High-precision wafer lifting control device and deposition equipment
Through the high-precision wafer lift control device, combined with servo drive and editable logic control, the smoothness and accuracy of the cylinder drive device are solved, the reliability of wafer movement and spraying effect are improved, and equipment failures are reduced.
Patent Information
- Application Number
- CN202510498348.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2025-07-25
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the prior art, the wafer lift control device driven by cylinder-pressed air has poor motion smoothness and difficult to control speed, resulting in insufficient position accuracy and easy damage, which affects the efficiency of equipment use.
High-precision wafer lift control device is adopted, including a mounting plate, a first motor, coupling, a moving plate, a screw, a sleeve, a moving assembly and a control module. Accurate control is achieved through a servo drive and an editable logic controller, combining the spray assembly and the collection assembly to improve motion smoothness and position accuracy.
It realizes smoothness of wafer movement and accuracy of position control, reduces equipment failures, improves usage efficiency and spray reliability, and prevents paint splashing and paint contamination.
Smart Images
Figure CN120376501A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of large-scale integrated circuit manufacturing technology, and particularly to a high-precision wafer lifting control device. Background Art
[0002] With the continuous reduction of the feature size of high-density integrated circuits, it is becoming increasingly important to uniformly and void-free fill trenches with high aspect ratios. The high-density plasma chemical vapor deposition (HDP) process has been developed specifically for the filling process, and has better performance especially for filling trenches with high aspect ratios.
[0003] For the equipment to complete this process, the device for controlling the wafer lifting in the deposition chamber adopts the method of driving by a cylinder plus compressed air. The smoothness of the cylinder movement is poor, the speed is not easy to control, and the accuracy of position control is poor, often causing system errors or wafer sliding during the wafer movement. In addition, the cylinder is easily damaged, affecting the equipment use efficiency. Summary of the Invention
[0004] The purpose of the invention is to provide a high-precision wafer lifting control device and a deposition equipment, which solve the problems that in the prior art, the method of driving by a cylinder plus compressed air has poor smoothness of cylinder movement, difficult speed control, and poor accuracy of position control.
[0005] To achieve the above purpose, the invention provides a high-precision wafer lifting control device, including a mounting plate, a first motor, a coupling, a moving plate, a lead screw, a sleeve, a moving component and a control module. The first motor is bolted to the mounting plate and is located below the mounting plate. The coupling is bolted to the output end of the first motor and is located above the first motor. The lead screw is bolted to the coupling and is located above the coupling. The moving plate is sleeved on the surface of the lead screw. The sleeve is threadedly connected to the moving plate and is sleeved on the surface of the lead screw. The lead screw is threadedly connected to the sleeve. The moving component is arranged on one side of the moving plate.
[0006] Wherein, the high-precision wafer lifting control device further includes a side plate and a limit block. The side plate is fixedly connected to the mounting plate and is located on one side of the mounting plate. The limit block is bolted to the side plate. On one side of the side plate, the limit block is slidably connected to the lead screw.
[0007] Wherein, the moving component includes a fixed block, a mounting block, a connecting rod and a connecting block. The fixed block is fixedly connected to the moving plate and is located on one side of the moving plate. The connecting block is bolted to the fixed block and is wrapped around the surface of the connecting rod. The mounting block is fixedly connected to the connecting rod and is located below the connecting rod.
[0008] Among them, the control module further includes a fixed frame, a plurality of servo drivers, a DC power supply, a programmable logic controller, a controller switch, and an operation screen. The plurality of servo drivers are bolted to the fixed frame and arranged inside the fixed frame. The DC power supply is bolted to the fixed frame and arranged on one side of the servo drivers. The programmable logic controller is bolted to the fixed frame and arranged on one side of the DC power supply. The control switch is bolted to the fixed frame and located on one side of the programmable logic controller. The operation screen is bolted to the fixed frame and located on one side of the fixed frame.
[0009] Among them, the high-precision wafer lifting control device further includes a partition board, which is bolted to the fixed frame and located between the programmable logic controller and the controller switch.
