Integrated tool lifter

Abstract

A semiconductor processing tool is provided comprising: an upper support frame; a plurality of semiconductor processing chambers arranged along a first axis; a linear guide system fixedly supported by the upper support frame and extending along a second axis substantially parallel to the first axis; and a carrier. Each processing chamber has a base fixedly mounted relative to the upper support frame and has a removable upper cover including one or more lift features. The carrier includes a lift arm configured to pivot about a vertical axis substantially perpendicular to the second axis, the carrier configured to movably engage with the linear guide system and translate along the second axis relative to the linear guide system. The carrier and the lift arm are both movable such that the lift feature engagement interface of the lift arm can be moved to engage with the lift feature of any one of the removable upper covers.

Description

This application is a divisional application of a patent application for "Integrated Tool Lift" with application number 202080032091.0, filing date February 21, 2020, and applicant Lam Research Corporation. Incorporated by reference

[0001] The PCT application form is filed herewith as part of this application. Each application for which this application claims the benefit of its rights or priority as identified in the PCT application form filed herewith is incorporated herein by reference in its entirety and for all purposes. Background of the Invention

[0002] Many semiconductor processing tools have large and bulky components that are removed during maintenance, servicing, and repair. Summary of the Invention

[0003] The novel devices and systems described herein are configured to move components of semiconductor processing tools for maintenance, servicing, and repair. These tools can have multiple semiconductor processing chambers that are directly or indirectly mounted on a support frame of the tool and arranged side by side in a linear array. Although many components of semiconductor processing chambers are traditionally lifted and moved using conventional lifting equipment such as cranes or forklifts that are separate from the tool and fully supported by the floor, some of the tools described herein have a lifting system integrated into the tool itself to move removable components. In some implementations, the lifting system can include a linear guiding system that is directly or indirectly mounted to the support frame and extends along the linear array of semiconductor processing chambers. A mobile carriage is connected to and supported by the linear guiding system and has a mobile lifting arm that can be connected to, lifted, and moved a component of any of the semiconductor processing chambers; the carriage and its lifting arm can move along the linear guiding system such that the lifting arm can connect to and move a removable component of any of the semiconductor processing chambers. The lifting arm and the removable component have complementary connection features that allow the lifting arm to connect to and lift the removable component. When the carriage lifts the removable component, its weight is fully transferred through the lifting arm, the carriage, and the linear guiding system to the support frame. In some embodiments, the carriage can be suspended from the linear guiding system, such as below the linear guiding system or to the side of the linear guiding system.

[0004] In some implementations, a person can move a carrier along a linear guidance system and can also move a lift arm to a position where it is connected to a removable component. In some such implementations, various aspects of the carrier can be driven by motors, such as a lift mechanism on the carrier for raising and lowering the lift arm. In some other implementations, motors and other moving mechanisms can move the carrier along the linear guidance system and / or move the lift arm horizontally and / or vertically. A controller having a processor and a memory can control the movement of the carrier and the lift arm.

[0005] In some alternative implementations, a tool can have a lift system different from the carrier and the linear guidance system. In these alternative implementations, a detachable lift system is used, which is connected to one or more attachment points, and these attachment points are connected to a support frame. The detachable lift system is positioned on the floor and supported by the floor, and it has a vertical member connected to the attachment points on the support frame to provide lateral support for the vertical member. The detachable lift system also includes a lift arm movably connected to the vertical member, and once the vertical member is connected to the one or more attachment points, the lift arm can be connected to and lift a removable component from one of the semiconductor processing chambers. In some implementations, the detachable lift system is fixed except for its lift arm once it is connected to the one or more attachment points, however, in some other implementations, the detachable lift system and the attachment points to which it is connected can move simultaneously along the array of semiconductor processing chambers.

[0006] In some implementations, a semiconductor processing tool can be provided. The semiconductor processing tool can include: an upper support frame; a first plurality of semiconductor processing chambers arranged along a first axis; a first linear guidance system fixedly supported by the upper support frame and extending along a second axis substantially parallel to the first axis; and a first carrier. Each semiconductor processing chamber can have a base fixedly mounted relative to the upper support frame and can have a removable upper cover including one or more lift features, the first carrier can include a first lift arm having one or more linkages, the first lift arm can be configured to pivot about a vertical axis substantially perpendicular to the second axis, the first carrier can be configured to movably engage with the first linear guidance system and translate along the second axis relative to the first linear guidance system, the first lift arm can include a lift feature engagement interface configured to engage with the lift features of any one of the removable upper covers of the first plurality of semiconductor processing chambers, and the first carrier and the first lift arm can both be movable such that the lift feature engagement interface can be moved to engage with the lift features of any one of the removable upper covers of the first plurality of semiconductor processing chambers.

[0007] In some embodiments, the first carrier may further include a first vertical translation system configured to vertically translate the first lifting arm relative to the first linear guiding system in a direction parallel to the vertical axis.

[0008] In some such embodiments, the semiconductor processing tool may further include a power supply. The first vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input being capable of vertically translating the first lifting arm in a direction parallel to the vertical axis. The first carrier may further include an electrical control cable connected to the power supply, disposed along the first lifting arm, and terminated at a connector. Each removable upper cover may further include an electrical interface configured to be connectable to the connector, and the length of the electrical control cable may be such that the connector and the lifting feature engagement interface of the first lifting arm can engage the electrical interface and the lifting feature of only a single processing chamber in the semiconductor processing chamber at a time.

[0009] In some additional such embodiments, the semiconductor processing tool may further include a controller having one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: receive information regarding the operating state of each semiconductor processing chamber, and cause a first actuation signal provided by the electrical interface of the semiconductor processing chamber to operate the first vertical translation system only when the information regarding the operating state of one of the semiconductor processing chambers in the semiconductor processing chamber indicates that the semiconductor processing chamber is in a condition of personnel safety.

[0010] In some additional such embodiments, the semiconductor processing tool may further include: a first carrier position sensor configured to generate data regarding the position of the first carrier along the first linear guiding system; and a controller including one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: determine the position of the first carrier along the first linear guiding system based on the data generated by the first carrier position sensor, and power only the electrical interface of one of the first plurality of semiconductor processing chambers at a time based on the determination of the position of the first carrier.

[0011] In some additional embodiments, the semiconductor processing tool may further include an arm position sensor configured to generate data regarding the position of the first lift arm relative to the semiconductor processing chamber in the first plurality of semiconductor processing chambers, and the one or more non-transitory memory devices store further instructions for controlling the one or more processors to: determine the position of the lift arm for each semiconductor processing chamber in the first plurality of semiconductor processing chambers based on the data generated by the arm position sensor, and based on the determination of the position of the lift arm and the determination of the position of the first carrier, only supply power to the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that is closest to the lift feature engagement interface of the first lift arm.

[0012] In some additional embodiments, the one or more non-transitory memory devices may store further instructions for controlling the one or more processors to cause the first lift arm to move only on a first side of a vertical plane that passes through the first carrier, is parallel to the vertical axis, and is perpendicular to the second axis.

[0013] In some additional embodiments, the semiconductor processing tool may further include: an engagement sensor configured to generate data regarding whether the lift feature engagement interface of the first lift arm is engaged with the lift feature of one of the removable upper covers, and a controller including one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: determine whether the lift feature engagement interface of the first lift arm is engaged with the lift feature of one of the removable upper covers of the first plurality of semiconductor processing chambers based on the data generated by the engagement sensor, and in response to determining that the lift feature engagement interface is engaged with the lift feature of one of the removable upper covers of the first plurality of semiconductor processing chambers, only supply power to the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that includes that removable upper cover.

[0014] In some additional embodiments, the removable upper cover may receive power from the power supply through the cable.

[0015] In some such embodiments, the first carrier may further include a first interlocking device configured to engage the lifting feature of any of the removable upper covers of the first plurality of semiconductor processing chambers and to prevent the first vertical translation system from vertically translating the first lifting arm when not engaged with the lifting feature of one of the removable upper covers of the first plurality of semiconductor processing chambers.

[0016] In some such embodiments, the first vertical translation system may be selected from the group consisting of a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and a cable winch.

[0017] In some such embodiments, the semiconductor processing tool may further include a controller including one or more processors and one or more non-transitory memory devices. The first linear guidance system may further include a carrier translation system configured to translate the first carrier along the second axis, the first carrier may further include a lifting arm movement system configured to move the first lifting arm in a plane perpendicular to the vertical axis, and the one or more non-transitory memory devices may store instructions for controlling the one or more processors to: move the first carrier along the second axis by the carrier translation system, move the first lifting arm by the lifting arm movement system and the first vertical translation system to engage the lifting feature engagement interface with the lifting feature of one of the removable upper covers of the first plurality of semiconductor processing chambers, vertically translate the removable upper cover by the first vertical translation system when the lifting feature engagement interface is engaged with the lifting feature of one of the removable upper covers, and translate the removable upper cover in a plane perpendicular to the vertical axis by the lifting arm movement system when the lifting feature engagement interface is engaged with the lifting feature of one of the removable upper covers.

[0018] In some such embodiments, the one or more non-transitory memory devices may store further instructions for controlling the one or more processors to: move the lifting arm movement system and the first vertical translation system to move the first lifting arm to disengage the lifting feature engagement interface from the lifting feature of the removable upper cover when the lifting feature engagement interface is engaged with the lifting feature of one of the removable upper covers.

[0019] In some additional such embodiments, the one or more non-transitory memory devices may store further instructions for controlling the one or more processors to: when the lift feature engagement interface engages the lift feature of one of the removable upper covers, cause the carrier translation system and the lift arm movement system to translate the removable upper cover in a plane perpendicular to the vertical axis.

[0020] In some embodiments, each of the semiconductor processing chambers in the first plurality of semiconductor processing chambers may be located within a tool enclosure, and the first lift arm is movable such that any of the removable upper covers of the first plurality of semiconductor processing chambers can be moved outside the tool enclosure.

[0021] In some embodiments, the first linear guiding system may further include a first rail and a second rail that are parallel to each other and offset from each other in a direction parallel to the vertical axis, and the first carrier may be configured to engage both the first rail and the second rail simultaneously and, when engaged with the first rail and the second rail simultaneously, translate along the second axis relative to the first linear guiding system.

[0022] In some such embodiments, the first carrier may further include a first vertical translation system configured to vertically translate the first lift arm relative to the first linear guiding system in a direction parallel to the vertical axis below the first linear guiding system and above the base of the first plurality of semiconductor processing chambers.

[0023] In some embodiments, the first vertical translation system may be further configured to vertically translate the first lift arm above the first linear guiding system.

[0024] In some embodiments, the first linear guiding system may be vertically offset in a direction parallel to the vertical axis above the first plurality of semiconductor processing chambers, and the first carrier may be vertically offset below the first linear guiding system.

[0025] In some embodiments, the lift feature engagement interface may be connected to the distal end of the first lift arm by a joint configured to allow the lift feature engagement interface to rotate about two or more axes perpendicular to the vertical axis.

[0026] In some such embodiments, the joint may be a ball joint.

[0027] In some such embodiments, the joint may be further configured to allow the lift feature engagement interface to rotate about an axis parallel to the vertical axis.

[0028] In some embodiments, the lifting feature of each removable upper cover may include a pair of saddle posts, each saddle post may include a pair of vertical lifting rods and a saddle plate spanning between and covering the vertical lifting rods, each saddle plate may include a first mechanical interface feature, and the saddle posts of each lifting feature may be positioned such that the first mechanical interface features are spaced apart from each other by a first distance. The lifting feature engagement interface may include a beam having two second mechanical interface features spaced apart by the first distance, and each first mechanical interface feature may be complementary to one of the second mechanical interface features.

[0029] In some embodiments, each semiconductor processing chamber of the first plurality of semiconductor processing chambers may include a removable component, which may be a radio frequency (RF) generator, a pump, and a cryopump. Each removable component may include one or more second lifting features, the lifting feature engagement interface of the first lifting arm may be further configured to engage the second lifting features of any of the removable components of the first plurality of semiconductor processing chambers, and the first carrier and the first lifting arm may be movable such that the lifting feature engagement interface can be moved to engage the second lifting features of any of the removable components of the first plurality of semiconductor processing chambers.

[0030] In some embodiments, the first lifting arm may include a linear section that is perpendicular to the vertical axis and includes the lifting feature engagement interface.

[0031] In some embodiments, the first lifting arm may include a pivot section in which the first lifting arm is configured to pivot about the vertical axis, and the first lifting arm may include an inclined section that spans between the pivot section and the linear section and is positioned at an oblique angle relative to the vertical axis.

[0032] In some embodiments, the first plurality of semiconductor processing chambers may include two semiconductor processing chambers.

[0033] In some such embodiments, the plurality of semiconductor processing tools may include three semiconductor processing chambers.

[0034] In some other such embodiments, the first plurality of semiconductor processing chambers may include five semiconductor processing chambers.

[0035] In some embodiments, the semiconductor processing tool may further include: a second plurality of semiconductor processing chambers disposed along a third axis that is substantially parallel to and offset from the first axis; an interior region located between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers; a second linear guide system fixedly supported by the upper support frame and extending along a fourth axis that is substantially parallel to the third axis; and a second carrier. The first linear guide system and the second linear guide system may be positioned outside the interior region. Each semiconductor processing chamber of the second plurality of semiconductor processing chambers may have a second base fixedly mounted relative to the upper support frame and a second removable upper cover that includes one or more second lift features. The second carrier may include a second lift arm having one or more linkages. The second lift arm may be configured to pivot about a second vertical axis that is substantially perpendicular to the fourth axis. The second carrier is configured to movably engage with the second linear guide system and translate along the fourth axis relative to the second linear guide system. The second lift arm may include a second lift feature engagement interface configured to engage the second lift features of any of the second removable upper covers of the semiconductor processing chambers of the second plurality of semiconductor processing chambers. The second carrier and the second lift arm may both be movable such that the second lift feature engagement interface can be moved to engage the lift features of any of the second removable upper covers of the semiconductor processing chambers of the second plurality of semiconductor processing chambers.

[0036] In some such embodiments, the base of the first plurality of semiconductor processing chambers, the second base of the second plurality of semiconductor processing chambers, and the interior region may all be located within a second enclosure. The first lift arm may be movable such that the removable upper cover of any of the first plurality of semiconductor processing chambers can be moved outside the second enclosure, and the second lift arm may be movable such that the second removable upper cover of any of the second plurality of semiconductor processing chambers can be moved outside the second enclosure.

[0037] In some such embodiments, the second removable upper cover and the removable upper cover may be of the same type, the second lift feature engagement interface and the lift feature engagement interface may be of the same type, and the second lift features and the lift features may be of the same type.

