Atomic layer deposition equipment and processing method

Abstract

The invention provides atomic layer deposition equipment and a processing method, and the atomic layer deposition equipment comprises a jig, the side wall of which is provided with a clamping projection; the processing mechanism comprises a shell and a box body, a sealing frame is arranged at an opening of the shell, and the box body is placed in the shell; the sealing mechanism comprises a moving frame, a cavity door and fork teeth, the cavity door and the box body synchronously move along with the moving frame, the fork teeth are connected to the moving frame, penetrate through the cavity door and then extend towards the machining cavity in the first direction, clamping blocks are arranged on the fork teeth, clamping grooves are formed in the clamping blocks, and the clamping protrusions can be embedded in the clamping grooves. Elements in the jig can be machined through the box body at the same time, the cavity door in the sealing mechanism is used for sealing and covering the machining cavity, the prongs can move synchronously with the cavity door and can be highly matched with the jig, and therefore compared with conventional atom deposition equipment at the present stage, the machining efficiency is greatly improved. The device has the remarkable advantages of being high in automation degree, flexible to use, convenient to control and adjust, high in structure matching degree, capable of remarkably improving the machining efficiency and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of deposition processing equipment, and particularly to an atomic layer deposition equipment and a processing method. Background Art

[0002] In high-tech fields such as semiconductor manufacturing, optical coating, and new energy material preparation, the atomic layer deposition (ALD) technology, with its precise atomic-level thin film control ability, can achieve high uniformity, high density, and excellent stoichiometry of thin films, playing an irreplaceable role in material surface modification and functional thin film preparation.

[0003] During the atomic layer deposition process, to ensure that the reaction precursors can be deposited according to the set chemical reaction path and avoid interference from external impurity gases, a highly sealed environment needs to be constructed at key parts such as the reaction chamber of the equipment. This highly sealed structure usually uses multiple seals (such as O-ring seals, metal sealing rings, etc.) in cooperation with fastening mechanisms to strictly seal the reaction chamber to maintain the vacuum degree or specific gas pressure inside the chamber. However, while this sealing design ensures the stability of the process environment, it brings other limitations.

[0004] On the one hand, to ensure a highly sealed effect, the prior art needs to limit the number of single - processing components, thereby restricting the production and processing efficiency. On the other hand, the sealing mechanism and the loading and unloading equipment operate independently with a low degree of cooperation, further increasing unnecessary action beats, so that conventional deposition equipment is difficult to match the current production requirements. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the problem of low deposition processing efficiency in the prior art, and provide an atomic layer deposition equipment and a processing method.

[0006] To solve the above technical problems, the present invention provides an atomic layer deposition device, which includes: a jig, a component to be processed is arranged in the jig, and at least one clamping protrusion is arranged on the side wall of the jig; a processing mechanism, the processing mechanism includes a housing and at least two boxes, openings are arranged on the same side of the housing and the boxes, a sealing frame is arranged at the opening of the housing, at least two boxes are placed inside the housing, the inside of the box is a processing chamber, and processing gas and the jig can both enter the inside of the processing chamber; a sealing mechanism, the sealing mechanism includes a moving frame, at least two chamber doors and a plurality of fork teeth, the moving frame can approach / away from the opening, the chamber doors are arranged in one-to-one correspondence with the openings of the boxes and move synchronously with the moving frame to seal / avoid the openings of the boxes, one end of the fork teeth is connected to the moving frame, the other end penetrates through the chamber doors and extends towards the processing chamber along a first direction, at least one clamping block is arranged thereon, and a clamping groove is arranged on the clamping block, and the clamping protrusion can be embedded in the clamping groove so that the jig moves with the fork teeth.

[0007] In an embodiment of the present invention, the sealing mechanism further includes a plurality of vacuum bellows, and the plurality of vacuum bellows are arranged inside the chamber doors, and the fork teeth penetrate and connect the vacuum bellows.

