Micro LED mass transfer device and transfer method

Abstract

The invention provides a Micro LED mass transfer device and method. The Micro LED mass transfer device specifically comprises a moving assembly, a clamping assembly and a transfer mechanism. And clamping force is provided through the clamping air cylinder, so that the material ring is clamped on the clamping part by the first clamping plate, and the stability and the reliability of the chip in the transferring process are guaranteed. Under the clamping acting force of the first clamping plate, the clamping force of the material ring is further increased through the elastically embedded second clamping plate, and meanwhile, the pressure applied to the chip can be dispersed, and the stress concentration phenomenon is reduced, so that the problems of breakage, cracks and the like of the chip caused by excessive pressure of a poke needle are reduced. Due to the fact that the first clamping plate and the second clamping plate are used in cooperation, the material ring transfer device can be matched with material rings in irregular shapes, and the flexibility of the transfer process is improved. Through practical cooperation of the poke needle and the transfer assembly, rapid and accurate chip mass transfer can be realized. Therefore, the technical problem that in the prior art, the clamping force of the material ring is insufficient in mass transfer of chips is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip transfer, and particularly to a Micro LED mass transfer device and a transfer method. Background Art

[0002] As the next-generation display technology, Micro LED (micro light-emitting diode) display technology has many advantages such as high brightness, high contrast, fast response time, and low power consumption, and has gradually become a hot spot in application fields such as displays, televisions, smart wearable devices, and augmented reality (AR) and virtual reality (VR). The mass transfer technology is one of the manufacturing processes of Micro LED.

[0003] In the prior art, during the Micro LED mass transfer process, the blue film chips are installed on the material ring and clamped by a cylinder. Then, the blue film chips are punctured by a puncture needle to transfer a large number of Micro LED chips from the growth substrate to the target substrate. However, with the above processing method, when the air pressure of the cylinder is unstable, the clamping force of the clamping cylinder is insufficient, and it is impossible to provide enough pressure to fasten the material ring, resulting in the chips not being able to maintain an accurate position during the transfer process, thereby affecting the efficiency and yield of the chip mass transfer. Summary of the Invention

[0004] The purpose of the present invention is to provide a Micro LED mass transfer device and a transfer method, which solve the technical problem of insufficient clamping force of the material ring in the chip mass transfer in the prior art.

[0005] To achieve this purpose, the present invention adopts the following technical solutions: According to a first aspect, the present invention discloses a Micro LED mass transfer device, including: a moving component, a clamping component, and a transfer mechanism. The moving component is disposed adjacent to the transfer mechanism, and the moving component is used to drive the clamping component to perform a moving operation; the clamping component includes a clamping table, a clamping cylinder is installed on the clamping table, and a first clamping plate is fixedly connected to the telescopic rod of the clamping cylinder; Wherein, a clamping portion is provided at the bottom of the clamping table, a material ring is clamped between the clamping portion and the first clamping plate, and a blue film is installed at the bottom of the material ring; a second clamping plate is elastically embedded in the first clamping plate, and the second clamping plate abuts against the outer wall of the material ring; The transfer mechanism includes a puncture needle and a transfer component, and the transfer component is used to drive the puncture needle to perform a chip transfer operation on the blue film; a through hole for accommodating the puncture needle to pass through is provided on the clamping table.

[0006] Optionally, a mounting groove with a rectangular cross section is provided in the first clamping plate, the second clamping plate is slidably fitted in the mounting groove, and a mounting column is provided on the second clamping plate which is an integrally formed structure with the second clamping plate; Wherein, the mounting column sleeve is provided with a clamping spring, one end of the clamping spring is connected to the inner wall of the mounting groove, and the other end of the clamping spring is connected to the second clamping plate.

[0007] Optionally, a limiting hole is provided on the clamping platform, and a connecting platform is vertically provided on the first clamping plate, and the connecting platform passes through the limiting hole and is an integrally formed structure with the first clamping plate; Among them, the connecting platform is provided with an adsorption connecting pipe, the first clamping plate is provided with at least one first adsorption hole, the second clamping plate is provided with at least one second adsorption hole, and the adsorption connecting pipe is respectively connected with the first adsorption hole and the second adsorption hole.

[0008] Optionally, the first clamping plate is provided with a first air channel and a second air channel that are interconnected, and the connecting platform is provided with a third air channel that is interconnected with the first air channel; Wherein, the first air channel is vertically arranged with the third air channel and the angle between the first air channel and the second air channel is an obtuse angle, and the second air channel is connected with the first adsorption hole; The first clamping plate is connected to a guide column located in the mounting groove, a fourth air duct connected to the second adsorption hole is provided in the mounting column, and the guide column is embedded in the fourth air duct; a fifth air duct is provided in the guide column, one end of the fifth air duct is connected to the first air duct, and the other end of the fifth air duct is connected to the fourth air duct.

