Heat dissipation module and electronic device

Abstract

The invention provides a heat dissipation module. The heat dissipation module comprises a bottom surface and a tunnel structure, the bottom surface comprises a first end, a second end, a first side and a second side, the first end is opposite to the second end, and the first side is opposite to the second side and is connected between the first end and the second end. The tunnel structure extends between the first side and the second side, the tunnel structure comprises a first port and a second port, the first port is closer to the first end than the second port, a channel is defined between the tunnel structure and the bottom surface, and the sectional area of the channel in the direction perpendicular to the bottom surface is gradually increased from the first port to the second port; the height change of the tunnel structure in the direction perpendicular to the bottom face is gradually increased from the first port to the second port. The invention further provides an electronic device comprising the heat dissipation module.

Description

Technical Field

[0001] The invention relates to a heat dissipation module and an electronic device. Background Art

[0002] As electronic devices become more popular, users have higher and higher requirements for the performance of electronic devices. Therefore, the number of components in electronic devices is increasing, resulting in a corresponding increase in the density of components in electronic devices. However, when electronic device components are operating, most of them will be accompanied by the generation of heat energy. Once the heat in the electronic device is not properly removed, it will significantly affect the performance of the electronic device.

[0003] In order to fully dissipate the heat of common components in electronic devices, such as circuit boards or expansion modules, fan modules are installed in the electronic devices to dissipate heat. In order to ensure the heat dissipation effect of the fan module, the heat dissipation module can also be used to increase the heat conduction area, and the heat dissipation purpose is achieved by airflow through the heat dissipation module. However, since the general heat dissipation module is composed of a plurality of parallel and spaced sheets, the airflow flowing through the heat dissipation module is limited, and the heat dissipation effect cannot be effectively improved, and needs to be improved. Summary of the invention

[0004] The present invention provides a heat dissipation module, comprising a bottom surface and a tunnel structure. The bottom surface comprises a first end, a second end, a first side and a second side, the first end is opposite to the second end, the first side is opposite to the second side and is respectively connected between the first end and the second end. The tunnel structure extends between the first side and the second side, the tunnel structure comprises a first port and a second port, the first port is closer to the first end than the second port, a channel is defined between the tunnel structure and the bottom surface, the cross-sectional area of the channel in a direction perpendicular to the bottom surface increases from the first port to the second port, and the height of the tunnel structure in a direction perpendicular to the bottom surface increases from the first port to the second port.

[0005] In some embodiments, the first end and the second end of the bottom surface extend along a first direction respectively, the first side and the second side extend along a second direction perpendicular to the first direction, and the tunnel structure includes a plurality of wings that are spaced apart from each other in the first direction.

[0006] In some embodiments, the wings include a plurality of first wings and a plurality of second wings, one end of the first wings is connected to the first side and extends toward the second side, one end of the second wings is connected to the second side and extends toward the first side, and there is a gap between the other end of the first wings and the other end of the second wings.

[0007] In some embodiments, the heat dissipation module further includes a covering member covering the notch.

[0008] In some embodiments, the wings are divided into a plurality of wing groups, each of the wing groups includes a plurality of wings, the shapes of the wings in each wing group are the same and parallel to each other, and the cross-sectional areas of the channels of the tunnel structure corresponding to each wing group in the direction perpendicular to the bottom surface are different from each other.

[0009] In some embodiments, the cross-sectional areas of the channels of the tunnel structure corresponding to each wing group in the direction perpendicular to the bottom surface increase from the first port to the second port.

[0010] The present invention further provides an electronic device, including a base, the heat source, and a heat dissipation module. The heat source is disposed on the base. The heat dissipation module is disposed on the heat source and includes a bottom surface and a tunnel structure. The bottom surface includes a first end, a second end, a first side, and a second side. The first end is opposite to the second end, the first side is opposite to the second side and is respectively connected between the first end and the second end, and the bottom surface abuts against the heat source. The tunnel structure extends between the first side and the second side. The tunnel structure includes a first port and a second port. The first port is closer to the first end than the second port. A channel is defined between the tunnel structure and the bottom surface. The change in the cross-sectional area of the channel in the direction perpendicular to the bottom surface increases from the first port to the second port, and the change in the height of the tunnel structure in the direction perpendicular to the bottom surface increases from the first port to the second port.