[0008] In an embodiment of the present invention, the sealing mechanism further includes a moving module and a guide rail, both the moving module and the guide rail extend along a first direction, the opening is arranged on one side of the housing and the box in the first direction, and the moving frame is slidably connected to the moving module and the guide rail to approach / away from the opening.

[0009] In an embodiment of the present invention, the sealing mechanism further includes a floating shaft and a fixing plate, the fixing plate is connected to the moving frame, the chamber door is connected to the fixing plate, and the floating shaft penetrates and connects the fixing plate and abuts against the chamber door.

[0010] In an embodiment of the present invention, the box includes a body, a connecting flange and a vacuum pipe, the connecting flange is arranged at the opening of the box and is arranged around the outer periphery of the body, the body is connected to the housing through the connecting flange, and the vacuum pipe penetrates and connects to one end of the body far from its opening, and it can be externally connected to a vacuum generator.

[0011] In an embodiment of the present invention, the housing further includes a shell and a cover, the cover is arranged at one end of the shell far from the opening, the vacuum pipe can penetrate to the outside of the cover, and a sealing member and a clamp are arranged at the connection between the cover and the vacuum pipe.

[0012] In one embodiment of the present invention, a water-cooling pipe is provided on the outer shell, a water-cooling joint is provided on the box body, the water-cooling pipe is arranged around the surface of the outer shell, and the water-cooling joint is connected to the opening of the box body and is externally connected to a coolant supply device.

[0013] In one embodiment of the present invention, the processing mechanism further includes a heating component, and the heating component is connected to the inner wall of the outer shell to heat the box body.

[0014] In one embodiment of the present invention, the atomic layer deposition device further includes a control mechanism, and the processing mechanism and the sealing mechanism are respectively connected to the control mechanism.

[0015] The present invention also provides an atomic layer deposition processing method, which uses the above-mentioned atomic layer deposition device for atomic layer deposition processing, and includes: Step S1, placing the element to be processed in a jig; Step S2, connecting at least two jigs to corresponding at least two fork teeth respectively, wherein the clamping protrusions are respectively embedded in the clamping grooves in a one-to-one correspondence; Step S3, simultaneously driving at least two fork teeth and at least two chamber doors, so that at least two jigs and the elements to be processed are respectively moved into at least two processing chambers until the chamber doors cover the corresponding box body openings; Step S4, synchronously processing the elements to be processed in each processing chamber; Step S5, after the processing is completed, driving the chamber doors away from the corresponding box body openings, and at the same time at least two fork teeth pull at least two jigs out of the processing chambers; Step S6, after discharging the elements in at least two jigs, repeating Step S1 to Step S5.

[0016] The above technical solution of the present invention has the following advantages compared with the prior art: For the atomic layer deposition device and processing method of the present invention, the jig is used to accommodate the element to be processed, and the elements in at least two jigs can be processed simultaneously by at least two box bodies, thereby doubling the deposition processing efficiency. In addition, the chamber doors in the sealing mechanism can respectively cover different processing chambers, the fork teeth can move synchronously with the chamber doors, and can be highly matched with the jigs, so that the jigs are pulled out of the processing chambers while the chamber doors are opened, thereby minimizing the beat setting to the greatest extent and improving the production and processing efficiency. Compared with the current conventional atomic deposition devices, the present application has significant advantages such as high automation, flexible use, convenient operation and adjustment, high degree of cooperation among various structures, and can significantly improve the processing efficiency, and has a broad application prospect in this industry. Description of the Drawings

[0017] In order to make the content of the present invention easier to be clearly understood, the following further details the present invention according to the specific embodiments of the present invention and in combination with the drawings.

[0018] Figure 1It is a schematic three-dimensional structure diagram of an atomic layer deposition device in a preferred embodiment of the present invention; Figure 2 is Figure 1 A schematic three-dimensional structure diagram of the outer shell and the vacuum pipe in the shown atomic layer deposition device; Figure 3 is Figure 1 A schematic internal structure diagram of the outer shell in the shown atomic layer deposition device; Figure 4 is Figure 1 A schematic three-dimensional structure diagram of the box body in the shown atomic layer deposition device; Figure 5 is Figure 1 A schematic three-dimensional structure diagram of the fixture and the component to be processed in the shown atomic layer deposition device; Figure 6 is Figure 1 An enlarged structure diagram at position A in; Figure 7 is Figure 1 A schematic three-dimensional structure diagram of the sealing mechanism in the shown atomic layer deposition device.

