Sensing system, chip packaging structure, sequencing slide and sequencing method

Abstract

The invention discloses a sensing system, a chip packaging structure, a sequencing slide glass and a sequencing method, the sensing system comprises at least two sensing substrates with sensing site arrays, and the at least two sensing substrates are mutually spaced and stacked; the sensing site arrays of the two adjacent sensing substrates in the stacking direction of the sensing substrates are oppositely arranged at intervals to form fluid channels, and the sensing site arrays are exposed to the fluid channels respectively; each sensing substrate comprises a sensing layer close to the fluid channel and a sensor layer stacked on the side, away from the fluid channel, of the sensing layer, and the sensing site array is arranged on the sensing layer; the sensor layer is provided with a sensor for collecting a sensing signal at a sensing site; the sensing system further comprises a signal transmission structure; the signal transmission structures are electrically connected with the sensor layers of the two adjacent sensing substrates in the stacking direction respectively and transmit sensing signals to the outside of the sensing system.

Description

Sensing system, chip packaging structure, sequencing slide and sequencing method Technical Field

[0001] The present application relates to the technical field of biomolecule analysis, for example, to a sensing system, a chip packaging structure, a sequencing slide, and a sequencing method. Background Art

[0002] Biochips are important tools for solution-based analysis of single-molecule life's key building blocks, including nucleic acids, proteins, polysaccharides, and a wide range of other biomolecules that play a vital role in life and healthcare. For example, a gene sequencing slide is a biochip used to sequence DNA.

[0003] Traditional sequencing systems typically use lasers to excite fluorescent dyes bound to the surface of a biochip. Optical lenses and cameras positioned above the biochip then capture the fluorescence image, allowing for analysis of biomolecules. However, this approach suffers from significant optical interference, complex lens structures, low sequencing quality, and low sequencing throughput (small numbers of biomolecules sequenced per run).

[0004] With the development of large-scale integrated circuit technology, sensor chips based on optical and electrical sensing are being applied to sequencing systems and used to prepare biochips. This eliminates the need for complex optical lens systems and lasers, reducing costs and improving sequencing quality. However, increasing sequencing throughput and reducing reagent waste remain pressing challenges.

[0005] Summary of the Invention

[0006] The present application provides a sensing system, a chip packaging structure, a sequencing carrier and a sequencing method to improve sequencing throughput and reduce reagent waste.

[0007] In a first aspect, the present application provides a sensing system, comprising:

[0008] At least two sensing substrates having arrays of sensing sites, wherein the at least two sensing substrates are spaced apart from each other and stacked;

[0009] The sensing site arrays of two adjacent sensing substrates along the stacking direction of the sensing substrates are opposite and spaced apart to form a fluid channel, and the sensing site arrays of the two adjacent sensing substrates are respectively exposed to the fluid channel;

[0010] Each sensing substrate includes a sensing layer close to the fluid channel and a sensor layer stacked on a side of the sensing layer away from the fluid channel. The sensing site array of each sensing substrate is arranged on the sensing layer; the sensor layer has sensors for collecting sensing signals at the sensing sites;

[0011] The sensing system further includes a signal transmission structure; the signal transmission structure is electrically connected to the sensor layers of two sensing substrates adjacent to each other along the stacking direction, and transmits the sensing signal to the outside of the sensing system.

[0012] In a second aspect, the present application provides a chip packaging structure, comprising an upper substrate, a lower substrate, and a support member separating the upper and lower substrates, wherein the upper and lower substrates are arranged opposite to each other and spaced apart to form a fluid channel, and the support member is sandwiched between the upper and lower substrates. The chip packaging structure further comprises:

[0013] a first sensing chip mounted on the upper substrate, the first sensing chip having a first sensing site array exposed to the fluid channel; and

[0014] A second sensing chip mounted on the lower substrate, the second sensing chip having a second array of sensing sites exposed to the fluid channel, the second array of sensing sites being opposite and spaced apart from the first array of sensing sites; the first sensing chip and the second sensing chip each comprising a sensing layer proximal to the fluid channel and a sensor layer stacked on a side of the sensing layer away from the fluid channel; the first and second arrays of sensing sites being disposed on the sensing layer; and the sensor layer having sensors for collecting sensing signals at the sensing sites.

[0015] The supporting component has a signal transmission mechanism; the signal transmission mechanism is electrically connected to the sensor layers of the first sensing chip and the second sensing chip respectively, and transmits the sensing signal to the outside of the chip packaging structure.

[0016] In a third aspect, the present application provides a sequencing slide, comprising:

[0017] At least one sequencing chipset; each sequencing chipset includes two sequencing chip layers, and each sequencing chip layer includes at least one sensor chip; the sensing surfaces of the sensor chips of the two sequencing chip layers in the same sequencing chipset are arranged opposite to each other with a gap therebetween; the sensing surface of the sensor chip includes a sensing area, and the sensing area is provided with arrayed sequencing sites;

[0018] At least one first signal transmission structure; the first signal transmission structures are electrically connected to the sensor chips in the same sequencing chip group, and transmit the detection signal of the sensor chip to the outside of the sequencing carrier.

[0019] In a fourth aspect, the present application provides a sequencing method using a sequencing slide, wherein the sequencing slide includes at least one sequencing chipset, the sequencing chipset includes two sequencing chip layers, and each sequencing chip layer includes at least one sensor chip; the sensing surfaces of the sensor chips of the two sequencing chip layers in the same sequencing chipset are arranged opposite to each other with a gap therebetween; the sensing surface of the sensor chip includes a sensing area, and the sensing area is provided with arrayed sequencing sites; the sequencing method comprises:

[0020] The library to be tested is fixed on the sequencing sites of the two sequencing chip layers in the same sequencing chipset, and multiple rounds of sequencing reactions are performed. In each round of sequencing reaction, the sequencing sites simultaneously generate reaction signals; the sensor chips of the two sequencing chip layers in the same sequencing chipset collect the reaction signals and then perform the next round of sequencing reaction; the sensor chips collect the reaction signals and generate corresponding detection signals, and the detection signals are transmitted to the outside of the sequencing carrier via the first signal transmission structure, and the first signal transmission structure is electrically connected to the sensor chips in the same sequencing chipset respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG1 is a schematic structural diagram of a sensing system provided in an embodiment of the present application;

[0022] FIG2 is a schematic structural diagram of another sensing system provided in an embodiment of the present application;

[0023] FIG3 is a schematic structural diagram of another sensing system provided in an embodiment of the present application;

[0024] FIG4 is a schematic structural diagram of a chip packaging structure provided in an embodiment of the present application;

[0025] FIG5 is a schematic structural diagram of another chip packaging structure provided in an embodiment of the present application;

[0026] FIG6 is a schematic top view of a chip packaging structure provided in an embodiment of the present application;

[0027] FIG7 is a schematic diagram of a top view of a sequencing slide provided in an embodiment of the present application;

[0028] FIG8 is a schematic cross-sectional view of the sequencing slide taken along AA′ in FIG7 ;

[0029] FIG9 is a schematic diagram of a partial top view of the sequencing slide corresponding to FIG8 ;

[0030] FIG10 is a schematic diagram of a three-dimensional structure of a shell in a sequencing slide corresponding to FIG7 ;

[0031] FIG11 is another schematic cross-sectional view of the sequencing slide taken along AA′ in FIG7 ;

[0032] FIG12 is another schematic cross-sectional view of the sequencing slide taken along AA′ in FIG7 ;

[0033] FIG13 is another schematic cross-sectional view of the sequencing slide taken along AA′ in FIG7 ;

[0034] FIG14 is another schematic cross-sectional view of the sequencing slide taken along AA′ in FIG7 ;

[0035] FIG15 is a schematic diagram of a partial top view of the sequencing slide corresponding to FIG14;

[0036] FIG16 is a schematic diagram of another three-dimensional structure of a shell in a sequencing slide provided in an embodiment of the present application;

[0037] FIG17 is a schematic diagram of a top view of the structure of a sequencing slide corresponding to FIG16 ;

[0038] FIG18 is a schematic cross-sectional view of the sequencing slide taken along BB′ in FIG17 ;

[0039] FIG19 is a schematic cross-sectional view of the sequencing slide taken along CC′ in FIG17 ;

[0040] FIG20 is a schematic diagram of a partial top view of the sequencing slide corresponding to FIG19;

[0041] FIG21 is another schematic cross-sectional view of the sequencing slide taken along BB′ in FIG17 ;

[0042] FIG22 is another schematic cross-sectional view of the sequencing slide taken along CC′ in FIG17 ;

[0043] FIG23 is another schematic cross-sectional view of the sequencing slide taken along CC′ in FIG17 ;

[0044] FIG24 is a schematic diagram of a partial top view of the sequencing slide corresponding to FIG23 . DETAILED DESCRIPTION

[0045] FIG1 is a schematic structural diagram of a sensing system provided in an embodiment of the present application. As shown in FIG1 , the sensing system 30 provided in an embodiment of the present application includes at least two sensing substrates 302 having a sensing site array (an array consisting of a plurality of sensing sites 301). The at least two sensing substrates 302 are spaced apart from each other and stacked. The sensing site arrays 301 (the same as the sensing sites 301 are marked, the same below) of the two adjacent sensing substrates 302 along the stacking direction of the sensing substrates 302 are opposite and spaced apart to form a fluid channel 303. The sensing site arrays 301 are exposed to the air. The sensing system 30 is exposed to the fluid channel 303; each sensing substrate 302 includes a sensing layer 304 close to the fluid channel 303 and a sensor layer 305 stacked on the side of the sensing layer 304 away from the fluid channel 303, and the sensing site array 301 is set on the sensing layer 304; the sensor layer 305 has sensors for collecting sensing signals at the sensing sites; the sensing system 30 also includes a signal transmission structure 306; the signal transmission structure 306 is electrically connected to the sensor layers 305 of the two sensing substrates 302 adjacent to each other along the stacking direction, and transmits the sensing signal to the outside of the sensing system 30.