[0009] Optionally, the first clamping plate is provided with at least one placement groove, and a silicone plate is placed in the placement groove; Among them, the silicone plate and the placement groove are both arranged in an irregular shape, the silicone plate is provided with at least one first vibration-damping hole, the central area of the second clamping plate is provided with at least one irregularly arranged second vibration-damping hole, and the end of the second clamping plate is provided with at least one U-shaped or V-shaped vibration-damping groove.

[0010] Optionally, a limiting plane is provided on the clamping table, and a first plane corresponding to the limiting plane is provided on the first clamping plate; Among them, the first clamping plate is provided with a first clamping surface set in an arc shape, the installation groove is connected with the first clamping surface, and the second clamping plate is provided with a second clamping surface set in an arc shape; the clamping part is provided with a third clamping surface set in an arc shape, and the third clamping surface is respectively arranged corresponding to the first clamping surface and the second clamping surface.

[0011] Optionally, the moving component includes a first moving frame, a first moving seat is slidably connected to the first moving frame, and a first moving motor for driving the first moving seat to move along a second direction is installed in the first moving frame; Wherein, a second moving seat slides on the first moving seat, a second moving motor for driving the second moving seat to move along a third direction is installed on the first moving seat, and the second moving seat is fixedly connected to the clamping table.

[0012] Optionally, the transfer component includes a first linear module, a second linear module and a third linear module connected in sequence, and a detection camera for visually detecting the blue film is installed on the third linear module; Wherein, the first linear module is used to drive the second linear module to perform a linear movement along a first direction, the second linear module is used to drive the third linear module to perform a linear movement along a second direction, and the third linear module is used to drive the punching needle to perform a linear movement along a third direction, so that the punching needle approaches or moves away from the blue film; the first direction, the second direction and the third direction are perpendicular to each other.

[0013] Optionally, the first linear module includes a first slide table, a first slide plate is slidably connected to the first slide table, and the first slide plate is fixedly connected to a first mover; The second linear module includes a second slide table fixedly installed on the first slide plate, a second slide frame is slidably connected to the second slide table, and the second slide frame is fixedly connected to a second mover; The third linear module includes a third slide table fixedly installed on the second slide frame, a third slide plate is slidably connected to the third slide table, and the third slide plate is fixedly connected to a third mover; Wherein, the punching needle is fixedly installed on the third slide plate, the detection camera is fixedly installed on the third slide table along the third direction, the first slide table, the second slide table and the third slide table are perpendicularly distributed, and the lengths of the first slide table, the second slide table and the third slide table show a decreasing trend.

[0014] According to a second aspect, the present invention discloses a Micro LED mass transfer method, which is applied to the Micro LED mass transfer device as described in the first aspect, and includes: Step S1, obtaining a first movement path of the clamping component according to the coordinate positions of the material ring, the clamping component and the target substrate; Step S2: Based on the first movement path, the clamping component is moved to the clamping position by the moving component, so that the clamping component clamps the material ring with the blue film, and then the material ring is moved to the transfer position; wherein, several Micro LED chips are bonded to the blue film, and the blue film is located above the target substrate. Step S3: According to the coordinate positions of the target substrate and the punching needle, the second movement path of the punching needle is obtained. Step S4: Based on the second movement path, the punching needle is moved to the transfer position by the transfer component, and the punching needle is sequentially driven to perform the transfer operation to transfer the chips in a large quantity to the target substrate.

[0015] Compared with the prior art, the present invention has the following beneficial effects: A Micro LED mass transfer device and method provided by the present invention specifically include a moving component, a clamping component, and a transfer mechanism. The clamping cylinder provides a clamping force, so that the first clamping plate clamps the material ring on the clamping part, ensuring the stability and reliability of the chips during the transfer process. Under the clamping force of the first clamping plate, the second clamping plate embedded elastically further increases the clamping force of the material ring, and at the same time can disperse the pressure applied to the chips, reducing the stress concentration phenomenon, thereby reducing problems such as cracking and chipping of the chips caused by excessive pressure of the punching needle. Due to the combined use of the first clamping plate and the second clamping plate, it can adapt to irregularly shaped material rings, improving the flexibility of the transfer process. Through the practical cooperation of the punching needle and the transfer component, rapid and accurate mass transfer of chips can be achieved, thus significantly improving the transfer efficiency and production capacity of the production line and meeting the high-intensity production requirements. Therefore, the present invention solves the technical problem of insufficient clamping force of the material ring in the mass transfer of chips in the prior art. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have a technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0018] Figure 1Schematic diagram of the application structure of a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 2 Top view structure diagram of a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 3 Connection structure diagram of the moving component and the clamping component in a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 4 Semi-sectional structure diagram of the material ring and the blue film in a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 5 Exploded structure diagram of the clamping component in a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 6 Partial front view structure diagram of the clamping component in a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 7 For Figure 6 Schematic diagram of the A-A sectional structure; Figure 8 For Figure 6 Schematic diagram of the B-B sectional structure; Figure 9 Semi-sectional structure diagram of the first clamping plate and the connecting table in a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 10 Three-dimensional structure diagram of the second clamping plate in a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 11 Three-dimensional structure diagram of the transfer mechanism in a Micro LED mass transfer device disclosed in Embodiment 1 of the present invention; Figure 12 Flow chart of a Micro LED mass transfer method disclosed in Embodiment 2 of the present invention.