[0019] Explanation of reference numerals in the specification drawings: 100, fixture; 110, clamping protrusion; 200, processing mechanism; 210, outer shell; 211, housing; 212, cover; 213, water-cooling pipe; 220, box body; 221, body; 222, connecting flange; 223, water-cooling joint; 224, processing gas pipe; 225, vacuum pipe; 230, heating component; 240, sealing frame; 300, sealing mechanism; 310, moving module; 320, guide rail; 330, moving frame; 340, fixing plate; 350, chamber door; 360, floating shaft; 370, vacuum bellows; 380, fork teeth; 381, clamping block; 382, clamping groove; X, first direction; Y, second direction; Z, third direction. Detailed implementation manners

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and be able to implement it, but the illustrated embodiments are not intended to limit the present invention.

[0021] Embodiment 1:

[0022] Refer to Figure 1As shown in the figure, this embodiment provides an atomic layer deposition device, which includes a fixture 100, a component to be processed is arranged in the fixture 100, and at least one clamping protrusion 110 is arranged on the side wall of the fixture 100; a processing mechanism 200, the processing mechanism 200 includes a housing 210 and at least two boxes 220, openings are arranged on the same side of the housing 210 and the boxes 220, a sealing frame 240 is arranged at the opening of the housing 210, at least two boxes 220 are placed inside the housing 210, the inside of the box 220 is a processing chamber, and processing gas and the fixture 100 can both enter the inside of the processing chamber; a sealing mechanism 300, the sealing mechanism 300 includes a moving frame 330, at least two chamber doors 350 and a plurality of fork teeth 380, the moving frame 330 can approach / away from the opening, the chamber doors 350 are arranged in one-to-one correspondence with the openings of the boxes 220, and move synchronously with the moving frame 330 to seal / avoid the openings of the boxes 220, one end of the fork teeth 380 is connected to the moving frame 330, the other end passes through the chamber door 350, and extends towards the processing chamber along the first direction X, and at least one clamping block 381 is arranged thereon, a clamping groove 382 is arranged on the clamping block 381, and the clamping protrusion 110 can be embedded in the clamping groove 382 so that the fixture 100 moves with the fork teeth 380.

[0023] It should be noted that for the convenience of description, in this embodiment, the moving direction of the fixture 100 is defined as the first direction X, the width direction of the device is defined as the second direction Y, and the height direction of the device is defined as the third direction Z. Among them, the first direction X, the second direction Y and the third direction Z are perpendicular to each other in pairs, and the first direction X and the second direction Y are located in the same plane.

[0024] The atomic layer deposition device provided by this embodiment accommodates the component to be processed through the fixture 100, and can process the components in at least two fixtures 100 simultaneously through at least two boxes 220, thereby doubling the deposition processing efficiency. In addition, the chamber doors 350 in the sealing mechanism 300 can respectively cover different processing chambers, the fork teeth 380 can move synchronously with the chamber doors 350, and can be highly coordinated with the fixture 100, so that the fixture 100 is pulled out of the processing chamber while the chamber doors 350 are opened, thereby minimizing the cycle time setting and improving the production processing efficiency. Compared with the current conventional atomic deposition devices, this application has significant advantages such as high automation, flexible use, convenient operation and adjustment, high degree of cooperation of each structure, and can significantly improve the processing efficiency, and has a broad application prospect in this industry.

[0025] See Figure 2 and Figure 3As shown, the processing mechanism 200 in this embodiment includes a housing 210 and two boxes 220. The housing 210 and the two boxes 220 extend along a first direction X, and the two boxes 220 are spaced apart along a second direction Y. Any box 220 can accommodate a jig 100, and any jig 100 can accommodate multiple components to be processed. Based on this, this embodiment can significantly increase the number of components to be processed. Furthermore, in different embodiments, the specific number of boxes 220 can be adaptively adjusted according to actual usage needs, and the present invention does not impose specific limitations on this.