[0038] In some embodiments, the semiconductor processing tool may further include a bellows that creates a seal at the interface of the first carrier and the first linear guide system when the first carrier engages the first linear guide system.

[0039] In some embodiments, the semiconductor processing tool may further include a second carrier. The second carrier may include a second lift arm having one or more linkages, and the second lift arm may be configured to pivot about a second vertical axis that is perpendicular to the second axis. The second carrier may be configured to movably engage with the first linear guide system and translate along the second axis relative to the first linear guide system. The second lift arm may include a second lift feature engagement interface configured to engage with the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers. Both the second carrier and the second lift arm may be movable such that the second lift feature engagement interface of the second lift arm can be moved to engage with the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers; and the first linear guide system may be further configured such that the first carrier and the second carrier can be simultaneously engaged with the first linear guide system and moved along the second axis.

[0040] In some embodiments, the removable upper cover may not be a substrate.

[0041] In some embodiments, the first lift arm may not be configured to support a substrate.

[0042] In some embodiments, the lift feature engagement interface may not be configured to support a substrate.

[0043] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include a support frame, a first plurality of semiconductor processing chambers disposed along a first axis, a first attachment point connected to the support frame, and a first removable lift system. Each semiconductor processing chamber may have a base fixedly mounted relative to the support frame and a removable upper cover including one or more lift features. The first removable lift system may include a vertical member having a top end with a complementary attachment point and a bottom end with a moving mechanism. The complementary attachment point may be detachably connected to the first attachment point, and the moving mechanism may be supported by the floor. The first removable lift system may further include a lift arm connected to the vertical member and having one or more linkages. The lift arm may be configured to pivot about a vertical axis that is substantially perpendicular to the first axis. The lift arm may include a lift feature engagement interface configured to engage with the lift feature of any one of the removable upper covers of the first plurality of semiconductor processing chambers.

[0044] In some embodiments, the first detachable lifting system may further include a vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis.

[0045] In some such embodiments, the first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate along the vertical member.

[0046] In some such embodiments, the first vertical translation system may move along the vertical member together with the lifting arm as a unit.

[0047] In some embodiments, the moving mechanism may include collapsible wheels.

[0048] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include a support frame having an upper attachment point and a lower attachment point vertically offset below the upper attachment point; a first plurality of semiconductor processing chambers arranged along a first axis; and a detachable lifting system. Each semiconductor processing chamber may have a base fixedly mounted relative to the support frame and a removable component including one or more lifting features. The detachable lifting system may include a vertical member including a top end having a raised attachment point, a bottom end having a bottom attachment point, and a moving mechanism. The raised attachment point may be detachably connected to the upper attachment point, and the bottom attachment point may be detachably connected to the lower attachment point. The detachable lifting system may further include a lifting arm having one or more linkages and configured to pivot about a vertical axis substantially perpendicular to the first axis, and a vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis. The lifting arm may include a lifting feature engagement interface configured to engage the lifting features of any of the removable components of the first plurality of semiconductor processing chambers.

[0049] In some embodiments, the vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, wherein the first mechanical input causes the lifting arm to translate in a direction parallel to the vertical axis.

[0050] In some such embodiments, the semiconductor processing tool may further include a power supply. The detachable lifting system may further include an electrical control cable connected to the power supply, arranged along the lifting arm, and terminated at a connector. Each removable component may further include an electrical interface configured to connect to the connector, and the length of the electrical control cable may be such that the connector and the lifting feature engagement interface of the lifting arm can only simultaneously engage the electrical interface and the lifting features of a single processing chamber in the semiconductor processing chambers, respectively, at one time.

[0051] In some further such embodiments, the semiconductor processing tool may further include a controller having one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: receive information regarding the operating state of each semiconductor processing chamber, and cause the first actuation signal provided by the electrical interface of the semiconductor processing chamber to operate the vertical translation system only if the information regarding the operating state of one of the semiconductor processing chambers indicates that the semiconductor processing chamber is in a condition of personnel safety.

[0052] In some further such embodiments, the removable component may receive power from a power source via a cable.

[0053] In some such embodiments, the vertical translation system may be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch.

[0054] In some such embodiments, the detachable lift system further includes a first interlock device configured to engage the lifting feature of any removable component of the first plurality of semiconductor processing chambers and prevent the first vertical translation system from vertically translating the first lift arm when not engaged with the lifting feature of one of the removable components of the first plurality of semiconductor processing chambers.

[0055] In some embodiments, the moving mechanism may include four wheels.

[0056] In some embodiments, the moving mechanism may include a collapsible wheel set.

[0057] In some embodiments, the first vertical translation system may be configured to move along a vertical member together with the lift arm as a unit.

[0058] In some such embodiments, the vertical member may further include a slide rail along which the first vertical translation system is configured to move.

[0059] In some embodiments, when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism may not be supported by the floor.

[0060] In some embodiments, when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism may be supported by the floor.

[0061] In some embodiments, the lower attachment point may be vertically offset below the base of the plurality of processing chambers.

[0062] In some embodiments, the support frame may further include a plurality of upper attachment points, the tool may further include a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers may include N processing chambers, the plurality of upper attachment points may include N - 1 upper attachment points, and the plurality of lower attachment points may include N - 1 lower attachment points.

[0063] In some embodiments, the lift arm may further include three or more linkages, a double shoulder joint, and a double elbow joint.

[0064] In some embodiments, the removable component may not be a substrate.

[0065] In some embodiments, the lift arm may not be configured to support a substrate.

[0066] In some such embodiments, the lift feature engagement interface may not be configured to support a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] The various embodiments disclosed herein are illustrated by way of example and not limitation, and in the accompanying drawings, like reference numerals refer to like elements.

[0068] Figure 1 A top view schematic diagram of an exemplary semiconductor processing tool including two sets of a plurality of semiconductor processing chambers is depicted.

[0069] Figure 2 Depicts Figure 1 A perspective view of a first example portion of an exemplary semiconductor processing tool.

[0070] Figure 3 Depicts Figure 2 A detailed perspective view of a portion of an exemplary semiconductor tool.

[0071] Figure 4A Depicts Figure 3 A cross-sectional view of a portion of an exemplary first lift arm, Figure 4B while Figure 3 describes an off-angle view of an exemplary removable upper cover.

[0072] Figure 5 Depicts Figure 3 The same detailed perspective view of this portion of the tool.

[0073] Figures 6A-6E Depicts Figure 2 The movement sequence of an exemplary removable component of a first example portion of an exemplary semiconductor tool.

[0074] Figure 7 depicts an exemplary lifting arm.

[0075] Figure 8 depicts Figure 1 a perspective view of a second alternative example portion of a schematic diagram of a tool.

[0076] Figure 9 depicts Figure 8 an enlarged portion of.

[0077] Figure 10 shows an exemplary tool similar to Figures 6A-6E having two first carriers engaged with a linear guiding system.

[0078] Figure 11 depicts a top view of an exemplary semiconductor processing tool, similar to Figure 1 the schematic diagram of a tool, but with additional details and features shown.

[0079] Figure 12 depicts Figure 6E a top view of a semiconductor processing tool of, but with additional features shown.

[0080] Figure 13 depicts a block diagram of a portion of an exemplary semiconductor processing tool 1200.

[0081] Figure 14 depicts another exemplary semiconductor processing tool.

[0082] Figure 15A and 15B depicts Figure 14 a side view and a first exemplary detachable lifting system of another exemplary semiconductor processing tool of.

[0083] Figure 16 depicts a perspective view of a second exemplary detachable lifting system.

[0084] Figure 17 depicts yet another exemplary semiconductor processing tool.

[0085] Figure 18A and Figure 18B depicts Figure 16 and Figure 17 a side view of the attachment sequence between the tool and a second exemplary detachable lifting system of.

[0086] Figure 19 depicts Figures 17-18B a perspective view of a second exemplary detachable lifting system of a tool connected to.

[0087] Figure 20A and20B Depicts the movement sequence of an example of a removable component performed by a second exemplary detachable lifting system.

[0088] Figure 21 Depicts Figure 16 Another configuration of the second exemplary detachable lifting system of Specific implementation

[0089] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the proposed embodiments. The embodiments of the present disclosure may be practiced without some or all of these specific details. In other instances, well-known processing steps and / or structures are not described in detail so as not to unnecessarily obscure the embodiments of the present disclosure. Although the disclosed embodiments are described in connection with specific embodiments, it should be understood that this is not intended to limit the disclosed embodiments.

[0090] Semiconductor processing tools typically have at least one processing chamber and other components capable of performing the processing, in which one or more substrates are processed. Exemplary substrate processing includes depositing materials on a substrate using chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and atomic layer deposition (ALD), and patterning and etching various materials (including conductors, semiconductors, and dielectric layers) using, for example, atomic layer etching (ALE). In this application, the terms "semiconductor wafer", "wafer", "substrate", "wafer substrate", and "partially fabricated integrated circuit" may be used interchangeably. For example, the operation of depositing a film on a semiconductor substrate can be performed in a substrate processing apparatus, which is a processing chamber having a single substrate holder located in an internal volume maintained at a vacuum by a vacuum pump. The substrate holder (e.g., a pedestal) may have a heating element to heat the pedestal and the substrate. A gas delivery system and a showerhead are also fluidly coupled to the processing chamber to deliver (e.g.) film precursors, carriers, and / or purge and / or process gases, secondary reactants, etc. A device for generating a plasma in the processing chamber may also be included in the apparatus, such as an RF power source and a matching network for powering the plasma. The plasma energy can be controlled by controlling one or more of the processing station pressure, gas concentration, RF source power, RF source frequency, and plasma power pulse timing (e.g., via a system controller having appropriate machine-readable instructions). The RF power source can provide RF power at any suitable frequency and can be configured as independently controllable high-frequency and low-frequency RF power sources and can include frequencies between 50 kHz and 500 kHz and between 1.8 MHz and 2.45 GHz.

[0091] While many substrate processing apparatuses use a single processing chamber, it may be advantageous to increase substrate processing throughput by performing multiple substrate operations in parallel on multiple substrates when dealing with time-consuming film deposition operations. To this end, a multi-station substrate processing apparatus may have a single substrate processing chamber that includes multiple substrate processing stations located within a single interior volume defined by the walls of the processing chamber. Some other multi-station substrate processing apparatuses may have multiple processing chambers, sometimes referred to as "cluster tools". A cluster tool may have processing chambers that include multiple stations, such as two, three, or four stations in each processing chamber. Similarly, a cluster tool may have two, three, four, five, six, seven, eight, nine, ten, eleven, twelve, thirteen, fourteen, fifteen, or sixteen or more processing chambers.

[0092] Various efficiencies can also be achieved by using a tool that includes multiple chambers (i.e., a cluster tool) in terms of equipment cost and operating expenses. For example, a single vacuum pump can be used to create a single high-vacuum environment for two or more processing chambers and can also be used to evacuate used process gases, etc. for the two or more chambers. Depending on the implementation, the processing chambers may share the same gas delivery system, and some components of the plasma generator equipment may be shared among the processing chambers (such as the power supply). In some cluster tools, multiple processing chambers are connected to a wafer transfer system and other components for performing deposition, etching, or other operations, such as a vacuum pump and a gas delivery system. The wafer transfer system may include a robotic arm having one or more end effectors configured to pick up and transfer wafers within the tool, including transferring wafers in and out of the processing chambers and in and out of wafer cassettes (such as a cassette or a front-opening unified pod (FOUP)). A single cluster tool may be able to perform multiple processes simultaneously in multiple chambers while sharing some operating systems such as a gas delivery system or a motor.

[0093] Various efficiencies such as space and throughput can also be obtained by using a cluster tool. Generally, multiple cluster tools are located on the floor of a semiconductor manufacturing plant or a wafer fabrication facility (Fab). However, the relative positioning of the tools on the floor is subject to many limitations, such as electrical clearance areas and service areas between the tools. The service area of a tool may include the areas required for performing operations such as removing tool components (such as pumps, upper covers of processing chambers), performing maintenance on the tool, adding or replacing tool parts, accessing the tool, inspecting the tool, and may be defined at least in part according to ergonomic or other industry standards, such as to meet the requirements of OSHA (Occupational Safety and Health Administration); the electrical clearance area may include the areas required for personal or equipment safety and for preventing electrical interference between one or more components of adjacent tools.

[0094] The multiple chambers of each cluster tool can also be configured to maximize the number of chambers located on the Fab floor, thereby potentially achieving higher substrate processing throughput. For example, cluster tools can be densely packed such that their components are positioned closely to each other, which results in limited space and gaps between components. Cluster tools with densely packed components pose challenges for performing tool maintenance and repairs, such as restricting the ability to access and move tool components required for numerous maintenance and repair operations. For many densely packed tools, the positioning and configuration of tool components prevent traditional lifting mechanisms from accessing and moving components. For example, access can be blocked by components that may be mounted closely side by side, components that are stacked and mounted on top of each other, and support components of the tool such as support frames. The closer the configuration, the more space limitations there are for accessing and moving tool components. In some cases, in order for a traditional lifting mechanism to enter and clear to connect, lift, and move a component of the tool, one or more components of the tool must be moved. For example, it is typically necessary to remove the upper cover of the processing chamber to inspect, repair, clean, repair, and maintain the internal components of the processing chamber. For some densely packed tools, some traditional lifting mechanisms cannot reach the upper cover without removing other components surrounding the upper cover (such as a heavy RF generator mounted above the upper cover). Even if there is some access to the upper cover, the support frame further prevents traditional lifting mechanisms from reaching the upper cover.

[0095] Similarly, there may not be enough space above, below, or inside the tool for traditional lifting mechanisms to access tool components. For example, some traditional lifting mechanisms are supported on the floor by long horizontal support feet that can slide under the semiconductor processing tool (similar to the way a pallet lift can slide under a shipping pallet) and use one or more lifting arms for lifting, but some tightly packed tools may not have enough space to accommodate the support feet or lifting arms of such mechanisms that are necessary for accessing and moving removable components.

[0096] In addition, the footprint of some traditional lifting mechanisms may adversely affect how closely tools can be positioned to each other, i.e., the spacing distance between tools. For example, it may be necessary to space some tools a first minimum distance that provides all sufficient clearance areas so that they can be placed as close as possible and maximize the floor space of the Fab. However, some traditional lifting mechanisms are moved onto the floor and supported by the floor, and they may have a footprint larger than the first minimum distance. In these cases, the tools may have to be spaced a distance greater than the first minimum distance to allow these traditional lifting mechanisms to move and operate, thereby reducing the spacing efficiency of the tools on the Fab floor.

