3D vertical stacking packaging structure and packaging technology thereof

Abstract

The invention belongs to the technical field of chip stacking packaging, and particularly relates to a 3D vertical stacking packaging structure and a packaging technology thereof.The 3D vertical stacking packaging structure comprises a substrate, a first chip is bonded to the substrate, first bonding wires are arranged between the two ends of the first chip and the substrate, a second chip is bonded to the first chip, and second bonding wires are arranged between the two ends of the second chip and the substrate; a first chip is bonded on the substrate, a second chip is bonded on the second chip, a third chip is bonded on the second chip, bonding wires III are arranged between two ends of the third chip and the substrate, and an adhesive layer is arranged between every two of the substrate, the first chip, the second chip and the third chip, so that the stability of the whole packaging structure is ensured, more chips can be bonded at the upper end of the third chip, the stacking of more chips is realized, the packaging area is reduced, and the packaging efficiency is improved. And the device is suitable for installation of smaller equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip stacking packaging, and particularly relates to a 3D vertical stacking packaging structure and its packaging process. Background Art

[0002] Most of the existing chip packaging structures are flat-packaged, with multiple chips laid flat on the substrate, resulting in a great waste of space, being unfavorable for assembly and use in small devices, and causing limitations in chip usage.

[0003] For example, the multi-chip packaging structure with the patent application number CN201310132992.9 includes a substrate unit, a light-emitting unit, a frame unit, a packaging unit, and a lens unit. The substrate unit includes a substrate body. The light-emitting unit includes two first light-emitting elements arranged diagonally on the substrate body and two second light-emitting elements arranged diagonally on the substrate body. The frame unit includes two first conductive frames arranged diagonally on the substrate body and respectively surrounding the two first light-emitting elements and two second conductive frames arranged diagonally on the substrate body and respectively surrounding the two second light-emitting elements. However, the disadvantage of this technical solution is that the substrate unit, the light-emitting unit, and the frame unit are arranged flatly, resulting in a great waste of space, being unfavorable for assembly and use in small devices, and causing limitations in chip usage. Summary of the Invention

[0004] The purpose of the present invention is to provide a 3D vertical stacking packaging structure and its packaging process to solve the problems in the prior art. The specific technical solutions are as follows:

[0005] A 3D vertical stacking packaging structure includes a substrate, a first chip is bonded to the substrate, bonding wires one are provided between both ends of the first chip and the substrate, a second chip is bonded to the first chip, bonding wires two are provided between both ends of the second chip and the substrate, a third chip is bonded to the second chip, and bonding wires three are provided between both ends of the third chip and the substrate.

[0006] Further, solder balls are provided at the lower end of the substrate.

[0007] Further, the widths of the first chip, the second chip, and the third chip decrease in sequence.

[0008] A packaging process for a 3D vertical stacking packaging structure is used to package the 3D vertical stacking packaging structure described in any one of the above, and includes the following steps:

[0009] S1. Store the substrate, the first chip, the second chip, and the third chip in a rotary loading component, move the substrate to the packaging table component through a transfer component, and after driving the transfer component 270 degrees by a first motor, four substrates are placed on the transfer component;

[0010] S2. Drive the transfer component to continue rotating by 90 degrees through the first motor. The transmission component arranged at the lower end of the transfer component drives the rotary loading component to rotate by 90 degrees. The first chip moves below the transfer component, and the transfer component moves the first chip onto the substrate.

[0011] S3. Apply glue between the substrate and the first chip through a glue dispensing device, and form a first bonding wire between the substrate and the first chip through a gold wire bonding device.

[0012] Furthermore, the rotary loading component includes a loading turntable. A central rotating column II is fixed at the central position of the loading turntable. The lower end of the central rotating column II is fixedly connected with a first gear. The central rotating column II is rotationally connected with the main body bracket. The first gear is in meshing transmission with the transmission component through gears. Four placement grooves II are arranged in the loading turntable. The substrate, the first chip, the second chip and the third chip are respectively stored in the four placement grooves II. One end of a third spring is connected to the bottom of the placement groove II, and the other end of the third spring is fixed on the lower support plate. Side support plates are slidably connected to both sides inside the placement groove II. A fourth spring is arranged between the side support plate and the inner wall of the placement groove II. A bent clamping part is arranged at the upper end of the side support plate. The placement groove II communicates with the outside through a side groove.