[0019] Illustration description: 10. Moving component; 11. First moving frame; 12. First moving seat; 13. First moving motor; 14. Second moving seat; 15. Second moving motor; 20. Clamping assembly; 21. Clamping table; 211. Clamping part; 2111. Third clamping surface; 212. Through hole; 213. Limit hole; 214. Limit plane; 22. Clamping cylinder; 23. First clamping plate; 231. Installation groove; 232. First adsorption hole; 233. First air duct; 234. Second air duct; 235. Placing groove; 236. First plane; 237. First clamping surface; 24. Second clamping plate; 241. Installation post; 2411. Fourth air duct; 242. Second adsorption hole; 243. Second damping hole; 244. Damping groove; 245. Second clamping surface; 25. Clamping spring; 26. Connection table; 261. Third air duct; 27. Adsorption connecting pipe; 28. Guide post; 281. Fifth air duct; 29. Silicone plate; 291. First damping hole 30. Transfer mechanism; 31. Poking needle; 32. First linear module; 321. First slide; 322. First slide plate; 323. First mover; 33. Second linear module; 331. Second slide; 332. Second slide frame; 333. Second mover; 34. Third linear module; 341. Third slide; 342. Third slide plate; 343. Third mover; 35. Detection camera 40. Material ring; 50. Blue film Detailed implementation manners

[0020] To make the objectives, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be an intermediate component present at the same time

[0022] The technical solutions of the present invention will be further described below with reference to the accompanying drawings and through specific implementation manners

[0023] Embodiment 1: The embodiment of the present invention provides a Micro LED mass transfer device, asFigures 1 to 11 As shown in the figure, it includes: a moving component 10, a clamping component 20, and a transfer mechanism 30. The moving component 10 is arranged adjacent to the transfer mechanism 30, and the moving component 10 is used to drive the clamping component 20 to perform a moving operation; the clamping component 20 includes a clamping table 21, a clamping cylinder 22 is installed on the clamping table 21, and a first clamping plate 23 is fixedly connected to the telescopic rod of the clamping cylinder 22; Among them, a clamping portion 211 is provided at the bottom of the clamping table 21, a material ring 40 is clamped between the clamping portion 211 and the first clamping plate 23, and a blue film 50 is installed at the bottom of the material ring 40; a second clamping plate 24 is elastically embedded in the first clamping plate 23, and the second clamping plate 24 abuts against the outer wall of the material ring 40; in this embodiment, the material ring 40 is made of a high-strength polymer, aluminum alloy or stainless steel material; The transfer mechanism 30 includes a punching needle 31 and a transfer component, and the transfer component is used to drive the punching needle 31 to perform a chip transfer operation on the blue film 50; a through hole 212 for accommodating the punching needle 31 to pass through is provided on the clamping table 21.

[0024] It should be noted that a Micro LED mass transfer device provided by the present invention specifically includes a moving component 10, a clamping component 20, and a transfer mechanism 30. By providing a clamping force through the clamping cylinder 22, the first clamping plate 23 clamps the material ring 40 on the clamping portion 211, ensuring the stability and reliability of the chip during the transfer process. Under the clamping force of the first clamping plate 23, through the elastically embedded second clamping plate 24, the clamping force of the material ring 40 is further increased, and at the same time, the pressure applied to the chip can be dispersed, reducing the stress concentration phenomenon, thereby reducing problems such as chip cracking and cracking caused by excessive pressure of the punching needle 31. Due to the combined use of the first clamping plate 23 and the second clamping plate 24, it can adapt to the irregularly shaped material ring 40, improving the flexibility of the transfer process. Through the practical cooperation of the punching needle 31 and the transfer component, rapid and accurate chip mass transfer can be achieved, thereby significantly improving the transfer efficiency and production capacity of the production line and meeting the high-intensity production requirements. Therefore, the present invention solves the technical problem of insufficient clamping force of the material ring 40 in the existing chip mass transfer technology.

[0025] As Figures 5 to 9 shown in the figure, an installation groove 231 with a rectangular cross-section is provided in the first clamping plate 23, the second clamping plate 24 is slidably fitted in the installation groove 231, and an installation column 241 integrally formed with the second clamping plate 24 is provided on the second clamping plate 24; Among them, a clamping spring 25 is sleeved on the installation column 241, one end of the clamping spring 25 is connected to the inner wall of the installation groove 231, and the other end of the clamping spring 25 is connected to the second clamping plate 24.

[0026] Specifically, during the clamping operation, the material ring 40 is arranged in a circular ring shape. In the initial state, the clamping spring 25 is in a natural state and does not bear any pressure. The clamping assembly 20 is moved to the clamping position by the moving assembly 10. The clamping cylinder 22 drives the first clamping plate 23 to move towards the direction close to the clamping part 211. The second clamping plate 24 first contacts the outer wall of the material ring 40, and the material ring 40 is clamped on the clamping part 211. At the same time, the clamping spring 25 is compressed. The first clamping plate 23 continues to move until it contacts the outer wall of the material ring 40, thus realizing the clamping operation of the material ring 40.