[0097] Even if the components of the tool can be fully accessed and moved, these conventional lifting mechanisms may still require additional time and labor to access and move the components of the tool. In addition, when space for other components must be made to access one component, the movement, disassembly, and reinstallation of these other components may require additional alignment and recalibration of these components. This additional time and labor for routine and necessary maintenance and servicing can result in an undesired downtime of the tool. Accordingly, there is a need for a tool having a lifting mechanism that can easily, quickly, and effectively access tool components without incurring undesired time, labor, and tool downtime.

[0098] Described herein are novel apparatuses and systems for moving components of a semiconductor processing tool or a cluster tool, all of which may be referred to herein as a tool. In some embodiments, features configured to move tool components are integrated into the tool itself. Figure 1 A top-down schematic view of an exemplary semiconductor processing tool is depicted, the exemplary semiconductor processing tool including two sets of multiple semiconductor processing chambers. As Figure 1 seen, tool 100 includes a first plurality of semiconductor processing chambers 102 having five semiconductor processing chambers 104 arranged along a first axis 106, and a second plurality of semiconductor processing chambers 108 including five processing chambers 110 also arranged along an axis 112 that is substantially parallel to the first axis 106. The term "substantially" is used herein because in practice, axes or other components may not be perfectly aligned; in this context substantially means that the axes can be accurately parallel to each other, but may also, for example, deviate from being parallel to each other by within + / - 10 degrees, + / - 5 degrees, or + / - 1 degree. Although each set of multiple semiconductor processing chambers includes five processing chambers, each set of multiple semiconductor processing chambers may, for example, have two, three, four, five, six, or more processing chambers. Tool 100 also includes an upper support frame 114 to which a portion of each semiconductor processing chamber 104 and 110 can be fixedly mounted. When an item is "fixedly mounted" to another item, this means that the item is mounted to the other item in a fixed position relative to the other item, either directly or through one or more intermediate components (such as a support frame). For example, a portion of each semiconductor processing chamber 104 and 110 is fixedly mounted to the upper support frame 114 such that these portions are fixed in their respective positions relative to the upper support frame 114. Other portions of the semiconductor processing chambers 104 may be meant to be removable / movable relative to the upper support frame 114 during normal service operations, which will be discussed further below.

[0099] As described above, the tool 100 has a service area 115 surrounding its footprint, where no parts of other tools are placed; similar service areas may also exist on opposite sides of the tool 100 (although not shown). The service area 115 can also be regarded as a separation distance between other tools, enabling personnel and equipment to move between these tools. Some tool embodiments described herein hardly increase the static footprint of the processing tools.

[0100] The tool 100 may also include a linear guiding system and a carrier configured to facilitate and enable the removal and movement of removable components of a semiconductor processing chamber. As discussed in more detail below, in some implementations, the linear guiding system can be fixedly connected to a support frame, and the carrier is movably connected to the linear guiding system and configured to movably connect to the removable components of the semiconductor processing chamber, such that the carrier translates along the linear guiding system to approach, connect to, and move the removable components of the semiconductor processing chamber.

[0101] Figure 2 is depicted Figure 1 A perspective view of a first exemplary portion of an exemplary semiconductor processing tool is shown. Here, although a first plurality of semiconductor processing chambers 102 are labeled, for illustrative purposes, only the base 116 of each of the five semiconductor processing chambers 104 and the removable upper cover 118 of the semiconductor processing chamber 104A shown in a removed state are shown (the remaining upper covers of the other semiconductor processing chambers 104 are not shown). Each base 116 of the semiconductor processing chamber 104 can be fixedly mounted directly or indirectly to the upper support frame 114, although the interface between each base 116 and the upper support frame 114 is not visible. The base 116 can be fixedly mounted to the upper support frame 114 by any known means such as bolts, welding, clamps, or pins.

[0102] Figure 2 Also depicted are a first linear guiding system 120 and a first carrier 122, Figure 3 which will be further depicted and discussed below. For illustrative purposes, the first carrier 122 is surrounded by a dashed line. The first linear guiding system 120 can be fixedly supported by or mounted to the upper support frame 114; this can include directly or indirectly fixing the first linear guiding system 120 to the upper support frame 114 or connecting it to the upper support frame 114 such that the first linear guiding system 120 is fixed in a position relative to the upper support frame 114. The arrangement of the first linear guiding system 120 can also be such that it extends along a second axis 124 that is substantially parallel to the first axis 106 (substantially means that these axes can be exactly parallel to each other or deviate from being parallel to each other by, for example, within + / - 10 degrees, + / - 5 degrees, or + / - 1 degree).

[0103] The first carrier 122 is configured to movably engage with a first linear guiding system 120 such that the first carrier 122 can be translated along a second axis 124. This configuration may include the first linear guiding system 120 that supports the first carrier 122 and has features enabling the first carrier 122 to move within and along the first linear guiding system 120. For example, the first carrier 122 may have wheels or bearings that can be received by one or more tracks or grooves of the first linear guiding system 120, thereby enabling the first linear guiding system 120 to support the first carrier 122 and enabling the first carrier 122 to move along the first linear guiding system 120 and the second axis 124, for example, in a rolling or sliding manner. In some embodiments, the movable engagement between the first carrier 122 and the first linear guiding system 120 may be passive, allowing a person to manually move the first carrier 122 along the first linear guiding system 120. In other embodiments described below, this movable engagement may be powered by a carrier translation system to propel the first carrier 122 along the first linear guiding system 120.

[0104] Figure 3 Depicted is Figure 2 A detailed perspective view of a portion of an exemplary semiconductor tool. A partial cross-sectional view of the first linear guiding system 120, the first carrier 122, and the removable upper cover 118 can be seen here. The first linear guiding system 120 can be seen extending along the second axis 124 and including two tracks 126A and 126B with which the wheels or bearings of the first carrier 122 movably engage, such that the first linear guiding system 120 supports the first carrier 122 and the first carrier 122 can move along the second axis 124, as indicated by the double-headed arrow 128.

[0105] Additional features of the first carrier 122 will now be discussed. In some implementations, the first carrier may include a first lifting arm having one or more linkages and being usable to pivot about a vertical axis. In Figure 3In [the context], the first carrier 122 includes a first lifting arm 130 having a single link 132. The first lifting arm 130 is configured to pivot, for example, about a vertical axis 134 as shown by arrow 136 relative to the first linear guiding system 120 or the upper support frame 114; the vertical axis 134 is substantially perpendicular to the second axis 124 (where substantially perpendicular means that these axes are actually perpendicular or orthogonal to each other within a degree difference of, for example, at least + / -10 degrees, + / -5 degrees, or + / -1 degree). The ability of the first lifting arm 130 to pivot enables it to be at least partially capable of moving to multiple positions in order to engage components of the semiconductor processing chamber, thereby allowing these components to be moved. The first lifting arm 130 is also connected to the first carrier 122 such that the first lifting arm 130 moves together with the first carrier 122.

[0106] The first lifting arm and the removable component are configured to be connected to each other such that the removable component can be lifted, lowered, and moved by the first carrier while being supported by the first carrier. In some implementations, this configuration includes a first lifting arm having a lifting feature engagement interface that is configured to engage a lifting feature of the removable component; the engagement between the lifting feature engagement interface and the lifting feature creates a connection between the first lifting arm and the removable component and enables the removable component to be lifted, lowered, and supported by the first lifting arm and the first carrier.

[0107] Some examples of suitable lifting feature engagement interfaces and lifting features and their physical connection to each other (i.e., engagement with each other) can be conventional elevators and connecting components, such as hooks or lifting holes, shackles, threaded connections between components, pins and holes, rotary latches, and cables, belts, or chains. For example, the lifting feature of the removable component can be a hook connected to the removable component, and the lifting feature engagement interface can be a cable connected to the first lifting arm, and their engagement can be the cable and the hook connected together (e.g., by bolts or screws). This connects the first lifting arm to the removable component, thereby enabling the first lifting arm to raise, lower, and move the removable component.

[0108] In some embodiments, the lifting feature engagement interface can have a first structure connected to an end of the first lifting arm and a second structure of the removable component for engaging the lifting feature. For example, as Figure 3As shown, the first lifting arm 130 includes a lifting feature engagement interface, which is the first structure 138 (i.e., beam 138) connected to the end 140 of the first lifting arm 130; the lifting features of the removable component or the removable top, the removable upper cover 118 (which may also be considered a removable top plate or a removable top in some embodiments) are the second structures 142A and 142B. The first structure 138 can be engaged with the second structures 142A and 142B in various ways, such as by connecting them together with pins, screws, clamps or bolts.

[0109] In some implementations, the lifting feature engagement interface can have mechanical features for engaging with complementary mechanical features of the lifting features. For example, Figure 4A depicts Figure 3 a cross-section of a portion of an example of the first lifting arm, Figure 4B while Figure 3 describes Figure 4A a perspective view of an example of the removable upper cover. In Figure 4B , the beam (i.e., the first structure 138 of the lifting feature engagement interface) includes two first mechanical interface features, depicted as holes 144A and 144B, separated by a first distance 146. These first mechanical interface features are complementary to the second mechanical interface features of the lifting features of the removable upper cover 118. In Figure 4B , the lifting features of the removable upper cover 118 (i.e., the second structures 142A and 142B, which can be referred to as saddle columns here) are enclosed within the dashed lines. Each second structure includes a pair of vertical lifting rods 148A and 148B and saddle plates 150A and 150B spanning between and covering each pair of vertical lifting rods 148A and 148B. Each saddle plate 150A and 150B also contains second mechanical interface features 151A and 151B (depicted as pins), and these second mechanical interface features 151A and 151B are separated by the first distance 146. Based on the configuration of these features, the second mechanical interface features 151A and 151B can be inserted into the first mechanical features of the lifting feature engagement interface, i.e., the holes 144A and 144B of the beam 138, and this can be regarded as the engagement between the lifting feature engagement interface and the removable component. Alternatively, the pins can be located on the lifting beam, and the holes can be located on the saddle plates.

[0110] In some embodiments, the first structure 138 of the lifting feature engagement interface can include a beam and a column perpendicular to the beam, similar to one of the vertical lifting rods 148A, which can be connected to the removable component using hooks, clamps, bolts, etc. In some such implementations, the lifting features can be holes, threaded holes or other connection features that can be connected to the lifting feature engagement interface.

[0111] The first carrier and the first lift arm are also movable such that the lift feature engagement interface can be moved and engaged with the lift features of any removable component. Returning to Figure 2 , this mobility includes the mobility of the first carrier 122 along the second axis 124 such that it can be positioned close to or adjacent to any one of the semiconductor processing chambers 104, and returning to Figure 3 , it includes the ability of the first lift arm 130 to rotate about the vertical axis 134. Rotation of the first lift arm 130 about the vertical axis 134 causes the first lift arm 130 to move in a plane perpendicular to the vertical axis 134, as discussed in more detail below.

[0112] The mobility of the first lift arm 130 may also include the mobility of the lift feature engagement interface. The lift feature engagement interface can rotate about one or more axes. Returning to Figure 4A , the lift feature engagement interface 152 is enclosed by a dashed shape and is connected at the joint 158 to a single link 132 of the first lift arm. The vertical axis 134, an axis 160 parallel to the vertical axis, and two other axes 154 and 156 perpendicular to the axis 160 are all shown in Figure 4A and 5 . The joint 158 at the connection of the lift feature engagement interface 152 to the link 132 of the first lift arm 130 can be configured to allow the lift feature engagement interface 152 to rotate about the one or more axes relative to the first link 132, which in this particular example includes the vertical axis 134 and the two other axes 154 and 156. For example, the lift feature engagement interface 152 can rotate about the axis 156 at the joint 158 relative to the link 132, but can also rotate about the axis 160 parallel to the vertical axis 134 relative to the link 132. In some cases, the joint at the connection of the lift feature engagement interface 152 to the link 132 of the first lift arm 130 can be a ball joint. The ball joint can allow for partial swing about an axis parallel to the vertical axis, which can assist in planar alignment. The ball joint may be advantageous because it can align the process chamber lid and the process chamber if they are misaligned. In certain cases, some of the movement axes can be lockable, for example using a spring plunger, pin, screw, or clamp to prevent movement about the locked axis.

[0113] In some embodiments, the first carrier can include a vertical translation system that is configured to vertically translate the lift arm relative to the first linear guide system or the upper support frame. This vertical movement of the lift arm can also cause the first carrier to engage and lift and lower a removable component of the semiconductor processing chamber. In Figure 5 , it is shown that Figure 3A perspective view of the same details of the tool portion, with the vertical translation system 162 covered by a dashed shape. The vertical translation system 162 is configured to vertically translate the first lifting arm 130 along a second vertical axis parallel to the vertical axis 134, with this translation shown using the double arrow 164. Returning to Figure 4A and 4B , the vertical translation system 162 can position the lift feature engagement interface 152 below the second mechanical interface features 151A and 151B (i.e., pins), and then move vertically upward such that the second mechanical interface features 151A and 151B are inserted into the first mechanical interface features (i.e., holes 144A and 144B) respectively, thereby engaging the lift feature engagement interface 152 with the lift features of the removable upper cover 118. Once these are engaged together, the vertical translation system 162 can be used to raise and lower the removable upper cover without the risk of disengaging the lift feature engagement interface 152.

[0114] The vertical translation system 162 can utilize a number of mechanisms to vertically translate the first lifting arm 130. For example, the vertical translation system 162 can be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch. The vertical translation system 162 can also include a motor 166, which is configured to provide a mechanical input to the vertical translation system 162. For example, the motor 166 can provide a mechanical driving force to any actuator such as a linear ball screw actuator.

[0115] In some embodiments, the tool can include one or more bellows to seal some parts of the linear guiding system and the first carrier, preventing contamination by particles and other substances generated by these movable features; these contaminants can be harmful to the substrate and other parts of the tool. The interface between the linear guiding system and the first carrier can be one of these movable components that can generate contaminants, and it may be advantageous to include a bellows around the interface between the linear guiding system and the first carrier to create a seal at this interface. The vertical translation system may also have a bellows because this system may generate contaminants.

