Near ultraviolet enhanced sunlight full spectrum LED lamp bead and preparation method thereof

Abstract

The invention relates to the technical field of LED lamp bead devices, in particular to a near ultraviolet enhanced sunlight full spectrum LED lamp bead and a preparation method thereof.The near ultraviolet enhanced sunlight full spectrum LED lamp bead comprises a molding compound which is of a hollow structure, an inner frame is fixed to the middle of the molding compound, a bottom block is arranged at the bottom end of the molding compound, a cylinder structure is fixed to the top end of the bottom block, and welding flux is arranged at the top end of a cylinder; a chip is fixed at the top end of the solder, a contact frame is arranged at the top end of the bottom block, a lead frame is arranged at the bottom end of the bottom block, and a lens group is arranged on the outer side of the contact frame, so that an emergent spectrum is fuller; meanwhile, the fluorescent glue layers are arranged to be of a stacked multi-layer structure, the wavelength of emergent light excited from the lowest fluorescent glue layer to the uppermost fluorescent glue layer is gradually shortened, that is, light with the long wavelength is excited firstly and then emitted through the short-wave fluorescent glue layer, long-wave light is not prone to being absorbed by the short-wave fluorescent glue layer, and then complete emission can be achieved. The overall lighting effect is ensured, and the near ultraviolet full spectrum lighting effect can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp bead devices, and particularly relates to a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead and a preparation method thereof. Background Art

[0002] Previously, most LED lamps were in three forms: red-blue combination, full blue, and full red, used for lighting or covering plants to provide the wavelength range required for plant photosynthesis. In recent years, full-spectrum LED lamps have become popular, which can better simulate sunlight, that is, by supplementing colors such as cyan and light blue to approach the solar visible light spectrum, and the color rendering index of the packaged finished product has also been greatly improved. Although it is called full-spectrum, it lacks some purple-spectrum components.

[0003] In addition, in the prior art, the doping of various phosphors makes the light excited by one phosphor easily absorbed by another phosphor again. Especially, short-wave light is easily absorbed by other phosphors and excites light with a longer wavelength. For example, in the prior art, common YAG yellow powder and nitride red powder used on blue LED chips, the emission spectrum part excited by the YAG yellow powder is easily absorbed and re-emitted by the nitride red powder. The yellow light amount excited by the YAG yellow powder will be absorbed and converted again, resulting in insufficient yellow light output. At the same time, the blue light emitted by the blue LED chip cannot be reasonably absorbed, resulting in a relatively large amount of blue light output, leading to problems such as reduced light extraction efficiency. Summary of the Invention

[0004] Technical Problem to be Solved

[0005] Aiming at the above-mentioned disadvantages of the prior art, the present invention provides a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead and a preparation method thereof. By setting a violet LED chip to complement the violet spectrum and make the emission spectrum more saturated; at the same time, the fluorescent glue layer is set as a stacked multi-layer structure, and the emission light wavelength excited by the lowest fluorescent glue layer to the uppermost fluorescent glue layer gradually becomes shorter, that is, the light with a longer wavelength is first excited and then emitted through the short-wave fluorescent glue layer. The long-wave light is not easily absorbed by the short-wave fluorescent glue layer and can thus be emitted completely, ensuring the overall light efficiency and effectively improving the near-ultraviolet full-spectrum light efficiency; it can effectively solve the problems in the prior art that the blue light emitted by the blue LED chip cannot be reasonably absorbed, resulting in a relatively large amount of blue light output and reduced light extraction efficiency.

[0006] Technical Solution

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions:

[0008] The present invention provides a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead, including a molding compound. The molding compound has a hollow structure, and an inner frame is fixed in the middle of the molding compound. A bottom block is provided at the bottom end of the molding compound. A cylindrical structure is fixed to the top end of the bottom block, and solder is provided at the top end of the cylinder. A chip is fixed to the top end of the solder. A contact frame is provided at the top end of the bottom block, and a lead frame is provided at the bottom end of the bottom block. A lens group is provided on the outer side of the contact frame. In the lens group, a fluorescent glue layer and a lens structure are sequentially arranged from the inside to the outside. The fluorescent glue layer is coated on the inner side of the lens structure, and the fluorescent glue layer has three layers, namely a red powder fluorescent glue layer, a yellow-green powder fluorescent glue layer, and a blue powder fluorescent glue layer that are stacked in sequence from bottom to top; the fluorescent glue layer is arranged as a stacked multi-layer structure, and the emission light wavelengths excited by the bottommost fluorescent glue layer to the topmost fluorescent glue layer gradually become shorter, that is, the light with a longer wavelength is excited first.

