Electronic device

Abstract

The invention provides electronic equipment. The electronic equipment comprises an equipment body, a heat source and a heat dissipation system, the heat source and the heat dissipation system are arranged on the equipment body, the equipment body is provided with a containing cavity, the containing cavity comprises a first cavity and a second cavity which are communicated, the height of the first cavity is larger than that of the second cavity, and at least part of the heat source is located in the second cavity. The heat dissipation system comprises a heat dissipation structure and heat dissipation fans, the heat dissipation fans comprise first fans, the first fans are axial flow fans, cross-flow fans and / or first centrifugal fans, the first fans are arranged in the first cavity, the heat dissipation structure comprises first heat dissipation modules corresponding to the first fans, and the first heat dissipation modules are located on the sides, close to a heat source, of the first fans. The electronic equipment provided by the invention can consider noise, thermal design power and whole machine thickness.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and particularly to an electronic device. Background Art

[0002] With the development of electronic devices towards high-performance trends, the power consumption of electronic components such as control chips and graphics processing units (GPUs) in electronic devices has been continuously increasing. The increase in the power consumption of these electronic components such as control chips and graphics processing units (GPUs) will lead to an increase in the thermal design power (TDP) of these electronic components. Also, since the heat dissipation performance of the heat dissipation system in an electronic device needs to match the TDP of these electronic components during design.

[0003] However, with the setting method of related technologies for the heat dissipation system, it is very difficult to improve the heat dissipation performance. For example, if a larger-sized heat dissipation fan is used, it will cause an increase in the overall thickness of the electronic device, which is not conducive to the thin and light design of the electronic device. Summary of the Invention

[0004] This application provides an electronic device, which improves the problem that it is difficult for existing electronic devices to balance the overall thickness and heat dissipation performance.

[0005] To achieve the above object, this application adopts the following technical solutions:

[0006] In a first aspect, an electronic device is provided. The electronic device includes a device main body, a heat source disposed on the device main body, and a heat dissipation system. The device main body has a receiving cavity, an air inlet structure, and an air outlet structure that are all communicated with the receiving cavity. The receiving cavity includes a first cavity and a second cavity that are communicated with each other. The height of the first cavity is greater than the height of the second cavity, and the volume of the first cavity is smaller than the volume of the second cavity. At least a part of the heat source is located in the second cavity. The heat dissipation system includes a heat dissipation fan. The heat dissipation fan includes a first fan, and at least a part of the first fan is disposed in the first cavity. The first fan is used for dissipating heat from at least a part of the heat source.

[0007] The electronic device provided by this implementation method changes the installation position of at least some of the fans (the first fans) in the cooling fan, so that the installation position of the cooling fan is no longer limited to the second cavity with a smaller height. At least part of the first fans can be arranged in the first cavity with a larger height. In this way, on the one hand, the type of the first fans is no longer limited to centrifugal fans, and fans with a larger height or thickness and a larger air volume, such as axial fans and cross-flow fans, can be selected, which is convenient for improving the heat dissipation performance of the heat dissipation system; on the other hand, all or part of the heat source is arranged in the second cavity. According to the usage requirements, the first cavity can be provided with only the first fans, or mainly provided with the first fans. In this way, the number of the first fans can be set as many as possible, or the length can be larger, so that the air volume output by the first fans can be larger, thereby helping to improve the heat dissipation performance of the heat dissipation system.

[0008] In addition, the installation of the first fans makes use of the first cavity with a relatively large height in the electronic device, and the volume of the first cavity is smaller than that of the second cavity. In this way, even if the thickness of the part of the device body where the first cavity is set is greater than the thickness of the part where the second cavity is set, it is only a local large thickness and it is not easy to cause an increase in the overall thickness of the electronic device. It can be seen that the electronic device provided by this implementation method can take into account both the overall thickness and the heat dissipation performance.

[0009] In some implementation methods, the heat dissipation system includes a heat dissipation structure. The heat dissipation structure includes a first heat dissipation module corresponding to the first fans. The first heat dissipation module is thermally connected to at least part of the heat source, and the first heat dissipation module is located on the side of the first fans close to the heat source.

[0010] The first heat dissipation module being thermally connected to at least part of the heat source means that the heat source includes a plurality of electronic components or parts. According to the heat dissipation requirements, the first heat dissipation module can be thermally connected to all the electronic components or parts in the heat source, or only to a part of the electronic components or parts in the heat source. The other part of the electronic components or parts can dissipate heat through air flow or with the help of a circuit board, etc.

[0011] In the related art, the heat dissipation structure is generally disposed on the air outlet side of the heat dissipation fan, and the gas discharged by the heat dissipation fan can only be discharged from the electronic device after passing through the heat dissipation structure. In this implementation, the relative positions of the first fan, the first heat dissipation module in the heat dissipation structure, and the heat source are changed, so that the first heat dissipation module is no longer located on the air outlet side of the first fan, but is changed to be located on the air inlet side of the first fan. In this way, the gas discharged by the first fan can be discharged from the electronic device without passing through the first heat dissipation module, which can reduce the resistance of the gas discharged by the first fan, thereby reducing the probability of turbulence of the above gas in the accommodation cavity, enabling the gas to be discharged from the electronic device smoothly and quickly. On the one hand, this can improve the flow rate of the gas in the accommodation cavity to a certain extent, thereby improving the heat dissipation efficiency of the electronic device. On the other hand, it can also reduce the noise to a certain extent, and can improve the user experience to a certain extent.

[0012] In some implementations, the first fan includes at least one of an axial flow fan, a cross-flow fan, and a first centrifugal fan.

[0013] Among them, the centrifugal fan can generate a relatively high static pressure, and can provide a large air flow rate and pressure in a small space, which is suitable for electronic devices that need to overcome large resistance and are compact. Also, because the centrifugal fan structure design can better handle the internal air flow and can be designed into a system with better sealing, using the first centrifugal fan for the first fan helps to reduce the entry of dust and other pollutants into the motor and bearing parts of the first fan, thereby improving the reliability and stability of the long-term operation of the first fan.

[0014] Both the axial flow fan and the cross-flow fan can achieve low-noise operation. When the first fan is an axial flow fan and / or a cross-flow fan, on the first hand, the first fan is an axial flow fan and / or a cross-flow fan, which can achieve low-noise and large-airflow operation compared with the centrifugal fan, can balance noise and TDP, and can improve the user experience to a certain extent; on the second hand, the installation position of the first fan is no longer in the second cavity with a relatively small height in the electronic device, but is installed in the first cavity with a relatively large height. In this way, even if the height of the first fan is greater than that of the centrifugal fan in the related art, it is not easy to increase the overall thickness of the electronic device, and the thickness of the electronic device can be balanced. Thus, when the first fan is an axial flow fan and / or a cross-flow fan, the electronic device can balance noise, TDP, and the overall thickness of the machine.

[0015] In some implementations, the first cavity has a length direction, and a plurality of first fans are provided, and the plurality of first fans are arranged in sequence along the length direction of the first cavity. This can increase the number of first fans provided, which helps to improve the heat dissipation efficiency of the electronic device.

[0016] In some implementations, the first fan includes a first centrifugal fan. The first centrifugal fan is inclined so that the air inlet of the first centrifugal fan faces the first heat dissipation module, and the air outlet of the first centrifugal fan faces at least part of the air outlet structure. The first centrifugal fan is inclined so that the air outlet of the first centrifugal fan is not easily perpendicular to the inner wall of the accommodation cavity, thereby reducing the probability that the first centrifugal fan is blocked by the inner wall of the accommodation cavity and facilitating the discharge of air flow.

[0017] In some implementations, the first cavity has a length direction, and there are multiple first centrifugal fans. The multiple first centrifugal fans are arranged at intervals along the length direction of the first cavity.

[0018] On the one hand, the space between two adjacent first centrifugal fans can allow air flow to pass through, reducing the resistance of the gas flowing from the channel to the air outlet structure, thereby improving the heat dissipation rate to a certain extent. On the other hand, when the scheme of the figure is adopted, if the first protruding part and the main body part are separate structures, connection points, such as hot melt connection points, can be set at the gaps between two adjacent first centrifugal fans to make the connection between the first protruding part and the main body part stable.

[0019] In some implementations, the first centrifugal fan is fixed in the device main body through a fixing member. When the first centrifugal fan is fixed through the fixing member, the original structure in the accommodation cavity can be unchanged, which is convenient for preparation and assembly.

[0020] In some implementations, the fixing member is fixedly installed on the inner wall of the device main body. The fixing member is provided with a clamping structure, and the first centrifugal fan is fixed on the fixing member through the clamping structure. The first centrifugal fan is connected to the fixing member through the clamping structure, which is convenient for the installation and disassembly of the first centrifugal fan.

[0021] In some implementations, the electronic device further includes a circuit board, and the heat source is at least part of the electronic components arranged on the circuit board. The accommodation cavity has two main surfaces oppositely arranged along the height direction. Channels for air flow to pass through are formed between the circuit board and the main surfaces. The fixing member is provided with a through structure communicating at least one channel and the air outlet structure.

[0022] The through structure can be a notch, a through hole, etc., which can be determined according to actual use needs. In this way, the gas entering the accommodation cavity through the air inlet structure can reach the air outlet structure through different channels, reducing the temperature of the two main surfaces and facilitating the overall heat dissipation of the electronic device.

[0023] In some implementations, in the length direction of the first cavity, the sum of the sizes of all the first fans is greater than or equal to 1 / 2 of the size of the first cavity.

[0024] In this implementation manner, all the first fans occupy most of the space in the first cavity, realizing the rational utilization of this space. By adopting this implementation manner, axial fans are arranged as many as possible, and the axial fans are arranged in the first cavity with a relatively large height, which neither increases the thickness of the input part nor makes the heat dissipation system meet the TDP and noise requirements.

[0025] In some implementation manners, in the length direction of the first cavity, the sum of the sizes of all the first fans is adapted to the size of the first heat dissipation module, or is greater than the size of the first heat dissipation module.

[0026] When the size of the first heat dissipation module is adapted to the sum of the sizes of the first fans, the number of the first heat sinks in the first heat dissipation module is large, the heat dissipation area is large, and the heat dissipation efficiency is high. When the size of the first heat dissipation module is smaller than the sum of the sizes of the first fans, the number of the first heat sinks in the first heat dissipation module is small, the heat dissipation area is small, but more installation space can be provided for other structures in the electronic device.

[0027] In some implementation manners, there are multiple first heat dissipation modules, and the multiple first heat dissipation modules are arranged at intervals in the length direction of the first cavity.

[0028] By adopting this implementation manner, the volume of a single first heat dissipation module is small, the occupied space is small, and more installation space can be provided for other structures in the electronic device.

[0029] In some implementation manners, the heat dissipation fan further includes a second fan. The second fan is a second centrifugal fan. At least part of the second fan is located in the second cavity. The heat dissipation structure further includes a second heat dissipation module corresponding to the second fan. The second heat dissipation module is thermally connected to at least part of the heat source, and the second heat dissipation module is located on the air outlet side of the second fan.

[0030] By adopting this implementation manner, compared with only setting the first fan, the number of fans in the heat dissipation fan is increased, so that the air output volume of the heat dissipation system is further increased, which is suitable for electronic devices with higher TDP requirements.

[0031] In some implementation manners, the second fan is provided with an air outlet, and the air outlet of the second fan is arranged in a direction away from the heat source along the first direction, and the first direction is arranged at an angle with the length direction of the first cavity.

[0032] The centrifugal fan has an air outlet, and the second heat dissipation module only needs to be arranged on the air outlet side of this air outlet. The number of the required second heat dissipation modules is small, and it is convenient for design and installation.

[0033] In some implementations, the second fan is provided with a first air outlet and a second air outlet. The first air outlet is arranged along the side facing away from the heat source, and the second air outlet is arranged along the length direction of the first cavity towards the side facing away from the heat source. Second heat dissipation modules are provided at both the first air outlet and the second air outlet. At least part of the second heat dissipation module corresponding to the first air outlet is arranged in the first cavity, and the first fan is arranged to avoid at least part of the second heat dissipation module arranged in the first cavity. In other words, the second heat dissipation module corresponding to the first air outlet is denoted as the target heat dissipation module. At least part of the target heat dissipation module is arranged in the first cavity. The first fan is arranged to avoid the target heat dissipation module. The first direction and the first direction are arranged at an angle. With this implementation, compared with the second fan having only one air outlet, the second fan has more air outlets, which can improve the air volume characteristics of the single fan, and can reduce the number of first fans or reduce the length of the first fan, and can reduce the manufacturing cost of the electronic device to a certain extent.

[0034] In some implementations, the corresponding second fan and the second heat dissipation module form a heat dissipation module. There are two groups of heat dissipation modules, which are arranged at intervals along the length direction of the first cavity and are respectively arranged on both sides of the heat source. The first fan is located between the two groups of heat dissipation modules in the length direction of the first cavity. In this way, compared with only one heat dissipation module, the number of first fans can be further reduced or the length of the first fan can be reduced, and the manufacturing cost of the electronic device can be reduced to a certain extent.

[0035] In some implementations, the second fan is provided with a first air outlet and a second air outlet. The first air outlet is arranged along the first direction towards the side facing away from the heat source, and the second air outlet is arranged along the length direction of the first cavity towards the heat source. A second heat dissipation module is provided at the first air outlet, and at least part of the second heat dissipation module is arranged in the first cavity. The first fan is arranged to avoid at least part of the second heat dissipation module arranged in the first cavity.

[0036] With this implementation, compared with the second fan having only one air outlet, the air volume of the second fan can be increased, the number of first fans can be reduced or the length of the first fan can be reduced, and the manufacturing cost of the electronic device can be reduced to a certain extent. In addition, with this implementation, compared with the solution of arranging the second heat dissipation module at the second air outlet, the number of second heat dissipation modules can be reduced, the cost can be reduced, and the gas discharged through the second air outlet can quickly discharge after taking away the heat of the heat source under the action of the first fan, and the heat dissipation performance can be improved to a certain extent.

[0037] In some implementations, a flow guiding structure is provided in the second cavity. The flow guiding structure is disposed between the second air outlet and the first heat dissipation module. The flow guiding structure is configured to guide the air flow discharged through the second air outlet to pass through the heat source first and then be discharged through the first heat dissipation module. The arrangement of the flow guiding structure enables the gas discharged through the second air outlet of the second fan to pass through the heat source first and then be discharged through the first fan, without flowing to other areas of the electronic device. This can improve the utilization rate of the gas discharged through the second air outlet and enhance the heat dissipation efficiency.

[0038] In some implementations, the heat source includes a first heating module and a second heating module. The power of the second heating module is less than that of the first heating module. The maximum air volume discharged by the first fan per unit time is less than the maximum air volume discharged by the second fan per unit time. The first heat dissipation module is thermally connected to the second heating module, and the second heat dissipation module is thermally connected to the second heating module.

[0039] Since the heat generated by the first heating module per unit time is greater than that generated by the second heating module per unit time, and the maximum air volume discharged by the first fan per unit time is less than the maximum air volume discharged by the second fan per unit time, with the first heat dissipation module being thermally connected to the second heating module and the second heat dissipation module being thermally connected to the second heating module, it can be ensured that the first heating module with a large heat generation amount corresponds to the second heat dissipation module with a high heat dissipation efficiency, and the second heating module with a small heat generation amount corresponds to the first heat dissipation module with a low heat dissipation efficiency. This can make the heat dissipation rates of both the first heating module and the second heating module relatively high, thereby enhancing the heat dissipation efficiency of the electronic device.

[0040] In addition, the first heat dissipation module is thermally connected to the second heating module, and the second heat dissipation module is thermally connected to the second heating module, that is, the first fan is responsible for the heat dissipation of the second heating module, and the second fan is responsible for the heat dissipation of the first heating module. In cooperation with the control chip, this can ensure that when the temperature of any one of the first heating module and the second heating module is too high, only the corresponding fan is started, without starting both the first fan and the second fan, which can reduce energy consumption and noise. For example, when the temperature of the first heating module is low and the temperature of the second heating module is high, only the first fan is controlled to operate; when the temperature of the second heating module is low and the temperature of the first heating module is high, only the second fan is controlled to operate to ensure low noise / lower surface temperature. When the temperatures of both the first heating module and the second heating module are high, the first fan and the second fan operate simultaneously.

[0041] In some implementations, the first heating module includes a control chip and / or a GPU, and the second heating module includes a voltage regulation module and / or a power supply module electrically connected to the first heating module.

[0042] Under normal circumstances, the electronic components with relatively large heat generation in a circuit board assembly mainly include control chips, GPUs, voltage regulation modules, power supply modules, etc. Among them, the power of control chips and GPUs is generally relatively large, and the heat generation per unit time of control chips and GPUs is generally greater than that of electronic components such as voltage regulation modules and power supply modules per unit time. The heat dissipation structures in related technologies generally only conduct heat with control chips and GPUs through heat conducting components, and do not conduct heat with electronic components such as voltage regulation modules and power supply modules. This enables only some of the electronic components with relatively large heat generation in the circuit board assembly (control chips and GPUs) to achieve heat conduction with the heat dissipation structure through heat conducting components with relatively high heat conduction efficiency. When these electronic components dissipate heat, the heat generated by the electronic components can be directly transferred to the heat dissipation structure through the heat conducting components. However, the heat conduction paths (also known as heat transfer paths) of other electronic components with relatively large heat generation in the circuit board assembly (such as voltage regulation modules and power supply modules) are relatively long. The heat conduction paths of the above-mentioned electronic components are as follows: from the electronic components to the circuit board, then from the circuit board to the control chip or GPU, and then from the control chip or GPU to the heat conducting component, and finally from the heat conducting component to the heat dissipation structure. It can be seen that the heat dissipation paths of some of the electronic components with relatively large heat generation in the circuit board assembly in related technologies (i.e., the second heat generation module in this implementation) pass through multiple components, and the heat dissipation paths are affected by multiple factors such as the contact thermal resistance between the electronic components and the circuit board, the thermal resistance of the heat conducting component, the heat dissipation area of the heat sink in the heat dissipation structure, and the performance of the cooling fan, resulting in extremely low heat dissipation efficiency of these electronic components. The heat generated by these electronic components cannot be effectively exchanged with the outside in a timely manner, further causing the surface temperature of the entire machine to be too high.

