Anti-reverse diode for integrated circuit

Abstract

The invention provides an anti-reverse diode for an integrated circuit, and relates to the technical field of diodes, and the anti-reverse diode comprises an anti-reverse diode pedestal, the upper end part of the anti-reverse diode pedestal is provided with a mounting groove, the interior of the mounting groove is symmetrically provided with first slots, the upper end part of the anti-reverse diode pedestal is provided with a first inner groove, and the first inner groove is communicated with the first slots. A heat dissipation mechanism is fixedly mounted at the upper end part of the anti-reverse diode base; the heat dissipation mechanism comprises a heat dissipation plate body, the heat dissipation plate body is fixedly installed on the anti-reverse diode base, a containing groove is formed in the upper end of the heat dissipation plate body, a heat transfer block is installed in the containing groove through bolts, and a rectangular groove is formed in the heat transfer block. And internal elements are ensured to work in a proper temperature range, and the problems of performance reduction, frequent faults and the like caused by overheating are avoided, so that stable operation of equipment is ensured, and the reliability and stability of the equipment are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of diodes, and more specifically, particularly relates to an anti-reverse diode for integrated circuits. Background Art

[0002] In the field of electronic circuits, circuit boards play a vital role as the supporting basis for various electronic components. Anti-reverse diodes are commonly used electronic devices on circuit boards to prevent reverse current flow and ensure the normal operation of circuits. However, when used in conjunction with circuit boards, existing anti-reverse diodes have significant deficiencies in heat dissipation.

[0003] On the one hand, the current heat dissipation technology of the anti-reverse diode on the circuit board has limitations. In most cases, it relies on a single heat dissipation method, which is difficult to adapt to the diverse operating temperature conditions of the circuit board. For example, when the circuit board is used in equipment in a high-temperature environment, such as an electronic control system near a high-temperature industrial furnace, or equipment that is in a high-load operation state for a long time (such as a data center server circuit board that runs uninterruptedly), the traditional single heat dissipation method cannot effectively cope with the large amount of heat generated. Overheating of the anti-reverse diode will cause the performance of its internal components to deteriorate, which in turn affects the normal operation of the entire circuit board, and even causes equipment failure, reducing the stability and reliability of the circuit board and related equipment.

[0004] On the other hand, the installation method of the anti-reverse diode heat sink fins also has problems when combined with the circuit board. Existing heat sink fins are usually installed in the anti-reverse diode housing in a fixed vertical manner. However, the spatial layout on the circuit board is complex, and the heat dissipation space around the anti-reverse diode often presents an irregular shape. In this case, the fixed vertically installed heat sink fins will cause the formation of airflow dead zones in the anti-reverse diode housing, and the air cannot fully and fully contact the fin surface, making the heat exchange process insufficient, greatly reducing the heat dissipation efficiency, and ultimately affecting the heat dissipation effect of the anti-reverse diode on the circuit board, which has an adverse effect on the overall performance of the circuit board.

[0005] In summary, when the existing anti-reverse diode works in conjunction with the circuit board, its heat dissipation technology and heat sink fin installation method have obvious deficiencies. An innovative heat dissipation solution is urgently needed to improve the heat dissipation capacity of the anti-reverse diode in different circuit board working scenarios to ensure the stable operation of the circuit board and the reliable performance of the electronic equipment. Summary of the invention

[0006] In order to solve the above technical problems, the present invention provides an anti-reverse diode for integrated circuits to solve the above problems.