[0009] Further, the transparent glue layer is a transparent silica gel layer or an epoxy resin layer; then it is emitted through the short-wave fluorescent glue layer. The long-wave light is not easily absorbed by the short-wave fluorescent glue layer, and thus can be emitted completely, ensuring the overall light efficiency and effectively improving the near-ultraviolet full-spectrum light efficiency.

[0010] Further, one end of the contact frame penetrates through the endoscope and is connected to the chip.

[0011] Further, a clamping block is fixed to the outer side of the lens group, and the clamping block is clamped at the bottom end of the molding compound. The top cross-section of the molding compound is an L-shaped structure.

[0012] Further, the main wavelength band of the chip is 390 - 400 nm.

[0013] A preparation method of a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead, including a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead, the specific steps are as follows:

[0014] S1: Provide a molding compound and a chip. The chip is welded and fixed to the top end of the bottom block through solder, and is die-bonded inside the bottom block and the molding compound. The outer gold wire is connected to the chip, and the outer side of the gold wire is in contact with the contact frame to form an electrical connection;

[0015] S2: Stack multiple layers of fluorescent glue layers on the light-emitting surface of the chip in sequence, and the emission light wavelengths excited by the bottommost fluorescent glue layer to the topmost fluorescent glue layer gradually become shorter;

[0016] S3: The lens group is clamped and fixed with the molding compound through the outer clamping blocks to cover and wrap the gold wire and the endoscope. By using an arc-shaped mirror, when the LED lamp beads emit light, the path of the light can be better changed through the arc-shaped mirror, so that the light can be better focused together, thereby better increasing the illumination intensity of the LED lamp beads. At the same time, when replacing the damaged arc-shaped mirror, by releasing the fixation between the clamping blocks and the molding compound, the arc-shaped mirror can be better replaced, facilitating the operation of the user.

[0017] Further, the chip is a near-ultraviolet LED chip; the ultraviolet LED chip is used to complement the ultraviolet spectrum, making the emitted spectrum more saturated.

[0018] Further, the lens group has a cavity structure, and the inner cavity of the lens group is a planar structure, and the outer side of the lens group is a convex lens; the lens group is arranged in the molding compound, and a combined structure of endoscope - gold wire - solder - chip is arranged in the lens group. The chip is electrically connected to the contact frame through the gold wire, and the outer lens group can be fixedly connected with the molding compound through the clamping blocks therein to meet the fastening requirement, and the structure of the lens group is an inner-square and outer-arc structure.

[0019] Beneficial Effects

[0020] The technical solution provided by the present invention has the following beneficial effects compared with the known public technologies:

[0021] 1. By using an ultraviolet LED chip in the present invention to complement the ultraviolet spectrum, the emitted spectrum is made more saturated; at the same time, the fluorescent glue layer is set as a laminated multi-layer structure, and the wavelength of the emitted light excited from the lowermost fluorescent glue layer to the uppermost fluorescent glue layer gradually becomes shorter, that is, the light with a longer wavelength is first excited and then emitted through the fluorescent glue layer with a shorter wavelength. The light with a longer wavelength is not easily absorbed by the fluorescent glue layer with a shorter wavelength, and thus can be emitted completely, ensuring the overall light efficiency and effectively improving the near-ultraviolet full-spectrum light efficiency.

[0022] 2. In this device, the lens group is arranged in the molding compound, and a combined structure of endoscope - gold wire - solder - chip is arranged in the lens group. The chip is electrically connected to the contact frame through the gold wire, and the outer lens group can be fixedly connected with the molding compound through the clamping blocks therein to meet the fastening requirement, and the structure of the lens group is an inner-square and outer-arc structure. Therefore, when in use, by using an arc-shaped mirror, when the LED lamp beads emit light, the path of the light can be better changed through the arc-shaped mirror, so that the light can be better focused together, thereby better increasing the illumination intensity of the LED lamp beads. At the same time, when replacing the damaged arc-shaped mirror, by releasing the fixation between the clamping blocks and the molding compound, the arc-shaped mirror can be better replaced, facilitating the operation of the user. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 is a schematic structural diagram of the present invention;

[0025] Figure 2 is a split structural diagram of the present invention;

[0026] Figure 3 is a structural sectional view of the lens group in the present invention;

[0027] Figure 4 is a structural sectional view in the present invention;

[0028] Figure 5 is Figure 4 a split structural diagram of.

[0029] The reference numerals in the figure respectively represent: 1, molding compound; 11, bottom block; 111, chip; 112, solder; 2, lead frame; 21, contact frame; 3, lens group; 31, clamping block; 4, gold wire; 5, inner frame; 6, endoscope. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the protection scope of the present invention.

[0031] The following further describes the present invention with reference to the embodiments.

