Glass slide cooling / heating device and glass slide cooling / heating method

Abstract

A slide cooling / heating device (10) is provided with: a plurality of heat pumps (22a, 22b) that cool or heat a plurality of slides (11) one by one; a heat sink that promotes heat dissipation of the heat pumps (22a, 22b); and a heat transfer plate (14) that connects the heat sink and the plurality of heat pumps (22a, 22b) and thermally connects the plurality of heat pumps (22a, 22b). As a result, provided are a glass slide cooling / heating device and a glass slide cooling / heating method with which it is possible to reduce the power consumption of a heat pump in a device for simultaneously heating and cooling a plurality of glass slides using the heat pump.

Description

Technical Field

[0001] The present invention relates to an apparatus and method for cooling / heating multiple glass slides simultaneously by a heat pump. Background Art

[0002] As an example of an apparatus and method for automatically staining or processing multiple tissue samples placed on a microscope slide, Patent Document 1 describes the following: heating the slide and then performing individualized slide temperature adjustment using a heating system having a hot stage radially mounted on a circular conveyor for sensing each temperature.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2002-505089 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] Biological tissue diagnosis involves microscopic observation of a part of a collected body tissue and pathological diagnosis.

[0008] Therefore, for an examination specimen prepared on a glass slide by slicing a collected body tissue or the like, heat treatment is performed together with the glass slide in order to dissolve the paraffin for fixing the tissue, promote the staining reaction based on a reagent, etc. In this heat treatment, the glass slide containing the examination specimen is heated or cooled to a specific temperature in accordance with the examination order.

[0009] In order to effectively process multiple examination specimens, it is required to perform heat treatment on multiple glass slides simultaneously.

[0010] In order to enable a more flexible examination order to be established, even adjacent glass slides need to be heated or cooled to different specific temperatures as the case may be.

[0011] For example, Patent Document 1 describes the following apparatus: thermally separating adjacent glass slides from each other and heating or cooling adjacent glass slides to different temperatures at a specific time as the case may be by a heater or a heat pump such as a Peltier device installed below the glass slide.

[0012] Patent Document 1 described the following apparatus: thermally separating adjacent glass slides from each other and heating or cooling adjacent glass slides to different temperatures at a specific time as the case may be by a heater or a heat pump such as a Peltier device installed below the glass slide.

[0013] However, if adjacent slides are thermally separated and heated or cooled individually by a heat pump, the heat absorbed from the slides by the heat pump during cooling is dissipated into the atmosphere and cannot be effectively utilized, so there is a problem that the power consumption of the heat pump increases.

[0014] An object of the present invention is to provide a slide cooling / heating device and a slide cooling / heating method capable of reducing the power consumption of a heat pump in a device that uses a heat pump to simultaneously heat and cool multiple slides.

[0015] Means for Solving the Problem

[0016] The present invention includes multiple solutions to the above problems. If one example is cited, it is characterized by including: multiple slides; multiple heat pumps that cool or heat the multiple slides one by one; a radiator that promotes heat dissipation of the heat pumps; and a heat conduction plate that connects the radiator to the multiple heat pumps and thermally connects the multiple heat pumps.

[0017] Advantageous Effects of the Invention

[0018] According to the present invention, in the case of simultaneously heating and cooling multiple slides, the power consumption of the heat pump can be reduced. Problems, structures, and effects other than the above will be clarified by the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a top view showing the overall slide cooling / heating device according to Embodiment 1 of the present invention.

[0020] Figure 2 It is a side cross-sectional view showing the main part of the slide cooling / heating device according to Embodiment 1.

[0021] Figure 3 It is a top view showing the main part of the slide cooling / heating device according to Embodiment 2 of the present invention.

[0022] Figure 4 It is a top view showing the main part of the slide cooling / heating device according to Embodiment 3 of the present invention.

[0023] Figure 5 It is a top view showing the main part of the slide cooling / heating device according to Embodiment 4 of the present invention.

[0024] Figure 6 It is a top view showing the main part of the slide cooling / heating device according to Embodiment 5 of the present invention.

[0025] Figure 7 It is a bottom view of the slide cooling / heating device according to Embodiment 5.

[0026] Figure 8 It is a top view of the air-cooling unit of the slide cooling / heating device of Embodiment 5. Specific Embodiment

[0027] Hereinafter, embodiments of the slide cooling / heating device and the slide cooling / heating method of the present invention will be described with reference to the accompanying drawings. It should be noted that in the drawings used in this specification, the same or corresponding components are labeled with the same or similar reference numerals, and the repeated description of these components may sometimes be omitted.