[0007] An anti-reverse diode for an integrated circuit, comprising an anti-reverse diode base. An installation groove is provided at the upper end of the anti-reverse diode base. First slots are symmetrically provided inside the installation groove. A first inner groove is provided at the upper end of the anti-reverse diode base, and the first inner groove communicates with the first slots. Second slots are symmetrically provided inside both of the first slots. First strip-shaped grooves are symmetrically provided on both side walls of the anti-reverse diode base. An anti-reverse diode housing is provided above the anti-reverse diode base. Heat dissipation grooves are provided on both side walls of the anti-reverse diode housing. An inner strip is fixedly installed inside the anti-reverse diode housing. First wedge-shaped blocks are evenly and equidistantly fixedly installed on the inner strip. Plug blocks are symmetrically and fixedly installed at the lower end of the anti-reverse diode housing. The two plug blocks are respectively adapted to the two first slots. Second inner grooves are provided inside both of the plug blocks. Second wedge-shaped blocks are symmetrically and slidably installed inside both of the second inner grooves. The two groups of second wedge-shaped blocks are respectively adapted to the two groups of second slots. A first spring is fixedly installed inside each group of second wedge-shaped blocks; A heat dissipation mechanism is fixedly installed at the upper end of the anti-reverse diode base; The heat dissipation mechanism includes a heat dissipation plate main body, which is fixedly installed on the anti-reverse diode base. A receiving groove is provided at the upper end of the heat dissipation plate main body. A heat transfer block is installed in the receiving groove through bolts. A rectangular groove is provided inside the heat transfer block.

[0008] Preferably, fixing columns are evenly and equidistantly fixedly installed inside the rectangular groove. A fin is rotatably installed on each fixing column.

[0009] Preferably, a wedge-shaped groove is provided on each fin, and each wedge-shaped groove corresponds to each first wedge-shaped block one by one.

[0010] Preferably, torsion springs are sleeved at both ends of each fixing column. Both ends of each torsion spring are respectively fixedly connected to the fin and the inner wall of the rectangular groove. A sliding frame is fixedly installed at the lower end of the heat dissipation plate main body.

[0011] Preferably, a positioning column is fixedly installed at the center of the first inner groove. The sliding frame is slidably sleeved on the positioning column.

[0012] Preferably, third wedge-shaped blocks are symmetrically arranged inside the first inner groove. Second strip-shaped grooves are provided inside both of the third wedge-shaped blocks.

[0013] Preferably, sliders are slidably installed at the centers of both of the second strip-shaped grooves. The two sliders are fixedly installed in the first inner groove.

[0014] Preferably, second springs are fixedly installed at both ends of the two sliders. The ends of the two groups of second springs away from the two sliders are respectively fixedly connected to the inner walls of the two second strip-shaped grooves.

[0015] Preferably, fixing bars are fixedly installed inside both groups of the first strip-shaped grooves. Inner columns are fixedly installed inside each fixing bar. Slide bars are slidably installed at both ends of each inner column. Each group of slide bars is respectively slidably installed in each first strip-shaped groove.

[0016] Preferably, third springs are sleeved at both ends of each inner column. Both ends of each group of third springs are fixedly connected to the fixing bar and the slide bar.