[0010] The present invention also provides a deposition device, which includes the above-mentioned high-precision wafer lifting control device, and further includes a fixed ring, a support disk, a plurality of placement tables, and a spraying component. The fixed ring is fixedly connected to the mounting block and located on one side of the mounting block. The support disk is rotatably connected to the fixed ring and located above the rotating ring. The placement tables are fixedly connected to the support disk and evenly arranged above the support disk. The spraying component is arranged above the corresponding placement table.
[0011] Among them, the spraying component includes a top plate, a nozzle, a cylinder, and a protective shell. The top plate is arranged above the corresponding placement table. The cylinder is bolted to the top plate and located above the top plate. The nozzle is fixedly connected to the output end of the cylinder and located below the top plate. The protective shell is fixedly connected to the output end of the cylinder and covers the outside of the cylinder.
[0012] For a high-precision wafer lifting control device of the invention, the first motor is bolted to the mounting plate and located below the mounting plate. The coupling is bolted to the output end of the first motor and located above the first motor. The lead screw is bolted to the coupling and located above the coupling. The moving plate is sleeved on the surface of the lead screw. The sleeve is threadedly connected to the moving plate and sleeved on the surface of the lead screw. The lead screw is threadedly connected to the sleeve. The moving component is arranged on one side of the moving plate. Description of the Drawings
[0013] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0014] Figure 1 It is a schematic structural diagram of the first embodiment of the invention.
[0015] Figure 2 It is of the invention Figure 1 Schematic structural diagram of the structure at position A.
[0016] Figure 3 It is a schematic structural diagram of the control module of the first embodiment of the invention.
[0017] Figure 4 It is a schematic structural diagram of the second embodiment of the invention.
[0018] Figure 5 It is a side view of the second embodiment of the invention.
[0019] Figure 6 It is of the invention Figure 5 Cross-sectional view taken along line B - B.
[0020] Figure 7 It is a schematic structural diagram of the third embodiment of the invention.
[0021] Figure 8 It is a side view of the third embodiment of the invention.
[0022] Figure 9 It is of the invention Figure 8 Cross-sectional view taken along line C - C.
[0023] 101 - mounting plate, 102 - first motor, 103 - coupling, 104 - moving plate, 105 - lead screw, 106 - sleeve, 107 - side plate, 108 - limit block, 109 - fixing block, 110 - connecting block, 111 - connecting rod, 112 - mounting block, 113 - fixing frame, 114 - servo driver, 115 - DC power supply, 116 - programmable logic controller, 117 - controller switch, 118 - operation screen, 119 - partition, 201 - fixing ring, 202 - support disk, 203 - placement table, 204 - top plate, 205 - spray head, 206 - cylinder, 207 - protective shell, 301 - toothed ring, 302 - gear, 303 - second motor, 304 - connecting ring, 305 - collection bottle, 306 - groove. Detailed implementation manners
[0024] Embodiments of the invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the invention and should not be construed as limiting the invention.
[0025] First Embodiment:
[0026] Please refer to Figures 1 to 3 , wherein, Figure 1 is a schematic structural diagram of the first embodiment of the invention, Figure 2 is of the invention Figure 1 schematic structural diagram of the structure at position A, Figure 3 is a schematic structural diagram of the control module of the first embodiment of the invention.
[0027] The invention provides a high-precision wafer lifting control device, including a mounting plate 101, a first motor 102, a coupling 103, a moving plate 104, a lead screw 105, a sleeve 106, a side plate 107, a limit block 108, a moving component and a control module. The moving component includes a fixed block 109, a mounting block 112, a connecting rod 111 and a connecting block 110. The control module further includes a fixed frame 113, a plurality of servo drivers 114, a DC power supply 115, a programmable logic controller 116, a controller switch 117 and an operation screen 118. By the foregoing solution, the problems in the prior art of using a cylinder driven by compressed air, where the smoothness of the cylinder movement is poor, the speed is not easy to control, and the precision control of the position is poor, are solved.