[0028] <Embodiment 1>

[0029] Use Figure 1 And Figure 2 To describe Embodiment 1 of the slide cooling / heating device and the slide cooling / heating method of the present invention.

[0030] First, use Figure 1 To describe the overall structure of the slide cooling / heating device 10. Figure 1 It is a top view showing the whole of the slide cooling / heating device 10.

[0031] Figure 1 In the shown slide cooling / heating device 10, a plurality of slides 11 are linearly arranged on a fixed table 13, and a plurality of brackets 12 that respectively hold one slide 11. The bracket 12 is a member that holds the slide 11 and a heat equalizer 21 ( Figure 2 ) described later, and the fixed table 13 is a member that fixes the bracket 12. These brackets 12 and fixed table 13 are preferably made of plastic or polycarbonate resin.

[0032] At the lower part of the fixed table 13 in the vertical direction, there is a heat conducting plate 14 made of a material with excellent thermal conductivity. The heat conducting plate 14 is a member that connects an air-cooling radiator 15 as a radiator to a plurality of heat pumps 22a and 22b and thermally connects the plurality of heat pumps 22a and 22b. Considering from the aspects of cost and weight, it is preferably made of aluminum, but copper or the like can also be used.

[0033] At the lower part of the heat conducting plate 14 in the vertical direction, as a radiator, there is an air-cooling radiator 15 for promoting the heat dissipation of the heat pumps 22a and 22b. In Figure 1 , it is described that the air-cooling radiator 15 has flat fins, but as long as it is a shape that increases the surface area of the air-cooling radiator 15, it is not limited to a specific fin shape. Similar to the heat conducting plate 14, considering from the aspects of cost and weight, the air-cooling radiator 15 is also preferably made of aluminum, but copper or the like can also be used.

[0034] The fan 16 further promotes heat dissipation by delivering cooling air to the air-cooling radiator 15.

[0035] Furthermore, disposing the pipe 17 between the fan 16 and the air-cooled radiator 15 improves the directivity of the wind from the fan 16, thereby defining the wind direction so that the wind from the fan 16 efficiently passes through the surface of the air-cooled radiator 15.

[0036] Next, use Figure 2 to describe the main part of the slide cooling / heating device 10 of Embodiment 1. Figure 2 is a side cross-sectional view showing the main part of the slide cooling / heating device 10.

[0037] As Figure 2 shown, the heat sink 21 is disposed between the slide 11 and the heat pumps 22a, 22b, and is provided to make the in-plane temperature distribution of the slide 11 uniform. Due to the effect of making the in-plane temperature distribution of the slide 11 uniform, it is preferable that the area of the heat sink 21 is the same as or larger than the area of the slide 11. The heat sink 21 can be made of copper or a copper-based material, aluminum, etc.

[0038] Heat pumps 22a, 22b for cooling or heating each slide 11a, 11b are provided below the heat sink 21 to adjust the slides 11a, 11b to the temperature required for the purpose. These heat pumps 22a, 22b preferably employ Peltier elements.

[0039] The purpose of preparing the heat pump 22a is to cool and heat the slide 11a, and the purpose of preparing the heat pump 22b is to cool and heat the slide 11b.

[0040] The heat pumps 22a, 22b each include a heat absorption surface 23a, 23b and a heat dissipation surface 24a, 24b. The heat conduction plate 14 contacts the heat dissipation surface 24a of the heat pump 22a and the heat absorption surface 23b of the heat pump 22b, thermally connecting the heat pump 22a and the heat pump 22b.

[0041] It should be noted that in Figure 2 , for the convenience of illustration, only two heat pumps 22a, 22b are shown, but it is a structure in which all the heat pumps for cooling and heating the five slides 11 shown in Figure 1 are thermally connected. In addition, the number of thermally connected heat pumps may be two or more, and there is no particular limitation.

[0042] In as Figure 1 , described later Figure 3 , Figure 4When the glass slides 11 are arranged linearly in this way, when all the heat pumps are collectively connected using a single heat conducting plate, the structure of the heat conducting plate 14 is simplified, and manufacturing and the like become easier. Additionally, when multiple heat conducting plates are used to separately connect the heat pumps instead of using a single heat conducting plate to thermally connect all the heat pumps, it has the effect of making it easier to handle repairs to the heat pumps and the like, so they can be used separately as appropriate.

[0043] When both the heat pumps 22a and 22b operate for the purpose of cooling the glass slides 11a and 11b, or when the heat absorbed by the heat absorption surface 23b and remaining to the extent that it hinders the cooling of the glass slide 11a is released from the surface of the air-cooled radiator 15 into the atmosphere.

[0044] Next, the driving method of the fan 16 will be described.

