Heat pipe type radiator device applied to high-power-consumption chip test

Abstract

The invention discloses a heat pipe type radiator device applied to high-power-consumption chip testing, and the device comprises a first connection seat plate which is provided with a connection part; the first connecting seat plate is rotatably connected with one side of the second connecting seat plate, and the first connecting seat plate and the second connecting seat plate are respectively provided with a locking piece and a locking piece which are detachably connected; the second connecting seat plate is provided with a connecting position used for being connected with a tester. The heat dissipation module is connected with the connecting part, and the heat dissipation module comprises a fin group, an air flow starting part, a heat pipe heat transfer part, a heat conduction block and an air duct enclosure cover; the heat pipe heat transfer piece comprises a bottom plate and a plurality of heat pipe columns; the first end face of the bottom plate is connected with the heat conduction block in an attached mode, and the multiple heat pipe columns are arranged on the second end face of the bottom plate. The multiple heat pipe columns penetrate through the fin set, and the air flow starting piece is arranged on one side of the fin set. The air channel enclosing cover is connected with the enclosing fin set and the air flow starting piece, and a main air inlet and a main air outlet are enclosed.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, specifically a heat pipe type radiator device applied to high-power chip testing. Background Art

[0002] With the market application scenarios such as GTP, intelligent computing, servers, and AGI artificial intelligence, the computing power required for chip products has also increased. Generally, the computing power of chip products is positively correlated with their power consumption and heat generation. That is, the higher the computing power of a chip product, the greater its power consumption and heat generation during operation. A large amount of heat is generated during the computing operations of large categories such as CPUs, GPGPUs, and DCUs. Overheating of the chip environment can lead to chip short-circuit failure, or even burnout and fire safety accidents.

[0003] Currently, traditional air duct radiators on the market have the defects of insufficient cooling capacity and overly large device size, which causes interference with the EVB circuit board. Therefore, improvements are urgently needed. Summary of the Invention

[0004] The present invention mainly addresses the above problems and proposes a heat pipe type radiator device applied to high-power chip testing, aiming to solve the technical problems in the background art.

[0005] To achieve the above object, the present invention provides a heat pipe type radiator device applied to high-power chip testing, including: A first connection seat plate, which is provided with a connection portion; A second connection seat plate, one side of the first connection seat plate is rotatably connected to the second connection seat plate. At the end far from the rotation connection, the first connection seat plate and the second connection seat plate are respectively provided with a detachable locking member and a locking component; the second connection seat plate is provided with a connection position for connecting to a tester; A heat dissipation module, the heat dissipation module is connected to the connection portion. The heat dissipation module includes a fin group, a wind flow generating member, a heat pipe heat transfer member, a heat conduction block, and an air duct enclosure; the heat pipe heat transfer member includes a bottom plate and a plurality of heat pipe columns; the first end face of the bottom plate is attached and connected to the heat conduction block, and a plurality of the heat pipe columns are arranged on the second end face of the bottom plate; a plurality of the heat pipe columns penetrate through the fin group, and the wind flow generating member is arranged on one side of the fin group; the air duct enclosure is connected and encloses the fin group and the wind flow generating member, enclosing a total air inlet, a total air outlet, and an air duct connecting the total air inlet and the total air outlet.

[0006] Furthermore, it includes a support plate arranged between the fin group and the bottom plate. The support plate is provided with positioning connection holes corresponding to the plurality of heat pipe columns, and the air duct enclosure is connected to the side of the support plate by screws.

[0007] Further, the heat dissipation module includes a third connecting seat plate, which is arranged on the first end face side of the bottom plate. The third connecting seat plate and the bottom plate are penetrated by a screw group and connected to the support plate; the connecting part is a bolt connection hole arranged on the side wall of the first connecting seat plate, and the third connecting seat plate is provided with a threaded hole corresponding to the bolt connection hole. The bolt connection hole and the threaded hole are connected by bolts to fasten their connection.

[0008] Further, an elastic buffer is arranged between the bottom plate and the support plate.

[0009] Further, a backing plate and a disc spring are arranged between the bottom plate and the third connecting seat plate.

