LED packaging body with built-in driving chip and manufacturing method thereof
By adopting a double-layer substrate unit structure in the LED package, the driving chip is arranged on the second surface and electrically connected to the LED chip through the mounting hole position, the problem of inability to reduce the pixel pitch is solved, and a smaller package volume and better fixity are achieved.
Patent Information
- Application Number
- CN202410088137.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-22
- Publication Date
- 2025-07-25
AI Technical Summary
In the prior art, the LED chip and the driver chip are located on the same side surface, so that the pixel spacing cannot be further reduced.
Two substrate unit structures that are electrically connected to each other are adopted. The driving chip is arranged on the second surface and is electrically connected to the LED chip through the mounting holes to avoid occupying the space on the surface where the LED chip is located, and a packaging layer is used to protect the chip.
It is achieved to further reduce the LED chip and pixel spacing, and reduce the volume of the LED package, while ensuring that the package is subsequently fixed to the target substrate.
Smart Images
Figure CN120379415A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of display technologies, and in particular to an LED package with a built-in driving chip and a manufacturing method thereof. Background Art
[0002] Figure 1 For an existing LED package with a built-in driving IC chip, the LED package includes a substrate 1a, one or more LED chips 2a, a driving IC chip 3a, and a packaging layer 4a. The LED chips 2a and the driving IC chip 3a are on the same side surface of the substrate 1a and are wrapped by the packaging layer 4a. The advantage of the LED chips 2a and the driving IC chip 3a being on the same side surface is that they can be connected by wire bonding or surface circuits. However, when the size of the LED chips 2a and the pixel pitch are further reduced, when the LED chips 2a and the driving IC chip 3a are on the same side surface, the driving IC chip 3a will occupy a certain space, resulting in the inability to further reduce the pixel pitch. Summary of the Invention
[0003] The purpose of the present invention is to provide an LED package with a built-in driving chip and a manufacturing method thereof, so as to solve the problem in the prior art that the pixel pitch cannot be further reduced because the LED chip and the driving chip are on the same side surface.
[0004] To achieve the above purpose, an LED package with a built-in driving chip provided by the present invention includes a first substrate unit, a second substrate unit, at least one LED chip, and at least one driving chip. The first substrate unit includes a first surface and a second surface opposite to the first surface. At least one first mounting position for mounting the LED chip is provided on the first surface, and at least one second mounting position for mounting the driving chip is provided on the second surface. The second substrate unit is stacked below the first substrate unit, and the second substrate unit is fixedly connected and electrically connected to the first substrate unit. The second substrate unit is provided with mounting hole positions corresponding to the second mounting positions. The second substrate unit includes a third surface and a fourth surface opposite to the third surface. The third surface faces the second surface. The driving chip is disposed at the mounting hole position and mounted on the second mounting position. The driving chip is electrically connected to the LED chip, and the surface of the driving chip facing away from the first substrate unit does not exceed the fourth surface.
[0005] Preferably, the mounting hole is a through hole to avoid the driving chip. A second encapsulation layer covering the driving chip is further provided on the second surface of the first substrate unit. The second encapsulation layer extends into the through hole and does not exceed the fourth surface. A first encapsulation layer is provided on the first surface of the first substrate unit, and the first encapsulation layer covers the LED chip.
[0006] Preferably, the mounting hole is a blind hole opened from the third surface to the fourth surface, and the driving chip is placed in the blind hole. A first encapsulation layer is provided on the first surface of the first substrate unit, and the first encapsulation layer covers the LED chip.
[0007] Preferably, a first metal circuit is provided on the first surface of the first substrate unit, and a first mounting position is provided on the first metal circuit. A second metal circuit is provided on the second surface of the first substrate unit, and a second mounting position is provided on the second metal circuit. The first metal circuit and the second metal circuit are electrically connected by a first connection circuit passing through the first substrate unit. A third metal circuit is provided on the third surface of the second substrate unit, and a fourth metal circuit is provided on the fourth surface of the second substrate unit. The third metal circuit and the fourth metal circuit are electrically connected by a second connection circuit passing through the second substrate unit. The second metal circuit and the third metal circuit are welded to electrically connect the first substrate unit and the second substrate unit.
[0008] The present invention also provides a method for manufacturing an LED package with a built-in driving chip, comprising the following steps: providing a first circuit board, a second circuit board, a plurality of LED chips, and a plurality of the driving chips, wherein the first circuit board comprises a plurality of first substrate units, each first substrate unit comprises a first surface and a second surface opposite to the first surface, at least one first mounting position for mounting an LED chip is arranged on the first surface, at least one second mounting position for mounting the driving chip is arranged on the second surface, the second circuit board comprises a plurality of second substrate units, each second substrate unit comprises a third surface and a fourth surface opposite to the third surface, at least one mounting hole position is formed on the second substrate unit, and the mounting hole position is a through hole; mounting the LED chips on the first mounting positions; mounting the driving chips on the second mounting positions, and the driving chips are used for being electrically connected with the corresponding LED chips to drive the LED chips; stacking the second circuit board below the first circuit board, and making the third surface face the second surface and the through hole correspond to the second mounting position, and fixedly connecting and electrically connecting the first substrate unit and the second substrate unit; arranging a first encapsulation layer on the first surface of the first substrate unit, and the first encapsulation layer covers the LED chips; arranging a second encapsulation layer covering the LED chips on the second surface of the first substrate unit, the second encapsulation layer extends into the through hole and the second encapsulation layer does not exceed the fourth surface; cutting the first circuit board and the second circuit board to form a plurality of LED packages with built-in driving chips, and each LED package with a built-in driving chip comprises a first substrate unit, a second substrate unit, at least one LED chip, at least one driving chip, a first encapsulation layer, and a second encapsulation layer.