[0116] The first carrier, the first lifting arm, or both can also be movable such that the removable component engaged with the first lifting arm can be moved. As described above, once the lift feature engagement interface of the first lifting arm is engaged with the lift features of the removable component, the first carrier can be used to vertically translate the removable component in a direction parallel to the vertical axis 134, as Figure 5 shown. Additionally, the first carrier is configured such that the removable component engaged with the first lifting arm can be moved horizontally or in one or more directions within a plane perpendicular to the vertical axis 134. Figures 6A-6E Depicts Figure 2The movement sequence of an example of a removable component of a first example portion of an exemplary semiconductor tool. For illustrative purposes, these figures are Figure 2 a simplified top view of a tool without an upper support frame; these figures are viewed at an angle parallel to the Figure 3 vertical axis of Figure 5 such that the vertical axis is perpendicular to and extends into the page. Here, the first linear guide system 120 includes two rails 126A and 126B and extends along a second axis 124. The first carrier 122 is movably engaged with the first linear guide system 120 so that the first carrier 122 can be translated along the second axis 124. Also visible in the figure are the first plurality of semiconductor processing chambers 102, as well as the bases 116 of these semiconductor processing chambers, the first lift arm 130, the link 132, and the lift feature engagement interface 152 that engages with lift features (i.e., the second structures 142A and 142B of the removable upper cover 118).

[0117] As Figures 6A-6E shown, the first lift arm 130, the link 132, the lift feature engagement interface 152, the first carrier 122, and the removable upper cover 118 are all movable within a plane perpendicular to the vertical axis. Figure 6A can be regarded as the starting position after the lift features of the removable upper cover 118 engage with the lift feature engagement interface 152 of the first lift arm 130. In Figure 6B , the first carrier 122 has been translated along the second axis 124 in the direction of arrow 128, and the removable upper cover 118 has been moved in a horizontal direction 168 perpendicular to the second axis 124. This movement of the removable upper cover 118 can be regarded as a movement within a plane perpendicular to the vertical axis. This movement of the upper cover 118 can also be achieved by the rotation of the lift feature engagement interface 152 relative to the link 132 (as shown by arrow 169) and by the linear translation of the carrier 122 along the second axis 124, by the rotation of the first lift arm 130 about the vertical axis (extending into the page and marked by "X" 134), as shown by arrow 136. The additional movement of the removable upper cover 118 in the horizontal direction 168, as well as the corresponding movement and rotation of the first lift arm 130, the lift feature engagement interface 152, the link 132, and the first carrier 122 are further visible in Figures 6C-6E .

[0118] The removable component can be different from Figures 6A-6EMove in the manner described. For example, the carrier 122 can be held in a fixed position on the second axis 124, while one or more of the first lifting arm 130, the lifting feature engagement interface 152, the link 132, and the removable upper cover 118 can rotate about an axis parallel to the vertical axis 134. In some examples, only the first lifting arm 130 can rotate about an axis parallel to the vertical axis 134 (as shown by arrow 136), while other aspects of the first carrier remain fixed. The mobility of the removable component engaged with the first carrier is not limited to linear movement in the horizontal direction 168 or along the second axis 124. In some embodiments, the removable component can be moved such that the movement has vector components within the horizontal direction 168 and the second axis 124, and has rotational components about an axis parallel to the vertical axis (as shown by arrow 136) and about an axis perpendicular to the first axis within the horizontal plane (including but not limited to the aforementioned horizontal direction 168 and the second axis 124).

[0119] The mobility of the first carrier, the first lifting arm, or both also enables the removable component engaged with the first lifting arm to be moved outside the tool housing. In some embodiments, for example, referring to Figure 6E , the bases of the first plurality of semiconductor processing chambers can be located within the housing 170, and the aforementioned movement of the first carrier 122 can move the removable upper cover 118 outside the housing 170. In some cases, the removable upper cover 118 can be moved outside the housing 170 but into the service area around the tool 100, as Figure 1 shown. The housing 170 can be considered to contain all the bases of the semiconductor processing chambers of the tool.

[0120] In some embodiments, the first lifting arm can have a linear section as Figure 3 shown. This linear section can be the same as the link 132 that extends between the pivot section 133 and the end 140 of the first lifting arm 130 (i.e., the lifting feature engagement interface connection), and the pivot section 133 is the part where the first lifting arm 130 pivots or rotates about the vertical axis 134 (as shown by arrow 136). In some such embodiments, the first lifting arm can have a linear section and an inclined section. Figure 7 An exemplary lifting arm is depicted. Here, the exemplary lifting arm includes a linear section 732, which has an end 740 connected to the lifting feature engagement interface 752, and it also includes an inclined section 772 that bridges between the pivot section 733 and the linear section 732. The inclined section 772 is oriented at an oblique angle 774 relative to the vertical axis 134, and this oblique angle can be an acute angle (as Figure 7(depicted) or obtuse. The angle ranges between about 15 and 75 degrees, between about 30 and 60 degrees, including about 45 degrees. The angled lift arm can be advantageous because it can achieve different vertical strokes compared to a lift arm having only a linear section. In some embodiments, the lift arm can include two or more linkages and a plurality of joints, such as an elbow joint and a double elbow joint.

[0121] The positioning and arrangement of the first linear guiding system and the first carrier can be different, thereby affecting the mobility of the first carrier and the first lift arm. In some embodiments, the first linear guiding system can be positioned above the first plurality of semiconductor processing chambers. For example, referring back Figure 2 , it can be seen that the first linear guiding system 120 is directly above or vertically offset above the first plurality of semiconductor processing chambers 102, and the first plurality of semiconductor processing chambers 102 are in a direction parallel to the vertical axis 134. In some implementations, the first carrier 122 can be vertically offset below the first linear guiding system 120 in a direction parallel to the vertical axis 134, as Figure 2 shown. In some embodiments, when viewed in a direction parallel to the second axis 124, the first carrier 122 can be regarded as being vertically inserted between the first linear guiding system 120 and a part (such as the base 116) of the first plurality of semiconductor processing chambers 102.

[0122] The first lift arm 130 can engage with various removable components of the semiconductor processing chamber 104 in the first plurality of semiconductor processing chambers 102, and these various removable components can be connected to or surround the base 116. These removable components can include, for example, a removable upper cover 118, a radio frequency (RF) generator, a pump, or a cryopump. It may be desirable to remove these components from the semiconductor processing chamber for maintenance or repair of the removable components or another part of the semiconductor processing chamber. Each of these removable components can include some of the lifting features discussed above so that the lifting feature engagement interface engages with these removable components, enabling the removable components to be lifted, lowered, and removed. For example, any removable component has the Figure 4B lifting features described above, or they can have conventional lifting features, such as hooks, eyebolts, etc. Regardless of the type of lifting features arranged on the removable components, the first carrier and the first lift arm are movable so that the lifting feature engagement interface can be moved to engage with these lifting features of the removable components.

[0123] In some other embodiments, the configuration and positioning of the linear guiding system and the first carrier are such that the first carrier can approach other parts of the tool. For cases with different component configurations, different configurations of the linear guiding system and the carrier are advantageous. For example,Figure 2 The first example portion of the tool has components arranged in a specific manner that may be sufficient for the positioning of the above linear guide system and the first carrier. In other cases, the tool has a configuration of removable components such that the above linear guide system and the first carrier cannot reach these components. In these cases, the configuration may be different from the above.

[0124] Figure 8 depicts Figure 1 A perspective view of a second alternative example portion of the schematic diagram of the tool. The component arrangement of tool 800 is similar to but different from that of tool 100 described above. Herein, Figure 8 in, Figure 2 , a first plurality of semiconductor processing chambers 802 includes three semiconductor processing chambers arranged along a first axis 806 in this example, and each semiconductor processing chamber includes a base 816 fixedly mounted on an upper support frame 814. As Figure 8 further shown, tool 800 includes components 874 above the first plurality of semiconductor processing chambers 802, some of which can be removed. The positioning and arrangement of these components 874 may be advantageous in using a linear guide system, a first carrier, or both different from those described above, for example. Figure 2

[0125] Tool 800 includes a second linear guide system 876, which is arranged along a second axis 824 substantially parallel to the first axis 806, as described above, and which includes a first track 878A and a second track 878B. As described above, these two tracks are parallel to each other and vertically offset from each other along a vertical axis 834 perpendicular to the second axis 824. The second linear guide system 876 is also directly or indirectly fixedly supported by the upper support frame 814; Figure 8 shows that the second linear guide system 876 is directly and fixedly mounted to the upper support frame 814. A second carrier 880 is also depicted in a dashed shape and will be seen in more detail in Figure 9 Figure 8 the enlarged portion. In Figure 9 , the second carrier 880 is movably engaged with the second linear guide system 876 such that it is movably engaged with both the first track 878A and the second track 878B simultaneously, thereby enabling the second carrier to translate along the second axis 824 in the direction of arrow 828, as described above. It should be understood that the reference to the "second" linear guide system and carrier is not intended to imply that there must be a corresponding "first" instance in every semiconductor tool of the same type. The ordinal numbers are used only to distinguish this linear guide system and carrier from the examples discussed above.

[0126] The second carrier 880 also includes a first lifting arm 830, which (including its components, its ability to rotate about an axis parallel to the vertical axis 834, and its including a lifting feature engagement interface for engaging with the lifting features of the removable component) can be the same as that described above for the first lifting arm 130. In some cases, the link 832 can be longer or shorter than Figure 2 to reach other components of the tool 800. Also as described above, the second carrier 880 can include a first vertical translation system 862 for translating the first lifting arm 830 in a direction parallel to the vertical axis 834, as indicated by the arrow 864. The first vertical translation system 862 includes a motor 866, which can use pulleys and cables or a screw actuator to drive the vertical translation as described above.

[0127] In some embodiments, the configuration of the second linear guiding system and the second carrier enables the second lifting arm to translate below, in the middle of, and above the second linear guiding system. For example, in Figure 8 the first lifting arm 830 is capable of translating below the second linear guiding system 876 and between the first track 878A and the second track 878B; in some implementations, the vertical translation system can even extend above the second track 878B, thereby allowing the second lifting arm to translate to a position above the second track 878B. This vertical translation range enables the lifting feature engagement interface of the first lifting arm 830 to approach and move removable components below the second linear guiding system 876, such as the removable upper cover 818 and the removable component 882A, as well as removable components located between both the first track 878A and the second track 878B (or above the second track 878B), such as the removable component 882B. In some embodiments, the configuration of the first carrier enables the first lifting arm 830 to approach and move removable components above the bottom of the second linear guiding system 876.

[0128] Some embodiments of the tool can have two or more carriers simultaneously movably engaged to the same linear guiding system. For example, Figure 2 and 3 the first linear guiding system 120 in can have two first carriers 122 simultaneously and movably engaged thereto. In some implementations, these two first carriers 122 can be copies of each other. For example, Figure 10 depicts as Figures 6A-6EThe tool shown has two first carriers that engage a linear guidance system. Here, a first carrier 122A and a first carrier 122B (which can be considered a second carrier) are simultaneously movably engaged with a first linear guidance system 120 such that they can both be translated along a second axis 124. In these embodiments, the first carrier 122A and the first carrier 122B are duplicates and are configured to be the same as the first carrier 122 described above. This allows the removable components of multiple semiconductor processing chambers 104 to be accessed and moved, thereby increasing the efficiency of repair and maintenance and reducing time.

[0129] Returning to Figure 1 , the tool 100 can have two sets of multiple semiconductor processing chambers, namely a first multiple semiconductor processing chambers 102 and a second multiple semiconductor processing chambers 108. The second multiple semiconductor processing chambers 108 can be arranged along a third axis considered to be the same as axis 112, and the axis 112 is offset but substantially parallel to the first axis 106. In Figure 1 , the second multiple semiconductor processing chambers 108 are offset from the first multiple semiconductor processing chambers 102 in another direction perpendicular to the first axis such that the tool has an internal region 184 (shown in dashed lines and having translucent hatching) between the multiple semiconductor processing chambers. The internal region can include a portion of the upper support frame 114 and components for semiconductor processing, such as gas boxes, manifolds, gas sources, electronics, conduits, etc. The internal region 184 can also include one or more substrate handling robots for transferring one or more substrates into and out of the processing chambers or other parts of the tool. As discussed herein, these substrate handling robots are different from the disclosed carriers. For example, substrate handling robots are typically located in the internal region because this allows such robots to effectively transfer wafers between different processing chambers while still keeping the wafers in a controlled environment, such as within a vacuum transfer module.

[0130] The tool 100 having multiple sets of multiple semiconductor processing chambers can have a linear guidance system and carriers in each set of multiple semiconductor processing chambers. Figure 11 Depicted is a top view of an exemplary semiconductor processing tool similar to the schematic diagram of the tool in Figure 1 , but showing additional details and features. The first multiple semiconductor processing chambers 102 can be similar to those described in Figures 2-7 . These semiconductor processing chambers can be arranged along the second axis 124, and their bases 116 can be fixedly mounted to the upper support frame 114. As described above in Figures 2-7 , the positioning and configuration of the first linear guidance system 120 and the first carrier 122 are such that removable components, such as a removable upper cover 118, of only the first multiple semiconductor processing chambers 102 can be accessed and moved.

[0131] In addition, the second plurality of semiconductor processing chambers 108 may be arranged along a third axis. The second linear guiding system 1120 may be positioned along a fourth axis 1185 that is substantially parallel to the third axis 112 (see Figure 1 ). The second carrier 1122 may be movably engaged with the second linear guiding system 1120 and is configured to approach and move only the removable components of the second plurality of semiconductor processing chambers 108. The second carrier 1122 may be configured to engage with the lifting features of the removable components (such as the removable upper cover 1118) of the second plurality of semiconductor processing chambers 108, as described above for the first carrier 122. In some embodiments, the second linear guiding system 1120 may be the same as the first linear guiding system 120, the second carrier 1122 may be the same as the first carrier 122, and the removable components of the first and second pluralities of semiconductor processing chambers may all have the same or similar design. In some other embodiments, the first linear guiding system 120 may be different from the second linear guiding system 1120, and the first carrier 122 may be different from the second carrier 1122, but each of the first carrier and the second carrier may still be used to engage with the lifting features of the removable components of their respective semiconductor processing chambers.

[0132] In some embodiments, the first plurality of semiconductor processing chambers 102, the second plurality of semiconductor processing chambers 108, and the internal area may all be located within the housing 170. In some instances, at least a portion of the first carrier and / or the linear guiding system is positioned outside the housing 170. The first carrier 122 and the second carrier 1122, including their respective first and second lifting arms, are all movable so that the removable components in each semiconductor processing chamber can be moved outside the housing. Figure 11 Figures Figure 11 and show the removable upper covers 118 and 1118 being moved and positioned outside the housing 170.

