A multi-size compatible wafer inspection calibrator

Abstract

The present invention discloses a multi-size compatible wafer inspection calibrator, comprising: a calibrator body; a calibration unit, the calibration unit comprising a connecting shaft connected to a base by a bearing, and a swing arm mounted on the connecting shaft, both ends of the swing arm being rotatably connected to a connecting rod via a rotating shaft, and the end of the connecting rod away from the swing arm being rotatably connected to a movable table via a rotating shaft; a first positioning table being mounted on the side close to each other on the through-section of the two sets of movable tables, and a first positioning plate being mounted on the first positioning table; a second positioning table being mounted on the side away from each other on the through-section of the two sets of movable tables, and a second positioning plate being mounted on the second positioning table. The present invention uses a rotating connection mechanism of the swing arm, the connecting rod and the movable table, so that the first positioning plate and the second positioning plate can synchronously adjust the spacing, thereby avoiding the offset problem of the existing single-axis drive method and achieving precise centering and positioning of wafer carrier rings of different sizes.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer inspection calibrators, and more particularly, to a multi-size compatible wafer inspection calibrator. Background Art

[0002] Wafers are the basic material for manufacturing semiconductor chips. After being processed into crystals, they can be fabricated into various circuit component structures, ultimately becoming integrated circuit products with specific electrical functions. Slicing is an essential step in the wafer processing process. Before dicing the wafer, the outer periphery of the carrier film must be fixed to the wafer bonding ring, and then the carrier film and wafer are bonded. The chips on the wafer are then diced and cut to perform the initial separation of the wafer.

[0003] Existing inspection and calibration equipment has significant limitations in adapting to wafer carrier rings of different sizes. Due to the fixed size of the positioning structure and support components, traditional equipment cannot be flexibly adjusted to accommodate wafer carrier rings of different sizes. This results in poor versatility of the equipment and makes it difficult to quickly and accurately adjust it according to the actual size of the wafer carrier ring. Specifically, when it is necessary to fix and calibrate a larger wafer carrier ring, the positioning components may not be able to effectively clamp it, causing the wafer carrier ring to shift during processing; and for smaller wafer carrier rings, the excessive spacing between the positioning components may not provide sufficient support and fixing force, which greatly limits the scope of application of wafer processing equipment and makes it difficult to meet the actual needs of multi-sized wafer co-production in modern semiconductor manufacturing.

[0004] Furthermore, during the semiconductor manufacturing process, wafers must be placed on an aligner via a transfer device. The mechanical structure and transfer path of the wafer transfer equipment place restrictions on the aligner's support layout. To avoid interference with the wafer transfer equipment's robotic arm or conveyor and ensure smooth wafer transfer, the aligner's location on the transfer path cannot be supported. This results in instability such as jitter during wafer dicing on the aligner due to a lack of sufficient support, impacting processing accuracy and product quality. Summary of the Invention

[0005] The present invention aims to provide a multi-size compatible wafer inspection calibrator to solve the technical problems that the existing equipment cannot be flexibly adjusted to accommodate wafer carrier rings of different sizes due to the fixed sizes of the positioning structure and supporting components, and the calibrator is located on the transfer path and cannot be supported. As a result, when the wafer is diced and cut on the calibrator, it produces unstable phenomena such as jitter due to lack of sufficient support, which affects the processing accuracy and product quality.

[0006] Some embodiments of the present invention provide a multi-size compatible wafer inspection calibrator, comprising:

[0007] A calibrator body, the calibrator body comprising a base, with a panel mounted on the base;

[0008] A calibration unit, the calibration unit comprising a connecting shaft connected to the base by a bearing, a swing arm mounted on the connecting shaft, both ends of the swing arm being rotatably connected to a connecting rod via a rotating shaft, and an end of the connecting rod away from the swing arm being rotatably connected to a movable platform via a rotating shaft, the movable platform extending through the enclosure to the outer surface of the enclosure, the movable platform passing through a section of the enclosure to form a through section;

[0009] A first positioning platform is installed on one side of the through section of the two sets of movable platforms, and a first positioning plate is installed on the first positioning platform. The two sets of the first positioning plates are used to clamp and position the first wafer carrier ring;

[0010] A second positioning platform is installed on one side of the two groups of movable platform penetration sections that are away from each other. A second positioning plate is installed on the second positioning platform. The two groups of the second positioning plates are used to clamp and position the second wafer carrier ring.