[0013] Furthermore, the encapsulation table component includes a rotating turntable. A central rotating column I is fixed at the central position of the rotating turntable. The central rotating column I is connected to the output end of the first motor. The first motor is fixed at the bottom of the main body bracket. The rotating turntable rotates on the supporting turntable. The central rotating column I is rotationally connected with the supporting turntable.

[0014] Furthermore, four placement grooves I are arranged on the rotating turntable. A plurality of adsorption holes are arranged in the placement groove I. The plurality of adsorption holes communicate with a communication chamber arranged inside the rotating turntable. The lower end of the communication chamber communicates with a communication pipe. A cylinder is slidably connected inside the communication pipe. The cylinder is fixed inside the rotating turntable.

[0015] Furthermore, baffles are arranged on both sides inside the placement groove I. Both baffles are slidably connected with the rotating turntable. End blocks are fixedly connected to the ends of both baffles. A pull rod is slidably connected inside the end block. A first spring is arranged between the end block and the pull rod. The lower end of the pull rod is fixed with an inserting block. The inserting block is inserted into a slot arranged on the rotating turntable. A triangular block is arranged on the end block. The front end of the triangular block points to a scale line arranged on the rotating turntable.

[0016] Furthermore, the transmission component includes a circular frame. The circular frame is fixedly connected with the central rotating column I. The circular frame is fixedly connected with the end of a support pipe. An inner sliding rod is slidably connected inside the support pipe. A second spring is arranged between the support pipe and the inner sliding rod. A sliding column is fixed at the end of the inner sliding rod. The sliding column slides in a sliding groove arranged at the bottom of the supporting turntable.

[0017] Further, the sliding column is slidably fitted and connected in the groove on the functional wheel, the circular frame is slidably fitted and connected with the edge of the functional wheel, the functional wheel is fixedly connected with the second gear through a connecting column, the connecting column is rotatably connected with the main body bracket, and the second gear is in gear meshing transmission with the first gear.

[0018] The advantages of the present invention are as follows:

[0019] There is an adhesive layer between the substrate, the first chip, the second chip and the third chip, which ensures the stability of the overall packaging structure. More chips can be attached to the upper end of the third chip to achieve stacking of more chips, reducing the packaging area and adapting to the installation of smaller devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the 3D vertical stacking packaging structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the rotary loading component and the packaging table component structure of the present invention Figure 1 ;

[0022] Figure 3 It is a schematic diagram of the rotary loading component and the packaging table component structure of the present invention Figure 2 ;

[0023] Figure 4 It is a schematic diagram of the transmission component structure of the present invention Figure 1 ;

[0024] Figure 5 It is a schematic diagram of the transmission component structure of the present invention Figure 2 ;

[0025] Figure 6 It is a schematic diagram of the packaging table component structure of the present invention Figure 1 ;

[0026] Figure 7 is Figure 6 the partial enlarged view at A in

[0027] Figure 8 It is a schematic diagram of the packaging table component structure of the present invention Figure 2 ;

[0028] Figure 9 It is a schematic diagram of the packaging table component structure of the present invention Figure 3 ;

[0029] Figure 10 It is a schematic diagram of the packaging table component structure of the present invention Figure 4 ;

[0030] Figure 11 is is Figure 10 the partial enlarged view at B in

[0031] Figure 12 Structural Schematic of the Rotating Loading Component of the Present Invention Figure 1 ;

[0032] Figure 13 Structural Schematic of the Rotating Loading Component of the Present Invention Figure 2 ;

[0033] Figure 14 is Figure 13 the partial enlarged view at position C in

[0034] Figure 15 Structural Schematic of the Transfer Component of the Present Invention Figure 1 ;

[0035] Figure 16 Structural Schematic of the Transfer Component of the Present Invention Figure 2 ;

[0036] Explanation of Markings in the Figure:

[0037] Substrate 1; First Chip 2; Second Chip 3; Third Chip 4; First Bonding Wire 5; Second Bonding Wire 6; Third Bonding Wire 7; Solder Balls 8; Main Body Bracket 9; First Motor 10; First Central Rotating Column 11; Support Round Table 12; Rotating Round Table 13; First Placing Groove 14; Adsorption Hole 15; Communication Chamber 16; Communication Pipe 17; Piston 18; Cylinder 19; Baffle 20; End Block 21; Pull Rod 22; First Spring 23; Insert Block 24; Insert Slot 25; Triangular Block 26; Scale Line 27; Slide Groove 28; Circular Frame 29; Support Pipe 30; Inner Slide Rod 31; Second Spring 32; Slide Column 33; Loading Round Table 34; Second Central Rotating Column 35; First Gear 36; Second Placing Groove 37; Third Spring 38; Lower Support Plate 39; Fourth Spring 40; Side Support Plate 41; Bending Clamping Portion 42; Second Bracket 43; Second Motor 44; First Rotating Rod 45; First Slide Block 46; Rocking Rod 47; Second Rotating Rod 48; Second Slide Block 49; Upper Bracket 50; Screw 51; Support Rod 52; Functional Block 53; First Link 54; Bent Frame 55; Second Link 56; Long Rod 57; Suction Cup 58; Second Gear 59; Functional Wheel 60; Connecting Column 61; Gold Wire Bonding Equipment 62; Dispensing Equipment 63; Slide Plate 64; Side Slot 65. Detailed Embodiment

[0038] Next, the technical solution of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0039] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0040] Embodiment 1

[0041] As Figures 1 - 16 shown, a 3D vertical stacked package structure includes a substrate 1, a first chip 2 is bonded on the substrate 1, bonding wires 1 are provided between both ends of the first chip 2 and the substrate 1, a second chip 3 is bonded on the first chip 2, bonding wires 2 are provided between both ends of the second chip 3 and the substrate 1, a third chip 4 is bonded on the second chip 3, and bonding wires 3 are provided between both ends of the third chip 4 and the substrate 1;

[0042] The working principle of the above technical solution: There is an adhesive layer between the substrate 1, the first chip 2, the second chip 3, and the third chip 4, which ensures the stability of the overall package structure. More chips can be attached to the upper end of the third chip 4 to achieve stacking of more chips, reduce the package area, and adapt to the installation of smaller devices.

[0043] Embodiment 2

[0044] As Figures 1 - 16 shown, the lower end of the substrate 1 is provided with solder balls 8;

[0045] The working principle of the above technical solution: The substrate 1 is connected to the device circuit board through the solder balls 8 at its lower end, reducing lead connections and occupying less space.

[0046] Embodiment 3

[0047] As Figures 1 - 16 shown, the widths of the first chip 2, the second chip 3, and the third chip 4 decrease in sequence;

[0048] The working principle of the above technical solution: The chips on the substrate 1 are arranged from large to small upward, preventing the upper chips from squeezing the bonding wires of the lower chips, and in order to expose the bonding wire solder joints for convenient observation and operation.

[0049] Embodiment 4

[0050] As Figures 1 - 16As shown in the figure, a packaging process for a 3D vertical stacking package structure is used to package a 3D vertical stacking package structure described in any one of the above, and includes the following steps:

[0051] S1. Place the substrate 1, the first chip 2, the second chip 3, and the third chip 4 in the rotary loading component. Move the substrate 1 to the packaging table component through the transfer component. After driving the transfer component 270 degrees by the first motor 10, there are four substrates 1 placed on the transfer component.

[0052] S2. Drive the transfer component to continue rotating 90 degrees by the first motor 10. The transmission component arranged at the lower end of the transfer component drives the rotary loading component to rotate 90 degrees. The first chip 2 moves to the lower part of the transfer component, and the first chip 2 is moved to the substrate 1 through the transfer component.

[0053] S3. Apply glue between the substrate 1 and the first chip 2 through the glue dispensing device 63, and form a first bonding wire 5 between the substrate 1 and the first chip 2 through the gold wire bonding device 62.

[0054] Both the gold wire bonding device 62 and the glue dispensing device 63 are fixed to the main body bracket 9, and a slide plate 64 is fixed on the main body bracket 9.

