Liquid-cooled fin-type heat dissipation structure for processor and manufacturing method

Abstract

The present invention relates to the field of liquid cooling and heat dissipation technology, particularly a liquid cooling fin-type heat dissipation structure for a processor and its manufacturing method. The structure comprises a composite fin unit, a nanoporous thermal interface layer, and a dual-phase cooling channel. The composite fin unit is composed of a plurality of heat dissipation fins, each made of a copper-based dual-gradient nanostructure composite material reinforced with silicon carbide particles; the nanoporous thermal interface layer is disposed on the outer surface of the heat dissipation fins; and the dual-phase cooling channel is disposed within the heat dissipation fins. The dual-phase cooling channel comprises a main cooling channel, a micro-injection branch, and a spiral fractal channel. The present invention utilizes a dual-phase cooling channel that coordinates the main cooling channel, the micro-injection branch, and the spiral fractal channel. The main cooling channel extends along the length of the fins, ensuring that the coolant can flow evenly within the fins, thereby increasing the contact area between the coolant and the fins and improving cooling efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling and heat dissipation, and in particular to a liquid cooling fin type heat dissipation structure for a processor and a manufacturing method thereof. Background Art

[0002] Liquid cooling utilizes the coolant's excellent specific heat capacity to absorb the high heat generated by the processor. The coolant, flowing through the circulation pipes, removes heat from the processor surface, effectively lowering the processor's operating temperature and ensuring stable operation within an optimal temperature range. This maximizes processor performance and avoids frequency throttling caused by overheating.

[0003] However, in the existing heat dissipation structure, due to internal setting design reasons, the internal transmission stability is poor and the local heat source cannot be ensured to dissipate heat. Therefore, it is necessary to make new improvements to the structure of the existing heat dissipation components. Summary of the Invention

[0004] To solve the above problems, the dual-phase cooling flow channel of the present invention cooperates with each other through the main cooling channel, micro-injection branch and spiral fractal flow channel. The main cooling channel extends along the length of the fin to ensure that the coolant can flow evenly inside the fin; the micro-injection branch arranged in a fishbone shape can spray the coolant to various places inside the fin in a more uniform manner, thereby enhancing the contact area between the coolant and the fin and improving the cooling efficiency of the liquid-cooled fin-type heat dissipation structure and manufacturing method for the processor.

[0005] The technical solution adopted by the present invention is: a liquid-cooled fin-type heat dissipation structure for a processor, comprising a composite fin unit, a nanoporous thermal interface layer and a dual-phase cooling flow channel, wherein the composite fin unit is composed of multiple heat dissipation fins, and the heat dissipation fins are made of a copper-based dual-gradient nanostructure composite material reinforced with silicon carbide particles; the nanoporous thermal interface layer is arranged on the outer surface of the heat dissipation fin, the nanoporous thermal interface layer has a porosity of 40% to 60%, a pore size of 50 to 200 nm, and contains a graphene quantum dot enhanced phase; the dual-phase cooling flow channel is arranged inside the heat dissipation fin, and the dual-phase cooling flow channel includes a main cooling channel, a micro-injection branch and a spiral fractal flow channel, the main cooling channel extends along the length direction of the heat dissipation fin, and the micro-injection branch is provided in plurality, and the plurality of micro-injection branches are arranged in a fishbone shape on both sides of the main cooling channel; the spiral fractal flow channel is arranged on the periphery of the main cooling channel, and the main cooling channel is provided with an inlet and an outlet, and the plurality of heat dissipation fins are connected through the inlet and the outlet.

[0006] A further improvement to the above scheme is that the hydraulic diameter size of the main cooling channel is 1.5~3.0mm; the diameter size of the micro-injection branch is 0.1~0.5mm; the diameter size of the spiral fractal flow channel is 0.3~1.2mm, and the spiral rise angle is 25°~45°.

[0007] A further improvement to the above solution is that the fractal dimension of the spiral fractal flow channel is 1.5-1.8, and the spacing ratio between adjacent flow channels satisfies:

[0008]

[0009] in, is the nth level flow channel spacing.

[0010] A further improvement to the above scheme is that the silicon carbide particle reinforced copper-based double-gradient nanostructured composite material includes a base layer, an intermediate layer and a functional layer arranged in sequence, the thickness of the base layer is 0.5~1.0mm; the thickness of the intermediate layer is 0.3~0.8mm; the thickness of the functional layer is 50~200μm.