[0011] In some embodiments, the electronic device further includes a first heat conducting member disposed between the bottom surface of the heat dissipation module and the heat source.

[0012] In some embodiments, the electronic device further includes a second heat conducting member disposed between the base and the heat source.

[0013] In some embodiments, the electronic device further includes a circuit board, a connector, and a cooling device. The connector is electrically connected to the circuit board, the heat source is electrically connected to the connector, the cooling device faces the second port of the heat dissipation module, and the cooling device causes air flow to pass through the first port and the second port.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The heat dissipation module can contact a heat source through the bottom surface to conduct the heat generated by the heat source. The tunnel structure of the heat dissipation module can reduce the impedance of the surrounding air flow entering the heat dissipation module, assist the air flow to completely contact and pass through the tunnel structure of the heat dissipation module, increase the chance of the air flow contacting the heat dissipation module, and effectively improve the heat dissipation ability. Description of the Drawings

[0015] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein:

[0016] Figure 1 It is a schematic diagram of an embodiment of the heat dissipation module of the present invention;

[0017] Figure 2 It is a plan view of an embodiment of the heat dissipation module of the present invention;

[0018] Figure 3 It is a partial exploded view of an embodiment of the heat dissipation module of the present invention applicable to an electronic device Figure 1 ;

[0019] Figure 4 It is a partial exploded view of an embodiment of the heat dissipation module of the present invention applicable to an electronic device Figure 2 ;

[0020] Figure 5 It is a plan view of the usage state of an embodiment of the heat dissipation module of the present invention Figure 1 ;

[0021] Figure 6 It is a plan view of the usage state of an embodiment of the heat dissipation module of the present invention Figure 2 ;

[0022] Figure 7 It is an exploded view of an embodiment of the heat dissipation module of the present invention applicable to an electronic device;

[0023] Figure 8 It is an assembled view of an embodiment of the heat dissipation module of the present invention applicable to an electronic device;

[0024] Figure 9 It is an exploded view of another embodiment of the heat dissipation module of the present invention applicable to an electronic device;

[0025] Figure 10 It is a three - dimensional sectional view of an embodiment of the heat dissipation module of the present invention applicable to an electronic device; and

[0026] Figure 11 It is a plan sectional view of an embodiment of the heat dissipation module of the present invention applicable to an electronic device. Detailed Description of the Invention

[0027] Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same reference numerals.

[0028] Refer to Figures 1 to 4 , Figure 1 It is a schematic diagram of an embodiment of the heat dissipation module of the present invention; Figure 2 It is a plan view of an embodiment of the heat dissipation module of the present invention; Figure 3 It is a partial exploded view of an embodiment of the heat dissipation module of the present invention applicable to an electronic device Figure 1 ;Figure 4 Partial exploded schematic diagram of one embodiment of the heat dissipation module of the present invention applicable to an electronic device Figure 2 The heat dissipation module R is adapted to contact the heat source H to dissipate the heat generated by the heat source H to achieve a cooling effect. The heat source H can be, but is not limited to, an electronic component that generates heat during operation, such as, but not limited to, a central processing unit (CPU), a dual in-line memory module (DIMM), a south bridge chip (PCH), or a solid-state drive module (such as a solid-state storage module with an M.2 connector). The following heat source H is described by taking a solid-state storage module with an M.2 connector as an example, but the present case is not limited thereto.

[0029] Refer to Figure 1 and Figure 2 , the heat dissipation module R includes a bottom surface 10 and a tunnel structure 20. The bottom surface 10 includes a first end 11, a second end 12, a first side 13, and a second side 14. The first end 11 is opposite to the second end 12, and the first side 13 is opposite to the second side 14 and is respectively connected between the first end 11 and the second end 12. The tunnel structure 20 extends between the first side 13 and the second side 14. The tunnel structure 20 includes a first port 201 and a second port 202. The first port 201 is closer to the first end 11 than the second port 202. A channel P is defined between the tunnel structure 20 and the bottom surface 10. The cross-sectional area of the channel P in the direction perpendicular to the bottom surface 10 increases from the first port 201 to the second port 202, and the height of the tunnel structure 20 in the direction perpendicular to the bottom surface 10 increases from the first port 201 to the second port 202.

