Ka and S wave band radio frequency module for airborne satellite communication antenna

Abstract

The invention belongs to the technical field of high-frequency satellite communication, and particularly relates to a Ka and S wave band radio frequency module for an airborne satellite communication antenna. Comprising a multi-layer structure including a plurality of signal layers, a plurality of grounding layers, at least one power supply layer and at least one control layer; wherein the signal layer is formed by laminating a low-loss material Rogers RT / dudroid 5880 and a Tacic TLY-5, and interlayer signal interconnection is realized through a blind hole and a buried hole; the grounding layer is of a double-layer copper foil structure, a honeycomb-shaped copper-clad pattern is laid on the surface of the grounding layer, and hole positions of the honeycomb-shaped copper-clad pattern and blind holes and buried holes of the signal layer are arranged in a staggered mode. The power supply layer adopts a PTFE substrate, and the Pi-type filter network is mounted on the surface of the PTFE substrate through surface mounting; the control layer adopts an FR4 substrate, and an impedance matching microstrip line is arranged on the surface of the FR4 substrate; the size of the radio frequency module does not exceed 50mm * 50mm * 5mm, and the weight of the radio frequency module does not exceed 50g. The performance bottleneck of a traditional radio frequency module is broken through, and unification of miniaturization, high performance and strong environment adaptability is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of high-frequency satellite communication, and particularly relates to a Ka and S-band radio frequency module for an airborne satellite communication antenna. Specifically, it relates to a radio frequency module designed specifically for airborne platforms (such as commercial airplanes, military drones, high-altitude balloon communication platforms, etc.). Background Art

[0002] With the progress of airborne satellite communication technology, the Ka band and the S band have become the mainstream frequency bands due to their high bandwidth and high data transmission rate (the Ka band can reach hundreds of Mbps, and the S band is dozens of Mbps). However, the existing radio frequency modules generally have the following technical bottlenecks in high-frequency applications. Taking the traditional design represented by the Honeywell HTS-9000 series as an example: First, the traditional design mostly uses FR4 substrates (dielectric constant ≈ 4.5, loss factor tanδ ≈ 0.02@10GHz). The insertion loss in the Ka band (30GHz) is as high as 2.5 - 3.0 dB, resulting in low signal transmission efficiency and an energy loss of about 40% - 50%.

[0003] Second, the thickness of the copper foil in the ground layer is insufficient (≤20µm), and the shielding effectiveness is only about 20 dB. The isolation degree is as low as -20dB. It is vulnerable to electromagnetic noise in the airborne environment (such as coexistence of multiple devices and radar interference), and the bit error rate increases by about 5% - 10%.

[0004] Third, the module size is usually ≥100mm × 100mm × 10mm, and the weight is ≥100 grams, exceeding the requirements of the airborne platform for lightweight design (the ideal weight < 60 grams), which limits its application on platforms such as small drones.

[0005] Fourth, under high-temperature (>85°C) or vibration (>10G) conditions, the thermal expansion coefficient (CTE ≈ 50 ppm / °C) of the FR4 substrate is too high, resulting in impedance mismatch, phase shift ≥ 10°, and performance attenuation ≥ 10%, which cannot meet the aviation standards (such as MIL-STD-810G).

[0006] The existing technology lacks a customized optimization design for the characteristics of the Ka and S bands, and it is difficult to achieve a balance among miniaturization, low loss, high anti-interference ability, and environmental adaptability. Therefore, there is an urgent need for an innovative radio frequency module design to break through the above limitations and promote the further development of airborne satellite communication technology. Summary of the Invention

[0007] The present invention aims at the defects existing in the prior art and provides a Ka and S-band radio frequency module for an airborne satellite communication antenna.

[0008] To achieve the above object, the present invention adopts the following technical solutions. A Ka and S-band radio frequency module for an airborne satellite communication antenna includes: a multi-layer structure including a plurality of signal layers, a plurality of ground layers, at least one power supply layer, and at least one control layer; wherein, the signal layer is formed by laminating low-loss materials Rogers RT / duroid 5880 and Taconic TLY-5, and inter-layer signal interconnection is achieved through blind vias and buried vias.

[0009] The ground layer adopts a double-layer copper foil structure, and a honeycomb-shaped copper-clad pattern is laid on its surface. The hole positions of the honeycomb-shaped copper-clad pattern are staggered from the blind vias and buried vias of the signal layer to enhance the electromagnetic shielding effect.