[0043] Compared with related technologies, in this implementation, the heat dissipation paths of the electronic components in the second heat generation module are from the electronic components to the heat conducting component and then to the heat dissipation structure, or directly from the electronic components to the heat dissipation structure, eliminating the heat conduction processes such as from the electronic components to the circuit board and then from the circuit board to the first heat generation module, which can shorten the heat conduction path of the second heat generation module, improve its heat dissipation speed, thereby improving the heat dissipation efficiency of the electronic device. Moreover, the acceleration of the heat dissipation efficiency can also reduce energy consumption to a certain extent. Also, due to the shortening of the heat conduction path of the second heat generation module, the thermal resistance it is subject to will also decrease accordingly. In this way, the heat dissipation efficiency of the second heat generation module is higher under the same noise, and the rotation speed of the first fan can be smaller and the noise can be lower under the same heat dissipation efficiency.

[0044] In some implementations, the second heat generation module is arranged closer to the first fan than the first heat generation module.

[0045] In the related art, the second heating module is located on the side of the first heating module away from the rotating shaft structure. In this implementation, the first fan is arranged close to the rotating shaft. Thus, if the arrangement positions of the second heating module and the first heating module still adopt the arrangement method of the related art, the second heating module will be arranged farther away from the first fan than the first heating module. The first heat dissipation module corresponding to the second heating module is in heat conduction connection, so that a relatively long heat conducting member needs to be arranged between the second heating module and the first heat dissipation module, which will occupy a large space. In this implementation, the second heating module is arranged closer to the first fan than the first heating module. Thus, when the second heating module is in heat conduction connection with the first heat dissipation module, the second heating module can be in direct heat conduction contact with the first heat dissipation module, or the heat conduction between the two can be realized through a shorter heat conducting member, which can occupy a smaller space, making the structure compact, facilitating the miniaturization design of the electronic device, and being beneficial to its thin and light design.

[0046] In some implementations, the corresponding second fan and the second heat dissipation module form a heat dissipation module. The first fan is arranged corresponding to the heat dissipation module, and the first fan is located within the projection area of the corresponding heat dissipation module along the first cavity.

[0047] Adopting this implementation, the positions of the first fan and the second fan correspond to each other, which is convenient for design and installation, and can provide more installation space for other electronic components. Compared with the first fan occupying as much space of the first cavity as possible, the manufacturing cost of the electronic device can be reduced to a certain extent.

[0048] In some implementations, the device body includes a first housing. The first housing includes a first part and a second part that are arranged and connected in sequence. The height of the first part is greater than the height of the second part. At least part of the first cavity is arranged inside the first part, and a second cavity is arranged inside the second part.

[0049] When the electronic device is a laptop computer, in this implementation, the first part can be the above-mentioned main body part, and the second part is the protruding part. When the electronic device is other devices, the first part and the second part can be divided according to the usage requirements. Adopting this implementation, the overall height of the electronic device is not likely to increase.

[0050] In some implementations, the device body further includes a second housing. The second housing is rotatably connected to the first part through a rotating shaft structure. The device body can be switched between a closed state and an open state. In the closed state, the second housing and the second part are stacked, and the height of the first part is adapted to the height of the stacked structure of the second housing and the second part.

[0051] With this implementation method, in the closed state, the second housing only overlaps with the second part having a smaller height, so that the setting of the first part will not have a great impact on the thickness of the electronic device, facilitating the thin and light design of the electronic device.

[0052] In some implementation methods, at least part of the rotating shaft structure is located in the first cavity, and the first fan is arranged to avoid the rotating shaft structure. This can ensure that the design of the first fan does not affect the rotation of the second part, and the rotating shaft structure is not located on the air flow path between the first heat dissipation module and the first fan, or on the air outlet side of the first fan, that is, the rotating shaft structure will not block the heat dissipation air flow, meeting its usage requirements.

[0053] In some implementation methods, the device body includes a first housing, a first protruding part, and a first structural member. A first cavity and an opening communicating with the first cavity are provided inside the first housing. The first protruding part covers the opening. A second cavity is provided inside the first protruding part. The second cavity communicates with the first cavity to form a receiving cavity. At least part of the first cavity is formed by the second cavity and the corresponding part of the first cavity corresponding to the second cavity, and the other part of the first cavity forms the second cavity.

[0054] The first protruding part can support at least part of the main body part, so that when the electronic device is placed on a table, at least part of the main body part is spaced from the table. In this way, the heat dissipation holes provided on the main body part are not easily blocked by the table, facilitating the entry of gas into the receiving cavity through the heat dissipation holes or the discharge from the receiving cavity.

[0055] In some implementation methods, the opening of the air outlet structure is arranged facing away from the air inlet structure. In this way, the gas discharged through the air outlet structure is not easily refluxed to the air inlet structure, and the heat dissipation performance of the electronic device can be ensured.

[0056] In some implementation methods, at least part of the air outlet structure is adjacent to and communicates with the first cavity. The electronic device further includes a protection structure. The protection structure is located on the air outlet side of the first fan and is connected to the device body. The protection structure is provided with a ventilation opening communicating the first cavity and the air outlet structure.

[0057] The protection structure can be a protection net plate provided inside or outside the receiving cavity, or other structural members that can play a protective role, such as a baffle with a microporous structure. The protection structure is used to prevent objects outside the electronic device from entering the first fan through the air outlet holes in the heat dissipation holes, so as to affect the use of the first fan or cause damage to the user. At the same time, the setting of the protection structure does not have an adverse impact or a great impact on the heat dissipation of the electronic device, enabling the electronic device to still meet the usage requirements.

[0058] In some implementations, the electronic device is a laptop computer. This helps to balance the overall thickness and heat dissipation performance of the laptop computer, and helps to improve the user experience of the laptop computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 FIG. 6 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in an open state;

[0060] Figure 2 FIG. 10 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in a closed state;

[0061] Figure 3 FIG. 14 is a Figure 1 partial cross-sectional structural diagram taken along line A-A in FIG. 6. The heat dissipation system is not shown in the figure, and the arrows in the figure indicate the flow direction of the air flow;

[0062] Figure 4 FIG. 20 is an exploded structural diagram of an input part in an electronic device in the related art;

[0063] Figure 5 FIG. 24 is a structural diagram of a heat dissipation system in an electronic device in the related art;

[0064] Figure 6 FIG. 28 is a Figure 5 cross-sectional structural diagram taken along line B-B in FIG. 24;

[0065] Figure 7 FIG. 34 is a Figure 5 cross-sectional structural diagram taken along line C-C in FIG. 34;

[0066] Figure 8 FIG. 40 is a cross-sectional structural diagram of a device body in an electronic device provided in an embodiment of the present application;

[0067] Figure 9 FIG. 44 is a cross-sectional structural diagram of a device body in an electronic device provided in another embodiment of the present application;

[0068] Figure 10 FIG. 48 is a cross-sectional structural diagram of a device body in an electronic device provided in some other embodiments of the present application, Figure 10 wherein (a), (b), and (c) in FIG. 50 are cross-sectional structural diagrams of a device body in an electronic device;

[0069] Figure 11 FIG. 54 is a cross-sectional structural diagram of an electronic device provided in an embodiment of the present application;

[0070] Figure 12 FIG. 58 is a structural diagram of a heat dissipation system in an electronic device provided in Embodiment 1 of the present application;

[0071] Figure 13Schematic structural diagram of the heat dissipation system in the electronic device provided in the second embodiment of the present application;

[0072] Figure 14 Bottom view structural diagram of the electronic device provided in the third embodiment of the present application;

[0073] Figure 15 For Figure 14 Partial cross-sectional structural diagram along line D-D in

[0074] Figure 16 For Figure 14 Partial cross-sectional structural diagram along line E-E in

[0075] Figure 17 Stereoscopic structural diagram of the electronic device provided in the third embodiment of the present application;

[0076] Figure 18 Schematic structural diagram of the heat dissipation system in the electronic device provided in the fourth embodiment of the present application;

[0077] Figure 19 Schematic structural diagram of the heat dissipation system in the electronic device provided in the fifth embodiment of the present application;

[0078] Figure 20 Schematic structural diagram of the heat dissipation system in the electronic device provided in the sixth embodiment of the present application;

[0079] Figure 21 Schematic structural diagram of the heat dissipation system in the electronic device provided in the seventh embodiment of the present application;

[0080] Figure 22 Schematic structural diagram of the heat dissipation system in the electronic device provided in the eighth embodiment of the present application;

[0081] Figure 23 For Figure 21 Partial structural diagram of the heat dissipation system in the electronic device shown in

[0082] Figure 24 Cross-sectional structural diagram of the electronic device provided in another embodiment of the present application.

[0083] Explanation of reference numerals:

[0084] 100, device main body;

[0085] 10, input part; 20, display part;

[0086] 11. First housing; 11a. Main body part; 11b. Second protruding part; 111. Accommodating cavity; 111a. First cavity; 111b. Second cavity; 111c. Third cavity; 111d. Fourth cavity; 111e. Main surface; 112. C shell; 113. D shell; 1131. Main body part; 1132. First protruding part; 114. Functional port; 115. Heat dissipation holes; 1151. Air intake structure; 1152. First air outlet hole; 1153. Second air outlet hole; 1154. Third air outlet hole;

[0087] 12. Keyboard assembly; 121. Keycap assembly; 122. Bottom plate;

[0088] 13. Circuit board assembly; 131. Circuit board; 132. Electronic components;

[0089] 14. Battery;

[0090] 15. Touchpad;

[0091] 16. Heat dissipation system; 161. Heat conducting member; 1611. First heat pipe; 1612. Second heat pipe; 1613. Metal sheet; 162. Heat dissipation structure; 1621. First heat dissipation module; 1622. Second heat dissipation module; 163. Heat dissipation fan; 1631. First fan; 163a. Axial flow fan; 163b. Cross-flow fan; 163b1. Fan main body; 163b2. Motor; 1632. Second fan;

[0092] 17. Heat source; 171. First heating module; 172. Second heating module;

[0093] 18. Protection structure;

[0094] 19. Fixing member; 191. Snap connection structure; 192. Through structure;

[0095] 21. Second housing; 211. A shell; 212. B shell;

[0096] 22. Display screen;

[0097] 30. Flow guiding structure; 31. Partition board; 32. Flow guiding strip. Detailed implementation manners

[0098] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application, and should not be construed as a limitation to the present application.

[0099] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "inner" and "outer" is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0100] For the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish the same items or similar items with basically the same functions and effects. For example, the first limiting portion and the second limiting portion are only used to distinguish different limiting portions, and do not limit their sequence. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and "first", "second", etc. do not necessarily mean different.

[0101] It should be noted that in the present application, words such as "in one of the embodiments" or "for example" are used to give examples, illustrations or explanations. Any embodiment or design solution described as "in one of the embodiments" or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, using words such as "in one of the embodiments" or "for example" is intended to present related concepts in a specific way.

[0102] In the present application, unless otherwise clearly defined and limited, terms such as "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0103] In order to make the purpose, technical solutions and advantages of the present application more clear and understandable, the present application will be further described in detail below with reference to the drawings and embodiments.

[0104] The embodiments of the present application provide an electronic device. The above-mentioned electronic device can also be called a terminal, a user equipment (UE), a mobile station (MS), a mobile terminal (MT), etc. The electronic device can be a notebook computer, a tablet PC, a netbook, an LED lighting device, a server, an industrial control circuit board, a micro-projector, etc. with a heat dissipation system, and can be specifically determined according to the usage needs.

[0105] For ease of understanding and description, taking an electronic device as a laptop as an example, the structure of the electronic device and the layout of the heat dissipation system provided by the embodiments of the present application will be described below.

[0106] It can be understood that the structure schematically shown in the embodiments of the present application does not constitute a specific limitation on the laptop. In other embodiments of the present application, the laptop may include more or fewer components than those shown in the figures, or combine certain components, or split certain components, or have different component arrangements.

[0107] Figure 1 The following is a schematic structural diagram of the electronic device provided by an embodiment of the present application in an open state. Figure 2 The following is a schematic structural diagram of the electronic device provided by an embodiment of the present application in a closed state.

[0108] As Figure 1 and Figure 2 shown, the electronic device includes an input part 10 and a display part 20. Both the input part 10 and the display part 20 are important components of the main body of the electronic device (hereinafter referred to as the device main body 100). The input part 10 and the display part 20 are generally rotationally connected through a hinge structure. One end of the input part 10 and the display part 20 close to the hinge structure can rotate around the hinge structure, so that the ends of the input part 10 and the display part 20 away from the hinge structure approach or depart from each other relatively, that is, the laptop can present different states such as being closed or opened accordingly. When the laptop is in the open state (as Figure 1 shown), the display part 20 and the input part 10 form an angle greater than 0°. When the laptop is in the closed state (as Figure 2 shown), the display part 20 covers the input part 10, and the display surface of the display part 20 faces the keyboard surface of the input part 10.

[0109] The above-mentioned hinge structure generally has only one rotation axis, and this rotation axis generally extends along the length direction of the laptop. In some embodiments, the hinge structure may also be provided with multiple rotation axes. For example, for a laptop that can be flipped left and right, the display part 20 can rotate 360° around a certain fulcrum on the input part 10.

[0110] Among them, the input part 10 has a first housing 11, the display part 20 has a second housing 21, and the first housing 11 and the second housing 21 are rotationally connected through a hinge structure.

[0111] Specifically, as Figure 1 shown, the display part 20 includes a second housing 21 and a display screen 22 provided on the second housing 21.

[0112] Figure 3is a partial sectional view along the Figure 1 A-A line in Figure 1 . The heat dissipation system is not shown in the figure, and the arrows in the figure indicate the flow direction of the air flow.

[0113] As Figure 3 shown, the second housing 21 includes at least an A housing 211 and a B housing 212. The A housing 211 and the B housing 212 can be composed of one component or multiple components respectively, which can be determined according to actual use needs. The A housing 211 and the B housing 212 are covered with each other, and the A housing 211 and the B housing 212 together define a first accommodation space for accommodating the display screen 22. The A housing 211 can be a hollow structure with one end open, and the B housing 212 can be a plate-like structure. The B housing 212 covers the open side of the A housing 211 so that the A housing 211 and the B housing 212 together define the first accommodation space; the A housing 211 and the B housing 212 can also both be hollow structures with one side open, and the open side of the A housing 211 covers the open side of the B housing 212. Among them, an opening is provided on the B housing 212 for the display surface of the display screen 22 to be exposed. When the notebook computer is in the closed state, the B housing 212 contacts the input part 10 and is at least partially hidden inside the notebook computer. When the notebook computer is in the closed state, the A housing 211 is exposed outside, and product names and other identifiers of the electronic device can be set on its outer wall.

[0114] The display screen 22 is an output device of the notebook computer and is used to display images, videos, etc. The display screen 22 can include, but is not limited to, at least one of a thin film transistor (TFT) display screen, an organic light-emitting diode (OLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light emitting diodes (QLED) display screen, etc. At least part of the display screen 22 is located in the first accommodation space surrounded by the A housing 211 and the B housing 212, and the display surface of the display screen 22 is exposed outside the second housing 21 through the opening provided on the B housing 212.

[0115] As Figure 1 and Figure 3As shown in the figure, the input part 10 includes a first housing 11, and a keyboard assembly 12, a circuit board assembly 13, a battery 14, a touchpad 15, a heat dissipation system, etc., all of which are disposed in the first housing 11. Among them, the first housing 11 at least includes a C-shell 112 and a D-shell 113. The C-shell 112 and the D-shell 113 can be respectively composed of one part or multiple parts, which can be specifically determined according to the usage requirements. The C-shell 112 and the D-shell 113 are covered with each other, and the C-shell 112 and the D-shell 113 can be fixed by means of plugging, clamping, screw connection, etc., and the two jointly define a second accommodation space a. Specifically, the D-shell 113 can be a hollow structure with an open end, and the C-shell 112 can be a plate-like structure. The C-shell 112 covers the open side of the D-shell 113 so that the C-shell 112 and the D-shell 113 jointly define the second accommodation space a; the C-shell 112 and the D-shell 113 can also be hollow structures with an open side on one side, and the open side of the C-shell 112 covers the open side of the D-shell 113.

[0116] Among them, the C-shell 112 is provided with holes for at least part of components such as the keyboard assembly 12 and the touchpad 15 to be exposed, and when the laptop is in a closed state, the C-shell 112 contacts the display part 20 and is at least partially hidden inside the electronic device. The D-shell 113 is exposed outside when the laptop is in a closed state. In addition, as Figure 2 shown, functional ports 114 for exposing or passing through structures such as interfaces and heat dissipation holes 115 for heat dissipation can also be provided on the side walls of the C-shell 112 and / or the D-shell 113. As Figure 3 shown, the above heat dissipation holes 115 generally include an air intake structure 1151 and a first air outlet hole 1152.