[0017] Compared with the prior art, the present invention has the following beneficial effects: In the present invention, by providing an anti-reverse diode base, an anti-reverse diode housing, heat dissipation grooves, insertion blocks, a heat dissipation plate main body, a sliding frame, positioning columns, third wedge-shaped blocks, and second springs, during the installation process, the two insertion blocks will squeeze the two third wedge-shaped blocks. The two third wedge-shaped blocks will slide towards the middle on the two sliders under the squeezing force. At this time, the second springs inside the two third wedge-shaped blocks will deform accordingly. At this time, the two third wedge-shaped blocks will squeeze both ends of the sliding frame to slide vertically upward on the positioning columns. The sliding frame will drive the heat dissipation plate main body to move upward. When the anti-reverse diode housing is installed, the position of the heat dissipation plate main body will be fixed in the middle of the heat dissipation grooves. At the same time, the heat dissipation plate main body will be separated from the anti-reverse diode base. At this time, the air circulation channels formed by the two heat dissipation grooves of the anti-reverse diode housing will be divided into two by the heat dissipation plate main body, distributed on the upper and lower sides of the heat dissipation plate main body. At this time, heat dissipation is carried out through the two channels, and at this time, the heat dissipation plate main body is in a suspended state, which also increases the heat dissipation area. Therefore, the heat dissipation efficiency is greatly improved; In the present invention, by providing an anti-reverse diode base, an anti-reverse diode housing, heat dissipation grooves, a heat dissipation plate main body, heat transfer blocks, and fins, the heat generated by the equipment operation will be transferred to the heat transfer blocks through the heat dissipation plate main body, and then transferred to multiple fins through the heat transfer blocks. Since the lower end of the heat dissipation plate main body is in contact with the anti-reverse diode base at this time, and the air circulation channels formed by the two heat dissipation grooves of the anti-reverse diode housing are located above the heat transfer blocks, the heat dissipated from the fins will be carried out by the air circulation at this time. Heat dissipation is completed in a normal operating environment. This heat dissipation design makes full use of the internal structure, constructs a reasonable heat transfer and air circulation path, does not require additional complex heat dissipation equipment, reduces costs, and through the function of switching between two heat dissipation methods, enables the equipment to maintain good heat dissipation performance under different temperature conditions, ensures that the internal components work within an appropriate temperature range, and avoids problems such as performance degradation and frequent failures caused by overheating, thereby ensuring the stable operation of the equipment and improving the reliability and stability of the equipment; In the present invention, by providing an anti - reverse diode housing, an inner strip, a first wedge - shaped block, a fixing post, fins, a wedge - shaped groove, and a torsion spring, when adjusting the heat dissipation channel, as the anti - reverse diode housing descends, the inner strip inside the anti - reverse diode housing will also descend accordingly. The first wedge - shaped block on the inner strip will move synchronously with it. Under the movement of the first wedge - shaped block, it will slide into the wedge - shaped groove. At this time, the fins will be subjected to a squeezing force and rotate on the fixing post, and the torsion spring fixed to it will be twisted accordingly. The fins will then change from a vertical state to an inclined state. By changing the fins to an inclined state, the inclined installation can increase the disturbance of air on the surface of the fins, avoid the occurrence of air - flow dead zones, and make the heat exchange between air and fins more sufficient. For an irregular heat - dissipation space similar to the anti - reverse diode housing, the inclined - installed fins may be more conducive to improving the overall heat - dissipation effect; In the present invention, by providing a first slot, a first strip - shaped groove, an anti - reverse diode housing, a second wedge - shaped block, a sliding strip, and a third spring, when the anti - reverse diode housing needs to be disassembled, at this time, the sliding strips at different heights can be pulled according to the state of the device. At this time, the two sliding strips will move towards the middle inside the first strip - shaped groove, and the two sliding strips will squeeze the two third springs to compress. At this time, under the sliding of the two sliding strips, the two groups of second wedge - shaped blocks will be squeezed and slide into the channels of the two first slots, and then the anti - reverse diode housing can be pulled out to complete the disassembly. Compared with the traditional complex disassembly method, there is no need to use a variety of tools for cumbersome disassembly work. Maintenance personnel can quickly start the maintenance or replacement of the anti - reverse diode housing components, significantly improving the efficiency of equipment maintenance; In the present invention, this solution designs the anti - reverse diode housing to be inserted into the installation groove and cooperates with installation sealant, improving the overall sealing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three - dimensional structural schematic diagram of the present invention; Figure 2 is an exploded structural schematic diagram of the connection of the anti - reverse diode housing of the present invention; Figure 3 is an exploded structural schematic diagram of the connection of the inner strip of the present invention; Figure 4 is an exploded structural schematic diagram of the connection of the heat - transfer block of the present invention; Figure 5 is an exploded structural schematic diagram of the connection of the fins of the present invention; Figure 6 is an exploded structural schematic diagram of the connection of the carriage of the present invention; Figure 7 is an exploded structural schematic diagram of the connection of the third wedge - shaped block of the present invention; Figure 8 is an exploded structural schematic diagram of the connection of the fixing strip of the present invention; Figure 9It is a schematic diagram of the anti - reverse diode base structure of the present invention; Figure 10 It is a schematic diagram of the slide bar connection structure of the present invention.