[0133] The lifting aspects such as the linear guiding system and the first carrier described herein may include varying degrees of powered and non-powered features. For example, in some implementations of the tool, the movement of the first carrier 122 along the second axis 124 and the horizontal and rotational movement of the first lifting arm may be non-powered, such that manual, non-motor, electric, or mechanical power can be used to move the first carrier 122 and horizontally move and rotationally move the first lifting arm. In some examples, mechanical power such as a motor or a hydraulic device may vertically move the first carrier 122 and one or more portions of the first lifting arm 130, such as a motor causing the first lifting arm 130 to move vertically. In some other implementations, the movement of the first carrier along the linear guiding system and the horizontal movement and rotational movement of the first lifting arm may be powered movements, such as movements using a motor, a pump, hydraulics, or the like.

[0134] Some embodiments of the tools described herein may also include a controller that controls different aspects of the tools. In some implementations, the controller can be part of one or more processing chambers, one or more platforms for processing, and / or specific processing components (wafer pedestal, gas flow system, etc.). These tools can be integrated with electronics for controlling their operations before, during, and after the processing of semiconductor wafers or substrates. The electronics can be referred to as a "controller" that can control various components or sub-components of the tool. Depending on the processing requirements and / or tool type, the controller can be programmed to control any of the processes disclosed herein, including, for example, controlling the power supplied to the lift system disclosed herein and monitoring the operating status of the semiconductor processing chamber for maintaining safe conditions. The controller can also control other aspects of the tool operation, including controlling the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out of the tool and other transfer tools and / or load locks connected or interfaced with a specific system.

[0135] Broadly speaking, the controller can be defined as electronics having various integrated circuits, logic, memory (including non-transitory media), and / or software for receiving instructions, issuing instructions, controlling operations, enabling cleaning operations, enabling endpoint measurements, etc. The integrated circuits can include chips in the form of firmware storing program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing specific processes on or for semiconductor wafers or systems. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or die of a wafer.

[0136] In some implementations, the controller can be part of or coupled to a computer that is integrated with, coupled to, otherwise networked to, or a combination thereof with the tool. For example, the controller can be in the "cloud" or be all or part of a fab host system, which can allow for remote access to wafer processing. The computer can implement remote access to the system to monitor the current progress of a manufacturing operation, review the history of past manufacturing operations, review trends or performance criteria for multiple manufacturing operations, change the parameters of the current process, set up process steps to follow the current process, or initiate a new process. In some examples, a remote computer (e.g., a server) can provide a process recipe to the system via a network, which can include a local network or the Internet. The remote computer can include a user interface that enables the input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify the parameters for each process step to be performed during one or more operations. It should be understood that the parameters can be specific to the type of process to be performed and the type of tool, and the controller is configured to interface with or control the tool. Thus, as described above, the controller can be distributed, for example, by including one or more discrete controllers networked together and working towards a common purpose (e.g., the processing and control described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remote (e.g., at the platform level or as part of a remote computer), which are combined to control the processing on the chamber.

[0137] Exemplary tools can include, but are not limited to, a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, or an orbit chamber or module. The tool can have multiple processing chambers or modules.

[0138] As described above, depending on the one or more process steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in the material transport that shuttles wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

[0139] In some embodiments, the various lift aspects of the tool can be powered, and the controller can be configured to control a drive system that controls the movement of the carrier relative to a linear guide system and / or the movement of an arm linkage relative to the carrier.Figure 12 depicts Figure 6E a top view of an exemplary semiconductor processing tool, but shows additional features. For example, tool 1200 has a first linear guide system 120 that includes a carriage translation system 1288 for translating a first carriage 122 along a first axis 124. The carriage translation system 1288 can include a moving mechanism (such as a motor) to push the first carriage 122 along the first linear guide system 120. For example, the first carriage 122 can have one or more motors to drive one or more wheels and move the first carriage 122 along the first linear guide system 120. In another case, as Figure 6A shown, the first linear guide system 120 can have a linear ball screw actuator with a set motor 191 for rotating a linear ball screw 189 connected to the first carriage 122, such that when the linear ball screw 189 is actuated by the motor 191, the first carriage 122 moves along the first linear guide system 120.

[0140] In some implementations, tool 1200 can have a first carriage (represented by box 1290) that further includes a lift arm movement system configured to move a first lift arm 130 in a plane perpendicular to the above-described vertical axis. This configuration can include the ability to rotationally drive one or more pivot points of the first lift arm about a direction parallel to the vertical axis. For example, the first carriage 122 can include a motor connected to a first link 132 at a pivot section 133 that can cause the first link 132 to rotate about the vertical axis in the direction of arrow 136. The first carriage 122 can also include another motor directly or indirectly connected to a lift feature engagement interface 152 that can cause the lift feature engagement interface 152 to rotate about an axis 160, as Figure 4A and Figures 6C-6E shown by 169 above. This other motor (a pneumatic or hydraulic system) can be located on the first lift arm or can also be located within the first carriage 122 and is connected to the lift feature engagement interface 152 by a pulley, belt, drive chain, gear, link, or the like. In some implementations, the lift arm movement system can also be capable of causing the lift feature engagement interface 152 to rotate about one or more axes perpendicular to the vertical axis, such as about an axis parallel to the first axis as described above. Tool 1200 also includes the above-described vertical translation system 162 configured to translate the first lift arm 130 along the vertical axis 134.

[0141] The tool 1200 also includes a controller 1292, such as those similar to the controllers used above for controlling the carrier translation system and the lift arm movement mechanism. The controller 1292 can include one or more non-transitory memory devices 1294 and one or more processors 1296. The processor 1296 can include one or more CPUs, multiple ASICs, one or more general-purpose computers and / or special-purpose computers (s), one or more analog and / or digital input / output connectors (s), one or more stepper motor controller panels, etc.

[0142] The controller 1292 is communicatively coupled to the carrier translation system 1288, the lift arm movement system 1290, and the vertical translation system 162. Figure 13 A block diagram showing a portion of an exemplary semiconductor processing tool 1200 is shown, and as can be seen, the controller 1292 is communicatively coupled to each semiconductor processing chamber 104 in the first plurality of semiconductor processing chambers 102, the carrier translation system 1288, the lift arm movement system 1290, and the vertical translation system 162. The controller 1292 stores instructions in its non-transitory memory 1294 for controlling one or more processors 1296 to cause movement of the first carrier 122, including causing movement of the first lift arm 130. This includes causing the carrier translation system 1288 to move the first carrier 122 along the second axis 124, causing the vertical translation system 162 to move the first lift arm 130 (including the first link 132 and the lift feature engagement interface 152) in the vertical direction, as described above, and causing the lift arm movement system 1290 to move the first lift arm 130 in a plane perpendicular to the vertical axis 134, as described above.

[0143] In some implementations, the controller 1292 also stores instructions in its non-transitory memory 1294 for controlling one or more processors 1296 to cause the lift feature engagement interface 152 to engage the lift features of the removable component of the semiconductor processing chamber 104. These instructions can cause various actions of the first carrier 122, such as linear translation along the second axis 124, vertical movement of the first lift arm 130, and horizontal movement of the first lift arm 130 (i.e., movement in a plane perpendicular to the vertical axis. For example, referring back to Figure 4A and 4B, the instruction can cause the vertical translation system 162 to move the first lifting arm 130 in a direction parallel to the vertical axis 134, so that the lifting feature engagement interface 152 (including holes 144A and 144B) is located below the second mechanical interface features 151A and 151B of the lifting feature, that is, the second structures 142A and 142B. The instruction can also cause the first lifting arm 130 (which may include the lifting feature engagement interface 152) to move rotationally, linearly, or both in a plane perpendicular to the vertical axis 134, so that the second mechanical interface features 151A and 151B are respectively aligned with the holes 144A and 144B. Once these features are aligned (which can be determined, for example, based on the outputs of various sensors used to detect such alignment), the instruction can, or allow the user to manually input, cause the vertical translation system 162 to move the first lifting arm 130 upward in a direction parallel to the vertical axis 134, so that the second mechanical interface features 151A and 151B are respectively inserted into the holes 144A and 144B. In some embodiments, the saddle plates 150A and 150B contact the lifting feature engagement interface 152.

[0144] Once the lifting feature of the removable component and the lifting feature engagement interface of the first lifting arm are engaged with each other, the instruction can control one or more processors to raise and / or lower the removable component in a direction parallel to the vertical axis; similarly, the instruction can move the first lifting arm by causing the lifting arm movement system, the carrier translation system, or both in the above manner, so that the removable component moves in a plane perpendicular to the vertical axis. For example, the controller 1292 may include instructions that cause the movement sequence described Figures 6A-6E to occur.

[0145] In some implementations, the instruction can cause only the lifting arm movement system to move the first lifting arm, while the first carrier remains stationary. In some embodiments, the instruction can cause both the lifting arm movement system and the carrier translation system to move the first lifting arm, as described above Figures 6A-6E For example, the rotation of one or more lifting arm linkages combined with the simultaneous translation of the carrier causes the removable component to travel along a generally linear axis perpendicular to the translation axis of the carrier. In other cases, the instruction can cause only the carrier translation system to move the first lifting arm, while the lifting arm movement system does not move the first lifting arm. In an illustrative example, referring to Figure 12 , the lifting feature engagement interface 152 engages with the lifting feature of the removable upper cover 1218, and the carrier translation system 1288 can translate the first carrier 122 along the second axis 124 and thus translate the removable upper cover 1218 along the second axis 124. During the movement, the lifting arm movement mechanism 1290 and the first vertical translation system 162 may not move the first lifting arm 130.

[0146] The instruction can also disengage the lifting feature of the removable component and the engagement interface of the first lifting arm, for example, after the removable component has returned to its original position and been reinstalled. In Figure 4A and 4B , this can include lowering the first lifting arm 130 such that the second mechanical interface features 151A and 151B are removed from the holes 144A and 144B.

[0147] In some embodiments, the tool may further include a first carrier position sensor configured to generate data regarding the position of the first carrier along the first linear guiding system. Referring back to Figure 13 , it can be seen that the first carrier position sensor 1298 is positioned on the first carrier 122 and is communicatively connected to the controller 1292, either wired or wirelessly, such that the controller 1292 can receive the data generated by the first carrier position sensor 1298. The controller 1292 can also interpret and determine the position of the first carrier along the first linear guiding system 120, including data regarding which semiconductor processing chambers 104 in the semiconductor processing chamber 104 are closest to the first carrier 122 and which are closest to or adjacent to the first carrier 122. For example, in Figure 13 , the first carrier position sensor 1298 can generate data indicating that the first carrier 122 is closest to the semiconductor processing chamber 104A and adjacent to the semiconductor processing chamber 104B. The carrier position can enable determination of which semiconductor processing chamber the lifting arm can enter. For example, in Figure 6A , the carrier position sensor 1298 can indicate that, when the first carrier 122 is located close to the two semiconductor processing chambers 104A and 104B, the first lifting arm may be able to access the removable components of both processing chambers.

[0148] In some implementations, the tool may further include a first arm position sensor configured to generate data regarding the position of the first lifting arm relative to the semiconductor processing chamber. In Figure 13In this case, the first arm position sensor 12100 is positioned on the first lift arm 130 and is communicatively coupled to the controller 1292 via a wired or wireless connector such that the controller 1292 can receive data generated by the first arm position sensor 12100. The controller 1292 can also interpret and determine the position of the first lift arm 130 relative to each semiconductor processing chamber 104 from the carrier position data and / or the arm position data, including, in the case of the position of the first carrier 122, which lift features can be engaged by the first lift arm 130, which semiconductor processing chamber 104 is closest to or adjacent to the first lift arm 130, the position of the pivot section (i.e., shoulder) of the first lift arm 130 relative to each semiconductor processing chamber 104, the position of the first lift arm 130 relative to the lift features of each removable component on each semiconductor processing chamber 104, and the position of the first lift arm 130 along the vertical axis (e.g., to determine the vertical position of the first lift arm and the lift feature engagement interface relative to the lift features of the removable component). The data can also include distances of aspects of the first lift arm 130 from various features of the tool (e.g., achievable by using proximity sensors). In some embodiments, the tool can also include an arm position sensor configured to generate data regarding the position of the lift arm rotating about the vertical axis. The controller can, for example, determine from this data whether the arm is properly positioned such that known obstacles are avoided during vertical translation or lift features are engaged. The controller can also include instructions to prevent the vertical translation system from vertically translating or not translating the arm above or below a certain height.

[0149] For example, the first arm position sensor 12100 can generate data indicating the position of the first lift arm, including the horizontal and vertical positions of its lift feature engagement interface relative to the lift features of the semiconductor processing chamber; this position data can be used to determine which lift features can be engaged by the first lift arm 130. In Figure 6A this case, for example, the first arm position sensor 12100 can generate data that the controller can use to determine that the lift feature engagement interface can engage the lift features of the semiconductor processing chamber 104A. As described above, the controller can determine the position of the first arm 130 along the vertical axis and further determine this position relative to the lift features of the removable component. In some embodiments, the tool can have two or more arm position sensors, all of which generate data regarding the position of the first lift arm relative to the processing chamber.

[0150] In some embodiments, the tool can also include an engagement sensor configured to generate data regarding whether the lift feature engagement interface is engaged with the lift features of any semiconductor processing chamber. In Figure 13In this case, the engagement sensor 12102 is positioned on the first lifting arm 130 and communicatively connected to the controller 1292 via a wired or wireless connector so that the controller 1292 can receive data generated by the engagement sensor 12102. The controller 1292 can also interpret and determine, based on this data, whether the lifting feature engagement interface engages any lifting features. For example, the engagement sensor 12102 can be a conductive surface configured to be electrically connected to another conductive surface on the lifting feature such that when the lifting feature engagement interface engages the lifting feature, electrical continuity is created between these conductive surfaces. Return reference Figure 4A and 4B , for example, the first conductive surface can be positioned on the top surface of the first structure 138, and when the lifting feature engagement interface 152 engages the lifting features 142A and 142B, the top surface of the first structure 138 can contact the second conductive surface located on the lower side of the saddle plate 150A or 150B. The controller 1292 can detect whether there is electrical continuity between these two surfaces and determine the engagement between the lifting feature engagement interface and the lifting feature. The engagement sensor can be other types of sensors, such as proximity sensors, contact switches, vision sensors, etc. In some implementations, when the lifting feature engagement interface does not engage any lifting features, the controller 1292 can include instructions to prevent the vertical translation system from vertically translating the first arm or translating above a certain level (thus allowing sufficient vertical translation to enable the lifting feature engagement interface to engage the lifting features).

