Preparation method of protective cover plate

Abstract

The invention discloses a preparation method of a protective cover plate, and belongs to the technical field of display. The preparation method of the protective cover plate comprises the steps that after a first protective film and a first shading layer are sequentially formed on the first side of a cover plate body, pollutants are attached to the first side of the cover plate body, and the first side of the cover plate body is subjected to first cleaning treatment. In the cleaning process, the plasma bombards the first side of the cover plate body, so that the pollutants are separated from the surface of the first side of the cover plate body, meanwhile, the plasma reacts with the pollutants, chemical bonds in pollutant molecules are destroyed, and the surface pollutants are changed into ions and gaseous substances with low adhesive force; and pollutants with reduced adhesive force can be removed from the first side of the cover plate body, so that the cleanliness of the protective cover plate is relatively good.

Description

Technical Field

[0001] This application relates to the field of display technology, and particularly to a method for preparing a protective cover plate. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels are regarded as the next-generation display devices due to their advantages such as self-luminescence, high efficiency, vivid colors, thin and light weight, power saving, and rollability, and have attracted more and more attention in recent years.

[0003] A protective cover plate is usually required to protect the display side of the display panel. There is a light-shielding ink formed by a pad printing process on the back of the protective cover plate. The pad printing process presses and transfers the pattern of the light-shielding ink on the etching plate to the protective cover plate through a silicone head. Before forming the light-shielding ink, a protective film needs to be adhered to the back of the protective cover plate to prevent organic molecule in the drying furnace from adhering to the back of the protective cover plate during the drying process of the light-shielding ink in the drying furnace, resulting in black spots in the display area.

[0004] However, due to the blank area between the area where the light-shielding ink is formed and the protective film, during the pad printing process, the silicone head contacts the protective cover plate with a relatively large pressure, making it in a vacuum state with the protective cover plate. When the silicone head is lifted, dust and other dirt in the air will be adsorbed on the surface of the product and the film under the action of atmospheric pressure, and part of the glue on the protective film will overflow and mix with dust impurities, forming a film print that is difficult to clean after drying; in addition, macromolecular organic matter will precipitate on the surface of the silicone head, and some precipitates will adhere to the surface of the protective cover plate after contacting the blank area, changing the surface energy of the blank area and making it difficult to clean, resulting in poor cleanliness of the protective cover plate. Summary of the Invention

[0005] Embodiments of this application provide a method for preparing a protective cover plate, which can solve the problem of poor cleanliness of the protective cover plate in the prior art. The technical solutions are as follows:

[0006] On the one hand, a method for preparing a protective cover plate is provided, and the method includes:

[0007] Providing a cover plate body;

[0008] Forming a first protective film on the first side of the cover plate body; in a direction parallel to the cover plate body, the edge portion of the cover plate body protrudes from the first protective film;

[0009] Forming a first light-shielding layer in the area on the first side of the cover plate body that is not covered by the first protective film;

[0010] Perform a first cleaning process on the first side of the cover plate body where the first light-shielding layer and the first protective film are distributed.

[0011] Optionally, after forming the first light-shielding layer on the first side of the cover plate body, the first side of the cover plate body adheres to first contaminants; performing the first cleaning process on the first side of the cover plate body includes:

[0012] Perform a plasma bombardment process on the first side of the cover plate body to remove the first contaminants.

[0013] Optionally, the interior of the first protective film has a hollowed-out area; the method further includes:

[0014] After forming the first light-shielding layer, form a second light-shielding layer in the area of the first side of the cover plate body that coincides with the hollowed-out area.

[0015] Optionally, the second light-shielding layer is formed after performing the first cleaning process on the cover plate body.

[0016] Optionally, the method further includes:

[0017] After forming the second light-shielding layer, perform a second cleaning process on the first side of the cover plate body where the first light-shielding layer, the second light-shielding layer, and the first protective film are distributed.

[0018] Optionally, after forming the second light-shielding layer on the first side of the cover plate body, the first side of the cover plate body adheres to second contaminants; performing the second cleaning process on the first side of the cover plate body includes:

[0019] Perform a plasma bombardment process on the first side of the cover plate body to remove the second contaminants.

[0020] Optionally, the second light-shielding layer is formed before performing the first cleaning process on the cover plate body; after forming the first light-shielding layer on the first side of the cover plate body, the first side of the cover plate body adheres to first contaminants; after forming the second light-shielding layer on the first side of the cover plate body, the first side of the cover plate body adheres to second contaminants; performing the first cleaning process on the first side of the cover plate body where the first light-shielding layer and the second light-shielding layer are distributed includes:

[0021] Perform a plasma bombardment process on the first side of the cover plate body to remove the first contaminants and the second contaminants.

[0022] Optionally, the method further includes:

[0023] Before forming the first protective film on the first side of the cover plate body, form a second protective film on the second side of the cover plate body;

[0024] Among them, the first side and the second side of the cover plate body are two opposite sides, and the second protective film covers the second side of the cover plate body.