[0010] The power supply layer adopts a PTFE substrate, and a π-type filter network is installed on the surface of the PTFE substrate by surface mounting. The π-type filter network is electrically connected to the signal layer through buried vias.

[0011] The control layer adopts an FR4 substrate, and microstrip lines with impedance matching are arranged on the surface of the FR4 substrate. The microstrip lines form a continuous impedance transition structure with the signal layer through blind vias.

[0012] Among them, the size of the radio frequency module does not exceed 50mm×50mm×5mm, and the weight does not exceed 50 grams.

[0013] Furthermore, the layout of the blind vias and buried vias is determined by optimizing through a genetic algorithm, which specifically includes the following steps: S1. Construct a three-dimensional grid model of the radio frequency module, abstract the signal layer, ground layer, power supply layer, and control layer into three-dimensional space grids, and each grid node represents a potential blind via or buried via position.

[0014] S2. Set constraint conditions, including: Constraint condition 1: The center distance between any two blind vias or buried vias needs to be ≥0.2mm.

[0015] Constraint condition 2: The center position of the blind via and / or buried via is at least 0.5mm away from the physical edge of the module.

[0016] Constraint condition 3: The blind vias and buried vias on the signal layer need to be staggered from the honeycomb-shaped copper-clad pattern on the ground layer.

[0017] S3. Based on the three-dimensional grid model, generate multiple initial layout schemes of blind vias and buried vias that meet the constraint conditions of S2.

[0018] S4. Calculate the node importance of the blind vias and buried vias; that is, evaluate the importance of each hole position to signal transmission and screen key nodes.

[0019] S5. Perform performance calculations to supplement the relevance of critical hole positions. Specifically, for each initial layout plan, calculate the path length L and impedance matching error E of the signal from the starting point to the ending point. And it is necessary to prioritize ensuring the path connectivity of critical hole positions. Among them, for the path length L, all critical hole positions need to be passed from the starting point to the ending point, and then calculate the total length. For the impedance error E, focus on accumulating the impedance mismatch components of critical hole positions.

[0020] S6. Iteratively optimize the blind via and buried via layouts based on the genetic algorithm and select the optimal plan. After obtaining multiple initial layout plans that meet the physical constraints in the previous steps, use the genetic algorithm to globally search and optimize the layout plans. Take the objective function F = αL + βE as the fitness function to preferably select the optimal blind via and buried via layout plan. Among them, α represents the weight of the path length, and β represents the weight of the impedance error. The value range is [0, 1], and α + β = 1.

[0021] Further, step S4 specifically includes: S4.1. Initialize the grid nodes corresponding to potential blind vias and buried vias, and set the initial importance of all nodes corresponding to blind vias and buried vias: S(0) = 1, ensuring that each hole position has the same importance at the initial stage of optimization.

[0022] S4.2. Iteratively calculate the importance of critical nodes.

[0023] The iterative calculation formula for the node importance is: S(n + 1) = ΣS(t) * w.

[0024] Among them, w is the weight coefficient between adjacent nodes, which is jointly determined by the path length and impedance matching error. n represents the current iteration number, and t represents the adjacent nodes directly connected to the current node. When all nodes satisfy max∣S(n + 1) - S(n)∣ < 0.01, it is determined that the importance converges and the iteration is terminated.

[0025] S4.3. Record the importance S of each node, sort the importance S of each node in ascending order, and calculate the sorting ratio value r / N. Among them, the ranking serial number of a certain node is recorded as r, and the total number of nodes is recorded as N. And screen the nodes with large ratio values as the positions of critical blind vias and buried vias.

[0026] After the node importance converges, sort the importance values S of all grid nodes in ascending order to generate the corresponding sorting serial numbers r. Among them, r = 1 represents the node with the lowest importance, r = N represents the node with the highest importance, and N is the total number of nodes.

[0027] Then calculate the sorting ratio value r / N of each node, and select the nodes with large sorting ratio values as the positions of critical blind vias and buried vias, that is, critical hole positions.

[0028] Furthermore, the microstrip line includes a tapered section where the line width gradually changes along the signal path. The tapered section is connected to the signal layer through blind vias to achieve continuous impedance transition.