[0009] Preferably, a first metal circuit is arranged on the first surface of the first substrate unit, the first mounting position is arranged on the first metal circuit, a second metal circuit is arranged on the second surface of the first substrate unit, the second mounting position is arranged on the second metal circuit, the first metal circuit and the second metal circuit are electrically connected through a first connection circuit passing through the first substrate unit, a third metal circuit is arranged on the third surface of the second substrate unit, a fourth metal circuit is arranged on the fourth surface of the second substrate unit, the third metal circuit and the fourth metal circuit are electrically connected through a second connection circuit passing through the second substrate unit, and the step of fixedly connecting and electrically connecting the first substrate unit and the second substrate unit comprises: welding and connecting the second metal circuit and the third metal circuit.
[0010] Preferably, before the step of stacking the second circuit board under the first circuit board, the following steps are further included: providing a solder paste layer on the third metal line of the second substrate unit, and providing an insulating layer on the second surface of the first substrate unit in an area except for the second metal line.
[0011] The present invention also provides a method for manufacturing an LED package with a built-in driving chip, including the following steps: providing a first circuit board and a plurality of LED chips, the first circuit board including a plurality of first substrate units, each first substrate unit including a first surface and a second surface opposite to the first surface, at least one first mounting position for mounting an LED chip being provided on the first surface, and at least one second mounting position for mounting the driving chip being provided on the second surface; mounting the LED chips on the first mounting positions; providing a second circuit board and a plurality of driving chips, the second circuit board including a plurality of second substrate units, each second substrate unit including a third surface and a fourth surface opposite to the third surface, at least one mounting hole being provided on the second substrate unit; disposing the driving chips at the mounting holes and exposing the pins of the driving chips; stacking the second circuit board under the first circuit board, with the third surface facing the second surface and the pins of the driving chips being attached to the second mounting positions; fixedly connecting and electrically connecting the first substrate units and the second substrate units, and mounting the pins of the driving chips on the second mounting positions to be electrically connected to the corresponding LED chips; providing a first encapsulation layer on the first surface of the first substrate unit, the first encapsulation layer covering the LED chips; cutting the first circuit board and the second circuit board to form a plurality of LED packages with built-in driving chips, each LED package with a built-in driving chip including a first substrate unit, a second substrate unit, at least one LED chip, at least one driving chip, and a first encapsulation layer.
[0012] Preferably, the mounting hole is a through hole, and the step of disposing the driving chips at the mounting holes and exposing the pins of the driving chips includes: providing a first temporary carrier, disposing the second circuit board on the first temporary carrier with the third surface facing the first temporary carrier; pasting the driving chips through the through holes onto the first temporary carrier, and pasting the pins of the driving chips onto the first temporary carrier; providing a second encapsulation layer on the surface of the first temporary carrier where the driving chips are pasted, the second encapsulation layer extending into the through holes and not exceeding the fourth surface; removing the first temporary carrier.
[0013] Preferably, the installation hole is a blind hole opened from the third surface to the fourth surface, and the driving chip is placed in the blind hole.
[0014] Compared with the prior art, the LED package of the present invention includes two first substrate units and a second substrate unit that are electrically connected to each other. The driving chip is disposed on the second surface, and the driving chip does not occupy the space on the first surface where the LED chip is located, which can further reduce the pitch of the LED chip and the pixel. In addition, the surface of the driving chip facing away from the first substrate unit does not exceed the fourth surface, ensuring that the driving chip is located inside the second substrate unit, further reducing the volume of the LED package without affecting the subsequent fixation of the LED package on the target substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural diagram of a package with a built-in driving chip in the prior art.
[0016] Figure 2 It is a structural diagram of a package with a built-in driving chip according to an embodiment of the present invention.
[0017] Figures 3a to 3g It is a preparation flowchart of a package with a built-in driving chip according to an embodiment of the present invention, where Figure 3a It is a structural diagram of the first circuit board, Figure 3b It is a structural diagram after installing the LED chip on the first circuit board, Figure 3c It is a structural diagram after installing the driving chip on the first circuit board, Figure 3d It is a structural diagram of the docking of the first circuit board and the second circuit board, Figure 3e It is a structural diagram after the first circuit board and the second circuit board are welded and connected, Figure 3f It is a structural diagram of setting the first encapsulation layer on the first substrate unit and the second encapsulation layer on the second surface, Figure 3g It is a structural diagram of cutting the first circuit board and the second circuit board.