[0011] In one embodiment, fixed frames are symmetrically installed on both sides of the interior of the enclosure, and a supporting frame is installed on the fixed frame, the supporting frame corresponds to the position of the movable table, a first supporting platform is installed on the side close to the supporting frame, the first supporting platform is used to support the first wafer carrier ring, and a second supporting platform is installed on the side away from the supporting frame, the second supporting platform is used to support the second wafer carrier ring.

[0012] In one embodiment, the first positioning plate and the second positioning plate are connected to multiple sets of rotating shafts with bearings, guide rollers are installed on the rotating shafts, and a pressing unit is provided inside the rotating shafts. The pressing unit cooperates with the rotating shafts to press and fix the first wafer carrier ring and the second wafer carrier ring.

[0013] In one embodiment, the pressing unit includes a through-hole opened inside the rotating shaft, a movable shaft is slidably connected in the through-hole, and a connecting arm is installed on the movable shaft, a pressure rod is also installed on the connecting arm, and a rubber pad is installed on the end of the pressure rod away from the connecting arm, and connecting plates are symmetrically arranged on both sides below the first positioning plate and the second positioning plate, the movable shaft is fixedly connected to the corresponding connecting plates, and a first tilting block is installed on the close end of each two groups of connecting plates, and a second tilting block is arranged on the first tilting block.

[0014] In one embodiment, push rods are symmetrically arranged inside the first positioning plate and the second positioning plate, and multiple push rods are slidably connected to the inside of the first positioning plate and the second positioning plate respectively, the second tilting block is fixedly connected to the push rods, and the first positioning plate and the second positioning plate are respectively provided with slots for the second tilting block to slide, and multiple groups of the push rods are installed with abutment blocks at one end close to the first bearing platform and the second bearing platform.

[0015] In one embodiment, both the first supporting platform and the second supporting platform are provided with a movable support unit, and the movable support unit includes a first support platform respectively installed on both sides of the first supporting platform and the second supporting platform, and the interior of the first support platform is slidably connected to the second support platform, a telescopic airbag is installed inside the first support platform, and the end of the telescopic airbag away from the second supporting platform is fixedly connected to the second support platform, and the end of the telescopic airbag close to the end is installed with a tee, and a connecting pipe is installed on the tee.

[0016] In one embodiment, a movable groove is formed at one end of the second support platform away from the first support platform, and a movable plate is provided above the movable groove, a third inclined block is installed on the side of the movable plate close to the movable groove, and a fourth inclined block is abutted on one side of the third inclined block, and a pull rope is installed on the fourth inclined block.

[0017] In one embodiment, the pull rope passes through the second support platform and extends to the interior of the telescopic airbag. A limit frame is installed inside the telescopic airbag, and the limit frame is slidably connected to the pull rope.

[0018] In one embodiment, guide grooves are provided on both sides of the movable groove, and guide blocks are installed inside the guide grooves, and the guide blocks are fixedly connected to the fourth tilting block.

[0019] In one embodiment, multiple groups of guide columns are installed on one side of the movable plate close to the movable groove, and a guide groove adapted to the guide column is opened on the second support platform. The guide groove is slidably connected to the guide column, and a second spring is also provided on the guide column.