[0025] Optionally, the method further includes:

[0026] After performing the first cleaning process on the first side of the cover plate body, remove the first protective film and the second protective film;

[0027] Perform a third cleaning process on the first side and the second side of the cover plate body.

[0028] Optionally, performing a third cleaning process on the first side and the second side of the cover plate body includes:

[0029] Clean the first side and the second side of the cover plate body with a weakly alkaline cleaning agent.

[0030] The beneficial effects brought by the technical solution provided by the embodiments of the present application at least include:

[0031] In the method for preparing the protective cover plate according to the embodiments of the present application, after the first protective film and the first light-shielding layer are sequentially formed on the first side of the cover plate body, contaminants adhere to the first side of the cover plate body, and the first cleaning process is performed on the first side of the cover plate body. During the cleaning process, the plasma bombards the first side of the cover plate body, causing the contaminants to detach from the surface of the first side of the cover plate body. At the same time, the plasma reacts with the contaminants, breaking the chemical bonds in the contaminant molecules and turning the surface contaminants into ions and gaseous substances with low adhesion, which is conducive to removing the contaminants with reduced adhesion from the first side of the cover plate body, resulting in a better cleanliness of the protective cover plate. Description of the Drawings

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0033] Figure 1 is a flowchart of a method for preparing a protective cover plate provided by an embodiment of the present application;

[0034] Figure 2 is Figure 1 a schematic diagram of the film layer structure of the first protective film in the method shown;

[0035] Figure 3 is Figure 1 a top view of the formation of the first light-shielding layer in the method shown;

[0036] Figure 4 Yes Figure 3 Schematic diagram of the film layer structure at A - A'.

[0037] Figure 5 It is a flowchart of another method for preparing a protective cover plate provided by an embodiment of the present application;

[0038] Figure 6 Yes Figure 5 Schematic diagram of the film layer structure for forming the second protective film in the method shown;

[0039] Figure 7 Yes Figure 5 Top view of forming the first protective film in the method shown;

[0040] Figure 8 Yes Figure 5 Top view of forming the first light - shielding layer in the method shown;

[0041] Figure 9 Yes Figure 5 Top view of forming the second light - shielding layer in the method shown;

[0042] Figure 10 Yes Figure 5 Schematic diagram of the film layer structure after removing the first protective film and the second protective film in the method shown;

[0043] Figure 11 It is a flowchart of yet another method for preparing a protective cover plate provided by an embodiment of the present application;

[0044] Figure 12 It is a flowchart of still another method for preparing a protective cover plate provided by an embodiment of the present application. Detailed implementation manners

[0045] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0046] Please refer to Figure 1 , Figure 1 It is a flowchart of a method for preparing a protective cover plate provided by an embodiment of the present application.

[0047] Step 101: Provide a cover plate body.

[0048] Step 102: Form a first protective film on the first side of the cover plate body.

[0049] Please refer to Figure 2 , Figure 2 Yes Figure 1Schematic diagram of the film layer structure for forming the first protective film in the method shown. Since a first light-shielding layer needs to be formed on the first side of the cover plate body in subsequent processes, the edge portion of the cover plate body 100 protrudes from the first protective film 200 in a direction parallel to the cover plate body 100. Exemplarily, the first protective film 200 can be made of polyethylene material, and the first protective film 200 can be adhered to the first side of the cover plate body 100 through acrylic adhesive. Here, after the protective cover plate and the display panel are assembled into a display module, the first side of the cover plate body in the protective cover plate is the side of the cover plate body close to the display panel.

[0050] Step 103: Form a first light-shielding layer in the area on the first side of the cover plate body that is not covered by the first protective film.

[0051] Please refer to Figure 3 and Figure 4 , Figure 3 is Figure 1 the top view of forming the first light-shielding layer in the method shown, Figure 4 is Figure 3 the schematic diagram of the film layer structure at A-A'. The first light-shielding layer 300 covers the edge portion of the cover plate body 100 that is not covered by the first protective film 200, and the orthographic projection of the first light-shielding layer 300 on the cover plate body 100 does not coincide with the orthographic projection of the first protective film 200 on the cover plate body 100. After the protective cover plate and the display panel are assembled into a display module, the first light-shielding layer 300 can be the frame of the display module. Exemplarily, the first light-shielding layer 300 can be a light-shielding ink formed by pad printing process.

[0052] It should be noted that the pad printing process presses and transfers the pattern of the light-shielding ink on the etching plate to the protective cover plate through a silicone head. The first light-shielding layer 300 needs to be placed in a drying oven for drying. Since there are a large number of organic molecules in the drying oven, in order to prevent organic molecules in the drying oven from adhering to the first side of the cover plate body 100 during the drying process of the light-shielding ink, resulting in black spots in the display area of the display module assembled with the cover plate body 100. Therefore, the first protective film 200 is provided at at least some positions on the first side of the cover plate body 100 where the first light-shielding layer 300 is not distributed, so that the display effect of the display module including the cover plate body 100 is better.