[0030] Thereby, the heat dissipation module R can contact the heat source H through the bottom surface 10 to conduct the heat generated by the heat source H. The tunnel structure 20 of the heat dissipation module R can reduce the impedance of the surrounding air flow entering the heat dissipation module R, assist the air flow to completely contact and pass through the tunnel structure 20 of the heat dissipation module R, increase the chance of the air flow contacting the heat dissipation module R, and effectively improve the heat dissipation capacity.

[0031] In some embodiments, the bottom surface 10 and the tunnel structure 20 of the heat dissipation module R are a single-piece structure integrally formed of the same material. Preferably, the bottom surface 10 and the tunnel structure 20 of the heat dissipation module R are made of a high thermal conductivity material, such as, but not limited to, aluminum, aluminum alloy, copper, copper alloy, silver, silver alloy, high thermal conductivity graphite sheet, or a high thermal conductivity material.

[0032] Refer to Figures 1 to 4 , in some embodiments, the shape of the bottom surface 10 is rectangular. In these embodiments, the first end 11 and the second end 12 of the bottom surface 10 are parallel and opposite to each other, the first side 13 and the second side 14 are parallel and opposite to each other, and the first side 13 and the second side 14 are respectively perpendicular to the first end 11 and the second end 12. Herein, the first end 11 and the second end 12 extend along a first direction D1, and the first side 13 and the second side 14 extend along a second direction D2 perpendicular to the first direction D1.

[0033] Refer to Figures 1 to 4 , the tunnel structure 20 is located on one side of the bottom surface 10 and extends between the first side 13 and the second side 14. The tunnel structure 20 forms a first port 201 at the position of the first end 11 adjacent to the bottom surface 10, and the tunnel structure 20 forms a second port 202 at the position of the second end 12 adjacent to the bottom surface 10. Moreover, a channel P for air flow is formed between the first port 201, the second port 202 of the tunnel structure 20 and the bottom surface 10. Herein, the first port 201 and the second port 202 of the heat dissipation module R serve as the entrances and exits for air to enter or exit the heat dissipation module R, and can be guided by the tunnel structure 20 to flow through the channel P along the second direction D2.

[0034] Refer to Figures 1 to 4 , in some embodiments, the tunnel structure 20 includes a plurality of wing portions 21, and the wing portions 21 are strip-shaped structures. In these embodiments, one end of each wing portion 21 is connected to the first side 13 or the second side 14 of the bottom surface 10.

[0035] Refer to Figures 1 to 4 , in some embodiments where the tunnel structure 20 includes a plurality of wing portions 21, the positions of the wing portions 21 disposed on the bottom surface 10 are spaced apart from each other in the second direction D2, so that there is a gap G between the adjacent wing portions 21 of the tunnel structure 20 spaced apart in the second direction D2. In this way, when the air flow enters the channel P of the heat dissipation module R along the second direction D2, the gap G between the adjacent wing portions 21 spaced apart from each other can serve as a pressure relief duct, further reducing the impedance in the channel P, and can also break the boundary layer of the velocity and temperature between the air flow and the heat dissipation module R to generate an eddy current effect, maintaining the flow rate of the air flow passing through the heat dissipation module R.

[0036] In some embodiments where the wing portion 21 is a strip-shaped structure, the length between the two ends of the wing portion 21 can be greater than or less than the distance between the first side 13 and the second side 14 of the bottom surface 10 in the first direction D1. In some embodiments, the length between the two ends of the wing portion 21 is greater than the distance between the first side 13 and the second side 14 in the first direction D1 (i.e., when the cross-sectional area of the channel P of the tunnel structure 20 is larger). In these embodiments, the wing portion 21 can be selectively connected to the first side 13 and the second side 14 of the bottom surface 10 at both ends, or one end of the wing portion 21 can be connected to the first side 13 or the second side 14 of the bottom surface 10. That is to say, in some embodiments where the length between the two ends of the wing portion 21 is greater than the distance between the first side 13 and the second side 14 in the first direction D1, the wing portion 21 is not limited to being connected to the bottom surface 10 at both ends, and can also be connected to the bottom surface 10 at only one end.