[0020] Compared with the prior art, the beneficial effects of the present invention are at least that: the present invention uses a rotating connection mechanism of a swing arm, a connecting rod and a movable platform, so that the first positioning plate and the second positioning plate can adjust the distance synchronously, avoiding the offset problem of the traditional single-axis drive method, and realizing the precise centering and positioning of wafer carrier rings of different sizes. The first positioning plate and the second positioning plate can adapt to wafer carrier rings with large diameter differences, greatly improving the adaptation efficiency of wafer carrier rings of multiple sizes. In addition, the telescopic airbag is inflated and deflated through the connecting tube, driving the second support platform to slide inside the first support platform, so that the support diameter can be continuously adjusted within a large range. When the second support platform is fully unfolded, the pull rope is tightened to drive the fourth tilting block to squeeze the third tilting block, so that the movable plate is lifted to contact with the lower surface of the wafer carrier ring, supporting the wafer carrier ring and improving the stability of the support process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of a wafer inspection calibrator in the first embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of a hidden three-dimensional structure of a cover in embodiment 1 of the present invention. Figure 1 ;

[0023] Figure 3 This is a schematic diagram of a hidden three-dimensional structure of a cover in embodiment 1 of the present invention. Figure 2 ;

[0024] Figure 4 This is a schematic top view of the structure of a wafer inspection calibrator in the first embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the three-dimensional structure of a wafer inspection calibrator in the second embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of a hidden three-dimensional structure of a first wafer carrier ring and a second wafer carrier ring in the second embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of a partial three-dimensional structure of a calibration unit and a movable support unit in the second embodiment of the present invention. Figure 1 ;

[0028] Figure 8 This is a schematic diagram of a partial three-dimensional structure of a pressing unit in the second embodiment of the present invention;

[0029] Figure 9 This is a schematic diagram of a partial three-dimensional structure of a calibration unit and a movable support unit in the second embodiment of the present invention. Figure 2 ;

[0030] Figure 10 This is a partial three-dimensional cross-sectional structural diagram of a movable support unit in the second embodiment of the present invention;

[0031] Figure 11 This is a structural diagram of the connection between a pull rope and a limit frame in the second embodiment of the present invention;

[0032] Figure 12 This is a structural diagram of the connection between the third inclined block, the fourth inclined block and the pull rope in the second embodiment of the present invention.

[0033] Explanation of Reference Numerals: 111, base; 112, enclosure; 113, cover plate; 114, first wafer carrier ring; 115, second wafer carrier ring; 211, connecting shaft; 212, swing arm; 213, connecting rod; 214, movable platform; 215, first positioning platform; 216, first positioning plate; 217, second positioning platform; 218, second positioning plate; 219, cylinder; 220, push plate; 221, fixing frame; 222, carrier frame; 223, first carrier platform; 224, second carrier platform; 225, slideway; 226, rotating shaft; 227, guide roller; 311. Movable shaft; 312. Connecting arm; 313. Pressure rod; 314. Rubber pad; 315. Connecting plate; 316. First spring; 317. First tilting block; 318. Second tilting block; 319. Push rod; 320. Abutment block; 411. First support platform; 412. Second support platform; 413. Telescopic airbag; 414. Tee; 415. Connecting pipe; 416. Movable groove; 417. Movable plate; 418. Third tilting block; 419. Fourth tilting block; 420. Pull rope; 421. Limiting frame; 422. Guide column; 423. Second spring. DETAILED DESCRIPTION

[0034] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed solely to enable those skilled in the art to better understand and implement the subject matter described herein, and that the functions and arrangements of the elements discussed may be varied without departing from the scope of this specification. Various examples may omit, substitute, or add various processes or components as needed. In addition, features described with respect to some examples may also be combined in other examples.

[0035] according to Figure 1 As shown, an embodiment of the present invention provides a multi-size compatible wafer inspection calibrator, including: a calibrator body, a first wafer carrier ring 114 and a second wafer carrier ring 115; and a calibration unit for positioning and calibrating the first wafer carrier ring 114 and the second wafer carrier ring 115.

[0036] The calibrator body includes a base 111 , and a surrounding plate 112 is installed on the base 111 , and a cover plate 113 is installed on the surrounding plate 112 .

[0037] In one embodiment, according to the attached Figure 2 To the attached Figure 4 As shown, the calibration unit includes a connecting shaft 211 connected to the base 111 by a bearing, and a swing arm 212 is installed on the connecting shaft 211. Both ends of the swing arm 212 are connected to a connecting rod 213 through a rotating shaft, and the end of the connecting rod 213 away from the swing arm 212 is connected to a movable platform 214 through a rotating shaft.