[0011] A further improvement to the above scheme is that the base layer is prepared by adding 3wt% titanium to a copper matrix; the intermediate layer is a copper-based silicon carbide composite material, and the volume fraction of silicon carbide is 15%~30%; the functional layer is nanocrystalline silicon carbide, and the nanocrystalline grain size is 20~50nm.

[0012] A further improvement to the above scheme is that the injection angle of the micro-injection branch is 30°~60°, and a turbulence generator is provided at the outlet of the micro-injection branch. The turbulence generator includes a hemispherical pit array and a nanowire fence structure, and the hemispherical pit array and the nanowire fence structure are alternately arranged.

[0013] A further improvement to the above solution is that the preparation of the nanoporous thermal interface layer includes:

[0014] The copper substrate is anodic oxidized to form a CuO nanotube template;

[0015] Chemical vapor deposition siliconization to generate SiC nanowire network;

[0016] Electrochemical deposition of graphene quantum dots with a deposition current density of 2~5mA / cm².

[0017] A further improvement to the above scheme is that it also includes a laser-induced hydrophilic modification area, in which a femtosecond laser is used to process a micron-scale groove array on the surface of the heat sink fin, wherein the groove depth of the micron-scale groove array is 50~200μm and the width-to-depth ratio is 1:1 to 1:3.

[0018] A method for manufacturing a liquid-cooled fin-type heat dissipation structure, comprising the liquid-cooled fin-type heat dissipation structure for a processor;

[0019] The method comprises the following steps:

[0020] Step S1, gradient fin forming: using electron beam melting technology to deposit silicon carbide particles reinforced copper-based double gradient nanostructured composite materials layer by layer, with an electron beam current of 10-15 mA, a scanning speed of 2000-3000 mm / s, and a layer thickness of 40-60 μm;

[0021] Step S2, inner flow channel processing: a spiral fractal flow channel is manufactured by two-photon polymerization 3D printing, with a laser wavelength of 780 nm, a pulse energy of 3-5 nJ, and a resolution of ±2 μm;

[0022] Step S3, surface modification: Plasma electrolytic oxidation is performed on the outer surface of the heat sink fins at a voltage of 300-500 V, with the electrolyte containing 10 g / L, 5 g / L of Na2SiO3 and silicon carbide nanoparticles, to form a nanoporous thermal interface layer with a thickness of 20-50 μm;

[0023] The inner wall of the spiral fractal flow channel is covered with Al2O3 / TiO2 superlattice coating by atomic layer deposition. The single layer thickness is 0.5~1.5nm, the total number of layers is 50~100, and the interface thermal resistance is ≤5×10⁻ 9 m²·K / W.

[0024] The beneficial effects of the present invention are:

[0025] Compared with existing heat dissipation structures, the present invention uses heat dissipation fins made of silicon carbide particles reinforced copper-based double-gradient nanostructured composite materials, which have excellent thermal conductivity and mechanical properties. High thermal conductivity can quickly conduct the heat generated by the processor, effectively reducing the surface temperature of the processor, ensuring its operation in a stable temperature environment, and improving work efficiency and reliability; good mechanical properties ensure that the fins are not easily damaged during long-term use, extending the service life of the heat dissipation structure. The nanoporous thermal interface layer has a porosity of 40% to 60%, a pore diameter of 50 to 200nm, and contains a graphene quantum dot enhanced phase, which greatly increases the effective heat dissipation area of ​​the heat dissipation fins and can more efficiently exchange heat with the surrounding medium. At the same time, the graphene quantum dot enhanced phase further enhances the thermal conductivity of the thermal interface layer, allowing heat to be transferred more smoothly from the fins to the surrounding environment, enhancing the overall heat dissipation effect. The two-phase cooling flow channel cooperates with each other through the main cooling channel, micro-injection branch and spiral fractal flow channel. The main cooling channel extends along the length of the fin to ensure that the coolant can flow evenly inside the fin; the micro-injection branch arranged in a fishbone shape can spray the coolant to various places inside the fin in a more uniform manner, enhancing the contact area between the coolant and the fin and improving the cooling efficiency; the spiral fractal flow channel further extends the flow path of the coolant in the fin, fully utilizing the cooling capacity of the coolant, effectively taking away heat, and significantly improving the heat dissipation performance of the entire heat dissipation structure.