[0028] For this specific embodiment, the first motor 102 is bolted to the mounting plate 101 and is located below the mounting plate 101. The coupling 103 is bolted to the output end of the first motor 102 and is located above the first motor 102. The lead screw 105 is bolted to the coupling 103 and is located above the coupling 103. The moving plate 104 is sleeved on the surface of the lead screw 105. The sleeve 106 is threadedly connected to the moving plate 104 and is sleeved on the surface of the lead screw 105. The lead screw 105 is threadedly connected to the sleeve 106. The moving component is disposed on the moving plate 104. The first motor 102 drives the lead screw 105 to rotate, so that the sleeve 106 drives the moving component to move correspondingly, changing the height of the moving component.
[0029] Wherein, the side plate 107 is fixedly connected to the mounting plate 101 and is located on one side of the mounting plate 101. The limit block 108 is bolted to the side plate 107, on one side of the side plate 107. The limit block 108 is slidably connected to the lead screw 105. The position of the limit block 108 fixed to the lead screw 105 makes the lead screw 105 in the vertical direction, improving the stability of the lead screw 105.
[0030] Secondly, the fixed block 109 is fixedly connected to the moving plate 104 and is located on one side of the moving plate 104. The connecting block 110 is bolted to the fixed block 109 and covers the surface of the connecting rod 111. The mounting block 112 is fixedly connected to the connecting rod 111 and is located below the connecting rod 111. The mounting block 112 is fixed to one side of the moving plate 104 through the connecting block, facilitating the installation or disassembly of the mounting block 112.
[0031] Secondly, a plurality of the servo drivers 114 are bolted to the fixed frame 113 and are arranged inside the fixed frame 113. The DC power supply 115 is bolted to the fixed frame 113 and is arranged on one side of the servo driver 114. The programmable logic controller 116 is bolted to the fixed frame 113 and is arranged on one side of the DC power supply 115. The control switch is bolted to the fixed frame 113 and is located on one side of the programmable logic controller 116. The operation screen 118 is bolted to the fixed frame 113 and is located on one side of the fixed frame 113. The main power supply converts alternating current into direct current to supply the first motor 102 and the operation screen 118. The servo driver 114 is used to drive the first motor 102. The programmable logic controller controls the operation of the entire system, including signal processing, instruction sending, and signal collection.
[0032] In addition, the partition plate 119 is bolted to the fixed frame 113 and is located between the programmable logic controller 116 and the controller switch 117. The partition plate 119 separates the control switch and separates the wires on the other side of the fixed frame 113, facilitating the operation of the control switch.
[0033] When the invention is in use, the main power supply converts alternating current into direct current to supply the first motor 102 and the operation screen 118. The servo driver 114 is used to drive the first motor 102. The programmable logic controller controls the operation of the entire system. The mounting block 112 is fixed to one side of the moving plate 104 through the connecting block. The first motor 102 drives the lead screw 105 to rotate, causing the sleeve 106 to drive the mounting block 112 to move accordingly, changing the height of the mounting block 112.
[0034] Second Embodiment:
[0035] Please refer to Figures 4 to 6 , wherein, Figure 4 is a schematic structural diagram of the second embodiment of the invention, Figure 5 is a side view of the second embodiment of the invention, Figure 6 is of the inventionFigure 5 Cross-sectional view taken along line B-B
[0036] Based on the first embodiment, the invention provides a deposition device, which includes the above-mentioned high-precision wafer lifting control device, and further includes a fixed ring 201, a support disk 202, a plurality of placement platforms 203 and a spraying assembly. The spraying assembly includes a top plate 204, a spray head 205, a cylinder 206 and a protective shell 207. The problem of paint splashing during spraying is solved by the foregoing solution.