[0010] Further, it includes a floating buffer block and an elastic buffer; a receiving groove is arranged on the end face of the second connecting seat plate opposite to the first connecting seat plate; the floating buffer block is connected to the receiving groove by a limit screw, and the elastic buffer is arranged between the floating buffer block and the bottom wall of the receiving groove.

[0011] Further, the air flow generating member is two fans arranged side by side; a temperature sensor and a heater are arranged in the heat conducting block.

[0012] Further, the locking member is rotatably connected to the first connecting seat plate, and the locking member is provided with a hook portion; the locking member includes an operating handle, a locking block, and a support shaft; the operating handle is rotatably connected to the second connecting seat plate, and a protruding pressing portion is arranged at the rotation connection of the operating handle; a strip hole is arranged on the second connecting seat plate, and the support shaft penetrates the strip hole and the locking block; the locking block is provided with a clamping groove corresponding to and cooperating with the hook portion; when the operating handle rotates to a predetermined angle, the protruding pressing portion presses the support shaft.

[0013] Further, the second connecting seat plate is provided with a movable groove, and the locking block is located in the movable groove; an elastic abutting member is arranged between the locking block and the bottom wall of the movable groove; an elastic abutting member is arranged between the side of the locking member away from its hook portion and the first connecting seat plate.

[0014] Further, in the fin group, each fin has folded-up edges at both edges, and the folded-up edges abut against the bottom wall of the fin at the upper end; the fin is provided with a through hole for the heat pipe column to pass through, and a ring edge extending towards the top end of the heat pipe column is arranged at the edge of the through hole; a solder port is opened beside the through hole.

[0015] Compared with the prior art, the heat pipe radiator device applied to high-power chip testing provided by the present invention can, by setting an air duct enclosure cover, make the air flow generated by the air flow generating component located at the total air inlet or the total air outlet of the fin group only enter the air duct from the total air inlet and then flow out from the total air outlet, with a clear directionality, which can effectively prevent the heat air flow from escaping from around the fin group and the hot air from re-entering the fin group through the air flow generating component, resulting in poor heat dissipation and cooling effect. Description of the Drawings

[0016] Figure 1 It is a statistical chart of the heat dissipation effect when the heat pipe radiator device applied to high-power chip testing of this application is used for testing chips with different power consumptions.

[0017] Figure 2 It is a statistical record curve graph of the heat dissipation effect when the heat pipe radiator device applied to high-power chip testing of this application is used for testing chips with different power consumptions.

[0018] Figure 3 It is a schematic diagram of the air flow direction driven by the air flow generating component, where the air duct enclosure cover of the heat pipe radiator device applied to high-power chip testing of this application connects to the surrounding fin group and the air flow generating component, enclosing the total air inlet, the total air outlet, and the air duct connecting the total air inlet and the total air outlet.

[0019] Figure 4 It is a heat distribution diagram when the heat pipe radiator device applied to high-power chip testing of this application is working.

[0020] Figure 5 It is a schematic structural diagram when the first connecting seat plate and the second connecting seat plate of the heat pipe radiator device applied to high-power chip testing of this application are connected and closed.

[0021] Figure 6 It is a schematic structural diagram when the first connecting seat plate and the second connecting seat plate of the heat pipe radiator device applied to high-power chip testing of this application are relatively opened.

[0022] Figure 7 It is another perspective schematic structural diagram when the first connecting seat plate and the second connecting seat plate of the heat pipe radiator device applied to high-power chip testing of this application are relatively opened.

[0023] Figure 8 It is an exploded schematic diagram of the structure of the heat pipe radiator device applied to high-power chip testing of this application.

[0024] Figure 9 It is a partial component cross-sectional view of the heat pipe radiator device applied to high-power chip testing of this application.

[0025] Figure 10This is a schematic diagram of a fin structure in a fin group of a heat pipe radiator device applied to high-power chip testing in this application.

[0026] Figure 11 This is a schematic diagram of the structural decomposition of some components of a heat pipe radiator device applied to high-power chip testing in this application.

[0027] Figure 12 This is a schematic diagram of the structural decomposition of some components of a heat pipe radiator device applied to high-power chip testing in this application.