[0037] The wing portion 21 extends completely between the first side 13 and the second side 14 of the bottom surface 10, thereby forming a part of the channel P between the wing portion 21 and the bottom surface 10.

[0038] Refer to Figures 1 to 4 In some embodiments, the length between the two ends of the wing portion 21 is less than the distance between the first side 13 and the second side 14 in the first direction D1. In these embodiments, one end of the wing portion 21 is connected to the first side 13 or the second side 14 of the bottom surface 10, and the other end of the wing portion 21 extends between the first side 13 and the second side 14 of the bottom surface 10. Herein, a plurality of wing portions 21 are respectively arranged on the first side 13 and the second side 14 of the bottom surface 10, and the wing portions 21 are spaced from each other in the first direction D1, and the wing portions 21 on the first side 13 and the second side 14 are opposite to each other in pairs. That is to say, the wing portions 21 are provided at the same position in the second direction D2 on the first side 13 and the second side 14 of the bottom surface 10, whereby the wing portions 21 are arranged symmetrically on the bottom surface 10, and a part of the channel P for air flow is formed between the wing portions 21 at the same position in the second direction D2 and the bottom surface 10. Thereby, the overall heat dissipation module R can be formed into the tunnel structure 20 by bending a single sheet, reducing the manufacturing difficulty.

[0039] Refer to Figures 1 to 4 In some embodiments, the length between the two ends of the wing portion 21 is less than the distance between the first side 13 and the second side 14 in the first direction D1, and the wing portion 21 includes a connecting section 211 and an extending section 212 which are connected at an angle, and the wing portion 21 is connected to the first side 13 or the second side 14 by the connecting section 211. In some embodiments, there is a first included angle θ1 between the connecting section 211 and the bottom surface 10, a second included angle θ2 between the connecting section 211 and the extending section 212, and the extending section 212 is parallel to the bottom surface 10. In these embodiments, through the angle configuration of the wing portion 21, the difficulty of bending and forming the wing portion 21 can be reduced. It should be noted that the shape of the wing portion 21 is not limited to this embodiment. In other embodiments, the wing portion 21 may also be in a curved arc shape with a non-fixed specific included angle relative to the bottom surface 10 but having a radian.

[0040] Refer to Figures 1 to 4 In some embodiments where there is a first included angle θ1 between the wing portion 21 and the bottom surface 10 of the tunnel structure 20 and the wing portion 21 itself has a second included angle θ2, the first included angle θ1 of the plurality of wing portions 21 of the tunnel structure 20 changes gradually along the second direction D2, while the second included angle θ2 of the wing portion 21 itself remains consistent. Specifically, the first included angle θ1 of each wing portion 21 of the tunnel structure 20 may increase gradually along the second direction D2, and the first included angle θ1 of each wing portion 21 of the tunnel structure 20 may also decrease gradually along the second direction D2. In addition, the height of each wing portion 21 of the tunnel structure 20 in the direction perpendicular to the bottom surface 10 may increase gradually along the second direction D2, and the height of each wing portion 21 of the tunnel structure 20 in the direction perpendicular to the bottom surface 10 may also decrease gradually along the second direction D2.

[0041] Refer toFigures 1 to 4 , for the sake of clear illustration, in some embodiments where the length between the two ends of the wing portion 21 is less than the distance between the first side 13 and the second side 14 in the first direction D1, the wing portion 21 that is connected to the first side 13 at only one end is referred to as the first wing portion 21A, and the wing portion 21 that is connected to the second side 14 at only one end is referred to as the second wing portion 21B. There is a notch B between the other end of the first wing portion 21A and the other end of the second wing portion 21B.