[0032] Embodiment 1: A near-ultraviolet enhanced sunlight full-spectrum LED lamp bead, as Figures 1-5As shown, it includes molding compound 1, the molding compound 1 is of a hollow structure, and an inner frame 5 is fixed in the middle of the molding compound 1. A bottom block 11 is arranged at the bottom end of the molding compound 1. A cylindrical structure is fixed at the top end of the bottom block 11, and a solder 112 is arranged at the top end of the cylinder. A chip 111 is fixed at the top end of the solder 112. A contact frame 21 is arranged at the top end of the bottom block 11. A lead frame 2 is arranged at the bottom end of the bottom block 11. A lens group 3 is arranged outside the contact frame 21. In the lens group 3, in order from inside to outside, a fluorescent glue layer and a lens structure are sequentially arranged. The fluorescent glue layer is coated on the inner side of the lens structure, and the fluorescent glue layer has three layers, namely a red powder fluorescent glue layer, a yellow-green powder fluorescent glue layer, and a blue powder fluorescent glue layer that are stacked in sequence from bottom to top; a chip 111 using a violet LED is arranged to complement the violet light spectrum and make the emitted light spectrum more saturated; at the same time, the fluorescent glue layer is set as a stacked multi-layer structure, and the wavelengths of the emitted light excited by the lowermost fluorescent glue layer to the uppermost fluorescent glue layer gradually become shorter, that is, the light with a longer wavelength is first excited and then emitted through the fluorescent glue layer with a shorter wavelength. The light with a longer wavelength is not easily absorbed by the fluorescent glue layer with a shorter wavelength, and can thus be emitted completely, ensuring the overall light efficiency and effectively improving the near-ultraviolet full-spectrum light efficiency;

[0033] The transparent glue layer is a transparent silicone layer or an epoxy resin layer; one end of the contact frame 21 penetrates through the endoscope 6 and is connected to the chip 111; a clamping block 31 is fixed outside the lens group 3, and the clamping block 31 is clamped at the bottom end of the molding compound 1. The top cross-section of the molding compound 1 is of an L-shaped structure; the main wavelength band of the chip 111 is 390 - 400 nm; the lens group 3 is arranged in the molding compound 1, and a combined structure of an endoscope 5 - gold wire 4 - solder 112 - chip 111 is arranged in the lens group 3. The chip 111 is electrically connected to the contact frame 21 through the gold wire 4, and the outer lens group 3 can be fixedly connected to the molding compound 1 through the clamping block 31 therein to meet the fastening requirement. The structure of the lens group 3 is of an inner-square and outer-arc structure. Therefore, when in use, by adopting an arc mirror, when the LED lamp bead emits light, the path of the light can be better changed through the arc mirror, so that the light can be better concentrated together, thereby better increasing the illumination intensity of the LED lamp bead. At the same time, when replacing the damaged arc mirror, by canceling the fixation of the clamping block 31 and the molding compound 1, the arc mirror can be better replaced, facilitating the operation of the user.

[0034] Embodiment 2: A preparation method of a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead, including Embodiment 1, characterized in that the specific steps are as follows:

[0035] S1: Provide molding compound and a chip. Fix the chip to the top of the base block by soldering, and then solidify the chip in the interior of the base block and the molding compound. The outer gold wire is connected to the chip, and the outer side of the gold wire is in contact with the contact frame to form an electrical connection;

[0036] S2: Stack multiple layers of fluorescent glue layers in sequence on the light-emitting surface of the chip, and the wavelengths of the emitted light excited by the lowermost fluorescent glue layer to the uppermost fluorescent glue layer gradually become shorter;

[0037] S3: The lens group is fixed to the molding compound through the outer clamping block, covering and wrapping the gold wire and the endoscope.

[0038] The chip 111 is a near-ultraviolet LED chip.

[0039] The lens group 3 has a cavity structure, and the inner cavity of the lens group 3 is a planar structure, and the outer side of the lens group 3 is a convex lens. In this embodiment, by using a curved mirror, when the LED lamp bead emits light, the path of the light can be better changed through the curved mirror, so that the light can be better concentrated together, thereby better increasing the illumination intensity of the LED lamp bead. At the same time, when replacing the damaged curved mirror, by removing the fixing of the clamping block 31 and the molding compound 1, the curved mirror can be better replaced, which is convenient for the user to operate.