[0019] In the figure, the corresponding relationship between the component names and the attached drawing numbers is as follows: 11, anti - reverse diode base; 12, installation groove; 13, first slot; 14, first inner groove; 15, second slot; 16, first strip - shaped groove; 17, anti - reverse diode housing; 18, heat dissipation groove; 19, inner strip; 21, first wedge - shaped block; 22, insertion block; 23, second inner groove; 24, second wedge - shaped block; 25, first spring; 31, heat dissipation plate main body; 32, accommodation groove; 33, heat transfer block; 34, rectangular groove; 35, fixing column; 36, fin; 37, wedge - shaped groove; 38, torsion spring; 39, sliding frame; 41, positioning column; 42, third wedge - shaped block; 43, second strip - shaped groove; 44, slider; 45, second spring; 51, fixing strip; 52, inner column; 53, slide bar; 54, third spring. Specific embodiments

[0020] The following further describes the embodiments of the present invention in detail in conjunction with the attached drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0021] Please refer to Figures 1 - 10 , the present invention provides an anti - reverse diode for integrated circuits, including an anti - reverse diode base 11. An installation groove 12 is opened at the upper end of the anti - reverse diode base 11. First slots 13 are symmetrically opened inside the installation groove 12. A first inner groove 14 is opened at the upper end of the anti - reverse diode base 11, and the first inner groove 14 is communicated with the first slots 13. Second slots 15 are symmetrically opened inside both first slots 13. First strip - shaped grooves 16 are symmetrically opened on both side walls of the anti - reverse diode base 11. An anti - reverse diode housing 17 is arranged above the anti - reverse diode base 11. Heat dissipation grooves 18 are opened on both side walls of the anti - reverse diode housing 17. An inner strip 19 is fixedly installed inside the anti - reverse diode housing 17. First wedge - shaped blocks 21 are evenly and equidistantly fixedly installed on the inner strip 19. Insertion blocks 22 are symmetrically fixedly installed at the lower end of the anti - reverse diode housing 17. The two insertion blocks 22 are respectively adapted to the two first slots 13. Second inner grooves 23 are opened inside both insertion blocks 22. Second wedge - shaped blocks 24 are symmetrically slidably installed inside both second inner grooves 23. The two groups of second wedge - shaped blocks 24 are respectively adapted to the two groups of second slots 15. A first spring 25 is fixedly installed inside each group of second wedge - shaped blocks 24; A heat dissipation mechanism is fixedly installed at the upper end of the anti - reverse diode base 11; The heat dissipation mechanism includes a heat dissipation plate main body 31, which is fixedly installed on the anti - reverse diode base 11. An accommodation groove 32 is formed at the upper end of the heat dissipation plate main body 31. A heat transfer block 33 is installed in the accommodation groove 32 through bolts. A rectangular groove 34 is formed inside the heat transfer block 33. Fixed columns 35 are evenly and equidistantly fixedly installed inside the rectangular groove 34. A fin 36 is rotatably installed on each fixed column 35. A wedge - shaped groove 37 is formed on each fin 36. Each wedge - shaped groove 37 corresponds to each first wedge - shaped block 21 one by one. A torsion spring 38 is sleeved at both ends of each fixed column 35. Both ends of each torsion spring 38 are fixedly connected to the fin 36 and the inner wall of the rectangular groove 34 respectively. A sliding frame 39 is fixedly installed at the lower end of the heat dissipation plate main body 31. During use, the heat transfer block 33 can be first installed in the accommodation groove 32 through bolts, and then the heat dissipation plate main body 31 can be installed inside the anti - reverse diode base 11. At this time, the sliding frame 39 will also be inserted onto the positioning column 41, and at this time, the installation of the heat dissipation plate main body 31 is completed. At this time, sealant can be adhered to the connection part between the anti - reverse diode housing 17 and the anti - reverse diode base 11 to seal the connection part. Then, the anti - reverse diode housing 17 can be inserted into the installation groove 12. At this time, the two insertion blocks 22 on the anti - reverse diode housing 17 will be inserted into the two first slots 13 accordingly. At this time, the two groups of second wedge - shaped blocks 24 inside the insertion blocks 22 will be subjected to extrusion force and slide towards the middle in the second inner groove 23. At this time, the two first springs 25 will be compressed accordingly. When the two groups of second wedge - shaped blocks 24 slide to the position level with the second slot 15 at the upper end, the first spring 25 will restore its deformation and spring the two groups of second wedge - shaped blocks 24 into the second slot 15 to complete the clamping. At this time, the anti - reverse diode housing 17 will also just be immersed in the installation groove 12. At this time, the heat generated by the equipment operation will be transferred to the heat transfer block 33 through the heat dissipation plate main body 31, and then transferred to multiple fins 36 through the heat transfer block 33. Since the lower end of the heat dissipation plate main body 31 is in contact with the anti - reverse diode base 11 at this time, and the air circulation channel formed by the two heat dissipation slots 18 on the anti - reverse diode housing 17 is located above the heat transfer block 33, the air circulation will carry out the heat dissipated