[0042] Refer to Figures 2 to 4 , in some embodiments where the wing portion 21 includes the first wing portion 21A and the second wing portion 21B, the heat dissipation module R further includes a covering member 30. The covering member 30 covers the notch B between the first wing portion 21A and the second wing portion 21B, improving the sealing of the channel P between the first wing portion 21A, the second wing portion 21B, and the bottom surface 10. Specifically, the covering member 30 is respectively connected to the ends of the first wing portion 21A and the second wing portion 21B that are not connected to the bottom surface 10 to shield the notch B formed between the end of the first wing portion 21A that is not connected to the bottom surface 10 and the end of the second wing portion 21B that is not connected to the bottom surface 10. Thereby, it can be avoided that the air flow passing through the channel P leaves the channel P from the notch B prematurely, ensuring that the air flow can completely pass through the channel P and maintaining the heat dissipation effect of the heat dissipation module R. It can also reduce or avoid the vibration of the wing portion 21 caused by the air flow passing through the channel P.

[0043] Refer to Figures 1 to 4 , in some embodiments where the tunnel structure 20 includes a plurality of wing portions 21, the wing portions 21 of the tunnel structure 20 are divided into a plurality of wing portion groups 21G. Each wing portion group 21G respectively includes a plurality of wing portions 21. The shapes of the wing portions 21 in each wing portion group 21G can be the same or different and parallel to each other. And among the cross-sectional areas of each wing portion group 21G in the direction perpendicular to the bottom surface 10, at least two wing portion groups 21G have different cross-sectional areas in the direction perpendicular to the bottom surface 10. It can also be that the cross-sectional areas of each wing portion group 21G in the direction perpendicular to the bottom surface 10 are all different from each other.

[0044] Such as Figure 1 and Figure 2In some of the illustrated embodiments, the tunnel structure 20 includes a first wing group 21G1, a second wing group 21G2, a third wing group 21G3, and a fourth wing group 21G4 arranged in sequence along the second direction D2. The first wing group 21G1 is closest to the first end 11 of the bottom surface 10, the fourth wing group 21G4 is closest to the second end 12 of the bottom surface 10, the second wing group 21G2 is closer to the second end 12 than the first wing group 21G1, and the third wing group 21G3 is closer to the second end 12 than the second wing group 21G2. In these embodiments, the first port 201 of the tunnel structure 20 is formed in the first wing group 21G1, the second port 202 is formed in the fourth wing group 21G4, and the cross-sectional area of the channel P in the direction perpendicular to the bottom surface 10 increases from the first port 201 to the second port 202. Herein, the cross-sectional area of the channel P in the direction perpendicular to the bottom surface 10 increases in sequence for the first wing group 21G1, the second wing group 21G2, the third wing group 21G3, and the fourth wing group 21G4.

[0045] Referring to Figure 2 , specifically, the first included angles θ1 of the wings 21 of each wing group 21G are the same as each other, and the second included angles θ2 of the wings 21 of each wing group 21G are the same as each other. In these embodiments, the first included angle θ1 of the wings 21 of the first wing group 21G1 is less than the first included angle θ1 of the wings 21 of the second wing group 21G2; the first included angle θ1 of the wings 21 of the second wing group 21G2 is less than the first included angle θ1 of the wings 21 of the third wing group 21G3; and the first included angle θ1 of the wings 21 of the third wing group 21G3 is less than the first included angle θ1 of the wings 21 of the fourth wing group 21G4. In addition, the height of the extension section 212 of the wings 21 of the first wing group 21G1 in the direction perpendicular to the bottom surface 10 is less than the height of the extension section 212 of the wings 21 of the second wing group 21G2 in the direction perpendicular to the bottom surface 10; the height of the extension section 212 of the wings 21 of the second wing group 21G2 in the direction perpendicular to the bottom surface 10 is less than the height of the extension section 212 of the wings 21 of the third wing group 21G3 in the direction perpendicular to the bottom surface 10; and the height of the extension section 212 of the wings 21 of the third wing group 21G3 in the direction perpendicular to the bottom surface 10 is less than the height of the extension section 212 of the wings 21 of the fourth wing group 21G4 in the direction perpendicular to the bottom surface 10.

[0046] Accordingly, in terms of the change in cross-sectional area in the direction perpendicular to the bottom surface 10, the cross-sectional area of the channel P at the position of the first wing group 21G1 is smaller than the cross-sectional area of the channel P at the position of the second wing group 21G2; the cross-sectional area of the channel P at the position of the second wing group 21G2 is smaller than the cross-sectional area of the channel P at the position of the third wing group 21G3; and the cross-sectional area of the channel P at the position of the third wing group 21G3 is smaller than the cross-sectional area of the channel P at the position of the fourth wing group 21G4.

