Repair device and repair system for display panel

Abstract

The invention relates to a display panel repairing device and system, and the device comprises a feeding device which comprises a feeding driving assembly and a feeding table, and the feeding driving assembly drives the feeding table to translate and rotate in a horizontal plane; the repairing device comprises a repairing driving assembly and a repairing table, and the repairing driving assembly drives the repairing table to horizontally move and rotate in the horizontal plane; the repairing table is suitable for enabling a plurality of defect points of the to-be-repaired substrate to be sequentially located at the welding position of the welding device; and the transfer device comprises a transfer driving assembly and an adsorption assembly, the adsorption assembly comprises an adsorption needle tube, and the transfer driving assembly drives the adsorption assembly to pick up the chip on the standby substrate and send the chip to the defect point located at the welding device. The chip is compressed and adsorbed by the adsorption needle tube, interference with other chips is avoided, the chips are stably picked up and transferred, the relative positions of the welding device and the to-be-repaired substrate are consistent, the repair consistency is better, and the repair quality is ensured.

Description

Technical Field

[0001] This application relates to the technical field of display device repair, and particularly to a repair device and a repair system for a display panel. Background Art

[0002] MicroLED (micro light-emitting diode) display devices are widely used due to their advantages such as small size, low power consumption, high brightness, high color saturation, fast response, and long lifespan. In order to improve the yield of MicroLED display devices, during the preparation process of existing MicroLED display devices, after the LED chips are transferred, precise addressing detection and repair are performed on the LED chips to eliminate the non-displayable light-emitting chips and improve the yield of the display devices.

[0003] The chips to be transferred are usually arranged in batches on a spare substrate. When it is necessary to repair the defective points on the panel to be repaired, after picking up the chips from the spare substrate, they are then transferred to the defective points on the substrate to be repaired. Generally, the chips are picked up by means of bonding, adsorption, magnetism, etc. After picking up the chips, the chips are placed at the defective points and fixed at the defective points.

[0004] In the related art, a glass cavity is arranged, and adsorption holes are opened on the bottom surface of the glass cavity. Through the form of vacuum pumping, the chips are adsorbed on the bottom surface of the glass cavity. And by arranging a laser on the top of the glass cavity, the laser passes through the glass cavity and irradiates the surface of the chip, thereby heating the chip to fix the chip by welding.

[0005] However, first, the chips on the spare substrate and the substrate to be repaired are arranged closely, and the size of the chips is small. When the glass cavity presses down to adsorb the chips, the glass cavity will touch the chips around the chip to be picked up, which not only causes the glass cavity to be unable to press down the chip to be picked up, making it difficult to ensure the vacuum between the chip and the bottom surface of the glass cavity, but also easily causes damage to the surrounding chips. Due to the small size of the chips, it is also difficult to process the adsorption holes. Second, the laser passes through the glass cavity, and part of the laser passes through the adsorption holes and irradiates the chip, resulting in uneven energy intensity of the light spot formed on the chip surface, making it difficult to control the energy of the laser. And the laser needs to move synchronously with the glass cavity, and the reciprocating movement of the internal components of the laser easily causes the optical path of the laser to change, which has an adverse effect on the welding and fixing of the chip. Summary of the Invention

[0006] The embodiments of this application provide a repair device and a repair system for a display panel to solve the technical problems in the related art that it is difficult to pick up and press the chips, and the laser energy uniformity is poor, affecting the repair quality of the display panel.

[0007] In the first aspect, a repair device for a display panel is provided, which includes:

[0008] Feeding device, the feeding device includes a feeding drive assembly and a feeding table, the feeding table is used to support the spare substrate, and the feeding drive assembly drives the feeding table to translate and rotate in a horizontal plane;

[0009] Repair device, the repair device includes a repair drive assembly and a repair table, the repair table is used to support the substrate to be repaired, and the repair drive assembly drives the repair table to translate and rotate in a horizontal plane;

[0010] Welding device, the repair table is adapted to sequentially place a plurality of defective points of the substrate to be repaired at the welding position of the welding device;

[0011] Transfer device, the transfer device includes a transfer drive assembly and an adsorption assembly, the adsorption assembly includes an adsorption needle tube for adsorbing the chip, and the transfer drive assembly drives the adsorption assembly to pick up the chip on the spare substrate and send the chip to the defective point at the welding device.

[0012] In some embodiments, the adsorption assembly further includes:

[0013] Sliding seat, the sliding seat is arranged to lift and slide at the driving end of the transfer drive assembly, and the adsorption needle tube is installed on the sliding seat;

[0014] Pressure sensing element, the pressure sensing element is installed at the driving end of the transfer drive assembly, and the sliding seat is connected to the measuring end of the pressure sensing element.

[0015] In some embodiments, the adsorption assembly further includes a connecting rod, the adsorption needle tube is connected to the sliding seat through the connecting rod, and the sliding seat and the adsorption needle tube are respectively located at opposite ends of the connecting rod.

[0016] In some embodiments, the adsorption assembly further includes an elastic member, the elastic member connects the adsorption needle tube to the driving end of the transfer drive assembly, and the elastic force of the elastic member cancels part or all of the gravity of the load component of the elastic member.

[0017] In some embodiments, the welding device includes a laser, and the optical path of the emitted light of the laser is arranged obliquely to the plane where the substrate to be repaired is located, so that the emitted light irradiates the surface of the chip avoiding the adsorption needle tube.