[0037] For this specific embodiment, the fixed ring 201 is fixedly connected to the mounting block 112 and is located on one side of the mounting block 112. The support disk 202 is rotatably connected to the fixed ring 201 and is located above the rotating ring. The placement platforms 203 are fixedly connected to the support disk 202 and are evenly arranged above the support disk 202. The spraying assembly is arranged above the corresponding placement platform 203. The wafer is placed on the surface of the placement platform 203. The first motor 102 drives the lead screw 105 to rotate, so that the support disk 202 rises correspondingly, and the spraying assembly sprays the wafer.
[0038] Among them, the top plate 204 is arranged above the corresponding placement platform 203. The cylinder 206 is bolted to the top plate 204 and is located above the top plate 204. The spray head 205 is fixedly connected to the output end of the cylinder 206 and is located below the top plate 204. The protective shell 207 is fixedly connected to the output end of the cylinder 206 and covers the outside of the cylinder 206. The cylinder 206 drives the spray head 205 to move, so that the protective shell 207 covers the surface of the placement platform 203 to prevent paint splashing.
[0039] When using the invention, the wafer is placed on the surface of the placement platform 203. The first motor 102 drives the lead screw 105 to rotate, so that the support disk 202 rises correspondingly. The wafer is placed on the surface of the placement platform 203. The first motor 102 drives the lead screw 105 to rotate, so that the support disk 202 rises correspondingly. The cylinder 206 drives the spray head 205 to move, so that the protective shell 207 covers the surface of the placement platform 203 to prevent paint splashing.
[0040] Third Embodiment:
[0041] The deposition device further includes a toothed ring 301, a gear 302, and a second motor 303. The toothed ring 301 is fixedly connected to the support disk 202 and is located below the support disk 202. The second motor 303 is fixedly connected to the mounting block 112 and is located on one side of the mounting block 112. The gear 302 is fixedly connected to the output end of the second motor 303 and is located above the second motor 303. The gear 302 meshes with the toothed ring 301.
[0042] The deposition device further includes a collection assembly. Four grooves 306 are provided on the surface of the support disk 202. The grooves 306 are provided outside the four placement platforms 203. The four grooves 306 communicate with each other. The collection assembly is provided below the support disk 202.
[0043] The collection assembly includes a connecting ring 304 and a collection bottle 305. The connecting ring 304 is fixedly connected to the support disk 202 and is located below the support disk 202. The collection bottle 305 is threadedly connected to the connecting ring 304 and is located below the connecting ring 304.
[0044] Please refer to Figures 7 to 9 , in which, Figure 7 is a schematic structural diagram of the third embodiment of the invention, Figure 8 is a side view of the third embodiment of the invention, Figure 9 is the Figure 8 cross-sectional view taken along the C-C line of the invention.
[0045] On the basis of the second embodiment, the invention provides a deposition device, including a toothed ring 301, a gear 302, a second motor 303, and a toothed ring 301, a gear 302, and a second motor 303. The collection assembly includes a connecting ring 304 and a collection bottle 305. By the foregoing solution, the problem that excess coating adheres to the surface of the support disk 202 and is not easy to clean is solved.
[0046] For this specific embodiment, the toothed ring 301 is fixedly connected to the support disk 202 and is located below the support disk 202. The second motor 303 is fixedly connected to the mounting block 112 and is located on one side of the mounting block 112. The gear 302 is fixedly connected to the output end of the second motor 303 and is located above the second motor 303. The gear 302 meshes with the toothed ring 301. The second motor 303 drives the gear 302 to rotate, and the gear 302 drives the toothed ring 301 to rotate, so that the support disk 202 rotates accordingly, and the wafers are sequentially moved below the nozzle 205.
[0047] Among them, four grooves 306 are provided on the surface of the support plate 202. The grooves 306 are arranged outside the four placement platforms 203. The four grooves 306 communicate with each other. The collection assembly is arranged below the support plate 202. After spraying, the excess paint moves into the grooves 306 and then moves into the collection assembly through the grooves 306.
[0048] Secondly, the connecting ring 304 is fixedly connected to the support plate 202 and is located below the support plate 202. The collection bottle 305 is threadedly connected to the connecting ring 304 and is located below the connecting ring 304. The paint flows into the collection bottle 305 through the grooves 306. The collection bottle 305 is fixed below the support plate 202 through the connecting ring 304, which is convenient for disassembly or installation.
