Packaging structure and preparation method thereof
By directly connecting the first conductive structure and the second conductive structure in the stacked package, the problems of poor welding and limited number of ports are solved, and more efficient electrical connections and a smaller package structure are achieved.
Patent Information
- Application Number
- CN202410064830.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-16
- Publication Date
- 2025-07-25
AI Technical Summary
In stacked packages, different warping directions are different due to different heated states, resulting in poor soldering, and the ball spacing limits the number of input and output ports.
The first conductive structure and the second conductive structure are used to directly electrically connect the first element and the second element, eliminating solder ball connections, and forming an electrical connection through the rewiring layer process, reducing the number of reflow soldering times, and increasing the number of input and output interfaces of the package structure.
Reduces the risk of component warping during packaging, increases the number of input and output ports, and simplifies the assembly process of the packaging structure.
Smart Images
Figure CN120376556A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, and in particular to a packaging structure and a preparation method thereof. Background Art
[0002] In the semiconductor industry, package-on-package (POP) is widely used. The POP packaging method can re-integrate various packages with the same shape and different functions, which is a kind of 3D system-level packaging technology. It can improve the chip performance while saving the space occupied by the chip on the circuit board, and is one of the development trends of the system-level packaging technology.
[0003] In the POP packaging method, the chip can be an active component, such as a logic chip, a memory chip, an image sensor chip or a microelectromechanical chip; the chip can also be a passive component, such as a resistor, a capacitor or an inductor. First, various chips are integrated into a SIP (System In Package) product according to the functions required by the integrated circuit (IC) product. The packages with different functions are stacked on top of each other, and solder balls are used to bond the multi-layer packages, thereby forming an integrated packaging structure. However, when using solder balls for packaging, since the heat states of various chip packages are different due to their different structures from other packages, the warping directions of each package are different during the reflow soldering process, resulting in poor soldering of the packaging structure; at the same time, when using solder balls for soldering, the distance between each package and the solder ball metal pad needs to be at least 0.3 mm or more, and there also needs to be a certain distance between solder balls to avoid bridging of solder balls during the reflow process, which limits the number of input / output ports (IO pins) of the packaging structure. Summary of the Invention
[0004] In view of this, this application provides a packaging structure and a preparation method thereof to solve the above problems.
[0005] The present application provides a packaging structure, including a first encapsulant, a second encapsulant, a first component, and a second component. The first encapsulant includes a first surface and a second surface disposed opposite to each other. A plurality of first conductive structures are provided in the first encapsulant, and some of the first conductive structures are exposed on the second surface; the first component is embedded in the first encapsulant, and the first conductive structures exposed on the second surface are electrically connected to the first component; the second encapsulant is disposed on the first encapsulant. The second encapsulant includes a third surface facing the second surface and a fourth surface disposed opposite to the third surface. A plurality of second conductive structures are provided in the second encapsulant, and some of the second conductive structures are exposed on the third surface and the fourth surface. The second conductive structures exposed on the third surface are electrically connected to the first conductive structures exposed on the second surface; the second component is embedded in the second encapsulant, and the second conductive structures exposed on the fourth surface are electrically connected to the second component, so that the first component and the second component are electrically connected through the first conductive structures and the second conductive structures.
[0006] In some embodiments, the first encapsulant includes a first block and a second block disposed on the first block. The surface of the first block facing away from the second block is the first surface, and the surface of the second block facing away from the first block is the second surface. The first component is embedded in the first block. The first conductive structure includes a first conductive portion disposed in the first block and a second conductive portion disposed in the second block and connected to the first conductive portion. The first conductive portion is exposed on the first surface, and the second conductive portion is exposed on the second surface and electrically connected to the first component.
[0007] In some embodiments, the second encapsulant includes a third encapsulation block and a fourth encapsulation block disposed on the third encapsulation block. The third encapsulation block is disposed on the first encapsulant. The surface of the third encapsulation block facing away from the fourth encapsulation block is the third surface, and the surface of the fourth encapsulation block facing away from the third encapsulation block is the fourth surface. The second component is embedded in the fourth encapsulation block. The second conductive structure includes a third conductive portion disposed in the third encapsulation block and a fourth conductive portion disposed in the fourth encapsulation block and connected to the third conductive portion. The third conductive portion is exposed on the third surface and electrically connected to the first conductive structure, and the fourth conductive portion is exposed on the fourth surface and electrically connected to the second component.
[0008] In some embodiments, the third encapsulation block has a hollow portion. The first encapsulant and the fourth encapsulation block respectively seal two sides of the hollow portion. The packaging structure further includes a third component disposed on the second surface, and the third component is placed in the hollow portion and electrically connected to the first component.
[0009] In some embodiments, a dielectric layer is provided on the first surface. A plurality of third conductive structures are provided in the dielectric layer. The third conductive structures are exposed on the dielectric layer and electrically connected to the first conductive structures. Solder balls electrically connected to the third conductive structures are further provided on the bottom surface of the dielectric layer.
[0010] In some embodiments, a first electrical connector is provided on a surface of the second component facing away from the first encapsulation body. Part of the second encapsulation body covers the first electrical connector, and the second conductive structure is electrically connected to the second component through the first electrical connector.
[0011] In some embodiments, a protective cover is further provided on a surface of the second encapsulation body away from the first encapsulation body.
[0012] The present application also provides a method for manufacturing an encapsulation structure. The manufacturing method includes: disposing a first component and a first encapsulation body on a carrier plate, with the first component embedded in the first encapsulation body. The first encapsulation body includes a first surface and a second surface that are oppositely disposed; forming a plurality of first channels in the first encapsulation body, with one end of each first channel extending to the first component; disposing a first conductive structure in the first channels, with part of the first conductive structure exposed on the second surface and electrically connected to the first component; disposing a second encapsulation body on the first encapsulation body, with a second component embedded in the second encapsulation body. The second encapsulation body includes a third surface facing the second surface and a fourth surface opposite to the third surface; forming a plurality of second channels in the second encapsulation body, with one end of each second channel extending to the second component; disposing a second conductive structure in the second channels, with part of the second conductive structure exposed on the third surface and electrically connected to the first conductive structure exposed on the second surface, and part of the second conductive structure exposed on the fourth surface. The second conductive structure exposed on the fourth surface is electrically connected to the second component, and the first component and the second component are electrically connected through the first conductive structure and the second conductive structure; removing the carrier plate to obtain the encapsulation structure.
[0013] In some embodiments, the method for disposing the first conductive structure in the first channels includes: disposing a conductive material in the first channels and curing the conductive material to form the first conductive structure in the first channels.
[0014] In some embodiments, the conductive material includes at least one of conductive ink, conductive ink or conductive paste.
[0015] In some embodiments, the step of disposing the first component and the first encapsulation body on the carrier plate includes: disposing the first component on the carrier plate and disposing a first encapsulation preform on the carrier plate, with the first encapsulation preform located on the sidewall of the first component; curing the first encapsulation preform to obtain a first block; forming a plurality of first holes in the first block, with the first holes penetrating the first block along the stacking direction, and disposing a first conductive part in the first holes; disposing a second block on the first block and the first component, with the first block and the second block constituting the first encapsulation body; forming a plurality of first grooves in the second block and disposing a second conductive part in the first grooves. The first holes and the first grooves constitute the first channels, and the first conductive part and the second conductive part are electrically connected and constitute the first conductive structure.