[0027] During the release operation, the clamping assembly 20 is moved to the release position by the moving assembly 10. The clamping cylinder 22 drives the first clamping plate 23 to move away from the clamping part 211. The first clamping plate 23 first disengages from the material ring 40. The first clamping plate 23 continues to move away from the clamping part 211, and the clamping spring 25 slowly returns to the natural state. The second clamping plate 24 disengages from the material ring 40, thus realizing the release operation of the material ring 40.

[0028] It should be noted that through the buffering effect of the clamping spring 25, it is ensured that even when the clamping force changes, the clamping ability remains consistent, improving the stability and safety of clamping. Through reasonable contact force and distribution, the integrity of the chip during transfer is ensured. This clamping mechanism effectively simplifies the clamping and release processes, improves the degree of automation, reduces manual intervention, and improves production efficiency.

[0029] As Figures 5 to 9 shown, a limiting hole 213 is provided on the clamping table 21. A connecting table 26 is vertically provided on the first clamping plate 23. The connecting table 26 passes through the limiting hole 213 and is an integrally formed structure with the first clamping plate 23. In this embodiment, the connecting table 26 is fixedly connected to the moving assembly 10. The limiting hole 213 is a square hole, and the connecting table 26 is square. Among them, an adsorption connecting pipe 27 is provided on the connecting table 26. At least one first adsorption hole 232 is provided on the first clamping plate 23, and at least one second adsorption hole 242 is provided on the second clamping plate 24. The adsorption connecting pipe 27 is respectively communicated with the first adsorption hole 232 and the second adsorption hole 242. In this embodiment, the number of the first adsorption holes 232 is set to be multiple. The first adsorption holes 232 and the second adsorption holes 242 are both used to adsorb the material ring 40. Along the direction away from the second adsorption hole 242, the distance between two adjacent first adsorption holes 232 gradually decreases. The adsorption connecting pipe 27 is externally connected to a common vacuum pumping device in the art, which will not be elaborated here.

[0030] It should be noted that it is connected to an external vacuum pumping device through the adsorption connection pipe 27. When the device is started and a negative pressure is formed, the first adsorption hole 232 and the second adsorption hole 242 connected to the adsorption connection pipe 27 quickly generate an adsorption force. Under this negative pressure, the material ring 40 is tightly clamped and adsorbed on the clamping assembly 20. Through the adsorption force generated by the device, it is ensured that the material ring 40 can be firmly clamped on the clamping assembly 20 to avoid deviation or dropping during the transfer process. The diverse layout of the adsorption holes can adapt to material rings 40 of different sizes and shapes, with wide applicability.

[0031] As Figures 5 to 9 shown, a first air passage 233 and a second air passage 234 that communicate with each other are provided in the first clamping plate 23, and a third air passage 261 that communicates with the first air passage 233 is provided in the connecting platform 26; Among them, the first air passage 233 is vertically arranged with the third air passage 261 and the included angle with the second air passage 234 is an obtuse angle, and the second air passage 234 communicates with the first adsorption hole 232; The first clamping plate 23 is connected with a guide post 28 located in the installation groove 231. A fourth air passage 2411 that communicates with the second adsorption hole 242 is provided in the installation post 241, and the guide post 28 is embedded in the fourth air passage 2411; a fifth air passage 281 is provided in the guide post 28. One end of the fifth air passage 281 communicates with the first air passage 233, and the other end of the fifth air passage 281 communicates with the fourth air passage 2411. In this embodiment, the guide post 28 and the first clamping plate 23 can be fixedly connected or integrally formed. The fifth air passage 281 is vertically arranged with the first air passage 233.

[0032] It should be noted that through the settings of the first air passage 233, the second air passage 234, the third air passage 261, the fourth air passage 2411 and the fifth air passage 281, it is convenient to realize the air path connection between the adsorption pipe and the first adsorption hole 232 and the second adsorption hole 242 respectively. Since the adsorption connection pipe 27 is located on the end face of the connecting platform 26, when the clamping assembly 20 moves in the direction of approaching or moving away from the material ring 40, there will be no movement interference. Through a reasonable air passage design, the air flow is smoother during the clamping process. In addition, through the adsorption settings of the first adsorption hole 232 and the second adsorption hole 242, when fine debris appears on the outer wall surface of the material ring 40 due to multiple clamping contacts, it can be sucked away in time, making the clamping of the first clamping plate 23 and the second clamping plate 24 on the material ring 40 tighter.