[0018] Figures 4a to 4h It is another preparation flowchart of a package with a built-in driving chip according to an embodiment of the present invention, where Figure 4a It is a structural diagram of the first circuit board, Figure 4b It is a structural diagram of the docking of the first circuit board and the second circuit board, Figure 4c It is a structural diagram after the first circuit board and the second circuit board are welded and connected, Figure 4d It is a structural diagram after installing the driving chip on the first circuit board, Figure 4e It is a structural diagram after installing the LED chip on the first circuit board, Figure 4f It is a structural diagram of setting the first encapsulation layer on the first surface of the first substrate unit and the second encapsulation layer on the second surface,Figure 4g Structural diagram of the cutting of the first circuit board and the second circuit board Figure 4h Structural diagram of a package body with a built-in driving chip according to an embodiment of the present invention
[0019] Figures 5a to 5g A preparation flowchart of a package body with a built-in driving chip according to another structure of an embodiment of the present invention, where Figure 5a Structural diagram after installing an LED chip on the first circuit board Figure 5b Structural diagram after placing a driving chip in the blind hole of the second circuit board Figure 5c Structural diagram of the docking of the first circuit board and the second circuit board Figure 5d Structural diagram after the first circuit board and the second circuit board are welded and connected Figure 5e Structural diagram of setting a first encapsulation layer on the first surface of the first substrate unit Figure 5f Structural diagram of the cutting of the first circuit board and the second circuit board Figure 5g Structural diagram of a package body with a built-in driving chip according to another structure of an embodiment of the present invention
[0020] Figures 6a to 6f Another preparation flowchart of a package body with a built-in driving chip according to an embodiment of the present invention, where Figure 6a Structural diagram after installing an LED chip on the first circuit board Figure 6b Structural diagram after placing a driving chip in the through hole of the second circuit board Figure 6c Structural diagram of the docking of the first circuit board and the second circuit board Figure 6d Structural diagram after the first circuit board and the second circuit board are welded and connected Figure 6e Structural diagram of setting a first encapsulation layer on the first surface of the first substrate unit Figure 6f Structural diagram of the cutting of the first circuit board and the second circuit board Figure 6g Structural diagram of a package body with a built-in driving chip according to another structure of an embodiment of the present invention
[0021] Figures 7a to 7f Preparation according to an embodiment of the present invention Figure 6b Flowchart of placing a driving chip in the through hole of the second circuit board in the above, where Figure 7a Structural diagram of the second circuit board Figure 7b Structural diagram of temporarily bonding the second circuit board to the first temporary carrier Figure 7c Structural diagram of pasting a driving chip onto the first temporary carrier through a through hole Figure 7d Structural diagram after setting a second encapsulation layer on the driving chip Figure 7e Structural diagram of temporarily bonding a second temporary carrier to the second circuit board to remove the first temporary carrier Detailed implementation manners
[0022] To describe in detail the technical content, structural features, and achieved effects of the present invention, the following will be described in detail in conjunction with the implementation manners and with reference to the accompanying drawings.
[0023] Embodiment 1
[0024] As Figures 2 to 7f shown, an LED package 100 with a built-in driving chip according to an embodiment of the present invention includes a first substrate unit 101, a second substrate unit 201, at least one LED chip 2, and at least one driving chip 3. The first substrate unit 101 includes a first surface 11 and a second surface 12 opposite to the first surface 11. At least one first mounting position 13 for mounting the LED chip 2 is provided on the first surface 11, and at least one second mounting position 14 for mounting the driving chip 3 is provided on the second surface 12. The second substrate unit 201 is stacked below the first substrate unit 101. The second substrate unit 201 is fixedly connected and electrically connected to the first substrate unit 101. The second substrate unit 201 is provided with a mounting hole corresponding to the second mounting position 14. The second substrate unit 201 includes a third surface 41 and a fourth surface 42 opposite to the third surface 41. The third surface 41 faces the second surface 12. The driving chip 3 is disposed at the mounting hole and mounted on the second mounting position 14. The driving chip 3 is electrically connected to the LED chip 2, and the surface of the driving chip 3 facing away from the first substrate unit 101 does not exceed the fourth surface 42.
[0025] Specifically, the LED chip 2 can be a single-color light-emitting chip or a light-emitting chip that emits red light, green light, or blue light respectively. The driving chip 3 is used to drive the corresponding LED chip 2. The driving chip 3 and the LED chip 2 can be arranged one-to-one or one-to-many, and specific selection is made according to actual needs. Metal lines are preset on the first substrate unit 101 and the second substrate unit 201. As Figure 3a and Figure 4a shown, a first metal line 15 is provided on the first surface 11 of the first substrate unit 101, and the first mounting position 13 is provided on the first metal line 15. A second metal line 16 is provided on the second surface 12 of the first substrate unit 101, and the second mounting position 14 is provided on the second metal line 16. The first metal line 15 and the second metal line 16 are electrically connected through a first connection line 17 passing through the first substrate unit 101. As Figure 3d and Figure 4bAs shown, a third metal line 44 is provided on the third surface 41 of the second substrate unit 201, and a fourth metal line 45 is provided on the fourth surface 42 of the second substrate unit 201. The third metal line 44 and the fourth metal line 45 are electrically connected through a second connection line 46 passing through the second substrate unit 201. The LED chip 2 is welded to the first mounting position 13, and the driving chip 3 is welded to the second mounting position 14. Of course, in some other embodiments, the first mounting position 13 and the second mounting position 14 may not be the preset metal lines on the first substrate unit 101 and the second substrate unit 201. After the LED chip 2 and the driving chip 3 are mounted, they can be electrically connected to the preset metal lines through leads.
[0026] In the LED package 100 according to the embodiment of the present invention, it includes two electrically connected first substrate units 101 and second substrate units 201. The driving chip 3 is disposed on the second surface 12. The driving chip 3 does not occupy the space on the first surface 11 where the LED chip 2 is located, which can further reduce the pitch of the LED chip 2 and the pixels. In addition, the surface of the driving chip 3 facing away from the first substrate unit 101 does not exceed the fourth surface 42, which ensures that the driving chip 3 is located inside the second substrate unit 201, further reducing the volume of the LED package 100 without affecting the subsequent fixation of the LED package 100 to the target substrate.