[0016] In some embodiments, before removing the carrier board, the preparation method further includes: disposing a third component on the first encapsulant, and a third encapsulation block is further provided on the first encapsulant. A plurality of second holes are formed in the third encapsulation block, and a conductive material is disposed in the second holes to form a third conductive portion in the second holes. The third conductive portion is electrically connected to the first conductive structure; a second component and a fourth encapsulation block are disposed on the support board, the third component is embedded in the fourth encapsulation block, and a plurality of connection channels are formed in the fourth encapsulation block; a conductive material is disposed in the connection channels to form a fourth conductive portion in the connection channels, and the fourth conductive portion is electrically connected to the second component; the support board is removed to obtain an intermediate body; the fourth encapsulation block in the intermediate body is disposed on the third encapsulation block, the third encapsulation block and the fourth encapsulation block constitute a second encapsulant, and the third conductive portion and the fourth conductive portion are electrically connected and constitute a second conductive structure.
[0017] In some embodiments, an adhesive layer is further disposed between the third encapsulation block and the fourth encapsulation block.
[0018] In some embodiments, after removing the carrier board, the preparation method further includes: disposing a dielectric layer on a surface of the first encapsulant facing away from the second encapsulant, and a plurality of third channels are formed in the dielectric layer; a conductive material is disposed in the third channels to form a third conductive structure in the third channels; solder balls are welded on a surface of the dielectric layer, and the solder balls are electrically connected to the third conductive structure.
[0019] In some embodiments, the second component has a first electrical connector located on a surface of the second component facing away from the first encapsulant. The preparation method further includes: the second encapsulant at least covers the first electrical connector.
[0020] In some embodiments, the method for embedding the second component in the second encapsulant includes: fixing the second component on the first encapsulant, and a second encapsulation preform is further provided on the first encapsulant, and the second encapsulation preform at least covers the first electrical connector; the second encapsulation preform is cured to obtain the second encapsulant.
[0021] In some embodiments, a protective cover is further provided on a surface of the second encapsulant away from the first encapsulant.
[0022] In this application, the electrical connection between the first component and the second component is realized through the electrical connection between the first conductive structure and the second conductive structure, and the first conductive structure and the second conductive structure are directly electrically connected. Compared with the method of encapsulation using solder balls, the solder balls are omitted at the connection between the first conductive structure and the second conductive structure in this application. Therefore, during the encapsulation process, the number of reflow soldering can be reduced, thereby reducing the risk of warping of the first component and the second component when the first conductive structure and the second conductive structure are electrically connected. Since the number of input / output interfaces of the encapsulation structure is not limited by the pitch between the solder balls, the number of input / output ports in the encapsulation structure can also be increased. Description of the Drawings
[0023] Figure 1 Schematic structural diagram of a packaging structure provided by an embodiment of the present application.
[0024] Figure 2 In (a), it is a schematic structural diagram of arranging a first element and a first plastic encapsulation preform on a carrier board; Figure 2 In (b), it is a schematic structural diagram of the first block obtained after curing the first plastic encapsulation preform in (a); Figure 2 In (c), it is a schematic structural diagram of opening a first hole in the first block in (b).
[0025] Figure 3 It is Figure 2 Schematic structural diagram after arranging a first conductive part in the first hole in (c).
[0026] Figure 4 It is in Figure 3 Top view observed along the stacking direction after forming the first conductive part.
[0027] Figure 5 In (a), it is a schematic structural diagram of arranging a second plastic encapsulation preform on the first block; Figure 5 In (b), it is a schematic structural diagram of the second block obtained after curing the second plastic encapsulation preform in (a).
[0028] Figure 6 It is in Figure 5 Schematic structural diagram after opening a first groove in the second block.
[0029] Figure 7 In (a), it is Figure 6 Schematic structural diagram after arranging a second conductive part in the first groove; Figure 7 In (b), it is a top view observed along the stacking direction after forming the second conductive part.
[0030] Figure 8 It is in Figure 7 Schematic structural diagram of arranging a third element in (a).
[0031] Figure 9 It is Figure 8 Schematic structural diagram of arranging a third plastic encapsulation block on the first plastic encapsulation body.
[0032] Figure 10 It is Figure 9 Schematic structural diagram after forming a third conductive part in the third plastic encapsulation block.
[0033] Figure 11 In (a), it is a schematic structural diagram of arranging a second element and a fourth plastic encapsulation block on a support board; Figure 11In (b) is a schematic structural view of a connection channel formed on the fourth encapsulation block; Figure 11 In (c) is a schematic structural view after a fourth conductive part is arranged in the connection channel of (b) and the support plate is removed; Figure 11 In (d) is a schematic structural view of a groove formed on the surface of the third block of (c) facing away from the fourth surface and an eighth conductive part arranged;
[0034] Figure 12 is Figure 11 the intermediate obtained from (c) in and Figure 10 the schematic structural view after being assembled with the third encapsulation block of
[0035] Figure 13 is in Figure 12 the schematic structural view after the carrier plate is removed.
[0036] Figure 14 is a schematic structural view of an encapsulation structure provided by another embodiment of the present application.
[0037] Figure 15 is in Figure 7 the schematic structural view of arranging a second element in (a) in another embodiment.
[0038] Figure 16 is in Figure 15 the schematic structural view of arranging a second encapsulation body on the second block of
[0039] Figure 17 is in Figure 16 the schematic structural view of arranging a protective cover on the second encapsulation body of
[0040] Main element symbol description
[0041] Encapsulation structures 100, 100'
[0042] First encapsulation body 10
[0043] First block 11
[0044] First hole 111
[0045] Second block 12
[0046] First groove 121
[0047] Second groove 122 First channel 13 First conductive structure 14 First conductive part 141 Second conductive part 142 Fifth conductive part 143 First surface 151 Second surface 152 First component 20 Second electrical connector 21 Second component 30 First electrical connector 31 Adhesive layer 32 Second encapsulant 40 Second channel 41 Second conductive structure 42 Third conductive part 421 Fourth conductive part 422 Third encapsulant block 43
[0048] Second hole 431 Hollow part 432
[0049] Seventh conductive part 433 Fourth encapsulant block 44 Connection channel 441
[0050] Third hole 4411
[0051] Third groove 4412
[0052] Third block 442
[0053] Eighth conductive part 4421
[0054] Fourth block 443
[0055] Extension block 45
[0056] Third surface 461
[0057] Fourth surface 462
[0058] Sixth conductive part 47
[0059] Third component 50
[0060] Third electrical connector 51
[0061] Protective cover 60
[0062] Dielectric layer 71
[0063] Third channel 711
[0064] Third conductive structure 712
[0065] Solder ball 713
[0066] Electrical connection part 81
[0067] Reinforcement layer 82
[0068] Receiving hole 821
[0069] First plastic encapsulation preform 1
[0070] Second plastic encapsulation preform 2
[0071] Carrier plate 3
[0072] Support plate 4
[0073] Intermediate body 5
[0074] Bonding layer 7
[0075] Adhesive layer 8 Specific implementation mode
[0076] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.
[0077] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. When an element is considered to be "arranged on" another element, it can be directly arranged on the other element or there may be a middle element at the same time.
[0078] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments, and are not intended to limit this application.