[0055] The working principle of the above technical solution: There are four placement grooves two 37 in the rotary loading component. Stack and place multiple substrates 1, multiple first chips 2, multiple second chips 3, and multiple third chips 4 in the four placement grooves two 37 respectively. In the initial state, the placement groove two 37 with the substrate 1 placed therein is located at a preset position below the transfer component. The transfer component can transfer the first substrate 1 at the top layer in the placement groove two 37 to the packaging table component. Drive the packaging table component to rotate 90 degrees by the first motor 10, and the transfer component transfers the second substrate 1 to the packaging table component. Drive the packaging table component to rotate 90 degrees again by the first motor 10, and the transfer component transfers the third substrate 1 to the packaging table component. Drive the packaging table component to rotate 90 degrees again by the first motor 10, and the transfer component transfers the fourth substrate 1 to the packaging table component. At this time, the packaging table component rotates a total of 270 degrees, and four substrates 1 are evenly and equidistantly placed on the packaging table component.

[0056] During the rotation of the packaging table component, the glue dispensing device 63 applies glue on the substrate 1.

[0057] The motor 10 drives the encapsulation table assembly to rotate 90 degrees again. The encapsulation table assembly drives the rotary feeding assembly to rotate 90 degrees through the transmission assembly. At this time, the placement groove two 37 with the first chip 2 placed therein rotates to a preset position below the transfer assembly. The transfer assembly transfers the uppermost first chip 2 in the placement groove two 37 onto the substrate 1, and the substrate 1 and the first chip 2 are bonded together through the glue on the substrate 1. As the encapsulation table assembly rotates continuously, the first chip 2 lands on all four substrates 1;

[0058] When the substrate 1 with the first chip 2 lands below the wire bonding device 62, a first bonding wire 5 is formed between the substrate 1 and the first chip 2 through the wire bonding device 62;

[0059] Repeat the above operations. Glue is applied to the first chip 2, the second chip 3 lands on the first chip 2, and a second bonding wire 6 is formed between the second chip 3 and the substrate 1 through the wire bonding device 62;

[0060] Glue is applied to the second chip 3, the third chip 4 lands on the second chip 3, and a third bonding wire 7 is formed between the third chip 4 and the substrate 1 through the wire bonding device 62;

[0061] The 3D vertical stacked packaging structure is packaged through the above solution, with high automation and fast production efficiency.

[0062] Embodiment Five

[0063] As Figures 1 - 16 shown, the rotary feeding assembly includes a feeding turntable 34. A central rotating column two 35 is fixed at the central position of the feeding turntable 34. The lower end of the central rotating column two 35 is fixedly connected to a gear one 36. The central rotating column two 35 is rotationally connected to the main body bracket 9. The gear one 36 is in meshing transmission with the transmission assembly through gears. Four placement grooves two 37 are provided inside the feeding turntable 34. The substrate 1, the first chip 2, the second chip 3, and the third chip 4 are respectively stored in the four placement grooves two 37. One end of a spring three 38 is connected to the bottom of the placement groove two 37, and the other end of the spring three 38 is fixed on the lower support plate 39. Both sides inside the placement groove two 37 are slidably connected with side support plates 41. A spring four 40 is provided between the side support plates 41 and the inner wall of the placement groove two 37. A bent clamping portion 42 is provided at the upper end of the side support plate 41. The placement groove two 37 communicates with the outside through a side groove 65;

[0064] Working principle of the above technical solution: Stack multiple substrates 1, multiple first chips 2, multiple second chips 3, and multiple third chips 4 in four placement grooves two 37 respectively. Taking the placement groove two 37 with the substrate 1 placed in it as an example, when the uppermost substrate 1 is taken away by the transfer component, the uppermost substrate 1 squeezes the two ends of the bent clamping part 42 to move to both sides, driving the two side support plates 41 to move to both sides. After the uppermost substrate 1 is taken away by the transfer component, under the elastic force of the spring three 38, the lower support plate 39 squeezes the multiple substrates 1 to move upward. After the second substrate 1 moves upward, both ends are clamped by the bent clamping part 42, keeping the transfer component sucking the substrate 1 at the same position, ensuring the stability of sucking the substrate 1;

[0065] The remaining amount of the substrate 1 in the placement groove two 37 can be viewed through the side groove 65, which is convenient for timely replenishment;

[0066] For the placement groove two 37 with the first chip 2 or the second chip 3 or the third chip 4 placed in it, under the elastic force of the spring four 40, the two side support plates 41 can be closely attached to both sides of the first chip 2 to adapt to the clamping and accommodation of chips with different widths.