[0038] It should be understood that, in this embodiment, when one of the groups of movable platforms 214 is driven to move, the swing arm 212, the connecting rod 213 and the movable platform 214 are rotatably connected, and the driving connecting rod 213 drives the swing arm 212 to rotate, so that the two groups of movable platforms 214 move synchronously inward or outward at the same time, thereby facilitating the adjustment of the distance between the movable platforms 214, and also facilitating the centering and positioning operations in subsequent work.

[0039] The movable platform 214 extends through the enclosure 112 to the outer surface of the enclosure 112. The movable platform 214 passes through a section of the enclosure 112 to form a through section. The enclosure 112 is provided with a slot that matches the movable platform 214. In this embodiment, the movable platform 214 is slidably connected to the slot, allowing the through section to pass through the slot and move within the slot. The slot acts to limit the movement of the through section. In addition, a cylinder 219 is mounted on the base 111, and a push plate 220 is mounted at the telescopic end of the cylinder 219. One set of movable platforms 214 is fixedly connected to the push plate 220. In this embodiment, when the cylinder 219 is driven to extend and retract, the cylinder 219 drives one set of movable platforms 214 to move via the push plate 220. The swing arm 212, the connecting rod 213, and the movable platform 214 are rotatably connected. The driving connecting rod 213 drives the swing arm 212 to rotate, causing the two sets of movable platforms 214 to move inward or outward synchronously.

[0040] In addition, a first positioning platform 215 is installed on the side close to each other on the through-section of the two groups of movable platforms 214, and a first positioning plate 216 is installed on the first positioning platform 215. The two groups of first positioning plates 216 are used to clamp and position the first wafer carrier ring 114; a second positioning platform 217 is installed on the side away from each other on the through-section of the two groups of movable platforms 214, and a second positioning plate 218 is installed on the second positioning platform 217. The two groups of second positioning plates 218 are used to clamp and position the second wafer carrier ring 115.

[0041] Specifically, according to the attached Figure 3 and attached Figure 4As shown, fixed frames 221 are symmetrically installed on both sides of the interior of the enclosure 112, and a supporting frame 222 is installed on the fixed frame 221. The supporting frame 222 corresponds to the position of the movable platform 214. A first supporting platform 223 is installed on the side close to the supporting frame 222. The first supporting platform 223 is used to support the first wafer carrier ring 114. A second supporting platform 224 is installed on the side away from the supporting frame 222. The second supporting platform 224 is used to support the second wafer carrier ring 115.

[0042] It should be noted that a slide groove 225 is provided inside the carrier 222 for the first positioning platform 215 to move. In this embodiment, the slide groove 225 is provided so that when the movable platform 214 moves, the first positioning platform 215 can move normally, avoiding interference with its movement caused by the carrier 222.

[0043] In summary, by the rotational connection of the swing arm 212, the connecting rod 213 and the movable table 214, the positions of the first positioning plate 216 and the second positioning plate 218 can be synchronously adjusted, so that the first positioning plate 216 and the second positioning plate 218 are close to or away from each other, thereby facilitating the adaptation of the first wafer carrier ring 114 and the second wafer carrier ring 115, and the first positioning plate 216 and the second positioning plate 218 can adapt to the first wafer carrier ring 114 and the second wafer carrier ring 115 with a large difference in size specifications; and by the rotational connection of the swing arm 212, the connecting rod 213 and the movable table 214, the spacing between the first positioning plate 216 and the second positioning plate 218 can also be fine-tuned, so that based on the size of the first wafer carrier ring 114 and the second wafer carrier ring 115, a variety of wafer carrier rings of different sizes can be adapted, thereby achieving multi-size compatibility.

[0044] Furthermore, according to the attached Figure 5 and attached Figure 8 As shown, bearings on the first positioning plate 216 and the second positioning plate 218 are connected to multiple sets of rotating shafts 226, and guide rollers 227 are mounted on the rotating shafts 226. In this embodiment, the guide rollers 227 on the first positioning plate 216 and the second positioning plate 218 are connected via the rotating shafts 226 bearings. When in contact with the first wafer carrier ring 114 and the second wafer carrier ring 115, sliding friction is converted to rolling friction. This reduces contact stress during positioning, prevents scratches on the edges of the first wafer carrier ring 114 and the second wafer carrier ring 115, and allows for positioning and calibration of the edges of the first wafer carrier ring 114 and the second wafer carrier ring 115.