[0018] In some embodiments, the welding device includes two lasers, and the two lasers respectively emit laser light to the chip from opposite sides of the adsorption needle tube, and two light spots formed by the two lasers on the chip overlap.

[0019] In some embodiments, the welding device includes:

[0020] A laser, the laser beam emitted by which is perpendicularly incident on the chip at the defective point;

[0021] A light-transmitting pressing block, which is located below the laser;

[0022] A pressing block driving assembly, which is installed on the laser, the pressing block driving assembly driving the light-transmitting pressing block to extend to the optical path of the laser beam emitted by the laser and pressing the light-transmitting pressing block against the chip.

[0023] In some embodiments, the feeding device further includes a feeding vision detection assembly, and the feeding vision detection assembly includes:

[0024] A feeding vision positioning member, which is located above the feeding table, and the feeding vision positioning member captures the marking points on the spare substrate;

[0025] A picking vision monitoring member, which is located above the feeding table, the imaging direction of the picking vision monitoring member being inclined to the plane where the spare substrate is located, and the picking vision monitoring member imaging the chip to be picked up.

[0026] In some embodiments, the repairing device further includes a repairing vision detection assembly, and the repairing vision detection assembly includes:

[0027] A repairing vision positioning member, which is located above the repairing table, and the repairing vision positioning member is used to capture the marking points on the substrate to be repaired;

[0028] A placing vision monitoring member, which is located above the repairing table, the imaging direction of the placing vision monitoring member being inclined to the plane where the substrate to be repaired is located, and the placing vision monitoring member imaging the defective point where the chip will be placed.

[0029] The beneficial effects brought by the technical solution provided in this application include:

[0030] The embodiment of this application provides a repairing device for a display panel. When transferring a chip, the adsorption assembly moves above the spare chip, the adsorption assembly presses down and adsorbs the chip to pick up the chip, and transfers the chip to the defective point of the substrate to be repaired. Since the chip is adsorbed and picked up by the adsorption needle tube, the tip size of the adsorption needle tube is small, and it can only be pressed against the surface of the chip to be picked up. Moreover, the adsorption needle tube can be further lowered to press the chip tightly, which not only facilitates ensuring the vacuum degree between the chip and the adsorption needle tube, but also ensures that when welding, the chip is pressed against the defective point by the adsorption needle tube, so as to ensure that the chip is accurately installed at the defective point and the repairing quality is guaranteed.

[0031] Further, the defective points to be repaired are moved to the welding position of the welding device as the repair table moves, and the suction needle tube transfers the chip to the defective points. After the chip is transferred to the defective points, welding can be immediately performed. It is convenient to directly press the chip with the suction needle tube. When the chip is welded and fixed, it is not easy to shift, ensuring the fixing quality of the chip and improving the repair efficiency. In addition, since the position of the welding device does not change, when the defective points are repaired in sequence, the relative positions of the welding device and different defective points on the substrate to be repaired are consistent, ensuring better repair consistency and repair quality.

[0032] In a second aspect, a repair system for a display panel is provided, including the repair device for a display panel as described above.

[0033] Another embodiment of the present application provides a repair system for a display panel. Since it includes the above-mentioned repair device for a display panel, the beneficial effects of the repair system for a display panel are the same as those of the above-mentioned repair device for a display panel, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0035] Figure 1 Schematic diagram of the repair device for a display panel provided by an embodiment of the present application;

[0036] Figure 2 Internal schematic diagram of the repair device for a display panel provided by an embodiment of the present application;

[0037] Figure 3 Schematic diagram of a single-group transfer device provided by an embodiment of the present application;

[0038] Figure 4 Schematic diagram of chip transfer and placement provided by an embodiment of the present application;

[0039] Figure 5 Schematic diagram of the feeding device provided by an embodiment of the present application;

[0040] Figure 6 Schematic diagram of the repair device and the welding device provided by an embodiment of the present application;

[0041] Figure 7 Schematic diagram of the transfer device and the repair device provided by an embodiment of the present application;

[0042] Figure 8Partial schematic diagram of the transfer device provided by the embodiment of the present application;

[0043] Figure 9 Schematic diagram of the adsorption component provided by the embodiment of the present application;

[0044] Figure 10 Schematic diagram of two sets of lasers provided by another embodiment of the present application;

[0045] Figure 11 Schematic diagram of the welding device provided by another embodiment of the present application.

[0046] In the figure: 1, machine table; 2, housing; 3, feeding device; 31, feeding drive component; 32, feeding table; 321, positioning pin; 33, feeding vision detection component; 331, feeding vision positioning part; 332, picking vision monitoring part; 4, repair device; 41, repair drive component; 42, repair table; 43, repair vision detection component; 431, repair vision positioning part; 432, placing vision monitoring part; 5, welding device; 51, laser; 52, light-transmitting pressing block; 53, pressing block drive component; 6, transfer device; 61, transfer drive component; 62, adsorption component; 621, adsorption needle tube; 622, sliding seat; 623, pressure sensing part; 624, connecting rod; 625, elastic part; 63, transfer rack; 7, spare substrate; 8, substrate to be repaired; 8a, defect point; a, chip. Detailed implementation manners

[0047] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0048] The embodiment of the present application provides a repair device and a repair system for a display panel. By using an adsorption needle tube to press and adsorb a chip, there will be no interference with other chips, ensuring stable picking and transferring of the chip. The relative positions of the welding device and different defect points on the substrate to be repaired are consistent, so as to ensure better repair consistency and repair quality. The present application solves the technical problems in the related art that it is difficult to pick up and press the chip, and the laser energy uniformity is poor, affecting the repair quality of the display panel.