[0027] In the embodiment of the present invention, the mounting hole is a through hole 43 to avoid the driving chip 3. A second encapsulation layer 6 covering the driving chip 3 is further provided on the second surface 12 of the first substrate unit 101. The second encapsulation layer 6 extends into the through hole 43 and the second encapsulation layer 6 does not exceed the fourth surface 42. A first encapsulation layer 5 is provided on the first surface 11 of the first substrate unit 101, and the first encapsulation layer 5 covers the LED chip 2. Specifically, as Figure 2 、 Figure 4h and Figure 6g shown, setting the mounting hole as the through hole 43 can avoid the driving chip 3. At the same time, through the setting of the first encapsulation layer 5 and the second encapsulation layer 6, the LED chip 2 and the driving chip 3 can be effectively protected. In addition, the second encapsulation layer 6 not exceeding the fourth surface 42 ensures that the second encapsulation layer 6 does not affect the subsequent fixation of the LED package 100 to the target substrate.
[0028] In some other embodiments, the mounting hole is a blind hole 47 opened from the third surface 41 to the fourth surface 42, and the driving chip 3 is placed in the blind hole 47. A first encapsulation layer 5 is provided on the first surface 11 of the first substrate unit 101, and the first encapsulation layer 5 covers the LED chip 2. Specifically, as Figure 5gAs shown, a blind hole 47 for accommodating the driving chip 3 is formed on the second substrate unit 201. The back surface of the driving chip 3 opposite to the surface where the pins of the driving chip 3 are located faces the blind hole 47. The blind hole 47 supports and protects the driving chip 3, and there is no need to additionally provide a second encapsulation layer 6 covering the driving chip 3, which can effectively save process steps and has a clever design.
[0029] In the embodiment of the present invention, a first metal circuit 15 is provided on the first surface 11 of the first substrate unit 101, a first mounting position 13 is provided on the first metal circuit 15, a second metal circuit 16 is provided on the second surface 12 of the first substrate unit 101, a second mounting position 14 is provided on the second metal circuit 16, the first metal circuit 15 and the second metal circuit 16 are electrically connected through a first connection circuit 17 passing through the first substrate unit 101. A third metal circuit 44 is provided on the third surface 41 of the second substrate unit 201, a fourth metal circuit 45 is provided on the fourth surface 42 of the second substrate unit 201, the third metal circuit 44 and the fourth metal circuit 45 are electrically connected through a second connection circuit 46 passing through the second substrate unit 201. The second metal circuit 16 and the third metal circuit 44 are welded to electrically connect the first substrate unit 101 and the second substrate unit 201. Specifically, a second mounting position 14 and a preset position for welding with the third metal circuit 44 are provided on the second metal circuit 16. The first substrate unit 101 and the second substrate unit 201 are fixedly connected and electrically connected by welding the second metal circuit 16 and the third metal circuit 44, which is more convenient for connection and has a compact structure.
[0030] Embodiment Two
[0031] As Figure 2 and Figures 3a to 3g shown, the embodiment of the present invention provides a method for manufacturing an LED package 100 with a built-in driving chip, which includes the following steps:
[0032] S1. Provide a first circuit board 10, a second circuit board 20, a plurality of LED chips 2, and a plurality of driving chips 3. The first circuit board 10 includes a plurality of first substrate units 101. Each first substrate unit 101 includes a first surface 11 and a second surface 12 opposite to the first surface 11. At least one first mounting position 13 for mounting the LED chips 2 is provided on the first surface 11, and at least one second mounting position 14 for mounting the driving chips 3 is provided on the second surface 12. The second circuit board 20 includes a plurality of second substrate units 201. Each second substrate unit 201 includes a third surface 41 and a fourth surface 42 opposite to the third surface 41. At least one mounting hole position is formed on the second substrate unit 201, and the mounting hole position is a through hole 43. Specifically, the first circuit board 10 and the second circuit board 20 can be one of a BT substrate, a PCB substrate, a ceramic substrate, or a glass substrate. Figure 3a shows the structure of the first circuit board 10. Metal lines are preset on the first circuit board 10 and the second circuit board 20. A first metal line 15 is provided on the first surface 11 of the first substrate unit 101, and the first mounting position 13 is provided on the first metal line 15. A second metal line 16 is provided on the second surface 12 of the first substrate unit 101, and the second mounting position 14 is provided on the second metal line 16. The first metal line 15 and the second metal line 16 are electrically connected through a first connection line 17 passing through the first substrate unit 101. A third metal line 44 is provided on the third surface 41 of the second substrate unit 201, and a fourth metal line 45 is provided on the fourth surface 42 of the second substrate unit 201. The fourth metal line 45 is used for subsequent electrical connection with a target substrate. The third metal line 44 and the fourth metal line 45 are electrically connected through a second connection line 46 passing through the second substrate unit 201. The LED chip 2 can be a single-color light-emitting chip or a light-emitting chip that emits red, green, or blue light respectively. The driving chip 3 is used to drive the corresponding LED chip 2.