[0045] The heat remaining to the extent that it hinders the cooling of the glass slide 11 must be released from the surface of the air-cooled radiator 15 into the atmosphere, but if the amount of heat released is excessive, it will hinder the heating of the glass slide 11, and the power consumption of the heat pump 22 that drives to heat the glass slide 11 will increase.

[0046] Therefore, it is desirable to release an appropriate amount of heat into the atmosphere according to the driving conditions of the heat pump 22. The amount of heat released into the atmosphere increases in proportion to the air volume from the fan 16.

[0047] Therefore, a sensor for measuring the temperature of the heat pump 22, or a sensor for measuring the current value supplied to the heat pumps 22a and 22b composed of Peltier elements, and a control unit that receives the input value from the sensor and controls the rotation of the fan 16 are also provided.

[0048] For example, when most of the multiple heat pumps 22 are driven for cooling, the fan 16 provided near the heat pump 22 driven for cooling is driven at a duty ratio of 100%. Additionally, when the proportion of the heat pumps 22 driven for heating is large, the fan 16 provided near the heat pump 22 driven for heating is driven with a reduced duty ratio. When all the heat pumps 22 are driven for heating, by controlling to stop the fan 16 etc., the power consumption can be further reduced.

[0049] When the control of the fan 16 becomes complicated, by providing the same number of fans 16 as the heat pumps 22, a method of driving the fan 16 only when the heat pump 22 is driven for cooling can be adopted.

[0050] Next, the effects of this embodiment will be described.

[0051] The slide cooling / heating device 10 of embodiment 1 of the present invention comprises: a plurality of heat pumps 22a, 22b, which cool or heat a plurality of slides 11 one by one; a radiator, which promotes heat dissipation of the heat pumps 22a, 22b; and a heat conduction plate 14, which connects the radiator and the plurality of heat pumps 22a, 22b and thermally connects the plurality of heat pumps 22a, 22b.

[0052] Thus, when the heat pumps 22a and 22b are used to heat and cool a plurality of slide glasses 11 simultaneously, part of the heat released from the heat pumps 22a and 22b can be reused for heating adjacent slide glasses 11, thereby reducing power consumption of the heat pumps 22a and 22b.

[0053] The effect of this embodiment was verified by a heat circuit network. The heat circuit network method refers to a method of solving heat energy conservation by combining basic heat transfer equations. For example, if it is assumed that two Peltier elements (a type of heat pump) are connected and driven for the purpose of heating one to 70°C and cooling the other to 10°C at an ambient temperature of 40°C, then compared with the case where the two Peltier elements are thermally separated, the power consumption of the Peltier elements can be reduced by about 30% when the structure of this embodiment is adopted.

[0054] Furthermore, since the heat pumps 22a and 22b are Peltier elements, a small and simple device structure can be achieved.

[0055] Furthermore, by providing the heat spreader 21 between the slide glass 11 and the heat pumps 22 a and 22 b , the heating and cooling efficiency of the slide glass 11 can be improved.

[0056] Furthermore, by further providing the holder 12 for holding the slide glass 11 and the heat spreader 21 and the fixing table 13 for fixing the holder 12 , it is possible to avoid movement of the slide glass 11 during cooling or heating, thereby enabling efficient cooling or heating.

[0057] Furthermore, by using the air-cooling radiator 15 as the radiator, heat can be efficiently radiated in a case where it is difficult to recycle heat, and the performance as a cooling / heating device can be improved.

[0058] Furthermore, by further providing a fan 16 for sending cooling air to the air-cooling radiator 15 , the heat dissipation efficiency can be further improved.

[0059] Furthermore, by further providing the duct 17 disposed between the fan 16 and the air-cooling radiator 15 to improve the directivity of the wind from the fan 16 , the heat dissipation efficiency can be further improved.

[0060] <Implementation Method 2>

[0061] use Figure 3A description will be given of the slide cooling / heating device and the slide cooling / heating method according to Embodiment 2 of the present invention. Figure 3 It is a top view showing the main part of the slide cooling / heating device according to Embodiment 2.

[0062] As Figure 3 shown, the slide cooling / heating device 10A of the present embodiment uses an air-cooled radiator 15 and a pipe 17 to form an integrated forced air-cooling dedicated radiator 31.

[0063] The forced air-cooling dedicated radiator 31 has a ventilation path and a fin shape for the purpose of increasing the heat dissipation area inside. Therefore, the forced air-cooling dedicated radiator 31 receives heat from the heat conduction plate 14 and dissipates heat from the surface of the forced air-cooling dedicated radiator 31 to the atmosphere through heat transfer. The air coming out of the fan 16 passes through the ventilation path, thereby promoting heat dissipation based on heat transfer.