[0049] Refer to Figures 1 to 3, A repair device for a display panel, including a machine table 1 and a feeding device 3, a repair device 4, a welding device 5 and a transfer device 6 arranged on the machine table 1. In addition, a housing 2 is arranged on the top of the machine table 1, and the feeding device 3, the repair device 4, the welding device 5 and the transfer device 6 are all arranged in the processing chamber formed by the housing 2 and the machine table 1.

[0050] Referring to Figures 2 - 4 , wherein, the feeding device 3 is used to carry a spare substrate 7, the repair device 4 is used to carry a substrate 8 to be repaired, the transfer device 6 is used to pick up the chip a on the spare substrate 7 and transfer it to the defective position 8a of the substrate 8 to be repaired, and the welding device 5 is used to weld the chip a to the defective position 8a. Thus, the repair is completed.

[0051] It should be noted that a soldering flux is pre-arranged at the defective position 8a. After the chip a is pressed on the soldering flux, by heating the chip a, the chip a can be welded to the defective position 8a.

[0052] With such a setting, by integrating the transfer and welding of the chip a, the automatic full-process repair of the substrate 8 to be repaired is realized, improving the repair efficiency.

[0053] Referring to Figure 3 and Figure 5 , wherein, the feeding device 3 includes a feeding drive assembly 31 and a feeding table 32, and the feeding table 32 is used to support the spare substrate 7. The feeding drive assembly 31 includes a cross slide and a turntable. The turntable is used to carry the spare substrate 7 and drive the spare substrate 7 to rotate in the horizontal plane. The cross slide drives the turntable and the spare substrate 7 to translate in the horizontal plane together. In this embodiment, the cross slide drives the spare substrate 7 to move in a first direction and a second direction. Preferably, the first direction and the second direction are perpendicularly arranged. For the convenience of understanding, the X-axis direction in the figure is the first direction, that is, the left-right direction. The Y-axis direction is the second direction, that is, the front-back direction.

[0054] With such a setting, after the spare substrate 7 is loaded onto the feeding table 32, it is driven by the turntable and the cross slide to move to the transfer device 6 for the transfer device 6 to pick up.

[0055] Specifically, the cross slide is assembled by two linear modules, and the linear module includes a linear motor or a lead screw mechanism. The turntable includes an electric turntable.

[0056] Referring to Figure 3 and Figure 5Further, a plurality of feeding platforms 32 are arranged, and the plurality of feeding platforms 32 are arranged in sequence in the first direction. Adaptively, the feeding driving assembly 31 includes a plurality of turntables, and the number of turntables corresponds to the number of feeding platforms 32 one by one. In this way, a plurality of spare substrates 7 can be carried, and the individual movement positions of different spare substrates 7 can be satisfied. In this embodiment, three feeding platforms 32 and three turntables are arranged, and the three feeding platforms 32 are respectively used to carry the spare substrates 7 with chips a of red, green, and blue colors.

[0057] With such an arrangement, while carrying the spare chips a with different color chips a, according to the type of chip a required for the defective point 8a of the substrate 8 to be repaired, the transfer device 6 picks up the chip a of the required color to meet the repair requirements of different defective points 8a.

[0058] Refer to Figure 3 and Figure 5 , wherein, a plurality of positioning pins 321 are arranged on the bearing surface of the feeding platform 32, and the plurality of positioning pins 321 are all arranged close to the surface edge of the feeding platform 32. The circumferential side surface of the spare substrate 7 is adapted to abut against the positioning pins 321.

[0059] With such an arrangement, after the spare substrate 7 is loaded onto the feeding platform 32, the spare substrate 7 abuts against the positioning pins 321, and the positioning of the spare substrate 7 is realized by using the form of mechanical edge alignment, so as to quickly determine the position of the chip a on the spare substrate 7.

[0060] Further, the feeding platform 32 fixes the spare substrate 7 in an adsorption form. Specifically, through holes are formed on the surface of the feeding platform 32, and are communicated with an external negative pressure device to form a negative pressure state on the surface of the feeding platform 32, so as to adsorb and fix the spare substrate 7.

[0061] Refer to Figure 3 and Figure 5 , wherein, the feeding device 3 further includes a feeding vision detection assembly 33, and the feeding vision detection assembly 33 includes a feeding vision positioning member 331. The feeding vision positioning member 331 is installed on the inner wall of the housing 2 through a bracket. The imaging direction of the feeding vision positioning member 331 is arranged perpendicular to the surface of the feeding platform 32.

[0062] As the feeding platform 32 moves, different positions of the spare substrate 7 are moved into the visual field range of the feeding vision positioning member 331. The feeding vision positioning member 331 determines the position of the spare substrate 7 by capturing the marking points on the surface of the spare substrate 7. In this embodiment, the feeding vision positioning member 331 determines the position of the spare substrate 7 and each chip a on the spare substrate 7 by capturing the positions of two chips a at the diagonal corners.