[0026] See also Figure 4 As shown, in this embodiment, the opening at one end of the box body 220 is connected to the opening of the outer shell 210, and any of the box bodies 220 includes a main body 221, a connecting flange 222 and a vacuum air pipe 225. The connecting flange 222 is arranged at the opening of the box body 220 and is arranged around the outer periphery of the main body 221. The main body 221 is connected to the outer shell 210 through the connecting flange 222. The vacuum air pipe 225 is connected to the end of the main body 221 away from its opening, and can be externally connected to a vacuum generator.

[0027] Specifically, the outer shell 210 also includes a shell body 211 and a cover 212. The cover 212 is arranged at one end of the shell body 211 away from the opening. The vacuum air pipe 225 can be passed through the outside of the cover 212. A seal and a clamp are provided at the connection between the cover 212 and the vacuum air pipe 225, thereby ensuring the connection stability and sealing degree between the box body 220 and the outer shell 210.

[0028] Furthermore, a plurality of processing gas pipes 224 are provided on the housing 210 in this embodiment to input processing gas into the processing chamber through external gas supply.

[0029] Furthermore, the processing mechanism 200 also includes a heating component 230, which is connected to the inner wall of the shell 210 to heat the box 220. The operator can adjust the heating temperature according to actual use requirements during the atomic deposition process. Furthermore, in order to ensure the safety of the processing mechanism 200 and avoid overheating of the processing chamber due to abnormalities in the heating component 230, the shell 210 in this embodiment is provided with a water cooling pipe 213, and the box 220 is provided with a water cooling joint 223. The water cooling pipe 213 is arranged around the surface of the shell 210, and the water cooling joint 223 is connected to the opening of the box 220. It is connected to an external coolant supply device, thereby improving the control of the internal environment of the processing chamber and the safety of use.

[0030] See also Figure 5As shown, the jig 100 in this embodiment is configured as a box extending along the first direction X, and the opposite side walls in the second direction Y are provided with snap-fit protrusions 110. Furthermore, in this embodiment, any processing chamber can accommodate two stacked jigs 100, thereby further improving its capacity for processing elements. In different implementations, the specific size and quantity of the jig can be adaptively adjusted according to actual usage requirements, and the present invention does not impose specific restrictions on this.

[0031] The sealing mechanism 300 in the embodiment is used to seal the openings of the box body 220 and the shell 210, and at the same time, the fork tine 380 provided thereon drives the chamber door 350 to move. Furthermore, in this embodiment, two chamber doors 350 are provided corresponding to the two box bodies 220, and two fork tines 380 are connected to any chamber door 350. The fork tines 380 are symmetrically arranged on both sides opposite to the chamber door 350 along the second direction Y to perform synchronous processing on both sides of the fixture 100 inside. The movable frame 330 is used to drive the chamber door 350 and the fork tines 380 to move along the first direction X, the chamber door 350 is used to cooperate with the opening to achieve sealing and avoidance of the processing chamber, and the fork tines 380 are used to detachably connect the fixture 100 to achieve synchronous pulling out or pushing in of the fixture 100 during the opening and closing movement of the chamber door 350.

[0032] Further, see Figure 6 and Figure 7 As shown, the sealing mechanism 300 in this embodiment also includes a plurality of vacuum bellows 370, and the plurality of vacuum bellows 370 are arranged inside the chamber door 350. The fork teeth 380 are connected to the vacuum bellows 370. The vacuum bellows 370 can withstand an axial expansion and contraction of ±5 mm and a radial deflection angle of ±2°. During the opening and closing process of the chamber door 350, the elastic deformation of the corrugated folds automatically compensates for the displacement deviation of the fork teeth 380 during movement (such as thermal expansion deformation of the chamber caused by temperature gradient), ensuring that the sealing surface always maintains a uniform contact pressure (typical value 1.5~2.0MPa), avoiding sealing failure caused by mechanical stress concentration in traditional rigid sealing structures.