[0064] Other structures / operations are substantially the same as those of the slide cooling / heating device 10 and the slide cooling / heating method according to Embodiment 1 described above, and detailed description thereof is omitted.

[0065] In the slide cooling / heating device 10A and the slide cooling / heating method according to Embodiment 2 of the present invention, substantially the same effects as those of the slide cooling / heating device 10 and the slide cooling / heating method according to the foregoing Embodiment 1 can also be obtained.

[0066] In addition, by making the air-cooled radiator 15 and the pipe 17 integrated, it is not necessary to provide a plurality of fans 16 and pipes 17, and the structure can be simplified.

[0067] <Embodiment 3>

[0068] Use Figure 4 A description will be given of the slide cooling / heating device and the slide cooling / heating method according to Embodiment 3 of the present invention. Figure 4 It is a top view showing the main part of the slide cooling / heating device according to Embodiment 3.

[0069] As Figure 4 shown, the slide cooling / heating device 10B of the present embodiment uses a water-cooled radiator as the radiator, and is a device that replaces the air-cooled radiator 15, the fan 16, and the pipe 17 of the slide cooling / heating device 10 shown Figure 1 in with a water-cooling system.

[0070] The water-cooling system is composed of a water-cooled radiator 41 having a space for the coolant to flow inside, a pipe 42 for circulating the coolant, a pump 43 for circulating the coolant, and a heat exchanger 44 for cooling the coolant.

[0071] In the present embodiment, the coolant flowing inside the water-cooled radiator 41 receives heat from the heat conduction plate 14, and the heat exchanger 44 cools the coolant after the temperature rises. The cooled coolant circulates through the pump 43 and returns inside the water-cooled radiator 41 again, repeating a series of processes.

[0072] Other structures / operations are structures / operations that are substantially the same as those of the slide cooling / heating device 10 and the slide cooling / heating method of the above-described Embodiment 1, and detailed descriptions thereof are omitted.

[0073] As in the slide cooling / heating device 10B and the slide cooling / heating method of Embodiment 3 of the present invention, by using a water-cooled radiator as the radiator, effects substantially the same as those of the slide cooling / heating device 10 and the slide cooling / heating method of the aforementioned Embodiment 1 can also be obtained.

[0074] <Embodiment 4>

[0075] Use Figure 5 The slide cooling / heating device and the slide cooling / heating method according to Embodiment 4 of the present invention will be described. Figure 5 It is a plan view showing the main part of the slide cooling / heating device according to the present embodiment 4.

[0076] As Figure 5 shown, the slide cooling / heating device 10C of the present embodiment is different from the slide cooling / heating devices 10, 10A, and 10B of Embodiments 1 to 3, and a plurality of slides 11 are arranged radially.

[0077] In some cases, it is necessary to arrange the slides 11 radially. In such a case, as Figure 5 shown, by arranging the fixing table 13C, the heat conduction plate 14C, and the air-cooled radiator 15C in a circular shape, space saving of the device can be achieved.

[0078] For example, in the case of a processing device 52 that requires a certain process such as dispensing a reagent onto the slide 11, a rotating shaft 51 is provided to rotate the fixing table 13C, and the position of the slide 11 is changed as needed, so that the process can be performed without a mechanism for changing the position in the processing device 52.

[0079] Other structures / operations are structures / operations that are substantially the same as those of the slide cooling / heating device 10 and the slide cooling / heating method of the above-described Embodiment 1, and detailed descriptions thereof are omitted.

[0080] As in the slide cooling / heating device 10C and the slide cooling / heating method of Embodiment 4 of the present invention, by arranging multiple slides 11 in a radial pattern, it is also possible to obtain substantially the same effects as those of the slide cooling / heating device 10 and the slide cooling / heating method of the aforementioned Embodiment 1.

[0081] It should be noted that in this embodiment, it is possible to use the forced air cooling dedicated radiator as in Embodiment 2 and the water cooling radiator as in Embodiment 3.

[0082] <Embodiment 5>

[0083] Use Figures 6 to 8 The slide cooling / heating device and the slide cooling / heating method of Embodiment 5 of the present invention will be described. Figure 6 It is a top view showing the main part of the slide cooling / heating device of this Embodiment 5, Figure 7 It is a bottom view of the slide cooling / heating device, Figure 8 It is a top view of the air cooling unit of the slide cooling / heating device.

[0084] As Figure 6 And Figure 7 As shown, the slide cooling / heating device 10D of this embodiment replaces the heat conduction plate 14C and the air cooling radiator 15C in the slide cooling / heating device 10C of Embodiment 4 with an air cooling unit 60.