from the fins 36 at this time, and complete heat dissipation in the normal operation environment. This heat dissipation design makes full use of the internal structure, constructs a reasonable heat transfer and air circulation path, does not require additional complex heat dissipation equipment, reduces costs, and through the design of the function of switching between two heat dissipation methods, enables the equipment to maintain good heat dissipation performance under different temperature conditions, ensures that the internal components work within a suitable temperature range, avoids problems such as performance degradation and frequent failures caused by overheating, thereby ensuring the stable operation of the equipment and improving the reliability and stability of the equipment;When adjusting the heat dissipation channel, as the anti - reverse diode housing 17 descends, the inner strip 19 inside the anti - reverse diode housing 17 will also descend accordingly. The first wedge - shaped block 21 on the inner strip 19 will move synchronously with it. Under the movement of the first wedge - shaped block 21, it will slide into the wedge - shaped groove 37. At this time, the fin 36 will be subjected to a squeezing force and rotate on the fixed column 35, and the torsion spring 38 fixed to it will be distorted accordingly. The fin 36 will then change from a vertical state to an inclined state. By changing the fin 36 to an inclined state, the inclined installation can increase the disturbance of air on the surface of the fin 36, avoid the occurrence of air - flow dead zones, and make the heat exchange between air and the fin 36 more sufficient. For an irregular heat - dissipation space similar to the anti - reverse diode housing 17, the inclined - installed fins 36 may be more conducive to improving the overall heat - dissipation effect; A positioning column 41 is fixedly installed at the center inside the first inner groove 14. The carriage 39 is slidably sleeved on the positioning column 41. Third wedge - shaped blocks 42 are symmetrically arranged inside the first inner groove 14. Second strip - shaped grooves 43 are opened inside both of the two third wedge - shaped blocks 42. Sliders 44 are slidably installed at the centers inside the two second strip - shaped grooves 43. Both of the two sliders 44 are fixedly installed in the first inner groove 14. Second springs 45 are fixedly installed at both ends of both of the two sliders 44. The ends of the two groups of second springs 45 away from the two sliders 44 are respectively fixedly connected to the inner walls of the two second strip - shaped grooves 43. When the diode operates for a long time in a high - temperature environment, the anti - reverse diode housing 17 can be further pressed down at this time. At this time, the principle is the same as in step one, and the two groups of second wedge - shaped blocks 24 will pop into the second slots 15 at the lower end. During this process, the two plug blocks 22 will squeeze the two third wedge - shaped blocks 42. The two third wedge - shaped blocks 42 will slide towards the middle on the two sliders 44 under the squeezing force. At this time, the second springs 45 inside the two third wedge - shaped blocks 42 will be deformed accordingly. At this time, the two third wedge - shaped blocks 42 will squeeze both ends of the carriage 39 to slide vertically upward on the positioning column 41. The carriage 39 will drive the heat - dissipation plate main body 31 to move upward. When the anti - reverse diode housing 17 is installed, the position of the heat - dissipation plate main body 31 will be fixed in the middle of the heat - dissipation groove 18. At the same time, the heat - dissipation plate main body 31 will be separated from the anti - reverse diode base 11. At this time, the air - flow channel formed by the two heat - dissipation grooves 18 of the anti - reverse diode housing 17 will be divided into two by the heat - dissipation plate main body 31, distributed on the upper and lower sides of the heat - dissipation plate main body 31. At this time, heat dissipation is carried out through the two channels, and at this time, the heat - dissipation plate main body 31 is in a suspended state, which also increases the heat - dissipation area. Therefore, the heat - dissipation efficiency is greatly improved; Fixed bars 51 are fixedly installed inside both sets of first strip-shaped grooves 16. Inner columns 52 are fixedly installed inside each fixed bar 51. Slide bars 53 are slidably installed at both ends of each inner column 52. Each set of slide bars 53 is respectively slidably installed in each first strip-shaped groove 16. Third springs 54 are sleeved at both ends of each inner column 52. Both ends of each set of third springs 54 are fixedly connected to the fixed bar 51 and the slide bar 53. When the anti-reverse diode housing 17 needs to be disassembled, at this time, the slide bars 53 at different heights can be pulled according to the state of the device. At this time, the two slide bars 53 will move towards the middle inside the first strip-shaped groove 16. The two slide bars 53 will squeeze the two third springs 54 to compress. At this time, under the sliding of the two slide bars 53, the two sets of second wedge-shaped blocks 24 will be squeezed and slide into the channels of the two first slots 13. Then the anti-reverse diode housing 17 can be pulled out to complete the disassembly. Compared with the traditional complex disassembly method, there is no need to use a variety of tools for cumbersome disassembly work. Maintenance personnel can quickly start the maintenance or replacement of the anti-reverse diode housing 17 components, significantly improving the efficiency of equipment maintenance.