[0046] As described above, the sensing site array is composed of a plurality of sensing sites 301 arranged in an array in the sensing layer 304. For example, the sensors in the sensor layer 305 are arranged in a one-to-one correspondence with the sensing sites 301 in the sensing layer 304. The sensing site array 301 is used to fix the sample to be detected. In this way, the sensors in the sensor layer 305 can collect sensing signals at the corresponding sensing sites and transmit the sensing signals to the outside of the sensing system via the signal transmission structure 306, so that an external analysis device (such as a computer) can analyze the sample to be detected based on the sensing signals.

[0047] As shown in FIG1 , the signal transmission structure 306 includes a conductive mechanism 308 , which refers to a structure such as a signal transmission line. The conductive mechanism 308 in the signal transmission structure 306 can transmit sensing signals of multiple sensors to outside the sensing system.

[0048] Exemplarily, FIG1 illustrates a sensing system 30 including two sensing substrates 302. In this embodiment, since both sensing substrates 302 have sensing site arrays 301, and the sensing site arrays 301 of the two are relatively spaced apart to form a fluid channel 303, the sensing site arrays 301 are both exposed to the fluid channel 303. In this way, during the sequencing process, when the reagent carrying the sample to be detected enters the fluid channel 303, the sensing site arrays 301 on the two sensing substrates 302 can fix the sample to be detected, thereby increasing the number of samples that can be fixed in a single sequencing, detecting more samples to be detected at one time, increasing sequencing throughput, and reducing reagent waste.

[0049] In other embodiments, the sensing system 30 may include a larger number of sensing substrates 302, so that more fluid channels can be formed, further improving the sequencing throughput and reducing reagent waste. For example, Figure 2 is a structural schematic diagram of another sensing system provided in an embodiment of the present application. Figure 2 is an example of a sensing system 30 including four sensing substrates 302. As shown in Figure 2, along the stacking direction of the sensing substrates 302, the sensing site arrays 301 of each two adjacent sensing substrates 302 are relative and spaced apart to form a fluid channel 303. In this way, the sensing site arrays 301 on the two sensing substrates 302 corresponding to each fluid channel 303 can fix the sample to be detected, thereby further improving the sequencing throughput and reducing reagent waste.

[0050] It should be noted that Figures 1 and 2 only illustrate the example of the signal transmission structure 306 having a portion located between two adjacent sensing substrates 302. The embodiment of the present application does not limit the setting method of the signal transmission structure 306. As long as the signal transmission structure 306 is electrically connected to the sensor layers 305 of the two adjacent sensing substrates 302 along the stacking direction, the sensing signals of multiple sensors in the sensor layer 305 of the sensing substrate 302 can be transmitted to the outside of the sensing system.

[0051] In summary, the embodiment of the present application sets up a sensing system including at least two sensing substrates with sensing site arrays, so that the at least two sensing substrates are spaced apart and stacked from each other, and the sensing site arrays of the two sensing substrates adjacent along the stacking direction of the sensing substrates are opposite and spaced apart to form a fluid channel, so that the sensing site arrays are all exposed to the fluid channel. In addition, each sensing substrate includes a sensing layer close to the fluid channel and a sensor layer stacked on the side of the sensing layer away from the fluid channel. The sensing site array is set in the sensing layer, and the sensor layer has sensors for collecting sensing signals at the sensing sites. The sensing system also includes a signal transmission structure, which is electrically connected to the sensor layers of the two sensing substrates adjacent along the stacking direction. In this way, when a reagent carrying a sample to be detected enters the fluid channel, the sensing site arrays on the sensing substrates on both sides of the fluid channel can fix the sample to be detected, so that the sensors in the sensing substrate collect the sensing signals at the sensing sites, and use the signal transmission structure to transmit the sensing signals to the outside of the sensing system, thereby increasing sequencing throughput and reducing reagent waste.

[0052] 1 , for example, the sensing system 30 includes a spacer 307 located within the fluid channel 303 and sandwiched between two adjacent sensing substrates 302 along the stacking direction. The spacer 307 supports the two opposing, spaced-apart sensing substrates 302, ensuring structural stability of the sensing system.

[0053] Continuing with FIG1 , in one embodiment, for example, the signal transmission structure 306 includes a conductive mechanism 308 formed within the spacer 307 and electrically connected to two adjacent sensing substrates 302. This arrangement enables the signal transmission structure 306 located between two adjacent sensing substrates 302 to simultaneously perform signal transmission and support the sensing substrates 302. This ensures signal transmission and product structural stability while also reducing the overall thickness of the sensing system.

[0054] FIG3 is a schematic diagram of the structure of another sensing system provided by an embodiment of the present application. As shown in FIG3 , in other embodiments, the signal transmission structure 306 may be selected to have a portion located on the side of the sensing substrate 302 away from the fluid channel 303, so that the signal transmission structure 306 can be electrically connected to the sensor layers 305 of two adjacent sensing substrates 302 along the stacking direction, thereby transmitting the sensing signals of multiple sensors to the outside of the sensing system. In this case, the spacer 307 can be provided to support the two opposing and spaced sensing substrates 302 to ensure the structural stability of the sensing system.

[0055] For example, the sensor is a photoelectric sensor or a nanopore sensor. A photoelectric sensor can collect optical signals at a sensing site, convert them into electrical signals, and transmit the electrical signals to an external sensing system using a signal transmission structure for analysis by an analytical device. A nanopore sensor can collect changes in electrical signals at a nanopore (sensing site) and transmit the electrical signals to an external sensing system using a signal transmission structure for analysis by an analytical device.

[0056] For example, the sample to be tested includes a nucleic acid macromolecule. Exemplary, the sample to be tested may include any of the following many components. For example, it may contain a nucleic acid macromolecule (e.g., DNA, RNA, etc.), a protein, etc. The sample can be analyzed to determine gene sequence, DNA-DNA hybridization, single nucleotide polymorphism, protein interaction, peptide interaction, antigen-antibody interaction, glucose monitoring, cholesterol monitoring, etc.

[0057] In some embodiments, the sample to be detected is a nucleic acid, such as DNA. A DNA biomolecule can be, but is not limited to, a DNA nanoball (single-stranded concatemer) that hybridizes with a labeled probe (e.g., in DNB sequencing by ligation or cPAL methods) or with a complementary growing chain (e.g., in DNB sequencing by synthesis methods) or with both; or hybridizes with a single DNA molecule (e.g., in single molecule sequencing); or hybridizes with a cloned DNA molecule population, such as generated in bridge PCR-based sequencing. Therefore, the “biomolecule,” “DNA macromolecule,” or “nucleic acid macromolecule” mentioned in this application can include more than one molecule (e.g., a DNA cluster of a cloned population of DNA molecules or a DNB associated with multiple growing complementary chains or comprising hundreds or thousands of DNA molecules).

[0058] The present application also provides a chip packaging structure that can be applied to the analysis and detection of samples to be detected. The samples to be detected and the detection items thereof can be referred to the description of the above-mentioned sensing system embodiment, which will not be repeated here.

[0059] FIG4 is a schematic structural diagram of a chip packaging structure provided in an embodiment of the present application. As shown in FIG4 , the chip packaging structure 70 provided in an embodiment of the present application includes an upper substrate 701, a lower substrate 702, and a support member 703 separating the upper substrate 701 and the lower substrate 702. The upper substrate 701 and the lower substrate 703 are arranged relative to each other and spaced apart to form a fluid channel 704. The support member 703 is sandwiched between the upper substrate 701 and the lower substrate 702. The chip packaging structure 70 also includes a first sensing chip 705 mounted on the upper substrate 701, the first sensing chip 705 having a first sensing site array 706 exposed to the fluid channel 704; and a second sensing chip 707 mounted on the lower substrate 702, the second sensing chip 707 having a first sensing site array 706 exposed to the fluid channel 704. The second sensing site array 708 is opposite to the first sensing site array 706 and is spaced apart from each other. The first sensing chip 705 and the second sensing chip 707 respectively include a sensing layer 709 close to the fluid channel 704 and a sensor layer 710 stacked on the side of the sensing layer 709 away from the fluid channel 704. The first sensing site array 706 and the second sensing site array 708 are arranged on the sensing layer 709. The sensor layer 710 has sensors for collecting sensing signals at the sensing sites. The support member 703 has a signal transmission mechanism 711. The signal transmission mechanism 711 is electrically connected to the sensor layers 710 of the first sensing chip 705 and the second sensing chip 707, respectively, and transmits the sensing signals to the outside of the chip package structure 70.

[0060] For example, the sensors in the sensor layer 710 of the first sensing chip 705 and the second sensing chip 707 may be photosensors or nanopore sensors.

[0061] Both the first sensing site array 706 and the second sensing site array 708 are composed of a plurality of sensing sites arranged in an array. For example, the sensors in the first sensing chip 705 are arranged in a one-to-one correspondence with the sensing sites in the first sensing site array 706, and the sensors in the second sensing chip 707 are arranged in a one-to-one correspondence with the sensing sites in the second sensing site array 708. Both the first sensing site array 706 and the second sensing site array 708 are used to secure samples to be detected. Thus, the sensors in the sensor layer 710 can collect sensing signals at the corresponding sensing sites and then transmit the sensing signals to the outside of the chip packaging structure via the signal transmission mechanism 711. Because both the first sensing site array 706 and the second sensing site array 708 can secure samples to be detected, the number of samples that can be detected in a single test can be increased, improving sequencing throughput and reducing reagent waste.

[0062] Among them, the signal transmission mechanism 711 can be understood as a routing structure for transmitting sensing signals. As shown in Figure 4, the support member 703 has a signal transmission mechanism 711, and the signal transmission mechanism 711 is electrically connected to the sensor layer 710 of the first sensing chip 705 and the second sensing chip 707 respectively, so that the sensing signals of multiple sensors can be transmitted to the outside of the chip packaging structure.

[0063] It should be noted that the upper substrate 701 can be mounted with at least one first sensing chip 705, and the lower substrate 702 can be mounted with at least one second sensing chip 707. The present embodiment of the application does not limit the number of sensing chips mounted on the upper substrate 701 and the lower substrate 702. For example, as shown in FIG4 , when multiple sensing chips are mounted on the upper substrate 701 and the lower substrate 702, respectively, a spacer 712 having signal transmission wiring can be provided within the fluid channel 704, so that the wiring in the support member 703 and the spacer 712 are connected, so that the sensing signals of the sensors of the multiple sensing chips can be transmitted to the outside of the chip packaging structure using the signal transmission mechanism 711.