[0079] In order to further elaborate on the technical means and effects adopted by the present application to achieve the predetermined purpose, the following detailed description of the present application is made in conjunction with the accompanying drawings and implementation modes.
[0080] Embodiment 1
[0081] Refer to Figure 1, this application provides a packaging structure 100, and the packaging structure 100 includes a first plastic package 10, a first component 20, a second component 30, and a second plastic package 40. A plurality of first conductive structures 14 are provided in the first plastic package 10, and the first conductive structures 14 are exposed on the first plastic package 10. The first component 20 is embedded in the first plastic package 10. The exposed first conductive structures 14 are also electrically connected to the first component 20. Specifically, the first plastic package 10 includes a first surface 151 and a second surface 152 that are oppositely arranged, and a part of the first conductive structures 14 are exposed on the second surface 152, and the first conductive structures 14 exposed on the second surface 152 are electrically connected to the first component 20.
[0082] The second plastic package 40 is disposed on the first plastic package 10 and a plurality of second conductive structures 42 are provided in the second plastic package 40. The second plastic package 40 includes a third surface 461 facing the second surface 152 and a fourth surface 462 oppositely arranged with the third surface 461. A part of the second conductive structures 42 are exposed on the third surface 461 and the fourth surface 462. The second conductive structures 42 exposed on the third surface 461 and the first conductive structures 14 exposed on the second surface 152 are electrically connected. The second component 30 is embedded in the second plastic package 40. The second conductive structures 42 exposed on the fourth surface 462 are also electrically connected to the second component 30. Therefore, the first component 20 and the second component 30 are electrically connected through the first conductive structures 14 and the second conductive structures 42.
[0083] In the above technical solution, the first conductive structures 14 and the second conductive structures 42 are directly electrically connected, and the first component 20 and the second component 30 are electrically connected through the first conductive structures 14 and the second conductive structures 42. Compared with the packaging method using solder balls, the solder balls are omitted at the connection between the first conductive structures 14 and the second conductive structures 42 in this application. Therefore, during the packaging process, the number of reflow solders can be reduced, thereby reducing the risk of warping of the first component 20 and the second component 30 during the electrical connection between the first conductive structures 14 and the second conductive structures 42. Since the number of input / output interfaces of the packaging structure 100 is not limited by the pitch between the solder balls, the number of input / output interfaces in the packaging structure 100 can also be increased.
[0084] In some embodiments, the second element 30 has a first electrical connector 31. The first element 20 has a second electrical connector 21. The second conductive structure 42 is electrically connected to the second element 30 through the first electrical connector 31. The first conductive structure 14 is electrically connected to the first element 20 through the second electrical connector 21. For example, at least two first electrical connectors 31 are provided on the second element 30 to be electrically connected to two corresponding sets of second conductive structures 42 through the at least two first electrical connectors 31, so as to realize the electrical connection between the second element 30 and the first element 20. In other embodiments, the second conductive structure 42 can also be electrically connected to the electrode of the second element 30 to realize the connection between the second conductive structure 42 and the second element 30.
[0085] In some embodiments, the first electrical connector 31 and the second electrical connector 21 can be pads, specifically aluminum pads. The first conductive structure 14 and the second conductive structure 42 can be columnar structures. The positions and shapes of the first conductive structure 14 and the second conductive structure 42 in this case can also be set according to requirements.
[0086] Refer to Figure 1 , in some embodiments, the first encapsulant 10 includes a first block 11 and a second block 12 disposed on the first block 11. The first element 20 is embedded in the first block 11. The surface of the first block 11 facing away from the second block 12 is the first surface 151, and the surface of the second block 12 facing away from the first block 11 is the second surface 152. In some embodiments, there can be multiple first elements 20, and the multiple first elements 20 are all embedded in the first encapsulant 10. In this embodiment, two first elements 20 are used as an example for illustration, and both two first elements 20 are embedded in the first block 11. The connection manners of the two first elements 20 and the first conductive structure 14 are the same. Subsequently, the connection manner of a group of first elements 20 and the corresponding first conductive structure 14 will be described.
[0087] The first conductive structure 14 includes a first conductive portion 141 disposed in the first block 11 and a second conductive portion 142 disposed in the second block 12. Define the direction from the second encapsulant 40 to the first encapsulant 10 as the stacking direction. The first conductive portion 141 penetrates through the first block 11 along the stacking direction of the packaging structure 100 and is exposed on the first block 11. One end thereof is used for electrical connection with the second conductive portion 142, and the other end is exposed on the first surface 151 for electrical connection with an external device. The second conductive portion 142 extends at least simultaneously along the stacking direction of the packaging structure 100 and the horizontal direction perpendicular to the stacking direction. Both ends of the second conductive portion 142 extend to the first block 11 and the first element 20 respectively. Specifically, one end of the second conductive portion 142 extends to the second electrical connector 21, and the other end is electrically connected to the first conductive portion 141. The electrical connection between the first conductive portion 141 and the first element 20 is realized through the second conductive portion 142.
[0088] The first conductive structure 14 further includes a fifth conductive portion 143. The fifth conductive portion 143 is disposed in the second block 12. One end of the fifth conductive portion 143 extends to the other second electrical connector 21 of the first component 20, and the other end is exposed outside the second block 12 for electrical connection with other components.
[0089] A plurality of second conductive portions 142 and the fifth conductive portion 143 are in the second block 12 to perform a redistribution layer (RDL) process to form a circuit layer. The second block 12 can adjust the positions and shapes of the second conductive portions 142 and the fifth conductive portion 143 in the second block 12 to perform the redistribution layer process on the second block 12. For example, some of the second conductive portions 142 may be arranged in a "U" shape, and one end of the second conductive portion 142 is electrically connected to the second electrical connector 21; some other second conductive portions 142 are exposed on the second surface 152, and both ends of the second conductive portion 142 are electrically connected to the first conductive portion 141 and the first component 20 respectively.
[0090] In the above packaging structure 100, the first conductive structure 14 forms a redistribution layer structure in the first encapsulant 10, so that the structures of the first encapsulant 10 and the first conductive structure 14 can serve as a circuit board, thereby replacing the circuit board in the packaging structure 100 in the prior art.
[0091] In some embodiments, both the first component 20 and the second component 30 include active components or passive components. The active components include logic chips, memory chips, image sensing chips, or microelectromechanical chips, and the passive components include resistors, capacitors, or inductors.
[0092] Refer to Figure 1, in some embodiments, the second encapsulant 40 includes a third encapsulation block 43 and a fourth encapsulation block 44 disposed on the third encapsulation block 43. The third encapsulation block 43 is disposed on the second block 12. The surface of the third encapsulation block 43 facing away from the fourth encapsulation block 44 is the third surface 461, and the surface of the fourth encapsulation block 44 facing away from the third encapsulation block 43 is the fourth surface 462. The second component 30 is embedded in the fourth encapsulation block 44, and the first electrical connector 31 is located on the surface of the second component 30 facing away from the third encapsulation block 43. The second conductive structure 42 includes a third conductive portion 421 disposed in the third encapsulation block 43 and a fourth conductive portion 422 disposed in the fourth encapsulation block 44. The fourth conductive portion 422 is exposed on the surface of the fourth encapsulation block 44 facing away from the fourth surface 462 and is electrically connected to the third conductive portion 421. The third conductive portion 421 is exposed on the third surface 461 and is electrically connected to the second conductive portion 142. One end of the fourth conductive portion 422 is exposed on the fourth surface 462 and is electrically connected to the first electrical connector 31 of the second component 30. The third encapsulation block 43 and the fourth encapsulation block 44 are fixed by wafer bonding, and the third conductive portion 421 and the fourth conductive portion 422 are fixedly connected by metal bonding. The separate setting of the third encapsulation block 43 and the fourth encapsulation block 44 facilitates the preparation and assembly in sequence during the encapsulation process to obtain the encapsulation structure 100.