[0033] In summary, through the obtuse angle configuration between the first air duct 233 and the second air duct 234, and the perpendicular setting between the first air duct 233 and the third air duct 261, the distribution and flow path of the air flow are ensured to have a certain flexibility. The air flow can not only effectively flow to the adsorption holes, but also remain uniform without interference, avoiding reverse flow or interference of the air flow, and ensuring the balanced adsorption force of the first adsorption hole 232 and the second adsorption hole 242. The fifth air duct 281 is perpendicular to the first air duct 233, which can effectively reduce the vibration interference caused by the air flow and avoid the vibration conduction to the adsorption system. Especially in the rapid clamping or transfer operation, the layout of the air ducts reduces the unexpected mechanical interference caused by the air flow vibration, further ensuring the stability and accuracy of the clamping force. Through the collaborative setting of the first air duct 233, the second air duct 234, the third air duct 261, the fourth air duct 2411 and the fifth air duct 281, not only the distribution of the air flow is optimized, the adsorption capacity of the first adsorption hole 232 and the second adsorption hole 242 is improved, but also the vibration interference is effectively reduced, ensuring the stability of the material ring 40 during the transfer process. The precise connection and layout between the air ducts enable the system to achieve efficient and stable adsorption and fixation during the transfer of Micro LED chips, avoiding uneven adsorption and vibration interference caused by conventional air flows, thus greatly improving the transfer accuracy and reliability of the chips.

[0034] As Figures 5 to 9 shown, at least one placement groove 235 is formed through the first clamping plate 23, and a silica gel plate 29 is placed in the placement groove 235; in this embodiment, the silica gel plate 29 can effectively absorb the vibration and impact generated during the clamping process, and the shape of the silica gel plate 29 is set to an irregular state to better adapt to the boundary of the placement groove 235 and improve the contact area and vibration damping effect; Among them, both the silica gel plate 29 and the placement groove 235 are set in an irregular shape. At least one first vibration damping hole 291 is formed on the silica gel plate 29. At least one second vibration damping hole 243 in an irregular shape is provided in the central area of the second clamping plate 24, and at least one vibration damping groove 244 in a U shape or a V shape is provided at the end of the second clamping plate 24.

[0035] It should be noted that since the silica gel plate 29 is placed in the first placement groove 235, it can absorb the low-frequency vibration of the material ring 40. The first damping holes 291 on the silica gel plate 29 further enhance the damping effect, reduce the propagation of low-frequency vibration, avoid these vibrations from affecting the stability of the chip, and ensure that the material ring 40 remains stable during the clamping and transfer processes. By providing the second damping holes 243 on the second clamping plate 24, the second damping holes 243 can absorb high-frequency vibration and avoid these vibrations from interfering with the precise positioning and transfer operations of the chip. Since at least one damping groove 244 in the shape of a U or V is provided at the end of the second clamping plate 24, it helps to reduce the transmission of high-frequency vibration; it can ensure that the chip remains in a stable state, thereby improving the accuracy and success rate of the massive transfer of the chip.

[0036] In summary, through the arrangement of the silica gel plate 29 and the first damping holes 291, the low-frequency vibration generated during the clamping process and the transfer process is effectively absorbed, making it difficult for the vibration to conduct to the adsorption holes; the second damping holes 243 and the damping grooves 244 (especially the design of the U-shaped or V-shaped grooves) can effectively absorb and disperse high-frequency vibration, weaken the influence of high-frequency vibration on the adsorption holes, ensure that the material ring maintains an accurate position during the adsorption process, and thus reduce the chip misalignment or damage caused by minute vibration. During the adsorption process, the silica gel plate 29 and the damping structure cooperate with each other to effectively eliminate the fluctuations of the clamping force and the adsorption force, making the adsorption process smoother and reducing the offset or loosening of the material ring caused by vibration.

[0037] As Figures 5 to 10 shown, a limiting plane 214 is provided on the clamping table 21, and a first plane 236 corresponding to the limiting plane 214 is provided on the first clamping plate 23; Among them, a first clamping surface 237 arranged in an arc shape is provided on the first clamping plate 23, and the installation groove 231 communicates with the first clamping surface 237. A second clamping surface 245 arranged in an arc shape is provided on the second clamping plate 24; a third clamping surface 2111 arranged in an arc shape is provided on the clamping portion 211, and the third clamping surface 2111 corresponds to the first clamping surface 237 and the second clamping surface 245 respectively.

[0038] It should be noted that by the cooperation of the limiting plane 214 and the first plane 236 on the first clamping plate 23, it can be ensured that the telescopic rod of the clamping cylinder 22 retracts in place; through the arc-shaped settings of the first clamping surface 237, the second clamping surface 245, and the third clamping surface 2111, the pressure applied to the material ring 40 during clamping is evenly distributed, and it can adapt to material rings 40 of different shapes. Especially when the outer shape of the material ring 40 is not completely regular, it can still provide a stable and balanced clamping force. This flexibility improves the adaptability of the equipment and is suitable for the transfer of chips of various different specifications. The arc-shaped surface also helps to improve the clamping stability, reduce the vibration or shaking caused by unstable clamping, and thus enhance the safety and reliability during the entire transfer process.