[0053] Step 104: Perform a first cleaning process on the first side of the cover plate body where the first light-shielding layer and the first protective film are distributed.

[0054] Here, as Figure 3As shown, there is a gap between the area where the first light-shielding layer 300 is formed and the area where the first protective film 200 is formed, and there is a blank area S in the cover plate body 100 that does not cover the first protective film 200 and the first light-shielding layer 300. During the process of forming the first light-shielding layer 300 by pad printing, the silicone head contacts the cover plate body 100 with a relatively large pressure, making the space between the silicone head and the cover plate body 100 in a vacuum state. When the silicone head is lifted, dust and other dirt in the air will be adsorbed on the blank area S of the cover plate body 100 and on the side of the first protective film 200 facing away from the cover plate body 100 under the action of atmospheric pressure. Moreover, the overflowed part of the glue used to bond the first protective film 200 and the cover plate body 100 will be mixed with dust impurities and form a film print that is difficult to clean after drying.

[0055] In addition, macromolecular organic substances will precipitate on the surface of the silicone head. After contacting the blank area S of the cover plate body 100, some of the precipitates will adhere to the blank area S, causing a change in the surface energy of the blank area S and forming a mark that is difficult to clean.

[0056] Therefore, it is necessary to perform a first cleaning process on the first side of the cover plate body 100 where the first light-shielding layer 300 and the first protective film 200 are distributed to remove pollutants such as dust impurities and macromolecular organic substances precipitated from the silicone head attached to the first side of the cover plate body 100. Exemplarily, the first cleaning process can be Plasma cleaning. During the cleaning process, the plasma bombards the first side of the cover plate body 100, causing the pollutants to detach from the surface of the first side of the cover plate body 100. At the same time, the plasma reacts with the pollutants, breaking the chemical bonds in the pollutant molecules and turning the surface pollutants into ions and gaseous substances with low adhesion, which is conducive to removing the pollutants with reduced adhesion from the first side of the cover plate body 100.

[0057] In summary, the embodiment of the present application provides a method for preparing a protective cover plate. After sequentially forming a first protective film and a first light-shielding layer on the first side of the cover plate body, pollutants are attached to the first side of the cover plate body, and a first cleaning process is performed on the first side of the cover plate body. During the cleaning process, the plasma bombards the first side of the cover plate body, causing the pollutants to detach from the surface of the first side of the cover plate body. At the same time, the plasma reacts with the pollutants, breaking the chemical bonds in the pollutant molecules and turning the surface pollutants into ions and gaseous substances with low adhesion, which is conducive to removing the pollutants with reduced adhesion from the first side of the cover plate body, resulting in a better cleanliness of the protective cover plate.

[0058] It should be noted that after forming the first light-shielding layer on the first side of the protective cover plate, it is usually necessary to continue forming a second light-shielding layer on the first side of the protective cover plate.

[0059] Here, a Plasma cleaning can be performed immediately after each formation of the light-shielding layer. That is, after the first light-shielding layer is formed on the first side of the protection cover plate, a first cleaning process is immediately performed, and then after the second light-shielding layer is formed on the first side of the protection cover plate for the first time, a second cleaning process is immediately performed.

[0060] Of course, it is also possible to perform only one Plasma cleaning (i.e., the first cleaning process), and this first cleaning process can be performed before the formation of the second light-shielding layer or after the formation of the second light-shielding layer. For this reason, the following will illustrate these three cases respectively with the following three preparation methods of the protection cover plate.

[0061] Another preparation method of the protection cover plate is provided in an embodiment of the present application. Two Plasma cleanings can be performed during the preparation of the protection cover plate. That is, after the first light-shielding layer is formed on the first side of the protection cover plate, a first cleaning process is immediately performed to remove the first contaminants; then after the second light-shielding layer is formed on the first side of the protection cover plate for the first time, a second cleaning process is immediately performed to remove the second contaminants. Exemplarily, please refer to Figure 5 , Figure 5 which is a flowchart of another preparation method of the protection cover plate provided in an embodiment of the present application.

[0062] Step 201: Provide a cover plate body.

[0063] The cover plate body can be made of microcrystalline glass.

[0064] Step 202: Form a second protective film on the second side of the cover plate body.

[0065] Please refer to Figure 6 , Figure 6 which is Figure 5 a schematic diagram of the film layer structure of the second protective film formed in the method shown. The second protective film 400 covers the second side of the cover plate body 100.

[0066] It should be noted that since the first light-shielding layer and the second light-shielding layer need to be formed on the first side of the cover plate body in the subsequent process, during the process of forming the first light-shielding layer and the second light-shielding layer by the pad printing process, the silicone head contacts the cover plate body with a relatively large pressure. To avoid scratches on the second side of the cover plate body 100 due to friction between the second side of the cover plate body 100 and the stage, therefore, the second protective film 400 covers the second side of the cover plate body 100 to protect the second side of the cover plate body 100. Exemplarily, the second protective film 400 can be made of polyethylene material, and the second protective film 400 can be bonded to the second side of the cover plate body 100 through acrylic glue. Here, after the protection cover plate and the display panel are assembled into a display module, the second side of the cover plate body in the protection cover plate is the side of the cover plate body facing away from the display panel.