[0045] In yet another embodiment, according to the attached Figure 8As shown, a pressing unit is provided inside the rotating shaft 226 for pressing and fixing the first wafer carrier ring 114 and the second wafer carrier ring 115 to prevent the first wafer carrier ring 114 and the second wafer carrier ring 115 from being offset and misaligned during processing.

[0046] According to the attached Figure 8 As shown, the pressing unit includes a through-hole opened inside the rotating shaft 226, in which a movable shaft 311 is slidably connected, and a connecting arm 312 is installed on the movable shaft 311, and a pressure rod 313 is also installed on the connecting arm 312, and a rubber pad 314 is installed on the end of the pressure rod 313 away from the connecting arm 312, and connecting plates 315 are symmetrically arranged on both sides below the first positioning plate 216 and the second positioning plate 218, and the movable shaft 311 is fixedly connected to the corresponding connecting plate 315, and a first tilting block 317 is installed on the close end of each two groups of connecting plates 315, and a second tilting block 318 is arranged on the first tilting block 317.

[0047] Specifically, push rods 319 are symmetrically arranged inside the first positioning plate 216 and the second positioning plate 218, and multiple push rods 319 are respectively slidably connected to the inside of the first positioning plate 216 and the second positioning plate 218, the second tilting block 318 is fixedly connected to the push rods 319, and the first positioning plate 216 and the second positioning plate 218 are respectively provided with slots for the second tilting block 318 to slide, and multiple groups of push rods 319 are installed with abutment blocks 320 at one end near the first load-bearing platform 223 and the second load-bearing platform 224.

[0048] It should be understood that when the movable platform 214 drives the first positioning plate 216 or the second positioning plate 218 to approach each other, the abutment block 320 abuts against the first supporting platform 223 and the second supporting platform 224 respectively. By squeezing the abutment block 320, the abutment block 320 drives the push rod 319 to move, so that the second inclined block 318 slides on the first inclined block 317.

[0049] When the second tilting block 318 slides along the inclined surface of the first tilting block 317, a downward component force is generated, squeezing the connecting plate 315 to drive the movable shaft 311 to move downward, and the movable shaft 311 drives the pressure rod 313 to press down through the connecting arm 312, so that the rubber pad 314 contacts the upper surface of the wafer carrier ring with a certain elastic pressure (for example, 5-10N), forming an elastic pressing to press and clamp the first wafer carrier ring 114 or the second wafer carrier ring 115.

[0050] A first spring 316 is installed on each of the movable shafts 311 near the first tilting block 317. One end of each of the multiple first springs 316 is mounted on the first positioning plate 216 and the second positioning plate 218, respectively, while the other end of each of the multiple first springs 316 is mounted on the connecting plate 315. In this embodiment, the provision of the first springs 316 facilitates the reset of the connecting plate 315, releasing the pressure of the rubber pad 314 on the first wafer carrier ring 114 or the second wafer carrier ring 115.

[0051] Furthermore, the interior of the rubber pad 314 is hollow. When the thickness of the first wafer carrier ring 114 or the second wafer carrier ring 115 is different, the rubber pad 314 produces elastic deformation in the hollow state, and can adapt to the first wafer carrier ring 114 and the second wafer carrier ring 115 of different thicknesses.

[0052] In yet another embodiment, according to the attached Figure 6 and attached Figure 7 As shown, both the first supporting platform 223 and the second supporting platform 224 are provided with movable supporting units.

[0053] According to the attached Figure 10 and attached Figure 11 As shown, the movable support unit includes a first support platform 411 respectively installed on both sides of the first support platform 223 and the second support platform 224, and the interior of the first support platform 411 is slidably connected to the second support platform 412, a telescopic airbag 413 is installed inside the first support platform 411, and the end of the telescopic airbag 413 away from the second support platform 412 is fixedly connected, and the end of the telescopic airbag 413 close to the end is installed with a three-way pipe 414, and a connecting pipe 415 is installed on the three-way pipe 414, the connecting pipe 415 passes through the first support platform 223 and the second support platform 224 respectively, and extends to the outer surfaces of the first support platform 223 and the second support platform 224.