[0047] Accordingly, the air flow can enter from the second port 202 having a larger cross-sectional area relative to the first port 201 (as Figure 5 shown), and the configuration of the tunnel structure 20 can reduce the impedance of the air flow entering the tunnel structure 20, ensuring sufficient air flow enters the heat dissipation module R and ensuring the heat dissipation efficiency of the heat dissipation module R; the air flow can also be extracted from the second port 202 having a large cross-sectional area (as Figure 6 shown), and the configuration of the tunnel structure 20 reduces the impedance of the air flow being extracted from the tunnel structure 20, forcing the air flow to be drawn into and flow through the tunnel structure 20, ensuring the heat dissipation efficiency of the heat dissipation module R.

[0048] In some embodiments where the wing part 21 of the tunnel structure 20 is divided into a plurality of wing groups 21G, the heat dissipation module R includes a cover 30, and the number of covers 30 can be single or plural. In these embodiments, a plurality of covers 30 can be respectively arranged on each wing group 21G, or a single cover 30 can cover all wing groups 21G. Accordingly, the wing parts 21 can be more flexibly configured such that both ends are connected to the bottom surface 10 or only one end is connected to the bottom surface 10, improving the configuration freedom.

[0049] Refer to Figure 3 、 Figure 4 、 Figure 7 and Figure 8 , Figure 7 which are exploded schematic views of some embodiments of the heat dissipation module R used in the electronic device E; Figure 8 which are combined schematic views of some embodiments of the heat dissipation module R used in the electronic device E. In some embodiments, the electronic device E includes a base E1, a heat source H, and a heat dissipation module R. The heat source H is arranged on the base E1, and the heat dissipation module R can dissipate heat from the heat source H inside the electronic device E.

[0050] The base E1 is used to carry the heat source H. Therefore, the form of the base E1 can be determined according to the different appearance forms of the heat source H, and this case is not limited thereto. In some embodiments, the base E1 includes a support surface E11, and the heat source H is supported by the support surface E11 of the base E1. In these embodiments, the heat dissipation module R abuts against the heat source H with the bottom surface 10 to dissipate heat from the heat source H sufficiently.

[0051] Refer to Figure 7, in some embodiments, the base E1 further includes two side stoppers E12, and the two side stoppers E12 are perpendicular to the support surface E11 and are connected to opposite sides of the support surface E11. Thus, when the heat source H is disposed on the base E1, it can be stopped by each side stopper E12 to improve the stability of the load on the base E1. In some embodiments, the base E1 can be integrally bent from a single sheet structure to form the support surface E11 and the side stoppers E12.

[0052] Refer to Figure 7 , in some embodiments, the base E1 further includes a stopper E13, and the stopper E13 is perpendicular to the support surface E11 and is connected to one end of the support surface E11 in the second direction D2. Thus, when the heat source H is disposed on the base E1, it can be stopped by the stopper E13 to limit the sliding of the heat source H in the second direction D2, and improve the stability of the load of the heat source H on the base E1. In some embodiments, the base E1 can be integrally bent from a single sheet structure to form the support surface E11 and the stopper E13.

[0053] Refer to Figures 9 to 11 , in some embodiments, the bottom surface 10 of the heat dissipation module R further includes a positioning portion 15, and the base E1 further includes a fixing portion E14. In these embodiments, the heat dissipation module R and the base E1 can be fixed by sleeving the fixing member F on the positioning portion 15 of the heat dissipation module R and the fixing portion E14 of the base E1.

[0054] In some embodiments, the positioning portion 15 of the heat dissipation module R is connected to the first side 13 and the second side 14 of the bottom surface 10 and is adjacent to the first end 11 and the second end 12. As Figure 9 shown in the embodiment, the heat dissipation module R includes four positioning portions 15, which are respectively located on the first side 13 and the second side 14 adjacent to the first end 11, and the first side 13 and the second side 14 adjacent to the second end 12. Specifically, the positioning portion 15 is arc-shaped and extends on the bottom surface 10 with the same side as the tunnel structure 20.