[0117] It can be understood that on which shell the heat dissipation holes 115 and the functional ports 114 are provided can be determined according to the setting requirements and the structures of the C-shell 112 and the D-shell 113. For example, when the C-shell 112 is a plate-like structure, if both the functional port 114 and the heat dissipation hole 115 need to be provided on the side wall of the first housing 11, then both the functional port 114 and the heat dissipation hole 115 are provided on the side wall of the D-shell 113. If the functional port 114 needs to be provided on the side wall of the first housing 11 and the heat dissipation hole 115 can be provided on the side wall of the first housing 11, or on the top surface or the bottom surface of the first housing 11, then the functional port 114 needs to be provided on the side wall of the D-shell 113, and the heat dissipation hole 115 can be provided on the D-shell 113 or on the C-shell 112. When both the C-shell 112 and the D-shell 113 are hollow structures with an open side on one side, if both the functional port 114 and the heat dissipation hole 115 need to be provided on the side wall of the first housing 11, then both the functional port 114 and the heat dissipation hole 115 can be partly provided on the side wall of the C-shell 112 and partly on the side wall of the D-shell 113, or the functional port 114 can be provided on the side wall of the C-shell 112 and the heat dissipation hole 115 can be provided on the side wall of the D-shell 113.

[0118] As Figure 3 shown, the keyboard assembly 12 includes a keycap assembly 121 and a bottom plate 122. The keycap assembly 121 is used for inputting instructions and data. The keycap assembly 121 includes a plurality of key units. A part of the keycap assembly 121 is located in the second accommodation space a of the first housing 11 and is electrically connected to the circuit board assembly 13, and is movably connected to the bottom plate 122. Another part of the keycap assembly 121 passes through the hole in the C-shell 112 and protrudes from the first housing 11, being exposed outside the first housing 11. The bottom plate 122 is used to support the keycap assembly 121. The bottom plate 122 is arranged in the second accommodation space a of the first housing 11, and the bottom plate 122 can be fixed to the D-shell 113 or the C-shell 112 by means of plugging, clamping, screw connection, riveting, etc. Generally, the bottom plate 122 is substantially in the shape of a rectangular flat plate and is made of metal. In other embodiments, the bottom plate 122 can also adopt other shapes, such as an irregular shape, a plate body with a curved edge, etc., which can be determined according to the actual use needs.

[0119] The touchpad 15 is provided on the C-shell 112 and is generally located on the side of the keyboard assembly 12 away from the rotation axis structure. A part of the touchpad 15 is arranged in the second accommodation space a of the first housing 11 and is electrically connected to the circuit board assembly 13, and another part is exposed outside the C-shell 112 through the hole in the C-shell 112 for the user to press. The touchpad 15 allows the user to control the pointer on the screen by moving a finger on a smooth surface, aiming to facilitate the user's operation without an external mouse. In addition to being able to move the pointer, the touchpad 15 can also implement other functions, such as single-click, right-click, multi-touch, gesture recognition, pressure sensing, etc.

[0120] The circuit board assembly 13 can be fixed in the first housing 11 by means of plugging, clamping, screw connection, soldering, etc. In addition to being electrically connected to the keycap assembly 121, the touchpad 15, etc., the circuit board assembly 13 is also communicatively connected to the display screen. The above-mentioned communicative connection can be a wired connection through structures such as wires and flexible circuit boards 131, or a wireless connection through a wireless communication module. The circuit board assembly 13 is used to receive the instructions and data input by the keycap assembly 121, the touchpad 15, etc., and control the corresponding modules to work according to the above instructions to display corresponding content on the display screen.

[0121] The circuit board assembly 13 generally includes one or more circuit boards 131. Each circuit board 131 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board respectively. One or more electronic components 132 can be provided on each circuit board 131. The above-mentioned electronic components 132 include but are not limited to control chips, graphics processing units (GPUs), voltage regulation modules, video random access memories (VRAMs), memories, power modules, wireless communication modules, mobile communication modules, audio modules, sensor modules, charge management modules, power management modules, batteries, display screens, antennas, wireless communication modules, audio modules, speakers (i.e., horns), microphones, headphone jacks, touch pads, keyboards, cameras, universal serial bus (USB) interfaces, etc.

[0122] Among them, the sensor module includes but is not limited to pressure sensors, gyroscope sensors, barometric pressure sensors, magnetic sensors, acceleration sensors, distance sensors, proximity light sensors, fingerprint sensors, temperature sensors, touch sensors, ambient light sensors, bone conduction sensors, etc.

[0123] A control chip is provided on at least one circuit board 131. The control chip can include but is not limited to any one of a central processing unit (CPU), a multimedia application processor (MaP), etc.

[0124] The voltage regulation module at least includes a first regulation module corresponding to the control chip and a second regulation module corresponding to the graphics processor. Both the first regulation module and the second regulation module include a plurality of inductors and a plurality of metal-oxide-semiconductor field-effect transistors (MOSFETs). The inductor is used to store and release energy to help smooth the output voltage. MOSFETs are usually used as power switches, and they control the time ratio of power transmission to loads (such as CPUs, GPUs, etc.) according to pulse width modulation (PWM) signals.

[0125] The circuit board assembly 13 is generally located between the bottom plate 122 and the D-shell 113. In some embodiments, the main part of the circuit board assembly 13 can be located within the space enclosed by the bottom plate 122 and the D-shell 113, and a small part can extend outside this space, which can be determined specifically according to the design requirements of the circuit board assembly 13.

[0126] The battery 14 is electrically connected to the circuit board assembly 13, and is used to provide power to the circuit board assembly 13 and the keyboard assembly 12, the touch pad 15, the display screen, etc. connected to the circuit board assembly 13. The battery 14 is generally arranged in the first shell 11, and is located on one side of the circuit board assembly 13, that is, the battery 14 is generally located between the touch pad 15 and the D shell 113. In general, the battery 14 is located on the side of the circuit board assembly 13 away from the hinge structure. In other cases, the battery 14 can also be located on the side of the circuit board assembly 13 close to the hinge structure; or, the battery 14 and the circuit board assembly 13 are arranged in sequence along the length direction or the width direction of the laptop computer, which can be determined according to the shape of the circuit board assembly 13, the shape of the battery 14, the shape of the first shell 11, and the use requirements.

[0127] The heat dissipation system may be entirely disposed in the first housing 11, or may be partially disposed in the first housing 11 and the other partially disposed in the second housing 21. For example, in some embodiments, the heat dissipation system includes but is not limited to heat-conducting parts, heat dissipation structures, and heat dissipation fans, all of which are disposed in the first housing. The heat dissipation fan is electrically connected to the circuit board assembly 13. The heat dissipation structure includes a heat sink. The heat sink is usually made of a highly thermally conductive material (such as aluminum or copper) to increase the surface area to improve the heat dissipation efficiency. The heat dissipation structure is generally thermally connected to the electronic components with a relatively large heat generation in the circuit board assembly 13 through a heat-conducting part. The heat-conducting part may include but is not limited to a vapor chamber (VC), a heat pipe, and the like.

[0128] For ease of understanding, the connection structure and function of the heat conductive member are now explained by taking the heat conductive member including a temperature equalizing plate and a heat pipe as an example. The temperature equalizing plate is in contact with at least part of the electronic components in the circuit board assembly 13 that generate a large amount of heat, and the heat pipe is stacked and in thermal contact with the temperature equalizing plate. During use, the electronic components dissipate heat, and the heat is conducted to the heat pipe through the temperature equalizing plate, and then conducted to the heat dissipation structure through the heat pipe. During this period, the heat dissipation fan works, driving the air through the air inlet structure 1151 into the second accommodating space a, flowing through the heat dissipation structure, and then discharged through the first air outlet 1152. In the above process, the air will take away the heat on the surface of the heat dissipation structure in the process of flowing through the heat dissipation structure, thereby achieving cooling of the heat dissipation structure.

[0129] In other embodiments, the heat conductor may only include a temperature equalizing plate or a heat pipe. In this case, the heat conduction principle of the heat conductor is similar to the above description. However, during use, the heat emitted by the corresponding electronic components is directly conducted to the heat dissipation structure through the heat conductor. The heat conductor 161 and the electronic components can be thermally connected by heat conducting materials (such as silicone grease, thermal paste, etc.). The heat pipe may be provided with a capillary structure and a phase change medium. Among them, the capillary structure may include a mesh structure, a groove structure or sintered copper powder, etc. The phase change medium may be a coolant, water, etc.

[0130] In some other embodiments, the heat dissipation system may further include a liquid cooling system. A part of the liquid cooling system is located inside the first housing, and another part is located inside the second housing.

[0131] For aesthetics and the relatively thin overall thickness of the laptop, generally, the thicknesses of different regions of the input part 10 are the same or not much different. Since the keyboard assembly 12 in the input part 10 has a relatively large number of structures and a certain thickness, the height d1 of the space in the second accommodation space a corresponding to the keyboard assembly 12 where other components can be accommodated is relatively small. The height d of the above space is at least less than or equal to the height d2 of the second accommodation space a minus the thickness of the keyboard assembly 12. For ease of description, hereinafter, the region in the input part 10 corresponding to the keyboard assembly 12 is named the keyboard region Q1, the region of the keyboard region Q1 close to the hinge structure side is named the hinge region Q2, and the region of the keyboard region Q1 far from the hinge structure, which is also the region where the touchpad 15 is located, is named the support region Q3.

[0132] Figure 4 FIG. is an exploded structural schematic diagram of the input part in an electronic device in the related art. In the figure, the D shell 113 is composed of multiple parts; Figure 5 FIG. is a structural schematic diagram of the heat dissipation system in an electronic device in the related art; Figure 6 Along Figure 5 is a sectional structural schematic diagram taken along the B - B line in Figure 7 Along Figure 5 is a sectional structural schematic diagram taken along the C - C line in Figure 5 FIG. is a bottom view structural schematic diagram of the electronic device in a closed state after removing the D shell.

[0133] As Figures 4 to 7 shown, in the related art, the circuit board assembly 13 is generally mainly disposed in the keyboard region Q1. In some embodiments, in addition to a part of the circuit board assembly 13 being disposed in the keyboard region Q1, a part of it extends to the hinge region Q2 and / or the support region Q3. The battery 14 is generally disposed in the support region Q3. The cooling fan 163 generally adopts a centrifugal fan and is also disposed in the keyboard region Q1. The heat dissipation structure 162 is generally disposed at the edge of the input part 10 and can be located in the hinge region Q2 or on one or both sides of the keyboard assembly 12. A part of the heat conducting member 161 is in contact with the heat source in the keyboard region Q1, and another part extends to the region where the heat dissipation structure 162 is located and is in heat conduction connection with the heat dissipation structure 162.

[0134] However, with the above - described setting method, since both the circuit board assembly 13 and the cooling fan 163 are disposed in the keyboard region Q1, and the height d1 of the keyboard region Q1 is relatively small, this limits the number and size of the cooling fans 163 that can be set, thereby limiting the air volume output of the cooling fans 163.

[0135] As electronic devices develop towards the trend of high performance, the integration of electronic components in electronic devices and the power consumption of electronic components such as control chips continue to increase. The increase in the power consumption of electronic components such as control chips will lead to an increase in the thermal design power (TDP) of these electronic components. The above-mentioned TDP represents the heat dissipation performance required when electronic components operate continuously under maximum load. In other words, TDP is the maximum heat dissipation power recommended by manufacturers to ensure the stable operation of the system. The unit of TDP is usually watt (W).

[0136] To ensure the stable operation of electronic devices, the heat dissipation performance of the heat dissipation system in electronic devices needs to match the TDP of corresponding electronic components (such as control chips, GPUs, etc.). The above-mentioned corresponding electronic components refer to the electronic components that are thermally conductively connected to the heat dissipation system, or the electronic components that need to be cooled by the heat dissipation system, such as the above-mentioned control chip. Therefore, as electronic devices develop towards the trend of high performance, the continuous increase in the TDP of corresponding electronic components will require the heat dissipation performance of the heat dissipation system in electronic devices to be continuously improved.

[0137] However, with the setting method of related technologies adopted by the heat dissipation system, the number and size of the installed heat dissipation fans are limited, which will make it difficult to improve the heat dissipation performance of the heat dissipation system and cannot meet the usage requirements. For example, if a larger-sized heat dissipation fan is used, the overall thickness of the electronic device will increase, which is not conducive to the thin and light design of the electronic device.

[0138] To balance the overall thickness and heat dissipation performance of the whole machine, an embodiment of the present application provides an electronic device. The electronic device includes a device main body. The device main body is the main part of the electronic device, and its specific structure can be determined according to the specific type of the electronic device. For example, if the electronic device is a notebook computer, the above-mentioned device main body can be a combined structure of other components except the heat source and the heat dissipation system in the input part and the display part; when the electronic device is a tablet computer, the above-mentioned device main body can be a combined structure of other components except the heat source and the heat dissipation system in the tablet computer. The above-mentioned heat source is a high-heat-generating electronic component or other component that is thermally conductively connected to the heat dissipation system.

[0139] Figure 8 It is a schematic cross-sectional structure diagram of the device main body in the electronic device provided by an embodiment of the present application. Figure 8 In the figure, the Y direction is one of the width direction and the length direction of the electronic device; the X direction is the other of the width direction and the length direction of the electronic device, and the Z direction is the thickness direction of the electronic device when it is in the closed state.

[0140] Such as Figure 8As shown, the device body 100 has a receiving cavity 111, as well as an air inlet structure and an air outlet structure both communicating with the receiving cavity 111. The receiving cavity 111 includes a first cavity 111a and a second cavity 111b that communicate with each other. The height of the first cavity 111a is greater than the height of the second cavity 111b. The height of the first cavity 111a is the dimension of the first cavity 111a in the Z direction. The height of the second cavity 111b is the dimension of the second cavity 111b in the Z direction. It can be understood that hereinafter, the height of other cavities also refers to the dimension of the corresponding cavity in the Z direction.

[0141] In this embodiment, the receiving cavity 111 is used to accommodate at least part of the heat dissipation system. Accommodating at least part of the heat dissipation system means that when the heat dissipation system needs to be entirely disposed within the electronic device, it accommodates the entire heat dissipation system; when only part of the heat dissipation system needs to be disposed within the electronic device, it accommodates the part of the heat dissipation system that needs to be disposed within the electronic device. Both the first cavity 111a and the second cavity 111b are part of the receiving cavity 111. The first cavity 111a is a continuous spatial structure, and the second cavity 111b is also a continuous spatial structure. The two can jointly form the receiving cavity 111, or can form the receiving cavity 111 together with other cavities. The first cavity 111a and the second cavity 111b can each be one or more. Both the first cavity 111a and the second cavity 111b are three-dimensional structures, and the inner walls enclosing the two cavities can be planar, curved, or irregular surfaces.

[0142] It should be noted that due to the complex situation of the inner walls enclosing the first cavity 111a and the second cavity 111b, the height at different positions of the first cavity 111a may be different, and the height at different positions of the second cavity 111b may also be different. The fact that the height of the first cavity 111a is greater than the height of the second cavity 111b means that under the same parameters, the height of the first cavity 111a is greater than the height of the second cavity 111b. For example, the first cavity 111a has multiple height parameters such as the maximum height, the minimum height, and the average height, and the second cavity 111b also has multiple height parameters such as the maximum height, the minimum height, and the average height. Among them, the maximum height refers to the height of the position with the greatest height in the first cavity 111a or the second cavity 111b, the minimum height refers to the height of the position with the smallest height in the first cavity 111a or the second cavity 111b, and the average height refers to the average value of the height values at any position in the first cavity 111a or the second cavity 111b.

[0143] If the height values measured at different positions of the first cavity 111a are a1, a2, a3, a4, ……, an respectively, where the value of a4 is the largest and the value of a1 is the smallest, then the maximum height of the first cavity 111a is a4, the minimum height is a1, and the average height is (a1 + a2 + a3 + a4 + …… + an) / n. The fact that the height of the first cavity 111a is greater than that of the second cavity 111b means that the maximum height of the first cavity 111a is greater than the maximum height of the second cavity 111b, or the minimum height of the first cavity 111a is greater than the minimum height of the second cavity 111b, or the average height of the first cavity 111a is greater than the average height of the second cavity 111b. It can be understood that when the first cavity 111a and the second cavity 111b have multiple height parameters, as long as any height parameter of the first cavity 111a is greater than the corresponding parameter of the second cavity 111b.

[0144] The accommodating cavity 111 in this embodiment can be arranged in various ways, and the division of the first cavity 111a and the second cavity 111b can be determined according to actual situations. Reference can be made to Figure 8 and Figure 10 for understanding. Among them, Figure 10 is a schematic cross-sectional structure diagram of the device main body in an electronic device provided in some other embodiments of the present application, Figure 10 in which (a), (b), and (c) are respectively schematic cross-sectional structure diagrams of the device main body in an electronic device.

[0145] As Figure 8 shown, in some embodiments, the electronic device is a laptop computer, and the accommodating cavity 111 is the cavity surrounded by the C shell, the keyboard assembly, and the D shell. The second cavity 111b is the cavity between the bottom plate 122 in the keyboard assembly 12 and the D shell 113, that is, the cavity corresponding to the above-mentioned keyboard area Q1, and is also the cavity between the dotted line L1 and the dotted line L2 in the figure. The first cavity 111a can be the part of the accommodating cavity 111 except the second cavity 111b, including the cavity corresponding to the above-mentioned rotation axis area Q2 (i.e., the cavity on the right side of the dotted line L2 in the figure) and the cavity corresponding to the support area Q3 (i.e., the cavity on the left side of the dotted line L2 in the figure); it can also be only the cavity corresponding to the above-mentioned rotation axis area Q2 (i.e., the cavity on the right side of the dotted line L2 in the figure), which can be specifically determined according to the usage requirements. In this embodiment, the maximum height of the first cavity 111a is d2, and the maximum height of the second cavity 111b is d1, and d1 is less than d2.