[0029] Furthermore, the manufacturing process of the RF module includes: laser pre-drilling the positions of blind vias and buried vias before lamination to ensure high-precision positioning; filling the holes with conductive materials and then laminating to form stable interlayer connections; where the lamination temperature is 200°C and the lamination pressure is 10 Mpa; and performing electroless nickel-gold plating treatment after forming the microstrip line to improve welding reliability and corrosion resistance.

[0030] Furthermore, the insertion loss of the RF module in the Ka band does not exceed 0.38 dB, the insertion loss in the S band does not exceed 0.12 dB, the isolation is not less than -35 dB, and the shielding effectiveness is not less than 40 dB.

[0031] Beneficial effects of the present invention compared with the prior art.

[0032] Through the systematic integration of material selection, interlayer structure optimization, and anti-interference design, the present invention breaks through the performance bottleneck of traditional RF modules, realizes the unity of miniaturization, high performance, and strong environmental adaptability, and meets the stringent requirements of airborne satellite communication. Brief Description of the Drawings

[0033] The following further describes the present invention in conjunction with the drawings and specific embodiments. The protection scope of the present invention is not limited only to the description of the following content.

[0034] Figure 1 It is a schematic diagram of the 6-layer structure RF module of Embodiment 2.

[0035] Figure 2 It is a schematic diagram of the honeycomb-shaped ground layer design.

[0036] Figure 3 It is a schematic diagram of the stepped impedance transition structure. Detailed Embodiments

[0037] To make the objectives, technical solutions, and beneficial effects of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention.

[0038] As Figure 2-3 shown, a Ka and S band RF module for an airborne satellite communication antenna includes: A multi-layer structure, including multiple signal layers, multiple ground layers, at least one power layer, and at least one control layer; among them, the signal layers are laminated with low-loss materials Rogers RT / duroid 5880 and Taconic TLY-5, and inter-layer signal interconnection is achieved through blind vias and buried vias.

[0039] The ground layer adopts a double-layer copper foil structure, and a honeycomb copper plating pattern is laid on its surface. The hole positions of the honeycomb copper plating pattern are staggered from the blind vias and buried vias of the signal layer to enhance the electromagnetic shielding effect.

[0040] The power layer uses a PTFE substrate, and a π-type filter network is installed on the surface of the PTFE substrate through surface mount technology (SMT). The π-type filter network is electrically connected to the signal layer through buried vias.

[0041] The control layer uses an FR4 substrate, and microstrip lines with impedance matching are arranged on the surface of the FR4 substrate. The microstrip lines form a continuous impedance transition structure with the signal layer through blind vias.

[0042] Among them, the size of the RF module does not exceed 50mm×50mm×5mm, and the weight does not exceed 50 grams.

[0043] Preferably, the layout of the blind vias and buried vias is optimized and determined through a genetic algorithm, specifically including the following steps: S1. Construct a three-dimensional grid model of the RF module, abstract the signal layer, ground layer, power layer, and control layer into three-dimensional space grids, and each grid node represents a potential blind via or buried via position.

[0044] S2. Set constraint conditions, including: Constraint 1: The center distance between any two blind vias or buried vias needs to be ≥0.2mm; to avoid short circuits or signal interference caused by processing errors.

[0045] Constraint 2: The center position of the blind vias and / or buried vias is at least 0.5mm away from the physical edge of the module; to prevent material cracking or hole position damage during lamination.

[0046] Constraint 3: The blind vias and buried vias on the signal layer need to be staggered from the honeycomb copper plating pattern on the ground layer; to avoid direct overlap, thereby reducing electromagnetic leakage or impedance discontinuity.

[0047] S3. Based on the three-dimensional grid model, generate multiple initial layout schemes of blind vias and buried vias that meet the constraint conditions of S2.

[0048] S4. Calculate the node importance of the blind vias and buried vias; that is, evaluate the importance of each hole position to signal transmission and screen key nodes.

[0049] S5. Perform performance calculations to supplement the relevance of key hole positions. Specifically, for each initial layout plan, calculate the path length L and impedance matching error E of the signal from the starting point to the ending point. And it is necessary to ensure the path connectivity of the key hole positions (the nodes screened in S4) preferentially. Among them, for the path length L, all key hole positions need to be passed from the starting point to the ending point, and then the total length is calculated. For the impedance error E: Focus on accumulating the impedance mismatch components near the key hole positions.