[0063] Further, by imaging the chip a on the spare substrate 7 and synchronously adjusting the position of the spare substrate 7, the length direction and width direction of the chip a on the spare substrate 7 are arranged along the first direction and the second direction respectively.

[0064] With such a setting, by correcting the position of the chip a, it is ensured that the relative position between the chip a and the pickup end of the transfer device 6 is consistent each time the chip a is picked up. During the transfer process of the chip a, both the length direction and width direction of the chip a are in a determined state. When the chip a is placed and fixed on the defect point 8a, the placement accuracy of the chip a is improved, ensuring the repair quality. In addition, each time the chip a is picked up, the position of the chip a after each pickup is the same, improving the consistency of the transfer of the chip a.

[0065] In this embodiment, the feeding vision positioning member 331 includes a camera or a camera group, and the camera group includes at least one high-magnification camera and at least one wide-angle camera.

[0066] Refer to Figure 3 and Figure 5 , wherein, the feeding vision detection assembly 33 further includes a pickup vision monitoring member 332. The pickup vision monitoring member 332 is fixed to the inner wall of the housing 2 through a bracket. The imaging direction of the pickup vision monitoring member 332 is arranged obliquely to the surface of the spare substrate 7. When picking up the chip a, the spare substrate 7 is moved so that the chip a to be transferred is within the imaging field of view of the pickup vision monitoring member 332. The pickup vision monitoring member 332 images the chip a to be picked up, and by monitoring the picking-up process, it ensures a stable and accurate pickup of the chip a.

[0067] With such a setting, during the test of picking up the chip a, by monitoring the picking-up process through the pickup vision monitoring member 332, the stability of the pickup of the chip a can be judged, and then the pickup strategy can be conveniently and adaptively adjusted. During the actual picking-up process of repair, by monitoring the picking-up state, it is suitable to timely detect the chip a with poor picking-up stability and give an alarm prompt in time.

[0068] Specifically, the pickup vision monitoring member 332 includes a camera.

[0069] Refer to Figure 3 and Figure 6 , wherein, the repair device 4 and the feeding device 3 are arranged at intervals in the second direction. The repair device 4 includes a repair driving assembly 41 and a repair table 42, and the repair table 42 is used to support the substrate 8 to be repaired. The repair driving assembly 41 includes a cross slide and a turntable. The turntable is used to carry the substrate 8 to be repaired and drive the substrate 8 to rotate in the horizontal plane. The cross slide drives the turntable and the substrate 8 to be repaired to translate in the horizontal plane together. In this embodiment, the cross slide drives the substrate 8 to be repaired to move in the first direction and the second direction.

[0070] With such a setting, through the turntable and the cross slide, it is convenient to move the repair table 42 to the loading position and the welding device 5, avoiding interference between the loading of the substrate 8 to be repaired and the welding device 5. After the substrate 8 to be repaired is loaded onto the repair table 42, the substrate 8 to be repaired is driven to move to the welding device 5, and multiple defect points 8a are sequentially placed at the welding positions of the welding device 5, waiting for the chip a to be sent to the defect points 8a at the welding positions of the welding device 5. Therefore, the substrate 8 to be repaired realizes the station switching of loading and welding through position movement, simplifies the overall repair structure, and optimizes the processing rhythm.

[0071] Referring to Figure 3 and Figure 6 , further, the repair table 42 fixes the substrate 8 to be repaired in an adsorption form. Specifically, through holes are formed on the surface of the repair table 42, and are communicated with an external negative pressure device through the through holes to form a negative pressure state on the surface of the repair table 42, thereby adsorbing and fixing the substrate 8 to be repaired.

[0072] Referring to Figure 3 and Figure 6 , wherein, the repair device 4 further includes a repair vision detection component 43, and the repair vision detection component 43 includes a repair vision positioning member 431. The repair vision positioning member 431 is installed on the inner wall of the housing 2 through a bracket. The imaging direction of the repair vision positioning member 431 is arranged perpendicular to the surface of the repair table 42.

[0073] With the movement of the repair table 42, different positions of the substrate 8 to be repaired are moved into the visual field range of the repair vision positioning member 431. The repair vision positioning member 431 determines the position of the substrate 8 to be repaired by capturing the marking points on the surface of the substrate 8 to be repaired. In this embodiment, the repair vision positioning member 431 determines the position of the substrate 8 to be repaired and each chip a on the substrate 8 to be repaired by capturing the positions of two chips a at the diagonal corners of the substrate 8 to be repaired. It is convenient to determine the specific position of the defect point 8a and accurately move the defect point 8a to the welding position of the welding device 5.

[0074] Further, by imaging the chip a on the substrate 8 to be repaired and synchronously adjusting the position of the substrate 8 to be repaired, the length direction and width direction of the chip a on the substrate 8 to be repaired are respectively arranged along the first direction and the second direction.

[0075] With such a setting, through the correction of the position of the chip a on the substrate 8 to be repaired, the length direction and width direction of the chip a on the substrate 8 to be repaired are made consistent with the length direction and width direction of the chip a picked up by the transfer device 6. When the transfer device 6 places the chip a at the defect point 8a, the placement state of the chip a at the defect point 8a is consistent with the placement state of the other chips a on the substrate 8 to be repaired, ensuring the accuracy of placing the chip a at the defect point 8a and improving the consistency of multiple repairs.

[0076] In this embodiment, the repair vision positioning member 431 includes a camera or a camera group, and the camera group includes at least one high-magnification camera and at least one wide-angle camera.