[0039] As Figure 1 and Figure 2 shown, the moving component 10 includes a first moving frame 11, a first moving seat 12 is slidably connected to the first moving frame 11, and a first moving motor 13 for driving the first moving seat 12 to move along a second direction is installed in the first moving frame 11; Wherein, a second moving seat 14 slides on the first moving seat 12, a second moving motor 15 for driving the second moving seat 14 to move along a third direction is installed on the first moving seat 12, and the second moving seat 14 is fixedly connected to the clamping table 21. In this embodiment, both the first moving motor 13 and the second moving motor 15 can be servo motors or stepper motors.

[0040] Specifically, in the working state, the first moving motor 13 starts to drive the first moving seat 12 to move along the second direction; at this time, the second moving motor 15 is in a stationary state, and the second moving seat 14 remains in a fixed position, ready to receive the displacement from the first moving seat 12. When the first moving seat 12 moves to a predetermined position, the second moving motor 15 starts to operate, driving the second moving seat 14 to move along the third direction, so that the clamping component 20 moves to the clamping position, and then the clamping component 20 performs a clamping operation. After the clamping component 20 clamps and fixes the material ring 40, through the movement of the moving component 10, the material ring 40 is moved to the transfer position, and the transfer component drives the punching needle 31 to perform a puncturing operation on the blue film 50, and the punching needle 31 sequentially transfers the chips on the blue film 50 to the target substrate.

[0041] It should be noted that through the hierarchical structure setting of the first moving frame 11, the first moving seat 12 and the second moving seat 14, the moving component 10 can flexibly adapt to various transfer paths and operation requirements, effectively improving the working efficiency of the clamping component 20. The modular structure makes the maintenance and replacement of the moving component 10 more convenient, reduces the equipment downtime caused by component damage, and improves the overall operation efficiency of the production line. Through the dual-motor drive setting of the first moving motor 13 and the second moving motor 15, the clamping component 20 has higher positioning accuracy, can meet the requirements of fast and high-precision chip transfer, and thus reduces the production risk caused by position deviation.

[0042] As Figure 1 、 Figure 2 and Figure 11 shown, the transfer component includes a first linear module 32, a second linear module 33 and a third linear module 34 connected in sequence, and a detection camera 35 for visually inspecting the blue film 50 is installed on the third linear module 34; the detection camera 35 is a CCD camera; Among them, the first linear module 32 is used to drive the second linear module 33 to move linearly along the first direction, the second linear module 33 is used to drive the third linear module 34 to move linearly along the second direction, and the third linear module 34 is used to drive the punching needle 31 to move linearly along the third direction, so that the punching needle 31 approaches or moves away from the blue film 50; the first direction, the second direction, and the third direction are perpendicular to each other.

[0043] Specifically, when the first linear module 32 is started, it drives the second linear module 33 to move along the first direction. When it moves to a predetermined position, the second linear module 33 starts to work and pushes the third linear module 34 to move along the second direction. After the third linear module 34 reaches the designated position, the punching needle 31 starts to move along the third direction to realize the massive transfer operation of the chip.

[0044] It should be noted that since the three linear modules are arranged perpendicular to each other, the transfer component can achieve a composite movement trajectory within a limited space, increasing the flexibility of the device. Each linear module uses a high-precision drive device to ensure position control at the micron level of accuracy, reducing the risk caused by position deviation. Combined with the vision detection system of the CCD camera, the transfer component can monitor the state of the chip in real time, automatically adjust the operation parameters, and ensure the stability and repeatability of the chip transfer process.

[0045] As Figure 1 、 Figure 2 and Figure 11 shown, the first linear module 32 includes a first slide 321, a first slide plate 322 is slidably connected to the first slide 321, and a first mover 323 is fixedly connected to the first slide plate 322; The second linear module 33 includes a second slide 331 fixedly installed on the first slide plate 322, a second carriage 332 is slidably connected to the second slide 331, and a second mover 333 is fixedly connected to the second carriage 332; The third linear module 34 includes a third slide 341 fixedly installed on the second carriage 332, a third slide plate 342 is slidably connected to the third slide 341, and a third mover 343 is fixedly connected to the third slide plate 342; Among them, the punching needle 31 is fixedly installed on the third slide plate 342, the detection camera 35 is fixedly installed on the third slide 341 along the third direction, the first slide 321, the second slide 331, and the third slide 341 are perpendicularly distributed to each other, and the lengths of the first slide 321, the second slide 331, and the third slide 341 show a decreasing trend. In this embodiment, the first mover 323, the second mover 333, and the third mover 343 are structures well known in the art and will not be elaborated here.

[0046] It should be noted that since the first slide 321, the second slide 331, and the third slide 341 are all perpendicular to each other, the transfer component can achieve precise control of the position in three-dimensional space, effectively meeting the requirements of different transfer directions. Since the lengths of the first slide 321, the second slide 331, and the third slide 341 show a decreasing trend, this structural setting optimizes the space utilization rate, reduces the overall height of the device, and improves the compactness and flexibility of the device. The slides with different lengths make the transfer path smoother and more efficient during actual operation. The detection camera 35 is fixed on the third slide 341 and can perform visual detection of the blue film 50 before the needle 31 moves. Through real-time feedback, it is ensured that the state of the blue film 50 meets the transfer requirements, thereby improving the success rate and accuracy of chip transfer.