[0151] In some embodiments, the tool can also include an alignment sensor configured to generate data regarding whether the lifting feature engagement interface is aligned with the lifting features of any semiconductor processing chamber. In certain cases, this data can be used to determine whether the vertical movement of the first lifting arm 130 will cause engagement between the lifting features and the lifting feature engagement interface. The alignment sensor can be located on the first lifting arm 130, on a removable component, or both, and communicatively connected to the controller 1292 via a wired or wireless connector so that the controller 1292 can receive data generated by the alignment sensor. The controller 1292 can thus interpret and determine, based on the data, whether the lifting feature engagement interface is properly aligned with the lifting features of any removable component such that the vertical movement of the first lifting arm engages these objects. For example, referring back Figure 4A and 4B, an alignment sensor can generate data such that the controller 1292 can determine whether the holes 144A and 144B are located below and aligned with the second mechanical interface features 151A and 151B so that upward movement of the first lift arm 130 will cause the second mechanical interface features 151A and 151B to be inserted into the holes 144A and 144B. Such an alignment sensor can be, for example, a vision, magnetic, or proximity sensor.

[0152] The controller can utilize the data from any of the above sensors to perform the above-described movement of the first carrier and the removable component. For example, referring to Figure 13 , the controller 1292 can first determine the positioning and engagement of the first carrier 122; as Figure 13 shown, these determinations are: the position of the first carrier 122 is closest to the semiconductor processing chamber 104B, the position of the first lift arm 130 is closest to the semiconductor processing chamber 104C, and the lift feature engagement interface is not engaged with any lift feature. If it is desired to move the removable component of the semiconductor processing chamber 104A, the controller 1292 can use these determinations and data to move the first carrier 122 and / or the first lift arm 130 so that the first lift arm 130 can engage with the lift feature of the semiconductor processing chamber 104A. This movement can include instructing the carrier translation system 1288 to move the first carrier 122 to a position closer to the semiconductor processing chamber 104A and rotating the first lift arm 130 (e.g., clockwise by approximately 180 degrees) so that it is closer to the semiconductor processing chamber 104A than Figure 13 shown.

[0153] In some embodiments, the tool can have a number of safety features. For example, the controller can be configured to receive information about the operating state of each semiconductor processing chamber. The operating state can be whether the semiconductor processing chamber is actively processing a substrate and whether the semiconductor processing chamber is in a personnel-safe state for people to enter the chamber, e.g., the chamber is not powered on, the pressure is at ambient pressure, and volatile chemicals have been removed from the chamber. If the information received by the controller is or determines that one of the semiconductor processing chambers is in a personnel-safe state, the controller can allow the carrier translation system, the lift arm movement system, and / or the vertical translation system to operate and move the removable component of that semiconductor processing chamber. Similarly, if the information received by the controller is or determines that one of the semiconductor processing chambers is not in a personnel-safe state, the controller may prevent the carrier translation system, the lift arm movement system, and / or the vertical translation system from operating in a manner that would cause the removable component of that semiconductor processing chamber to move (although it can allow the movable components of other chambers on the tool that are in a safe state to move for such activities).

[0154] In some embodiments, each semiconductor processing chamber may have an electrical interface, such as a power outlet, configured to connect to a cable of the first carrier; such an electrical interface may be located on its removable portion. The cable may be electrically connected to a power source on the first carrier or another power source on the tool (such as the system power distribution box (SPDB) of the tool). Power may be transmitted from the SPDB along the linear guide system to the first carrier and then terminated at the lifting mechanism, or may be transmitted along the first lifting arm through the cable. The cable may be terminated at a connector configured to connect to the electrical interface of any removable component and may be configured to supply power to such a component when powered and the connector is connected. Supplying power to the removable component may allow maintenance tasks to be performed on the removed removable component (such as driving a motor located on the removable upper cover during calibration) and keep the equipment on the removable upper cover powered and warm (such as a pressure gauge) to speed up the maintenance recovery time.

[0155] In some embodiments, the electrical interface may be used as part of a safety interlock device. For example, the controller may include instructions for determining the electrical continuity between the cable and the electrical interface. If electrical continuity is determined to exist, the controller may allow the vertical translation or other moving mechanism on the first carrier to operate. Additionally, the controller can determine whether the chamber is in the atmosphere, and if the chamber is in the atmosphere, the controller allows the movement of the removable component (such as the top plate). In some embodiments, an atmosphere signal is generated by the chamber and relayed through the electrical interface and the cable, and this signal can be detected by the controller. The atmosphere signal may indicate whether the chamber is or is not in the atmosphere.

[0156] In some embodiments, the cable may be arranged along the first lifting arm, and its length is such that the connector engages the lifting feature engagement interface of the first lifting arm and can only engage the electrical interface and the lifting feature of a single processing chamber in the semiconductor processing chamber simultaneously at one time. For example, referring back to Figure 5 , the first carrier 122 includes a cable 1104 arranged along the first lifting arm 130, and its length is such that the connector 1106 can engage the electrical interface 1108 of the removable upper cover 118. And the length of the cable 1104 simultaneously allows the connector 1106 to engage the electrical interface 1108 of the semiconductor processing chamber and allows the lifting feature engagement interface to engage the lifting feature of the removable upper cover 118, as Figure 4A and 4B described, but during the engagement of the first lifting arm with the lifting feature of the depicted removable upper cover 118, it prevents the connector 1106 from connecting to a similar electrical interface of any other removable upper cover. For example, referring to Figure 12When the lift feature engagement interface engages with the lift feature of the removable upper cover 118 of the semiconductor processing chamber 104A, the length of the cable 1104 prevents the connector 1106 from simultaneously connecting to the electrical interface 1108 of the removable upper cover 118 of the semiconductor processing chamber 104B.

[0157] In some other embodiments, the electrical interface can supply power to components on the carrier. The electrical interface can be located at a fixed position in each semiconductor processing chamber or can be located on a removable component. The cable can be connected to one or more motors of the first carrier, such as the motors of the vertical translation system and the lift arm movement system (if present), and terminated at a connector that is configured to connect to the electrical interface of any removable component and, if powered on and the connector is connected, is configured to supply power to these components.

[0158] In some implementations, the controller can also include instructions for powering the electrical interface of the semiconductor processing chamber based on data from one or more of the above sensors. For example, in some implementations, the controller can, based on the determination of the position of the first carrier, cause the electrical interface of only one of the first plurality of semiconductor processing chambers to be powered at a time and only when it is determined that the operating state of the semiconductor processing chamber is in a condition where it is safe to remove the upper cover. If multiple carriers / lift arms are included in a single set of multiple semiconductor processing chambers, this function can be extended to allow power to be supplied to the electrical interface of a particular semiconductor processing chamber only when one of the carriers / lift arms is determined to be in a position suitable for removing the removable component from the semiconductor processing chamber and only when the semiconductor processing chamber is determined to be in an operationally safe state. Refer to Figure 13 , for example, the controller 1292 receives data regarding the position of the first carrier 122 from the first carrier position sensor 1298, determines the position of the first carrier based on this data, and then powers only the electrical interface of the semiconductor processing chamber 104B (after determining that the processing chamber is in a "safe" state) because the lift feature of the first arm 130 can only reach the removable component of the semiconductor processing chamber 104A. As described above, such a "safe" state can be when a person can safely approach the chamber, such as when the chamber is not powered, the chamber pressure is at ambient pressure, at a low enough temperature for a worker to handle the removable component, and any volatile or harmful chemicals have been removed from the chamber and the removable component has been unlatched or unbolted from the chamber.

[0159] Similarly, based on the determination of the positions of the first lift arm 130 and the first carrier 122, the controller 1292 may include instructions for controlling the processor 1296 to power the electrical interface 1108 of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that only have lift features that can engage the lift feature engagement interface 152 of the first lift arm 130. Again, for example, in Figure 13 these determinations may indicate that the lift features of the removable component of the semiconductor processing chamber 104A can engage the lift feature engagement interface of the first lift arm 130, and the controller 1292 may accordingly power the electrical interface 1108 of the semiconductor processing chamber 104C.

[0160] Additionally or alternatively, the controller may, in response to the determination that the lift feature engagement interface engages the lift features of one of the removable upper covers of the first plurality of semiconductor processing chambers, power only the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that includes the removable upper cover, as described above. In Figure 13 for example, based on the data generated by the engagement sensor 12104, the first arm position sensor 12100, and the carrier position sensor 1298, it may be determined that the lift feature engagement interface of the first lift arm 130 engages the lift features of the removable component of the semiconductor processing chamber 104C, and based on this determination, the controller 1292 may power only the electrical interface of the semiconductor processing chamber 104C.

[0161] In some embodiments, the engagement sensor may be regarded as a first interlock sensor configured to generate data regarding whether the lift features engage the lift feature engagement interface. The instructions may cause the controller to control the processor to determine whether the lift feature engagement interface engages the lift features of one of the removable components of the first plurality of semiconductor processing chambers based on the data generated by the first interlock sensor. The instructions may also, in response to receiving a first input signal to cause the vertical translation system to operate and determining that the lift feature engagement interface engages the lift features of one of the removable upper covers, cause the vertical translation system to vertically translate the first lift arm. The instructions may further prevent the vertical translation system from vertically translating the first lift arm in response to receiving a first input signal to cause the vertical translation system to operate and determining that the lift feature engagement interface does not engage the lift features of one of the removable upper covers.

[0162] In some embodiments, another safety feature may be included that limits the movement of the first lift arm to within a sector less than 360 degrees, such as within a sector of substantially 180 degrees or 270 degrees (substantially means within + / - 10 degrees). This limitation may be provided by using one or more physical hard stops (such as one or more pins) to prevent the first lift arm from rotating to a position outside the sector, or alternatively, this limitation may be provided by instructions (if present) within the controller to prevent the motor from causing the first arm to rotate to a position outside the sector. In some cases, the first lift arm, which is restricted to move only on the first side of the vertical plane passing through the first carrier, is parallel to the vertical axis and perpendicular to the second axis. For example, referring to Figure 6B , it is shown that the vertical plane 1110 is substantially perpendicular to the second axis 124 (such as within + / - 5 degrees of orthogonality), substantially parallel to the vertical axis 134 (such as within + / - 5 degrees of parallelism) and passes through the first carrier 122. Here, the first lift arm 130 can only rotate to a position on the left side of the vertical plane 1110. As described above, the instructions may control one or more processors to cause the first lift arm 130 to move only on the first side or the left side of the vertical plane 1110. Alternatively, such a rotational limitation feature may be operable to limit the movement of the lift arm to only positions on the right side.

[0163] To avoid any potential confusion, it should be noted that the carriers and lift arms discussed herein are not equivalent to the robotic arms or end effectors intended or used for transporting substrates. Additionally, the removable components of the semiconductor processing chamber described herein should not be considered substrates, and the lift arms described herein are not configured or intended to support substrates.

[0164] In some embodiments, instead of a carrier and lift arm system that is intended to be permanently mounted to a semiconductor processing tool and supported entirely by a linear guide system to which it is attached, a lift system that is removable from the semiconductor processing tool may be used. In such an alternative system, the lift arm may be attached to a removable vertical member equipped with a vertical translation system (it should be understood that the reference to "vertical" in this embodiment refers to the orientation of the components when the lift system is mounted on the semiconductor processing tool; obviously, if such a lift system is removed from the semiconductor processing tool, rotated 90° and laid flat on the floor, then the parts previously described as "vertical" are technically horizontal, and vice versa, for the purposes of this disclosure, such components may still potentially be described as "vertical"). The removable vertical member may include one or more mechanical interfaces that allow the removable vertical member to be connected to corresponding attachment points located at various locations on the semiconductor processing tool (e.g., an upper support frame of the tool or other lower portion of a similar lower frame). The bottom of the vertical member may be equipped with rollers or wheels to allow it to be rotated and positioned in the semiconductor processing equipment so that it is positioned to allow it to interface with different semiconductor processing tools. The vertical member itself may have one or more arm links that are supported by a vertical translation system mounted on the vertical member. Once the vertical member is attached to the upper support frame of the semiconductor processing tool, the vertical translation system can be used to drive the one or more arm links vertically up and down.

[0165] Such a lifting system may be designed such that it is not freestanding and / or is not capable of supporting removable components without some form of support attached to the tool (e.g., via attachment points on an upper support frame). Thus, for example, in some embodiments, the lifting system may lack support feet (as previously discussed in the present disclosure) extending to a position approximately below the lifting arm, which would act to prevent the lifting system from tipping over due to its weight (and what it is lifting). In another example, the lifting system may have a lightweight support system that supports only the weight of the lifting system itself and not the weight of the removable components. Existing freestanding lifting systems include feet or equivalent structures that extend to a position approximately below the lifting arm. In contrast, the removable lifting systems discussed herein are not capable of supporting the weight of the lifting arm and / or removable components without some form of external support.

[0166] When such a lift system is attached to a semiconductor processing tool via one or more attachment points, the attachment points may be primarily used to withstand lateral loads, while axial (vertical) loads may alternatively be transferred along the length of the removable vertical member and exit through the bottom of the removable vertical member into the facility floor (e.g., in some cases, through wheels located at the base of the removable vertical member). Thus, any torque resulting from a vertical load applied away from the centerline of the removable vertical member may be offset by the resistance applied by the attachment points. In some cases, the attachment points may withstand lateral loads as well as some or all of the vertical loads. Here, the tool may include upper and lower attachment points, thereby being able to support the lateral and some or all of the vertical loads of the lift system. The above torque may be offset by these multiple attachment points at the end of the vertical member of the lift system. The vertical load may also be transferred to the vertical member, the upper attachment point, and the upper support frame, as well as the lower attachment point, and ultimately be directed to the ground, which is different from passing through the wheels of the lift system. This may make the vertical member and its moving mechanism lighter in weight and have less load-bearing structure.

[0167] Since such lift systems do not need to be self-supporting, they can have a very small footprint and be lighter in weight compared to freestanding lift systems. This can make it easier for personnel to operate and allow use in more confined spaces.

[0168] Accordingly, the present disclosure includes additional alternative embodiments of another exemplary semiconductor processing tool that does not have the above-described linear guidance system and carrier, but instead has a removable lift system. In these alternative lift system embodiments, the tool still includes an upper support frame, a plurality of semiconductor processing chambers arranged along a first axis, and a base fixedly attached to the upper support frame. In some such implementations, the semiconductor chambers may be arranged in a non-linear axis manner, such as in a circular arrangement.

[0169] In some of these alternative embodiments, the removable lift system is supported by the Fab floor, is connectable to the support frame at elevated attachment points, and has a lift arm. The removable lift system is portable such that it can be moved to a position next to the tool within the service area on the Fab floor and then secured to the upper support frame at the attachment points of the upper support frame. Once in place and connected to the upper support frame, the lift arm and the vertical translation system can be used to raise, lower, and move one or more removable components of the semiconductor processing tool. As discussed in more detail below, the lift arm and the vertical translation system may be the same as or similar to the above-described lift arm and vertical translation system.