[0067] Embodiment Six

[0068] As Figures 1 - 16 shown, the encapsulation table assembly includes a rotating turntable 13. A central rotating column one 11 is fixed at the center position of the rotating turntable 13. The central rotating column one 11 is connected to the output end of the motor one 10. The motor one 10 is fixed at the bottom of the main body bracket 9. The rotating turntable 13 rotates on the supporting turntable 12, and the central rotating column one 11 is rotatably connected to the supporting turntable 12;

[0069] Four placement grooves one 14 are provided on the rotating turntable 13. A plurality of adsorption holes 15 are provided in the placement grooves one 14. The plurality of adsorption holes 15 are all communicated with a communication chamber 16 provided in the rotating turntable 13. The lower end of the communication chamber 16 is communicated with a communication pipe 17. A cylinder 19 is slidably connected in the communication pipe 17, and the cylinder 19 is fixed in the rotating turntable 13;

[0070] Two baffles 20 are provided on both sides in the placement groove one 14. The two baffles 20 are both slidably connected to the rotating turntable 13. End blocks 21 are fixedly connected to the ends of the two baffles 20. A pull rod 22 is slidably connected in the end block 21. A spring one 23 is provided between the end block 21 and the pull rod 22. The lower end of the pull rod 22 is fixed with an insertion block 24. The insertion block 24 is inserted into a slot 25 provided on the rotating turntable 13. A triangular block 26 is provided on the end block 21, and the front end of the triangular block 26 points to a scale line 27 provided on the rotating turntable 13;

[0071] Working principle of the above technical solution: In the initial state, the placement groove two 37 with the substrate 1 placed therein is located at a preset position below the transfer assembly. The transfer assembly transfers the substrate 1 into the placement groove one 14 on the rotating turntable 13. The air cylinder 19 is started to drive the piston 18 to move backward in the connecting pipe 17, thereby increasing the space in the connecting chamber 16 and the connecting pipe 17. As a result, a negative pressure is formed in the connecting chamber 16 and the connecting pipe 17. With the external atmospheric pressure, the substrate 1 is tightly pressed in the placement groove one 14, ensuring that the substrate will not move easily when rotating with the rotating turntable 13, and guaranteeing the reliability of chip packaging;

[0072] Pull the pull rod 22 upward. The pull rod 22 slides upward in the end block 21, driving the first spring 23 to be stretched, driving the insertion block 24 to move upward, and driving the insertion block 24 to separate from the slot 25. Translate the pull rod 22 to drive the end block 21 and the baffle 20 to slide on the rotating turntable 13, thereby changing the width of the placement groove one 14, and then adapting to substrates 1 or chips of different widths. When the position of the baffle 20 is adjusted appropriately, release the upward pull restriction on the pull rod 22. Under the pulling force of the first spring 23, drive the pull rod 22 to move downward, drive the insertion block 24 to be inserted into the slot 25, thereby preventing the end block 21 and the baffle 20 from moving automatically, ensuring the structural stability. The distance between the two baffles 20 can be determined by the position pointed to by the triangular block 26 on the scale line 27, which can better adapt to the width of the substrate 1 or the chip.

[0073] Embodiment Seven

[0074] As Figures 1 - 16 shown, the transmission assembly includes a circular frame 29. The circular frame 29 is fixedly connected to the first central rotating column 11. The circular frame 29 is fixedly connected to the end of the support pipe 30. An inner sliding rod 31 is slidably connected in the support pipe 30. A second spring 32 is provided between the support pipe 30 and the inner sliding rod 31. A sliding column 33 is fixed to the end of the inner sliding rod 31. The sliding column 33 slides in the chute 28 provided at the bottom of the support turntable 12;

[0075] The sliding column 33 is slidably and fittingly connected in the groove on the function wheel 60. The circular frame 29 is slidably and fittingly connected to the edge of the function wheel 60. The function wheel 60 is fixedly connected to the second gear 59 through a connecting column 61. The connecting column 61 is rotatably connected to the main body bracket 9. The second gear 59 is in gear meshing transmission with the first gear 36;