[0026] This method for manufacturing a liquid-cooled fin-type heat sink utilizes electron beam melting technology to deposit silicon carbide particles to reinforce a copper-based dual-gradient nanostructured composite material during the gradient fin formation process. Precisely controlling the electron beam current, scanning speed, and layer thickness results in gradient fins with excellent thermal conductivity and mechanical properties, effectively conducting heat generated by the processor to meet high-power cooling requirements. The internal flow channel is fabricated using two-photon polymerization 3D printing to create a spiral fractal flow channel, which is then coated with an Al2O3 / TiO2 superlattice coating. This unique flow channel structure effectively improves coolant flow uniformity and turbulence, enhancing convective heat transfer. The superlattice coating's extremely low interfacial thermal resistance further reduces thermal resistance during heat transfer, significantly improving heat dissipation efficiency. Surface modification involves plasma electrolytic oxidation to create a nanoporous thermal interface layer, which significantly increases surface roughness, improves the surface heat dissipation coefficient, and optimizes heat transfer between the heat sink fins and the surrounding environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of a liquid-cooled fin-type heat dissipation structure for a processor according to the present invention;

[0028] Figure 2 for Figure 1 Schematic diagram of the internal structure of the liquid cooling fin type heat dissipation structure for the processor;

[0029] Figure 3 for Figure 1 A schematic cross-sectional view of a liquid cooling fin heat dissipation structure for a processor;

[0030] Figure 4 for Figure 1 A schematic cross-sectional view of a liquid cooling fin heat dissipation structure for a processor;

[0031] Figure 5 Schematic diagram of the structure of the silicon carbide particle reinforced copper-based double-gradient nanostructured composite material of the present invention;

[0032] Figure 6 Schematic diagram of the structure of the turbulence generator of the present invention;

[0033] Figure 7 It is a schematic flow chart of the manufacturing method of the liquid-cooled fin-type heat dissipation structure of the present invention.

[0034] Explanation of the accompanying drawings: composite fin unit 1, heat dissipation fin 11, base layer 111, intermediate layer 112, functional layer 113, micron-scale groove 12, nanoporous thermal interface layer 2, two-phase cooling channel 3, main cooling channel 31, inlet 311, outlet 312, micro-injection branch 32, hemispherical pit array 321, nanowire fence structure 322, spiral fractal channel 33. DETAILED DESCRIPTION

[0035] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0036] It should be noted that when an element is referred to as being “fixed to” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0038] like Figures 1 to 7As shown, in one embodiment of the present invention, a liquid-cooled fin-type heat dissipation structure for a processor is provided, comprising a composite fin unit 1, a nanoporous thermal interface layer 2 and a dual-phase cooling flow channel 3, wherein the composite fin unit 1 is composed of a plurality of heat dissipation fins 11, and the heat dissipation fins 11 are made of a silicon carbide particle reinforced copper-based dual-gradient nanostructure composite material; the nanoporous thermal interface layer 2 is arranged on the outer surface of the heat dissipation fin 11, and the porosity of the nanoporous thermal interface layer 2 is 40% to 60%, the pore size is 50 to 200 nm, and it contains a graphene quantum dot enhanced phase; the dual-phase cooling flow channel The channel 3 is arranged inside the heat sink 11. The dual-phase cooling channel 3 includes a main cooling channel 31, a micro-injection branch 32, and a spiral fractal channel 33. The main cooling channel 31 extends along the length of the heat sink 11. There are multiple micro-injection branches 32, and the multiple micro-injection branches 32 are arranged in a fishbone shape on both sides of the main cooling channel 31; the spiral fractal channel 33 is arranged on the periphery of the main cooling channel 31. The main cooling channel 31 is provided with an inlet 311 and an outlet 312. The multiple heat sink fins 11 are connected through the inlet 311 and the outlet 312. This embodiment uses a heat sink 11 made of a copper-based double-gradient nanostructured composite material reinforced with silicon carbide particles, which has excellent thermal conductivity and mechanical properties. High thermal conductivity can quickly conduct the heat generated by the processor, effectively reducing the surface temperature of the processor, ensuring its operation in a stable temperature environment, and improving work efficiency and reliability; good mechanical properties ensure that the fins are not easily damaged during long-term use, thereby extending the service life of the heat dissipation structure. The nanoporous thermal interface layer 2 has a porosity of 40% to 60%, a pore size of 50 to 200 nm, and contains a graphene quantum dot-enhanced phase, which greatly increases the effective heat dissipation area of ​​the heat sink 11, enabling more efficient heat exchange with the surrounding medium. At the same time, the graphene quantum dot-enhanced phase further enhances the thermal conductivity of the thermal interface layer, allowing heat to be transferred more smoothly from the fins to the surrounding environment, enhancing the overall heat dissipation effect. The dual-phase cooling channel 3 cooperates through the main cooling channel 31, micro-injection branch 32, and spiral fractal flow channel 33. The main cooling channel 31 extends along the length of the fin to ensure that the coolant can flow evenly within the fin. The fishbone-shaped micro-injection branch 32 can spray the coolant more evenly throughout the fin, increasing the contact area between the coolant and the fin and improving cooling efficiency. The spiral fractal flow channel 33 further extends the coolant flow path within the fin, fully utilizing the cooling capacity of the coolant, effectively removing heat, and significantly improving the heat dissipation performance of the entire heat dissipation structure.