[0055] The fixing portion E14 of the base E1 is connected to the surface of the support surface E11 opposite to the side stopper E12. As Figure 10 , Figure 11 shown in the embodiment, the base E1 includes four fixing portions E14, which are respectively located on opposite sides adjacent to both ends of the base E1 in the second direction D2. Specifically, when the heat source H is disposed in the base E1 and the heat dissipation module R abuts against the heat source H, the positions of the positioning portion 15 of the heat dissipation module R and the fixing portion E14 of the base E1 correspond to each other. Thus, both ends of the fixing member F can be respectively sleeved on the positioning portion 15 of the heat dissipation module R and the fixing portion E14 of the base E1 to fix the heat dissipation module R and the base E1. In some embodiments, the fixing member F can be made of a material with elastic restoring force, thereby providing a more effective fixing effect and improving the convenience of use.

[0056] Refer to Figures 9 to 11 Figures 9 to 11 , in some embodiments where the heat source H is disposed on the base E1 and dissipates heat through the heat dissipation module R, a first heat conducting member 40 is further included. The first heat conducting member 40 is disposed between the bottom surface 10 of the heat dissipation module R and the heat source H, thereby improving the heat conduction efficiency between the heat source H and the heat dissipation module R.

[0057] Refer to Figures 9 to 11 Figures 9 to 11 , in some embodiments where the heat source H is disposed on the base E1 and dissipates heat through the heat dissipation module R, a second heat conducting member 50 is further included. The second heat conducting member 50 is disposed between the base E1 and the heat source H, thereby improving the heat conduction efficiency between the heat source H and the base E1.

[0058] Refer to Figures 5 to 7 Figures 5 to 7 , in some embodiments, the electronic device E further includes a circuit board E2 and a connector E3. The connector E3 is electrically connected to the circuit board E2, and the heat source H is electrically connected to the connector E3. In these embodiments, the electronic device E includes a cooling device C, and a cooling air flow is provided through the cooling device C to improve the heat dissipation efficiency of the heat dissipation module R. Herein, the cooling device C may be a fan, and the cooling device C is not limited to a blowing fan or an exhausting fan.

[0059] Refer to Figure 5 and Figure 7 Figure 7 , in some embodiments where the cooling device C is a blowing fan, the cooling device C blows air towards the second port 202 of the heat dissipation module R, so that the air flow is blown into the heat dissipation module R from the second port 202 of the tunnel structure 20 of the heat dissipation module R. After the air flow passes through the channel P, it is output from the first port 201. Thereby, due to the low impedance of the large-diameter second port 202, the cooling air flow can fully enter the tunnel structure 20 from the second port 202, and the small-diameter first port 201 has a reduced diameter and an increased flow rate, so that the air flow is forced to be quickly output from the first port 201, thereby enabling the air flow to smoothly and completely flow through the tunnel structure 20 and ensuring the heat dissipation effect of the heat dissipation module R.

[0060] Refer to Figure 6 and Figure 7, in some embodiments where the cooling device C is a suction fan, the cooling device C sucks air towards the second port 202 of the heat dissipation module R, causing the air flow to be sucked out from the second port 202 of the tunnel structure 20 of the heat dissipation module R. The active suction force is applied by the large-diameter second port 202. A large amount of gas is actively sucked out from the channel P of the tunnel structure 20 by the large-diameter second port 202, forcing the gas to enter the channel P of the tunnel structure 20 from the small-diameter second port 202. Thus, since the active suction force is applied by the large-diameter second port 202, a large amount of gas inside the tunnel structure 20 can be pumped out from the second port 202. In this way, the gas outside the tunnel structure 20 can enter the tunnel structure 20 from the small-diameter first port 201, enabling the air flow to be forced to smoothly and completely circulate through the tunnel structure 20, ensuring the heat dissipation effect of the heat dissipation module R.

[0061] It should be noted that in some embodiments where the heat dissipation module R is fixed to the base E1 through the fixing member F, the heat dissipation module R can be disassembled or assembled simply by disassembling and assembling the fixing member F. This can facilitate changing the direction of the heat dissipation module R. Optionally, the first port 201 can face the connector E3 (such as Figure 4 state) or the second port 202 can face the connector E3 (such as Figure 3 state). Thus, it can adapt to different space configurations or cooling devices C with different characteristics, improving the applicability of the heat dissipation module R.