[0077] Refer to Figure 3 and Figure 6 , wherein, the repair vision detection component 43 further includes a placement vision monitoring member 432. The placement vision monitoring member 432 is fixed to the inner wall of the housing 2 through a bracket. The imaging direction of the placement vision monitoring member 432 is arranged obliquely to the surface of the substrate 8 to be repaired. The placement vision monitoring member 432 images the defective points 8a where the chip is to be placed. When placing the chip a, the imaging position of the placement vision monitoring member 432 coincides with the welding position of the welding device 5. By moving the substrate 8 to be repaired, when the defective points 8a on the substrate 8 to be repaired are placed at the welding position, the transfer device 6 places the chip a at the defective points 8a. At this time, the placement vision monitoring member 432 images the placement process of the chip a.

[0078] With such a setting, during the transfer and testing process of the chip a, by monitoring the placement process of the chip a, it is convenient to timely detect problems in the placement and is suitable for adjusting the parameters of the transfer device 6 when placing the chip a. During the actual repair process, by monitoring the placement of the chip a, it is convenient to timely detect that the chip a is placed offset, or even the situation where the chip a cannot be separated from the transfer device 6, and give a timely feedback alarm.

[0079] Specifically, the placement vision monitoring member 432 includes a camera.

[0080] Among them, the repair table 42 is adapted to carry the substrate 8 to be repaired and move in the second direction, so that the substrate 8 to be repaired is located below the welding device 5, and by changing the position of the substrate 8 to be repaired in the first direction and the second direction, a plurality of defective points 8a on the substrate 8 to be repaired are sequentially located at the welding positions of the welding device 5.

[0081] With such a setting, by changing the position of the substrate 8 to be repaired, the substrate 8 to be repaired is located at the welding position, so as to repair the defective points 8a on the substrate 8 to be repaired in sequence.

[0082] Refer to Figure 2 and Figure 3 , wherein, the transfer device 6 includes a transfer rack 63, a transfer drive assembly 61 and an adsorption assembly 62. The transfer drive assembly 61 drives the adsorption assembly 62 to pick up the chip a on the spare substrate 7 and send the chip a to the defective points 8a at the welding device 5.

[0083] Refer to Figure 2 and Figure 3, specifically, the transfer rack 63 is fixed on the machine platform 1, the transfer driving component 61 is installed on the transfer rack 63, and the transfer driving component 61 drives the adsorption component 62 to move in the second direction, so that the adsorption component 62 switches positions between the spare substrate 7 and the substrate to be repaired 8. Correspondingly, the spare substrate 7 and the substrate to be repaired 8 are driven to move, so that the chip a or the defective point 8a is placed directly below the adsorption component 62. The transfer driving component 61 drives the adsorption component 62 to descend to pick up the chip a or place the chip a at the defective point 8a. In addition, the transfer driving component 61 can drive the adsorption component 62 to move in the first direction, and cooperate with the movement of the spare substrate 7 and the substrate to be repaired 8 in the first direction to ensure that the movement range of the adsorption component 62 covers all the spare substrates 7 and the substrates to be repaired 8.

[0084] In this embodiment, the transfer driving component 61 includes two linear modules. The two linear modules are combined, one of which moves up and down, and the other moves in the first direction to drive the adsorption component 62 to move in the vertical direction and the first direction. Among them, the linear module includes a lead screw mechanism or a linear motor. The driving end of the transfer driving component 61 is a mounting bracket, and the adsorption needle tube 621 is installed on the mounting bracket.

[0085] Refer to Figures 6 - 9 , in this embodiment, the adsorption component 62 includes an adsorption needle tube 621. The adsorption needle tube 621 picks up the chip a by means of negative pressure pumping, and breaks the vacuum between the chip a and the adsorption needle tube 621 by means of positive pressure ventilation.

[0086] With such a setting, since the chip a is adsorbed and picked up by the adsorption needle tube 621, the tip size of the adsorption needle tube 621 is small, and it can be just pressed on the surface of the chip a to be picked up. Moreover, the adsorption needle tube 621 can be further lowered to press the chip a tightly, which not only facilitates ensuring the vacuum degree between the chip a and the adsorption needle tube 621, but also ensures that when welding, the adsorption needle tube 621 presses the chip a tightly at the defective point 8a, so as to ensure that the chip a is accurately installed at the defective point 8a and ensure the repair quality.

[0087] In this embodiment, the inner diameter of the tip of the adsorption needle tube 621 is 5-15 microns, and the orthographic projection of the tip of the adsorption needle tube 621 on the chip a all falls on the surface of the chip a.

[0088] Refer to Figures 6 - 9 , further, the adsorption component 62 further includes a sliding seat 622 and a pressure sensing member 623. The sliding seat 622 is arranged on the driving end of the transfer driving component 61 through a slide rail group to lift and slide.

[0089] With such a setting, as the adsorption syringe 621 descends and touches the chip a, during the process of the adsorption syringe 621 contacting the chip a, the adsorption syringe 621 gradually rises relative to the transfer driving assembly 61 along with the sliding seat 622, thus avoiding a hard collision between the adsorption syringe 621 and the chip a and preventing damage to the adsorption syringe 621 and the chip a. Additionally, when placing the chip a at the defect position 8a, during the process of the adsorption syringe 621 carrying the chip a to contact the pad at the defect position 8a, after the chip a contacts the pad, the chip a rises relative to the transfer driving assembly 61 along with the sliding seat 622, thus avoiding a hard collision between the chip a and the pad and preventing damage to the chip a.