[0033] S2. Mount the LED chips 2 on the first mounting positions 13. Specifically, as Figure 3b shown, the first metal line 15 is provided with the first mounting position 13, and the electrodes of the LED chips 2 can be welded to the first mounting positions 13. Of course, in some other embodiments, the first mounting position 13 may not be part of the first metal line 15 on the first substrate unit 101. After the LED chips 2 are mounted, electrical connection can be achieved through leads and the preset metal lines, and the specific connection method is not limited.
[0034] S3. Mount the driving chip 3 on the second mounting position 14. The driving chip 3 is used for electrically connecting with the corresponding LED chip 2 to drive the LED chip 2. Specifically, the driving chip 3 and the LED chip 2 can be set one-to-one or one-to-many, and the specific selection is based on actual needs. For example, Figure 3c As shown, the second mounting position 14 is provided on the second metal line 16. The pins of the driving chip 3 can be welded to the second mounting position 14. Of course, in some other embodiments, the second mounting position 14 may not be part of the second metal line 16 on the first substrate unit 101. After the LED chip 2 is mounted, it can be electrically connected to the preset metal line through leads. The specific connection method is not limited.
[0035] S4. Stack the second circuit board 20 below the first circuit board 10, and make the third surface 41 face the second surface 12 and the through hole 43 correspond to the second mounting position 14. Fix and electrically connect the first substrate unit 101 and the second substrate unit 201. Specifically, the second substrate unit 201 is stacked below the first substrate unit 101 and the first substrate unit 101 is electrically connected to the second substrate unit 201. For example, Figure 3d and Figure 3e As shown, the first substrate unit 101 and the second substrate unit 201 are electrically connected by welding the second metal line 16 and the third metal line 44. The through hole 43 corresponds to the second mounting position 14 to avoid the driving chip 3.
[0036] S5. Set the first encapsulation layer 5 on the first surface 11 of the first substrate unit 101. The first encapsulation layer 5 covers the LED chip 2. Specifically, for example, Figure 3f As shown, the first encapsulation layer 5 is set on the first surface 11 of the first substrate unit 101 to encapsulate and protect the LED chip 2.
[0037] S6. Set the second encapsulation layer 6 covering the LED chip 2 on the second surface 12 of the first substrate unit 101. The second encapsulation layer 6 extends into the through hole 43 and the second encapsulation layer 6 does not exceed the fourth surface 42. Specifically, for example, Figure 3f As shown, the second encapsulation layer 6 is set on the second surface 12 of the first substrate unit 101 to encapsulate and protect the LED chip 2. The fact that the second encapsulation layer 6 does not exceed the fourth surface 42 ensures that the second encapsulation layer 6 does not affect the subsequent fixing of the LED package 100 on the target substrate.
[0038] S7. Cut the first circuit board 10 and the second circuit board 20 to form a plurality of LED packages 100 with built-in driving chips 3. Each LED package 100 with a built-in driving chip 3 includes a first substrate unit 101, a second substrate unit 201, at least one LED chip 2, at least one driving chip 3, a first encapsulation layer 5, and a second encapsulation layer 6. Specifically, as Figure 2 and Figure 3g shown, by cutting the first circuit board 10 and the second circuit board 20, the LED package 100 with a built-in driving chip 3 of the present invention is formed, and the design is ingenious.
[0039] In the LED package 100 according to the embodiment of the present invention, there are two first substrate units 101 and second substrate units 201 that are electrically connected to each other. The driving chip 3 is disposed on the second surface 12. The driving chip 3 does not occupy the space of the first surface 11 where the LED chip 2 is located, which can further reduce the pitch between the LED chips 2 and the pixels. In addition, the surface of the driving chip 3 facing away from the first substrate unit 101 does not exceed the fourth surface 42, ensuring that the driving chip 3 is located inside the second substrate unit 201, further reducing the volume of the LED package 100 without affecting the subsequent fixing of the LED package 100 to the target substrate.
[0040] In the embodiment of the present invention, a first metal line 15 is disposed on the first surface 11 of the first substrate unit 101, a first mounting position 13 is disposed on the first metal line 15, a second metal line 16 is disposed on the second surface 12 of the first substrate unit 101, a second mounting position 14 is disposed on the second metal line 16, the first metal line 15 and the second metal line 16 are electrically connected through a first connection line 17 passing through the first substrate unit 101, a third metal line 44 is disposed on the third surface 41 of the second substrate unit 201, a fourth metal line 45 is disposed on the fourth surface 42 of the second substrate unit 201, the third metal line 44 and the fourth metal line 45 are electrically connected through a second connection line 46 passing through the second substrate unit 201. Step S4, the step of fixedly connecting and electrically connecting the first substrate unit 101 and the second substrate unit 201 includes:
[0041] S41. Weld and connect the second metal line 16 and the third metal line 44. The connection between the second circuit board 20 and the first circuit board 10 is realized through welding connection, and the process is simpler and the structure is more compact.
[0042] In the embodiment of the present invention, before the step of stacking the second circuit board 20 below the first circuit board 10 in step S4, it further includes:
[0043] S04. A solder paste layer is disposed on the third metal line 44 of the second substrate unit 201, and an insulating layer is disposed on the second surface 12 of the first substrate unit 101 except for the area of the second metal line 16. Specifically, a solder paste layer is formed on the third metal line 44 of the second substrate unit 201, and an insulating layer is disposed on the second surface 12 of the first substrate unit 101 except for the area of the second metal line 16. The pattern of the insulating layer is complementary to the pattern of the solder paste layer, which can prevent short - circuiting between adjacent lines when they are bonded and welded. It should be noted that after the first circuit board 10 is stacked below the first circuit board 10, a certain gap still remains between the solder paste layer and the insulating layer to meet the fluidity between the solder paste layer and the insulating layer during welding. The solder paste layer is formed by solder paste printing, and the insulating layer is formed by scribing, dispensing, etc. Disposing the solder paste layer on the second surface 12 of the first substrate unit 101 can avoid being affected by the driving chip 3 when printing the solder paste, and the operation is more convenient.