[0093] Specifically, the fourth encapsulation block 44 can be prepared separately. First, the third encapsulation block 43 is prepared on the second block 12. Through metal bonding technology, the fourth encapsulation block 44 embedded with the second component 30 is joined to the third encapsulation block 43. The metal bonding method can be fusion bonding, metal thermal compression bonding, eutectic bonding, etc. The fourth conductive portion 422 and the third conductive portion 421 exposed on the third encapsulation block 43 facing away from the third surface 461 are connected by metal bonding (such as using solder paste), and glue is filled at the joint of the third encapsulation block 43 and the fourth encapsulation block 44 to strengthen the bonding strength between the third encapsulation block 43 and the fourth encapsulation block 44 and prevent water and moisture from invading and affecting the reliability.
[0094] Refer to Figure 1, in some embodiments, the third encapsulation block 43 has a hollow portion 432, and the second block 12 and the fourth encapsulation block 44 respectively seal both sides of the hollow portion 432. The encapsulation structure 100 further includes a third component 50 disposed on the second block 12. The third component 50 is located within the hollow portion 432 and is electrically connected to the first component 20. In the stacking direction, the second component 30 and the third component 50 are spaced apart. The third component 50 has a third electrical connector 51, and the third electrical connector 51 is located on the surface of the third component 50 facing the second block 12. Specifically, the third electrical connector 51 is a pad, such as an aluminum pad. The third electrical connector 51 is electrically connected to the fifth conductive portion 143 exposed on the second surface 152, that is, both ends of the fifth conductive portion 143 are electrically connected to the second electrical connector 21 and the third electrical connector 51 respectively, so as to achieve the electrical connection between the first component 20 and the third component 50. The first component 20, the second component 30 and the third component 50 are electrically connected through the first conductive structure 14 and the second conductive structure 42. Through the above arrangement, multiple components can be integrated and encapsulated into an encapsulation structure 100, which is beneficial to the miniaturization of the encapsulation structure 100 module and also beneficial to the simplification of the assembly of the encapsulation structure 100. In the above structure, the third encapsulation block 43 plays a role of frame support to support the fourth encapsulation block 44 and ensure a gap is maintained between the second component 30 and the third component 50. If the hollow portion 432 in the above structure is in a vacuum state, it can protect the third component 50 from the influence of the external environment (such as temperature, humidity or gas), and the third component 50 can be a MEMS component, such as an accelerometer, a magnetic sensor, a gyroscope sensor, etc.
[0095] In other embodiments, the third encapsulation block 43 covers the side wall of the third component 50, and the third component 50 is embedded in the third encapsulation block 43, that is, there is no hollow portion 432 in the third encapsulation block 43. By completely covering the third component 50 with the third encapsulation block 43, multiple components can be integrated in the encapsulation structure 100.
[0096] Refer to Figure 1 , an electrical connection portion 81 is further provided between the third electrical connector 51 and the fifth conductive portion 143. The third component 50 is soldered between the third electrical connector 51 and the fifth conductive portion 143 via the electrical connection portion 81 by flip chip technology. In some embodiments, a reinforcement layer 82 is further provided between the third electrical connector 51 and the fifth conductive portion 143. A receiving hole 821 is formed in the reinforcement layer 82, and the electrical connection portion 81 is received in the receiving hole 821. The reinforcement layer 82 is bonded between the third component 50 and the second block 12, thereby improving the mechanical strength and stability of the electrical connection between the third component 50 and the first component 20, and at the same time, the stress at the connection between the third electrical connector 51 and the second conductive portion 142 can also be dispersed. Specifically, the electrical connection portion 81 can be conductive glue or solder.
[0097] Refer toFigure 1 , in some embodiments, a dielectric layer 71 is provided on the surface of the first block 11 facing away from the second encapsulation body 40, and a plurality of third conductive structures 712 are provided in the dielectric layer 71. A plurality of third conductive structures 712 are subjected to a redistribution layer process in the dielectric layer 71 to form a circuit layer. The third conductive structures 712 are exposed from the dielectric layer 71 and are electrically connected to the first conductive portion 141. A plurality of solder balls 713 electrically connected to the third conductive structures 712 are further provided on the bottom surface of the dielectric layer 71, so that the encapsulation structure 100 can be electrically connected to an electronic device through the solder balls 713, such as a processor in a mobile phone, a computer, or a wearable device.
[0098] Referring to Figures 1 to 13 , the present application further provides a method for manufacturing an encapsulation structure 100, including the following steps:
[0099] S1. A first component 20 and a first encapsulation body 10 are disposed on a carrier 3, and the first component 20 is embedded in the first encapsulation body 10. A plurality of first channels 13 are formed in the first encapsulation body 10 (see Figure 1 ), the first encapsulation body 10 includes a first surface 151 and a second surface 152 disposed opposite to each other, and the first channels 13 are exposed from the first surface 151 and the second surface 152; a first conductive structure 14 is disposed in the first channels 13, and a part of the first conductive structure 14 is exposed from the second surface 152 and is electrically connected to the first component 20.
[0100] In some embodiments, the first encapsulation body 10 includes a first block 11 and a second block 12 disposed on the first block 11. The surface of the first block 11 facing away from the second block 12 is the first surface 151. The surface of the second block 12 facing away from the first block 11 is the second surface 152. The first channels 13 include first holes 111 disposed on the first block 11 and first grooves 121 disposed on the second block 12, and the first conductive structure 14 includes a first conductive portion 141 disposed in the first block 11 and a second conductive portion 142 disposed in the second block 12 and connected to the first conductive portion 141. This step S1 may specifically include the following steps:
[0101] (1) Referring to Figure 2 in (a), a first component 20 is disposed on the carrier 3, and a first encapsulation preform 1 is disposed on the carrier 3, and the first encapsulation preform 1 covers the side wall of the first component 20.
[0102] Wherein, the first component 20 has a second electrical connector 21, the second electrical connector 21 is located on the surface of the first component 20 facing away from the carrier 3, and the second electrical connector 21 is exposed from the first encapsulation preform 1. The number of the first components 20 can be set according to requirements.
[0103] A bonding layer 7 is further provided between the carrier plate 3 and the first component 20, and the first component 20 is mounted on the carrier plate 3 through the bonding layer 7. The carrier plate 3 is used to provide a supporting function and certain structural strength for the packaging structure 100, so as to facilitate transportation or transfer during the manufacturing process. In some embodiments, the bonding layer 7 includes a bonding material layer and a photothermal conversion layer, so that the carrier plate 3 can be peeled off by laser irradiating the photothermal conversion layer in a subsequent process.
[0104] (2) Refer to Figure 2 in (b), the first encapsulation preform 1 is cured to obtain the first block 11.