[0064] It should be noted that the electrical connection method between the signal transmission mechanism 711 and the sensor layer 710 of the first sensing chip 705 and the second sensing chip 707 shown in Figure 4 is only illustrative and not limiting. Those skilled in the art may adopt other methods to electrically connect the signal transmission mechanism 711 with the sensor layer 710 of the first sensing chip 705 and the second sensing chip 707, and the embodiments of the present application are not limited to this.

[0065] The chip packaging structure provided in the embodiment of the present application includes an upper substrate and a lower substrate, and a first sensing chip and a second sensing chip are respectively mounted on the upper substrate and the lower substrate, and a first sensing site array of the first sensing chip and a second sensing site array of the second sensing chip are relatively spaced apart and are both exposed to the fluid channel. In addition, the support member between the upper substrate and the lower substrate has a signal transmission mechanism, and the signal transmission mechanism is electrically connected to the sensor layers of the first sensing chip and the second sensing chip, respectively. In this way, when the sequencing reagent enters the fluid channel, the first sensing site array of the first sensing chip and the second sensing site array of the second sensing chip can both fix the sample to be detected, so that the sensor in the sensor layer collects the sensing signal at the corresponding sensing site, and uses the signal transmission mechanism to transmit the sensing signal to the outside of the chip packaging structure, thereby increasing the sequencing throughput and reducing reagent waste.

[0066] FIG5 is a schematic diagram of another chip packaging structure provided by an embodiment of the present application. Referring to FIG5 , for example, an upper substrate 701 is provided with a first circuit 713 electrically connecting the sensor layer 710 of a first sensing chip 705 and a signal transmission mechanism 711, and a lower substrate 702 is provided with a second circuit 714 electrically connecting the sensor layer 710 of a second sensing chip 707 and the signal transmission mechanism 711. With this arrangement, the signal transmission mechanism 711 in the support member 703 can be electrically connected to the sensor layer 710 of the first sensing chip 705 via the first circuit 713 in the upper substrate 701, and to the sensor layer 710 of the second sensing chip 707 via the second circuit 714 in the lower substrate 702, thereby transmitting sensing signals from multiple sensors in the sensor layer 710 to the outside of the chip packaging structure.

[0067] As shown in Figure 5, the first sensing chip 705 can be electrically connected to the first circuit 713 in the upper substrate 701 through the solder pad 715 on the back side thereof, and the second sensing chip 707 can be electrically connected to the second circuit 714 in the lower substrate 702 through the solder pad 715 on the back side thereof. The first circuit 713 and the second circuit 714 shown in Figure 5 only illustrate their electrical connection relationship with the sensor layer 710 and the signal transmission mechanism 711, and do not represent the actual wiring situation of the first circuit and the second circuit. For example, the wiring method of the first circuit and the second circuit can be designed according to actual conditions, and the embodiments of the present application are not limited to this.

[0068] In addition, referring to Figure 5, when the first circuit 713 and the second circuit 714 are respectively provided in the upper substrate 701 and the lower substrate 702, a spacer component 716 can also be provided between the first sensing chip 705 and the second sensing chip 707 to assist the support member 703 in supporting the upper substrate 701 and the lower substrate 702, thereby improving the stability of the chip packaging structure.

[0069] FIG6 is a schematic top view of a chip packaging structure provided in an embodiment of the present application. As shown in FIG6 , for example, an upper substrate 701 is mounted with a plurality of first sensing chips 705, and a plurality of first sensing chips 704 are arranged in an array with spacing therebetween. Similarly, for example, a lower substrate 702 is mounted with a plurality of second sensing chips 707, and a plurality of second sensing chips 707 are arranged in an array with spacing therebetween.

[0070] For example, a fluid inlet connected to the fluid channel is provided on the upper substrate or the lower substrate; a fluid outlet connected to the fluid channel is provided on the upper substrate or the lower substrate. For example, FIG6 illustrates the example of a fluid inlet 717 and a fluid outlet 718 both being provided on the upper substrate 701. In other embodiments, the fluid inlet and the fluid outlet can be provided on the lower substrate at the same time, or the fluid inlet and the fluid outlet can be provided on the upper substrate and the lower substrate respectively. For example, the fluid inlet is provided on the upper substrate and the fluid outlet is provided on the lower substrate, or the fluid outlet is provided on the upper substrate and the fluid inlet is provided on the lower substrate. The embodiments of the present application are not limited to this. By providing the fluid inlet and the fluid outlet on the upper substrate and the lower substrate, the sequencing reagent can be injected through the fluid inlet, so that the sequencing reagent flows out from the fluid outlet after passing through the fluid channel. When flowing through the fluid channel, the sample to be detected in the reagent can be fixed by the first sensing site array and the second sensing site array, thereby realizing the analysis and detection of the sample to be detected.

[0071] The following describes the technical solution of this application in detail, using a sequencing slide for gene sequencing as an example. Sequencing slides based on optical or electrical sensing sensors in related art typically include a first substrate and a second substrate positioned opposite each other. The first substrate houses the sensor chip, while the second substrate serves as a protective cover. Consequently, sequencing slides can only sequence a small number of biomolecules at a time, resulting in low sequencing throughput and reagent waste.

[0072] The present application provides a sequencing carrier. FIG7 is a schematic diagram of a top view of a sequencing carrier provided in an embodiment of the present application, FIG8 is a schematic diagram of a cross-sectional structure of the sequencing carrier taken along line AA' in FIG7 , and FIG9 is a schematic diagram of a partial top view of the sequencing carrier corresponding to FIG8 . As shown in FIG7 , FIG8 and FIG9 , the sequencing carrier 100 provided in an embodiment of the present application includes at least one sequencing chip set 1 and at least one first signal transmission structure 2; the sequencing chip set 1 includes two sequencing chip layers 11, each sequencing chip layer 11 including at least one sensor chip 111; the sensing surfaces F1 of the sensor chips 111 of the two sequencing chip layers 11 in the same sequencing chip set 1 are arranged opposite to each other with a gap therebetween; the sensing surface F1 of the sensor chip 111 includes a sensing area S1, on which an array of sequencing sites 4 is arranged; and the first signal transmission structure 2 is electrically connected to the sensor chips 111 in the same sequencing chip set 1, respectively, and transmits the detection signal of the sensor chip 111 to the outside of the sequencing carrier.

[0073] Illustratively, the sequencing slide provided in the embodiments of the present application may be, for example, a gene sequencing slide, which is used for DNA sequencing, ie, analyzing the base sequence of DNA fragments.

[0074] Among them, the sensor chip 111 is the core component of the sequencing slide. For example, it can be a sensor chip 111 used to collect optical signals or electrical signals generated by the sample during the sequencing process. The optical signals or electrical signals collected by the sensor chip 111 can then be analyzed to obtain the base sequence, thereby achieving gene sequencing. As shown in Figures 7 and 8, for example, each sequencing chip layer 11 has multiple sensor chips 111 arranged in an array. The multiple sensor chips 111 are arranged along a first direction D1 and a second direction D2 parallel to the plane of the sequencing chip layer 11, and the first direction D1 and the second direction D2 intersect.

[0075] As shown in FIG8 , the sensor chip 111 is provided with an array of sequencing sites 4, which are used to "capture" the DNA to be tested so that the sensor can collect signals. Sequencing sites 4 may have different structures for different types of sensor chips 111, and this embodiment of the present application does not limit this.

[0076] For example, the sensor chip 111 includes a photosensor chip or a nanopore sensor chip.

[0077] For the photosensor chip, sequencing site 4 can be a DNB (DNA Nanoball) fixed structure for immobilizing DNBs. By using appropriate reagents, the bases in the DNA can specifically bind to the luciferase and substrate in the reagents, achieving self-luminescence. In this way, the photosensor chip can collect the light signal generated during the sequencing process and generate a corresponding detection signal (electrical signal) output. The analysis equipment can then analyze the detection signal output by the photosensor chip to obtain the base sequence, thus achieving gene sequencing.

[0078] For a nanopore sensor chip, sequencing site 4 can be a nanopore through which the DNA strand passes. Nanopore sequencing technology is essentially based on electrical signal sequencing. Its principle is that a covalently bound molecular linker within the nanopore causes a change in charge as the DNA strand passes through the nanopore channel, affecting the current intensity flowing through the nanopore. Different bases generate different current intensities as they pass through the nanopore. Thus, the nanopore sensor chip can detect the changes in the current in the nanopore and generate a corresponding detection signal output. This signal is then analyzed by an analytical device to determine the base sequence, achieving gene sequencing.

[0079] Gene sequencing based on photoelectric sensor chips or nanopore sensor chips does not require the use of complex optical lens systems and lasers, thereby reducing costs and improving sequencing quality.

[0080] For example, as shown in FIG8 , in this embodiment, a sequencing carrier 100 includes at least one sequencing chipset 1, which includes two sequencing chipset layers 11, such as a first sequencing chipset layer 11-1 and a second sequencing chipset layer 11-2. Each sequencing chipset layer 11 includes a plurality of sensor chips 111 arranged in an array. Furthermore, within the same sequencing chipset 1, the sensing surfaces F1 of the sensor chips 111 of the two sequencing chipset layers 11 are disposed opposite each other with a gap therebetween. That is, the two sequencing chipset layers 11 within the same sequencing chipset 1 are disposed opposite each other with a gap therebetween. With this arrangement, when a reagent carrying DNA enters the gap, the sequencing sites 4 on the sensor chips 111 in both the first sequencing chipset layer 11-1 and the second sequencing chipset layer 11-2 can capture the DNA, and the sensor chips 111 in both the first sequencing chipset layer 11-1 and the second sequencing chipset layer 11-2 can collect optical / electrical signals, thereby achieving the aforementioned gene sequencing. This can significantly increase sequencing throughput and reduce reagent waste.