[0076] Working principle of the above technical solution: In the initial state, the placement groove two 37 with the substrate 1 placed therein is located at a preset position below the transfer assembly. The transfer assembly transfers the first substrate 1 to the first placement groove one 14 on the rotary turntable 13. The first motor 10 is started to drive the central rotating column one 11 to rotate 90 degrees. The circular frame 29 slides on the edge of the functional wheel 60. The support tube 30 and the inner sliding rod 31 rotate with the central rotating column one 11. The sliding column 33 at the front end of the inner sliding rod 31 slides in the sliding groove 28. The rotary turntable 13 rotates 90 degrees. The transfer assembly transfers the second substrate 1 to the second placement groove one 14 on the rotary turntable 13. By driving the central rotating column one 11 to rotate another 90 degrees through the first motor 10, the circular frame 29 slides on the edge of the functional wheel 60. The support tube 30 and the inner sliding rod 31 rotate with the central rotating column one 11. The sliding column 33 at the front end of the inner sliding rod 31 slides in the sliding groove 28. The rotary turntable 13 rotates 90 degrees again. The transfer assembly transfers the third substrate 1 to the third placement groove one 14 on the rotary turntable 13. By driving the central rotating column one 11 to rotate another 90 degrees through the first motor 10, the circular frame 29 slides on the edge of the functional wheel 60. The support tube 30 and the inner sliding rod 31 rotate with the central rotating column one 11. The sliding column 33 at the front end of the inner sliding rod 31 slides in the sliding groove 28. The rotary turntable 13 rotates 90 degrees again. The transfer assembly transfers the fourth substrate 1 to the fourth placement groove one 14 on the rotary turntable 13. At this time, the central rotating column one 11 has rotated a total of 270 degrees, and there are substrates 1 in all four placement grooves one 14 on the rotary turntable 13;

[0077] When the substrate 1 is transferred below the dispensing device 63, the dispensing device 63 dispenses glue on the substrate 1;

[0078] By driving the central rotating column one 11 to rotate another 90 degrees through the first motor 10, the circular frame 29 separates from the edge of the functional wheel 60. The sliding column 33 slides into the groove on the functional wheel 60. After the sliding column 33 drives the functional wheel 60 to rotate 90 degrees, the sliding column 33 slides out of the groove on the functional wheel 60. The functional wheel 60 rotates 90 degrees and drives the second gear 59 to rotate 90 degrees through the connecting column 61, drives the first gear 36 to rotate 90 degrees, and drives the feeding turntable 34 to rotate 90 degrees. At this time, the placement groove two 37 with the first chip 2 placed therein is transferred to the preset position below the transfer assembly. The first chip 2 is transferred to the glued substrate 1 through the transfer assembly. As the rotary turntable 13 continuously rotates at intervals of 90 degrees, the four first chips 2 are sequentially transferred to the four substrates 1. When the substrate 1 with the first chip 2 attached is transferred below the wire bonding device 62, the wire bonding device 62 forms a bonding wire one 5 between the substrate 1 and the first chip 2;

[0079] Repeat the above operations. Glue is dispensed on the first chip 2, the second chip 3 falls on the first chip 2, and the wire bonding device 62 forms a bonding wire two 6 between the second chip 3 and the substrate 1;

[0080] Apply glue on the second chip 3, and the third chip 4 lands on the second chip 3. A bonding wire three 7 is formed between the third chip 4 and the substrate 1 through the gold wire bonding device 62;

[0081] Package the 3D vertical stacked package structure through the above solution, realizing that the rotating turntable 13 rotates 360 degrees and the loading turntable 34 rotates 90 degrees, ensuring the accuracy of loading and unloading, with high automation and fast production efficiency.