[0044] It should be noted that in this embodiment, the order of step S2 of installing the LED chip 2 and step S3 of installing the driving chip 3 can be swapped, that is, step S3 is executed first and then step S2.
[0045] Embodiment Three
[0046] The difference between this embodiment and Embodiment Two is that: as Figures 4a to 4h shown, in this embodiment, step S4 in Embodiment One is executed first. As Figure 4b and Figure 4c shown, that is, the second circuit board 20 is first stacked below the first circuit board 10, and then step S2 of installing the LED chip 2 and step S3 of installing the driving chip 3 are executed. Specifically, as Figure 4d and Figure 4e described, since the mounting hole is a through - hole 43, the driving chip 3 can be installed through the through - hole 43, and the design is ingenious. The subsequent steps are the same as steps S5 to S7 in Embodiment One, specifically as Figures 4f to 4h shown.
[0047] Embodiment Four
[0048] As Figures 5a to 5g shown, an embodiment of the present invention also provides a manufacturing method of an LED package 100 with a built - in driving chip 3, including the following steps:
[0049] S10. Provide a first circuit board 10 and a plurality of LED chips 2. The first circuit board 10 includes a plurality of first substrate units 101. Each first substrate unit 101 includes a first surface 11 and a second surface 12 opposite to the first surface 11. At least one first mounting position 13 for mounting the LED chip 2 is provided on the first surface 11, and at least one second mounting position 14 for mounting the driving chip 3 is provided on the second surface 12. Mount the LED chip 2 on the first mounting position 13. Specifically, the first circuit board 10 can be one of a BT substrate, a PCB substrate, a ceramic substrate, or a glass substrate. As Figure 5a shown, metal lines are preset on the first circuit board 10. A first metal line 15 is provided on the first surface 11 of the first substrate unit 101, and the first mounting position 13 is provided on the first metal line 15. A second metal line 16 is provided on the second surface 12 of the first substrate unit 101, and the second mounting position 14 is provided on the second metal line 16. The first metal line 15 and the second metal line 16 are electrically connected by a first connection line 17 passing through the first substrate unit 101. The LED chip 2 can be a single-color light-emitting chip or a light-emitting chip that emits red, green, or blue light respectively. The electrodes of the LED chip 2 can be welded to the first mounting position 13. Of course, in some other embodiments, the first mounting position 13 may not be part of the first metal line 15 on the first substrate unit 101. After the LED chip 2 is mounted, it can be electrically connected to the preset metal line through leads. The specific connection method is not limited.
[0050] S20. Provide a second circuit board 20 and a plurality of driving chips 3. The second circuit board 20 includes a plurality of second substrate units 201. Each second substrate unit 201 includes a third surface 41 and a fourth surface 42 opposite to the third surface 41. At least one mounting hole is provided on the second substrate unit 201. Place the driving chip 3 at the mounting hole so that the pins of the driving chip 3 are exposed. Specifically, the second circuit board 20 can be one of a BT substrate, a PCB substrate, a ceramic substrate, or a glass substrate. Figure 5bShows the structure of the second circuit board 20. There are metal lines preset on the second circuit board 20. A third metal line 44 is provided on the third surface 41 of the second substrate unit 201, and a fourth metal line 45 is provided on the fourth surface 42 of the second substrate unit 201. The fourth metal line 45 is used for subsequent electrical connection with the target substrate. The third metal line 44 and the fourth metal line 45 are electrically connected through a second connection line 46 passing through the second substrate unit 201. The driving chip 3 and the LED chip 2 can be arranged one-to-one or one-to-many, specifically selected according to actual needs. The mounting hole is a blind hole 47 opened from the third surface 41 to the fourth surface 42. The driving chip 3 is placed in the blind hole 47, and the back surface of the driving chip 3 opposite to the surface where the pins of the driving chip 3 are located faces the blind hole 47. The blind hole 47 plays a role in supporting and protecting the driving chip 3, and there is no need to additionally provide a second encapsulation layer 6 covering the driving chip 3, which can effectively save process steps and is ingeniously designed.
[0051] S30. Stack the second circuit board 20 below the first circuit board 10, and make the third surface 41 face the second surface 12 and the pins of the driving chip 3 fit the second mounting position 14; specifically, as Figure 5c and Figure 5d shown.
[0052] S40. Fix and electrically connect the first substrate unit 101 and the second substrate unit 201, and mount the pins of the driving chip 3 on the second mounting position 14 to electrically connect with the corresponding LED chip 2; specifically, as Figure 5c and Figure 5d shown. The second mounting position 14 and a preset position for soldering connection with the third metal line 44 are provided on the second metal line 16. The first substrate unit 101 and the second substrate unit 201 are fixedly connected and electrically connected by soldering the second metal line 16 and the third metal line 44, which is more convenient for connection and has a compact structure.
[0053] S50. Set a first encapsulation layer 5 on the first surface 11 of the first substrate unit 101, and the first encapsulation layer 5 covers the LED chip 2; specifically, as Figure 5e shown. Set a first encapsulation layer 5 on the first surface 11 of the first substrate unit 101 to encapsulate and protect the LED chip 2.