[0081] It should be noted that FIG8 illustrates only an example in which a sequencing slide 100 includes a single sequencing chipset 1. This allows for sequencing of DNA fragments at least twice the sequencing throughput of conventional techniques during the sequencing process. Of course, in other embodiments, the sequencing slide may include a greater number of sequencing chipsets 1 to further increase sequencing throughput, and this embodiment of the present application is not limited thereto.

[0082] It should also be noted that FIG7 only illustrates an example of a sequencing chip layer 11 including 9 sensor chips 111. The embodiment of the present application does not limit the number of sensor chips 111 in the sequencing chip layer 11. In addition, as shown in FIG8 , the multiple sensor chips 111 in a sequencing chip layer 11 can be multiple independent sensor chips 111, with a certain gap between adjacent sensor chips 111. This setting is not limiting. In other embodiments, the multiple sensor chips 111 in a sequencing chip layer 11 can also be integrated into the same wafer. In other words, a sequencing chip layer 11 is a sensor chip wafer. This setting will be exemplified later.

[0083] For example, the first direction D1 and the second direction D2 are orthogonal to each other. In this configuration, the sensor chips 111 can be arranged in a rectangular array, thereby ensuring the alignment accuracy between the sensor chips 111 .

[0084] For example, in this embodiment, the detection signal of the sensor chip 111 can be transmitted to the outside of the sequencing carrier through the first signal transmission structure 2, and then received by the analysis device, so that the analysis device analyzes the base sequence according to the detection signal of the sensor chip 111 to achieve gene sequencing.

[0085] The first signal transmission structure 2 includes a signal transmission line for transmitting the detection signal of the sensor chip 111. For example, the number of first signal transmission structures 2 is the same as the number of sequencing chip groups 1, and the sensor chips 111 in the same sequencing chip group 1 are all electrically connected to the signal transmission line in the first signal transmission structure 2.

[0086] As shown in FIG. 8 , for example, the sequencing slide 100 further includes a plurality of signal output terminals 3 , and the signal output terminals 3 are electrically connected to the first signal transmission structure 2 .

[0087] Signal output terminal 3 can be understood as an external pin of the sequencing slide, which is used to electrically connect to an analytical device (such as a computer) to output the detection signal from sensor chip 111 to the analytical device, allowing the analytical device to analyze the base sequence based on the detection signal to achieve gene sequencing. It is understood that during the sequencing process, signal output terminal 3 does not come into contact with the reagents.

[0088] It should be noted that Figure 8 only illustrates the electrical connection relationship between the first signal transmission structure 2 and the sensor chip 111 and the signal output terminal 3. Any first signal transmission structure with any structure that can transmit the detection signal of the sensor chip 111 in the same sequencing chip group 1 to the signal output terminal 3 is acceptable. This embodiment does not limit this, and the specific structure of the first signal transmission structure 2 will be further explained later.

[0089] It should also be noted that the sequencing carrier 100 can also be electrically connected to the analysis equipment in other ways, and the signal output terminal 3 can be set or not according to actual needs. The embodiment of the present application does not limit this, and the following description will only take the sequencing carrier 100 including the signal output terminal 3 as an example.

[0090] In summary, the technical solution of the embodiment of the present application is to arrange a sequencing carrier including at least one sequencing chipset and at least one first signal transmission structure, and to arrange the sequencing chipset to include two sequencing chip layers, each sequencing chip layer including at least one sensor chip, and the sensing surfaces of the sensor chips of the two sequencing chip layers in the same sequencing chipset are arranged relative to each other and have a gap, so that the first signal transmission structure is electrically connected to the sensor chips in the same sequencing chipset, respectively, so that biological molecules with a sequencing throughput at least twice that of the related technology can be sequenced during the sequencing process, and the detection signals of multiple sensor chips in the same sequencing chipset are transmitted to the outside of the sequencing carrier through the first signal transmission structure, so that the external analysis equipment electrically connected to the sequencing carrier can analyze the biological molecules, thereby improving the sequencing throughput and reducing reagent waste.

[0091] As shown in Figure 7, sequencing slide 100 further includes a housing 5, which is used to protect the internal structures, including the sequencing chipset 1 and the first signal transmission structure 2. Based on the above embodiment, the housing 5 of the sequencing slide can have different structures. Furthermore, the first signal transmission structure 2 can have different structures. Based on this, the sequencing slide can have a variety of feasible specific structures, which are described in detail below.

[0092] As for the shell 5, as a feasible embodiment, Figure 10 is a schematic diagram of a three-dimensional structure of the shell in the sequencing slide corresponding to Figure 7. As shown in Figure 10, for example, the shell 5 includes a first shell section 51 and a second shell section 52 parallel to the plane where the sequencing chip layer 11 is located. Along the first direction D1, the opposite ends of the first shell section 51 are respectively provided with a liquid inlet 501 and a liquid outlet 502; the liquid inlet 501 and the liquid outlet 502 both pass through the first shell section 51.

[0093] For example, as shown in FIG10 , the housing 5 forms a sealed space except for the liquid inlet 501 and the liquid outlet 502. In this case, a reagent can be injected into the housing 5 through the liquid inlet 501, flowing through the gap in the sequencing chipset 1 and out of the housing 5 through the liquid outlet 502. During this process, the sequencing site 4 can capture the DNA in the reagent, the sensor chip 111 collects the optical / electrical signal, and transmits the detection signal to the signal output terminal 3 via the first signal transmission structure 2. For example, the signal output terminal 3 is located outside the housing 5 and is electrically connected to the first signal transmission structure 2. In this way, during the sequencing process, the signal output terminal 3 does not come into contact with the reagent.

[0094] It should be noted that FIG10 only illustrates the case where the housing 5 is a rectangular parallelepiped. In other embodiments, the housing 5 may have other shapes, such as a cylinder.

[0095] As shown in Figure 7, for example, the first shell section 51 includes a first edge area 511 and a second edge area 512 opposite to each other along the second direction D2, the second shell section 52 includes a third edge area and a fourth edge area opposite to each other along the second direction D2, and a plurality of signal output terminals 3 are located in at least one of the first edge area 511, the second edge area 512, the third edge area and the fourth edge area.

[0096] Since the first edge region 511 and the second edge region 512 are located on opposite sides of the first shell portion 51 along the second direction D2, the third edge region and the fourth edge region are located on opposite sides of the second shell portion 52 along the second direction D2, and the liquid inlet 501 and the liquid outlet 502 are located at opposite ends of the first shell portion 51 along the first direction D1, the area where the signal output terminal 3 is located and the area where the liquid inlet 501 and the liquid outlet 502 are located are located on different sides of the shell 5. In this way, since the signal output terminal 3 needs to be electrically connected to the first signal transmission structure 2, by setting the area where the signal output terminal 3 and the area where the liquid inlet 501 and the liquid outlet 502 are located on different sides of the shell 5, on the one hand, sufficient space can be ensured for setting the signal output terminal 3 and electrically connecting it to the first signal transmission structure 2. On the other hand, the signal output terminal 3 can be kept away from the liquid inlet 501 and the liquid outlet 502 or the area where the reagents flow through, thereby ensuring the performance reliability of the sequencing carrier.

[0097] It should be noted that Figure 7 only illustrates the first shell division 51, and takes the example of signal output terminals 3 being provided in the first edge area 511 and the second edge area 512 of the first shell division 51. It can be understood that the second shell division 52 is located on the opposite side of the first shell division 51, and the third edge area and the fourth edge area are respectively opposite to the first edge area 511 and the second edge area 512. In the actual preparation process, at least one area among the first edge area 511, the second edge area 512, the third edge area and the fourth edge area can be selected to set the signal output terminal 3 according to the number of signal output terminals 3. The embodiment of the present application does not limit this.

[0098] For example, for the design scheme in which the first housing section 51 of the housing 5 includes a liquid inlet 501 and a liquid outlet 502 , the first signal transmission structure 2 may adopt different structures, which will be described in detail below.

[0099] As an embodiment of the first signal transmission structure 2, as shown in Figures 8 and 9, for example, the sensing surface F1 of the sensor chip 111 also includes a pad area S2, which is located on at least one side of the sensing area S1; the first signal transmission structure 2 includes a plurality of first transmission sub-sections 21 extending along the first direction D1 and at least one second transmission sub-section 22 extending along the second direction D2, and the first transmission sub-sections 21 are electrically connected to the second transmission sub-sections 22; the first transmission sub-sections 21 are located in the gaps of the sequencing chip group 1, and one first transmission sub-section 21 is electrically connected to the pad areas S2 of at least one row of opposite sensor chips 111 arranged along the first direction D1; the gap between two adjacent first transmission sub-sections 21 in the same sequencing chip group 1 forms a sequencing channel 6; along the third direction D3, the second transmission sub-section 22 does not overlap with the sequencing chip group 1; the third direction D3 is perpendicular to the plane of the sequencing chip layer 11, that is, perpendicular to the plane formed by the first direction D1 and the second direction D2.

[0100] In this embodiment, the first signal transmission structure 2 is located between two sequencing chip layers 11 of the same sequencing chip set 1 . For example, as shown in conjunction with Figures 8 and 9 , the first signal transmission structure 2 includes a plurality of first transmission sub-sections 21 extending along a first direction D1. Each first transmission sub-section 21 is electrically connected to a pad area S2 of at least one row of opposing sensor chips 111 arranged along the first direction D1. As can be understood from Figures 8 and 9 , a first transmission sub-section 21 located at the edge of the sequencing chipset 1 along the second direction D2 is electrically connected to a row of opposing sensor chips 111, and a first transmission sub-section 21 located within the sequencing chipset 1 is electrically connected to two adjacent rows of opposing sensor chips 111 along the second direction D2. In this way, the gap between two adjacent first transmission sub-sections 21 in the same sequencing chipset 1 can form a sequencing channel 6. After the reagent enters the sequencing slide through the liquid inlet 501, it can pass through the sequencing channel 6 in the direction of the arrow shown in Figure 9 (i.e., the first direction D1). The DNA is captured by the sequencing sites 4 located on both sides of the sequencing channel 6 along the third direction D3, allowing the sensor chips 111 to collect optical / electrical signals.