[0039] The hydraulic diameter of the main cooling channel 31 is 1.5 to 3.0 mm; the diameter of the micro-injection branch 32 is 0.1 to 0.5 mm; the diameter of the spiral fractal flow channel 33 is 0.3 to 1.2 mm, and the helix angle is 25° to 45°. In this embodiment, the hydraulic diameter of the main cooling channel 31 is designed to be 1.5 to 3.0 mm. This specification ensures that the coolant has appropriate flow space, avoiding excessive flow resistance due to a narrow channel, which affects the coolant circulation efficiency, and preventing insufficient coolant flow rate due to an overly wide channel, which reduces the heat dissipation effect. The diameter of the micro-injection branch 32 is 0.1 to 0.5 mm, which can achieve fine spraying of the coolant, allowing the coolant to contact the fins more evenly and enhancing the heat exchange efficiency between the coolant and the fins. The spiral fractal flow channel 33 has a diameter of 0.3~1.2mm and a spiral angle of 25°~45°, which can effectively extend the flow path of the coolant in the flow channel and increase the contact time between the coolant and the fins. At the same time, the spiral flow mode can destroy the boundary layer and improve the convective heat transfer coefficient.

[0040] The fractal dimension of the spiral fractal flow channel 33 is 1.5-1.8, and the spacing ratio between adjacent flow channels satisfies:

[0041] in, is the spacing between the nth-level flow channels. In this embodiment, the fractal dimension range creates a complex and orderly flow pattern within the flow channels, increasing the contact area between the coolant and the fins, enhancing convective heat transfer, and significantly improving heat dissipation efficiency. A reasonable spacing ratio between adjacent flow channels ensures even distribution of coolant across all levels of the flow channels, avoiding localized excess or loss of flow, effectively preventing hot spots, and ensuring temperature uniformity across all parts of the processor.

[0042] See Figure 5As shown, the silicon carbide particle reinforced copper-based dual-gradient nanostructured composite material includes a base layer 111, an intermediate layer 112, and a functional layer 113 arranged in sequence. The base layer 111 has a thickness of 0.5 to 1.0 mm; the intermediate layer 112 has a thickness of 0.3 to 0.8 mm; and the functional layer 113 has a thickness of 50 to 200 μm. In this embodiment, the base layer 111 has a thickness of 0.5 to 1.0 mm, providing a solid support foundation for the entire heat dissipation structure, ensuring structural stability and effectively withstanding the heat and mechanical stress generated by the processor during operation. The intermediate layer 112 has a thickness of 0.3 to 0.8 mm, which plays a key role in transitioning and optimizing the heat dissipation path, enhancing the uniformity of heat conduction within the composite material, reducing thermal resistance, and allowing heat to be more efficiently transferred from the functional layer 113 to the base layer 111. The 50~200μm functional layer 113 is in direct contact with the coolant or heat dissipation medium. With its special nanostructure and the strengthening effect of silicon carbide particles, it greatly improves the surface heat dissipation efficiency, accelerates heat dissipation, and reduces the operating temperature of the processor.