[0050] S6. Iteratively optimize the blind via and buried via layouts based on the genetic algorithm and select the optimal plan. After obtaining multiple initial layout plans that meet the physical constraints in the previous steps, use the genetic algorithm to perform global search and optimization on the layout plans, with the objective function F = αL + βE as the fitness function, and preferably select the optimal blind via and buried via layout plan. Among them, α represents the weight of the path length, and β represents the weight of the impedance error. The value range is [0, 1], and α + β = 1.

[0051] Preferably, step S4 specifically includes: S4.1. Initialize the grid nodes corresponding to the potential blind vias and buried vias, and set the initial importance of all nodes corresponding to the blind vias and buried vias: S(0) = 1; ensure that each hole position has the same importance in the initial stage of optimization.

[0052] S4.2. Iteratively calculate the importance of the key nodes.

[0053] The iterative calculation formula for the node importance is: S(n + 1) = ΣS(t) * w.

[0054] Among them, w is the weight coefficient between adjacent nodes, which is jointly determined by the path length and impedance matching error; n represents the current iteration number, and t represents the adjacent nodes directly connected to the current node; determined based on the electrical connection relationship of the three-dimensional grid model.

[0055] When all nodes satisfy max∣S(n + 1)−S(n)∣<0.01, it is determined that the importance converges and the iteration is terminated.

[0056] S4.3. Record the importance S of each node, sort the importance S of each node in ascending order, and calculate the sorting ratio value r / N, where the ranking serial number of a certain node is recorded as r, and the total number of nodes is recorded as N; and screen the nodes with large ratio values as the positions of the key blind vias and buried vias.

[0057] After the importance of the nodes converges, sort the importance values S of all grid nodes in ascending order to generate the corresponding sorting serial number r; among them, r = 1 represents the node with the lowest importance, r = N represents the node with the highest importance, and N is the total number of nodes.

[0058] Then calculate the sorting ratio value r / N of each node, and select the node with a large sorting ratio value as the position of the key blind hole and buried hole, that is, the key hole position; for the node with r / N close to 1, it represents that its importance ranking is relatively high and it is more critical for signal transmission and impedance matching.

[0059] Preferably, the microstrip line includes a tapered section, the line width of the tapered section gradually changes along the signal path, and the tapered section is connected to the signal layer through blind holes to achieve continuous impedance transition.

[0060] Preferably, the manufacturing process of the RF module includes: performing laser pre-drilling on the positions of blind holes and buried holes before lamination to ensure high-precision positioning; filling the holes with conductive materials and then performing lamination to form a stable interlayer connection; wherein, the lamination temperature is 200°C and the lamination pressure is 10 Mpa; and performing electroless nickel-gold treatment after forming the microstrip line to improve welding reliability and corrosion resistance.

[0061] Preferably, the insertion loss of the RF module in the Ka band does not exceed 0.38 dB, the insertion loss in the S band does not exceed 0.12 dB, the isolation is not less than -35 dB, and the shielding effectiveness is not less than 40 dB.

[0062] In Embodiment 1, step S6 specifically includes: S6.1. Define the fitness function, and construct the objective function according to the signal path length L and the impedance error E near the key hole position: F = αL + βE; where: α and β are the weighting coefficients of the path length and impedance error respectively, and the value ranges are [0,1], and α + β = 1. The weight coefficients can be calibrated and set through expert experience or experimental data, and priority is given to ensuring the connectivity of the key hole positions and low impedance mismatch; L is the total path length from the starting point to the ending point passing through all key hole positions; E is the sum of the impedance mismatch components near each key hole position.

[0063] S6.2. Initialize the population and perform genetic operations: Use the multiple initial layout schemes generated in S3 as the initial population; each individual coding represents a complete layout of blind holes and buried holes (binary or real number coding can be used to represent whether each grid node is drilled); perform genetic operations on the population, including selection, crossover, and mutation, to generate a new generation of individuals.

[0064] S6.3. Evaluate and screen the optimal individual: Calculate the objective function value F of each generation of individuals and retain the best individual in the current generation; if the change in the F value for several consecutive generations is less than the preset threshold ε (such as 0.001), it is determined that the algorithm converges and the optimization is terminated; otherwise, continue to iterate until the maximum number of iterations is reached.

[0065] S6.4. Output the optimal layout scheme: Output the layout scheme of blind holes and buried holes with the best fitness in the final convergence state.

[0066] Example 2: As Figure 1 shown, an unmanned aerial vehicle (UAV)-borne radio frequency module.