[0082] Embodiment Eight

[0083] As Figures 1 - 16 shown, the transfer component includes a second bracket 43. The lower end of the second bracket 43 is fixedly connected to the main bracket 9. The second bracket 43 is fixedly connected to a second motor 44. The output end of the second motor 44 is connected to a first rotating rod 45. The first rotating rod 45 is rotatably connected to a first slider 46. The first slider 46 slides within a swing rod 47. The lower end of the swing rod 47 is rotatably connected to the second bracket 43. A second slider 49 is slidably connected within the swing rod 47. The second slider 49 is rotatably connected to a second rotating rod 48. The second rotating rod 48 is fixedly connected to a functional block 53 through a connecting rod. The connecting rod rotates at the lower end of a support rod 52. A first connecting link 54 is slidably connected within the functional block 53. The end of the first connecting link 54 is rotatably connected to a bent frame 55. The bent frame 55 is slidably connected to a second connecting link 56. The second connecting link 56 is slidably connected to a long rod 57. A suction cup 58 is fixed to the lower end of the bent frame 55;

[0084] The long rod 57 is fixed to an upper bracket 50. The upper bracket 50 is fixedly connected to the second bracket 43. The upper bracket 50 is threadedly connected to a screw rod 51. The lower end of the screw rod 51 is rotatably connected to the support rod 52. The support rod 52 slides within the upper bracket 50;

[0085] The working principle of the above technical solution: Start the second motor 44, drive the first rotating rod 45 to rotate, drive the first slider 46 to slide within the swing rod 47, drive the lower end of the swing rod 47 to rotate with the second bracket 43, and the upper end of the swing rod 47 swings left and right. When the swing rod 47 swings towards the loading turntable 34, the swing rod 47 drives the second rotating rod 48 to rotate through the second slider 49, drives the functional block 53 to rotate, drives the first connecting link 54 to rotate, drives the bent frame 55 to move towards the loading turntable 3, drives the second connecting link 56 to slide on the long rod 57, the bent frame 55 slides up and down on the second connecting link 56, drives the suction cup 58 to move downwards, the suction cup 58 contacts the upper surface of the substrate 1, and adsorbs the substrate 1. The first rotating rod 45 continues to rotate, drives the swing rod 47 to rotate towards the rotating turntable 13, drives the second rotating rod 48 to rotate towards the rotating turntable 13, drives the functional block 53 and the first connecting link 54 to rotate towards the rotating turntable 13, drives the bent frame 55 to move towards the rotating turntable 13, drives the suction cup 58 to hold the substrate 1, and moves the substrate 1 into the first placement groove 14;

[0086] Rotate the screw rod 51 to drive the support rod 52 to rise or fall within the upper bracket 50, thereby changing the swing amplitude of the second rotating rod 48, further changing the width of the left and right movement of the bending frame 55, and further changing and adapting to the width between the first placement groove 14 and the second placement groove 37, ensuring the transfer accuracy of the substrate 1 or the chip.

[0087] It can be understood that the present invention is described through some embodiments. Those skilled in the art know that without departing from the spirit and scope of the present invention, various changes or equivalent replacements can be made to these features and embodiments. Additionally, under the teaching of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the scope protected by the present invention.

Claims

1. A 3D vertical stacked packaging structure, characterized in that, It includes a substrate (1), on which a first chip (2) is bonded. Bonding wires one (5) are provided between both ends of the first chip (2) and the substrate (1). A second chip (3) is bonded on the first chip (2). Bonding wires two (6) are provided between both ends of the second chip (3) and the substrate (1). A third chip (4) is bonded on the second chip (3). Bonding wires three (7) are provided between both ends of the third chip (4) and the substrate (1).

2. The 3D vertical stacking package structure according to claim 1, wherein Ball grid array (BGA) balls (8) are provided at the lower end of the substrate (1).

3. A 3D vertical stacked packaging structure according to claim 2, characterized in that, The widths of the first chip (2), the second chip (3), and the third chip (4) decrease in sequence.

4. A packaging process for a 3D vertical stacked packaging structure, which is used to package a 3D vertical stacked packaging structure according to any one of claims 1-3, characterized in that, It includes the following steps: S1. The substrate (1), the first chip (2), the second chip (3), and the third chip (4) are all stored in a rotary loading component. The substrate (1) is moved to a packaging table component through a transfer component. After the transfer component is driven by a first motor (10) to rotate 270 degrees, four substrates (1) are placed on the transfer component. S2. The transfer component is driven by the first motor (10) to continue rotating 90 degrees. A transmission component provided at the lower end of the transfer component drives the rotary loading component to rotate 90 degrees. The first chip (2) moves to the lower part of the transfer component. The first chip (2) is moved to the substrate (1) through the transfer component. S3. Glue is applied between the substrate (1) and the first chip (2) through a dispensing device (63). A bonding wire one (5) is formed between the substrate (1) and the first chip (2) through a gold wire bonding device (62).