[0043] The base layer 111 is made of copper with 3wt% titanium added to the base. The intermediate layer 112 is a copper-based silicon carbide composite material with a volume fraction of 15% to 30% silicon carbide. The functional layer 113 is nanocrystalline silicon carbide with a nanocrystalline grain size of 20 to 50nm. In this embodiment, the base layer 111 is made of copper with a volume fraction of 3wt% titanium added. Copper's excellent electrical and thermal conductivity lays the foundation for heat dissipation. The addition of titanium enhances the strength and corrosion resistance of the base layer 111, improves the stability and durability of the overall structure, and ensures long-term stable heat dissipation. The copper-based silicon carbide composite material of the intermediate layer 112, with a volume fraction of 15% to 30% silicon carbide, imparts high hardness and a low thermal expansion coefficient, effectively improving the thermomechanical performance of the heat dissipation structure, strengthening the bonding with the base layer 111 and the functional layer 113, optimizing the heat conduction path, and reducing thermal resistance. The functional layer is made of 113 nanocrystalline silicon carbide, with a nano-grain size of 20~50nm, which greatly increases the specific surface area and improves the surface heat dissipation efficiency. With its excellent high-temperature stability and wear resistance, it can maintain efficient heat dissipation under complex working conditions.

[0044] See Figure 6As shown, the injection angle of the micro-injection branch 32 is 30°~60°, and a turbulence generator is provided at the outlet of the micro-injection branch 32. The turbulence generator includes a hemispherical pit array 321 and a nanowire fence structure 322. The hemispherical pit array 321 and the nanowire fence structure 322 are alternately arranged. In this embodiment, the angle range enables the coolant to impact the fin surface with a suitable trajectory, which not only ensures that the coolant covers a sufficient heat dissipation area, but also generates sufficient impact force, effectively breaking the boundary layer thermal resistance between the coolant and the fin surface, and enhancing the convective heat transfer efficiency. The turbulence generator provided at the outlet plays a significant role. The hemispherical pit array 321 and the nanowire fence structure 322 are alternately arranged. The hemispherical pits can cause the coolant to form a complex vortex flow, increase the disturbance inside the coolant, and improve the degree of fluid mixing. The nanowire fence structure 322 further refines the flow field, strengthens the microscopic turbulence effect of the coolant, and allows the coolant to fully contact the fin surface on a microscopic scale, greatly improving the heat transfer coefficient between the coolant and the fin.

[0045] The preparation of the nanoporous thermal interface layer 2 involves: anodizing a copper substrate to form a CuO nanotube template; siliconizing a SiC nanowire network via chemical vapor deposition; and electrochemically depositing graphene quantum dots at a deposition current density of 2-5 mA / cm². In this embodiment, the CuO nanotube template formed by anodizing the copper substrate significantly increases the specific surface area of ​​the heat dissipation structure, providing more heat exchange sites and effectively improving heat transfer efficiency. Furthermore, the SiC nanowire network generated by chemical vapor deposition siliconization exhibits excellent thermal conductivity, acting as an efficient heat conduction channel, rapidly dissipating heat generated by the processor and reducing heat accumulation. Furthermore, the electrochemically deposited graphene quantum dots, at a deposition current density of 2-5 mA / cm², not only further improve the thermal resistance of the thermal interface but also enhance the liquid affinity of the heat dissipation structure surface, allowing for better spread and flow of the coolant and optimizing the contact between the coolant and the fins, thereby comprehensively improving the heat dissipation performance of the liquid-cooled fin-type heat dissipation structure.

[0046] The heat sink also includes a laser-induced hydrophilic modification zone, in which a femtosecond laser is used to machine a 12-micron-scale groove array on the surface of the heat sink fin. The groove depth of the 12-micron-scale groove array is 50-200μm, and the aspect ratio is 1:1 to 1:3. In this embodiment, the 12-micron-scale groove array increases the roughness and specific surface area of ​​the fin surface. The design of a groove depth of 50-200μm and an aspect ratio of 1:1 to 1:3 reduces the contact angle of the coolant on the fin surface, enhances the wettability of the coolant on the fin surface, and allows the coolant to spread more evenly on the fin surface, effectively improving the heat exchange conditions between the coolant and the fin. Laser-induced hydrophilic modification further optimizes heat dissipation performance. These structures formed by femtosecond laser processing promote the formation of a thinner and more uniform liquid film during the coolant flow process, reducing thermal resistance and improving heat dissipation efficiency. This allows the heat generated by the processor to be transferred more quickly and effectively, ensuring that the processor operates in a stable temperature environment.