[0054] S60. Cut the first circuit board 10 and the second circuit board 20 to form a number of LED packages 100 with built-in driving chips 3. Each LED package 100 with a built-in driving chip 3 includes a first substrate unit 101, a second substrate unit 201, at least one LED chip 2, at least one driving chip 3, and a first encapsulation layer 5. Specifically, as Figure 5f andFigure 5g As shown, by cutting the first circuit board 10 and the second circuit board 20, the LED package 100 with the built-in driving chip 3 of the present invention is formed, and the design is ingenious.
[0055] The LED package 100 of the embodiment of the present invention includes two first substrate units 101 and second substrate units 201 that are electrically connected to each other. The driving chip 3 is disposed on the second surface 12. The driving chip 3 does not occupy the space of the first surface 11 where the LED chip 2 is located, and can further reduce the pitch of the LED chip 2 and the pixels. In addition, the surface of the driving chip 3 facing away from the first substrate unit 101 does not exceed the fourth surface 42, ensuring that the driving chip 3 is located inside the second substrate unit 201, further reducing the volume of the LED package 100 without affecting the subsequent fixing of the LED package 100 on the target substrate.
[0056] Embodiment Five
[0057] The difference between the embodiment of the present invention and Embodiment Four is that: the mounting hole position in this embodiment is a through hole 43. As Figures 6a to 6g shown, the steps of this embodiment are the same as steps S10 to S60 of Embodiment Four. The difference is that in the execution of step S40 in this embodiment, the steps of disposing the driving chip 3 at the mounting hole position and exposing the pins of the driving chip 3 include:
[0058] S401. Provide a first temporary carrier 7, and dispose the second circuit board 20 on the first temporary carrier 7 with the third surface 41 facing the first temporary carrier 7; specifically, as Figure 7a and Figure 7b shown, paste the second circuit board 20 on the first temporary carrier 7 through a temporary bonding adhesive. The temporary bonding adhesive can be a UV adhesive or the like.
[0059] S402. Paste the driving chip 3 through the through hole 43 on the first temporary carrier 7, and paste the pins of the driving chip 3 on the first temporary carrier 7; specifically, as Figure 7c shown, paste the driving chip 3 on the first temporary carrier 7 through a temporary bonding adhesive.
[0060] S403. Set a second encapsulation layer 6 covering the driving chip 3 on the surface of the first temporary carrier 7 where the driving chip 3 is pasted. The second encapsulation layer 6 extends into the through hole 43 and the second encapsulation layer 6 does not exceed the fourth surface 42; specifically, as Figure 7d shown, form a second encapsulation layer 6 on the first temporary carrier 7 and in the through hole 43 to protect the driving chip 3.
[0061] S404. Remove the first temporary carrier 7. Specifically, as Figure 7e and Figure 7fAs shown, first, the second temporary carrier 8 can be temporarily bonded to the fourth surface 42 of the second circuit board 20, then the first temporary carrier 7 can be debonded, and after the first circuit board 10 and the second circuit board 20 are connected, the second temporary carrier 8 can be removed. The second temporary carrier 8 can be used for supporting, facilitating the soldering connection between the first circuit board 10 and the second circuit board 20. Of course, in some other embodiments, the second temporary carrier 8 may not be used, and instead, the first temporary carrier 7 can be directly debonded.
[0062] It should be noted that the LED package 100 with the built-in driving chip 3 prepared in this embodiment includes a first substrate unit 101, a second substrate unit 201, at least one LED chip 2, at least one driving chip 3, a first encapsulation layer 5, and a second encapsulation layer 6.
[0063] The above-disclosed are only the preferred examples of the present invention. Of course, the scope of the rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.
Claims
1. An LED package with a built-in driving chip, characterized in that It includes a first substrate unit, a second substrate unit, at least one LED chip, and at least one driving chip. The first substrate unit includes a first surface and a second surface opposite to the first surface. At least one first mounting position for mounting the LED chip is provided on the first surface, and at least one second mounting position for mounting the driving chip is provided on the second surface; The second substrate unit is stacked below the first substrate unit. The second substrate unit is fixedly connected and electrically connected to the first substrate unit. The second substrate unit is provided with a mounting hole corresponding to the second mounting position. The second substrate unit includes a third surface and a fourth surface opposite to the third surface. The third surface faces the second surface. The driving chip is disposed at the mounting hole and mounted on the second mounting position. The driving chip is electrically connected to the LED chip, and the surface of the driving chip facing away from the first substrate unit does not extend beyond the fourth surface.
2. The LED package with a built-in drive chip according to claim 1, characterized in that, The mounting hole is a through hole to avoid the driving chip. A second encapsulation layer covering the driving chip is further provided on the second surface of the first substrate unit. The second encapsulation layer extends into the through hole and the second encapsulation layer does not extend beyond the fourth surface. A first encapsulation layer is provided on the first surface of the first substrate unit, and the first encapsulation layer covers the LED chip.
3. The LED package with a built-in driving chip according to claim 1, characterized in that, The mounting hole is a blind hole opened from the third surface to the fourth surface. The driving chip is placed in the blind hole. A first encapsulation layer is provided on the first surface of the first substrate unit, and the first encapsulation layer covers the LED chip.