[0105] The first encapsulation preform 1 is cured by heating or ultraviolet irradiation. The material of the first encapsulation preform 1 can be at least one of epoxy resin, polyimide resin, polyimide derivative, silica gel, and silicon oxide. The first block 11 covers the side wall of the first component 20, the first component 20 is embedded in the first block 11, and the second electrical connector 21 is exposed on the surface of the first block 11 facing away from the first surface 151. The second electrical connector 21 can be a pad.
[0106] In some embodiments, the top surface of the first block 11 needs to be polished, specifically by chemical mechanical polishing, so that the top surface of the first block 11 is flat, which is beneficial to subsequent operations.
[0107] (3) Refer to Figure 2 in (c), a plurality of first holes 111 are formed in the first block 11, and the first holes 111 penetrate the first block 11 along the direction from the first block 11 to the carrier plate 3.
[0108] In some embodiments, the first holes 111 can be formed by laser drilling.
[0109] (4) Refer to Figure 3 and Figure 4 , a conductive material is disposed in the first holes 111 to form a first conductive portion 141 in the first holes 111.
[0110] In some embodiments, the first conductive portion 141 is filled in the first holes 111 and one end is exposed on the first block 11. By forming holes in the first block 11 and curing a conductive material in the holes, a redistribution layer process is performed in the first block 11 to obtain a circuit layer, so as to utilize the cooperation of the first block 11 and the plurality of first conductive portions 141 to perform the function of a circuit board in the prior art.
[0111] In some embodiments, the conductive material includes at least one of conductive ink, conductive ink, or conductive paste. For example, the conductive ink can be a particle-free conductive ink, and the conductive ink contains at least one element of silver, platinum, gold, copper, nickel, and aluminum.
[0112] Among them, the cured conductive ink includes a first curing stage and a second curing stage that are carried out in sequence.
[0113] The first curing stage includes: after spraying or injecting (such as by spraying or injecting) the conductive ink into the first hole 111, irradiating the conductive ink with ultraviolet light, and pre-curing the conductive ink. In this stage, through ultraviolet irradiation, the conductive ink is quickly pre-cured to avoid the flow of the conductive ink. The ultraviolet irradiation time is several seconds, specifically 1 - 5 s.
[0114] The second curing stage includes: baking the pre-cured conductive ink to obtain the first conductive part 141. After the conductive ink goes through the first curing stage, the conductive ink is pre-cured on the inner wall of the first hole 111, and then baked at 100°C - 180°C for 0.1 h - 3 h, and the conductive ink is completely cured on the inner wall of the first hole 111. The remaining subsequent curing can also be carried out in this way. In some other embodiments, screen printing of the conductive ink can also be used. In some other embodiments, carbon-based conductive ink can also be selected as the conductive ink.
[0115] The conductive ink can be at least one of nano silver ink, nano silver copper ink or silver ion ink. In some other embodiments, the conductive material can also include conductive paste, and the conductive paste can be a mixture of precious metal powder, base metal powder, glass powder and synthetic resin. The conductive paste includes copper paste, gold paste or nickel paste. The conductive paste is printed by screen printing and exposed and cured to obtain the conductive part.
[0116] In some other embodiments, it can also be obtained by filling the hole with a conductive metal material. In this embodiment, the conductive material can be selected as conductive ink.
[0117] (5) Refer to Figure 5 in (a) and (b), a second encapsulation preform 2 is provided on the first block 11 and the first component 20 and cured to obtain a second block 12.
[0118] The second encapsulation preform 2 covers the surface of the first block 11 and the surface of the first component 20. Among them, both the second electrical connector 21 and the first conductive part 141 are blocked by the second encapsulation preform 2.
[0119] In some embodiments, the materials of the first block 11 and the second block 12 are the same. After obtaining the second block 12, the top surface of the second block 12 needs to be ground to make its surface flat, which is beneficial for subsequent operations.
[0120] (6) Refer to Figure 6 , a plurality of first grooves 121 and second grooves 122 are formed on the second block 12.
[0121] The first groove 121 is formed by concaving from the second surface 152 of the second block 12. The first groove 121 is arranged such that the ends of the second electrical connector 21 and the first conductive part 141 are both exposed in the first groove 121. Among them, both ends of the first groove 121 penetrate through the second block 12, so that the first conductive part 141 and the second electrical connector 21 are both exposed at the bottom of the first groove 121. In the specific preparation process of the first groove 121, laser drilling can be used for the second block 12 to expose the first conductive part 141 on the second block 12 and form a groove on the second block 12, and then drill holes at the position corresponding to the second electrical connector 21 to expose the second electrical connector 21 on the second block 12, so as to form the first groove 121 on the second block 12. The order of the above laser drilling is not limited to this.
[0122] The second groove 122 is formed by concaving from the second surface 152 and exposes one of the second electrical connectors 21. One end of the second groove 122 penetrates through the second block 12, so that the second electrical connector 21 is exposed on the second block 12.
[0123] (7) Refer to Figure 7 in (a), a conductive material is arranged in the first groove 121 to form a second conductive part 142 in the first groove 121, and the first conductive part 141 and the second conductive part 142 are electrically connected.
[0124] In this step, a conductive material is also arranged in the second groove 122 to form a fifth conductive part 143 in the second groove 122. The conductive material can be arranged synchronously in the first groove 121 and the second groove 122.
[0125] The conductive materials of the first conductive part 141 and the second conductive part 142 are the same.
[0126] Refer to Figure 7 in (b), the second conductive part 142 is arranged on the second block 12, electrically connected to the first element 20, and the second conductive part 142 is exposed on the second block 12.
[0127] S2. Refer to Figure 8 , a third element 50 is arranged on the first encapsulant 10. The third element 50 has a third electrical connector 51, and the third electrical connector 51 is electrically connected to the first conductive structure 14.
[0128] The third component 50 is flip-chip soldered onto the first conductive structure 14. Specifically, the third electrical connector 51 is located on the surface of the third component 50 facing the second block 12 and is flip-chip soldered to the fifth conductive portion 143. Specifically, conductive adhesive or solder can be used to solder the two. Then, glue is filled between the second block 12 and the third component 50 and cured to obtain a reinforcement layer 82, so as to improve the firmness of the connection between the third component 50 and the second block 12, thereby improving the stability of the electrical connection between the third component 50 and the fifth conductive portion 143.
[0129] S3. Refer to Figure 9 、 Figure 10 and Figure 13 ,a second encapsulant 40 is provided on the first encapsulant 10. A second component 30 is embedded in the second encapsulant 40. A plurality of second channels 41 are opened on the second encapsulant 40. A conductive material is filled in the second channels 41 to form a second conductive structure 42. The second encapsulant 40 includes a third surface 461 facing the second surface 152 and a fourth surface 462 opposite to the third surface 461.
[0130] Part of the second conductive structure 42 is exposed on the third surface 461 and is electrically connected to the first conductive structure 14 exposed on the second surface 152. Part of the second conductive structure 42 is exposed on the fourth surface 462. The second conductive structure 42 exposed on the fourth surface 462 is electrically connected to the second component 30. The first component 20 and the second component 30 are electrically connected through the first conductive structure 14 and the second conductive structure 42.