[0067] Step 203: forming a first protective film on a first side of the cover body.

[0068] Please refer to Figure 7 , Figure 7 yes Figure 5 A top view of the first protective film formed in the method shown. Since the first light shielding layer needs to be formed on the first side of the cover body in the subsequent process, the edge portion of the cover body 100 protrudes from the first protective film 200 in a direction parallel to the cover body 100. Exemplarily, the first protective film 200 can be made of polyethylene material, and the first protective film 200 can be bonded to the first side of the cover body 100 by acrylic glue. Here, after the protective cover and the display panel are assembled into a display module, the first side of the cover body in the protective cover is the side of the cover body close to the display panel, that is, the first side and the second side of the cover body 000 are two sides arranged oppositely.

[0069] It should be noted that if Figure 7 As shown, the cover body 000 further includes a light-transmitting area K. For a display device integrated with such a cover body 000, various sensor devices such as a camera and a light sensor in the display device can be placed on the side of the cover body 100 away from the second protective film 400, and the light-sensitive surface of the sensor device can face the light-transmitting area K of the cover body 100. In this way, the ambient light can enter the light-incident surface of the camera after passing through the light-transmitting area K of the cover body 100, so that the camera can normally acquire images.

[0070] In this case, the first protective film 200 has a hollow area 210 inside. The hollow area 210 may include: a first hollow area 211 arranged around the outer edge of the cover body 100, and a second hollow area 212 arranged around the light-transmitting area K of the cover body 100, so as to form a first light-shielding layer and a second light-shielding layer on the first side of the cover body 100 in a subsequent process.

[0071] It should also be noted that, in other embodiments, after the first protective film is formed on the first side of the cover body, the second protective film is formed on the second side of the cover body. That is, step 202 and step 203 can be switched.

[0072] Step 204: forming a first light shielding layer on a first side of the cover body.

[0073] Please refer to Figure 8 , Figure 8 yes Figure 5Top view of forming the first light-shielding layer in the method shown. The first light-shielding layer 300 covers the edge portion of the cover plate body 100 that is not covered by the first protective film 200, and the orthographic projection of the first light-shielding layer 300 on the cover plate body 100 is located within the orthographic projection of the first hollow-out area 211 on the cover plate body 100. After the protective cover plate and the display panel are assembled into a display module, the first light-shielding layer 300 can be the border of the display module. Exemplarily, the first light-shielding layer 300 can be light-shielding ink formed by a pad printing process.

[0074] It should be noted that in the pad printing process, the pattern of the light-shielding ink on the etching plate is pressed and transferred to the protective cover plate by a silicone head. The first light-shielding layer 300 needs to be placed in a drying oven for drying. Exemplarily, the drying temperature is 150 degrees Celsius to 180 degrees Celsius, and the drying time is 20 minutes to 50 minutes. Since there are a large number of organic molecule in the drying oven, in order to prevent the organic molecules in the drying oven from adhering to the first side of the cover plate body 100 during the drying process of the light-shielding ink in the drying oven, resulting in black spots in the display area of the display module assembled with the cover plate body 100. Therefore, the first protective film 200 is provided at at least part of the position where the first light-shielding layer 300 is not distributed on the first side of the cover plate body 100, so that the display effect of the display module including the cover plate body 100 is better.

[0075] Step 205: Perform a first cleaning process on the first side of the cover plate body.

[0076] Here, as Figure 8 shown, since there is a gap between the area where the first light-shielding layer 300 is formed and the area where the first protective film 200 is formed, there is a blank area S in the cover plate body 100 that is not covered by the first protective film 200 and the first light-shielding layer 300. During the process of forming the first light-shielding layer 300 by the pad printing process, the silicone head contacts the cover plate body 100 with a relatively large pressure, making a vacuum state between the silicone head and the cover plate body 100. When the silicone head is lifted, dust and other dirt in the air will be adsorbed on the blank area S of the cover plate body 100 and the side of the first protective film 200 facing away from the cover plate body 100 under the action of atmospheric pressure. And the overflowed part of the glue used to bond the first protective film 200 and the cover plate body 100 will be mixed with dust impurities and form a film print that is difficult to clean after drying. In addition, macromolecular organic matter will precipitate on the surface of the silicone head. After contacting the blank area S of the cover plate body 100, some of the precipitates will adhere to the blank area S, causing a change in the surface energy of the blank area S and forming an imprint that is difficult to clean. That is, after the first light-shielding layer 300 is formed on the first side of the cover plate body 100, the first side of the cover plate body 100 is adhered with the first pollutant.