[0101] For example, as shown in FIG9 , the first signal transmission structure 2 further includes a second transmission subsection 22 extending along the second direction D2. Multiple first transmission subsections 21 are electrically connected to the second transmission subsection 22. Thus, the signal transmission lines in the first transmission subsection 21 can be extended to the region where the signal output terminals 3 are located via the signal transmission lines in the second transmission subsection 22, thereby transmitting the detection signals from the multiple sensor chips 111 to the signal output terminals 3. Furthermore, by ensuring that the second transmission subsection 22 does not overlap with the sequencing chipset 1 along the third direction D3, the reagents can be ensured to enter the sequencing flow channel 6 smoothly.

[0102] It should be noted that Figure 9 only illustrates the example of the first signal transmission structure 2 including two second transmission sections 22 located on opposite sides of the first transmission section 21 along the first direction D1 and extending along the second direction D2. In other embodiments, the first signal transmission structure 2 may only include one second transmission section 22 extending along the second direction D2, and the second transmission section 22 may be located at any end of the first transmission section 21 along the first direction D1. The embodiments of the present application are not limited to this. For example, it can be set accordingly according to the actual situation of the signal transmission line, as long as the second transmission section 22 does not overlap with the sequencing chip group 1 and does not affect the flow of reagents.

[0103] For example, the signal transmission lines in the first signal transmission structure 2 are integrated into the same wafer. For the first signal transmission structure 2 shown in FIG9 , the signal transmission lines can be formed in the wafer and the wafer where the sequencing channel 6 is located can be removed by etching.

[0104] Figure 11 is another schematic cross-sectional structure diagram of the sequencing carrier taken along AA' in Figure 7. As shown in Figure 11, for example, the sequencing carrier includes at least two sequencing chip groups 1, and the at least two sequencing chip groups 1 are stacked along the third direction D3, and the two adjacent sequencing chip layers 11 in the two adjacent sequencing chip groups 1 are bonded and fixed; the sequencing carrier further includes at least one second signal transmission structure 7; along the third direction D3, the second signal transmission structure 7 is located between the two adjacent first signal transmission structures 2 and is electrically connected to the two adjacent first signal transmission structures 2; along the third direction D3, the second signal transmission structure 7 overlaps with the area where the signal output terminal 3 is located.

[0105] For example, by setting the sequencing carrier to include at least two sequencing chip groups 1 stacked along the third direction D3, the sequencing throughput can be further improved and reagent waste can be reduced. Exemplarily, Figure 11 is illustrated by taking the sequencing carrier including three sequencing chip groups as an example. For example, in this embodiment, since the first signal transmission structure 2 is located between the two sequencing chip layers 11 of the same sequencing chip group 1, by setting the second signal transmission structure 7, the second signal transmission structure 7 is located between the two adjacent second signal transmission structures 7, and is electrically connected to the two adjacent first signal transmission structures 2, and the second signal transmission structure 7 is set to overlap with the area where the signal output terminal 3 is located along the third direction D3, so that the second signal transmission structure 7 can be used to extend the line of each first signal transmission structure 2 to the location of the signal output terminal 3, and electrically connected to the signal output terminal 3, so that the detection signals of the multiple sensor chips 111 are all output to the signal output terminal 3.

[0106] As another embodiment of the first signal transmission structure 2, Figure 12 is a schematic diagram of another cross-sectional structure of the sequencing carrier taken along AA' in Figure 7. As shown in Figure 12, for example, the pad 1110 of the sensor chip 111 is located on the surface opposite to the sensing surface F1; the two sequencing chip layers 11 in the sequencing chip group 1 include a first sequencing chip layer 11-1 and a second sequencing chip layer 11-2; the first signal transmission structure 2 includes a third transmission section 23 and a fourth transmission section 24; the third transmission section 23 is located on a side of the first sequencing chip layer 11-1 away from the second sequencing chip layer 11-2, and is electrically connected to the pad 1110 of the sensor chip 111 in the first sequencing chip layer 11-1; the fourth transmission section 24 is located on a side of the second sequencing chip layer 11-2 away from the first sequencing chip layer 11-1, and is electrically connected to the pad 1110 of the sensor chip 111 in the second sequencing chip layer 11-2.

[0107] For example, the third transmission subsection 23 may be used to transmit detection signals of the sensor chip 111 in the first sequencing chip layer 11 - 1 , and the fourth transmission subsection 24 may be used to transmit detection signals of the sensor chip 111 in the second sequencing chip layer 11 - 2 . In this embodiment, by arranging the third transmission sub-section 23 to be located on a side of the first sequencing chip layer 11-1 away from the second sequencing chip layer 11-2 and electrically connected to the pads of the sensor chip 111 in the first sequencing chip layer 11-1, and the fourth transmission sub-section 24 to be located on a side of the second sequencing chip layer 11-2 away from the first sequencing chip layer 11-1 and electrically connected to the pads of the sensor chip 111 in the second sequencing chip layer 11-2, the first signal transmission structure 2 can be located outside the same sequencing chip group 1, thereby not affecting the flow of reagents in the gaps in the sequencing chip group 1. In this way, the third transmission sub-section 23 and the fourth transmission sub-section 24 can be arranged as a whole layer of a circuit board or a wafer formed with a signal transmission line, that is, the third transmission sub-section 23 and the fourth transmission sub-section 24 cover the first sequencing chip layer 11-1 and the second sequencing chip layer 11-2, thereby ensuring that there is more space for setting the signal transmission line and reducing the risk of short circuit.

[0108] Continuing with Figure 12 , for example, a second support structure 82 is disposed between the third transmission subsection 23 and the fourth transmission subsection 24. Along the third direction D3, the second support structure 82 does not overlap with the sequencing chipset 1. With this arrangement, the second support structure 82 can support the third and fourth transmission subsections 23 and 24. The third transmission subsection 23 supports the first sequencing chip layer 11-1, while the fourth transmission subsection 24 supports the second sequencing chip layer 11-2. This allows for a certain gap between the first and second sequencing chip layers 11-1 and 11-2 for reagent flow. It should be noted that in Figure 12 , since the third and fourth transmission subsections 23 and 24 are not electrically connected, signal output terminals 3 need to be provided on both the first and second housing subsections 51 and 52, so that the third and fourth transmission subsections 23 and 24 are electrically connected to the signal output terminals 3 on different sides, respectively.

[0109] Based on the same concept, Figure 13 is another schematic cross-sectional structure diagram of the sequencing carrier taken along AA' in Figure 7. As shown in Figure 13, in other embodiments, for example, the first signal transmission structure 2 also includes a fifth transmission division 25; the fifth transmission division 25 is located between the third transmission division 23 and the fourth transmission division 24, and is electrically connected to the third transmission division 23 and the fourth transmission division 24, respectively; along the third direction D3, the fifth transmission division 25 overlaps with the area where the signal output terminal 3 is located, and does not overlap with the sequencing chip group 1; the third direction D3 is perpendicular to the plane where the sequencing chip layer 11 is located.

[0110] In this embodiment, a fifth transmission division 25 is provided between the third transmission division 23 and the fourth transmission division 24, the third transmission division 23 and the fourth transmission division 24 are electrically connected by the fifth transmission division 25, and the fifth transmission division 25 is provided along the third direction D3 to overlap with the area where the signal output terminal 3 is located, and does not overlap with the sequencing chip group 1. Therefore, when the number of signal output terminals 3 is small, the signal output terminals 3 can be provided only on the first shell division 51 or the second shell division 52, thereby improving the integration of the signal output terminals 3.

[0111] Furthermore, when the sequencing slide includes multiple sequencing chip sets 1, the fifth transmission subsection 25 can be used to connect the signal transmission lines in the third transmission subsection 23 and the fourth transmission subsection 24, thereby transmitting the detection signals of multiple sensor chips 111 to the signal output terminal 3. For example, Figure 14 is a schematic cross-sectional view of another sequencing slide taken along AA' in Figure 7. As shown in Figure 14, the sequencing slide includes at least two sequencing chip sets 1, which are stacked along a third direction D3. The two first signal transmission structures 2 corresponding to two adjacent sequencing chip sets 1 are bonded, fixed, and electrically connected. This arrangement can further improve sequencing throughput and reduce reagent waste.

[0112] Figure 15 is a schematic diagram of a partial top view of the sequencing carrier corresponding to Figure 14. As shown in combination with Figures 14 and 15, for example, the sequencing carrier also includes at least one first support structure 81; the first support structure 81 includes a plurality of first support sections 811 extending along the first direction D1, the first support sections 811 are located in the gaps of the sequencing chip group 1, and one first support section 811 contacts the sensing surface F1 of at least one row of opposite sensor chips 111 arranged along the first direction D1, and along the third direction D3, the first support section 811 does not overlap with the sensing area S1 of the sensor chip 111; the third direction D3 is perpendicular to the plane where the sequencing chip layer 11 is located; the gap between two adjacent first support sections 811 in the same sequencing chip group 1 forms a sequencing flow channel 6.

[0113] The configuration of the first support sub-section 811 is similar to that of the first transmission sub-section 21 described above, except that no signal transmission lines are provided within the first support sub-section 811. Instead, the first support sub-section 811 serves only to support the two sequencing chip layers 11 within the same sequencing chip set 1. The relative positional relationship between the first support sub-section 811 and the sensor chip 111 can be understood with reference to the explanation regarding the first transmission sub-section 21 described above and will not be further elaborated here. For example, the first support structure 81 can be made of glass or silicon.

[0114] In the embodiment of the present application, the first support structure 81 includes a plurality of first support sections 811 extending along a first direction D1. The first support sections 811 are positioned within the gaps of the sequencing chipset 1, and one first support section 811 contacts the sensing surface F1 of at least one row of sensor chips 111 arranged along the first direction D1, without overlapping with the sensing area S1 of the sensor chip 111. The gap between two adjacent first support sections 811 in the same sequencing chipset 1 forms a sequencing flow channel 6. This allows the first support structure 81 to separate and support two sequencing chip layers 11 in the same sequencing chipset 1 without affecting reagent flow, thereby ensuring the structural stability of the sequencing chipset 1, preventing deformation of the sequencing chip layer 11 due to insufficient support from the third transmission section 23 or the fourth transmission section 24, and reducing the impact on the performance of the sensor chip 111.