[0047] In the above embodiment, the test was performed under the following conditions:

[0048] Thermal resistance calculation:

[0049] Pressure drop measurement: using differential pressure sensor (range 0-100kPa, accuracy ±0.5%);

[0050] Temperature uniformity: collected by infrared thermal imager (FLIR A65, spatial resolution 0.05°C);

[0051] The basic performance verification obtained the following data:

[0052]

[0053] The high flow rate test yielded the following data:

[0054]

[0055] The extreme heat dissipation capacity test yielded the following data:

[0056]

[0057] (Note: The above data is based on actual measurements of the NVIDIA A100 GPU module, with an ambient temperature of 25±1°C and a humidity of 50±5%)

[0058] See Figures 1 to 7As shown, a method for manufacturing a liquid-cooled fin-type heat dissipation structure includes the liquid-cooled fin-type heat dissipation structure for a processor; the method includes the following steps: step S1, gradient fin forming: using electron beam melting technology to stack silicon carbide particles layer by layer to reinforce copper-based double-gradient nanostructured composite materials, the electron beam current is 10-15mA, the scanning speed is 2000-3000mm / s, and the layer thickness is 40-60μm; step S2, inner flow channel processing: using two-photon polymerization 3D printing to manufacture spiral fractal flow channels 33, the laser wavelength is 780nm, and the pulse The impulse energy is 3-5 nJ and the resolution is ±2 μm. Step S3, surface modification: the outer surface of the heat sink fin 11 is subjected to plasma electrolytic oxidation at a voltage of 300-500 V. The electrolyte contains 10 g / L, 5 g / L of Na2SiO3 and silicon carbide nanoparticles to generate a nanoporous thermal interface layer 2 with a thickness of 20-50 μm. The inner wall of the spiral fractal flow channel 33 is coated with an Al2O3 / TiO2 superlattice coating by atomic layer deposition. The single layer thickness is 0.5-1.5 nm, the total number of layers is 50-100, and the interface thermal resistance is ≤ 5 × 10⁻. 9 m²·K / W. During the gradient fin forming process, this embodiment utilizes electron beam melting technology to deposit silicon carbide particles to reinforce a copper-based dual-gradient nanostructured composite material. By precisely controlling the electron beam current, scanning speed, and layer thickness, gradient fins with excellent thermal conductivity and mechanical properties can be produced. These fins can efficiently conduct heat generated by the processor and meet high-power heat dissipation requirements. The internal flow channel is processed using two-photon polymerization 3D printing to create a spiral fractal flow channel 33, and its inner wall is coated with an Al2O3 / TiO2 superlattice coating. This unique flow channel structure effectively improves the flow uniformity and turbulence of the coolant, enhancing convective heat transfer. The superlattice coating's extremely low interfacial thermal resistance further reduces the thermal resistance during heat transfer, significantly improving heat dissipation efficiency. Surface modification involves plasma electrolytic oxidation to form a nanoporous thermal interface layer 2, which significantly increases surface roughness, improves the surface heat dissipation coefficient, and optimizes the heat exchange capacity between the heat sink fin 11 and the surrounding environment.

[0059] The above embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A liquid cooling fin type heat dissipation structure for a processor, characterized by: include A composite fin unit, wherein the composite fin unit is composed of a plurality of heat dissipation fins, and the heat dissipation fins are made of a silicon carbide particle reinforced copper-based double-gradient nanostructured composite material; A nanoporous thermal interface layer, the nanoporous thermal interface layer being disposed on the outer surface of the heat sink fin, the nanoporous thermal interface layer having a porosity of 40% to 60%, a pore diameter of 50 to 200 nm, and containing a graphene quantum dot enhanced phase; and A two-phase cooling channel is arranged inside the heat sink fins. The two-phase cooling channel includes a main cooling channel, a micro-injection branch and a spiral fractal channel. The main cooling channel extends along the length of the heat sink fins. There are multiple micro-injection branches, and the multiple micro-injection branches are arranged in a fishbone shape on both sides of the main cooling channel; the spiral fractal channel is arranged on the periphery of the main cooling channel. The main cooling channel is provided with an access port and an access port, and multiple heat sink fins are connected through the access port and the access port.