[0090] Referring to Figures 6 - 9 , the pressure sensing member 623 is installed at the driving end of the transfer driving assembly 61, and the sliding seat 622 is connected to the measuring end of the pressure sensing member 623. In this embodiment, the sliding seat 622 is rigidly connected to the measuring end of the pressure sensing member 623 through a rod member to measure the force generated when the sliding seat 622 moves relative to itself. In this embodiment, the pressure sensing member 623 includes a pressure sensor.

[0091] With such a setting, through the measurement of the pressure sensing member 623, it is possible to know the pressure exerted on the chip a when the adsorption syringe 621 picks up the chip a. On the one hand, it indicates that the adsorption syringe 621 has contacted the chip a. On the other hand, by presetting the force with which the adsorption syringe 621 presses on the chip a, it is ensured that the adsorption syringe 621 adheres tightly to the chip a, ensuring the vacuum degree between the adsorption syringe 621 and the chip a and ensuring stable adsorption and picking up of the chip a.

[0092] By stably adsorbing the chip a, it is ensured that during the transfer process of the chip a, the chip a does not move relative to the adsorption syringe 621. Therefore, it can be ensured that the chip a is placed at the defect position 8a in the predetermined length and width directions, ensuring the placement accuracy of the chip a and improving the repair quality.

[0093] In addition, when the adsorption syringe 621 places the chip a at the defect position 8a, the force with which the chip a is pressed against the defect position 8a can also be measured, thereby ensuring that the chip a is stably placed at the defect position 8a and is not prone to displacement of the chip a, thereby improving the installation accuracy of the chip a.

[0094] Referring to Figures 6 - 9 , further, the adsorption assembly 62 further includes a connecting rod 624, and the connecting rod 624 is horizontally placed. The adsorption syringe 621 is connected to the sliding seat 622 through the connecting rod 624, and the sliding seat 622 and the adsorption syringe 621 are respectively located at opposite ends of the connecting rod 624. The adsorption syringe 621 is inserted and fixed at one end of the connecting rod 624.

[0095] With such an arrangement, the adsorption syringe 621 is connected to the sliding seat 622 by the connecting rod 624. In the horizontal direction, the distance between the adsorption syringe 621, the sliding seat 622, and the transfer driving assembly 61 is lengthened. Therefore, when the chip a is transferred to the defective position 8a by the adsorption syringe 621, since the defective position 8a is located at the welding position of the welding device 5, the connecting rod 624 prevents the transfer driving assembly 61 and the sliding seat 622 from interfering with the welding device 5 in terms of position, and also prevents the transfer driving assembly 61 and the sliding seat 622 from blocking the welding device 5, ensuring the normal progress of welding.

[0096] Referring to Figures 6 - 9 , further, the adsorption assembly 62 further includes an elastic member 625. The elastic member 625 connects the adsorption syringe 621 and the driving end of the transfer driving assembly 61, that is, the adsorption syringe 621 is elastically slidably arranged on the mounting frame. The elastic force of the elastic member 625 cancels part or all of the gravity of the load components of the elastic member 625. In this embodiment, the elastic member 625 is connected to the sliding seat 622 and the driving end of the transfer driving assembly 61. The load components of the elastic member 625 include the sliding seat 622 and the adsorption syringe 621, and the elastic force of the elastic member 625 cancels part or all of the gravity of the adsorption syringe 621 and the sliding seat 622. Preferably, the elastic force of the elastic member 625 cancels all of the gravity of the adsorption syringe 621 and the sliding seat 622.

[0097] With such an arrangement, under the traction of the elastic member 625, the self - gravity of the sliding seat 622 and the adsorption syringe 621 is not likely to be overly loaded on the pressure sensing member 623, and the pressure sensing member 623 is not likely to be damaged due to long - term loading, thereby protecting the pressure sensing member 623.

[0098] In addition, the elastic force of the elastic member 625 restricts the position of the sliding seat 622, preventing the sliding seat 622 from rising and falling randomly, and ensuring the stability of the transfer of the chip a during the transfer process of the chip a. Moreover, it is convenient to determine the height of the adsorption syringe 621, and accurately control the lifting height of the adsorption syringe 621.

[0099] In this embodiment, the elastic member 625 includes one or more of a spring, an elastic sheet, and an elastic pin.

[0100] In this embodiment, when the adsorption syringe 621 is connected to the sliding seat 622 through the connecting rod 624, the elastic force of the elastic member 625 cancels part or all of the gravity of the sliding seat 622, the adsorption syringe 621, and the connecting rod 624.

[0101] Referring to Figure 2 , preferably, there are two sets of transfer devices 6. The two sets of transfer devices 6 are arranged at intervals in the first direction and are respectively arranged close to the opposite two edges of the machine table 1. By using the two sets of transfer devices 6 to transfer the chip a, the transfer efficiency of the chip a is improved, and the repair efficiency is also improved.

[0102] Specifically, while one transfer device 6 picks up chip a, the other transfer device 6 is in a state of placing chip a at the defect position 8a and fixing chip a. The processing cycle is optimized and the repair efficiency is improved.

