoiding space 21 are located at the top of the third avoiding groove 47.

[0054] The first displacement mechanism 7 comprises an X-axis displacement mechanism 48, the output end of the X-axis displacement mechanism 48 is provided with a first Y-axis displacement mechanism 49, the output end of the first Y-axis displacement mechanism 49 is provided with a Z-axis displacement mechanism 50, and the first connecting plate 9 is arranged at the output end of the Z-axis displacement mechanism 50.

[0055] The height measuring functional head 11 comprises a 2D camera 51, a height measuring sensor 52, a light splitting piece 53 and a first light source 54, the upper end of the first connecting plate 9 is provided with a first connecting block 55, the 2D camera 51 is arranged on the first connecting block 55, the lower end of the first connecting plate 9 is provided with a second connecting block 56, the light splitting piece 53 is arranged on the second connecting block 56, the first light source 54 is arranged at the bottom of the second connecting block 56, the height measuring sensor 52 is arranged outside the second connecting block 56, and the 2D camera 51 and the height measuring sensor 52 are arranged at the top and the front end of the light splitting piece 53 respectively.

[0056] The transmission point detection device of the die bonder of the embodiment, the output end of the Y-axis displacement mechanism 49 is provided with the fifth connecting plate 57, the rear end of the Z-axis displacement mechanism 50 is provided with the sixth connecting plate 58, the fifth connecting plate 57 is provided with the fixing frame 59, and the fixing frame 59 is connected with the sixth connecting plate 58. Specifically, by arranging the fifth connecting plate 57 at the output end of the Y-axis displacement mechanism 49, arranging the sixth connecting plate 58 at the rear end of the Z-axis displacement mechanism 50, and connecting the fixing frame 59 with the two, the stability of the whole moving system is increased, and the accuracy and repeatability of the position in the dispensing and height measuring process are ensured.

[0057] The transmission point detection device of the die bonder of the embodiment, the Z-axis displacement mechanism 50 includes the first driving motor 60 and the right-angle commutator 61, the first driving motor 60 is arranged on the fifth connecting plate 57, the output end of the first driving motor 60 is provided with the rotating shaft 62, the right-angle commutator 61 is arranged at the rear end of the sixth connecting plate 58, the rotating shaft 62 is connected with the input end of the right-angle commutator 61, the output end of the right-angle commutator 61 is provided with the first lead screw 64, the rear end of the first connecting plate 9 is provided with the first lead screw nut 65, the first lead screw nut 65 is connected with the first lead screw 64, the rotating shaft 62 is arranged along the Y-axis direction, and the first lead screw 64 is arranged along the Z-axis direction. Specifically, the design of the first driving motor 60 in the Z-axis displacement mechanism 50 cooperates with the right-angle commutator 61, realizes efficient vertical motion conversion, improves the positioning speed and accuracy in the Z-axis direction, reduces energy consumption, and prolongs the service life of the equipment. Since the transmission mechanism 2 is located at the bottom of the X, Y and Z-axis displacement mechanisms, and the assembly platform 13 is formed by extending the bottom of the first stand 5 to the front end, the arrangement of the first driving motor 60 on the fifth connecting plate 57 can adjust the center of gravity to a certain extent.

[0058] The first stand 5 is provided with a second Y-axis displacement mechanism 66, the second connecting plate 12 is arranged at the output end of the second Y-axis displacement mechanism 66, the AOI detection assembly 4 comprises a camera 67, a lens group 68, a second light source 69 and a ring light source 70, the first fixed plate 71, the second fixed plate 72, the third fixed plate 73 and the fourth fixed plate 74 are sequentially arranged on the second connecting plate 12 from top to bottom, the camera 67 is connected with the first fixed plate 71, the lens group 68 is connected with the second fixed plate 72, the second light source 69 is connected with the third fixed plate 73, and the ring light source 70 is connected with the fourth fixed plate 74. Specifically, the AOI detection assembly 4 integrates the high-resolution camera 67, the optimally designed lens group 68 and the appropriate second light source 69, can realize high-precision detection, especially the identification ability of fine defects is greatly enhanced, and the high-quality standard of the final product is ensured.