[0146] As Figure 9As shown, in some other embodiments, the electronic device is a laptop computer, and the first housing includes a C shell 112 and a D shell 113. The D shell 113 includes a main body portion 1131 and a first protruding portion 1132. Heat dissipation holes 115 are provided on the main body portion 1131. An opening communicating with the accommodation cavity 111 is provided on one side of the main body portion 1131 close to the rotation axis structure. The first protruding portion 1132 covers the opening and protrudes in a direction away from the C shell 112. The first protruding portion 1132 can support at least a part of the main body portion 1131, so that when the electronic device is placed on a desktop, at least a part of the main body portion 1131 is spaced apart from the desktop. In this way, the heat dissipation holes 115 provided on the main body portion 1131 are not easily blocked by the desktop, facilitating gas to enter the accommodation cavity 111 through the heat dissipation holes 115 or to be discharged from the accommodation cavity 111.

[0147] In this embodiment, cavities are provided inside both the main body portion 1131 and the first protruding portion 1132. The maximum height d3 of the cavity at the connection between the two is greater than the maximum height d2 of the cavity of the main body portion 1131. In this embodiment, the cavity where the first protruding portion 1132 is located (i.e., the cavity between the dotted lines L3 and L4 in the figure) is the first cavity 111a, and the cavity formed by the other part of the main body portion 1131 and the C shell 112 (i.e., the cavities on the left side of the dotted line L3 and on the right side of the dotted line L4 in the figure) is the second cavity 111b. Or it can also be understood that the cavity where the first protruding portion 1132 is located (i.e., the cavity between the dotted lines L3 and L4 in the figure) is the first cavity 111a, and the cavity formed by the part of the other part of the main body portion 1131 located on the left side of the dotted line L3 and the C shell 112 (i.e., the cavity on the left side of the dotted line L3 in the figure) is the second cavity 111b. Specifically, it can be determined according to the usage requirements.

[0148] As Figure 10 As shown, in some other embodiments, the electronic device is a laptop computer. In addition to the C shell 112 and the D shell 113, the first housing further includes a second protruding portion 11b. The second protruding portion 11b is located on one side of the main body portion 11a formed by the C shell 112 and the D shell 113 close to the rotation axis structure. Among them, the thickness of each region of the main body portion 11a is the same or differs little. The main body portion 11a is used to be stacked with the display portion 20 when the laptop computer is in a closed state, and the dimensions of the main body portion 11a in the Y direction and the X direction are adapted to the dimensions of the display portion 20. Adaptation means that when the laptop computer is in a closed state, the display portion 20 can completely cover the main body portion 11a, or basically cover the main body portion 11a. Basically covering the main body portion 11a means that in the thickness direction of the main body portion, most regions of the main body portion 11a can be covered, and only the edge portions can be seen.

[0149] The thickness of the second protruding portion 11b (dimension in the Z direction) is generally greater than the thickness of the main body portion 11a. In some embodiments, the bottom surface of the second protruding portion 11b may be flush with the bottom surface of the D shell 11, and only its top surface protrudes from the main body portion 11a, as shown in (a) of Figure 10 . At this time, for aesthetics, the thickness of the second protruding portion 11b may be equivalent to the thickness of the stack assembly of the main body portion 11a and the display portion 20 when the laptop is in the closed state. In this way, the upper surface of the laptop is flat when it is in the closed state. In other embodiments, both the top surface and the bottom surface of the second protruding portion 11b may protrude from the main body portion 11a, as shown in (b) of Figure 10 . This can further increase the height of the first cavity 111a.

[0150] The hinge structure is generally at least partially located on the second protruding portion 11b. When the laptop is in the open state, the part of the top surface of the second protruding portion 11b that protrudes from the main body portion 11a can be blocked by the display portion 20. The above-mentioned blocking means that when the user faces the display surface, it is difficult or impossible to see the second protruding portion 11b, and the second protruding portion 11b can be seen from other sides. In this embodiment, a cavity is provided inside the second protruding portion 11b, and the accommodation cavity 111 is a cavity jointly formed by the second protruding portion 11b, the C shell 112, and the D shell 113. And the maximum height of the cavity inside the second protruding portion 11b is d4, and d4 is greater than the maximum height d2 of the cavity inside the main body portion 11a. In this embodiment, the second cavity 111b is the part of the accommodation cavity 111 located inside the main body portion 11a, and the first cavity 111a is the cavity located inside the second protruding portion 11b.

[0151] It can be understood that Figure 10 in (a) only shows a possible implementation. In other embodiments, the first housing may only include the C shell 112 and the D shell 113, and the C shell 112 and the D shell 113 form a shape similar to the electronic device shown in Figure 10 , that is, the upper half of the second protruding portion 11b is integrally formed with the C shell 112, and the lower half is integrally formed with the D shell 113, as shown in (b) of Figure 10 . In addition, Figures 8 to 10 only shows a solution with one first cavity in the electronic device. In other embodiments, multiple first cavities may also be provided, which can be determined according to actual use needs. Such as Figure 10As shown in (c) thereof, the space between the dashed line L3 and the dashed line L4 is a first cavity 111a, and the space on the right side of the dashed line L5 can also be a first cavity 111a. In this case, the following first fans can be arranged in both of the two first cavities 111a, or the first fan can be arranged only in one of the first cavities 111a, or a part of the first fan can be located in one of the first cavities 111a and a part in the other first cavity 111a, which can be specifically determined according to the usage requirements.

[0152] In addition, when the electronic device is other devices, the accommodation cavity 111 can adopt other setting manners, which can be a cavity formed by one or more shells, or a cavity formed by a shell and other structural members. No matter which setting manner is adopted, the accommodation cavity 111 needs to be able to accommodate all or the main components of the heat dissipation system. It can be understood that when the accommodation cavity 111 is formed by one or more shells, the heights of at least two parts of the accommodation cavity are different; when the accommodation cavity 111 is formed by a shell and other structural members, the cavity surrounded by the shell can be a cavity with the same height at each position, and the height difference between the first cavity 111a and the second cavity 111b can be caused by the cavity surrounded by the shell occupied by at least one structural member. The first cavity 111a and the second cavity 111b can be divided in a similar division manner to the above two embodiments according to the actual situation.

[0153] Figure 11 is a schematic cross-sectional structure diagram of an electronic device provided by an embodiment of the present application. As Figure 11 shown, in this embodiment, in addition to the device main body 100, the electronic device further includes a heat source 17 and a heat dissipation system 16 provided on the device main body 100. The heat source 17 can be an electronic component with a large heat generation amount in the above circuit board assembly and having heat conduction with the heat dissipation system 16, or can be other components in the electronic device that generate heat and have heat conduction with the heat dissipation system 16. There can be one or more heat sources 17, which can be specifically determined according to the usage requirements.

[0154] At least a part of the heat source 17 is located in the second cavity 111b. Specifically, according to the installation requirements, the heat source 17 can be entirely located in the second cavity 111b, or a part can be located in the second cavity 111b and the other part in the first cavity 111a. The heat dissipation system 16 includes a heat dissipation structure 162 and a heat dissipation fan 163.

[0155] The heat dissipation fan 163 includes a first fan 1631. At least a part of the first fan 1631 is arranged in the first cavity 111a.

[0156] The cooling fan 163 in this embodiment may only include the first fan 1631, or may also include other fans in addition to the first fan 1631, specifically determined according to the cooling requirements of the electronic device. If the cooling fan 163 only includes the first fan 1631 and can meet the cooling requirements of the electronic device, then the cooling fan 163 may only include the first fan 1631; if the cooling fan 163 only including the first fan 1631 cannot meet the cooling requirements of the electronic device, then the cooling fan 163 may also include other fans.

[0157] One or more first fans 1631 may be provided in this embodiment. The first fan 1631 may be wholly disposed in the first cavity 111a, or a part may be disposed in the first cavity 111a and another part may be disposed in the second cavity 111b, which can be specifically set according to the size of the first fan 1631 and the size of the first cavity 111a.

[0158] Since the first fan 1631 in this embodiment is no longer disposed in the second cavity 111b with a relatively small height in the electronic device, but at least partially disposed in the first cavity 111a with a relatively large height, the first fan 1631 can select a fan with a relatively large height or thickness and a large air volume, such as an axial flow fan and a cross flow fan. Also, since the heat source 17 and the first fan 1631 may no longer be disposed in the same cavity (the second cavity 111b), when the first fan 1631 is arranged, it can occupy as much space of the first cavity 111a as possible. In this case, when the size of the first fan 1631 is relatively small, a larger number of them can be provided. At this time, in addition to axial flow fans and cross flow fans, centrifugal fans can also be used for the first fan 1631.

[0159] In addition, the placement manner of the first fan 1631 can be set according to the usage requirements. It can be that the bottom surface or other surfaces of the first fan 1631 are placed in contact with the bottom surface of the first cavity 111a; it can also be that the bottom surface of the first fan 1631 forms an angle with the bottom surface of the first cavity 111a, that is, the first fan 1631 is placed obliquely, which can be specifically determined according to the usage requirements.

[0160] For example, when the first fan 1631 is an axial flow fan, its air inlet and air outlet are arranged axially. At this time, the first fan 1631 can be placed vertically when placed, so that any surface parallel to the axis in the axial flow fan fits against the bottom surface of the first cavity 111a, and the air inlet of the axial flow fan faces the side where the first heat dissipation module 1621 is located, and the air outlet faces the air outlet structure communicated with the accommodation cavity 111. When the first fan 1631 is a cross-flow fan, the axis of the first fan 1631 can be arranged along the length direction of the first cavity 111a, and any surface parallel to the axis in the cross-flow fan and not the surface where the air inlet and air outlet are located fits against the bottom surface of the first cavity 111a. At the same time, the air inlet of the cross-flow fan faces the side where the first heat dissipation module 1621 is located, and the air outlet faces the air outlet structure communicated with the accommodation cavity 111.

[0161] When the first fan 1631 is a centrifugal fan, since the air inlet and air outlet of the centrifugal fan are generally perpendicular, if the width of the first cavity 111a is small at this time, the centrifugal fan can be inclined so that the axis of the centrifugal fan forms an angle with the height direction of the first cavity 111a. This is convenient for placing the centrifugal fan and for gas to pass through the centrifugal fan.

[0162] In summary, for the electronic device provided in the embodiment of the present application, the installation position of at least part of the fans (the first fan 1631) in the heat dissipation fan 163 is changed, so that the installation position of the heat dissipation fan 163 is no longer limited to the second cavity 111b with a small height, and at least part of the first fan 1631 can be arranged in the first cavity 111a with a large height. In this way, on the one hand, the type of the first fan 1631 is no longer limited to the centrifugal fan, and a fan with a large height or thickness and a large air volume, such as an axial flow fan and a cross-flow fan, can be selected, which is convenient for improving the heat dissipation performance of the heat dissipation system 16; on the other hand, all or part of the heat source 17 is arranged in the second cavity 111b, and the first cavity 111a can be provided with only the first fan 1631 according to the use needs, or mainly provided with the first fan 1631. In this way, the number of the first fans 1631 can be set as many as possible, or the length can be larger, so that the air volume output by the first fan 1631 can be larger, which helps to improve the heat dissipation performance of the heat dissipation system 16.

[0163] In addition, the installation of the first fan 1631 utilizes the originally large-height first cavity 111a in the electronic device, and the volume of the first cavity 111a is smaller than the volume of the second cavity 111b. In this way, even if the thickness of the part of the device main body 100 where the first cavity 111a is provided is greater than the thickness of the part where the second cavity 111b is provided, it is only a local large thickness and it is not easy to cause an increase in the overall thickness of the electronic device. It can be seen that the electronic device provided in the embodiment of the present application can take into account both the overall thickness and the heat dissipation performance.

[0164] The improvement of heat dissipation performance can be achieved not only by increasing the air volume output of the cooling fan, but also by enhancing the heat dissipation efficiency.

[0165] To improve the heat dissipation efficiency, based on the above embodiments, in some embodiments, as Figure 11 shown, generally, in addition to the cooling fan 163, the heat dissipation system 16 further includes a heat dissipation structure 162. The heat dissipation structure 162 at least includes a first heat dissipation module 1621 corresponding to the first fan 1631. The first heat dissipation module 1621 at least includes a first heat sink, and in addition, it can also include a base, etc., which can be specifically determined according to the usage requirements. The first heat dissipation module 1621 is thermally connected to at least part of the heat source 17.

[0166] The fact that the first heat dissipation module 1621 is thermally connected to at least part of the heat source 17 means that the heat source 17 includes a plurality of electronic components or parts. According to the heat dissipation requirements, the first heat dissipation module 1621 can be thermally connected to all the electronic components or parts in the heat source 17, or only to a part of the electronic components or parts in the heat source 17. The other part of the electronic components or parts can achieve heat dissipation through air flow or by means of a circuit board, etc. For the convenience of description, hereinafter, the part of the heat source 17 that is thermally connected to the first heat dissipation module 1621 is referred to as the first heating module.

[0167] The above thermal connection can be a thermal contact or a thermal connection, which can be specifically determined according to the setting method between the first heat dissipation module 1621 and the first heating module. No matter which method is adopted, there is heat conduction between the first heat dissipation module 1621 and the first heating module. In this embodiment, the first heat dissipation module 1621 can be directly in thermal contact with the first heating module, or can be thermally connected to the first heating module through a heat conducting member 161, which can be specifically determined according to the relative positions of the first heat dissipation module 1621 and the first heating module.

[0168] For example, the first heat dissipation module 1621 and the first heat generating module can be in direct contact or arranged at intervals. For example, both the first heat dissipation module 1621 and the first heat generating module are located in the same cavity (the first cavity 111a or the second cavity 111b), and their positions are relatively close, being stacked or adjacent. At this time, heat conduction can be achieved through direct contact. For example, the first heat dissipation module 1621 and the first heat generating module are located in different cavities, or although they are located in the same cavity, there is a distance between them. At this time, the first heat dissipation module 1621 can be thermally connected to the first heat generating module through the heat conducting member 161, and heat exchange can be achieved with the first heat generating module through the heat conducting member 161. It should be noted that when the heat conducting member 161 is in use, one end can be stacked with the first heat generating module, and the other end can be stacked with the first heat dissipation structure 162. The first heat generating module in this embodiment can include one or more devices. When the first heat generating module includes multiple devices, the heat conducting member 161 can have multiple ends and be stacked with different devices in the first heat generating module.

[0169] In this embodiment, the first heat dissipation module 1621 can be arranged in the first cavity 111a, or can be arranged in the second cavity 111b, or a part can be arranged in the first cavity 111a and the other part can be arranged in the second cavity 111b. Specifically, it can be determined according to the shape and size of the accommodating cavity, as well as the shape, size, and number of the first fan 1631, etc.

[0170] If the volume of the first cavity 111a is greater than or equal to the sum of the volumes of the spaces occupied by the first fan 1631 and the first heat dissipation module 1621, then the first heat dissipation module 1621 can be arranged in the first cavity 111a; if the volume of the first cavity 111a is greater than the volume of the space occupied by the first fan 1631 but less than the sum of the volumes of the spaces occupied by the first fan 1631 and the first heat dissipation module 1621, then a part of the first heat dissipation module 1621 can be arranged in the first cavity 111a and the other part can be arranged in the second cavity 111b.

[0171] The first heat dissipation module 1621 is located on the side of the first fan 1631 close to the heat source 17 (which is also the air inlet side of the first fan 1631). That is, the gas discharged from the air outlet of the first fan 1631 can be directly discharged from the electronic device through the air outlet structure of the electronic device without passing through the first heat dissipation module 1621.

[0172] The heat dissipation principle of the electronic device provided in this embodiment is as follows:

[0173] The electronic device operates, and the heat source 17 dissipates heat. The heat is conducted to the first heat dissipation module 1621 through a heat conducting member or direct contact, etc. The first fan 1631 operates to discharge the hot air inside the electronic device to the outside of the electronic device. The air in the accommodation cavity 111 becomes less, and the air pressure becomes lower. The air outside the electronic device enters the accommodation cavity 111 through the air inlet structure 1151 under the action of the air pressure, and then is discharged from the electronic device through the first heat dissipation module 1621 and the first fan 1631 in sequence.

[0174] In the above process, the first fan 1631 can always operate when the electronic device is operating, or can operate after the temperature of the electronic device reaches a certain temperature, which can be determined according to actual usage needs. It can be understood that if the first fan 1631 operates after the temperature of the electronic device reaches a certain temperature, the device body generally includes a detection device for detecting the temperature inside the accommodation cavity. And the circuit board assembly in the device body can control the turning on or off of the first fan 1631 according to the detection result of the detection device. And when there are multiple first fans 1631, any first fan 1631 can be controlled to turn on or off according to actual usage needs. This is the prior art and will not be elaborated here.

[0175] In the related art, the heat dissipation structure is generally arranged on the air outlet side of the heat dissipation fan 163, and the gas discharged by the heat dissipation fan 163 can be discharged from the electronic device only after passing through the heat dissipation structure. The solution provided in this embodiment changes the relative positions of the first fan 1631, the first heat dissipation module 1621 in the heat dissipation structure and the heat source 17, so that the first heat dissipation module 1621 is no longer located on the air outlet side of the first fan 1631, but is changed to be located on the air inlet side of the first fan 1631. In this way, the gas discharged by the first fan 1631 can be discharged from the electronic device without passing through the first heat dissipation module 1621, which can reduce the resistance suffered by the gas discharged by the first fan 1631, thereby reducing the probability of turbulence of the above gas in the accommodation cavity 111, enabling the gas to be discharged from the electronic device smoothly and quickly. On the one hand, this can improve the flow rate of the gas in the accommodation cavity 111 to a certain extent, thereby improving the heat dissipation efficiency of the electronic device. On the other hand, it can also reduce the noise to a certain extent and improve the user experience to a certain extent.