[0022] Working principle: First step, when in use, the heat transfer block 33 can be first installed in the receiving groove 32 through bolts, and then the heat dissipation plate body 31 can be installed inside the anti - reverse diode base 11. At this time, the carriage 39 will also be inserted onto the positioning post 41 accordingly. At this time, the installation of the heat dissipation plate body 31 will be completed. At this time, sealant can be adhered to the anti - reverse diode housing 17 (at the connection part with the anti - reverse diode base 11) to seal the connection part between the two. Then, the anti - reverse diode housing 17 can be inserted into the installation groove 12. At this time, the two insertion blocks 22 on the anti - reverse diode housing 17 will be inserted into the two first slots 13 accordingly. At this time, the two groups of second wedge - shaped blocks 24 inside the insertion blocks 22 will be subjected to extrusion force and slide towards the middle in the second inner groove 23. At this time, the two first springs 25 will be compressed accordingly. When the two groups of second wedge - shaped blocks 24 slide to a position level with the second slots 15 at the upper end, at this time, the first springs 25 will recover their deformation and spring the two groups of second wedge - shaped blocks 24 into the second slots 15 to complete the clamping. At this time, the anti - reverse diode housing 17 will also just be submerged in the installation groove 12. At this time, the heat generated by the equipment operation will be transferred from the heat dissipation plate body 31 to the heat transfer block 33, and then transferred to the multiple fins 36 through the heat transfer block 33. Since the lower end of the heat dissipation plate body 31 is in contact with the anti - reverse diode base 11 at this time, and the air circulation channel formed by the two heat dissipation grooves 18 on the anti - reverse diode housing 17 is located above the heat transfer block 33, at this time, the air circulation will take out the heat dissipated from the fins 36 and complete heat dissipation in a normal operation environment. This heat dissipation design makes full use of the internal structure, constructs a reasonable heat transfer and air circulation path, does not require additional complex heat dissipation equipment, reduces costs, and through the design of the function of switching between two heat dissipation methods, enables the equipment to maintain good heat dissipation performance under different temperature conditions, ensures that the internal components work within a suitable temperature range, and avoids problems such as performance degradation and frequent failures caused by overheating, thereby ensuring the stable operation of the equipment and improving the reliability and stability of the equipment; Second step, when the diode operates for a long time in a high-temperature environment, the anti-reverse diode housing 17 can be further pressed downwards at this time. The principle is the same as that in the first step, and the two groups of second wedge-shaped blocks 24 will pop into the second slots 15 at the lower end. During this process, the two insertion blocks 22 will squeeze the two third wedge-shaped blocks 42. The two third wedge-shaped blocks 42 will slide towards the middle on the two sliders 44 under the squeezing force. At this time, the second springs 45 inside the two third wedge-shaped blocks 42 will deform accordingly. At this time, the two third wedge-shaped blocks 42 will squeeze both ends of the carriage 39 to slide vertically upwards on the positioning posts 41. The carriage 39 will drive the heat dissipation plate body 31 to move upwards. When the anti-reverse diode housing 17 is installed, the position of the heat dissipation plate body 31 will be fixed in the middle of the heat dissipation slots 18. At the same time, the heat dissipation plate body 31 will be separated from the anti-reverse diode base 11. At this time, the air circulation channel formed by the two heat dissipation slots 18 of the anti-reverse diode housing 17 will be divided into two by the heat dissipation plate body 31, distributed on the upper and lower sides of the heat dissipation plate body 31. At this time, heat dissipation is carried out through the two channels, and at this time, the heat dissipation plate body 31 is in a suspended state, which also increases the heat dissipation area. Therefore, the heat dissipation efficiency is greatly improved; Third step, when adjusting the heat dissipation channel, at this time, as the anti-reverse diode housing 17 descends, the inner strip 19 inside the anti-reverse diode housing 17 will also descend accordingly, and the first wedge-shaped block 21 on the inner strip 19 will also move synchronously with it. Under the movement of the first wedge-shaped block 21, it will slide into the wedge-shaped groove 37. At this time, the fin 36 will rotate on the fixed post 35 under the squeezing force, and the torsion spring 38 fixed to it will be twisted accordingly. The fin 36 will then change from a vertical state to an inclined state. By changing the fin 36 to an inclined state, the inclined installation can increase the disturbance of the air on the surface of the fin 36, avoid the occurrence of air flow dead zones, and make the heat exchange between the air and the fin 36 more sufficient. For an irregular heat dissipation space similar to the anti-reverse diode housing 17, the inclined fins 36 may be more conducive to improving the overall heat dissipation effect; Fourth step, when the anti-reverse diode housing 17 needs to be disassembled, the slide bars 53 at different heights can be pulled according to the state of the device at this time. At this time, the two slide bars 53 will move towards the middle inside the first strip-shaped groove 16. The two slide bars 53 will squeeze the two third springs 54 to compress. At this time, under the sliding of the two slide bars 53, they will squeeze the two groups of second wedge-shaped blocks 24 to make them slide into the channels of the two first slots 13, and then the anti-reverse diode housing 17 can be pulled out to complete the disassembly. Compared with the traditional complex disassembly method, there is no need to use a variety of tools for cumbersome disassembly work. The maintenance personnel can quickly start the maintenance or replacement of the anti-reverse diode housing 17 components, significantly improving the efficiency of equipment maintenance; Fifth step, this solution improves the overall sealing performance by designing the anti-reverse diode housing 17 to be inserted into the installation groove 12 and cooperating with the installation sealant.