[0067] 1. Prototype parameters: Number of layers: 6 layers (2 signal layers + 2 ground layers + 1 power layer + 1 control layer).

[0068] Dimensions: 50 mm × 50 mm × 5 mm.

[0069] Weight: 48 grams.

[0070] Operating frequency bands: Ka band (28 GHz), S band (3.5 GHz).

[0071] 2. Layer structure design: Signal layer: Material: Alternate lamination of Rogers RT / duroid 5880 and Taconic TLY-5.

[0072] Insertion loss: 0.35 dB @ 28 GHz, 0.10 dB @ 3.5 GHz.

[0073] Ground layer: Double-layer copper foil (total thickness 70 µm), honeycomb copper plating.

[0074] Shielding effectiveness: ≥40 dB @ 28 GHz.

[0075] Power layer: PTFE substrate, embedded π-type filter network.

[0076] Noise level: ≤ -60 dBm.

[0077] Control layer: FR4 substrate, 50Ω microstrip line design.

[0078] Crosstalk: ≤ -55 dB.

[0079] Signal path: Optimized by genetic algorithm, length 9.7 mm (reduced by 35%).

[0080] 3. Manufacturing process: Lamination process: Use a high-temperature and high-pressure laminator (temperature 200°C, pressure 10 MPa), interlayer bonding strength ≥1.5 N / mm.

[0081] Imaging and drilling: Laser direct imaging (LDI), line width accuracy ±5 µm.

[0082] UV laser drilling (wavelength 355 nm), blind hole and buried hole accuracy ±2 µm, filled with nano silver paste.

[0083] Surface treatment: Electroless nickel plating and gold plating (nickel thickness 3 µm, gold thickness 0.05 µm) to improve welding reliability.

[0084] 4. Performance Verification: Simulation Tool: ANSYS HFSS v19.2.

[0085] Testing Equipment: Vector Network Analyzer (Keysight N5247B, frequency range 10 MHz - 67 GHz).

[0086] Environmental Test Chamber (temperature -55°C to 125°C, humidity 0 - 95% RH).

[0087] Comparison Results: Ka Band (28 GHz): Traditional FR4 Module: Insertion Loss 2.8 dB, Return Loss -10 dB, Isolation -20 dB.

[0088] This Invention: Insertion Loss 0.35 dB, Return Loss -18 dB, Isolation -35 dB.

[0089] S Band (3.5 GHz): Traditional FR4 Module: Insertion Loss 0.5 dB, Return Loss -12 dB, Isolation -25 dB.

[0090] This Invention: Insertion Loss 0.12 dB, Return Loss -22 dB, Isolation -40 dB.

[0091] Environmental Test: High Temperature and High Humidity (85°C / 85% RH, 1000 hours): Performance Degradation 0.8%.

[0092] Vibration (20G, 10 - 2000 Hz): Impedance Change 0.3%.

[0093] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "preferred embodiments", "specific implementation manners", or "preferred implementation manners", etc. means that the specific features, structures, materials, or characteristics described in connection with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0094] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; thus, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope defined by the claims of the present invention.

Claims

1. A Ka and S-band radio frequency module for an airborne satellite communication antenna, characterized in that Comprising: A multi-layer structure, including multiple signal layers, multiple ground layers, at least one power supply layer, and at least one control layer; wherein, The signal layer is laminated by using low-loss materials Rogers RT / duroid 5880 and Taconic TLY-5, and inter-layer signal interconnection is achieved through blind vias and buried vias; The ground layer adopts a double-layer copper foil structure, and a honeycomb-shaped copper plating pattern is laid on its surface. The hole positions of the honeycomb-shaped copper plating pattern are staggered from the blind vias and buried vias of the signal layer to enhance the electromagnetic shielding effect; The power supply layer adopts a PTFE substrate, and a π-type filter network is installed on the surface of the PTFE substrate through surface mounting. The π-type filter network is electrically connected to the signal layer through buried vias; The control layer adopts an FR4 substrate, and microstrip lines with impedance matching are arranged on the surface of the FR4 substrate. The microstrip lines form a continuous impedance transition structure with the signal layer through blind vias; Wherein, the size of the radio frequency module does not exceed 50mm×50mm×5mm, and the weight does not exceed 50 grams.