[0115] It should be noted that Figure 15 illustrates the first support structure 81 as comprising multiple independent first support sub-sections 811 extending along the first direction D1, and is not intended to be limiting. For example, in other embodiments, the first support structure 81 may further include at least one second support sub-section extending along the second direction D2, with each of the multiple first support sub-sections 811 communicating with the second support sub-section. Along the third direction D3, the second support sub-sections do not overlap with the sequencing chipset 1. This configuration creates a single, integrated structure for the first support structure 81, further enhancing the structural stability of the product.

[0116] In summary, the above embodiment, based on the design scheme of the first housing section 51 of the housing 5 including the liquid inlet 501 and the liquid outlet 502, provides a detailed description of the specific structure of the sequencing slide, particularly the first signal transmission structure 2. Next, an alternative housing 5 structure is provided and the structure of the sequencing slide is described.

[0117] Figure 16 is another three-dimensional structural schematic diagram of the shell in the sequencing slide provided in an embodiment of the present application. As shown in Figure 16, as another embodiment of the shell 5, for example, the shell 5 includes a first shell section 51 and a second shell section 52 parallel to the plane where the sequencing chip layer 11 is located, a third shell section 53 connecting the first shell section 51 and the second shell section 52, and an opening 503 opposite to the third shell section 53 along the first direction D1.

[0118] For example, in this embodiment, in addition to the first housing section 51 and the second housing section 52, the surface of the housing 5 that intersects (e.g., is orthogonal to) the plane of the sequencing chip layer 11 is an opening 503, which semi-encloses the sequencing chip set 1 and the first signal transmission structure 2 within. For example, FIG16 illustrates the housing 5 as a rectangular parallelepiped. The upper and lower surfaces of the rectangular parallelepiped correspond to the first housing section 51 and the second housing section 52, respectively. Of the two opposing surfaces along the first direction D1, one of the surfaces is an opening 503. In this way, by immersing the portion of the sequencing slide, excluding the area where the signal output terminal 3 is located, in the reagent, the aforementioned gene sequencing can be achieved.

[0119] Figure 17 is a schematic top view of a sequencing slide corresponding to Figure 16 . As shown in Figure 17 , the first housing section 51 includes a fifth edge region 515 adjacent to the third housing section 53, and the second housing section 52 includes a sixth edge region adjacent to the third housing section 53. Multiple signal output terminals 3 are located within at least one of the fifth edge region 515 and the sixth edge region. This arrangement allows the signal output terminals 3 to be positioned away from the openings 503, thereby preventing them from being immersed in reagents during the sequencing process.

[0120] It should be noted that Figure 17 only illustrates the first shell division 51, and takes the signal output terminal 3 set in the fifth edge area 515 of the first shell division 51 as an example. It can be understood that the sixth edge area of ​​the second shell division 52 is opposite to the fifth edge area 515 of the first shell division 51 along the third direction D3. In the actual preparation process, at least one area in the fifth edge area 515 and the sixth edge area can be selected to set the signal output terminal 3 according to the number of signal output terminals 3. The embodiment of the present application does not limit this.

[0121] Referring to Figure 16 , it should also be noted that during the sequencing process, the sequencing slide can be immersed in the reagents with the opening 503 facing downward and the third housing section 53 facing upward, that is, with the plane of the first and second housing sections 51, 52 perpendicular to the horizontal plane. Alternatively, the sequencing slide can be inserted into the reagents while the first and second housing sections 51, 52 are parallel to the horizontal plane, as long as a good seal is ensured and the signal output terminal 3 is not immersed in the reagents.

[0122] For example, for a design scheme where the housing 5 includes an opening 503, the first signal transmission structure 2 may also adopt a different structure. Based on the explanation of different design schemes for the first signal transmission structure 2 in the above embodiment where the housing 5 includes a liquid inlet 501 and a liquid outlet 502, the following briefly describes the structure of the sequencing slide, particularly a feasible implementation of the first signal transmission structure 2, based on a scheme where the housing 5 includes an opening 503.

[0123] As a feasible embodiment, Figure 18 is a schematic diagram of a cross-sectional structure of the sequencing carrier taken along BB' in Figure 17, Figure 19 is a schematic diagram of a cross-sectional structure of the sequencing carrier taken along CC' in Figure 17, and Figure 20 is a schematic diagram of a partial top view of the sequencing carrier corresponding to Figure 19. In combination with Figures 17 to 20, for example, the sequencing carrier includes at least two sequencing chip groups 1, and the at least two sequencing chip groups 1 are stacked along a third direction D3, and the adjacent two sequencing chip layers 11 in the two adjacent sequencing chip groups 1 are bonded and fixed; the sensing surface F1 of the sensor chip 111 includes a pad area S2 in addition to the sensing area S1, and the pad area S2 is located on at least one side of the sensing area S1; the first signal transmission structure 2 includes a plurality of first transmission sub-sections 21 extending along the first direction D1 and a second transmission sub-section 22 extending along the second direction D2, and the first transmission sub-section 21 and the second transmission sub-section 22 are connected. The second transmission subsection 22 is electrically connected; the first transmission subsection 21 is located within the gaps of the sequencing chipset 1, and one first transmission subsection 21 is electrically connected to the pad area S2 of at least one row of opposing sensor chips 111 arranged along the first direction D1. The gap between two adjacent first transmission subsections 21 in the same sequencing chipset 1 forms a sequencing flow channel 6. Along the third direction D3, the second transmission subsection 22 does not overlap with the sequencing chipset 1. The third direction D3 is perpendicular to the plane of the sequencing chipset layer 11, that is, perpendicular to the plane formed by the first direction D1 and the second direction D2. The sequencing slide also includes at least one second signal transmission structure 7. Along the third direction D3, the second signal transmission structure 7 is located between two adjacent first signal transmission structures 2 and is electrically connected to the two adjacent first signal transmission structures 2. Along the third direction D3, the second signal transmission structure 7 overlaps with the area where the signal output terminal 3 is located. As shown in FIG. 18 , this embodiment is illustrated by taking the integration of multiple sensor chips 111 in the sequencing chipset layer 11 into a single wafer as an example.

[0124] It should be noted that this embodiment is only illustrated by taking the sequencing carrier including at least two sequencing chip groups 1 as an example (the sequencing carrier in Figure 18 includes three sequencing chip groups 1). For example, in this embodiment, the first signal transmission structure 2 is located between two sequencing chip layers 11 of the same sequencing chip group 1, wherein the multiple first transmission sub-sections 21 extending along the first direction D1 are used to electrically connect to the multiple sensor chips 111 in the same sequencing chip group 1, and the gap between two adjacent first transmission sub-sections 21 is used to form a sequencing flow channel 6. The second transmission sub-section 22 can be located at the end of the first transmission sub-section 21 away from the opening 503, and is used to connect the multiple first transmission sub-sections 21 and connect the signal transmission lines in the first transmission sub-sections 21 to the signal output terminal 3. In addition, since the sequencing carrier includes multiple sequencing chip groups, by arranging the second signal transmission structure 7 at the end of the first transmission sub-section 21 away from the opening 503, and overlapping with the area where the second transmission sub-section 22 is located and the area where the signal output terminal 3 is located along the third direction D3, the signal transmission lines of the multiple first signal transmission structures 2 can be connected to the signal output terminal 3.

[0125] In this way, during the sequencing process, the reagent can enter the gap of the sequencing chip group 1 inside the sequencing carrier (i.e., the above-mentioned sequencing channel 6) through the opening 503, the sequencing site 4 on the sensor chip 111 captures DNA, and the sensor chip 111 collects optical / electrical signals and generates corresponding detection signals, and transmits the detection signals to the signal output terminal 3 through the first signal transmission structure 2 and the second signal transmission structure 7, so that the analysis equipment can perform base sequence analysis to complete gene sequencing.

[0126] As another feasible embodiment, FIG21 is another schematic cross-sectional structure diagram of the sequencing carrier taken along BB' in FIG17, and FIG22 is another schematic cross-sectional structure diagram of the sequencing carrier taken along CC' in FIG17. In combination with FIG17, FIG21 and FIG22, for example, the pad 1110 of the sensor chip 111 is located on the surface opposite to the sensing surface F1; the two sequencing chip layers 11 in the sequencing chip group 1 include a first sequencing chip layer 11-1 and a second sequencing chip layer 11-2; the first signal transmission structure 2 includes a third transmission sub-section 23, a fourth transmission sub-section 24 and a fifth transmission sub-section 25; the third transmission sub-section 23 is located on the side of the first sequencing chip layer 11-1 away from the second sequencing chip layer 11-2, and is connected to the sensor chip 111 in the first sequencing chip layer 11-1. The pads are electrically connected; the fourth transmission division 24 is located on the side of the second sequencing chip layer 11-2 away from the first sequencing chip layer 11-1, and is electrically connected to the pad of the sensor chip 111 in the second sequencing chip layer 11-2; the fifth transmission division 25 is located between the third transmission division 23 and the fourth transmission division 24, and is electrically connected to the third transmission division 23 and the fourth transmission division 24 respectively; along the third direction D3, the fifth transmission division 25 overlaps with the area where the signal output terminal 3 is located, and does not overlap with the sequencing chip group 1; the third direction D3 is perpendicular to the plane where the sequencing chip layer 11 is located; the sequencing carrier includes at least two sequencing chip groups 1, and the at least two sequencing chip groups 1 are stacked along the third direction D3; the two first signal transmission structures 2 corresponding to the two adjacent sequencing chip groups 1 are bonded and fixed and electrically connected.