[0131] The second encapsulant 40 can be formed by curing a prefabricated encapsulant, and the second encapsulant 40 is directly cured on the second block 12. In some embodiments, the material of the second encapsulant 40 includes at least one of epoxy resin, polyimide resin, polyimide derivative, silica gel, and silicon oxide. In this embodiment, specifically, molding silica gel can be used.
[0132] Refer to Figure 9 、 Figure 10 and Figure 11 ,the second encapsulant 40 includes a third encapsulation block 43 provided on the first encapsulant 10 and a fourth encapsulation block 44 provided on the third encapsulation block 43. The surface of the third encapsulation block 43 facing away from the fourth encapsulation block 44 is the third surface 461, and the surface of the fourth encapsulation block 44 facing away from the third encapsulation block 43 is the fourth surface 462. The second component 30 is embedded in the fourth encapsulation block 44. The second conductive structure 42 includes a third conductive portion 421 provided in the third encapsulation block 43 and a fourth conductive portion 422 provided in the fourth encapsulation block 44. The second channel 41 (see Figure 12)It includes a second hole 431 formed in the third encapsulation block 43 and a connection channel 441 formed in the fourth encapsulation block 44. The specific steps for disposing the second encapsulation body 40 on the first encapsulation body 10 are as follows:
[0133] S3-1. Refer to Figure 9 , by disposing an encapsulation preform on the second block body 12 and curing it, the third encapsulation block 43 is obtained. Among them, the third encapsulation block 43 has a hollow portion 432, the hollow portion 432 is located in the middle of the third encapsulation block 43, the third component 50 is located in the hollow portion 432, and there is a gap between the third encapsulation block 43 and the third component 50.
[0134] In some other embodiments, the third encapsulation block 43 covers the side wall of the third component 50, and the third component 50 is embedded in the third encapsulation block 43 (not shown in the figure). And the top surface of the third encapsulation block 43 is ground to facilitate subsequent bonding with the fourth encapsulation block 44.
[0135] S3-2. Refer to Figure 10 , a second hole 431 is formed in the third encapsulation block 43, and a conductive material is disposed in the second hole 431 to form a third conductive portion 421 in the second hole 431.
[0136] The second hole 431 penetrates the third encapsulation block 43 along the stacking direction, and the third conductive portion 421 is exposed on the third surface 461 and electrically connected to the second conductive portion 142. The second hole 431 is also exposed on the third encapsulation block 43 away from the third surface 461, so that a part of the third conductive portion 421 is exposed on the surface of the third encapsulation block 43, facilitating electrical connection with other devices.
[0137] In some embodiments, the third encapsulation block 43 further has a groove at the end of the second hole 431 away from the third surface 461, and the groove communicates with the second hole 431. The setting of the groove is conducive to increasing the area of the third conductive portion 421 exposed on the third encapsulation block 43, facilitating subsequent bonding with the fourth conductive portion 422 in the fourth encapsulation block 44.
[0138] In some embodiments, a groove is further formed on the surface of the third encapsulation block 43 away from the third surface 461, and the groove is filled with a conductive material to form a seventh conductive portion 433. The seventh conductive portion 433 is exposed on the surface of the third encapsulation block 43 away from the third surface 461.
[0139] S3-3. Refer to Figure 11 , prepare the intermediate 5, among which, step S3-3 can also be performed in any step of step S3.
[0140] The specific steps of S3-3 include:
[0141] (1) Refer to Figure 11In (a), a second component 30 and a fourth plastic encapsulation block 44 are arranged on the support plate 4, and the second component 30 is embedded in the fourth plastic encapsulation block 44.
[0142] The fourth plastic encapsulation block 44 includes a third block 442 and a fourth block 443 disposed on the third block 442, and the second element 30 is embedded in the third block 442. The third block 442 is disposed on the support plate 4, and an adhesive layer 8 is further disposed between the third block 442 and the support plate 4, and the third block 442 is bonded to the support plate 4 through the adhesive layer 8. The third block 442 is formed by curing the plastic encapsulation preform, wherein the first electrical connector 31 is located on the surface of the second element 30 away from the support plate 4. After the third block 442 is formed, the fourth block 443 is formed on the third block 442 and the second element 30 by curing the plastic encapsulation preform, and the fourth block 443 covers the surface of the second element 30 away from the support plate 4.
[0143] (2) See Figure 11 In (b), a plurality of connecting channels 441 are opened on the fourth plastic encapsulation block 44 .
[0144] The support plate 4 and the adhesive layer 8 disposed between the support plate 4 and the third block 442 are removed, and the connection channel 441 penetrates the third block 442 and the fourth block 443 and extends along the surface of the fourth block 443 and extends to the first electrical connector 31 .
[0145] In this embodiment, the connection channel 441 includes a third hole 4411 penetrating the third block 442 and a third groove 4412 provided on the fourth block 443. The third hole 4411 penetrates the third block 442, and both ends of the third groove 4412 pass through the fourth block 443, wherein the third groove 4412 is connected to the third hole 4411, and the first electrical connector 31 is exposed on the fourth block 443. In some embodiments, the connection channel 441 is obtained by laser drilling.
[0146] In other embodiments, only the support plate 4 is removed, and the adhesive layer 8 is still bonded to the third block 442 , so as to strengthen the subsequent bonding force between the third block 442 and the second block 12 .
[0147] (3) See Figure 11 In (c), a conductive material is disposed in the connection channel 441 to form a fourth conductive portion 422 in the connection channel 441 , and the support plate 4 is removed to obtain an intermediate 5 .
[0148] A conductive material is filled in the third holes 4411 and the third grooves 4412 to form a fourth conductive part 422. Both ends of the fourth conductive part 422 are respectively exposed on the third block 442 and the fourth block 443. The part of the fourth conductive part 422 located in the third groove 4412 is exposed on the fourth surface 462. One end of the fourth conductive part 422 extends to the first electrical connector 31 and is electrically connected to the second component 30 through the first electrical connector 31. The other end of the fourth conductive part 422 is exposed on the surface of the third block 442 away from the fourth surface 462.
[0149] Referring to Figure 11 (d) therein, in some embodiments, a groove is further formed on the surface of the third block 442 facing away from the fourth surface 462, and a conductive material is filled in the groove to form an eighth conductive part 4421.
[0150] S4. Referring to Figure 12 , the intermediate 5 prepared in step S3 is disposed on the third encapsulation block 43. The fourth conductive part 422 and the third conductive part 421 are electrically connected, and the electrical connection between the first component 20 and the second component 30 is realized through the electrical connection between the third conductive part 421 and the second conductive part 142.
[0151] Wherein, the fourth encapsulation block 44 is disposed on the third encapsulation block 43 and is connected by metal bonding. The third conductive part 421 and the fourth conductive part 422 are connected by metal bonding to realize the electrical connection between the third conductive part 421 and the fourth conductive part 422. In this embodiment, the eighth conductive part 4421 and the seventh conductive part 433 are connected by metal bonding and the electrical connection between the two is realized (see Figure 13 ).
[0152] In some embodiments, an adhesive layer (not shown in the figure) is further disposed between the intermediate 5 and the second block 12. The adhesive layer can be formed by curing glue to reinforce the connection stability between the intermediate 5 and the second block 12.
[0153] S5. Referring to Figure 13 , the carrier plate 3 is removed.
[0154] Meanwhile, the adhesive layer 7 is also removed.