[0028] The reference numerals shown in the figure: 1. First connection seat plate; 110. Connection part; 120. Locking part; 121. Hook part; 2. Second connection seat plate; 210. Locking part; 211. Operating handle; 2111. Protruding pressing part; 212. Locking block; 2121. Clamping groove; 213. Support shaft; 220. Connection position; 230. Accommodating groove; 240. Strip hole; 250. Moving groove; 3. Heat dissipation module; 310. Fin group; 311. Folded vertical edge; 312. Through hole; 313. Ring edge; 314. Solder port; 320. Air flow generating part; 330. Heat pipe heat transfer part; 331. Bottom plate; 332. Heat pipe column; 340. Heat conducting block; 350. Air duct enclosing cover; 360. Support plate; 361. Positioning connection hole; 370. Third connection seat plate; 4. Pad; 5. Disc spring; 6. Floating buffer block; 7. Elastic buffer part; 8. Temperature sensor; 9. Heater; 10. Elastic abutting part; 11. Limit screw. Detailed implementation manners

[0029] Please refer to Figure 1 - Figure 12 In this embodiment, a heat pipe radiator device applied to high-power chip testing is provided, including: A first connection seat plate 1, and the first connection seat plate 1 is provided with a connection part 110; A second connection seat plate 2, one side of the first connection seat plate 1 is rotatably connected to the second connection seat plate 2, and at the end far from the rotation connection, the first connection seat plate 1 and the second connection seat plate 2 are respectively provided with detachably connected locking parts 120 and locking parts 210; the second connection seat plate 2 is provided with a connection position 220 for connecting to a tester; A heat dissipation module 3, the heat dissipation module 3 is connected to the connection part 110, and the heat dissipation module 3 includes a fin group 310, an air flow generating member 320, a heat pipe heat transfer member 330, a heat conduction block 340, and an air duct enclosure cover 350; the heat pipe heat transfer member 330 includes a bottom plate 331 and a plurality of heat pipe columns 332; a first end surface of the bottom plate 331 is abutted and connected to the heat conduction block 340, and a plurality of the heat pipe columns 332 are arranged on a second end surface of the bottom plate 331; a plurality of the heat pipe columns 332 penetrate through the fin group 310, and the air flow generating member 320 is arranged on one side of the fin group 310; the air duct enclosure cover 350 is connected to enclose the fin group 310 and the air flow generating member 320, enclosing a total air inlet, a total air outlet, and an air duct connecting the total air inlet and the total air outlet.

[0030] The material of the heat conduction block 340 is preferably copper with good heat conduction performance.

[0031] The heat pipe heat transfer member 330 is manufactured by a 3DVC capillary tube heat dissipation process. The bottom plate 331 integrates one ends of a plurality of heat pipe columns 332 together and is abutted and connected to the heat conduction block 340. During operation, the other end surface of the heat conduction block 340 abuts against the chip to be measured. The heat generated when the chip works is transmitted to each heat dissipation fin in the fin group 310 through the heat conduction block 340, the bottom plate 331, and a plurality of heat pipe columns 332.

[0032] Due to the arrangement of the air duct enclosure cover 350, the air flow generated by the air flow generating member 320 located at the total air inlet or the total air outlet of the fin group 310 can only enter the air duct from the total air inlet and then flow out from the total air outlet, having a clear directionality, which can effectively prevent the heat air flow from escaping from around the fin group 310 and the hot air from re-entering the fin group 310 through the air flow generating member 320, resulting in poor heat dissipation and cooling effect.

[0033] Compared with the prior art, such as a chip high-temperature aging test socket with independently controllable temperature disclosed in the patent document with the patent application number CN201920152609.9, in which heat dissipation fans are stacked and distributed in the vertical direction, the heat pipe type radiator device provided in the present application has stronger cooling ability, smaller size, and at the same time avoids the vertical action of the air flow force on the chip to be measured, causing contact jitter and affecting the actual measurement effect.

[0034] The first connection seat plate 1 and the second connection seat plate 2 are generally structures with through grooves dug out in the center, which avoid the position of the heat conduction block 340, facilitating the heat conduction block 340 to abut against the chip to be measured when the first connection seat plate 1 and the second connection seat plate 2 are rotated and closed. In some embodiments, the connection position 220 is a screw hole and screw group arranged at the edge of the second connection seat plate 2.

[0035] The power consumption of chips in commercial desktop computers is generally about 60-110W, and that of laptops is about dozens of watts. For the so-called high-power chips, when such a single chip or integrated circuit is being tested or working, the power consumption can be as high as about 1000W.