[0054] It should be understood that when the telescopic airbag 413 is inflated through the connecting tube 415, the expansion of the airbag pushes the second support platform 412 to slide outward from the inside of the first support platform 411, thereby expanding the support range; when deflated, the telescopic airbag 413 contracts, and the second support platform 412 retracts under its own gravity or external tension. This process realizes the synchronous inflation and deflation of multiple telescopic airbags 413 through the three-way pipe 414 to ensure the consistency of movement of the support platforms on both sides. Parameters such as the inflation pressure of the telescopic airbag can be determined according to actual needs. For example, the inflation pressure of the telescopic airbag can be set to 0.2-0.5MPa, which can drive the second support platform to expand outward by 10-30mm, and the support diameter range can cover 150-300mm.

[0055] It should be noted that when working, the connecting pipe 415 is connected to the external air supply device through the connecting hose to realize the air injection and air extraction operations inside the connecting pipe 415.

[0056] In yet another embodiment, according to the attached Figure 12 As shown, a movable groove 416 is provided at one end of the second support platform 412 away from the first support platform 411, and a movable plate 417 is provided above the movable groove 416. A third inclined block 418 is installed on the side of the movable plate 417 close to the movable groove 416, and a fourth inclined block 419 is abutted on one side of the third inclined block 418.

[0057] Among them, a pull rope 420 is installed on the fourth inclined block 419, and the pull rope 420 passes through the second support platform 412 and extends to the inside of the telescopic airbag 413. A limit frame 421 is installed inside the telescopic airbag 413, and the limit frame 421 is slidably connected to the pull rope 420.

[0058] It should be noted that when the second support platform 412 moves out from the inside of the first support platform 411, the pull rope 420 is limited by the restraining action of the limit frame 421. When the first support platform 411 is fully unfolded, the pull rope 420 is in a taut state. The pull rope 420 pulls the fourth inclined block 419 to move, and the third inclined block 418 is squeezed by the fourth inclined block 419. Under the action of the inclined surface, the movable plate 417 is lifted upward, wherein a silicone pad is provided on the movable plate 417 to provide auxiliary support for the first wafer carrier ring 114 or the second wafer carrier ring 115.

[0059] Specifically, guide grooves are formed on both sides of the movable groove 416, and guide blocks are installed inside the guide grooves. The guide blocks are fixedly connected to the fourth inclined block 419. In this embodiment, the guide grooves and guide blocks are provided to limit the fourth inclined block 419, allowing it to move stably within the movable groove 416, thereby allowing the movable plate 417 to rise stably.

[0060] Furthermore, a plurality of guide posts 422 are mounted on the side of the movable plate 417 near the movable groove 416. The second support platform 412 is provided with guide grooves adapted to the guide posts 422, which are slidably connected to the guide grooves. The guide posts 422 are also provided with second springs 423, one end of which is fixedly connected to the guide grooves, and the other end of which is fixedly connected to the guide posts 422. In this embodiment, the provision of the guide posts 422 and the second springs 423 enables the movable plate 417 to be reset and provides a restraining force during its ascent, thereby making its ascent more stable.

[0061] The above describes an embodiment of this specific implementation method, but this embodiment is not limited to the above specific implementation method. The above specific implementation method is merely illustrative and not restrictive. Ordinary technicians in this field can also make many forms based on the inspiration of this embodiment, all of which are protected by this embodiment.