4. The LED package with a built-in driving chip according to claim 1, wherein, A first metal circuit is provided on the first surface of the first substrate unit, and the first mounting position is provided on the first metal circuit. A second metal circuit is provided on the second surface of the first substrate unit, and the second mounting position is provided on the second metal circuit. The first metal circuit and the second metal circuit are electrically connected through a first connection circuit penetrating through the first substrate unit; A third metal circuit is provided on the third surface of the second substrate unit, and a fourth metal circuit is provided on the fourth surface of the second substrate unit. The third metal circuit and the fourth metal circuit are electrically connected through a second connection circuit penetrating through the second substrate unit. The second metal circuit and the third metal circuit are welded to electrically connect the first substrate unit and the second substrate unit.
5. A manufacturing method of an LED package with a built-in driving chip, characterized in that, It includes the following steps: Provided are a first circuit board, a second circuit board, a plurality of LED chips, and a plurality of the driving chips. The first circuit board includes a plurality of first board units. Each first board unit includes a first surface and a second surface opposite to the first surface. At least one first mounting position for mounting an LED chip is provided on the first surface, and at least one second mounting position for mounting the driving chip is provided on the second surface. The second circuit board includes a plurality of second board units. Each second board unit includes a third surface and a fourth surface opposite to the third surface. At least one mounting hole position is formed on the second board unit, and the mounting hole position is a through hole; Mount the LED chip on the first mounting position; Mount the driving chip on the second mounting position. The driving chip is used to be electrically connected to the corresponding LED chip to drive the LED chip; Stack the second circuit board below the first circuit board, and make the third surface face the second surface and the through hole correspond to the second mounting position. Fix and electrically connect the first board unit and the second board unit; Provide a first encapsulation layer on the first surface of the first board unit. The first encapsulation layer covers the LED chip; Provide a second encapsulation layer covering the LED chip on the second surface of the first board unit. The second encapsulation layer extends into the through hole and the second encapsulation layer does not extend beyond the fourth surface; Cut the first circuit board and the second circuit board to form a plurality of LED packages with built-in driving chips. Each LED package with a built-in driving chip includes a first board unit, a second board unit, at least one LED chip, at least one driving chip, a first encapsulation layer, and a second encapsulation layer.
6. The manufacturing method of the LED package with a built-in driving chip according to claim 5, characterized in that, A first metal circuit is provided on the first surface of the first board unit, and the first mounting position is provided on the first metal circuit. A second metal circuit is provided on the second surface of the first board unit, and the second mounting position is provided on the second metal circuit. The first metal circuit and the second metal circuit are electrically connected through a first connection circuit passing through the first board unit. A third metal circuit is provided on the third surface of the second board unit, and a fourth metal circuit is provided on the fourth surface of the second board unit. The third metal circuit and the fourth metal circuit are electrically connected through a second connection circuit passing through the second board unit. The step of fixing and electrically connecting the first board unit and the second board unit includes: Weld and connect the second metal circuit and the third metal circuit.
7. The manufacturing method of the LED package with a built-in driving chip according to claim 6, characterized in that, Before the step of stacking the second circuit board below the first circuit board, further include: Provide a solder paste layer on the third metal circuit of the second board unit, and provide an insulating layer on the area other than the second metal circuit on the second surface of the first board unit.
8. A manufacturing method of an LED package with a built-in driving chip, characterized in that, Include the following steps: Provide a first circuit board and a plurality of LED chips. The first circuit board includes a plurality of first board units. Each first board unit includes a first surface and a second surface opposite to the first surface. At least one first mounting position for mounting an LED chip is provided on the first surface, and at least one second mounting position for mounting the driving chip is provided on the second surface. Mount the LED chips on the first mounting positions; Provide a second circuit board and a plurality of driving chips. The second circuit board includes a plurality of second board units. Each second board unit includes a third surface and a fourth surface opposite to the third surface. At least one mounting hole is formed in the second board unit. Place the driving chip at the mounting hole so that the pins of the driving chip are exposed; Stack the second circuit board below the first circuit board, and make the third surface face the second surface and the pins of the driving chip fit the second mounting position; Fix and electrically connect the first board unit and the second board unit, and mount the pins of the driving chip on the second mounting position to be electrically connected to the corresponding LED chip; Provide a first encapsulation layer on the first surface of the first board unit, and the first encapsulation layer covers the LED chips; Cut the first circuit board and the second circuit board to form a plurality of LED packages with built-in driving chips. Each LED package with a built-in driving chip includes a first board unit, a second board unit, at least one LED chip, at least one driving chip, and a first encapsulation layer.
9. The manufacturing method of the LED package with a built-in driving chip according to claim 8, characterized in that, The mounting hole is a through hole. The step of placing the driving chip at the mounting hole so that the pins of the driving chip are exposed includes: Provide a first temporary carrier board, place the second circuit board on the first temporary carrier board with the third surface facing the first temporary carrier board; Paste the driving chip onto the first temporary carrier board through the through hole, and paste the pins of the driving chip onto the first temporary carrier board; Provide a second encapsulation layer covering the driving chip on the surface of the first temporary carrier board where the driving chip is pasted. The second encapsulation layer extends into the through hole and the second encapsulation layer does not extend beyond the fourth surface; Remove the first temporary carrier board.
10. The manufacturing method of the LED package with a built-in drive chip as described in claim 8, characterized in that, The mounting hole is a blind hole opened from the third surface to the fourth surface, and the driving chip is placed in the blind hole.