[0036] Please refer to Figure 1 , in which the shell temperature Tc of this radiator device is 125°C, the air volume provided by the air flow driving part 320 is 49.4 CFM, and the ambient wind speed is 5M / S. When cooling down chips with full-load working powers of 800, 700, 600, 500, 400, and 300W respectively, it can control the temperature at the contact part between the chip and the heat conduction block 340 at 101, 94, 86, 78, 70, and 63°C.

[0037] Please refer to Figure 9 and Figure 11 , which includes a support plate 360 arranged between the fin group 310 and the bottom plate 331. The support plate 360 is provided with positioning connection holes 361 corresponding to a plurality of the heat pipe columns 332, and the air duct enclosing cover 350 is connected to the side of the support plate 360 through screws.

[0038] Please refer to Figure 7 and Figure 9 、 Figure 11 , the heat dissipation module 3 includes a third connecting seat plate 370. The third connecting seat plate 370 is arranged on the first end face side of the bottom plate 331 and is connected to the support plate 360 by passing screw groups through the third connecting seat plate 370 and the bottom plate 331; the connecting part 110 is a bolt connection hole arranged on the side wall of the first connecting seat plate 1, and the third connecting seat plate 370 is provided with a threaded hole corresponding to the bolt connection hole, and the bolt connection hole and the threaded hole are connected by bolts to fasten their connection.

[0039] Since the heat pipe heat transfer part 330 is generally made of copper material with good heat conduction performance, its internal structure is hollow, and the overall texture is relatively soft, and it cannot be repeatedly and strongly connected by screw groups. Therefore, it is fixed in the form of clamping the heat pipe heat transfer part 330 by setting the support plate 360 and the third connecting seat plate 370. The bottom plate 331 only needs to be provided with through holes, the threaded holes are specifically set on the support plate 360, and the nut part of the bolt abuts against the third connecting seat plate 370, ensuring that the heat pipe heat transfer part 330 will not be deformed or damaged due to excessive force extrusion.

[0040] The positioning connection hole 361 specifically sleeved on the root part of the heat pipe column 332 can provide support and positioning for the heat pipe column 332 and enhance its structural strength.

[0041] Please refer to Figure 11 , an elastic buffer 7 is arranged between the bottom plate 331 and the support plate 360.

[0042] Through the elastic buffer 7, when connecting and fixing the heat pipe heat transfer member 330 to the support plate 360 by passing through the third connecting seat plate 370 and the bottom plate 331 with a screw group, it is possible to avoid rigid extrusion damage to the end face of the bottom plate 331 facing the support plate 360.

[0043] Please refer to Figure 9 and Figure 11 , a cushion plate 4 and a disc spring 5 are provided between the bottom plate 331 and the third connecting seat plate 370.

[0044] Through the cushion plate 4 and the disc spring 5, when connecting and fixing the heat pipe heat transfer member 330 to the support plate 360 by passing through the third connecting seat plate 370 and the bottom plate 331 with a screw group, it is possible to avoid rigid extrusion damage to the end face of the bottom plate 331 facing the third connecting seat plate 370.

[0045] In this way, the height position of the heat conduction block 340 in abutting connection with the bottom plate 331 can be adjusted, better avoiding excessive extrusion of the chip under test or insufficient contact sufficiency with the chip. Please refer to Figure 7 and Figure 12 , including a floating buffer block 6 and an elastic buffer 7; a receiving groove 230 is provided on the end face of the second connecting seat plate 2 relative to the first connecting seat plate 1; the floating buffer block 6 is connected to the receiving groove 230 by a limit screw 11, and the elastic buffer 7 is provided between the floating buffer block 6 and the bottom wall of the receiving groove 230.

[0046] The floating buffer block 6 and the elastic buffer 7 are specifically located on the edge of the through groove in which the second connecting seat plate 2 avoids the heat conduction block 340, and are arranged corresponding to the end face of the third connecting seat plate 370, so that when the first connecting seat plate 1 and the second connecting seat plate 2 are rotationally closed, buffering is obtained, avoiding the rigid force of the heat conduction block 340 pressing on the relatively brittle chip and causing chip fragmentation. This design is well - considered.