[0103] Referring to Figure 3 and Figure 6 , wherein the soldering device 5 includes a laser 51, and the laser 51 is fixed to the housing 2 through a bracket. The optical path of the emitted light of the laser 51 is arranged obliquely to the plane where the substrate 8 to be repaired is located, so that the emitted light avoids the adsorption needle tube 621 and irradiates the surface of chip a.

[0104] Specifically, after the adsorption needle tube 621 picks up and transfers chip a to the defect position 8a, the adsorption needle tube 621 presses down chip a and maintains chip a in a pressed state. At this time, the soldering device 5 heats chip a in the form of laser, thereby soldering and fixing chip a.

[0105] With such a setting, on the one hand, the repair table 42 drives the substrate 8 to be repaired to bring the defect position 8a to the soldering position of the soldering device 5 in advance. When chip a is placed at the defect position 8a, the soldering and fixing operation can be carried out, and the alignment process between the defect position 8a and the soldering device 5 is completed in advance, saving processing time.

[0106] On the other hand, the adsorption needle tube 621 presses chip a against the defect position 8a and maintains the pressed state. At the same time, the soldering device 5 uses laser to heat chip a to melt the solder flux, thereby fixing chip a. Due to the pressing action of the adsorption needle tube 621, chip a is not easily displaced or poorly soldered during the soldering and fixing process, ensuring the installation accuracy and fixing quality of chip a.

[0107] On the third hand, the soldering device 5 is in a fixed position, and the light spot generated by the laser emitted by the soldering device 5 on the substrate 8 to be repaired remains unchanged. Therefore, as different defect positions 8a move to the soldering position of the soldering device 5, the light spots generated by the soldering device 5 at the defect positions 8a are all the same, ensuring that the energy for heating chip a each time is consistent, and improving the soldering consistency. The soldering device 5 does not need to move its position, ensuring that the light spot emitted by the soldering device 5 on the substrate 8 to be repaired remains unchanged.

[0108] On the fourth hand, the optical path of the emitted laser of the soldering device 5 is arranged obliquely to the adsorption needle tube 621, avoiding the occlusion of the adsorption needle tube 621 and the connecting rod 624, improving the energy uniformity of the light spot irradiated on chip a, improving the heating uniformity of chip a, and improving the soldering quality.

[0109] Referring to Figure 10, Further, the welding device 5 includes two lasers 51. The two lasers 51 respectively emit lasers to the chip a from opposite sides of the adsorption needle tube 621, and the two light spots formed by the two lasers 51 on the chip a overlap.

[0110] With such an arrangement, since the light spot obliquely irradiated on the surface of the chip a is elliptical, and the energy of the part of the light spot close to the laser 51 is slightly stronger. Therefore, two lasers 51 are used to irradiate two overlapping light spots. The region with stronger energy of one light spot overlaps with the region with weaker energy of the other light spot. Thus, the energy uniformity of the overlapping light spot is better, and the welding quality is ensured.

[0111] Further, the connecting rod 624 is a light-transmitting rod to reduce the blockage of the laser.

[0112] Refer to Figure 11 , In other embodiments, the welding device 5 includes a laser 51, a light-transmitting pressing block 52, and a pressing block driving assembly 53. The laser 51 emits a laser vertically towards the chip a at the defect position 8a. The light-transmitting pressing block 52 is located below the laser 51, and the pressing block driving assembly 53 is installed on the laser 51. The pressing block driving assembly 53 drives the light-transmitting pressing block 52 to extend to the optical path of the laser emitted by the laser 51 and presses the light-transmitting pressing block 52 against the chip a.

[0113] Specifically, after the chip a is placed at the defect position 8a by the adsorption needle tube 621, the pressing block driving assembly 53 drives the light-transmitting pressing block 52 to press against the chip a, so that the chip a is pressed against the defect position 8a. The laser emitted by the laser 51 passes through the light-transmitting pressing block 52 and irradiates the surface of the chip a, thereby heating the chip a to weld and fix the chip a.

[0114] With such an arrangement, the light-transmitting pressing block 52 is used to press the chip a, and the laser emitted by the laser 51 directly irradiates the surface of the chip a. The energy intensity of the light spot on the surface of the chip a is more uniform, thereby improving the welding quality.

[0115] In this embodiment, the pressing block driving assembly 53 includes two linear modules. One linear module drives the light-transmitting pressing block 52 to move up and down, and the other linear module drives the light-transmitting pressing block 52 to move horizontally. The two linear modules are combined. In this embodiment, the linear module includes a linear motor or a lead screw mechanism.

[0116] Further, a part of the light-transmitting pressing block 52 is arranged in a convex shape downward to use the convex part to press the chip a and avoid interference with other chips a.

[0117] An embodiment of the present application provides a repair device for a display panel. When transferring chip a, the adsorption component 62 moves above the spare chip a, the adsorption component 62 presses down and adsorbs chip a to pick up chip a, and transfers chip a to the defective position 8a of the substrate 8 to be repaired. Since chip a is adsorbed and picked up by the adsorption needle tube 621, the tip size of the adsorption needle tube 621 is small, which can only be pressed on the surface of the chip a to be picked up, and the adsorption needle tube 621 can be further lowered to press tightly on chip a, which not only facilitates ensuring the vacuum degree between chip a and the adsorption needle tube 621, but also ensures that when welding, the adsorption needle tube 621 presses chip a tightly at the defective position 8a, so as to ensure that chip a is accurately installed at the defective position 8a and ensure the repair quality.