[0047] Embodiment 2: The embodiment of the present invention provides a Micro LED mass transfer method, which is applied to the MicroLED mass transfer device as described in Embodiment 1, as Figure 12 shown, including: Step S1, according to the coordinate positions of the material ring 40, the clamping component 20, and the target substrate, obtain the first movement path of the clamping component 20; Specifically, the coordinate information of the material ring 40, the clamping component 20, and the target substrate is obtained through a positioning system commonly used in the art. Based on these data, the first movement path of the clamping component 20 is calculated. Step S1 ensures that the clamping component 20 can accurately reach the clamping position according to a predetermined trajectory, thus preparing for the clamping operation.

[0048] Step S2, based on the first movement path, move the clamping component 20 to the clamping position through the moving component 10, so that the clamping component 20 clamps the material ring 40 with the blue film 50, and then move the material ring 40 to the transfer position; wherein, a plurality of Micro LED chips are bonded on the blue film 50, and the blue film 50 is located above the target substrate; Specifically, based on the first movement path generated in step S1, the moving component 10 drives the clamping component 20 to move along the path to the clamping position. The clamping component 20 clamps the material ring 40 with the blue film 50 and ensures that the material ring 40 is stable and without deviation. Then, the clamping component 20 is continuously moved to the transfer position, and the blue film 50 is located above the target substrate, preparing for the chip transfer operation.

[0049] Step S3, according to the coordinate positions of the target substrate and the needle 31, obtain the second movement path of the needle 31; Specifically, the accurate coordinate information of the target substrate and the needle 31 is obtained through a positioning system commonly used in the art, and the second movement path of the needle 31 is calculated and determined. This path calculation ensures that the needle 31 can accurately align with the target substrate and prepare for the chip transfer operation.

[0050] Step S4: Based on the second movement path, move the punching pin 31 to the transfer position through the transfer component, and sequentially drive the punching pin 31 to perform the transfer operation to transfer a large number of chips to the target substrate.

[0051] Specifically, according to the second movement path obtained in step S3, start the transfer component to accurately move the punching pin 31 to the transfer position. When the punching pin 31 reaches the target position, drive the punching pin 31 to sequentially perform the transfer operation for each chip. Pierce the blue film 50 through the punching pin 31 to separate the Micro LED chip from the blue film 50 and accurately transfer it to the target substrate. After the transfer is completed, confirm whether the chip is successfully transferred through the vision detection system to ensure that the transfer position of each chip meets the predetermined requirements.

[0052] It should be noted that this method ensures the efficient and accurate transfer of Micro LED chips through precise path calculation and an efficient transfer system, significantly improving the transfer efficiency and the yield rate of the production line, and reducing possible operation errors and damages.

[0053] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A Micro LED mass transfer device, characterized in that, Including: A moving component (10), a clamping component (20) and a transfer mechanism (30). The moving component (10) is arranged adjacent to the transfer mechanism (30), and the moving component (10) is used to drive the clamping component (20) to perform a moving operation; the clamping component (20) includes a clamping table (21), a clamping cylinder (22) is installed on the clamping table (21), and a first clamping plate (23) is fixedly connected to the telescopic rod of the clamping cylinder (22). Wherein, a clamping portion (211) is provided at the bottom of the clamping table (21), a material ring (40) is clamped between the clamping portion (211) and the first clamping plate (23), and a blue film (50) is installed at the bottom of the material ring (40); a second clamping plate (24) is elastically embedded in the first clamping plate (23), and the second clamping plate (24) abuts against the outer wall of the material ring (40). The transfer mechanism (30) includes a punching needle (31) and a transfer component, and the transfer component is used to drive the punching needle (31) to perform a chip transfer operation on the blue film (50); a through hole (212) for accommodating the punching needle (31) to pass through is provided on the clamping table (21).

2. The Micro LED mass transfer device according to claim 1, wherein, An installation groove (231) with a rectangular cross-section is provided in the first clamping plate (23), the second clamping plate (24) is slidably fitted in the installation groove (231), and an installation column (241) integrally formed with the second clamping plate (24) is provided on the second clamping plate (24). Wherein, a clamping spring (25) is sleeved on the installation column (241), one end of the clamping spring (25) is connected to the inner wall of the installation groove (231), and the other end of the clamping spring (25) is connected to the second clamping plate (24).

3. The Micro LED mass transfer device according to claim 2, wherein, A limiting hole (213) is provided on the clamping table (21), a connecting platform (26) is vertically provided on the first clamping plate (23), and the connecting platform (26) passes through the limiting hole (213) and is integrally formed with the first clamping plate (23). Wherein, an adsorption connecting pipe (27) is provided on the connecting platform (26), at least one first adsorption hole (232) is provided on the first clamping plate (23), at least one second adsorption hole (242) is provided on the second clamping plate (24), and the adsorption connecting pipe (27) is respectively communicated with the first adsorption hole (232) and the second adsorption hole (242).