[0077] To this end, it is necessary to perform a first cleaning process on the first side of the cover plate body 100 where the first light-shielding layer 300 and the first protective film 200 are distributed. That is, perform a plasma bombardment process on the first side of the cover plate body 100 to remove the first contaminants. Exemplarily, the first cleaning process can be Plasma cleaning. During the cleaning process, the plasma bombards the first side of the cover plate body 100, causing the first contaminants to separate from the surface of the first side of the cover plate body 100. At the same time, the plasma reacts with the contaminants, breaking the chemical bonds in the first contaminant molecules and turning the first contaminants into ions and gaseous substances with low adhesion, which is conducive to removing the first contaminants with reduced adhesion from the first side of the cover plate body 100. Exemplarily, the power of the first cleaning process is 700 watts to 900 watts, and the distance between the plasma release source in the first cleaning process and the cover plate body 100 is 12 millimeters to 15 millimeters.

[0078] Step 206: Form a second light-shielding layer on the first side of the cover plate body.

[0079] Please refer to Figure 9 , Figure 9 Yes Figure 5 is the top view of forming the second light-shielding layer in the method shown. A second light-shielding layer 500 is formed in the area of the first side of the cover plate body 100 that coincides with the hollow area 310. The orthographic projection of the second light-shielding layer 500 on the cover plate body 100 is within the orthographic projection of the second hollow area 212 on the cover plate body 100. Exemplarily, the second light-shielding layer 500 can be a light-shielding ink formed by the pad printing process.

[0080] It should be noted that the pad printing process transfers the pattern of the light-shielding ink on the etching plate to the protective cover plate by pressing with a silicone head. The second light-shielding layer 500 needs to be placed in a drying oven for drying. Exemplarily, the drying temperature is 150 degrees Celsius to 180 degrees Celsius, and the drying time is 20 minutes to 50 minutes. Since there are a large number of organic molecules in the drying oven, in order to prevent the organic molecules in the drying oven from adhering to the first side of the cover plate body 100 during the drying process of the light-shielding ink, resulting in black spots in the display area of the display module assembled with the cover plate body 100. Therefore, a first protective film 200 is provided at the position on the first side of the cover plate body 100 where the first light-shielding layer 300 and the second light-shielding layer 500 are not distributed, so that the display effect of the display module including the cover plate body 100 is better.

[0081] It should also be noted that during the formation of the second light-shielding layer 500, the code of the cover plate body 100 can also be formed on the first side of the cover plate body 100 at the same time ( Figure 9 is not drawn in).

[0082] Step 207: Perform a second cleaning process on the first side of the cover plate body.

[0083] Since there are gaps between the area where the first light-shielding layer 300 is formed and the area where the first protective film 200 is formed, and also between the area where the second light-shielding layer 500 is formed and the area where the first protective film 200 is formed, there is a blank area S in the cover plate body 100 that does not cover the first protective film 200, the first light-shielding layer 300, and the second light-shielding layer 500. During the process of forming the second light-shielding layer 500 by pad printing, the silicone head contacts the cover plate body 100 with a relatively large pressure, making a vacuum state between the silicone head and the cover plate body 100. When the silicone head is lifted, dust and other dirt in the air will be adsorbed on the blank area S of the cover plate body 100 and on the side of the first protective film 200 facing away from the cover plate body 100 under the action of atmospheric pressure. Moreover, the overflowed part of the glue used to bond the first protective film 200 and the cover plate body 100 will be mixed with dust impurities and form a film print that is difficult to clean after drying. In addition, macromolecular organic substances will precipitate on the surface of the silicone head. After contacting the blank area S of the cover plate body 100, some of the precipitates will adhere to the blank area S, causing a change in the surface energy of the blank area S and forming an imprint that is difficult to clean. That is, after the second light-shielding layer 500 is formed on the first side of the cover plate body 100, a second pollutant adheres to the first side of the cover plate body 100.

[0084] Therefore, it is necessary to perform a second cleaning process on the first side of the cover plate body 100 where the first light-shielding layer 300, the second light-shielding layer 500, and the first protective film 200 are distributed. That is, perform a plasma bombardment process on the first side of the cover plate body 100 to remove the second pollutant. Exemplarily, the second cleaning process can be Plasma cleaning. During the cleaning process, the plasma bombards the first side of the cover plate body 100, causing the second pollutant to separate from the surface of the first side of the cover plate body 100. At the same time, the plasma reacts with the pollutant, breaking the chemical bonds in the second pollutant molecules and turning the second pollutant into ions and gaseous substances with low adhesion, which is conducive to removing the second pollutant with reduced adhesion from the first side of the cover plate body 100. Exemplarily, the power of the second cleaning process is 700 watts to 900 watts, and the distance between the plasma release source in the second cleaning process and the cover plate body 100 is 12 millimeters to 15 millimeters.

[0085] Step 208, remove the first protective film and the second protective film.

[0086] Please refer to Figure 10 , Figure 10 Yes Figure 5Schematic diagram of the film layer structure after removing the first protective film and the second protective film in the shown method. After removing the first protective film 200 and the second protective film 500, contaminants adhering to the surfaces of the first protective film 200 and the second protective film 500 can be removed. It should be noted that the size of the protection cover plate needs to be detected before removing the first protective film and the second protective film. The first protective film 200 and the second protective film 500 can protect the first side and the second side of the cover plate body 100 to avoid damaging the cover plate body 100 during the detection process.