[0118] Further, the defective position 8a to be repaired moves to the welding position of the welding device 5 as the repair table 42 moves, and the adsorption needle tube 621 transfers chip a to the defective position 8a. After chip a is transferred to the defective position 8a, welding can be carried out immediately. It is convenient to directly press chip a tightly by the adsorption needle tube 621. When chip a is welded and fixed, it is not easy to shift, which ensures the fixing quality of chip a and improves the repair efficiency. In addition, since the position of the welding device 5 does not change, when the defective positions 8a are repaired in sequence, the relative positions of the welding device 5 and different defective positions 8a on the substrate 8 to be repaired are consistent, which ensures better repair consistency and ensures the repair quality.

[0119] In a second aspect, a repair system for a display panel is provided, including the repair device for a display panel as described above.

[0120] Another embodiment of the present application provides a repair system for a display panel. Since it includes the above-mentioned repair device for a display panel, the beneficial effects of this repair system for a display panel are the same as those of the above-mentioned repair device for a display panel, and will not be elaborated here.

[0121] In the description of the present application, it should be understood that the positive direction of "X" in the drawings represents the right side, and correspondingly, the reverse direction of "X" represents the left side; the positive direction of "Y" represents the front, and correspondingly, the reverse direction of "Y" represents the rear; the orientation or positional relationship indicated by the terms "X", "Y", etc. is based on the orientation or positional relationship shown in the drawings of the specification, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0122] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. Unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0123] It should be noted that in the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0124] The above description is only the specific implementation manners of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A repair device for a display panel, characterized in that, It includes: A feeding device, the feeding device comprising a feeding drive assembly and a feeding table, the feeding table is used to support the spare substrate, and the feeding drive assembly drives the feeding table to translate and rotate in a horizontal plane; A repair device, the repair device comprising a repair drive assembly and a repair table, the repair table is used to support the substrate to be repaired, and the repair drive assembly drives the repair table to translate and rotate in a horizontal plane; A welding device, wherein the repair station is suitable for placing the plurality of defective points of the substrate to be repaired at the welding position of the welding device in sequence; The transfer device comprises a transfer drive component and an adsorption component, wherein the adsorption component comprises an adsorption needle tube for adsorbing the chip, and the transfer drive component drives the adsorption component to pick up the chip on the spare substrate and deliver the chip to the defective point at the welding device.

2. The repair device for the display panel according to claim 1, wherein, The adsorption assembly also includes: A sliding seat, the sliding seat is lifted and slidably arranged at the driving end of the transfer driving component, and the adsorption needle tube is installed on the sliding seat; A pressure sensor is installed at the driving end of the transfer drive assembly, and the sliding seat is connected to the measuring end of the pressure sensor.

3. The repair device for a display panel according to claim 1, characterized in that, The adsorption assembly further comprises a connecting rod, through which the adsorption needle tube is connected to the sliding seat, and the sliding seat and the adsorption needle tube are respectively located at opposite ends of the connecting rod.

4. The repair device for a display panel according to any one of claims 1 to 3, characterized in that The adsorption component also includes an elastic member, which connects the adsorption needle tube to the driving end of the transfer driving component, and the elastic force of the elastic member offsets part or all of the gravity of the load component of the elastic member.

5. The repair device for a display panel according to claim 1 or 3, characterized in that, The welding device comprises a laser, and the optical path of the emitted light of the laser is inclined to the plane where the substrate to be repaired is located, so that the emitted light avoids the adsorption needle tube and irradiates the chip surface.

6. The repair device for the display panel according to claim 5, wherein, The welding device comprises two lasers, which respectively emit lasers from opposite sides of the adsorption needle tube to the chip, and two light spots formed by the two lasers on the chip overlap.

7. The repair device for a display panel according to claim 1 or 3, characterized in that, The welding device comprises: A laser, wherein the laser emitted by the laser is vertically directed toward the chip at the defect point; A light-transmitting pressing block, the light-transmitting pressing block is located below the laser; A pressing block driving component is installed on the laser, and the pressing block driving component drives the light-transmitting pressing block to extend to the optical path of the laser emitted by the laser, and presses the light-transmitting pressing block against the chip.

8. The repair device for a display panel according to claim 1, characterized in that, The feeding device further comprises a feeding visual detection component, and the feeding visual detection component comprises: A feeding visual positioning member, the feeding visual positioning member is located above the feeding table, and the feeding visual positioning member captures the marking point on the spare substrate; A picking visual monitoring component is located above the feeding table, the imaging direction of the picking visual monitoring component is inclined to the plane where the spare substrate is located, and the picking visual monitoring component images the chip to be picked up.

9. The repair device for a display panel according to claim 1, wherein, The repair device also includes a repair visual detection component, and the repair visual detection component includes: Repair vision positioning member, the repair vision positioning member is located above the repair table, and the repair vision positioning member is used to capture the marking points on the substrate to be repaired; Placement vision monitoring member, the placement vision monitoring member is located above the repair table, the imaging direction of the placement vision monitoring member is inclined to the plane where the substrate to be repaired is located, and the placement vision monitoring member images the defective positions where the chips will be placed.

10. A repair system for a display panel, characterized in that, A repair device including a display panel according to any one of claims 1 to 9.

Images