[0155] S6. Referring to Figure 1 , a dielectric layer 71 is disposed on the surface of the first encapsulation body 10 facing away from the second encapsulation body 40, and a redistribution layer process is performed on the dielectric layer 71 to obtain the encapsulation structure 100.
[0156] A dielectric layer 71 is provided on the surface of the first encapsulation body 10 facing away from the second encapsulation body 40. The dielectric layer 71 is provided with a plurality of third channels 711. Some of the third channels 711 penetrate through the dielectric layer 71, and the other part of the third channels 711 are formed by concavities on the surface of the dielectric layer 71 facing away from the first encapsulation body 10. The third channels 711 are formed by grooves, some of the grooves penetrate through the dielectric layer 71, and some of the grooves do not penetrate through the dielectric layer 71.
[0157] A conductive material is disposed in the above-mentioned third channels 711 to form a third conductive structure 712 in the third channels 711. The third conductive structure 712 formed in the third channels 711 that penetrate through the dielectric layer 71 is electrically connected to the first conductive portion 141 exposed on the first surface 151. The third conductive structure 712 formed in the other part of the third channels 711 is only exposed on the surface of the dielectric layer 71 facing away from the first encapsulation body 10.
[0158] A plurality of solder balls 713 are soldered on the surface of the dielectric layer 71 facing away from the first encapsulation body 10, and the solder balls 713 are electrically connected to each third conductive structure 712.
[0159] In the manufacturing method of the encapsulation structure 100 provided in this embodiment, by forming the second encapsulation body 40 on the first encapsulation body 10, the second encapsulation body 40 is directly formed on the first encapsulation body 10 and realizes the electrical connection of the first conductive structure 14 and the second conductive structure 42, thereby realizing the electrical connection of the first component 20 and the second component 30. And in the above electrical connection process, reflow soldering is not used with solder balls, so that it can replace the method of reflow soldering with solder balls (such as tin balls) when encapsulating the intermediate body 5 and the first encapsulation body 10 in the prior art, reduce the use of solder balls, thereby reducing the high-temperature treatment steps and reducing the warping phenomenon in the encapsulation structure 100. At the same time, since the number of input / output interfaces of the encapsulation structure 100 is not limited by the pitch between solder balls, the number of input / output ports in the encapsulation structure 100 can also be increased. The second encapsulation body 40 also functions as a frame to support the intermediate body 5.
[0160] At the same time, in the present application, a method of combining a plastic encapsulation preform (such as resin) with a conductive material is used to prepare a POP encapsulation. During the preparation process, the first component 20, the second component 30, and the third component 50 can be integrally encapsulated to form a system-level encapsulation module, which is beneficial to the miniaturization of the encapsulation module, and the preparation method is simple, simplifying the semiconductor process for preparing the encapsulation module.
[0161] Embodiment 2
[0162] Refer to Figure 14, Another embodiment of the present application further provides a packaging structure 100', which is different from the above-mentioned packaging structure 100 in that the second encapsulant 40 is a single-layer structure (i.e., it is not composed of a third encapsulation block 43 and a fourth encapsulation block 44). The first electrical connector 31 is located on the surface of the second component 30 facing away from the first encapsulant 10, and a part of the second encapsulant 40 at least covers the first electrical connector 31. A part of the second conductive structure 42 is electrically connected to the second component 30 through the first electrical connector 31. And the second encapsulant 40 covers the side wall of the second component 30 to realize the encapsulation of the second component 30. The second conductive structure 42 in the second encapsulant 40 is exposed on the third surface 461 and electrically connected to the second conductive part 142. The second conductive structure 42 is exposed on the fourth surface 462 and electrically connected to the first electrical connector 31, and is electrically connected through the second conductive structure 42 and the second conductive part 142 to realize the electrical connection between the first component 20 and the second component 30.
[0163] Refer to Figure 14 , In some embodiments, an adhesive layer 32 is provided between the second component 30 and the second block 12, and the second component 30 is bonded to the first encapsulant 10 through the adhesive layer 32. The material used for the adhesive layer 32 is such as DAF glue, die attach film or wafer adhesive film.
[0164] Refer to Figure 14 , In some embodiments, a protective cover 60 is further provided on the surface of the second encapsulant 40. The protective cover 60 covers the surface of the second encapsulant 40, which can not only shield the second conductive structure 42 exposed on the second encapsulant 40, but also encapsulate the second component 30 in the packaging structure 100'. The protective cover 60 can be a glass chip, a silicon chip, a sapphire chip, a quartz chip or a germanium chip, etc.
[0165] An extension block 45 is convexly formed on the edge of the second encapsulant 40 away from the third surface 461. A sixth conductive part 47 is further provided in the second encapsulant 40. The sixth conductive part 47 penetrates through the extension block 45 and the second encapsulant 40. The sixth conductive part 47 is exposed on the third surface 461 and electrically connected to the second conductive part 142. The sixth conductive part 47 is exposed on the extension block 45 for electrical connection with other devices. The setting of the extension block 45 is to keep a certain gap between the protective cover 60 and the second conductive structure 42 exposed on the second encapsulant 40, to avoid contact between the protective cover 60 and the second conductive structure 42, and to reduce the possibility of short circuit in the packaging structure 100'. The preparation method of a packaging structure 100' provided in this embodiment is only the same as steps S1 and S6, and the rest of the steps are different. The preparation method in this embodiment further includes:
[0166] S21. Refer to Figure 15, a second component 30 is provided on the first encapsulant 10, and a first electrical connector 31 is located on the surface of the second component 30 facing away from the first encapsulant 10.
[0167] The second component 30 is fixed to the second block 12 through an adhesive layer 32.
[0168] S22. Refer to Figure 16 , a second encapsulant 40 is provided on the surface of the first encapsulant 10. The second encapsulant 40 at least covers a part of the surface of the second component 30 away from the first encapsulant 10. The second encapsulant 40 covers the first electrical connector 31. A plurality of second channels 41 are formed in the second encapsulant 40. Conductive ink is disposed in the second channels 41, and the conductive ink is cured to form a second conductive structure 42 in the second channels 41. The second conductive structure 42 is electrically connected to the first conductive structure 14 and the first electrical connector 31. Meanwhile, a sixth conductive portion 47 is also formed in this step.
[0169] The second encapsulant 40 can also be formed by curing a prefabricated encapsulant. In this step, during the process of curing the conductive ink to form the second conductive structure 42, the second conductive structure 42 is directly electrically connected to the second conductive portion 142 in the first conductive structure 14, thereby replacing the method of using solder balls for reflow soldering to electrically connect the second conductive structure 42 and the first conductive structure 14 in the prior art.
[0170] S23. Refer to Figure 17 , a protective cover 60 is provided on the surface of the second encapsulant 40.
[0171] The protective cover 60 can be adhesively bonded to the surface of the second encapsulant 40 facing away from the first encapsulant 10.
[0172] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit them. Although the present application has been described in detail with reference to the embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.