[0176] Figure 12 It is a schematic structural diagram of the heat dissipation system in the electronic device provided in the first embodiment of the present application. In the figure, the first fan is an axial flow fan; Figure 13 It is a schematic structural diagram of the heat dissipation system in the electronic device provided in the second embodiment of the present application. In the figure, the first fan is a cross-flow fan.

[0177] As Figure 12 and Figure 13As shown, in some embodiments, the first fan 1631 includes at least one of an axial fan 163a, a cross-flow fan 163b, and a first centrifugal fan (not shown in the figure).

[0178] Among them, the centrifugal fan can generate a relatively high static pressure and can provide a large air flow rate and pressure in a relatively small space, which is suitable for electronic devices that need to overcome relatively large resistance and are compact. Also, because the structural design of the centrifugal fan can better handle the internal air flow and can be designed into a system with better sealing, using the first centrifugal fan for the first fan helps to reduce the entry of dust and other pollutants into the motor and bearing parts of the first fan, thereby improving the reliability and stability of the long-term operation of the first fan.

[0179] The main feature of the axial fan 163a is that the air flow is along the axial direction, that is, air enters from one end of the fan along the axial direction of the fan's rotating shaft and exits from the other end. This design makes the axial fan 163a have a relatively high air volume and a relatively low pressure loss, which is suitable for occasions that require a large air flow circulation. The axial fan 163a usually has a lower noise level under the same air volume as the centrifugal fan. Moreover, the structure of the axial fan 163a is relatively simple, with a lower manufacturing cost and convenient maintenance.

[0180] The cross-flow fan 163b also belongs to the impeller type of fan. Different from the centrifugal fan and the axial fan, the axial width of its impeller is much larger than the impeller diameter, and the air flow direction is transverse (i.e., perpendicular to the axial direction) through the impeller, so it is also called a cross-flow fan. The cross-flow fan 163b mainly consists of a fan body 163b1 and a motor 163b2. Among them, the fan body 163b1 includes an impeller and an air duct. The motor 163b2 is the power part of the cross-flow fan 163b, which can be powered by alternating current or direct current. The alternating current power supply mainly includes a shaded-pole motor and a capacitor-start motor, and the direct current power supply is a brushless DC motor. The motor 163b2 is generally flexibly installed with the impeller and fixed on the air duct.

[0181] When the cross-flow fan 163b is in use, air enters the fan from the air inlet, bypasses the impeller twice along a spiral path, and then exits from the air outlet at the other end of the fan in the same direction. The cross-flow fan 163b usually has a lower noise level under the same air volume as the centrifugal fan. The design of the cross-flow fan 163b helps the fan to have a compact size and low-noise operation, making it suitable for space-limited environments that require quiet air flow.

[0182] It can be seen that both the axial flow fan 163a and the cross-flow fan 163b can achieve low-noise operation. When the first fan adopts the axial flow fan 163a and / or the cross-flow fan 163b, in the first aspect of the air inlet structure, the first fan 1631 is an axial flow fan and / or a cross-flow fan, which can achieve low-noise and large-air-volume operation compared with the centrifugal fan, can balance noise and TDP, and can improve the user experience to a certain extent; in the second aspect, the installation position of the first fan 1631 is no longer in the second cavity 111b with a smaller height in the electronic device, but is arranged in the first cavity 111a with a larger height. In this way, even if the height of the first fan 1631 is greater than that of the centrifugal fan in the related art, it is not easy to increase the overall thickness of the electronic device, and the thickness of the electronic device can be balanced. It can be seen that when the first fan adopts the axial flow fan 163a and / or the cross-flow fan 163b, the electronic device can balance noise, TDP and the thickness of the whole machine.

[0183] It should be noted that when the first fan 1631 adopts an axial flow fan and the first fan 1631 is located on the side of the first heat dissipation module 1621 away from the heat source 17 and blows air towards the side away from the first heat dissipation module 1621, the axial blind area of the axial flow fan has no adverse effect or little effect on the exhaust effect, and the heat dissipation effect of the heat dissipation system can be good. The above-mentioned axial blind area refers to an area near the central axis of the axial flow fan. In this area, the air flow is relatively weak or almost no flow. This is caused by the design principle of the axial flow fan: the blades rotate around the central axis to push the air to flow axially, but at a position very close to the axis, due to the close distance between the blades and the axis, the generated thrust is small, thus forming a relatively static or slow-flowing area.

[0184] In some embodiments, the first cavity has a length direction. There are multiple first fans. The multiple first fans are arranged in sequence along the length direction of the first cavity. In this way, the number of first fans that can be set is relatively large, which helps to improve the heat dissipation efficiency of the electronic device.

[0185] In order to make the electronic device thinner and lighter, the volume of the above-mentioned first cavity can be set as small as possible. For example, the volume of the first cavity can be less than or equal to 1 / 2, 1 / 3 or 1 / 4 of the volume of the second cavity, etc. In this way, even if the thickness of the part of the electronic device where the first cavity is set is relatively large, the thickness of most areas of the electronic device can be made not affected by the setting of the first cavity, and the thickness of most areas of the electronic device is relatively small.

[0186] Since there are many electronic components in the electronic device and the volume of the first cavity is limited, sometimes only setting the first fan cannot meet the heat dissipation requirements. To further improve the heat dissipation performance of the electronic device, in some embodiments, the heat dissipation fan further includes a second fan arranged in the second cavity.

[0187] The second fan can be a centrifugal fan in the related art or can be arranged according to the arrangement position in the related art. In this way, the first fan and the second fan cooperate with each other, which can improve the heat dissipation performance of the electronic device and is not likely to increase the overall thickness of the electronic device. The above-mentioned first fan and second fan can work simultaneously for dissipating heat of all the electronic components that generate heat in the electronic device, or the first fan can be responsible for dissipating heat of a part of the heat sources and the second fan can be responsible for dissipating heat of another part of the heat sources.

[0188] Since there are a large number of electronic components in the electronic device and the electronic components that generate heat are unevenly distributed, this will result in different heat flux densities (Heat Flux, Thermal Flux) in different regions of the electronic device. The above-mentioned heat flux density, also known as heat flux, is generally represented by q, and refers to the amount of heat passing through the unit cross-sectional area of an object per unit time. The unit of heat flux density is J / (m 2 ·s).

[0189] If the first fan and the second fan work simultaneously for dissipating heat of all the electronic components that generate heat in the electronic device (hereinafter referred to as the first solution), then the temperature in both the region with a large heat flux density and the region with a small heat flux density will be relatively high, and it is necessary to start both the first fan and the second fan, which will cause unnecessary energy waste and make the noise of the electronic device relatively high. If the first fan is responsible for dissipating heat of a part of the heat sources and the second fan is responsible for dissipating heat of another part of the heat sources (hereinafter referred to as the second solution), then the first fan and the second fan can work only when the temperature of the heat sources they are responsible for is relatively high. In this way, on the one hand, unnecessary energy waste can be avoided, and on the other hand, the noise of the electronic device can be reduced.

[0190] When the second solution is adopted, in order to improve the heat dissipation efficiency of the heat dissipation system, in some embodiments, the heat dissipation structure further includes a second heat dissipation module corresponding to the second fan. The second heat dissipation module is in thermal contact with at least part of the heat sources and is located on the air outlet side of the second fan. In this way, the heat generated by the heat sources can be quickly conducted to the second heat dissipation module, and the heat exchange between the heat sources and the second heat dissipation module can be realized, so as to achieve a relatively fast cooling speed. In this way, the cooling fan can achieve the required cooling effect at a relatively low rotation speed, which helps to reduce noise.

[0191] The heat dissipation system 16 of the electronic device provided in the above embodiments has various layout modes. For the convenience of understanding, examples are given below. Please refer to Figures 12 to 22 for understanding. Among them, Figure 14 is a bottom view structural schematic diagram of the electronic device provided in Embodiment 3 of the present application, Figure 15 is a partial cross-sectional structural schematic diagram along the D-D line in Figure 14 ​Figure 18 This is a schematic structural diagram of the heat dissipation system in the electronic device provided in the fourth embodiment of the present application. Figure 19 This is a schematic structural diagram of the heat dissipation system in the electronic device provided in the fifth embodiment of the present application. Figure 20 This is a schematic structural diagram of the heat dissipation system in the electronic device provided in the sixth embodiment of the present application. Figure 21 This is a schematic structural diagram of the heat dissipation system in the electronic device provided in the seventh embodiment of the present application. Figure 22 This is a schematic structural diagram of the heat dissipation system in the electronic device provided in the eighth embodiment of the present application.

[0192] In the following embodiments, the first cavity 111a is located at one end of the second cavity 111b in the Y direction, and the length direction of the first cavity 111a is arranged along the X direction. In other embodiments, the first cavity 111a and the second cavity 111b can also adopt other setting manners, which can be specifically determined according to the usage requirements.

[0193] Embodiment 1

[0194] As Figure 12 shown, the first fan 1631 is an axial flow fan 163a and is arranged in the first cavity. There are multiple axial flow fans 163a, and they are arranged in sequence along the length direction X of the first cavity. The axial flow fans 163a in this embodiment are arranged as many as possible in the first cavity. In the length direction X of the first cavity, the sum of the sizes of the multiple first fans 1631 is greater than or equal to 1 / 2 of the size of the first cavity. That is, all the first fans 1631 together occupy most of the space of the first cavity, realizing the rational utilization of this space. Or, all the first fans 1631 together occupy all the areas of the first cavity or all the areas except the necessary structures (such as the rotating shaft structure, etc.).

[0195] All or part of the heat dissipation structure 162 is located in the second cavity. In this embodiment, the heat dissipation structure 162 includes a first heat dissipation module 1621. The first heat dissipation module 1621 includes a plurality of first heat dissipation fins arranged at intervals along the length direction X of the first cavity. The interval between any two adjacent first heat dissipation fins can be the same or different, which can be specifically determined according to the usage requirements.

[0196] It can be understood that the first heat dissipation module 1621 in this embodiment can only include the first heat dissipation fins, or can also include other components in addition to the first heat dissipation fins. For example, in some embodiments, the first heat dissipation module 1621 can also include a first base, and the above-mentioned first heat dissipation fins are arranged on the first base. The first heat dissipation fins can be in thermal conduction contact with the heat conducting member 161 or the heat source 17 through the first base.

[0197] In the length direction X of the first cavity, the sum of the dimensions of all the first fans 1631 is adapted to the dimension of the first heat dissipation module 1621, or is smaller than the sum of the dimensions of the first fans 1631. Since there are multiple first fans 1631, the sum of the dimensions of all the first fans 1631 is the sum of the dimensions of all the first fans 1631 in the length direction X of the first cavity. Adaptation means that the dimension of the first heat dissipation module 1621 is equal to the sum of the dimensions of the first fans 1631, or the difference between the two is within 5% of the sum of the dimensions of the first fans 1631.

[0198] When the dimension of the first heat dissipation module 1621 is adapted to the sum of the dimensions of all the first fans 1631, the number of first heat dissipation fins in the first heat dissipation module 1621 is large, the heat dissipation area is large, and the heat dissipation efficiency is high. When the dimension of the first heat dissipation module 1621 is smaller than the sum of the dimensions of all the first fans 1631, the number of first heat dissipation fins in the first heat dissipation module 1621 is small, the heat dissipation area is small, but more installation space can be provided for other structures in the electronic device.

[0199] Adopting the solution provided by this embodiment, as many axial fans 163a as possible are arranged to increase the air volume of the whole-machine cooling fan 163. At the same time, taking advantage of the noise superposition of the axial fans 163a, the noise of the whole machine can be reduced. In this way, neither the thickness of the input part 10 is increased, nor the cooling system 16 fails to meet the TDP and noise requirements. The above-mentioned advantage of noise superposition means that the noise of multiple axial fans 163a (i.e., the superposed noise, which is also the noise when multiple axial fans 163a are used simultaneously) is less than the sum of the noises of multiple axial fans 163a. That is, if the noise of a single axial fan 163a is a and the noise of n axial fans 163a is b, then b is less than a * n.

[0200] Compared with the related art, adopting the solution provided by this embodiment, the original area b for placing centrifugal fans can be vacated for arranging the circuit board assembly 13, the battery 14 or other structural parts (such as speakers, horns, etc.) to enhance the functions of the electronic device and improve the user experience.

[0201] Embodiment 2

[0202] As Figure 13As shown, the first fan 1631 is a cross-flow fan 163b, which is disposed in the first cavity. One or more cross-flow fans 163b can be provided. When there is one cross-flow fan 163b, its length can be as long as possible. In the length direction X of the first cavity, the size of all the first fans 1631 is greater than or equal to 1 / 2 of the size of the first cavity. Alternatively, the first fan 1631 can occupy the entire area of the first cavity or the entire area except for necessary structures (such as the shaft structure, etc.). This can make the size of the cross-flow fan 163b larger and the air volume discharged larger. When there are multiple cross-flow fans 163b, the multiple cross-flow fans 163b can be sequentially arranged along the length direction X of the first cavity. This solution can be applied to electronic devices with a relatively large length of the first cavity. It can be understood that when there are multiple cross-flow fans 163b, the above-mentioned size of the first fan 1631 is the sum of the sizes of the multiple first fans 1631 in the length direction X of the first cavity.

[0203] The heat dissipation structure in this embodiment also includes a first heat dissipation module 1621, and the structure of the first heat dissipation module 1621 is the same as that in Embodiment 1, which will not be elaborated here.

[0204] In the length direction X of the first cavity, the size of the first heat dissipation module 1621 can be equivalent to the size of the air inlet of the cross-flow fan 163b, can also be larger than the size of the air inlet of the cross-flow fan 163b, or smaller than the size of the air inlet of the cross-flow fan 163b, which can be determined according to actual usage needs. It can be understood that when there is one cross-flow fan 163b, the above-mentioned size of the air inlet of the cross-flow fan 163b is the maximum size of the air inlet of a single cross-flow fan 163b in the length direction X of the first cavity. When there are multiple cross-flow fans 163b, the above-mentioned size of the air inlet of the cross-flow fan 163b refers to the sum of the maximum sizes of the air inlets of the multiple cross-flow fans 163b in the length direction X of the first cavity.

[0205] Adopting the solution provided in this embodiment, by arranging the cross-flow fan 163b taking advantage of the relatively high height of the first cavity, it will neither increase the thickness of the input part 10 nor make the heat dissipation system 16 fail to meet the TDP and noise requirements. Compared with the related art, adopting the solution provided in this embodiment, the original area b for placing the centrifugal fan can also be vacated for arranging the circuit board assembly 13, the battery 14 or other structural parts (such as speakers, horns, etc.) to enhance the functions of the electronic device and improve the user experience.

[0206] Embodiment 3

[0207] As Figure 14 and Figure 15As shown, the first fan 1631 is the first centrifugal fan 163c. The first centrifugal fan 163c is inclined, with a part located in the first cavity 111a and the other part located in the second cavity 111b. The inclination angle of the first centrifugal fan 163c can be determined according to the usage requirements. For example, the inclination angle can be selected as 85°, 80°, etc. The above inclination angle is the included angle α between the bottom surface of the first centrifugal fan 163c and the plane in the inner wall of the C shell.

[0208] The air inlet of the first centrifugal fan 163c faces the circuit board, and the air outlet faces the air outlet structure.

[0209] There are multiple first centrifugal fans 163c, which are arranged at intervals in sequence along the length direction X of the first cavity 111a. In this embodiment, the first centrifugal fans 163c are arranged as many as possible in the first cavity 111a. In the length direction X of the first cavity 111a, the sum of the sizes of the multiple first fans 1631 is greater than or equal to 1 / 2 of the size of the first cavity 111a. That is, all the first fans 1631 together occupy most of the space of the first cavity 111a, realizing the rational utilization of this space. Or, all the first fans 1631 together occupy all the areas of the first cavity 111a or all the areas except for necessary structures (such as the shaft structure, etc.).

[0210] The heat dissipation structure 162 in this embodiment also includes the first heat dissipation module 1621, and the structure of the first heat dissipation module 1621 is the same as that in Embodiment 1, which will not be elaborated here.

[0211] In the length direction X of the first cavity 111a, the sum of the sizes of all the first fans 1631 is adapted to the size of the first heat dissipation module 1621, or is smaller than the sum of the sizes of the first fans 1631. Since there are multiple first fans 1631, the sum of the sizes of all the first fans 1631 mentioned above is the sum of the sizes of all the first fans 1631 in the first cavity 111a in the length direction X of the first cavity 111a. Adaptation means that the size of the first heat dissipation module 1621 is equal to the sum of the sizes of the first fans 1631, or the difference between the two is within 5% of the sum of the sizes of the first fans 1631.

[0212] When the size of the first heat dissipation module 1621 is adapted to the sum of the sizes of all the first fans 1631, the number of the first heat dissipation fins in the first heat dissipation module 1621 is large, the heat dissipation area is large, and the heat dissipation efficiency is high. When the size of the first heat dissipation module 1621 is smaller than the sum of the sizes of all the first fans 1631, the number of the first heat dissipation fins in the first heat dissipation module 1621 is small, the heat dissipation area is small, but more installation space can be provided for other structures in the electronic device.

[0213] Compared with the related art, by adopting the solution provided in this embodiment, the area originally used to place the centrifugal fan can be vacated for arranging circuit board components, batteries or other structural components (such as speakers, horns, etc.) to enhance the functions of the electronic device and improve the user experience. The first centrifugal fan 163c is inclined so that the air outlet of the first centrifugal fan 163c is not easily perpendicular to the inner wall of the accommodation cavity, thereby reducing the probability that the first centrifugal fan 163c is blocked by the inner wall of the accommodation cavity and facilitating the discharge of air flow.