[0049] When using the invention, the wafer is placed on the surface of the placement platform 203. The first motor 102 drives the lead screw 105 to rotate, so that the support plate 202 rises correspondingly. The wafer is placed on the surface of the placement platform 203. The first motor 102 drives the lead screw 105 to rotate, so that the support plate 202 rises correspondingly. The second motor 303 drives the gear 302 to rotate, and the gear 302 drives the toothed ring 301 to rotate, so that the support plate 202 rotates correspondingly, so that the wafer moves below the nozzle 205 in turn. The cylinder 206 drives the nozzle 205 to move, so that the protective shell 207 covers the surface of the placement platform 203 to prevent paint from splashing. The nozzle 205 sprays the wafer.
[0050] The above-disclosed are only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Those of ordinary skill in the art can understand the whole or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.
Claims
1. A high-precision wafer lifting control device, characterized in that it includes a mounting plate, a first motor, a coupling, a moving plate, a lead screw, a sleeve, a moving component and a control module. The first motor is bolted to the mounting plate and is located below the mounting plate. The coupling is bolted to the output end of the first motor and is located above the first motor. The lead screw is bolted to the coupling and is located above the coupling. The moving plate is sleeved on the surface of the lead screw. The sleeve is threadedly connected to the moving plate and is sleeved on the surface of the lead screw. The lead screw is threadedly connected to the sleeve. The moving component is arranged on one side of the moving plate.
2. The high-precision wafer lifting control device according to claim 1, characterized in that the high-precision wafer lifting control device further includes a side plate and a limit block. The side plate is fixedly connected to the mounting plate and is located on one side of the mounting plate. The limit block is bolted to the side plate and is located on one side of the side plate. The limit block is slidably connected to the lead screw.
3. The high-precision wafer lifting control device according to claim 2, characterized in that the moving component includes a fixed block, a mounting block, a connecting rod and a connecting block. The fixed block is fixedly connected to the moving plate and is located on one side of the moving plate. The connecting block is bolted to the fixed block and is sleeved on the surface of the connecting rod. The mounting block is fixedly connected to the connecting rod and is located below the connecting rod.
4. The high-precision wafer lifting control device according to claim 3, characterized in that the control module further includes a fixed frame, a plurality of servo drivers, a DC power supply, a programmable logic controller, a controller switch and an operation screen. The plurality of servo drivers are bolted to the fixed frame and are arranged inside the fixed frame. The DC power supply is bolted to the fixed frame and is arranged on one side of the servo drivers. The programmable logic controller is bolted to the fixed frame and is arranged on one side of the DC power supply. The control switch is bolted to the fixed frame and is located on one side of the programmable logic controller. The operation screen is bolted to the fixed frame and is located on one side of the fixed frame.
5. The high-precision wafer lifting control device according to claim 4, characterized in that the high-precision wafer lifting control device further includes a partition plate. The partition plate is bolted to the fixed frame and is located between the programmable logic controller and the controller switch.
6. A deposition device, including the high-precision wafer lifting control device according to claim 5, characterized in that it further includes a fixed ring, a support disk, a plurality of placement tables and a spraying component. The fixed ring is fixedly connected to the mounting block and is located on one side of the mounting block. The support disk is rotatably connected to the fixed ring and is located above the rotating ring. The placement tables are fixedly connected to the support disk and are evenly arranged above the support disk. The spraying component is arranged above the corresponding placement table.
7. The deposition device according to claim 6, characterized in that The spraying assembly includes a top plate, a spray head, a cylinder, and a protective shell. The top plate is disposed above the corresponding placement table. The cylinder is bolted to the top plate and is located above the top plate. The spray head is fixedly connected to the output end of the cylinder and is located below the top plate. The protective shell is fixedly connected to the output end of the cylinder and covers the outside of the cylinder.