[0127] It should be noted that this embodiment illustrates only a sequencing carrier including at least two sequencing chip sets 1. For example, in this embodiment, the first signal transmission structure 2 is located outside the first sequencing chip set 1, and is semi-enclosed by the third transmission sub-section 23, the fourth transmission sub-section 24, and the fifth transmission sub-section 25. The third transmission sub-section 23 and the fourth transmission sub-section 24 are electrically connected to the sensor chips 111 in the first sequencing chip layer 11-1 and the second sequencing chip layer 11-2, respectively. The fifth transmission sub-section 25 is used to connect the circuits of the third transmission sub-section 23 and the fourth transmission sub-section 24. Thus, by bonding and electrically connecting multiple first signal transmission structures, the detection signals of multiple sensor chips 111 can be transmitted to the signal output terminal 3, thereby achieving gene sequencing.

[0128] FIG23 is another schematic cross-sectional structure diagram of the sequencing carrier taken along CC′ in FIG17 , and FIG24 is a schematic partial top view structure diagram of the sequencing carrier corresponding to FIG23 . As shown in FIG17 , FIG21 , FIG23 and FIG24 , for example, the sensor chip 111 further includes at least one first support structure 81; the first support structure 81 includes a plurality of first support sections 811 extending along a first direction D1, the first support sections 811 being located in gaps within the sequencing chip set 1, and one first support section 811 being in contact with the sensing surface F1 of at least one row of opposing sensor chips 111 arranged along the first direction D1. Along a third direction D3, the first support section 811 does not overlap with the sensing area S1 of the sensor chip 111; the third direction D3 is perpendicular to the plane of the sequencing chip layer 11; and the gap between two adjacent first support sections 811 in the same sequencing chip set 1 forms a sequencing flow channel 6. This arrangement ensures that the reagent flow path is maintained while the first support structure 81 provides support for the two sequencing chip layers 11 in the sequencing chip set 1, ensuring structural stability. Furthermore, as shown in FIG24 , the first support structure 81 may also include a second support sub-section 812 , which connects the plurality of first support sub-sections 811 .

[0129] In summary, the above embodiment is based on the design scheme that the housing 5 includes the opening 503, and briefly describes the specific structure of the sequencing slide, especially the first signal transmission structure 2. The above embodiments can be combined arbitrarily without contradiction, and will not be described one by one here.

[0130] Based on the same application concept, the present application also provides a method for preparing a sequencing slide, which comprises the following steps:

[0131] S101. Form at least one sequencing chipset 1. The sequencing chipset 1 includes two sequencing chips layers 11, each including at least one sensor chip 111. Sensing surfaces F1 of the sensor chips 111 of the two sequencing chips layers 11 in the same sequencing chipset 1 are disposed opposite each other with a gap therebetween. The sensing surface F1 of the sensor chip 111 includes a sensing region S1, on which arrayed sequencing sites 4 are disposed.

[0132] S102 , forming at least one first signal transmission structure 2 ; the first signal transmission structures 2 are electrically connected to the sensor chips 111 in the same sequencing chip set 1 .

[0133] The sensor chips 111 in the sequencing chip layer 11 can be independent of each other or integrated into the same wafer, which is not limited in this embodiment of the present application. For example, each sequencing chip layer 11 has multiple sensor chips 111 arranged in an array, and the multiple sensor chips 111 are arranged along a first direction D1 and a second direction D2 parallel to the plane of the sequencing chip layer 11, and the first direction D1 and the second direction D2 intersect.

[0134] For example, the sensor chip 111 may be a photoelectric sensor chip or a nanopore sensor chip. The embodiment of the present application does not limit the method for preparing the sensor chip 111 .

[0135] The first signal transmission structure 2 may be a circuit board or a wafer formed with a signal transmission line, which is not limited in the embodiment of the present application.

[0136] For example, the sequencing chip further includes a plurality of signal output terminals 3, which are electrically connected to the first signal transmission structure 2. The signal output terminals 3 can be formed on the outer shell of the sequencing chip and electrically connected to the first signal transmission structure 2.

[0137] It should be noted that based on the different setting positions of the pads of the sensor chip 111 and the different structures of the first signal transmission structure 2, the specific preparation process of the sequencing carrier is different. The above step sequence does not represent the actual preparation sequence, which will be explained later with specific examples.

[0138] The embodiment of the present application forms the above-mentioned sequencing chipset and the first signal transmission structure to prepare a sequencing carrier, which can sequence biological molecules with a sequencing throughput at least twice that of the related art during the sequencing process, and transmit the detection signals of multiple sensor chips in the same sequencing chipset to the outside of the sequencing carrier through the first signal transmission structure, so that the analysis equipment electrically connected to the sequencing carrier can analyze the biological molecules, thereby improving the sequencing throughput and reducing reagent waste.

[0139] Based on the above embodiments, the preparation method of the sequencing slide will be described in detail below, taking the sequencing slide shown in FIG8 as an example.

[0140] For example, referring to Figures 8 and 9, the sequencing slide shown in Figure 8 can be prepared according to the following steps:

[0141] (a) providing a silicon substrate and forming a metal circuit on the silicon substrate to obtain a wafer having a signal transmission circuit formed thereon;

[0142] (b) etching the wafer to form a cavity (the cavity passes through the wafer and corresponds to the region where the sequencing channel 6 in FIG8 is located), thereby obtaining a first signal transmission structure 2 including a plurality of first transmission sub-portions 21 extending along the first direction D1 and at least one second transmission sub-portion 22 extending along the second direction D2;

[0143] (c) bonding a plurality of independent sensor chips 111 or a wafer integrated with a plurality of sensor chips 111 to corresponding signal transmission lines in the first signal transmission structure 2, and bonding a plurality of sensor chips 111 to opposite sides of the first signal transmission structure 2 along the third direction D3 to form two sequencing chip layers 11, thereby obtaining a sequencing chip set 1;

[0144] (d) Forming a housing 5 and a signal output terminal 3 (solder pad), and electrically connecting the signal output terminal 3 to the metal line in the first signal transmission structure 2 to obtain a sequencing slide.

[0145] For example, the sequencing carrier containing multiple sequencing chip groups 1 shown in FIG11 can form a second signal transmission structure 7 on this basis, and can be obtained by bonding and fixing adjacent sequencing chip layers 11 in two sequencing chip groups 1.

[0146] Next, taking the sequencing slide shown in FIG13 as an example, the preparation method of the sequencing slide is described in detail.

[0147] For example, referring to FIG13 , the sequencing slide shown in FIG13 can be prepared according to the following steps:

[0148] (a) Providing a substrate (a silicon substrate or a glass substrate), and etching the substrate to form a cavity (the cavity penetrates the substrate and corresponds to the region where the sequencing channel 6 in FIG13 is located), thereby obtaining a first support structure 81 having a plurality of first support sections 811 extending along a first direction D1;

[0149] (b) attaching a plurality of independent sensor chips 111 or a wafer integrated with a plurality of sensor chips 111 to a first support structure 81, with the plurality of sensor chips 111 attached to opposite sides of the first support structure 81, to form two sequencing chip layers 11, thereby obtaining a sequencing chip set 1;

[0150] (c) electrically connecting the first signal transmission structure 2 to the pads of the sensor chip 111; wherein the third transmission sub-section 23, the fourth transmission sub-section 24, and the fifth transmission sub-section 25 in the first signal transmission structure 2 may be a circuit board or a wafer with metal circuits formed thereon;

[0151] (d) Forming a housing 5 and a signal output terminal 3 (solder pad), and electrically connecting the signal output terminal 3 to the metal line in the first signal transmission structure 2 to obtain a sequencing slide.

[0152] For example, the sequencing carrier containing multiple sequencing chip groups 1 shown in Figure 14 can be obtained by pasting and fixing the first signal transmission structures 2 corresponding to two adjacent sequencing chip groups 1, and electrically connecting the signal transmission lines in the two adjacent first signal transmission structures 2.

[0153] In addition, the sequencing slide corresponding to the opening 503 of the housing 5 can be prepared by referring to the above-mentioned preparation method, which will not be described in detail here.

[0154] For example, embodiments of the present application further provide a sequencing method using the aforementioned sequencing chips. A library to be tested (i.e., the sample to be tested as described above) is fixed to sequencing sites on two sequencing chip layers within a single sequencing chipset, and multiple rounds of sequencing reactions are performed. During each round of sequencing reactions, the sequencing sites simultaneously generate reaction signals. Sensor chips on the two sequencing chip layers within the same sequencing chipset collect the reaction signals and then proceed to the next round of sequencing reactions. The sensor chips collect the reaction signals and generate corresponding detection signals, which are then transmitted to the outside of the sequencing chipset via a first signal transmission structure electrically connected to each sensor chip within the same sequencing chipset.

[0155] The above-mentioned sensor chip can be a photoelectric sensor chip. The library to be tested at each sequencing site generates a fluorescent signal (i.e., the above-mentioned reaction signal) during the sequencing reaction. The photoelectric sensor chip collects the corresponding fluorescent signal and performs photoelectric conversion to generate a detection signal. Finally, the detection signal is transmitted to the outside of the sequencing carrier by the above-mentioned first signal transmission structure.

[0156] For example, in another embodiment of the present application, the above-mentioned sensor chip is a nanopore sensor chip, and the library to be tested at each sequencing site generates a detectable current signal (i.e., a reaction signal) during the sequencing reaction. The nanopore sensor chip collects the reaction signal and outputs the relevant detection signal to the first signal transmission structure, which is then transmitted to the outside of the sequencing carrier by the first signal transmission structure.

[0157] It should be understood that the sequencing slide involved in the embodiments of the present application has a similar structure to any of the above-mentioned sequencing slides and will not be described in detail here.

Claims

1. A sensing system comprising: At least two sensing substrates having arrays of sensing sites, wherein the at least two sensing substrates are spaced apart from each other and stacked; Along the stacking direction of the sensing substrates, the sensing site arrays of two adjacent sensing substrates are opposite and spaced apart to form a fluid channel, and the sensing site arrays of the two adjacent sensing substrates are respectively exposed to the fluid channel; Each sensing substrate includes a sensing layer close to the fluid channel and a sensor layer stacked on a side of the sensing layer away from the fluid channel. The sensing site array of each sensing substrate is arranged on the sensing layer; the sensor layer has sensors for collecting sensing signals at the sensing sites; The sensing system further includes a signal transmission structure; the signal transmission structure is electrically connected to the sensor layers of two adjacent sensing substrates along the stacking direction, and transmits the sensing signal to outside the sensing system. 2 . The sensing system according to claim 1 , further comprising a spacer located in the fluid channel and sandwiched between two adjacent sensing substrates along the stacking direction.