[0214] In the third embodiment, the first centrifugal fan 163c can be fixed by setting clamping structures, plugging structures, etc. on the inner wall of the accommodation cavity, such as slots, clamping grooves, buckles, etc., or the first centrifugal fan 163c can be fixed in the accommodation cavity by a fixing member 19. When the first centrifugal fan 163c is fixed by the fixing member 19, the original structure in the accommodation cavity can be unchanged, which is convenient for preparation and assembly.

[0215] Figure 16 For the Figure 14 partial cross-sectional structural schematic diagram of the E-E line in

[0216] As Figure 16 shown, in some embodiments, the fixing member 19 can adopt a strip-shaped frame extending along the length direction of the first cavity 111a, and a plurality of clamping structures 191 can be arranged on the strip-shaped frame, and each clamping structure 191 corresponds to a first centrifugal fan 163c. The first centrifugal fan 163c is fixed to the fixing member 19 through the clamping structure 191. Specifically, the clamping structure 191 can adopt a groove-shaped structure with an opening facing the circuit board, and the first centrifugal fan 163c can be inserted into the clamping structure 191 in an interference fit manner. The fixing member 19 is fixed to the inner wall of the accommodation cavity 111 by bolts, plugging, etc. In other embodiments, the fixing member 19 can also adopt other structures, such as being composed of multiple components, each component corresponding to a first centrifugal fan 163c, and the first centrifugal fan 163c can be fixed by magnetic attraction, plugging, etc., as long as the fixation of the first centrifugal fan 163c can be achieved. When the first centrifugal fan 163c is connected to the fixing member 19 through the clamping structure 191, it is convenient for the installation and disassembly of the first centrifugal fan 163c.

[0217] As Figure 15As shown, in some embodiments, the first housing 11 includes a C-shell 112 and a D-shell 113. The D-shell 113 includes a main body portion 1131 and a first protruding portion 1132. The size of the first protruding portion 1132 is small, and the fixing member 19 is connected to the C-shell 112. The C-shell 112 includes a metal shell and a plastic part provided on the inner side wall of the metal shell. The fixing member 19 can be threadedly connected to the plastic part by screws. In order to make the volume of the first fan 1631 larger, the plastic part may not be provided at the contact portion between the C-shell 112 and the first fan 1631, or a groove for accommodating the first fan 1631 may be formed in the plastic part. This can make the volume of the first fan 1631 larger, with a larger air output, and will not affect the overall thickness of the electronic device.

[0218] The above-mentioned fixing member 19 can be a metal part, such as an aluminum bracket, a stainless steel bracket, etc.

[0219] Such as Figure 15 As shown, in some embodiments, the accommodating cavity 111 has two main surfaces 111e oppositely arranged in the height direction. Channels for the airflow to pass through are formed between the circuit board 131 and the main surfaces 111e. The fixing member 19 is provided with a through structure 192 that communicates at least one channel and the first air outlet hole 1152. The through structure 192 can be a notch, a through hole, etc., and can be specifically determined according to the usage requirements. In this way, the gas entering the accommodating cavity through the air inlet structure can reach the air outlet structure through different channels, which can reduce the temperature of the two main surfaces and facilitate the overall heat dissipation of the electronic device.

[0220] It can be understood that the fixing member 19 can be arranged adjacent to the channel and the air outlet structure, or can be arranged at intervals from the channel and the air outlet structure. When the fixing member 19 is arranged adjacent to the channel and the air outlet structure, the channel and the air outlet structure can be directly communicated through the above-mentioned through structure 192; when the fixing member 19 is arranged at intervals from at least one of the channel and the air outlet structure, the communication between the channel and the air outlet structure not only passes through the above-mentioned through structure 192, but also needs to pass through the space between the fixing member 19 and the channel, or the space between the fixing member 19 and the air outlet structure. The above-mentioned through structure 192 that communicates at least one channel and the air outlet structure can be understood as that the gas passing through the channel opposite to the fixing member 19 can pass through the through structure 192 to reach the air outlet structure.

[0221] This can reduce the resistance of the setting of the fixing member 19 to the gas flowing from the channel to the air outlet structure, thereby improving the heat dissipation rate to a certain extent.

[0222] In addition, when multiple first centrifugal fans 163c are provided in the third embodiment, the multiple first centrifugal fans 163c can be arranged at intervals. In this way, on the one hand, the space between two adjacent first centrifugal fans 163c can allow air flow through, so as to reduce the resistance of the gas flowing from the channel to the air outlet structure, and thus the heat dissipation rate can be improved to a certain extent; on the other hand, when adopting Figure 11 the solution, if the first protruding part 1132 and the main body part 1131 are of a split structure, connection points, such as hot melt connection points, can be provided at the gap between two adjacent first centrifugal fans 163c, so that the first protruding part 1132 and the main body part 1131 are stably connected.

[0223] On the basis of the third embodiment, since the first centrifugal fan 163c is inclined, its air outlet forms an angle with the thickness direction Z of the electronic device. In this way, if the air outlet structure is only provided on the side wall of the first housing 11, the gas discharged from the air outlet of the first centrifugal fan 163c will be blocked by the inner wall of the accommodation cavity. To further improve the heat dissipation efficiency and enable the gas discharged from the first centrifugal fan 163c to be quickly discharged, in some embodiments, the air outlet structure includes a first air outlet hole 1152 provided on the outer peripheral wall of the first housing 11 and a second air outlet hole 1153 provided on the first protruding part 1132. The air outlet of the first fan 1631 is located within the first protruding part 1132, and the second air outlet hole 1153 is provided on the side of the first protruding part 1132 facing away from the air inlet structure 1151.

[0224] In this way, the gas discharged from the first centrifugal fan 163c can be directly discharged through the second air outlet hole 1153 on the first protruding part 1132 without passing through the first air outlet hole 1152 provided on the side wall of the electronic device, which can reduce the resistance of the gas discharged from the first centrifugal fan 163c, improve the air outlet rate, and the heat dissipation efficiency of the electronic device.

[0225] Figure 17 This is a three-dimensional structure schematic diagram of the electronic device provided in the third embodiment of the present application.

[0226] As Figure 15 shown, in some embodiments, the air inlet of the first centrifugal fan 163c faces the circuit board 131, and the air outlet faces the side of the first protruding part 1132 facing away from the C shell 112. As Figure 17As shown in the figure, the air outlet structure further includes a third air outlet hole 1154 provided on the surface of the main body 1131 where the air inlet structure 1151 is provided. The third air outlet hole 1154 is located on the side of the first protruding portion 1132 away from the air inlet structure 1151. In this way, the gas discharged by the first centrifugal fan can be discharged through the nearest air outlet holes (the second air outlet hole 1153 and / or the third air outlet hole 1154), so as to reduce the resistance of the gas discharged by the first centrifugal fan, improve the air outlet rate, and the heat dissipation efficiency of the electronic device.

[0227] The dimension of the distance between two adjacent first centrifugal fans 163c in the length direction of the first cavity can be 5 mm, or other dimensions, such as 7 mm, 9 mm, etc., which can be determined according to actual use requirements.

[0228] Embodiment 4

[0229] As Figure 18 shown in the figure, in this embodiment, the first fan 1631 is an axial flow fan (not shown in the figure), a cross-flow fan 163b and / or a first centrifugal fan, and is provided in the first cavity. When the first fan 1631 is an axial flow fan, the setting method of the first fan 1631 is the same as that in Embodiment 1. When the first fan 1631 is a cross-flow fan 163b, the setting method of the first fan 1631 is the same as that in Embodiment 2. When the first fan 1631 is a first centrifugal fan, the setting method of the first fan 1631 is the same as that in Embodiment 3.

[0230] In this embodiment, the heat dissipation structure 162 includes a plurality of first heat dissipation modules 1621. The structures of the first heat dissipation modules 1621 are the same as those in Embodiments 1 to 3, and will not be elaborated here.

[0231] The plurality of first heat dissipation modules 1621 are arranged at intervals along the length direction X of the first cavity. That is, in this embodiment, in the length direction X of the first cavity, the size of any first heat dissipation module 1621 is smaller than the sum of the sizes of all the first fans 1631, and the sum of the sizes of all the first heat dissipation modules 1621 is also smaller than the sum of all the first fans 1631.

[0232] Adopting the solution provided in this embodiment, the size of a single first heat dissipation module 1621 is small. In Embodiments 1 and 2, in the area originally used to place the first heat dissipation module 1621, other structural parts can be placed in addition to the first heat dissipation module 1621, which can provide more installation space for other structures in the electronic device.

[0233] Embodiment 5

[0234] As Figure 19As shown, the heat dissipation fan 163 includes a second fan 1632 in addition to the first fan 1631. The first fan 1631 is an axial flow fan, a cross-flow fan and / or a first centrifugal fan, and is at least partially arranged in the first cavity. When the first fan 1631 is an axial flow fan, the arrangement of the first fan 1631 is the same as that of Example 1. When the first fan 1631 is a cross-flow fan, the arrangement of the first fan 1631 is the same as that of Example 2. When the first fan 1631 is a first centrifugal fan, the arrangement of the first fan 1631 is the same as that of Example 3. In addition, when there are multiple first fans 1631, one or more of them can be axial flow fans, and the rest can be cross-flow fans and / or first centrifugal fans. Multiple first fans 1631 can be arranged in sequence along the length direction of the first cavity.

[0235] The second fan 1632 is a second centrifugal fan, which is disposed in the second cavity. In this embodiment, the second centrifugal fan has an air outlet, which is disposed along the length direction X of the first cavity toward a side away from the heat source 17 .

[0236] In this embodiment, the heat dissipation structure 162 includes a first heat dissipation module 1621 and a second heat dissipation module 1622 corresponding to the second fan 1632. Among them, the setting method of the first heat dissipation module 1621 can be the same as any of the embodiments in Example 1 to Example 4. The second heat dissipation module 1622 can be arranged on the air outlet side of the air outlet of the second centrifugal fan, that is, the second heat dissipation module 1622 is located on the side of the second centrifugal fan away from the heat source 17. The second heat dissipation module 1622 in this embodiment can generally also include a plurality of second heat sinks, and the plurality of second heat sinks are arranged along the Y interval. In addition, in some embodiments, the second heat dissipation module 1622 can also include a second base corresponding to the second heat sink, and the second heat sink is arranged on the second base.

[0237] In this embodiment, the second centrifugal fan and the second heat dissipation module 1622 can be arranged in the manner of related art, that is, the second centrifugal fan is arranged in the area corresponding to the keyboard assembly 12 (that is, the keyboard area) in the accommodating cavity 111, and the second heat dissipation module 1622 is arranged outside the keyboard area and is thermally connected to the heat source 17 through the heat conductive member 161. The second centrifugal fan in the second heat dissipation module can be a smaller fan to reduce noise, thereby ensuring that the overall noise meets the requirements.

[0238] In this embodiment, one or more second fans 1632 may be provided. When a plurality of second fans 1632 are provided, the plurality of second fans 1632 may be divided into two groups and provided at both sides of the heat source 17 .

[0239] By adopting the solution provided in this embodiment, compared with the solutions of Embodiments 1 to 4, the number of fans in the cooling fan 163 is increased, so that the air output of the cooling system 16 is further increased, which is suitable for electronic devices with higher TDP requirements. Among them, the second centrifugal fan has one air outlet, and the second heat dissipation module 1622 only needs to be arranged on the air outlet side of this air outlet, and the number of the second heat dissipation modules 1622 required is small, and it is convenient for design and installation.

[0240] Embodiment 6

[0241] As Figure 20 shown, the cooling fan 163 includes a first fan 1631 and a second fan 1632. The first fan 1631 is an axial flow fan, a cross-flow fan, and / or a first centrifugal fan, and at least part of it is arranged in the first cavity. The second fan 1632 is a second centrifugal fan and is arranged in the second cavity. The same second centrifugal fan is provided with two air outlets. One of the air outlets faces away from the heat source 17, which is denoted as the first air outlet; the other air outlet faces away from the heat source 17 along the length direction X of the first cavity, which is denoted as the second air outlet. A second heat dissipation module 1622 is arranged on the air outlet side of any air outlet. In this embodiment, at least part of the second heat dissipation module 1622 corresponding to the first air outlet is arranged in the first cavity, and the first fan 1631 is arranged to avoid this group of second heat dissipation modules 1622.

[0242] The second fan 1632 is provided with two air outlets, which can improve the air volume characteristics of the single fan (the air volume of the single fan is increased by about 15%-30%).

[0243] Moreover, since the cost of the first fan 1631 is generally higher than that of the second fan 1632, by adopting the solution provided in this embodiment, compared with the solution of Embodiment 5, the number of the first fans 1631 can be reduced or the length of the first fan 1631 can be reduced, which can reduce the manufacturing cost of the electronic device to a certain extent.

[0244] In the above embodiments, one or more second fans 1632 can be provided. When multiple second fans 1632 are provided, the multiple second fans 1632 can be divided into two groups and arranged on both sides of the heat source 17. That is, one or more second fans 1632 on the same side of the heat source 17 can be a group. At this time, the corresponding second fan 1632 and the second heat dissipation module 1622 form a heat dissipation module. There are two groups of heat dissipation modules. The heat dissipation modules on the same side of the heat source 17 form a group. The two groups of heat dissipation modules are arranged at intervals along the length direction X of the first cavity. The first fan 1631 is located between the two groups of heat dissipation modules. In this way, compared with only one heat dissipation module, the number of the first fans 1631 can be further reduced or the length of the first fan 1631 can be reduced, which can reduce the manufacturing cost of the electronic device to a certain extent.

[0245] Embodiment VII

[0246] As Figure 21 shown, the cooling fan 163 includes a first fan 1631 and a second fan 1632. The first fan 1631 is an axial flow fan, a cross-flow fan, and / or a first centrifugal fan, and is at least partially disposed in the first cavity. The second fan 1632 is a second centrifugal fan and is disposed in the second cavity. The same second centrifugal fan has two air outlets. One of the air outlets faces away from the heat source 17 along the first direction, denoted as the first air outlet; the other air outlet faces the heat source 17 along the length direction X of the first cavity, denoted as the second air outlet. A second heat dissipation module 1622 is provided on the air outlet side of the first air outlet. In this embodiment, at least a part of the second heat dissipation module 1622 corresponding to the first air outlet is disposed in the first cavity, and the first fan 1631 is arranged to avoid this group of second heat dissipation modules 1622.

[0247] Adopting the solution provided in this embodiment, compared with the solution of Embodiment IV, the air volume discharged by the second fan can be increased, the number of the first fans 1631 can be reduced or the length of the first fans 1631 can be reduced, which can reduce the manufacturing cost of the electronic device to a certain extent. In addition, the solution provided in this embodiment, compared with the solution of Embodiment V, can reduce the number of second heat dissipation modules, reduce the cost, and the gas discharged through the second air outlet can quickly discharge after taking away the heat of the heat source under the action of the first fan, which can improve the heat dissipation performance to a certain extent.

[0248] In the above embodiments, one or more second fans 1632 can be provided. When multiple second fans 1632 are provided, the multiple second fans 1632 can be divided into two groups and are respectively disposed on both sides of the heat source 17. That is, one or more second fans 1632 on the same side of the heat source 17 can be a group. At this time, the corresponding second fans 1632 and second heat dissipation modules 1622 form a heat dissipation module. There are two groups of heat dissipation modules. The heat dissipation modules on the same side of the heat source 17 form a group. The two groups of heat dissipation modules are arranged at intervals along the length direction X of the first cavity. The first fan 1631 is located between the two groups of heat dissipation modules. In this way, compared with only providing one heat dissipation module, the number of the first fans 1631 can be further reduced or the length of the first fans 1631 can be reduced, which can reduce the manufacturing cost of the electronic device to a certain extent.

[0249] Also, since the gas discharged through the second air outlet can be discharged through the first fan 1631 and the first heat dissipation module 1621, and the first heat dissipation module 1621 includes a plurality of first heat dissipation fins, and the first heat dissipation fins are arranged at intervals along the length direction of the first cavity 111a. The above first heat dissipation fins can be perpendicular to the X direction or can be arranged at other angles with respect to the X direction. A gas channel is formed between two adjacent first heat dissipation fins.

[0250] When the first heat sink is perpendicular to the X direction, since the second fan is located on one side of the first heat sink, that is, the second air outlet is located on one side of the first heat sink, there is generally a certain angle between the flow direction of the gas discharged through the second air outlet and the gas passage between the first heat sinks. The resistance suffered by the gas discharged through the second air outlet when passing through the gas passage is relatively large.

[0251] To reduce the above resistance, two first heat dissipation modules 1621 can be provided, as Figure 21 shown. The openings of the gas passages in each first heat dissipation module 1621 are inclined towards the adjacent second fan 1632. In this way, the wind resistance when the gas discharged through the second air outlet enters the gas passage can be reduced, facilitating the gas discharged through the second air outlet to quickly pass through the first heat dissipation module 1621 and improving the heat dissipation efficiency. The above first heat sink can form an angle of 35°, 45° or other angles with the X direction, which can be specifically determined according to the usage requirements.

[0252] In addition, adopting the solution of Embodiment Seven, if the first fan is not provided and the second air outlet is located inside the second fan, although the air flow path of the gas discharged through the second air outlet can directly pass through the heat source by using the sealed structure design of the electronic device. However, although the link thermal resistance of this solution is small, due to the large number of electronic components on the circuit board and the very small gap between adjacent two electronic components, the wind resistance is large. The gas discharged through the second air outlet cannot cover all the heat generating components (i.e., all heat sources). At the same time, since there is no corresponding air duct structure at the second air outlet of the second fan, it is not easy to control the main air volume of the second fan, which is not conducive to the design of the heat dissipation system. By setting the first fan, the gas discharged through the second air outlet of the second fan can reach the air outlet structure of the whole machine more efficiently. And when the first fan adopts the first centrifugal fan, compared with the axial flow fan, the wind pressure is greater and the thickness is thinner.