[0033] Furthermore, the sealing mechanism 300 also includes a movable module 310 and a guide rail 320. Both the movable module 310 and the guide rail 320 extend along a first direction X. The opening is provided on one side of the housing 210 and the box body 220 in the first direction X. The movable frame 330 is slidably connected to the movable module 310 and the guide rail 320 to move toward or away from the opening. The movable module 310 is used to drive the movement of the chamber door 350 and includes two guide rails 320. The guide rails 320 are used to guide the movement direction of the chamber door 350 to ensure the accuracy of its movement.

[0034] The sealing mechanism 300 in this embodiment further includes a floating shaft 360 and a fixing plate 340. The fixing plate 340 is connected to the moving frame 330, the chamber door 350 is connected to the fixing plate 340, and the floating shaft 360 penetrates and connects the fixing plate 340 and abuts against the chamber door 350. Among them, the fixing plate 340 is used to connect the chamber door 350 and the moving frame 330, and the floating shaft 360 is used to perform elastic buffering when the chamber door 350 contacts the sealing frame 240, thereby avoiding extrusion damage between the chamber door 350 and the outer shell 210, and at the same time ensuring that the chamber door 350 can firmly abut against the sealing frame 240.

[0035] This embodiment further includes that the atomic layer deposition equipment further includes a control mechanism, and the processing mechanism 200 and the sealing mechanism 300 are respectively connected to the control mechanism. During the actual production and processing process, the operator can perform real-time regulation on the above structures through the control mechanism, thereby improving the flexibility of use of this equipment, and can also perform parameter presetting through the control mechanism, thereby improving the automation degree of this equipment.

[0036] Embodiment Two:

[0037] This embodiment provides an atomic layer deposition processing method, which uses the atomic layer deposition equipment described in the embodiment to perform atomic layer deposition processing, and it includes: Step S1: Place the element to be processed in the fixture 100; Step S2: Connect at least two fixtures 100 to the corresponding at least two fork teeth 380 respectively, wherein the clamping protrusions 110 are respectively embedded in the clamping grooves 382 in a one-to-one correspondence; Step S3: Drive at least two fork teeth 380 and at least two chamber doors 350 simultaneously, so that at least two fixtures 100 and the elements to be processed respectively move into at least two processing chambers until the chamber doors 350 cover the openings of the corresponding boxes 220; Step S4: Synchronously process the elements to be processed in each processing chamber; Step S5: After the processing is completed, drive the chamber door 350 away from the opening of its corresponding box 220, and at the same time at least two fork teeth 380 pull at least two fixtures 100 out of the processing chamber; Step S6: After discharging the elements in at least two fixtures 100, repeat steps S1 to S5.

[0038] In summary, for the atomic layer deposition equipment and processing method of the present invention, the fixture 100 is used to accommodate the element to be processed, and the elements in at least two fixtures 100 can be processed simultaneously by at least two boxes 220, thereby doubling the deposition processing efficiency. In addition, the chamber doors 350 in the sealing mechanism 300 can respectively cover different processing chambers, the fork teeth 380 can move synchronously with the chamber doors 350, and can be highly matched with the fixture 100. Therefore, the fixture 100 can be pulled out of the processing chamber while the chamber doors 350 are opened, thereby minimizing the cycle time setting and improving the production and processing efficiency. Compared with the current conventional atomic deposition equipment, the present application has significant advantages such as high automation, flexible use, convenient operation and adjustment, high degree of cooperation of each structure, and can significantly improve the processing efficiency, and has broad application prospects in this industry.

[0039] Obviously, the above embodiments are merely examples for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. The obvious changes or variations derived therefrom are still within the protection scope of the present invention.