[0047] In some embodiments, the elastic buffer 7 is a cylindrical spring.

[0048] In addition, when the chip test is completed and the first connecting seat plate 1 and the second connecting seat plate 2 need to be opened relatively, the floating buffer block 6 provides a certain holding force to the third connecting seat plate 370, facilitating opening and preventing the heat conduction block 340 from pressing against the chip under test to exhaust air and form a vacuum state, which is not convenient for opening.

[0049] Please refer to Figure 6 and Figure 11 , the air flow generating member 320 is two fans arranged side by side; a temperature sensor 8 and a heater 9 are provided in the heat conduction block 340.

[0050] Selecting two fans arranged side by side can save more costs compared with using a single large fan with a higher total power, and can also better match the layout of the total air inlet and total air outlet port areas.

[0051] The heater 9 can actively generate heat, quickly reach the required test environment, and improve the test efficiency.

[0052] Please refer to Figure 9 and Figure 11 、 Figure 12 As shown in FIGS.

[0053] The convex pressing portion 2111 forms a cam structure on the operating handle 211. When the operating handle 211 rotates to the angle where the convex pressing portion 2111 presses the support shaft 213, the pressing and fixing of the support shaft 213 is completed, preventing the support shaft 213 from moving along the strip-shaped hole 240. In this way, the hook portion 121 can stably engage with the locking slot 2121.

[0054] When it is necessary to relatively open the first connecting seat plate 1 and the second connecting seat plate 2, rotate the operating handle 211 to cancel the pressing of the support shaft 213 by the convex pressing portion 2111. The locking block 212 and the support shaft 213 can move together within the length range of the strip-shaped hole 240, and the hook portion 121 no longer tightly engages with the locking slot 2121. The locking member 120 can be flipped, and then the first connecting seat plate 1 and the second connecting seat plate 2 can be relatively opened.

[0055] Preferably, E-shaped fasteners are provided at both ends of the support shaft 213 to prevent the support shaft 213 from axially moving out of the strip-shaped hole 240.

[0056] Please refer to Figure 9 and Figure 12 As shown in FIGS.

[0057] Through the elastic abutting member 10, when the first connecting seat plate 1 and the second connecting seat plate 2 are in a relatively open state, the elastic abutting member 10 abuts against the locking block 212, so that the locking block 212 and the support shaft 213 are kept moving in the opposite direction of being pressed by the convex pressing portion 2111.

[0058] When the first connecting seat plate 1 and the second connecting seat plate 2 are in a relatively closed state, the elastic abutting member 10 abuts against the locking member 120, and keeps the hook portion 121 tightly buckled in the clamping groove 2121.

[0059] The elastic abutting member 10 can be a cylindrical spring.

[0060] Preferably, a torsion spring is provided at the rotational connection of the first connecting seat plate 1 and the second connecting seat plate 2 to keep the first connecting seat plate 1 tending to be in an open state relative to the second connecting seat plate 2.

[0061] Please refer to Figure 9 and Figure 10 , in the fin group 310, each fin has folding vertical edges 311 provided at both edges, and the folding vertical edges 311 abut against the bottom wall of the fin at the upper end; this can ensure that there is no air leakage in the air path and improve the heat dissipation effect.

[0062] The height of the bottom wall of two adjacent fins is the height of the folding vertical edge 311.

[0063] The fin is provided with a through hole 312 for the heat pipe column 332 to pass through, and a ring edge 313 extending towards the top end of the heat pipe column 332 is provided at the edge of the through hole 312; a solder port 314 is opened beside the through hole 312.

[0064] Preferably, the ring edge 313 and the fin body are in an arc transition connection, which can prevent the heat pipe column 332 from being scratched when passing through the through hole 312. The solder port 314 is used for placing solder after the position of the heat pipe column 332 passing through the through hole 312 is determined, and then the heat pipe column 332 and the fin are welded into a whole.

[0065] In summary, in the heat pipe type radiator device applied to high-power chip testing provided by the present application, multi-stage buffers are provided between key components to prevent damage to the heat pipe heat transfer member 330 and effectively prevent damage to the chip, and the chip can be repeatedly replaced and stably tested for a long life.