[0170] Figure 14 Another exemplary semiconductor processing tool is depicted; the figure is similar to Figure 2, but there are distinct differences. In these embodiments, as described above, another tool example 1400 includes an upper support frame 1414, a first plurality of semiconductor processing chambers 1402 arranged along a first axis 1406, a base 1416 fixedly connected to the upper support frame 1414, and a removable component (such as a removable upper cover 1418) having a lifting feature (such as the second structure 1442 described above).

[0171] Compared to tool 100, another tool 1400 includes an attachment system, which may include one or more attachment points 14112 fixedly supported by the upper support frame 1414. In some embodiments, two or more attachment points 14112 are connected to fixed positions of the upper support frame 1414 relative to the upper support frame 1414 and along a second axis 1424. In some other embodiments, the attachment system may include a guide to which one or more attachment points are movably connected. For example, in Figure 14 the guide 14114 highlighted in shadow extends along the second axis 1424, similar to the first linear guide system described above, and one or more attachment points 14112 are movably connected to the guide 14114 such that one or more attachment points 14112 can be translated along the second axis 1424 as shown by the arrow 1428. In some such implementations, the attachment points can be locked or loosened so that when locked, the attachment points are fixed relative to the guide, or when loosened, they can slide along the track, which can allow repositioning of the attachment points to accommodate new tool configurations or modifications to maintenance procedures. As discussed below, one or more attachment points 14112 of the attachment system serve as positions (i.e., elevated connection points) where a removable lifting system can be attached and connected to the upper support frame 1414.

[0172] Figure 15A and 15B depicts Figure 14 a side view of another exemplary semiconductor processing tool and a first exemplary removable lifting system. In Figure 15AIn [the figure], it can be seen that the base 1416 is attached to the upper support frame 1414 and has a removable component 1418. It can also be seen that the attachment point 14112 is connected to the upper support frame 1414; this can be a movable or fixed attachment point as discussed above. It can also be seen that there is a first exemplary detachable lifting system 14116, and it includes a vertical member 14118 which has a top end 14120 to which a complementary attachment point 14122 is attached and a bottom end 14124 to which a moving mechanism 14126 (such as wheels or tracks) is attached. The moving mechanism 14126 can be positioned on and supported by the Fab floor 14128, and allows the first exemplary detachable lifting system 14116 to move in various directions around the Fab floor. The complementary attachment point 14122 is configured to connect or attach to the attachment point 14112 of the attachment system, as Figure 15B shown; when they are connected as shown by the identification symbol 14127, the first exemplary detachable lifting system 14116 is attached to the upper support frame 1414. This attachment provides lateral support for the first exemplary detachable lifting system 14116, such that it can have a relatively small footprint, so that it can be installed within the service area 1415 and close to the tool 1400, and enables the first exemplary detachable lifting system 14116 to lift, lower, and support the heavy removable component of the tool 1400. Without the elevated attachment between the upper support frame 1414 and the detachable lifting system 14116, the first exemplary detachable lifting system 14116 would not be able to lift, move, or support the removable component, but instead would tip over in the absence of support features (similar to the feet extending from a traditional lifting mechanism) extending along the fab floor, which may be larger than the area allowed between tools.

[0173] The first exemplary detachable lifting system 14116 further includes a lifting arm 14130, which can be the same as or similar to the above-described first lifting arm. For example, the lifting arm 14130 can include a lifting feature engagement interface as described above, and can be configured to pivot about a vertical axis 1434 which is perpendicular to the second axis 1424 and the first axis 1406, and extends through the vertical member 14118. In some embodiments, the first exemplary detachable lifting system 14116 can further include a vertical translation system 14132 which is configured to translate the lifting arm 14130 along the vertical axis 1434 in the direction of arrow 1464, as described above. As described above, the vertical load of the removable component is borne by the lifting arm 14130 and the vertical member 14118, and thus is transferred from the first exemplary detachable lifting system 14116 connected to the Fab floor to the Fab floor.

[0174] This vertical translation system 14132 can be powered by a motor or manually driven, such as by a manual crank or cable and winch drive, as Figure 15B depicted in. In some embodiments, once the complementary attachment point 14122 of the first exemplary detachable lift system 14116 is connected to the upper support frame 1414 at the attachment point 14112, the lift arm 14130 is movable such that the lift feature engagement interface can be moved to engage the lift feature of one of the removable components of the first plurality of 1402 semiconductor processing chambers 1404. The mobility of the lift arm 14130 can be the same as described above, such as the same as that included in Figures 6A-6E shown, such that it can move horizontally or in a plane perpendicular to the vertical axis 1434.

[0175] In some embodiments, the first exemplary detachable lift system 14116 is configured to translate along a second axis 1424. In some such embodiments, the attachment system can have a guide 14114 and a movable attachment point 14112 connected to the guide 14114 and movable along the second axis 1424, as described above, such that when the complementary attachment point 14122 of the first exemplary detachable lift system 14116 is connected to the upper support frame 1414 at the attachment point 14112, the first exemplary detachable lift system 14116 and the attachment point 14112 move together simultaneously along the second axis 1424, as Figure 14 shown by the arrow 1428 in. In Figure 15A and 15B this movement can be considered to be into and out of the page. This movement enables the first exemplary detachable lift system 14116 to connect to any removable component of the first plurality of semiconductor processing chambers 1402, lift, move, and lower the removable component. In such an embodiment, the movement mechanism 14126 contacts the Fab floor 14128 and moves the vertical member 14118 along the second axis 1424 together with the remainder of the first exemplary detachable lift system 14116.

[0176] In some embodiments, a second exemplary detachable lift system can be provided, which is similar in construction to the first exemplary detachable lift system but different in some aspects. The second exemplary detachable lift system includes a vertical member, a lift arm, at least one attachment point for connection to a tool, wheels or rollers for allowing movement around the semiconductor processing equipment, and additional features and construction described herein. In some cases, the second exemplary detachable lift system may not be able to self - position independently or support the load of the removable component without being connected to a tool. Figure 16Depicts a perspective view of a second exemplary detachable lifting system 16116, which includes a vertical member 16118 having a top end 16120 with a raised attachment point 16121 (also referred to herein as a complementary attachment point) and a bottom end 16124 with a movement mechanism 16126 (such as wheels or tracks), and further includes a lifting arm 16130 and a vertical translation system 16132.

[0177] In some embodiments, the lifting arm 16130 may be the same as or similar to the above-described first lifting arm and lifting arm 14130. In some embodiments, the lifting arm 16130 may include two or more linkages, as Figure 16 shown. Here, the lifting arm 16130 has three linkages, where the first linkage 16131 and the second linkage 16133 are parallel to each other and form a double shoulder joint 16135 and a double elbow joint 16137 with the third linkage 16139. The lifting arm 16130 is configured to pivot about a vertical axis 1634 at the double shoulder joint 16135, and the vertical axis 1634 is substantially parallel to the longitudinal axis of the vertical member 16118 (substantially means, for example, within about 5% or 1% of being parallel). The Figure 21 longitudinal axis depicted in extends along the length of the vertical member 16118 and intersects the top end 16120 and the bottom end 16124. The lifting arm 16130 is also configured to rotate about another axis 16141 parallel to the vertical axis 1634 at the elbow joint 16137. The distal end of the third linkage 16139 of the lifting arm 16130 may have any of the above-described lifting feature engagement interfaces such that it is used to engage the lifting features of any of the removable components described herein. Depending on the configuration of the lifting arm, it may be the above-described mobile type, for example, including those shown in Figures 6A-6E such that it can move horizontally or in a plane perpendicular to the vertical axis 1634. This movement is also shown in Figure 20A and 20B as well.

[0178] Such a vertical translation system 16132 may be powered by a motor or manually driven, for example, driven by a motor 16166 and a drive screw 16167, as Figure 16 depicted. The vertical translation system 16132 is configured to translate the lifting arm 16130 along the vertical axis 1634. As described above, this enables the lifting arm 16130 to raise and lower the removable components of the tool.

[0179] The second exemplary detachable lifting system can be attached to the tool in a number of ways. For example, similar to the first exemplary detachable lifting system, the second exemplary detachable lifting system can be connected to the tool at a single elevated attachment point, while the bottom of the second exemplary detachable lifting system is located on and supported by the floor of the manufacturing facility. In some embodiments, the second exemplary detachable lifting system can be connected to the tool at two different attachment points (e.g., an upper attachment point and a lower attachment point). Figure 17 Another exemplary semiconductor processing tool is depicted. Similar to the other figures above, the exemplary tool 1700 includes an upper support frame 1714, a first plurality 1702 of semiconductor processing chambers 1704 disposed along a first axis 1706, a base 1716 fixedly attached directly or indirectly to the upper support frame 1714, and a removable component (e.g., a removable upper cover 1718) having a lifting feature as described above. The tool also includes one or more upper attachment points 17112A-D fixedly attached to the upper support frame 1714 and one or more lower attachment points 17113A-D fixedly attached to a lower component of the tool (e.g., a lower frame or plate 17115). As Figure 17 shown, in some embodiments, each upper attachment point has a corresponding lower attachment point, and each pair is positioned parallel to each other along an axis (e.g., a vertical axis 1634) perpendicular to the first axis 1706.

[0180] Figure 18A and Figure 18B show side views of the attachment sequence between the tool and Figure 16 and Figure 17 the second exemplary detachable lifting system. In Figure 18A , the second exemplary detachable lifting system 16116 is separated from but aligned with the tool 1700 such that the upper attachment points 17112 of the tool 1700 can be connected to the elevated attachment points 16121 of the second exemplary detachable lifting system 16116, and the lower attachment points 17113 of the tool can be connected to the bottom attachment points 16123 of the second exemplary detachable lifting system 16116, as shown by the dashed double arrows. The lower attachment points 17113 can be used to support the weight of the second exemplary detachable lifting system 16116, such as a horizontal bar having a U-shaped container to receive the bottom attachment points 16123, as Figure 18A shown.

[0181] In Figure 18BIn [the figure], the second exemplary detachable lifting system 16116 is connected to the tool 1700 at the upper attachment point 17112 and the lower attachment point 17113 of the tool 1700. This attachment provides lateral and vertical support for the second exemplary detachable lifting system 16116, enabling it to have a relatively small footprint, so that it can be adapted within the service area and adjacent to the tool 1700, allowing the second exemplary detachable lifting system 16116 to lift, lower, and support the heavy removable components of the tool 1700. Without these upper and lower attachments, it would be impossible for the second exemplary detachable lifting system 16116 to lift, move, or support the removable components without tipping over. In some embodiments, as Figure 18B shown, when connected to the tool 1700, the second exemplary detachable lifting system 16116 may not be in direct contact with or supported by the floor of the manufacturing facility. In some such embodiments, the vertical loads supported by the second exemplary detachable lifting system 16116 are transferred to the tool 1700 through the upper and lower attachment points 17112 and 17113; these loads are not directly transmitted to the floor through direct contact between the floor and the second exemplary detachable lifting system 16116. In some other embodiments, the second exemplary detachable lifting system 16116 may be in direct contact with and supported by the floor of the manufacturing facility, so that the vertical loads supported by the second exemplary detachable lifting system 16116 are directly transmitted to the floor.

[0182] Once connected to the tool, the lifting arm 16130 is movable such that its lifting feature engagement interface can be moved to engage the lifting feature of one of the above-described removable components. Figure 19 depicts the second exemplary detachable lifting system 16116 connected to Figures 17-18B the tool 1700 in a perspective view. As Figure 19 shown, the lifting arm 16130 has been moved such that its lifting feature engagement interface 1652 can engage the lifting feature 1942 of the removable component 1718. Once these objects are engaged, the lifting arm 16130 can be moved to move the removable component 1718 in a plane transverse to the vertical axis 1634, which is along the x-axis and y-axis shown in the figure. The vertical translation system 16132 can also raise and lower the removable component along the depicted z-axis or vertical axis 1634, which can be substantially parallel to each other (e.g., within + / -5% of being parallel).

[0183] Figure 20A and 20B depicts the sequence of an example of the second exemplary detachable lifting system 16116 moving a removable component. Similar to the above Figures 6A-6E , these figures are Figures 17-19A simplified top view of the tool, where a second exemplary detachable lift system 16116 is attached to the tool; viewing them at an angle parallel to the vertical axis 1634 of Figure 16 , 18A and 19, such that the vertical axis 1634 is perpendicular to the page and extends into the page. Also visible are a first plurality of 1702 semiconductor processing chambers 1704, as well as the bases 1716 of these processing chambers, lift arms 16130, and lift feature engagement interfaces 1752 that engage the lift features 1742 of the removable component 1718. As Figure 20B shown, the lift arm 16130 is movable such that the removable component 1718 can be removed from the processing chamber 1704 and moved away from the processing chamber 1704 in a direction at least perpendicular to the first axis 1706, as indicated by the arrow on the removable component 1718. This movement is caused by the movement of the linkages and joints of the lift arm 16130 (including rotation about the vertical axis 1634 and another axis 16141). In some embodiments, the lift arm 16130 can have only one linkage, and the removable component 1718 can still move within a plane perpendicular to the vertical axis 1634 as described above, including in examples where the first carrier remains fixed. As described above and partially depicted in Figure 20B , this movement of the lift arm also enables the removable component engaged with the lift arm to be moved outside the housing 20170 of the tool.

[0184] In some embodiments, the second exemplary detachable lift system is configured such that the vertical translation system and the lift arm move together as a unit along a vertical member. This can allow the second exemplary detachable lift system to be easily moved around the manufacturing facility and stored closely when not in use. This can also advantageously enable the vertical translation system to be moved out of the way during installation and removal from the tool, so that the vertical translation system does not block or impede access to the elevated attachment points. Figure 21 Depicts Figure 16 Another configuration of the second exemplary detachable lift system. Here, the second exemplary detachable lift system 16116 includes a slide rail 16145 configured to allow the vertical translation system 16132 and the lift arm 16130 to move together as a unit along the longitudinal axis 16147 of the vertical member 16118 along the vertical member 16118. As Figure 21 shown, the vertical translation system 16132 and the lift arm 16130 have moved together towards the bottom end of the vertical member 16118. In some embodiments, this movement is unpowered, while in other embodiments, it can be driven by a motor, a linear actuator, or other mechanisms described herein.