[0087] Step 209: Perform a third cleaning process on the first side and the second side of the cover plate body.

[0088] During the process of removing the first protective film 200 and the second protective film 500, dust and other contaminants may be adsorbed on the first side and the second side of the cover plate body 100. Therefore, through the third cleaning process, the dust and other contaminants on the first side and the second side of the cover plate body 100 are removed. Exemplarily, the third cleaning process can be cleaning with a flat panel cleaning machine. By using a weak alkaline cleaning agent to clean the first side and the second side of the cover plate body 000 formed with the first light-shielding layer 300 and the second light-shielding layer 500, the cleaning temperature range is 45 degrees Celsius to 55 degrees Celsius, the cleaning time range is 130 seconds to 150 seconds, and the concentration range of the weak alkaline cleaning agent is 30% to 10%. It should be noted that performing the third cleaning process within half an hour after the second cleaning process can effectively improve the cleanliness of the surface of the protection cover plate and have less impact on the surface roughness of the protection cover plate.

[0089] In summary, the embodiment of the present application provides a method for preparing a protection cover plate. After sequentially forming a first protective film and a first light-shielding layer on the first side of the cover plate body, contaminants adhere to the first side of the cover plate body, and a first cleaning process is performed on the first side of the cover plate body. During the cleaning process, the first side of the cover plate body is bombarded by plasma, so that the contaminants are separated from the surface of the first side of the cover plate body. At the same time, the plasma reacts with the contaminants to break the chemical bonds in the contaminant molecules, making the surface contaminants become ions and gaseous substances with low adhesion, which is beneficial to removing the contaminants with reduced adhesion from the first side of the cover plate body, resulting in a better cleanliness of the protection cover plate.

[0090] The embodiment of the present application provides another method for preparing a protection cover plate. In the process of preparing the protection cover plate, a Plasma cleaning (i.e., the first cleaning process) can be performed once, and the first cleaning process can be performed before forming the second light-shielding layer. That is, the second light-shielding layer is formed after performing the first cleaning process on the cover plate body. Through this first cleaning process, the first contaminants can be removed. Exemplarily, please refer to Figure 11 , Figure 11 is a flowchart of another method for preparing a protection cover plate provided by the embodiment of the present application.

[0091] Step 301: Provide a cover plate body.

[0092] This step can refer to step 201 above and will not be elaborated here.

[0093] Step 302: Form a second protective film on the second side of the cover plate body.

[0094] This step can refer to step 202 above and will not be elaborated here.

[0095] Step 303: Form a first protective film on the first side of the cover plate body.

[0096] This step can refer to step 203 above and will not be elaborated here.

[0097] Step 304: Form a first light-shielding layer on the first side of the cover plate body.

[0098] This step can refer to step 204 above and will not be elaborated here.

[0099] Step 305: Perform a first cleaning process on the first side of the cover plate body.

[0100] This step can refer to step 205 above and will not be elaborated here.

[0101] Step 306: Form a second light-shielding layer on the first side of the cover plate body.

[0102] This step can refer to step 206 above and will not be elaborated here.

[0103] Step 307: Remove the first protective film and the second protective film.

[0104] This step can refer to step 208 above and will not be elaborated here.

[0105] It should be noted that there are gaps between the area where the first light-shielding layer 300 is formed and the area where the first protective film 200 is formed, and there are also gaps between the area where the second light-shielding layer 500 is formed and the area where the first protective film 200 is formed. There is a blank area S in the cover plate body 100 that does not cover the first protective film 200, the first light-shielding layer 300, and the second light-shielding layer 500. During the process of forming the second light-shielding layer 500 by the pad printing process, the silicone head contacts the cover plate body 100 with a relatively large pressure, making the space between the silicone head and the cover plate body 100 in a vacuum state. When the silicone head is lifted, dust and other dirt in the air will be adsorbed on the blank area S of the cover plate body 100 and on the side of the first protective film 200 facing away from the cover plate body 100 under the action of atmospheric pressure. Moreover, the overflowed part of the glue used to bond the first protective film 200 and the cover plate body 100 will be mixed with dust and impurities, and a film print that is difficult to clean will be formed after drying. In addition, macromolecular organic substances will precipitate on the surface of the silicone head. After contacting the blank area S of the cover plate body 100, some of the precipitates will adhere to the blank area S, causing a change in the surface energy of the blank area S and forming an imprint that is difficult to clean. That is to say, after the second light-shielding layer 500 is formed on the first side of the cover plate body 100, a second pollutant adheres to the first side of the cover plate body 100. After removing the first protective film 200 and the second protective film 500, the second pollutant adhering to the side of the first protective film 200 facing away from the cover plate body 100 can be removed.

[0106] Step 308: Perform a third cleaning process on the first side and the second side of the cover plate body.