[0253] When the first fan adopts the first centrifugal fan, three, four or other numbers of first fans can be provided between the two second fans, which can be specifically determined according to the usage requirements and the limitation of the installation space. In some embodiments, the size of the first centrifugal fan can be 20*16.8*3.5mm. In other embodiments, the size of the first centrifugal fan can adopt other sizes, which can be specifically determined according to the usage requirements and the limitation of the installation space.

[0254] On the basis of Embodiment Seven, in order to enable the gas discharged through the second air outlet to finally be discharged through the first fan 1631. In some embodiments, a flow guiding structure 30 is provided in the second cavity 111b. The flow guiding structure 30 is arranged between the second air outlet and the first heat dissipation module 1621. The flow guiding structure 30 is used to guide the air flow discharged through the second air outlet to first pass through the heat source 17 and then be discharged through the first heat dissipation module 1621.

[0255] The diversion structure 30 can be made of foam, or can be made of other structures, such as plastic materials, metal materials, etc.

[0256] The diversion structure can have various setting manners, which can be specifically determined according to the usage requirements. For the convenience of understanding, examples are given below.

[0257] Such as Figure 17 As shown, in some embodiments, the air inlet structure 1151 includes a plurality of air inlet holes, and the plurality of air inlet holes are arranged at intervals in the X direction. And the length of the air inlet structure 1151 is not much different from the length of the electronic device. Thus, air inlet holes are also provided at the location of the second air outlet. In order to prevent the gas discharged from the second air outlet from directly being discharged through the air inlet structure 1151, in some embodiments, as Figure 21 shown, the diversion structure 30 includes a partition 31 provided between the air inlet structure and the second air outlet, and the partition 31 is used to block the gas discharged from the second air outlet from being discharged through the air inlet structure. At the same time, the diversion structure 30 further includes a diversion strip 32 such as foam surrounding the heat source 17, so that the gas discharged through the second air outlet can pass through the heat source 17 and then be discharged through the first fan 1631. The above-mentioned diversion strip 32 can be arranged between the two plate surfaces of the circuit board 131 and the inner wall of the accommodating cavity, and can be made of foam, or can be made of plastic strips, rubber strips, etc., which can be specifically determined according to the usage requirements. In other embodiments, the diversion structure 30 can also adopt other forms. For example, if the air inlet structure 1151 is not provided at the second air outlet, the diversion structure 30 may not include the above-mentioned partition 31.

[0258] The setting of the diversion structure 30 enables the gas discharged from the second air outlet of the second fan 1632 to pass through the heat source 17 first and then be discharged through the first fan 1631, and will not flow to other areas of the electronic device. In this way, the utilization rate of the gas discharged through the second air outlet can be improved, and the heat dissipation efficiency can be improved.

[0259] Such as Figure 17 As shown, adopting the solution provided in this embodiment, the air inlet structure 1151 is arranged on the main body portion 1131 of the D shell 113, and the air inlet structure 1151 can be divided into two parts by a partition. Specifically, the part of the air inlet structure 1151 on one side of the partition forms an air inlet, and the part on the other side of the partition forms another air inlet. The air outlet structure can include three groups of first air outlet holes 1152, a plurality of second air outlet holes 1153 and a plurality of third air outlet holes 1154. Among them, the three groups of first air outlet holes 1152 are all on the side of the C shell near the rotating shaft, and the second air outlet holes 1153 and the third air outlet holes 1154 are respectively located on the first protruding part 1132 and the main body portion 1131, and the air outlet structure is separated from the air inlet structure 1151 by the first protruding part 1132 to prevent the gas discharged through the air outlet structure from flowing back to the air inlet structure 1151.

[0260] like Figure 21 As shown, in some embodiments, there are multiple guide bars, such as 12, 14, etc., which can be determined according to the needs of use. For example, there are 12 guide bars, of which 6 are between the fan and the C shell and the D shell. These guide bars surround the second air outlets of the two second fans into a U-shaped air outlet, and the guide bars can be placed close to the heat source (such as the CPU, GPU, etc.) to ensure that the gas discharged through the second air outlet can cover a larger area of the circuit board. At the same time, the gas discharged through the second air outlet can be divided into two paths, one of which flows along the Figure 15 The airflow goes through the channel between the circuit board and the C case to reach the first heat dissipation module, then passes through the gap between the first fans and reaches the environment from the first air outlet. The other airflow goes along Figure 15 In the direction indicated by the solid arrow in the figure, the air passes through the circuit board and the D shell to the first fan, and then passes through the second air outlet and / or the third air outlet to the environment, so that the two air flows are divided into two air ducts and go from different air outlets to the environment without interfering with each other. The above method can simultaneously remove the heat from both sides of the circuit board and the C shell and the D shell, thereby achieving overall cooling of the electronic equipment.

[0261] In this embodiment, the heat sources can be all arranged on the side of the circuit board facing the D shell, or most of the heat sources can be arranged on the side of the circuit board facing the D shell, and a small part can be arranged on the side of the circuit board facing the C shell. In this way, the temperatures of the two airflows can be different. The airflow with a higher temperature is discharged through the air outlet of the first fan, and the airflow with a lower temperature is discharged through the gap between the first fans. Therefore, the flow rate of the airflow with a higher temperature can be higher, so that the heat dissipation efficiency of the electronic equipment is higher.

[0262] Embodiment 8

[0263] like Figure 22 As shown, the heat dissipation fan 163 includes a first fan 1631 and a second fan 1632. The second fan 1632 is a second centrifugal fan, which is arranged in the second cavity. The first fan 1631 is an axial flow fan, a cross-flow fan and / or a first centrifugal fan, which is arranged in the first cavity. The first fan 1631 only occupies part of the first cavity, and there is still other space in the first cavity except for the shaft structure and the first fan 1631. The above space can be used to install the circuit board assembly 13 or other electronic components 132.

[0264] In this embodiment, the second fan 1632 is provided with an air outlet, which is arranged along the length direction X of the first cavity toward a side away from the heat source 17, and the second heat dissipation module 1622 is located at the air outlet side of the air outlet.

[0265] In this embodiment, the corresponding second fan 1632 and the second heat dissipation module 1622 form a heat dissipation module. The first fan 1631 is correspondingly arranged with the heat dissipation module. The corresponding arrangement means that the first fan 1631 is located within the projection area of the corresponding heat dissipation module along the first cavity.

[0266] Adopting the solution provided in this embodiment, the positions of the first fan 1631 and the second fan 1632 correspond to each other, which is convenient for design and installation, and can provide more installation space for other electronic components 132. Compared with the solution of Embodiment Five, the manufacturing cost of the electronic device can be reduced to a certain extent.

[0267] It should be noted that in the solutions provided in Embodiments One to Eight, in order to ensure the air outlet effect, there is generally a gap between the first fan and the first heat dissipation module, and between the second fan and the second heat dissipation module. The width of the gap can be determined according to the air outlet effect, such as less than 5 mm, less than 4 mm, etc., and no specific limitation is made here.

[0268] To verify the effect of the heat dissipation system provided in the embodiments of the present application, some parameters of the related art and Embodiments One and Two are compared here. In the related art, two centrifugal fans are used as the heat dissipation fans, which are arranged on both sides of the circuit board assembly. The maximum air volume (also known as the maximum air flow rate) Qmax discharged by a single centrifugal fan per unit time is 10.5 CFM, the noise is 43 dB, and the air pressure is 90 Pa. In Embodiment One, the heat dissipation fan includes multiple axial fans. The maximum air volume Qmax of a single axial fan is 1.9 CFM, the noise is 25 dB, and the air pressure is 75 Pa. In Embodiment Two, the heat dissipation fan includes a single cross-flow fan. The maximum air volume Qmax of a single cross-flow fan is 20 CFM, the noise is 30 dB, and the air pressure is 75 Pa. The test results are as follows:

[0269] Table 1

[0270] Related technologies Example 1 Example 2 Maximum air volume / CFM 21 23 20 Maximum wind pressure / Pa 90 75 40 Noise / dB 46 36 30 Number of fans 2 12 1

[0271] Table 2

[0272]

[0273] As can be seen from the above Table 1 and Table 2, compared with the related art, adopting the solutions of Embodiments One and Two of the present application can keep the maximum air volume of the heat dissipation system 16 unchanged, and make parameters such as air pressure, noise, weight, and volume smaller, that is, meet the requirement of reducing fan noise under the condition of meeting the rated TDP, and achieve the balance of parameters such as noise, TDP, and the thickness of the whole machine.

[0274] Figure 23 For Figure 21 The partial structural schematic diagram of the heat dissipation system in the shown electronic device.

[0275] Based on any one of Embodiments 4 to 8, in some embodiments, such as Figure 23 shown, the heat source 17 includes a first heating module 171 and a second heating module 172. The power of the second heating module 172 is less than the power of the first heating module 171. The maximum air output per unit time of the first fan 1631 is less than the maximum air output per unit time of the second fan 1632. The first heat dissipation module 1621 is thermally connected to the second heating module 172, and the second heat dissipation module 1622 is thermally connected to the second heating module 172.

[0276] Power is the rate of change of energy over time, that is, the energy converted per second. For a heating module, power directly reflects the amount of heat generated per unit time. The power of the first heating module 171 is greater than the power of the second heating module 172, that is, the heat generation amount of the first heating module 171 per unit time is greater than the heat generation amount of the second heating module 172 per unit time.

[0277] In this embodiment, the first heating module 171 can be a control chip, a GPU, etc., and the second heating module 172 can be at least some of the above-mentioned voltage regulation modules, power supply modules, etc., such as the electronic components 132.

[0278] Since the heat generation amount of the first heating module 171 per unit time is greater than the heat generation amount of the second heating module 172 per unit time, and the maximum air output per unit time of the first fan 1631 is less than the maximum air output per unit time of the second fan 1632, and the first heat dissipation module 1621 is thermally connected to the second heating module 172, and the second heat dissipation module 1622 is thermally connected to the second heating module 172, it can be made such that the first heating module 171 with a large heat generation amount corresponds to the second heat dissipation module 1622 with a high heat dissipation efficiency, and the second heating module 172 with a small heat generation amount corresponds to the first heat dissipation module 1621 with a low heat dissipation efficiency. In this way, the heat dissipation rates of the first heating module 171 and the second heating module 172 can both be relatively high, so that the heat dissipation efficiency of the electronic device is relatively high.

[0279] In addition, the first heat dissipation module 1621 is thermally connected to the second heat generating module 172, and the second heat dissipation module 1622 is thermally connected to the second heat generating module 172. That is, the first fan 1631 is responsible for dissipating heat from the second heat generating module 172, and the second fan 1632 is responsible for dissipating heat from the first heat generating module 171. In cooperation with the control chip, this can ensure that when the temperature of either the first heat generating module 171 or the second heat generating module 172 is too high, only the corresponding fan is started, without starting both the first fan 1631 and the second fan 1632, which can reduce energy consumption and noise. For example, when the temperature of the first heat generating module 171 is low and the temperature of the second heat generating module 172 is high, only the first fan 1631 is controlled to operate. When the temperature of the second heat generating module 172 is low and the temperature of the first heat generating module 171 is high, only the second fan 1632 is controlled to operate to ensure low noise / lower surface temperature. When the temperatures of both the first heat generating module 171 and the second heat generating module 172 are high, the first fan 1631 and the second fan 1632 operate simultaneously.

[0280] In some embodiments, the first heat generating module 171 includes a control chip and / or a GPU, and the second heat generating module 172 includes a voltage regulation module and / or a power supply module electrically connected to the first heat generating module 171.

[0281] Specifically, the power supply module may include a battery 14 charging controller, filter capacitors, protection circuits, etc.

[0282] When the first heat generating module 171 is a control chip, the second heat generating module 172 includes at least a voltage regulation module corresponding to the control chip. When the first heat generating module 171 is a GPU, the second heat generating module 172 includes at least a voltage regulation module corresponding to the GPU. When the first heat generating module 171 is a control chip and a GPU, the second heat generating module 172 includes at least a voltage regulation module corresponding to the control chip and a voltage regulation module corresponding to the GPU.

[0283] Under normal circumstances, the electronic components 132 with relatively large heat generation in the circuit board assembly mainly include control chips, GPUs, voltage regulation modules, power supply modules, etc. Among them, the power of the control chip and the GPU is generally relatively large, and the heat generation per unit time of the control chip and the GPU is generally greater than that of the voltage regulation module, the power supply module and other electronic components 132 per unit time. In the related art, the heat dissipation structure 162 is generally only thermally connected to the control chip and the GPU through the heat conducting member 161, and is not thermally connected to the voltage regulation module, the power supply module and other electronic components 132. This enables only some of the electronic components 132 with relatively large heat generation (control chips and GPUs) in the circuit board assembly to achieve heat conduction with the heat dissipation structure 162 through the heat conducting member 161 with relatively high thermal conductivity. When these electronic components 132 dissipate heat, the heat generated by the electronic components 132 can be directly transferred to the heat dissipation structure 162 through the heat conducting member 161. However, the heat conduction path (also called the heat transfer path) of the heat dissipated by other electronic components 132 with relatively large heat generation in the circuit board assembly (such as the voltage regulation module, the power supply module, etc.) is relatively long. The heat conduction path of the above-mentioned electronic components 132 is as follows: from the electronic components 132 to the circuit board 131, then from the circuit board 131 to the control chip or the GPU, and then from the control chip or the GPU to the heat conducting member 161, and then from the heat conducting member 161 to the heat dissipation structure 162. It can be seen that in the related art, the heat dissipation path of some of the electronic components 132 with relatively large heat generation in the circuit board assembly (i.e., the second heat generation module 172 in this embodiment) passes through multiple components, and the heat dissipation path is affected by multiple factors such as the contact thermal resistance between the electronic components 132 and the circuit board 131, the thermal resistance of the heat conducting member 161, the heat dissipation area of the heat sink in the heat dissipation structure 162, and the performance of the cooling fan 163, resulting in extremely low heat dissipation efficiency of these electronic components 132. The heat generated by these electronic components 132 further causes the surface temperature of the whole machine to be too high because it cannot be effectively exchanged with the outside world in time.

[0284] Compared with the related art, by adopting the solution provided in this embodiment, the heat dissipation path of each electronic component 132 in the second heat generation module 172 is from the electronic component 132 to the heat conducting member 161 and then to the heat dissipation structure 162, or directly from the electronic component 132 to the heat dissipation structure 162, omitting the heat conduction processes such as from the electronic component 132 to the circuit board 131 and then from the circuit board 131 to the first heat generation module 171. This can shorten the heat conduction path of the second heat generation module 172, improve its heat dissipation speed, thereby improving the heat dissipation efficiency of the electronic device. And the acceleration of the heat dissipation efficiency can also reduce the energy consumption to a certain extent. Also, since the heat conduction path of the second heat generation module 172 is shortened, the thermal resistance it suffers will also decrease accordingly. In this way, the heat dissipation efficiency of the second heat generation module 172 is higher at the same noise level, and the rotation speed of the first fan 1631 can be smaller and the noise can be lower at the same heat dissipation efficiency.

[0285] As Figure 23 shown, in some embodiments, the second heating module 172 is disposed closer to the first fan 1631 than the first heating module 171.

[0286] In the related art, the second heating module 172 is located on the side of the first heating module 171 away from the rotating shaft structure, while the first fan 1631 in this embodiment is disposed close to the rotating shaft. Thus, if the arrangement positions of the second heating module 172 and the first heating module 171 still adopt the arrangement mode of the related art, the second heating module 172 will be disposed farther from the first fan 1631 than the first heating module 171. And the second heating module 172 is thermally connected to the first heat dissipation module 1621 corresponding to the first fan 1631, so that a relatively long heat conducting member 161 needs to be provided between the second heating module 172 and the first heat dissipation module 1621, which will occupy a relatively large space. However, in the solution provided in this embodiment, the second heating module 172 is disposed closer to the first fan 1631 than the first heating module 171. In this way, when the second heating module 172 is thermally connected to the first heat dissipation module 1621, the second heating module 172 can be directly in thermal contact with the first heat dissipation module 1621, or the heat conduction between the two can be realized through a relatively short heat conducting member 161, which can occupy a relatively small space, making the structure compact, facilitating the miniaturization design of the electronic device, and being beneficial to its thin and light design.

[0287] As Figure 22 shown, in some other embodiments, the second heating module 172 may also adopt the arrangement mode in the related art and be disposed farther from the first fan 1631 than the first heating module 171. However, the second heating module 172 can be in thermal contact with the second heat dissipation module 1622 through the heat conducting member 161. In this way, the heat conduction path of the second heating module 172 can also be shortened, and its heat dissipation rate can be improved.

[0288] Based on the above embodiments, in order to make the heat dissipation rate of the second heating module 172 relatively high, the housing of the second fan 1632 can be made of a metal material, and the heat conducting member 161 can also be made of a metal material. When setting, the heat conducting member 161 is brought into contact with at least a part of the second fan 1632, so that the heat conducting member 161 can be quickly cooled, and thus the second heating module 172 can be quickly cooled.

[0289] However, when adopting this solution, since the heat conducting member 161 and the second heat dissipation module 1622 are stacked at the second air outlet of the second fan 1632, it may affect the overall thickness of the machine. Adopting the Figure 21 solution shown can reduce the influence on the overall thickness of the machine.

[0290] In some embodiments, the second heating module 172 includes a voltage regulation module. The voltage regulation module includes an inductor and a MOS transistor. The volume of the MOS transistor is relatively small, and it can be arranged close to the first fan 1631 and stacked with the first heat dissipation module 1621. The two are in direct thermal contact. The inductor is arranged on the side of the MOS transistor close to the control chip, and the inductor is thermally connected to the first heat dissipation module 1621 through a heat conducting member 161. The heat conducting member 161 can be a metal sheet 1613 (such as an aluminum sheet, a copper sheet, etc.), a heat pipe, etc., and can be specifically determined according to the usage requirements.