[0062] Refer to Figure 3 、 Figure 4 and Figure 7 , in some embodiments, the bottom surface 10 of the heat dissipation module R further includes a first avoidance opening 16 and a second avoidance opening 17. The first avoidance opening 16 is located at the first end 11, and the second avoidance opening 17 is located at the second end 12. Thus, when the heat source H is disposed on the base E1, and the heat dissipation module R is abutted against the heat source H and disposed on the circuit board E2, the first avoidance opening 16 or the second avoidance opening 17 can allow the screw locking member for locking the heat source H to the circuit board E2 to pass through and be locked to the circuit board E2, thereby improving the stability between the heat source H and the circuit board E2. In these embodiments, since the bottom surface 10 is provided with the first avoidance opening 16 and the second avoidance opening 17, therefore, when the heat dissipation module R changes its assembly direction to adapt to the surrounding space configuration or the configuration of the cooling device C, it can provide an avoidance space for the screw locking member, improving the applicability.

[0063] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A heat dissipation module, characterized in that, Comprising: A bottom surface, including a first end, a second end, a first side, and a second side, the first end being opposite to the second end, the first side being opposite to the second side and respectively connecting between the first end and the second end; and A tunnel structure extending between the first side and the second side, the tunnel structure including a first port and a second port, the first port being closer to the first end than the second port, a channel being defined between the tunnel structure and the bottom surface, the cross-sectional area of the channel in a direction perpendicular to the bottom surface increasing from the first port to the second port, and the height of the tunnel structure in a direction perpendicular to the bottom surface increasing from the first port to the second port.

2. The heat dissipation module according to claim 1, wherein, The first end and the second end of the bottom surface respectively extend along a first direction, the first side and the second side extend along a second direction perpendicular to the first direction, the tunnel structure includes a plurality of wing parts, and the wing parts are spaced from each other in the first direction.

3. The heat dissipation module according to claim 2, wherein, The wing parts include a plurality of first wing parts and a plurality of second wing parts. One end of the first wing parts is connected to the first side and extends towards the second side, one end of the second wing parts is connected to the second side and extends towards the first side, and there is a notch between the other ends of the first wing parts and the other ends of the second wing parts.

4. The heat dissipation module according to claim 3, wherein Further comprising a covering member covering the notch.

5. The heat dissipation module according to claim 2, characterized in that, The wing parts are divided into a plurality of wing part groups, each of the wing part groups includes a plurality of wing parts, the shapes of the wing parts in each wing part group are the same and parallel to each other, and the cross-sectional areas of the channel of the tunnel structure corresponding to each wing part group in a direction perpendicular to the bottom surface are different from each other.

6. The heat dissipation module according to claim 5, characterized in that, The cross-sectional areas of the channel of the tunnel structure corresponding to each wing part group in a direction perpendicular to the bottom surface increase from the first port to the second port.

7. An electronic device, characterized in that, Comprising: A base; A heat source disposed on the base; and A heat dissipation module disposed on the heat source, including: A bottom surface, including a first end, a second end, a first side, and a second side, the first end being opposite to the second end, the first side being opposite to the second side and respectively connecting between the first end and the second end, the bottom surface abutting against the heat source; And A tunnel structure extending between the first side and the second side, the tunnel structure including a first port and a second port, the first port being closer to the first end than the second port, a channel being defined between the tunnel structure and the bottom surface, the cross-sectional area of the channel in a direction perpendicular to the bottom surface increasing from the first port to the second port, and the height of the tunnel structure in a direction perpendicular to the bottom surface increasing from the first port to the second port.

8. The electronic device according to claim 7, wherein Further comprising a first heat conducting member disposed between the bottom surface of the heat dissipation module and the heat source.

9. The electronic device according to claim 7 or 8, characterized in that, Further comprising a second heat conducting member disposed between the base and the heat source.

10. The electronic device according to claim 7, characterized in that, Further comprising a circuit board, a connector, and a cooling device. The connector is electrically connected to the circuit board, the heat source is electrically connected to the connector, the cooling device faces the second port of the heat dissipation module, and the cooling device causes air flow to pass through the first port and the second port.

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