2. The Ka and S-band radio frequency module for an airborne satellite communication antenna according to claim 1, characterized in that: The layout of the blind vias and buried vias is determined by optimizing through a genetic algorithm, specifically including the following steps: S1. Construct a three-dimensional grid model of the radio frequency module, abstract the signal layer, ground layer, power supply layer, and control layer into three-dimensional space grids, and each grid node represents a potential blind via or buried via position; S2. Set constraint conditions, including: Constraint condition 1: The center distance between any two blind vias or buried vias needs to be ≥0.2mm; Constraint condition 2: The center position of the blind vias and / or buried vias is at least 0.5mm away from the physical edge of the module; Constraint condition 3: The blind vias and buried vias on the signal layer need to be staggered from the honeycomb-shaped copper plating pattern on the ground layer; S3. Based on the three-dimensional grid model, generate multiple initial layout schemes of blind vias and buried vias that meet the constraint conditions of S2; S4. Calculate the node importance of the blind vias and buried vias; that is, evaluate the importance of each hole position to signal transmission and screen key nodes; S5. Perform performance calculation to supplement the relevance of key hole positions; specifically including: for each initial layout scheme, calculate the path length L and impedance matching error E of the signal from the starting point to the ending point; and it is necessary to ensure the path connectivity of key hole positions first; wherein, for the path length L, all key hole positions need to be passed from the starting point to the ending point, and then the total length is calculated; for the impedance error E, the impedance mismatch components of key hole positions are mainly accumulated; S6. Iteratively optimize the layout of the blind vias and buried vias based on the genetic algorithm and select the optimal scheme; after obtaining multiple initial layout schemes that meet the physical constraints in the previous steps, use the genetic algorithm to perform global search and optimization on the layout scheme, and use the objective function F = αL + βE as the fitness function to preferably select the optimal layout scheme of the blind vias and buried vias; wherein, α represents the weight of the path length, β represents the weight of the impedance error; the value range is [0, 1], and α + β = 1.

3. The Ka and S-band RF module for an airborne satellite communication antenna according to claim 2, characterized in that: Step S4 specifically includes: S4.

1. Initialize the grid nodes corresponding to the potential blind vias and buried vias, and set the initial importance of all nodes corresponding to the blind vias and buried vias: S(0) = 1; ensure that each hole position has the same importance in the initial stage of optimization; S4.

2. Iteratively calculate the importance of key nodes; The iterative calculation formula for node importance is: S(n + 1)=ΣS(t)*w; where w is the weight coefficient between adjacent nodes, which is jointly determined by the path length and impedance matching error; n represents the current iteration number, and t represents the adjacent nodes directly connected to the current node; When all nodes satisfy max∣S(n + 1)−S(n)∣<0.01, it is determined that the importance converges and the iteration is terminated; S4.

3. Record the importance S of each node, sort the importance S of each node in ascending order, and calculate the sorting proportion value r / N. Among them, the ranking number of a certain node is recorded as r, and the total number of nodes is recorded as N; and select the nodes with large proportion values as the positions of key blind vias and buried vias; After the node importance converges, sort the importance values S of all grid nodes in ascending order to generate the corresponding sorting serial number r; among them, r = 1 represents the node with the lowest importance, r = N represents the node with the highest importance, and N is the total number of nodes; Then calculate the sorting proportion value r / N of each node, and select the nodes with large sorting proportion values as the positions of key blind vias and buried vias, that is, the key hole positions.

4. The Ka and S-band radio frequency module for an airborne satellite communication antenna according to claim 1, characterized in that: The microstrip line includes a tapered section, the line width of the tapered section gradually changes along the signal path, and the tapered section is connected to the signal layer through blind vias to achieve continuous impedance transition.

5. The Ka and S-band radio frequency module for an airborne satellite communication antenna according to claim 1, characterized in that, The manufacturing process of the RF module includes: Before lamination, laser pre-drill the positions of blind vias and buried vias to ensure high-precision positioning; and fill the holes with conductive materials and then perform lamination to form a stable interlayer connection; among them, the lamination temperature is 200°C and the lamination pressure is 10 Mpa; and perform electroless nickel-gold plating treatment after forming the microstrip line to improve the welding reliability and corrosion resistance.

6. The Ka and S-band radio frequency module for an airborne satellite communication antenna according to claim 1, characterized in that: The insertion loss of the RF module in the Ka band does not exceed 0.38 dB, the insertion loss in the S band does not exceed 0.12 dB, the isolation is not less than -35 dB, and the shielding effectiveness is not less than 40 dB.

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