Claims
1. An encapsulation structure, characterized in that, Comprising: A first encapsulation body, including a first surface and a second surface arranged oppositely, wherein a plurality of first conductive structures are provided in the first encapsulation body, and part of the first conductive structures are exposed on the second surface; A first component, embedded in the first encapsulation body, and the first conductive structures exposed on the second surface are electrically connected to the first component; A second encapsulation body, arranged on the first encapsulation body, the second encapsulation body includes a third surface facing the second surface and a fourth surface arranged oppositely to the third surface, wherein a plurality of second conductive structures are provided in the second encapsulation body, and part of the second conductive structures are exposed on the third surface and the fourth surface, and the second conductive structures exposed on the third surface are electrically connected to the first conductive structures exposed on the second surface; A second component, embedded in the second encapsulation body, and the second conductive structures exposed on the fourth surface are electrically connected to the second component, so that the first component and the second component are electrically connected through the first conductive structures and the second conductive structures.
2. The encapsulation structure according to claim 1, wherein The first encapsulation body includes a first block and a second block arranged on the first block, the surface of the first block facing away from the second block is the first surface, the surface of the second block facing away from the first block is the second surface, the first component is embedded in the first block, the first conductive structure includes a first conductive part arranged in the first block and a second conductive part arranged in the second block and connected to the first conductive part, the first conductive part is exposed on the first surface, and the second conductive part is exposed on the second surface and electrically connected to the first component.
3. The encapsulation structure according to claim 1, characterized in that, The second encapsulation body includes a third encapsulation block and a fourth encapsulation block arranged on the third encapsulation block, the third encapsulation block is arranged on the first encapsulation body, the surface of the third encapsulation block facing away from the fourth encapsulation block is the third surface, the surface of the fourth encapsulation block facing away from the third encapsulation block is the fourth surface, the second component is embedded in the fourth encapsulation block, the second conductive structure includes a third conductive part arranged in the third encapsulation block and a fourth conductive part arranged in the fourth encapsulation block and connected to the third conductive part, the third conductive part is exposed on the third surface and electrically connected to the first conductive structure, and the fourth conductive part is exposed on the fourth surface and electrically connected to the second component.
4. The encapsulation structure according to claim 3, characterized in that The third encapsulation block has a hollow part, the first encapsulation body and the fourth encapsulation block respectively seal two sides of the hollow part, and the encapsulation structure further includes a third component arranged on the second surface, and the third component is placed in the hollow part and electrically connected to the first component.
5. The encapsulation structure according to claim 1, wherein, The first surface is provided with a dielectric layer, a plurality of third conductive structures are provided in the dielectric layer, the third conductive structures are exposed on the dielectric layer and electrically connected to the first conductive structures, and solder balls electrically connected to the third conductive structures are further provided on the bottom surface of the dielectric layer.
6. The encapsulation structure according to claim 1, characterized in that, A first electrical connector is provided on a surface of the second component facing away from the first encapsulation body, and a part of the second encapsulation body covers the first electrical connector. The second conductive structure is electrically connected to the second component through the first electrical connector.
7. The encapsulation structure according to claim 6, wherein A protective cover is further provided on a surface of the second encapsulation body away from the first encapsulation body.
8. A method for preparing a packaging structure, characterized in that, The preparation method includes: placing a first component and a first encapsulation body on a carrier, the first component being embedded in the first encapsulation body, and the first encapsulation body including a first surface and a second surface arranged opposite to each other; forming a plurality of first channels in the first encapsulation body, one end of each first channel extending to the first component; arranging a first conductive structure in the first channels, a part of the first conductive structure being exposed on the second surface and electrically connected to the first component; placing a second encapsulation body on the first encapsulation body, a second component being embedded in the second encapsulation body, and the second encapsulation body including a third surface facing the second surface and a fourth surface arranged opposite to the third surface; forming a plurality of second channels in the second encapsulation body, one end of each second channel extending to the second component; arranging a second conductive structure in the second channels, a part of the second conductive structure being exposed on the third surface and electrically connected to the first conductive structure exposed on the second surface, a part of the second conductive structure being exposed on the fourth surface, and the second conductive structure exposed on the fourth surface being electrically connected to the second component. The first component and the second component are electrically connected through the first conductive structure and the second conductive structure; removing the carrier to obtain the encapsulation structure.
9. The manufacturing method of the encapsulation structure according to claim 8, characterized in that The preparation method for arranging the first conductive structure in the first channels includes: arranging a conductive material in the first channels and curing the conductive material to form the first conductive structure in the first channels.
10. The manufacturing method of the encapsulation structure as described in claim 9, characterized in that, The conductive material includes at least one of conductive ink, conductive ink or conductive paste.
11. The manufacturing method of the encapsulation structure according to claim 8, characterized in that, The step of placing the first component and the first encapsulation body on the carrier includes: placing the first component on the carrier and arranging a first encapsulation preform on the carrier, the first encapsulation preform being located on a sidewall of the first component; curing the first encapsulation preform to obtain a first block; forming a plurality of first holes in the first block, the first holes penetrating through the first block along a stacking direction, and arranging a first conductive part in the first holes; placing a second block on the first block and the first component, the first block and the second block constituting the first encapsulation body; forming a plurality of first grooves in the second block and arranging a second conductive part in the first grooves, the first holes and the first grooves constituting the first channels, and the first conductive part and the second conductive part being electrically connected to form the first conductive structure.
12. The method for preparing the encapsulation structure according to claim 9, characterized in that, Before removing the carrier, the preparation method further includes: A third component is disposed on the first encapsulant, and a third encapsulation block is further provided on the first encapsulant. A plurality of second holes are formed in the third encapsulation block, and the conductive material is disposed in the second holes to form a third conductive portion in the second holes. The third conductive portion is electrically connected to the first conductive structure; A second component and a fourth encapsulation block are disposed on a support plate. The third component is embedded in the fourth encapsulation block, and a plurality of connection channels are formed in the fourth encapsulation block; the conductive material is disposed in the connection channels to form a fourth conductive portion in the connection channels. The fourth conductive portion is electrically connected to the second component; The support plate is removed to obtain an intermediate body; The fourth encapsulation block in the intermediate body is disposed on the third encapsulation block. The third encapsulation block and the fourth encapsulation block constitute the second encapsulant, and the third conductive portion and the fourth conductive portion are electrically connected to form the second conductive structure.
13. The manufacturing method of the encapsulation structure according to claim 12, wherein, An adhesive layer is further disposed between the third encapsulation block and the fourth encapsulation block.
14. The method for preparing the encapsulation structure according to claim 9, characterized in that, After removing the carrier plate, the manufacturing method further includes: A dielectric layer is disposed on a surface of the first encapsulant facing away from the second encapsulant. A plurality of third channels are formed in the dielectric layer; The conductive material is disposed in the third channels to form a third conductive structure in the third channels; A solder ball is welded on a surface of the dielectric layer. The solder ball is electrically connected to the third conductive structure.
15. The manufacturing method of the encapsulation structure according to claim 8, characterized in that, The second component has a first electrical connector located on a surface of the second component facing away from the first encapsulant. The manufacturing method further includes: The second encapsulant at least covers the first electrical connector.
16. The manufacturing method of the encapsulation structure according to claim 15, characterized in that, The method for embedding the second component in the second encapsulant includes: The second component is fixed on the first encapsulant, and a second encapsulation preform is further provided on the first encapsulant. The second encapsulation preform at least covers the first electrical connector; The second encapsulation preform is cured to obtain the second encapsulant.
17. The manufacturing method of the encapsulation structure according to claim 15, characterized in that, A protective cover is further provided on a surface of the second encapsulant away from the first encapsulant.