[0107] During the process of removing the first protective film 200 and the second protective film 500, dust and other pollutants may be adsorbed on the first side and the second side of the cover plate body 100, and the second pollutant adhering to the blank area S in the cover plate body 100 has not been removed. Therefore, through the third cleaning process, the dust and other pollutants on the first side and the second side of the cover plate body 100, as well as the remaining second pollutant, are removed. Exemplarily, the third cleaning process can be cleaning with a flat panel cleaning machine. By using a weak alkaline cleaning agent to clean the first side and the second side of the cover plate body 000 where the first light-shielding layer 300 and the second light-shielding layer 500 are formed, the cleaning temperature range is 45 degrees Celsius to 55 degrees Celsius, the cleaning time range is 130 seconds to 150 seconds, and the concentration range of the weak alkaline cleaning agent is 30% to 10%.

[0108] In summary, the embodiment of the present application provides a method for preparing a protection cover plate. After forming a first protective film and a first light-shielding layer on the first side of the cover plate body in sequence, contaminants adhere to the first side of the cover plate body, and a first cleaning process is performed on the first side of the cover plate body. During the cleaning process, the first side of the cover plate body is bombarded by plasma, so that the contaminants are separated from the surface of the first side of the cover plate body. At the same time, the plasma reacts with the contaminants, breaking the chemical bonds in the contaminant molecules, turning the surface contaminants into ions and gaseous substances with low adhesion, which is conducive to removing the contaminants with reduced adhesion from the first side of the cover plate body, making the cleanliness of the protection cover plate better.

[0109] The embodiment of the present application provides another method for preparing a protection cover plate. During the preparation process of the protection cover plate, a Plasma cleaning (i.e., the first cleaning process) can be performed, and the first cleaning process can be carried out after forming the second light-shielding layer. That is to say, the second light-shielding layer is formed before the first cleaning process of the cover plate body, and the first cleaning process can remove the first contaminants and the second contaminants. For example, please refer to Figure 12 , Figure 12 is the flow chart of another method for preparing a protection cover plate provided by the embodiment of the present application.

[0110] Step 401: Provide a cover plate body.

[0111] This step can refer to step 201 above and will not be elaborated here.

[0112] Step 402: Form a second protective film on the second side of the cover plate body.

[0113] This step can refer to step 202 above and will not be elaborated here.

[0114] Step 403: Form a first protective film on the first side of the cover plate body.

[0115] This step can refer to step 203 above and will not be elaborated here.

[0116] Step 404: Form a first light-shielding layer on the first side of the cover plate body.

[0117] This step can refer to step 204 above and will not be elaborated here.

[0118] Step 405: Form a second light-shielding layer on the first side of the cover plate body.

[0119] This step can refer to step 206 above and will not be elaborated here.

[0120] Step 406: Perform a first cleaning process on the first side of the cover plate body.

[0121] Since there is a gap between the area where the first light-shielding layer 300 is formed and the area where the first protective film 200 is formed, there is a blank area S in the cover plate body 100 that does not cover the first protective film 200 and the first light-shielding layer 300. During the process of forming the first light-shielding layer 300 and the second light-shielding layer 500 by the pad printing process, the silicone head contacts the cover plate body 100 with a relatively large pressure, making the space between the silicone head and the cover plate body 100 in a vacuum state. When the silicone head is lifted, dust and other dirt in the air will be adsorbed on the blank area S of the cover plate body 100 and on the side of the first protective film 200 facing away from the cover plate body 100 under the action of atmospheric pressure. Moreover, the overflowed part of the glue used to bond the first protective film 200 and the cover plate body 100 will be mixed with dust and impurities, and a film print that is difficult to clean will be formed after drying. In addition, macromolecular organic substances will precipitate on the surface of the silicone head. After contacting the blank area S of the cover plate body 100, some of the precipitates will adhere to the blank area S, causing a change in the surface energy of the blank area S and forming an imprint that is difficult to clean. That is to say, after the first light-shielding layer 300 is formed on the first side of the cover plate body 100, the first side of the cover plate body 100 adheres to the first pollutant. After the second light-shielding layer 500 is formed on the first side of the cover plate body 100, the first side of the cover plate body 100 also adheres to the second pollutant.

[0122] Therefore, it is necessary to perform a first cleaning process on the first side of the cover plate body 100 where the first light-shielding layer 300 and the first protective film 200 are distributed. That is to say, perform a plasma bombardment process on the first side of the cover plate body 100 to remove the first pollutant and the second pollutant. Exemplarily, the first cleaning process can be Plasma cleaning. During the cleaning process, the plasma bombards the first side of the cover plate body 100, causing the first pollutant and the second pollutant to separate from the surface of the first side of the cover plate body 100. At the same time, the plasma reacts with the pollutants, breaking the chemical bonds in the molecules of the first pollutant and the second pollutant, making the first pollutant and the second pollutant become ions and gaseous substances with low adhesion, which is conducive to removing the first pollutant and the second pollutant with reduced adhesion from the first side of the cover plate body 100. Exemplarily, the power of the first cleaning process is 700 watts to 900 watts, and the distance between the plasma release source in the first cleaning process and the cover plate body 100 is 12 millimeters to 15 millimeters.