Claims

1. An atomic layer deposition apparatus, characterized in that: Including: A jig, a component to be processed is disposed in the jig, and at least one clamping protrusion is provided on a side wall of the jig; A processing mechanism, the processing mechanism includes a housing and at least two boxes, openings are provided on the same side of the housing and the boxes, a sealing frame is provided at the opening of the housing, at least two of the boxes are placed inside the housing, a processing chamber is inside the box, and processing gas and the jig can both enter the inside of the processing chamber; A sealing mechanism, the sealing mechanism includes a moving frame, at least two chamber doors and a plurality of fork teeth, the moving frame can approach / away from the opening, the chamber doors are arranged in one-to-one correspondence with the openings of the boxes and move synchronously with the moving frame to seal / avoid the openings of the boxes, one end of the fork teeth is connected to the moving frame, the other end penetrates through the chamber doors and extends towards the processing chamber along a first direction, at least one clamping block is provided thereon, and a clamping groove is provided on the clamping block, and the clamping protrusion can be embedded in the clamping groove so that the jig moves with the fork teeth.

2. The atomic layer deposition equipment according to claim 1, characterized in that: The sealing mechanism further includes a plurality of vacuum bellows, and the plurality of vacuum bellows are arranged inside the chamber doors, and the fork teeth penetrate and connect the vacuum bellows.

3. The atomic layer deposition equipment according to claim 1, characterized in that: The sealing mechanism further includes a moving module and a guide rail, both the moving module and the guide rail extend along the first direction, the opening is provided on one side of the housing and the boxes in the first direction, and the moving frame is slidably connected to the moving module and the guide rail to approach / away from the opening.

4. The atomic layer deposition apparatus according to claim 1, characterized in that: The sealing mechanism further includes a floating shaft and a fixing plate, the fixing plate is connected to the moving frame, the chamber door is connected to the fixing plate, and the floating shaft penetrates and connects the fixing plate and abuts against the chamber door.

5. The atomic layer deposition apparatus according to claim 1, characterized in that: The box includes a body, a connecting flange and a vacuum pipe, the connecting flange is provided at the opening of the box and is arranged around the outer periphery of the body, the body is connected to the housing through the connecting flange, and the vacuum pipe penetrates and connects to one end of the body away from its opening, and it can be externally connected to a vacuum generator.

6. The atomic layer deposition apparatus according to claim 5, characterized in that: The housing further includes a shell body and a cover, the cover is provided at one end of the shell body away from the opening, the vacuum pipe can penetrate to the outside of the cover, and a sealing member and a clamp are provided at the connection between the cover and the vacuum pipe.

7. The atomic layer deposition apparatus according to claim 1, wherein: A water cooling pipe is provided on the housing, a water cooling joint is provided on the box, the water cooling pipe is arranged around the surface of the housing, and the water cooling joint is connected to the opening of the box and is externally connected to a coolant supply device.

8. The atomic layer deposition equipment according to claim 1, characterized in that: The processing mechanism further includes a heating component, and the heating component is connected to the inner wall of the housing to heat the box.

9. The atomic layer deposition apparatus according to claim 1, wherein: The atomic layer deposition equipment further includes a control mechanism, and the processing mechanism and the sealing mechanism are respectively connected to the control mechanism.

10. An atomic layer deposition processing method, characterized in that: Using the atomic layer deposition equipment according to any one of claims 1 to 9 for atomic layer deposition processing, it includes: Step S1, placing the component to be processed in the jig; Step S2, connecting at least two jigs to the corresponding at least two fork teeth respectively, wherein the clamping protrusions are embedded in the clamping grooves in one-to-one correspondence; Step S3: Drive at least two fork teeth and at least two cavity doors simultaneously, so that at least two fixtures and the elements to be processed are respectively moved into at least two processing cavities until the cavity doors cover the corresponding openings of the boxes; Step S4: Synchronously process the elements to be processed in each processing cavity; Step S5: After the processing is completed, drive the cavity doors away from the corresponding openings of the boxes, and at the same time, at least two fork teeth pull at least two fixtures out of the processing cavities; Step S6: After discharging the elements in at least two fixtures, repeat Steps S1 to S5.

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