[0291] In this way, the heat dissipation assembly composed of the second heating module 172 and the first heat dissipation module 1621 has a simple and compact structure and is convenient for assembly.

[0292] In some embodiments, the first heating module 171 is thermally connected to the second heat dissipation module 1622 through a first heat pipe 1611, and the second heating module 172 is thermally connected to the first heat dissipation module 1621 through a second heat pipe 1612, and the second heat pipe 1612 is thermally connected to the first heat pipe 1611.

[0293] Among them, based on the above embodiments, the second heat pipe 1612 can be arranged between the MOS transistor and the first heat dissipation module 1621. The size of the second heat pipe 1612 can be determined according to the usage requirements. For example, in some embodiments, the second heat pipe 1612 can be made of a heat pipe with a diameter of 5 mm and a thickness of about 0.8 mm - 1.2 mm, or other sizes can also be used. The specific size can be determined according to the power consumption of the CPU / GPU.

[0294] The second heat pipe 1612 can adopt a similar U-shaped structure with an opening facing the first heat pipe 1611, and the first heat pipe 1611 can also adopt a similar U-shaped structure with an opening facing the second heat pipe 1612. When the two are thermally connected, the two ends of the first heat pipe 1611 can be welded to the two ends of the second heat pipe 1612, or other connection methods can be used to ensure good temperature uniformity of the entire heat dissipation system 16.

[0295] In some embodiments, the inductor is welded to the first heat dissipation module 1621 through a metal sheet 1613, and the first heat dissipation module 1621 is welded to the second heat pipe 1612. In this way, the connection of the three can be stable, and the heat generated by the inductor and the MOS transistor is concentrated on the first heat dissipation module 1621.

[0296] The solutions provided by the above embodiments are mainly applied to the heat dissipation solution of a notebook computer. Based on the theory of improving the fan performance and reducing the thermal resistance of each path on the heat dissipation path of the notebook computer, the heat pipe is directly in contact with the heat-generating components of the circuit board, and then the temperature of the heat-generating components of the circuit board is effectively reduced by using the air outlet of the fan, further achieving the purpose of reducing the surface temperature of the notebook. In addition, it can also be used for the cooling of other electronic devices, which can be determined according to specific usage requirements.

[0297] Based on the above Embodiments 1 to 8, in some embodiments, the device body 100 includes a first housing 11 and a first structural member. The first housing 11 may adopt the structure of the first housing provided by the above embodiments, or may adopt an integrally formed structure, and there is no unique limitation here. The first structural member may be the above keyboard assembly, or may be a display screen, or other structural members, which can be determined according to specific usage requirements. The first housing 11 is provided with a receiving cavity 111 and an opening communicating with the receiving cavity 111. At least part of the first structural member is located in the receiving cavity 111, and at least part of the first structural member is exposed through the opening. A second cavity 111b is formed between the first structural member and the bottom wall of the first housing 11. The part of the receiving cavity 111 other than the second cavity 111b forms a first part; or, a part of the part of the receiving cavity 111 other than the second cavity 111b forms a first part. At this time, the structure of the electronic device is relatively simple, which is convenient for design and installation.

[0298] Based on the above embodiments, the electronic device may further include a battery 14. The battery 14 is disposed in the first cavity 111a, and the battery 14 is electrically connected to the heat source 17 and / or the cooling fan 163, which can enable the electronic device to have a self-power supply function for a certain period of time.

[0299] Based on the above Embodiments 1 to 8, in other embodiments, the device body 100 includes a first housing 11 and a first structural member. The first housing 11 may adopt the structure of the first housing provided by the above embodiments, or may adopt an integrally formed structure, and there is no unique limitation here. The first structural member may be the above keyboard assembly, or may be a display screen, or other structural members, which can be determined according to specific usage requirements. The first housing 11 includes a first part and a second part that are sequentially arranged and connected. The height of the first part is greater than the height of the second part. A first cavity 111a is provided in the first part. A second cavity 111b is provided in the second part. The second part is further provided with an opening communicating with the second cavity 111b. At least part of the first structural member is located in the second cavity, and at least part of the first structural member is exposed through the opening.

[0300] It can be understood that when the electronic device is a laptop computer, the first part in this embodiment can be the above-mentioned main body part, and the second part is the second protruding part. When the electronic device is other devices, the first part and the second part can be divided according to the usage requirements.

[0301] By adopting the solution provided in this embodiment, the overall height of the electronic device is not likely to increase.

[0302] Figure 24 It is a schematic cross-sectional structure diagram of an electronic device provided in another embodiment of the present application.

[0303] Such as Figure 10 and Figure 24 As shown, in some embodiments, the second cavity 111b includes a third cavity 111c and a fourth cavity 111d communicating with the third cavity 111c. The third cavity 111c is formed between the first structural member and the bottom wall of the first housing 11, that is, the cavity between the dotted line L1 and the dotted line L2 in the figure, and is also the cavity corresponding to the keyboard area Q1 above. The fourth cavity 111d is the part of the second cavity 111b except the third cavity 111c, that is, the cavity on the left side of the dotted line L1 and the right side of the dotted line L2 in the figure, and is also the cavity corresponding to the hinge area Q2 and the palm rest area Q3 above. The height d1 of the third cavity 111c is less than the height d2 of the fourth cavity 111d. At least part of the heat source 17, at least part of the heat conducting member 161, and at least part of the second fan 1632 are provided in the third cavity 111c.

[0304] By adopting the solution provided in this embodiment, the structure of the electronic device can be made compact, which is convenient for its miniaturized design.

[0305] On the basis of the above embodiments, in some embodiments, the electronic device further includes a battery 14. The battery 14 is provided in the fourth cavity 111d. The battery 14 is electrically connected to the heat source 17 and / or the cooling fan 163. By adopting the solution provided in this embodiment, the battery 14 is located in the fourth cavity 111d, which can make the volume of the battery 14 larger and can provide more electric energy for the relevant electronic components 132 of the electronic device.

[0306] In some embodiments, in addition to the first housing 11, the device body 100 further includes a second housing 21. The second housing 21 is rotatably connected to the first part through a hinge structure. The device body 100 can be switched between a closed state and an open state. In the closed state, the second housing 21 is stacked with the second part, and the height of the first part is adapted to the height of the stacked structure of the second housing 21 and the second part. By adopting the solution provided in this embodiment, in the closed state, the second housing 21 is only stacked with the second part with a smaller height, so that the setting of the first part will not have a great impact on the thickness of the electronic device, which is convenient for the thin and light design of the electronic device.

[0307] The above-mentioned rotating shaft structure can be arranged inside the first cavity, outside the first cavity, or part of it can be arranged inside the first cavity and the other part outside the first cavity. In some embodiments, at least part of the rotating shaft structure is located inside the first cavity. The first fan is arranged to avoid the rotating shaft structure. In this embodiment, the rotating shaft structure and the first fan are arranged offset in the X direction. This can ensure that the design of the first fan does not affect the rotation of the second part, and the rotating shaft structure is not located on the air flow path between the first heat dissipation module and the first fan, or on the air outlet side of the first fan, that is, the rotating shaft structure does not block the heat dissipation air flow, meeting its usage requirements.

[0308] In some embodiments, the first part and the second part are detachably connected. For example, the first part and the second part can be detachably connected by bolts, snap connections, plug-in connections, etc., which is convenient for the assembly and maintenance of the electronic device.

[0309] As Figure 24 shown, based on the above embodiments, in some embodiments, the first fan 1631 is arranged close to the first air outlet hole 1152 of the electronic device. Specifically, the first air outlet hole 1152 of the electronic device is adjacent to and communicated with the first cavity 111a. This makes the heat dissipated by the operation of the first fan 1631 not easily stay in the accommodation cavity 111 and can be quickly dissipated outside the electronic device. Moreover, since the first fan 1631 is arranged close to the air outlet of the electronic device, it can also shorten the length of the flow path of the gas discharged by the first fan 1631 inside the electronic device, improving the heat dissipation efficiency to a certain extent.

[0310] Based on the above embodiments, in some embodiments, the electronic device further includes a protection structure 18. The protection structure 18 is located on the air outlet side of the first fan 1631 and is connected to the device main body 100. The protection structure 18 is provided with a ventilation opening communicating the first cavity 111a and the external space.

[0311] The protection structure 18 can be a protection mesh plate arranged inside or outside the accommodation cavity 111, or other structural members that can play a protective role, such as a baffle with a microporous structure. The protection structure 18 is used to prevent objects outside the electronic device from entering the first fan 1631 through the first air outlet hole 1152 in the heat dissipation holes 115, so as not to affect the use of the first fan 1631 or cause damage to the user. At the same time, the setting of the protection structure 18 does not cause an adverse effect or a large impact on the heat dissipation of the electronic device, enabling the electronic device to still meet the usage requirements.

[0312] In each of the above embodiments, the air inlet structure may be provided only on the D shell, or a part of it may be provided on the D shell and the other part on the C shell. When the air inlet structure is provided on the C shell, it may be provided at the position where the keyboard assembly is located, or at other positions. Specifically, it can be determined according to the usage requirements. The air outlet structure can be provided at multiple positions according to the usage requirements. For example, the air outlet structure can be provided on the bottom surface of the D shell, or on multiple outer peripheral surfaces of the D shell, or on the first protruding part. Specifically, it can be determined according to the usage requirements. Specifically, as Figure 17 shown, the air inlet structure 1511 can be provided on the bottom surface of the D shell, and air outlet holes can also be provided on any outer peripheral surface of the D shell connected to the bottom surface. The air outlet holes, as Figure 17 shown, can be provided outside the side wall close to the rotating shaft structure, and can also be provided on the side wall connecting this side wall and the bottom surface. That is Figure 17 at A in

[0313] air outlet holes can be provided when the second air outlet of the second fan faces outward. At the same time, air outlet holes can also be provided on the side wall of the D shell that is arranged opposite to the side wall where A is located. Specifically, it can be determined according to the usage requirements. Finally, it should be noted that the above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any change or replacement within the technical scope disclosed in this application should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that, It includes a device body, a heat source and a heat dissipation system provided on the device body. The device body has a receiving cavity, an air inlet structure and an air outlet structure both communicating with the receiving cavity. The receiving cavity includes a first cavity and a second cavity communicating with each other. The height of the first cavity is greater than that of the second cavity, and the volume of the first cavity is smaller than that of the second cavity. At least part of the heat source is located in the second cavity. The heat dissipation system includes a heat dissipation fan, and the heat dissipation fan includes a first fan, and at least part of the first fan is provided in the first cavity.

2. The electronic device according to claim 1, wherein The heat dissipation system includes a heat dissipation structure. The heat dissipation structure includes a first heat dissipation module corresponding to the first fan. The first heat dissipation module is thermally connected to at least part of the heat source, and the first heat dissipation module is located on the side of the first fan close to the heat source.

3. The electronic device according to claim 2, wherein The first fan includes at least one of an axial flow fan, a cross flow fan and a first centrifugal fan.

4. The electronic device according to claim 2 or 3, characterized in that, The first cavity has a length direction. A plurality of the first fans are provided, and the plurality of first fans are arranged in sequence along the length direction of the first cavity.

5. The electronic device according to claim 2, wherein The first fan includes a first centrifugal fan, and the first centrifugal fan is obliquely arranged so that the air inlet of the first centrifugal fan faces the first heat dissipation module, and the air outlet of the first centrifugal fan faces at least part of the air outlet structure.

6. The electronic device according to claim 5, characterized in that The first cavity has a length direction. A plurality of the first centrifugal fans are provided, and the plurality of first centrifugal fans are arranged at intervals along the length direction of the first cavity.

7. The electronic device according to claim 5 or 6, characterized in that, The first centrifugal fan is fixed in the device body through a fixing member.

8. The electronic device according to claim 7, wherein The fixing member is fixedly installed on the inner wall of the device body. The fixing member is provided with a clamping structure, and the first centrifugal fan is fixed on the fixing member through the clamping structure.

9. The electronic device according to claim 7 or 8, characterized in that, The electronic device further includes a circuit board, and the heat source is at least part of the electronic components provided on the circuit board. The receiving cavity has two main surfaces oppositely arranged in the height direction. Channels for air flow are formed between the circuit board and the main surfaces. The fixing member is provided with a through structure communicating at least one of the channels and the air outlet structure.

10. The electronic device according to any one of claims 1-9, characterized in that, In the length direction of the first cavity, the sum of the sizes of all the first fans is greater than or equal to 1 / 2 of the size of the first cavity.

11. The electronic device according to any one of claims 2-10, characterized in that, In the length direction of the first cavity, the sum of the sizes of all the first fans is adapted to the size of the first heat dissipation module or greater than the size of the first heat dissipation module.

12. The electronic device according to any one of claims 2-10, characterized in that, A plurality of the first heat dissipation modules are provided, and the plurality of first heat dissipation modules are arranged at intervals along the length direction of the first cavity.

13. The electronic device according to any one of claims 2-10, characterized in that, The heat dissipation fan further includes a second fan. The second fan is a second centrifugal fan, and at least part of the second fan is located in the second cavity. The heat dissipation structure further includes a second heat dissipation module corresponding to the second fan. The second heat dissipation module is thermally connected to at least part of the heat source, and the second heat dissipation module is located on the air outlet side of the second fan.

14. The electronic device according to claim 13, wherein The second fan is provided with an air outlet, and the air outlet of the second fan is arranged along a first direction toward a side away from the heat source, and the first direction is arranged at an angle to the length direction of the first cavity.

15. The electronic device according to claim 13, wherein The second fan is provided with a first air outlet and a second air outlet, the first air outlet is arranged along a side facing away from the heat source, and the second air outlet is arranged along a length direction of the first cavity toward a side facing away from the heat source, the second heat dissipation module is provided at both the first air outlet and the second air outlet, at least a portion of the second heat dissipation module corresponding to the first air outlet is arranged in the first cavity, and the first fan is arranged to avoid the second heat dissipation module at least partially arranged in the first cavity.

16. The electronic device according to claim 15, wherein The corresponding second fan and the second heat dissipation module form a heat dissipation module, and the heat dissipation module is provided with two groups. The two groups of heat dissipation modules are arranged at intervals along the length direction of the first cavity and are arranged on both sides of the heat source. The first fan is located between the two groups of heat dissipation modules in the length direction of the first cavity.

17. The electronic device according to claim 13, wherein The second fan is provided with a first air outlet and a second air outlet, the first air outlet is arranged along a first direction toward a side away from the heat source, the second air outlet is arranged along a length direction of the first cavity toward a side of the heat source, the second heat dissipation module is provided at the first air outlet, at least a portion of the second heat dissipation module is arranged in the first cavity, and the first fan is arranged to avoid the second heat dissipation module at least partially arranged in the first cavity.

18. The electronic device according to claim 17, wherein A flow guiding structure is provided in the second cavity, and the flow guiding structure is provided between the second air outlet and the first heat dissipation module. The flow guiding structure is used to guide the airflow discharged through the second air outlet to first pass through the heat source and then be discharged through the first heat dissipation module.

19. The electronic device according to any one of claims 13-18, characterized in that, The heat source includes a first heating module and a second heating module, the power of the second heating module is less than the power of the first heating module, the maximum air output per unit time of the first fan is less than the maximum air output per unit time of the second fan, the first heat dissipation module is thermally connected to the second heating module, and the second heat dissipation module is thermally connected to the second heating module.

20. The electronic device according to claim 19, wherein The first heating module includes a control chip and / or a GPU, and the second heating module includes a voltage regulating module and / or a power supply module electrically connected to the first heating module.

21. The electronic device according to claim 19 or 20, characterized in that, The second heating module is disposed closer to the first fan than the first heating module.

22. The electronic device according to any one of claims 13-21, characterized in that, The corresponding second fan and the second heat dissipation module form a heat dissipation module, the first fan is arranged corresponding to the heat dissipation module, and the first fan is located in the projection area of the corresponding heat dissipation module in the first cavity.

23. The electronic device according to any one of claims 1-22, characterized in that, The device body includes a first shell, which includes a first part and a second part that are arranged and connected in sequence, the height of the first part is greater than the height of the second part, at least a part of the first cavity is disposed in the first part, and the second cavity is disposed in the second part.

24. The electronic device according to claim 23, wherein The device body further includes a second housing, which is rotatably connected to the first part through a rotating shaft structure. The device body can be switched between a closed state and an open state. In the closed state, the second housing is stacked with the second part, and the height of the first part is adapted to the height of the stacked structure of the second housing and the second part.

25. The electronic device according to claim 24, characterized in that, At least part of the rotating shaft structure is located in the first cavity, and the first fan is arranged to avoid the rotating shaft structure.

26. The electronic device according to any one of claims 1-22, characterized in that, The device body includes a first housing, a first protruding part, and a first structural member. A first cavity and an opening communicating with the first cavity are provided inside the first housing. The first protruding part covers the opening. A second cavity is provided inside the first protruding part. The second cavity communicates with the first cavity to form the accommodating cavity. At least part of the first cavity is formed by the second cavity and the corresponding part of the first cavity corresponding to the second cavity, and the other part of the first cavity forms the second cavity.

27. The electronic device according to any one of claims 1-26, characterized in that, The opening of the air outlet structure is arranged facing away from the air inlet structure.

28. The electronic device according to any one of claims 1-27, characterized in that, At least part of the air outlet structure is arranged adjacent to and communicates with the first cavity; The electronic device further includes a protection structure, which is located on the air outlet side of the first fan and is connected to the device body. The protection structure is provided with a ventilation opening communicating the first cavity and the air outlet structure.

29. The electronic device according to any one of claims 1-28, characterized in that, The electronic device is a laptop computer.

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