2. The liquid-cooled fin-type heat dissipation structure for a processor according to claim 1, characterized in that: The hydraulic diameter of the main cooling channel is 1.5-3.0 mm; the diameter of the micro-injection branch is 0.1-0.5 mm; the diameter of the spiral fractal flow channel is 0.3-1.2 mm, and the spiral rise angle is 25°-45°.

3. The liquid-cooled fin-type heat dissipation structure for a processor according to claim 1, characterized in that: The fractal dimension of the spiral fractal flow channel is 1.5-1.8, and the spacing ratio between adjacent flow channels satisfies: in, is the nth level flow channel spacing.

4. The liquid-cooled fin-type heat dissipation structure for a processor according to claim 1, characterized in that: The silicon carbide particle reinforced copper-based double-gradient nanostructured composite material includes a base layer, an intermediate layer and a functional layer arranged in sequence, wherein the base layer has a thickness of 0.5-1.0 mm; the intermediate layer has a thickness of 0.3-0.8 mm; and the functional layer has a thickness of 50-200 μm.

5. The liquid cooling fin type heat dissipation structure for a processor according to claim 4, characterized in that: The base layer is prepared by adding 3 wt % of titanium to copper as a matrix.

6. The liquid cooling fin type heat dissipation structure for a processor according to claim 5, characterized in that: The intermediate layer is a copper-based silicon carbide composite material, and the volume fraction of the silicon carbide is 15% to 30%; The functional layer is nanocrystalline silicon carbide, and the nanocrystalline grain size is 20-50nm.

7. The liquid-cooled fin-type heat dissipation structure for a processor according to claim 1, characterized in that: The injection angle of the micro-injection branch is 30°~60°. A turbulence generator is provided at the outlet of the micro-injection branch. The turbulence generator includes a hemispherical pit array and a nanowire fence structure. The hemispherical pit array and the nanowire fence structure are alternately arranged.

8. The liquid-cooled fin-type heat dissipation structure for a processor according to claim 1, characterized in that: The preparation of the nanoporous thermal interface layer comprises: The copper substrate is anodic oxidized to form a CuO nanotube template; Chemical vapor deposition siliconization to generate SiC nanowire network; Electrochemical deposition of graphene quantum dots with a deposition current density of 2~5mA / cm².

9. The liquid cooling fin type heat dissipation structure for a processor according to claim 1, characterized in that: It also includes a laser-induced hydrophilic modification area, in which a micron-scale groove array is processed on the surface of the heat sink fin by a femtosecond laser. The groove depth of the micron-scale groove array is 50 to 200 μm, and the width-to-depth ratio is 1:1 to 1:

3.

10. A method for manufacturing a liquid-cooled fin-type heat dissipation structure, characterized in that: Used to manufacture the liquid-cooled fin-type heat dissipation structure for a processor according to any one of claims 1 to 9; The method comprises the following steps: Step S1, gradient fin forming: using electron beam melting technology to deposit silicon carbide particles reinforced copper-based double gradient nanostructured composite materials layer by layer, with an electron beam current of 10-15 mA, a scanning speed of 2000-3000 mm / s, and a layer thickness of 40-60 μm; Step S2, inner channel processing: The spiral fractal channel was manufactured by two-photon polymerization 3D printing, with a laser wavelength of 780nm, a pulse energy of 3-5nJ, and a resolution of ±2μm; the inner wall of the spiral fractal channel was coated with an Al2O3 / TiO2 superlattice coating by atomic layer deposition, with a single layer thickness of 0.5-1.5nm, a total of 50-100 layers, and an interface thermal resistance of ≤5×10⁻ 9 m²·K / W; Step S3, surface modification: Plasma electrolytic oxidation is performed on the outer surface of the heat sink fins at a voltage of 300-500 V. The electrolyte contains 10 g / L Na2SiO35 g / L and silicon carbide nanoparticles to form a nanoporous thermal interface layer with a thickness of 20-50 μm.

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