5. The encapsulation process of a 3D vertical stacked package structure according to claim 4, characterized in that, The rotary loading component includes a loading turntable (34). A second central rotating column (35) is fixed at the central position of the loading turntable (34). The lower end of the second central rotating column (35) is fixedly connected to a first gear (36). The second central rotating column (35) is rotatably connected to a main body bracket (9). The first gear (36) is in meshing transmission with a transmission component gear. Four placing grooves two (37) are provided in the loading turntable (34). The substrate (1), the first chip (2), the second chip (3), and the third chip (4) are respectively stored in the four placing grooves two (37). One end of a third spring (38) is connected to the bottom of the placing groove two (37), and the other end of the third spring (38) is fixed on a lower support plate (39). Both sides in the placing groove two (37) are slidably connected with side support plates (41). A fourth spring (40) is provided between the side support plate (41) and the inner wall of the placing groove two (37). A bent clamping part (42) is provided at the upper end of the side support plate (41). The placing groove two (37) communicates with the outside through a side groove (65).

6. The packaging process of a 3D vertical stacking packaging structure according to claim 5, characterized in that, The packaging table component includes a rotating turntable (13). A first central rotating column (11) is fixed at the central position of the rotating turntable (13). The first central rotating column (11) is connected to the output end of the first motor (10). The first motor (10) is fixed at the bottom of the main body bracket (9). The rotating turntable (13) rotates on a supporting turntable (12). The first central rotating column (11) is rotatably connected to the supporting turntable (12).

7. The packaging process of a 3D vertical stacking packaging structure according to claim 6, characterized in that, The rotating turntable (13) is provided with four first placing grooves (14). A plurality of adsorption holes (15) are arranged in the first placing grooves (14). The plurality of adsorption holes (15) are all communicated with a communication chamber (16) arranged in the rotating turntable (13). The lower end of the communication chamber (16) is communicated with a communication pipe (17). A cylinder (19) is slidably connected in the communication pipe (17), and the cylinder (19) is fixed in the rotating turntable (13).

8. The packaging process of a 3D vertical stacked packaging structure according to claim 7, characterized in that, Both sides in the first placing groove (14) are provided with baffles (20). The two baffles (20) are both slidably connected with the rotating turntable (13). End blocks (21) are fixedly connected to the ends of the two baffles (20). A pull rod (22) is slidably connected in the end block (21). A first spring (23) is arranged between the end block (21) and the pull rod (22). The lower end of the pull rod (22) is fixed with an insertion block (24). The insertion block (24) is inserted into a slot (25) arranged on the rotating turntable (13). A triangular block (26) is arranged on the end block (21), and the front end of the triangular block (26) points to a scale line (27) arranged on the rotating turntable (13).

9. The packaging process of a 3D vertical stacking packaging structure according to claim 8, characterized in that, The transmission assembly includes a circular frame (29). The circular frame (29) is fixedly connected to the first central rotating column (11). The circular frame (29) is fixedly connected to the end of a support pipe (30). An inner sliding rod (31) is slidably connected in the support pipe (30). A second spring (32) is arranged between the support pipe (30) and the inner sliding rod (31). The end of the inner sliding rod (31) is fixed with a sliding column (33). The sliding column (33) slides in a chute (28) arranged at the bottom of the support turntable (12).

10. The packaging process of a 3D vertical stacked packaging structure according to claim 9, characterized in that, The sliding column (33) is slidably and fittingly connected in a groove on the functional wheel (60). The circular frame (29) is slidably and fittingly connected to the edge of the functional wheel (60). The functional wheel (60) is fixedly connected to a second gear (59) through a connecting column (61). The connecting column (61) is rotatably connected to the main body bracket (9). The second gear (59) is in gear meshing transmission with the first gear (36).

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