[0123] Step 407, Remove the first protective film and the second protective film.

[0124] This step can refer to the above step 208 and will not be elaborated here.

[0125] Step 408, Perform a third cleaning process on the first side and the second side of the cover plate body.

[0126] During the process of removing the first protective film 200 and the second protective film 500, dust and other pollutants may be adsorbed on the first side and the second side of the cover plate body 100. Therefore, through the third cleaning process, the dust and other pollutants on the first side and the second side of the cover plate body 100 are removed. Exemplarily, the third cleaning process can be cleaning by a flat panel cleaning machine. The first side and the second side of the cover plate body 000 formed with the first light-shielding layer 300 and the second light-shielding layer 500 are cleaned by using a weakly alkaline cleaning agent. The cleaning temperature range is 45 degrees Celsius to 55 degrees Celsius, the cleaning time range is 130 seconds to 150 seconds, and the concentration range of the weakly alkaline cleaning agent is 30% to 10%.

[0127] In summary, the embodiment of the present application provides a method for preparing a protective cover plate. After the first protective film and the first light-shielding layer are sequentially formed on the first side of the cover plate body, pollutants are attached to the first side of the cover plate body, and the first cleaning process is performed on the first side of the cover plate body. During the cleaning process, the first side of the cover plate body is bombarded by plasma, so that the pollutants are separated from the surface of the first side of the cover plate body. At the same time, the plasma reacts with the pollutants, breaking the chemical bonds in the pollutant molecules, and turning the surface pollutants into ions and gaseous substances with low adhesion, which is beneficial to removing the pollutants with reduced adhesion from the first side of the cover plate body, and making the cleanliness of the protective cover plate better.

[0128] It should be noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Moreover, it can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be an intermediate layer. Additionally, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intermediate layer or element. Additionally, it can also be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout the specification indicate similar elements.

[0129] In the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise clearly defined.

[0130] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for preparing a protective cover plate, characterized in that, The method includes: Providing a cover plate body; Forming a first protective film on a first side of the cover plate body; in a direction parallel to the cover plate body, an edge portion of the cover plate body protrudes from the first protective film; Forming a first light-shielding layer in an area on the first side of the cover plate body that is not covered by the first protective film; Performing a first cleaning process on the first side of the cover plate body where the first light-shielding layer and the first protective film are distributed.

2. The preparation method according to claim 1, wherein After forming the first light-shielding layer on the first side of the cover plate body, a first contaminant adheres to the first side of the cover plate body; Performing the first cleaning process on the first side of the cover plate body includes: Performing a plasma bombardment process on the first side of the cover plate body to remove the first contaminant.

3. The preparation method according to claim 1, characterized in that, The interior of the first protective film has a hollowed-out area; the method further includes: After forming the first light-shielding layer, forming a second light-shielding layer in an area on the first side of the cover plate body that coincides with the hollowed-out area.

4. The preparation method according to claim 3, wherein The second light-shielding layer is formed after performing the first cleaning process on the cover plate body.

5. The preparation method according to claim 4, characterized in that, The method further includes: After forming the second light-shielding layer, performing a second cleaning process on the first side of the cover plate body where the first light-shielding layer, the second light-shielding layer, and the first protective film are distributed.

6. The preparation method according to claim 5, wherein After forming the second light-shielding layer on the first side of the cover plate body, a second contaminant adheres to the first side of the cover plate body; Performing the second cleaning process on the first side of the cover plate body includes: Performing a plasma bombardment process on the first side of the cover plate body to remove the second contaminant.

7. The preparation method according to claim 3, characterized in that, The second light-shielding layer is formed before performing the first cleaning process on the cover plate body; after forming the first light-shielding layer on the first side of the cover plate body, a first contaminant adheres to the first side of the cover plate body; after forming the second light-shielding layer on the first side of the cover plate body, a second contaminant adheres to the first side of the cover plate body; Performing the first cleaning process on the first side of the cover plate body where the layers are distributed includes: Performing a plasma bombardment process on the first side of the cover plate body to remove the first contaminant and the second contaminant.

8. The preparation method according to any one of claims 1-7, characterized in that, The method further includes: Before forming the first protective film on the first side of the cover plate body, forming a second protective film on a second side of the cover plate body; Wherein, the first side and the second side of the cover plate body are opposite sides, and the second protective film covers the second side of the cover plate body.

9. The preparation method according to claim 8, wherein The method further includes: After performing the first cleaning process on the first side of the cover plate body, removing the first protective film and the second protective film; Performing a third cleaning process on the first side and the second side of the cover plate body.

10. The preparation method according to claim 9, characterized in that, Performing the third cleaning process on the first side and the second side of the cover plate body includes: Cleaning the first side and the second side of the cover plate body with a weakly alkaline cleaning agent.

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