[0059] The second connecting plate 12 is provided with a second driving motor 75 at the top, the output end of the second driving motor 75 is provided with a second lead screw 76, the second lead screw 76 is sleeved with a second lead screw nut 77, the outer periphery of the second lead screw nut 77 is provided with a seventh connecting plate 78, the bottom outer side of the seventh connecting plate 78 is provided with a fifth fixed plate 79, the fifth fixed plate 79 is provided with a jet pipe 80, and the top of the jet pipe 80 is provided with a hose 81. Specifically, the moving mechanism composed of the second driving motor 75, the second lead screw 76 and the second lead screw nut 77 can realize the accurate displacement of the fifth fixed plate 79 and the jet pipe 80 thereon, which is used for removing dust or foreign matters in the detection area, ensures the cleanliness of the detection environment, and further improves the accuracy of the detection result.

[0060] The second connecting plate 12 is provided with a side plate 82, the outer side of the second Y-axis displacement mechanism 66 is provided with a sliding rail 83, the inner side of the side plate 82 is provided with a sliding block (not shown), and the sliding block is in sliding connection with the sliding rail 83. Specifically, the sliding rail 83 provided on the outer side of the second Y-axis displacement mechanism 66 cooperates with the sliding block on the inner side of the side plate 82, provides a stable and accurate moving mode, enhances the stability of the equipment during operation, effectively reduces the influence of mechanical vibration on the detection process, and improves the detection precision.

[0061] The second Y-axis displacement mechanism 66 is provided with a code reader 85 on the outer bottom, the bottom of the side plate 82 is provided with an encoded ruler 86, the code reader 85 is arranged correspondingly with the encoded ruler 86, the outer bottom of the second Y-axis displacement mechanism 66 is provided with two photoelectric switches 87, the bottom of the side plate 82 is provided with a mounting groove 88, and the photoelectric switch 87 is mounted in the mounting groove 88. Specifically, the combination of the code reader 85 arranged on the outer bottom of the second Y-axis displacement mechanism 66 and the encoded ruler 86 can monitor and feed back the position information of the second connecting plate 12 in real time, the photoelectric switch 87 is used for limiting the stroke range, ensuring the safety and accuracy of the operation of the equipment, improving the degree of automation, and enhancing the control accuracy and response speed of the system.

[0062] The second aspect embodiment of the present application provides a kind of transmission dispensing detection method of die bonder, it is applied in the transmission dispensing detection mechanism of the die bonder described in the first aspect embodiment, and the transmission dispensing detection method includes the following steps:

[0063] S100, the conveying mechanism 2 drives a plurality of chips to be transported to the bottom of the first connecting plate 9;

[0064] S200, the first displacement mechanism 7 drives the dispensing function head 10 on the first connecting plate 9 to move to the top of the chip for dispensing;

[0065] S300, after dispensing, the height measuring function head 11 measures the thickness of the last dispensing glue, and adjusts the amount of glue for the next dispensing according to the system preset glue thickness;

[0066] S400, repeat S200-S300 until all chips are dispensed;

[0067] S500, the AOI detection mechanism 4 detects the appearance of the chip.

[0068] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A transfer dispensing detection device of a die bonder, characterized by: The utility model provides a kind of dispensing and measuring height mechanism, including workbench, transmission mechanism, point glue measuring height mechanism and AOI detection mechanism, the workbench is provided with first stand and second stand, the left and right sides of the first stand are respectively provided with first displacement mechanism and second displacement mechanism, the transmission mechanism is arranged on the second stand, the output end of the first displacement mechanism is provided with first connecting plate, the point glue measuring height mechanism includes dispensing function head and height measuring function head, the dispensing function head and the height measuring function head are arranged on the first connecting plate, the output end of the second displacement mechanism is provided with second connecting plate, the AOI detection mechanism is arranged on the second connecting plate, the first connecting plate and the second connecting plate are respectively located at the first and last ends of the transmission mechanism;The transmission mechanism includes rack, linear drive mechanism, lifting mechanism and lifting platform, the front end of the rack is provided with first connecting frame, the front end of the first connecting frame is provided with second connecting frame, first space is provided between the rack and the first connecting frame, second space is provided between the first connecting frame and the second connecting frame, the linear drive mechanism is arranged on the top of the rack, the output end of the linear drive mechanism is connected with the lifting mechanism, the lifting mechanism is located in the first space, the output end of the lifting mechanism is connected with the lifting platform, the rear end of the lifting platform is provided with connecting part, the top of the connecting part is provided with first space recess, the first connecting frame is located in the first space recess, the front end of the lifting platform extends into the second space.