4. The Micro LED mass transfer device according to claim 3, wherein, A first air passage (233) and a second air passage (234) which are communicated with each other are provided in the first clamping plate (23), and a third air passage (261) communicated with the first air passage (233) is provided in the connecting platform (26). Wherein, the first air passage (233) is vertically arranged with the third air passage (261) and the included angle between the first air passage (233) and the second air passage (234) is an obtuse angle, and the second air passage (234) is communicated with the first adsorption hole (232). The first clamping plate (23) is connected to a guide post (28) located in the installation groove (231). A fourth air passage (2411) communicating with the second adsorption hole (242) is provided in the installation post (241), and the guide post (28) is embedded in the fourth air passage (2411). A fifth air passage (281) is provided in the guide post (28). One end of the fifth air passage (281) communicates with the first air passage (233), and the other end of the fifth air passage (281) communicates with the fourth air passage (2411).

5. The Micro LED mass transfer device according to claim 4, wherein, At least one placement groove (235) is formed through the first clamping plate (23), and a silica gel plate (29) is placed in the placement groove (235). Among them, both the silica gel plate (29) and the placement groove (235) are arranged in an irregular shape. At least one first damping hole (291) is formed in the silica gel plate (29). At least one second damping hole (243) arranged in an irregular shape is provided in the central area of the second clamping plate (24). At least one damping groove (244) in a U shape or V shape is provided at the end of the second clamping plate (24).

6. The Micro LED massive transfer device according to claim 5, wherein, A limiting plane (214) is provided on the clamping table (21), and a first plane (236) corresponding to the limiting plane (214) is provided on the first clamping plate (23). Among them, a first clamping surface (237) in an arc shape is provided on the first clamping plate (23), and the installation groove (231) communicates with the first clamping surface (237). A second clamping surface (245) in an arc shape is provided on the second clamping plate (24). A third clamping surface (2111) in an arc shape is provided on the clamping part (211), and the third clamping surface (2111) corresponds to the first clamping surface (237) and the second clamping surface (245) respectively.

7. The Micro LED mass transfer device according to claim 1, wherein, The moving assembly (10) includes a first moving frame (11). A first moving seat (12) is slidably connected to the first moving frame (11). A first moving motor (13) for driving the first moving seat (12) to move along the second direction is installed in the first moving frame (11). Among them, a second moving seat (14) slides on the first moving seat (12). A second moving motor (15) for driving the second moving seat (14) to move along the third direction is installed on the first moving seat (12), and the second moving seat (14) is fixedly connected to the clamping table (21).

8. The Micro LED mass transfer device according to claim 1, wherein, The transfer assembly includes a first linear module (32), a second linear module (33), and a third linear module (34) connected in sequence. An inspection camera (35) for visually inspecting the blue film (50) is installed on the third linear module (34). Among them, the first linear module (32) is used to drive the second linear module (33) to move linearly along the first direction, the second linear module (33) is used to drive the third linear module (34) to move linearly along the second direction, and the third linear module (34) is used to drive the punching needle (31) to move linearly along the third direction, so that the punching needle (31) approaches or moves away from the blue film (50); the first direction, the second direction, and the third direction are perpendicular to each other.

9. The Micro LED mass transfer device according to claim 8, wherein, The first linear module (32) includes a first slide (321), a first slide plate (322) is slidably connected to the first slide (321), and a first mover (323) is fixedly connected to the first slide plate (322); The second linear module (33) includes a second slide (331) fixedly installed on the first slide plate (322), a second slide carriage (332) is slidably connected to the second slide (331), and a second mover (333) is fixedly connected to the second slide carriage (332); The third linear module (34) includes a third slide (341) fixedly installed on the second slide carriage (332), a third slide plate (342) is slidably connected to the third slide (341), and a third mover (343) is fixedly connected to the third slide plate (342); Among them, the punching needle (31) is fixedly installed on the third slide plate (342), the detection camera (35) is fixedly installed on the third slide (341) along the third direction, the first slide (321), the second slide (331), and the third slide (341) are perpendicularly distributed, and the lengths of the first slide (321), the second slide (331), and the third slide (341) show a decreasing trend.

10. A method for massive transfer of Micro LEDs, applied to the Micro LED massive transfer device according to any one of claims 1 to 9, characterized in that, Including: Step S1, according to the coordinate positions of the material ring (40), the clamping assembly (20), and the target substrate, obtain the first movement path of the clamping assembly (20); Step S2, based on the first movement path, use the moving assembly (10) to move the clamping assembly (20) to the clamping position, so that the clamping assembly (20) clamps the material ring (40) with the blue film (50), and then move the material ring (40) to the transfer position; among them, several Micro LED chips are bonded to the blue film (50), and the blue film (50) is located above the target substrate; Step S3, according to the coordinate positions of the target substrate and the punching needle (31), obtain the second movement path of the punching needle (31); Step S4, based on the second movement path, use the transfer assembly to move the punching needle (31) to the transfer position, and sequentially drive the punching needle (31) to perform transfer operations to transfer a large number of chips to the target substrate.

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