[0040] Embodiment 3: In this embodiment, for the fluorescent glue layer in Embodiment 1 being a light supplement material, verify the necessity and functionality of its multi-layer structure:

[0041] A near-ultraviolet enhanced sunlight full-spectrum LED lamp bead includes a molding compound 1. The molding compound 1 has a hollow structure, and an inner frame 5 is fixed in the middle of the molding compound 1. A base block 11 is provided at the bottom end of the molding compound 1. A cylindrical structure is fixed to the top end of the base block 11, and a solder 112 is provided at the top end of the cylinder. A chip 111 is fixed to the top end of the solder 112. A contact frame 21 is provided at the top end of the base block 11. A lead frame 2 is provided at the bottom end of the base block 11. A lens group 3 is provided on the outer side of the contact frame 21. In the lens group 3, a fluorescent glue layer and a lens structure are sequentially arranged in the order from the inside to the outside. The fluorescent glue layer is coated on the inner side of the lens structure, and the fluorescent glue layer has a single layer, specifically a yellow-green powder fluorescent glue layer;

[0042] The transparent glue layer is a transparent silicone layer or an epoxy resin layer.

[0043] One end of the contact frame 21 penetrates through the endoscope 6 and is kept connected to the chip 111; a clamping block 31 is fixed on the outer side of the lens group 3, and the clamping block 31 is clamped at the bottom end of the molding compound 1, and the top cross-section of the molding compound 1 is an L-shaped structure; the main wavelength band of the chip 111 is 390-400 nm. In this embodiment, a single-layer fluorescent glue layer structure is adopted. When in use, light with a longer wavelength is first excited and then emitted through the single fluorescent glue layer. The light with a longer wavelength is absorbed by the fluorescent glue layer and there is no complete emission, so it is impossible to ensure the near-ultraviolet full-spectrum light effect. Therefore, when this embodiment is in use, compared with the first embodiment, it cannot meet the on-site use requirements.

[0044] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A near-ultraviolet enhanced sunlight full-spectrum LED lamp bead, characterized in that, It includes a molding compound (1), the molding compound (1) has a hollow structure, and an inner frame (5) is fixed in the middle of the molding compound (1). A bottom block (11) is provided at the bottom end of the molding compound (1). A cylindrical structure is fixed to the top end of the bottom block (11), and a solder (112) is provided at the top end of the cylinder. A chip (111) is fixed to the top end of the solder (112). A contact frame (21) is provided at the top end of the bottom block (11). A lead frame (2) is provided at the bottom end of the bottom block (11). A lens group (3) is provided outside the contact frame (21). In the lens group (3), in the order from the inside to the outside, a fluorescent glue layer and a lens structure are sequentially provided. The fluorescent glue layer is coated on the inner side of the lens structure, and there are three layers of the fluorescent glue layer, which are a red powder fluorescent glue layer, a yellow-green powder fluorescent glue layer, and a blue powder fluorescent glue layer stacked in sequence from bottom to top.

2. The near-ultraviolet enhanced full-spectrum LED lamp bead according to claim 1, wherein The transparent glue layer is a transparent silicone layer or an epoxy resin layer.

3. The near-ultraviolet enhanced sunlight full-spectrum LED lamp bead according to claim 1, wherein One end of the contact frame (21) penetrates through the endoscope (6) and remains connected to the chip (111).

4. The near-ultraviolet enhanced full-spectrum LED lamp bead according to claim 1, wherein A clamping block (31) is fixed to the outside of the lens group (3), and the clamping block (31) is clamped at the bottom end of the molding compound (1). The top cross-section of the molding compound (1) is an L-shaped structure.

5. The near-ultraviolet enhanced sunlight full-spectrum LED lamp bead according to claim 4, wherein The main wavelength band of the chip (111) is 390 - 400 nm.

6. A preparation method of a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead, comprising a near-ultraviolet enhanced sunlight full-spectrum LED lamp bead according to any one of claims 1-5, characterized in that, The specific steps are as follows: S1: Provide a molding compound and a chip. The chip is welded and fixed to the top end of the bottom block through a solder, and is die-bonded inside the bottom block and the molding compound. The outer gold wire is connected to the chip, and the outer side of the gold wire is in contact with the contact frame to form an electrical connection. S2: Stack multiple layers of fluorescent glue layers on the light-emitting surface of the chip in sequence, and the wavelength of the emitted light excited by the lowermost fluorescent glue layer to the uppermost fluorescent glue layer gradually becomes shorter. S3: The lens group is fixedly clamped with the molding compound through the clamping block on the outside to cover and wrap the gold wire and the endoscope.

7. The near-ultraviolet enhanced full-spectrum LED lamp bead according to claim 6, wherein The chip (111) is a near-ultraviolet LED chip.

8. The near-ultraviolet enhanced full-spectrum LED lamp bead according to claim 6, wherein The lens group (3) has a cavity structure, the inner cavity of the lens group (3) is a planar structure, and the outside of the lens group (3) is a convex lens.

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