[0023] The embodiments of the present invention are provided by way of example and description, and are not exhaustive or limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better illustrate the principles of the present invention and its practical applications, and to enable those of ordinary skill in the art to understand the present invention so as to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. An anti-reverse diode for an integrated circuit, comprising an anti-reverse diode base (11), wherein an installation groove (12) is formed at the upper end of the anti-reverse diode base (11), and is characterized in that: The inner part of the installation groove (12) is symmetrically provided with first slots (13). The upper end of the anti - reverse diode base (11) is provided with a first inner groove (14). The first inner groove (14) communicates with the first slots (13). The two first slots (13) are symmetrically provided with second slots (15) inside. The two side walls of the anti - reverse diode base (11) are symmetrically provided with first strip - shaped grooves (16). Among them, an anti - reverse diode housing (17) is arranged above the anti - reverse diode base (11). Heat dissipation grooves (18) are provided on the two side walls of the anti - reverse diode housing (17). An inner strip (19) is fixedly installed inside the anti - reverse diode housing (17). First wedge - shaped blocks (21) are evenly and equidistantly fixedly installed on the inner strip (19). Plug blocks (22) are symmetrically and fixedly installed at the lower end of the anti - reverse diode housing (17). The two plug blocks (22) are respectively adapted to the two first slots (13). Second inner grooves (23) are provided inside the two plug blocks (22). Second wedge - shaped blocks (24) are symmetrically and slidably installed inside the two second inner grooves (23). The two groups of second wedge - shaped blocks (24) are respectively adapted to the two groups of second slots (15). A first spring (25) is fixedly installed inside each group of second wedge - shaped blocks (24). A heat dissipation mechanism is fixedly installed at the upper end of the anti - reverse diode base (11). The heat dissipation mechanism includes a heat dissipation plate main body (31). The heat dissipation plate main body (31) is fixedly installed on the anti - reverse diode base (11). A receiving groove (32) is provided at the upper end of the heat dissipation plate main body (31). A heat transfer block (33) is installed in the receiving groove (32) through bolts. A rectangular groove (34) is provided inside the heat transfer block (33).