Claims

1. A heat pipe type radiator device applied to the testing of high-power chips, characterized in that, Comprising: A first connecting seat plate, the first connecting seat plate being provided with a connecting portion; A second connecting seat plate, the first connecting seat plate being rotatably connected to one side of the second connecting seat plate. At one end away from the rotational connection, the first connecting seat plate and the second connecting seat plate are respectively provided with a detachable locking member and a locking component; the second connecting seat plate is provided with a connection position for connecting to a tester; A heat dissipation module, the heat dissipation module being connected to the connecting portion. The heat dissipation module includes a fin group, an air flow generating member, a heat pipe heat transfer member, a heat conducting block, and an air duct enclosure cover; the heat pipe heat transfer member includes a bottom plate and a plurality of heat pipe columns; a first end face of the bottom plate is in abutting connection with the heat conducting block, and the plurality of heat pipe columns are arranged on a second end face of the bottom plate; the plurality of heat pipe columns penetrate through the fin group, and the air flow generating member is arranged on one side of the fin group; the air duct enclosure cover is connected and encloses the fin group and the air flow generating member, enclosing a total air inlet, a total air outlet, and an air duct connecting the total air inlet and the total air outlet.

2. The heat pipe type radiator device applied to high-power chip testing according to claim 1, characterized in that, Comprising a support plate provided between the fin group and the bottom plate, the support plate being provided with positioning connection holes corresponding to the plurality of heat pipe columns, and the air duct enclosure cover being connected to a side of the support plate by screws.

3. The heat pipe type radiator device applied to the high-power chip test according to claim 2, characterized in that, The heat dissipation module includes a third connecting seat plate, the third connecting seat plate being arranged on a side of the first end face of the bottom plate, and being connected to the support plate by a screw group passing through the third connecting seat plate and the bottom plate; the connecting portion is a bolt connection hole provided on a side wall of the first connecting seat plate, and the third connecting seat plate is provided with a threaded hole corresponding to the bolt connection hole, and the bolt connection hole and the threaded hole are connected by a bolt to fasten their connection.

4. The heat pipe type radiator device applied to the high-power chip test according to claim 2, wherein An elastic buffer member is provided between the bottom plate and the support plate.

5. The heat pipe type radiator device applied to high-power chip testing according to claim 3, wherein A cushion plate and a disc spring are provided between the bottom plate and the third connecting seat plate.

6. The heat pipe type radiator device applied to high-power chip testing according to claim 1, wherein, Comprising a floating buffer block and an elastic buffer member; an accommodating groove is provided on an end face of the second connecting seat plate opposite to the first connecting seat plate; the floating buffer block is connected to the accommodating groove by a limit screw, and the elastic buffer member is arranged between the floating buffer block and the bottom wall of the accommodating groove.

7. The heat pipe type radiator device applied to the high-power chip test according to claim 1, characterized in that, The air flow generating member is two fans arranged side by side; a temperature sensor and a heater are provided in the heat conducting block.

8. The heat pipe type radiator device applied to the high-power chip test according to claim 1, characterized in that, The locking member is rotatably connected to the first connecting seat plate, and the locking member is provided with a hook portion; the locking component includes an operating handle, a locking block, and a support shaft; the operating handle is rotatably connected to the second connecting seat plate, and a protruding pressing portion is provided at the rotational connection of the operating handle; the second connecting seat plate is provided with a strip-shaped hole, and the support shaft passes through the strip-shaped hole and the locking block; the locking block is provided with a clamping groove corresponding to and cooperating with the hook portion; when the operating handle rotates to a predetermined angle, the protruding pressing portion presses the support shaft.

9. The heat pipe type radiator device applied to the high-power chip test according to claim 8, characterized in that, The second connecting seat plate is provided with a movable groove, and the locking block is located in the movable groove; an elastic abutting member is provided between the locking block and the bottom wall of the movable groove; an elastic abutting member is provided between a side of the locking member away from its hook portion and the first connecting seat plate.

10. The heat pipe type radiator device applied to high-power chip testing according to claim 1, characterized in that, In the fin group, each fin has folded edges at both edges, and the folded edges abut and connect to the bottom wall of the fin at the upper end; the fin is provided with a through hole for the heat pipe column to pass through, and a ring edge extending towards the top end of the heat pipe column is provided at the edge of the through hole; a solder port is formed beside the through hole.

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