2. The transfer dispensing detection device of a die bonder according to claim 1, wherein: The bottom of the first stand extends to the front end to form an assembly platform, the height of the second stand is less than the height of the first stand, and the transmission mechanism is located at the bottom of the assembly platform.

3. The transfer dispensing detection device of claim 1, wherein: The output end of the lifting mechanism is provided with a third connecting plate, the bottom of the third connecting plate is provided with a fourth connecting plate, the rear end of the lifting platform is provided with a positioning block on both sides, a positioning groove is provided between the two positioning blocks, and the bottom of the fourth connecting plate is connected with the bottom of the positioning groove.

4. The transfer dispensing detection device of claim 3, wherein: Gas connection ports are arranged on the positioning blocks, first gas flow channels are arranged at the left and right ends of the connecting part, a second gas flow channel is arranged at the rear end of the lifting platform, the second gas flow channel, a containing space is arranged at the middle of the lifting platform, a plurality of accommodating grooves are formed in the top of the lifting platform, the gas connection ports, the first gas flow channels, the second gas flow channel, the containing space and the accommodating grooves are sequentially communicated, and the accommodating grooves are arranged in an array.

5. The transfer dispensing detection device of claim 4, wherein: The second gas flow channel is transversely arranged, the two first gas flow channels are respectively communicated with the two ends of the second gas flow channel, the top of the first gas flow channel is provided with a long strip-shaped notch, and the containing space is communicated with the second gas flow channel through the notch.

6. The transfer dispensing detection device of claim 1, wherein: The first displacement mechanism includes an X-axis displacement mechanism, the output end of the X-axis displacement mechanism is provided with a first Y-axis displacement mechanism, the output end of the first Y-axis displacement mechanism is provided with a Z-axis displacement mechanism, and the first connecting plate is arranged at the output end of the Z-axis displacement mechanism.

7. The transfer dispensing detection device of claim 1, wherein: The height measuring functional head comprises a 2D camera, a height measuring sensor, a light splitting sheet and a first light source, the upper end of the first connecting plate is provided with a first connecting block, the 2D camera is arranged on the first connecting block, the lower end of the first connecting plate is provided with a second connecting block, the light splitting sheet is arranged on the second connecting block, the first light source is arranged at the bottom of the second connecting block, the height measuring sensor is arranged outside the second connecting block, and the 2D camera and the height measuring sensor are arranged at the top and the front end of the light splitting sheet respectively.

8. The transfer dispensing detection device of claim 1, wherein: The second displacement mechanism comprises a second Y-axis displacement mechanism, the second connecting plate is arranged at the output end of the second Y-axis displacement mechanism, the AOI detection mechanism comprises a camera, a lens group, a second light source and a ring-shaped light source, the first fixed plate, the second fixed plate, the third fixed plate and the fourth fixed plate are sequentially arranged on the second connecting plate from top to bottom, the camera is connected with the first fixed plate, the lens group is connected with the second fixed plate, the second light source is connected with the third fixed plate, and the ring-shaped light source is connected with the fourth fixed plate.

9. A transfer dispensing detection method for a die bonder, the method comprising: The application is applied to the transmission point detection mechanism of the die bonder in any one of claims 1-8, and the transmission point detection method comprises the following steps: S100, the transmission mechanism drives a plurality of chips to be transported to the bottom of the first connecting plate; S200, the first displacement mechanism drives the dispensing functional head on the first connecting plate to move to the top of the chip for dispensing; S300, after the dispensing is completed, the height measuring functional head measures the thickness of the glue of the last dispensing, and adjusts the glue amount of the next dispensing according to the system preset glue thickness; S400, repeat S200-S300 until all the chips are dispensed; S500, the AOI detection mechanism detects the appearance of the chip.

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