2. The anti - reverse diode for an integrated circuit according to claim 1, wherein, Fixed columns (35) are evenly and equidistantly fixedly installed inside the rectangular groove (34). Among them, fins (36) are rotatably installed on each fixed column (35).

3. The anti - reverse diode for an integrated circuit according to claim 2, characterized in that, Each fin (36) is provided with a wedge - shaped groove (37). Among them, each wedge - shaped groove (37) corresponds to each first wedge - shaped block (21) one by one.

4. The anti-reverse diode for an integrated circuit according to claim 3, wherein Torsion springs (38) are sleeved at both ends of each fixed column (35). Both ends of each torsion spring (38) are fixedly connected to the fin (36) and the inner wall of the rectangular groove (34) respectively. Among them, a sliding frame (39) is fixedly installed at the lower end of the heat dissipation plate main body (31).

5. The anti-reverse diode for an integrated circuit according to claim 4, characterized in that, A positioning column (41) is fixedly installed at the center of the first inner groove (14). Among them, the sliding frame (39) is slidably sleeved on the positioning column (41).

6. The anti-reverse diode for an integrated circuit according to claim 5, wherein Third wedge - shaped blocks (42) are symmetrically arranged inside the first inner groove (14). Among them, second strip - shaped grooves (43) are provided inside the two third wedge - shaped blocks (42).

7. The anti-reverse diode for an integrated circuit according to claim 6, wherein Sliders (44) are slidably installed at the centers of the two second strip - shaped grooves (43). Among them, the two sliders (44) are fixedly installed in the first inner groove (14).

8. The anti - reverse diode for an integrated circuit according to claim 7, wherein, Second springs (45) are fixedly installed at both ends of the two sliders (44). One end of each of the two groups of the second springs (45) away from the two sliders (44) is fixedly connected to the inner walls of the two second strip-shaped grooves (43), respectively.

9. The anti - reverse diode for an integrated circuit according to claim 1, characterized in that, Fixing bars (51) are fixedly installed inside each of the two groups of the first strip-shaped grooves (16), and inner columns (52) are fixedly installed inside each of the fixing bars (51). Sliding bars (53) are slidably installed at both ends of each of the inner columns (52), and each group of the sliding bars (53) is slidably installed in each of the first strip-shaped grooves (16), respectively.

10. The anti-reverse diode for an integrated circuit according to claim 9, wherein, Third springs (54) are sleeved at both ends of each of the inner columns (52). One end of each group of the third springs (54) is fixedly connected to the fixing bar (51) and the sliding bar (53), respectively.

Images