[0085] As Figure 8 Shown, the air cooling unit 60 is composed of a heat conduction plate 14D, an air cooling radiator 15D, a fan 16D, and a pipe 17D. The heat conduction plate 14D is provided with protrusions 81 so as to be able to contact the heat pumps 22a, 22b. In the air cooling unit 60, in order to thermally connect different heat pumps 22a, 22b, at least two or more protrusions 81 are provided. It should be noted that the protrusions 81 may not be provided, and the lower surfaces of the heat pumps 22a, 22b may be set to the same height as the lower surface of the fixed table 13D.

[0086] Other structures / operations are substantially the same as those of the slide cooling / heating device 10C and the slide cooling / heating method of the above-mentioned Embodiment 4, and their detailed descriptions are omitted.

[0087] In the slide cooling / heating device 10D and the slide cooling / heating method of Embodiment 5 of the present invention, it is also possible to obtain substantially the same effects as those of the slide cooling / heating device 10C and the slide cooling / heating method of the aforementioned Embodiment 4.

[0088] In addition, in the present embodiment, compared with Embodiment 4, the volumes of the heat conduction plate and the air-cooled radiator can be reduced, so there is an advantage of achieving weight reduction.

[0089] It should be noted that in the present embodiment, as the air-cooling unit, a dedicated forced air-cooling radiator or a water-cooled radiator can also be used as in Embodiments 2 and 3.

[0090] <Other>

[0091] Furthermore, the present invention is not limited to the above-described embodiments and includes various modification examples. The above-described embodiments are embodiments described in detail for easy understanding of the present invention and are not limited to having all the structures described.

[0092] In addition, a part of the structure of a certain embodiment can be replaced with the structure of another embodiment. Moreover, the structure of another embodiment can be added to the structure of a certain embodiment. In addition, for a part of the structure of each embodiment, other structures can also be added / deleted / replaced.

[0093] Symbol Explanation

[0094] 10, 10A, 10B, 10C, 10D—Slide cooling / heating device; 11, 11a, 11b—Slide; 12—Bracket; 13, 13C, 13D—Fixed table; 14, 14C, 14D—Heat conduction plate; 15, 15C, 15D—Air-cooled radiator (radiator); 16, 16D—Fan; 17, 17D—Pipe; 21—Heat equalizer; 22a, 22b—Heat pump; 23a, 23b—Heat absorption surface; 24a, 24b—Heat dissipation surface; 31—Dedicated forced air-cooling radiator (radiator); 41—Water-cooled radiator (radiator); 42—Pipe; 43—Pump; 44—Heat exchanger; 51—Rotating shaft; 52—Processing device; 60—Air-cooling unit; 81—Protrusion.

Claims

1. A glass slide cooling / heating device, characterized in that, Comprising: A plurality of heat pumps for cooling or heating a plurality of glass slides one by one; A radiator for promoting heat dissipation of the heat pump; and A heat conducting plate connecting the radiator to the plurality of heat pumps and thermally connecting the plurality of heat pumps.

2. The glass slide cooling / heating device according to claim 1, characterized in that The heat pump is a Peltier element.

3. The glass slide cooling / heating device according to claim 1, characterized in that A heat equalizer is further provided between the glass slide and the heat pump.

4. The slide cooling / heating device according to claim 3, characterized in that, Further comprising: A bracket for holding the glass slide and the heat equalizer; and A fixing table for fixing the bracket.

5. The glass slide cooling / heating device according to claim 1, characterized in that An air-cooled radiator is used as the radiator.

6. The glass slide cooling / heating device according to claim 5, characterized in that A fan is further provided, and the fan conveys cooling air to the air-cooled radiator.

7. The glass slide cooling / heating device according to claim 6, characterized in that A duct is further provided, and the duct is arranged between the fan and the air-cooled radiator to improve the directivity of the air from the fan.

8. The glass slide cooling / heating device according to claim 7, characterized in that The air-cooled radiator and the duct are of an integrated type.

9. The glass slide cooling / heating device according to claim 1, characterized in that A water-cooled radiator is used as the radiator.

10. The glass slide cooling / heating device according to claim 1, characterized in that The plurality of glass slides are arranged in a straight line.

11. The glass slide cooling / heating device according to claim 1, characterized in that The plurality of glass slides are arranged radially.

12. A method for cooling / heating a glass slide, which is a method for cooling / heating a plurality of glass slides, characterized in that The glass slides are cooled / heated in a state where a plurality of heat pumps for cooling or heating the plurality of glass slides one by one are thermally connected by a heat conducting plate.

Images