Claims

1. A multi-size compatible wafer inspection calibrator for positioning and calibrating a first wafer carrier ring and a second wafer carrier ring, characterized in that: include: A calibrator body, the calibrator body comprising a base, with a panel mounted on the base; A calibration unit, the calibration unit comprising a connecting shaft connected to the base by a bearing, a swing arm mounted on the connecting shaft, both ends of the swing arm being rotatably connected to a connecting rod via a rotating shaft, and an end of the connecting rod away from the swing arm being rotatably connected to a movable platform via a rotating shaft, the movable platform extending through the enclosure to the outer surface of the enclosure, the movable platform passing through a section of the enclosure to form a through section; A first positioning platform is installed on one side of the through section of the two sets of movable platforms, and a first positioning plate is installed on the first positioning platform. The two sets of the first positioning plates are used to clamp and position the first wafer carrier ring; A second positioning platform is installed on one side of the two sets of movable platform penetration sections away from each other, and a second positioning plate is installed on the second positioning platform. The two sets of the second positioning plates are used to clamp and position the second wafer carrier ring; Fixed frames are symmetrically installed on both sides of the interior of the enclosure, and a carrying frame is installed on the fixed frame. The position of the carrying frame corresponds to that of the movable platform. A first carrying platform is installed on the side close to the carrying frame, and the first carrying platform is used to carry and support the first wafer carrier ring. A second carrying platform is installed on the side away from the carrying frame, and the second carrying platform is used to carry and support the second wafer carrier ring. The first positioning plate and the second positioning plate are connected to a plurality of sets of rotating shafts with bearings, the rotating shafts are equipped with guide rollers, and the interior of the rotating shafts is provided with a pressing unit, which cooperates with the rotating shafts to press and fix the first wafer carrier ring and the second wafer carrier ring; The pressing unit includes a through-hole opened inside the rotating shaft, a movable shaft is slidably connected in the through-hole, a connecting arm is installed on the movable shaft, a pressure rod is also installed on the connecting arm, a rubber pad is installed on the end of the pressure rod away from the connecting arm, connecting plates are symmetrically provided on both sides below the first positioning plate and the second positioning plate, the movable shaft is fixedly connected to the corresponding connecting plates, and a first tilting block is installed on the close end of each two groups of connecting plates, and a second tilting block is provided on the first tilting block.

2. The multi-size compatible wafer inspection calibrator according to claim 1, characterized in that: Push rods are symmetrically arranged inside the first positioning plate and the second positioning plate, and multiple push rods are slidably connected to the inside of the first positioning plate and the second positioning plate respectively. The second tilting block is fixedly connected to the push rods, and the first positioning plate and the second positioning plate are respectively provided with slots for the second tilting block to slide. Multiple groups of push rods are installed with abutment blocks at one end close to the first bearing platform and the second bearing platform.

3. The multi-size compatible wafer inspection calibrator according to claim 1, characterized in that: Both the first supporting platform and the second supporting platform are provided with a movable support unit, and the movable support unit includes a first supporting platform respectively installed on both sides of the first supporting platform and the second supporting platform, the interior of the first supporting platform is slidably connected to the second supporting platform, and a telescopic airbag is installed inside the first supporting platform, the end of the telescopic airbag away from the second supporting platform is fixedly connected, and the end of the telescopic airbag close to the three-way pipe is installed, and a connecting pipe is installed on the three-way pipe.

4. The multi-size compatible wafer inspection calibrator according to claim 3, characterized in that: A movable groove is provided at one end of the second support platform away from the first support platform, a movable plate is provided above the movable groove, a third inclined block is installed on the side of the movable plate close to the movable groove, a fourth inclined block is abutted on one side of the third inclined block, and a pull rope is installed on the fourth inclined block.

5. The multi-size compatible wafer inspection calibrator according to claim 4, characterized in that: The pull rope passes through the second supporting platform and extends to the interior of the telescopic airbag. A limiting frame is installed inside the telescopic airbag, and the limiting frame is slidably connected to the pull rope.

6. The multi-size compatible wafer inspection calibrator according to claim 4, characterized in that: Guide grooves are provided on both sides of the movable groove, and guide blocks are installed inside the guide grooves. The guide blocks are fixedly connected to the fourth tilting block.

7. The multi-size compatible wafer inspection calibrator according to claim 4, characterized in that: A plurality of guide columns are installed on one side of the movable plate close to the movable groove. A guide groove adapted to the guide column is provided on the second support platform. The guide groove is slidably connected to the guide column. A second spring is also provided on the guide column.

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