[0185] As described above, by positioning the mobile mechanism 16126 on the floor of the manufacturing facility, the second exemplary detachable lifting system 16116 can be moved on the floor of the manufacturing facility. In some embodiments, the mobile mechanism 16126 can include Figure 21 a collapsible wheel set 16149 therein. Here, the collapsible wheel set 16149 is deployed such that all four wheels of the second exemplary detachable lifting system 16116 are positioned on and supported by the floor, and thus it can be moved on the floor. The collapsible wheel set 16149 is not intended to support the load of the removable components of the tool, but rather is intended to assist in moving the second exemplary detachable lifting system 16116. In Figure 18A it can be seen that the collapsible wheel set 16149 is folded or collapsed to reduce the footprint of the installed second exemplary detachable lifting system 16116.

[0186] As described above, the tool can include additional upper and lower attachment points such that the second exemplary detachable lifting system can be positioned at various locations of the tool to access all semiconductor processing chambers of the tool. For example, referring to Figure 20B , the tool 1700 can include additional upper and lower attachment points around some or all of the semiconductor processing chambers (e.g., around the location 20150). This enables the second exemplary detachable lifting system 16116 to be detachably connected to the tool 1700 at each of these locations 20150 so that it can access the removable components on all semiconductor processing chambers 1704A - E. In some embodiments, each pair of upper and lower attachment points can be positioned generally between two side-by-side chambers such that the second exemplary detachable lifting system 16116 can be positioned at one location and access the removable components of two side-by-side chambers. For example, referring to Figure 20A , where the upper and lower attachment points to which the second exemplary detachable lifting system 16116 is attached allow it to access the removable components of two semiconductor processing chambers 1704D and 1704E. Thus, in some such embodiments, the number of pairs of upper and lower attachment points can be one less than the number of chambers in the plurality of semiconductor processing chambers. For example, in Figure 20A and 20B the plurality of semiconductor processing chambers 1702 has five chambers 1704A - E, and there can be four pairs of upper and lower attachment points positioned generally between each pair of these chambers, as Figure 17 visible, which depicts four pairs of upper and lower attachment points 17112A - D and 17113A - D at the location 20150 respectively.

[0187] As described above, the connection between the detachable lift system and the tool is reconfigurable, enabling the system to be attached to or removed from the tool without destructive means. This can include the use of bolts, pins, screws, clamps, or other features that can be fastened together and removed without damaging the tool or system (such as damage caused by welding). Thus, the detachable lift system can be moved into position and connected to the tool within a limited time (e.g., the time required for maintenance or repair), and then disassembled and moved to different storage locations within other tools or facilities.

[0188] The detachable lift system may also include any of the safety features described above, such as power lines and safety interlocks disposed along the lift arm.

[0189] In addition to the claims listed in this disclosure, it should be understood that the following additional implementations are within the scope of this disclosure:

[0190] Implementation 1: A semiconductor processing tool, comprising: a support frame, a first plurality of semiconductor processing chambers disposed along a first axis, a first attachment point connected to the support frame, and a first detachable lift system, wherein each semiconductor processing chamber has a base fixedly mounted relative to the support frame and a removable upper cover including one or more lifting features, the first detachable lift system may include a vertical member having a top end with a complementary attachment point and a bottom end with a moving mechanism, the complementary attachment point being detachably connected to the first attachment point, the moving mechanism being supported by the floor, the first detachable lift system may further include a lift arm connected to the vertical member and having one or more linkages, the lift arm being configured to pivot about a vertical axis that is substantially perpendicular to the first axis, the lift arm including a lift feature engagement interface configured to engage the lift features of any of the removable upper covers of the first plurality of semiconductor processing chambers.

[0191] Implementation 2: The semiconductor processing tool according to Implementation 1, wherein the first detachable lift system further includes a vertical translation system configured to vertically translate the lift arm relative to the support frame in a direction parallel to the vertical axis.

[0192] Implementation 3: The semiconductor processing tool according to Implementation 2, wherein the first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, and wherein the first mechanical input causes the lift arm to translate along the vertical member.

[0193] Implementation 4: The semiconductor processing tool according to Implementation 3, wherein the first vertical translation system and the lift arm move together as a unit along the vertical member.

[0194] Implementation Option 5: The semiconductor processing tool according to Implementation Option 1, wherein the moving mechanism may include collapsible wheels.

[0195] Implementation Option 6: A semiconductor processing tool includes a support frame having an upper attachment point and a lower attachment point vertically offset below the upper attachment point; a first plurality of semiconductor processing chambers arranged along a first axis; and a detachable lifting system, wherein each semiconductor processing chamber has a base fixedly mounted relative to the support frame and has a removable component including one or more lifting features, and the detachable lifting system includes a vertical member having a top end with a raised attachment point, a bottom end with a bottom attachment point, and a moving mechanism, the raised attachment point being detachably connected to the upper attachment point, the bottom attachment point being detachably connected to the lower attachment point, the detachable lifting system further including: a lifting arm having one or more linkages and configured to pivot about a vertical axis substantially perpendicular to the first axis, and including a vertical translation system configured to vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis, and the lifting arm includes a lifting feature engagement interface configured to engage the lifting features of any removable component of the first plurality of semiconductor processing chambers.

[0196] Implementation Option 7: The semiconductor processing tool according to Implementation Option 6, wherein the vertical translation system includes a motor configured to provide a first mechanical input to a first vertical translation system, and wherein the first mechanical input causes the lifting arm to translate in a direction parallel to the vertical axis.

[0197] Implementation Option 8: The semiconductor processing tool according to Implementation Option 7, wherein the semiconductor processing tool further includes a power source, and the detachable lifting system further includes an electrical control cable connected to the power source, arranged along the lifting arm, and terminated at a connector, and each removable component further includes an electrical interface configured to connect to the connector, and the length of the electrical control cable is such that the connector and the lifting feature engagement interface of the lifting arm can only engage the electrical interface and the lifting features of a single processing chamber in the semiconductor processing chambers respectively at one time.

[0198] Implementation Option 9: The semiconductor processing tool according to Implementation Option 8 may further include a controller having one or more processors and one or more non-transitory memory devices storing instructions for controlling the one or more processors to: receive information about the operating state of each semiconductor processing chamber, and cause the first actuation signal provided by the electrical interface of the semiconductor processing chamber to operate the vertical translation system only when the information about the operating state of one of the semiconductor processing chambers indicates that the semiconductor processing chamber is in a condition of personnel safety.

[0199] Implementation 10: The semiconductor processing tool according to Implementation 8, wherein the removable component can receive power from a power source via a cable.

[0200] Implementation 11: The semiconductor processing tool according to Implementation 7, wherein the vertical translation system is a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, or a cable winch.

[0201] Implementation: The semiconductor processing tool according to the implementation, wherein the detachable lifting system further includes a first interlock device configured to engage with the lifting feature of any removable component of the first plurality of semiconductor processing chambers, and to prevent the first vertical translation system from vertically translating the first lifting arm when not engaged with the lifting feature of one of the removable components of the first plurality of semiconductor processing chambers.

[0202] Implementation 13: The semiconductor processing tool according to Implementation 6, wherein the moving mechanism includes four wheels.

[0203] Implementation 14: The semiconductor processing tool according to Implementation 6, wherein the moving mechanism includes a collapsible wheel set.

[0204] Implementation 15: The semiconductor processing tool according to Implementation 6, wherein the first vertical translation system is configured to move along a vertical member together with the lifting arm as a unit.

[0205] Implementation 16: The semiconductor processing tool according to Implementation 15, wherein the vertical member further includes a slide rail, and the first vertical translation system is configured to move along the slide rail.

[0206] Implementation 17: The semiconductor processing tool according to Implementation 6, wherein when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism is not supported by the floor.

[0207] Implementation 18: The semiconductor processing tool according to Implementation 6, wherein when the moving mechanism is connected to the lower attachment point and the upper attachment point, the moving mechanism is supported by the floor.

[0208] Implementation 19: The semiconductor processing tool according to Implementation 6, wherein the lower attachment point is vertically offset below the base of the plurality of processing chambers.

[0209] Implementation 20: The semiconductor processing tool according to Implementation 6, wherein the support frame further includes a plurality of upper attachment points, the tool further includes a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers includes N processing chambers, the plurality of upper attachment points may include N - 1 upper attachment points, and the plurality of lower attachment points includes N - 1 lower attachment points.

[0210] Implementation 21: The semiconductor processing tool according to Implementation 6, wherein the lift arm further includes three or more linkages, double shoulder joints, and double elbow joints.

[0211] Implementation 22: The semiconductor processing tool according to Implementation 6, wherein the removable component is not a substrate.

[0212] Implementation 23: The semiconductor processing tool according to Implementation 6, wherein the lift arm is not configured to support a substrate.

[0213] Implementation 24: The semiconductor processing tool according to Implementation 23, wherein the lift feature engagement interface is not configured to support a substrate.

[0214] Compared with traditional lifting mechanisms, the tool features described herein provide numerous advantages for lifting and moving removable components. These features enable cluster tools to be placed closer together because no additional Fab floor space is required to accommodate separate lifting mechanisms, the footprint of the tool does not increase or only increases slightly due to the inclusion of these features, and the removable component can be more easily accessed and moved more quickly, thereby reducing the tool downtime required for repair and maintenance. The ability to use the movement mechanism and controller to control the movement of the carrier and lift arm can also enable more effective, faster, and safer control and movement of the removable component.

[0215] Unless the context of the present disclosure clearly requires otherwise, throughout the description of the invention and the claims, words such as "comprising," "including," and the like shall be construed in an inclusive sense, rather than an exclusive or exhaustive sense; that is, they shall be construed to mean "including, but not limited to." The use of the singular or plural number generally also includes the plural or singular, respectively. In addition, terms such as "herein," "hereinafter," "above," "below," and terms of similar import refer to the entire application rather than any particular part of the application. When the word "or" is used in a list of two or more items, it is applicable to all of the following interpretations: any one of the items in the list, all of the items in the list, and any combination of the items in the list. The term "implementation" means an implementation of the technologies and methods described herein, as well as a physical object embodying the structures described herein and / or incorporating the technologies and / or methods described herein. Unless otherwise specified, the term "substantially" herein means within 5% of the reference value. For example, substantially vertical means within + / - 5% of vertical.

Claims

1. A semiconductor processing tool, comprising: A support frame; A first plurality of semiconductor processing chambers arranged along a first axis; A first attachment point connected to the support frame; And A first detachable lifting system, Wherein: Each semiconductor processing chamber includes a base fixedly mounted relative to the support frame and a removable upper cover including one or more lifting features; The first detachable lifting system includes a vertical member having a top end including complementary attachment points and a bottom end including a moving mechanism; The complementary attachment points are detachably connected to the first attachment point; The moving mechanism is supported by the floor; The first detachable lifting system further includes a lifting arm connected to the vertical member, the lifting arm including one or more linkages; The lifting arm is configured to pivot about a vertical axis substantially perpendicular to the first axis; and The lifting arm includes a lifting feature engagement interface configured to engage the lifting features of any removable upper cover of the first plurality of semiconductor processing chambers.

2. The semiconductor processing tool according to claim 1, wherein, The first detachable lifting system further includes a vertical translation system configured to at least partially vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis.

3. The semiconductor processing tool according to claim 2, wherein: The vertical translation system includes a motor configured to provide a first mechanical input to the vertical translation system; and The first mechanical input at least partially translates the lifting arm along the vertical member.

4. The semiconductor processing tool according to claim 2, wherein, The vertical translation system is configured to move as a unit and with the lifting arm along the vertical member.

5. The semiconductor processing tool according to claim 1, wherein, The moving mechanism includes collapsible wheels.

6. A semiconductor processing tool, comprising: A support frame including an upper attachment point; A lower attachment point vertically offset below the upper attachment point; A first plurality of semiconductor processing chambers arranged along a first axis; And A detachable lifting system, Wherein: Each semiconductor processing chamber includes a base fixedly mounted relative to the support frame and a removable component including one or more lifting features; The detachable lifting system includes a vertical member; The vertical member includes a top end including a raised attachment point, a bottom end including a bottom attachment point, and a moving mechanism; The raised attachment point is detachably connected to the upper attachment point; and The bottom attachment point is detachably connected to the lower attachment point; Wherein the detachable lifting system further includes: A lifting arm including one or more linkages, the lifting arm being configured to pivot about a vertical axis substantially perpendicular to the first axis; and A vertical translation system configured to at least partially vertically translate the lifting arm relative to the support frame in a direction parallel to the vertical axis, and Wherein the lifting arm includes a lifting feature engagement interface configured to engage the lifting features of any removable component of the first plurality of semiconductor processing chambers.

7. A semiconductor processing tool, comprising: An upper support frame extending along a first axis; A linear guiding system connected to the upper support frame and extending along the first axis; And A carrier movably connected to the linear guiding system, having: A lift arm configured to rotate about a second axis perpendicular to the first axis and having a lift feature engagement interface configured to engage a lift feature on a component of the semiconductor processing tool; and A vertical translation system configured to move the lift arm up and down along the second axis.

8. A semiconductor processing tool, comprising: An upper support frame extending along a first axis and having a plurality of upper attachment points; A lower support frame extending along the first axis and having a plurality of lower attachment points; and A detachable lift system having: A vertical member having a top complementary attachment point at its top end and a bottom complementary attachment point at its bottom end; A lift arm configured to rotate about a second axis perpendicular to the first axis and having a lift feature engagement interface configured to engage one or more lift features on a component of the semiconductor processing tool; A vertical translation system connected to the lift arm and configured to move the lift arm up and down; and A moving mechanism connected to the vertical member and configured to be supported by the floor, wherein: Each upper attachment point has a corresponding lower attachment point; The top complementary attachment point is configured to be detachably connected to the upper attachment point; and The bottom complementary attachment point is configured to be detachably connected to the lower attachment point.

9. A lift system for a semiconductor processing tool, the lift system comprising: A linear guiding system extending along a first axis; and A carrier movably connected to the linear guiding system, the carrier having: A lift arm having an end and a pivot portion, wherein the pivot portion is configured to rotate about a second axis and the end is configured to engage a component of the semiconductor processing tool; and A vertical translation system connected to the pivot portion of the lift arm and configured to move the lift arm up and down along the second axis.

10. A lift system for a semiconductor processing tool, the lift system comprising: A support frame having a plurality of attachment points arranged along a first axis; and A detachable lift system having: A vertical member having a top end, a bottom end, and a complementary attachment point configured to be detachably connected to the attachment point of the support frame; A lift arm configured to rotate about a second axis and having an end configured to engage a component of the semiconductor processing tool; A vertical translation system connected to the lift arm and configured to move the lift arm up and down; and A moving mechanism connected to the bottom end of the vertical member and configured to be supported by the floor.

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