3. The sensing system according to claim 2, wherein: The signal transmission structure includes a conducting mechanism formed in the spacer and electrically connected to two adjacent sensing substrates respectively.

4. The sensing system according to claim 1, wherein: The sensor is a photoelectric sensor or a nanopore sensor.

5. The sensing system according to claim 1, wherein The sensing site array is configured to fix a sample to be detected.

6. The sensing system according to claim 5, wherein: The sample to be detected includes nucleic acid macromolecules.

7. A chip packaging structure comprising an upper substrate, a lower substrate, and a support member separating the upper and lower substrates, wherein the upper and lower substrates are arranged opposite each other and spaced apart to form a fluid channel, and the support member is sandwiched between the upper and lower substrates. The chip packaging structure further comprises: a first sensing chip mounted on the upper substrate, the first sensing chip having a first sensing site array exposed to the fluid channel; as well as a second sensing chip mounted on the lower substrate, the second sensing chip having a second sensing site array exposed to the fluid channel, the second sensing site array being opposite to and spaced apart from the first sensing site array; the first sensing chip and the second sensing chip each comprising a sensing layer proximal to the fluid channel and a sensor layer stacked on a side of the sensing layer away from the fluid channel; The first sensing site array and the second sensing site array are arranged on the sensing layer; The sensor layer has sensors for collecting sensing signals at sensing sites; The supporting member has a signal transmission mechanism; the signal transmission mechanism is electrically connected to the sensor layers of the first sensing chip and the second sensing chip respectively, and transmits the sensing signal to the outside of the chip packaging structure.

8. The chip packaging structure according to claim 7, wherein: A plurality of first sensing chips are mounted on the upper substrate, and the plurality of first sensing chips are arranged in an array and spaced apart from each other.

9. The chip packaging structure according to claim 7, wherein: A plurality of second sensing chips are mounted on the lower substrate, and the plurality of second sensing chips are arranged in an array and spaced apart from each other.

10. The chip packaging structure according to claim 7, wherein: A fluid inlet communicating with the fluid channel is provided on the upper substrate or the lower substrate.

11. The chip packaging structure according to claim 7, wherein: A fluid outlet communicating with the fluid channel is provided on the upper substrate or the lower substrate.

12. The chip packaging structure according to claim 7, wherein: The sensors in the first sensing chip are arranged in a one-to-one correspondence with the sensing sites of the first sensing site array; the sensors in the second sensing chip are arranged in a one-to-one correspondence with the sensing sites of the second sensing site array.

13. The chip packaging structure according to claim 7, wherein: The upper substrate is provided with a first circuit electrically connecting the sensor layer of the first sensing chip and the signal transmission mechanism, and the lower substrate is provided with a second circuit electrically connecting the sensor layer of the second sensing chip and the signal transmission mechanism.

14. A sequencing slide comprising: At least one sequencing chipset; each sequencing chipset comprises two sequencing chip layers, and each sequencing chip layer comprises at least one sensor chip; The sensing surfaces of the sensor chips of the two sequencing chip layers in the same sequencing chip set are arranged opposite to each other with a gap therebetween; the sensing surface of the sensor chip comprises a sensing area, and the sensing area is provided with arrayed sequencing sites; At least one first signal transmission structure; the first signal transmission structure is electrically connected to the sensor chips in the same sequencing chip group, and transmits the detection signal of the sensor chip to the outside of the sequencing carrier.

15. The sequencing slide according to claim 14, wherein: A plurality of the sensor chips are arrayed on each sequencing chip layer.

16. The sequencing slide according to claim 15, wherein: The plurality of sensor chips are arranged along a first direction and a second direction parallel to the plane where the sequencing chip layer is located, and the first direction intersects with the second direction.

17. The sequencing slide according to claim 16, wherein: The sequencing slide includes a plurality of signal output terminals, and the signal output terminals are electrically connected to the first signal transmission structure.

18. The sequencing slide according to claim 17, wherein: The sensing surface of the sensor chip further includes a pad area, and the pad area is located on at least one side of the sensing area; The first signal transmission structure includes a plurality of first transmission sub-sections extending along the first direction and at least one second transmission sub-section extending along the second direction, wherein the first transmission sub-section is electrically connected to the second transmission sub-section; The first transmission sub-section is located in a gap between the sequencing chipset, and one of the first transmission sub-sections is electrically connected to the pad areas of at least one row of the sensor chips that are opposite to each other and arranged along the first direction; the gap between two adjacent first transmission sub-sections in the same sequencing chipset forms a sequencing flow channel; Along a third direction, the second transmission subsection does not overlap with the sequencing chip group; wherein the third direction is perpendicular to the plane where the sequencing chip layer is located.

19. The sequencing slide according to claim 18, comprising at least two sequencing chip sets, wherein the at least two sequencing chip sets are stacked along the third direction, and adjacent two sequencing chip layers in two adjacent sequencing chip sets are bonded and fixed; The sequencing carrier also includes at least one second signal transmission structure; along the third direction, the second signal transmission structure is located between two adjacent first signal transmission structures and is electrically connected to the two adjacent first signal transmission structures; along the third direction, the second signal transmission structure overlaps with the area where the signal output terminal is located.

20. The sequencing slide according to claim 17, wherein: The pad of the sensor chip is located on a surface opposite to the sensing surface; The two sequencing chip layers in the sequencing chip group include a first sequencing chip layer and a second sequencing chip layer; the first signal transmission structure includes a third transmission division and a fourth transmission division; the third transmission division is located on a side of the first sequencing chip layer away from the second sequencing chip layer, and is electrically connected to the pads of the sensor chip in the first sequencing chip layer; the fourth transmission division is located on a side of the second sequencing chip layer away from the first sequencing chip layer, and is electrically connected to the pads of the sensor chip in the second sequencing chip layer.

21. The sequencing slide according to claim 20, further comprising at least one first support structure; The first supporting structure includes a plurality of first supporting sections extending along the first direction, wherein the first supporting sections are located in the gaps of the sequencing chip group, and one of the first supporting sections contacts the sensing surfaces of at least one row of opposite sensor chips arranged along the first direction. Along a third direction, the first supporting section does not overlap with the sensing area of ​​the sensor chip; the third direction is perpendicular to the plane where the sequencing chip layer is located; and the gap between two adjacent first supporting sections in the same sequencing chip group forms a sequencing flow channel.

22. The sequencing slide according to claim 20, wherein: The first signal transmission structure further includes a fifth transmission sub-section; the fifth transmission sub-section is located between the third transmission sub-section and the fourth transmission sub-section, and is electrically connected to the third transmission sub-section and the fourth transmission sub-section respectively; Along a third direction, the fifth transmission subsection overlaps with the area where the signal output terminal is located, and does not overlap with the sequencing chip group; the third direction is perpendicular to the plane where the sequencing chip layer is located.

23. The sequencing slide according to claim 22, comprising at least two sequencing chip sets, wherein the at least two sequencing chip sets are stacked along the third direction; The two first signal transmission structures corresponding to two adjacent sequencing chip groups are bonded, fixed, and electrically connected.

24. The sequencing slide according to claim 17, further comprising a housing; the housing comprising a first housing section and a second housing section parallel to the plane of the sequencing chip layer; a liquid inlet and a liquid outlet are respectively provided at opposite ends of the first housing section along the first direction; the liquid inlet and the liquid outlet both pass through the first housing section; The first shell section includes a first edge area and a second edge area opposite to each other along the second direction, the second shell section includes a third edge area and a fourth edge area opposite to each other along the second direction, and the plurality of signal output terminals are located in at least one of the first edge area, the second edge area, the third edge area and the fourth edge area.

25. The sequencing slide according to claim 17, further comprising a housing; the housing comprising a first housing section and a second housing section parallel to the plane where the sequencing chip layer is located, a third housing section connecting the first housing section and the second housing section, and an opening opposite to the third housing section along the first direction; The first shell section includes a fifth edge area close to one side of the third shell section, the second shell section includes a sixth edge area close to one side of the third shell section, and the plurality of signal output terminals are located in at least one of the fifth edge area and the sixth edge area.

26. The sequencing slide according to claim 14, wherein The plurality of sensor chips in the sequencing chip layer are integrated into the same wafer; The signal transmission lines in the first signal transmission structure are integrated into the same wafer.

27. The sequencing slide according to claim 14, wherein The sensor chip includes a photoelectric sensor chip or a nanopore sensor chip.

28. A sequencing method using a sequencing slide, the sequencing slide comprising at least one sequencing chipset, each sequencing chipset comprising two sequencing chips layers, each sequencing chips layer comprising at least one sensor chip; the sensing surfaces of the sensor chips of the two sequencing chips layers in the same sequencing chipset being arranged opposite each other with a gap therebetween; the sensing surfaces of the sensor chips comprising a sensing region having arrayed sequencing sites disposed thereon; the sequencing method comprising: The library to be tested is fixed on the sequencing sites of the two sequencing chip layers in the same sequencing chipset, and multiple rounds of sequencing reactions are performed. In each round of sequencing reaction, the sequencing sites of the two sequencing chip layers in the same sequencing chipset simultaneously generate reaction signals; the sensor chips of the two sequencing chip layers in the same sequencing chipset collect the reaction signals and then perform the next round of sequencing reaction; the sensor chips collect the reaction signals and generate corresponding detection signals, and the detection signals are transmitted to the outside of the sequencing carrier via a first signal transmission structure, and the first signal transmission structure is electrically connected to the sensor chips in the same sequencing chipset respectively.

29. The sequencing method according to claim 28, wherein The sensor chip is a photoelectric sensor chip or a nanopore sensor chip.

30. The sequencing method according to claim 28, wherein Each of the sequencing chip layers includes a plurality of the sensor chips distributed in an array.

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